siemens d900 commissioning itmn offline

Commissioning

System

ITMN - OFFLINE

A30808-X3063-A403-2-7630

AD – 2 A30808-X3063-A403-2-7630

ITMN - OFFLINE CommissioningSystem

Copyright (C) Siemens AG 1997

Issued by the Public Communication Network GroupHofmannstraße 51D-81359 München

Technical modifications possible.Technical specifications and features are binding only insofar asthey are specifically and expressly agreed upon in a written contract.

Important Notice on Product SafetyElevated voltages are inevitably present at specific points in this electrical equipment. Some of theparts can also have elevated operating temperatures.

Non-observance of these conditions and the safety instructions can result in personal injury or in prop-erty damage.

Therefore only trained and qualified personnel may install and maintain the system.

The system complies with the standard EN 60950. All equipment connected has to comply with theapplicable safety standards.

!

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IssuesChange indications (Ind.):

N = new; G = modified; 0 = deleted;

Document Titel Page(s) Issue/Ind.

Register ADMIN

ITMN - OFFLINE . . . . . . AD . . . . . . . . . . . . . . . . . . . . . . . . . 1... 12 2 GITMN - OFFLINE . . . . . . IN . . . . . . . . . . . . . . . . . . . . . . . . . . 1... 6 2 G

Register TL

ITMN - OFFLINE . . . . . . TL . . . . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G

Register PROC

ITMN - OFFLINE . . . . . . PROCIN. . . . . . . . . . . . . . . . . . . . . 1... 2 2 GITMN - OFFLINE . . . . . . PROC:CCG . . . . . . . . . . . . . . . . . . 1... 20 2 GITMN - OFFLINE . . . . . . PROC:MBB . . . . . . . . . . . . . . . . . . 1... 12 2 GITMN - OFFLINE . . . . . . PROC:SYP . . . . . . . . . . . . . . . . . . 1... 44 2 GITMN - OFFLINE . . . . . . PROC:SN . . . . . . . . . . . . . . . . . . . 1... 30 2 GITMN - OFFLINE . . . . . . PROC:CCNC_CCS7 . . . . . . . . . . . 1... 10 2 GITMN - OFFLINE . . . . . . PROC:LTG . . . . . . . . . . . . . . . . . . 1... 22 2 GITMN - OFFLINE . . . . . . PROC:DAS300 . . . . . . . . . . . . . . . 1... 6 2 GITMN - OFFLINE . . . . . . PROC:DSU . . . . . . . . . . . . . . . . . . 1... 16 2 GITMN - OFFLINE . . . . . . PROC:MODEM . . . . . . . . . . . . . . . 1... 6 2 GITMN - OFFLINE . . . . . . PROC:DLUB . . . . . . . . . . . . . . . . . 1... 22 2 GITMN - OFFLINE . . . . . . PROC:TESMOD2E . . . . . . . . . . . . 1... 22 2 NITMN - OFFLINE . . . . . . PROC:DLUD . . . . . . . . . . . . . . . . . 1... 20 2 NITMN-OFFLINE . . . . . . . PROC:CP113 . . . . . . . . . . . . . . . . 1... 36 1 0ITMN - OFFLINE . . . . . . PROC:CP113D . . . . . . . . . . . . . . . 1... 40 2 NITMN - OFFLINE . . . . . . PROC:MTD_STC2922 . . . . . . . . . 1... 6 2 NITMN-OFFLINE . . . . . . . PROC:CP113C . . . . . . . . . . . . . . . 1... 38 1 0ITMN - OFFLINE . . . . . . PROC:CP113C/CR . . . . . . . . . . . . 1... 54 2 NITMN - OFFLINE . . . . . . PROC:MTD_STC2925 . . . . . . . . . 1... 4 2 GITMN - OFFLINE . . . . . . PROC:MTD_HP . . . . . . . . . . . . . . 1... 8 2 G

Register TAB

ITMN - OFFLINE . . . . . . TABIN . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G

Register APP

ITMN - OFFLINE . . . . . . APP . . . . . . . . . . . . . . . . . . . . . . . . 1... 2 2 G

This document consists of a total of 368 Pages

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A30808-X3063-A403-2-7630 AD – 5

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Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 11.1 Overview of functional areas and subsystems . . . . . . . . . . . . . . . . . . . . IN - 11.2 CE Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.3 Required knowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.4 Locating Modules and Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 21.5 Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 31.6 List of Universal Measurement and Test Equipment . . . . . . . . . . . . . . . IN - 31.7 System Voltages in the SSS-NE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 31.8 Error Reports on the Installation Test Manual . . . . . . . . . . . . . . . . . . . . IN - 41.9 Dealing with Defective Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.10 Procedure in the Event of Faults. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.11 Procedure in the Event of Serious Faults . . . . . . . . . . . . . . . . . . . . . . . . IN - 41.12 Checking the Scope of Delivery and the Installation Work . . . . . . . . . . . IN - 51.13 Interpretation of Exchange Configuration Documents . . . . . . . . . . . . . . IN - 6

2 Task List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL - 1

3 Procedures (PROCIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROCIN - 13.1 Off-line Installation of Common Clock Generator . . . . . . . . . . PROC:CCG - 13.2 Off-line Installation of Message Buffer . . . . . . . . . . . . . . . . . . PROC:MBB - 13.3 Off-line Installation Test of the System Panel . . . . . . . . . . . . . .PROC:SYP - 13.4 Off-line Installation of Switching Network . . . . . . . . . . . . . . . . . .PROC:SN - 13.5 Off-line Installation of Common Channel Signaling

Network Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 13.6 Off-line Installation of Line Trunk Groups . . . . . . . . . . . . . . . . .PROC:LTG - 13.7 Test Procedure for DAS 300. . . . . . . . . . . . . . . . . . . . . . . PROC:DAS300 - 13.8 Off-line Installation of Data Service Unit . . . . . . . . . . . . . . . . . PROC:DSU - 13.9 Off-line Installation of modems for 3.1 kHz

audio bearer services . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 13.10 Off-line Installation of Digital Line Unit

(Frames D / E / F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 13.11 Testing DLUB with the TESMOD2E . . . . . . . . . . . . . . PROC:TESMOD2E - 13.12 Off-line Installation of Digital Line Unit

(Frames G / E / F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DLUD - 13.13 Off-line Installation of CP113D . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 13.14 Switching on MTD STC 2922 of Storage Tek . . . . . .PROC:MTDSTC2922 - 13.15 Off-line Installation of CP113C/CR . . . . . . . . . . . . . . . PROC:CP113C/CR - 13.16 Switching on MTD STC 2925 of Storage Tek . . . . . .PROC:MTDSTC2925 - 13.17 Switching on the MTD HP 88781A of Hewlett Packard . . .PROC:MTDHP - 1

4 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TABIN - 1

5 Appendix (APP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . APP - 1

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IllustrationsFig. 1.1.1 Functional areas in a network node together with the subsystems . . IN - 1

Fig. 1.4.1 Meaning of the test points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IN - 3

Fig. 2.1.1 Installation Test Sequence of Register OFFLINE . . . . . . . . . . . . . . .TL - 1

Fig. 3.0.1 Elements used in the procedures . . . . . . . . . . . . . . . . . . . . . . PROCIN - 2

Fig. 3.1.1 Rack: MB/CCG(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 2

Fig. 3.1.2 Rack: SN/MB/LTGM(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 3

Fig. 3.1.3 Rack CE(Fuse Assignment for CCG). . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 4

Fig. 3.1.4 Standard cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 8

Fig. 3.1.5 Standard cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ) . . . . . . . . . . . . . . . . PROC:CCG - 9

Fig. 3.1.6 Standard cabling CCG(A) in F:SMSC(C)(Plesiochronous mode) . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 10

Fig. 3.1.7 Standard cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ) . . . . . . . . . . . . . . . PROC:CCG - 11

Fig. 3.2.1 Rack: MB/CCG(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 2

Fig. 3.2.2 Rack: SN/MB/LTGM(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 4

Fig. 3.2.3 Rack CE(Fuse Assignment for MB) . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 6

Fig. 3.3.1 Rack R:MB/CCG(Fuse Assignment for SYP) . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 2

Fig. 3.3.2 Rack R:CE (Fuse Assignment for SYP). . . . . . . . . . . . . . . .PROC:SYP - 3

Fig. 3.3.3 Rack R:SE (Fuse Assignment for SYP). . . . . . . . . . . . . . . .PROC:SYP - 4

Fig. 3.3.4 Position of the SYP in the EWSD system . . . . . . . . . . . . . .PROC:SYP - 6

Fig. 3.3.5 Location of the USER-PROM on module COM:SYPC . . . .PROC:SYP - 8

Fig. 3.3.6 Location of the USER PROM on module PU:SYCR.. . . . . .PROC:SYP - 8

Fig. 3.3.7 Overview of system panel connections in F:SYPC . . . . . . .PROC:SYP - 9

Fig. 3.3.8 Overview of system panel connections in F:SMSC(C) . . .PROC:SYP - 10

Fig. 3.3.9 Front view of the system panel display SYPD . . . . . . . . . .PROC:SYP - 12

Fig. 3.3.10 SYPD modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 13

Fig. 3.3.11 Options for the connection of the systempanel display SYPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 15

Fig. 3.3.12 E&M signaling (4-wire transmission) . . . . . . . . . . . . . . . . .PROC:SYP - 16

Fig. 3.3.13 Loop signaling (2-wire transmission) . . . . . . . . . . . . . . . . .PROC:SYP - 17

Fig. 3.3.14 SYPD E&M grounding on T/RM:SYPC . . . . . . . . . . . . . . .PROC:SYP - 18

Fig. 3.3.15 SYPD E&M grounding on T/RM:SYCR . . . . . . . . . . . . . . .PROC:SYP - 19

Fig. 3.3.16 Block diagram of the SYPD and its interfaces . . . . . . . . . .PROC:SYP - 21

Fig. 3.3.17 R/T and E+M interfaces in F:SMSCfor SYPD-0 - SYPD-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:SYP - 22

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Fig. 3.3.18 R/T and E+M interfaces in F:SYPCfor SYPD-0 - SYPD-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 23

Fig. 3.3.19 R/T and E+M interfaces in frame SYPCfor SYPD-5 - SYPD-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 24

Fig. 3.3.20 Methods of connecting alarm lines to the MDF. . . . . . . . . PROC:SYP - 26

Fig. 3.3.21 Alarm inputs on the backplane connector of cable 223(32 wires) from the MDF to the SYP (module RM:EA) . . . PROC:SYP - 27

Fig. 3.3.22 Alarm inputs on the backplane connector of moduleT/RM:SYCR from the MDF to the SYP . . . . . . . . . . . . . . . PROC:SYP - 28

Fig. 3.3.23 Assignment of external alarms on the horizontal MDF . . . PROC:SYP - 28

Fig. 3.3.24 Assignment of external alarms on the vertical MDF . . . . . PROC:SYP - 29

Fig. 3.3.25 Connections on the jumper field for alarm output . . . . . . . PROC:SYP - 31

Fig. 3.3.26 Connector pin assignment for alarm forwarding on module TXA:SYPC. . .PROC:SYP - 32

Fig. 3.3.27 Connector pin assignment for alarm forwardingon module T/RM:SYCR . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SYP - 33

Fig. 3.4.1 Rack R:CE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:SN - 2

Fig. 3.4.2 SN Fuses / Frames and Modules in R:CE . . . . . . . . . . . . . . PROC:SN - 3

Fig. 3.4.3 R:SN(B)/LTGG cable routing from above . . . . . . . . . . . . . . . PROC:SN - 4

Fig. 3.4.4 R:SN(B)/LTGG cable routing from below . . . . . . . . . . . . . . . PROC:SN - 5

Fig. 3.4.5 R:SN(B)/LTGM cable routing from above . . . . . . . . . . . . . . . PROC:SN - 6

Fig. 3.4.6 R:SN(B)/LTGM cable routing from below . . . . . . . . . . . . . . . PROC:SN - 7

Fig. 3.4.7 R:SN/MB/LTGM cable routing from above . . . . . . . . . . . . . . PROC:SN - 8

Fig. 3.4.8 R:SN/MB/LTGM cable routing from below . . . . . . . . . . . . . . PROC:SN - 9

Fig. 3.4.9 R:TSG(B)/LTGG cable routing from above. . . . . . . . . . . . . PROC:SN - 10

Fig. 3.4.10 R:TSG(B)/LTGG cable routing from below . . . . . . . . . . . . . PROC:SN - 11

Fig. 3.4.11 R:TSG(B)/LTGM cable routing from above. . . . . . . . . . . . . PROC:SN - 12

Fig. 3.4.12 R:TSG(B)/LTGM cable routing from below . . . . . . . . . . . . . PROC:SN - 13

Fig. 3.4.13 R:SN/MB/LTGM cable routing from above . . . . . . . . . . . . . PROC:SN - 14

Fig. 3.4.14 R:SN/MB/LTGM cable routing from below . . . . . . . . . . . . . PROC:SN - 15

Fig. 3.4.15 Frame SSG(B) for SN (126 LTG) . . . . . . . . . . . . . . . . . . . . PROC:SN - 16

Fig. 3.4.16 Frame SSG(B) for SN (252 LTG..504 LTG) . . . . . . . . . . . . PROC:SN - 16

Fig. 3.4.17 R:SSG(B)/LTGG cable routing from above. . . . . . . . . . . . . PROC:SN - 17

Fig. 3.4.18 R:SSG(B)/LTGG cable routing from below . . . . . . . . . . . . . PROC:SN - 18

Fig. 3.4.19 R:SSG(B)/LTGM cable routing from above . . . . . . . . . . . . PROC:SN - 19

Fig. 3.4.20 R:SSG(B)/LTGM cable routing from below. . . . . . . . . . . . . PROC:SN - 20

Fig. 3.4.21 R:SN/MB/LTGM with F:SSG(B) cable routing from above . PROC:SN - 21

Fig. 3.4.22 R:SN/MB/LTGM with F:SSG(B) cable routing from below . PROC:SN - 22

Fig. 3.5.1 Rack R:SILTD . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCNC:CCS7 - 4

Fig. 3.5.2 Rack R:CCNP/SILTD. . . . . . . . . . . . . . . . . . . . . . PROC:CCNC:CCS7 - 5

Fig. 3.6.1 Fuse Assignment of R:LTGA . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 2

Fig. 3.6.2 Fuse Assignment of R:LTGB . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 3

Fig. 3.6.3 Fuse Assignment of R:LTGC . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 4

Fig. 3.6.4 Fuse Assignment of R:LTGC/CR . . . . . . . . . . . . . . . . . . . . PROC:LTG - 5

Fig. 3.6.5 Fuse Assignment of R:LTGD . . . . . . . . . . . . . . . . . . . . . . . PROC:LTG - 6

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Fig. 3.6.6 Fuse Assignment of R:LTGF . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 7

Fig. 3.6.7 Fuse Assignment of R:LTGG. . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 8

Fig. 3.6.8 Fuse Assignment of R:LTGG:OSS . . . . . . . . . . . . . . . . . . .PROC:LTG - 9

Fig. 3.6.9 Fuse Assignment of R:SNB/LTGG(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 10

Fig. 3.6.10 Fuse Assignment of R:SNB/LTGG(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 11

Fig. 3.6.11 Fuse Assignment of R:LTGH. . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 12

Fig. 3.6.12 Fuse Assignment of R:LTGM. . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 13

Fig. 3.6.13 Fuse Assignment of R:SNB/LTGM(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 14

Fig. 3.6.14 Fuse Assignment of R:SNB/LTGM(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 15

Fig. 3.6.15 Fuse Assignment for R:SN/MB/LTGM(Cable routing from above) . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 16

Fig. 3.6.16 Fuse Assignment for R:SN/MB/LTGM(Cable routing from below). . . . . . . . . . . . . . . . . . . . . . . . .PROC:LTG - 17

Fig. 3.7.1 Digital announcement system DAS 300 . . . . . . . . . . . PROC:DAS300 - 1

Fig. 3.7.2 Digital announcement system DAS 300 (rear view) . . PROC:DAS300 - 2

Fig. 3.8.1 R:DSU, Configuration A-B-B-Modem. . . . . . . . . . . . . . . . . PROC:DSU - 2

Fig. 3.8.2 Connection of DLU to two LTG . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 6

Fig. 3.8.3 Wiring between DIU:DLU and LTU . . . . . . . . . . . . . . . . . . PROC:DSU - 7

Fig. 3.8.4 Connection path from DLU to LTE. . . . . . . . . . . . . . . . . . . PROC:DSU - 8

Fig. 3.8.5 Connection path from LTG to LTE. . . . . . . . . . . . . . . . . . . PROC:DSU - 9

Fig. 3.9.1 R:DSU, Configuration A-B-B-Modem. . . . . . . . . . . . . . PROC:MODEM - 2

Fig. 3.9.2 R:Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 3

Fig. 3.9.3 Frame F:Modem (GPT) . . . . . . . . . . . . . . . . . . . . . . . . PROC:MODEM - 4

Fig. 3.9.4 Frame F:Modem (NEUHAUS) . . . . . . . . . . . . . . . . . . . PROC:MODEM - 5

Fig. 3.10.1 Sicherungszuordnung R:DLUB (D-E-D-E). . . . . . . . . . . . PROC:DLUB - 2

Fig. 3.10.2 Sicherungszuordnung R:DLUB (D-E-D-D). . . . . . . . . . . . PROC:DLUB - 3

Fig. 3.10.3 Sicherungszuordnung R:DLUB (D-E-D-F) . . . . . . . . . . . . PROC:DLUB - 4

Fig. 3.10.4 Configuration of ’Remote Shelter DLU 400’. . . . . . . . . . . PROC:DLUB - 6

Fig. 3.10.5 Configuration of ’Remote Shelter DLU 700’. . . . . . . . . . . PROC:DLUB - 7

Fig. 3.10.6 Connection of DLUB to two LTG . . . . . . . . . . . . . . . . . . . PROC:DLUB - 9

Fig. 3.10.7 Wiring between DIU:DLU and LTU (DIU120A) . . . . . . . PROC:DLUB - 10

Fig. 3.10.8 Numbering method on F:LTGM . . . . . . . . . . . . . . . . . . . PROC:DLUB - 11

Fig. 3.10.9 Wiring between DIU:DLU and LTU (DIU30D) . . . . . . . . PROC:DLUB - 12

Fig. 3.10.10 Connection path from DLUB to LTE . . . . . . . . . . . . . . . PROC:DLUB - 12

Fig. 3.10.11 Connection path from LTG to LTE. . . . . . . . . . . . . . . . . PROC:DLUB - 13

Fig. 3.11.1 TESMOD2E -Overview . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 1

Fig. 3.11.2 Memory organization for DLUC and TESMOD2E . PROC:TESMOD2E - 2

Fig. 3.11.3 Input and display panel . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 5

Fig. 3.12.1 Fuse Assignment R:DLUD (G-E-G-E) . . . . . . . . . . . . . . . PROC:DLUD - 2

Fig. 3.12.2 Fuse Assignment R:DLUD (G-E-G-G) . . . . . . . . . . . . . . . PROC:DLUD - 3

Fig. 3.12.3 Fuse Assignment R:DLUD (G-E-G-F) . . . . . . . . . . . . . . . PROC:DLUD - 4

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Fig. 3.12.4 Configuration of ’Remote Shelter DLU 400’ . . . . . . . . . . .PROC:DLUD - 6

Fig. 3.12.5 Configuration of ’Remote Shelter DLU 700’ . . . . . . . . . . .PROC:DLUD - 7

Fig. 3.12.6 Connection of remote DLUD to two LTG . . . . . . . . . . . . .PROC:DLUD - 9

Fig. 3.12.7 Wiring between DLUS and LTU (DIU120A) . . . . . . . . . .PROC:DLUD - 10

Fig. 3.12.8 Numbering method on F:LTGM . . . . . . . . . . . . . . . . . . .PROC:DLUD - 11

Fig. 3.12.9 Wiring between DLUS and LTU (DIU30D) . . . . . . . . . . .PROC:DLUD - 12

Fig. 3.12.10 Connection path from DLUD to LTE . . . . . . . . . . . . . . . .PROC:DLUD - 12

Fig. 3.12.11 Connection path from LTG to LTE . . . . . . . . . . . . . . . . .PROC:DLUD - 13

Fig. 3.13.1 Overview: Hardware belonging to the CP-Complex . . . PROC:CP113D - 5

Fig. 3.13.2 Overview of Interfaces B:CMY . . . . . . . . . . . . . . . . . . . PROC:CP113D - 6

Fig. 3.13.3 Module Connectors and numbering . . . . . . . . . . . . . . . PROC:CP113D - 7

Fig. 3.13.4 Coding switch on module MUH:1088 . . . . . . . . . . . . . . PROC:CP113D - 8

Fig. 3.13.5 Rack R:CP113A - Variant A . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 9

Fig. 3.13.6 Rack R:CP113B - Variant A . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 10

Fig. 3.13.7 Rack R:DEVD - Variant A . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 11

Fig. 3.15.1 Overview: Hardware belonging to the CP-ComplexPROC:CP113C/CR - 5

Fig. 3.15.2 Overview of Interfaces B:CMY . . . . . . . . . . . . . . . .PROC:CP113C/CR - 6

Fig. 3.15.3 Overview IOPs (DE5/2). . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 7

Fig. 3.15.4 Overview IOPs (DE5/4) Part 1 . . . . . . . . . . . . . . . .PROC:CP113C/CR - 8

Fig. 3.15.5 Overview IOPs (DE5/4) Part 2 . . . . . . . . . . . . . . . .PROC:CP113C/CR - 9

Fig. 3.15.6 Cabling of the 230V inverter DCIRC . . . . . . . . . . .PROC:CP113C/CR - 10

Fig. 3.15.7 230V AC-Connectors on Inverter DCIRC . . . . . . .PROC:CP113C/CR - 11

Fig. 3.15.8 Fan Alarm Cabling in CP113C/CR . . . . . . . . . . . .PROC:CP113C/CR - 12

Fig. 3.15.9 SCSI bus cabling for MDD, MOD and MTD(CP113C/CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 13

Fig. 3.15.10 SCSI bus cabling of 2 MTDs (CP113C/CR) . . . . .PROC:CP113C/CR - 14

Fig. 3.15.11 SCSI bus cabling with MDD and MOD(CP113C/CR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 15

Fig. 3.15.12 F:DEVF front view. . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 16

Fig. 3.15.13 F:DEV(F) rear view with cabling to:MDD, MOD and MTD (CP113C/CR) . . . . . . . . . .PROC:CP113C/CR - 16

Fig. 3.15.14 Overview of MP:CP113C . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 18

Fig. 3.15.15 Normal display of MP:CP113C . . . . . . . . . . . . . . .PROC:CP113C/CR - 18

Fig. 3.15.16 Rack R:CP113C . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 20

Fig. 3.15.17 Rack R:CP113 CE . . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 21

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TablesTab. 3.1.1 CCG Racks and Frames . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 5

Tab. 3.1.2 Types of submodules and concerning referencefrequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CCG - 5

Tab. 3.1.3 Submodules and specification of CCGxxA . . . . . . . . . . . . PROC:CCG - 6

Tab. 3.1.4 Necessary Submodules for CCGxxA. . . . . . . . . . . . . . . . . PROC:CCG - 6

Tab. 3.1.5 Terminals for cross-joint cable 570-802/570-804. . . . . . . . PROC:CCG - 7

Tab. 3.1.6 Terminals for reference clock cables . . . . . . . . . . . . . . . . . PROC:CCG - 7

Tab. 3.2.1 Fuse Assignment R:MB/CCG Basic Rack . . . . . . . . . . . . . PROC:MBB - 3

Tab. 3.2.2 Fuse Assignment R:MB/CCG Extension Rack . . . . . . . . . PROC:MBB - 3

Tab. 3.2.3 Fuse Assignment R:SN/MB/LTGMBasic Rack / Extension Rack . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 5

Tab. 3.2.4 Fuse Assignment R:SN/MB/LTGM Extension Racks . . . . PROC:MBB - 5

Tab. 3.2.5 Fuse Assignment R:CE . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 7

Tab. 3.2.6 Capacity stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:MBB - 7

Tab. 3.3.1 Explanations on E&M and loop signaling. . . . . . . . . . . . . .PROC:SYP - 17

Tab. 3.3.2 Mounting locations of SYPD connections on F:SYPC(A) .PROC:SYP - 34

Tab. 3.3.3 Mounting locations of SYPD connections on F:SMSC(C) .PROC:SYP - 34

Tab. 3.5.1 LEDs on M:PU:SIMP (M:PMU:SIMP) . . . . . . . . . .PROC:CCNC:CCS7 - 1

Tab. 3.5.2 LEDs on M:MH:SIMP. . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 1

Tab. 3.5.3 LEDs on M:SIPA . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 1

Tab. 3.5.4 LEDs on M:PU:CPI (M:PMU:CPI) . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2

Tab. 3.5.5 LEDs on M:SILTC . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2

Tab. 3.5.6 LEDs on M:SILTD . . . . . . . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 2

Tab. 3.5.7 Fuse assignment R:CCNP/SILTD(shielded or unshielded version) . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3

Tab. 3.5.8 Fuse assignment R:CCNP/SILTD(partially shielded version) . . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3

Tab. 3.5.9 Fuse assignment R:SILTD. . . . . . . . . . . . . . . . . . .PROC:CCNC:CCS7 - 3

Tab. 3.8.1 Equipment list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 3

Tab. 3.8.2 Mounting location list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:DSU - 4

Tab. 3.10.1 Assignment of primary fuses . . . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 7

Tab. 3.10.2 Assignment of secondary fuses . . . . . . . . . . . . . . . . . . . . PROC:DLUB - 8

Tab. 3.10.3 Pin numbers for PCM30 connectors of DIU120A . . . . . PROC:DLUB - 10

Tab. 3.11.1 Switch functions . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 3

Tab. 3.11.2 Key functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 4

Tab. 3.11.3 Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 4

Tab. 3.11.4 Switch functions . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 6

Tab. 3.11.5 Test codes and test routines . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 7

Tab. 3.11.6 Basic switch settings on control panel . . . . . . . . . PROC:TESMOD2E - 10

Tab. 3.11.7 Basic switch settings on the input and displaypanel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 10

Tab. 3.11.8 Mounting locations for module typesQ965, Q1101, Q838 . . . . . . . . . . . . . . . . . . . . . . PROC:TESMOD2E - 10

AD – 12 A30808-X3063-A403-2-7630


Tab. 3.11.9 Mounting locations for module typesQ1103, Q1192 . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 11

Tab. 3.11.10Mounting locations for module type Q1338 . . . . .PROC:TESMOD2E - 11

Tab. 3.11.11DCC ID-Bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 11

Tab. 3.11.12Flag-Bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 12

Tab. 3.11.13Module ID-Bytes . . . . . . . . . . . . . . . . . . . . . . . . . .PROC:TESMOD2E - 12

Tab. 3.12.1 Assignment of primary fuses. . . . . . . . . . . . . . . . . . . . . . .PROC:DLUD - 7

Tab. 3.12.2 Assignment of secondary fuses . . . . . . . . . . . . . . . . . . . .PROC:DLUD - 8

Tab. 3.12.3 Pin numbers for PCM30 connectors of DIU120A . . . . . .PROC:DLUD - 10

Tab. 3.13.1 Coding switch settings . . . . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 8

Tab. 3.13.2 Fuse Assignment of R:CP113A (Variant A) . . . . . . . . PROC:CP113D - 12

Tab. 3.13.3 Fuse Assignment of R:CP113B (Variant A) . . . . . . . . PROC:CP113D - 12

Tab. 3.13.4 Fuse Assignment of R:DEVD (Variant A) . . . . . . . . . . PROC:CP113D - 13

Tab. 3.13.5 Fuse Assignment to Fans . . . . . . . . . . . . . . . . . . . . . . PROC:CP113D - 13

Tab. 3.13.6 Overview: OEM-Devices / IOPs / frames . . . . . . . . . . PROC:CP113D - 14

Tab. 3.13.7 Sequence for Switching on the Frames . . . . . . . . . . . PROC:CP113D - 14

Tab. 3.13.8 Displays after successful Hardware Startup . . . . . . . . PROC:CP113D - 15

Tab. 3.15.1 Modules with front connector for MP:CP113C . . .PROC:CP113C/CR - 17

Tab. 3.15.2 Key functions of MP . . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 19

Tab. 3.15.3 Fuse Assignment R:CP113C . . . . . . . . . . . . . . . .PROC:CP113C/CR - 22

Tab. 3.15.4 Fuse Assignment R:DEVB . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 23

Tab. 3.15.5 Fuse Assignment to fans . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 23

Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural) PROC:CP113C/CR -23

Tab. 3.15.7 Memory organization . . . . . . . . . . . . . . . . . . . . . .PROC:CP113C/CR - 25

Tab. 3.15.8 Sequence for switching on the modules R:CP113C . PROC:CP113C/CR -25

Tab. 3.15.9 Sequence for switching on the modules R:CE . . .PROC:CP113C/CR - 26

Tab. 3.15.10Displays after successful Hardware Startup . . . . .PROC:CP113C/CR - 27

A30808-X3063-A403-2-7630 IN – 1

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1 Introduction

1.1 Overview of functional areas and subsystems

Fig. 1.1.1 Functional areas in a network node together with the subsystems

Coordination

CP

Common channel signaling

DLU

LTG

LTG

Access Switching

SN

CCNC

SYP

MB

CCG

IN – 2 A30808-X3063-A403-2-7630


1.2 CE Declaration of Conformity

1.3 Required knowledge

No specialist knowledge is required to carry out installation testing of a system with fault-free hardware and software. The experience described below is generally sufficient.

• Basic training on SSS-NE (EWSD)

• Practical experience in the operation of SSS-NE (EWSD systems) and clearance ofsimple faults

• General knowledge of how to use D900/D1800 documents such as maintenancemanuals, command manual, hardware documents

• Handling of fault reports:

– Hardware fault reports

– Software fault reports

– Document error reports

1.4 Locating Modules and Test Points

The term "mounting unit" is abbreviated to MUT and "mounting location" to MOLOC.The black fast-on connector point to the right of the wrapping field is marked "202”, andthe one to the left of the wrapping field "205".

iAttention !The CE Declaration of Conformity for the product will be fulfilled if the construction andcabling is undertaken in accordance with the manual and the documents listed therein,e.g. mounting instructions, cable lists. Where necessary account should be taken ofproject-specific documents.

Deviations from the specifications or unstipulated changes during construction, e.g. theuse of cable types with lower screening values can lead to violation of the CE require-ments. In such cases the conformity declaration is invalidated and the responsibilitypasses to those who have caused the deviations.

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Fig. 1.4.1 Meaning of the test points

In multiple statements the individual figures are separated by a slashe.g.: 03/05 A 205 19.

1.5 Test Equipment

The test equipment required for fault clearance is specified in the descriptions of the indi-vidual systems. A comprehensive list of these devices can be found in the list ofuniversal measurement and test equipment.

1.6 List of Universal Measurement and Test Equipment

The details relate to devices which are necessary for the installation of an EWSDsystem. Devices from other manufacturers can be used in place of those given here, aslong as their specifications are equivalent.

• Digital multimeter, e.g. Siemens VMG-3

• Continuity tester, e.g. Cirtest PS 12

• Test headset 600/10000 ohms

1.7 System Voltages in the SSS-NE

All the system units in an EWSD exchange require a system voltage of -40V to -75V(peak -80V).

This means that all units which are operated via voltage converter or inverters can workwith this system voltage. These units include:

CP, MB, CCG, SYP, SN, CSC, LTG, DLU

Exceptions: All load circuits which access the system voltage directly. Care must betaken here to ensure that the system voltage tolerances prescribed by the manufac-turers are observed.

Meaning of the test points (SIVAPAC) e.g:(Rear of module frame)

Mounting units

Row in module frame

Mounting location

Terminal (wire wrap pin)

03 A 205 19

IN – 4 A30808-X3063-A403-2-7630


e.g.: DAS = Digital announcement unit

1.8 Error Reports on the Installation Test Manual

Incorrect or unclear sections of the ITMN should be described in detail in a documenterror report.

The error report must be sent to TAC or VI.

1.9 Dealing with Defective Modules

If a module should prove to be defective, it should have a form attached to it (e.g. hard-ware fault report as supplied by the relevant administration) containing the followinginformation:

1. Name and code number of the module or OEM device

2. Description of the fault

The module/OEM device should then be sent to the repair center in an EWSD modulebox or OEM-device container together with the form.

If possible, magnetic tape devices should be repaired on site by trained technicians.

1.10 Procedure in the Event of Faults

If faults occur in on-line operation, the system messages should be interpreted bymeans of the Maintenance Manual (MMN) and/or the Command Manual (CML).

Hardware faults should be localized and cleared in accordance with the instructions inthe Maintenance Manual.

1.11 Procedure in the Event of Serious Faults

Serious faults are those which are not dealt with in the MMN. They include:

– short circuits, breaks in cables

– short circuits, breaks in the backplane wiring (wire wrapping, cables, foreign mate-rial)

– multiple faults

– faults where the MMN instructions are insufficient

– software errors (general programs, exchange-specific data memories)

If there is a malfunction in a unit, this should normally be reported first to the specialistin the installation test team, and then to the higher-level Technical Assistance Center(TAC).

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If the installation technician is not qualified to eliminate serious faults, a fault report mustbe filled out, providing the following information in detail:

– description of the test step attempted

– description of the system response, if possible including the fault printouts

– description of any system activities taking place at the same time, e.g. work done byother testers during modifications to hardware or software, or activities on subscriberstations, test desk

– tracer logs (if applicable)

1.12 Checking the Scope of Delivery and the Installation Work

Compare the parts list in the contract with the delivery documents and the assembledexchange, with reference to the exchange-related documentation.

• Check the installation work

The following installation work must be carried out before testing:

– The EWSD racks are assembled

– The internal cabling of the system is completed

– The system voltage of -48V/-60V is connected and constantly available (theemergency power supply system is operational)

– The EWSD racks are equipped with the current hardware/firmware (see AKUHWlists)

• Check the software

The following should be observed:

– The system APS must be available and released by the department responsiblefor system acceptance

– System-specific exchange acceptance DATABASE on magnetic tape

– Floppy disks containing the software required for PC installation (see MMN:PCRegister BASIS)

– Project-specific user-EPROM or standard PROM for SYPC

– Test diagnostic command file

• Check the documentation

Check that the exchange-related documentation is complete. The following are themost important documents:

– DOL - Document list

– SUP - Survey plan

– SUL - Survey list

– LP - Equipment layout plan

– LL - Layout list

– EP - Equipment plan

– EL - Equipment list

– AL - Allocation list

– CLL - Cable laying list

A check should also be made, using superordinate documents, to ascertain thatdocuments which are not system-specific are complete and up-to-date.

IN – 6 A30808-X3063-A403-2-7630


This applies in particular to: Manuals

• Check the equipment

The main points for a visual check in an EWSD exchange are:

– Check that the racks are complete by comparing with the equipment lists

– Check that the test and auxiliary equipment is complete and functions correctly

– Check the input/output devices and the background memory

– Check that the system tapes and data tapes are complete, and also the correctiontape if applicable

• Visual check of the entire system

– The cabling and positioning of the modules should be checked against the instal-lation instructions for the individual system components.

– Check that the modules are firmly in position.

1.13 Interpretation of Exchange Configuration Documents

For overview and interpretation of the exchange configuration documents seeOGL:ECD.

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2 Task List

2.1 Installation Test Sequence of Register OFFLINE

Fig. 2.1.1 Installation Test Sequence of Register OFFLINE

Manual MMN:DSU/DLUB/DLUD, TAB, MOD

Manual MMN:PC Register BASIS

The CCG has a special position in the installation test sequence.When it is tested, check wether the reference frequency(ies) is (are)already switched on.- Wiring of a CCGxxA module- Plesiochronous mode/ synchronous mode- Waiting times before testing(The CCG should be switched on as early as possible so that thequartz crystals can temperature-stabilize as soon as possible.

Installation test of SYP and plug in the USER-PROM

Test of the SNMalfunctions caused by cabling faults (cross joint cable), must belocated by means of diagnosis

Installation test of CCNC

Installation test of LTG

Maintenance of DSU/DLUB/DLUDThe section MOD is used to set switches of DSU/DLUB/DLUD

Installation test of CPThe section MMN:PC Register BASIS is used for startup of the PC

Part in the ITMN-OFFLINE

The INTRO section contains basic information

Content

Introduction

Installation test of DAS 300

CCG

MBB Installation test of MB(B)

SYP

SN

LTG

DAS 300 TEST

DSU DLUB

TESMOD2E

CP113C/CR

DLUD

CCNC:CCS7

CP113D

MODEM

TL – 2 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROCIN – 1

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3 Procedures (PROCIN)

Notes on module replacement:

• Precautionary measures for electrostatic-sensitive componentsAll modules are equipped with electrostatic-sensitive components (ESD symbol).For this reason the precautionary measures for electrostatic-sensitive componentsmust be observed when extracting and inserting modules.When replacing modules, the maintenance personnel must wear a conducting wrist-strap to discharge static. Before modules, leads or components are touched, thewrist-strap must be connected via a flexible lead to the ground potential of the rack.It is important to note that the conducting parts of the banana plug must not betouched while the lead is being plugged in (bridging of the leakage resistance).Further information can be found in the brochure “Safety Instructions for Personneland for Products as per EN 60950” (A30808-X3008-X280-*-7619).

• Extracting and inserting modulesWhen replacing modules it is essential that the special tool provided (C39300-A195-C70) should be used both for extracting and for inserting modules.Faulty modules that have been removed must be marked as faulty, and they must behandled just as carefully as new modules.For transportation to a repair center the faulty modules must be marked and packedin accordance with the precautionary requirements for electrostatic-sensitivecomponents.Further information can again be found in the brochure “Safety Instructions forPersonnel and for Products as per EN 60950” (A30808-X3008-X280-*-7619).

• Replacement modulesThe replacement module must be identical with the original module (same codenumber both for HW/FW and for functional status). In exceptional cases theFunctional Level List can be used to determine whether the functional status of thereplacement module (as regards HW/FW) is compatible with that of the originalmodule.If there are switches or other control elements on the module, they must be set asthey were on the extracted original module.

PROCIN – 2 A30808-X3063-A403-2-7630


3.0.1 Explanations of the Procedure Elements

Fig. 3.0.1 Elements used in the procedures

12 Decision block

Must clearance of this fault be postponed (e.g. because no sparemodules available)?

Commentary are always written in italics

b CONF SN:SN=sn,OST=STB;

ERROR MESSAGE DURING CONFIGURATION OF MCH-0-ltg MMN:MCH50-zzzz

To evaluate the system output, see

Continue according to the system reaction:

- EXEC’D..................................................................................................

- NOT EXEC’D..........................................................................................

- else.........................................................................................................

i....PROC:SN001

h.......18h.......19

Y h .....13

N h .....16

.....AL:SN

Block number

Commentary(in italics)

MML commandinput

MML mask(Courier

Multiplebranch

Branch symbol

Yes/Nobranch

Branch dest.(block number)

Block

Reference todocument withadditionalinformation

Branch symbolwith reentry

13 Decision block

typeface)

A30808-X3063-A403-2-7630 PROC:CCG – 1

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3.1 Off-line Installation of Common Clock Generator

CCG

3.1.1 Documents

The following documents are required as references

– Maintenance Manual MMN:CCG / MMN:CCG for CDE

– AKUHW Lists

PROC:CCG – 2 A30808-X3063-A403-2-7630


3.1.2 Rack MB/CCG(Fuse Assignment for CCG)

Fig. 3.1.1 Rack: MB/CCG(Fuse Assignment for CCG)

A

B

F:MB/CCG(A) orF:MB/CCG(B)

CD

Fuse panel

MUT02

MUT03

MUT06

MUT07

MUT08

MUT09

MUT01

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

02

12

FU

MOLOC A119 or A121 (CCG)

MOLOC A119 or A121 (CCG)

MUT05

MUT04


F:SYPC(A)



SYPD (or empty)

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3.1.3 Rack SN/MB/LTGM(Fuse Assignment for CCG)

Fig. 3.1.2 Rack: SN/MB/LTGM(Fuse Assignment for CCG)

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

D

F:TSG(B), F:SSG(B)or F:LTGM(A)

Fuse panel

C

DFU


MOLOC A121 (CCG)

MOLOC A121 (CCG)

F:MB/CCG(B)



F:MB/CCG(B)23

09

PROC:CCG – 4 A30808-X3063-A403-2-7630


3.1.4 Rack CE(Fuse Assignment for CCG)

Fig. 3.1.3 Rack CE(Fuse Assignment for CCG)

C

DF:SMSC(C)-0

F:SMSC(C)-1

F:PIOP(A)

F:PBC(A)

F:PBC(A)

F:DEV

Fuse panel / AD:RAL

MUT02

MUT04

MUT03

MUT06

MUT09

MUT10

C

D

C

D

C

D

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

04

25

FU

MOLOC C153 (Supply for CCG-0)

MOLOC C153 (Supply for CCG-1)

292721 2523 31 33

30282622 3224

F:PIOPA)C

D

Air circulator

MUT11

MUT07

MUT05

MUT08

MUT01

Air circulator

Air circulator

A30808-X3063-A403-2-7630 PROC:CCG – 5

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3.1.5 CCG Racks / Frames / Modules

The CCG consists of 4 modules which can be located in the following racks / frames:

The modules are:

– M:CCGB

– M:CCGD

– M:CCGxxA

– M:DCCCR

In accordance with the environmental requisites of the EXCH the CCG can be used inthe following operating modes:

– plesiochronous mode

– synchronous mode

The module M:CCGxxA has to be equipped with different submodules according to thenumber of reference frequencies and the operating mode used.The use of two submodules is standard. One CCGxxA module with two submodules canprocess two reference frequencies.

3.1.5.1 Submodules for CCGxxAThe type of the submodules used is dependent upon the reference frequencyconcerned:

The dummy xx in the term CCGxxA depends on the submodule used:

Rack Frame Module FrameCode Number

R:MB/CCG F:MB/CCG(A) S30804-B2567

F:MB/CCG(B) S30804-B2641

R:SN/MB/LTGM F:MB/CCG(B) S30804-B2641

R:CE F:SMSC(C) S30804-B2693

Tab. 3.1.1 CCG Racks and Frames

type ofsubmodule

reference frequency

Type1 (D319) 2,048 MHZ / 300 KHZ

Type2 (D320) 5 MHZ / 10 MHZ

Type3 (D337) 1,544 MHZ / 300 KHZ

Tab. 3.1.2 Types of submodules and concerning referencefrequencies

PROC:CCG – 6 A30808-X3063-A403-2-7630


Depending on the position of the EXCH in the network hierachy, different referencefrequencies have to be used. An overview is given in the following table:

*)In a synchronous digital network, master exchanges are those which receive their refer-ence frequencies directly from a universal frequency standard UFS. UFS standardsgenerate reference frequencies of 5 MHz, 10 MHz, 2.048 MHz and 1.544 MHz,depending on the delivery. The use of a reference frequency of 2.048 MHz is standard.The type of CCGxxA module, i.e. its equipping with submodules, depends on the refer-ence frequency present in each case.

If there is not yet a master exchange with primary standard, or an all-embracing PCMnetwork, the CCG(A) must be operated plesiochronously (island exchange). TheCCG(A) then works with its own accuracy. Every CCGxxA module always generates afrequency of 2.048 MHz, irrespective of which submodules are plugged in and whetherthey are synchronized or not. In this way the CCG-0 can synchronize the CCG-1 if theCCG10A or CCG11A module is plugged in the CCG-1.If CCG22A or CCG33A are plugged in, both modules have to be installed plesiochro-nously.

Submodule 0 Submodule 1 CCGxxA-

Type 1 (D319) Type 1 (D319) CCG11A



Tab. 3.1.3 Submodules and specification of CCGxxA

Exch(s) CCGxxA Input module Reference freq.

Master Exch(s) CCGxxA

*)

Type 1 (D319) 2.048 MHz

Type 2 (D320) 5 or 10 MHz

Type 3 (D337) 1,544 MHz

Slave Exch(s) w. PCM30 CCG11A Type 1 (D319) 2.048 MHz

Slave Exch(s) w. PCM24 CCG33A Type 3 (D337) 1.544 MHz

Tab. 3.1.4 Necessary Submodules for CCGxxA

A30808-X3063-A403-2-7630 PROC:CCG – 7

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3.1.6 Terminals for Cross-joint Cables and Reference Clock Cables

3.1.6.1 Terminals for Cross-joint Cable 570-802/570-804

3.1.6.2 Terminals for Reference Clock Cables

*)No reference clock cables may be plugged in when plesiochronous mode is used,even if they are listed in the cable laying list.

Operating mode F:MB/CCG(A) F:MB/CCG(B) F:SMSC(C)

CCG-0 CCG-1 CCG-0 CCG-1 CCG-0 CCG-1

Plesiochronous modewith synchronization ofCCG1 by CCG0(at least one CCG1xAmust be on CCG1)

B112 A112 B114 A114 D193 C193

Synchronous mode withone reference frequency

A112 A112 A114 A114 C193 C193

Synchronous mode with 2reference frequencies

A112 A112 A114 A114 C193 C193

Tab. 3.1.5 Terminals for cross-joint cable 570-802/570-804

Operating mode F:MB/CCG(A) F:MB/CCG(B) F:SMSC(C)

CCG-0 CCG-1 CCG-0 CCG-1 CCG-0 CCG-1

Plesiochronous mode *) *) *) *) *) *)

Synchronous mode withone reference frequency

A109 ------- A111 ------- C187 -------

Synchronous mode with 2reference frequencies

A109 B109 A111 B111 C187 D187

Tab. 3.1.6 Terminals for reference clock cables

PROC:CCG – 8 A30808-X3063-A403-2-7630


3.1.6.3 Standard Cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode)

Fig. 3.1.4 Standard cabling CCG(A) in F:MB/CCG(B)(Plesiochronous mode)

CCG11A

49

50

Submodule 0

A111

A114

B111

2949

50

B114

2,048 MHz

29

49

50

Backpanel

S3 S2 S1

P0 R2 R1

D319

A111

A111

4344

CCG-0

CCG-1

F E D C

Cross-joint-Cable 570-804

2,048 MHz

2,048 MHz

No cable plugged in!


249

250

Submodule 1

229D319

F E D C

4746

CCG11A

49

50

Submodule 0

A111

A114

B111

2949

50

B114

2,048 MHz

29

49

50

S3 S2 S1

P0 R2 R1

D319

43

44

F E D C

249

250

Submodule 1

229D319

F E D C

4746

Backpanel

48

48

A30808-X3063-A403-2-7630 PROC:CCG – 9

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3.1.6.4 Standard Cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ)

Fig. 3.1.5 Standard cabling CCG(A) in F:MB/CCG(B)(Synchronous mode with 2,048 MHZ)

CCG11A

49

50

Submodule 0

A111

A114

B111

2949

50

B114

2,048 MHz

29

49

50

Backpanel

S3 S2 S1

P0 R2 R1

D319

A111

A111

4344

CCG-0

CCG-1

F E D C


2,048 MHz

249

250

Submodule 1

229D319

F E D C

4746

CCG11A

49

50

Submodule 0

A111

A114

B111

2949

50

B114

2,048 MHz

29

49

50

S3 S2 S1

P0 R2 R1

D319

43

44

F E D C

249

250

Submodule 1

229D319

F E D C

4746

Backpanel

48

910

910

ref

ref

Ref 0

2,048 MHZfrom DIU or PRCsymm.

Ref 1


Clock from:MDF, with cableType 941/ 942

or fromLTG, with cableType 923/ 924

48

PROC:CCG – 10 A30808-X3063-A403-2-7630


3.1.6.5 Standard Cabling CCG(A) in F:SMSC(C)(Plesiochronous mode)

Fig. 3.1.6 Standard cabling CCG(A) in F:SMSC(C)(Plesiochronous mode)

CCG11A

49

50

Submodule 0

C187

C193

D187

2949

50

D193

2,048 MHz

29

49

50

Backpanel

S3 S2 S1

P0 R2 R1

D319

C187

C187

4344

CCG-0

CCG-1

F E D C


2,048 MHz

2,048 MHz



249

250

Submodule 1

229D319

F E D C

4746

CCG11A

49

50

Submodule 0

C187

C193

D187

2949

50

D193

2,048 MHz

29

49

50

S3 S2 S1

P0 R2 R1

D319

43

44

F E D C

249

250

Submodule 1

229D319

F E D C

4746

Backpanel

48

48

A30808-X3063-A403-2-7630 PROC:CCG – 11

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3.1.6.6 Standard Cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ)

Fig. 3.1.7 Standard cabling CCG(A) in F:SMSC(C)(Synchronous mode with 2,048 MHZ)

CCG11A

49

50

Submodule 0

C187

C193

D187

2949

50

D193

2,048 MHz

29

49

50

Backpanel

S3 S2 S1

P0 R2 R1

D319

C187

C187

4344

CCG-0

CCG-1

F E D C


2,048 MHz

249

250

Submodule 1

229D319

F E D C

4746

CCG11A

49

50

Submodule 0

C187

C193

D187

2949

50

D193

2,048 MHz

29

49

50

S3 S2 S1

P0 R2 R1

D319

43

44

F E D C

249

250

Submodule 1

229D319

F E D C

4746

Backpanel

48

910

910

ref

ref

Ref 0


Ref 1


Clock from:MDF, with cableType 941/ 942

or fromLTG, with cableType 923/ 924

48

PROC:CCG – 12 A30808-X3063-A403-2-7630


1 Decision Block

When the basic test has been completed, changeover from plesiochronous tosynchronous mode can be made if the reference frequency(ies) is/are available.

– Starting the basic test h...2– Changeover from plesiochronous to synchronous mode h...26

2 Check of System Voltage per Rack Row

Ensure that the main fuses are unscrewed before starting the check

Measure the system voltage for each rack row at the last frame

The operational voltage is dependent upon the charging status of the batteries:

Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6V ... -57V)

Is system voltage -60V (-48V) present? Y h...4N h...3

3 Special Fault Clearance

Carry out special fault clearance

– After finishing special fault clearance h...2

4 Basic Test (Rack)

Check rack layout and issues against exchange specific document (AKUHWlists), if not already done.

Check that all modules and cables are firmly in place.

Look at wrap fields to check that wrap pins and contacts are not bent ortouching and that there are no foreign bodies.

5 Preparation of Basic Test

Pull reference clock and cross-joint cables ......(see 3.1.6)

6 Information about Basic Test

The basic test must be carried out for CCG-0 and CCG-1 successively. CCGxxAmodules must be handled with great care as the quartz oscillators installed onthe modules are sensitive to shock and impact.

7 Checking the Required CCGxxA Modules

Check that the correct CCGxxA modules are inserted

Information about the required CCGxxA modules ......(see 3.1.5.1)

A30808-X3063-A403-2-7630 PROC:CCG – 13

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8 Checking Switch Settings and Solder Straps

Set only those switches described in the MMN. All other switches are set by themanufacturer.Set DIP-FIX switches according to the hardware currently present.

Check that all the solder straps and DIP-FIX switches of the CCGxxA andCCGB described in the MMN are in the correct position for plesiochronousmode.

......MMN:CCG,TAB LED:CCG

9 Checking DCCs

Pull modules CCGB, CCGD and CCGxxA of the CCG-0 (CCG1), but leave inposition

Screw in the associated fuse:

Fuse assignment in R:MB/CCG ...... (see Fig. 3.1.1)

Fuse assignment in R:SN/MB/LTGM ...... (see Fig. 3.1.2)

Fuse assignment in R:CE ...... (see Fig. 3.1.3)

Switch on the associated DCC

Is the green LED of the DCC lit? Y h...12N h...10

10 Replacing Defective DCC

Switch off defective DCC

Unscrew corresponding fuse

Check that spare module is switched off

Replace defective DCC by spare module

Screw in corresponding fuse

Switch on DCC





PROC:CCG – 14 A30808-X3063-A403-2-7630


12 Checking CCG Modules

Switch off DCC

Insert all modules of the associated CCG

Switch on DCC

If LED goes dark again, there is presumably a short circuit in the CCG-modules.

– If LED is lit h...18– If LED is dark h...13

13 Prepare Search for Module Suspected of Shorting

Switch of DCC

Pull all modules of the associated CCG

14 Search for Module Suspected of Shorting

Repeat the following steps until all modules of the CCG concerned have beentested.

Switch off DCC of the CCG concerned (if not already done)

Insert first/ next module

Switch on DCC of the CCG concerned

The following system reactions are possible

– Green LED on DCC is lit h...17– Green LED on DCC is not lit h...15

15 Replace Defective Module

Short circuit on the module last inserted

Switch off DCC of the CCG concerned

Replace defective module by spare module

Switch on DCC of the CCG concerned





17 Decision Block

Have all modules already been tested? Y h...18N h...14

A30808-X3063-A403-2-7630 PROC:CCG – 15

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18 Checking LED AL

Is LED AL on module CCGxxA lit? Y h...20N h...19

19 Replacing Module CCGxxA

Switch off DCC

Replace module by spare module

– After replacing the module h...12

20 Decision Block

Have both CCGs already been tested? Y h...21N h...9

21 Plesiochronous Mode

CCG-0 and CCG-1 do not receive an external reference frequency. Duringplesiochronous mode with synchronization of CCG1 by CCG0, only the cross-joint cable may be plugged in. Clock cables must not be plugged in, even if theyare listed in the cable laying list. Plesiochronous mode with synchronization ofCCG1 by CCG0 is possible only if there is at least one CCG11A plugged in theCCG-1.If CCG22A or CCG33A are plugged in, both CCGs have to be run plesiochro-nously.

Is there at least one CCG11A in the CCG1? Y h...22N h...24

22 Plesiochronous Mode with Synchronization of CCG1 by CCG0

Switch off converter DCCCR at both CCGs

Insert cross-joint cable type 570-802 ...... (see Tab. 3.1.5)

Switch on converter DCCCR at both CCGs

LED AL lights approx. 30 minutes

Then In CCG-0 the LEDs P (plesiochronous) and F (free-running) light on thefaceplate of CCG11A-0. In CCG-1 the LEDs A (holdover state A) and REF0 lighton the faceplate of CCG11A-1.

Then the display on the CCG11A-1 changes to synchronous state 4 via hold-over state B. After synchronization the LEDs F and P on module CCG11A-0light up, as do LEDs REF0 and synchronous state 4 on module CCG11A-1.

When both CRA (control range) LEDs light, PLL regulation is working to itslimits. If LED AL also lights up, there is no longer any synchronization.

– If both CRA LEDs are on h...23– If LEDs are dark h...25

PROC:CCG – 16 A30808-X3063-A403-2-7630





24 Plesiochronous Mode without Synchronization of CCG1 by CCG0

LED AL lights approx.30 minutes

When the LED AL has gone dark, the LEDs P (plesiochronous) and F (free-running) light up

25 Decision Block

End of basic test CCG

Should changeover from plesiochronous mode to synchronous mode be carriedout? (Reference frequency(ies) must be available) Y h...26

N h...END

26 Prerequisites

Subsequent external synchronization of the exchanges must be carried out insequence according to the network hierarchy. Changeover from plesiochronousto synchronous mode is described below for the following basic configuration:

• The CCGs are equipped with CCG11A modules

• 2.048 MHz frequencies of high accuracy must be available for synchroniza-tionThe reference frequencies are derived from a primary frequency standard orfrom the DIU30D/DIU120D of a LTG. The connection with the referencefrequencies is established via symmetrical cables (120 Ohm)

– references of a frequency standard are cabled to the MDF and from thereto the CCG with cable type 941/942

– references of the LTG are cabled to the CCG with cable type 923/924

• Reference cable and cross-joint cable must be available.

The cross joint cable 570 802 in CCG-0 is plugged into the following position:

– B 112 for F:MB/CCG(A)

– B 114 for F:MB/CCG(B)

– D 193 for F:SMSC(C)

The cross joint cable 570 802 in CCG-1 is plugged into the following position:

– A 112 for F:MB/CCG(A)

– A 114 for F:MB/CCG(B)

– C 193 for F:SMSC(C)

• The CCGs are in operating state ACT/ STB

– On CCG11A in CCG-0 the LEDs P and F are lit

– On CCG11A in CCG-1 the LEDs Ref0 (green) and 4 are lit

A30808-X3063-A403-2-7630 PROC:CCG – 17

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27 Checking Cables

Are reference clock and cross-joint cables present? Y h...29N h...28

28 Ordering Cables

Order reference clock and cross-joint cables

29 Synchronization of the Plesiochronous CCG-0

For synchronization of the plesiochronous CCG-0 no switch settings on themodule CCG11A need to be changed because the switches are not located inthe signal line of the reference frequency. I.e. even in plesiochronous mode theCCG detects the reference frequency and synchronizes to it.

Plug the first reference frequency into the following position of the CCG-0

– A109 in F:MB/CCG(A)

– A111 in F:MB/CCG(B)

– C 187 in F:SMSC(C)

System reaction:

– After 2-3 minutes in CCG-0 on module CCG11A the LED REF0 lights green

– LED F is switched off

– LED A is switched on

This means that the CCG-0 accepts the reference frequency because it is inpull-in range

Within one hour the CCG-control runs through the following modes:

– LED A lights (holdover state A)

– LED B lights (holdover state B)

– LED B lights (holdover state B) and LED 1 lights (synchronous state 1)

– The display changes trough synchronous states 2 and 3 to synchronousstate 4

Simultaneously the CCG-1 is synchronized by CCG-0 because of the cross-jointcable between CCG-0 and CCG-1.

If the reference frequency is disturbed during synchronization, the display doesnot go beyond status A. In this case, synchronization must be carried out with areference frequency derived from a rubidium standard (e.g. FTU).

PROC:CCG – 18 A30808-X3063-A403-2-7630


30 Change Position of Cross-joint Cable

Unplug cross-joint cable 570 802 on CCG-0 from the following positions:

– B 112 for F:MB/CCG(A)

– B 114 for F:MB/CCG(B)


Plug in cross-joint cable on CCG-0 at the following positions:

– A112 for F:MB/CCG(A)

– A114 for F:MB/CCG(B)

– C 193 for F:SMSC(C)

Now the CCG-1 is not synchronized by the 2.048 MHZ of the CCG-0 anymorebut directly by the reference frequency.The change of the plug positions has to be finished within a time interval of twominutes. Otherwise the CCG-1 changes to holdover mode.

31 Switchover of CCG-0 to Synchronous Mode

b CONF CCG:CCG=0,OST=MBL;command repetition EXEC´D

Switch off CCG-0 converter

Pull module CCG11A

Set switch settings / solder straps to synchronous mode ......MMN:CCG,TAB LED:CCG

Plug in module CCG11A

Switch on CCG-0 converter

LED AL on the module faceplate of module CCG11A lights

After approx. 30 minutes the LED AL is switched off. The LEDs Ref0 (green),Ref1 (red) and A light up. After another 120 minutes the CCG-0 has to beconfigured to STB (If LED1 is lit).

b CONF CCG:CCG=0,OST=STB;command repetition EXEC´D

32 Connecting the second Reference Frequency to CCG-1

Plug the second reference frequency into the following position on CCG-1:

– B109 in F:MB/CCG(A)

– B111 in F:MB/CCG(B)


In CCG-0 the LED Ref 1 (red) is switched off. The green LED (Ref 0) indicatesthat Ref 0 is synchronizing.

A30808-X3063-A403-2-7630 PROC:CCG – 19

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33 Switchover of CCG-1 to Synchronous Mode

b CONF CCG:CCG=1,OST=MBL;command repetition EXEC´D

Switch off CCG-1 converter

Pull module CCG11A

Set switch settings / solder straps to synchronous mode ......MMN:CCG,TAB LED:CCG

Plug in module CCG11A

Switch on CCG-1 converter

LED AL on the module faceplate of module CCG11A lights

After approx. 30 minutes the LED AL is switched off. The LEDs Ref0 (green),Ref1 (red) and A light up. After another 120 minutes the CCG-1 has to beconfigured to STB (If LED1 is lit).

b CONF CCG:CCG=1,OST=STB;command repetition EXEC´D

END

PROC:CCG – 20 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:MBB – 1

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3.2 Off-line Installation of Message Buffer

MBB

3.2.1 Documents

The following documents are required as reference

– Maintenance Manual MMN:MB

– AKUHW Lists

PROC:MBB – 2 A30808-X3063-A403-2-7630


3.2.2 MB in Rack MB/CCG

3.2.2.1 Rack MB/CCG(Fuse Assignment for MB)

Fig. 3.2.1 Rack: MB/CCG(Fuse Assignment for MB)

A

B

MOLOC A001 (MB-1)


CD

Fuse panel

MUT02

MUT03

MUT06

MUT07

MUT08

MUT09

MUT01

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

04

14

FU

MOLOC A001 (MB-0)

MOLOC A001 (MB-1)

MOLOC A001 (MB-0)

MUT05

MUT04


F:SYPC(A)



SYPD (or empty)

A30808-X3063-A403-2-7630 PROC:MBB – 3

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3.2.2.2 Fuse Assignment R:MB/CCG

Basic system configuration extension frame for SN(252 LTG)

FU 1 11 4 14

MUT 02 03 08 09

UNIT MB-0:MBUS0-0MBUL0-0MBUL0-1

MB-1:MBUS1-0MBUL1-0MBUL1-1


MB1:MBUS1-1MBUL1-2MBUL1-3

Tab. 3.2.1 Fuse Assignment R:MB/CCG Basic Rack

Extension rack for SN (504 LTG)

FU 1 11 4 14

MUT 02 03 08 09





Tab. 3.2.2 Fuse Assignment R:MB/CCG Extension Rack

PROC:MBB – 4 A30808-X3063-A403-2-7630


3.2.3 MB in Rack SN/MB/LTGM

3.2.3.1 Rack SN/MB/LTGM(Fuse Assignment for MB)

Fig. 3.2.2 Rack: SN/MB/LTGM(Fuse Assignment for MB)

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

D


Fuse panel

C

DFU


MOLOC A001 (MB-0)

MOLOC A001 (MB-1)

08

22

F:MB/CCG(B)



F:MB/CCG(B)

A30808-X3063-A403-2-7630 PROC:MBB – 5

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3.2.3.2 Fuse Assignment R:SN/MB/LTGM

Basic RackCapacity stage until SN

(126LTG)

Basic RackCapacity stage until SN

(252LTG)

FU 8 22 FU 8 22

MUT 04 05 MUT 04 05



EINH MB-0:MBUS0-1MBUL0-2MBUL0-3


Tab. 3.2.3 Fuse Assignment R:SN/MB/LTGMBasic Rack / Extension Rack

Capacity stage until SN (504LTG)

Extension Rack Extension Rack

FU 8 22 FU 8 22

MUT 04 05 MUT 04 05



EINH MB-0:MBUS0-3MBUL0-6MBUL0-7


Tab. 3.2.4 Fuse Assignment R:SN/MB/LTGM Extension Racks

PROC:MBB – 6 A30808-X3063-A403-2-7630


3.2.4 MB in Rack CE

3.2.4.1 Rack CE(Fuse Assignment for MB)

Fig. 3.2.3 Rack CE(Fuse Assignment for MB)

C

DF:SMSC(C)-0

F:SMSC(C)-1

F:PIOP(A)

F:PBC(A)

F:PBC(A)

F:DEV

Fuse panel / AD:RAL

MUT02

MUT04

MUT03

MUT06

MUT09

MUT10

C

D

C

D

C

D

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

08

27

FU

MOLOC C259 (Supply for MB-0)

MOLOC C259 (Supply for MB-1)

292721 2523 31 33

30282622 3224

F:PIOPA)C

D

Air circulator

MUT11

MUT07

MUT05

MUT08

MUT01

Air circulator

Air circulator

A30808-X3063-A403-2-7630 PROC:MBB – 7

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3.2.4.2 Fuse Assignment MB(B) (R:CE)

3.2.5 Capacity stages

1 Basic Test (Rack)




2 Fuse Assignment MB(B)

The fuse assignment to the frames F:MB/CCG(B) / F:SMSC(C) is dependent onthe rack used:

Fuse assignment for switching on the MB in R:MB/CCG ...... (see 3.2.2.2)

Fuse assignment for switching on the MB in R:SN/MB/LTGM ...... (see 3.2.3.2)

Fuse assignment for switching on the MB in R:CE ...... (see 3.2.4.2)

3 Information Block

The MB can be delivered in different capacity stages (According to the capacitystage of the SN):

...... (see Tab. 3.2.6)

Rack CECapacity stage until SN (31LTG)

FU 8 27

MUT 02 04

UNIT MB-0 MB-1

FRAME SMSC-0 SMSC-1

Tab. 3.2.5 Fuse Assignment R:CE

Capacity stage of the SN Capacity stage of the MB(Number of frames)

Frame Type

SN 31 LTG (Rural Exchange) 2 (1 for MB-0 / 1 for MB-1) F:SMSC(C)

SN 63 / 126 LTG 2 (1 for MB-0 / 1 for MB-1) F:MB/CCG(B)

SN 252 LTG 4 (2 for MB-0 / 2 for MB-1) F:MB/CCG(B)

SN 504 LTG 8 (4 for MB-0 / 4 for MB-1) F:MB/CCG(B)

Tab. 3.2.6 Capacity stages

PROC:MBB – 8 A30808-X3063-A403-2-7630


4 Preparation

Switch off all DCCs of MB(B)

Unscrew all MB fuses

Mounting locations of the corresponding DCCs in R:MB/CCG ......(see Fig. 3.2.1)

Mounting locations of the corresponding DCCs in R:SN/MB/LTGM ......(see Fig. 3.2.2)

Mounting locations of the corresponding DCCs in R:CE ......(see Fig. 3.2.3)

5 Off-line Installation of the first / next Frame for (MB-0)

Screw in fuse of the first / next frame for MB-0

Fuse assignment for switching on the MB in R:MB/CCG ......(see 3.2.2.2)

Fuse assignment for switching on the MB in R:SN/MB/LTGM ......(see 3.2.3.2)

Fuse assignment for switching on the MB in R:CE ......(see 3.2.4.2)

Check that all corresponding modules are plugged in

Switch on corresponding DCC for MB-0

Mounting location of the corresponding DCC in R:MB/CCG ......(see Fig. 3.2.1)

Mounting location of the corresponding DCC in R:SN/MB/LTGM ......(see Fig. 3.2.2)

Mounting location of the corresponding DCC in R:CE ......(see Fig. 3.2.3)


6 Check DCC (MB-0)

Pull all related modules but leave in position


7 Fault Clearance DCC / Fuse (MB-0)

Possible fault cause: DCC or main fuse defective

Switch off the DCC affected

Screw out corresponding fuse

– If fuse is suspect to be faulty h...8– If DCC is suspect to be faulty h...9

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8 Replace Fuse

Replace affected fuse with spare fuse h...10

9 Replace DCC

Replace affected DCC with spare DCC h...10

10 Check Spare DCC / Fuse

Screw in fuse again

Switch on corresponding DCC again


11 Fault Clearance Modules (MB-0)

Insert first / next corresponding module


12 Decision: next Module (MB-0)

Have all corresponding modules already been tested? Y h...15N h...11

13 Replace Module (MB-0)

The module last inserted is suspect to be faulty

Replace module with spare module




– Repeat installation test after successful fault clearance h...5

PROC:MBB – 10 A30808-X3063-A403-2-7630


15 Off-line Installation of the first / next Frame for (MB-1)

Screw in fuse of the first / next frame for MB-1

Fuse assignment for switching on the MB in R:MB/CCG ......(see 3.2.2.2)

Fuse assignment for switching on the MB in R:SN/MB/LTGM ......(see 3.2.3.2)

Fuse assignment for switching on the MB in R:CE ......(see 3.2.4.2)

Check that all corresponding modules are plugged in

Switch on corresponding DCC for MB-1

Mounting location of the corresponding DCC in R:MB/CCG ......(see Fig. 3.2.1)

Mounting location of the corresponding DCC in R:SN/MB/LTGM ......(see Fig. 3.2.2)

Mounting location of the corresponding DCC in R:CE ......(see Fig. 3.2.3)


16 Check DCC (MB-1)

Pull all related modules but leave in position


17 Fault Clearance DCC / Fuse (MB-1)

Possible fault cause: DCC or main fuse defective

Switch off the DCC affected

Screw out corresponding fuse

– If fuse is suspect to be faulty h...18– If DCC is suspect to be faulty h...19

18 Replace Fuse

Replace affected fuse with spare fuse h...20

19 Replace DCC

Replace affected DCC with spare DCC h...20

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20 Check Spare DCC / Fuse

Screw in fuse again

Switch on corresponding DCC again


21 Fault Clearance Modules (MB-1)

Insert first / next corresponding module


22 Decision: next Module (MB-1)

Have all corresponding modules already been tested? Y h...25N h...21

23 Replace Module (MB-1)

The module last inserted is suspect to be faulty

Replace module with spare module




– Repeat installation test after successful fault clearance h...15

25 Decision: Next Frame

Have all frames of the MB already been put into service? Y h...ENDN h...5

END

PROC:MBB – 12 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:SYP – 1

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3.3 Off-line Installation Test of the System Panel

SYP

3.3.1 Documentation

The following documentation will be needed for reference:

– Maintenance Manual MMN:SYP / MMN:SYP for CDE

– AKUHW lists

– NIMN:SYP for the programming of the USER-PROM

PROC:SYP – 2 A30808-X3063-A403-2-7630


3.3.2 Rack R:MB/CCG(Fuse Assignment for SYP)

Fig. 3.3.1 Rack R:MB/CCG(Fuse Assignment for SYP)

A

B


CD

Fuse panel

MUT02

MUT03

MUT06

MUT07

MUT08

MUT09

MUT01

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

MUT05

MUT04


F:SYPC(A)



SYPD (or empty)

05

06

07

08

03

09

15

FU

MOLOC A116 (DCCCL) (10A)

MOLOC A001 (DCCCR) (10A)

(SYPD0) (1A)

(SYPD2) (1A)

MOLOC A043 (TXA:SYPC) (1A)

(SYPD1) (1A)

(SYPD3) (1A)

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3.3.3 Rack R:CE(Fuse Assignment for SYP)

Fig. 3.3.2 Rack R:CE (Fuse Assignment for SYP)

C

DF:SMSC(C)-0

F:SMSC(C)-1

F:PIOP(A)

F:PBC(A)

F:PBC(A)

F:DEV

Fuse panel / AD:RAL

MUT02

MUT04

MUT03

MUT06

MUT09

MUT10

C

D

C

D

C

D

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

02

06

FU

MOLOC C101 (DCCCR) (10A)

SYPD0 (10A)

292721 2523 31 33

30282622 3224

F:PIOPA)C

D

Air circulator

MUT11

MUT07

MUT05

MUT08

MUT01

Air circulator

Air circulator

M:T/RM:SYCR and alarm transfer (10A)

MOLOC C101 (DCCCR for CDEX) (10A)

11

23

PROC:SYP – 4 A30808-X3063-A403-2-7630


3.3.4 Rack R:SE(Fuse Assignment for SYP)

Fig. 3.3.3 Rack R:SE (Fuse Assignment for SYP)

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

A

B

any Equipment

CD

Fuse panel

MUT02

MUT03

MUTxx

MUT01

A

B

A

B

MUT05

any Equipment

any Equipment

18

08

09

17

MOLOC A116 (DCCCL) (10 A)

07

10

16

FU

MOLOC A001 (DCCCR) (10 A)

(SYPD3) (1 A)

(SYPD1) (1 A)

MOLOC A043 (TXA:SYPC) (1 A)

(SYPD0) (1 A)

(SYPD2) (1 A)

MUT04

A

B

F:SYPC(A) orany Equipment

A

B

any Equipment

MUT17

A

B

F:SYPC(A) orany Equipment

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3.3.5 Introduction

The system panel is supplied in a number of different variants, e.g.:

– The SYP can be located in F:SYPC or in F:SMSC(C) (Rural Exchanges)

– with one or two system panel displays

– with or without module TXA:SYPC for the forwarding of alarms (in F:SYPC)

– with CDEX modules built into the frame for the 2.048-MHz clock distribution incl. DCconverters

For the position of the SYP in the EWSD system, see Fig. 3.3.4.

In the installation test phase of an EWSD/MSC network node, the SYP must beplaced in service in a minimum configuration.

All other work, such as the connection of external alarms and additional SYPDs, shouldbe carried out after installation testing or when the node is in service.

PROC:SYP – 6 A30808-X3063-A403-2-7630


3.3.5.1 Position of the SYP in the EWSD System

Fig. 3.3.4 Position of the SYP in the EWSD system

AC/DC

E&Mtrans-mission

MDF/DDF

SYPD

SYPD

F:SYPC in R:MB/CCG: F:SMSC(C)-0 in R:CE

Alternative

CP/IOP

F:SMSC(C)-1 in R:CE

CP/IOP

AC/DC

E&Mtrans-mission

OMC

MDF/DDF

SYPD

SYPD

OMC

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3.3.6 Requirements for Installation Testing

• The Maintenance Manual MMN:SYP (MMN:SYP for CDE) must be available

• The cable laying list must be available

• If the SYP is located in F:SYPC, the F:SYPC must be equipped with the followingmodules at least:

– DCCCR

– COM:SYPC

– IOC:SYPC

– RM:EA

– T/RM:EAFor mounting locations, see Fig. 3.3.7.

• If the SYP is located in F:SMSC(C), the F:SMSC(C) must be equipped with thefollowing modules:

– DCCCR

– GCGR

– PU:SYCR

– T/RM:SYCRFor mounting locations, see Fig. 3.3.8.

• One SYPD must be connected directly using cable type 225 (e.g. at SYP mountinglocation B034 in F:SYPC / C 135 in F:SMSC(C))

• The power supply is fed to the SYPD via the same cable.Requirement: Fuse for -UE -48/60 V is inserted.

• A programmed USER-PROM is mounted on module COM:SYPC / PU:SYCR (stan-dard PROM with the designation V30113-....) (see Fig. 3.3.5) / (see Fig. 3.3.6).Note:This USER-PROM is pre-programmed for one SYPD-0 and one SYPD-1.If only one SYPD is installed, the double SYP indicator lights up when the SYP isactive and in service, and messages are output stating that the number of SYPDsdoes not match the number of SYPDs programmed in the USER-PROM.

PROC:SYP – 8 A30808-X3063-A403-2-7630


• ESD safety precautions must be observed, i.e. a grounding bracelet must beworn, for instance.

3.3.6.1 Location of the USER-PROM

Fig. 3.3.5 Location of the USER-PROM on module COM:SYPC

Fig. 3.3.6 Location of the USER PROM on module PU:SYCR.

COM:SYPC

USER-PROM (V30113-J122-A1) EPROM 2732

Standard PROM or Exch. Spec. PROM

PU:SYCR

USER-PROM (V30113-J122-A1) EPROM 2764

Standard PROM or Exch. Spec. PROM

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3.3.6.2 Overview of SYP Connections in F:SYPC

Fig. 3.3.7 Overview of system panel connections in F:SYPC

DCCCR IOC:SYPC

COM:SYPC

RM:EA T/RM:SYPC

0

T/RM:SYPC

1

TXA:SYPC

A001 A013 A019 A025 A031 A037 A043

B2 034 A2 040 A2 034 B2 040 A2 028 B2 028

B2 016B2 010

A2 016A2 010

A2 022 A2 046 B2 046

T/R E1/M1 E2/M2 E3/M3 T/R

E1/M1

E2/M2

E3/M3

2DR

4DR

4DR

4DR

T/R

E1/M1

E2/M2

E3/M3

SYPD0

SYPD1

E&M

E&M

MDFSYPD0-3 SYPD4-7SYPD1 SYPD2 SYPD3

OMC

Optional Optional

Backplane connector:

SYPD0 2-wire only

SYPD1-3 4-wire

EWSD node

SYPC(A)S30804-B2573-

AL1..AL12 AL13..AL24

EDL1..EDL24

External alarmsfrom the MDF1-24 Alarm forwarding to

other OMCs

to the MDF

IOP-0 IOP-1

to/from CP

Backplaneconnector:

SYPD with -UE power supplyvia SYP from the fuse panel

SYPD with internal 220 V ACpower supply

PROC:SYP – 10 A30808-X3063-A403-2-7630


3.3.6.3 Overview of SYP Connections in F:SMSC(C)

Fig. 3.3.8 Overview of system panel connections in F:SMSC(C)

DCCCR GCGR PU:SYCR T/RM:SYCR

C101 C119 C129 C141

C 135 D141 D 141

D 107D 113

C 107C 113

D 141 D 141

T/R E1/M1 T/R

E1/M1

2DR

4DR

SYPD0

SYPD1

E&M

E&M

MDFSYPD0-1SYPD1

OMC

Backplane connector:

SYPD0 2-wire only

SYPD1 4-wire

EWSD node

SMSC(C)-0S30804-B2693-

AL1..AL8EAI1..EAI8

External alarmsfrom the MDF 1-8

Alarm forwarding toother OMCs

to the MDF

IOP-0 IOP-1

to/from CP

Backplaneconnector:

SYPD with -UE power supplyvia SYP from the fuse panel

SYPD with internal 220 V ACpower supply

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3.3.7 SYPD

Every EWSD exchange is equipped with at least one system panel display (SYPD),which is able to display:

– alarms and indications from specific units in the system

– general system alarms

– the current call-processing load on the processor

– external alarms

Alarms and indications are indicated visually (LED indicators) and audibly (horn) on theSYPD.

The indicators on the SYPD are arranged in three sections:

– system unit alarms

– general system alarms

– external alarms

A front view of the SYPD is shown in Fig. 3.3.9

PROC:SYP – 12 A30808-X3063-A403-2-7630


3.3.7.1 Front View of the SYPD

Fig. 3.3.9 Front view of the system panel display SYPD

Maint.alarm

Switchingnetwork

Line/trunk groupsLTG

Coordination processorCP

System panelSYP

External alarmsMonth Day Time

Update

Servicealarm

Ext.Equip.

Processorload

ERL

Central unit

Clock

Messagebuffer

Commonchannelsignaling

Test Accept

TGRP alarm

Line lockout

Signalinglink

Callidentification

Trunk groupblocked

Cat. 1

Cat. 2

Systemoperator

ExternalDLU alarms

Admin.alarm

Recovery

Time insecure

HW units MBL

Sig. linksblocked

Alarmsuppression

Labels for the external alarms must be affixed in accordance with thecustomer’s requirements and the programming of the USER-PROM.

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3.3.7.2 SYPD Modules

Fig. 3.3.10 SYPD modules

Loosen screws to access modulesEWA (DC/DC converter) andT/RM:SYPD

Open SYPD:(module DYM:SYPD swung to the side)

Loosen screws to openthe SYPD

SYPD front view:

Open SYPDModule DYM:SYPD and shielding panelswung to the side

T/RM:SYPD

EWA (DCDCInternal horn

Module DYM:SYPD(swung to the side)

Shielding panel and support formodules EWA:SYPD andT/RM:SYPD (attached behind)

1 2

22 11

Hornvolume

Ext. horn1=off2=ON

Int. horn1=off2=ON

Transm. MB1=open2=grounded

Plug position forSYP/SYPD interface

+UE -UE

to external horn

to internal horn

Plug position forSYP/SYPD interface

DC from:ACC (220/110 V AC power supply)or -48//-60 V DC power supply

PROC:SYP – 14 A30808-X3063-A403-2-7630


3.3.8 Connection of SYPDs

3.3.8.1 GeneralThe system panel displays (SYPD) are controlled by the system panel control (SYPC)or the system panel control rural (SYCR).

In DE4 and DE5 switches, the system panel control is installed in module frameSYPC(A) (B2573) and can be linked to a maximum of 8 SYPDs. This frame can alsoaccommodate up to 10 CDEX modules (Q900) for external synchronization.In DE3 switches (rural exchanges), the smaller system panel control SYCR is used,which can be linked to a maximum of 2 SYPDs. SYCR is installed in module frameSMSC (B2693) together with the clock generator, message buffer and switchingnetwork.

3.3.8.2 Options for the Connection of the System Panel Display SYPDThe SYPD can be installed locally or in a remote location, depending on the application.The transmission medium and cabling required between a remote SYPD and theSYPC/SYCR depends on the distance between them.An overview of the different options is shown in Fig. 3.3.11.Further information on the signaling methods and cabling are shown in Fig. 3.3.12 andFig. 3.3.13.

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Fig. 3.3.11 Options for the connection of the systempanel display SYPD

T/RM:SYPCT/RM:SYCR

(4-wire transmission)Range 2 * 200 Ω= ca. 3km (1)

(4-wire transmission)Range 2 * 200 Ω= ca. 3km (1)

Loop signaling(2-wire transmission)Range 2 * 750 Ω= ca. 11 km (1)

Line leading to carrierequipmentE&M signaling(4-wire transmission)Range 2 * 200 Ω= ca. 3 km (1)

SYPD

SYPD

SYPD

SYPD

DF

FDM/PCMequipment

MDF DF

MDF DF

Maintenance centre

< 3 km

< 3 km

< 11km

FDM/PCM link

FDM/PCMequipment

MDF

Exchange Maintenance room Remote building

with remote power feedmax. 200 m

Every SYPD must have its own power supply (-48/60 VDC or 110/220 VAC).

If a SYPD uses remote power feeding, the maximum range with standard cabling is 200m.

(1) applies to copper lines with a diameter of 0.6mm

PROC:SYP – 16 A30808-X3063-A403-2-7630


Fig. 3.3.12 E&M signaling (4-wire transmission)

TX

RX

TX

RX

FDM/PCM equipmentSystem panel controlSYPC / SYCR

M/SAB

(MA)

(MB)

TX

RX

TX

RX

System panel displaySYPD

2BR

1

GND

2BR

1

GND

E/SAN

(EA)

(EB)

-UB

-UB

GND GND

E/SAN

(MA)

(MB)

-UB

-UB

GND

GND

E/SAN

(EA)

(EB)

FDM/PCM

link

For explanations see Tab. 3.3.1

FDM/PCM equipment

DISPLAY

MODULE

CONTROL

MODULE

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Fig. 3.3.13 Loop signaling (2-wire transmission)

Explanations:

-UB: Exchange voltage -48/60 V

GND: Ground

RX: Receiver

BR: Switch1= FDM/PCM equipment has ground2= FDM/PCM does not offer ground

TX: Transmitter (fully electronic, transistors as switches)It must be ensured that the voltages to be switched by the transmissionequipment lie in the range -48/-60V.

Tab. 3.3.1 Explanations on E&M and loop signaling

TX

RX

Displaymodule

RX

-UB GND

TX

A (T) (T) A

System panel controlSYPC, SYCR

Two-wire linewith loop signaling

B (R) (R) B

System panel displaySYPD

For explanations see Tab. 3.3.1

CONTROL

MODULE

PROC:SYP – 18 A30808-X3063-A403-2-7630


3.3.8.3 Location of BR switches on T/RM:SYPC / T/RM:SYCRSwitch BR:

This switch is used to connect the MB-line to ground in Position 2 for the SYPD whichruns via 4-wire method on the transmit side.

This is necessary, for example, if a connected carrier frequency device is not grounded.

Fig. 3.3.14 SYPD E&M grounding on T/RM:SYPC

Range when using E&M signaling (4-wire lines):between SYPC/SYCR and FDM/PCM equipment: each 2*200 ohm (ca. 3 km *))between the two FDM/PCM equipments: varies according to FDM/PCM systembetween FDM/PCM equipment and SYPD: each 2*200 ohm (ca. 3 km *) )

*) applies to copper lines with a diameter of 0.6 mm

Range when using loop signaling (2-wire lines):between SYPC/SYCR and SYPD: each 2*750 ohm (ca. 11 km)(applies to copper lines with a diameter of 0.6 mm)

Explanations:

Tab. 3.3.1 Explanations on E&M and loop signaling

21

3BR

21

212BR

1BR

MB transmission1= open2= grounded

E&M interface 3

E&M interface 2

E&M interface 1

T/RM:SYPC

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Fig. 3.3.15 SYPD E&M grounding on T/RM:SYCR

3.3.8.4 Installing A Second SYPD in the Same BuildingA second SYPD can be connected directly to the SYP using standard EWS cable, butthe length of the cable must not exceed 200 meters.In this case, the SYPD does not need any external power supply from a 220V powerpack or -48/-60V, because it is fed by the SYP. Check that the correct fuse is insertedin the rack for this SYPD.

When using the standard USER-PROM, the SYPDs must be installed as SYPD 0and SYPD 1.

If the MB wire on the transmission side of the 4-wire ports needs to be grounded, thecorresponding switch must be set to position 2 on module T/RM:SYPC (see Fig. 3.3.14)(T/RM:SYCR in F:SMSC(C) (see Fig. 3.3.15)) and on module T/RM:SYPD(see Fig. 3.3.10) .

3.3.8.5 Installing a Second SYPD in Another Building Without TransmissionEquipmentRange:2-wire: 2*750 ohm ca. 11 km4-wire: 2*200 ohm ca. 3kmThe choice of 2-wire or 4-wire line to connect the remote SYPD depends on the distance(see Fig. 3.3.11).

The interfaces of SYP and SYPD are illustrated in: Fig. 3.3.16 - Fig. 3.3.19

21

BR

MB transmission1= open2= grounded

E&M interface

T/RM:SYCR

PROC:SYP – 20 A30808-X3063-A403-2-7630


The 2-wire or 4-wire transmission lines originate at mounting location A 028 of the SYPand run parallel to the SYP backplane mounting locations on the special MDF terminalstrip.

Caution: It must be ensured that each SYPD has its own transmission link.

When using 2-wire lines, wire R at the SYP is connected to wire R of the SYPD and wireT of the SYP is connected to wire T of the SYPD.

When using 4-wire lines, wire MA at the SYP is connected to wire EA of the SYPD andwire MB of the SYP is connected to wire EB of the SYPD. The connections in the otherdirection are made on the same principle.

Power feeding of the SYPD is either from the -48/-60V exchange voltage or from an inte-gral 110/220V power pack.

Attach labels to the SYPD as described in the procedure.Check the horn setting.

3.3.8.6 Installing a Second SYPD in Another Building With TransmissionEquipmentE&M signaling is used on the link between SYP and SYPD. In other words, the trans-mitting SYP or SYPD sets the input voltage for transmission by means of an electronicswitch to approximately 0V or the original value (usually 48/60V).On PCM links, these signals are carried in channel 16 and converted back into E&Msignals at the other end for transfer to the SYP/SYPD.For this reason, signaling converters are needed in conjunction with PCM links.

In carrier systems, these signals are transmitted outside the voice band (out-bandsignaling).

Range: unlimited

The interfaces of SYP and SYPD are shown in: Fig. 3.3.16, Fig. 3.3.18

Caution: It must be ensured that each SYPD is assigned its own transmission link.

The SYPD is fed either with the -48/-60V exchange voltage or from an integral 110/220Vpower pack.

Attach labels to the SYPD as described in the procedure.Check the horn setting.

If necessary, set the switches for grounding of signal MB in SYP and SYPD.

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3.3.8.7 Block Diagram of the SYPD and its Interfaces

Fig. 3.3.16 Block diagram of the SYPD and its interfaces

T/RM:SYPD

DCC

ACC:SYPD

Option

MAMBEAEBRT

43

4445465556

1314

16

17

DYM:SYPD

B2

A2

4-wire

2-wire

DC fromframe

to/from SYP:

Internal horn

External horn

- UE

- UEDC from OMC

110 / 220 V AC

Standard

DC from transformerand rectifier

Connector pinnumber:

345

615

16535456

57

PROC:SYP – 22 A30808-X3063-A403-2-7630


3.3.8.8 R/T and E+M Interfaces in F:SMSC for SYPD-0 - SYPD-1

Fig. 3.3.17 R/T and E+M interfaces in F:SMSCfor SYPD-0 - SYPD-1

SYPD 0

SYPD 1

EA= Ear AMA= Mouth A

C 135

Pin 56,57 -UEPin 53,54 GNDto SYPDpower supply

T15

R16

53T

54R

55EA

56EB

57MA

58MB

Module T/RM:SYCRCD 141

to SYPD-0

to MDF / DDF(External SYPDs)

Grounded if signalground is available. Inthis case only the EA orMA signals areconnected

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3.3.8.9 R/T and E+M Interfaces in F:SYPC for SYPD-0 - SYPD-3

Fig. 3.3.18 R/T and E+M interfaces in F:SYPCfor SYPD-0 - SYPD-3

15 T16 R

A2 028

SYP backplaneconnector

SYPD 0

3 EA14 EB1

5 MA16 MB1

SYPD 1

7 EA28 EB2

9 MA210 MB2

SYPD 2

11 EA312 EB3

13 MA314 MB3

SYPD 3


B2 034

Pin 55, 56 -UEPin 53, 54 +UEto SYPDpower supply

T15

EA3

EB4

R16

MA5

MB6

A2 034


EA3

EB4

MA5

MB6

A2 040


EA3

EB4

MA5

MB6

B2 040


46T

47R

8EA1

9EB1

23MA1

41MB1

30EA2

31EB2

49MA2

50MB2

3EA3

6EB3

45MA3

42MB3

Module T/RM:SYPCA2 031

to SYPD-0 to SYPD-1 to SYPD-2 to SYPD-3

ExternalSYPDs to MDF/ DDF

Pin numbers corre-spond to numbering onthe module backplane!Example: Backplane pin3 is connector pin 43

Grounded if signalground is available. Inthis case only the EA orMA signals areconnected

PROC:SYP – 24 A30808-X3063-A403-2-7630


3.3.8.10 R/T and E+M Interfaces for SYPD-5 - SYPD-8

Fig. 3.3.19 R/T and E+M interfaces in frame SYPCfor SYPD-5 - SYPD-8

15 T16 R

A2 028

SYP backplaneconnector

SYPD 5

3 EA14 EB1

5 MA16 MB1

SYPD 6

7 EA28 EB2

9 MA210 MB2

SYPD 7

11 EA312 EB3

13 MA314 MB3

SYPD 8


46T

47R

8EA1

9EB1

23MA1

41MB1

30EA2

31EB2

49MA2

50MB2

3EA3

6EB3

45MA3

42MB3

Module T/RM:SYPCA2 037

ExternalSYPDs to MDF/ DDF

Pin numbers corre-spond to numbering onthe module backplane!Example: Backplane pin3 is connector pin 43

Grounded if signalground is available. Inthis case only the EA orMA signals areconnected.

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3.3.8.11 Installation of More Than 4 SYPDs (only in F:SYPC)Module T/RM:SYPC has interfaces to four SYPDs. Additional SYPDs (maximum 8) canbe connected if another T/RM:SYPC module is installed (see Fig. 3.3.7).

3.3.9 The User EPROM (USMOF)

External alarms can be displayed at the SYPD. The way in which external alarms aredisplayed (alarm priority and lamp address) must be programmed in the user EPROM(USMOF). In addition, it is possible to analyze the duration of alarms by means of timersand raise their priority where appropriate.

To adapt alarm signaling (external alarm inputs) to specific customer requirements,parameter sets are provided which are stored in the user EPROM. Parameters includethe assignment of alarm events to their display and priority in the external alarm section(all other alarms are controlled by the coordination processor CP). It is also defined inthe user EPROM which SYPDs are connected, which one of them is operating as themaster panel, the horn time limit and the CP supervision time.Programming of the USER-PROM is described in NIMN:SYP.

3.3.10 Connection of an External Horn

The same type of horn is used externally and internally (telephone transmitter amplifier).For its connection, see Fig. 3.3.10

3.3.11 Connection of External Alarms to the SYPD

External alarm lines are connected to the MDF special terminal strip and jumpered tothe SYP’s external alarm inputs at the MDF.

The unit issuing the alarm can send signals to the SYP as follows:

• With normally open contact: The unit switches ground to the SYP with its contact

• With normally closed contact: The unit interrupts ground to the SYP with its contact

Connection of alarm lines to the MDF

• With one wire: The other side of the contact is connected to the common ground inthe unit issuing the alarm

• With two wires: One wire is connected to the MDF. The other wire is connected tothe MDF’s common ground.

The SYP ground is connected to the MDF over one wire of the alarm cable.

For a graphical representation of the various connection options see Fig. 3.3.20.

PROC:SYP – 26 A30808-X3063-A403-2-7630


Fig. 3.3.20 Methods of connecting alarm lines to the MDF

The assignment of connector pins on cable 223 to the MDF is shown in Fig. 3.3.21,Fig. 3.3.23, Fig. 3.3.24:

1-wire:

SYPExternalequipment

1-wire:


External alarms, closed loop (cl) External alarms, open loop (ol)

2-wire:


2-wire:


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Fig. 3.3.21 Alarm inputs on the backplane connector of cable 223(32 wires) from the MDF to the SYP (module RM:EA)

Connectorpin no.

1

20

41

60

Connectorpin no.

A 022

No. of theexternalalarm

EAL 1

EAL 2

EAL 3

EAL 4

EAL 5

EAL 6

EAL 7

EAL 8

EAL 9

EAL 10

EAL 11

EAL 12

EAL 13

EAL 14

EAL 15

EAL 16

EAL 17

EAL 18

EAL 19

EAL 20

EAL 21

EAL 22

EAL 23

EAL 24

notused

notused

Groundfrom SYP


PROC:SYP – 28 A30808-X3063-A403-2-7630


Fig. 3.3.22 Alarm inputs on the backplane connector of moduleT/RM:SYCR from the MDF to the SYP

Fig. 3.3.23 Assignment of external alarms on the horizontal MDF

Connectorpin no.

41

60 20

D 141


EAJ 1

EAJ 2

EAJ 3

EAJ 4

EAJ 5

EAJ 6

EAJ 7

EAJ 8

Connectorpin no.

01

EAL1

EAL 8

EAL9

EAL12

EAL13

EAL20

EAL21

EAL24

GND

not usednot used

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Fig. 3.3.24 Assignment of external alarms on the vertical MDF

3.3.11.1 Test of AlarmsAlarm as normally open contact:Apply ground to the corresponding MDF input. The corresponding SYPD LED shouldthen light up.

Alarm as normally closed contact:The SYPD LED is lit when the alarm is programmed as normally closed contact and thealarm input is open. Applying ground switches off the alarm and the correspondingSYPD LED goes off.

3.3.12 Forwarding of Alarms with Module TXA:SYPC / T/RM:SYCR

Module TXA:SYPC or T/RM:SYCR is used to forward alarms from the system panelcontrol. Up to 24 (max.8 in the case of T/RM:SYCR) different SYPD indications can beforwarded to external fault signaling equipment via relays. It is defined in the userEPROM which priorities of alarms (critical, major, minor) on which SYPD indicator areoutput to one or more relays. The assignment of relays to alarm lines (AL) is fixed. Therelays have the same designation as the alarm lines and their contacts are marked al.

EAL1 EAL 8

EAL9 EAL12

EAL13 EAL20

EAL21 EAL24 GND

not used

not used

Groundfrom SYP

PROC:SYP – 30 A30808-X3063-A403-2-7630


Electrically, there are four ways of forwarding alarms (see also Fig. 3.3.25):

a) contact switches ground on or off

b) contact switches -48V / -60V on or off

c) contact switches a passive loop on or off

d) contact switches an active loop carrying -48V / -60V on or off

Resistors or jumpers must be inserted for each relay or wire pair in the jumper field ofmodule TXA:SYPC / T/RM:SYCR, in accordance with the type of alarm forwarding used,as shown in Fig. 3.3.25 (resistors are included with the rack delivery package).

The position of the jumper field on module TXA:SYPC is shown in: MMN:SYP-TAB .

The position of the jumper field on module T/RM:SYCR is shown in: MMN:SYP for CDE-TAB.

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3.3.12.1 Connections on the Jumper Field for Alarm Output (TXA:SYPC /T/RM:SYCR)

Fig. 3.3.25 Connections on the jumper field for alarm output

=

.8

0.1M

470

-UB

A B

≥ 2K

DB.7

.4

.5

.2

=

.8

0.1M

470

GND “B”

A B

≥ 2K

DB.7

.4

.5

.2

=

.8

0.1M

470

A B

DB.7

.4

.5

.2

=

.8

0.1M

470

-UB

A B

DB.7

.4

.5

.2

.1 .1 .1 .1

DB

-UB

GND “B”

.3.3.3.3

GND “B”

RA RB

RA+RB≥ 2K

R or DB

Receiver≥ 2K

a) Ground

R = 1000 ohm P Wid 51 V39200-Z4102-J or equivalentDB = Wire link-UB = Exchange voltage -48/-60 VGND “B” = Ground B

The link between .7 and .8 must always be inserted. Certain input circuits of external alarm receiversmay require that it be open.

b) Power c) Passive loop d) Active loop

PROC:SYP – 32 A30808-X3063-A403-2-7630


3.3.12.2 Connector Pin Assignment for Alarm Forwarding (ModuleTXA:SYPC)

Fig. 3.3.26 Connector pin assignment for alarm forwarding on module TXA:SYPC

Connectorpin no.

1

20

41

60

Connector pin no.

A 046

Alarmnumber

AL 1B

AL 2B

AL 3B

AL 4B

AL 5B

AL 6B

AL 7B

AL 8B

AL 9B

AL 10B

AL 11B

AL 12B

notused

notused

notused

AL 1A

AL 2A

AL 3A

AL 4A

AL 5A

AL 6A

AL 7A

AL 8A

AL 9A

AL 10A

AL 11A

AL 12A

notused

1

B 046

AL 13B

AL 14B

AL 15B

AL 16B

AL 17B

AL 18B

AL 19B

AL 20B

AL 21B

AL 22B

AL 23B

AL 24B

notused

notused

AL 13A

AL 14A

AL 15A

AL 16A

AL 17A

AL 18A

AL 19A

AL 20A

AL 21A

AL 22A

AL 23A

AL 24A

notused

60 20

41

notused

Alarmnumber

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3.3.12.3 Connector Pin Assignment for Alarm Forwarding (ModuleT/RM:SYCR)

Fig. 3.3.27 Connector pin assignment for alarm forwardingon module T/RM:SYCR

3.3.13 Notes on Installation Testing of the SYPD

To test the EWSD installation, the SYP equipment and SYPD (in the exchange) mustfirst be tested and placed in service. A remote SYPD cannot be included in the installa-tion test until the customer has installed the required 2-wire or 4-wire transmission linkto the OMC (see also Fig. 3.3.11).

Module TXA:SYPC (S30810-Q759-..) (T/RM:SYCR in F:SMSC) is used for theforwarding of alarms to the OMC or another location. The jumpers on this module aresoldered in when the customer’s requirements have been clarified. Alarms to beforwarded that are not included in the standard USER-PROM must be programmed inaddition.

How external alarms are received (RM:SYPC / T/RM:SYCR) must also be clarified withthe customer. The external alarms must be programmed in the USER-PROM.

Connectorpin no.

41

60

01

20

Connector pin no.

D 141

AL 1A

AL 1B

AL 2A

AL 2B

AL 3A

AL 3B

AL 4A

AL 4B

AL 5A

AL 5B

AL 6A

AL 7A

Alarmnumber

AL 6B

AL 7B

AL 8A

AL 8B

PROC:SYP – 34 A30808-X3063-A403-2-7630


If only one SYPD is deployed in the exchange, its cable connector is plugged into back-plane mounting location B034 (C135 in F:SMSC(C)) as SYPD 0. If power is supplied viathe exchange voltage, it is fed to the SYPD via the corresponding SYPD fuse in theSYPC If a second SYPD is installed in the OMC as a remote SYPD, then this SYPDmust have its own power pack, because remote feeding from the exchange is notpossible over a distance of more than 200m. If two SYPDs are installed, it must beensured that they are connected to different transmitters/receivers in the modulesT/RM:SYPC / T/RM:SYCR.Cabling from the transmitter/receiver modules T/RM:SYPC / T/RM:SYCR to the MDFruns via the backplane cable at mounting location A028 / D141.Using a 2-wire line, a distance of up to 11 km can be bridged between SYPC and SYPD.Over greater distances, a 4-wire E&M line must be used.(see also Fig. 3.3.11)

1 Basic Test of Rack

Check the rack equipment and revision statuses (issues) against the exchangeconfiguration documents (AKUHW lists), if this has not already been done.


Perform a visual inspection of the wire-wrap fields for bent pins, short circuits,contacts and foreign objects.

System panel

MOLOC onbackplane

ofF:SYPC(A)

Transmissionline

Comments

SYPD0 B034 2-wire Remote SYPD or SYPD in the exchange

SYPD1 A040 4-wire Remote SYPD or SYPD in the exchange

SYPD2 A034 4-wire

SYPD3 B040 4-wire

Tab. 3.3.2 Mounting locations of SYPD connections on F:SYPC(A)

System panel

MOLOC onbackplaneof F:SMSC

Transmissionline

Comments

SYPD0 C 135 2-wire Remote SYPD or SYPD in the exchange

SYPD1 D 141 4-wire Remote SYPD or SYPD in the exchange

Tab. 3.3.3 Mounting locations of SYPD connections on F:SMSC(C)

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2 Create Basic State

Note: The assignment of fuses and DCCs depends on the rack used :

If SYP is installed in R:MB/CCG ...... (see Fig. 3.3.1)

If SYP is installed in R:CE ...... (see Fig. 3.3.2)

If SYP is installed in R:SE ...... (see Fig. 3.3.3)

Make sure that all SYP fuses have been unscrewed

Make sure that all SYP DCCs are switched off

3 Connect the SYPD

In the installation test phase of an EWSD/MSC network node, the SYP must beplaced in service in a minimum configuration. In other words, the SYPD must beinstalled in the exchange for the basic test as SYPD0 using cable type 225.

If SYP is installed in F:SYPC ...... (see Fig. 3.3.7)

If SYP is installed in F:SMSC ...... (see Fig. 3.3.8)

Power is supplied to the SYPD via the same cable as soon as the fuse for -UE -48/60 V is inserted.

4 Check Switch Settings

– If SYP is installed in R:MB/CCG:Check the position of the switches on module T/RM:SYPC i ...MMN:SYP, TAB

– If SYP is installed in R:CE:Check the position of the switches on module T/RM:SYCR i ...MMN:SYP for

CDE, TAB

PROC:SYP – 36 A30808-X3063-A403-2-7630


5 Insert USER-PROM

Caution: ESD safety precautions must be observed, i.e. a grounding braceletmust be worn, for instance.

The USER-PROM supplied on module COM:SYPC / PU:SYCR (standardPROM with the designation V30113-....) is pre-programmed for one SYPD-0and one SYPD-1.If only one SYPD is installed, the double SYP indicator lights up when the SYPis active and in service, and messages are output stating that the number ofSYPDs does not match the number of SYPDs programmed in the USER-PROM.Customer requirements that call for modifications in the USER-PROM shouldnot be programmed into the USER-PROM until after installation testing.

Programming of the USER-PROM is described in: ......NIMN:SYP

Position of the USER-PROM on module COM:SYPC: ......(see Fig. 3.3.5)

Position of the USER-PROM on module PU:SYCR: ......(see Fig. 3.3.6)

Insert the standard PROM or customized USER-PROM on module COM:SYPC/ PU:SYCR.

6 Attach Labels on SYPD

Undo the four screws on the front of the SYPD. ......(see Fig. 3.3.10)

After removing the front, unfasten the light-colored plastic panel behind thetransparent front face and remove it.

Attach the adhesive labels from the supplied label sheet in the marked areas, ifthis has not been done already.The labels for external alarms are not attached until the customized USER-PROM has been produced according to the customer requirements.

......(see Fig. 3.3.9)

7 Insert Fuses

Insert the SYP fuses in the fuse panel:

If SYP is installed in R:MB/CCG ......(see Fig. 3.3.1)

If SYP is installed in R:CE ......(see Fig. 3.3.2)

If SYP is installed in R:SE ......(see Fig. 3.3.3)

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8 Switch on the DCC

Switch on the corresponding DCC




Is the green LED on the faceplate of the DCC lit? Y h...14N h...9

9 LED not lit

Switch off the DC converter

Check the fuse and replace if necessary

Pull all corresponding modules

Switch the DC converter on again

Is the green LED lit? Y h...11N h...10

10 Fault Clearance

Possible causes of the fault:

• DCC faulty

• Break in the power supply between the fuse and the converter

• Ground connection from frame/DCC to the + bus bar has a break in it

• Short-circuit on the wire-wrap field

Clear the fault

If it is the DCC that is faulty:

– Switch off the DC converter

– Make sure that the spare DCC is switched off

– Replace the faulty DCC with the spare module

After fault clearance, re-insert all modules h...8

11 Identify Faulty Module

One or more modules faulty (repeat the following steps until all modules havebeen tested)


Insert the first (next) module

Switch the DC converter on again

Is the green LED lit? Y h...13N h...12

PROC:SYP – 38 A30808-X3063-A403-2-7630


12 Replace Faulty Module

The last module inserted is suspect


Replace the faulty module with a spare module

When installing a spare COM:SYPC / PU:SYCR module, check the USER-PROM or transfer the USER-PROM from the faulty module.

13 Decision: all Modules Tested

Have all modules now been tested? Y h...8N h...11

14 Decision Block: LED HOLD

Is the HOLD LED on module COM:SYPC / PU:SYCR still lit? Y h...15N h...17

15 Reset Module COM:SYPC / PU:SYCR

Press the RESET key

Is the HOLD LED on module COM:SYPC / PU:SYCR still lit? Y h...16N h...17

16 Replace Module COM:SYPC / PU:SYCR

Module COM:SYPC / PU:SYCR is probably faulty

Switch off DC converter

Replace the faulty module with a spare module

When installing a spare COM:SYPC / PU:SYCR module, check the USER-PROM or transfer the USER-PROM from the faulty module.

– After replacing the module, continue h...8

17 Basic Test (SYPD in the Exchange)

Check the switches on module T/RM:SYPD and, if installed, on moduleACC:SYPD

......MMN:SYP-TAB LED:SYP

Plug in the connecting cable to the SYPC at the SYPD ......(see Fig. 3.3.10)

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18 TEST key (SYPD in the Exchange)

Press the TEST key

Go to one of the following blocks in accordance with the system response

– All LEDs lit, 7-segment displays lit, horn sounding h...22– All LEDs lit, 7-segment displays lit, horn not sounding h...19– Only the 7-segment displays are lit h...20– No LEDs are lit, no 7-segment displays are lit and the horn is not sounding h...21

19 Horn (SYPD in the Exchange)

Check the setting of switch HI on module T/RM:SYPD

Check that the connecting cable to the horn is plugged in correctly

Replace the horn if it is faulty

– Repeat the test h...18

20 Module DYM:SYP Faulty (SYPD in the Exchange)

Pull the connecting cable to the SYPC from the SYPD

Unplug the power cable, if there is one

Replace the faulty DYM:SYP module with a spare module

Insert the power cable, if there is one

Insert the connecting cable to the SYPC in the SYPD


21 Check System Voltage (SYPD in the Exchange)

If system voltage is present, the SYP displays light up when the TEST key ispressed. Any other response implies that a fuse or the EWA module is faulty.

Check the system voltage at pins +UE and -UE on module ACC:SYPD, if it isinstalled

Check the fuse (FU) assigned to the SYPD in the fuse panel:




Check the system voltage in the connecting cable SYPD-SYPC at pins 13 and14 (+UE), 16 and 17 (-UE)

If the system voltage up to the SYPD is OK: Replace module EWA in the SYPD


22 UPDATE Key (SYPD in the Exchange)

Press the UPDATE key

PROC:SYP – 40 A30808-X3063-A403-2-7630


The following system responses are possible:

• Data are transferred from the SYPC / SYCR to the SYPD. The transfer takesabout 1 minute. Displayed statuses are random.The “UPDATE” indicator is lit during the data transfer.

• The indicator does not light

Possible causes could be:

– Fault in the transmission equipment

– Wiring error: Transmitter and receiver transposed

Did the indicator light up? Y h...24N h...23

23 Nonstandard Maintenance

Perform nonstandard maintenance

– Repeat the test after completing nonstandard maintenance h...18

24 End of the Basic Test (SYPD in the Exchange)

End of the basic test for SYPD in the exchange

– For the basic test of the remote SYPDs h...25

25 Basic Test (Remote SYPD)

This test cannot be performed until the remote SYPD is connected over a 2-wireor 4-wire transmission line (E&M) and the USER-PROM has been programmedfor two SYPDs.

If the remote SYPD is operated over a 2-wire line, the remote SYPD is SYPD0and the SYPD in the exchange is SYPD1.If the remote SYPD is operated over a 4-wire E&M line, the remote SYPD isSYPD1 and the SYPD in the exchange is SYPD0.

If SYP is installed in F:SYPC ......(see Tab. 3.3.2)

If SYP is installed in F:SMSC(C) ......(see Tab. 3.3.3)

Check the switches on module T/RM:SYPD and, if it is installed, on moduleACC:SYPD

......MMN:SYP-TAB LED:SYP

Plug in the power cable

Insert the connecting cable to the transmission equipment at the SYPD

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26 TEST Key (Remote SYPD)

Press the TEST key

Go to one of the following blocks, depending on the system response

– All LEDs lit, 7-segment displays lit, horn sounding h...30– All LEDs lit, 7-segment displays lit, horn not sounding h...27– Only the 7-segment displays are lit h...28– No LEDs are lit, no 7-segment displays are lit and the horn is not sounding h...29

27 Horn (Remote SYPD)

Check the setting of switch HI on module T/RM:SYPD

Check that the connecting cable to the horn is plugged in correctly

Replace the horn if it is faulty


28 Module DYM:SYP Faulty (Remote SYPD)

Pull the connecting cable to the SYPC from the SYPD

Unplug the power cable, if there is one

Replace the faulty DYM:SYP module with a spare module

Insert the power cable, if there is one

Insert the connecting cable to the SYPC in the SYPD


29 Check System Voltage (Remote SYPD)

Check the operating voltage of the SYPD

If the system voltage up to the SYPD is OK:Replace module EWA in the SYPD


30 UPDATE Key (UPDATE) (Remote SYPD)

Press the UPDATE key

The following system responses are possible:

• Data are transferred from the SYPC to the SYPD. The transfer takes about 1minute. Displayed statuses are random.The “UPDATE” indicator is lit during the data transfer.

• The indicator does not light

Possible causes could be:

– Fault in the transmission equipment

– Wiring error: Transmitter and receiver transposed

Did the indicator light up? Y h...32N h...31

PROC:SYP – 42 A30808-X3063-A403-2-7630


31 Nonstandard Maintenance

Perform nonstandard maintenance

– Repeat the test after completing nonstandard maintenance h...26

32 End of the Basic Test (Remote SYPD)

End of the basic test for remote SYPD

– For the testing of external alarms h...33

33 Programming the USER-PROM for External Alarms

Clarify with the customer which alarms signaled by external alarm units are tobe indicated with what priority at the SYPD.Both the connection of the alarms to the SYP and the means of forwarding ofthe alarms must be programmed into the USER-PROM.

If the STANDARD-USER-PROM for Deutsche Telekom AG is being used, it isnot necessary to program external alarms because Deutsche Telekom uses auniform signaling concept.

Program the connection and forwarding of external alarms into the USER-PROM, if this has not already been done.

......NIMN:SYP

Label the corresponding SYPD indicators with the adhesive labels from thesupplied label sheet. Labels not included on the sheet must be ordered from theresponsible sales department.

34 Connection of External Alarms

Connect the external alarm units to the MDF. ......(see 3.3.11)

External alarms must be connected on the special terminal strip of the MDF andjumpered to the external alarm inputs of the SYP on the MDF.

For the assignment of connector pins to the MDF terminal points: ......(see 3.3.11)

35 Enter Alarm Texts

External alarms are reported at the OMT-PC with the number of the externalalarm and its name.

The name of an alarm is entered at the OMT-PC when the alarm is created.

Enter the alarm name, e.g. FIRE ALARM, as text no. 1

b Display existing alarm names with DISP ALTEXT.

b Alarm names which are not needed must be canceled with CAN ALTEXT (butonly if they are no longer linked to external alarms).

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36 Link Alarm Names to External Alarms

b Link the alarm names to the external alarms with:CR EAL:SITE=EXCH,EAL=...(1-24),TEXTNO=...(1 - x);

Further commands: DISP EAL and CAN EAL

37 Decision Block

Are alarms to be forwarded from the SYPD to another facility (e.g. OMC)? Y h...38N h...END

38 Forwarding of External Alarms

Module TXA:SYPC must be installed for the forwarding of alarms (only inF:SYPC).

Before inserting the jumpers on module TXA:SYPC / T/RM:SYCR, various pointsmust be clarified with the customer:

• Are alarms/indications to be forwarded to the OMC or other facilities (e.g.building security staff). If so, jumpers or resistors must be soldered ontomodule TXA:SYPC / T/RM:SYCR (see MMN:SYP, TAB / MMN:SYP for CDE,TAB).

• How are the alarms to be forwarded?

– Individually: One or more alarms/indications are assigned to a relay onmodule TXA:SYPC / T/RM:SYCR and forwarded by this relay.

– In groups: The alarms are grouped and forwarded.

Example:All critical alarms indicated at the SYPD are assigned as a group to the 1strelay and forwarded.All major alarms are assigned to the 2nd relay and forwarded.All indications are assigned to the 3rd relay and forwarded.

The alarms/indications are assigned to the relays in the USER-PROM.

Deactivate the SYP and switch off the DC converter

Pull module TXA:SYPC / T/RM:SYCR and solder in jumpers or resistors on themodule

...... (see 3.3.12)

Insert module TXA:SYPC / T/RM:SYCR

Check the corresponding fuse

Activate the SYP

Connect the customer’s alarm signaling equipment to the MDF

For alarm forwarding, the USER-PROM must be programmed as specified in: ......NIMN, SYP

PROC:SYP – 44 A30808-X3063-A403-2-7630


39 Enable Alarm Forwarding

The alarm forwarding function of module TXA:SYPC is only enabled if ALSTAT1or ALSTAT2 is set.

b Check the system settings in the database with command DISP ALMODE

System response:STATUS | HLIM

------------------------------

ALSTAT1 | YES

b If any other status is set, change it with the following command:ENTR ALMODE:STATUS=ALSTAT1,HLIM=YES;

40 Test Alarm Forwarding

In the installation test phase, system error messages must be compared withthe alarms signaled by the signaling facilities.

Trigger alarms to check the alarm forwarding function.

Note:Alarm forwarding is dependent on the SYPD indication and the priority definedfor the alarm.If a single lamp/LED on the SYPD only allows the indication of a major alarm, itis not possible to forward a critical alarm.An alarm is only forwarded as a critical alarm if its priority is defined as critical.

END

A30808-X3063-A403-2-7630 PROC:SN – 1

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3.4 Off-line Installation of Switching Network

SN

3.4.1 Documents

The following documents are required as references:

– Maintenance Manual MMN:SN(B)

– AKUHW Lists

3.4.2 Fuse Assignments

There are different fuse assignments for the SN. These assignments depend on:

• The rack used

– R:SN(B)/LTGG

– R:SN(B)/LTGM

– R:SN(B)/MB/LTGM

– R:CE (Rural Exchanges)

• The cable routing for the SN:

– Cable routing from above

– Cable routing from below

• The size of the SN

• The frame to be switched on:

– TSG-frame

– SSG-frame

PROC:SN – 2 A30808-X3063-A403-2-7630


3.4.3 Fuse Assignment for SN (31LTG)(Rural Exchanges)

3.4.3.1 Rack R:CE

Fig. 3.4.1 Rack R:CE

C

DF:SMSC(C)-0

F:SMSC(C)-1

F:PIOP(A)

F:PBC(A)

F:PBC(A)

F:DEV

Fuse panel / AD:RAL

MUT02

MUT04

MUT03

MUT06

MUT09

MUT10

C

D

C

D

C

D

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

10

29

FU

MOLOC C343 (Supply for SN-0)


292721 2523 31 33

30282622 3224

F:PIOPA)C

D

Air circulator

MUT11

MUT07

MUT05

MUT08

MUT01

Air circulator

Air circulator

A30808-X3063-A403-2-7630 PROC:SN – 3

CommissioningSystem

ITMN - OFFLINE

3.4.3.2 SN Fuses / Frames and Modules in R:CE

Fig. 3.4.2 SN Fuses / Frames and Modules in R:CE

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

10

FU

292721 2523 31 33

30282622 3224

101 113 125 137 149 161 173 185 197 209 221 233 245 257 269 281 293 305 317 329 341

101 113 125 137 149 161 173 185 197 209 221 233 245 257 269 281 293 305 317 329 341

C

D

C

D

F:SMSC-1

F:SMSC-0

TS

MB

0T

SM

B 1

SS

M16

B

TS

MB

3

TS

MB

2

SG

CB

DC

CM

C

TS

MB

0T

SM

B 1

SS

M16

B

TS

MB

3

TS

MB

2

SG

CB

DC

CM

C

29

PROC:SN – 4 A30808-X3063-A403-2-7630


3.4.4 Fuse Assignment for SN (63LTG)

3.4.4.1 Fuse Assignment for R:SN(B)/LTGG

Fig. 3.4.3 R:SN(B)/LTGG cable routing from above

C

DF:TSG(B) (SN-0)

F:TSG(B) (SN-1)

F:LTG

F:LTG

F:LTG

F:LTG

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

C

D

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

FU



MUT01

A30808-X3063-A403-2-7630 PROC:SN – 5

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.4 R:SN(B)/LTGG cable routing from below

A

BF:LTG

F:LTG

F:LTG

F:LTG

F:TSG(B) (SN-0)

F:TSG(B) (SN-1)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

A

B

A

B

A

B

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

FU



MUT01

PROC:SN – 6 A30808-X3063-A403-2-7630


3.4.4.2 Fuse Assignment for R:SN(B)/LTGM

Fig. 3.4.5 R:SN(B)/LTGM cable routing from above

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

DF:TSG(B) (SN-0)

F:TSG(B) (SN-1)

Fuse panel

C

D

01FU



LTG LTG LTG LTG

32

A30808-X3063-A403-2-7630 PROC:SN – 7

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.6 R:SN(B)/LTGM cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

F:LTGM(A)

LTG LTG LTG LTG LTG

F:LTGM(A)

LTG LTG LTG LTG LTG

C

DF:TSG(B) (SN-0)

F:TSG(B) (SN-1)C

D

32



01

PROC:SN – 8 A30808-X3063-A403-2-7630


3.4.4.3 Fuse Assignment for R:SN(B)/MB/LTGM

Fig. 3.4.7 R:SN/MB/LTGM cable routing from above

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

DF:TSG(B)

Fuse panel

C

D

FU

01

32

F:MB/CCG(B)

F:LTGM(A)

F:LTGM(A)

F:MB/CCG(B)

F:TSG(B)



A30808-X3063-A403-2-7630 PROC:SN – 9

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.8 R:SN/MB/LTGM cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

DF:LTGM(A)

Fuse panel

C

D

FU

F:LTGM(A)

01

32

F:MB/CCG(B)

F:TSG(B)

F:TSG(B)

F:MB/CCG(B)



PROC:SN – 10 A30808-X3063-A403-2-7630


3.4.5 Fuse Assignment for SN (126 LTG - 504 LTG) TSG-frame

3.4.5.1 Fuse Assignment for R:TSG(B)/LTGG

Fig. 3.4.9 R:TSG(B)/LTGG cable routing from above

C

DF:TSG(B) (TSG-0-tsg)

F:TSG(B) (TSG-1-tsg)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

C

D

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

FU

MOLOC C331 (Supply for TSG-0-tsg)


MUT01

A30808-X3063-A403-2-7630 PROC:SN – 11

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.10 R:TSG(B)/LTGG cable routing from below

A

BF:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)



CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

A

B

A

B

A

B

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

FU



MUT01

PROC:SN – 12 A30808-X3063-A403-2-7630


3.4.5.2 Fuse Assignment for R:TSG(B)/LTGM

Fig. 3.4.11 R:TSG(B)/LTGM cable routing from above

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C



Fuse panel

C

D

01FU



LTG LTG LTG LTG

32

A30808-X3063-A403-2-7630 PROC:SN – 13

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.12 R:TSG(B)/LTGM cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

F:LTGM(A)

LTG LTG LTG LTG LTG

F:LTGM(A)

LTG LTG LTG LTG LTG

C


F:TSG(B) (TSG-1-tsg)C

D

32



01

PROC:SN – 14 A30808-X3063-A403-2-7630


3.4.5.3 Fuse Assignment for R:TSG(B)/MB/LTGM

Fig. 3.4.13 R:SN/MB/LTGM cable routing from above

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

DF:TSG(B)

Fuse panel

C

D

FU

01

32

F:MB/CCG(B)

F:LTGM(A)

F:LTGM(A)

F:MB/CCG(B)

F:TSG(B)



A30808-X3063-A403-2-7630 PROC:SN – 15

CommissioningSystem

ITMN - OFFLINE

Fig. 3.4.14 R:SN/MB/LTGM cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

DF:LTGM(A)

Fuse panel

C

D

FU

F:LTGM(A)

01

32

F:MB/CCG(B)

F:TSG(B)

F:TSG(B)

F:MB/CCG(B)



PROC:SN – 16 A30808-X3063-A403-2-7630


3.4.6 Fuse Assignment for SN (126 LTG - 504 LTG) SSG-frame

In SN (126LTG) switching networks only the left half of the SSG module frame isequipped. This is fed by only one DCC.

Fig. 3.4.15 Frame SSG(B) for SN (126 LTG)

In SN (252 LTG..504 LTG) switching networks both halves of the SSG module frame areequipped and each one is fed by a separate DCC.

Fig. 3.4.16 Frame SSG(B) for SN (252 LTG..504 LTG)

DCCMS

EMPTY

SSG EMPTY

DCCMS

SSG

DCCMS

SSG

A30808-X3063-A403-2-7630 PROC:SN – 17

CommissioningSystem

ITMN - OFFLINE

3.4.6.1 Fuse Assignment for R:SSG(B)/LTGG

Fig. 3.4.17 R:SSG(B)/LTGG cable routing from above

C

D

F:SSG(B)

F:LTGG(A)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

C

D

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

11

12

FU

MOLOC C101 (Supply for SSG-0-0

SSG-1-0or SSG-1-2

SSG-1-1or SSG-1-3

F:SSG(B)SSG-0-0

or SSG-0-2SSG-0-1

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

or SSG-0-2)

MOLOC C331 (Supply for SSG-0-1or SSG-0-3)



MUT01

or SSG-0-3

PROC:SN – 18 A30808-X3063-A403-2-7630


Fig. 3.4.18 R:SSG(B)/LTGG cable routing from below

A

B

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

A

B

A

B

A

B

C

D

C

D

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

11

12

FU

MUT01

F:SSG(B)SSG-0-0

or SSG-0-2SSG-0-1

or SSG-0-3

F:SSG(B)SSG-1-0

or SSG-1-2SSG-1-1

or SSG-1-3

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)MOLOC C101 (Supply for SSG-0-0or SSG-0-2)




A30808-X3063-A403-2-7630 PROC:SN – 19

CommissioningSystem

ITMN - OFFLINE

3.4.6.2 Fuse Assignment for R:SSG(B)/LTGM

Fig. 3.4.19 R:SSG(B)/LTGM cable routing from above

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

32

33

01

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG





C

D

F:SSG(B)C

DSSG-1-0

or SSG-1-2SSG-1-1

or SSG-1-3

F:SSG(B)SSG-0-0

or SSG-0-2SSG-0-1

or SSG-0-3

02

PROC:SN – 20 A30808-X3063-A403-2-7630


Fig. 3.4.20 R:SSG(B)/LTGM cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

FU

32

01





C

D

F:SSG(B)C

DSSG-1-0

or SSG-1-2SSG-1-1

or SSG-1-3

F:SSG(B)SSG-0-0

or SSG-0-2SSG-0-1

or SSG-0-3

02

33

F:LTGM(A)

LTG LTG LTG LTG LTG

F:LTGM(A)

LTG LTG LTG LTG LTG

A30808-X3063-A403-2-7630 PROC:SN – 21

CommissioningSystem

ITMN - OFFLINE

3.4.6.3 Fuse Assignment for R:SSG(B)/MB/LTGM

Fig. 3.4.21 R:SN/MB/LTGM with F:SSG(B) cable routing from above

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

Fuse panelFU

01

F:MB/CCG(B)

F:LTGM(A)

F:LTGM(A)

F:MB/CCG(B)

02

32

33

MOLOC C101 (Supply for SSG-0-0/ SSG-0-2)

MOLOC C101

MOLOC C331

MOLOC C331

(Supply for SSG-1-1/ SSG-1-3)



C

D

C

D

F:SSG(B)

F:SSG(B)

SSG-0-0

SSG-1-0 SSG-1-1

SSG-0-1

/ SSG-1-3

/ SSG-0-3

/ SSG-1-2

/ SSG-0-2

PROC:SN – 22 A30808-X3063-A403-2-7630


Fig. 3.4.22 R:SN/MB/LTGM with F:SSG(B) cable routing from below

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

D

F:LTGM(A)

Fuse panel

C

DF:LTGM(A)

F:MB/CCG(B)

F:SSG(B)

F:SSG(B)

F:MB/CCG(B)

FU

01

02

32

33

MOLOC C101 (Supply for SSG-0-0/ SSG-0-2)

MOLOC C101

MOLOC C331

MOLOC C331




SSG-0-0

SSG-1-0 SSG-1-1

SSG-0-1

/ SSG-1-3

/ SSG-0-3

/ SSG-1-2

/ SSG-0-2

A30808-X3063-A403-2-7630 PROC:SN – 23

CommissioningSystem

ITMN - OFFLINE

1 Basic Test (Rack)




2 Check Ground Connections

Check whether the ground connections between adjacent racks are correctlyplugged in

3 Decision Block: Capacity stage of the SN

Branch to one of the following blocks according to the capacity stage of the SN

– It is an SN (31 LTG) switching network h...4– It is an SN (63 LTG) switching network h...12– It is an SN (126 LTG.. 504 LTG) switching network h...20

4 Create Basic State (SN (31 LTG))

The location of the SN modules in the SMSC(C) frames and the correspondingfuses are shown in: ...... (see Fig. 3.4.2)

Switch off SN DCCs in the SMSC(C) frames

Screw out all SN main fuses

5 Power Supply Check (SN (31 LTG))

Screw in the first/next SN-fuse

Switch on the corresponding DCC in the SN module frame to check the fuseassignment to the MUT

Is the LED of the DCC lit? Y h...6N h...7

6 Decision Block

Have all SN-fuses already been screwed in? Y h...ENDN h...5

7 Identify Faulty Modules

Unplug all related modules individually under power (except DCC), but leavethem in position.

After each module is unplugged the voltage should be checked again. (Thegreen LED of the DCC is lit)

Could the fault be cleared by removing a certain module? Y h...8N h...9

PROC:SN – 24 A30808-X3063-A403-2-7630



Replace faulty module, plug in all modules

– Repeat testing after replacing faulty module h...5

9 Faulty DCC

Switch off the DCC of the faulty module frame

Screw out the fuse which is allocated to this DCC

Replace DCC by spare module, screw in fuse, switch on DCC




– Repeat testing after finishing special fault clearance h...5

11 Plug in Modules

Plug in all modules

– Repeat testing after replacing the DCC h...5

12 Create Basic State (SN (63 LTG))

Switch off DCCs in the SN module frames

Screw out all SN main fuses

A30808-X3063-A403-2-7630 PROC:SN – 25

CommissioningSystem

ITMN - OFFLINE

13 Power Supply Check (SN (63 LTG))

Caution: The assignment of the fuses to the relevant module frame is imple-mented for two different cable routings and for two different racks:

Fuse assignment in R:SN(B)/LTGG for cable routing from above ...... (see Fig. 3.4.3)

Fuse assignment in R:SN(B)/LTGG for cable routing from below ...... (see Fig. 3.4.4)

Fuse assignment in R:SN(B)/LTGM for cable routing from above ...... (see Fig. 3.4.5)

Fuse assignment in R:SN(B)/LTGM for cable routing from below ...... (see Fig. 3.4.6)

Fuse assignment in R:SN(B)/MB/LTGM for cable routing from above ...... (see Fig. 3.4.7)

Fuse assignment in R:SN(B)/MB/LTGM for cable routing from below ...... (see Fig. 3.4.8)

Screw in the first/next SN-fuse

Switch on the corresponding DCC in the SN module frame to check the fuseassignment to the MUT


14 Decision Block

Have all SN-fuses already been screwed in? Y h...ENDN h...15

15 Identify Faulty Modules

Unplug all modules individually under power (except DCCMS), but leave them inposition.






PROC:SN – 26 A30808-X3063-A403-2-7630


17 Faulty DCC








19 Plug in Modules

Plug in all modules


20 Create Basic State (TSG frames)

Switch off DCCs in the TSG module frames

Screw out all TSG main fuses

A30808-X3063-A403-2-7630 PROC:SN – 27

CommissioningSystem

ITMN - OFFLINE

21 Power Supply Check (TSG-Frames for SN(126..504LTG))








Screw in the first/next TSG-fuse

Switch on the corresponding DCC in the TSG module frame to check the fuseassignment to the MUT


22 Decision Block

Have all TSG-fuses already been screwed in? Y h...29N h...21

23 Identify Faulty Modules (TSG-Frames)




24 Replace Faulty Module (TSG-Frames)



PROC:SN – 28 A30808-X3063-A403-2-7630


25 Faulty DCC (TSG-Frames)








27 Plug in Modules (TSG-Frames)

Plug in all modules


28 Create Basic State (SSG-Frames)

Switch off DCCs in the SSG module frames

Screw out all SSG main fuses

A30808-X3063-A403-2-7630 PROC:SN – 29

CommissioningSystem

ITMN - OFFLINE

29 Power Supply Check (SSG-Frames)

• In SN (126LTG) switching networks only the left half of the SSG moduleframe is equipped. This is fed by only one DCC

• In SN (252 LTG..504 LTG) switching networks both halves of the SSG moduleframe are equipped and each one is fed by a separate DCC








Screw in the first/next SSG-fuse

Switch on the corresponding DCC in the SSG module frame to check the fuseassignment to the MUT


30 Decision Block

Have all SSG-fuses already been screwed in? Y h...ENDN h...29

31 Identify Faulty Modules (SSG-Frames)




PROC:SN – 30 A30808-X3063-A403-2-7630


32 Replace Faulty Module (SSG-Frames)



33 Faulty DCC (SSG-Frames)


Screw out the fuse which is assigned to this DCC






35 Plug in Modules (SSG-Frames)

Plug in all modules


END

A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 1

CommissioningSystem

ITMN - OFFLINE

3.5 Off-line Installation of Common Channel SignalingNetwork Control

CCNC:CCS7

3.5.1 Documents

The following documents are required as references

– Maintenance Manual MMN:CCS7

– AKUHW Lists

3.5.2 LED Displays (Processor Modules)

To show the operating state and the statuses in the start-up procedure, the LEDs in thefaceplate of the processor modules are activated as follows:

Status in the start-up procedure LEDs

H1 H2 H3 H4

Start-up/M:P(M)U:SIMP test x 1 1 1

End of start-up 0 1 0 0

Test mode / Watchdog inactive 1 x x x

Tab. 3.5.1 LEDs on M:PU:SIMP (M:PMU:SIMP)

Status in the start-up procedure LED

H1

Start-up/M:MH:SIMP test 1

End of start-up 0

Tab. 3.5.2 LEDs on M:MH:SIMP


H1 H2 H3

Start-up/M:SIPA test x 0 1

End of start-up 0 1 0

Test mode / Watchdog inactive 1 x x

Tab. 3.5.3 LEDs on M:SIPA

PROC:CCNC_CCS7 – 2 A30808-X3063-A403-2-7630


3.5.3 LED Displays (SILT Modules)

3.5.4 Fuse Assignment

The fuse assignment for F:SILTD(A) dependents on the rack where the frame is built in


H1 H2 H3 H4

Start-up/M:P(M)U:CPI test x 1 1 1



Tab. 3.5.4 LEDs on M:PU:CPI (M:PMU:CPI)


H1 H2 H3 H4

Start-up and MU test x 0 1 0

Test of peripheral units x 0 1 1

Initialization of HW/RL x 1 1 1



Tab. 3.5.5 LEDs on M:SILTC


H1 H2 H3 H4 H5 H6 H7

Start-up and RAM test x 1 1 1 1 1 1

Stack, watchdog test x 1 1 1 0 1 1

EPROM test x 1 1 1 0 0 1

Notebook, RAM test x 1 1 1 0 0 0

TIMER, DMA test x 1 0 1 0 0 0

PORT HDLC x 1 0 0 0 0 0

End of start-up 0 1 0 0 0 0 0

Test mode / Watchdog inactive 1 x x x x x x

Tab. 3.5.6 LEDs on M:SILTD

A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 3

CommissioningSystem

ITMN - OFFLINE

3.5.4.1 Fuse Assignment in R:CCNP/SILTDThe fuse assignment in R:CCNP/SILTD is realized for 2 different versions of the rack:

– shielded or unshielded version

– partially shielded version

3.5.4.2 Fuse Assignment in R:SILTD

MUT SILT Groupleft

SILT Groupright

02 FU 1 FU 11

04 FU 3 FU 13

06 FU 7 FU 17

Tab. 3.5.7 Fuse assignment R:CCNP/SILTD(shielded or unshielded version)

MUT SILT Groupleft

SILT Groupright

02 FU 1 FU 11

04 FU 2 FU 12

06 FU 3 FU 13

Tab. 3.5.8 Fuse assignment R:CCNP/SILTD(partially shielded version)

MUT SILT Groupleft

SILT Groupright

02 FU 1 FU 11

03 FU 3 FU 13

04 FU 5 FU 15

05 FU 7 FU 17

06 FU 9 FU 19

07 FU 10 FU 20

Tab. 3.5.9 Fuse assignment R:SILTD

PROC:CCNC_CCS7 – 4 A30808-X3063-A403-2-7630


3.5.5 Rack SILTD

Fig. 3.5.1 Rack R:SILTD

MOLOC A120

MOLOC A001

A

BMOLOC A001

F:SILTD

F:SILTD

F:SILTD

F:SILTD

F:SILTD

F:SILTD

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

03

13

05

15

07

17

09

19

10

20

FU

MOLOC A001

MOLOC A001

MOLOC A001

MOLOC A001

MOLOC A120

MOLOC A120

MOLOC A120

MOLOC A120

MOLOC A120

A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 5

CommissioningSystem

ITMN - OFFLINE

3.5.6 Rack CCNP/SILTD

Fig. 3.5.2 Rack R:CCNP/SILTD

MOLOC A120

MOLOC A001

A

BMOLOC A001

F:SILTD

F:SILTD

F:SILTD

F:CCNP(B)

F:CCNP(B)

CD

Fuse panel

MUT02

MUT04

MUT06

MUT08

MUT10

MUT01

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

11

03

13

07

17

05

06

15

16

FU

MOLOC A001

MOLOC A001

MOLOC A001

MOLOC A120

MOLOC A120

MOLOC A120

MOLOC A120

PROC:CCNC_CCS7 – 6 A30808-X3063-A403-2-7630


1 Basic Test (Rack)




2 Information Block

All work should be performed for the two CCNPs in MUT 08 and 10 in parallel

3 Create Basic State

Switch off all CCNC-DCCs

Screw out all CCNC-fuses

4 Screw in Fuses (CCNP)

Screw in the following fuses:

• FU 6 for CCNP0 MUT 08

• FU16 for CCNP1 MUT 10

5 Switch on DCCs (CCNP)

Switch on the corresponding DCCs ......(see Fig. 3.5.2)

Is the green LED in the module faceplate on? Y h...7N h...6

6 LED off (CCNP)

DCC or modules suspect

– If DCC is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:DCC

– If a module is defective, carry out fault clearance according to i....MMN:CCS7,PROC,REP:MOD

7 Check Basic Setting (CCNP)

When the DCCs have been switched on, the CCNP automatically performs self-tests for a few seconds. Modules given in parenthesis refer to a CCNP with a 4MB memory

A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 7

CommissioningSystem

ITMN - OFFLINE

Basic setting for the LED displays on the faceplates of the processor modules is,that only the following LEDs are lit:

• PU:SIMP (PMU:SIMP) : H2

• SIPA : H2

• PU:CPI (PMU:CPI) : H2

Are the LED displays in the basic setting? Y h...16N h...8

8 Fault Analysis

To show the operating state and the statuses in the start-up procedure, theLEDs in the faceplates of the processor modules are activated as shown in: ...... (see 3.5.2)

Carry out fault analysis according to the tables mentioned above

Is LED H1 on one or more of the modules: M:P(M)U:SIMP / M:SIPA /M:P(M)U:CPI lit? Y h...9

N h...10

9 Slide Switches (CCNP)

Move slide switch S2, which is reached through faceplate opening 400 (exceptfor M:SIPA, where S2 is marked on the faceplate), until LED H1 goes out.

10 Troubleshooting for CCNP Modules

Switch off all DCCs

Replace module identified by means of fault analysis

Switch on all DCCs again

Is the LED display in basic setting when self-test is completed? Y h...16N h...11

11 Decision Block: Same Fault Pattern

Same fault pattern as before module replacement? Y h...12N h...13

12 Reinsert Original Module

Switch off all DCCs and reinsert original module

– After reinserting original module h...14

13 Possible Faults

Spare module could be defective or there is another fault in the CCNP

Switch off all DCCs

– After switching off all DCCs h...14

PROC:CCNC_CCS7 – 8 A30808-X3063-A403-2-7630


14 Decision Block: Other Modules Suspect

Are any other modules suspect? Y h...10N h...15




16 Switch on DCCs (SILTD(A))

Screw fuses for F:SILTD(A) (in R:CCNP/SILTD or in R:SILTD depending onconfiguration) into fuse panel.

......(see 3.5.4)

Switch on DCCs

Is green LED on DCC faceplate lit? Y h...18N h...17

17 LED off




18 Check Basic Setting (SILTC)

When DCCs have been switched on, SILTC and SILTD automatically performself-tests for a few seconds.

Is only LED H2 lit on all M:SILTC? Y h...19N h...20

19 Check Basic Setting (SILTD)

Is only LED H2 lit on all M:SILTD? Y h...35N h...28

20 Interpretation of LED Combinations (SILTC)

For Interpretation of the LED combinations ......(see Tab. 3.5.5)

Is LED H1 lit? Y h...21N h...22

21 Slide Switches (SILTC)

Move slide switch S2 (can be reached through faceplate opening 400) until LEDH1 goes out.

A30808-X3063-A403-2-7630 PROC:CCNC_CCS7 – 9

CommissioningSystem

ITMN - OFFLINE

22 Check LED H3

Is LED H3 lit? Y h...23N h...18

23 Replace Defective Module (SILTC)

Switch off DCC for suspect M:SILTC by way of toggle switch on DCC modulefaceplate

Replace suspect M:SILTC

24 RESET (SILTC)

Switch on DCC and press RESET

Has a new EPROM been installed, and still LED H3 alone is lit on M:SILTC afterself-test? Y h...25

N h...26




26 Check LED H2

Is only LED H2 lit on M:SILTC after self test? Y h...18N h...27

27 Test EPROM

Test EPROM for faults or install new EPROM

– Repeat testing h...24

28 Interpretation of LED Combinations (SILTD)

For Interpretation of the LED combinations ...... (see Tab. 3.5.6)

29 Replace Defective Module (SILTD)

Switch off DCC for suspect M:SILTD by way of toggle switch on DCC modulefaceplate

Replace suspect M:SILTD

30 RESET (SILTD)

Switch on DCC and press RESET

31 Check LED H2 (SILTD)

Is only LED H2 lit on M:SILTD after self test? Y h...19N h...32

PROC:CCNC_CCS7 – 10 A30808-X3063-A403-2-7630


32 Decision Block: Components Changed

Have components from the defective M:SILTD been installed on the replace-ment module (e.g. EPROM)? Y h...34

N h...33




34 Test EPROM (SILTD)

Switch off DCC by way of toggle switch on DCC module faceplate

Test EPROM for faults or install new EPROM

– Repeat testing h...30

35 Screw in Fuses (MUXM)

Screw in the following fuses:

• FU 5 for MUXM-0

• FU15 for MUXM-1

36 Switch on DCCs (MUXM)

Switch on DCCs for MUXM

Is green LED in the module faceplates lit? Y h...38N h...37

37 LED off (MUXM)




38 RESET (MUXM)

Press reset switch S1 and start self test

Does LED2 flash when test is finished? Y h...ENDN h...39

39 Replace MUXM

Switch off relevant DCC and replace MUXM

– Repeat testing after replacing MUXM h...36

END

A30808-X3063-A403-2-7630 PROC:LTG – 1

CommissioningSystem

ITMN - OFFLINE

3.6 Off-line Installation of Line Trunk Groups

LTG

3.6.1 Documents

The following documents are required as references:

– Maintenance Manual MMN:LTGx

– AKUHW Lists

PROC:LTG – 2 A30808-X3063-A403-2-7630


3.6.2 Fuse Assignments of the different Types of LTG

3.6.2.1 Fuse Assignment of R:LTGA

Fig. 3.6.1 Fuse Assignment of R:LTGA

F:LTGA(A) 0

F:LTGA(B) 0

F:LTGA(A) 1

F:LTGA(B) 1

CD

MUT02

MOLOC C091

MOLOC C001, C013, C025,C 037

MOLOC C079, C085, C103, C115

MUT03

MUT04

MUT05MOLOC C091

MOLOC C001, C013, C025,C 037

MOLOC C079, C085, C103, C115

MUT01

A

B

C

D

A

B

C

D

A

B

C

D

A

B

C

D

Fuse panel

01

02

03

11

12

13

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

A30808-X3063-A403-2-7630 PROC:LTG – 3

CommissioningSystem

ITMN - OFFLINE

3.6.2.2 Fuse Assignment of R:LTGB/LTGB:OSS

Fig. 3.6.2 Fuse Assignment of R:LTGB

F:LTGB(A)

F:LTGB(A)

F:LTGB(A)

F:LTGB(A)

CD

MUT02

MUT03

MUT04

MUT05

MUT01

A

B

C

D

A

B

C

D

A

B

C

D

A

B

C

D

Power supply for all LTU

MOLOC C001, C013

MOLOC C103, C115


MOLOC C001, C013

MOLOC C103, C115


MOLOC C001, C013

MOLOC C103, C115


MOLOC C001, C013

MOLOC C103, C115

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

03

01

02

13

11

12

06

04

05

16

14

15

FU

Fuse panel

PROC:LTG – 4 A30808-X3063-A403-2-7630


3.6.2.3 Fuse Assignment of R:LTGC

Fig. 3.6.3 Fuse Assignment of R:LTGC

A

B

MOLOC A001, A015

MOLOC A001, A015

MOLOC A001, A015

MOLOC A001, A015

MOLOC A001, A015

MOLOC A001, A015

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

03

FU

11

12

13

Fuse panel

A30808-X3063-A403-2-7630 PROC:LTG – 5

CommissioningSystem

ITMN - OFFLINE

3.6.2.4 Fuse Assignment of R:LTGC/CR

Fig. 3.6.4 Fuse Assignment of R:LTGC/CR

A

B

MOLOC A001, A115

MOLOC A001

MOLOC A001, A115

MOLOC A001, A115

MOLOC A001

MOLOC A001, A115

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

F:LTGC(A)

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

F:CR(A) F:CR(A)

F:CR(A) F:CR(A)

*

*

*

*

*):Each half-frame F:CR(A) is assigned to the LTGC above / below and electrically connected with it

MOLOC A115

MOLOC A115

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

03

FU

11

13

Fuse panel

PROC:LTG – 6 A30808-X3063-A403-2-7630


3.6.2.5 Fuse Assignment of R:LTGD

Fig. 3.6.5 Fuse Assignment of R:LTGD

A

B

MOLOC A001

MOLOC A115

MOLOC A001, A115

MOLOC A001

MOLOC A001, A115

MOLOC A001

F:CRES(A) 0

F:LTGD(A) 0

F:CRES(A) 1

F:CRES(A) 2

F:LTGD(A) 1

F:CRES(A) 3

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

MOLOC A115

MOLOC A001

MOLOC A115

MOLOC A115

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

03

05

06

11

12

13

15

16

FU

Fuse panel

A30808-X3063-A403-2-7630 PROC:LTG – 7

CommissioningSystem

ITMN - OFFLINE

3.6.2.6 Fuse Assignment of R:LTGF

Fig. 3.6.6 Fuse Assignment of R:LTGF

A

B

MOLOC A117

MOLOC A117

MOLOC A117

MOLOC A117

MOLOC A117

MOLOC A117

F:LTGF(A)

F:LTGF(A)

F:LTGF(A)

F:LTGF(A)

F:LTGF(A)

F:LTGF(A)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

01

02

03

FU

04

05

06

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

PROC:LTG – 8 A30808-X3063-A403-2-7630


3.6.2.7 Fuse Assignment of R:LTGG

Fig. 3.6.7 Fuse Assignment of R:LTGG

A

BMOLOC A001 (left LTG)

MOLOC A123 (right LTG)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

11

12

03

04

13

14

05

06

15

16

FU

MOLOC A001 (left LTG)










A30808-X3063-A403-2-7630 PROC:LTG – 9

CommissioningSystem

ITMN - OFFLINE

3.6.2.8 Fuse Assignment of R:LTGG:OSS

Fig. 3.6.8 Fuse Assignment of R:LTGG:OSS

F:LTGG(A)

F:LTGG(A)

CD

Fuse panel

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

MOLOC

A001

A008, A013, A018, A023, A028

A123

A066, A071, A076, A081, A086

01

03

02

04

F:LTGG(A)

A123

A066, A071, A076, A081, A086

06

08

A123

A066, A071, A076, A081, A086

10

12

A001

A008, A013, A018, A023, A028

05

07

A001

A008, A013, A018, A023, A028

09

11

F:LTGG(A)

F:LTGG(A)

A123

A066, A071, A076, A081, A086

14

16

A123

A066, A071, A076, A081, A086

18

20

A001

A008, A013, A018, A023, A028

13

15

A001

A008, A013, A018, A023, A028

17

19

MUT01

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

FU FU

MOLOC

PROC:LTG – 10 A30808-X3063-A403-2-7630


3.6.2.9 Fuse Assignment of R:SNB/LTGG (Cable routing from above)

Fig. 3.6.9 Fuse Assignment of R:SNB/LTGG(Cable routing from above)

A

B


F:SSG(B) or F:TSG(B)


F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

11

12

03

04

13

14

05

06

15

16

FU








A30808-X3063-A403-2-7630 PROC:LTG – 11

CommissioningSystem

ITMN - OFFLINE

3.6.2.10 Fuse Assignment of R:SNB/LTGG (Cable routing from below)

Fig. 3.6.10 Fuse Assignment of R:SNB/LTGG(Cable routing from below)

A


F:LTGG(A)

F:LTGG(A)

F:LTGG(A)

F:LTGG(A)



CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

05

06

15

16

03

04

13

14

01

02

11

12

FU








PROC:LTG – 12 A30808-X3063-A403-2-7630


3.6.2.11 Fuse Assignment of R:LTGH

Fig. 3.6.11 Fuse Assignment of R:LTGH

A



F:LTGG(A) 0

F:LTGG(A) 1

F:LTGG(A) 2

F:LTGG(A) 3

F:LTGH(A) 4

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

A

B

A

B

A

B

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

02

11

12

03

04

13

14

15

16

FU









A30808-X3063-A403-2-7630 PROC:LTG – 13

CommissioningSystem

ITMN - OFFLINE

3.6.2.12 Fuse Assignment of R:LTGM

Fig. 3.6.12 Fuse Assignment of R:LTGM

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

02

03

05

19

20

21

22

23

06

07

04

08

09

01

10

24

26

27

28

11

12

13

14

15

25

29

30

31CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

MOLOC C151 / LTGM 1

MOLOC C203 / LTGM 2MOLOC C255 / LTGM 3MOLOC C305 / LTGM 4

MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

32

33

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

PROC:LTG – 14 A30808-X3063-A403-2-7630


3.6.2.13 Fuse Assignment of R:SNB/LTGM

Fig. 3.6.13 Fuse Assignment of R:SNB/LTGM(Cable routing from above)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

02

32

08

09

10

11

12

22

23

24

33

25

26

01

03

04

06

07

27

28

29

30

31

05

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

F:SSG(B) or F:TSG(B)A

B

F:SSG(B) or F:TSG(B)A

B

A30808-X3063-A403-2-7630 PROC:LTG – 15

CommissioningSystem

ITMN - OFFLINE

Fig. 3.6.14 Fuse Assignment of R:SNB/LTGM(Cable routing from below)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

04

05

07

27

28

29

30

31

08

09

06

10

11

03

12

22

24

25

26

01

02

32

33

23

CD

Fuse panel

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

C

D F:LTGM(A)

LTG LTG LTG LTG LTG

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

MOLOC C151 / LTGM 1


MOLOC C101 / LTGM 0

F:SSG(B) or F:TSG(B)C

D

F:SSG(B) or F:TSG(B)C

D

PROC:LTG – 16 A30808-X3063-A403-2-7630


3.6.2.14 Fuse Assignment for R:SNB/MB/LTGM

Fig. 3.6.15 Fuse Assignment for R:SN/MB/LTGM(Cable routing from above)

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

DF:TSG(B) or F:SSG(B)

Fuse panel

C

D

FU

F:TSG(B) or F:SSG(B)

03

F:MB/CCG(B)

F:MB/CCG(B)

04

05

06

07

27

28

29

30

31

C

D F:LTGM(A)

0 1 2 3 4

C

D F:LTGM(A)

0 1 2 3 4

MOLOC C101/LTGM 0

MOLOC C255/LTGM 3

MOLOC C203/LTGM 2

MOLOC C151/LTGM 1

MOLOC C305/LTGM 4

MOLOC C101/LTGM 0

MOLOC C151/LTGM 1

MOLOC C203/LTGM 2

MOLOC C255/LTGM 3

MOLOC C305/LTGM 4

A30808-X3063-A403-2-7630 PROC:LTG – 17

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Fig. 3.6.16 Fuse Assignment for R:SN/MB/LTGM(Cable routing from below)

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

CD

MUT02

MUT03

MUT04

MUT05

MUT06

MUT07

MUT01

A

B

A

B

C

D

C

D

C

D

Fuse panel

FU

F:LTGM(A)

03

F:MB/CCG(B)



F:MB/CCG(B)

04

05

06

07

27

28

29

30

31

0 1 2 3 4

C

D F:LTGM(A)

0 1 2 3 4

MOLOC C101/LTGM 0

MOLOC C255/LTGM 3

MOLOC C203/LTGM 2

MOLOC C151/LTGM 1

MOLOC C305/LTGM 4

MOLOC C101/LTGM 0

MOLOC C151/LTGM 1

MOLOC C203/LTGM 2

MOLOC C255/LTGM 3

MOLOC C305/LTGM 4

PROC:LTG – 18 A30808-X3063-A403-2-7630


1 Check of System Voltage per Rack Row

Ensure that the main fuses are unscrewed before starting the check.

Measure system voltage for each rack row at the last frame

Note: the operational voltage is dependent upon the charging status of thebatteries.Tolerance range: -60 V (-54 V...-71 V)Tolerance range: -48 V (-45.6 V...-57 V)





3 Basic Test (Rack)

Check rack layout and issues against exchange-specific document (AKUHWlists), if not already done.



4 Visual Check

Check of all cable ends at the distributing frame

Are the cables already on-hook at the distributing frame and/or the ports? Y h...6N h...5

5 Visual Check

Make sure that there are no short circuits between the single conductors.

If this is not possible (e.g. lack of materials) or when in doubt, disconnect thecables which lead to the central/main distribution frame at the wire-wrappingfield of the F:LTG

6 Set DIPFIX Switch

For setting the DIPFIX switch and solder strap ......MMN:LTGx -TAB

Set the DIPFIX switch and the solder strap for all M:DIUs and M:RGEs.

Comply with country-specific settings.

A30808-X3063-A403-2-7630 PROC:LTG – 19

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7 Preparation

Put the switches on all LTG-current converters down

8 Information about Fuse Assignments

For screwing in fuses and switching on the relevant DCCs refer to the fuseassignments shown in the following figures:

Fuse Assignment of R:LTGA: ...... (see Fig. 3.6.1)

Fuse Assignment of R:LTGB/LTGB:OSS: ...... (see Fig. 3.6.2)

Fuse Assignment of R:LTGC: ...... (see Fig. 3.6.3)

Fuse Assignment of R:LTGC/CR: ...... (see Fig. 3.6.4)

Fuse Assignment of R:LTGD: ...... (see Fig. 3.6.5)

Fuse Assignment of R:LTGF: ...... (see Fig. 3.6.6)

Fuse Assignment of R:LTGG: ...... (see Fig. 3.6.7)

Fuse Assignment of R:LTGG/OSS: ...... (see Fig. 3.6.8)

Fuse Assignment of R:SNB/LTGG (cable routing from above): ...... (see Fig. 3.6.9)

Fuse Assignment of R:SNB/LTGG (cable routing from below): ...... (see Fig. 3.6.10)

Fuse Assignment of R:LTGH: ...... (see Fig. 3.6.11)

Fuse Assignment of R:LTGM: ...... (see Fig. 3.6.12)

Fuse Assignment of R:SNB/LTGM (cable routing from above): ...... (see Fig. 3.6.13)

Fuse Assignment of R:SNB/LTGM (cable routing from below): ...... (see Fig. 3.6.14)

Fuse Assignment of R:SN/MB/LTGM (cable routing from above): ...... (see Fig. 3.6.15)

Fuse Assignment of R:SN/MB/LTGM (cable routing from below): ...... (see Fig. 3.6.16)

PROC:LTG – 20 A30808-X3063-A403-2-7630


9 Switch on Power Supply

Screw in only one fuse at a time and switch on the relevant current converter(In LTGM the module in the corresponding MOLOC).

Screw in the first/next fuse for the LTG which is to be switched on.

Caution: use only 10 A fuses

Switch on the according current converter(s)(In LTGM the module in the corresponding MOLOC:M:DIU120A or M:DIU:LDIM)

System reaction: green LED of current converter(s) lights up

10 Check LED

Is the green LED of the current converter(s) lit?(In LTGM the green LED of the corresponding module: M:DIU120A orM:DIU:LDIM) Y h...14

N h...11

11 Find Faulty Module

Possible causes of fault: Module short circuit, faulty current converter or mainfuse

Pull all corresponding modules individually under power (except DCC orM:DIU120A/M:DIU:LDIM), but leave them in position.

After each module is pulled the voltage should be checked again.






replace faulty module

plug in all modules h...10

14 Decision: Next Current Converter

are all current converters (or M:DIU120A/M:DIU:LDIM) for this LTG alreadyswitched on? Y h...15

N h...9

A30808-X3063-A403-2-7630 PROC:LTG – 21

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15 Decision: Next LTG

Are all LTGs already switched on? Y h...ENDN h...8

END

PROC:LTG – 22 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:DAS300 – 1

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3.7 Test Procedure for DAS 300

DAS 300 TEST

The DAS 300 is an OEM device which is not tested by Siemens. To make claims on thevendor’s warranty, if necessary, the device must be checked with the integrated testfunctions during installation testing.

Operation of the DAS 300:

• The menu options referred to in the procedure appear in the LCD display above thefunction keys F1 to F4.

• Menu options are selected by pressing the relevant function key.

3.7.1 Digital Announcement System DAS 300

Fig. 3.7.1 Digital announcement system DAS 300

F1 F2 F3 F4

0# *

87 9

54 6

21 3

LoudspeakerTape recorderinput

Cursor keysNumerical keypad

Headphonejack

Microphonejack

Function keys

LCD display, 2 lines of 40 characters Key switch

DAS 300

PROC:DAS300 – 2 A30808-X3063-A403-2-7630


3.7.2 Digital Announcement System DAS 300 (Rear View)

Fig. 3.7.2 Digital announcement system DAS 300 (rear view)

CPU module

Power supply

120 Ω PCM connec-tions

PCMCPU

PCM module

SVA STV 48DC+5/+12/-12

+-

Power∆V1∆V2

LD1

LD2

RSTERRRST

ABT

A30808-X3063-A403-2-7630 PROC:DAS300 – 3

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1 Decision Block

Is the DAS 300 already in service? Y h...2N h...7

2 Identify the DIU Number

Refer to the exchange configuration documents to obtain the numbers of theLTG and DIU to which the DAS is connected.

3 Interrogate State of DIU

b STAT DIU:LTG=tsg-ltg,DIU=diu;

The command is repeated with the addition: EXEC'D

A list of the operating states of the interrogated units is output.

4 Decision Block

What is the operating state of the DIU?

– ACT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...5– MBL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...7– other. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . h...6

5 Configure the DIU to CBL

b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=CBL;

The command is repeated with the addition: EXEC'D

Continue with the next block after 5 minutes at most. But if the CBL acknowl-edgement arrives within the 5 minutes, continue with the next block immedi-ately.

6 Configure the DIU to MBL

b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=MBL;

The command is repeated with the addition: EXEC'D h...8

7 Switch on the DAS

When it is switched on, the DAS 300 should first go to the start menu. This canbe recognized by the texts OPT, MON and STA above the function keys.

– Switch on the DAS 300 using the key switch on the front.

– Wait for the start menu to appear (OPT above F1, MON above F2 and STAabove F3 in the LCD).

8 Select the Test Menu

– Press the key below menu option STA to select the status interrogationmenu.

– Press the key below menu option TEST to select the test menu.

PROC:DAS300 – 4 A30808-X3063-A403-2-7630


9 Enter Password

– Enter the test password (default ex-factory code ’1357902468’).

– Confirm with the # key.

10 Select System Test

Press the key below menu option SYS to select the system test menu.

11 Evaluation of Test Results

If the test was completed without error, the tested unit appears in the displaywith the addition O.K..

12 Perform CPU Test

Press the key below menu option CPU to start the CPU test.

Is the tested unit OK? Y h...13N h...26

13 Perform CRC Test

Press the key below menu option CRC to check the fixed texts.


14 Perform RAM Test

Press the key below menu option RAM to start the RAM test.


15 Select PCM Test

– Press the * key to return to the test start menu.

– Press the key below menu option PCM to select the PCM test menu.

16 Perform SYN Test

Press the key below menu option SYN to test the synchronization of the PCMinterface.


17 Perform TSx Test

Press the key below menu option TSx to test PCM time slots.


A30808-X3063-A403-2-7630 PROC:DAS300 – 5

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18 Perform SIG Test

Press the key below menu option SIG to test the signaling in PCM time slot 16.


19 Select Interface Test

– Press the * key to return to the test start menu.

– Press the key below menu option IF to select the interface test menu.

20 Perform RS1 Test

Press the key below menu option RS1 to test processor interface 1.

21 Decision Block

The processor interfaces can only be tested in the DAS 300 FLASH version.If the unit under test is a DAS 300 with EPROM, it does not have any processorinterfaces. The displayed result states that the interface test is ’not available’.

Is the unit under test a DAS 300 with EPROM? (test not possible?) Y h...25N h...22

22 Decision Block


23 Perform RS2 Test

Press the key below menu option RS2 to test processor interface 2.


24 Identify DIU Number

Refer to the exchange configuration documents to obtain the numbers of theLTG and DIU to which the DAS is connected.

25 Configure DIU to ACT

b CONF DIU :LTG=tsg-ltg,DIU=diu,OST=ACT;

The command is repeated with the addition EXEC'D

End of DAS 300 test

PROC:DAS300 – 6 A30808-X3063-A403-2-7630


26 Replace DAS 300

The DAS 300 is faulty. Replace the DAS 300 and send back the faulty device inits original packing materials.

End of DAS 300 test

END

A30808-X3063-A403-2-7630 PROC:DSU – 1

CommissioningSystem

ITMN - OFFLINE

3.8 Off-line Installation of Data Service Unit

DSU

3.8.1 Documents

The following Documents are required as references

– Maintenance Manual MMN:DSU

– AKUHW Lists

3.8.2 General

The DSU is based on the concept of the DLU. It provides interworking functions (IWF)for data exchange with different external telecommunication networks.The IWF is implemented in the interworking equipment (IWE). The IWE consists of oneIWE module and one IWES module which replace two SLM modules of the DLU.

The DSU is called DLU in the following procedure because the term DLU continues tobe used in fault reports and diagnostic results.

PROC:DSU – 2 A30808-X3063-A403-2-7630


3.8.3 Rack Layout

3.8.3.1 Rack Layout R:DSU (A-B-B-Modem) / (Fuse Assignment R:DSU)

Fig. 3.8.1 R:DSU, Configuration A-B-B-Modem

Shelf 0

Shelf 2

Shelf 4

CD

Fuse panel

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01 MOLOC A001, A058, A119

FU

MUT02

MUT03

MUT05

MUT06

MUT01

MOLOC A010-052, A089-11305

11 MOLOC C001, C058,C119

MOLOC C010-052, C089-11315

02 MOLOC A00, A119

MOLOC A010-052, A071-11306

12 MOLOC C001, C119

MOLOC C010-052, C071-11316

03 MOLOC A001, A119

MOLOC A010-052, A071-11307

13 MOLOC C001, C119

MOLOC C010-052, C071-11317

04

14

Shelf 1

Shelf 3

Shelf 5

F:DLU(A)

F:DLU(B)

F:DLU(B)

to PSU

to PSU

Modem

Modem

A30808-X3063-A403-2-7630 PROC:DSU – 3

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3.8.4 Equipment List

F:DLU(A), F:DLU(B) and F:DLU(C)

Basic frame F:DLU(A) Shelf 0, 1 Ext. frame F:DLU(B) Shelf 2...7

Mountinglocation

Module type Mountinglocation

Module type

Standard Variant Standard Variant

A001 M:DCCx A001 M:DCCx

A010 M:IWEx A010 M:IWEx

A016 M:IWESx 1) A016 M:IWESx 1)







A058 empty A058 M:BDE

A065 M:BDB A065 M:BDE

A071 M:BDCG A071 M:IWEx

A077 M:DLUC A077 M:IWESx 1)

A083 M:DIUD M:LDID A083 M:IWEx

A089 empty A089 M:IWESx 1)




A113 M:IWESx 1) M:ALEX 2) A113 M:IWESx 1)

A119 M:DCCx A119 M:DCCx

C001 M:DCCx C001 M:DCCx

C010 M:IWEx C010 M:IWEx

C016 M:IWESx 1) C016 M:IWESx 1)







C058 empty C058 M:BDE

C065 M:BDB C065 M:BDE

C071 M:BDCG C071 M:IWEx

Tab. 3.8.1 Equipment list

PROC:DSU – 4 A30808-X3063-A403-2-7630


The equipment complement of F:DLU(C) is the same as for F:DLU(B), but it onlyoccupies mounting location row A.

3.8.5 Mounting Location List

F:DLU(A), F:DLU(B) and F:DLU(C)

C077 M:DLUC C077 M:IWESx 1)

C083 M:DIUD M:LDID C083 M:IWEx

C089 empty C089 M:IWESx 1)



C107 empty C107 M:IWEx

C113 empty C113 M:IWESx 1)

C119 M:DCCx C119 M:DCCx

Moduletype

Address Mountinglocation

Basic frameShelf 0, 1

Ext. frame 0Shelf 2, 3



M:ALEX 0 - 15 A113

M:BDB 0 - A065

1 - C065

M:BDCG 0 - 8 A071

1 - 8 C071

M:BDE 2 - 4 - 6 - A058

2 - 4 - 6 - A065

3 - 5 - 7 - C058

3 - 5 - 7 - C065

M:DCCx 0 - 0 2 - 0 4 - 0 6 - 0 A001

0 - 1 2 - 1 4 - 1 6 - 1 A119

1 - 0 3 - 0 5 - 0 7 - 0 C001

1 - 1 3 - 1 5 - 1 7 - 1 C119

M:DIUD 0 - 10 A083

1 - 10 C083

M:LDID 0 - 10 A083

1 - 10 C083

Tab. 3.8.2 Mounting location list

Basic frame F:DLU(A) Shelf 0, 1 Ext. frame F:DLU(B) Shelf 2...7

Mountinglocation

Module type Mountinglocation

Module type

Standard Variant Standard Variant

Tab. 3.8.1 Equipment list

A30808-X3063-A403-2-7630 PROC:DSU – 5

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The mounting location list for the expansion frame F:DLU(C) is the same as forF:DLU(B), but only mounting location row A.

M:DLUC 0 - 9 A077

1 - 9 C077

M:IWEx 0 - 0 2 - 0 4 - 0 6 - 0 A010

M:IWEx 1 - 0 3 - 0 5 - 0 7 - 0 C010

M:IWESx 0 - 1 2 - 1 4 - 1 6 - 1 A016

M:IWESx 1 - 1 3 - 1 5 - 1 7 - 1 C016

M:IWEx 0 - 2 2 - 2 4 - 2 6 - 2 A022

M:IWEx 1 - 2 3 - 2 5 - 2 7 - 2 C022

M:IWESx 0 - 3 2 - 3 4 - 3 6 - 3 A028

M:IWESx 1 - 3 3 - 3 5 - 3 7 - 3 C028

M:IWEx 0 - 4 2 - 4 4 - 4 6 - 4 A034

M:IWEx 1 - 4 3 - 4 5 - 4 7 - 4 C034

M:IWESx 0 - 5 2 - 5 4 - 5 6 - 5 A040

M:IWESx 1 - 5 3 - 5 5 - 5 7 - 5 C040

M:IWEx 0 - 6 2 - 6 4 - 6 6 - 6 A046

M:IWEx 1 - 6 3 - 6 5 - 6 7 - 6 C046

M:IWESx 0 - 7 2 - 7 4 - 7 6 - 7 A052

M:IWESx 1 - 7 3 - 7 5 - 7 7 - 7 C052

M:IWEx 2 - 8 4 - 8 6 - 8 A071

M:IWEx 3 - 8 5 - 8 7 - 8 C071

M:IWESx 2 - 9 4 - 9 6 - 9 A077

M:IWESx 3 - 9 5 - 9 7 - 9 C077

M:IWEx 2 - 10 4 - 10 6 - 10 A083

M:IWEx 3 - 10 5 - 10 7 - 10 C083

M:IWESx 2 - 11 4 - 11 6 - 11 A089

M:IWESx 3 - 11 5 - 11 7 - 11 C089

M:IWEx 0 - 12 2 - 12 4 - 12 6 - 12 A095

M:IWEx 1 - 12 3 - 12 5 - 12 7 - 12 C095

M:IWESx 0 - 13 2 - 13 4 - 13 6 - 13 A101

M:IWESx 1 - 13 3 - 13 5 - 13 7 - 13 C101

M:IWEx 0 - 14 2 - 14 4 - 14 6 - 14 A107

M:IWEx 3 - 14 5 - 14 7 - 14 C107

M:IWESx 0 - 15 2 - 15 4 - 15 6 - 15 A113

M:IWESx 3 - 15 5 - 15 7 - 15 C113

Moduletype

Address Mountinglocation

Basic frameShelf 0, 1




Tab. 3.8.2 Mounting location list

PROC:DSU – 6 A30808-X3063-A403-2-7630


3.8.6 Connection of DLU to two LTG

Fig. 3.8.2 Connection of DLU to two LTG

DIUDLU0

PDC0

DLU

PDC1

DIUDLU1

PDC0

PDC1

DIUDLU0

PDC0

DLU

PDC1

DIUDLU1

PDC0

PDC1

LTUU21 S

ILCLTU

U21

LTUU20

LTUU20

LTUU21 S

ILCLTU

U21

LTUU20

LTUU20

LTGx

LTGy

A30808-X3063-A403-2-7630 PROC:DSU – 7

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The diagram above shows the connection of the DLU to two LTGs. One DLU system isconnected to the LTGx and the other to the LTGy. The dotted lines represent the linkswithout CCS.

3.8.7 Wiring between DIU:DLU and LTU

Fig. 3.8.3 Wiring between DIU:DLU and LTU

F2in.....F1ou49

50F2ou F1in.....F2ou F2in

49

50

F2ou.....F1in51

52F2in F1ou.....F2in F2ou

51

52

F2in.....F1ou49

50F2ou F1in.....F2ou F2in

49

50

F2ou.....F1in51

52F2in F1ou.....F2in F2ou

51

52

PDC0

PDC1

Pin No.

Pin No.

Pin No.

Pin No.

LTU/U21

LTU/U20

DIU:DLU LE LE DIU30A

PROC:DSU – 8 A30808-X3063-A403-2-7630


3.8.8 Connection path from DLU to LTE

Fig. 3.8.4 Connection path from DLU to LTE

DIUDLU0

PDC0

DLU

PDC1

F2in F1ouLTE

F2ou F1in

F2in F1ouLTE

F2ou F1in

PCM 30 with CCS

PCM 30 without CCS

To/from LTGx

To/from LTGx

DIUDLU1

PDC0

PDC1

F2in F1ouLTE

F2ou F1in

F2in F1ouLTE

F2ou F1in

PCM 30 with CCS

PCM 30 without CCS

To/from LTGy

To/from LTGy

A30808-X3063-A403-2-7630 PROC:DSU – 9

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3.8.9 Connection path from LTG to LTE

Fig. 3.8.5 Connection path from LTG to LTE

F1inLTE

F2ouF1ou

LTE

PCM 30 with CCS

PCM 30 without CCS

To/from DLU

To/from DLU

F2in

F1in F2ouF1ou F2in

LTUU21

SILC

LTGx

F1inLTE

F2ouF1ou

LTE

PCM 30 with CCS

PCM 30 without CCS

To/from DLU

To/from DLU

F2in

F1in F2ouF1ou F2in

LTUU21

SILC

LTGy

LTUU20

LTUU20

PROC:DSU – 10 A30808-X3063-A403-2-7630


1 Check of system voltage per rack row






2 Special fault clearance



3 Basic test (rack)




4 Check switch settings

Check modules for correct positioning of straps and switch settings ......MMN:DSU,TAB, MOD

5 Information block

6 Switch on exchange voltage (R:DSU)

The assignment of fuses to the individual modules is given in ......(see 3.8.3)

Switch off all DCCxx and RGMG of the first/ next R:DSU

Unscrew all fuses in this R:DSU h...7

!CAUTION:Areas on the wrap fields with pins for ringing or system voltage (e.g. SLM modules or DCCs) may beequipped with protection caps. The protection caps protect the operating personnel from touching the pinswith ringing or system voltage and must not be removed.

A30808-X3063-A403-2-7630 PROC:DSU – 11

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7 Information about DCCxx

If a DCCDB (A001, A119) is installed instead of the DCCCR, there is no needfor the DCCCV or DCCDD (A010). The DCCDB provides all the voltages thatwere otherwise provided by the DCCCR and DCCCV/DCCDD. If a DCCDC(A001) is used, there is also no need for the voltage of 93 V.

8 Screw in fuses

The assignment of fuses to the individual modules is given in ...... (see 3.8.3)

Screw in the fuse assigned to the DCCs in the first / next shelf

9 Switch on left-hand DCCxx

Switch on the left-hand DCCxx (MOLOC A001/C001)

Is the green LED on the faceplate of the DCCxx lit? Y h...12N h...10

10 Replace defective DCCxx

Switch off defective DCCxx

Unscrew relevant fuse

Switch off spare module

Replace defective DCCxx by spare module

Screw in relevant fuse

Switch on DCCxx



Note:If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective


– Repeat testing after successful fault clearance h...9

12 Switch on right-hand DCCxx

Switch on the right-hand DCCxx (MOLOC A119/C119)


PROC:DSU – 12 A30808-X3063-A403-2-7630


13 Replace defective DCCxx

Switch off defective DCCxx



Replace defective DCCxx by spare module


Switch on DCCxx






15 Decision: DCCDV/DCCDD

Is there a DCCDV or DCCDD in the shelf? Y h...16N h...19

16 Switch on DCCDV/DCCDD

Switch on DCCDV/DCCDD (MOLOC A010/ C010)

Is the green LED on the faceplate of the DCCDV/DCCDD lit? Y h...19N h...17

17 Replace defective DCCDV/DCCDD

Switch off defective DCCDV/DCCDD



Replace defective DCCDV/DCCDD by spare module


Switch on DCCDV/DCCDD

Is the green LED on the faceplate of the DCCDV/DCCDD lit? Y h...19N h...18

A30808-X3063-A403-2-7630 PROC:DSU – 13

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19 Next shelf?

Are all DCCs in all shelves switched on? Y h...20N h...8

20 Information about connection path test

The connection of the DLU to LTG is shown in:(LTGs used are LTGB, LTGG, LTGM) ...... (see Fig. 3.8.2)

When the DLU and LTG are connected, care must be taken to ensure 1:1wiring. This means that F2out of DIU:DLU0 goes via pins 49 and 50, just as F2inof LTU:U21. ...... (see Fig. 3.8.3)

21 Information about connection path from DLU to LTE

Because the DLU and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DIU:DLU andLTE (line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLU and LTG, the PCM link is interrupted.

The connection of DLU to LTE is shown in ...... (see Fig. 3.8.4)

22 Establish connection DIU:DLU to LTE

The connection first has to be established for DIU:DLU0 and than for DIU:DLU1

23 Establish test loop for PDC0

Link up the outgoing cable with CCS (PDC0) from the DIU:DLU0 (DIU:DLU1) tothe LTE which is to be connected with the LTE of LTGx (LTGy).

Red LED F2 on LTE goes out

Link F1out to F1in at the output of the LTE

Did the red LEDs MA0 and SA0 on the DIU:DLU0 (DIU:DLU1) go out? Y h...25N h...24

PROC:DSU – 14 A30808-X3063-A403-2-7630


24 Fault clearance

First check the cable for continuity.

If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1)module.

25 Connect PDC0 to the link

Open the loop and connect the PDC0 to the link

26 Establish test loop for PDC1

Link up the outgoing cable without CCS (PDC1) from the DIU:DLU0 (DIU:DLU1)to the LTE which is to be connected with the LTE of LTGx (LTGy).

Red LED F2 on the LTE goes out



27 Fault clearance


If no faults can be found here, replace the DIU:DLU0 (DIU:DLU1) module.



29 Decision: next DLU system

Note that DLU system 1 is connected to another LTG as shown in ......(see Fig. 3.8.2)

Has DLU system 1 already been checked? Y h...30N h...23

30 Information about connection LTG to LTE

The connection first has to be established for LTGx (to DLU system 0) and thanfor LTGy (to DLU system 1).

The connection of LTG to LTE is shown in ......(see Fig. 3.8.5)

A30808-X3063-A403-2-7630 PROC:DSU – 15

CommissioningSystem

ITMN - OFFLINE

31 Establish test loop for cable with CCS

Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLU system 0 (DLU system 1), if notalready done.


Link F1out at the output of the LTE to F1in

Have the red LEDs MA0 and SA0 on the DIU:LTG gone out? Y h...33N h...32

32 Fault clearance


If no faults can be found here, replace the DIU module in question.

33 Connect LTU:U21 to the link

Open the loop and connect the LTU:U21 to the link

34 Establish test loop for cable without CCS

Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLU system 0 (DLU system 1), if notalready done.

Red LED F2 goes out



35 Fault clearance





37 Decision: test DLU-system 1

Has the connection of LTGy to DLU system 1 already been checked? Y h...38N h...31

38 Decision: F:Modem

Are there F:Modem installed in the current R:DSU? Y h...PROC:MODEM

N h...39

PROC:DSU – 16 A30808-X3063-A403-2-7630


39 Decision: next R:DSU

Have all R:DSU of the NE already been switched on? Y h...40N h...6

40 Decision: R:Modem

– Repeat the following procedure until all R:Modem of the NE are put intoservice h...PROC:

MODEM

– If no R:Modem is installed in the NE or all R:Modem have already been putinto service, continue: h...END

END

A30808-X3063-A403-2-7630 PROC:MODEM – 1

CommissioningSystem

ITMN - OFFLINE

3.9 Off-line Installation of modems for 3.1 kHzaudio bearer services

MODEM

3.9.1 Rack Layouts

3.9.1.1 Rack Layout R:DSU (A-B-B-Modem) / (Fuse Assignment forModems)

PROC:MODEM – 2 A30808-X3063-A403-2-7630


Fig. 3.9.1 R:DSU, Configuration A-B-B-Modem

Shelf 0

Shelf 2

Shelf 4

CD

Fuse panel

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

01

FU

MUT02

MUT03

MUT05

MUT06

MUT01

05

11

15

12

16

03

07

13

17

04

14

Shelf 1

Shelf 3

Shelf 5

F:DLU(A)

F:DLU(B)

F:DLU(B)

to PSU

to PSU

Modem

Modem

02

06

A30808-X3063-A403-2-7630 PROC:MODEM – 3

CommissioningSystem

ITMN - OFFLINE

3.9.1.2 Rack Layout R:Modem / (Fuse Assignment for Modems)

Fig. 3.9.2 R:Modem

Fuse panel

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

FU

03 to PSU

01 to PSU

to PSU02

Modem

06 to PSU

04 to PSU

to PSU05

Modem

Modem

Modem

Modem

Modem

not equipped

not equipped

PROC:MODEM – 4 A30808-X3063-A403-2-7630


3.9.2 Modem Frame Layouts

Two different types of modems for 3.1 kHz audio bearer services can be used in theDSU:

– GPT modem

– NEUHAUS modem

According to the type of modem it is possible to place 12 (NEUHAUS) or 14 (GPT)modems into one frame F:Modem.All modems in a frame are supplied by one power supply unit (PSU). It is not possibleto mix both types of modems in one frame, because they are fed by different types ofPSUs.The modem frames F:Modem can be located in the Mounting Units 06 and 07 of theR:DSU and/or in a separate rack R:Modem.

3.9.2.1 Frame F:Modem (GPT)

Fig. 3.9.3 Frame F:Modem (GPT)

Modem frame (Type GPT)

PSU

1413121110987654321

A30808-X3063-A403-2-7630 PROC:MODEM – 5

CommissioningSystem

ITMN - OFFLINE

3.9.2.2 Frame F:Modem (NEUHAUS)

Fig. 3.9.4 Frame F:Modem (NEUHAUS)

1 Prepare modem frames

Unscrew the fuses of all modem frames F:Modem of the current rack, if notalready done

The fuse assignment for the modem frames is shown in: ......3.9.1

2 Switch on PSU

Unplug all modems in the first/next F:Modem but leave in position

Plug in the PSU of this F:Modem

Screw in the fuse for this F:Modem

Check if PSU is working:

• On PSU for GPT: Green LED “Mains in” and red LED “PWR Monitor” mustlight up

• On PSU for NEUHAUS: All 3 Green LEDs must light up

Is the PSU working? Y h...5N h...3

Modem frame (Type NEUHAUS)

PSU

121110987654321

PROC:MODEM – 6 A30808-X3063-A403-2-7630


3 Replace PSU

Unscrew the corresponding fuse

Replace the PSU by spare module of the same PSU type

Screw in the corresponding fuse

Check if PSU is working:

• On PSU for GPT: Green LED “Mains in” and red LED “PWR Monitor” mustlight up

• On PSU for NEUHAUS: All 3 Green LEDs must light up

Is the PSU working? Y h...5N h...4




5 Plug in modems

Plug in the first/next modem of the frame where the PSU has been switched on

Is the modem working? (Red LED for Power must light up) Y h...8N h...6

6 Replace modem

Replace the modem by spare module of the same modem type

Is the modem working? (Red LED for Power must light up) Y h...8N h...7




8 Decision: next modem

Have all modems of the frame already been plugged in Y h...9N h...5

9 Decision: next F:Modem

Have all modem frames of the current rack already been put into service? Y h...10N h...2

10 Return blockReturn to calling procedure

END

A30808-X3063-A403-2-7630 PROC:DLUB – 1

CommissioningSystem

ITMN - OFFLINE

3.10 Off-line Installation of Digital Line Unit(Frames D / E / F)

DLUB

3.10.1 Documents


– Maintenance Manual MMN:DLUB

– AKUHW Lists

PROC:DLUB – 2 A30808-X3063-A403-2-7630



3.10.2.1 Fuse Assignment R:DLUB (D-E-D-E)

Fig. 3.10.1 Sicherungszuordnung R:DLUB (D-E-D-E)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

Shelf 0

Fuse panel

MUT02

MUT03

MUT01

01

MGB

04

03

A001-057 02A068-121

05

06

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

Shelf 2

12

11

10

13

14

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)

Shelf 0MUT05

21

20

A001-057 19A068-121

22

23

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

07

18

A001,A015-033

08 A008,A039-057

09A116,A068-086

A123,A092-110

Shelf 2

27

30

31

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E) A116,A068-086

A123,A092-110

29

28 C001,C015-033

C008,C039-057

A001,A015-033

25 A008,A039-057

24 26

CD

MUT06

FU

BD2

BD2

BD3

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

RGB

RGB

RGB

RGB

MGB

BD3

* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the accordingfuses.

A30808-X3063-A403-2-7630 PROC:DLUB – 3

CommissioningSystem

ITMN - OFFLINE

3.10.2.2 Fuse Assignment R:DLUB (D-E-D-D)

Fig. 3.10.2 Sicherungszuordnung R:DLUB (D-E-D-D)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

Shelf 0

Fuse panel

MUT02

MUT03

MUT01

01

04

03

A001-057 02A068-121

05

06

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

Shelf 2

12

11

10

13

14

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)

Shelf 0MUT05

21

20

A001-057 19A068-121

22

23

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

07

18

A001,A015-033

08 A008,A039-057

09A116,A068-086

A123,A092-110

CD

Shelf 2MUT06

29

28

A001-057 26A068-121

30

31

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(D)

24

FU

BD2

BD3

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

RGB

RGB

RGB

RGB

RGB

RGB

MGB

MGB

MGB

* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the according

PROC:DLUB – 4 A30808-X3063-A403-2-7630


3.10.2.3 Fuse Assignment Rack R:DLUB (D-E-D-F)

Fig. 3.10.3 Sicherungszuordnung R:DLUB (D-E-D-F)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

Shelf 0

Fuse panel

MUT02

MUT03

MUT01

01

MGB

04

03

A001-057 02A068-121

05

06

C001,C015-033

C008,C039-057*

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

Shelf 2

12

11

10

13

14

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)

Shelf 0MUT05

21

20

A001-057 19A068-121

22

23

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(D)

07

18

A001,A015-033

08 A008,A039-057

09A116,A068-086

A123,A092-110

Shelf 2

27

A116,A074-92

A123,A098-110

A001,A015-033

25 A008,A039-057

24 26

CD

FU

F:DLU(F)

BD2

BD3

BD2

BD3

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

RGB

RGB

RGB

RGB

MGB

* 057 Only if MGB is inserted.Note: If only one DCC is used per halfshelf, the DCC Pos shf-1 and shf-3 are omitted as well as the according

A30808-X3063-A403-2-7630 PROC:DLUB – 5

CommissioningSystem

ITMN - OFFLINE

3.10.3 Equipment of the different frames

Detailed information about the equipment of the different frames are listed in the equip-ment list and the mounting location list of the MMN:DLUB, APP.

3.10.4 Shelter DLU 400/700

The shelter can contain the following equipment:

• Remote Shelter DLU 400 (Fig. 3.10.4)Basic frame D for DLUB (F:DLU(D)) with a max. of 384 subscribers or basic frameG for DLUD (F:DLU(G)) with a max. of 448 subscribers

• Remote Shelter DLU 700 (Fig. 3.10.5)Basic frame F:DLU(D)) or F:DLU(G)) and also extension frame F for DLUB(F:DLU(F)) with a max. of 240 subscribers

• Transmission equipment for the shelter (optional)The following transmission equipment is provided in the shelter for connection to thenetwork node or for the connection of additional shelters (ring or star configuration):

– Transmission technology in the synchronous digital hierarchy (SDH)SDH: synchronous multiplexers (SMA1/4) or, alternatively,synchronous dual terminal multiplexers (STM1D)

– Transmission technology in the plesiochronous digital hierarchy (PDH)PDH technology in the shelter:Optical/HDSL terminal multiplexer for 2 Mbit/s (OMX2/HMX)Optical terminal multiplexer for 34 Mbit/s (OMX16)

(PDH technology can also be integrated in the DLU hardware)

PROC:DLUB – 6 A30808-X3063-A403-2-7630


• MDF/ DDF distribution frame

• Air conditioning (fan and heater)

• Power supply unit, including standby battery

• Cable TV

• Modem for OFDC (optional)

3.10.4.1 Overview Shelter 400/700

Fig. 3.10.4 Configuration of ’Remote Shelter DLU 400’

MDF200 DA internal

MDF200 DA internal

MDF200 DA external

MDF200 DA external

MDF200 DA external

Mains access (MAP)orlightning overvoltageprotection (LOP)

SMA 1/4 or SMT1D(SDH)

1600

mm

1800 mm500 mm

Front viewSide view (left)

Fan

Basic frame D(F:DLU(D)) or G

(F:DLU(G))

Connector panel

Fan

OMX2/HMX or OMX16(PDH)

Connector panel

AC/DC converter (48 V/30 A)

Cable TV

SIEMENS

Heater 1600 W

DDF24 PCM30

DDF24 PCM30

DC distribution

AC distribution

Battery

(Connection foremergency power supply)

OFDC modem

A30808-X3063-A403-2-7630 PROC:DLUB – 7

CommissioningSystem

ITMN - OFFLINE


3.10.4.2 Fuse Assignment PPD (Primary power distribution)

Sicherungen gesicherte Einheit

F1 25 A AC Power supply(Fehlerstromschutzschalter)

F2 16 A Rectifier 1

F3 16 A Rectifier 2 (optional)

F4 10 A Heater

F5 10 A Cabel TV (optional)

Tab. 3.10.1 Assignment of primary fuses


Heater 1600 W

AC/DCconverter(48 V/30 A)

MDF200 DA external


(F:DLU(G))

Extension frame F(F:DLU(F))


1800

mm

1800 mm500 mm


Fan

Connecting panel

Fan


Connecting panel

DC distribution

AC distribution

Cable TV

SIEMENS

MDF200 DA external

MDF200 DA external

MDF200 DA internal

MDF200 DA internal

MDF200 DA internal

MDF200 DA external

DDF24 PCM30

DDF24 PCM30

DDF24 PCM30

104 DAinternal

(Connection for emer-gency power supply)

Battery

OFDC modem

MDF200 DA external

PROC:DLUB – 8 A30808-X3063-A403-2-7630


3.10.4.3 Fuse Assignment SPD (Secondary power distribution)

Caution:The fuse cover must not be removed by the maintenance. personnel. If maintenancework on the fuses is necessary, this can only be carried out by trained specialists. Beforethe fuse cover is removed the 220 V AC line voltage must be switched off.

F6 10 A Socket (for OFDC-Modem)

Fuses Unit

F1 10 A DLU Shelf 0 (System side 1)




F5 10 A Transmission equipment (SDH)orRadio equipment SRA L1/SRA L2

F6 10 A not used

F7 10 A Transmission equipment (PDH)orRadio equipment SRA L1/SRA L2

F8 10 A Shelter DLU 400: not usedbzw.Shelter DLU 700: Shelf 2 (System side 1)

F9 10 A Fan 2

F10 10 A Fan 1

F11 10 A Monitoring and heater control


F13 50 A Battery

Tab. 3.10.2 Assignment of secondary fuses



A30808-X3063-A403-2-7630 PROC:DLUB – 9

CommissioningSystem

ITMN - OFFLINE

3.10.5 Remote DLU

3.10.5.1 Connection of a remote DLU to two LTG

Fig. 3.10.6 Connection of DLUB to two LTG

The diagram above shows the connection of the DLUB to two LTGs. One DLUB systemis connected to the LTGx and the other to the LTGy. The dotted lines represent the linkswithout CCS.

PDC0

PDC1

LTUU21

LTUU21

PDC0

PDC0

PDC0

PDC1

PDC1

PDC1

DLU

DLU

LTUU20

LTUU20

LTUU21

LTUU21

LTUU20

LTUU20

LTGx

LTGy

SILC

SILC

DIUDLU0

DIUDLU1

DIUDLU0

DIUDLU1

A2 051

B2 051

A2 074

B2 074

Plug position

A2 051

B2 051

A2 074

B2 074

PROC:DLUB – 10 A30808-X3063-A403-2-7630


3.10.5.2 Wiring between DIU:DLU and LTU

Fig. 3.10.7 Wiring between DIU:DLU and LTU (DIU120A)

(*): The pin numbers refer to the first of four PDC connectors of the DIU120A. An over-view of all pin numbers is shown in the following table:

PDC(0) PDC(1) PDC(2) PDC(3)

Sym Koax Sym Koax Sym Koax Sym Koax

E132 E132 E142 E142 E152 E152 E212 E212

E134 C134 E144 C144 E154 C154 E214 C214

E136 E136 E146 E146 E156 E156 E216 E216

E138 C136 E148 C146 E158 C156 E218 C216

Tab. 3.10.3 Pin numbers for PCM30 connectors of DIU120A

F1in...F2outF2in...F1out

F2in

F2out49

50

51

52

F2out...F1in F1out...F2in


F2in

F2out


F2out

F2in

F2out

F2in

PDC0

Pin No. (Plug pin)

PDC1

LTU/U21

LTU/U20

DIU:DLU

LE LE

DIU120A

Sym. Koax.

49

29

51

31

49

50

51

52

49

29

51

31

E132

E134

E136

E138

Pin No.(*)

Sym. Koax.

E132

C134

E136

C136

E132

E134

E136

E138

E132

C134

E136

C136

A30808-X3063-A403-2-7630 PROC:DLUB – 11

CommissioningSystem

ITMN - OFFLINE

Fig. 3.10.8 Numbering method on F:LTGM

row C(mounting area 1)

SU1

SU4

SU5

SU2

SU3

SU1

SU4

SU2

SU3

row D(mounting area 2)

ABCDE

1

9

5

Pin E 2 1 2 2

0 (no pins available)

PDC1

PDC2

Pin E 2 1 4

Pin E 2 1 6

Pin E 2 1 8

Pins for PDC3 (sym.)

101

F:LTGM(A) Rearview

151203255305

PDC0

DIU120A MOLOCS:

PROC:DLUB – 12 A30808-X3063-A403-2-7630


Fig. 3.10.9 Wiring between DIU:DLU and LTU (DIU30D)

3.10.5.3 Connection path from DLUB to LTE

Fig. 3.10.10 Connection path from DLUB to LTE


F2in

F2out49

50

51

52



F2in

F2out


F2out

F2in

F2out

F2in

PDC0

Pin No. (Plug pin)

PDC1

LTU/U21

LTU/U20

DIU:DLU

LE LE

DIU30D

Sym. Koax.

49

29

51

31

49

50

51

52

49

29

51

31

49

50

51

52

Pin No. (Plug pin)

Sym. Koax.

49

29

51

31

49

50

51

52

49

29

51

31

PDC0

PDC0

PDC1

PDC1

DLU

PCM 30 with CCS

PCM 30 without CCS

F2in

F2out F1in

F1outLTE

F2in

F2out F1in

F1outLTE

PCM 30 with CCS

PCM 30 without CCS

F2in

F2out F1in

F1outLTE

F2in

F2out F1in

F1outLTE

to/from LTGx

to/from LTGx

to/from LTGy

to/from LTGy

DIUDLU0

DIUDLU1

A30808-X3063-A403-2-7630 PROC:DLUB – 13

CommissioningSystem

ITMN - OFFLINE

3.10.5.4 Connection path from LTG to LTE











LTUU21PCM 30 with CCS

PCM 30 without CCS

F2out

F2inF1out

F1inLTE

F2in

F2outF1in

F1outLTE

to/from DLU

to/from DLU

LTUU20

SILC

LTGx


PCM 30 without CCS

F2out

F2inF1out

F1inLTE

F2in

F2outF1in

F1outLTE

to/from DLU

to/from DLU

LTUU20

SILC

LTGy

PROC:DLUB – 14 A30808-X3063-A403-2-7630


3 Basic test (rack)




Check and if necessary correct positioning of straps and switch settings on themodules

......MMN:DLUB -TAB MOD:DLU

4 Create basic state


Switch off all DCCxx (RGB, MGB, if present)

Unscrew all fuses in the R:DLU h...5


If SLM_8 or SLMD modules are used, each halfshelf is supplied by one DCC_8(DCCDD, DCCDC, DCCCR) instead of 2 DCCDF.These DCC_8 are inserted in the mounting locations of DCC x-0 and DCC x-2.DCC x-1 and DCC x-3 are omitted and also the corresponding fuses.

The following steps have to be carried out for each shelf of the DLUB.

6 Information block: Thermal switch

In every DLUB rack, a thermal switch is built into the bottom panel of the rack.The contact is fixed at the allowable room temperature. If this temperature isexceeded, then, via this thermal switch all DCCs in the rack receive groundpotential via the individual control input.In this way the DCCs are switched off.Exception: The DCCs in basic shelf0 are not switched off. In this way messagesare still possible.If the temperature goes down, the DCCs are switched back on.


A30808-X3063-A403-2-7630 PROC:DLUB – 15

CommissioningSystem

ITMN - OFFLINE

7 Screw in fuses


Screw in the fuse for the first/next DCCxx which is to be switched on

Switch on the corresponding DCCxx


8 Replace DCCxx

Switch off DCCxx



Replace DCCxx by spare module


Switch on DCCxx



If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective



10 Decision: next DCCxx

Are all DCCs in the shelf switched on? Y h...11N h...7

11 Decision: next shelf

Are all DCCs in each shelf of the rack switched on? Y h...12N h...7

12 Decision: RGB

Is at least one module M:RGB present in the rack? Y h...13N h...18

13 Switch on RGB

Fuse allocation to DCCxx and RGB-modules (if present) in F:DLU(D)

PROC:DLUB – 16 A30808-X3063-A403-2-7630


Switch on the first / next RGB (in F:DLU(D))

Is the green LED on the faceplate of the RGB module lit? Y h...16N h...14

14 Replace defective RGB

Switch off defective RGB


Replace defective RGB by spare module(Replacing the RGB module under power is possible)

Switch on RGB





16 Measure ringing voltage

The ringing voltage can be measured with a multimeter between the test jackson the front panel of the RGB module. ......MMN:DLUB -

TAB:MOD

Measure the ringing voltage between the test jacks.

Is the ringing voltage correct? Y h...17N h...14

17 Decision: next RGB

Have all RGB modules in the rack already been switched on? Y h...18N h...13

18 Decision: MGB

Is at least one module M:MGB present in the rack? Y h...19N h...23

MUT FUSE DCCxx RGB Remark

02 01 0-0 0

02 0-2 1

05 18 0-0 0

19 0-2 1

06 24 2-0 0 Only in Version D, E, D, D

26 2-2 1

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19 Switch on MGB

The MGB modules in F:DLU(D) are (if present) redundantly supplied via thefuses of DCCxx 1-0 and 1-1

Fuse allocation to DCCxx and MGB-modules (if present) in F:DLU(D)

Switch on MGB in the first / next F:DLU(D)

Is the green LED on the faceplate of the MGB module lit? Y h...22N h...20

20 Replace defective MGB

Switch off defective MGB


Replace defective MGB by spare module(Replacing the MGB module under power is possible)

Switch on MGB





22 Decision: next MGB

Have all MGB modules in the rack already been switched on? Y h...23N h...19

MUT FUSE DCCxx Remark

02 03 1-0 Parallel for one MGB module

04 1-1


21 1-1

06 28 3-0 Parallel for one MGB module(Only possible in Version D, E, D,

D)29 3-1

PROC:DLUB – 18 A30808-X3063-A403-2-7630


23 Information about TESMOD2E

Before on-line testing of the DLUB, all the test routines that can be called by theCP with MML commands can also be called by means of the TESMOD2E (TEStMOdule for DLU 2 Extended) and the results displayed. In this way TESMOD2Ecan be used in off-line mode to obtain a statement on the operability of theDLUB to be put into service before the DLUB is connected to the parentexchange via the PCM lines.

Answer the following question with yes only if a TESMOD2E is available and on-line testing is not possible in the foreseeable future.

Do you want to test the DLUB with the TESMOD2E ? Y i....PROC:TESMOD2E

N h...24– After finishing DLUB testing with TESMOD2E continue h...24


The connection of the DLUB to LTG is shown in:(LTGs used are LTGB, LTGF, LTGG, LTGM) ......(see Fig. 3.10.

6)

According to the LTG the DIU30D or DIU120A is used as LTU. The wiringbetween DIU:DLU and the corresponding LTU is shown in the following figures:

Wiring to DIU120A ......(see Fig. 3.10.7)

Wiring to DIU30D ......(see Fig. 3.10.9)

25 Information about connection path from DLUB to LTE

Because the DLUB and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DIU:DLU and LTE(line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLUB and LTGB, the PCM link is interrupted.

The connection of DLUB to LTE is shown in ......(see Fig. 3.10.10)

26 Establish connection DIU:DLU to LTE

The connection first has to be established for DIU:DLU0 and than for DIU:DLU1

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27 Create test loop for PDC0

Link up the outgoing cable with CCS (PDC0) from the DIU:DLU0 (DIU:DLU1) tothe LTE which is to be connected with the LTE of LTGx (LTGy).




28 Fault clearance






Link up the outgoing cable without CCS (PDC1) from the DIU:DLU0 (DIU:DLU1)to the LTE which is to be connected with the LTE of LTGx (LTGy).




31 Fault clearance





33 Decision: next DLUB system

Note that DLUB system 1 is connected to another LTG as shown in ...... (see Fig. 3.10.6)

Has DLUB system1 already been checked? Y h...34N h...27

PROC:DLUB – 20 A30808-X3063-A403-2-7630


34 Establish connection LTG to LTE

The connection first has to be established for LTGx (to DLUB system 0) andthan for LTGy (to DLUB system 1).

The connection of LTG to LTE is shown in ......(see Fig. 3.10.11)

35 Create test loop for cable with CCS

Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLUB system 0 (DLUB system 1), if notalready done.




36 Fault clearance





38 Create test loop for cable without CCS

Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLUB system 0 (DLUB system 1), ifnot already done.

Red LED F2 goes out



39 Fault clearance





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41 Decision: test connection to DLUB system 1

Has the connection of LTGy to DLUB system 1 already been checked? Y h...ENDN h...35

END

PROC:DLUB – 22 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:TESMOD2E – 1

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3.11 Testing DLUB with the TESMOD2E

TESMOD2E

3.11.1 Overview of TESMOD2E parts

The test module can be divided into two parts: the control/ memory board and the controlpanel. TESMOD2E can have an input and display panel connected and/or a printer.TESMOD2E is plugged into the mounting location of the DLUC module and the DLUCmodule is plugged into TESMOD2E.

Fig. 3.11.1 TESMOD2E -Overview

HEX display

X

X

LED

off/on

LIST key

= TESMOD /DLUC

= SME/TESMOD

= A

= LIMITER

= PRINTER

= RUN IN

= SINGLE/CONTI.

= STOP

RESET key

Control panel

PT 80 connector

Connector for inputand display panel

PlugDLUC

Control/memory board

Module frameconnector

PIOP8255

Memory bankswitchover

Controllogic

27C201EPROM

27C201EPROM

27256EPR

27256EPR

62256-RAM

PROC:TESMOD2E – 2 A30808-X3063-A403-2-7630


3.11.2 Control and memory unit

The control logic for TESMOD2E is used to access the memory and peripheral compo-nents and to switch over the memory areas between the DLUC module and TESMOD2EThe organization of the memory areas on both modules is shown in the following figure.

Fig. 3.11.2 Memory organization for DLUC and TESMOD2E

The memory area is switched over with the comparator chip and a register. The DLUCmemory area is always enabled if the address wanted is larger than the value stored inthe register. The TESMOD2E memory is disabled during this access procedure. On theDLUC module the memory chips are accessed or disabled by the enabling and disablingof the CS chip.

The DLUC memory area is enabled by:

– switch position on TESMOD2E

– access to the RAM area of the DLUC module

– switchover by program

0000H 0000H

6000H

FFFFH

C000H

E000H

FFFFH

E P R O M

R A M

DLUC TESMOD2E

27C256 /62256

27C256 /62256

62256

8000H 0

1

3132

63

27C201

27C201

.

.

.

Country

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The memory unit of TESMOD2E is realized by a program memory with a capacity of 48Kbyte, a data memory with a capacity of 16 Kbyte and 2 country specific EPROMs witha total capacity of 512 Kbyte. The total memory area of both country specific EPROMsis divided into 64 memory banks with a capacity of 8 Kbyte each.Each memory bank contains the country specific loading data of one country. Switch-over between the memory banks is realized by a decoder with address latch. The corre-sponding memory bank is selected by the 'PORT command OUT adr.'.

The addresses of the TESMOD2E memory area are located on the same level as theEPROM area of the M:DLUC (see Fig. 3.11.2)

The module PIOP 8255 is used as an interface to switches, LEDs, Hex-displays and theprinter.

3.11.3 Control panel

The control panel contains switches, keys and displays.

3.11.3.1 Switch functions

Switch Position Meaning

STOP OFF/ON ON A test run can be stopped by putting the switch to the ON position. Theprogram stops when the job buffer has been processed.

OFF The test is resumed by changing the switch to the OFF position.

SINGLE/CONT SINGLE When the switch is in the SINGLE position, the selected program isexecuted once. All the tests executed are shown in the test log.

CONT The selected program executes 65535 times. The test log will containonly those tests in which faults occurred.

RUN IN OFF/ON ON Run-in mode: The program executes 65535 times. A printer must beconnected. If faults have occurred, a summary of the fault messages isprinted out after every program execution. If the same fault occurs onthree consecutive occasions, the message "Same fault from test run X toY" is only printed out from time to time. This happens until another faultoccurs.

OFF The run-in mode is switched off.

PRINTER OFF/ON OFF The printer is switched off.

ON The printer is switched on. A printer must be connected, otherwise theprogram does not execute.

Caution! Do not connect a print multiplexer

LIMITER OFF/ON ON Only 10 consecutive fault messages are printed out.Fault output does not start again until a new program step has begun.

OFF Fault output is only interrupted when the fault field is full (approx. 500messages).

Tab. 3.11.1 Switch functions

PROC:TESMOD2E – 4 A30808-X3063-A403-2-7630


3.11.3.2 Key functions

3.11.3.3 Displays

A OFF/ON OFF Normal initialization procedure:In this position, the RAM area and the DMA/DLC chips undergo a pretestin the first run. In a subsequent run these chips are not pretested. If theconfiguration data have been entered, the load routine is executed. Afterthe DLU load routine, the TESMOD2E is ready for test command input.

ON In this position no more activities are carried out after initialization of theTESMOD2E .

SME/TESMOD SME With the switch in this position, control is taken over by the ETA85controller.

TESMOD

TESMOD with original processor on DLUC module.It is controlled by the input and display panel.

EPROMDLUC/TESMOD

DLUC When power has been switched on or the reset key pressed, the DLUoperating program is started. The TESMOD2E functions are not avail-able in this setting.

Key Function

LIST Printer switch "OFF":The test log is displayed in the form of a code on the HEX display in single-step mode.Advance step-by-step by repeatedly pressing the LIST key. When each code number isoutput the red LED indicates whether the value displayed refers to a text message or a faultmessage.

Red LED on: Fault messageRed LED off: Text message

Printer switch "ON":The test log is printed out.

RESET The RESET key resets the processor and restarts the program depending on the EPROMDLUC/TESMOD.

Tab. 3.11.2 Key functions

Display Meaning

Hexadecimal display This identifies the test routines and the coded test results.

Tab. 3.11.3 Displays



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3.11.4 Input and display panel

Fig. 3.11.3 Input and display panel

Red LED Each time a code number is output, the red LED indicates whether the valuedisplayed refers to a text message or a fault message.

red LED on - fault messagered LED off - text message

Green LED The green LED indicates that a test is currently running.

Display Meaning

Tab. 3.11.3 Displays

0 1 2 3

D I S P L A Y

7654

8

C D

9 A B

E F I L

S G

B T

D E

SWITCHES

KEY

HEX - INPUT FUNCTION KEYS

PROC:TESMOD2E – 6 A30808-X3063-A403-2-7630


As shown in the figure above, the input and display panel contains:

• a 16-character alphanumeric display

• a hexadecimal key pad

• a function key pad

• two switches

• a RESET key

3.11.4.1 16-character displayThe 16-character alphanumeric display shows the test messages, addresses and data.

3.11.4.2 RESET keyPress the RESET key to reset the DLUC, initialize, and then to load the DLU.

3.11.4.3 Switch functions

3.11.4.4 Hexadecimal key padThe hexadecimal key pad is used to enter the module flag byte, to select test routinesand to enter addresses and data.

3.11.4.5 Function key pad

The function key pad comprises eight keys. When one of these function keys is pressed,the function is selected on the basis of the key value that has been read in, a corre-sponding status byte is set and the necessary memory cells reserved. The two key padsare then interrogated for input. If one of the hexadecimal keys is now pressed, this valueis stored and displayed. When a new function key is pressed, the status byte is resetand the memory cells reserved again. If the E key is pressed, the function called isexecuted. When the function has terminated, the status byte is cleared and the keys areinterrogated again for input. The function keys are explained below:

• E keyThe E key (Enter) starts routines or initiates actions which have been called by theother function keys.


TEST PORT/ALL PORT With the switch in this position, one module can be tested on its own.

ALL With the switch in this position, all the modules of a module type aretested.

RAM TESMOD /DLUC TESMOD Press the G key to modify or display files, or to start programs fromthe TESMOD2E memory area.

DLUC Press the G key to modify or display files, or to start programs fromthe DLUC memory area.


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• B keyBefore starting the test routines, the configuration data of the DLU (each insertedmodule is represented by an identification byte) have to be input. By pressing the Bkey all modules, except the controller modules (DLUC,DIUD,BDCG) and the TUmodules (FMTU, LCMM) will be preset with the identification byte of a normalsubscriber line module.The preset id bytes are only written into the memory if pressing the B key is followedby pressing the E key. Thus it can be avoided that identification bytes, which havebeen input manually, are unintentionally overwritten by pressing the B key.

• T keyPress the T key (Test) and state the test block number to call all test routines. Thetest routines are started by pressing the E key. After the test the result is output andthe keys are interrogated for new input.

• D keyPress the D key to display the DLUC or TESMOD2E data. The position of the RAMTESMOD2E /DLUC switch determines the memory area from which the data aretaken. After pressing the D key, enter the required address. The contents of theaddress are displayed when the E key has been pressed. The I key can be used todisplay neighboring memory cells.

• I keyPress the I key to increment the address by one. This key can also be used for thedecrement function when the configuration data are being entered, if the TESTPORT/ALL switch is in the PORT position when the I key is pressed.

• S key Press the S key (Substitute) to change the contents of memory cells. The displayshows the address of the memory location to be changed, the contents of thememory location and the data to be entered. Press the E key to transfer the dataentered on the keypad into the memory cell.

• G keyPress the G key (Go) to start a program from any address.

• L keyPress the L key (List) to print out the last test log.

3.11.5 Test options with TESMOD2E

To call the individual test routines, press the T key and then specify the test by statingthe test code number. The following table gives an overview of the individual testroutines.

Test code no. Test object

0 Entire DLU system

1 DLUC

2 GCG

3 All BD/DCC if switch PORT/ALL is at ALL

3 One BD/DCC if switch PORT/ALL is at PORT

Tab. 3.11.5 Test codes and test routines

PROC:TESMOD2E – 8 A30808-X3063-A403-2-7630


Tests of the entire DLU system are carried out in the following sequence:

– DLUC test

– GCG test

– BD test

– DIU:DLU test

– TU test

– SLMAC test

– EMSP test

The tests listed above check the following:

• DLUC test

– Checksum per EPROM with reference value

– Checksum of all EPROMs

– Writability of the RAM cells

– Writability of the RAM cells with different bit patterns

– Availability of memory addresses

• GCG test

– Switchover of clock systems

– Loop test for checking the correct DLU clock distribution

4 DIU:DLU

5 All SLMACs if switch PORT/ALL is at ALL

5 One SLMAC if switch PORT/ALL is at PORT

6 SASC

7 All TU modules

8 FMTU

9 LCMM

A LVMM (not possible in DLUB)

B EMSP

C All SLMD if switch PORT/ALL is at ALL

C One SLMD if switch PORT/ALL is at PORT

D ALEX

E MTA

F MTAM

10 LTAM

11 TBAM

12 SLCI Version 6.2 or later

20 DIAGNOSIS for Version 6.2

30 QUICKCHECK for SLMA / SLMD

40 MDF test for Version 5.1

Test code no. Test object

Tab. 3.11.5 Test codes and test routines

A30808-X3063-A403-2-7630 PROC:TESMOD2E – 9

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– Analysis of acknowledgments issued by the GCG

• BD test

– Disconnection of an SLMA group of four

– DCC and RGB flag tests are already implemented in the diagnosis

• DIU:DLU test

– TSX status bit

– All PCM channels

– PCM link up to the LTGB interface

– Signaling path to the LTGB

• TU test

– PCM link up to the COSLAC/SICOFI

– meter pulse

– Ringing current indicator

– Leak current, short-to-ground and voltage failure indicator

– LN-, LR, C-, D-, EN-, EH- and UN-indicators

– Reference values on LCMM for resistance, voltage and capacitance

• SLMA test

– Signaling path DLUP <---> SLMCP

– Interface between SLMCP and COSLAC/SICOFI

– Line-dependent COSLAC data (if COSLAC is used)

– Loopback setting of COSLAC/SICOFI in analog area

– B seizure:Testing feeding voltagePort seizure as B subscriberRinging trough connectionRing trippingTesting feeding voltage (low impedance)Testing feeding voltage (high impedance)clear back

– A subscriber:Port seizure as A subscriberDigit inputTesting speech path (frequency and level)Testing meter pulseReversal(Loop open)clear forwardoverload testTesting the test relays

• EMSP testThe EMSP test checks the line-dependent COSLAC data.

PROC:TESMOD2E – 10 A30808-X3063-A403-2-7630


3.11.6 Tables relevant for the procedure

3.11.6.1 Basic switch settings

3.11.6.2 Mounting locations for SLMD short circuit connectors

Switch Switch position

EPROM DLUC/TESMOD TESMOD

STEUERUNG SME/TESMOD TESMOD

A OFF/ON OFF

LIMITER OFF/ON ON

PRINTER OFF/ON ON OFF (only if there is no printer)

RUN IN OFF/ON OFF

TEST SINGLE/CONT SINGLE

STOP OFF/ON OFF

Tab. 3.11.6 Basic switch settings on control panel

Switch Switch position

TEST PORT/ALL PORT

RAM TESMOD/DLUC TESMOD

Tab. 3.11.7 Basic switch settings on the input and displaypanel

Frame left halfshelf right halfshelf

F:DLU(D) C2 15/27/39/51 C2 68/80/92/104

F:DLU(E) A2 15/27/39/51 A2 68/80/92/104

C2 15/27/39/51 C2 68/80/92/104

F:DLU(F) A2 15/27/39/51 A2 80/92/104

Tab. 3.11.8 Mounting locations for module typesQ965, Q1101, Q838

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3.11.6.3 Mounting locations for SLMX short circuit connectors

3.11.6.4 ID-Bytes for Configuration Data


F:DLU(D)

C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110

F:DLU(E) A2 15/21/27/33/39/45/51/57 A2 68/74/80/86/92/98/104/110

C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110

F:DLU(F) A2 15/21/27/33/39/45/51/57 A2 74/80/86/92/98/104/110

Tab. 3.11.9 Mounting locations for module typesQ1103, Q1192


F:DLU(D)

C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110

F:DLU(E) A2 15/21/27/33/39/45/51/57 A2 68/74/80/86/92/98/104/110

C2 15/21/27/33/39/45/51/57 C2 68/74/80/86/92/98/104/110

F:DLU(F) A2 15/21/27/33/39/45/51/57 A2 74/80/86/92/98/104/110

Tab. 3.11.10 Mounting locations for module type Q1338

Shelf ID-Bytes for DCCs in lefthalfshelf

ID-Bytes for DCCs in righthalfshelf

0 00 / 01 02 / 03

1 04 / 05 06 / 07

2 08 / 09 0A / 0B

3 0C / 0D 0E / 0F

Tab. 3.11.11 DCC ID-Bytes

PROC:TESMOD2E – 12 A30808-X3063-A403-2-7630


Flag byte Module

0 not present

1 DCC

2 RGB

Tab. 3.11.12 Flag-Bytes

ID-Byte Module

00 not present

01 SLMA:COS

02 SLMA:CM16

03

04 SLMA:CCBR

05 SLMA:CRMP

06 SLMD:C

07 LMEM

08 LVMM

09 FTEM

0A ALEX

0B EMSP Q828 or Q1094-X1/X2

0C GCG

0D DLUC

0E DIU:DLU

0F SLMA:C12R

10 SLMA:CMC

11 SLMA:SAB

12 SLMA:TPL / SLMA:TAB

13 SLMA:DID

14 SLMA:CAB

15 SLMA:CMRL

18 SLMA:GAB

19 SLMA:GLAB

1A MTAM

1B LTBAM-TBA EBP 1F

1C LTBAM-LTA EBP 1E

1D

1E SLMA:DIOD

1F

20 SLMA:FPB

Tab. 3.11.13 Module ID-Bytes

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21 SLMA:CSR

22 SLMD:A

23 SLMA:BEL

24 SLMA:12R

25 SLMD:B

27 SLMA:FPC

28 FMTU

29 LCMM

2A

2B

2C EMSP Q1094-X4

2D SASC

2F SLCIM

30

31

32 SLMA:FPS

33 IWEA

34

35 IWEB

36 SLMA CSP (Brasil)

37 ALMA (Brasil)

38 OLMA (Brasil)

39 OLMAC (Brasil)

3A SLMA FPD

3C SLMA:FPC8 (Austria)

41 SLMX

49 DIUDRA (SDE)

4A DIUDRB (SDE)

4B SUR

50 SLMA:FPE

51 SLMA:FPF

52 MGB

ID-Byte Module

Tab. 3.11.13 Module ID-Bytes

PROC:TESMOD2E – 14 A30808-X3063-A403-2-7630


1 Switch settings on the TESMOD2E

Put all switches on the control panel to the basic position according to: ......(see Tab.3.11.6)

Put switches on the input and display panel to the basic position according to: ......(see Tab.3.11.7)

2 Connect the TESMOD2E

Switch off current converter DCCxx in the left halfshelf of shelf 0 and switch offRGB0 (if present)

The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 go out

Pull control module DLUC0 in the left halfshelf of shelf 0

Plug TESMOD2E into the mounting location of DLUC0

Plug module DLUC0 onto the TESMOD2E module

Connect control and display panel to TESMOD2E

Switch on printer and connect to control and display panel

3 Plug in ADL

Plug ADL test module onto the rear of mounting location A2/B2 051 and C2/D2074

Set switches on the ADL test module to the following positions:

• S1 = ON

• S2 = OFF

• S3 = OFF

• S4:

– S4 = OFF : No CRC4 mode (switch S5 on M:DIUDC at OFF) for WM

– S4 = ON : CRC4 mode (if S5 on M:DIUDC is ON) for DBP

As of Version 6.2, only the ADL is used as a DIU termination

4 Prepare SLMD-Test

Connect the network terminator (NT) for ISDN subscribers on the back of theSLMD modules.

A30808-X3063-A403-2-7630 PROC:TESMOD2E – 15

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For module frames with code number S30804-B2709-X- * (F:DLU(D)) to thefollowing points:

• A-wire of NT to pin B2 039 37

• B-wire of NT to pin B2 039 38

The SLMD short-circuit connector S30189-H4906-A110 can be used for SLMDmodule types Q965, Q1101 and Q838. One SLMD short-circuit connector isrequired per SLMD. The SLMD short circuit connector is like the SLMD moduleplugged into a mounting location with integer value.

The following mounting locations for SLMD short-circuit connectors arepossible:

...... (see Tab.3.11.8)

The SLMD short-circuit connector S30189-H4906-A110 must be used for SLMDmodule types Q1103 and Q1192. One SLMD short-circuit connector is requiredper SLMD.

The following mounting locations for SLMD short-circuit connectors arepossible:

...... (see Tab.3.11.9)

5 Prepare SLMX-Test

The SLMX short-circuit connector S30257-Z7103-A20 can be used for SLMXmodule type Q1338. One SLMX short-circuit connector is required per SLMX.The SLMX short circuit connector must be plugged into the rear side of theSLMX mounting location.

The following mounting locations for SLMX short-circuit connectors arepossible:

...... (see Tab.3.11.10)

6 Information about Country settings

If the STOP-Switch is in position OFF before switching on the power, the lastselected country memory bank is active.If another country is to be activated, the STOP Switch has to be set to positionON before power is switched on. Then the program runs in an endless loop afterswitching on the power and the user can select the relevant country memorybank. After selecting the correct country memory bank the STOP Switch is to beset to position OFF again and the automatic initializing starts.

7 Decision: select memory bank with country specific loading data

Is already the correct memory bank with the country specific loading dataselected? Y h...9

N h...8

PROC:TESMOD2E – 16 A30808-X3063-A403-2-7630


8 Select memory bank with country specific loading data

Set STOP-Switch to position ON

Switch on current converter DCCxx in the left halfshelf and RGB0 (if present)

The program runs in an endless loop.

Select the correct memory bank with the HEX-keys or by pressing the I-key(increment) or L-key (decrement)

Set STOP-Switch to position OFF h...10

9 Switch on DCCxx


The LEDs on the faceplates of modules DCCxx and RGB in the left halfshelf ofshelf 0 light up.

10 Initializing TESMOD2E

TESMOD2E is automatically initialized. A RAM test and a DLC/DMA test arethen carried out on the DLUC. If no faults are found during the test, the DLUC issubsequently initialized.At the end of the TESMOD initialization the display shows:' BASIC - TEST ' ' **NO FAULTS DETECTED** ' ' END OF TEST 'and the configuration data can be entered.

Does the display panel show '**NO FAULT DETECTED**'? Y h...12N h...11

11 Replace defective TESMOD2E

The TESMOD2E is probably defective and must be replaced

Switch off current converter DCCxx and RGB0 (if present) in the left halfshelf ofshelf 0

Remove input and display panel from TESMOD2E

Remove DLUC0 module from TESMOD2E

Replace TESMOD2E in DLUC0 mounting location

Plug DLUC0 onto TESMOD2E

Connect input and display panel to TESMOD2E

– After replacing defective TESMOD2E continue h...9

12 Decision: automatic input of configuration data

The rack capacity stage has to be input before starting the DLU test. For thisreason it is necessary to generate the configuration data. Every module which ispresent in the DLU is entered in the configuration data.

Caution: Only the modules entered in the configuration data will be tested

A30808-X3063-A403-2-7630 PROC:TESMOD2E – 17

CommissioningSystem

ITMN - OFFLINE

Depending on the switch A OFF/ON the configuration data are input automati-cally or manually:

• A=OFF : Configuration data are input automatically

• A=ON : Configuration data have to be input manually

Is the configuration data input automatically? Y h...13N h...15

13 Automatic input of configuration data

A printer should be connected for automatic input of configuration data so that aprintout of the data can be made. Whenever automatic configuration data isexecuted, the display "GET EQUIPMENT DATA" appears on the control panel oron the printout. Each time an automatic input of configuration data has takenplace, the printout of the data should be compared with the actual rack configu-ration. If a module is installed at a mounting location, the printout of the configu-ration data must show the hardware ID of the module in question. If it shows 00,however, instead of the right hardware ID, the module in question is defective.The BD modules do not appear in the configuration data printout.The RGB, MGB and DCC modules are recognized automatically.

The DCCs are assigned to the following HEX-numbers: ...... (see Tab.3.11.11)

In the case of automatic configuration data input, only the DIUD in the shelf inwhich the TESMOD2E is plugged in is entered in the configuration data; theDIUD in the other DLUC system is not entered, however.

DLUB READY is printed out after successful input of the configuration data

DLUB READY

Compare the configuration data printout with the rack layout

Are all the modules contained in the configuration data? Y h...16N h...14

14 Replace modules

Switch off DCC

Modules marked 00 must be replaced

Switch on DCC

– After replacing modules continue h...13

PROC:TESMOD2E – 18 A30808-X3063-A403-2-7630


15 Manual input of configuration data

The TESMOD2E needs the configuration data for the DLU load routine. Theconfiguration data contain the module data and the capacity stage.

Press the B key on the input panel

"DLU DATA" appears on the alphanumeric display

Press the E key on the input panel

The alphanumeric display shows the number of the first DCC and the corre-sponding flag byte.

The flag byte must be entered on the keypad according to: ......(see Tab.3.11.12)

The TESMOD2E begins with the left-hand DCC in shelf 0. After entering thecode number, press the I key and the TESMOD2E is ready for entry of the nextcode number. The DCCxx are numbered from 00 through 0F. Simply enter thatthe DCCxx is present or not. The bus distributors are automatically enteredwhen the DCCxx are entered. If both DCCxx in a shelf are entered as notpresent, the entire shelf is taken as not present. Positions 10 and 11 arereserved for the RGB.

Caution!When the TEST PORT/ALL switch is changed to the ALL position, the I key nolonger has the increment function, but the decrement function. This means thatif an input error is made, the entire configuration data do not have to be reen-tered.

Enter the configuration data for all DCCxx and RGB according to the followingtable:

......(see Tab.3.11.12)

Press the E key when all 18 flag bytes have been entered.

The bytes are stored in the EPROM EMULATOR.

The TESMOD2E is now ready for entry of the remaining module types.

Enter the configuration data for the remaining modules according to: ......(see Tab.3.11.13)

Press the E key when all flag bytes have been entered.

All flag bytes are stored in the EPROM EMULATOR.

When the configuration data have been entered, the DLU is loaded with system,device, module and port data. The operation and maintenance program of theDLU is then started up until all the modules present have been created and acti-vated.

When the load routine has terminated, TESMOD2E is ready for tests to beexecuted and indicates this on the display with DLUB READY.

A30808-X3063-A403-2-7630 PROC:TESMOD2E – 19

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16 Test entire DLU with TESMOD2E

Press the T key

The display shows a 0

The code number 0 executes all the possible tests on the DLU in sequence. ...... (see 3.11.5)

Start the tests by pressing E

When these tests have terminated, the green LED on the control panel goes outand the number of errors is shown on the display panel.

17 Evaluate message

Branch to the following blocks according to the message which is displayed

– The message NO ERRORS DETECTED is displayed h...28– The message XX ERRORS DETECTED is displayed (XX indicates the

number of errors that have occurred) h...18

18 L key

If a module needs to be replaced, it must be marked as faulty once it has beenremoved.

Press the L key

The display outputs the first error that occurred, stating the fault location(module identification).

19 Identify the errors that have occurred (1)

Does the error displayed relate to an SLMAC module? Y h...20N h...23


Is LOOP TEST ERROR displayed? Y h...21N h...23


– If LOOP TEST ERROR is output for one port only h...23– If LOOP TEST ERROR is output for the entire SLMAC h...22

22 Pull SLMAC module

Pull the identified SLMAC module and then reinsert it h...26

23 Decision: fault clearance

Is it probable that the displayed error can be cleared? Y h...24N h...25

PROC:TESMOD2E – 20 A30808-X3063-A403-2-7630


24 Clear error

Clear displayed error h...26

25 Replace module

Replace the module indicated in the display h...26

26 Display next error

Display the next error by pressing I

Is another error displayed? Y h...19N h...27

27 RESET

Press RESET key h...16

28 DLU system 1 already tested?

Has DLU system 1 already been tested? Y h...30N h...29

A30808-X3063-A403-2-7630 PROC:TESMOD2E – 21

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ITMN - OFFLINE

29 Test DLU system 1

Switch off current converter DCCxx in the left halfshelf of shelf 0 and switch offRGB0 (if present)

The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 go out

Pull control module DLUC0 in the left halfshelf of shelf 0

Unplug TESMOD2E

Plug in DLUC0 again


The LEDs on the module faceplates of DCCxx and RGB in the left halfshelf ofshelf 0 are lit

Switch off current converter DCCxx in the right halfshelf of shelf 0 and switch offRGB1 (if present)

The LEDs on the module faceplates of DCCxx and RGB in the right halfshelf ofshelf 0 go out

Pull control module DLUC1 in the right halfshelf of shelf 0

Plug TESMOD2E into the DLUC1 mounting location

Plug the DLUC1 onto the TESMOD2E

Switch on printer and connect to the control and display panel

Switch on current converter DCCxx in the right halfshelf of shelf 0 and RGB1 (ifpresent)

The LEDs on the module faceplates of the DCCxx and RGB in the right halfshelfof shelf 1 light up.

TESMOD2E is automatically initialized when power is switched on. A RAM testand a DLC/DMA test are then carried out on the DLUC. If no faults are foundduring the tests, the DLUC is subsequently initialized. The configuration data donot have to be reentered for DLU system 1 as they are still stored in the EPROMemulator. After initialization the DLU is loaded with system, device, module andport data. Subsequently, the operation and maintenance software of the DLU isstarted until all the modules present have been created and activated.When the load routine has terminated, the TESMOD2E is ready for tests to beexecuted and indicates this by displaying DLUB READY.

h...12

30 End of DLU-Test with TESMOD2E

End of DLU-Test with TESMOD2E

Return to calling procedure

END

PROC:TESMOD2E – 22 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:DLUD – 1

CommissioningSystem

ITMN - OFFLINE

3.12 Off-line Installation of Digital Line Unit(Frames G / E / F)

DLUD

3.12.1 Documents


– Maintenance Manual MMN:DLUD

– AKUHW Lists

PROC:DLUD – 2 A30808-X3063-A403-2-7630



3.12.2.1 Fuse Assignment R:DLUD (G-E-G-E)

Fig. 3.12.1 Fuse Assignment R:DLUD (G-E-G-E)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

Shelf 0

Sicherungsschiene

MUT02

MUT03

MUT01

01

RGB

MGB

04

03

A001-057 02A066-125

05

06

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

Shelf 2

12

11

10

13

14

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)

21

20

19

22

23

07

18

A001,A015-033

08 A008,A039-057

09A116,A068-086

A123,A092-110

27

30

31

24 26

CD

FU

BD2

BD3

Shelf 0 MUT05

MUT06

A001-057 A066-125

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

Shelf 2

29

28 C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)A001,A015-033

25 A008,A039-057

A116,A068-086

A123,A092-110

BD2

BD3

* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auchdie zugehörigen Sicherungen.

MGB

RGB

RGB

RGB

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

A30808-X3063-A403-2-7630 PROC:DLUD – 3

CommissioningSystem

ITMN - OFFLINE

3.12.2.2 Fuse Assignment R:DLUD (G-E-G-G)

Fig. 3.12.2 Fuse Assignment R:DLUD (G-E-G-G)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

MUT01

01

04

03

02

05

06

12

11

10

13

14

Shelf 0MUT05

21

20

A001-057 19A066-125

22

23

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

07

18

08

09

CD

Shelf 2MUT06

29

28

A001-057 26A066-125

30

31

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(G)

24

FU

Sicherungsschiene

Shelf 0 MUT02

MUT03

A001-057 A066-125

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

Shelf 2

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)A001,A015-033

A008,A039-057

A116,A068-086

A123,A092-110

BD2

BD3

* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auch die

MGB

MGB

MGB

RGB

RGB

RGB

RGB

RGB

RGB

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

PROC:DLUD – 4 A30808-X3063-A403-2-7630


3.12.2.3 Fuse Assignment R:DLUD (G-E-G-F)

Fig. 3.12.3 Fuse Assignment R:DLUD (G-E-G-F)

FU

09 1907 170501 11 1503 13 FUFU

10 2008 180602 12 1604 14 FUFU

292721 2523 31 33

30282622 3224

Sicherungsschiene MUT01

01

04

03

02

05

06

12

11

10

13

14

Shelf 0MUT05

21

20

A001-057 19A066-125

22

23

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

07

18

08

09

Shelf 2

27

A116,A074-92

A123,A098-110

A001,A015-033

25 A008,A039-057

24 26

CD

FU

F:DLU(F)

Shelf 0 MUT02

MUT03

A001-057 A066-125

C001,C015-033,057*

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 1

F:DLU(G)

Shelf 2

C001,C015-033

C008,C039-057

C116,C068-086

C123,C092-110

Shelf 3

F:DLU(E)A001,A015-033

A008,A039-057

A116,A068-086

A123,A092-110

BD2

BD3

BD2

BD3

* 057 nur wenn MGB gesteckt ist.Hinweis: Wird nur ein DCC pro Halbshelf verwendet, entfallen die DCC Pos shf-1 und shf-3 und somit auch die

MGB

MGB

RGB

RGB

RGB

RGB

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

DCC

A30808-X3063-A403-2-7630 PROC:DLUD – 5

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ITMN - OFFLINE

3.12.3 Equipment of the different Frames

Detailed information about the equipment of the different frames are listed in the equip-ment list and the mounting location list of the MMN:DLUD, APP.

3.12.4 Shelter DLU 400/700

The shelter can contain the following equipment:

• Remote Shelter DLU 400 (Fig. 3.12.4)Basic frame D for DLUB (F:DLU(D)) with a max. of 384 subscribers or basic frameG for DLUD (F:DLU(G)) with a max. of 448 subscribers

• Remote Shelter DLU 700 (Fig. 3.12.5)Basic frame F:DLU(D)) or F:DLU(G)) and also extension frame F for DLUB(F:DLU(F)) with a max. of 240 subscribers

• Transmission equipment for the shelter (optional)The following transmission equipment is provided in the shelter for connection to thenetwork node or for the connection of additional shelters (ring or star configuration):

– Transmission technology in the synchronous digital hierarchy (SDH)SDH: synchronous multiplexers (SMA1/4) or, alternatively,synchronous dual terminal multiplexers (STM1D)

– Transmission technology in the plesiochronous digital hierarchy (PDH)PDH technology in the shelter:Optical/HDSL terminal multiplexer for 2 Mbit/s (OMX2/HMX)Optical terminal multiplexer for 34 Mbit/s (OMX16)

(PDH technology can also be integrated in the DLU hardware)

PROC:DLUD – 6 A30808-X3063-A403-2-7630


• MDF/ DDF distribution frame

• Air conditioning (fan and heater)

• Power supply unit, including standby battery

• Cable TV

• Modem for OFDC (optional)

3.12.4.1 Overview Shelter 400/700


MDF200 DA internal

MDF200 DA internal

MDF200 DA external

MDF200 DA external

MDF200 DA external



1600

mm

1800 mm500 mm


Fan


(F:DLU(G))

Connector panel

Fan


Connector panel

AC/DC converter (48 V/30 A)

Cable TV

SIEMENS

Heater 1600 W

DDF24 PCM30

DDF24 PCM30

DC distribution

AC distribution

Battery

(Connection foremergency power supply)

OFDC modem

A30808-X3063-A403-2-7630 PROC:DLUD – 7

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ITMN - OFFLINE


3.12.4.2 Fuse Assignment PPD (Primary power distribution)


F1 25 A AC Power supply(Fehlerstromschutzschalter)

F2 16 A Rectifier 1

F3 16 A Rectifier 2 (optional)

F4 10 A Heater

F5 10 A Cabel TV (optional)



Heater 1600 W

AC/DCconverter(48 V/30 A)

MDF200 DA external


(F:DLU(G))

Extension frame F(F:DLU(F))


1800

mm

1800 mm500 mm


Fan

Connecting panel

Fan


Connecting panel

DC distribution

AC distribution

Cable TV

SIEMENS

MDF200 DA external

MDF200 DA external

MDF200 DA internal

MDF200 DA internal

MDF200 DA internal

MDF200 DA external

DDF24 PCM30

DDF24 PCM30

DDF24 PCM30

104 DAinternal

(Connection for emer-gency power supply)

Battery

OFDC modem

MDF200 DA external

PROC:DLUD – 8 A30808-X3063-A403-2-7630


3.12.4.3 Fuse Assignment SPD (Secondary power distribution)

Caution:The fuse cover must not be removed by the maintenance. personnel. If maintenancework on the fuses is necessary, this can only be carried out by trained specialists. Beforethe fuse cover is removed the 220 V AC line voltage must be switched off.

F6 10 A Socket (for OFDC-Modem)

Fuses Unit





F5 10 A Transmission equipment (SDH)orRadio equipment SRA L1/SRA L2

F6 10 A not used

F7 10 A Transmission equipment (PDH)orRadio equipment SRA L1/SRA L2


F9 10 A Fan 2

F10 10 A Fan 1

F11 10 A Monitoring and heater control


F13 50 A Battery

Tab. 3.12.2 Assignment of secondary fuses



A30808-X3063-A403-2-7630 PROC:DLUD – 9

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3.12.5 Remote DLU

3.12.5.1 Connection of a remote DLUD to two LTG

Fig. 3.12.6 Connection of remote DLUD to two LTG

The diagram above shows the connection of the remote DLUD to two LTGs. One DLUDsystem is connected to the LTGx and the other to the LTGy. The dotted lines representthe links without CCS.

PDC0

PDC1

LTUU21

LTUU21

PDC0

PDC0

PDC0

PDC1

PDC1

PDC1

DLU

DLU

LTUU20

LTUU20

LTUU21

LTUU21

LTUU20

LTUU20

LTGx

LTGy

SILC

SILC

DLUS0

DLUS1

DLUS0

DLUS1

Plug position

B2 057

B2 066

B2 057

B2 066

PROC:DLUD – 10 A30808-X3063-A403-2-7630


3.12.5.2 Wiring between DLUS and LTU

Fig. 3.12.7 Wiring between DLUS and LTU (DIU120A)

(*): The pin numbers refer to the first of four PDC connectors of the DIU120A. An over-view of all pin numbers is shown in the following table:

PDC(0) PDC(1) PDC(2) PDC(3)

Sym Koax Sym Koax Sym Koax Sym Koax

E132 E132 E142 E142 E152 E152 E212 E212

E134 C134 E144 C144 E154 C154 E214 C214

E136 E136 E146 E146 E156 E156 E216 E216

E138 C136 E148 C146 E158 C156 E218 C216

Tab. 3.12.3 Pin numbers for PCM30 connectors of DIU120A


F2in

F2out53

54

55

56



F2in

F2out


F2out

F2in

F2out

F2in

PDC0

PDC1

LTU/U21

LTU/U20

DLUS

LE LE

DIU120A

Sym. Koax.

53

57

55

58

43

44

45

46

43

47

45

48

E132

E134

E136

E138

Pin No.(*)

Sym. Koax.

E132

C134

E136

C136

E132

E134

E136

E138

E132

C134

E136

C136

Pin No. (Plug Pin)

A30808-X3063-A403-2-7630 PROC:DLUD – 11

CommissioningSystem

ITMN - OFFLINE

Fig. 3.12.8 Numbering method on F:LTGM

row C(mounting area 1)

SU1

SU4

SU5

SU2

SU3

SU1

SU4

SU2

SU3

row D(mounting area 2)

ABCDE

1

9

5

Pin E 2 1 2 2

0 (no pins available)

PDC1

PDC2

Pin E 2 1 4

Pin E 2 1 6

Pin E 2 1 8

Pins for PDC3 (sym.)

101

F:LTGM(A) Rearview

151203255305

PDC0

DIU120A MOLOCS:

PROC:DLUD – 12 A30808-X3063-A403-2-7630


Fig. 3.12.9 Wiring between DLUS and LTU (DIU30D)

3.12.5.3 Connection path from DLUD to LTE

Fig. 3.12.10 Connection path from DLUD to LTE


F2in

F2out53

54

55

56



F2in

F2out


F2out

F2in

F2out

F2in

PDC0

Pin No. (Plug Pin)

PDC1

LTU/U21

LTU/U20

DLUS

LE LE

DIU30D

Sym. Koax.

53

57

55

58

43

44

45

46

43

47

45

48

49

50

51

52

Pin No. (Plug pin)

Sym. Koax.

49

29

51

31

49

50

51

52

49

29

51

31

PDC0

PDC0

PDC1

PDC1

DLU

DLUS0

DLUS1

PCM 30 with CCS

PCM 30 without CCS

F2in

F2out F1in

F1outLTE

F2in

F2out F1in

F1outLTE

PCM 30 with CCS

PCM 30 without CCS

F2in

F2out F1in

F1outLTE

F2in

F2out F1in

F1outLTE

To/from LTGx

To/from LTGx

To/from LTGy

To/from LTGy

A30808-X3063-A403-2-7630 PROC:DLUD – 13

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ITMN - OFFLINE

3.12.5.4 Connection path from LTG to LTE












PCM 30 without CCS

F2out

F2inF1out

F1inLTE

F2in

F2outF1in

F1outLTE

To/from DLU

To/from DLU

LTUU20

SILC

LTGx


PCM 30 without CCS

F2out

F2inF1out

F1inLTE

F2in

F2outF1in

F1outLTE

To/from DLU

To/from DLU

LTUU20

SILC

LTGy

PROC:DLUD – 14 A30808-X3063-A403-2-7630


3 Basic test (rack)




Check and if necessary correct positioning of straps and switch settings on themodules

......MMN:DLUD -TAB MOD:DLU

4 Create basic state


Switch off all DCCxx (RGB, MGB, if present)

Unscrew all fuses in the R:DLUD h...5


If SLM_8 or SLMD modules are used, each halfshelf is supplied by one DCC_8(DCCDD, DCCDC, DCCCR) instead of 2 DCCDF.These DCC_8 are inserted in the mounting locations of DCC x-0 and DCC x-2.DCC x-1 and DCC x-3 are omitted and also the corresponding fuses.

The following steps have to be carried out for each shelf of the DLUD.

6 Information block: Thermal switch

In every DLUD rack, a thermal switch is built into the bottom panel of the rack.The contact is fixed at the allowable room temperature. If this temperature isexceeded, then, via this thermal switch all DCCs in the rack receive groundpotential via the individual control input.In this way the DCCs are switched off.Exception: The DCCs in basic shelf0 are not switched off. In this way messagesare still possible.If the temperature goes down, the DCCs are switched back on.


A30808-X3063-A403-2-7630 PROC:DLUD – 15

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ITMN - OFFLINE

7 Screw in fuses


Screw in the fuse for the first/next DCCxx which is to be switched on

Switch on the corresponding DCCxx


8 Replace DCCxx

Switch off DCCxx



Replace DCCxx by spare module


Switch on DCCxx



If the green LEDs in all DCCs do not light when the DCCs have been switchedon, the thermal contact is probably defective



10 Decision: next DCCxx

Are all DCCs in the shelf switched on? Y h...11N h...7

11 Decision: next shelf

Are all DCCs in each shelf of the rack switched on? Y h...12N h...7

12 Decision: RGB

Is at least one module M:RGB present in the rack? Y h...13N h...18

13 Switch on RGB

Fuse allocation to DCCxx and RGB-modules (if present) in F:DLU(G)

PROC:DLUD – 16 A30808-X3063-A403-2-7630


Switch on the first / next RGB (in F:DLU(G))


14 Replace defective RGB

Switch off defective RGB


Replace defective RGB by spare module(Replacing the RGB module under power is possible)

Switch on RGB





16 Measure ringing voltage

The ringing voltage can be measured with a multimeter between the test jackson the front panel of the RGB module. ......MMN:DLUD -

TAB:MOD

Measure the ringing voltage between the test jacks.

Is the ringing voltage correct? Y h...17N h...14

17 Decision: next RGB

Have all RGB modules in the rack already been switched on? Y h...18N h...13

MUT FUSE DCCxx RGB Remark

02 01 0-0 0

02 0-2 1

03 07 2-0 0 Only in Version G,G,G,G

09 2-2 1

05 18 0-0 0

19 0-2 1

06 24 2-0 0 Only in Version G,E,G,G orG,G,G,G

26 2-2 1

A30808-X3063-A403-2-7630 PROC:DLUD – 17

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ITMN - OFFLINE

18 Decision: MGB

Is at least one module M:MGB present in the rack? Y h...19N h...23

19 Switch on MGB

The MGB modules in F:DLU(D) are (if present) redundantly supplied via thefuses of DCCxx 1-0 and 1-1

Fuse allocation to DCCxx and MGB-modules (if present) in F:DLU(D)

Switch on MGB in the first / next F:DLU(G)


20 Replace defective MGB

Switch off defective MGB


Replace defective MGB by spare module(Replacing the MGB module under power is possible)

Switch on MGB





22 Decision: next MGB

Have all MGB modules in the rack already been switched on? Y h...23N h...19

MUT FUSE DCCxx Remark


04 1-1

03 11 3-0 Parallel for one MGB module(Only possible in Version G,G,G,G)

12 3-1


21 1-1

06 28 3-0 Parallel for one MGB module(Only possible in Version G,E,G,G

or G,G,G,G)29 3-1

PROC:DLUD – 18 A30808-X3063-A403-2-7630



The connection of the DLUD to LTG is shown in:(LTGs used are LTGB, LTGF, LTGG, LTGM) ......(see Fig. 3.12.

6)

According to the LTG the DIU30D or DIU120A is used as LTU. The wiringbetween DIU:DLU and the corresponding LTU is shown in the following figures:

Wiring to DIU120A ......(see Fig. 3.12.7)

Wiring to DIU30D ......(see Fig. 3.12.9)

24 Information about connection path from DLUD to LTE

Because the DLUD and the start of the PCM link may be located apart, specialprecautions must be taken to ensure that the cabling between DLUS and LTE(line terminating equipment / loading equipment) is correct. If it is, the corre-sponding PCM link simply needs to be connected to the LTE. If then no connec-tion can be established between DLUD and LTGB, the PCM link is interrupted.

The connection of DLUD to LTE is shown in ......(see Fig. 3.12.10)

25 Establish connection DLUS to LTE

The connection first has to be established for DLUS0 and than for DLUS1


Link up the outgoing cable with CCS (PDC0) from the DLUS0 (DLUS1) to theLTE which is to be connected with the LTE of LTGx (LTGy).



Did the red LED for PDC0 alarm on DLUS0 (DLUS1) go out? Y h...28N h...27

27 Fault clearance


If no faults can be found here, replace the DLUS0 (DLUS1) module.



A30808-X3063-A403-2-7630 PROC:DLUD – 19

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Link up the outgoing cable without CCS (PDC1) from the DLUS0 (DLUS1) to theLTE which is to be connected with the LTE of LTGx (LTGy).



Did the red LED for PDC0 alarm on DLUS0 (DLUS1) go out? Y h...31N h...30

30 Fault clearance


If no faults can be found here, replace the DLUS0 (DLUS1) module.



32 Decision: next DLUD system

Note that DLUD system 1 is connected to another LTG as shown in ...... (see Fig. 3.12.6)

Has DLUD system1 already been checked? Y h...33N h...26

33 Establish connection LTG to LTE

The connection first has to be established for LTGx (to DLUD system 0) andthan for LTGy (to DLUD system 1).

The connection of LTG to LTE is shown in ...... (see Fig. 3.12.11)

34 Create test loop for cable with CCS

Link the outgoing cable with CCS from the LTU:U21 of LTGx (LTGy) to the LTEwhich is to be connected to the LTE of DLUD system 0 (DLUD system 1), if notalready done.




35 Fault clearance



PROC:DLUD – 20 A30808-X3063-A403-2-7630




37 Create test loop for cable without CCS

Link the outgoing cable without CCS from the LTU:U20 of LTGx (LTGy) to theLTE which is to be connected to the LTE of DLUD system 0 (DLUD system 1), ifnot already done.

Red LED F2 goes out



38 Fault clearance





40 Decision: test connection to DLUD system 1

Has the connection of LTGy to DLUD system 1 already been checked? Y h...ENDN h...34

END

A30808-X3063-A403-2-7630 PROC:CP113D – 1

CommissioningSystem

ITMN - OFFLINE

3.13 Off-line Installation of CP113D

CP113D

3.13.1 Documents


– AKUHW Lists (Equipment Lists)

– Maintenance Manual MMN:CP113D

– Maintenance Manual MMN:PC - BASIS, Ordering no.: A30808-X3069-Y260- * -7620

– MMN:SW

– NM:CP113D

– NM:CP Devices

– Manuals required:MTDMDDPC

PROC:CP113D – 2 A30808-X3063-A403-2-7630


3.13.2 Abbreviations

3.13.3 Test Equipment and Resources

– APS (contained on both disks)

– Multimeter (DMM)

– Scratch tapes with write ring

3.13.4 General Information about Testing CP113D

The coordination processor CP113D undergoes a system test before leaving the manu-facturing plant. The individual racks are tested to check that the voltage converters, thelogic components and the internal cabling function correctly.

a) The cables of the CP rack row are supplied as a supplementary package to the coor-dination processor and are given a system test in the rack (except when cables aresupplied later).

Abb. Meaning

B:CMY bus to common memory

B:IOC bus system for input/output control

BAP base processor

CAP call processor

CI common interface

CMY common memory

F: frame

IOC input/output control

IOP input/output processor

LMY local memory

MDD magnetic disk device

MI memory interface

MOLOC mounting location

MTD magnetic tape device

MUT mounting unit

MYB memory bank

MYC memory control

PI processor interface

PU processor unit

R: rack

A30808-X3063-A403-2-7630 PROC:CP113D – 3

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b) Once accepted by the test department, all modules are protected from unauthorizedaccess (by means of a loop secured round each individual module frame).

c) The magnetic tape device, the disk drives and the personal computers are system-tested and separately packed for delivery. The disk storage units had the test-APScopied onto them in the test department.

d) The coordination processor is checked in the system test department with a testAPS. This APS is located on both magnetic disks.

e) The CP113D installation test can begin once installation is completed. The APS onthe disks is used for system testing.

f) The CP113D is tested in the following steps:

Off-line test:

– Visual check of devices and cabling

– Preset all devices (if not already done at the factory)

– Start up the PC on-line following manufacturer's instructions (if not already doneat the factory)

– Start the fans

– Switch on power to all equipment

– Off-line diagnostics of CMY, IOC, IOP, (BAP/CAP only if faulty)

On-line test:

– Start up hardware

– Load application program system (test APS) and start operating system (APSpresent on both system disks)

– Configure the necessary operating states in the CP area

– Check the logic components and devices:common memory (CMY),base processor (BAP),input/output control (IOC)input/output processor (IOP)bus to common memory (B:CMY)magnetic tape device (MTD) andmagnetic disk device (MDD)using the appropriate test and diagnostic software

– Introduce hardware modifications if necessary

– Incorporate the current operating APS and repeat the on-line tests

g) Error messages output by the test programs are handled on the basis of the MMN.

h) Implementation of modifications according to instructions (notices are sent by themodification service). The modification guidelines must be observed. If the installa-tion tester does not carry out the modifications himself, he should at least know

PROC:CP113D – 4 A30808-X3063-A403-2-7630


which ones are made.Any faults that occur when the modifications have been incor-porated must be eliminated with the operating APS and the MMN.

i) After each hardware modification to a device, the modification service must beinformed of the new device issue.

j) A fault report must be written on each hardware fault (for repairs and statistics).

k) Always disconnect power before unplugging modules and plugging them in again.

l) If modules with DIP switches are replaced by spares, find the correct new settingsin the MMN:CP113D - TAB.

A30808-X3063-A403-2-7630 PROC:CP113D – 5

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3.13.5 Overview of the Hardware belonging to the CP Complex

Fig. 3.13.1 Overview: Hardware belonging to the CP-Complex

CAP-5

PU0

PU1

CI

PI

LMY

PI

PU0

PU1

CI

PI

LMY

PI

PU0

PU1

CI

PI

LMY

PI

PU0

PU1

CI

PI

LMY

PI

MI

MI

PU0

PU1

CI

PI

LMY

PI

B:IOC

IOP

IOP

PU0

PU1

CI

PI

LMY

PI

B:IOC

IOP

IOP

MYB0

MYB MYB MYB1 2 3

MYC

MYB0

MYB MYB MYB1 2 3

MYC

MI

MI

CAP-0 BAP-0 BAP-1 IOC-0

IOC-1

IOC-2

IOC-3

MINIMUM Configuration

MAXIMUM Configuration

CMY-0 CMY-1

B:CMY-0

B:CMY-1

PROC:CP113D – 6 A30808-X3063-A403-2-7630


3.13.6 Overview of Interfaces B:CMY

Fig. 3.13.2 Overview of Interfaces B:CMY

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

CPCIACPCIB

BAP-0 IOC-0 BAP-1 IOC-1 IOC-2 IOC-3 CAP-0 CAP-5

PIDATPIADR

PIDATPIADR

PIDATPIADR

PIDATPIADR

PIDATPIADR

PIDATPIADR

PIDATPIADR

PIDATPIADR

MIAD MIAD MIAD MIAD

CMYA CMYA CMYA CMYA

Control C(MYC)

Control D

Control C(MYC)

Control D

CMYD CMYD CMYD CMYD

Interface modules to the CMY

B:CMY-0 B:CMY-1

CMY-0 CMY-1

CMY

B:CMY

Only for CP113D with R:CP113B.Connection with PIDAT and PIADR as for other Processors.

Interface modules to B:CMY

Interface modules to the processors

.....

A30808-X3063-A403-2-7630 PROC:CP113D – 7

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3.13.7 Module Connectors and Numbering

Fig. 3.13.3 Module Connectors and numbering

112

113

114

116

118

120

115

117

119

1

2

3

4

5

6

7

8

129

240

1

2

3

4

5

6

7

248

AB

CD

E Backplane labelling

Rear view and numbering of a module connector in CP113D

PROC:CP113D – 8 A30808-X3063-A403-2-7630


3.13.8 Coding Switch on Module MUH:1088

Fig. 3.13.4 Coding switch on module MUH:1088

VariantS30810-Q1088-

Capacity stage inMBYTE

Switch Settings

S1 S2 S3 S4

X200 8 ON OFF OFF ON

X400 16 ON ON OFF ON

X500 16 OFF OFF ON OFF

X600 32 ON OFF ON OFF

X800 64 ON ON ON OFF

Coding switch settings

Tab. 3.13.1 Coding switch settings

1 2 3 4

ON

MUH:1088

Coding switch

A30808-X3063-A403-2-7630 PROC:CP113D – 9

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3.13.9 Rack Overview

3.13.9.1 Rack for CP113A - Variant A

Fig. 3.13.5 Rack R:CP113A - Variant A

MUT09

MUT10

MUT05

Fuse panel, AD:RAL

MUT03

MUT04

MUT12

MUT01

CMY 0

Fans

F:CMY 0

F:CMY 1

F:P/IOC 1

CMY 1

Fanbox

BAP 1 IOC 1

FU 01 03 05 07 09 11 13 15 17 19

02 04 06 08 10 12 14 16 18 20FU

FU Frame Unit

19 --- AD:RAL,HW-Tracer

20 --- AD:RAL,HW-Tracer

02 F:CMY 0 CMY 0

12 F:CMY 1 CMY 1

07 -- Fans(AIC 1)

04 F:MI 0 BCMY 0

14 F:MI 1 BCMY 1

05 F:P/IOC 0 BAP 0

06 F:P/IOC 0 IOC 0

15 F:P/IOC 1 BAP 1

16 F:P/IOC 1 IOC 1

17 -- Fanbox(AIC 0)

F:P/IOC 0 BAP 0 IOC 0

MUT06

MUT07F:MI 1 BCMY 1

F:MI 0 BCMY 0

PROC:CP113D – 10 A30808-X3063-A403-2-7630


3.13.9.2 Rack for CP113B - Variant A

Fig. 3.13.6 Rack R:CP113B - Variant A

MUT09

MUT10

MUT05

MUT03

MUT04

MUT12

MUT01

Fans

F:P/IOC 2

F:P/IOC 3

F:P/IOC 5

Fanbox

CAP 4 CAP 5

FU 01 03 05 07 09 11 13 15 17 19

02 04 06 08 10 12 14 16 18 20FU

FU Frame Unit

01 F:P/IOC 2 CAP 0

02 F:P/IOC 2 IOC 2

11 F:P/IOC 3 CAP 1

12 F:P/IOC 3 IOC 3

07 --- Fans (AIC 17)

03 F:PI 0 BCMY 0

13 F:PI 1 BCMY 1

05 F:P/IOC 4 CAP 2

06 F:P/IOC 4 CAP 3

15 F:P/IOC 5 CAP 4

16 F:P/IOC 5 CAP 5

17 -- Fanbox(AIC 16)

F:P/IOC 4 CAP 2 CAP 3

MUT06

MUT07F:PI 1 BCMY 1

F:PI 0 BCMY 0

CAP 1 IOC 3

CAP 0 IOC 2

A30808-X3063-A403-2-7630 PROC:CP113D – 11

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3.13.9.3 Rack for DEVD - Variant A

Fig. 3.13.7 Rack R:DEVD - Variant A

MUT06

MUT05

Fuse panel, AD:RAL

MUT03

MUT04

MUT08

MUT12

MUT01

Luftableitblech

IOPG 0

Fans

F:IOP 0

F:IOP 1

F:DEV(E)orF:DEV(F)

IOPG 1

Fanbox

MTD 0

MOD0

FU 01 03 05 07 09 11 13 15 17 19

02 04 06 08 10 12 14 16 18 20FU

FU Frame Unit

01 F:IOP 0 IOPG 0

02 F:IOP 0 IOPG 0

05 F:IOP 0 M:LAUB

06 F:IOP 0 M:LAUB

11 F:IOP 1 IOPG 1

12 F:IOP 1 IOPG 1

15 F:IOP 1 M:LAUB

16 F:IOP 1 M:LAUB

14 --- Fans(AIC 9)

03 --- MTD 0

07 F:DEV(E) orF:DEV(F)

MDD 0,MOD 0

17 F:DEV(E) orF:DEV(F)

MDD 1,MOD 1

08 -- Fanbox(AIC 8)

MDD0

MOD1

MDD1

PROC:CP113D – 12 A30808-X3063-A403-2-7630



3.13.10.1 Fuse Assignment of R:CP113A (Variant A)

3.13.10.2 Fuse Assignment of R:CP113B (Variant A)

MUT Frame FU Unit MOLOC Module

01 AD:RAL 19 External devices,e.g. tracer

20 External devices

03 F:CMY 0 02 CMY 0 C101,C327

DCCx,DCCx

04 F:CMY 1 12 CMY 1 C101,C327

DCCx,DCCx

05 FAN 07 Fans

06 F:MI 0 04 BCMY 0 C101,C327

DCCx,DCCx

07 F:MI 1 14 BCMY1 C101,C327

DCCx,DCCx

09 F:P/IOC 0 05 BAP 0 C101 DCCx

06 IOC 0 C327 DCCx

10 F:P/IOC 1 15 BAP 1 C101 DCCx

16 IOC 1 C327 DCCx

12 FANBOX 17

Tab. 3.13.2 Fuse Assignment of R:CP113A (Variant A)

MUT Frame FU Unit MOLOC Module

01 AD:RAL

03 F:P/IOC 2 01 CAP 0 C101 DCCx

02 IOC 2 C327 DCCx


12 IOC 3 C327 DCCx

05 FAN 07 Fans

06 F:PI 0 03 BCMY 0 C101,C327

DCCx,DCCx

07 F:PI 1 13 BCMY 1 C101,C327

DCCx,DCCx


06 CAP 3 C327 DCCx


16 CAP 5 C327 DCCx

12 FANBOX 17 Fans

Tab. 3.13.3 Fuse Assignment of R:CP113B (Variant A)

A30808-X3063-A403-2-7630 PROC:CP113D – 13

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3.13.10.3 Fuse Assignment of R:DEVD (Variant A)

3.13.10.4 Fuse Assignment to Fans

MUT Frame FU Unit MOLOC Module Remark

01 AD:RAL -- --

03 F:IOP 0 01 IOPG 0 C101,C331 DCCMS

02 IOPG 0 C313 DCCMR

05 M:LAUB LAUB:BLAUB:E

06 M:LAUB LAUB:DLAUB:S

04 F:IOP 1 11 IOPG 1 C101,C331 DCCMS

12 IOPG 1 C313 DCCMR

15 M:LAUB LAUB:BLAUB:E

16 M:LAUB LAUB:DLAUB:S

05 FAN 14 Fans

06 MTD 03 MTD 0

08 F:DEF(F) 07 MDD 0 A056 DCCDA F:DEV(E) orF:DEV(F) can beused alternativelyMOD 0 A049 DCCDA

17 MDD 1 A121 DCCDA

MOD 1 A115 DCCDA

08 F:DEV(E) 07 MDD 0 A001 DCCDA

17 MDD 1 A115 DCCDA

12 FANBOX 08 Fan

Tab. 3.13.4 Fuse Assignment of R:DEVD (Variant A)

Rack Fuse Fans in MUT Remark

R:CP113A FU 07 05 --

FU 17 12 FANBOX

FU19 -- External devices, e.g. tracer

FU 20 -- External devices

R:DEVD FU 14 05 --

FU 08 12 FANBOX

R:CP113B(Extension Rack)

FU 07 05 --

FU 17 12 FANBOX

Tab. 3.13.5 Fuse Assignment to Fans

PROC:CP113D – 14 A30808-X3063-A403-2-7630


3.13.11 Overview OEM-Devices / IOPs / frames

3.13.12 Sequence for Switching on the Frames

OEM-Device IOP-type required Frame required

MTD:STC 2922 IOP:MTD

MTD:STC 2925 IOP:UNI

MTD:HP 88781 IOP:UNI

MDD M2263SA(780 MByte)

IOP:MDD F:DEV(E)

MDD HP C2490A(2,1 GByte)

IOP:MDDorIOP:UNI

F:DEV(E)orF:DEV(F)

MDD XP34550S(4,5 GByte)

IOP:UNI F:DEV(F)orF:DEV(E)

MOD Sony SMO-F531(1,3 GB)

IOP:UNI F:DEV(F)

MOD Sony SMO-F541(2,6 GB)

IOP:UNI F:DEV(F)

Tab. 3.13.6 Overview: OEM-Devices / IOPs / frames

Rack Frame MUT FU Unit Remark

R:CP113A F:MI 0 06 04 BCMY 0

F:MI 1 07 14 BCMY 1

F:CMY 0 03 02 CMY 0

F:CMY 1 04 12 CMY 1

F:P/IOC 0 09 05 BAP 0

06 IOC 0

F:P/IOC 1 10 15 BAP 1

16 IOC 1

R:DEVD F:IOP 0 03 01 IOPG 0

02 IOPG 0

05 M:LAUB

06 M:LAUB

F:IOP 1 04 11 IOPG 1

12 IOPG 1

15 M:LAUB

16 M:LAUB

Tab. 3.13.7 Sequence for Switching on the Frames

A30808-X3063-A403-2-7630 PROC:CP113D – 15

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3.13.13 Displays on Module Faceplates

3.13.13.1 Displays after successful Hardware Start-up

R:CP113B F:PI 0 06 03 BCMY 0 Extension rack

F:PI 1 07 13 BCMY1

F:P/IOC 2 03 01 CAP 0

02 IOC 2

F:P/IOC 3 04 11 CAP 1

12 IOC 3

F:P/IOC 4 09 05 CAP 2

06 CAP 3

F:P/IOC 5 10 15 CAP 4

16 CAP 5

Unit Module Display LED Remarks

4 3 2 1

B:CMY-0 BCTI none see procedure

PIDAT * *(05A131) / (05A145) in BAP-SPR the inhibit-bit remains setuntil startup is concluded

PIDAT *

PIDAT none (05A163) for IOC-0


B:CMY-1 BCTI none

PIDAT * *(06A131) / (06A145) in BAP-SPR the inhibit bit remains setuntil startup is concluded

PIDAT *



CMY-0 CMY 2C any none The displays on both CMY2Cs in a CMY must be identical,otherwise error. Switching power off then at the CMYconcerned may remedy the situationCMY-1 CMY 2C any none

BAP-0 CPCL xxxx Sequence on the 7-segment displays is shown in the proce-dure

*A925 After manual start-up with BAP-0

Tab. 3.13.8 Displays after successful Hardware Startup

Rack Frame MUT FU Unit Remark

Tab. 3.13.7 Sequence for Switching on the Frames

PROC:CP113D – 16 A30808-X3063-A403-2-7630


1 Check the Basic State (Preparation) of R:CP113 and R:DEVD

Check the basic state of R:CP113A, R:DEVD and if present R:CP113B (exten-sion rack).




Tolerance range: -60V (-54V .... -71V)Tolerance range: -48V (-45.6 V... -57V)





3 Switch off DCCs

Switch off all DCCs

Check: System test log (if included)

BAP-1 CPCL xxxx Sequence on the 7-segment displays is shown in the proce-dure

*A925 After manual start-up with BAP-1

IOC-0 CPCL A 3 8 5 A1A5 is also possible

IOC-1 CPCL A 3 8 5 A1A5 is also possible

IOP IOP:TA ******CF none *Time display (not time-of-day) for several minutes

IOP:MBIBREQ

IOP:SCDV

none

IF:MDD * *H1 or H2 or none

IK:DTD none


4 3 2 1


A30808-X3063-A403-2-7630 PROC:CP113D – 17

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4 Check Mechanical Layout

Check racks and module frames (R:CP113A, R:DEVD and R:CP113B ifpresent) to see if any parts are touching, or if there is any foreign material ortransport damage.

Check that all modules and cables are firmly in place

If any transport damage or damaged seals have been detected, the rack layout(R:CP113A and R:DEVD or R:CP113B) has to be checked against the equip-ment list.

Check the layout of the module frames and the standard cabling plan

Break module seal

Check connections between wire wrap field and chassis ground bus.

Check cabling against cable laying list A30808-A....-X...- * -33

5 Check Memory Settings

Check that the memory settings on all MUH:1088 modules are correct.

Unplug module MUH:1088 from all mounting locations.

The module contains a coding switch for adapting memory addressing to thepossible equipment variants.

Check switch settings of the coding switch on the MUH:1088 modules andcorrect if necessary

Coding switch and the correct switch settings are given in ...... (see 3.13.8)

6 Check the Jumpering in F:MI0

Check the following wire wrap connections:

• From MOLOC 277 PIN E 212 to MOLOC 277 PIN C 212

• From MOLOC 285 PIN E 212 to MOLOC 285 PIN C 212

7 Test Fans

Screw in the fuses for the fans consecutively and turn fan switches on

The assignment of fuses to the fans is given in ...... (see Tab.3.13.5)

Are all fans working? Y h...9N h...8




PROC:CP113D – 18 A30808-X3063-A403-2-7630


9 Switching on the MTD

Branch to one of the following procedures for switching on the MTD according tothe MTD used:

– Switching on the MTD: STC 2922 of Storage Tek(Connected to IOP:MTD) i....PROC:

MTD_STC2922

– Switching on the MTD: STC 2925 of Storage Tek(Connected to IOP:UNI / SCSI-Interface) i....PROC:

MTD:STC2925

– Switching on the MTD: HP 88781 A of Hewlett Packard(Connected to IOP:UNI / SCSI Interface) i....PROC:

MTD:HP88781A

– After the MTD is successfully put into service, continue: h...10

10 Check Cabling of Disk Storage Unit (MDD)

The following different types of MDD can be used for the CP113D:

• Quantum Atlas Disk storage Unit XP34550S (4,5GByte)

• HP Disk storage Unit HP C2490A (2,1Gbyte)

• Fujitsu Disk storage Unit M2263SA (780 Mbyte)

Check that interface cables to the IOP:MDD / IOP:UNI are connected accordingto the following instructions:

– If Quantum Atlas disk storage unit XP34550S (4,5Gbyte) is used(Connected to IOP:UNI / SCSI-Interface) i....NM:CP -

Devices, MDDXP34550S(4,5 Gbyte)

– If HP disk storage unit MDD HP C2490A (2,1Gbyte) is used(Connected to IOP:MDD or IOP:UNI) i....NM:CP -

Devices, MDDHP C2490A(2,1 Gbyte)

– If Fujitsu disk storage unit MDD M2263SA (780 Mbyte) is used(Connected to IOP:MDD) i....NM:CP -

Devices,MDD M2263SA(780 Mbyte)

No transport safety catches (bolts etc.) have to be removed in this disk genera-tion.

Have one or both disk memories (MDD) been replaced or supplied after theoriginal installation? Y h...11

N h...12

A30808-X3063-A403-2-7630 PROC:CP113D – 19

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11 Check Switch Settings of Disk Storage Unit (MDD)

Check that switch settings are set according to the following instructions:

– If Quantum Atlas disk storage unit XP34550S (4,5Gbyte) is used i ...NM:CP -Devices, MDDXP34550S(4,5 Gbyte)

– If HP disk storage unit MDD HP C2490A (2,1Gbyte) is used i ...NM:CP -Devices, MDDHP C2490A(2,1 Gbyte)

– If Fujitsu disk storage unit MDD M2263SA (780 Mbyte) is used i ...NM:CP -Devices,MDD M2263SA(780 Mbyte)

12 Check Cabling of MODs (Only in F:DEV(F))

Check the following cable connections of the MODs:

• Correct attachment of the power supply plug to the MOD

• Correct attachment of the power supply plug to the MOD-fan

• Correct attachment of the SCSI bus cabling

For MOD Sony SMO-F531 (1,3 GB): check these cable connections accordingto the instructions in

......NM:CP -Devices,MOD SonySMO-F531

For MOD Sony SMO-F541 (2,6 GB): check these cable connections accordingto the instructions in


13 Check Settings of the MODs (Only in F:DEV(F))

Check the following settings of the operation mode plug of the MODs:

• Check the setting to the correct SCSI address (SCSI-ID 2)

• Check the correct jumper setting in the operation mode plug for deactivatingthe internal terminating resistor (Depending on the SCSI devices connected)

For MOD Sony SMO-F531 (1,3 GB): check these settings according to theinstructions in


For MOD Sony SMO-F541 (2,6 GB): check these settings according to theinstructions in


14 Screw in Fuse

Screw in fuse for MDD-0 (and MOD-0 in F:DEV(F))(One fuse supplies the DCCs of both devices)

...... (see Tab.3.13.4)

PROC:CP113D – 20 A30808-X3063-A403-2-7630


15 Switch on MDD-0

Switch on DCC for MDD-0 ......(see Tab.3.13.4)

LED of the DCC lights up

LED of the MDD lights up for approx. 30 s

16 Switch on MOD-0 (Only in F:DEV(F))

Switch on DCC for MOD-0 ......(see Tab.3.13.4)


MOD fan starts up

MOD-LED lights up shortly

17 Screw in Fuse

Screw in fuse for MDD-1 (and MOD-1 in F:DEV(F))(One fuse supplies the DCCs of both devices)

......(see Tab.3.13.4)

18 Switch on MDD-1

Switch on DCC for MDD-1 ......(see Tab.3.13.4)


LED of the MDD lights up for approx. 30 s

19 Switch on MOD-1 (Only in F:DEV(F))

Switch on DCC for MOD-1 ......(see Tab.3.13.4)


MOD fan starts up


20 Installation of PC

Information about the inverter:The 220V outputs of the inverter (220V, 1KVA and 2,5KVA) are floating. If testdevices are supplied by the inverter, electrostatical charging or grounding loopsmay lead to faulty test results or defects.Remedy: Grounding one line of the 220V output, before switching on theinverter (If not already done by the manufacturer).

Switch on the inverter for the PC.

Installation of the PC according to ......MMN:PC -BASIS

– After the PC has been installed and a CP session opened h...21

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21 Prepare Switching on DCCs

Put all inhibit bit switches in module faceplates (on PIDAT, BCTI) in ON position(up). Put the TEST switches on the faceplates of the CPCL modules (in BAP0/1and IOC0/1) up to the ON position.

Make sure that all DCCs of the CP113D are switched off

22 Switch on DCCs

A distinction is drawn between the capacity stages of the CP113Ds. Because ofclock synchronization the module frames are tested in the following sequence : ...... (see Tab.

3.13.7)

Screw in fuse for the first (next) module frame (see preceding table).

Switch on power with the switch on the assigned DCC module faceplates.

Caution: If there are several DCCs in one MI, CMY or IOP module frame, theswitches of all these DCCs must be switched on.

Are the green LEDs on the DCC modules lit? Y h...23N h...24

23 Decision: Next Modules

Are all units listed in the table in operation? Y h...32N h...22

24 Fault Clearance

Switch off the voltage converter(s) immediately and unscrew the assigned fuse

25 Check the Fuse for DCC

Is the corresponding fuse in the fuse panel defective? Y h...26N h...27

26 Replace Fuse

Replace the fuse in the fuse panel h...22

27 Decision Block: DCC

Has the current converter already been replaced? Y h...29N h...28

28 Replace DCC

Replace the DCC with spare DCC

Mark the replaced DCC as defective h...22

PROC:CP113D – 22 A30808-X3063-A403-2-7630


29 Decision Block: Cable

Is a cable the next unit to be cleared of faults? Y i....NM:CP113D, TAB,CP0050

N h...31

30 Decision Block

Could the fault be cleared? Y h...22N h...31


The fault could not be cleared by standard fault clearance measures. A systemspecialist must carry out fault clearance.

– After successful fault clearance h...22

32 Diagnosis 0 CMY

The off-line diagnostics must be carried out on both CMYs one after the other.

Set the inhibit bit switches for the CMY to be tested on the BCTI modules ofboth B:CMYs to the ON position

Press the DIAG key on the CMY to be tested

Diagnostic 0 is started and indicated by LED DIAG0. On completion, if no errorshave been found, 5AAA is displayed.

Is 5AAA displayed? Y h...34N h...33

33 Fault Clearance

– Fault clearance according to i....NM:CP113D,TAB, CP053


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34 Diagnosis 2 CMY

Press RESET key on the CMY to be tested

The display shows E-01 (- = dark) and the DIAG0 LED goes out.

Press DIAG key on the CMY to be tested

Diagnostic 2 is started and indicated by the LED DIAG2. On completion, if noerrors have been found, 5AAA is displayed.

Diagnostic 2 can be restarted by pressing the DIAG key again. Diagnostic 3 canonly be started if diagnostic 2 ends with an error. Press the RES key again(display then shows E-02) to start diagnostic 0 again.

Is 5AAA displayed? Y h...35N h...36

35 Decision: Next CMY

Switch the inhibit-bit switches for the tested CMY in the BCTI modules of bothB:CMYs to OFF

Have off-line diagnostics been performed on both CMYs? Y h...37N h...32

36 Diagnosis 3 CMY

Press RESET key on the CMY to be tested

The display goes dark and the DIAG2 LED goes out.

Press DIAG key on the CMY to be tested

Diagnostic 3 is started and indicated by the LEDs DIAG0 and DIAG2.

Diagnostic 3 can be restarted by pressing the DIAG key again.

– Analyze track numbers and carry out fault clearance according to i ...NM:CP113D,TAB, CP053


37 Off-line Diagnostics IOC

Perform off-line diagnostics in both IOCs, and for further IOCs in the extensionframe R:CP113B, if present.The TEST switch (down = OFF) on the CPCL module is used to switch off thesupervisory circuit (comparator).The TEST switch should only be put in the OFF position during fault clearancefor test purposes.

The BOOT or RES key triggers a RESET in the IOC.

Diagnostics are started by pressing the RES and BOOT keys simultaneously.

PROC:CP113D – 24 A30808-X3063-A403-2-7630


The display is changed with the DIAG switch.

• Switch ON (up): The part of the diagnostic register belonging to the leadingprocessor half within the IOC is displayed.

• Switch OFF (down): The part of the diagnostic register belonging to thesecondary processor half within the IOC is displayed.

The contents of the diagnostic registers are the same if PU-0 and PU-1 in anIOC come to the same result during an audit.

Press RES key

Press RES and BOOT keys simultaneously

Off-line diagnostics are started. If executed without error, x55x appears in thedisplay. (x has no significance for the analysis).

Is x55x displayed? Y h...39N h...38

38 Fault Clearance

Analyze the track numbers

Carry out fault clearance according to i....NM:CP113D,TAB, CP052

– After finishing fault clearance h...39

39 Decision: Next IOC

Have off-line diagnostics already been performed on all IOCs? Y h...40N h...37

40 Off-line Diagnostics IOP

These off-line diagnostics must be run on all IK:DTD and IOP:SCDV modules.

When the off-line diagnostics are started on module IK:DTD, the MDD must beswitched on for the IOP:MDD and the MTD for the IOP:MTD. A tape must alsobe mounted in the MTD, and the device must be switched on-line.

The PC must be ready for operation (a printer may not benecessary)

Start the off-line diagnostics with the DIAG key on the faceplate of modulesIK:DTD and IOP:SCDV.

Track numbers of the RESET test are indicated by way of LEDs.The LEDs go dark for 1 second on completion of the RESET test.The IOP type is displayed for 1.5 secs.:

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The track numbers of the test/diagnostic programs are then displayed.Following error-free execution, the LEDs on the IOP:MDD, IOP:MTD and theIOP:SCDX go dark again.The LEDs of the IOP:SCDV, however, light up.

Performing SCDV diagnostics is only possible if the firmware of moduleIOP:SCDV is not issue G5.

Start off-line diagnostics by pressing the DIAG key on the faceplate of moduleIOP:SCDV.

Track numbers of the RESET test are indicated by way of LEDs.The LEDs go dark for 1 second on completion of the RESET test.The IOP type is displayed for 1.5 secs.:

LED display goes dark for 1 secondThe track numbers of the test/diagnostic programs are then displayed.Following error-free execution, the LEDs on the IOP:SCDV, light up.

The printer and the screen of the PC output the following:CP113 off-line diagnosticsPlease enter the following characters:ASDFGHJKL

Enter the string 'ASDFGHJKL' on the PC and confirm with <ENTER>

CP113 off-line diagnostics passedLEDs on the SCDV module go out

Off-line diagnostics terminated without error? Y h...42N h...41

41 Fault Clearance

Analyze the LED display

Carry out fault clearance according to i ...NM:CP113D,TAB, CP054


LED display IOP type

D3 D2 D1 D0

1 0 1 0 IOP:MTD

1 0 0 1 IOP:MDD

- 0 1 1 IOP:SCDX

LED display IOP type

D3 D2 D1 D0

- 0 1 1 IOP:SCDV

PROC:CP113D – 26 A30808-X3063-A403-2-7630


42 Off-line Diagnostics IOP:TA

Press DISPLAY key in module faceplate of IOP:TA.

The following can be checked by pressing the DISPLAY key in the faceplate ofmodule IOP:TA:

• Press key down = (off-line) the displays are checked.

• Key up = (on-line) the time is displayed.

Press the DIAG key in the faceplate of module IOP:TA.

Diagnostics are started. On completion without error, the display goes darkagain for a short time.

Off-line diagnostics terminated without error? Y h...44N h...43

43 Fault Clearance

Analyze the LED display

Carry out fault clearance according to i....NM:CP113D,TAB, CP054


44 Decision: IOPAUC

The IOPAUC is only used in CP113 of AC (authentication center)

Is there at least one IOPAUC in use Y h...45N h...47

45 Off-line diagnostics of IOPAUC

Press the RESET key on the front panel of the IOPAUC module

The progress of the test is indicated via the LEDs of the IOPAUC

– For evaluating the LED displays of the IOPAUC see i....NM:CP113D, TAB,CP0054

Has the diagnostics ended without faults? Y h...47N h...46

46 Fault clearance

Carry out fault clearance according to i....NM:CP113D, TAB,CP0054


47 Prepare BAP Hardware Start-up

Flick all inhibit-bit switches to OFF

Switch off the DCCs connected to BAP-0 and BAP-1, if not already done

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48 Information about BAP Hardware Start-up

When the DCCs have been switched on, the initialization and test programs inthe individual processors are run (hardware start-up). Track numbers aredisplayed which give information on the type of error if one occurs.The BAP to which power is first applied becomes the MASTER, as long as thisBAP is error-free.

For start-up with the APS, it is necessary for the following units to be connectedto a B:CMY (displayed by reset inhibit bits (SPB LED = off)):

• one BAP (SPB LED on module PIDAT A131 or A145)

• one IOC (SPB LED on module PIDAT A163 or A175)

• one CMY (SPB LED on module BCTI)

Ensure that the following IOPs can be reached via the IOC connected to theB:CMY, and that they have the status shown in the table:

• one IOP:MDD

• one IOP:SCDV (for connection of the PC)

The BAP that becomes MASTER formats both CMYs first. Display on master:A885' for approx. 5sec.

It then initializes BCMY0/1, and IOC0/1Display: 'A8A5',...,'A8C5',...,'AB05'

When 'AB05' is displayed, the test APS is already being loaded from one of thedisks (MDD0 or MDD1). This can be seen by the rhythmic flashing of one of theLEDs. (module IF:MDD H1-reading from MDD).

Displays on the other module faceplates after initialization, if no errors are foundin the processors during hardware start-up are given in:

...... (see Tab.3.13.8)

49 Switch on BAP0 and BAP1

Screw in the fuses for the DCCs of BAP-0 and BAP-1

Switch on DCCs in BAP0 and BAP1

Are the green LEDs on both DCC modules lit? Y h...58N h...50

50 Fault Clearance

Switch off the DCC on which the LED is not lit immediately and unscrew therelevant fuse. After a successful test start-up, remove the fault from the defec-tive unit with the test APS (provided a BAP can load the APS).

– If only one BAP is defective, continue h...58– If both BAPs are defective, the errors must be removed immediately h...51

PROC:CP113D – 28 A30808-X3063-A403-2-7630




52 Replace Fuse




54 Replace DCC




Is a cable the next unit to be cleared of faults? Y i....NM:CP113D, TAB,CP0050

N h...57

56 Decision Block





58 Decision: Start-up with Test APS Possible

Has the system been configured to allow start-up with the test APS? Y h...87N h...59

59 Decision: BAP-0/-1 already Reset

Has the firmware been reinitiated in processor BAP-0/1 by means of the BOOTkey on the faceplate of module CPCL? Y h...60

N h...61

60 Analyze Inhibit-bit LEDs

Analyze the inhibit-bit LEDs and eliminate errors using i....MMN:CP113D- FC

– When errors have been successfully eliminated h...47

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61 Decision: SPB0 and SPB1 Lit

Are the red SPB, SPB0 and SPB1 LEDs lit on the faceplates of modules BCTIand PIDAT (F:MI 0, F:MI 1)? Y h...63

N h...62

62 Check DCCs

Check that all DCCs have power “ON”

63 Decision: Inhibit-bit Switches

Is the corresponding inhibit-bit switch SPB still ON? Y h...64N h...65

64 Inhibit-bit Switch

Flick corresponding inhibit-bit switch (SPB, SPB0 or SPB1) to OFF h...47

65 Decision: Other BAP MASTER

The inhibit-bit has been set by the firmware

– If no start-up with the other BAP as MASTER has been attempted the start-up has to be repeated with switching on the DCCs of BAP-0 and BAP-1 in adifferent order h...47

– If a start-up with the other BAP as MASTER has already run through amanual start-up must be attempted h...66

66 Manual Start-up Part 1

BAP-0 becomes master if the inhibit-bit switch in BCMY-0 and BCMY-1 onmodule PIDAT (mounting location 145) is put ON (up).BAP-1 becomes master if the inhibit-bit switch in BCMY-0 and BCMY-1 onmodule PIDAT (mounting location 131) is put ON (up).BAP-0 becomes master with the procedure described below. If you want BAP-1to be master, set the inhibit-bit switch accordingly and press the BOOT key onmodule CPCL in BAP-1.

Flick the inhibit-bit switch to ON (up) in BCMY-0 and BCMY-1 on module PIDAT(mounting location 145).

Related LEDs on the modules light up

Press BOOT key on faceplate of module CPCL in BAP-0.

When the DCCs have been switched on, the initialization and test programs(hardware start-up) run in the individual processors. Track numbers aredisplayed which give information on the type of fault if a fault occurs. The BAP-0becomes MASTER.

PROC:CP113D – 30 A30808-X3063-A403-2-7630


For start-up with the APS, it is necessary for the following units to be connectedto a B:CMY (displayed by reset inhibit bits (SPB LED = off)):

• one BAP (SPB LED on module PIDAT A131 or A145)

• one IOC (SPB LED on module PIDAT A163 or A175)

• one CMY (SPB LED on module BCTI)

Ensure that the following IOPs can be reached via the IOC connected to theB:CMY, and that they have the status shown in the table:

• one IOP:MDD

• one IOP:SCDV (for connection of the PC)

Displays on the module faceplates when the BOOT key has been pressed, if noerrors have been found in the processors during hardware start-up: ......(see Tab.

3.13.8)

Has the system been configured so that start-up with the test APS is possible? Y h...68N h...67

67 Decision: Manual Start-up with second BAP

– Repeat manual start-up with second BAP, if not already done h...66– If the manual start-up has already been attempted with the second BAP, off-

line diagnostics must be executed h...82

68 Manual Start-up Part 2IPL113: MANUAL START - CURRENT CONFIGURATION

UNIT STATUS TEST

********************************************

BAP-0 ost Test result


B:CMY-0 ost Test result


CMY-0 ost Test result


IOC-0 ost Test result


IPL113: ENTER PARAMS

TO DIAGNOSE MEMORY : “DIAG;”

TO FORMAT MEMORY : “FORMAT;”

TO CONTINUE : “;ETX”

Is the preceding message output? Y h...73N h...69

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69 Decision: Check IOP:SCDV/Cabling to PC

Have the switch settings on module IOP:SDCV and the cable connection to thePC already been checked? Y h...70

N h...71




71 Check Cabling to PC

Check and if necessary replace connecting cable to the PC or change plug posi-tion

72 Check Switches on IOP:SCDV

Check and if necessary adjust the switches on module IOP:SCDV. Themounting location for this IOP can be found in the exchange configuration docu-ments. The location and setting of the switches can be found in: ......MMN:CP113D

- TAB

Switch off power at the switch on the DCC faceplate in the IOP module frame.

To connect the PC to the IOP:SCDV, check and if necessary adjust the settings.

Switch on power again h...47

PROC:CP113D – 32 A30808-X3063-A403-2-7630



Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS

TO START APS MANUALLY : “MANUALLY;”

TO START INSTALLAT.RECOV : “INSTALLATION;”

TO START UTILITY(MONITOR) : “UTILITY;”

TO STOP INITIAL START : “STOP;”

TO START APS AUTOMATICALLY: “;ETX”

Enter “MAN;” and press <ENTER>IOC-0 MDD : BZS/AKD AND GENERATION LIST

IOC-1 MDD : BZS/AKD AND GENERATION LIST

The current generation list is output:

xxxxxxxxxxxxxx

99999999 xxxxxxxxxxxxxxxxxxxxx

MANUAL RECOVERY - LOADING VIA IOC : “IOC-0;/IOC-1;”

Enter “IOC-0;” or “IOC-1;” and press <ENTER>LOAD.DEV. - *MDD* -GENERATION TO LOAD :”NAME;” (8 CHAR)

Enter the current APS generation 8 characters (in APS documentation or at theplace marked 9999999 in the generation list printed out previously).

Enter 'Generation-No.' and press <ENTER>

If the APS version is unknown and cannot be found out, enter *. For safetyreasons this must be repeated 3 times after system enquiry.

MANUAL RECOVERY - LTG LOADING : “Y;/N;”

Enter "N;" and press <ENTER>

Flick inhibit-bit switch in BCMY-0 and BCMY-1 on module PIDAT (mountinglocation 145) to OFF (down).

Related LEDs on the modules go out

Manual start-up is initiated.

The track numbers to be run through on the module CPCL in the BAP masterare shown in block: ......(see 87)

To make things clearer, only the headline is given for the system messages.

Wait for the following system message:ALL DOUBLE FILES SYNCHRONIZED

Was the manual start-up with the test APS successful? Y h...89N h...74

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74 Decision: Manual Start-up with other BAP

Has the manual start-up been attempted with another BAP? Y h...76N h...75

75 Boot Key

Press BOOT key of other BAP and repeat manual start-up h...66

76 Decision: Manual Start-up via IOC-1

Branch to one of the following blocks

– Repeat manual start-up via IOC-1, if not already done h...66– If manual start-up via IOC-1 has already been attempted h...77

PROC:CP113D – 34 A30808-X3063-A403-2-7630


77 START/UTILITY

When working with the IMON, ensure that the PC can be reached via the IOCspecified in the Start Utility.

Press BOOT key in BAP-0IPL113: MANUAL START - CURRENT CONFIGURATION

UNIT STATUS TEST

********************************************













– If the preceding message did not appear h...69Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS






Enter “UTI;” and press <ENTER>UTILITY - RECOVERY - DEVICE - TYPE TO USE : “MDD;/MTD;”

Enter “MDD;” and press <ENTER>UTILITY - RECOV. - LOAD FROM MDD VIA : “IOC-0;/IOC-1;”

Enter “IOC-0;” or “IOC-1;” and press <ENTER>PLEASE ENTER UTILITY - FILE - NAME

Acknowledge this message with “SY.INSTALL”IMON : V0031 START

IMON : ENTER COMMAND

Was it possible to start IMON? Y h...79N h...78

78 Fault Clearance

Check connection of MDD to IOP:MDD against the cable laying list.

Check switch settings and cable connections in the MDD against the manufac-turer's documentation.


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79 Display Disk Contents

Display disk contents with the following commands:DISP MDDIR:DEVIN=010E01; (for MDD-0)

DISP MDDIR:DEVIN=030E01; (for MDD-1)

All disk files of MDD-0 (MDD-1) are displayed

Branch to one of the following blocks according to the files displayed

– If all system files are present continue h...80– If not all system files are present the files must be copied again from tape to

disk. System test with test APS must be omitted h...93

80 Decision: BAP Off-line Diagnostics

Have BAP off-line diagnostics been carried out? Y h...81N h...82

81 Branch according to Off-line Diagnostics

– If all off-line diagnostics have been terminated without error, one or moresystem files have probably been destroyed. In this case the test with the testAPS must be omitted h...93

– Otherwise h...21

82 Prepare BAP Off-line Diagnostics (Special Fault Clearance)

Off-line diagnostics must be performed on both BAPs.

Flick the TEST switch on module CPCL to OFF to switch off the supervisorycircuit. It should only be switched OFF for test purposes. Diagnostics cannot beinitiated by MML or key when the supervisory circuit is switched off.

Initiate hardware start-up with the BOOT key on the CPCL module. The BAP inwhich the BOOT key was pressed becomes the master.

Reset the processor with the RES key.

Start diagnostics by pressing the RES and BOOT keys simultaneously.

PROC:CP113D – 36 A30808-X3063-A403-2-7630


Change the display with the DIAD switch.

• When the switch is ON (up), the part of the diagnostic register that belongsto the leading processor half (PU) in the BAP is displayed.

• When the switch is OFF (down) the part of the diagnostic register thatbelongs to the secondary processor half (PU) in the BAP is displayed.

The contents of the diagnostic registers are the same if the PU-0 and PU-1 in aBAP come to the same result in the audit.

Switch off the DCCs connected to BAP0/1

For the off-line diagnostics in the BAPs, disconnect the start-up lines and put thecorresponding PINs in the multilayer to 0 V.

Disconnect the start-up lines shown in the following table:

Insert the following links:

Switch on DCCs connected to BAP0/1

An initialization program runs in both BAPs

Is 'A435' displayed in at least one BAP? Y h...84N h...83


Carry out special fault clearance according to i....NM:CP113D,TAB, CP052


Rack Frame MUT MOLOC

R:CP113A P/IOC0 09 D179P3

D179P4

P/IOC1 10 D179P3

D179P4

Rack MUT from to

MOLOC PIN MOLOC PIN

R:CP113A 09 179 A248 179 C248

10

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84 Start BAP Off-line Diagnostics

Start diagnostics in the BAP with the correct display ('A435') by pressing theRES and BOOT keys simultaneously.

Off-line diagnostics are started. On termination without error, xAAx is displayed.(x has no significance for the analysis).

Is xAAx displayed? Y h...86N h...85

85 Fault Clearance

Analyze the track numbers and clear faults using i ...NM:CP113D,TAB, CP052


86 Check Internal Cabling

The BAP(s) is/are OK. The fault is in the cabling between BAP-0/1 and BCMY-0/1, or in the cabling between BCMY-0/1 and CMY-0/1 or in the CMY-0/1.

Check the internal cabling of the R:CP113A against the cable laying list

– If any faults have been found in the internal cabling, remove faults andcontinue h...47

– If no faults have been found in the internal cabling, evaluate and clear faultsaccording to i ...NM:CP113D,

TAB, CP052


87 Software Start-up with test APS

Software start-up is initiated as soon as the display of the CPCL module of theBAP master changes from 'Axx5' to 'Bxx4'. (xx - different track points of start-up)

The following track points run trough:

– ‘Bx34‘

– ‘Bx54‘

– ‘Bx74‘

– ‘Bx94‘

or: ‘Dxx2‘ or ‘Exx1‘ (changes every 4 s)(xx-arbitrary, with:

– 'Dxx2' the call processing load is shown in Erl.

– 'Exx1' the entire processor load in percent)

Have the track points shown above been run trough? Y h...88N h...66

PROC:CP113D – 38 A30808-X3063-A403-2-7630


88 System Messages

To make things clearer, only a headline is given for system messages.

If startup with test APS was successful the following message is output:ALL DOUBLE FILES SYNCHRONIZED

Wait for system message

Branch to the following blocks according to the system reaction:

– ALL DOUBLE FILES SYNCHRONIZED is displayed h...89– Any other message is displayed h...66– No message is displayed h...71

89 Enter USER-ID and Password

USER-ID and password will be interrogated.For the first OMT “EWSD0” and for further OMTs “EWSD1”, “EWSD2”,“EWSD3” has to be entered as USER-ID.The password is “SYSTEM-1”.(All inputs in capital letters)

Enter USER-ID and password

90 Enter Date and Time

Enter date and time:

b ENTR TIME:DATE=yy-mm-dd,TIME=hh-mm-ss,WD=xx;

Secure time:

b CORR TIME:MODE=SECURE;

91 Check Fan Alarms

Switch off the individual fans in each fan module by the switches on themodules. After about 5 secs. this is logged on the printer.

System message fan alarm

Switch on fans again (do not wait for longer than 5 mins.)

Was it possible to generate this message from each fan module? Y h...93N h...92

92 Check Alarm Lines

Check alarm lines from the fan modules to the IOP:TA against cabling list and ifnecessary perform special fault clearance IOP:TA according to the MMN.


!Caution:Do not leave the fans switched off for longer than 5 mins. as racks warm up rapidly, endangering compo-nents.

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93 Install Hardware APS

The term Hardware APS indicates that the APS contains only the data of thehardware which is present in the exchange and no routing-, zoning-, orsubscriber-data.

The following is necessary before installing the hardware APS:

• error-free configuration of CP113D with the test APS

• APS documentation

Observe the notes in the APS documentation supplied.

Note:The APS installation is to be carried out according to procedure SW140 (if deliv-ered on Tape) or according to procedure SW141 (If delivered on MOD).

Install the APS, using one of the following procedures (According to the mediumon which the APS is delivered).

– For APS delivered on tape h...NM:SW,PROC:SW140

– For APS delivered on MOD h...NM:SW,PROC:SW141

END

PROC:CP113D – 40 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:MTD_STC2922 – 1

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3.14 Switching on MTD STC 2922 of Storage Tek

MTD_STC2922

3.14.1 Introduction

• The scope of delivery of the magnetic tape device STC 2922 of Storage Tek containsa user manual.

• MTD-fault clearance should only be carried out by especially trained personnel.

1 Basic test Magnetic Tape Device STC 2922

Check that interface cables to the IOP:MTD are connected according to ......NM:CP -Devices,MTD:STC 2922

Open the door of MTD

Turn POWER switch to OFF

Unscrew the cover of MTD module frame (using special tool Torx 15) andremove foam rubber in front of the modules.

Unplug the IFP module of the MTD

PROC:MTD_STC2922 – 2 A30808-X3063-A403-2-7630


The switch settings must be checked or set according to ......NM:CP -Devices,MTD:STC 2922

Reconnect the IFP module

Replace the foam rubber in front of the modules and screw on the cover of theMTD module frame

Open the cover of the tape path

Before testing the MTD, cleaning must be carried out according to the instruc-tions given in

......MMN:CP113,MAINT:MTDSTC 2922

The cleaning should be recorded in a copy of the maintenance list which accom-panies the MMN. The list should be attached to the door of the rack.

If the cover does not close tightly due to a physical defect, the magnetic tape willnot be automatically threaded. In this case spare catches must be obtained andexchanged. ......MMN:CP113,

MAINT:MTDSTC 2922

Close the cover of the tape path

Switch on the main supply switch at the rear of the MTD, if not already done

The location of the main supply switch is given in: ......NM:CP -Devices,MTD:STC 2922

!Observe the EGB regulations

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2 Switch on Magnetic Tape Device

A short self-test is carried out after switching on the power. Operating or hard-ware faults are shown on the MTD display. An explanation of the fault numbersis to be found on the inside of the MTD door, or in Section "INTF FCD" (FaultCode Dictionary 2921&2922 with Industry standard Interface) of the manual thatis supplied.

The tape leader must be cleanly cut, i.e. not have a plastic threading end (cut offwith a special tool) as this prevents the tape from being guided when it isthreaded in. If automatic tape threading is not possible, e.g. at altitudes over1.800m, it must be threaded by hand. Manual threading is started by pressingthe LOAD-REW key twice. The magnetic spool must be turned so that the tapeis inserted into the suction opening. If SHUT DOOR is displayed on the MTD,ensure that the MTD door is properly closed.

Screw in fuse 3 for MTD (in R:DEVD)

Close MTD door

Put POWER switch to ON position

If the self-test completes without finding a fault, - - - - is displayed.

PROC:MTD_STC2922 – 4 A30808-X3063-A403-2-7630


3 Diagnose Magnetic Tape Device

The following inputs relate to the MTD keyboard

Press the <ENTER ADDR> key, enter '1 F F A' and then press <ENTER>(Request the firmware version)

D1 is shown in the MTD display

Press <ENTER>

'16' or '17' appears on the MTD display

MTDs with FW < D1 16 may not be used.

Open the MTD door

Insert a fault-free empty tape with a write enable ring, but do not load (ScratchTape)

Press <ENTER DIAG> enter '1 0' and then press <ENTER>

The last input starts the complete MTD device diagnostics. The magnetic tape isautomatically loaded after internal checks are carried out. Read/write tests withboth recording densities are then made. After a positive run the diagnostics endwith - - - - on the display. If there is a fault, a fault number is displayed. Detailsabout the cause of the fault together with fault numbers are listed in the STCManual, Section "INTF FCD" (Fault Code Dictionary 2921&2922 with Industrystandard Interface) . Fault clearance is explained in the section for Mainte-nance, Removal/Replacement, Diagnostics in the STC Manual.

Is - - - - displayed after the diagnostics? Y h...5N h...4

4 Fault clearance

Carry out fault clearance as described in STC Manual, sections Maintenance,Removal/Replacement, Diagnostics


5 Check Tape

Open MTD door

The following test overwrites any files that may exist!

Press the door contact (below left) with a pen or any other suitable tool and holdit down

Press <ENTER DIAG>, enter 'D' and then press <ENTER>

The tape is written to with higher recording density 6250 BPI and read in theREAD AFTER WRITE MODE. MTD Display: @D

'@D' appears in the MTD display

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The following 2 system responses are possible:

• If the magnetic tape is fault-free, it is wound back when the end-of-tape mark(EOT) is recognized.

• If the magnetic tape is faulty it is stopped after 5 faults. MTD display: ODC(In this case the tape cannot be used)

Is the tape fault-free? Y h...6N h...7

6 Unload fault-free tape

Unload tape and remove it

Remove pen (or tool) from the door contact.

Close the MTD doorReturn to calling procedure

7 Unload faulty tape

Rewind tape


Tape must not be used anymore



END

PROC:MTD_STC2922 – 6 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 PROC:CP113C/CR – 1

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3.15 Off-line Installation of CP113C/CR

CP113C/CR

3.15.1 Documents


– AKUHW Lists (Equipment Lists)

– Maintenance Manual MMN:CP113C/CR

– Maintenance Manual MMN:PC - BASIS, Ordering no.: A30808-X3069-Y260- * -7620

– MMN:SW

– NM:CP113C/CR

– NM:CP-Devices

– Manuals required:MTDMDDPC

PROC:CP113C/CR – 2 A30808-X3063-A403-2-7630


3.15.2 Abbreviations

3.15.3 Test Equipment and Resources

– APS (contained on both disks)

– Multimeter (DMM)

– Scratch tapes with write ring

3.15.4 General Information about Testing CP113C/CR

The coordination processor CP113C/CR undergoes a system test before leaving themanufacturing plant. The individual racks are tested to check that the voltageconverters, the logic components and the internal cabling function correctly.

a) The cables of the CP rack row are supplied as a supplementary package to the coor-dination processor and are given a system test in the rack (except when cables aresupplied later).

Abb. Meaning

B:CMY bus to common memory

B:IOC bus system for input/output control

BAP base processor

CAP call processor

CI common interface

CMY common memory

F: frame

IOC input/output control

IOP input/output processor

LMY local memory

MDD magnetic disk device

MI memory interface

MOLOC mounting location

MTD magnetic tape device

MUT mounting unit

MYB memory bank

MYC memory control

PI processor interface

PU processor unit

R: rack

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b) Once accepted by the test department, all modules are protected from unauthorizedaccess (by means of a loop secured round each individual module frame).

c) The magnetic tape device, the disk drives and the personal computers are system-tested and separately packed for delivery. The disk storage units had the test-APScopied onto them in the test department.

d) The coordination processor is checked in the system test department with a testAPS. This APS is located on both magnetic disks.

e) The CP113C/CR installation test can begin once installation is completed. The APSon the disks is used for system testing.

f) The CP113C/CR is tested in the following steps:

Off-line test:

– Visual check of devices and cabling

– Preset all devices (if not already done at the factory)

– Start up the PC on-line following manufacturer's instructions (if not already doneby the manufacturer)

– Start the fans

– Switch on power to all equipment

– Off-line diagnostics of CMY, IOC, IOP, (BAP/CAP only if faulty)

On-line test:

– Start up hardware

– Load application program system (test APS) and start operating system (APSpresent on both system disks)

– Configure the necessary operating states in the CP area

– Check the logic components and devices:common memory (CMY),base processor (BAP),input/output control (IOC)input/output processor (IOP)bus to common memory (B:CMY)magnetic tape device (MTD) andmagnetic disk device (MDD)using the appropriate test and diagnostic software

– Introduce hardware modifications if necessary

– Incorporate the current operating APS and repeat the on-line tests

g) Error messages output by the test programs are handled on the basis of the MMN.

h) Implementation of modifications according to instructions (notices are sent by themodification service). The modification guidelines must be observed. If the installa-tion tester does not carry out the modifications himself, he should at least know

PROC:CP113C/CR – 4 A30808-X3063-A403-2-7630


which ones are made. Any faults that occur when the modifications have been incor-porated must be eliminated with the operating APS and the MMN.

i) After each hardware modification to a device, the modification service must beinformed of the new device issue.

j) A fault report must be written on each hardware fault (for repairs and statistics).

k) Always disconnect power before unplugging modules and plugging them in again.

l) If modules with DIP switches are replaced by spares, find the correct new settingsin the MMN:CP113C/CR - TAB.

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3.15.5 Overview of the Hardware Belonging to the CP Complex

Fig. 3.15.1 Overview: Hardware belonging to the CP-Complex

CAP-0

LMY

PU0

PU1

CI

PI

PI

BCMY-0

BCMY-1

CAP-5

LMY

PU0

PU1

CI

PI

PI

BAP-0

LMY

PU0

PU1

CI

PI

PI

BAP-1

LMY

PU0

PU1

CI

PI

PI

B:IOC

LMY

PI

PI

PU0

PU1

CI

B:IOC

LMY

PI

PI

PU0

PU1

CI

IOP

IOP

IOP

IOP

MYC

MYB0

MYB1

MYB2

MYB3

CMY-1

MI

MI

MYC

MYB0

MYB1

MYB2

MYB3

CMY-0

MI

MI

Minimum Configuration

Maximum Configuration

IOC-1IOC-0

IOC-3IOC-2

PROC:CP113C/CR – 6 A30808-X3063-A403-2-7630


3.15.6 Overview of Interfaces B:CMY

Fig. 3.15.2 Overview of Interfaces B:CMY

M:PIA 0

Stg 0

Stg 1

M:PIA 1

Stg 0

Stg 1

M:PIA 2

Stg 0

Stg 1

M:PIA 3

Stg 0

Stg 1

BAP-0

IOC-0

BAP-1

IOC-1

CAP-0

CAP-1

IOC-2

IOC-3

CAP-2

CAP-3

CAP-4

CAP-5

Reserve

Stg 0

Stg 1

M:MTI

M:BCM

Stg 1

Stg 0

Control bus (doubled)

Address/ Data bus (ECC secured)

Capacity dependent partof the BCMY

Processors B:CMYInterface to theprocessors

Interface to theCMY

CMY0

CMY1

HW tracer

MP:CP113C

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3.15.7 Overview IOPs (DE5/2)

Fig. 3.15.3 Overview IOPs (DE5/2)

-1

B:IOC

LMY

PU-0

PU-1

IOP:SCDP-0

IOP:MB 0

IOP:UNI-0

IOP:MB 34

IOP:MB 32

IOP:MB42

IOP:MB 40

IOP:TA

IOP:SCDP-1

IOP:MB 1

IOP:UNI-1

IOP:MB 35

IOP:MB 33

IOP:MB43

IOP:MB 41

IOP:TA

CCG(A)-0

CCNP-0

-1

1-1MB-0-1

1-0MB-0-0

SYPC

DC/AC-Conv. DCIRC

OMT-1

X.21

MTDMODMDD

DC/AC-Conv. DCIRC

OMT-0

X.21

MTD MOD MDD

GPS-Receiver

Fan Alarms

GPS-Receiver

Fan Alarms

IOC-0 IOC-1

PROC:CP113C/CR – 8 A30808-X3063-A403-2-7630


3.15.8 Overview IOPs (DE5/4)

3.15.8.1 IOPs (DE5/4) Part 1

Fig. 3.15.4 Overview IOPs (DE5/4) Part 1

B:IOC

LMY

PU-0

PU-1

IOP:SCDP-0

IOP:UNI-0

IOP:MB 34

IOP:MB 32

IOP:MB42

IOP:MB 40

IOP:TA

IOP:SCDP-1

IOP:UNI-1

IOP:MB 35

IOP:MB 33

IOP:MB43

IOP:MB 41

IOP:TA

CCG(A)-0-1

1-1MB-0-1

1-0MB-0-0

SYPC

DC/AC-Conv. DCIRC

OMT-1

X.21

MTDMODMDD

DC/AC-Conv. DCIRC

OMT-0

X.21

MTD MOD MDD

GPS-Receiver

Fan Alarms

GPS-Receiver

Fan Alarms

IOC-0 IOC-1

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3.15.8.2 IOPs (DE5/4) Part 2

Fig. 3.15.5 Overview IOPs (DE5/4) Part 2

-1

B:IOC

LMY

PU-0

PU-1

IOP:MB 0

Optional

IOP:MB 38

IOP:MB 36

IOP:MB 1

Optional

IOP:MB 39

IOP:MB 37

CCNP-0

1-3MB-0-3

1-2MB-0-2

IOC-2 IOC-3

PROC:CP113C/CR – 10 A30808-X3063-A403-2-7630


3.15.9 Inverter

3.15.9.1 Cabling of the 230V Inverter DCIRC

Fig. 3.15.6 Cabling of the 230V inverter DCIRC

DCIRC500 VA

WR-0

inside

inside

To fuse panel(20A fuse)

Terminal strip

E

When installing the DCIRC into therack, this connector is to be used forgrounding the DCIRC

121110

9

87

456

32

1

151413

Connectors 3, 6, 9, 12, 15 areinternally grounded

230V/AC

Grounding!

Feedtrough elements

230V/AC to F:Modem

NL

230V/ACTo OEM-Devices

-UE2

+UE1

UA2

UA1

DCIRC500 VA

WR-1

inside

inside-UE2

+UE1

UA2

UA1

9874 5 6321 11 ...

Terminal strip

L1

L2

Load compensation

230V/AC from WR-1

32

1

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3.15.9.2 230V AC-Connectors on Inverter DCIRC

Fig. 3.15.7 230V AC-Connectors on Inverter DCIRC

DCIRC 500 VA

DCIRC 500 VA

20 A 20 A

Modem

Modem

OMT-0

OMT-1

Load comp. Load comp.

Feedtrough elements

0

1

- UE

PROC:CP113C/CR – 12 A30808-X3063-A403-2-7630


3.15.10 Fan Alarm Cabling on CP113C/CR

Fig. 3.15.8 Fan Alarm Cabling in CP113C/CR

0 1 2 3 4 5 6 7

AD:RAL

Cable:AD:RAL - IOPTA

Alarm-Inputs

Switches for activating theAlarm inputs

SU 1 SU 2

FAN (AIC-2)

FAN (AIC-1)

FANBOX (AIC-0)-UE

+UE (GND)

Alarm-Switch

To fuse panelIOPTA-0

IOPTA-1

Grounding bar

RACK

Wires

(03 C329P4)

(07 C329P4)

Plug position:

04

08

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3.15.11 SCSI Bus Cabling CP113C/CR

3.15.11.1 SCSI Bus with 1 MTD

Fig. 3.15.9 SCSI bus cabling for MDD, MOD and MTD(CP113C/CR)

MDD1 MOD1 MDD0

MTD0MTD1

IOP:UNI0

IOP:UNI1

Rear view of the rack

R:CP113C/CR R:DEV(B)

MDD0 MTD0

IOP:UNI1

IOP:UNI0

MTD0

MDD1 MOD1

SCSI-Bus(Cable Z55...) SCSI-Bus

(Cable Z56...)

SCSI-Bus(Cable Z55...)


Terminatingresistor (active)

Terminatingresistor(active)

MTD-0 can beplugged asMTD-1 ontothe other bus

PROC:CP113C/CR – 14 A30808-X3063-A403-2-7630


3.15.11.2 SCSI-Bus with 2 MTDs

Fig. 3.15.10 SCSI bus cabling of 2 MTDs (CP113C/CR)

MDD1 MDD0

IOP:UNI0

IOP:UNI1



MDD0 MTD0

IOP:UNI1

IOP:UNI0

MTD0

MDD1

SCSI-Bus(Cable Z55...) SCSI-Bus

(Cable Z56...)


Terminatingresistor (active)


MTD1


MOD0 (Option)

MTD1


Terminating resistor(active)

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3.15.11.3 SCSI Bus with MDD and MOD

Fig. 3.15.11 SCSI bus cabling with MDD and MOD(CP113C/CR)

MDD1 MOD1 MDD0

IOP:UNI0

IOP:UNI1



MDD0

IOP:UNI1

IOP:UNI0

MDD1 MOD1



MOD0

MOD0

Terminalresistor(active)

Terminalresistor(active)

PROC:CP113C/CR – 16 A30808-X3063-A403-2-7630


3.15.12 F:DEVF Overview

Fig. 3.15.12 F:DEVF front view

Fig. 3.15.13 F:DEV(F) rear view with cabling to:MDD, MOD and MTD (CP113C/CR)

FANFAN

MDD1MDD0

MOD0 MOD1

001 015 029 049 056 067 081 095 115 122

DCCDA DCCDA

support plate

fromIOP:UNI0

DCCDA

fromIOP:UNI1

DCCDA

MDD0 MOD0MDD1 MOD1

to MTD-1 to MTD-0

ribbon cable ribbon cable

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3.15.13 Maintenance Panel MP:CP113C

An outline functional description and short introduction to the MP follows below.Complete operating instructions for the MP are contained in NM:CP113C/CR.

3.15.13.1 Performance FeaturesThe maintenance panel unit is remote from the PC and can be connected via a cablesimultaneously with a maximum of three different units of the CP.

These units are:

• Processor (BAP, CAP, IOC)

• Common memory (CMY0, CMY1)

• Bus to the Common memory (BCMY0, BCMY1)

• Input/output processor of the peripheral devices (IOP:UNI)

The MP is connected to these units, via the module front-facing connector, which aresituated on the following modules for the above-named units:

The maintenance panel is for the display or input of data and commands relating to theCP units to which it is connected. The MP power supply is realized via the currentconverter module DCCMC.Several of these DCCMCs are located in each CP module frame.

Unit Module with front connector forMP

Processor M:PEX

CMY M:CMYC

BCMY M:BCM

IOP:UNI M:IOP:UNI

Tab. 3.15.1 Modules with front connector for MP:CP113C

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3.15.13.2 Overview of MP:CP113C

Fig. 3.15.14 Overview of MP:CP113C

3.15.13.3 Operation of the MPThere are 5 keys and one LCD display for operating the MP. The "SELECT UNIT" keyis on the left of the LCD display. The other four are directly beneath the LCD display.They have various uses which can be read off in the last line of the LCD display. TheLCD display has 4 lines with 20 characters each and basically provides three differenttypes of display:normal display, extended display and fault display. This short description only refers tothe normal display:

Fig. 3.15.15 Normal display of MP:CP113C

SELECT UNIT

Menu keys

LCD-display,consists of 4 LCD rows

RESET-key

Potentiometer forLCD-brightness

Unit 3Unit 1 Unit 2Powerconnection

Cable to:

Unit 1: Data 1 Comm.1Unit 2: Comm.2Unit 3: Comm.3disp | req | cmd | send

Unit identification (four characters)

Data field (eight characters)

Command field (six characters)

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3.15.13.4 Key Functions of MP

A list of all menu key functions as well as all possible commands is in the MP OperatingInstructions in NM:CP113C/CR.

3.15.13.5 New Start of the MPA new start is made by pressing the "RESET" key or by unplugging the MP transformerand plugging it in again.

Notes for use:

• The MP:CP113C can be unplugged or plugged in again without interrupting thecomputer.

• After pulling MP:CP113C the processes which were started by the MP in allconnected CP units are reset.

• The CP unit to be controlled must be in MBL status.

• The serial interface of the MP:CP113C functions with TTL level and is thereforecompatible to a standard V.28 interface.

Key Key function Meaning

SELECT UNIT Selects the unit for which a command is to be enteredThe selected unit is shown inverted in the display

MENU KEYS Their function isshown in the lastline of the display

disp switches between normal and extended display

esc ends the current input or output and reactivates the latest validmenu key assignment

cmd selects the next command from the currently valid command list(dependent on the selected unit) and shows the selected unit inthe command field

beg jumps to the first command of the current command list

send carries out the displayed command

Tab. 3.15.2 Key functions of MP

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3.15.14 Rack Equipment

3.15.14.1 Rack (R) for CP113 COMPACT

Fig. 3.15.16 Rack R:CP113C

F:PIOP 0

MUT09

MUT10

MUT04

Fuse panel, AD:RAL

MUT02

MUT03

MUT01

IOPG 2

Fans

F:PIOP 2

F:DEV (F)

IOPG 0

FU 01 03 05 07 09 11 13 15 17 19

02 04 06 08 10 12 14 16 18 20FU

FU Frame Units

01 F:DEV (F) MOD 0,MDD 0

02 F:PIOP 2 CAP 4

03 F:PIOP 0 CAP 2

04 F:PIOP 2 IOC 2

05 F:PIOP 0 IOC 0

06 F:PIOP 2 M:LAUB

07 F:PIOP 0 M:LAUB

08 F:PIOP 2 IOPG 2

09 F:PIOP 0 IOPG 0

12 --- Fans(MUT04)

13 F:PBC 0 BAP 0

14 F:PBC 0 CAP 0

15 F:PBC 0 BCMY 0

16 F:PBC 0 M:BCM 0

17 F:PBC 0 CMY 0

18 F:PBC 1 BAP 1

19 F:PBC 1 CAP 1

20 F:PBC 1 BCMY 1

21 F:PBC 1 M:BCM 1

22 F:PBC 1 CMY 1

23 F:PIOP 1 CAP 3

24 F:PIOP 3 CAP 5

25 F:PIOP 1 IOC 1

26 F:PIOP 3 IOC 3

27 F:PIOP 1 M:LAUB

28 F:PIOP 3 M:LAUB

29 F:PIOP 1 IOPG 1

30 F:PIOP 3 IOPG 3

31 --- Fanbox

32 --- Fans, optional(MUT08)

33 F:DEV (F) MOD 1,MDD 1

F:PIOP 3CAP5

IOPG 3

MUT05

MUT07F:PIOP 1

F:PBC 0 CMY 0

MUT08Fans

21 23 25 27 29 31

22 24 26 28 30

MUT11Fanbox

IOC3

CAP3

IOPG 1

IOC1

BAP0

CAP0

CAP2

IOC0

CAP4

IOC2

BCMY 0

MUT06F:PBC 1 CMY 1

BAP1

CAP1

BCMY 1

33

32

MOD0

MDD0

MOD1

MDD1

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3.15.14.2 Rack (R) for CP113 COMPACT RURAL

Fig. 3.15.17 Rack R:CP113 CE

F:SMSC 1

MUT07

MUT10

MUT08

Fuse panel, AD:RAL

MUT02

MUT04

MUT01

SMSC 0

Fans

F:SMSC 0

F:DEV (F)

SMSC 1

FU 01 03 05 07 09 11 13 15 17 19

02 04 06 08 10 12 14 16 18 20FU

FU Frame Units

01 F:DEV (F) MDD 0,MOD 0

02 F:SMSC 0 SMSC 0

04 F:SMSC 0 SMSC 0

05 F:PIOP 0 IOC 0

06 F:SMSC 0 SMSC 0

07 F:PIOP 0 M:LAUB

08 F:SMSC 0 SMSC 0

09 F:PIOP 0 IOPG 0

10 F:SMSC 0 SMSC 0

12 --- Fans(MUT08)

14 F:PBC 0 BAP 0

15 F:PBC 0 BCMY 0

16 F:PBC 0 M:BCM 0

17 F:PBC 0 CMY 0

19 F:PBC 1 BAP 1

20 F:PBC 1 BCMY 1

21 F:PBC 1 M:BCM 1

22 F:PBC 1 CMY 1

23 F:SMSC 1 SMSC 1

25 F:SMSC 1 SMSC 1

26 F:PIOP 1 IOC 0

27 F:SMSC 1 SMSC 1

28 F:PIOP 1 M:LAUB

29 F:SMSC 1 SMSC 1

30 F:PIOP 1 IOPG 1

31 --- Fanbox

32 --- Fans(MUT09)

33 F:DEV (F) MDD 1,MOD 1

F:PIOP 1 IOPG 1

MUT05F:PBC 0 CMY 0

MUT09Fans

21 23 25 27 29 31

22 24 26 28 30

MUT11Fanbox

IOC1

BAP0

BCMY 0

MUT06F:PBC 1 CMY 1

BAP1

BCMY 1

33

32

MUT03F:PIOP 0 IOPG 0

IOC0

MOD0

MDD0

MOD1

MDD1

PROC:CP113C/CR – 22 A30808-X3063-A403-2-7630



3.15.15.1 Fuse Assignment for R:CP113C

MUT Frame FU Plugposition

of supplyplug

Suppliedmodule

Mounting location ofthe supplied module

Allocated unit

01 AD:RAL 12 external devices, e.g.Tracer

31 external devices

02 F:PIOP(A) 02 C101 DCCMC C101 CAP 4

04 C127 DCCMC C127 IOC 2

06 C249 M:LAUB C153, C177, C199, C221 LAU

08 C337 DCCMC C337 IOPG 2



07 C249 M:LAUB C153, C177, C199, C221 LAU


04 FAN 12 F2 (-UE) FAN

05 F:PBC(A) 13 C101 DCCMC C101 BAP 0

14 C125 DCCMC C125 CAP 0

15 C151 DCCMC C151 BCMY 0

16 C159 M:BCM C167 M:BCM0

17 C339 DCCMC C339 CMY 0








27 C249 M:LAUB C153, C177, C199, C221 LAU





28 C249 M:LAUB C153, C177, C199, C221 LAU


Note: every fuse is 10 A

Tab. 3.15.3 Fuse Assignment R:CP113C

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3.15.15.2 Fuse Assignment for R:DEVB

3.15.15.3 Fuse Assignment to Fans

3.15.15.4 Fuse Assignment for R:CE (CP113 Compact Rural)

10 F:DEV(F) 01 DCCDA A056 MDD 0

DCCDA A049 MOD 0

33 DCCDA A122 MDD 1

DCCDA A115 MOD 1

11 FANBOX 31 X22 (-UE) FANBOX

MUT Equipment FU Ampere

04 MTD 05 10

07 MTD 02 10

10 DCIRC0 19 20

11 DCIRC1 20 20

Tab. 3.15.4 Fuse Assignment R:DEVB

Rack Fuse Fan in MUT Remarks

CP113C 12 04 Fan and external devices, e.g. HW tracer

32 08 Fan (if available)

31 11 Fan and external devices

Tab. 3.15.5 Fuse Assignment to fans


of supplyplug

Suppliedmodule


Allocated unit

01 AD:RAL 12 external devices

31 external devices


Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural)


of supplyplug

Suppliedmodule


Allocated unit


Tab. 3.15.3 Fuse Assignment R:CP113C

PROC:CP113C/CR – 24 A30808-X3063-A403-2-7630


02 F:SMSC(C) 02 DCCCR C101 SYP

04 DCCCR C153 CCG-0

06 SYPD-0/1

08 DCCDE C259 MB-0

10 C343 DCCMC C343 SN-0

11 ext. hooter/ ext.Alarms

03 F:PIOP(A) 03 C101 DCCMC C101

05 C127 C127 IOC-0

07 C249 C153, C177, C199, C221 LAU

09 C337 C337 IOPG-0

04 F:SMSC(C) 23 DCCCR C101 CDEX

25 DCCCR C153 CCG-1

27 DCCDE C259 MB-1

29 C343 DCCMC C343 SN-1











07 F:PIOP(A) 24 C101 DCCMC C101


28 C249 M:LAUB C153, C177, C199, C221 LAU




10 F:DEV(F) 01 DCCDA A056 MDD 0

DCCDA A049 MOD 0

33 DCCDA A122 MDD 1

DCCDA A115 MOD 1

11 FANBOX 31 X22 (-UE) FANBOX


of supplyplug

Suppliedmodule


Allocated unit


Tab. 3.15.6 Fuse Assignment for R:CE (CP113 Compact Rural)

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 25

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3.15.16 Memory Organization

Two different types of modules M:CMYM can be used in the CMY:

3.15.17 Sequence for Switching on the Modules in R:CP113C

3.15.17.1 Sequence for Switching on the Modules in R:CP113C

Serial Number Memory capacity of a CMYMmodule in Mbyte

..Q1256-X100 64

..Q1256-X200 128

Tab. 3.15.7 Memory organization

Fuse MUT Supplied module Mounting location ofthe supplied module

Allocated unit Frame Remark Remark

16 05 M:BCM C167 *) PBC0 Minimumconfiguration21 06 M:BCM C167 *) PBC1

15 05 DCCMC C151 BCMY0 PBC0


17 05 DCCMC C339 CMY0 PBC0


05 03 DCCMC C127 IOC0 PIOP Parallel

09 03 DCCMC C337 IOPG0 PIOP



07 03 M:LAUB C153, C177, C199, C221 LAU PIOP


*) Note: The fuses for M:BCM supply the DCCs on board. These DCCs supply the clock generator on the module directly,so that the clock generator is still able to work, even if the DCC of the corresponding BCMY is switched off or defective.

The LEDs of the modules M:BCM remain dark when these fuses are screwed in

Tab. 3.15.8 Sequence for switching on the modules R:CP113C

PROC:CP113C/CR – 26 A30808-X3063-A403-2-7630


3.15.17.2 Sequence for Switching on the Modules in R:CE

14 05 DCCMC C125 CAP0 PBC0 Extension

19 06 DCCMC C125 CAP1 PBC1

03 03 DCCMC C101 CAP2 PIOP











Allocated unit Frame Remark

16 05 M:BCM C167 *) PBC0

21 06 M:BCM C167 *) PBC1













Tab. 3.15.9 Sequence for switching on the modules R:CE


Allocated unit Frame Remark Remark



Tab. 3.15.8 Sequence for switching on the modules R:CP113C

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 27

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3.15.18 Displays on Module Faceplates

3.15.18.1 Displays after Successful Hardware Start-up


B:CMY-0 BCM MST green

CG0 green if selected/red if not

CG1 green if selected/red if not.one LED must be green, the other is automatically red

ILBS green if the ILB is resetred if the ILB is set

PIA MST green

PIA MST green

PIA MST green

PIA MST green

MTI MST green

B:CMY-1 BCM MST green

CG0 green if selected/red if not

CG1 green if selected/red if notone LED must be green, the other is automatically red

ILBS green if the ILB is reset red if ILB is set

PIA MST green

PIA MST green

PIA MST green

PIA MST green

MTI MST green

CMY-0 CMYC MST green

ILB0 green if the ILB is reset to B:CMY0red if the ILB is set to B:CMY0


CMYM0 MST green

CMYM1 MST green

CMYM2 MST green

CMYM3 MST green


PROC:CP113C/CR – 28 A30808-X3063-A403-2-7630


3.15.19 Commands for Creating CAPs

List of CAPs and corresponding PBI-numbers

• CR CAP:CAP=0,PBI=4;






CMY-1 CMYC MST green



CMYM0 MST green

CMYM1 MST green

CMYM2 MST green

CMYM3 MST green

BAP-0 PEX Display at the MPThe sequence of the BAP master is described in the proce-dure

(DY A925 if manually booted with BAP-0)

BAP-1 PEX Display at the MPThe sequence of the BAP master is described in the proce-dure

(DY A925 if manually booted with BAP-1)

IOC-0 PEX DY A385 Display at the MP (A1A5 is also possible)

MST green

ILB0 green if the ILB is reset to the B:CMY0red if the ILB is set to B:CMY0

ILB1 green if the ILB is reset to B:CMY1red if ILB is set to B:CMY1

IOC-1 PEX DY A385 Display at the MP (A1A5 is also possible)

MST green



IOP IOP:TA ******* * Time is displayed for approx. 5 mins. if the display keyis pressed

IOP:MB IBREQ green for a few minutes

IOP:UNI MST green



A30808-X3063-A403-2-7630 PROC:CP113C/CR – 29

CommissioningSystem

ITMN - OFFLINE

1 Check the Basic State (Preparation) of Racks R:CP113C / R:DEVB / R:CE

Check the basic state of the racks R:CP113C / R:DEVB / R:CE









3 Switch off DCCs

Switch off all DCCs

4 Check Mechanical Layout

Check racks and module frames (R:CP113C / R:DEVB / R:CE) to see if anyparts are touching, or if there is any foreign material or transport damage.

Check that all modules and cables are firmly in place

If any transport damage or damaged seals have been detected, the rack layout(R:CP113C and R:DEVB) / R:CE has to be checked against the equipment list.

Check the layout of the module frames and the standard cabling plan

Break module seal

Check connections between wire wrap field and chassis ground bus.

Check cabling against cable laying list A30808-A....-X...- * -33

5 Automatic Memory Setting

No manual memory setting is necessary for CP113C/CR.An address decoder is loaded when the voltage is switched on via the CMY-FW.This enables memory modules of the most differing level of component place-ment and DRAM layout to be mixed in a CMY.

The memory is distributed on one till four modules (M:CMYM0 - M:CMYM3).Two different types of modules can be used:

...... (see Tab.3.15.7)

The CMY has no set BCMY connection number in the hardware. This is allo-cated with the RESET incode from BCMY during the system run-up, and storesthem in the RAM of the MC and in ASIC MFC.

PROC:CP113C/CR – 30 A30808-X3063-A403-2-7630


6 Check Cabling of Fan Alarm Lines

Check cabling between AD:RAL and both IOP:TA ......(see Fig. 3.15.8)

Check switches for activating the alarm inputs in AD:RAL ......(see Fig. 3.15.8)

7 Test fans

Insert the following fuses (depending on the rack to be switched on) one afterthe other and switch on the fans:

Are the corresponding LEDs lit? Y h...9N h...8




9 Basic State DCCs

Make sure that all DCCs of the CP113C/CR are switched off

10 Switch on DCCs

To prevent module damage and because of clock synchronization the moduleframes are switched on in a special sequence:

Sequence for switching on the modules in R:CP113C ......(see Tab.3.15.8)

Sequence for switching on the modules in R:CE ......(see Tab.3.15.9)

Screw in the first (next) fuse (see table mentioned above).


R:CP113C FU 12 04 Fan and external devices e.g. HW Tracer

FU 32 08 Fan (if available)

FU 31 11 Fan and external devices


R:CE FU 12 08 Fan and external devices e.g. HW Tracer

FU 32 09 Fan (if available)

FU 31 11 Fan and external devices

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 31

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The following system responses are possible, according to the fuse screwed in:

• Fuse for M:BCM:The DCCs on board of the corresponding module M:BCM are supplied withsystem voltage but the LEDs on the module faceplate remain dark.

• Fuse for DCCMC:No system reaction until the corresponding DCC is switched on

• Fuse for M:LAUB:LEDs on the corresponding module M:LAUB light up

Switch on power with the switch on the assigned DCC module faceplates.(Except for M:LAUB and M:BCM which are directly connected to the fuse)

The following system responses are possible, according to the module switchedon:

• DCCMC:

– Green LED on the module faceplate of the DCCMC lights up

– The green LEDs of the DCCs for IOPG and IOC only light up if bothDCCMCs have been switched on

• DCCMC for BCMY0:


– LED on M:BCM in F:PBC0 lights green immediately

• DCCMC for BCMY1:


– LED on M:BCM in F:PBC1 lights yellow for approx. 5 sec. and then green

Does the LED of the module switched on light as shown in the preceding list? Y h...11N h...12

11 Decision: Next Module

Are all units listed in the table in operation? Y h...22N h...10

12 Fault Clearance

Switch off the voltage converter immediately and unscrew the assigned fuse



14 Replace Fuse




PROC:CP113C/CR – 32 A30808-X3063-A403-2-7630


16 Replace DCC



17 Decision Block: Module

Have all corresponding modules already been replaced? Y h...19N h...18

18 Replace the Corresponding Modules

Replace modules of the affected unit successively by spare modules.

If the green LED of the DCC is still not lit after replacing a module, the sparemodule has to be replaced with the original module again.

After each module replacement h...10


Is a cable the next unit to be cleared of faults? Y i....NM:CP113C/CR,TAB, CP0050

N h...21

20 Decision Block





22 Information Block: SCSI Bus

The cabling of the complete SCSI bus is shown in ......(see 3.15.11)

23 Switch on Magnetic Tape Device

Branch to one of the following MTD procedures according to the MTD used:

– Switching on MTD: STC 2925 of Storage Tek i....PROC:MTD:STC2925

– Switching on MTD: HP 88781 A of Hewlett Packard i....PROC:MTD:HP88781A

– After successful MTD start-up, continue: h...24

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 33

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24 Check Cabling of Disk Storage Unit (MDD)

The following cabling of the MDDs has to be checked:

• Correct connection of the power supply plug to the MDD

• Correct connection of the SCSI-bus cabling to MDD

For MDD HP C2490A (2,1 GByte), check cabling according to: ......NM:CP -Devices,MDDHPC2490A(2,1 GByte)

For MDD Quantum Atlas XP34550S (4,5 GByte), check cabling according to: ......NM:CP -Devices, MDDXP34550S(4,5 GByte)

25 Check Switch Settings of Disk Storage Unit (MDD)

For MDD HP C2490A (2,1 GByte): check that switch settings are set accordingto:

......NM:CP -Devices, MDDHP C2490A(2,1 GByte)

For MDD Quantum Atlas XP34550S (4,5 GByte): check that switch settings areset according to:

......NM:CP -Devices, MDDXP34550S(4,5 GByte)

26 Check Cabling of MODs

Check the following cable connections of the MODs:

• Correct attachment of the power supply plug to the MOD

• Correct attachment of the power supply plug to the MOD-fan

• Correct attachment of the SCSI bus cabling

For MOD Sony SMO-F531 (1,3 GB) check cabling according to ......NM:CP -Devices,MOD SonySMO-F531

For MOD Sony SMO-F541 (2,6GB) check cabling according to ......NM:CP -Devices,MOD SonySMO-F541

PROC:CP113C/CR – 34 A30808-X3063-A403-2-7630


27 Check Settings of the MODs

Check the following settings of the operation mode plug of the MODs:

• Check the setting to the correct SCSI address (SCSI-ID 2)

• Check the correct jumper setting in the operation mode plug for deactivatingthe internal terminating resistor (Depending on the SCSI devices connected)

For MOD Sony SMO-F531 (1,3 GB) check settings according to ......NM:CP -Devices,MOD SonySMO-F531

For MOD Sony SMO-F541 (2,6GB) check settings according to ......NM:CP -Devices,MOD SonySMO-F541

28 Screw in Fuse

Screw in fuse for MDD-0 and MOD-0(One fuse supplies the DCCs of both devices)

......(see 3.15.15)

29 Switch on MDD-0

Switch on DCC for MDD-0 ......(see 3.15.15)


LED of the MDD lights up

30 Switch on MOD-0

Switch on DCC for MOD-0 ......(see 3.15.15)


MOD fan starts up


31 Screw in Fuse

Screw in fuse for MDD-1 and MOD-1(One fuse supplies the DCCs of both devices)

......(see 3.15.15)

32 Switch on MDD-1

Switch on DCC for MDD-1 ......(see 3.15.15)


LED of the MDD lights up

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 35

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33 Switch on MOD-1

Switch on DCC for MOD-1 ...... (see 3.15.15)


MOD fan starts up


34 Installation of PC

Information about the inverter:The 230V outputs of the inverter (230V, 500 VA) are floating.Before switching on the inverter one line of the 230V output has to be grounded.Normally the grounding is already done by the manufacturer but has to bechecked again now.

Check / establish the correct grounding of the inverter ...... (see Fig. 3.15.6)

Switch on the inverter for the PC.(To this inverter no further PCs can be connected)

...... (see Fig. 3.15.7)

Installation of the PC according to ......MMN:PC -BASIS

– After the PC has been installed and a CP session opened h...35

35 Connecting the Maintenance Panel

The Maintenance Panel (MP) can be connected in any order with up to threeunits and the voltage supply of any unit of the CP113C/CR. An interference ofactive units by a non-initialized MP is excluded.

Connect the Maintenance Panel to the voltage supply on the front panel plug ofany DCCMC voltage converter of the CP113C/CR.

After connecting the operating voltage to the MP, self-tests are first carried outby the FW.After a successful test the following text is displayed on the MP:

**************************

* *

* MP:CP113C, FW xxxx *

* Selftest OK !! *

* -------------------- *

* Hit any key to start *

* *

**************************

FW xxxx identifies the current firmware version

Has the self-test been terminated successfully? Y h...37N h...36

PROC:CP113C/CR – 36 A30808-X3063-A403-2-7630


36 Fault Clearance

Carry out fault clearance according to the instructions of the MP, given in ......NM:CP113C/CR,TAB


37 Diagnosis 0 CMY

The off-line diagnostics must be carried out on both CMYs one after the other.

Connect the maintenance panel via the front panel plug to the module M:BCMof both BCMYs and to the M:CMYC module of the CMY to be tested.

The interface lock bits of the CMY to be tested must be set to both BCMYs asfollows.

Select BCMY0 with the "SELECT UNIT" key.

Enter the command "SILBM0" ("SILBM1") with the menu keys for setting theinterface lock bits to the CMY0 (CMY1).


Enter the command "SILBM0" ("SILBM1") with the menu keys for setting theinterface lock bits to the CMY0 (CMY1).

The interface lock bits of the CMY0 (CMY1) are set to both BCMYs.

Select CMY with "SELECT UNIT" and enter the command "RESET" for theCMY with the menu key.

The module is reset (otherwise the diagnostic command is ineffective).

Enter the command "DIAG0" for the CMY with the menu keys.

Diagnostics 0 is started (complete CMY diagnostics). The LED MST on moduleM:CMYC flashes green. (Diagnostics ends after approx. 10 seconds, even if theLED continues to flash).

The diagnostics result can be found in the fourth entry of the trace RAM.

Enter the command "TRINF" for the CMY with menu keys.**************************

* *

* CMYx < list > TRINF *

* Show trace RAM *

* FAILNR 4: 5AAA5AAA * <- positive pattern after the diagnostics

* disp ---- ++++ end *

* *

**************************

Is "5AAA5AAA" displayed for FAILNR? Y h...39N h...38

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 37

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ITMN - OFFLINE

38 Fault Clearance

Carry out fault clearance according to i ...NM:CP113C/CR,TAB:CP053


39 Diagnosis 2 CMY

Enter the "RESET" command for the CMY with the menu keys

The module is reset (otherwise the diagnostics command is ineffective)

Enter the "DIAG2" command for the CMY with menu keys (diagnostics of theCMY memory medium)

Diagnostics 2 is started (diagnostics of the CMY memory medium). The LEDMST flashes green on module M:CMYC. (The diagnostics ends after approx. 10secs., even if the LED continues to flash).



* *


* Show trace RAM *

* FAILNR 4: 5AAA5AAA * <- positive pattern after the diagnostics

* disp ---- ++++ end *

* *

**************************

The diagnostics 2 can be restarted by repeatedly entering the DIAG2 command.Diagnostics 3 can only be started if the diagnostics 2 has ended with faults.

Is "5AAA5AAA" displayed for FAILNR? Y h...41N h...40

PROC:CP113C/CR – 38 A30808-X3063-A403-2-7630


40 Diagnosis 3 CMY

Enter the "RESET" command for the CMY with the menu keys

The module is reset (otherwise the diagnostics command is ineffective)

Enter the "DIAG3" command for the CMY with menu keys

Diagnostics 3 is started (localizing the defect RAM chip). The LED MST flashesgreen on the M:CMYC module. (The diagnostics ends after approx. 10 secs.,even if the LED continues to flash).



* *


* Show trace RAM *

* FAILNR 4: * <- Result after the diagnostics

* disp ---- ++++ end *

* *

**************************

Make an evaluation of the track numbers and carry out fault clearanceaccording to

i....NM:CP113C/CR -TAB:CP0053


41 Reset Interface Lock Bits

Enter the "RESET" command for CMY with the menu keys


Enter the command "RILBM0" ("RILBM1") with the menu keys for resetting theinterface lock bits to the CMY0 (CMY1).


Enter the command "RILBM0" ("RILBM1") with the menu keys for resetting theinterface lock bits to the CMY0 (CMY1).

The interface lock bits of the CMY0 (CMY1) are reset again.

Has the off-line diagnostics been carried out at both CMYs? Y h...43N h...42

42 Decision Block: other CMY

– Repeat CMY-diagnosis for other CMY (Carry out the details in parentheses) h...37

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 39

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ITMN - OFFLINE

43 Off-line Diagnostics IOC

Off-line diagnostics must be carried out for IOC0 and IOC1 as well as otherIOCs in case expansion module frames are available.

The command "NOTEST" switches off the supervisory circuit (comparator in theM:PEX module). The command "NOTEST" can therefore only be used for testpurposes when fault clearing.

The command "RESET" releases an impulse in the RESET line.

The "DIAGP" command releases an impulse in the RESET and the BOOT linewhich starts the processor diagnostics.

Connect the maintenance panel via the front panel plug of the M:PEX module(plug position 700) with the IOC to be tested.

Select the IOC to be tested with the "SELECT UNIT" key.

Enter the command "RESET" for the IOC with the menu keys.

Enter the command "DIAGP" with the menu keys.

The off-line diagnostics is started. The LED MST on module M:PEX flashesgreen.

" DY 3AAC" appears in the display of the maintenance panelwhen the diagnostics has run fault-free.

Has “ DY 3AAC” been displayed? Y h...45N h...44

44 Fault Clearance

Make an evaluation of the track numbers and carry out fault clearanceaccording to

i ...NM:CP113C/CR,TAB:CP0052


45 Decision: Next IOC

Has the off-line diagnostics been carried out for all IOCs? Y h...46N h...43

PROC:CP113C/CR – 40 A30808-X3063-A403-2-7630


46 Off-line Diagnostics IOP:UNI

This off-line diagnostics must be carried out for all M:IOP:UNI modules.

The interfaces to the devices are not tested by the test program, but only theIOP:UNI. This test includes all test/diagnostics programs which do not accessB:IOC.

The interfaces are only tested by the device tests so that in case there is a faultonly the device and not the IOP:UNI is taken out of service.

After the off-line diagnostics are carried out the IOP must be reset with RESET.

Connect the maintenance panel via the front panel plug with the M:IOP:UNI ofthe IOP:UNI to be tested.

Select the IOP:UNI to be tested with the "SELECT UNIT" key.

Enter the command "RESET" with the menu keys.

IOP:UNI is reset

Switch to extended display on the MP by pressing the "disp" key.

Enter the command "DIAG" with the menu keys.

A short diagnostics procedure is started in the IOP:UNI

"NO FAULT FOUND" appears in the MP display.

If a fault has been found, the LED MST of the IOP:UNI lights red and a faultmessage appears in full text in the MP display.

Has the off-line diagnostics been ended without faults? Y h...48N h...47

47 Fault Clearance

Evaluate the fault messages of the MP and clear faults accordingly.


48 Reset IOP:UNI

Enter the "RESET" command for the IOP:UNI with the menu keys at the MP.

The IOP:UNI is reset.

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 41

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ITMN - OFFLINE

49 Off-line Diagnostics IOP:TA

The IOP:TA must be inactive before starting off-line diagnostics.This means that a value other than "AC" must be displayed in the status displayof the M:IOP:TA module.

Press the diagnostics key on the front panel of the M:IOP:TA moduleuntil decimal points appear in the "Status" display.

Diagnostics is started (approx. 7 sec.)"OF" appears in the "Status" display.The progress of the diagnostics is shown in the display "Minutes" (00 - 9D)

"PU" or "IA" appears in the "Status" display after successful diagnostics (withoutCCG the "CF" message appears). The "Hours" display must not indicate "FF".


50 Fault Clearance

Evaluate the display and carry out fault clearance according to i ...NM:CP113C/CR,TAB, CP0054


51 Decision: IOPAUC

The IOPAUC is only used in CP113C of AC (authentication center)

Is there at least one IOPAUC in use Y h...52N h...54

52 Off-line diagnostics of IOPAUC

Press the RESET key on the front panel of the IOPAUC module

The progress of the test is indicated via the LEDs of the IOPAUC

– For evaluating the LED displays of the IOPAUC see i ...NM:CP113C/CR,TAB, CP0054


53 Fault clearance

Carry out fault clearance according to i ...NM:CP113C/CR,TAB, CP0054


PROC:CP113C/CR – 42 A30808-X3063-A403-2-7630


54 Prepare BAP Hardware Start-up

Switch off the DCCs connected to BAP-0 and BAP-1, if not already done

55 Information about BAP Hardware Start-up

The fuses for the voltage converters BAP0 and BAP1 must both be screwed inbefore switching on the voltage converter.

After switching on the voltage converter there is a sequence of initializing andtest programs (HW start-up) in the individual processors).The BAP where the power is switched on first becomes MASTER, but only oncondition that this BAP is fault-free. The MP should be connected to the BAPmaster and the corresponding IOC before switching on the voltage converter,because track numbers are used for displaying the boot status and are shownon the MP display if the MP is connected.

For start-up with the APS, the following units have to be connected to a B:CMY(is displayed by reset interface lock bits (LED ILB = green is displayed).

• one BAP (ILB LED on module PEX)

• one IOC (ILB LED on module PEX)

• one CMY (ILB LED on module CMYC)

Ensure that one IOP:UNI (for the connection from MDD and PC) can bereached via the IOC connected to the B:CMY, and that it has the status shownin:

......(see Tab.3.15.10)

The BAP, which becomes MASTER, first formats both CMYs.Display at the MP: " DY A885" for BAP master.

Then it initializes IOC0/1Display at the MP: " DY A8A5",...," DY A8B5",...," DY A8C5" for BAP master'

When “ DY AB05” (“ DY AD05”) is displayed, the test APS is already beingloaded from one of the disks (MDD-0 or MDD-1).

Displays on the other module panels, or on the MP display after initialization (incase no fault is found in the processors during the HW start-up):

......(see Tab.3.15.10)

56 Switch on BAP0 and BAP1

Screw in the fuses for the DCCs of BAP-0 and BAP-1

Switch on DCCs for BAP0 and BAP1

Are the green LEDs on both DCC modules lit? Y h...67N h...57

A30808-X3063-A403-2-7630 PROC:CP113C/CR – 43

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57 Fault Clearance

Switch off the DCC on which the LED is not lit immediately and unscrew therelevant fuse. After a successful test start-up, remove the fault from the defec-tive unit with the test APS (provided a BAP can load the APS).

– If only one BAP is defective, continue h...67– If both BAPs are defective, the errors must be removed immediately h...58



59 Replace Fuse




61 Replace DCC



62 Decision Block: PEX

Has the corresponding PEX already been replaced? Y h...64N h...63

63 Replace PEX

Replace the corresponding PEX with spare module.

Mark the replaced module as defective h...56


Is a cable the next unit to be cleared of faults? Y i ...NM:CP113C/CR,TAB, CP0050

N h...66

65 Decision Block


PROC:CP113C/CR – 44 A30808-X3063-A403-2-7630





67 Decision: Start-up With test APS Possible

Has the system been configured to allow start-up with the test APS? Y h...92N h...68

68 Decision: Other BAP MASTER

– If no start-up with the other BAP as MASTER has been attempted the start-up has to be repeated with switching on the DCCs of BAP-0 and BAP-1 in adifferent order h...54

– If a start-up with the other BAP as MASTER has already run through amanual start-up must be attempted h...69


It is best to carry out the manual recovery in the following way:

• The access to the bus is taken from one of both BAPs. This can be bestachieved by switching off the processor.

• Afterwards the BOOT key on the front panel of the M:BCM module allocatedto the other BAP must be pressed.

• Only after successful installation is the BAP to be switched on again andconfigured.

Switch off BAP-1 (BAP-0).

Activate the BOOT key on the front panel of the M:BCM module in the F:PBC0for BAP-0 (F:PBC1 for BAP-1).

After switching on the voltage converter the initialization and test programs runin the individual processor (HW recovery).Track points which are shown on the MP display are used to display the bootstatus. The MP also must be connected to the BAP master and the corre-sponding IOC before switching on the voltage converter.The BAP-0 (BAP-1) becomes MASTER.

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For start-up with the APS, the following units have to be connected to a B:CMY(is displayed by reset interface lock bits (LED ILB = green is displayed).

• one BAP (ILB LED on module PEX)

• one IOC (ILB LED on module PEX)

• one CMY (ILB LED on module CMYC)

Ensure that one IOP:UNI (for the connection from MDD and PC) can bereached via the IOC connected to the B:CMY, and that it has the status shownin:

...... (see Tab.3.15.10)

Displays on the other module panels, or on the MP display after initialization (incase no fault is found in the processors during the HW start-up): ...... (see Tab.

3.15.10)

Has the system been configured so that start-up with the test APS is possible? Y h...71N h...70




71 Manual Start-up Part 2IPL113: MANUAL START - CURRENT CONFIGURATION

UNIT STATUS TEST

********************************************













Is the preceding message output? Y h...77N h...72

72 Decision: Check IOP:UNI / Cabling to PC

Have the device settings on module IOP:UNI and the cable connections to thePC already been checked? Y h...73

N h...74

PROC:CP113C/CR – 46 A30808-X3063-A403-2-7630


73 Decision: Manual Start-up with Second BAP



74 Check Cabling to PC

Check and if necessary replace connecting cable to the PC or change plug posi-tion

75 Check Device Data in the IOP:UNI

Connect the MP to the front panel of the M:IOP:UNI module.

Call up the IOP:UNI with the "SELECT UNIT" key.

Enter the "SHOWCF" command with the menu keys.

The device data of the IOP:UNI are displayed.

Are the device data correctly set? Y h...54N h...76

76 Modify Device Data in the IOP:UNI

Transmit the "CONFIG" command with the menu keys.

Modify or regenerate the device settings with the "mod" or "crea" keys.

After modifying the device settings, the modifications must be retrieved bypressing the "ok" key.(The configuration can be interrupted without any modification by pressing the"end" key)

– After modifying the device settings h...54

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Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS






Enter “MAN;” and press <ENTER>IOC-0 MDD : BZS/AKD AND GENERATION LIST

IOC-1 MDD : BZS/AKD AND GENERATION LIST

The current generation list is output:

xxxxxxxxxxxxxx

99999999 xxxxxxxxxxxxxxxxxxxxx

MANUAL RECOVERY - LOADING VIA IOC : “IOC-0;/IOC-1;”

Enter “IOC-0;” or “IOC-1;” and press <ENTER>LOAD.DEV. - *MDD* -GENERATION TO LOAD :”NAME;” (8 CHAR)

Enter the current APS generation 8 characters (in APS documentation or at theplace marked 9999999 in the generation list printed out previously).

Enter 'Generation-No.' and press <ENTER>

If the APS version is unknown and cannot be found out, enter *. For safetyreasons this must be repeated 3 times after system enquiry.

MANUAL RECOVERY - LTG LOADING : “Y;/N;”

Enter "N;" and press <ENTER>

Manual start-up is initiated.

The track numbers to be run through which are shown in the MP display for theBAP master are shown in block: ...... (see 55)

To make things clearer, only the headline is given for the system messages.

Wait for the following system message:ALL DOUBLE FILES SYNCHRONIZED

Was the manual start-up with the test APS successful? Y h...78N h...79

78 Second BAP

Switch on the second BAP again h...94

PROC:CP113C/CR – 48 A30808-X3063-A403-2-7630


79 Decision: Manual Start-up with other BAP

Has the manual start-up been attempted with another BAP? Y h...81N h...80

80 Boot Key

Repeat the entire sequence with the other BAP (Details in Parentheses) h...69

81 Decision: Manual Start-up via IOC-1

Branch to one of the following blocks

– Repeat manual start-up via IOC-1, if not already done h...69– If manual start-up via IOC-1 has already been attempted h...82

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82 START / UTILITY

When working with the IMON, ensure that the PC can be reached via the IOCspecified in the Start Utility.

Switch off BAP-1 (BAP-0)

Press the BOOT key on the front panel of the M:BCM module in the F:PBC0 forBAP-0 (F:PBC1 for BAP-1).IPL113: MANUAL START - CURRENT CONFIGURATION

UNIT STATUS TEST

********************************************













– If the preceding message did not appear h...72Enter “;” and press <ENTER>IPL113: MANUAL START ENTER PARAMS






Enter “UTI;” and press <ENTER>UTILITY - RECOVERY - DEVICE - TYPE TO USE : “MDD;/MTD;/MOD;”

Enter “MDD;” and press <ENTER>UTILITY - RECOV. - LOAD FROM MDD VIA : “IOC-0;/IOC-1;”

Enter “IOC-0;” or “IOC-1;” and press <ENTER>PLEASE ENTER UTILITY - FILE - NAME

Acknowledge this message with “SY.INSTALL”IMON : V0031 START

IMON : ENTER COMMAND

Was it possible to start IMON? Y h...84N h...83

PROC:CP113C/CR – 50 A30808-X3063-A403-2-7630


83 Fault Clearance

Check connection of MDD to IOP:UNI according to ......NM:CP -Devices, MDDHP C2490A(2,1 Gbyte)

Check switch settings and cable connections in the MDD against the manufac-turer's documentation.


84 Display Disk Contents

Display disk contents with the following commands:DISP MDDIR:DEVIN=010C01; (for MDD-0)

DISP MDDIR:DEVIN=030C01; (for MDD-1)

All disk files of MDD-0 (MDD-1) are displayed

Branch to one of the following blocks according to the files displayed

– If all system files are present continue h...85– If not all system files are present the files must be copied again from tape to

disk. System test with test APS must be omitted h...98

85 Decision: BAP Off-line Diagnostics

Have BAP off-line diagnostics been carried out? Y h...86N h...87

86 Branch according to Off-line Diagnostics

– If all off-line diagnostics have been terminated without error, one or moresystem files have probably been destroyed. In this case the test with the testAPS must be omitted h...98

– Otherwise h...9

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87 Prepare BAP Off-line Diagnostics (Special Fault Clearance)

The off-line diagnostics must be carried out in both BAPs.

After connecting the MP at the front panel plug of the M:PEX module the off-linediagnostics can be started with the command "DIAGP".The test is made parallel, i.e. the test programs are processed synchronously inboth halves of the processor. The comparator between both halves whichcauses a resetting of the processor in the case of disparity, is generally locked.It is only released for special test stages. The comparison between theprocessor halves runs via the software.

The processor is reset with the "RESET" command. (Impulse on the RESETline)

The diagnostics is started with the "DIAGP" command. (Impulse on the RESETand the BOOT line)

The register contents, not only the leading but also the current processorhalves, are displayed on the MP display.

The content of the diagnostics register is the same when PU-0 and PU-1 reachthe same result for an audit within a BAP.

Switch off the DCCs connected to BAP0/1

Connect the maintenance panel with BAP0 and BAP1 via the front panel plug ofthe M:PEX module.

Switch on DCCs connected to BAP0/1

An initialization program runs in both BAPs

Does the display on the MP show " DY A435" for at least one BAP? Y h...89N h...88


Carry out special fault clearance according to i ...NM:CP113C/CR -TAB, CP0052


89 Start BAP Off-line Diagnostics

Select the BAP with the "SELECT UNIT" key for which "DY A435" wasdisplayed.

Transmit the "DIAGP" command with the menu keys for this BAP.

The off-line diagnostics are started. After the diagnostics have run fault-free "DY 3AAC" is displayed.

Is “ DY 3AAC” displayed? Y h...91N h...90

PROC:CP113C/CR – 52 A30808-X3063-A403-2-7630


90 Fault Clearance

Analyze the track numbers and clear faults using i....NM:CP113C/CR -TAB, CP052


91 Check Internal Cabling

The BAP(s) is/are OK. The fault is in the cabling between BAP-0/1 and BCMY-0/1, or in the cabling between BCMY-0/1 and CMY-0/1 or in the CMY-0/1.

Check the internal cabling of the R:CP113C / R:CE against the cable laying list

– If any faults have been found in the internal cabling, remove faults andcontinue h...54

– If no faults have been found in the internal cabling, evaluate and clear faultsaccording to i....NM:

CP113C/CR-TAB, CP052


92 Software Start-up with Test APS

The SW recovery begins as soon as the display on the MP for the BAP masterjumps from " DY Axx5" to " DY Bxx4". (xx - different track points of the recovery)

The following track points (among others) run trough:

– ‘DY Bx34‘

– ‘DY Bx54‘

– ‘DY Bx74‘

– ‘DY Bx94‘

or: ‘DY Dxx2‘ or ‘DY Exx1‘ (changes every 4 s)(xx-arbitrary, with:

– 'Dxx2' the call processing load is shown in Erl.

– 'Exx1' the entire processor load in percent)

Have the track points shown above been run trough? Y h...93N h...69

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93 System Messages

To make things clearer, only a headline is given for system messages.

If start-up with test APS was successful the following message is output:ALL DOUBLE FILES SYNCHRONIZED

Wait for system message

Branch to the following blocks according to the system reaction:

– ALL DOUBLE FILES SYNCHRONIZED is displayed h...94– Any other message is displayed h...69– No message is displayed h...74

94 Enter USER-ID and Password

USER-ID and password will be interrogated.For the first OMT “EWSD0” and for further OMTs “EWSD1”, “EWSD2”,“EWSD3” has to be entered as USER-ID.The password is “SYSTEM-1”.(All inputs in capital letters)

Enter USER-ID and password

95 Enter Date and Time

Enter date and time:

b ENTR TIME:DATE=yy-mm-dd,TIME=hh-mm-ss,WD=xx;

Secure time:

b CORR TIME:MODE=SECURE;

96 Check Fan Alarms

Switch off the individual fans in each fan module by the switches on themodules. After about 5 secs. a system message must be output.

System message fan alarm

Switch on fans again (do not wait for longer than 5 mins.)

Was it possible to generate this message from each fan module? Y h...98N h...97

!Caution:Do not leave the fans switched off for longer than 5 mins. as racks warm up rapidly, endangering compo-nents.

PROC:CP113C/CR – 54 A30808-X3063-A403-2-7630


97 Fault Clearance: IOP:TA

Prerequisites:Cabling between fans and AD:RAL / between AD:RAL and IOP:TA has beencontrolled according to: ......(see Fig. 3.15.

8)

Perform fault clearance of IOP:TA according to the MMN.


98 Install Hardware APS

The following is necessary before installing the hardware APS:

• error-free configuration of CP113C/CR with the test APS

• APS documentation

Observe the notes in the APS documentation supplied.

Note:The APS installation is to be carried out according to procedure SW140 (if deliv-ered on Tape) or according to procedure SW141 (If delivered on MOD).

Install the APS, using one of the following procedures (According to the mediumon which the APS is delivered).

– For APS delivered on tape h...NM:SW,PROC:SW140

– For APS delivered on MOD h...NM:SW,PROC:SW141

END

A30808-X3063-A403-2-7630 PROC:MTD_STC2925 – 1

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3.16 Switching on MTD STC 2925 of Storage Tek

MTD:STC2925

3.16.1 Introduction

• The scope of delivery of the magnetic tape device STC 2925 of Storage Tek containsa user manual: “2925 SCSI Maintenance Manual”


1 Check cabling to IOP:UNI

Check that interface cables to the IOP:UNI are connected according to ......NM:CP-MTD:STC 2925

2 Check switch settings

Open the door of MTD

Turn POWER switch at the front of the MTD to OFF

Unscrew the cover of MTD module frame (using special tool Torx 15) andremove foam rubber in front of the modules.

Unplug the IF card of the MTD

The switch settings must be checked or set according to ......NM:CP-MTD:STC 2925

Reconnect the IF card

Unplug the CS card of the MTD

The switch settings must be checked or set according to ......NM:CP-MTD:STC 2925

Reconnect the CS card

Replace the foam rubber in front of the modules and screw on the cover of theMTD module frame



PROC:MTD_STC2925 – 2 A30808-X3063-A403-2-7630


3 Switching on main supply switch/ cleaning tape path

Open the cover of the tape path

Before testing the MTD, cleaning must be carried out according to the instruc-tions given in

......MMN:CP113C/CR-MAINTMTD STC 2925


If the cover does not close tightly due to a physical defect, the magnetic tape willnot be automatically threaded. In this case spare catches must be obtained andexchanged. ......MMN:

CP113C/CR-MAINTMTD STC 2925

Close the cover of the tape path

Switch on main supply switch at the rear of the MTD, if not already done

The location of the main supply switch is given in: ......NM:CP-MTD:STC 2925

4 Switch on magnetic tape device

A short self-test is carried out after switching on the power. Operating or hard-ware faults are shown on the MTD display. An explanation of the fault numbersis to be found on the inside of the MTD door, or in Section "2925 SCSI FCD”(Fault Code Dictionary 2925 with SCSI Interface) of the manual that is supplied.

The tape leader must be cleanly cut, i.e. not have a plastic threading end (cut offwith a special tool) as this prevents the tape from being guided when it isthreaded in. If automatic tape threading is not possible, e.g. at altitudes over1.800m, it must be threaded by hand. Manual threading is started by pressingthe LOAD-REW key twice. The magnetic spool must be turned so that the tapeis inserted into the suction opening. If SHUT DOOR is displayed on the MTD,ensure that the MTD door is properly closed.

Screw in fuse for MTD (in R:DEVB)

Close MTD door

Put POWER switch to ON position

If the self-test completes without finding a fault, - - - - is displayed.

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5 Diagnose magnetic tape device

The following inputs relate to the MTD keyboard

Open the MTD door

Insert a fault-free empty tape with a write enable ring, but do not load (ScratchTape)

Press <ENTER DIAG> enter '1 0' and then press <ENTER>

The last input starts the complete MTD device diagnostics. The magnetic tape isautomatically loaded after internal checks are carried out. Read/write tests withboth recording densities are then made. After a positive run the diagnostics endwith - - - - on the display. If there is a fault, a fault number is displayed. Detailsabout the cause of the fault together with fault numbers are listed in the STCManual, Section "2925 SCSI FCD” (Fault Code Dictionary 2925 with SCSI Inter-face) . Fault clearance is explained in the section for Maintenance,Removal/Replacement, Diagnostics in the STC Manual.

Is - - - - displayed after the diagnostics? Y h...7N h...6

6 Fault clearance

Carry out fault clearance as described in STC Manual, sections Maintenance,Removal/Replacement, Diagnostics


7 Check Tape

Open MTD door


Press the door contact (below left) with a pen or any other suitable tool and holdit down

Press <ENTER DIAG>, enter '47' and then press <ENTER>

The tape is written to with higher recording density 6250 BPI and read in theREAD AFTER WRITE MODE.

The following 2 system responses are possible:

• If the magnetic tape is fault-free, it is wound back when the end-of-tape mark(EOT) is recognized.

• If the magnetic tape is faulty, “47B” or “47C” is shown in the MTD-Display(In this case the tape cannot be used)

Is the tape fault-free? Y h...8N h...9

PROC:MTD_STC2925 – 4 A30808-X3063-A403-2-7630







Rewind tape


Tape must not be used anymore



END

A30808-X3063-A403-2-7630 PROC:MTD_HP – 1

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3.17 Switching on the MTD HP 88781A of Hewlett Packard

MTD:HP 88781A

3.17.1 Introduction

• The scope of delivery of the magnetic tape device HP88781A contains a usermanual: “Tape Drive User´s Guide”.


• For fault clearance of the magnetic tape device a service manual, Part No.: 88781-90030 can be obtained from HP.

• The magnetic tape device has only two jumpers on the SCSI-interface module whichhave to be set. All other settings can be input at the control panel.

The configuration data of the magnetic tape device can be saved on a magnetic tapeor can be read in from a save tape.The device settings are stored in a non volatile memory. This memory is supplied bya 3V battery on the buffer module.(Lifetime of the battery approx. 10 years - type: BR 2335)

• The magnetic tape is to be threaded manually

• The door has to be closed after threading the magnetic tape

• The tape is automatically wound to the beginning-of-tape mark and the MTDswitches to the ONLINE state

• During ONLINE state the door is always locked

• The door can be unlocked by pressing the RESET key (ONLINE-display is switchedoff)

All inputs in the following procedure relate to the MTD keyboard

1 Check cabling to IOP:UNI

Check wether interface cables to the IOP:UNI are connected according to ......NM:CP-MTD:HP

2 Switch off power supply

Switch off power supply switch at the front of the MTD

Switch off power supply switch at the rear of the MTD

The location of the power supply switches is given in: ......NM:CP-MTD:HP

PROC:MTD_HP – 2 A30808-X3063-A403-2-7630


3 Check/set jumper settings on SCSI-interface module

Unscrew the six screws (Torx 25) of the Interface module at the rear of the MTDand take it out (Jumpers are located on the Interface module)

......NM:CP-MTD:HP

Use grounding strap (According to ESD regulations)

Check or set the settings of the two jumpers according to: ......NM:CP-MTD:HP

Mount the Interface module at the rear of the MTD again

4 Switch on power supply/clean tape path

Plug in Hubbel-plug (Power supply) at the rear of the MTD ......NM:CP-MTD:HP

Plug in Interface-cable (The fasten plug (grounding) is not plugged in for thisMTD)

......NM:CP-MTD:HP

Screw in MTD fuse

Switch on power supply switch at the rear of the MTD ......NM:CP-MTD:HP

Open MTD door

Switch on power supply switch at the front of the MTD

Clean tape path, instructions are given in: ......MMN:CP113-MAINTMTD HP


5 Check Device-Address

(The Device-Address (SCSI-ID) has to be set to 4)

b Press RESET keyDisplay: READY

b Press OPTION keyDisplay: TEST *

b Press NEXT key until ID * is displayed

b Press ENTER keyDisplay: ID 4

ID 4 indicates, that ID is set to 4

Has ID 4 been displayed? Y h...7N h...6

A30808-X3063-A403-2-7630 PROC:MTD_HP – 3

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6 Set Device-Address

b Press NEXT or PREV key until 4 is displayed

b Press ENTER keyDisplay: SET 4

b Press OPTION keyDisplay: READY

7 Information block: Configuration data

The device settings are stored in a non volatile memory. This memory issupplied by a 3V battery on the buffer module.(Lifetime of the battery approx. 10 years - type: BR 2335)

The configuration data of the MTD are already adapted to the system fordelivery of the complete EWSD-exchange.In case a magnetic tape device has to be replaced, the configuration data canbe saved to a save tape beforehand.This save tape must for safety reasons be set up directly at the time of thesystem initial switch on.

8 Load magnetic tape to save the configuration data

Load a small magnetic tape to save the configuration data and close the door.

Tape will be positioned to the beginning-of-tape mark (BOT), MTD switches toONLINE

Has the tape already been configured to save the configuration data? Y h...10N h...9

PROC:MTD_HP – 4 A30808-X3063-A403-2-7630


9 Prepare save tape for configuration data (Test 150)

b Press RESET key

b Press OPTION key

b Press NEXT key until TEST * is displayed

b Press ENTER keyDisplay: TEST 0 (number 0 is blinking)


b Press ENTER keyDisplay: ONCE *

b Press ENTER keyDisplay: A 6250 (Number 6250 is blinking indicating the recording

density)

b Press ENTER keyDisplay: RUN 150 (After termination PASS 150)

Magnetic tape has been written to with recording density of 6250 BPI andrewound

b Press OPTION keyDisplay: BOT

10 Saving configuration data (Test 128)

b Press OPTION key

b Press NEXT key until TEST * is displayedDisplay: TEST *

b Press ENTER keyDisplay: TEST 0 (Number 0 is blinking)



b Press ENTER keyDisplay: RUN 128 (After termination PASS 128)

Magnetic tape has been written to

b Press OPTION keyDisplay: IDLE

b Press REW/UNLD key (Tape is rewound)Display: BOT

b Press REW/UNLD key (Tape is completely rewound)Display: UNLOAD, READY

Unload tape, label and store it

A30808-X3063-A403-2-7630 PROC:MTD_HP – 5

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11 Off-line-Diagnosis of magnetic tape device (Test 1)

Open MTD-door

Insert a fault-free empty tape with write enable ring (Scratch Tape)

A small magnetic tape is sufficient for the diagnosis, because the time for thediagnosis increases with the tape length.

Close MTD door. (Tape is loaded, door is locked, MTD switches to ONLINE)

b Press RESET key (Display ONLINE switched off)

b Press OPTION key and select the Function TEST * with the NEXT key (if TEST* is not displayed automatically)Display: TEST *


b Select Number 1 with NEXT key (Test 1)


b Press ENTER keyDisplay: RUN xyz (Test-Numbers)

The following system reactions are possible:

– Display: PASS 1 h...12– Display: FAIL 1 h...13

12 Off-line-Diagnosis was successful

b Press OPTION keyDisplay: BOT

b Press REW/UNLD key (Tape is completely rewound)

Unload test tape h...14

13 Off-line-Diagnosis was faulty

b Press ENTER key. Alternately the error number and the test number aredisplayed. e.g.:Display: ERR 78 und TEST 165

(The fault number and the test number must be written down)Fault clearance on site should only be carried out by trained O&M personnel.(faults can also be caused by a defective magnetic tape)

PROC:MTD_HP – 6 A30808-X3063-A403-2-7630


For hints for fault clearance refer to:

• NM:CP113C-MTD:HP

• HP Service Handbook, chapter 8

b Press OPTION keyDisplay: IDLE

b Press REW/UNLD key (Tape is rewound)Display: BOT

b Press REW/UNLD key (Tape is completely rewound)

Unload test tape

14 Test magnetic tape (Test 2)

The quality of magnetic tapes can be tested with the magnetic tape device.(Off-line diagnosis, test 2)


The test takes about 23 minutes for a magnetic tape of 730 m (big reel)

Load magnetic tape which is to be tested (With write enable ring)

Close door - Tape is loaded

b Press RESET key (Display ONLINE is switched off)

b Press OPTION key and select the Function TEST * by pressing the NEXT key (IfTEST * is not automatically displayed)Display: TEST *


b Select Number 2 by pressing NEXT key (Test 2)


b Press ENTER keyDisplay: RUN xyz (Test-Numbers)

The magnetic tape is tested with recording modes GCR (Group Code Recording6250 CPI) and PE (Phase Encoded 1600 CPI).

The following 2 system reactions are possible:

– PASS 2 (Magnetic tape is error-free) h...15– FAIL 2 (Magnetic tape is faulty) h...16




A30808-X3063-A403-2-7630 PROC:MTD_HP – 7

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Rewind tape


Tape should not be used anymore


END

PROC:MTD_HP – 8 A30808-X3063-A403-2-7630


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4 Tables

This register remains free for editorial reasons.

TABIN – 2 A30808-X3063-A403-2-7630


A30808-X3063-A403-2-7630 APP – 1

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5 Appendix (APP)

This register remains free for editorial reasons.

APP – 2 A30808-X3063-A403-2-7630


siemens d900 commissioning itmn offline

Documents

gitmn offlineproc

nitmn offlineproc

gitmn offlinein1

offline installation

installation test manual

installation work

test points

system voltages