shaping the future with multi-mode chipsets for lte: what challenges lie ahead?

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Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?. What Challenges Lie Ahead?. Deployment models for early launches – the role of legacy networks and impact on devices New and refarmed spectrum opportunities – the proliferation of RF bands - PowerPoint PPT Presentation

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Page 1: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

Page 2: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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What Challenges Lie Ahead?

Deployment models for early launches – the role of legacy networks and impact on devices

New and refarmed spectrum opportunities – the proliferation of RF bands

Back to the basics: voice – how to enable voice and legacy services over LTE?

Page 3: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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Hotspot LTE deployments will come first

HSPA Coverage LTE

LTE boosts data capacity in dense urban areas 3G provides ubiquitous data coverage and voice services Seamless service continuity with 3G using multimode devices

Page 4: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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What does all this mean for LTE devices?

Multi-mode capability a must

Evolved HSPA capability for seamless user experience outside LTE coverage area

Mobility supported between LTE and 3G/2G networks

High level of integration and reuse across technologies for cost-effective, power-efficient, compact devices

Qualcomm uniquely positioned to support first multimode LTE devices

Page 5: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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Spectrum: opportunities … and challenges

Page 6: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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What does all this mean for LTE devices?

A multi-mode LTE/HSPA+ device needs to support high number of RF bands

The number of possible RF band combinations also increases

Potential impact on device complexity and cost, risk of device fragmentation

High level of RF IC integration is a must – a single SKU for multiple markets

Qualcomm RF IC solutions uniquely positioned to support multimode & multi-band LTE devices

Page 7: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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Voice and SMS ... different approaches

CS fallback voice calls are circuit switched & handled by “fallback” technology

VoIP over IMS over LTE Common platform (IMS) to deliver voice & operator controlled

applications

Voice over LTE with Generic Access Basic tenet of Volga – deliver “native” circuit switched voice

directly over LTE

SMS over CS domain using SGs interface, or over IMS over LTE

Page 8: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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What does all this mean for LTE handsets?

Various options for voice support in multi-mode LTE devices may lead to fragmentation

A standard-based solution is therefore needed. SMS over CS first, then over IMS over LTE CSFB first, then VoIP over IMS over LTE

… and lastly all the above packaged in a device with openOS and superior Multi-Media performance for successful launch of LTE handsets in the market

Qualcomm uniquely positioned with the MSM8960 toenable first LTE handsets of superior performance

Page 9: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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LTE

HSPA+/EV-DO

urban

suburban

rural

Qualcomm commitment to support HSPA and LTE

Enabling multi-mode HSPA/LTE devices packaged with openOS, strong processing power, advanced

multimedia capabilities, built-in always-on connectivity with all-day battery to deliver superior user experience

MDM9x00LTE

DC-HSPA+EDGE

MDM9600LTE

DC-HSPA+/DOrBEDGE

MSM8960LTE

DC-HSPA+/DOrBEDGE

Page 10: Shaping the Future with Multi-Mode Chipsets for LTE: What Challenges Lie Ahead?

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