sfh 4050 - farnell element14 · 2018. 12. 12. · sfh 4050 9 version 1.7 | 2018-04-20 reflow...
TRANSCRIPT
SFH 4050
1 Version 1.7 | 2018-04-20
Produktdatenblatt | Version 1.1 www.osram-os.com
SFH 4050
SMARTLED® High Power Infrared Emitter (850 nm)
Applications — Health monitoring (Health rate, Blood, Oximetry, …)
Features: — Package: clear epoxy
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
— Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm — Short switching times — High optical total power
Ordering Information
Type Radiant intensity 1) Radiant intensity 1) Ordering Codetyp.
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 msIe Ie
SFH 4050-Z 4.0 ... 20.0 mW/sr 9 mW/sr Q65110A6460
SFH 4050
2 Version 1.7 | 2018-04-20
Maximum RatingsTA = 25 °C
Parameter Symbol Values
Operating temperature Top min. max.
-40 °C 100 °C
Storage temperature Tstg min. max.
-40 °C 100 °C
Reverse voltage 2) VR max. 12 V
Forward current IF max. 100 mA
Surge current tp ≤ 200 µs; D = 0
IFSM max. 1 A
Power consumption Ptot max. 180 mW
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 4050
3 Version 1.7 | 2018-04-20
CharacteristicsIF = 100 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 860 nm
Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm
Half angle φ typ. 70 °
Dimensions of active chip area L x W typ. 0.3 x 0.3 mm x mm
Rise time (10% / 90%) IF = 100 mA; RL = 50 Ω
tr typ. 12 ns
Fall time (10% / 90%) IF = 100 mA; RL = 50 Ω
tf typ. 12 ns
Forward voltage VF typ. max.
1.5 V 1.8 V
Forward voltage IF = 1 A; tp = 100 µs
VF typ. max.
2.4 V 3 V
Reverse current 2) VR = 5 V
IR max. typ.
10 µA 0.01 µA
Total radiant flux 3) Φe typ. 60 mW
Radiant intensity 1) IF = 1 A; tp = 25 µs
Ie typ. 75 mW/sr
Temperature coefficient of brightness TCI typ. -0.5 % / K
Temperature coefficient of voltage TCV typ. -0.7 mV / K
Temperature coefficient of wavelength TCλ typ. 0.3 nm / K
Thermal resistance junction ambient real 4) RthJA max. 450 K / W
Thermal resistance junction solder point real 5) RthJS max. 250 K / W
SFH 4050
4 Version 1.7 | 2018-04-20
Brightness Groups TA = 25 °C
Group Radiant intensity Radiant intensity IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 msmin. max.Ie Ie
P 4.0 mW/sr 8.0 mW/sr
Q 6.3 mW/sr 12.5 mW/sr
R 10.0 mW/sr 20.0 mW/sr Only one group in one packing unit (variation lower 2:1).
7000
nm
%
OHF04132
20
40
60
80
100
950750 800 850
Irel
λ
Relative Spectral Emission 6), 7) Irel = f (λ); IF = 100 mA; tp = 20 ms
SFH 4050
5 Version 1.7 | 2018-04-20
OHF05654
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0ϕ
Radiation Characteristics 6), 7) Irel = f (φ)
OHL01715
10-3
mA
101
010
5
5
10-1
-2
5
10
e
e (100 mA)
II
IF
010 110 210 3105 5
Relative Radiant Intensity 6), 7)
Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs
OHL01713
FI
10-4
0.5 1 1.5 2 2.5 V 3
100
A
0
FV
-110
5
5
10-2
-3
5
10
Forward current 6), 7)
IF = f (VF); single pulse; tp = 100 µs
SFH 4050
6 Version 1.7 | 2018-04-20
tp
0
TtA
IF D = IP
T
F
PtOHF05709
-510 -3-410 10 -1-210 10 1010 10 s 210
0.51
0.20.1
0.01
0.050.02
=0.005D
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TA = 25°C
OHR00883
0
FΙ
0
20
40
60
80
100
120
20 40 60 80 100 120
mA
˚CTA
R thjA = 450 K/W
Max. Permissible Forward CurrentIF,max = f (TA); RthJA = 450 K / W
tp
0
TtA
IF D = IP
T
F
PtOHF05710
-510 -3-410 10 -1-210 10 1010 10 s 210
0.51
0.20.1
0.01
0.050.02
=0.005D
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.0
Permissible Pulse Handling CapabilityIF = f (tp); duty cycle D = parameter; TA = 85°C
SFH 4050
7 Version 1.7 | 2018-04-20
Dimensional Drawing 8)
GPLY7036
0.8 (0.031) ±0.1 (0.004)
Package
+0.05 (0.002)-0.03 (0.001)0.125 (0.005)
1.7
(0.0
67)±
0.1
(0.0
04)
7˚ m
ax
+0.02 (0.001)-0.05 (0.002)0.65 (0.026)
5˚
1.3
(0.0
51)±
0.1
(0.0
04)
marking markingPackage
±0.05 (0.002)0.7 (0.028)
Approximate Weight: 2.1 mg
SFH 4050
8 Version 1.7 | 2018-04-20
Recommended Solder Pad 8)
0.8 (0.031)
0.7 (0.028)
OHAPY606
0.8
(0.0
31)
0.8 (0.031)
Recommended Solder Pad 8)
OHPY3832
0.8 (0.031)
0.7 (0.028)
0.8
(0.0
31)
0.05 (0.002)
0.6 (0.024)
Solder stencil aperture
0.05
(0.0
02)
0.7
(0.0
28)
Copper solder pad
SFH 4050
9 Version 1.7 | 2018-04-20
Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 6 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
SFH 4050
10 Version 1.7 | 2018-04-20
Taping 8)
Tape and Reel 9)
D0
2P
P0
1P
WFE
Direction of unreeling
N
W1
2W
A
OHAY0324
Label
Leader:Trailer:
13.0
Direction of unreeling
±0.2
5
min. 160 mm *min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
SFH 4050
11 Version 1.7 | 2018-04-20
Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 5000
Barcode-Product-Label (BPL)
SFH 4050
12 Version 1.7 | 2018-04-20
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 8)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or equiv
alent p
rocessin
g (peak p
ackage
2. Afte
r th
is b
ag is o
pened, devic
es that w
ill b
e subje
cted to
infrare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body tem
p.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD
-033 fo
r bake p
rocedure
.
Flo
or tim
e see b
elow
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Flo
or tim
e 1
Year
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICO
NDUCTORS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Transportation Packing and Materials 8)
OHA02044
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
PACKVAR:
R077Additional TEXT
P-1+Q-1
Multi TOPLED
Muste
r
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
10
(9D) D/C:
11(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY: 2000
0144
(G) GROUP:
260 C RT240 C R
3
220 C R
MLBin3:Bin2: Q
-1-20
Bin1: P-1-20
LSY T6762
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Mois
ture
Level 3
Flo
or tim
e 168 H
ours
Mois
ture
Level 6
Flo
or tim
e 6
Hours
a) H
umid
ity In
dicato
r C
ard is
> 1
0% w
hen read a
t 23 ˚
C ±
5 ˚C
, or
reflo
w, v
apor-phase r
eflow
, or e
quivale
nt pro
cessing (p
eak package
2. Afte
r th
is b
ag is o
pened,
devices th
at will
be s
ubjecte
d to in
frare
d
1. Shelf
life in
seale
d bag: 2
4 month
s at <
40 ˚
C a
nd < 9
0% rela
tive h
umid
ity (R
H).
Mois
ture
Level 5
a
at facto
ry c
onditions o
f
(if b
lank, s
eal date
is id
entical w
ith d
ate c
ode).
a) M
ounted w
ithin
b) S
tore
d at
body te
mp.
3. Devic
es require
bakin
g, befo
re m
ounting, i
f:
Bag s
eal date
Mois
ture
Level 1
Mois
ture
Level 2
Mois
ture
Level 2
a4. If b
aking is
require
d,
b) 2a o
r 2b is
not m
et.
Date
and ti
me o
pened:
refe
rence IP
C/J
ED
EC
J-S
TD-0
33 for bake p
rocedure
.
Floor
time s
ee belo
w
If bla
nk, see b
ar code la
bel
Flo
or tim
e > 1
Year
Floor
time
1 Y
ear
Flo
or tim
e 4
Weeks10%
RH
.
_<
Mois
ture
Level 4
Mois
ture
Level 5
˚C).
OPTO
SEM
ICONDUCTO
RS
MO
ISTURE S
ENSITIV
E
This b
ag conta
ins
CAUTION
Flo
or tim
e 72 H
ours
Flo
or tim
e 48 H
ours
Flo
or tim
e 24 H
ours
30 ˚C
/60%
RH
.
_<
LE
VE
L
If bla
nk, see
bar code la
bel
Barcode label
SFH 4050
13 Version 1.7 | 2018-04-20
Dimensions of transportation box in mmWidth Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
SFH 4050
14 Version 1.7 | 2018-04-20
NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
For further application related informations please visit www.osram-os.com/appnotes
SFH 4050
15 Version 1.7 | 2018-04-20
Disclaimer
DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.
Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version in the OSRAM OS Webside.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
SFH 4050
16 Version 1.7 | 2018-04-20
Glossary1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.3) Total radiant flux: Measured with integrating sphere.4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 5 mm² each5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
7) Testing temperature: TA = 25°C8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
SFH 4050
17 Version 1.7 | 2018-04-20
Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.