roadmap’to’excellence’in’ quality’/’reliability’ madan roadmap to... ·...

Roadmap to Excellence in Quality / Reliability

Sudhir Madan Quality / Reliability Leader Six Sigma Master Black Belt

ASTR 2015, Sep 9 -‐ 11, Cambridge, MA 1

Quality Accolades Apple •  J.D. Power and Associates Top

Smartphone Manufacturer •  EquiTrend top brand in quality

for computers, tablets, phones

GE •  Boeing Award for Supplier

Excellence •  AHS Supplier Excellence Award •  OSHA Award


Secret "Sauce" •  Five Step Recipe – ORT (On-‐Going Reliability TesVng) – RRT (Rolling Reliability TesVng) – CQA (Customer Quality Audit) – TA (Take-‐apart) – CET (Customer Experience TesVng)

•  Two “must have” Best PracVces – EFFA (Early Field Failure Analysis) – Lessons Learned

ASTR 2015, Sep 9 – 11, Cambridge, MA 3

ORT (On-‐Going Reliability TesVng) •  Set up to monitor projected product life as units are manufactured over Vme

•  Understanding product reliability as processes and designs change

– HALT – HASS – ALT


Time

Failure Rate

Early Failure

Random Failure

Wear-‐Out Failure

HALT (Highly Accelerated Life TesVng) •  Improve reliability over a very short Vme (hours to days) by gradually increased stresses

•  Performed on enVre systems •  Stressed to failure to test design robustness •  Insight into weak areas to ensure product integrity •  Root cause analysis is essenVal to determine if failure was relevant


HASS (Highly Accelerated Stress Screen) •  Efficient manufacturing screen to catch weak products by exposing latent defects

•  Pushes products out of early failure stage •  Uses accelerated stresses (beyond specificaVon) – Shortens Vme to failure, and thus Vme to correcVon – Reduces amount of units built with similar flaws – Defect detecVon and correcVon prior to shipment


ALT (Accelerated Life TesVng) •  Improve reliability over a short Vme (weeks to months) with stress tests

•  Usually performed on individual assemblies •  AcceleraVon Factor – Arrhenius, Coffin-‐Manson, Norris-‐Lanzberg – ExperimentaVon


RRT (Rolling Reliability TesVng) •  Percentage of daily producVon randomly chosen for intensive tesVng. FantasVc “QC” method.

•  Any failure indicaVve of early life failures in field •  Failure is “big deal”. Small sample size implies “zero tolerance” for failures

•  OpVmal strategy to monitor ongoing producVon.


CQA (Customer Quality Audit) •  Measure and verify the effecVveness of the quality management system.

•  IndicaVve of customer experience at purchase. •  Any failures have enormous ramificaVons including and up to line stoppage.

•  Should include “standard” suite of user experience with product. Sample % varies by product/volume.


TA (Take-‐apart) •  The “best” methodology to detect “workmanship” type errors such as pinched cables, solderability type defects, and component issues.

•  As more and more companies outsource to Contract Manufacturers, this test is criVcal source of truth.

•  Should be done by in-‐house personnel/independent contractor.

•  Typical sample size is small (e.g. 0.25% of producVon)


CET (Customer Experience TesVng) •  CriVcal in Early stage of DVT (Design VerificaVon & Test) in PLM (Product Lifecycle Management)

•  Four corner tesVng to explore the limits of performance.

•  Early detecVon of performance issues leads to accurate specificaVons/enhancements.

•  Falls in “QA” category to reduce COPQ (Cost of Poor Quality)


Two “Must Have” Best PracVces •  EFFA (Early Field Failure Analysis) – Spot failures in product very soon amer product release – When unnoVced, these failures are extremely costly

•  Lessons Learned ParVcularly for NPI (New Product IntroducVon) – Best implemented during “C” phase of C.D.O.V. (Concept Design OpVmize Validate) DFSS (Design for six sigma methodology).

– Leads to true C.I (ConVnuous Improvement) iniVaVve.


Hardware vs. Somware Reliability


Hardware So/ware Product reliability

Good when released, gets worse over Vme

Worst when released, gets bener over Vme

Premise Good parts go bad, bad parts get worse

Lines of code do not wear out

Philosophy ProacVve – Find failure modes before they occur, harden devices

ReacVve – fix defects a/er they occur

Cause of failures

Physical wear, environmental, external events (vibraVon, load, etc.)

Latent defects, somware changes, other factors

Type of failures

Tangible – breakage, changes to material

Intangible, different manifestaVons

Tes=ng of failures

Re-‐engineer components to improve reliability, fault tolerance and defect predicVon

Fix found defects and re-‐test

Mathema=cal models

Weibull distribuVon, bath tub curves Raleigh curve (phases), ExponenVal decay (defects and defect arrival rate/tesVng)

Examples of Success:


Apple: TWR (Total Warranty Returns) at iPad launch > 10% TWR at Launch of iPad2 < 1.5% Success factors: First Pass Yields Supplier Quality (Good ingredients=Good Pizza-‐Papa John’s) EFFA (Early Field Failure Analysis)

Gigamon: Enterprise class product for Cyber-‐security / visibility matrix TWR at launch: 0.65% TWR 6 months later: 0.2% Success factors: ReducVon of NTF (No trouble found) / Vigorous field soluVoneering. DiagnosVcs tesVng prior to OBA (Out of Box Audit) RRT (Rolling Reliability TesVng) prior to lot release

QuesVons?


Intro. to author: Sudhir Madan

•  15+ years of ExecuVve Quality/Reliability Management experience in electronics, electro-‐mechanical, and consumer electronics industries.

•  Bachelor's degree in Engineering •  Master's degree in Business Management •  Extensive exposure and pracVcal experience in advanced quality engineering / lean / six

sigma. •  CerVfied Master Black Belt in Lean Six Sigma. Proficient in MiniTab and SAS •  Extensive experience in current and prior jobs using Agile / Scrum based product

development methodologies. •  Solid experience uVlizing RF, Wi-‐Fi, Bluetooth technologies •  Global experience with mulV-‐naVonal companies, suppliers, and contract manufacturers

worldwide •  ISO 9000 /13485 / 14000 cerVfied Lead Auditor •  Contact: [email protected]. Cell: 1-‐650 817 5211 (USA) ASTR 2015, Sep 9 -‐ 11, Cambridge, MA 16

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