COMPREHENSIVE REPORTS COLLECTIONReport subjects already available and considered for 2016:

• Component & module reverse costing® analysis• Technology trends and evolution• Supply and value chain analysis• In depth analysis of applications and market drivers• Market data• Patent investigation

Choose to buy over 12 months a set of 3, 5, 7, 12 reports.

Up to 53% discount!

BUNDLE PROCESS• Choose the number of reports you would like to receive amongour 3 catalogues (Reverse Costing ®, Market and Patent reports)

• Pay once and have up to 12 months to select your reports fromour current catalogue or from our 2016 forecast list

• Once you have selected the reports you receive themautomatically as soon as they are available

• Share reports among your company employees on a global basiswith the corporate license

• For over 12 reports, or for any specific request, feel free to contact us

MAIN BENEFITS• Economical: access analyses at best pricing available (up to 56%discount)

• Fast: shorten your purchasing process and get multiple reportswith only one order

• All-inclusive: quick delivery, large collection from 3 catalogues,complete flexibility, corporate license, and possible debriefing withour engineers. 12 months collaboration

• Flexible: Increase your number of reports at your convenience andstill benefit from package pricing

• Easy to use: budget your 2016 annual expenses with our annualsubscription

*The Bundle service runs for 12 months once we receive the order. Reports not selected during this period will not be refunded nor postponed to the next period.

3 COMPANIES, 3 CATALOGUES• +180 Reverse Costing® reports, +60 Market reports, +20 Patentreports ready to be delivered• 2016 Forecast additional reports: +40 Reverse Costing® reports,+30 Market reports, +20 Patent reports

QRcode

ANNUAL SUBSCRIPTION 2016REVERSE COSTING- MARKET AND PATENT ANALYSES

Choose to buy a set of 3, 5, 7 or 12 reports over 12 months*

Up to 56% discount!

KNOWMADE

More than describing the status of theIP situation Knowmade providesanalyses emphasizing a missing linkbetween patented technologicalsolutions and market, technologicaland business trends. The analysesinclude key technical insights intofuture technology trends & challenges.

SYSTEM PLUS CONSULTING

System Plus Consulting offers ReverseCosting® reports which provide a fullteardown, including detailed photos,precise measurements, materialanalysis, manufacturing process flow,supply chain evaluation, manufacturingcost analysis and selling priceestimation.

YOLE DEVELOPPEMENT

Yole Développement, technology andstrategy consulting company offersmarket reports including quantitativemarket forecasts, technology trends,company strategy evaluation and in-depth application analyses.

POWER ELECTRONIC & COMPOUND SEMICONDUCTOR (2015 or before*)• Transphorm TPH3002PS GaN transistor• GaN Systems GS66508P 650V GaN transistor• CREE 1200V SiC Module• Rohm SCH2080KE - SiC Power MOSFET with SiC-SBD• Infineon - CoolMOS C7 SuperJunctionMOSFET• Semikron SKiM306GD12E4 power module• Infineon EconoPACK4™ 1200V IGBT4 Module•Infineon FS600R07A2E3 HybridPACK2 100KW 3-phaseForecast for 2016**• 1 SiC MOSFET • 1 SiC Module• 1 MOSFET Low Voltage • 1 GaN HEMT• 1 IPM

LED (2015 or before*)• Toshiba GaN on Silicon LED• OSRAM OSTAR Automotive Headlamp Pro• SORAA : Tri-LED & Lightchip• CREE CXA1520 LED ArrayForecast for 2016**• 1 GaN on Si LED • 1 GaN on GaN LED• 1 LED Packaging Innovation • 1 High Power IR LED

ADVANCED PACKAGING (2015 or before*)• Infineon RRN7745P & RTN7735P eWLB Fan-Out Package –77GHz Radar Dies• AMD High-Bandwidth Memory• Samsung 3D TSV Stacked DDR4 DRAM• GaN Systems GaNpx Top Cooled – AT&S ECP® Power Die Package• GaN Systems HEMT - AT&S ECP® Embedded Power Die PackageForecast for 2016**• 1 Stacked Memory • 1 FO PLP• 2 FO WLP • 1 Embedded Die

SYSTEM AND DISPLAY (2015 or before*)• Apple iPhone 6s Plus Teardown & Physical Analyses of Key Components• Samsung Galaxy S6 Teardown & Physical Analysis of Key Components• Bosch Mid Range Radar (MRR) Sensor• SMA Sunny Boy 1.5 – Solar Inverter• TIGO Energy MM-2ES 50 Solar optimizerForecast for 2016**• 2 Automotive Radars • 1 DC Charger with GaN• 1 Infotainment Unit System • 1 Off Grid PV Inverter• 1 Head Up Display • 1 Microdisplay

REVERSE COSTING® ANALYSES - SYSTEM PLUS CONSULTING

RELATED SERVICESCustom and confidential analyses on demand:• Reverse Costing®• Technology analysis• Market data & research, marketing analysis• Strategy consulting• Patent analysis• Due diligence before investment

Costing tools by System Plus Consulting:• Process-based costing tools (specific processdescribed using libraries of equipment andconsumables)• Parametric costing tools (calculation from a setof parameters, a solution best suited tostandardized technologies)• On-demand costing tools

Workshops by Yole Développement:One day face-to-face presentation of our dataand analyses with a Q&A session on specificquestions of your choice: direct interaction withour experts at your site.

* Please check our catalogue for the full list available (more than 180 reports)**Please note that this list can be modified depending on product availability

INTEGRATED CIRCUIT (2015 or before*)• Infineon RRN7745P & RTN7735P 77GHz Radar Receiver & Transmitter• Mobileye EyeQ3® vision SoCForecast for 2016**• 1 Multimedia SoC • 1 Ethernet for Car IC• 1 Car Information System SoC

IMAGING (2015 or before*)• Fujitsu Iris Authentication Module – IR Camera Module & IR LED• Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector• Apple iPhone 6s Plus Rear Camera Module• Apple iPhone 6&6 Plus Front & Rear Camera Modules from Sony• Opgal Therm-App Infrared Camera & Ulis IR Microbolometer• Seek Thermal Infrared Camera & Raytheon IR Microbolometer• FLIR ONE Thermal Infrared Camera & LEPTON MicrobolometerForecast for 2016**• 1 IR Camera • 1 Pyroelectric IR Sensor• 2 Camera Modules (consumer) • 2 Automotive Cameras• 1 3D Stacked CIS

MEMS, SENSOR & RF (2015 or before*)• Nexus 6P Fingerprint Sensor - FPC1025• iPhone 6s Plus Fingerprint Sensor• Samsung Galaxy S6 Fingerprint Sensor - New Synaptics Design• Silicon Sensing CMS300 - Accelero/Gyro• Murata SCC2000 Series - Accelero/Gyro• mCube MC3413 3rd Generation 3-Axis Accelerometer• STMicroelectronics LSM6DS3 6-Axis MEMS IMU• STMicroelectronics LSM9DS0 9-Axis MEMS IMU• Bosch Sensortec BMI160 6-Axis MEMS IMU• InvenSense MP67B MEMS IMU• Cambridge CMOS Sensor CCS801- Gas Sensor• AMS AV-MLV-P2 VOC MEMS Gas Sensor• STMicroelectronics HTS221 Humidity Sensor• Freescale FXTH87- Tire Pressure Monitoring Sensor (TPMS)• SiTime SiT1552 – MEMS Oscillator• Cavendish Kinetics 32CK417R antenna tuner• iPhone 5S MEMS Microphones Knowles & AAC TechnologiesForecast for 2016**• 2 Filter, Duplexers • 1 RF LTE Module• 3 Fingerprint Sensors • 2 Light/Color Sensors• 1 MEMS Magnetic Reed Sensor • 2 Gas Sensors• 1 Environment Sensor • 2 Force Sensors• 4 IMU • 1 Autofocus MEMS• 1 TPMS

MEDTECH• BioMEMS 2016• Point of Need Testing 2016: Application of Microfluidic Technologies• Microfluidic for Sample Preparation 2015• Microfluidic Applications 2015• Sensors for Wearable Electronics and Mobile Healthcare 2015

IMAGING & OPTOELECTRONICS• Status of the CMOS Image Sensor Industry 2016*• Uncooled Infrared Imaging Technology & Market Trends 2016*• Imaging Technologies for Automotive 2016• Sensors for Drones & Consumer Robots 2016• 3D Imaging & Sensing 2016**• Silicon Photonics 2016• Camera Module Industry 2015• Infrared Detector Technology & Market Trends 2015

MANUFACTURING• Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**• Emerging Materials for Advanced Packaging 2016• Deposition Technologies Equipment & Materials 2016• Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016• Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications 2015

PATENT ANALYSIS - KNOWMADE

MEMS• Fingerprint Sensors Patent Infringement Risk Analysis 2016• Microphone Patent Landscape 2016• 6-axis & 9-axis Inertial MEMS IMUs Patent Landscape 2016• MEMS Gaz Sensors Patent Landscape 2016• Microbattery Patent Landscape 2016• Capacitive Fingerprint Sensors Patent Landscape 2015• Honeywell Microbolometer Patent Portfolio Analysis 2015• Resistive Memory Patent Landscape 2015• MEMS Microphone Patent Infringement Risk Analysis 2015• Emerging MEMS Patent Investigation 2015

IMAGING• Infrared Imagers (microbolometers) Patent Infringement Risk Analysis 2016• Mobile Camera Lens Patent Landscape 2016• Uncooled Infrared Imaging Patent Landscape 2016• Honeywell Microbolometer Patent Portfolio Analysis 2015

LED• UV LED Patent Landscape 2016• LED Packaging Patent Landscape 2016

COMPOUND SEMICONDUCTORS – POWER ELECTRONICS• GaN Devices for Power Electronics Patent Investigation 2015• Power Packaging Patent Landscape 2016 ADVANCED PACKAGING• Fan-out Patent Landscape 2016• 2.5D, 3DIC and TSV Interconnect Patent Landscape 2016• LED Packaging Patent Landscape 2016• 3D Memory Patent Landscape 2016• Power Packaging Patent Landscape 2016

MEDTECH• Micropumps Patent Landscape 2016• Biomedical Photoacoustic Imaging Patent Landscape 2015• Non-Invasive Glucose Monitoring Patent Landscape 2015

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

POWER ELECTRONICS• Power Electronics in Electric and Hybrid Vehicles 2016• Status of Power Electronics Industry 2016*• Passive Components Technologies and Market Trends for Power Electronics 2016• SiC Modules, Devices and Substrates for Power Electronics 2016*• GaN Modules, Devices and Substrates for Power Electronics 2016*• Inverter Technologies Trends & Market Expectations 2016• Power Electronics for Renewable Energy 2016• Thermal Management for LED and Power 2016• Status of Chinese Power Electronics Industry 2015• New Technologies and Architectures for Efficient Data Center 2015• IGBT Market and Technology Trends 2015

BATTERIES & ENERGY MANAGEMENT• Market Trends and Technologies in Battery Pack and Assembly 2016• Innovative and Emerging Technologies in Energy Storage Market 2016• Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery Electricity Storage Solutions 2015

COMPOUND SEMICONDUCTORS• SiC Modules, Devices and Substrates for Power Electronics 2016*• GaN Modules, Devices and Substrates for Power Electronics 2016*• Sapphire Applications & Market 2016: from LED to Consumer Electronics*

ADVANCED PACKAGING• FanOut and Embedded Die Business Update 2016*• 2.5D & 3D IC Business Update 2016• Status of the Advanced Packaging Industry 2016*• Advanced Packaging for Wearables and Mobile Applications 2016• Advanced Packaging in Emerging Markets: China 2016• Supply Chain Readiness for Panel Manufacturing in Packaging 2015• Fan-in Wafer Level Packaging: Market and Technology Trends 2015• Flip Chip Business Update 2015

LED• Sapphire Applications and Market 2016: From LED to Consumer Electronics*• LED Packaging 2016• Microdisplays and MicroLEDs• UV LED Technology, Manufacturing and Applications Trends 2016*• OLED for Lighting 2016• LED Lighting Module PCB / Substrate Technology, Industry and Market Trends 2016**• LED in Automotive Lighting 2016• LED Lighting Module Technology, Industry and Market Trends 2015• Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays

MEMS & SENSORS• Gas Sensors and Combos 2016• Status of the MEMS Industry 2016*• Sensors for Cellphones and Tablets 2016• Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities 2016…• Sensors for Biometry and Recognition 2016• Finger Print Sensors Market and Technologies 2016• 3D Imaging & Sensing 2016**• Silicon Photonics 2016• Emerging Non Volatile Memories 2016*• AlN Thin Film Markets and Applications 2016• Sensors and Data Management for Autonomous Vehicles 2015• Sensors for Wearable Electronics and Mobile Healthcare 2015• IR Detector and Small Size Imagers 2015• High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial 2015

*2015 version still available**To be confirmed

ORDER FORM

SHIP TO PAYMENT

BILLING CONTACT

ABOUT SYSTEM PLUS CONSULTING

Name (Mr/Ms/Dr/Pr):......................................................................................Job Title:......................................................................................Company:......................................................................................Address:......................................................................................City: State:......................................................................................Postcode/Zip:......................................................................................Country*:......................................................................................*VAT ID Number for EU members: ......................................................................................Tel:......................................................................................Email:.....................................................................................

Date:.......................................................................................Signature:......................................................................................

Name: ...................................................................

Email:.....................................................................

Phone:....................................................................

Please process my order for a common bundle (includes Reverse Costing® analyses, Market analyses and Patent analyses)

DELIVERY on receipt of payment:

By credit card:Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__|

Expiration date: |__|__| / |__|__| Card Verification Value: |__|__|__|

By bank transfer:HSBC – CAE- Le Terminal -2 rue du Charron- 44800 St Herblain FranceBIC code : CCFRFRPP

In EURBank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN : FR76 3005 6009 5509 5500 0323 439

In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN : FR76 3005 6009 5509 5500 0324 797

Return order by: FAX: +33 (0)2 53 55 10 59

MAIL: SYSTEM PLUS CONSULTING21 rue La Noüe Bras de Fer44200 Nantes – France

Contact: E-mail: sales@systemplus.frTel: +33 (0)240 18 09 16

*For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT

Set of 3 reports: EUR 9 990*

Set of 5 reports: EUR 16 650*

Set of 7 reports: EUR 20 990*

Set of 12 reports: EUR 34 650*

Our prices are subject to change.Please check our new releases and price changes on www.systemplus.fr

System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems. A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling price of a product is available.

Our services:

COSTING SERVICES - COSTING TOOLS - TRAININGS

www.systemplus.fr - sales@systemplus.fr

TERMS AND CONDITIONS OF SALES

1. INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consultingexcept in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2. PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and workedout without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged on theseinitial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commitsitself in invoicing at the prices in force on the date the order is placed.

3. REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to thenumber of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.

4. TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of aparticular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penaltyfor late payment the amount of which 3 times the French legal interest rate. The legal interest rate is the current one on thedelivery date. This penalty is worked out on the unpaid invoice amount without taxes, starting from the invoice deadline. Thispenalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total invoice

amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6. DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequently anyreasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.

7. ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or damageon the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takes place.Without any specific requirement, insurance terms for the return of goods will be the carrier current ones (reimbursementbased on good weight instead of the real value).

8. FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described in thecurrent terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes all externalevent unpredictable and irresistible as defined by the article 1148 of the French Code Civil?

9. CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10. RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costingtools.

11. APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.