qualifications: graduate of any engineering course (chemical engineering an advantage)

Qualifications:

Graduate of any engineering course (Chemical Engineering an advantage) At least 5 years of EHS experience Working knowledge of ISO14001 and OHSAS18001 Knowledge of applicable environmental, health and safety regulatory requirements Excellent oral and written communication skills Must be organized, detail oriented and proactive.

Brief Job Description:

The EHS Manager is responsible for managing environmental, health and safety compliance activities and programs of the ADGT/ADPI facilities.

EHS MANAGER (as E11 EHS Manager for ADGT / ADPI EHS Department)

For internal applicants: Probationary period will not apply to regular employees. You should have at least 1 year residency in the company and in the current position. Please submit a duly approved Job

Bid Form and Letter of Intent. Resume must be uploaded at https://analog.taleo.net/careersection/1Ph/jobsearch.ftl?lang=en.

For referrers: Probationary period will apply to successful external applicant. Please inform your referrals to apply at http://www.analog.com/en/careers/content/index.html.

Taleo Job Number: 100032

Deadline of submission is on March 3, 2010. For inquiries, you may call local 7022 / 7289 / 7413.

http://www.analog.com/en/careers/content/index.html

Qualifications:

College graduate. 2 years similar work experience in a manufacturing environment. Good verbal and written communication skills. Good coordination skills. Computer literate.


The Manufacturing Production Supervisor is responsible for executing production plans and ensuring continuous operations and effective utilization of resources. He/she will support attainment of Manufacturing Test goals and objectives.

MFG PRODUCTION SUPERVISOR (As E03-E09 Mfg. Prod Supervisor for ADPI Test Manufacturing)






For Internal Hiring Only!!!


QUALITY ASSURANCE INSPECTORS (4)(as QA Inspector for ADGT Quality Assurance)

For Internal Hiring Only!!!Qualifications:

Quality-driven, detail-oriented, and meticulous. Good oral and written communication skills. Computer literate.

Brief Description:

The QA Inspector will perform in line monitor at Assembly or Test in accordance with the defined

process and product specifications and work instructions. The QAI will also support in ensuring

that established quality systems are adhered to.




Bid Form & Letter of Intent. Resume must be uploaded at https://analog.taleo.net/careersection/1Ph/jobsearch.ftl?lang=en

https://analog.taleo.net/careersection/1Ph/jobsearch.ftl?lang=en

Qualifications:




MFG PRODUCTION SUPERVISORS (As E03-E07 Mfg Prod Supervisor for ADGT Test Manufacturing)







TEMPORARY TECHNICIANS(as N00 Temporary Test Technician in ADGT and ADPI)

Qualifications:

Graduate of a 3-year Electronics, Electromechanical, Instrumentation or Industrial Technology.

Good Communication skills.Computer Literate.OJT experience in a semiconductor company is an advantage


The Temporary Technician is responsible in providing adequate support in repair and set–up of manufacturing equipment with the aim of preventing and minimizing equipment downtime.

For referrers: Please inform your referrals to apply at http://www.analog.com/en/careers/content/index.html.




MANUFACTURING TEST ENGINEERS(as E05-E07 Migration Engineer for ADGT Mfg. Support Eng’g Dept.)

Qualifications:

At least 2 years experience in final test, wafer probe/sort, test development, or any related field in semiconductor and electronics.

Graduate of BS ECE/EE. Proficient in Circuit Analysis. Knowledgeable in C++ and Visual Basic. Familiar with linear and mixed signal testing. Excellent communication skills. Fresh graduates are welcome to apply.


The Manufacturing Test Engineer will provide support to manufacturing and ensure product testability with respect to published electrical specifications or datasheets to the highest quality and reliability.


For referrers: Probationary period will apply to successful external applicant. Please submit their resume to KC Kare and Daisy Francia (ADGT) and Bicbic Recto (ADPI).

For Manpower Pooling Only!!!

Qualifications:

Graduate of 2 or 3 years electronics or computer-related technology course. Knowledge on electronic components specifications is a must. Must have good English communication skills, a team player and can work under

pressure. Computer literate and knowledgeable in Microsoft office applications. Fresh graduates with good scholastic standing are welcome to apply.


The Product Test Engineering Technician will provide support for parts kitting, PCB assembly and PCB procurement. She/he will be under the Hardware Development group.






PRODUCT TEST ENGINEERING TECHNICIANS (4) (as N32 PCB Technician for ADGT Mfg Support Eng’g)


MANUFACTURING TEST ENGINEER(as E05-E09 WLCSP Process Engineer for ADGT Mfg. Support Eng’g)

Qualifications:

Graduate of BS ECE, EE, ME, MatSci/Metallurgical Eng’g. 2 years experience in a semiconductor manufacturing company. Experience in wafer saw process is an advantage. Knowledgeable in pick and place/tape and reel process. Proficient in FMEA, DOE, and SPC. Good communication and interpersonal skills. Good leadership skills


The Manufacturing Test Engineer will be assigned in WLCSP Backend and will focus on activities concerning process improvements. He/She will also sustain the WLCSP’s backend performance metrics in terms of yield, materials and cost reductions.







Qualifications:

Graduate of BS ECE, EE, ME, MatSci/Metallurgical Eng'g. 2 years experience in a semiconductor manufacturing company. Knowledgeable in FMEA and DOE. Proficient in Backgrind and Dicing Saw. Good communication and interpersonal skills. Good leadership skills.


The Manufacturing Test Engineer will be assigned in Die Prep area for Known Good Dice and WLCSP processes. He/ She will cover several process engineering initiatives such as yield improvement, process development, cost reduction and quality excellence.

MANUFACTURING TEST ENGINEER(as E05-E09 Die Prep Process Engineer for ADGT Mfg. Support Eng’g)







MANUFACTURING TEST ENGINEERS (7) (as E06-E09 PCB Design/Layout Engineer for ADGT Mfg. Support Eng’g)

Qualifications:

Graduate of ECE, COE, or EE.With in-depth experience in PCB design/layout i.e. schematic, layout, or simulation.At least 3 years exposure in PCB Design/Layout field.Knowledgeable in circuit and layout simulation and analysis.Knowledgeable in Cadence CAD tools (Concept and Allegro) is an advantage.Mature and team player.Good oral and written communication skills.







The PCB Design/Layout Engineer is responsible in the Layout and Design of Test and Burn-in Hardware; ensure DFM practice; and use of simulation analysis tools. He/She will be under the Hardware Engineering group.


Qualifications:




MFG PRODUCTION SUPERVISOR (As E03-E07 Mfg Prod Supervisor for ADGT Auto Group)







Qualifications:

Graduate of BS Electronics & Communications & Electrical Engineering. Proficient in circuit analysis. Knowledgeable in Pascal or C Programming language. Familiar with linear and mixed-signal testing. Excellent communication skills.


The Manufacturing Test Engineer will provide support to manufacturing and ensure product testability with respect to published electrical specifications or datasheets to the highest quality and reliability.

MANUFACTURING TEST ENGINEER(as E05 Product Engineer for ADGT Auto Group)







Qualifications:

Graduate of BS ECE, EE, Physics, or Materials Engineering. At least 2 years work experience in semiconductor test manufacturing

facility. Familiar with FA processes, techniques, and methods. Knowledgeable in data analysis and reporting. Good oral and written communication skills. Good interpersonal skills. Brief Job Description:

The Quality Engineer is responsible in ensuring completion of full failure analysis on customer returns, OQA failures, Reliability Monitor Program (RMP) failures, Reliability Assessment failures, Qualification/Certification failures, and failures pertaining to Special Occurrences (SO’s).

QUALITY ENGINEERS (4)(as E05-E07 Product Analysis Engineer for ADGT Auto Group)







EQUIPMENT ENGINEERS (2)(as E05-E09 Board Maintenance Engineer for ADGT Equipment Eng’g)


Qualifications:

Graduate of ECE, COE, or EE. With in-depth experience in PCB, Probe/Test Board Circuit Design and Board Failure

Analysis At least 3 years exposure in Probe/Test Board Design, Test Circuit Failure Analysis and

Repair Knowledgeable in circuit analysis. Knowledgeable in C++, Unix, Statistical Tools is an advantage. Good oral and written communication skills.


The Equipment Engineer is responsible in the Maintenance, Test Circuit Failure Analysis and Repair of Probe Card and Test Hardware; ensure DFM practice; and use of simulation analysis tools. He/She will be under the Board Maintenance Section. For internal applicants: Probationary period will not apply to regular employees. You should have at

least 1 year residency in the company and in the current position. Please submit a duly approved Job Bid Form and Letter of Intent. Resume must be uploaded at

https://analog.taleo.net/careersection/1Ph/jobsearch.ftl?lang=en.




EQUIPMENT ENGINEER(as E05-E09 Equipment Engineer for ADGT Equipment Engineering)

Taleo Job Number: 100137Qualifications:

Graduate of BS ECE, EE, ME, MatSci/Metallurgical Eng'g. 2 years experience in a semiconductor manufacturing company. Experience in backgrind process is an advantage. Knowledgeable in saw, pick and place/tape and reel/inspection process. Proficient in FMEA, DOE, and SPC. Good communication and interpersonal skills. Good leadership skills


The Equipment Engineer is responsible for equipment maintenance and improvement activities. He/She will also supervise and lead technical specialist in the repair, troubleshooting, and preventive maintenance of equipment.






MANUFACTURING TEST ENGINEERS (6) (as E06-E07 Product Engineer for ADGT Test/Product Engineering)

Qualifications:Graduate of Electronics & Communications Engineering.Strong technical background in mixed signal measurement methodology and bench setup

implementationAt least 2 years experience in semiconductor industry.Experience with mixed signal bench-top equipment and instrumentation.Skills required in limit setting, RnR and product statistical analysis.Proficient in module and system fabrication.Possesses strong knowledge in semiconductor fabrication.Has working knowledge in statistical process control and quality systems.Experience in designing PCB and background in die level circuit design/layout is an advantage.Has good project management skills.Good oral and written communication skills.






Brief Job Description:The Product Engineer will be responsible for designing and implementing bench setup and fixtures for product evaluation, silicon functionality verification and product characterization. He/she will work closely with design and test engineering, marketing, customers and management to define the product’s datasheet specification including final test limit. He/she will also provide support activities on improving the product’s performance.


TEST DEVELOPMENT ENGINEERS (2) (as E06-E07 MEMS Test Development Engineer for ADGT Test/ Product Eng’g)

Qualifications:Graduate of BS Electronics & Communications & Electrical Engineering.

Strong technical background in MEMS and mixed signal measurement methodology and test implementation.

At least 2 years experience in semiconductor industry.Has experienced working with Labview and Automatic Test Equipment (ATE).Proficient in MEMS module and system fabrication.Possesses strong knowledge in semiconductor MEMS fabrication.Has working knowledge in statistical process control and quality systems.Experience in designing PCB for MEMS application is an advantage.Has good project management skills.Good oral and written communication skills.






Brief Job Description:The MEMS Test Development Engineer will be responsible for designing and implementing both manual custom fixtures and test solutions for volume manufacturing. He/she will work closely with design engineering, product engineering, manufacturing, marketing, customers and management to define measurement strategies, implementation of test applications and release manufacturing solutions. He/she will also provide support during new product introductions and improvement activities on MEMS product testing.


TEST DEVELOPMENT ENGINEERS (9) (as E06-E07 Mixed Signal Test Dev’t. Engr. for ADGT Test/Product Eng’g)

Qualifications:Graduate of BS Electronics & Communications & Electrical Engineering. Strong technical background mixed signal measurement methodology and test implementation.Products of interest covers precision A/D and D/A converters, Audio DAC and Power Management.At least 2 years experience in semiconductor industry.Has experienced working with an Automatic Test Equipment (ATE).Possesses strong knowledge in semiconductor fabrication.Has working knowledge in statistical process control and quality systems.Experience in designing PCB for Mixed Signal application is an advantage.Has good project management skills.Good oral and written communication skills.






Brief Job Description:The Mixed Signal Test Development Engineer will be responsible for designing and implementing both manual custom fixtures and test solutions for volume manufacturing. He/she will work closely with design engineering, product engineering, manufacturing, marketing, customers and management to define measurement strategies, implementation of test applications and release manufacturing solutions. He/she will also provide support during new product introductions and improvement activities on product testing.


TEST DEVELOPMENT ENGINEER (as E06-E07 RF Test Development Engr. for ADGT Test/Product Eng’g)

Qualifications:Graduate of BS Electronics & Communications & Electrical Engineering. Can implement RF and mixed signal device characterization and testing.At least 2 years experience in semiconductor industry.Has experienced working with Labview and Automatic Test Equipment (ATE) such as Flex RF and

Ultraflex.Proficient in RF module and system fabrication.Possesses strong knowledge in semiconductor RF fabrication.Has working knowledge in statistical process control and quality systems.Experience in designing PCB for RF application is an advantage.Has good project management skills.Good oral and written communication skills.






Brief Job Description:The RF Test Development Engineer will be responsible for designing and implementing both manual custom fixtures and test solutions for volume manufacturing. He/she will work closely with design engineering, product engineering, manufacturing, marketing, customers and management to define measurement strategies, implementation of test applications and release manufacturing solutions. He/she will also provide support during new product introductions and improvement activities on RF product testing.


Qualifications:

Graduate of BS Electronics & Communications & Electrical Engineering. At least 2 years experience in final test, wafer probe/sort, test development, or any

related field in semiconductor and electronics. Proficient in circuit analysis. Knowledgeable in Pascal or C Programming language. Familiar with linear and mixed-signal testing. Excellent communication skills. Fresh graduates are welcome to apply.


The Manufacturing Test Engineer is responsible for product improvement covering quality, yield and cost. Understand root cause of quality/yield issue and drives resolution of the problem. Interfaces with various groups like chute yield team, product sustaining, test development and other teams necessary to drive improvements on products being supported.

MANUFACTURING TEST ENGINEERS (8)(as E05-E09 Test/Product Engineer for ADGT Test/Product Engineering)







Qualifications:Graduate of BS Electronics & Communications & Electrical Engineering. Strong technical knowledge on analog and digital circuit design.At least 2 years experience in IC layout and Layout Design Rules.Possesses strong knowledge in semiconductor fabricationExperience on Unix, CAD , Schematic capture, Custom layout, Circuit Simulator and Physical

Layout verification tools.

Has good project management skills.Good oral and written communication skills.


The Layout Engineering Specialist will demonstrate experience in the layout of integrated circuits including the ability to place and route active and passive devices. This includes the ability to plan the placement of major circuit components in an overall physical design and an understanding of how the physical layout can affect circuit performance of circuits like power amplifiers, switches and other devices. Responsibility also includes floor planning and top-level routing. The applicant must have a basic understanding of both digital and analog electrical circuits, be able to read electrical schematics and net lists, and be able to perform layout vs. schematic (LVS), design rule checks (DRC), electrical rule checks (ERC), ESD and latch-up checks. An understanding of semiconductor processes like Silicon CMOS/BiCMOS is desirable. The successful candidate must demonstrate an ability to work and communicate well with multiple groups, such as design automation, wafer fab engineering, and design engineering. Strong organization, documentation, and computer skills are required.

TEST DEVELOPMENT ENGINEERS (2)(as E06-E09 Layout Engineering Specialist for ADGT Test/Product Engineering)







Qualifications:

Graduate of BS Electronics & Communications & Electrical Engineering. Strong technical knowledge on analog and digital integrated circuit design and it's topologies and

architecturesAt least 7 years experience in analog/digital IC design, layout, characterization and design for testabilityPossesses strong knowledge in CMOS/BiCMOS semiconductor fabrication processesExperienced on Unix, CAD, Schematic capture, Custom layout, Circuit Simulator, and Physical Layout

verification toolsMasters degree in ECE/EE course is an advantage.Has good project management skills.Good oral and written communication skills.


TEST DEVELOPMENT ENGINEERS (2)(as E07-E11 Electrical Circuit Design Engineer for ADGT Test/Product Eng’g)






The Electrical Circuit Design Engineer will be part of a design team across multiple sites in developing innovative analog integrated circuit designs catering multiple strategies. Experienced in the entire product development process required, from product definition through circuit implementation, layout, debug, as well as playing an advisory role in test development and characterization. Must possess a solid understanding of various analog and digital topologies and architectures including amplifiers, ADC's, DAC's, sensors etc.


ASSEMBLY ENGINEER(as E07 to E11 Assembly Engineer for WW Packaging and Assembly Engineering)

Qualifications:

Graduate of BS Material Science, BS Metallurgical Engg, ECE, EE, ChE or ME. At least 5 years experience in semiconductor assembly manufacturing related roles. Team player, self-motivated, and with good communication skills. Excellent technical and project management skills. Knowledge in FMEA, 8D, SPC, DOE is preferred. Extensive experience in package development. Experienced in resolving assembly/packaging and test issues. Must be able to work with customers and subcontractors to resolve assembly related issues. Familiar with automotive AEC-Q-100 requirements is an added advantage. Experience in WLCSP is an added advantage.


The Assembly Engineer is responsible in process characterization, package analysis and subcon qualifications activities. He/She supports the development of advance packages; works closely with quality and resident engineering groups in the resolution of assembly related issues; coordinates with other groups (Test Manufacturing, Planning, Test Engg) in the testing of assembly/evaluation lots; and supports the resolution of test manufacturing issues related to assembly processes at ADI's assembly subcontractors. Part of his/her responsibilities may also include site certifications and qualification of major process changes.







TEMPORARY TECHNICIANS(as N00 Manufacturing Test Technician in GT Contactor group)

Qualifications: Graduate of Electronics, Electromechanical, Instrumentation or Industrial

Technology. With knowledge on test contactor repair and maintenance. Good Communication skills. Computer Literate.


The Equipment Maintenance Technician is responsible in providing adequate support in repair and recall of all test contactor with the aim of preventing and minimizing manufacturing downtime.

Deadline of submission is on March 3, 2010 For inquiries, you may call local 7022 / 7289 / 7413 / 7393.

For Manpower Pooling Only!!!

For referrers: Probationary period will apply to successful external applicant. Please submit their resume to KC Kare and Daisy Francia (ADGT) and Bicbic Recto (ADPI).

qualifications: graduate of any engineering course (chemical engineering an advantage)

Documents