qorvo qpf4006 39ghz gan mmic front end module - system ... · the first mmic fem targeting 5g base...
TRANSCRIPT
In the last year, the increasing develop-
ment of 5G has reshaped the Radio
Frequency (RF) power industry landscape,
driving the RF GaN market. Compared to
existing silicon LDMOS and GaAs
solutions, GaN devices are able to deliver
the power/efficiency level required for
next-generation high frequency telecom
networks. The Low Noise Amplifier (LNA)
market is expected to deliver a 16%
Compound Annual Growth Rate (CAGR)
with the implementation of diversity
modules, along with integration in Power
Amplifier (PA) modules for handsets.
Qorvo was the first player to unveil a
Front-End Module (FEM) for ultra-high
band coverage based on GaN-on-SiC
0.15µm technology.
System Plus Consulting unveils Qorvo’s
design, presenting our reverse costing of
the QPF4006 39GHz GaN Monolithic
Microwave Integrated Circuit (MMIC)
FEM. The device is targeted for 5G base
stations and terminals and combines, on
the same die, a high linearity LNA, a low
insertion-loss Transmit Receive (TR)
switch and a high gain PA.
The QPF4006 is assembled in an air-cavity
laminate package with embedded copper
heat slug which demonstrates Qorvo’s
internal test and packaging capability.
The device is manufactured with 0.15µm
gate technology and AlGaN/GaN epitaxial
structure deposited on a SiC substrate.
Other than MMIC components it includes
TaN resistors, SiN capacitors and three
levels of metal interconnects including
gold airbridges.
This report includes a detailed analysis of
the packaging and the GaN on SiC
transistor with optical and Scanning
Electron Microscope (SEM) pictures.
Moreover it provides a cost analysis for
the complete device.
COMPLETE TEARDOWN WITH
• Detailed photos
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Selling price estimation
The first MMIC FEM targeting 5G base stations and terminalsusing a 0.15µm GaN-on-SiC process.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: QorvoQPF4006 39GHz GaN MMIC Front End Module
Pages: 110
Date: October 2018
Format: PDF & Excel file
Price: EUR 3,990
Qorvo QPF4006 39GHz GaN MMIC Front End Module
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Company Profile
• Qorvo
Physical Analysis
• Synthesis of the Physical Analysis
• Package Analysis
Package opening
Front-end module design
Package cross-section
• Die
Die view and dimensions
Die process
Die cross-section
Die process characteristics
Manufacturing Process
• Die Front-End Process
• Die Fabrication Unit
• Final Test and Packaging Fabrication Unit
AUTHORS
Cost Analysis
• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• Gan on SiC die
Front-end cost
Die probe test, thinning and dicing
Wafer cost
Die cost
• Complete Device
Packaging cost
Final test cost
Component cost
Price Analysis
• Estimated Sales Price
QORVO QPF4006 39GHZ GAN MMIC FRONT END MODULE
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Elena holds a Master in Nano-technologies and a PhD inPower Electronics.
Elena Barbarini is in charge ofcosting analyses for MEMS, ICand Power Semiconductors.She has a deep knowledge ofElectronics R&D and Manu-facturing environment.
Yvon Le Goff has joined SystemPlus Consulting in 2011, in orderto setup the laboratory ofSystem Plus Consulting. Hepreviously worked during 25years in Atmel NantesTechnological Analysis Labor-atory as fab support in physicalanalysis, and 3 years at HirexEngineering in Toulouse, in aDPA lab.
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Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
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REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTQORVO QPF4006 39GHZ GAN MMIC FRONT END MODULE
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