printed electronics - mycmp · 4 printed electronics: why? disclaimer: si-based electronics...
TRANSCRIPT
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Printed Electronics
Laboratoire ITODYSUniv. Paris Diderot, Sorbonne Paris Cité, ITODYS,
UMR 7086 CNRS 15 rue J-A de Baïf, 75205 Paris Cedex 13, France
Benoît PIRO, Vincent Noël, Giorgio Mattana, Nicolas Battaglini, Samia Zrig, Guillaume Anquetin, Steeve Reisberg
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2020 Annual Users’ Meeting CMP
Team BIOSS, Bioelectronics& Smart Surfaces
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Ex-
(we moved from Jussieu in 2007)
2020 Annual Users’ Meeting CMP
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I. Printed Electronics: Why?II. The Printing ProcessesIII. What to Print? Which substrate?IV. Examples of Printed Electronics
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Summary
Printed Electronics
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Printed Electronics: Why?
DISCLAIMER: SI-BASED ELECTRONICS (“TRADITIONAL”ELECTRONICS) STILL REMAINS UNBEATEN IN TERMS OF:- SWITCHING TIME (VERY HIGH MOBILITY OF SI);- INTEGRATION DENSITY (~ 40 MILLION FETS PER MM2).
PRINTED ELECTRONICS IS NOT A DIRECT COMPETITOR OF SI-BASED
ELECTRONICS, IT RATHER OFFERS COMPLEMENTARY SOLUTIONS
WHENEVER THE FOLLOWING CHARACTERISTICS ARE NEEDED:- LARGE-AREA FABRICATION
- LIGHTWEIGHT;- FLEXIBILITY;- LOW FABRICATION COSTS.
MARKET PREVISIONS: ~ 70 BILLION $ IN 2025!
Source: Printed Electronic World
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CONTACT printing (conventional) vs. CONTACTLESS (numerical)
CONTACT Printing
CONTACTLESS
(conventionnal)
(numerical)
Ink spread over the master
Ink
Master
Contact with the sustrate
Pressure
Withdrawal of the master
Nozzle
InkReservoir
Filling Ejection of the drop Spreading of the drop
Printing techniques:
Printed Electronics: Processes
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Printing techniques:
Conventionalprinting
Digital printing
Printed Electronics: Processes
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Conventional printingPrinting techniques:
Screen -printing
FlexographyOffset,
lithograhy
Printed Electronics: Processes
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Screen-printingConventionnal
printing
Planar screen-printing (sheet) Roll-to-roll screen-printing
Blade
InkScreen
Frame
Substrate HolderPrinting roll
InkBlade
Printing roll with screen
Substrate
Printed Electronics: Processes
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Screen-printing machinesConventionnal
printing
Printed Electronics: Processes
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Screen-printing machinesConventionnal
printing
PRINTEC@BiOSS
PRINTEC@BiOSS
Printed Electronics: Processes
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Digital printingPrinting techniques:
Inkjet
Printed Electronics: Processes
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InkjetDigital
printing inkjet
Jet Drop-on-demand (DOD)
Thermal actuation
Piezzoactuation
Actuation Nozzle Substrate
Waveform
Moving direction
of the substrate
InkPrinting file
Printed Electronics: Processes
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Digital printing Inkjet printers
PRINTEC@BiOSS
PRINTEC@BiOSS
Dimatix 2840, Fujifilm (desktop)
Printed Electronics: Processes
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Inkjet-Printed Electronics
INKJET-PRINTING VS OTHER PRINTING TECHNIQUES
INKJET-PRINTING: ADVANTAGES- NON-CONTACT TECHNIQUE;- DIGITAL TECHNIQUE;- REQUIRES SMALLER AMOUNTS OF INKS;- VERSATILITY: FROM RAPID PROTOTYPING TO LARGE SCALE PRODUCTION.
INKJET-PRINTING: WEAKNESS- VERY STRICT TUNING OF INK PROPERTIES;- LIMITED SPATIAL RESOLUTION (~ 30 μM);- VERY LOW THROUGHPUT SPEED.
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Organic semiconductors
• 1948. First report of an organic semiconductor• 1963. Electroluminescence in anthracene crystals (Pope, Kallmann, Magnante)• 1977. Conducting polymers (Heeger, McDiarmid, Shirakawa)• 1986. Organic transistors (polythiophene) (Koezuka)• 1986. Organic photovoltaic cell• 1987. OLED (Tang & van Slyke)
Polyacetylene
Polyphenylene
Polythiophene
Poly(phenylene-vinylene)
Oligothiophene
Polyacene
What to Print? Which Substrate?
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PCDTBT PBTTT
PTB7
DPP-DTT
What to Print? Which Substrate?
P3HT
PBDTT-DPP
PDPP4T
PNDI(2HD)2T
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Drop Vol. = 10 pLNo satellite drops
Ejected droplets
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What to Print? Which Substrate?
Graphene Aqueous-based Suspension of “nanoflakes” of graphene
oxide (GO)
Surfactant-free ink formulation: water/ethylene glycol/ 1-propanol GO dispersed by ultrasonic fragmentation
headsuspension of
GO flakes
Au
substrate
Satisfy the rheological parameters for printing (dynamic viscosity & surface tension)
Ink : Suspension of GO flakes
Dimatix inkjet printer (DMP 2831)
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J. Perelaer et al., J. Mater. Chem. 2008, 18, 3209
Inkjet-printed silver tracks
Before sintering : separate AgNPs.NON CONDUCTING.
After sintering : AgNPs « melted » to forma percolation pathway. CONDUCTING.
What to Print? Which Substrate?
Metals !
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Flexible polymer substrates flexibles must present:
• Good dimensional stability,• Good thermal stability, high Tg, low
dilatation coefficient,• Good resistance to solvents,
& be impermeable to O2 and H20
What to Print? Which Substrate?
Flexible substrates
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G. Mattana et al. Org. Electron. 2015, 17, 77Example of a printed OFET:OFETs on ultrathin biodegradable PLA (poly lactic acid)
Examples of Printed Electronics
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B.B. Narakathu, et al. IEEE Sensors 2012, 1-4(Capacitive)
Pressure sensors (printed)
Examples of Printed Electronics
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L. Kergoat et al., Advanced Materials 2014, 26, 5658-5664
Neuromediators sensor
Biotransistors (printed): the OECT
Examples of Printed Electronics
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L. Kergoat et al., Advanced Materials 2014, 26, 5658-5664
Glutamate sensor
Acetylcholinesensor
Neuromediators sensor
Biotransistors (printed): the OECT
Examples of Printed Electronics
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Examples of Printed Electronics
Humidity sensors for the detection of R.H. in air
- SUBSTRATE: KAPTON® (POLYIMIDE);- ELECTRODES: Ag;- SENSING LAYER: CELLULOSE ACETATE BUTYRATE (CAB)
- DEVICE ACTIVE AREA: 10 MM × 15 MM
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Everything is possible…Humidity sensors for the detection of R.H. in air
Examples of Printed Electronics
On human
On living plants (e.g. leaves)
Inkjet-printing on Leaves (Eléagnus)Sensor’s Structure: - interdigitated electrodes printed in PEDOT:PSS; - 1 layer of CAB; - response to breath.
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Examples of Printed Electronics
FABRICATION OF ALL-INKJET-PRINTED ELECTROLYTE-GATED FIELD-EFFECT TRANSISTORS (EGOFETS)
- SUBSTRATE: KAPTON® (POLYIMIDE);- ELECTRODES: Au;- ORGANIC SEMICONDUCTOR:
- DEVICE ACTIVE AREA: 5 MM × 5 MM
DPP-DTT5 mm
L = 100 μm
0,0 -0,1 -0,2 -0,3 -0,4 -0,5
0,04
0,02
0,00
-0,02
-0,04 -0,8V
-0,7V
-0,6V
-0,5V
-0,4V
-0,3V
-0,2V
-0,1V
0V
i DS(µA)
VDS(V)
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TODAY IJP IS PRACTICALLY AND SUCCESSFULLY USED FOR THE FOLLOWING PURPOSES:- FABRICATION OF CONDUCTIVE ELECTRODES;- DEPOSITION OF FUNCTIONAL LAYERS (ADHESION LAYERS, DIELECTRIC LAYERS, SENSING LAYERS…).
DEPOSITION OF SEMI-CONDUCTING LAYERS NEEDS STILL OPTIMISATION!
CHALLENGES TO BE FACED- DROPLETS EMISSION AND MANIPULATION, INTERACTION DROPLETS/SUBSTRATE;
- TOWARDS SUB-MICROMETRE RESOLUTION
- IMPROVEMENT OF FUNCTIONAL MATERIALS (SEMICONDUCTORS) STABILITY AND PERFORMANCES;- MULTI-TECHNOLOGY INTEGRATION: SURFACE TREATMENTS, PRINTING, LAMINATION,… ALL INTEGRATED ON
A SINGLE INDUSTRIAL DEVICE.
Conclusions
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Materials(chemistry)
Inks(formulation)
Electronics(physics)
Printing (techniques)
Organic Electronics on Flexible Objects
Conclusions
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S. ZrigB. Piro G. AnquetinV. Noël S. ReisbergG. Mattana N. Battaglini
Implanted sensors in
Human / Living organisms
Sensors on Biomedical
devices
4D Printing
(3D + function)
Electrochemical
Systems
Concep. / Fab
Understanding
2D Printing
(inkjet – beyond the limits)
Biosensors
Electroch. /
Sensors /
Elec. Orga
Electroch.
Elec. Orga.
Synthesis Synthesis Inkjet /
Electron.
Semicon. /
Near Field
Imaging
Biotech. /
Med.
Applications
Team BiOSS – Bioelectronics and Smart Surfaces
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SelectedProjects
2
BiOSS / Hôpital Tubingen (DE)
Hydrogel EGOFETs
Applied to Living
Organisms
Dielectrophoresis and
Reverse Osmosis for
Membraneless Sieving
BiOSS / PHENIX /
IFREMER / ENS (FR)
Flexible and Printed
Electronics
(in general)
BiOSS / EPFL (CH)
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Team BiOSS – Bioelectronics and Smart Surfaces
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Printed Gas Sensors
Applied to Dysbiosis
BiOSS / ISEP / IM2NP
Electronic Devices in
Living Plants
BiOSS / U-Norkkoping (SE) /
U-Bari (IT) / U-Bordeaux
Printed Graphene and
Control of its
Electronic Properties
BiOSS / MPQ / PPSM / ICMMO
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Team BiOSS – Bioelectronics and Smart Surfaces
SelectedProjects
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Team BiOSS – Bioelectronics and Smart Surfaces
On-goingcollaborations
Collab.
• Nationales
• Internationales
5
X / ICMMO
ISEP / IM2NP
PHENIX /
IFREMER / ENS
MPQ / PPSM
/ ICMMO
Hopital
Tübingen
EPFL-
Neuchatel
U-Norkkoping /
U-Bari / U-Bordeaux
COBRA
LPL /
LSPM
• Industrielles
ValoTec
Omini lab
Air Liquide
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Team BiOSS – Bioelectronics and Smart Surfaces
SomeDedicatedEquipments
4
x 2
Sérigraphie 1
Sérigraphie 2
Jet d’encre
Tapis de séchage
Ozone 1
Ozone 2
Recuit thermique
Recuit photonique
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Team BiOSS – Bioelectronics and Smart Surfaces
SomeDedicatedEquipments
3
Carac. élec. 1
Carac. élec. 2 + carac. optiques
Potentiostats
Viscosimètre
Tension de surf.
AFM
Angle de contact
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Réunion de Printemps du Club MicroCapteurs
Chimiques
THÈME :
FLEXIBLE ELECTRONICS
Jeudi 26 mars 2020
Laboratoire ITODYS
15 rue Jean-Antoine de Baïf, Paris 13
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AFELIM représente la filière
de l'électronique imprimée, organique ou non organiquehttp://www.afelim.fr/
Paris, mars 2020