1Pacific MicroCHIP Corp. 2008

Dalius Baranauskas

Denis Zelenin

Evaluation Report – White Paper

2Pacific MicroCHIP Corp. 2008

OUTLINE

1. Test Objective. DUT Description

2. On-wafer Probing Setup For Static Frequency Divider

3. On-wafer Probing Equipment

4. Measurement Equipment Readings. DUT Input And Output

5. Measured Divider Input Power Level vs. Input Refered Working Frequency

6. Measured Divider Output Power Level vs. Input Refered Working Frequency

7. Measured Self-Oscillation Frequency over Power Supply Voltage

8. Measured Current Consumption over Power Supply Voltage

9. Measured Output Power over Power Supply Voltage in Self-Oscillation Mode

10.Conclusion

3Pacific MicroCHIP Corp. 2008

Objective: test and characterize 60GHz Frequency

divider By2. Device under test (DUT) was fabricated

on MPW runs at Jazz Semiconductor. DUT is a

3x1.3mm die on a 5x5mm MPW tile (Figure 1).

Figure 1. MPW tile and 60GHz divider location on the tile.

Test Objective. DUT Description

4Pacific MicroCHIP Corp. 2008

50

Spectrum

Analyser

G

G

SPitch 123um

Pitch 123um

GG S

50 - 75GHz

Up to 40GHz

G

SPitch 123um

+3.3V

Power

G GS

OPTIONAL

50

+

m

Pad Opening

Dimensions

m

m

Spectrum

Analyser

mm

mm

Signal

Generator

Up to 40GHz

On-wafer Probing Setup For Static Frequency Divider

1 2 3 4 5

1 2 3 4 5

MPW A0816

MPW A0686

10 DUT Tiles from 2 MPW runs

are glued on a blank wafer.

5Pacific MicroCHIP Corp. 2008

Equipment used:

1. Cascade Corp RF probe station and supporting equipment.

2. Agilent 83557A Source Module

3. Agilent 8565EC 50 GHz spectrum analyzer

4. HP 83650B Synthesizer

On-wafer Probing Equipment

6Pacific MicroCHIP Corp. 2008

70GHz Input signal.

NOTE: in order to calculated power level seen by

the IC, subtract 8dB from the source reading.

Divided Output signal.

NOTE: in order to calculated power level at the

IC output, add 5dB from the spectrum analyzer

reading.

Measurement Equipment Readings.

DUT Input And Output

7Pacific MicroCHIP Corp. 2008

Measured Divider Input Power Level vs. Input

Refered Working Frequency

Divider input power level vs. Input refered working frequency

-20

-15

-10

-5

0

5

50 55 60 65 70

Input Reffered working frequency, GHz

Input Power, dBm

DUT #1 MPW A0806

8Pacific MicroCHIP Corp. 2008

Output Power, dBm

-6

-5

-4

-3

-2

-1

0

1

2

50 52 54 56 58 60 62 64 66 68 70

Frequency, GHz

Power, dBm

Output Pow er, dBm

Measured Divider Output Power Level vs. Input

Refered Working Frequency

9Pacific MicroCHIP Corp. 2008

Measured Self-Oscillation Frequency

over Power Supply Voltage

Self Oscillation frequency

64

65

66

67

68

69

70

71

72

73

2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4

Power Supply Voltage, V

Frequency, GHz

Self Oscillation frequency

10Pacific MicroCHIP Corp. 2008

Measured Current Consumption

over Power Supply Voltage

IC current consumption over power supply voltage

0

50

100

150

200

250

300

350

2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4

Power supply voltage, V

Chip Current Consumption, mA

IC Current Consumption

11Pacific MicroCHIP Corp. 2008

Measured Output Power over Power Supply Voltage

in Self-Oscillation Mode

Output power at Self-Oscillation Frequency vs Power Supply Volatage

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4

Power supply voltage, V

Output power, dBm

Output power

12Pacific MicroCHIP Corp. 2008

Conclusion

Divider DUTs are measured and found

operating at expected 60GHz frequency

with sufficient margin up to about 70GHz.