photonic integrated circuits (pics)
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Photonic Integrated
Circuits (PICs)Nitin K. Lohar
2012JOP2495
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Overview
Introduction
Types of Integration
Materials used for PIC fabrication
Fabrication of Waveguides in PICs
PICs vs. Electronic ICs
References
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Photonic Integrated Circuits (PIC
Integrated circuit which incorporates at least two optical devoptical waveguide junction in between to form a single phot
Optical device such as lasers, modulators, detectors, attenuaDEMUXs, optical amplifiers, filters, couplers, photonic switches
Aim is to achieve greater processing power, lower cost per dimproved reliability, reduced space and power requirements
Primary application in fiber optic communication, others inclubiomedical sensing and photonic computing
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Example Devices
Image co
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Types of Integration
Hybrid
Many single function optical devices are assembled into a single
sometimes with associated electronic ICs
These devices are interconnected to each other by electronic a
couplings internal to the package
Highly complex and challenging
Monolithic Integration
Can consolidate many devices and functions into a single photo
Fabrication involves same steps as of electronic ICs: building dev
common substrate so that all photonic couplings occur within th
all functions are consolidated into a single, physically unique dev
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Material used for PIC Fabrication
Many material can be used such as: Indium Phosphide (InP), Arsenide (GaAs), Lithium Niobate (LiNbO3), Silicon (Si), and Si(Silicon on Insulator SOI).
LiNbO3: can be used for modulation and SHG, but cannot beactive Opto-electronic components such as lasers and detec
GaAs can be used for both lasing and detection but only in 8
telecom window. Si: mature CMOS technology available, can be used as mate
for passive optical components, but difficulties in active com
Indium Phosphide can be used for integration of both activeoptical devices operating in the 1310nm or 1550nm telecom
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Fabrication of Waveguides in PIC
Two types: Conventional index guided waveguides and Photon
Figure: of photstructurUV litho
etching
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PICs vs. Electronic ICs
Main difference: type of material used for fabrication
For Electronic ICs, it is mainly silicon
For the case of PICs, materials vary as per the functioning of dev
LiNbO3, GaAs, InP, SOI etc.
In an electronic IC, the main device is the transistor. In PIC, thparticular main device that dominates in the fabrication
Because of the mature technology available for Silicon, cost ICs is much less than of PICs, also, the number of componentICs is much larger than in PICs.
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Conclusion
Photonic integrated circuits make the whole system more cohelps in providing high performance.
These chips can be integrated with basic electronic circuits wapplicable for more functions.
The development of PIC technology has not yet reached its hThrough constant research, people are trying to make this te
common, low cost, and highly efficient one In future most of electronic ICs will be replaced by PICs.
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References
1. Application specic photonic integrated circuits through generic novel paradigm in photonics, P. Munoz, J.D. Domenech et al, Wa
2. Large-scale photonic integrated circuits, Nagarajan, R.; Joyner, Selected Topics in Quantum Electronics, IEEE Journal of , vol.11, nJan.-Feb. 2005 doi: 10.1109/JSTQE.2004.841721
3. Photonic Integrated Circuits: A Technology and Application Primwhite paper, Document Number: DS-008-001/0605, 2005.
4. Basic structures for photonic integrated circuits in Silicon-on-insulaBogaerts, D. Taillaert, B. Luyssaert, P. Dumon, J. Van Campenhou
D. Van Thourhout, R. Baets, V. Wiaux, and S. Beckx, Opt. Express 2004.
5. Diode Lasers and Photonic Integrated Circuits, L. A. Coldren, S. WWiley & Sons, Inc., 1995.
6. Image Courtesy: http://www.kaiamcorp.com/tech_detail1.htm