Photonic Integrated Circuits (PICs) Scaling Next Generation Optical Networks

Why integrate ?

Vacuum Tubes

Integration has led the way in electronics

Solid State Integrated Circuit

A look at how IC’s changed the electronic landscape

More Functions Capabilities Reliability

Less Space Power Unit Cost

Moore’s law + IC’s changed the landscape forever

Source: Wikipedia

So again … why converge Photonics onto IC’s? The question is – can you afford not to ?

Electronics…

Photonic Integrated Circuits are the next logical step in the world of optics!

Optics…

Demands on optical bandwidth are greater than ever

Drivers

Network Traffic

Video

Cloud

Mobility

6 © 2011 Infinera Corporation.

Market forces driving demands on DWDM systems

MORE BANDWIDTH

Capacity per Wave

Capacity per System

100G to Terabit pipes Rapid Plug & Play deployment

The optimal solution: Photonic Integration

Higher density Lower power

Carrier class reliability

Photonic Integration

8 © 2011 Infinera Corporation.

Optical Physical Layer Start with the basics

Intensity Modulation + Direct Detection (NRZ)

Tx Rx

100 Gb/s Transmit

100 Gb/s Receive

PICs Enable Economical Access to Digital Bandwidth

“WDM system on a chip”

Density allows for further integration of network functionality

Photonic Integration

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PICs Enable Integrated Switching

Enables “digital” functionality

Integrated switching at every node

High functionality Digital ROADM

Dramatic network simplification

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Optical (O) Electrical (E) Optical (O)

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Integrated Switching + WDM

Photonic Integration

PICs Enable On-Demand Network Bandwidth

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Pervasive Digital Switching

Integrated Switching + WDM

Photonic Integration

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Software-enabled “Ease-of-Use”

Digital switching at every node: OTN evolving to packet/OTN

Unconstrained bandwidth everywhere

Lowest cost per switched Gb/s

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Digital Optical Networks

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) PIC’s have been proven to be ultra reliable

Over 550M field hours without failures Entire PIC reliability better than single

discrete laser (FIT = 1.6)

High component reliability drives excellent Line Module reliability.

Line Modules MTBF of ~60 years

Next Generation DWDM 500Gb/s WDM “System on a Chip”

Move from OOK Modulation to Phase Modulation Creates an Optical Component “Explosion”

Tx

Rx

OOK

CMOS

PM-QPSK (DP-QPSK)

Photonic Integration is Required to Scale Space, Power and Reliability

500G, Large Scale, Monolithic PIC Implementation

500G Tx PIC

500G Rx PIC

Number of channels 5 x 100G

Monolithic InP Chips 2

Optical elements > 600

“Gold Box” Replacements > 100

Fiber Replacements > 400

COST

SIZE

POWER CAPACITY

RELIABILITY

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PIC’s lower costs & enable

greater functionality

Enable more functionality • Integrated switching

• Higher density design

• Greater convergence

Room for more • Packet convergence

• Scalable coherent networks

• Multi-Terabit Superchannels

Switching MPLS LSR

PIC’s enabling a generational change to meet market demands

PIC’s enables OPEX savings

Not just terabit scale…

Less Power

Less Space

Lower TCO 69% less

# Modules/Cards 9,770

3,024

67% less

# Chassis 568

189

33% less

Rack Space

150%

100%

50% less

Power

200%

100%

4D Junction; 1T/degree; 25% Add/Drop

Capacity

100%

~250% ~2-3X more

56% lower

Total Costs 225%

100%

Thank You