passive component technologies and market trends for power converters 2016 report by yole...
TRANSCRIPT
From Technologies to Market
Passives Components
Technologies & Market Trends for Power Converters
2016
Sample
From Technologies to Market
© 2016
3
REPORT OBJECTIVES
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
• In Yole’s investigation of the power passive components, we have identified diverse trends resulting from the
end-users of power electronics systems.
• This report analysis the market trends for passive components used at power converters (capacitors,
magnetics, resistors and laminated busbars).
• The scope of the report is limited to the main power converter applications (EV/HEV, PV inverters, wind
turbines, rail traction, UPS and industrial motor drives).
• And to the four passive components mentioned above (capacitors, magnetics, resistors and laminated busbars).
• The axes that are developed in this report are the following:
• Access the market for power passive components
• Have a clear overview of current technologies for passive components
• Understand the market dynamics for the related power electronics applications
• Identify the key drivers that will shape the market in the future
• Understand the main challenges and proposed innovations
4
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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REPORT METHODOLOGY
Technology analysis methodology Information collection
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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• Report Objectives 4
• What is in this report 5
• Glossary 9
• Executive Summary 10
• Power Electronics Market 2010 - 2021 31
Inverter market 38
• Passive Components Market 2015 - 2021 46
• Players landscape evolution 59
Partnerships & acquisitions in 2016 63
Capacitor manufacturers 65
Magnetic manufacturers 67
Resistors manufacturers 69
Laminated busbar manufacturers 71
Patent analysis 72
• Passive Components Technology Overview 75
• Capacitors 77
Characteristics 80
Technology challenges & innovations 91
Capacitor players – Focus on film capacitors 102
• Magnetics 107
Magnetic materials 109
Inductors & transformers 117
Innovations 121
Magnetics components players 130
• Resistors 134
Technology description 136
Innovations 142
Resistors players 144
• Laminated busbars 146
Connection type classification 149
Future challenges 158
Laminated busbar market & players 160
• Power Electronics Trends 166
• Passive components presence in applications 174
• Future challenges for passive components from system trends 197
• Conclusion 205
• Yole Presentation 209
TABLE OF CONTENTS
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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Biography & contacts
ABOUT THE AUTHORS
Mattin GRAO TXAPARTEGI
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutions andpassive components (from capacitors to protection devices). Previously, he worked as an intern at the French car maker Renault, designingpower converters for electric car chargers. He graduated from Grenoble INP with an Engineering degree in Electrical Systems, followed bya specialization in embedded systems for transportation. He then earned an advanced master’s degree in Aeronautics Engineering fromArts et Métiers ParisTech. During this time, he oversaw managerial, financial, and marketing fields within the aeronautics industry.
Mail: [email protected]
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PASSIVE COMPONENTS MARKET GROWTH
2012 - 2015 - 2021
The CAGR 2015-2021 of the capacitor market is +10%
• Capacitor and inductormarkets show the greatestgrowth between 2012 – 2021period.
• Resistors are mostly stable, witha greater increase for the next 5years.
• While laminated busbars arehaving a slight but continuousgrowth.
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PASSIVE COMPONENTS SPLIT PER APPLICATION
Which applications/industries are predominant?
• The XXX industryevolution between 2015 and2021 will be impressive atboth power capacitors andinductors markets.
• At the capacitor market,it will XXXX its marketshares reaching XXX% ofthe power capacitormarket.
• At the inductor market,it will XXX its marketshares, even though it willstill represent aroundXXX% of the market in2021.
• This means that technologyevolutions at the XXX systemlevel might directly affecta very important part ofthe power capacitorsuppliers.
The presence of EV/HEV industry at the power capacitor market will become predominant.
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PASSIVE COMPONENTS MARKET BY APPLICATION
Which application will drive the growth?
• XXXX, as well as XXXX or XXXX businesses will be the markets that will increase the overall passive components market.
• The main reason is related to their market growth at system level, more than a specific technology trends that could possibly impacttheir respective markets.
Inverter market growth drives a similar growth at the passive component markets.
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PASSIVE MARKET ANALYSIS
Bubble chart of the 2015 market
Motor drives
UPS
Wind turbines
Rail
EV/HEV
PV
ResistorsLaminated
busbars Capacitors Inductors
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PLAYERS LANDSCAPE & SUPPLY CHAINS
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FILM MANUFACTURERS MARKET SHARES
2015 film market share estimations
Film capacitor market shares in 2015
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PLAYERS POSITIONING ON THE MARKET
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FOCUS ON FILM DIELECTRICS
Most promising film dielectrics
Polypropylene (PP) and polyester (PET) are so far the preferred choices of converter manufacturers.
PP
PTFE
PET
PPS
PEN
~~
~
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TECHNOLOGY FEATURES & ROADMAPS
Exhaustive analysis of each passive component
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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INNOVATIONS
Embedded magnetics technologies
Integrated Passive Device (IPD) technologies are evolving faster than technologies on power electronics applications
Power electronicsLow power
IPD
PCB
embedded
Planar
magneticTechnologies NOT used at power electronic converters
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SYSTEM ARCHITECTURES
With passive components presence and function
With trends
per application
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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PASSIVE COMPONENTS COST ILLUSTRATION
Per application & power range
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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SYSTEM LEVEL TRENDS
Application main trends having an impact in power electronics
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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EVERY YEAR, YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US IN 2016 AT*:
• NEPCON JapanJanuary 13-15, 2016 – Tokyo, Japan
• CS InternationalMarch 1-2, 2016 – Brussels, Belgium
• Image SensorsMarch 15-17, 2016 – London, UK
• International Conference and Exhibition on Device PackagingMarch 15-17, 2016 – Fountain Hills, USA
• Lab-on-a-Chip European CongressMarch 15-16, 2016 – Madrid, Spain
• APECMarch 20-24, 2016 – Long Beach, USA
• PCIM EuropeMay 10-12, 2016 – Nuremberg, Germany
• ECTCMay 31-June 3, 2016 – Las Vegas, USA
• Sensors Expo & ConfJune 21-23, 2016 – San José, USA
• SEMICON WestJuly 12-15, 2016 – San Francisco, USA
• LED Professional Symposium – LpSSeptember 20-23, 2016 – Bregenz, Austria
• SEMICON EuropaOctober 25-27, 2016 – Grenoble, France
• SEMICON JapanDecember 14-16, 2016 – Tokyo, Japan
*Non exhaustive list
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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EVEN MORE !
• Who should be interested in this report? • Companies cited:
TDK/EPCOS, Murata, KEMET, AVX, Vishay, Panasonic, Taiyo Yuden, Exxelia
Technologies, ROHM, Nippon Chemi-Con, Johanson Dielectrics, Meritek
Electronics Corporation, Nichicon, Rogers Corporation, SBE Inc.,
Amphenol, AUXEL FTG, NEC TOKIN, TE Connectivity, Littelfuse, Maxwell,
Aerovox, Cornell Dublier, AEG, WIMA, Electronicon, Treofan, EACO,
Rubycon, Toray, Seika Electric, Hitachi Chemical, Shizuki, Xiamen Faratronic
CO., Kopafilm, Payton Planar, Himag, MHW, Coilcraft, Schaffner, Trasfor,
InTiCa Systems, EAGTOP, STS Induktivitaeten, BH Electronics, VAC
Vacuumschmelze, Wurth, Magnetics, Ferroxcube, Micrometals, Materials
Magic, AT&M, Magnetec, Cermet, Telema, MCB, Danotherm, Arcol, Ohmite,
Yageo, EBG, RS, Farnell, Idealec, Mersen, SunKing, Methode, CRRC,
Mitsubishi Electric, Denso, Sumitomo Electric Industries, Toshiba, Siemens,
Toyota Motor, General Electric, Kyocera, Samsung Electro Mechanics,
Fujitsu, DuPont Teijin Films, Electronic Concepts, Leclanché Capacitors,
Jianghai, Gore, KRAH, KHX,Vitrohm, etc.
o Passive components manufacturers:
• Evaluate the total accessible market for capacitors, magnetics, resitors
and laminated busbars in the power electronics industry
• Understand the power electronics industry’s market dynamics and its
important future applications
• Plan ahead for needed investment capacity related to this field
• Have access to new technological developments
o Raw material suppliers:
• Understand the differentiated value of your products and technologies
in the power passive components market
• Evaluate your TAM (Total Addressable Market) in power electronics
• Get the list of current and future key power players to drive your
business
• Evaluate which are the current needs that are not fulfiled with actual
technology solutions
o Inverter manufacturers:
• Identify which solutions your suppliers are lining up
• Understand the market trends affecting your suppliers
• Get the list of current and future key passive components players to
drive your business
• Have an overview of your competitive landscape
©2016 | www.yole.fr | Passives Components Technologies & Market Trends for Power Converters 2016 | Sample
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
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Sensors
LED
Compound
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Imaging Photonics
MedTech
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Advanced Packaging
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Management
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Yole Développement’s 30 analysts operate in the following areas
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4 BUSINESS MODELS
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• Market data & research, marketing analysis
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• Strategy consulting
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www.yole.fr
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www.i-Micronews.com/reports
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A GROUP OF COMPANIES
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technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
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OUR 2016 REPORTS PLANNINGo MEMS & SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities
2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology & Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Consumer Robots 2016
− 3D Imaging & Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Need Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut WLP: Technology Trends and Business Update 2016*
− Embedded Die Packaging: Technology and Markets Trends 2016*
− 2.5D & 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**
− Equipment and Materials for Fan Out Technology (Wafer vs Panel)
− Equipment and Materials for Advanced Substrates
− Equipment and Materials for 3D T(X)V Technology
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications & Market 2016: from LED to Consumer Electronics*
− RF GaN Technology and Market Analysis 2016
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
− OLED for Lighting 2016
− LED in Automotive Lighting 2016
o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends & Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
− RF GaN Technology and Market Analysis 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are available on
www.i-micronews.com
©2016 | www.yole.fr | About Yole Développement
30
OUR 2015 PUBLISHED REPORTS LIST
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Infrared Detector Technology & Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace & Industrial
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
o IMAGING & OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology & Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays
− Sapphire Applications & Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies & Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology & Market Trends
Patent Analysis by Knowmade and Teardown & Reverse Costing by System Plus Consulting are
available on www.i-micronews.com
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CONTACT INFORMATION
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• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]
• Japan & Asia: Takashi Onozawa, Representative Director, Yole KKEmail: [email protected]
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected]
• Report business
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]
• Europe: Lizzie Levenez, Global Business Development Manager EMEAEmail: [email protected]
• Asia: Takashi Onozawa, Representative Director, Yole KK.Email: [email protected]
• Greater China: Mavis Wang, Business Development DirectorEmail: [email protected]
• Financial services
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]
• General
• Email: [email protected]
©2016 | www.yole.fr | About Yole Développement