one shop stop semiconductors fabless

ONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOPSEMICONDUCTORSSEMICONDUCTORSSEMICONDUCTORSSEMICONDUCTORS

FABLESS FABLESS FABLESS FABLESS

VISIT USwww.serma-hirel.com

Stephen Rimbault BU MNGBenjamin Crouillere Sales Eng

AGENDAAGENDA

•• Group Serma at a glanceGroup Serma at a glance

•• Serma Technologies Serma Technologies FablessFabless offeroffer

•• Park of equipmentsPark of equipments

•• Physical and electrical expertise during product validationPhysical and electrical expertise during product validation

3 Divisions in France

1 Division in Germany

Created in 1991 / On Alternext MarketTurnover 2011 : 60 M€2 M€ investment / year6000 m² facilities650 Engineers & Technicians

GmbH

°

°

°°

PARIS - ILE DE FRANCEElectronics TechnologySoftware SafetyR&D

BORDEAUXHeadquartersElectronics TechnologyITSEFR&D

TOULOUSEElectronics TechnologyR&D

GRENOBLE - MinatecElectronics TechnologyMicro-Electronics

UKSales Office

TUNISIAElectronics Technologies

BULGARIA, ASIA (partners)

SERMA GmbhSales officesNuremberg, Berlin, Cologne

°

CANADASales Office - Montreal

-5

5

15

25

35

45

55

65

2005 2006 2007 2008 2009 2010

CA M€

Aeronautics / Space / Defence (32%)

Automotive (13%)

Railway (10%)

Energy / Measurement(19%)

Components and boardsmanufacturing (11%)

Telecom / Health/Consumer

(15%)

Serma Ingénierie (20M€)

Serma Technologies (21M€)

ID MOS (7M€)

Surlog(2M€)

Serma Gmbh (5M€)

Turnover per company - 2010Turnover

Turnover per field of activity

6

Created in 1991 / On Alternext MarketTurnover 2011 : 60 M€2 M€ investment / year6000 m² facilities650 Engineers & Technicians

PESSAC(BORDEAUX) HEADQUARTERSPESSAC(BORDEAUX) HEADQUARTERS

AGENDAAGENDA





Back End Semiconductors

1 Partner in Israel Verigy (Israel) Ltd.

1 Partner in EU / ASIA Test & Assy House

UNIC ONE SHOP STOPUNIC ONE SHOP STOP�� 1 FACE TO THE CUSTOMER1 FACE TO THE CUSTOMER

PACKAGINGPACKAGINGMASS MASS

PRODUCTIONPRODUCTION

ASSY & TESTASSY & TEST

ENGINEERINGENGINEERING

TEST PARTNERTEST PARTNER

FABLESSFABLESS

BACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONBACK END SERVICES SEMICONONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOP

Wafer Probing

Assembly

Final Testing

Packing

WarehouseTape outService

Package Design& Tooling

ATE Test HW & SW

ProductReliability

Product Characterization

PRODUCTION FLOWEN

GINEER

ING FLO

W

ESD IP & DFXDesign

Shipment


Tape outService


ATE Test HW & SW

ProductReliability


ENGINEER

ING FLO

W

ESD IP & DFXDesign


PHASE 1

� Design of ESD structures / IPs

� Mission profile and Reliability plan

� Test and Manufacturing Strategy

� ATE and Probing Test Program and tooling development

� Tape out Service* thru IDMOS

� Package Services (Organic and ceramics packages)

Design &Development

Validation

Industrialization

Pro

ject

Man

agem

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& c

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Ext

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Supply Chain


Reliability ExpertiseReliability ExpertiseReliability ExpertiseReliability ExpertiseReliability ExpertiseReliability ExpertiseReliability ExpertiseReliability ExpertiseQ&RQ&RQ&RQ&RQ&RQ&RQ&RQ&R

16

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical Lab-------- Reliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowMILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY –––––––– SPACE SPACE SPACE SPACE SPACE SPACE SPACE SPACE -------- DEFENSEDEFENSEDEFENSEDEFENSEDEFENSEDEFENSEDEFENSEDEFENSE

17

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical Lab-------- Reliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowAUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100AUTOMOTIVE AECQ100

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical Lab-------- Reliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowReliability FlowAUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE –––––––– HOME APPLIANCEHOME APPLIANCEHOME APPLIANCEHOME APPLIANCEHOME APPLIANCEHOME APPLIANCEHOME APPLIANCEHOME APPLIANCE

Reliability Reliability Reliability Reliability Reliability Reliability Reliability Reliability ExpertizeExpertizeExpertizeExpertizeExpertizeExpertizeExpertizeExpertize

We customize our reliability flowWe customize our reliability flowWe customize our reliability flowWe customize our reliability flowWe customize our reliability flowWe customize our reliability flowWe customize our reliability flowWe customize our reliability flowto match with customer environmentto match with customer environmentto match with customer environmentto match with customer environmentto match with customer environmentto match with customer environmentto match with customer environmentto match with customer environment

20

� ESD/LU/OVS Validation

� Electrical product characterization

� ATE & Lab Test Debugging

� Product & Package reliability testing

� Failure Analysis – Physical Lab (support to customers for

root cause analysis before launching a new mask set)

Design &Development

Validation

Industrialization

Pro

ject

Man

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& c

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Ext

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Supply Chain


� Pre-Production in House

� Partner in Europe for Ramp Up (OSAT)

� Test Transfer for mass Production (OSAT)

� Package qualification for mass production

� Time To Volume (TTV / Cost optimization)

21

Design & Development

Validation

Industrialization

Pro

ject

Man

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& c

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ltanc

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Ext

ende

d A

pplic

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Supply Chain


PACKAGINGPACKAGINGMASS MASS

PRODUCTIONPRODUCTION

ENGINEERINGENGINEERING

TEST PARTNERTEST PARTNER

CUSTOMERCUSTOMER

Wafer Probing

Assembly

Final Testing

Packing

Warehouse

PRODUCTION FLOW

Shipment


PHASE 2

Shipment

Die Bond Wire BondWafer-testWafer

MarkingTrim/FormTesting

Sawing

Molding

23

Design &Development

Validation

Industrialization

Pro

ject

Man

agem

ent

& c

onsu

ltanc

y

� Up-screening and production sustaining

� Zero Defect

� Yield Management

� Secured Warehouse EN9120 / EN9100 (in progress)*

� EAR/ITAR Management *

Ext

ende

d A

pplic

atio

ns

Supply Chain


24

Design &Development

Validation

Industrialization

Pro

ject

Man

agem

ent

& c

onsu

ltanc

y

� Up-screening and production sustaining

� Zero Defect

� Yield Management

� Secured Warehouse EN9120 / EN9100 (in progress)*

� EAR/ITAR Management *

Ext

ende

d A

pplic

atio

ns

Supply Chain


25

� Up-screening

� ULPY

� Moving Limits

Supply Chain


26

� Up-screening

� ULPY

� Moving Limits

Supply Chain


� Consulting on Industrial strategy, Qualification and test

� Risk Assessment (Cost Model / Quality / Schedule)

� Best practices for Industrial Strategy and implementations

� Supplier Quality assurance

� Service Level agreement for mass production

� Project Management (Schedule, Milestones, Gate Review)

� On site Training

27

Design &Development

Validation

Industrialization

Pro

ject

Man

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Supply Chain


Park of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of Equipments

Test EquipmentsMixed Signal /SOC tester

Verigy Pinscale 93K (448 Digital Channels, 3600Msps) (AWG/DIG 16/24 Bits)16 Power Supply

448 Digital Channels High Speed (up to 3600 msps) – SERDES – DDR2/DDR3 –HDMI …High Speed convertors 16 Bits / Low Speed convertor 24 Bits) ADC/DAC

Logics & Memories- Schlumberger EXA ITS 9000 (256 pins, 100 MHz)

- Schlumberger EXA 3000 SOC mixed (280 pins, 200 MHz)

- Sentry S15 (128 pins to 20 MHz) (x 2)

- Sentry 1650 (256 pins, 20/40MHz) (x2)

Analog testers- Teradyne A370 (x2)

- HP 9472, EATON ( discrete components)

- LTS2020 (discrete components)

- ATX7006 (AWG/DIG 16/24 bits) ADC/DAC

- ATX7002 (AWG/DIG 12/20 bits) ADC/DAC

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of Equipments

Investment 2011

Test Equipments

Power Analog testers- Custom tester for IGBT

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of EquipmentsPark of Equipments

Probe Test

- 6” and 8” prober EG2001 with Hot chuck

Thermostream- 250°C / -65°C

- 300°C / -65°C

DataManagement (Gauge R&R, Yield Management, Characterization, ZD)

Electrical and product Electrical and product Electrical and product Electrical and product Electrical and product Electrical and product Electrical and product Electrical and product ExpertiseExpertiseExpertiseExpertiseExpertiseExpertiseExpertiseExpertise

Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization Electrical Test & characterization (15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)(15 Test & Product engineers)

Memories & FPGAMemories & FPGAMemories & FPGAMemories & FPGAMemories & FPGAMemories & FPGAMemories & FPGAMemories & FPGA : Flash / SDRAM / DDR / MRAM / PCRAM…

Digital Digital Digital Digital Digital Digital Digital Digital SerdesSerdesSerdesSerdesSerdesSerdesSerdesSerdes: HDMI / PCie / JESD204x / SATA …

AnalogAnalogAnalogAnalogAnalogAnalogAnalogAnalog :Video AOP / Oscillators / TR/ VCO / DC-DC/… (capability of measurement pA on

ibias)ConvertorsConvertorsConvertorsConvertorsConvertorsConvertorsConvertorsConvertors ADC/DAC : 24 bits audio / 16 bits Video (Best practises for high accuracy)

Digital Digital Digital Digital Digital Digital Digital Digital : Scan / Bist / Boundary …

PowerPowerPowerPowerPowerPowerPowerPower : IGBT measurement and characterization

- Thermal cycles (X5)

- Temperature & humidity (HAST, UHAST,THB) (X3)

- Pressure Cooker (PPOT) (X3)

- High-temperature storage, Burn-in (X8)

- Thermal Shock (X2)

- Vibration HALT (-100°C / +250°C;70°C/mn;70 g) (X1)

- Preconditioning

- Very High Pressure cycling (2000 BAR, 275°C) (X4)

Environmental Test Service

Electrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabElectrical LabEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipmentsEnvironmental equipments

AGENDAAGENDA





Wafer Probing

Assembly

Final Testing

Packing



ATE Test HW & SW

ProductReliability


PRODUCTION FLOWEN

GINEER

ING FLO

W

ESD IP & DFXDesign

Shipment


Wafer Probing

Assembly

Final Testing

Packing



ATE Test HW & SW

ProductReliability

PRODUCTION FLOWEN

GINEER

ING FLO

W

ESD IP & DFXDesign

Shipment



Wafer Probing

Assembly

Final Testing

Packing



ATE Test HW & SW

ProductReliability

PRODUCTION FLOWEN

GINEER

ING FLO

W

ESD IP & DFXDesign

Shipment


Failure Analysis& FIB


SERMA TECHNOLOGIES

38

• 3D X RAYS• OPTICAL INSPECTION• ACOUSTIC INSPECTION• PIND TEST, • LEAK TEST• WETTING BALANCE• RGA• MECANICAL OPENING• CHEMICAL OPENING• WIRE PULL TEST • DIE SHEAR TEST• MICROSECTION• CHEMICAL STAINING • SEM INSPECTION• TEM INSPECTION• ATOMIC FORCE MICROSCOPY• ANALYSE EDX, WDX, AUGER, SIMS, ESCA• DELAYERING• METAL REMOVAL

Physical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabAnalysis ToolsAnalysis ToolsAnalysis ToolsAnalysis ToolsAnalysis ToolsAnalysis ToolsAnalysis ToolsAnalysis Tools

SERMA TECHNOLOGIES

39

• MICRO PROBING

• LASER CUTTING

• LIQUID CRISTAL

• EMISSION MICROSCOPE

• ION MICROSCOPE

• INFRARED THERMOGRAPHY

Physical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabPhysical LabFailure Analysis ToolsFailure Analysis ToolsFailure Analysis ToolsFailure Analysis ToolsFailure Analysis ToolsFailure Analysis ToolsFailure Analysis ToolsFailure Analysis Tools

Design modification (FIB)Design modification (FIB)Design modification (FIB)Design modification (FIB)duringduringduringduring chip validation / chip validation / chip validation / chip validation / CharacterizationCharacterizationCharacterizationCharacterization


Wafer Probing

Assembly

Final Testing

Packing



ATE Test HW & SW

ProductReliability

PRODUCTION FLOWEN

GINEER

ING FLO

W

ESD IP & DFXDesign

Shipment


Failure Analysis& FIB


SuccessSuccessSuccessSuccess StoryStoryStoryStoryASIC for ASIC for ASIC for ASIC for SpaceSpaceSpaceSpace ApplicationApplicationApplicationApplication

ONE SHOP STOPONE SHOP STOPONE SHOP STOPONE SHOP STOP

Wafer Probing

Assembly

Final Testing

Packing

WarehouseWafer HW & SW


ATE Test HW & SW

CharacterizationHW & SW


PRODUCTION FLOW

DEVELO

PMENT FLO

WNew Mask

Set

SuccessSuccess Story : Story : IndustrializationIndustrialization of of AnalogAnalog ASIC ASIC

for for SpaceSpace Application 16HPCMDApplication 16HPCMD


SuccessSuccess Story : Story : IndustrializationIndustrialization of Digital ASSP of Digital ASSP

for Consumer Businessfor Consumer Business

Wafer Probing

Assembly

Final Testing

Packing

WarehouseWafer HW & SW


ATE Test HW & SW



PRODUCTION FLOW

DEVELO

PMENT FLO

W

ESD IP & DFXDesign

Shipment

Analog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space Application

Analog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space ApplicationAnalog ASIC for Space Application

Wafer Wafer Wafer Wafer ProbingProbingProbingProbingHardware Hardware Hardware Hardware developmentdevelopmentdevelopmentdevelopment (Design & (Design & (Design & (Design & ManufacturingManufacturingManufacturingManufacturing))))

Wafer HW & SW

Wafer Wafer Wafer Wafer ProbingProbingProbingProbingEffectEffectEffectEffect of of of of probingprobingprobingprobing on the dieson the dieson the dieson the dies

Wafer HW & SW

Package Design and Package Design and Package Design and Package Design and ToolingToolingToolingTooling



Package Body & lids inspection

Package procurement

Wafer Sawing

Die Inspection

Die attachWire bonding

Bond strenghDie shear

Hermeticsealing

DimensionCheck

Package Package Package Package ManufacturingManufacturingManufacturingManufacturing

ATE Test HW & SW

AutomaticAutomaticAutomaticAutomatic Test Test Test Test Hardware and Software Hardware and Software Hardware and Software Hardware and Software DevelopmentDevelopmentDevelopmentDevelopment

ProductProductProductProductCharacterizationCharacterizationCharacterizationCharacterization


ReliabilityReliabilityReliabilityReliabilityHTOL HTOL HTOL HTOL BurnBurnBurnBurn in in in in BoardBoardBoardBoard Design and Design and Design and Design and ManufacturingManufacturingManufacturingManufacturing


ReliabilityReliabilityReliabilityReliabilityConstant Constant Constant Constant AccelerationAccelerationAccelerationAcceleration MIL 883G MIL 883G MIL 883G MIL 883G MethodMethodMethodMethod 2001.22001.22001.22001.2





SuccessSuccess Story : Story : IndustrializationIndustrialization of Digital IC of Digital IC

for Consumer Businessfor Consumer Business

Digital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationFor HDTVFor HDTVFor HDTVFor HDTVFor HDTVFor HDTVFor HDTVFor HDTV

Digital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in productionMain challenge Test Cost in production

High Volume ProductHigh Volume ProductHigh Volume ProductHigh Volume ProductHigh Volume ProductHigh Volume ProductHigh Volume ProductHigh Volume Product

5.5s8.75s8.75s8.75s8.75s15sTest Time per device

21s17.5s17.5s17.5s17.5s15sTotal Test Time

4s2s2s2s2s1sAudio/Video output tests

6s5s5s5s5s4sHDMI/SATA tests

3s2.5s2.5s2.5s2.5s2sIQ to MPEG Test

8s8s8s8s8s8sDigital Patterns

Quad SiteDual SiteDual SiteDual SiteDual SiteSingle SiteTest Type

Digital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93K

PS800 -200MbS

PS800 -800MbS

MBAV8

PS3600 -1.6GbS

Digital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93KVERIGY PINSCALE 93K

PreconditionningElectrical Test

SCAT Inspection(Top/Bottom) (3*10 parts)External Visual inspection

Bake 24 HoursMoisture

30°C/60%RH, 192 Hours(JEDEC22-A113, JESD20)

Convection Reflow 3 times 260°CElectrical Test

SCAT Inspection(Top/Bottom) (3*10 parts)External Visual inspection

231 samples135 samples

231 or 135 samplesHTOL Temperature Cycling HTSL THB HAST

HTOL 1000 Hours -55°C to 125°C HAST 264hrs 110°c/85%RH/2ATM2000 hours 500 cyc (2Cyc/h) 150°C / 1000hr 85°C/85%RH/1000hr HAST 96hrs 130°c/85%RH/2ATM

JESD22-A108 JESD22-A104 JESD22-A103C JESD22-A101C JESD22-A110D

77 samples 77 samples 77 samples 77 samples 77 samples45 samples 45 samples 45 samples 45 samples 45 samples

77 or 45 samples 77 or 45 samples 77 or 45 samples 77 or 45 samples 77 or 45 samples

Digital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationDigital IC for Consumer ApplicationReliability PlanReliability PlanReliability PlanReliability PlanReliability PlanReliability PlanReliability PlanReliability Plan

THANKS FOR YOUR ATTENTIONTHANKS FOR YOUR ATTENTION


VISIT USVISIT USwww.sermawww.serma --hirel.comhirel.com

one shop stop semiconductors fabless

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