om-5300 product guide sm967 - alpha assembly volume cpk: om-5300 (type 3) 0.00 0.50 1.00 1.50 2.00...
TRANSCRIPT
The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon
OM-5300Product Guide
Performance SummaryProcess Step Performance Feature OM-5300 Performance Capability
Fine Feature Print DefinitionExcellent print definition and consistant volumetric performance to 0.25mm (10 mil) circles and 0.3mm (12 mil) pitch rectangular QFP pads.
Tack Life >24 hours
Temperature Window Capable of printing in temperatures from 20°C to ≥ 30°C (68°F to ≥ 86°F)
Print ConsistancyRepeatable volume deposition and low volume variability (CpK > 2.0) on 0.25mm (10 mil) circles.
Print Speed Range25mm/second to 150mm/second (1 inch/second to 6 inches/second) down to 0.25mm (10 mil) circles and .3mm (12 mil) pitch QFP pads.
Pin Testability >98% Yield (<2% False Negatives) Best in Class
Resistance to Voids Exceeds requirements of IPC 7095 Class lll using soak reflow profile. Class II with straight ramp profiles.
Resistance to Hot and Cold Slump
Exceeds the requirements of IPC J-STD-005 and JIS-Z-3284 for hot and cold slump.
Flux Residue Cosmetics Clear, colorless residue.SIR Meets/Exceeds JIS, IPC and Bellcore Requirements
Electromigration Resistance Meets/Exceeds JIS, Bellcore and HP EL-EN 861-00 Requirements
J-STD-004 Classification ROL0Halide Content Halide and Halogen Free
Print Process Window
Reflow Yield
Electrical Reliability
The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon
Printing Performance
Print Performance
Fine Feature Print Definition
0.3mm (12mil) pitch QFPs* Using Type 3 Powder
Delivers High Fine Feature Print Yields
• Excellent print definition and consistent volumetric performance to 0.30mm (12mil) squares and 0.25mm (10mil) pitch circles
•Type 3 Powder Capable for Better Economy
*10 cm/sec (4in/sec), 0.26kg/cm (1.5 lbs/in) squeegee pressure, 0.125mm (5 mil) stencil
Print PerformancePaste Volume, Repeatability- Room Temperature (25° C)
Print volume CpK: OM-5300
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
4.00
1 7 13Board #
Volu
me
CpK
(with
in b
oard
s)
Initial - Boards 1-6
After wipe - Boards 7-12
After 1 hour pause - Boards 13-18
Print data: OM-5300
0
50
100
150
200
250
300
350
400
1 7 13
Board #
Volu
me
(cu
mil)
Average - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average - Boards 13-18 (pause)LSL - Average VolumeMinimum vol. - Boards 1-6Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume
Repeatable volumes after stencil wipe and 1 hour response to pause• Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300’s consistent printability
•High Volume Deposits
•High Level of Volume Repeatability
Print PerformancePaste Volume, Repeatability- Low Temperature (20° C)
Print data: OM-5300 (type 3)
0
50
100
150
200
250
300
350
1 7 13
Board #
Volu
me
(cu
mil)
Average - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average - Boards 13-18 (pause)LSL - Average VolumeMinimum vol. - Boards 1-6Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume
Print volume CpK: OM-5300 (type 3)
0.00
0.50
1.00
1.50
2.00
2.50
3.00
1 7 13Board #
Volu
me
CpK
(with
in b
oard
s)
Initial - Boards 1-6
After wipe - Boards 7-12
After 1 hour pause - Boards 13-18
Repeatable volumes after stencil wipe and 1 hour response to pause• Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300’s consistent printability
•High Volume Deposits
•High Level of Volume Repeatability
Print PerformancePaste Volume, Repeatability- High Temperature (30° C)
Print data: OM-5300 (type 3)
0
50
100
150
200
250
300
350
1 7 13
Board #
Volu
me
(cu
mil)
Average - Boards 1-6 (Initial)Average - Boards 7-12 (wipe)Average - Boards 13-18 (pause)LSL - Average VolumeMinimum vol. - Boards 1-6Minimum vol. - Boards 7-12Minimum vol. - Boards 13-18LSL - Minimum volume
Print volume CpK: OM-5300 (type 3)
0.00
0.50
1.00
1.50
2.00
2.50
3.00
1 7 13Board #
Volu
me
CpK
(with
in b
oard
s)
Initial - Boards 1-6
After wipe - Boards 7-12
After 1 hour pause - Boards 13-18
Repeatable volumes after stencil wipe and 1 hour response to pause• Continuous monitoring of paste volume over time demonstrates ALPHA OM-5300’s consistent printability
•High Volume Deposits
•High Level of Volume Repeatability
Print Consistency Over Range of Print Speeds-.010” (.25mm) Circles
Print Performance
Print speed = 1 in./sec (25.4mm/sec) Squeegee pressure = 1 lb/linear in.
(0.18 Kg/cm)
Print speed = 4 in./sec (100mm/sec) Squeegee pressure = 1.25lb/linear in.
(0.22 Kg/cm)
Print speed = 6 in./sec (150mm/sec) Squeegee pressure = 1.5 lb/linear in.
(0.26 Kg/cm)
Wide print speed capability allows for maximum throughput
• Repeatable volume deposition and low variability based on theoretical aperture volumes
• Faster print speed reduces print cycle time
• This allows printer to perform secondary functions without affecting SMT line beat rate
• Under stencil wipe
• 2D vision inspection
Print PerformancePrint Consistency Over Range of Print Speeds-.012” Pitch (.30mm) QFP Pads
Print speed = 1 in./sec (25.4mm/sec) Squeegee pressure = 1 lb/linear in.
(0.18 Kg/cm)
Print speed = 4 in./sec (100mm/sec) Squeegee pressure = 1.25lb/linear in.
(0.22 Kg/cm)
Print speed = 6 in./sec (150mm/sec) Squeegee pressure = 1.5 lb/linear in.
(0.27 Kg/cm)
Wide print speed capability allows for maximum throughput
• Repeatable volume deposition and low variability based on theoretical aperture volumes
• Faster print speed reduces print cycle time
• This allows printer to perform secondary functions without affecting SMT line beat rate
• Under stencil wipe
• 2D vision inspection
Hot Slump, 25% RH- PassHot Slump Test Form
Solder Paste: OM-5300 Sn 63 Date: 2/9/2007 Heating Equipment: OVENAlloy: 63/37 Temp / Hum 25% Profile 150C/10minLot #: 070208-P1 Substrate: Glass slide
Slide 1: Initial Slide 2: InitialStencil IPC-A-21 ( 8 mil thick ) Stencil IPC-A-21 ( 8 mil thick )
Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 0.33 0.15
0.1 B 0.10.08 B B 0.08
Slide 1: After 10 min in 25 %RH. +/-5% Slide 2: After 10 min in 25 %RH. +/-5%Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 0.33 0.15
0.1 B 0.10.08 B B 0.08
Slide 1: After 10 min in 150C Slide 2: After 10 min in 150CLarge 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 B B 0.33 0.15
0.1 B B 0.10.08 B B 0.08
If there is any bridging above the double lines, The test is a Fail.
Test Result: PASS Name: IshaForm 8442, Rev. 1,11/2000
Hot Slump, 75% RH- PassHot Slump Test Form
Solder Paste: OM-5300 Sn63 Date: 2/9/2007 Heating Equipment: OVENAlloy: 63/37 Temp / Hum 75% Profile 150C/10minLot #: 070208-P1 Substrate: Glass slide
Slide 1: Initial Slide 2: InitialStencil IPC-A-21 ( 8 mil thick ) Stencil IPC-A-21 ( 8 mil thick )
Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 0.33 0.15
0.1 B B 0.10.08 B B 0.08
Slide 1: After 10 min in 75 %RH. +/-5% Slide 2: After 10 min in 75 %RH. +/-5%Large 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Hor. Vert. Gap mm Hor. Vert. Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 0.33 0.15
0.1 B B 0.10.08 B B 0.08
Slide 1: After 10 min in 150C Slide 2: After 10 min in 150CLarge 0.63 x 2.03 mm Small 0.33 x 2.03 mm Large 0.63 x 2.03 mm Small 0.33 x 2.03 mmGap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical Gap mm Horiz. Vertical
0.79 0.45 0.79 0.450.71 0.4 0.71 0.40.63 0.35 0.63 0.350.56 0.3 0.56 0.30.48 0.25 0.48 0.250.41 0.2 0.41 0.20.33 0 0 0.15 B B 0.33 0.15
0.1 B B 0.10.08 B B 0.08
If there is any bridging above the double lines, The test is a Fail.
Test Result: PASS Name: IshaForm 8442, Rev. 1,11/2000
Wipe Frequency Number of Bridges Sample # 1 PitchPrints L25R L20R L16R L12R
1 O O O O2 O O O O3 O O O O4 O O O O5 O O O O6 O O O O7 O O O O8 O O O O9 O O O O10 O O O O11 O O O O12 O O 1 213 O O O O14 O O 1 O15 O O 2 11617181920
Inside PrinterTemperature 72.0FRelative Humidity 20%
PUT-001.07 Form 01 Rev 3/26/01
11 Prints, 16 Mil Features
>15 Prints, 20 Mil Features
5 Mil Thick Stencil
Tack Strength / Life
• Stable tack over time
The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon
Wetting to Pb-Free Components
Profile – HS 160°C (60s)240°C peak
Profile – HS 160°C (60s)240°C peak
Profile - Ramp 0.7 °C/sec235° C peak
Profile - Ramp 0.7 °C/sec235° C peak
• Lead finish – Sn100
Class III Resistance to VoidingVoid Size Distribution
BGA256
0.00%
10.00%
20.00%
30.00%
40.00%
50.00%
60.00%
70.00%
80.00%
90.00%
100.00%
ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%
% of Joint area
% o
f Joi
nts
OM5300 High Soak 160°C 220°C P
OM5300 Ramp 0.7°C Sec 220°C P
OM5000 High Soak
OM 5000 Ramp
The information contained herein is based on data considered accurate and complete and is offered at no charge and without any other consideration provided by the recipient. No warranty, representation or guaranty, express or implied, of any kind or nature, is provided with respect to the information contained herein or the data on which it is based, including, without, limitation, any implied warranty of merchantability or fitness for a particular purpose or any warranty, representation or guaranty regarding the accuracy or completeness of such information or data. By accepting such information, the recipient acknowledges that any and all liability is expressly disclaimed for any loss or injury, whether or not foreseeable, arising out of the use of or reliance upon this information or any related data or designated materials. It is strongly suggested that all recipients of such information independently test and verify the accuracy, completeness, usefulness and characteristics of any such information, data and/or materials prior to any use thereof or reliance thereupon
Electrical Reliability Data
Bellcore SIR- Pass SIR TEST REPORT - BELLCORE Request: (per GR-78-CORE Issue 1, Sept 97)
Test #.0714-b Date: 3/8/07 T/H/B:35/85/-48Tested by:.K. Tellefsen Reported by:K. Tellefsen P/F limit:1E11 Ohms________________________________________________________________MATERIAL TESTED/ SIR SIR COMMENTSCONDITION (1 day) (4 days) -------- --------OM5300 63 Sn/37 Pb 1.6E+10 8.2E+10 Visually OKReflowed paste 8.0E+10 6.9E+10 4.5E+11 3.2E+11uncleaned 2.5E+11 1.9E+11 1.3E+11 2.2E+11 1.2E+11 1.2E+10 3.6E+10 2.7E+10 3.3E+10 2.5E+10 5.0E+11 9.2E+11 2.3E+11 2.6E+11 9.7E+11 2.6E+11 7.7E+11 7.3E+11 ----- -----Geometric mean: 1.6E+11 1.3E+11________________________________________________________________
Control boards 2.8E+12 1.3E+12 2.7E+11 2.9E+11 6.7E+11 6.4E+11 2.2E+12 1.2E+12 2.7E+12 4.1E+12 8.5E+11 8.8E+11 4.1E+11 3.7E+11 4.3E+11 4.1E+11 2.9E+12 2.4E+12 1.1E+12 1.3E+12 2.0E+12 1.3E+12 7.0E+11 9.6E+11 ----- -----Geometric mean: 1.1E+12 9.6E+11
IPC SIR-PassSIR TEST PER J-STD-004 Request: **********************Test #:0714-1i Date: 3/3/2007 T/H/B 85C/85%RH/-48VTested by: K. Tellefsen P/F limit:Reported by: K. Tellefsen 1.0E+08 ohms_______________________________________________________________________________________MATERIAL TESTED/ Initial SIR(ohms) SIR SIR Final COMMENTSCONDITION ambient (1 day) (4 days)(7 days) ambient ------- ------- ------- ------- -------OM-5300 63/37 9.5E+10 5.2E+07 2.1E+08 6.2E+08 3.6E+11 passed electricalReflowed paste 1.5E+11 2.9E+07 1.2E+08 3.4E+08 5.1E+11 and visualuncleaned 1.9E+11 6.5E+07 2.0E+08 5.2E+08 4.2E+11 requirements 1.1E+11 1.0E+08 1.4E+08 3.6E+08 3.6E+11 2.5E+11 4.0E+07 1.6E+08 7.1E+08 7.6E+11 3.1E+11 3.0E+07 1.3E+08 5.2E+08 4.3E+11 2.6E+11 5.8E+07 2.8E+08 8.0E+08 4.3E+11 3.6E+11 1.6E+07 1.4E+08 2.1E+08 4.1E+11 4.2E+11 3.7E+08 9.9E+08 1.1E+09 9.2E+11 5.2E+11 5.1E+08 8.8E+08 1.1E+09 7.4E+11 4.8E+11 5.4E+08 1.4E+09 1.6E+09 6.6E+11 4.7E+11 3.3E+08 9.8E+08 1.3E+09 8.1E+11 ------- ------- ------- ------- -------Arithmetic mean: 3.0E+11 1.8E+08 4.7E+08 7.7E+08 5.7E+11_______________________________________________________________________________________Control boards >1.0E+12 5.1E+09 3.3E+09 2.2E+09 >1.0E+12 >1.0E+12 4.8E+09 2.8E+09 2.0E+09 >1.0E+12 >1.0E+12 4.0E+09 2.4E+09 1.8E+09 >1.0E+12 >1.0E+12 5.1E+09 3.5E+09 2.5E+09 >1.0E+12 6.1E+11 5.9E+09 1.7E+09 3.1E+09 2.6E+11 7.2E+11 5.7E+09 4.2E+09 3.2E+09 4.8E+11 6.4E+11 6.3E+09 4.3E+09 3.3E+09 4.0E+11 8.5E+11 4.5E+09 3.1E+09 2.9E+09 3.6E+11 9.5E+11 6.3E+09 2.9E+09 2.7E+09 >1.0E+12 >1.0E+12 6.3E+09 3.3E+09 2.6E+09 >1.0E+12 >1.0E+12 7.1E+09 4.0E+09 2.8E+09 >1.0E+12 >1.0E+12 5.2E+09 3.8E+09 2.5E+09 >1.0E+12 ------- ------- ------- ------- -------Arithmetic mean: 9.0E+11 5.5E+09 3.3E+09 2.6E+09 7.9E+11
IPC Compliance
OM-5300Lot 070208-P1
Ag chromate - Pass
Cu mirror - Pass
• Paste is halide free, ROL0 per IPC