old milestones

D0 PMG, April 20, 2000 Slide 1

Old Milestones

DØ SMT Status Report

1/3/00: 6-chip ladder fabrication 20% complete– Not met

» Problems with sensors, need for visual inspection» Inadequate sensor delivery rate from Micron

– Met 1/31/00, 3.8 week late

1/19/00: F Wedge Assemblies 20% complete – Met 1/24/00, 0.4 weeks late

DD

The DØ Silicon group, however, has now formally adopted the split silicon support cylinder as its baseline design with a new schedule:

– First half cylinder by August 1, 2000– Second half cylinder by November 1, 2000


New Schedule

New Schedule adopted based on split support cylinder:» First half cylinder by August 1» Second half cylinder by November 1

Milestone Finish Date

Barrel 1 Complete April 18, 2000Barrel 2 Complete May 23, 2000Barrel 3 Complete June 28, 2000Barrel 4 Complete July 27, 2000Barrel 5 Complete August 24, 2000Barrel 6 Complete September 22, 2000

F Disk 0 Complete March 28, 2000F Disk 1 Complete April 11, 2000F Disk 2 Complete April 25, 2000F Disk 3 Complete May 9, 2000F Disk 4 Complete May 23, 2000F Disk 5 Complete June 21, 2000F Disk 6 Complete July 6, 2000

F Disk 7 Complete July 20, 2000F Disk 8 Complete August 3, 2000F Disk 9 Complete August 17, 2000F Disk 10 Complete August 31, 2000F Disk 11 Complete September 15, 2000F Disk 12 Complete October 6, 2000

H Disk 1 Complete May 17, 2000H Disk 2 Complete July 7, 2000H Disk 3 Complete August 25, 2000H Disk 4 Complete October 16, 2000

North Half-Cylinder Complete and Ready to Move to DAB July 27, 2000South Half-Cylinder Complete and Ready to Move to DAB October 27, 2000


Axial detectors (3-chip):– All sensors in hand

90o detectors (6-chip): – Micron delivery last month good: 30/March– This month at most 15 (Bank holidays, vacation)– Some of the later sensors are of high quality – Micron implanter being commissioned

» implantation done at IBS (Marseille)» will use 10 wafers to quality control implanter » Early results show more uniform implantation

than at IBS for bias resistor» If adopted, processing reduced by ~6 weeks

– production paced by sensor delivery 2o detectors (9-chip)

Micron:– Overall yield for year 2000 is 57% – Recently lost 8 sensors at Micron due to residue

deposition and 26 sensors returned» residue looks like photoresist, but is due to

outgasing of jigs» attacks metal layer, cannot wirebond

– Full delivery of initial order anticipated in April/May» Still to deliver 40 + 24 (lyr2), 12 + 24 (lyr4)

sensors– Barely enough sensors to complete full order– 50 additional wafers entered into system.

Eurisys:– Order cancelled. $31k to recover

Silicon SensorsBarrel


Disks

F-Wedge sensors Micron:

– Full order of sensors (125) received! – Yields were good. Possibility to purchase at most an

additional 18 sensors from production batch

Eurisys:– Tests on 10 wafers from second batch of 70 wafers

started– Results on p- and n-side look okay

– Breakdown Voltage still 70-80V at Vdepl=15-20 V

– No change and no change anticipated since implantation is the same

– Delivery: scheduled: 35 on Jan 15, 2000, 30 on Feb 21, 2000actual:

» 2nd batch: Mid April» 3rd batch: Early May» 4th batch: Mid July

H-Wedge sensors– 60 additional sensors on order


High Density Interconnect (HDI)

9-chip hdi’s– All Be pieces needed received. – 37 (34 + 3) hdi’s sent to Promex for stuffing – 10 passed– 27 developed surface bubbles

» These hdi’s are short tail hdi’s needed for third barrel !» hdi’s were baked in oven for 1 hour at 1250 C » Baking not logged » Cannot die-attach; may not be able to wirebond» Mark Freytag (SLAC) involved in inspection

Promex claims cannot give adequate prior notification before starting SMT processing

F-wedge hdi’s– All components for hdi’s in hand: Be, jumpers, hdi’s – 77 hdi’s at or being sent to Promex – 23 hdi’s at Fermilab for production

H-wedge hdi’s – All hdi’s in hand– 60 being laminated – 30 laminated; shipped to Silitronics

6-chip hdi’s– currently plenty (65) available for ladder production– one more round needed at Promex


Ladder and Wedge Production

Axial detectors (3-chip):– Production picked up again– Ladders built at slow but steady pace

2o detectors (9-chip): – Production lagging, out of hdi’s– Problems with 27 “short tail” hdi’s serious set back

90o detectors (6-chip):– Paced by Micron delivery, 74 sensors built so far

F Wedges (14-chip):– Production needs to pick up pace – Eurisys order is late. Lower acceptance criteria for sensors – Encapsulation of wire bonds very time consuming process

H Wedges (6-chip):– 160 half wedges produced to date– Set up procedures for full wedge production– bi-facial accuracy ~5-10 microns– Glued 25 full wedges of which ~15 grade A – Also here, encapsulation slow process: 2 half-wedges / day– Will start up production again when hdi’s are received from

Silitronics


Production Status

D0SMT Ladder/Wedge Production

0

20

40

60

80

100

120

140

160

180

03/31/99 05/20/99 07/09/99 08/28/99 10/17/99 12/06/99 01/25/00 03/15/00 05/04/00

Date

As

se

mb

lie

s P

rod

uc

ed

9 Chip

3 chip

6 Chip

H disk

F Disk

Ladder/Wedge Production Rate(20% Spares)

0

100

200

300

400

500

600

700

800

900

1000

2/9/99 5/20/99 8/28/99 12/6/99 3/15/00 6/23/00 10/1/00

Date

Ass

emb

lies

Total Assemblies Produced

Planned


Production Status for first half cylinder

New Schedule based on split support cylinder:– First half cylinder by August 1– Second half cylinder by November 1

Last dates for detector production:– F Wedges: June 26, 2000– 6-chip ladders: June 12, 2000

Yield Folded Detector Production

0

0.2

0.4

0.6

0.8

1

3/31/99 5/20/99 7/9/99 8/28/99 10/17/99 12/6/99 1/25/00 3/15/00 5/4/00

Date

Fra

cti

on

Co

mp

lete

9 Chip

3 chip

6 Chip

F Disk

Assumed Yields: – 9-chip: 80%– 3-chip: 85%– 6-chip: 85%– H-wedge: 85%– F-wedge: 90%


Projection of Production

Yield Folded Detector Production

0

0.2

0.4

0.6

0.8

1

3/31/99 7/9/99 10/17/99 1/25/00 5/4/00 8/12/00

Date

Fra

cti

on

Co

mp

lete

9 Chip

3 chip

6 Chip

H disk

F Disk

This week


Barrel Assembly

Barrel assembly ORC received! Ladders being installed as we speak

number in sequence layer

position in layer ID

number in sequence layer

position in layer ID

1 4o 1 9401 37 2o 1 92052 4o 3 9410 38 2o 2 92143 4o 5 9403 39 2o 3 92124 4o 7 9416 40 2o 4 92115 4o 9 9418 41 2o 5 92156 4o 11 9404 42 2o 6 92137 4i 2 9310 43 1o 2 32218 4i 4 9314 44 1o 3 32559 4i 6 9322 45 1o 4 3257

10 4i 8 9321 46 1o 5 325611 4i 10 9315 47 1o 6 325812 4i 12 9320 48 1o 1 324313 3o 2 3427 49 1i 314 3o 4 3436 50 1i 4 313115 3o 6 3466 51 1i 516 3o 8 3459 52 1i 6 316017 3o 10 3439 53 1i 118 3o 12 3461 54 1i 2 315919 3i 2 3322 55 2i 3 910920 3i 4 3305 56 2i 4 911221 3i 6 3355 57 2i 5 912022 3i 8 3361 58 2i 6 910823 3i 10 3356 59 2i 1 912924 3i 12 3315 60 2i 2 912425 3o 1 3408 61 3i 3 332426 3o 3 3463 62 3i 5 331327 3o 5 3437 63 3i 7 331828 3o 7 3467 64 3i 9 336429 3o 9 3460 65 3i 11 333730 3o 11 3448 66 3i 1 335831 4o 12 9405 67 4i 3 931132 4o 2 9408 68 4i 5 931233 4o 4 9402 69 4i 7 931334 4o 6 9413 70 4i 9 930435 4o 8 9406 71 4i 11 930936 4o 10 9419 72 4i 1 9323


Assembly Sequence

Currently 45 ladders (out of 72) installed in first barrel Delays encountered

– sign off on pORC– LK CMM acting up– Readout electronics acting up – ……– In short, bugs being worked out

Start with outer ladders, every 60o, work radially inward Six HDI pigtail bundles of 8 and 4 bundles each First barrel may take a while


First Barrel Assembly

Grade B (electrical)

Grade C (electrical)

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First Barrel Ladder Installation


Completed Subassemblies

14th F-disk complete !– Mainly mechanical grade ladders (1 detector grade)– Used to establish procedures and alignment

1st F-disk schedule:– Waiting for pORC ! – Test stand read-out not approved today

old milestones

Documents

h halfwedge fabrication

half cylinder

split silicon support

hdisks readyaugust

complete3 wmarch

complete3 wmay

central silicon complete

ladder test completefebruary