octobre 20 2006mpi munich vfcal report w. lohmann, desy laser alignment system infrastructure for...
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![Page 1: Octobre 20 2006MPI Munich VFCAL Report W. Lohmann, DESY Laser alignment system Infrastructure for sensor diagnostics Sensor test facilities FE design Labs](https://reader035.vdocuments.mx/reader035/viewer/2022081603/5697bfa11a28abf838c95a21/html5/thumbnails/1.jpg)
Octobre 20 2006 MPI Munich
VFCAL Report
W. Lohmann, DESY
Laser alignment system
Infrastructure for sensor diagnostics
Sensor test facilities
FE design
Labs involved: Cracow UST, Cracow INP, Prague (AS), Tel Aviv Univ. DESY (Z.)
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Octobre 20 2006 MPI Munich
Current design (Example LDC, 14 mrad):
LumiCal(Luminometer)
BeamCal
TPC
ECA
L
HCAL
LumiCal: -control of position on ~10 m level -control of the inner acceptance radius on ~m level BeamCal: -radiation hard sensors (~10 MGy/year)
Both: -compact (smallest possible Moliere radius) -readout after each BX
Challenges
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Octobre 20 2006 MPI Munich
Laser alignment system
Two laser beams (one perpendicular, second with 45˚ angle to the sensor plane) allows to measure XYZ translation in one sensor
Wojciech Wierba et al., INP Cracow
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Octobre 20 2006 MPI Munich
Results and Status
New lasers with aspherical lenses – better spot.New lasers with aspherical lenses – better spot.Setup with two lasers – avoid beam splittingSetup with two lasers – avoid beam splittingCompact prototype – in progress (new person involved)Compact prototype – in progress (new person involved)Reference measurement of XYZ translations – Renishaw Reference measurement of XYZ translations – Renishaw industrial system (0.1 μm resolution)industrial system (0.1 μm resolution)Stability tests Stability tests
+-1 m +-
5 m
xy z
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Octobre 20 2006 MPI Munich
Infrastructure for Sensor Tests
H. Abramovicz, W. Lange et al., TAU, DESY
How can we characterize a sensor?
• I/V measurement with both polarities• C/V measurement (semiconductor (Vdep ?) or insulator?)• spectrum for MIPs (charge collection efficiency)• charge collection, leakage current etc. vs. irradiation dose• …• Always check calibration, data integrity, repeatability• Bookkeeping of data: from files to a data base
Measurement of mip spectra
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Octobre 20 2006 MPI Munich
Infrastructure for Sensor Tests
Rooms (Cracow, DESY):two rooms with filtered air (10k), stabilized temperature• room 1: bonding and assembly• room 2: all measurements without radioactive sourceInstruments:• manual prober in a shielded box (light, electrical screening)• manual prober for probe cards (chip testing)• microscopes with a large object distance• manual bonding machine with x-y computer control• glueing tools, oven etc.• computer controlled instruments (I, C, V, V and I sources)
Prob Station in TA
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Octobre 20 2006 MPI Munich
Test Beam Equipment
exit windowof beam line
collimator (IColl)
sensor box (IDia, TDia, HV)
Faraday cup (IFC, TFC)
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Octobre 20 2006 MPI Munich
FE design and studies H. Henschel, M. Idzik et al.,
Cracow Univ., DESY
Readout board for PHY3 chip with - control input/output- level shifters
- biasing switches & networks
- power connector - 18 FE inputs
- Amplifier
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Octobre 20 2006 MPI Munich
Sequential Readout
• definite charge of 0.33pC injected into one channel after the other
• readout with (slow) clock, hence considerable decay of captured charge is observed
Testmeasurements with Phy3
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Octobre 20 2006 MPI Munich
•signal from 4 fC (mip) to 6 pC• high occupancy – no multiplexing• DC coupled sensors, Cdet 20 -120 pf + fanout (~1pF/cm)• 300 (150) ns between bunches• limited power dissipation (~10 mW/ch)
•Charge sensitive• test and physics mode variable gain• test mode: S/N ~ 10 physics mode: > 11 bit• Tpeak: 50-70 ns
Future Design
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Octobre 20 2006 MPI Munich
•First prototype submission in 2-3 months•Testbeam application planned• More studies on general readout architecture necessary• Compatibility with mechanics/cooling
Plans and Summary
First steps are done:
•Test beam equipment partially available and running, completion is ongoing
•Laser alignment ‘proof of principle experiment’ under construction
• Test facilities for sensors in Zeuthen and Tel Aviv; Zeuthen will be upgraded, Tel Aviv started to collect equipment
•FE electronics development started
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Octobre 20 2006 MPI Munich