FOCUS ON EMERGING TECHNOLOGY

Now available from EMS...

LatticeGear Silicon Wafer Cleaving Tools

simple... fast... clean... precise

featuring LatticeAx™ Cleaving Systems

Ordering Information

www.emsdiasum.com

Recommended PackagesThe Wafer Cleaving Station The Wafer Cleaving Station includes a large cleaving mat, scribes for marking and scribing, pliers for cleaving, and rulers, everything in the Wafer Cleaving Kit. In addition, the Lattice Scriber, customized with an 8 point diamond tip that scribes well at any angle and an extra set of CleanBreak pliers is included with spare set of jaws so that a clean cleave is always possible.

This package includes: Wafer Cleaving Kit Lattice Scriber: Ultimate scriber for semiconductor samples CleanBreak Pliers: Wafer-cleaving pliers

LatticeAx™ Options PackageTwo spare custom diamond knives for the LatticeAx. The LatticeAx knife is replaced by the user and comes with allen wrenches and installation instructions.

This package includes:LatticeAx Diamond Indenter: Two spare diamond knives

Wafer Cleaving KitThe complete tool set to get from wafer to cleanly cleaved pieces. This is a critical step to getting the best cross-sections. The kit includes wafer mat, scribes for marking and scribing, pliers for cleaving, rulers and instructions.

Diamond Scriber — Pen style, optimal for top down scribeDiamond Scriber — Straight tip, optimal for top down precise marking and/or scribingDiamond Scriber — 30 degree tip, optimal for top down precise marking and/or scribingL-Square — 24"x 8.5", phenolic, non-warping, ruler acts as guide for macro cleaving up to 300mm wafers without damaging the top surface of the cleaving stationCleanBreak Pliers — 6" wafer-cleaving pliers. Simple and clean way to cleave (post scribe) wafers to strips and smaller pieces. 3/4" jawLarge Cutting Mat — Wafer-cutting mat, self healing, double sided, green and black, 18 x 24"Small Ruler Mat — Self healing, Small wafer piece ruler mat, double sided, green and black, 3.5 x 5.5"

FOCUS ON EMERGING TECHNOLOGYLatticeGear Silicon Wafer Cleaving Tools

P.O. Box 550 • 1560 Industry Rd.Hatfield, Pa 19440Tel: (215) 412-8400Fax: (215) 412-8450email: sgkcck@aol.com

stacie@ems-secure.com

Cat No. Description Qty.

7641 LatticeAx™-200 Silicon Cleaving System, includes •LatticeAx™ Precision Silicon Wafer Cleaving Tool •LatticeAx™ Diamond Indenter (7643), pre-installed •LargeCuttingMat,18"x24"•VacuumPump,115Vor220V,hoseincluded•EagleEyeCamera,including: Magnificationadjustable,20–80x Interface USB 2.0 Software with measurement and calibration features (Windows XP, Windows 7 required) Stand for mounting camera

Computer and display not included each7642 Wafer Cleaving Kit each7643 LatticeAx™ Diamond Indenter each7644 Marker-ScriberKit each7645 Lattice Scriber each7646 CleanBreak Pliers each7648 Wafer Cleaving Station each7649 LatticeAx™ Options Package each

LatticeAx™-200Ourmostpopularconfiguration,theLatticeAx™-200 is designed to cleave wafer samples with highqualityandaccuracy.ThissolutionintegratestheLatticeAxwiththeEagleEyeCameraandSoftware to provide a clear view of the sample during processing, and the ability to record images on video for reports and presentations.

CombiningtheEagleEyeCamerawiththeLatticeAx™ enables highly accurate placement of the indentation and visualization of the sample during the cleaving process. Cleaving accuracy is determined by the positioning of the indentation on the wafer surface. The LatticeAx stage is a high-performancelow-profileballbearinglinearstage.Itisusedtoprovidethefinemotionin5micron steps necessary to accurately position the indentation.

FOCUS ON EMERGING TECHNOLOGYLatticeGear Silicon Wafer Cleaving Tools

The LatticeAx™isaprecisioncleaverthatfitsin the palm of your hand. In an amazingly small footprint (4" cube, 100mm3), the patent pending “Ax” and process are designed to assist the user to cleave wafers, strips, or pieces to precisely sized samples with localized targets.

Unlike automated cleaving systems, the LatticeAx™ bridges the gap between manual cleaving and expensive alternatives. With the smartcombinationofahigh-magnificationcameraand precision knobs, the LatticeAx enables highly accurate, manual cleaving of wafer pieces and small samples of any aspect ratio.

Applications

Sample Types• Si-GaAs-Sapphire • Cu • Resist• Polyimide • Passivation • Films

CLEAVEIts simple. Just SET... INDENT... RESULT...

LatticeAx™ shown with Eagle Eye CameraLatticeAx™ Cleaving Systems

LatticeAx™ Diamond IndenterCustom diamond indenter for the LatticeAx. The LatticeAx indenter is easily replaced by the user and comes with screws, allen wrench and installation instructions.

Marker-Scriber KitDiamondscribersformarkingfinemarksandscribing the wafer surface. These diamond scribers also serve as replacements for those purchased in the starter kit. Threediamondscribersareincluded:

• Pen-stylediamondscriber• Finescriberforprecisemarking

and/or scribing• Finescriberwith30-degreetipforprecise

marking and/or scribing

Lattice ScriberThisisthebestscriberyou’lleverfindforscribing semiconductor wafers. This custom scriber has an eight point truncated diamond tip that can be used for both toe and heel scribing held by robust 4" long pin vise handle.

CleanBreak PliersCleanBreak 6" wafer cleaving pliers. Simple and clean way to cleave (post scribe) wafers and wafer strips and smaller pieces. 3/4" jaw, opening. Comes with one set of replaceable jaws to maintain the best cleaving performance.

Setup RequirementsFlat,stablesurfacetosupporttheLatticeAx™ at least 18" x 24" or 41cm x 61cm surface space

Powerforthevacuumpump(110Vor220Vdependingonlocalrequirements)

Computer running Windows 7 or XP with mouse, keyboard, monitor, video cable to the monitor

• Target localization prior to FIB• Prep for Broad Beam ion milling

or polishing• Downsize samples for SEM with

height restriction• Cleaving to create uniform samples

for other analysis tools with non-waferscale stages

• Vertical, mirror image cleaving forphotonics analysis

Wafer Cleaving KitThe complete tool set to get from wafer to cleanly cleaved pieces. This is a critical step to getting the best cross-sections. The kit includes wafer mat, scribers for marking and scribing, pliers for cleaving, rulers and instructions.

Diamond Scriber — Pen style, optimal for top down scribeDiamond Scriber — Straight tip, optimal for top down precise marking and/or scribingDiamond Scriber — 30-degree tip, optimal for top down precise marking and/or scribingL-Square — 24" x 8.5", phenolic, non-warping, ruler acts as guide for macro cleaving up to 300mm wafers without damaging the top surface of the wafer.CleanBreak Pliers — 6" wafer cleaving pliers. Simple and clean way to cleave (post scribe) wafers to strips and smaller pieces. 3/4" jaw, opening.Large Cutting Mat — Wafer cutting mat, self healing, double-sided, green and black, 18" x 24"Small Ruler Mat — Self healing, small wafer piece ruler mat, double-sided, green and black, 3.5" x 5.5"

Note: Always remember to use safety glasses when cleaving the wafer.

LatticeGear Accessories & Consumables

The Process Using the LatticeAx™, wafer cleaving is accomplished in three basic steps that compliment existing skill sets used in wafer analysis.

Selecttargetunderhighmagnification (up to 80x) and use micrometer to position the indenter tip.

A precision control knob coupled with a sharpindentertipresultsinfineindentationat the edge of the sample.

Cleaving position consists of a set cleaving pin and a cleaving bar used to apply uniform pressure to achieve a controlled cleave.

Overview

Meet the LatticeAx™ — the small, accurate, fast, low-cost cleaving solution, suitable for any lab.

Cleave is always clean and precise.

SpecificationsAccurate Targeting 20–50microns(basedonmagnification)

Minimum Sample Size 7mm in width

Camera Magnification 20–80x

Indenter Motion 10mm in each direction

Micrometer 5µm steps in the x-axis

Indent Size Several microns in width and ~500µm in length

Recommended ConfigurationLatticeAx™ Silicon Wafer Cleaving Tool

Replacement diamond indenter

Vacuumpump(115Vor220V)withhoseandfilter

Large mat for LatticeAx™ or for general cleaving purposes

EagleEyeCameraKit—USBcamerawithvideodisplaysoftware

OptionsLatticeAx™ Diamond Indenter The Wafer Cleaving Station

Lattice Scriber CleanBreak Pliers