Nittobo New Glass fabric for PCB

Nitto Boseki Co., Ltd.Glass Fiber Division

Technical Dept. Nov. 2011

The contents of this document are based on the results of experiments, investigations and analyses conducted by Nitto Boseki Ltd. (Nittobo). Nittobo does not intend to guaranteed the value.Nittobo reserves the right to change these typical values as a natural process of refining our test equipment and techniques.

11-2011Confidential

IC Substrate

BGA

CSP

High Speed

Switching system

High speed server

Our original processOur original process

SS processSS process , , NHR processNHR processConfidential

TT--glassglassLow CTE

NENE--glasglasssLow DkLow DfHigh Quality and Reliability

ETCC ABSEngine Controller PCB

PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target

Contents

1-1. Why Low CTE?1-2. Glass Fiber Composition1-3. Properties of glass fiber

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1.1. TT--glassglass fabricsfabrics

Mother board

Silicon chip

Substrate

1-1. Why Low CTE ?

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Demanded for lower CTE substrate materialsDemanded for lower CTE substrate materials

3～4 ppm/℃

9～11 ppm/℃

CTE :

PCB receives the heat stress by thermal expansion.

T-glass fabric respond

Heat stress

Mother board

Silicon chip

Substrate

Connected reliability decrease

1-2. Glass Fiber Composition

Nittobo is integrated Glass Fiber Manufacturer. (Yarn & Fabric)Nittobo can develop a different component Glass Fiber.

E-glass T-glass

SiO2 52-56 64-66Al2O3 12-16 24-26B2O3 5-10 -CaO

20-25-

MgO 9-11R2O 0-0.8 -

This is technical data, not guaranteed value.

Confidential

1-3. Properties of glass fiber

This is technical data, not guaranteed value.

Confidential

>1000844℃The Point softening

2.85.6ppm/℃Thermal Expansion

774763J/kg・KSpecific Heat

10151015Ω・cmVolume Resistance

0.00430.0035(1GHz)Dissipation factor

5.46.8(1GHz)Dielectric Constant

8675GPaTensile Modulus

4.83.2GPaTensile Strength

2.52.6g/cm3Density

T-glassE-glassUnitProperty

>1000844℃The Point softening

2.85.6ppm/℃Thermal Expansion

774763J/kg・KSpecific Heat

10151015Ω・cmVolume Resistance

0.00430.0035(1GHz)Dissipation factor

5.46.8(1GHz)Dielectric Constant

8675GPaTensile Modulus

4.83.2GPaTensile Strength

2.52.6g/cm3Density

T-glassE-glassUnitProperty

IC Substrate

BGA

CSP

High Speed

Switching system

High speed server

Confidential

High Quality and Reliability

ETCC ABSEngine Controller PWB

SS processSS process , , NHR processNHR process

TT--glassglassLow CTE

NENE--glassglassLow DkLow Df

PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target

Contents

2-1. Why Low Dk and Df ?2-2. Glass Fiber Composition2-3. Properties of glass fiber

Confidential

2. 2. NENE--glassglass fabricsfabrics

The high speed signal has been used for an electronic device.

Transmission speed (V)

V = C / √(Dk)

(C : Velocity of light)

Transmission loss (a)

a = f ×√（Dk） × Df

（f : Frequency）

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2-1. Why Low Dk and Df ?

Demanded for lower Demanded for lower DkDk and and DfDf materialsmaterialsNE-glass fabric respond

2-2. Glass Fiber Composition

Nittobo is integrated Glass Fiber Manufacturer. (Yarn & Fabric)Nittobo can develop a different component Glass Fiber.

E-glass NE-glass

SiO2 52-56 50-56

Al2O3 12-16 10-18

B2O3 5-10 18-25

CaO20-25 5-12

MgO

R2O 0-0.8 0-1

This is technical data, not guaranteed value.

Confidential

2-3. Properties of glass fiber

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-844℃The Point softening

3.35.6ppm/℃Thermal Expansion

862863J/kg・KSpecific Heat

10151015Ω・cmVolume Resistance

0.00150.0035(1GHz)Dissipation factor

4.86.8(1GHz)Dielectric constant

6475GPaTensile Modulus

3.13.2GPaTensile Strength

2.32.6g/cm3Density

NE-glassE-glassUnitProperty

This is technical data, not guaranteed value.

-844℃The Point softening

3.35.6ppm/℃Thermal Expansion

862863J/kg・KSpecific Heat

10151015Ω・cmVolume Resistance

0.00150.0035(1GHz)Dissipation factor

4.86.8(1GHz)Dielectric constant

6475GPaTensile Modulus

3.13.2GPaTensile Strength

2.32.6g/cm3Density

NE-glassE-glassUnitProperty

IC Substrate

BGA

CSP

High Speed

Switching system

High speed server

Confidential

High Quality and Reliability

ETCC ABSEngine Controller PWB

SS processSS process , , NHR processNHR process

TT--glassglassLow CTE

NENE--glassglassLow DkLow Df

PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target

Contents

3-1. What’s SS process?3-2. Characteristic impedance 3-3. Summary

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3. SS process3. SS process

3-1. What’s SS process

Conventional process SS process

SS = Smart SurfaceBasket hole

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The technical key of SS process :- Spread out and Flatten fiber technique- Uniform distribution of filaments

SS processSS process

Weft

Warp

Strand

Filament

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Conventional fabric (Cross section) :

① Surface smoothness

② Dimensional stability

③ Laser drill-ability

Advantage of the fabric with SS process :

④ Characteristic impedance④ Characteristic impedance

tW

εr

ｂb

εrConfidential

3-2. Characteristic impedance （Z0）

<Microstripline>

5.98×b

εrZ0

60ln

0.8 ×W + t=

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Conventional process

±2.5Ω

SS process

±1.0Ω

Z0 measurement

Circuit length : 10cm

Conventional process

SS process

Dk distribution is uneven

Dk distribution is even

Thickness of the board varies widely

Thickness of the board varies small

3-3. Summary

Confidential

Excellent characteristic impedanceExcellent characteristic impedance

IC Substrate

BGA

CSP

High Speed

Switching system

High speed server

Confidential

High Quality and Reliability

ETCC ABSEngine Controller PWB

SS processSS process NHR processNHR process

TT--glassglassLow CTE

NENE--glassglassLow DkLow Df

PCB Market and Nittobo’s TargetPPCCB Market and NittoboB Market and Nittobo’’s Targets Target

, ,

Contents

4-1. Resin impregnation measurement4-2. Influence by the viscosity of the resin4-3. Summary

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4. NHR process4. NHR process

Conventionalprocess

NHR process

Before measuring After 10 seconds

※Ending impregnation

4-1. Resin impregnation measurement

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Fabric type : 1027Resin : FR-4

Conventionalprocess

NHR process

Impregnation characteristics Impregnation characteristics for several fabric types :for several fabric types :

0.0

1.0

2.0

3.0

4.0

5.0

6.0

1017 1027 1037 1035 1078 2116

End

poin

t (m

in)

Fabric type

Conventional process

NHR process

Resin : FR-4 (100cps)

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Reference.

※End point = The fabric became transparent

4-2. Influence by the viscosity of the resin

0.0

5.0

10.0

15.0

20.0

25.0

30.0

100 200 300 500

End

poi

nt （

min

)

Viscosity of resin （cps）

Conventional process

NHR process

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Reference.

Fabric type : 1027

Resin : FR-4

4-3. Summary

・・ SuitableSuitable for special resinfor special resin

・・ Suitable for high insulation reliabilitySuitable for high insulation reliability

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- Large improvement resin impregnation characteristicsfor several fabric type.

- Excellent impregnation characteristics in the resin of the high viscosity.

T-glass Fabric ProductsTT--glass Fabric Productsglass Fabric Products

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-

20

40

60

80

100

120

0 20 40 60 80 100

Thickness (μm)

Base

wei

ght (

g/m

2 )

T1017

T1027

(T1029）T1024

T1037(T1039)

T1030

T1035T1067

T1080

T1280

T2118

T2116

T1078

The product with parentheses shows unregistration in IPC spec.

-

20

40

60

80

100

120

0 20 40 60 80 100Thickness (μm)

Bas

e w

eigh

t (g/

m 2 )

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※NE1017NE1027

NE1037

NE1067NE1080

(NE2013)

NE2116

NE106

NE1078

NE1035

※Development.

The product with parentheses shows unregistration in IPC spec.

NE-glass Fabric ProductsNENE--glass Fabric Productsglass Fabric Products

ConclusionConclusionConclusion

We will keep developing high-performance glass fabric!

E-glassT-glassNE-glass

Ultra-thin fabricHigh-density fabric

SS processNHR process

CompositionComposition

DesignDesign ProcessProcess

・・・