diamine including a mixture of paraphe- prised of bright nickel; a third layer com- nylenediamine and metaphenylenediamine prised of palladium alloy; a fourth layer in a ratio of metaphenylenediamine to par- comprised of zirconium or titanium; and a aphenylenediamine of 90: 10 to 1523.5; and, fifth layer comprised of a zirconium com- coating the article with the solution. pound or a titanium compound.

Two-Coat Finish U.S. Went 5,716,678. Feb. i0, 1998 U. R&krath et al., assignors to BASF Lacke Farben, AG, Muenster-H&up, Germany

A process for the production of a two-coat finish on a substrate surface comprising ap- plying a pigmented basecoat to the substrate surface; drying the basecoat film; applying to the basecoat film a nonaqueous, transparent topcoat comprising a hydroxyl group-con- taining polyacrylate resin and a crosslinking agent, and baking and curing the basecoat and the topcoat together.

Multilayer Coated Article U,S. Patent 5,716,721. Feb. 10, 1998 S.R. Moysan, 111 and R. W Sugg, assignors to Baldwin Hardwere Corp., Reading, Pa.

An article comprising a metallic sub- strate having on at least a portion of its surface a first layer comprised of semibright nickel; a second layer com-

Method to Eliminate the Use of a Solder Mask U.S. Patent 5,716,760. Feb. II?, 1998 E Juskey et al., assignors to Motorola Inc., Schaumburg, 111.

A method for plating a substrate to elim- inate the need for a solder mask during subsequent component solder attachment processes comprising coating with a poly- mer catalyst; coating with a first plating mask photopolymer; photo-optically imag- ing a circuit pattern; developing the thus exposed first plating mask photopolymer thereby forming windows; at least partially filling the windows with copper; covering the copper with nickel, said nickel oxidiz- ing rapidly when exposed to air. thereby rendering the exposed surface unsolder- able; removing the first plating mask pho- topolymer without removing the copper or nickel or said polymer catalyst; coating the

polymer catalyst and nickel with a second plating mask photopolymer; photo-opti- cally imaging an inteconnect pattern; de- veloping the thus exposed second plating mask photopolymer; plating over the inter- connect pattern with gold; removing the second plating mask photopolymer without removing the copper, nickel, or gold, wherein the nickel selectively prevents ad- hesion of solder applied to the substrate to provide electrical interconnection between the circuit pattern and an external compo- nent.

Recovery of Secondary Polyols from Paint Sludges U.S. Patent 5,776,9%X Feb. 70, 1998 B-U. Kefiemann and M. h4elchione, assignors to Mercedes-Benz AG, Stuttgart, Germany

A method for recovering secondary polyols from paint sludge coagulate formed from paint overspray collected during spray painting to which a coagulant has been added and which has been dewatered, said method comprising heating the paint coagulate to a temperature above IOO”C, and glycolytically splitting organic compo- nents of the paint coagulate into polyols,

There may be other power supply manufacturers, but only one with 30 years experience in producing state-of-the-art plating and process systems. You can rely on HBS for all of your power supply requirements.

b LABORATORY b PORTABLE POWER SilPPLlES .

b MFTFRS ANn TIMFRS ) VARIABLE

TRANSFORMERS b PERIODIC REVERSE UNITS

) PRECIOUS METAL PLATING k POWER SUPPLY PARTS

) SWITCH MODE ) CHEMICAL FEEDERS

) SOLID STATE ) AMP/HOUR METERS

b ANODIZING

For more information. contact us todav

E&pm&t Corporation

14700 Alondra Boulevard l La Mirada l CA l 90638 Fax 714521.4488 l Phone 7l4.522.4100

Circle 103 on reader information card

METAL FINISHING l AUGUST 1998 79