msw analytics introduction

9/5/2018 Confidential Material MSW Analytics 2018 1

MSW Analytics Introduction In Partnership with the top labs in the world

Teardown Reporting


• Cost Estimation Tools

• Circuit & Structural Analysis

• Data Extractions Device Reporting


Circuit Analysis

• Netlist Extraction

• Circuit Analysis

• Circuit Simulation and Testing

LAB Services


Structure Analysis

• SEM Scanning Electron Microscope

• Dual beam FIB Focused Ion Bea

m

Crircuitry Extract Repparation

• Decap

• Delay

• OM/SEM Imaging

Electrical Verification Test• ESD/ EOS / Latch-up Verification

• Low Voltage Surge Test

• EMC Verification (EMI+EMS)

• High-Temperature / High Electric F

ield Induced Gate Leakage Test

Material Analysis

• SEM

• EDX

• SCM/SIMS Scanning

• Capacitance Microscope/Secondary Ion Mas

s Spectroscopy

X-RAY


Feature

•Analysis Part Structure

•Pre-production inspection

•3D X-ray


Scanning Electron Microscopes (SEM)

Feature

• Magnification ranging from

20X to approximately

30,000X

• Resolution of 1.5 nm

• Observe the surface of the

chip

• EDS detector analysis

material of surface.

MICROSCOPE


Feature

•The resolution of 0.35um

•Magnification :5X、10X、20X、50X、100X

•Real Color image of sample

FIB – SEMFocused Ion Beam – Scanning Electron Microscope


Feature

•Circuit Edit

– Modifications can be made to

circuits

– Cut traces or add metal

connections

•Sputtering And Imaging

– Cross-Section circuit of die

– High resolution imaging

SCM – SIMSScanning Capacitance Microscope/Secondary Ion Mass Spectroscopy


Feature

•Analysis of elements and

isotopes

ESD Test Equipment


Feature

•HBM (Human Body Mode) Test

•MM (Machine Mode) Test

•SCDM (Socket CDM) Test

•CDM (Non-Socket) Test


Teardown Reporting• Assembly Structure Analysis

• Mobile Devices * Tablets/Notebooks * IOT * Automotive * Medical Devices * Wearables

EQUIPMENT SET


Manufacture Model Device age

Olympus STM6 Metallographic microscope 5 years

Weiyi WY-3230A Metallographic microscope 3 years

Weiyi SZM-45B1 Stereomicroscope 3 years

Carl Zeiss SIGMA HD SEM 3 years

Oxford X-act EDX 3 years

Cressington 208HR Sputter Coater 3 years

Carl Zeiss Atlas Mosaic Image acquirer 3 years

FEI Helios 660 FIB-SEM 7 years

CAMECA 4500 SIMS 10 years

HANWA HED-C5000 ESD Test 5 years

Kejing UNIPOL-820 Polisher 3 years

ZAPMASTER MK.2 SE HBM（8KV）MM （2KV）& latch-up 10 years

CONTACT

• MSW Analytics, Inc.

PO Box 204163

Austin, Texas 78720

• Phone: +1-512-203-0396

• Email: [email protected]


msw analytics introduction

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