Mobile Environment Chamber

Internal/External SearchTeam members:

Duc TranTuan NgoGiang Nguyen

Peter ElabThien NguyenThe Duong

Advisor:

Dr. Mark Weislogel

Problem Identification

Needs Assessment Objective Requirements Concept

GenerationConcept

Evaluation

Proposal PDS We are here!

OUTLINE

• PDS Review

• External Search

• Internal Search

• Concept Evaluation and Selection

• Conclusion

PDS REVIEW

Chamber

PC Controller

Facility

Actuator

Solid State Drives

Set T

Requirements• Temp. range: -5 oC 105 oC

• Accuracy: ± 2 oC

• Temp. uniformity: ± 4 oC

throughout the chamber

• Ramp rate:10 oC /minute

• Airflow: 0.5 to 5 m/s across

DUT

EXTERNAL SEARCHLiterature/Patent Search

Disk Drive Test Chamber

Socket for Disk Drive Tester

Efficient Air Flow Chamber

De-humidification

EXTERNAL SEARCHLiterature/Patent Search

Disk Drive Test Chamber

U.S. Patent No. 5,851,143

Socket for Disk Drive Tester Efficient Air Flow Chamber De-humidification

EXTERNAL SEARCHLiterature/Patent Search Disk Drive Test Chamber Socket for Disk Drive Tester

Efficient Air Flow Chamber De-humidification

U.S. Patent 6,124,707(Samsung)

U.S. Patent 6,806,700(Pemstar)

EXTERNAL SEARCHLiterature/Patent Search Disk Drive Test Chamber Socket for Disk Drive Tester Efficient Air Flow Chamber

U.S. Patent No. 7,111,211

De-humidification

EXTERNAL SEARCHLiterature/Patent Search Disk Drive Test Chamber Socket for Disk Drive Tester Efficient Air Flow Chamber De-humidification

Compressed dry air

Condensation (from air stream)

Systems Environment chambers

Burn-in chambers

Desktop testers

Temperature -34oC - 100oC Room - 70oC Room

Humidity 5% - 95% RH Room Room

Ramp rate 1oC/minute 1oC/minute none

# of Ports Up to 128 Up to 416 Up to 16

19’’ Rack Mountable No No Yes

Estimated cost $400k $100k $10k

EXTERNAL SEARCHSimilar Product Benchmarking

EXTERNAL SEARCHInterview expert

Dr. Mark WeislogelThermal and Fluid Sciences Group

Thermal & Fluid problem expert

Concept review & suggestion

Thermal analysis guidance

INTERNAL SEARCH

Environmental Chamber

Controller Heating/Cooling Sensors

Direct connect Gateway Counter

Flow Conventional Ther-mistors

Thermo-couples RTD

Concept tree

INTERNAL SEARCHElectrical Components

PID Controller

Heater Temperature sensor Chiller

o Industrial temperature and process controllers

o Automatically adjust outputs based on sensor feedback

o Control process variables: temperature, flow, pressure

and relative humidity

o Real-time communication with PC

o Intel recommended

INTERNAL SEARCHElectrical Components PID Controller Heater

Temperature sensor Chiller

o Wide-range of temperature: 200oC (390F) 1200oC (2200F)

o Selection based on actual mechanical shape and size

o Off-the-shelf heater is preferred (Intel’s inventory)

INTERNAL SEARCHElectrical Components PID Controller Heater Temperature sensor

Chiller

Thermocoupleo Voltage outputo Low accuracyo Very high temp. range

RTD (Resistive Thermal Devices)o Resistance output (metal based)o Below 600 °C rangeo High accuracy and repeatability

(low drift)

Thermistoro Resistance output

(ceramic/polymer based)o  Limited temperature range

(−90 °C to 130 °C)o Small package and cheap

INTERNAL SEARCHElectrical Components PID Controller Heater Temperature sensor Chiller

o Re-circulating chillers

o Min temperature: -40oC

o Reservoir Size: 2 Liters

o Intel provided

INTERNAL SEARCHHeating/Cooling Concepts

Technical Problems that designs must address• Heat Flux

• Condensation

• Thermal uniformity

• Airflow requirements

CONCEPT SELECTION

`

Heating Coils(Resistance)

Cooling Coils(Chilled Water)

Circulating FansIntel SSD’s

(Solid State Drives)

Counter flow Design

PROS CONSThermal Uniformity Difficult analysisHeat Flux controllability Condensation riskMaintainable Airflow

CONCEPT SELECTION

Heating Coils(Resistance)

Cooling Coils(Chilled Water)

Intel SSD’s(Solid State Drives)

Low Risk Design

PROS CONSThermal Uniformity Difficult analysisLimit Condensation ManufacturabilityMaintainable Airflow Cost

CONCEPT SELECTIONConventional Design

PROS CONSManufacturability Airflow RequirementsEasy Analysis Condensation risk

Thermal Uniformity

CONCLUSION

• Low Risk Design

• Conventional Design

• Counter flow Design

• Further Plans

1. Continue Analysis on each design

2. Computer Simulation

3. Concept/Design Selection

4. Part Selection

Q & A