mlsp 2020bhaskar rao university of california san diego raviv raich oregon state university call for...

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MLSP 2020 IEEE International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING September 21–24, 2020 Aalto University, Espoo, Finland http://ieeemlsp.cc ORGANIZING COMMITTEE General Chair Simo S ¨ arkk ¨ a Aalto University Program Chairs Lassi Roininen LUT University Andreas Hauptmann University of Oulu Manon Kok TU Delft Michael Riis Andersen Technical University of Denmark Finance Chair Seppo Sierla Aalto University Publicity Chairs Arno Solin Aalto University Marc Van Hulle KU Leuven Tutorial Chair Alexander Ilin Aalto University Publications Chair Roland Hostettler Uppsala University Advisory Zheng-Hua Tan Committee Aalborg University Murat Akcakaya University of Pittsburgh Bhaskar Rao University of California San Diego Raviv Raich Oregon State University CALL FOR SPECIAL SESSIONS MLSP is seeking original, high quality pro- posals for Special Sessions, to be included in the technical program along with the reg- ular track. Special Sessions are expected to address research in focused, emerging, or in- terdisciplinary areas of particular interest, not covered already by traditional MLSP sessions. SCHEDULE Special session call deadline March 19 Paper submission deadline April 19 Decision notification June 30 Camera-ready paper deadline July 25 Advance registration deadline August 22 CALL FOR PAPERS The 30 th MLSP workshop, an annual event organized by the IEEE Signal Pro- cessing Society MLSP Technical Committee, will present the most recent and exciting advances in machine learning for signal processing through keynote talks, tutorials, as well as special and regular single-track sessions. Prospec- tive authors are invited to submit papers on relevant algorithms and applica- tions including, but not limited to: ; Learning theory and modeling Neural networks and deep learning Bayesian Learning and modeling Sequential learning, sequential decision methods Information-theoretic learning Graphical and kernel models Bounds on performance Source separation and independent component analysis Signal detection, pattern recognition and classification Tensor and structured matrix methods Machine learning for big data Large scale learning Dictionary learning, subspace and manifold learning Semi-supervised and unsupervised learning Active and reinforcement learning Learning from multimodal data Resource efficient machine learning Cognitive information processing Bioinformatics applications Biomedical applications and neural engineering Speech and audio processing applications Image and video processing applications Intelligent multimedia and web processing Communications applications Other applications including social networks, games, smart grid, security and privacy Prospective authors are invited to submit a paper using the electronic sub- mission procedure that will be available at http://ieeemlsp.cc. The presented papers will be published in and indexed by IEEE Xplore. ;

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Page 1: MLSP 2020Bhaskar Rao University of California San Diego Raviv Raich Oregon State University CALL FOR SPECIAL SESSIONS MLSP is seeking original, high quality pro-posals for Special

MLSP 2020IEEE International Workshop onMACHINE LEARNING FOR SIGNAL PROCESSINGSeptember 21–24, 2020Aalto University, Espoo, Finland http://ieeemlsp.cc

ORGANIZING COMMITTEE

General Chair Simo SarkkaAalto University

Program Chairs Lassi RoininenLUT UniversityAndreas HauptmannUniversity of OuluManon KokTU DelftMichael Riis AndersenTechnical Universityof Denmark

Finance Chair Seppo SierlaAalto University

Publicity Chairs Arno SolinAalto UniversityMarc Van HulleKU Leuven

Tutorial Chair Alexander IlinAalto University

Publications Chair Roland HostettlerUppsala University

Advisory Zheng-Hua TanCommittee Aalborg University

Murat AkcakayaUniversity of PittsburghBhaskar RaoUniversity of CaliforniaSan DiegoRaviv RaichOregon State University

CALL FOR SPECIAL SESSIONS

MLSP is seeking original, high quality pro-posals for Special Sessions, to be includedin the technical program along with the reg-ular track. Special Sessions are expected toaddress research in focused, emerging, or in-terdisciplinary areas of particular interest, notcovered already by traditional MLSP sessions.

SCHEDULE

Special session call deadline March 19Paper submission deadline April 19Decision notification June 30Camera-ready paper deadline July 25Advance registration deadline August 22

CALL FOR PAPERSThe 30th MLSP workshop, an annual event organized by the IEEE Signal Pro-cessing Society MLSP Technical Committee, will present the most recent andexciting advances in machine learning for signal processing through keynotetalks, tutorials, as well as special and regular single-track sessions. Prospec-tive authors are invited to submit papers on relevant algorithms and applica-tions including, but not limited to:

;

• Learning theory and modeling

• Neural networks and deep learning

• Bayesian Learning and modeling

• Sequential learning, sequential decisionmethods

• Information-theoretic learning

• Graphical and kernel models

• Bounds on performance

• Source separation and independentcomponent analysis

• Signal detection, pattern recognition andclassification

• Tensor and structured matrix methods

• Machine learning for big data

• Large scale learning

• Dictionary learning, subspace andmanifold learning

• Semi-supervised and unsupervisedlearning

• Active and reinforcement learning

• Learning from multimodal data

• Resource efficient machine learning

• Cognitive information processing

• Bioinformatics applications

• Biomedical applications and neuralengineering

• Speech and audio processing applications

• Image and video processing applications

• Intelligent multimedia and web processing

• Communications applications

• Other applications including socialnetworks, games, smart grid, security andprivacy

Prospective authors are invited to submit a paper using the electronic sub-mission procedure that will be available at http://ieeemlsp.cc. The presentedpapers will be published in and indexed by IEEE Xplore.

;

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