microstrip to cpw transition 2004-30338 윤정훈. advantage of ms & cpw low cost, compact...
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Microstrip to CPW transition
2004-30338
윤정훈
Advantage of MS & CPW Low cost, compact size, and easy integration for devices
demand Low-loss, wideband, and compact transition
Two main techniques for the transition by electrical contact
• usually call for Via holes, bonding wires, or abrupt steps in the conductor
• Compact size and wide bandwidth• Some degree of mechanical complexity
by electromagnetic coupling• No wired bonds or via holes• Narrow bandwidth and larger size Recently wider bandwidth transition
Electrical Contact (1)
Case 1 : ribbon Superposition of two different substrates
• upper one works in a microstrip mode
• lower one works in a coplanar mode
a small capacitance is added at the beginning of the coplanar line• lowpass filter
maximum cut-off frequency is related with the height h1
Gold ribbon
inductancecapacitance
Electrical Contact (2)
Case 2 : air bridge Microstrip to CPW on GaAs chip substrate
Case 3 : via hole Microstrip to CPW on opposite sides of a common substrate
Electromagnetric Coupling(1)
Case 1 : uniplanar this one uses the coupling between the ground plane of the mi
crostrip and the ground planes of the coplanar line• Analyzed as a bandpass filter
cutoff frequency is determined by the length of the coupling region
With radial coupling stub
Electromagnetric Coupling(2)
as n increases, S11 decreases
Gradual transformation Return loss
as the length of the transition increases,
Bandwidth increases as well
Case 2 : Surface to surface transition CPW on one substrate surface to a MS on another
Types • Single-substrate transition
on opposite sides of a single substrate gap size of roughly 10 % of the total length empirically give the
best results• Chip to motherboard transition
Electromagnetric Coupling(3)
Wire bonding • can seriously degrade circuit operation• Is very labor intensive
No wire bonding • Improve performance
• Reduce costgap
Electromagnetric Coupling(4)
Chip to motherboard transition
Ground plane of the chip is removed in the area over the coupling region
The chip and mother board ground planes coincide
Single substrate transition
widening broadband transmission behavior
A variety of transition structure
As Sc is enlargedEM coupling becomes tightRasining the equivalent series capacitivie coupling
Constitute a Broad Passband with two minimum values
(A)
s
Widening the width
Futher expanding the transmission passband
As Sc is enlarged,
Lower end of a passband is moved to low frequency
But higher end of a passband is unchanged
(B)
By the coupled-strip length d
As d is enlarged,
the wide passband gradually moves down
Electromagnetric Coupling(3)
Case 2 : radial stub Radial shape of the open stub & shorted arm allow wider band
width operation signal is effectively transferred through resonant coupling
microstrip Two short slot arms
Two radial open stub
Stub reactanceMutual cancellation
conclusion
여러구조의 microstrip-to-CPW transition. 각 transition 의 다지인 패러미터 . 용도에 맞는 transition 구조의 선택 및 디자인에 도움 .
Reference
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