Electroplating Solution Barrier Device U.S. Patent 5399,431. Feb. 4, 1997 FE. Scorpio, assignor to Me&b Sales & Senlice hc., Warwick, RI.

An electroplating solution barrier device comprising a rectangular planar polyethyl- ene stabilizer having opposing faces, an opening through which articles to be elec- troplated can pass, a rectangular channel surrounding the opening, and a plurality of cylindrical stabilizer guide pin holes ex- tending through the opposing faces and passing through the channel; a silicon rub- ber solution barrier removably fitted in liq- uid-resistant contact in the channel, the so- lution barrier having a plurality of solution barrier guide pin holes matched to the sta- bilizer guide pin holes, and a liquid-resis- tant seam through which articles to be elec- troplated can pass, the seam heing aligned with the opening to permit articles to be electroplated to pass; and a plurality of cylindrical polyethylene guide pins remov- ably inserted in the stabilizer guide pin boles and through the solution barrier guide pin holes.

Apparatus for Removing Resist Particles from Stripping Solutions U.S. Patent $599,444. Feb 4, 1977 D.7: Baron ef al., assignors to Atotech USA Inc., Somerset, NJ

An apparatus for the continuous removal of cured resist particles dispersed in a liq- uid stripping solution for a printed wire board, the apparatus comprising means for contacting a treated printed wire board with a stripping solution, solution-movement means for urging the dispersion through a juxtaposed and fluidly connected curtain tube, the dispersion with resist particles dispersed therein depending from the cur- tain tube, wherein the tube comprises an inner concentric tube with a plurality of holes and an outer concentric tube having a slot, wherein the position of the slot is adjustable, the inner concentric tube being affixed within the outer concentric tube, and thereafter impinging on filter means whereby the resist particles are separated from the liquid stripping solution, the liq- uid stripping solution being collected in juxtaposed storage means, and recircula- tion means in fluid connection with the

storage means adauted to return filtered strip&g solution continuously to the con- tacting means

Copper Electrowinning Process U.S. Patent $599458. Feb. 4, 1997 L. Taboga, assIgnor to Laborator/ Taboga dj Taboga Leandro, Colloredo di Monte Albano, Ma/y

A method to prevent exhaustion of acid copper plating baths, comprising adding a compound to the bath to cause precipitation of iron in the form of ferrous sulfate so as to keep a concentration of iron below a value above which codeposition of crystals of ferrous sulfate and copper sulfate would occur.

Metallization of Plastic Materials U.S. Patent $599,592. Feb. 4, 1997 L.D. Laude, Haufmonf, France

A positive process for metallizing a plas- tic composite piece containing a polymer plastic material and oxide grains, said ox- ide grains being made of one or more ox- ides, comprising three successive steps, the first step consisting of the irradiation of a surface area of a plastic piece to be metal-

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lized with a light beam emitted by an ex- timer laser; the second step consisting of immersing the irradiated plastic piece in at least one autocatalytic bath containing metal ions and without palladium, said im- mersion inducing the deposit of metal ions onto the irradiated surface area to form a metal film resulting in the selective metal- lization of the surface; and the third step consisting of thermally processing the met- allized plastic piece to induce diffusion of the deposited metal film into the polymer plastic material.

Powder Coating for Galvanized Steel U.S. Patent 5,599,673. Feb. 4, 1997 E. Verwey et al, assignors to Fina Research S.A., Fehy, Belgium

A fluorinated powder coating for galva- nized steel, consisting essentially of a resin component consisting of 60 to 90% of at least one vinylidene fluoride copolymer having a melting temperature below 150°C: and 40 to 10% of at least one compatible resin; and, 1 to 35 parts by weight of at least one pigment per 100 parts by weight of the resin component.

Electroless Gold Plating Solution U.S. Pafent5,607,637. Feb. II, 1997 H. Wachi and K Otani, assignors to Hecfiuplafmg Engineers of Japan ltd., Tokyo

An electroless gold plating solution con- taining gold as a gold alkali metal dyanide, a boron-based reducing agent, and an alkali metal hydroxide as a pH adjustor, wherein 5 to 99 mg/L of sodium nitrobenzene- sulfonate, p-nitrobenzoic acid, or mixtures thereof are added.

Black Oxide on Aluminum U.S. Patent5,601,663. Feb. 11, 1997 R. Rungta et a/., assignors to General Motors Cop, Detroit

A solution for forming a black oxide on a surface of an aluminum containing metal, the solution comprising, per liter, 0.05 to 0.8 g of tolyltriazole, 0.2 to 1.5 g of sebacic acid, 15 to 50 ml of hexanoic acid, distilled water, 1.6 to 3.2 g of sddium chloride, 1.5 to 3.0 g of sodium sulfate, 1.4 to 2.8 g of sodium bicarbonate, and a substance for maintaining the pH of the solution at 7.5 to 8.5 at a temperature of 80 to 90°C.

Plating on Aluminum Alloys U.S. Pafent 5,601,695. Feb. 11, 1997 K Muranusbi, assignor lo Alotech U.S.A. Inc., Somerset, N.J.

A process for treating an aluminum-cop- per’ or an aluminum-silicon alloy to im- prove adhesion of metal layers to the alloy comprising contacting with an acidic tin immersion composition to produce a tin immersion coating on the alloy; contacting the tin immersion coating with an etchant to substantially remove the tin immersion coating to produce an etched alloy surface having a microporous structure; further coating the microporous structure with a metal by an immersion metal coating pro- cess to yield an immersion metal coated aluminum substrate; and electrolytically coating the immersion metal coated alumi- num substrate with a metal.

Silver Plating Bath U.S. Pafent5,601,696. Feb. 11, 1997 1 Asekatve, assignor to Nectroplatmg Engineers of Jepan Ltd., Tokyo

A silver electroplating bath consisting of at least one inorganic acid salt of silver used as a silver compound and at least one

.JksiiTe(h&as t@ rnost,~~~~~n exchange resim.av%able forall y&rwa@tand ~~~~~t needr.%n srdectiue chelating reins (for re@owalofheavy metals) to granular aaivated carbon,all afourpmdudsare manufactured to thehighest specificationsrurpassitlg other $@iers

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