metallization line-(수정본)2011_1106
DESCRIPTION
Metallization Line -SCM SJ INNO TECH PV PROJECT SCLI SCSP SCSP SCIB SCSP SCSP SCIF SCSPSCSP SCPI SCLI SCSP SCIF SCPISCSP Section C1, C2 Section C1, C2 SCIB SCSP Section B Section ATRANSCRIPT
SJ INNO TECH PV PROJECT
Metallization Line - SCM
PHOTO VOTAIC Products
Section A
SCLI SCSP
Section B
SCIB SCSP
Section C1, C2
SCIF SCPISCSP
Metallization Line SCM-14 Line
Section A Section B
Section C1, C2
SCLI SCSP SCSP SCIB SCSP SCSP
SCIF SCSPSCSP SCPI
Metallization Line SCM-28 Line
PHOTO VOTAIC Products
SPECIFICATIONS
Item Specifications Remark
Metallization Line Model SCM- 14 S/D SCM-28D S/D
Substrate 6 inch Square (156mm x 156mm) ±0.5mm
Lane number 1 Lane / Line 2 Lane / Line
Throughput(TPT)1200 cells/hr
(1400 cells/hr MAX)
2400 cells/hr
(2800 cells/hr MAX)
Wafer flow height950mm ±15mm
(The height is distance from floor to cell flow)
Up Time (%) ≥ 96%
Breakage rate (%) ≤ 0.3%
Wafer align accuracy±12.5um (3 or 5 camera system)
±50um (1 camera system) * SCSP14S only
FA SECS/GEM Support (ex. SECS II, HSMS) option
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Screen Printer Structure
Squeegee unit
MASK unit
Wafer align unit
Pre-align unitWork table unit
BreakageInspection
unit
Camera
Camera
Stencil
Fiducial Mark
Fiducial Mark
3
SCLI : Cassette Loading/Unloading, Wafer supply, Breakage inspectionSCSP : Bottom side(Bus bar) printing, Breakage inspectionDryer
SCLI SCSP
Section A
Section A Section B Section C
SCM-14D Inline System
Section A (Bus-Bar)
PHOTO VOTAIC Products
Section B (BSF)
SCIB : Breakage inspection, Buffer system (100wafer/lane)SCSP : Bottom side (BSF) printing, Breakage inspectionDryer
4
SCIB SCSP
Section B
Section A Section B Section C
SCM-14D Inline System
PHOTO VOTAIC Products
Section C1 (Finger)SCIF : Breakage inspection, Buffer system (100 wafer/lane), Flip stationSCSP : Bottom side (Finger grid) printing, Breakage inspectionSCPI : Pattern inspection (Finger grid)Dryer
5
SCIF SCPISCSP
Section C1
Section B Section C1, C2Section A
SCM-14D Inline System
PHOTO VOTAIC Products
Section C2 (Finger)SCIF : Breakage inspection, Buffer system (100 wafer/lane), Flip stationSCSP : Bottom side (Finger grid) printing, Breakage inspectionSCPI : Pattern inspection (Finger grid)Dryer & Firing Furnace
5
SCIF SCPISCSP
Section C2
Section B Section C1 C2, Section A
SCM-14D Inline System ( Double Printing )
Section C2 ( Same with Section C1)
PHOTO VOTAIC Products
PHOTO VOTAIC Products PHOTO VOTAIC Products
SCLI : Cassette Loading/Unloading, Wafer supply, Breakage inspectionSCSP : Bottom side(Bus bar) printing, Breakage inspectionSCSP : Bottom side(Bus bar) printing, Breakage inspectionDryer
Section A (Bus-Bar)
6
Section A Section B Section C1
SCLI SCSP SCSP
SCM-28D Inline System
POTO VOTAIC Products
Section A Section B Section1 C1
SCM-28D Inline System
Section B (BSF)
SCSP SCSPSCIB
Section B
SCIB : Breakage inspection, Buffer system (100wafer/lane)SCSP : Bottom side(BSF) printing, Breakage inspectionSCSP : Bottom side(BSF) printing, Breakage inspectionDryer
POTO VOTAIC Products
SCM-28D Inline System
SCSP SCSPSCIF SCPI
SCIF : Breakage inspection, Buffer system (100 wafer/lane), Flip stationSCSP : Bottom side(Finger grid) printing, Breakage inspectionSCSP : Bottom side(Finger grid) printing, Breakage inspectionSCPI : Pattern inspection (Finger grid)Dryer
Section C (Finger)
Section A Section B Section C1
POTO VOTAIC Products
SCM-28D Inline System ( Double Printing )
SCM-28D
SCSP SCSPSCIF SCPI
Section C2 ( Same with Section C1)
SCIF : Breakage inspection, Buffer system (100 wafer/lane), Flip stationSCSP : Bottom side(Finger grid) printing, Breakage inspectionSCSP : Bottom side(Finger grid) printing, Breakage inspectionSCPI : Pattern inspection (Finger grid)Dryer & Firing Furnace
Section C2 (Finger)
Section A Section B Section C1,C2
