mems brochure

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Except as otherwise noted, all marks are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. ® = registered in the U.S. Patent and Trademark Office. © 2013 Henkel Corporation. All rights reserved. 10676 / LT-6742 (6/13) Henkel Electronic Materials LLC 14000 Jamboree Road Irvine, CA 92606 1.714.368.8000 1.800.562.8483 Henkel Europe Nijverheidsstraat 7 B-2260, Westerlo Belgium +32.1457.5611 Henkel Asia 332 Mei Gui South Road Waigaoqiao FTZ Shanghai 200131 China +86.21.3898.4800 Across the Board, Around the Globe. www.henkel.com/electronics Henkel Electronics MEMS Micro-Electro-Mechanical Systems

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Page 1: MEMS Brochure

Except as otherwise noted, all marks are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere.® = registered in the U.S. Patent and Trademark Office. © 2013 Henkel Corporation. All rights reserved. 10676 / LT-6742 (6/13)

Henkel Electronic Materials LLC14000 Jamboree RoadIrvine, CA 926061.714.368.80001.800.562.8483

Henkel EuropeNijverheidsstraat 7B-2260, WesterloBelgium+32.1457.5611

Henkel Asia332 Mei Gui South RoadWaigaoqiao FTZShanghai 200131 China+86.21.3898.4800

Across the Board, Around the Globe.www.henkel.com/electronics

Redline® : Opt + 2 Henkel Electronics

MEMSMicro-Electro-Mechanical Systems

Page 2: MEMS Brochure

MEMSHenkel Electronic Advantage

Today, the average smartphone contains approximately eight to ten MEMS – a number which is projected to

grow in the coming years – one gets a sense for the breadth of MEMS applications. The ability to design, test

and commercialize new MEMS devices quickly is critical to a MEMS manufacturer’s market competitiveness.

In order to meet the average three-to-six month cycle time, MEMS manufacturers need to leverage proven

materials solutions that are market-ready, market-tested and supported globally to facilitate multi-site design

and manufacturing.

For trusted, proven MEMS materials, a full solutions approach, quick materials delivery for fast production

ramp-up, supply chain simplification, global support and capability, along with an expert, knowledgeable team,

Henkel is the obvious – and only – choice.

MEMS Application OverviewMicrophone, Pressure Sensors

Henkel's full portfolio of materials for varying processes from die attach to underfill to lid attach and glob top,

commercialized, proven materials, in combination with a global support structure, ensures Henkel quick delivery of

materials around the globe for just about any MEMS application.

MEMS Application OverviewAccelerometers, Gyroscope, Magnetometers

ASICMEMS

Diaphragm

Glob TopLid/Cap Attach MEMS AttachASIC Attach

Source: Yole Développement SARL

MoldCompound

MEMS Attach

ASICAttach

ASIC

Package

Sensor

Cap

ASICMEMS

Diaphragm

Glob TopLid/Cap Attach MEMS AttachASIC Attach

Source: Yole Développement SARL

MoldCompound

MEMS Attach

ASICAttach

ASIC

Package

Sensor

Cap

Application Products DescriptionModulus @ 25°C (MPa)

Modulus @ 250°C (MPa)

ASIc Attach or MEMS

Attach

Non-conductive –Paste

LocTITE AbLESTIk QMI 536Nb

Low stress and low moisture absorption. No bleed

300 89

LocTITE AbLESTIk QMI 538Nb 100 50

LocTITE AbLESTIk 2025D 400 100

Non-conductive – Paste Print b-Stage

LocTITE AbLESTIk 8006NS b-stagable, wafer backside coating, fillet control 4400 70

LocTITE AbLESTIk 6202cx b-stagable, printed boc, fillet control 600 12

ASIc Attach Non-conductive – Film b-Stage

LocTITE AbLESTIk ATb 120US

DDAF, compatible with UV tape. Suitable for >3x3mm die 1300 2

LocTITE AbLESTIk ATb F125E

DDAF, compatible with UV tape. Suitable for <3x3mm die 5300 180

ASIc Attach or MEMS

Attach

conductive – Paste

LocTITE AbLESTIk 8290

High reliability and good adhesive on different surfaces 3900 130

LocTITE AbLESTIk 2100A Good reliability on bGA package 1500 235

Lid or cap Attach

Non-conductive – Paste

LocTITE AbLESTIk 3220

Low cure temp and good adhesion on different surfaces including LcP 2800 75

LocTITE AbLESTIk 3128

Good adhesion on different surface including LcP 4600 37

LocTITE AbLESTIk Mc 723

75µm spacer for blt control. Good adhesion and reliability 4300 200

Lid or cap Attach

conductive – Paste

LocTITE AbLESTIk cE 3920

Sn compatible and good adhesion on different surfaces 4900 110

LocTITE AbLESTIk 84-1LMISR4 Good adhesion on different surfaces 6100 300

LocTITE AbLESTIk 2030Sc Fast and low temp cure, low modulus 5200 600

Glob Top Non-conductive – Liquid

LocTITE EccoboND Eo 1058 High Tg, low cTE 4100 N/A

LocTITE EccoboND UF 8828 High flow speed, high reliability 6500 120

Underfill Non-conductive – Liquid

LocTITE EccoboND FP 4549

Low viscosity, fast flow, high reliability, high thermal condition 6300 100

LocTITE EccoboND FP 4530

Snap curable and proven reliability on different surfaces 7200 50

Non conductive Paste (NcP)

Non-conductive – Paste

LocTITE EccoboND FP 5201 comparable with small gap and tight pitches 6400 900

LocTITE EccoboND FP 5208 Low viscosity, high Tg 4200 300

Mold compound Non-conductive LocTITE HYSoL

GR 9810-1PHigh Tg, low shrinkage and warpage. Available in 45µm & 75µm filler size 21000 2300

Henkel provides multiple materials for quick evaluation and testing. This combined with Henkel's global infrastructure,

ensures expert and on-site worldwide technical support.

Henkel's MEMS Material Portfolio