mems brochure
TRANSCRIPT
Except as otherwise noted, all marks are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere.® = registered in the U.S. Patent and Trademark Office. © 2013 Henkel Corporation. All rights reserved. 10676 / LT-6742 (6/13)
Henkel Electronic Materials LLC14000 Jamboree RoadIrvine, CA 926061.714.368.80001.800.562.8483
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Across the Board, Around the Globe.www.henkel.com/electronics
Redline® : Opt + 2 Henkel Electronics
MEMSMicro-Electro-Mechanical Systems
MEMSHenkel Electronic Advantage
Today, the average smartphone contains approximately eight to ten MEMS – a number which is projected to
grow in the coming years – one gets a sense for the breadth of MEMS applications. The ability to design, test
and commercialize new MEMS devices quickly is critical to a MEMS manufacturer’s market competitiveness.
In order to meet the average three-to-six month cycle time, MEMS manufacturers need to leverage proven
materials solutions that are market-ready, market-tested and supported globally to facilitate multi-site design
and manufacturing.
For trusted, proven MEMS materials, a full solutions approach, quick materials delivery for fast production
ramp-up, supply chain simplification, global support and capability, along with an expert, knowledgeable team,
Henkel is the obvious – and only – choice.
MEMS Application OverviewMicrophone, Pressure Sensors
Henkel's full portfolio of materials for varying processes from die attach to underfill to lid attach and glob top,
commercialized, proven materials, in combination with a global support structure, ensures Henkel quick delivery of
materials around the globe for just about any MEMS application.
MEMS Application OverviewAccelerometers, Gyroscope, Magnetometers
ASICMEMS
Diaphragm
Glob TopLid/Cap Attach MEMS AttachASIC Attach
Source: Yole Développement SARL
MoldCompound
MEMS Attach
ASICAttach
ASIC
Package
Sensor
Cap
ASICMEMS
Diaphragm
Glob TopLid/Cap Attach MEMS AttachASIC Attach
Source: Yole Développement SARL
MoldCompound
MEMS Attach
ASICAttach
ASIC
Package
Sensor
Cap
Application Products DescriptionModulus @ 25°C (MPa)
Modulus @ 250°C (MPa)
ASIc Attach or MEMS
Attach
Non-conductive –Paste
LocTITE AbLESTIk QMI 536Nb
Low stress and low moisture absorption. No bleed
300 89
LocTITE AbLESTIk QMI 538Nb 100 50
LocTITE AbLESTIk 2025D 400 100
Non-conductive – Paste Print b-Stage
LocTITE AbLESTIk 8006NS b-stagable, wafer backside coating, fillet control 4400 70
LocTITE AbLESTIk 6202cx b-stagable, printed boc, fillet control 600 12
ASIc Attach Non-conductive – Film b-Stage
LocTITE AbLESTIk ATb 120US
DDAF, compatible with UV tape. Suitable for >3x3mm die 1300 2
LocTITE AbLESTIk ATb F125E
DDAF, compatible with UV tape. Suitable for <3x3mm die 5300 180
ASIc Attach or MEMS
Attach
conductive – Paste
LocTITE AbLESTIk 8290
High reliability and good adhesive on different surfaces 3900 130
LocTITE AbLESTIk 2100A Good reliability on bGA package 1500 235
Lid or cap Attach
Non-conductive – Paste
LocTITE AbLESTIk 3220
Low cure temp and good adhesion on different surfaces including LcP 2800 75
LocTITE AbLESTIk 3128
Good adhesion on different surface including LcP 4600 37
LocTITE AbLESTIk Mc 723
75µm spacer for blt control. Good adhesion and reliability 4300 200
Lid or cap Attach
conductive – Paste
LocTITE AbLESTIk cE 3920
Sn compatible and good adhesion on different surfaces 4900 110
LocTITE AbLESTIk 84-1LMISR4 Good adhesion on different surfaces 6100 300
LocTITE AbLESTIk 2030Sc Fast and low temp cure, low modulus 5200 600
Glob Top Non-conductive – Liquid
LocTITE EccoboND Eo 1058 High Tg, low cTE 4100 N/A
LocTITE EccoboND UF 8828 High flow speed, high reliability 6500 120
Underfill Non-conductive – Liquid
LocTITE EccoboND FP 4549
Low viscosity, fast flow, high reliability, high thermal condition 6300 100
LocTITE EccoboND FP 4530
Snap curable and proven reliability on different surfaces 7200 50
Non conductive Paste (NcP)
Non-conductive – Paste
LocTITE EccoboND FP 5201 comparable with small gap and tight pitches 6400 900
LocTITE EccoboND FP 5208 Low viscosity, high Tg 4200 300
Mold compound Non-conductive LocTITE HYSoL
GR 9810-1PHigh Tg, low shrinkage and warpage. Available in 45µm & 75µm filler size 21000 2300
Henkel provides multiple materials for quick evaluation and testing. This combined with Henkel's global infrastructure,
ensures expert and on-site worldwide technical support.
Henkel's MEMS Material Portfolio