master bond ep21tcht-1 for high performance bonding and sealing
DESCRIPTION
Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 passes NASA low outgassing tests and develops a high bonding strength of 1,800 psi at ambient temperatures.TRANSCRIPT
