march, 2008 david e. swenson esd association · david e. swenson esd association president 2008....
TRANSCRIPT
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March, 2008David E. SwensonESD Association
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ESD Association Introduction, Advancements and Educational Opportunities
Presented by:David E. SwensonESD Association President 2008
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Why is ESD Still Important?
• Devices with increased ESD sensitivity are arriving at Electronics manufacturing companies now
• Automated processing replacing people – shift from Human Body Model to Charged Device Model and Machine Model concerns
• Manufacturing process capability needs to keep pace with changes in device susceptibility to ESD
• The disk drive industry has had to deal with increased ESD susceptibility for years – need to keep pace with technology advances and reduction in overall cost
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Changes in Device Performance
• To achieve the performance and density specifications required by industry, many types of electronic devices are becoming more sensitive to ESD
• The current trend, which is expected to continue, is to increase circuit performance at the expense of ESD protection• This is especially the case for RF circuit applications
• And, already well known in the disk drive industry
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ESD Technology Road Map
• Prediction in device sensitivity by senior device designers at IBM, Texas Instruments and Intel Corporations
• Increases in device sensitivity are here now, particularly for RF components
• Road Map already assumes the increase in magneto-resistive head ESD sensitivity
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Device Sensitivity RoadmapCMOS HBM (Min and Max Levels)
0
2000
4000
6000
8000
10000
1980 1985 1990 1995 2000 2005 2010
Year
HB
M V
olts
2005 level – 300 volts
2010 level – 100 volts
Copyright 2005 ESD Association
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Device Sensitivity Roadmap
2005 level – 100 volts
2010 level – 50 volts
Copyright 2005 ESD Association
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Device Sensitivity Roadmap
2005 level – 30 volts
2010 level – 10 voltsCopyright 2005 ESD Association
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ESD Damage!
ESD damage to the IC’s can occur in different failure modes from slight to severe
ESD Latch-up ESD
ESD ESDEOS
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EOS & ESD Damage
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Factory Issues
• Determine the process capability• What level of device ESD sensitivity can the process
handle?• What process areas are suspect?• Can you determine fall-out from ESD?
• Is it possible to verify that the ESD controls are functioning correctly?• What are the appropriate measurement tools?
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Factory Considerations - Personnel
• Relatively simple and proven methodology to establish the minimum requirements for personnel • ANSI/ESD S20.20, JESD 625A and IEC61340-5-1 all call for
<35 MΩ for personnel (100 V HBM) • IDEMA <10 MΩ (10 volts HBM)• Fairly easy to monitor these requirements• Daily (minimum) wrist strap and footwear checks
• Constant monitoring in sensitive applications• Regular floor maintenance
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Wrist Strap System Resistance Test
Ground Lead
Positive Lead
Wrist Strap #304 Stainless Steel Electrode
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Testing Shoe Grounder while worn
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ESD Association ESD STM97.1-1999Floor Materials and Footwear –
Resistance Measurement in Combination with a Person
Stainless steel, brass or copper electrode.
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ESD Association ESD STM97.2-1999Floor Materials and Footwear –
Voltage Measurement in Combination with a Person
Stainless steel, brass or copper electrode.(or wrist strap can be used.
312.6 - 1.24CHARGE PLATE MONITOR
+ -Voltage Adjust
Plate Controls
Charge Plate Monitor
8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8
Recording Device
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Voltage Vs. RTG (Wrist Strap)
IDEMA Level
General factory level
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Person Walking across various surfaces
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Person Walking – good example
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Factory Automation adds issues
• A need exists to measure charge generation, charge accumulation and ESD inside equipment -• What is happening inside the tool – fixture – assembly
line? • Goal is to qualify equipment in a similar way as
has been done for personnel in manual operations -• Quantify the electrostatic levels inside the equipment
to help establish process capability
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Machine Model Concerns
• Make sure that all the metal surfaces that can come into contact with ESD sensitive devices are grounded, all the time !!!
• Need to make resistance measurements with metal parts in motion – conveyors, belts, slides – to verify that all metal parts are electrically bonded and ultimately attached to ground
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Field Induced Charged Device Model
• Reduce electrical fields from the process essential insulators
• ESD sensitive devices grounded in the presence of an electrical field will charge and discharge – perhaps multiple times
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Workstation Monitoring
E-Field measurements of a manual workstation installing heat-sinks on a PC Board. Large pulses when empty plastic tray removed, 1 meter away from work area
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Workstation E-field
Plastic tray E-field increases as Heat Sinks are removed from tray pockets
Plastic Tray Removal
New Sensors are in development with extreme sensitivity
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Induced Voltage (Experimental Data)
S20.20 Recommendation
2
0
0
0
V
O
L
T
S
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Electrical Field Considerations in Disk Drive Industry
• Maximum E-field within 30 cm of any sensitive process:
500 Volts
• Not a simple requirement• Requires great care to eliminate non-essential
insulators• Use of properly applied ionization
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Impact of E-Field of 500 Volts at 1 inch at various distance and sizes
Various Size Plates Charged from 500 V Power Supply at Various Distances
0
100
200
300
400
500
600
1 3 6
Distance
Fiel
d St
reng
th
Volts
@in
ch 61.50.75
Plates in Inches
Field Mill Measurement
20,000 V/m
12,000 V/m
4,000 V/m
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Measuring Induction Inside Process Equipment
• Industry is developing tools and equipment for process verification• Monitor induced voltage levels inside process
equipment (Field Induced CDM)• Locate areas within equipment where discharges
occur• Help spot MM issues
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49 Volts
J. Kinnear, IBMBeta Test SeriesCDM/FIM Handlers
DevicePlacement
PCB Momentarily Stopped
Courtesy of SH&A/Prostat
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Process Monitoring
Electrical field measurement – Volts/meter
Circuit Board assembly
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Process Monitoring
Circuit Board assembly – expanded view
Electrical Field – Volts/Meter
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Process Monitoring
Circuit Board Assembly – Part Placement
Electrical Field – Volts/cm
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Transition to the Next Level
• Device Design and Factory personnel must prepare to handle the increased ESD sensitivity coming soon
• Having a better understanding of ESD control techniques will be required in the factory
• Knowing how to make all the required measurements will be an essential skill in the (near) future for those that must maintain an Electrostatic Protected Area
This leads to a need for increased education
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ESD Association - Professional Education
• ESD Program Manager Certification• 10 Tutorials in the education curriculum • Comprehensive 8 hour exam
• ESD Device Design Professional• 12 Tutorials in the education curriculum• Comprehensive 8 hour exam
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iNarte
• The ESD Association has a renewed agreement with iNARTE to assist with their certification programs
• ESD Association tutorials are the main training materials for the ESD Technician and ESD Engineer Certifications offered by iNARTE
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Certified Program Manager Tutorial Curriculum
• ESD Basics (full day)• How To’s of In-Plant ESD
Auditing and Evaluation Measurements (full day)
• ESD Program Development and Assessment (2-days)
• Device Technology and Failure Analysis Overview
• Electrostatic Calculations for the ESD Engineer
• Cleanroom considerations for the Program Manager
• System Level ESD/EMI: Testing to IEC and other Standards
• Air Ionization: Issues and Answers
• ESD Standards Overview for the Program Manager
• Packaging Principles for the Program Manager
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Additional Class Relevant to the Disk Drive Industry
ESD Control for Extremely Sensitive Class “0”Devices
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Certified Program Manager
• Comprehensive 8 hour exam covering all aspects/subjects taught in Tutorial program
• Essay questions – ~40% of score• Graded by two independent Program Manager
Council Members• Must pass each section with a minimum grade of
50%. Must have an overall average of >70%
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Certified Program Manager
• Current iNARTE Engineers may take test without taking Tutorials• Comments received:
• Difficult test • Good test of ESD Control knowledge• Much harder than the iNARTE test• Command of English (reading and writing) a must
for essay questions
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ESD Device Design Professional – Tutorial Curriculum
• ESD On-chip Protection in Advanced Technologies
• System Level ESD/EMI: Testing to IEC and other Standards
• On-Chip ESD Protection for RF Technologies
• Spice-Based ESD Protection Design Utilizing Diodes and Active MOSFER Rail Clamp Circuits
• EOS/ESD Failure Models and Mechanisms
• Circuit Modeling and Simulation for On-Chip Protection
• Latch-up Physics and Design• Device Testing-Component Level –
HBM,CDM,MM,& TLP• Impact of CMOS Technology Scaling
for ESD• CDM Design and Characterization• Troubleshooting On-Chip ESD
Failures• Transmission Line Pulse
Measurements: Parametric Analyzer for ESD On-Chip Protection
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ESD Device Design Professional
• The first examination for DD Certification was offered at the 2007 (EOS/ESD Symposium)
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Tutorial Offering - 2008
• The full slate of Tutorials are offered each year at the EOS/ESD Symposium • September 7-12, 2008, Westin La Paloma Resort and
Convention Center, Tucson, AZ• Selected Tutorials offered throughout the year at
ESD Association Standards/Planning meetings and co-sponsored by Local Chapters
See 2008 schedule at www.esda.org
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International Tutorials
• The ESD Association is developing plans to offer Tutorials throughout the world• High interest in Asia and Europe• Working on logistics
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Wrap-up
• ESD Sensitivity will increase dramatically over the next couple years for all electronic parts
• In-plant processes must improve to avoid costly losses• Education of employees involved in the ESD Control
Program is gaining in importance (again)• The Device Design community offers a new educational
package
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Thank you for allowing me to deliver this message today