tion of chromic acid by a reducingagent and the solid particles, saidelectroplating solution being de­void of complexing agents.

MAIlIU.ACTUU O' ....ffnDCIRCUIT BOARDSU.S. Patent 5,869,126. Feb. 9. 1999P. Kukallskis, assignor toMacDermid Inc., Waterbury, Conn.A process for producing printedcircuit boards, which comprisesforming circuitry comprising cir­cuit elements and other featuresselected from the group consistingof lands, tabs, pads, and other ar­eas of connection on a copper-cladlaminate; applying a mask overthe laminate; drilling holes in anarray; activating the holes to ac­cept plating therein; thereafter

stripping the mask; applying aplating mask over the laminate inan imagewise manner such thatat least the holes and some of theother features are not covered bythe mask; cleaning surfaces notcovered by the plating mask; andplating the holes and any otherareas not covered by the platingmask with a metallic coating.

APPARATUS POR PLAnNG PINGRID ARRAY MODULISU.S. Patent 5,869,139. Feb. 9, 1999C.N. Biggs et al., assignors to IBMCorp., Armonk, N. Y.An apparatus for plating pin gridarray modules equipped with apinned surface.

PRnMATMINT TO AcnvAnMIT.... POR SOL..IL COAnNe

U.S. Patent 5,869,140. Feb. 9, 1999K. Y. Blohowiak et al., assignors toThe Boeing Co., SeattleA method for treating a metal sur­face to leave the surface clean andactive for receiving a sol coatingcomprising degreasing the sur­face; cleaning in an alkalinecleaner; etching the cleaned sur­face with an alkaline etchant; anddesmutting using a solution madefrom HN03, H2S04 , and ammo­nium bifluoride, wherein the des­mutted surface is water-break­free for greater than 60 sec.

SOL COAnNG Of MlTAUIU.S. Patent 5.869,141. Feb. 9, 1999K. Y. Blohowiak et al., assignors toThe Boeing Co.• SeattleA method for promoting adhesion

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