lm1003h eies smd power choke coil m owe oe oil pic1003h … · lm lm lm lm lm lm lm lm 20 33 2.5...

800.729.2099 tel www.icecomponents.com (09/13) LM1003H-1

LM1003H Series SMD Power Choke Coil

(a) (d)(b) (e)

1. PART NO. EXPRESSION :

(b) Dimension code

(c) Type code

(a) Series code

2. CONFIGURATION & DIMENSIONS :

A

SUPERWORLD ELECTRONICS (S) PTE LTD

3. SCHEMATIC :

(d) Inductance code : 1R0 = 1.0uH

(e) Tolerance code : M = ±20%

PG. 1

10.0±0.3

B C

2.8±0.2

D

3.0±0.3

E

Unit:m/m

11.0±0.5 2.3±0.3

h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.

f) Heat Rated Current (Irms) will cause the coil temperature rise approximately t of 40°C (keep 1min.)

g) Saturation Current (Isat) will cause L0 to drop 20% typical. (keep quickly).

5. GENERAL SPECIFICATION :

d) Storage Temp. : -10°C to + 40°C

c) Operating Temp. : -40°C to +125°C

e) Humidity Range : 50 ~ 60% RH (Product without taping)

b) Ambient Temp. : 25°C

a) Test Freq. : L : 100KHz/1.0V

(c) (f)

(f) F : RoHS Compliant

1R01151

A

B

C D

E

4. MATERIALS :

LM 1 0 0 3 H 1 R 0 M F -

SMD Power Choke Coil PIC1003H SERIES

(g)

(g) 11~99 : Internal controlled number

NOTE : Speci�cations subject to change without notice. Please check our website for latest information.

20.02.2012

(a) Core : Carbonyl Powder.

(b) Wire : Polyester Wire or equivalent

(c) Solder Plating : 100% Pb free solder

(d) Ink : Halogen-free ketone

(e) Paint : Epoxy resinab

c

d

e

Pb



SUPERWORLD ELECTRONICS (S) PTE LTDPG. 2

6. ELECTRICAL CHARACTERISTICS :

Inductance LPart No.

LM1003HR36MF

0

0.36

( µH )±20% @ 0 A

1.3

DCR

Typ. @ 25°C( m )

Irms( A )

23 40

( A )Isat

Typ. Typ.

DCR( m )

Max. @ 25°C

1.6

1.274.0FM74RH3001LM

LM

LM

LM

LM

LM

LM

LM

LM

5.23302

6.265.0FM65RH3001 0.34261

6.400.1FM0R1H3001 0.60251

5.605.1FM5R1H3001 5.70231

0.802.2FM2R2H3001 0.96121

5.4103.3FM3R3H3001 61419

5.0207.4FM7R4H3001 5.22317

8206.5FM6R5H3001 5.23217

2.0308.6FM8R6H3001 535.95.6

7. CHARACTERISTICS CURVES :

SMD Power Choke Coil


LM1003H8R2MF

LM1003H100MF

2402.8 845.86

050.01 5585

20.02.2012

PIC1003H SERIES

0 9 18 27 36 45DC CURRE NT(A)

0

0.2

0.4

0.6

0.8

IND

UCTA

NC

E (u

H)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TMPC1003H-R36LM1003HR36MF

0 8.25 16.5 24.75 33DC CURRENT(A)

0

0.2

0.4

0.6

0.8

INDU

CTAN

CE (u

H)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)


Pb







20.02.2012

PIC1003H SERIES

0 6 12 18 24DC CURRENT(A)

0

0.2

0.4

0.6

0.8

1

IND

UCT

ANCE

(uH

)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)


0 4 8 12 16 20DC CURRENT(A)

0

0 .5

1

1 .5

2

IND

UCTA

NCE

(uH

)

0

1 0

2 0

3 0

4 0

5 0

6 0

7 0

8 0

TEM

P. R

ISE(

o C)

TMPC1003H-1R0

0 4 8 12 16 20DC CURRENT(A)

0

0.6

1.2

1.8

2.4

3

IND

UCT

ANCE

(uH

)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

oC)

TMPC 1003H-1R5LM1003H1R5MF


0

1

2

3

4

IND

UCT

ANCE

(uH

)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TMPC1003H-2R2

0 3.5 7 10.5 14DC CURRENT(A)

0

1.5

3

4.5

6

IND

UCT

ANCE

(uH

)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TM PC1003H-3R3

0 3.25 6.5 9.75 13DC CURRENT(A)

0

2

4

6

8

IND

UC

TA

NC

E (u

H)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TM PC1003H-4R7LM1003H4R7MF

LM1003H1R0MF

LM1003H2R2MF

LM1003H3R3MF

Pb







20.02.2012

PIC1003H SERIES

0 2.375 4.75 7.125 9.5DC CURRENT(A)

0

3

6

9

12

IND

UCT

ANCE

(uH

)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TMPC1003H-6R8


0

2

4

6

8

10

IND

UCT

ANCE

(uH)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

oC)

TMPC1003H-5R6LM1003H5R6M LM1003H6R8MFF

0 2.125 4.25 6.375 8.5DC CURRENT(A)

0

4

8

12

16

IND

UCT

AN

CE (u

H)

0

10

20

30

40

50

60

70

80

TEM

P. R

ISE(

o C)

TMPC1003H-8R2


0

4

8

12

16

20

IND

UCT

AN

CE

(uH

)

0

1 0

2 0

3 0

4 0

5 0

6 0

7 0

8 0

TEM

P. R

ISE(

o C)

TMPC1003H-100LM1003H100MLM1003H8R2MF F

Pb



PG. 5SUPERWORLD ELECTRONICS (S) PTE LTD

8. RELIABILITY AND TEST CONDITION

Humidity Resistance

Thermal Shock Test

High Temperature

Reliability Test

Measure at room temperature after placing for 2 to 3 hrs.

Humidity : 85±3% RHTime : 1000±12 hours

Temperature : 85±2°C

321

Total : 300 cycles

Step

Conditions of 1 cycle.

Room Temperature+125+2/-0

-40+0/-2

15±1

15±1Temperature (°C) Times (min.)

Measured at room temperature after placing for 2 to 3hrsTime : 1000±12 hoursTemperature : 125±2°C

Refer to standard electrical characteristics list

PERFORMANCEElectrical Characteristics Test

Saturation Current (Isat)

Heat Rated Current (Irms)

DCR

Inductance

ITEM

HP4284A, CH11025, CH3302, CH1320, CH1320S

CH16502, Agilent33420A Micro-Ohm Meter.

LCR meter.

TEST CONDITION

Vibration Test

This cycle shall be performed 12 times in each of three

Amplitude: Parts mounted within 2" from any secure point.Frequency : 10-2000-10Hz for 20min.

(MIL-PRF-27)

(AEC-Q200-REV C)

Temperature : 260±5°C, 20~40 secondsDuration : 5 minutesPreheat : 150±5°CReflow Test

Electric specification should be satisfied

Solder test After dip into flux dip into solder235±5°C, 4±1secondsFlux, solder for lead free(ANSI/J-STD-002C Method B)

Terminals should be covered by over 95% solder on visual inspection.

2. Temperature measured by digital surface thermometer1. Applied the allowed DC current(keep 1min).approximately T(°C) without core lossIrms(A) will cause the coil temperature rise

Isat(A) will cause Lo to drop L(%) (keep quickly).

Directions and times : X, Y, Z directions for 20 min.

Within <0.2

Measured at room temperature after placing for 2 to 3hrs(AEC-Q200-REV C)

Exposure Test

mutually perpendicular directions.(Total 12 hours)(MIL-STD-202 Method 204 D Test condition B)

(IPC/JEDEC J-STD-020C)

L20% typical.

Approximately T�40°C

Low Temperature

Measured at room temperature after placing for 2 to 3hrsTime : 500±12 hoursTemperature : -40±2°C

Life Test


NOTE : Specifications subject to change without notice. Please check our website for latest information.

20.02.2012

PIC1003H SERIES

Pb




9. SOLDERING AND MOUNTING :

c) Never contact the ceramic with the iron tip

e) Use a 20 watt soldering iron with tip diameter of 1.0mmd) 1.0mm tip diameter (max)

f) Limit soldering time to 4~5 secs.

9-2.2 Soldering Iron (Figure 2) :

In the event that a soldering iron must be employed the following precautions are recommended.Products attachment with soldering iron is discouraged due to the inherent process control limitations.

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses causedby the difference in coefficients of expansion between solder, chip and substrate. TAIPAQ terminations are suitable for allwave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

a) Preheat circuit and products to 150°C.

air soldering tools.

9-2.1 Solder Re-flow :

Note :

b) 355°C tip temperature (max)

13.6

9-2. Soldering3.

5

5.4

9-1. Recommended PC Board Pattern

TEM

PE

RA

TUR

E °

C

Over 60sGradualCooling

Within 4-5s

350

150

Preheating SolderingcoolingNatural

Time(sec.)

60~150s

20~40s

Soldering

TEM

PE

RA

TUR

E °

C

480s max.

60~180s

150

25

TP(260°C/40s max.)

217

200

PreheatingcoolingNatural

Figure 1. Re-flow Soldering: 3 times max. Figure 2. Hand Soldering: 1 times max.



20.02.2012

PIC1003H SERIES

Pb




10. PACKAGING INFORMATION :

Bo(mm)

11.6±0.1

10-3. Packaging Quantity

LM1003

Series Ao(mm)

10.4±0.1 11.5±0.1

F(mm)P(mm)

16.0±0.1

Ko(mm)

3.5±0.1

W(mm)

24±0.3 0.35±0.05

T(mm)

10-2 Tape Dimension

24.0±0.5

A(mm)

13" x 24mm

Type

100±2

B(mm)

D

D(mm)

13.5±0.5 330

C(mm)

EMBOSSED CARRIER

B

A

COVER TAPE

10-1. Reel Dimension

LM1003

4000

1000

Carton

Chip / Reel

Inner Box

Size

500

2.0±0.5

ØC



1R0D

/C

3°

T

K0

B0

A0

F

W

P

4.0 2.0

1.5±0.1

D(mm)

20.02.2012

PIC1003H SERIES

1R0D

/C

1R0D

/C

1R0D

/C

1R0D

/C

1R0D

/C

D

Pb



SUPERWORLD ELECTRONICS (S) PTE LTD

10-4. Tearing Off ForceThe force for tearing off cover tape is 10 to 130 gramsin the arrow direction under the following conditions.

a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.

1. Storage Conditions :To maintain the solderabililty of terminal electrodes :

a) Temperature and humidity conditions : Less than 30°C and 70% RH.b) Recommended products should be used within 6 months from the time of delivery.c) The packaging material should be kept where no chlorine or sulfur exists in the air.

b) The use of tweezers or vacuum pick up is strongly recommended for individual components.c) Bulk handling should ensure that abrasion and mechanical shock are minimized.

2. Transportation :

Application Notice

Top cover tape

F

Base tape

165° to 180°Room Temp.

(°C)

5~35

Room Humidity(%)

45~85

Tearing Speed(mm/min)

300

Room atm(hPa)

860~1060

PG. 8

(referenced ANSI/EIA-481-C-2003 of 4.11 standard)



20.02.2012

PIC1003H SERIES

Pb

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Authorized Distributor

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lm1003h eies smd power choke coil m owe oe oil pic1003h … · lm lm lm lm lm lm lm lm 20 33 2.5...

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