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Library Expert Surface Mount Families

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Non‐polarized Rectangular Chip Components

Chip Capacitor

Chip Resistor

Chip Inductor

Chip Fuse

Chip Thermistor

Chip Varistor

Chip Non‐polarized Diode

Land Pattern Zero Rotation




Polarized Rectangle Chip Components

Polarized Chip Capacitor

Chip Diode

Chip LED

Polarized Capacitor Land Pattern Zero Rotation

Diode and LED Land Pattern Zero Rotation

Rectangular Chip Components (unit: mm)

Lead Part Most Environment Density Level A

Nominal Environment Density Level B

Least Environment Density Level C

Toe (JT) 0.55 0.35 0.15

Heel (JH) 0.00 0.00 0.00

Side (JS) 0.05 0.00 ‐0.05

Round‐off factor Round off to the nearest two place decimal, i.e., 1.00, 1.01, 1.02, 1.03

Courtyard excess 0.50 0.25 0.12

Rectangular Chip Components Smaller than 1608 (0603) (unit: mm)

Toe (JT) 0402 0.15

Toe (JT) 0201 0.12

Toe (JT) 01005 0.10

Heel (JH) 0.00

Side (JS) 0.00


Courtyard excess 0.15




Rectangular Chip Component Package Sizes

Table of Chip Package Size Codes and Dimensions

EIA (inch) Name Inch Dimensions IEC (metric) Name Metric Dimensions

01005 0.0157 in × 0.0079 in 0402 0.4 mm × 0.2 mm

0201 0.024 in × 0.012 in 0603 0.6 mm × 0.3 mm

0402 0.039 in × 0.020 in 1005 1.0 mm × 0.5 mm

0603 0.063 in × 0.031 in 1608 1.6 mm × 0.8 mm

0805 0.079 in × 0.049 in 2012 2.0 mm × 1.25 mm

1008 0.098 in × 0.079 in 2520 2.5 mm × 2.0 mm

1206 0.126 in × 0.063 in 3216 3.2 mm × 1.6 mm

1210 0.126 in × 0.098 in 3225 3.2 mm × 2.5 mm

1806 0.177 in × 0.063 in 4516 4.5 mm × 1.6 mm

1812 0.18 in × 0.13 in 4532 4.5 mm × 3.2 mm

2010 0.197 in × 0.098 in 5025 5.0 mm × 2.5 mm

2512 0.25 in × 0.13 in 6332 6.4 mm × 3.2 mm

2920 (0.29 in × 0.20 in 7451 7.4 mm × 5.1 mm

Non‐polarized Molded Body Inward Flat Ribbon Components

Capacitors (CAPM)

Molded Non‐polarized Diode (DIOMN)

Fuses (FUSM)

Molded Body Inductor (INDM)

Molded Precision Inductor (INDPM)

Molded Resistors (RESM)

Land Pattern Zero Rotation




Polarized Molded Body Inward Flat Ribbon Components

Molded Body Polarized

Capacitor (CAPMP)

Molded Body Diode (DIOM)

Molded Body LED (LEDM)

Polarized Capacitor Land Pattern Zero Rotation

Diode and LED Land Pattern Zero Rotation

Inward Flat Ribbon L‐Leads (unit: mm)




Toe (JT) (to find G dim) 0.25 0.15 0.07

Heel (JH) (to find Z dim) 0.80 0.50 0.20

Side (JS) 0.01 ‐0.05 ‐0.10



Common Molded Body Tantalum Capacitors

EIA Size Code Package Dimensions KEMET Case Code AVX Case Code

2012‐12 2.0 mm × 1.3 mm × 1.2 mm R R

3216‐10 3.2 mm × 1.6 mm × 1.0 mm I K

3216‐12 3.2 mm × 1.6 mm × 1.2 mm S S

3216‐18 3.2 mm × 1.6 mm × 1.8 mm A A

3528‐12 3.5 mm × 2.8 mm × 1.2 mm T T

3528‐21 3.5 mm × 2.8 mm × 2.1 mm B B

6032‐15 6.0 mm × 3.2 mm × 1.5 mm U W

6032‐28 6.0 mm × 3.2 mm × 2.8 mm C C

7260‐38 7.3 mm × 6.0 mm × 3.8 mm E V

7343‐20 7.3 mm × 4.3 mm × 2.0 mm V Y

7343‐31 7.3 mm × 4.3 mm × 3.1 mm D D

7343‐43 7.3 mm × 4.3 mm × 4.3 mm X E




Common Molded Body Diodes

JEDEC Standard Case Code Package Dimensions

DO‐214AA SMB 5.30 mm × 3.60 mm × 2.25 mm

DO‐214AB SMC 7.95 mm × 5.90 mm × 2.25 mm

DO‐214AC SMA 5.20 mm × 2.60 mm × 2.15 mm

Metal Electrode Leadless Face (MELF)

MELF Resistor (RESMELF)

MELF Fuse (FUSEMELF)

MELF Diode (DIOMELF)

Resistor and Fuse Land Pattern Zero Rotation A

Diode Land Pattern Zero Rotation

Metal Electrode Leadless Face (MELF) (unit: mm)




Toe (JT) 0.60 0.40 0.20

Heel (JH) 0.20 0.10 0.02

Side (JS) 0.10 0.05 0.01



Common MELF Package Sizes

Common Case Names Size Code Package Dimensions

MicroMelf (MMU) 0102 2.20 mm L X 1.10 mm Dia.

MiniMelf (MMA) 0204 3.60 mm L X 1.40 mm Dia.

Melf (MMB) 0207 5.80 mm L X 2.20 mm Dia.




Small Outline Diode (SOD) with Gull‐Wing Leads

Small Outline Diode (SOD)

SOD Land Pattern

Zero Rotation A

Flat Ribbon L and Gull‐Wing Leads (unit: mm)




Toe (JT) 0.55 0.35 0.15

Heel (JH)1 0.45 0.35 0.25

Side (JS) 0.05 0.03 0.01



Common Small Outline Diode (SOD) Sizes

Case Code Package Dimensions

SOD‐123 3.68 mm × 1.17 mm × 1.60 mm

SOD‐128 5.00 mm × 2.70 mm × 1.10 mm

SOD‐323 1.70 mm × 1.25 mm × 0.95 mm

SOD‐523 1.25 mm × 0.85 mm × 0.65 mm

SOD‐723 1.40 mm × 0.60 mm × 0.59 mm

Small Outline Diode Flat Lead (SODFL)

Small Outline Diode Flat Lead

SODFL Land Pattern

Zero Rotation

Small Outline Diodes, Flat Lead (unit: mm)




Toe (JT) 0.30 0.20 0.10

Heel (JH) 0.00 0.00 0.00

Side (JS) 0.05 0.00 ‐0.05






Capacitor, Aluminum Electrolytic (CAPAE)

Aluminum Electrolytic Capacitor

CAPAE Land Pattern

Zero Rotation

Crystals (XTAL)

Crystal

XTAL Land Pattern

Zero Rotation

Electrolytic Aluminum Capacitor and Crystal (unit: mm)




Toe (JT) 0.70 0.50 0.30

10.0 mm or higher 1.00 0.70 0.40

Heel (JH) 0.00 ‐0.10 ‐0.20

10.0 mm or higher 0.00 ‐0.05 ‐0.10

Side (JS) 0.50 0.40 0.30

10.0 mm or higher 0.60 0.50 0.40






Non‐polarized Side Concave Packages 2‐pin

Side Concave Crystal

Side Concave Inductor

Land Pattern

Zero Rotation

Polarized Side Concave Packages 2‐pin

Side Concave Diode

Side Concave LED

Land Pattern

Zero Rotation

Side Concave Terminal (unit: mm)




Toe (JT) 0.55 0.45 0.35

Heel (JH) ‐0.05 ‐0.07 ‐0.10

Side (JS) ‐0.05 ‐0.07 ‐0.10






Non‐polarized Dual Flat No‐Lead (DFN) 2‐pin

DFN Resistor, Inductor, Capacitor, Crystal, Fuse

Non‐polarized DFN Land Pattern

Zero Rotation

Polarized Dual Flat No‐Lead (DFN) 2‐pin

DFN Diode and LED

DFN Diode and LED Land Pattern

Zero Rotation

2‐pin Dual Flat No‐Lead (DFN) (unit: mm)




Periphery 0.05 0.00 ‐0.05



Dual Flat No‐Lead (DFN) Less than 1608 (0603)

Periphery ‐0.04






Small Outline Transistor SOT23 (SOT)

SOT23‐3

Land Pattern Zero Rotation A

Land Pattern Zero Rotation B

SOT23‐5



SOT23‐6



SOT23‐8







SOT143



SOT143 Reverse




SOT223‐4



SOT223‐5







SOT223‐6 Land Pattern Zero Rotation A


Flat Ribbon Land Gull‐Wing Leads (unit: mm)




Toe (JT) 0.55 0.35 0.15

Heel (JH)1 0.45 0.35 0.25

Side (JS) 0.05 0.03 0.01




SOT89






Small Outline Transistor, Flat Lead (SOTFL)

SOTFL 3‐Pin



SOTFL 5‐Pin



SOTFL 6‐Pin



SOTFL 8‐Pin



Small Outline Components, Flat Lead (unit: mm)




Toe (JT) 0.30 0.20 0.10

Heel (JH) 0.00 0.00 0.00

Side (JS) 0.05 0.00 ‐0.05


Courtyard excess1 0.20 0.15 0.12




Transistor Outline (DPAK)

TO DPAK Extended Thermal Tab



TO DPAK Under Body Thermal Tab



Gull‐Wing and Flat Lug Leads (unit: mm)




Toe (JT) 0.55 0.35 0.15

Heel (JH) 0.45 0.35 0.25

Side (JS) 0.05 0.03 0.01



Transistor, Dual Flat No‐lead (TRXDFN)

Transistor DFN 3‐Pin






Oscillator, Dual Flat No‐lead (OSCDFN)

Oscillator DFN 4‐Pin



Dual Flat No‐lead (DFN) (unit: mm)




Periphery 0.05 0.00 ‐0.05



Oscillator, J‐Lead (OSCJ)

Oscillator J‐Lead



J‐Leads (unit: mm)





Toe (JT) (to find G dim) 0.10 0.00 ‐0.10

Side (JS) 0.05 0.03 0.01






Oscillator, L‐Lead (OSCL)

Oscillator L‐Lead



Inward Flat Ribbon L Lead (unit: mm)






Side (JS) 0.05 0.03 0.01



Oscillator, Corner Concave (OSCCC)

Oscillator Corner Concave



Corner Concave Component Oscillator Lead Package (unit: mm)




Outer Periphery1 0.35 0.25 0.15

Inner Periphery2 0.10 0.00 ‐0.05



Note 1. The edge of the land associated with the outside of the component body. Note 2. The edge of the land under the component body.




Oscillator, Side Concave (OSCSC)

Oscillator Side Concave 4‐Pin



Oscillator Side Concave 6‐Pin



Side Concave (4‐pin) Diode and LED

Diode Side Concave 4‐Pin

LED Side Concave 4‐Pin






Side Lead Flat, Concave and Convex Terminal (unit: mm)




Toe (JT) 0.55 0.45 0.35

Heel (JH) ‐0.05 ‐0.07 ‐0.10

Side (JS) ‐0.05 ‐0.07 ‐0.10



Small Outline IC (SOIC)

Small Outline IC



Small Outline IC (SOIC) with Thermal Tab

SOIC with Thermal Tab






Small Outline Package (SOP)

Small Outline Package



Small Outline Package (SOP) with Thermal Tab

SOP with Thermal Tab



Ceramic Flat Package (CFP)

Ceramic Flat Pack






Quad Flat Package (QFP)

Quad Flat Package



Quad Flat Package (QFP) with Thermal Tab

Quad Flat Package with Thermal Tab



Ceramic Quad Flat Package (CQFP)

Ceramic Quad Flat Pack






Flat Ribbon L and Gull‐Wing Leads (greater than 0.625 mm pitch) (unit: mm)




Toe (JT) 0.55 0.35 0.15

Heel (JH)1 0.45 0.35 0.25

Side (JS) 0.05 0.03 0.01



Note 1. For gull wing components where dimension Smin is less than or equal to dimension Emax, use the following heel fillet goals:

Density Level A ‐ 0.25 mm Density Level B ‐ 0.15 mm Density Level C ‐ 0.05 mm Note 2. This does not apply to gull wing components where the lead terminals have a tolerance L that is greater than 0.5 mm.

Flat Ribbon L and Gull‐Wing Leads (less than or equal to 0.625 mm pitch) (unit: mm)




Toe (JT) 0.55 0.35 0.15

Heel (JH)1 0.45 0.35 0.25

Side (JS) 0.01 ‐0.02 ‐0.04



Note 1. For gull wing components where dimension Smin is less than or equal to dimension Emax, use the following heel fillet goals: Density Level A ‐ 0.25 mm

Small Outline J‐Lead (SOJ)

Small Outline J‐Lead



Plastic Leaded Chip Carrier (PLCC)

Plastic Leaded Chip Carrier






Small Outline J‐Lead (unit: mm)






Side (JS) 0.05 0.03 0.01



Small Outline L‐Lead (SOL)

Small Outline L‐Lead



Small Outline L‐Lead (SOL) (unit: mm)






Side (JS) 0.01 ‐0.02 ‐0.04






Ball Grid Array, Collapsing Ball (BGA)

Collapsing Ball Grid Array



Collapsing Ball Grid Array (BGA) (unit: mm)




Periphery 25% reduction below nominal ball diameter

20% reduction below nominal ball diameter

15% reduction below nominal ball diameter



Ball Grid Array, Non‐collapsing Ball (BGAN)

Non‐collapsing Ball Grid Array



Non‐collapsing Ball Grid Array (BGA) (unit: mm)




Periphery

15% increase above the nominal ball or column

diameter


diameter


diameter






Column Grid Array (CGA)

Column Grid Array



Column Grid Array (CGA)

Lead Part Nominal Environment

Density Level B

Periphery 0.10






Small Outline No‐lead (SON)

Small Outline No‐lead



Small Outline No‐lead (SON) with Thermal Tab

SON with Thermal Tab



Quad Flat No‐lead (QFN)

Quad Flat No‐lead






Quad Flat No‐lead (QFN) with Thermal Tab

QFN with Thermal Tab



Small Outline No‐Lead and Quad Flat No‐Lead (unit: mm)




Toe (JT) 0.40 0.30 0.20

Heel (JH) 0.00 0.00 0.00

Side (JS) ‐0.04 ‐0.04 ‐0.04






Pull‐back Small Outline No‐lead (PSON)

Pull‐back Small Outline No‐lead



Pull‐back Small Outline No‐lead (PSON) with Thermal Tab

PQFN with Thermal Tab



Pull‐back Quad Flat No‐lead (PQFN)

Pull‐back Quad Flat No‐Lead






Pull‐back Quad Flat No‐lead (PQFN) with Thermal Tab

PQFN with Thermal Tab



Small Outline No‐Lead and Quad Flat No‐Lead with Pullback (unit: mm)

Lead Part Maximum (Most) Density Level A

Median (Nominal) Density Level B

Minimum (Least) Density Level C

Periphery 0.05 0.00 ‐0.05



Land Grid Array (LGA)

Land Grid Array



Land Grid Array (LGA) (unit: mm)

Lead Part Nominal Environment Density Level B

Periphery 0.10






Leadless Chip Carrier (LCC)

Leadless Chip Carrier



Leadless Chip Carrier (LCC) (unit: mm)






Side (JS) 0.05 ‐0.05 ‐0.15






Resistor, Side Concave Chip Array (RESCAV)

Concave Chip Array Resistor



Inductor, Side Flat Chip Array (INDCAV)

Concave Chip Array Inductor



Resistor, Side Concave Chip Array 4‐Sided (RESCAV)

Example of 3D STEP model






Resistor, Convex Chip Array Type E (RESCAXE)

Convex Chip Array Type E



Resistor, Convex Chip Array Type S (RESCAXS)

Convex Chip Array Type S



Side Flat/Concave/Convex Terminals (unit: mm)




Toe (JT) 0.55 0.45 0.35

Heel (JH) ‐0.05 ‐0.07 ‐0.10

Side (JS) ‐0.05 ‐0.07 ‐0.10



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