lg tft-lcd color monitor flatron l1553s-bfq(sfq) service manual

담 당 관 리 자

Model Description

MODEL BRAND

Printing Specification

1. Trim Size (Format) : 215mm x 280 mm

2. Printing Colors• Cover : LG COLORS• Inside : Black

3. Stock (Paper)• Cover : Snow White 150 g/• Inside : Snow White 100 g/

4. Printing Method : 5. Bindery : Saddle stitch6. Language : English7. Number of pages : 28 (Including blank 1page)

Part No.

1.

2.

Service Guide SpecificationService Guide Specification

Changes 4.

REV.NO. MM/DD/YY SIGNATURE CHANGE NO. CHANGE CONTENTS

1

2

3

4

5

7

6

SUFFIX

L1553S-SFQ/BFQ LG

MFL30290837

(1) Origin Notification* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K.* LGESP : Printed in Brazil * LGEMX : Printed in Mexico* LGENT : Printed in China * LGEIL : Printed in India

8

Special Instructions3.

Product Name FLATRON L1553S-SF/BF

Pagination sheetPagination sheet P/NO.MFL30290837Total pages :28pages

CoverEnglish

2

English

3

English

4

English

….

English

…..

Rear Cover

Front coverInside

blank

English

….

English

22

English

23

English

24

English

25

Rear coverInside

26

COLOR MONITORSERVICE MANUAL

*To apply the MSTAR Chip.

( ) **Same model for Service

Website:http://biz.LGservice.comE-mail:http://www.LGEservice.com/techsup.html

CAUTIONBEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : CL-82MODEL: L1553S(L1553S-SFQ.ACN*QP N )

L1553S(L1553S-BFQ.ACN*QP N )

- 2 -

CONTENTS

SPECIFICATIONS ................................................... 2PRECAUTIONS ....................................................... 3TIMING CHART ....................................................... 7DISASSEMBLY ....................................................... 8BLOCK DIAGRAM ................................................... 9DESCRIPTION OF BLOCK DIAGRAM....................10ADJUSTMENT ...................................................... 12

SERVICE OSD ...................................................... 13TROUBLESHOOTING GUIDE .............................. 14WIRING DIAGRAM ............................................... 18EXPLODED VIEW...................................................19REPLACEMENT PARTS LIST ...............................21 SCHEMATIC DIAGRAM......................................... 23

1. LCD CHARACTERISTICSType : TFT Color LCD ModuleActive Display Area : 15 inchSize : 326.5(W) x 253.5(H) x 11.2(D)Pixel Pitch : 0.297 (H) x 0.297 (V)Color Depth : 6bit with FRC, 16M clolorsElectrical Interface : LVDSSurface Treatment : Hard-coating(3H), Anti-GlareOperating Mode : Normally White, Transmissive modeBacklight Unit : 2-CCFL

2. OPTICAL CHARACTERISTICS2-1. Viewing Angle by Contrast Ratio ≥ 10CPT TNLeft : 60°min. Right : 70°(Typ)Top : 50°min., 60°(Typ) Bottom : 55°min., 65°(Typ)

LPL TNLeft : 55°min., 65°(Typ) Right : 55°min., 65°(Typ)Top : 40°min., 45°(Typ) Bottom : 50°min., 55°(Typ)

2-2. Luminance : 200(min), 250(Typ)

2-3. Contrast Ratio : 300(min), 400(Typ)

3. SIGNAL (Refer to the Timing Chart)3-1. Sync Signal

• Type : Separate Sync.

3-2. Video Input Signal1) Type : R, G, B Analog2) Voltage Level : 0~0.71 Va) Color 0, 0 : 0 Vp-pb) Color 7, 0 : 0.467 Vp-pc) Color 15, 0 : 0.714 Vp-p

3) Input Impedance : 75 Ω

3-3. Operating FrequencyHorizontal : 30 ~ 63kHzVertical : 56 ~ 75Hz

4. Max. ResolutionD-sub Analog : 1024 x 768@75Hz

5. POWER SUPPLY5-1. Power : AC 100~240V, 50/60Hz , 0.6A

5-2. Power Consumption

6. ENVIRONMENT

6-1. Operating Temperature : 10°C~35°C 6-2. Relative Humidity : 10%~80%6-3. MTBF : 50,000 HRS with 90%

Confidence levelLamp Life : 40,000 Hours(Min)

7. DIMENSIONS (with TILT/SWIVEL)

Width : 332 mm (13.07'')Depth : 180 mm (7.08'')Height : 339 mm (13.35'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight : 2.1 kg (4.63 lbs)Gross Weight : 5.0 kg (11.02 lbs)

SPECIFICATIONS

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

POWER S/W Off

H/V SYNC

ON/ON

OFF/ON

ON/OFF

OFF/OFF

-

POWER CONSUMPTION

less than 1 W

less than 17W

less than 1 W

less than 1 W

less than 1 W

LED COLOR

BLUE

or GREEN

AMBER

AMBER

AMBER

OFF

VIDEO

ACTIVE

OFF

OFF

OFF

-

- 3 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCDmonitor that are important for safety. These parts aremarked on the schematic diagram and thereplacement parts list. It is essential that these criticalparts should be replaced with the manufacturer’sspecified parts to prevent electric shock, fire or otherhazard.

• Do not modify original design without obtaining writtenpermission from manufacturer or you will void theoriginal parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULEWITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arrangedin four corners.

• Do not press on the panel, edge of the frame stronglyor electric shock as this will result in damage to thescreen.

• Do not scratch or press on the panel with any sharpobjects, such as pencil or pen as this may result indamage to the panel.

• Protect the module from the ESD as it may damage theelectronic circuit (C-MOS).

• Make certain that treatment person’s body aregrounded through wrist band.

• Do not leave the module in high temperature and inareas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit withinthe module.

• If the surface of panel become dirty, please wipe it offwith a softmaterial. (Cleaning with a dirty or rough clothmay damage the panel.)

WARNINGBE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) orinverter circuit, must disconnect the AC adapterbecause high voltage appears at inverter circuit about650Vrms.

• Handle with care wires or connectors of the invertercircuit. If the wires are pressed cause short and mayburn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTIONPlease use only a plastic screwdriver to protect yourselffrom shock hazard during service operation.

1.5 Kohm/10W

To Instrument'sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

- 4 -

SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by thisservice manual and its supplements and addenda, readand follow the SAFETY PRECAUTIONS on page 3 of thispublication.NOTE: If unforeseen circumstances create conflictbetween the following servicing precautions and any of thesafety precautions on page 3 of this publication, alwaysfollow the safety precautions. Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC

power source before;a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.CAUTION: A wrong part substitution or incorrectpolarity installation of electrolytic capacitors mayresult in an explosion hazard.

d. Discharging the picture tube anode.2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltagemeasuring device (DVM, FETVOM, etc) equipped witha suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) firstconnecting one end of an insulated clip lead to thedegaussing or kine aquadag grounding system shieldat the point where the picture tube socket ground leadis connected, and then (b) touch the other end of theinsulated clip lead to the picture tube anode button,using an insulating handle to avoid personal contactwith high voltage.

4. Do not spray chemicals on or near this receiver or anyof its assemblies.

5. Unless specified otherwise in this service manual,clean electrical contacts only by applying the followingmixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator;10% (by volume) Acetone and 90% (by volume)isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual,lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlockswith which receivers covered by this service manualmight be equipped.

7. Do not apply AC power to this instrument and/or any ofits electrical assemblies unless all solid-state deviceheat sinks are correctly installed.

8. Always connect the test receiver ground lead to thereceiver chassis ground before connecting the testreceiver positive lead.Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified inthis service manual.CAUTION: Do not connect the test fixture ground strapto any heat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can bedamaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive (ES)Devices. Examples of typical ES devices are integratedcircuits and some field-effect transistors andsemiconductor "chip" components. The followingtechniques should be used to help reduce the incidence ofcomponent damage caused by static by static electricity.1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drainoff any electrostatic charge on your body by touching aknown earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device,which should be removed to prevent potential shockreasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped withES devices, place the assembly on a conductivesurface such as aluminum foil, to prevent electrostaticcharge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder orunsolder ES devices.

4. Use only an anti-static type solder removal device.Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient todamage ES devices.

5. Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damage ESdevices.

6. Do not remove a replacement ES device from itsprotective package until immediately before you areready to install it. (Most replacement ES devices arepackaged with leads electrically shorted together byconductive foam, aluminum foil or comparableconductive material).

7. Immediately before removing the protective materialfrom the leads of a replacement ES device, touch theprotective material to the chassis or circuit assemblyinto which the device will be installed.CAUTION: Be sure no power is applied to the chassisor circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motionsuch as the brushing together of your clothes fabric orthe lifting of your foot from a carpeted floor cangenerate static electricity sufficient to damage an ESdevice.)

- 5 -

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tiptemperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core soldercomposed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with ametal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron t ip to reach normal

temperature.(500。F to 600。F)

b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solderbraid.CAUTION: Work quickly to avoid overheating thecircuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction ofthe component lead and the printed circuit foil, andhold it there only until the solder flows onto andaround both the component lead and the foil.CAUTION: Work quickly to avoid overheating thecircuit board printed foil.

d. Closely inspect the solder area and remove anyexcess or splashed solder with a small wire-bristlebrush.

IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong)through which the IC leads are inserted and then bent flatagainst the circuit foil. When holes are the slotted type,the following technique should be used to remove andreplace the IC. When working with boards using thefamiliar round hole, use the standard technique asoutlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering irontip as the solder melts.

2. Draw away the melted solder with an anti-staticsuction-type solder removal device (or with solderbraid) before removing the IC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad

and solder it.3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating tothe areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as

close as possible to the component body.2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit boardand crimp the "U" with long nose pliers to insure metalto metal contact then solder each connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor

leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the

circuit board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close

as possible to diode body.2. Bend the two remaining leads perpendicular y to the

circuit board.3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuitboard.

4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder

joints of the two "original" leads. If they are not shiny,reheat them and if necessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.2. Securely crimp the leads of replacement component

around notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between thereplaced component and adjacent components and thecircuit board to prevent excessive componenttemperatures.

- 6 -

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printedcircuit board will weaken the adhesive that bonds the foilto the circuit board causing the foil to separate from or"l i f t-off" the board. The following guidelines andprocedures should be followed whenever this condition isencountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections usethe following procedure to install a jumper wire on thecopper pattern side of the circuit board. (Use thistechnique only on IC connections).

1. Carefully remove the damaged copper pattern with asharp knife. (Remove only as much copper asabsolutely necessary).

2. carefully scratch away the solder resist and acryliccoating (if used) from the end of the remaining copperpattern.

3. Bend a small "U" in one end of a small gauge jumperwire and carefully crimp it around the IC pin. Solder theIC connection.

4. Route the jumper wire along the path of the out-awaycopper pattern and let it overlap the previously scrapedend of the good copper pattern. Solder the overlappedarea and clip off any excess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copperpattern at connections other than IC Pins. This techniqueinvolves the installation of a jumper wire on thecomponent side of the circuit board.1. Remove the defective copper pattern with a sharp

knife.Remove at least 1/4 inch of copper, to ensure that ahazardous condition will not exist if the jumper wireopens.

2. Trace along the copper pattern from both sides of thepattern break and locate the nearest component that isdirectly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the leadof the nearest component on one side of the patternbreak to the lead of the nearest component on theother side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire isdressed so the it does not touch components or sharpedges.

TIMING CHART

- 7 -

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

VIDEO

SYNC

B

C

EA

D

MODE H / V Sync Polarity Frequency

TotalPeriod

( E )

Blanking Time ( B )

DotClock

1 H(Pixels) + 25.175 31.468 KHz 800 640 16 96 48 640 x 350V(Lines) - 70.0 Hz 449 350 37 2 60

2 H(Pixels) - 28.322 31.468 KHz 900 720 17 108 55 720 x 400V(Lines) + 70.0 Hz 449 400 13 2 34 (TEXT)

3 H(Pixels) - 25.175 31.469 KHz 800 640 16 96 48 640 x 480V(Lines) - 60.0 Hz 525 480 10 2 33



6 H(Pixels) - 31.5 37.50KHz 840 640 16 64 120 640 x 480V(Lines) - 75.0 Hz 500 480 1 3 16

7 H(Pixels) + 36.0 35.156 KHz 1024 800 24 72 128 800 x 600V(Lines) + 56.25 Hz 625 600 1 2 22




11 H(Pixels) - 57.2832 49.725 KHz 1152 832 32 64 224 832 x 624V(Lines) - 74.55 Hz 667 624 1 3 39 (MAC)

12 H(Pixels) - 65 48.363 KHz 1344 1024 24 136 160 1024 x 768V(Lines) - 60.0 Hz 806 768 3 6 29

13 H(Pixels) - 75 56.476 KHz 1328 1024 24 136 144 1024 x 768V(Lines) - 70.0 Hz 806 768 3 6 29


VideoActive

Time ( A )

SyncDuration

( D )

FrontPorch ( C )

Resolution

- 8 -

DISASSEMBLY-Set

Disassembly Like a picture.

1. Pull the front cover upward.2. Then, let the all latches are separated.(#3-1~3-2)3. Put the front face down.

Disassemble back cover.

# 1

# 2-2# 2-1

# 3

- 9 -

DISASSEMBLY-Stand

1. In assembly state, Twist Stand Body toRight side.

2. Pull Stand and Separate Stand fromMonitor set.

3. Push the four latches on the bottom to theoutside and Separate Stand Body & Base.(Reference the #3-2)

# 1 # 2

# 3-1 # 3-2

# 4

- 9 -

BLOCK DIAGRAM

TSU

Mx6

AL

ADC

TMD

S R

x

MSt

arAC

E

LVD

STx

LVD

S

Anal

og (R

/G/B

)

D-Sub

5V

3.3V

1.8V

Vcc

3.3V

Scal

er

MC

UIn

tel8

032

Reg

ulat

orLD

O

INVE

RTE

R

ADAP

TER

KEY

3.3V

1.8V

Line

Buf

fer

OSD SS

C EEPR

OM

(Sys

tem

)

Module

3.3V

SDA

/SC

L

3.3V

Flas

h RO

M

12V

- 10 -

DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock.The pixel clock for each mode is generated by the PLL.The range of the pixel clock is from 25MHz to 78.75MHz.This part consists of the Scaler, ADC and TMDS receiver .The Scaler gets the video signal converted analog to digital, interpolates input to 1024 x 768 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.This part consists of the one regulator and one LDO to convert power.3.3V is provided for LCD panel.Also, 12V is converted 3.3V by regulator and 3.3V and 1.8V are provided for scaler. Converted power is provided for IC in the main board.

3. MICOM Part.This part consists of EEPROM IC which stores control data and the Micom.The Micom distinguishes polarity and frequency of the H/V sync supplied from signal cable.The controlled data of each modes is stored in EEPROM.

- 11 -

ADJUSTMENTWindows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XPPort Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.This program is available to LCD Monitor only.

1. Port Setupa) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folderb) Run Userport.exe

c) Remove all default numberd) Add 300-3FF

e) Click Start button.f) Click Exit button.

2. EDID Read & Write1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Numbera) Input User Info Datab) Click “Update” buttonc) Click “ Write” button

- 12 -

220

IBMCompatible PC

PARALLEL PORT

Power inlet (required)

Power LED

ST Switch

Power Select Switch(110V/220V)

Con

trol L

ine

Not us

edRS2

32C

PARAL

LEL

V-SYN

CPO

WER

ST

VGS

MONITOR

E

E

V-Sync On/Off Switch(Switch must be ON.)

F

F

A

A

BB

C

C

15105

569

1

1

114

1325

6

5V

5V

5V

4.7K4.7K

4.7K

74LS06

74LS06

OFF ON

OFF

ON

11Video SignalGenerator

Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value.b) NVRAM INIT : EEPROM initialize.(24C08)c) CLEAR ETI : To initialize using time.d) AGING : Select Aging mode(on/off).e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)i) MODULE : To select applied module.

- 13 -

TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER(POWER INDICATOR OFF)

CHECK U803 PIN3(1.8V)

CHECK U201

NO

NO

NO

CHECK ADAPTER LEDIS IT GREEN?

CHECK 3.3 LINE(OPEN CHECK)

CHECK 3.3V LINE

NOCHECK X-TAL

YES

YES

YES

YES

CHECK ADAPTER OUTPUT VOLTAGE(12V)?

CHECK U801 PIN1 VOLTAGE

(3.3V) ?

IS U201 PIN90 (3.3V) VOLTAGE ?

CHECK U201 PIN 96 PULSE

1

NO PROBLEM

1

Waveforms

U201-#96

- 14 -

2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

NO

REPLACE CCFL LAMPIN THE LCD MODULE

CHECK ADAPTER AND12 LINE

CHECK MICOM INVON/OFF PORT.

1. CONFIRM BRIGHTNESSOSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ PORT

INVENTER

YES

YES

YES

YES

U701PIN1312V?

U701 PIN2OVER THAN 1.5V?

U701 PIN83.3V?

CHECK PULSE AS

CONTACTING SCOPE PROBE TO CAUTION LABEL.

(CONTACT PROBE TO CAUTION LABEL.

CAN YOU SEE PULSE AT YOUR SCOPE?

- 15 -

3. NO RASTER (OSD IS NOT DISPLAYED) – Mstar

NO RASTER(OSD IS NOT DISPLAYED)

NO

NO

NO

TROUBLE IN CABLE OR LCD MODULE

CHECK U801

1. CHECK PIN122, 123 SOLDERING CONDITION

2. CHECK X2013. TROUBLE IN U201

CHECK CONNECTIONLINE FROM D-SUB TOU201

YES

YES

YES

U201PIN 16, 75

3.3V?

U201 PIN96, 97

OSCILLATE AS14.31MHZ?

U201PIN27 IS 48KHz H-SYNC?PIN28 IS 60Hz V-SYNC?IS PULSE APPEARED

AT SIGNAL PINS?AT MODE 12?

1

2

1 2

Waveforms

U201-#96, 97 U501-#43 H-SYNC 2 U501-#44 V-SYNC

- 16 -

4. TROUBLE IN DPM

TROUBLE IN DPM

NO

NO

TROUBLE IN U201

CHECK PC PC IS NOT GOINGINTO DPM OFF MODE

CHECK H/V SYNC LINE

YES

YES

CHECK R442, R443

CHECKU201 PIN 27,28SYNC PULSE ?

3

3

Waveforms

R216, R778 H-Sync 3 R217, R781 V-Sync

-23 -

010

020

030

040

050

060

EXPLODED VIEW

EXPLODED VIEW PARTS LIST

- 26 -

DescriptionPart No.Ref. No.

010

020

030

L1553S Q 15" L1553 Cabinet ASSY -SILVER NT-Local

ACQ30329002 L1552S A 15" L1552S Back Cover ASSY- NT LOCAL-CPT 15"

040

050

060

ACQ30329111

-

LM150X08-TLA1 DRIVER 15.0INCH 1024X768 250CD COLOR 60% 4/3 550 VS 1 8MS, LVDS, P4 FACTORY OF LM150X08-TL03(P5) LG PHILIPS LCD .EAJ32168001

CLAA150XP01 DRIVER 15.0INCH 1024X768 250CD COLOR 80% - 500VS1 - CHUNGHWA PICTURE TUBES, LTD.6304FCP005A

L1553 Q 15" L1552 Cabinet ASSY NT-local BKACQ30329110

33139L7032P L1752S-BFQ.KXRDQPT BRAND NT CKD LM57A TSUM16AWL 14LANGUAGE

ACQ30329001 L1552S A 15" L1552S Back Cover ASSY- LPL&NEC 15"

ACQ30329002 L1552S A 15" L1552S Back Cover ASSY- NT LOCAL-CPT 15"

AAN32608901 ASSY Lx53 LM57B Lx53 PATTERN TEXTURE(3043900041J)

35509K0245D MOLD ABS L1752 ABS L1752 NEW BODY

- 27 -

REPLACEMENT PARTS LISTCAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,

READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.* NOTE : S SAFETY Mark

AL ALTERNATIVE PARTS

*S *AL LOC NO. PART NO. DESCRIPTION/SPECIFICATON

C A P A C I T O R SC 2 0 1 0 C K 1 0 4 C K 5 6 A 0603B104K500CT 100nF 10% 50V X7R -

55TO+125C 1608 TP PILKOR E L E C T R O N I C S

C 2 0 3 0 C K 4 7 3 C K 5 6 A C1608X7R1H473KT 47nF 10% 50V X7R -55TO+125C 1608 TP TDK




C 2 0 7 0 C K 1 0 2 C K 5 6 A 0603B102K500CT 1nF 10% 50V X7R -55TO+125C 1608 TP PILKOR E L E C T R O N I C S



C 2 1 0 0 C C 2 2 0 C K 4 1 A C1608C0G1H220JT 22pF 5% 50V C0G -55TO+125C 1608 TP TDK



C 2 1 5 0 C Z Z T A B 0 0 6 A ST101M016E050A 100uF 20% 16V 60MA -40TO+105C WT 1000HR 6.3X5MM 2.5MM STRAIGHT BK










C 2 2 5 0 C K 1 0 4 C K 5 6 A 0603B104K500CT 100nF 10% 50V X7R -55TO+125C 1608 TP PILKOR

E L E C T R O N I C SC 2 2 6 0 C K 1 0 4 C K 5 6 A 0603B104K500CT 100nF 10% 50V X7R -

55TO+125C 1608 TP PILKOR E L E C T R O N I C S





C 2 3 1 0 C K 1 0 5 C D 5 6 A C1608X7R1A105KT 1uF 10% 10V X7R -55TO+125C 1608 TP TDK










C 7 0 1 0 C Z Z T A B 0 0 3 N 220uF 220uF 20% 25V 760MA -40TO+105C WT 2000HR 8X11.5MM 3.5MM STRAIGHT BK TIAN JIN SAMWHA ELECTRICS





C 7 0 7 0 C K 4 7 2 C K 5 6 A 0603B472K500CT 4.7nF 10% 50V X7R -55TO+125C 1608 TP PILKOR E L E C T R O N I C S


*S *AL LOC NO. PART NO. DESCRIPTION/SPECIFICATONMODEL :L1553S DATE:2007.02.12 MODEL :L1553S DATE:2007.02.12

*S *AL LOC NO. PART NO. DESCRIPTION/SPECIFICATONMODEL :L1553S DATE:2007.01.12 MODEL :L1553S DATE:2007.02.12


C 7 1 2 0 C K 3 3 4 C F 5 6 A C1608X7R1C334KT 330nF 10% 16V X7R -55TO+125C 1608 TP TDK


C 7 1 7 0 C K 1 0 2 C K 5 6 A 0603B102K500CT 1nF 10% 50V X7R 55TO+125C 1608 TP PILKOR E L E C T R O N I C S

C 7 1 8 0 C K 1 0 6 E F 5 6 A C3216X7R1C106KT 10uF 10% 16V X7R -55TO+125C 3216 TP TDK
















C 8 1 7 0 C K 2 2 3 C K 5 6 A UMK107JB223KA-T 22nF 10% 50V X7R -55TO+125C 1608 TP


C 8 2 2 0 C K 4 7 5 C C 9 4 A C1608Y5V0J475ZT 4.7uF -20TO+80% 6.3V Y5V -30TO+85C 1608 TP TDK

D I O D E SD 4 1 6 0 D S 2 2 6 0 0 9 A A KDS226 1.2V 85V 300MA 2A 4NSEC

150MW SOT23 R/TP 3P 2 KEC AMERICA C O R P O R A T I O N

D 4 1 7 0 D S 2 2 6 0 0 9 A A KDS226 1.2V 85V 300MA 2A 4NSEC

150MW SOT23 R/TP 3P 2 KEC AMERICA C O R P O R A T I O N

D 4 1 8 0 D S 2 2 6 0 0 9 A A KDS226 1.2V 85V 300MA 2A 4NSEC 150MW SOT23 R/TP 3P 2 KEC AMERICA C O R P O R A T I O N

D 7 0 1 0 D S D I 0 0 0 6 8 A BAV70-(F) 1.25V 100V 300MA 2A 4NSEC 350MW SOT23 R/TP 3P 2



D 8 0 1 0 D R T W 0 0 2 3 8 A SS34 500MV 40V 3A 0SEC 0F 2.27W DO214AB R/TP 2P 1 FAIRCHILD SEMICONDUCTOR CORP

R E S I S T O R SR 1 0 R J 4 3 0 1 D 4 7 7 MCR03EZPF432 4.3KOHM 1% 1/10W 1608

R/TP ROHMR 2 0 R J 4 3 0 1 D 4 7 7 MCR03EZPF432 4.3KOHM 1% 1/10W 1608

R/TP ROHMR 2 0 1 0 R J 0 5 6 2 D 6 7 7 MCR03EZPJ560 56OHM 5% 1/10W 1608




R/TP ROHMR 2 0 5 0 R J 1 0 0 1 D 4 7 7 MCR03EZPF102 1KOHM 1% 1/10W 1608



R/TP ROHMR 2 1 1 0 R J 1 0 0 2 D 6 7 7 MCR03EZPJ103 10KOHM 5% 1/10W 1608








R/TP ROHMR 2 2 3 0 R J 4 7 0 1 D 4 7 7 MCR03EZPF472 4.7KOHM 1% 1/10W 1608








R/TP ROHM

- 28 -


MODEL :L1553S DATE:2007.02.12MODEL :L1553S DATE:2007.02.12

R 2 3 4 0 R J 2 0 0 1 D 6 7 7 MCR03EZPJ202 2KOHM 5% 1/10W 1608 R/TP ROHM

R 2 3 5 0 R J 4 7 0 1 D 4 7 7 MCR03EZPF472 4.7KOHM 1% 1/10W 1608 R/TP ROHM


R 3 0 R J 1 8 0 1 D 6 7 7 MCR03EZPJ182 1.8KOHM 5% 1/10W 1608 R/TP ROHM


R 4 0 1 0 R J 3 3 0 0 D 6 7 7 MCR03EZPJ331 330OHM 5% 1/10W 1608 R/TP ROHM



















R 7 0 2 0 R J 3 3 0 3 D 6 7 7 MCR03EZPJ334 330KOHM 5% 1/10W 1608 R / T P


R 7 0 4 0 R J 3 3 0 3 D 6 7 7 MCR03EZPJ334 330KOHM 5% 1/10W 1608 R / T P

R 7 0 5 0 R J 1 2 0 2 D 4 7 7 MCR03EZPF123 12KOHM 1% 1/10W 1608 R/TP ROHM



R 7 0 9 0 R J 2 7 0 2 D 4 7 7 MCR03EZPF273 27KOHM 1% 1/10W 1608 R / T P

R 7 1 0 0 R J 1 0 0 1 D 4 7 7 MCR03EZPF102 1KOHM 1% 1/10W 1608 R/TP ROHM

R 7 1 1 0 R J 1 0 0 1 D 4 7 7 MCR03EZPF102 1KOHM 1% 1/10W 1608







R / T PR 7 1 8 0 R J 2 2 0 3 D 6 7 7 MCR03EZPJ224 220KOHM 5% 1/10W 1608




R/TP ROHMR 7 2 2 0 R J 0 4 7 1 D 6 7 7 MCR03EZPJ4R7 4.7OHM 5% 1/10W 1608





R/TP ROHMR 7 3 3 0 R J 5 1 0 1 D 6 7 7 MCR03EZPJ512 5.1KOHM 5% 1/10W 1608

R/TP ROHMR 8 0 1 0 R H 0 0 0 0 D 6 2 2 MCR10EZHJ000 0OHM 5% 1/8W 2012 R/TP

R O H MR 8 0 2 0 R H 0 0 0 0 D 6 2 2 MCR10EZHJ000 0OHM 5% 1/8W 2012 R/TP

R O H MR 8 0 5 0 R H 0 0 0 0 D 6 2 2 MCR10EZHJ000 0OHM 5% 1/8W 2012 R/TP

R O H MR 8 0 7 0 R J 1 0 0 2 D 6 7 7 MCR03EZPJ103 10KOHM 5% 1/10W 1608


R/TP ROHMR 8 1 0 0 R H 2 0 0 0 D 6 2 2 MCR10EZHJ201 200OHM 5% 1/8W 2012

R/TP ROHMR 8 1 1 0 R H 2 0 0 0 D 6 2 2 MCR10EZHJ201 200OHM 5% 1/8W 2012


R / T PR 8 1 3 0 R J 5 6 0 1 D 4 7 7 MCR03EZPF562 5.6KOHM 1% 1/10W 1608



R/TP ROHMR 8 2 6 0 R H 0 0 0 0 D 6 2 2 MCR10EZHJ000 0OHM 5% 1/8W 2012 R/TP

R O H MR 8 2 7 0 R H 2 0 0 0 D 6 2 2 MCR10EZHJ201 200OHM 5% 1/8W 2012

R/TP ROHMO T H E R S

S W 1 6 6 0 0 R 0 0 0 1 3 2 JTP1230B 1C1P 12VDC 0.05A VERTICAL 160GF TP

S W 2 6 6 0 0 R 0 0 0 1 3 2 JTP1230B 1C1P 12VDC 0.05A VERTICAL 160GF TP

S W 3 6 6 0 0 R 0 0 0 1 3 2 JTP1230B 1C1P 12VDC 0.05A VERTICAL


- 29 -


MODEL :L1553S DATE:2007.02.12MODEL :L1553S DATE:2007.02.12

160GF TPS W 4 6 6 0 0 R 0 0 0 1 3 2 JTP1230B 1C1P 12VDC 0.05A VERTICAL

160GF TPS W 5 6 6 0 0 R 0 0 0 1 3 2 JTP1230B 1C1P 12VDC 0.05A VERTICAL

160GF TPT 7 0 1 6 1 7 0 9 M C 0 0 9 A BCH-1927 EPC19 103uH 4H 60mOHM

1 . 2 k O H MU 2 0 1 0 I P R P 0 0 7 0 4 A “FE211M-LF(TSUM16AWL)

3VTO3.6V,1.5VTO1.98V 14.318MHZ 1.1W 0.000000000005F PQFP TR 100P MSTAR S E M I C O N D U C T O R ”

U 2 0 2 0 I M M R 0 0 2 2 7 A “AT25F2048N-10SU-2.7 2MBIT 256KX8BIT 2.7VTO3.6V,0VTO0V,0VTO0V 30USEC UNIFORM SECTOR SOIC(JEDEC) ST 8PA T M E L ”

U 2 0 3 0 I S G 2 4 0 8 6 0 B M24C08-WMN6TP 8KBIT 1KX8BIT 2.5VTO5.5V 10MSEC SO R/TP 8PSTMICROELECTRONICS INC

U 7 0 1 E A N 3 0 5 9 3 4 0 1 DT8210 7V TO 18V 0.1V TO 8V ; -8V TO 0V 1W SOP R/TP 16P

U 7 0 2 0 T F A N 8 0 0 0 1 A APM4546K N/P-CHANNEL MOSFET 30V +-16V 0A 0OHM 2W SO8 R/TP 8P ANPEC ELECTRONICS CORPORATION

U 8 0 1 0 I P M G 0 0 0 9 7 A APW1173 4.8TO22V 0 3W SOP R/TP 8PANPEC ELECTRONICS CORPORATION

U 8 0 3 0 I P M G 7 8 4 2 9 A APL5508-9-RA6 2.7V_6V 1.8V 1W SOT-223 R/TP 3P

X 2 0 1 6 2 1 2 A A 2 0 0 1 H “HLX-S-F-14.31818M-18 14.31818MHZ 30PPM 18pF,7pF HC-49U/S DIP BKNANJING HUA LIAN XING ELECTRONICS”

Z D 1 0 D Z D I 0 0 0 7 8 A BZT52C3V3S-F 3.3V 3.1TO3.5V 95OHM 200MW SOD323 TP 2P 1 DIODES

Z D 2 0 D Z D I 0 0 0 7 8 A BZT52C3V3S-F 3.3V 3.1TO3.5V 95OHM 200MW SOD323 TP 2P 1 DIODES

Z D 4 1 0 0 D Z K E 0 0 1 3 8 A KDZ5.6V 5.6V 5.3TO6V 40OHM 200MW USC R/TP 2P 1





J 2 0 1 E A G 3 0 4 2 7 0 0 1 “PHD-20AW 20P 2.0MM 2R ANGLE DIP BK GRAY SERIES SUZHOU JINGSHI ELECTRONICS TECHNOLOGY CO,LTD”

J 3 6 6 0 2 T 2 0 0 0 9 B SMAW200-03P 3P 2.00MM 1R ANGLE DIP ST NATURAL . YEONHO ELECTRONICS

J 4 0 2 6 6 0 2 T 2 0 0 0 9 B SMAW200-03P 3P 2.00MM 1R ANGLE DIP ST NATURAL . YEONHO ELECTRONICS

J 7 0 1 E A G 3 0 4 2 7 2 0 1 “BH-5A2 5P 2.00MM 1R STRAIGHT SMD R/TP YELLOW NO2PIN NO3PIN NO4PINSUZHOU JINGSHI ELECTRONICS TECHNOLOGY CO,LTD”

J 7 0 2 E A G 3 0 4 2 7 2 0 1 “BH-5A2 5P 2.00MM 1R STRAIGHT SMD R/TP YELLOW NO2PIN NO3PIN NO4PINSUZHOU JINGSHI ELECTRONICS TECHNOLOGY CO,LTD”

L 8 0 1 0 L C J B 0 0 0 0 1 A JPI105-150 15UH 20% 0V 0A 0.11OHM 0HZ 0 NON SHIELD 9X10X5.7MM NONE R/TPFEELUX CO

L E D 1 0 D L L T 0 0 8 9 A A LTL-1BEDJ-0C2 ROUND 3MM YELLOW/GREEN WHITE DIFFUSED 2.6V 20mA 30mA 19mCD - 2.54MM TP 3P LITE-

O NQ 2 0 1 0 T R 3 9 0 4 0 9 A E KST3904 NPN 6V 60V 40V 200MA 50NA

100TO300 350MW SOT23 R/TP 3PFAIRCHILD SEMICONDUCTOR CORP

Q 4 0 1 0 T R 3 9 0 6 0 9 F A KST3906-MTF PNP -5V -40V -40V -0.2A -0.00000005A 100TO300 350MW SOT23 R/TP 3P FAIRCHILD SEMICONDUCTOR C O R P

Q 4 0 2 0 T R 3 9 0 6 0 9 F A KST3906-MTF PNP -5V -40V -40V -0.2A -0.00000005A 100TO300 350MW SOT23 R/TP 3P FAIRCHILD SEMICONDUCTOR C O R P

Q 7 0 1 0 T R 2 2 2 2 0 9 A B KTN2222AS NPN 6V 75V 40V 600MA 10NA 100TO300 350MW SOT23 R/TP 3P KEC C O R P E R A T I O N



Q 8 0 1 0 T R 1 2 7 3 0 9 A A KTA1273 PNP -5V -30V -30V -2A -0.0000001A 100TO320 1W TO92L TP 3PKEC CORPERATION

Q 8 0 2 0 T R 3 9 0 4 0 9 A E KST3904 NPN 6V 60V 40V 200MA 50NA 100TO300 350MW SOT23 R/TP 3PFAIRCHILD SEMICONDUCTOR CORP

J 4 0 1 E A G 3 0 4 2 7 0 0 2 “PHD-22AW 22P 2.0MM 2R ANGLE DIP BK GRAY SERIES SUZHOU JINGSHI ELECTRONICS TECHNOLOGY CO,LTD”

- 30 -

*S *AL LOC NO. PART NO. DESCRIPTION/SPECIFICATON*S *AL LOC NO. PART NO. DESCRIPTION/SPECIFICATON

- 31 -

1. MAIN BOARD

SCHEMATIC DIAGRAM

- 32 -

2. D-SUB/KEY BOARD/DC-DC

- 33 -

3. INVERTER

Feb. 2007P/NO : MFL30290837 Printed in China

lg tft-lcd color monitor flatron l1553s-bfq(sfq) service manual

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