laboratory for interconnecting and packaging electronic ... · pdf filefaculty of microsystem...

Faculty of Microsystem Electronics

and Photonics

Laboratory for Interconnecting

and Packaging

Electronic Circuits

Wrocław, Poland

http://www.lipec.info

We are here – Wrocław – The Heart of Europe

Metropolis Wrocław

•„Polish Venice” - 117 bridges,

- 12 islands,

- 25 rivers and channels

•650 000 citizens,

~30 Universities, Academies and higher education institutes

•293 km2 partly covered in June 1997 with water

Wrocław University of Technology

THE STORY:

• founded in 1945 by Polish academic teachers, mostly from Lviv, arrived in Wrocław, in ruins in the wake of the last siege of World War II

• housed in the buildings of the former Technische Hochschule Breslau (1910)

• first lecture - 15th of Nov. 1945 - the day of university's anniversary celebrated up to now

UNIVERSITY CAMPUS AND NUMBERS:

•over 4 000 employees, including about 2 000 research and teaching staff

•managed by Rector and five vice-rectors of research, education, student affairs, development and general affairs. They are elected by the staff for four-year terms and may be re-elected only once

• The highest governing body within the university is the senate, which consists (rector, five vice-rectors, deans, students and eligible staff representatives


We are here

•one of the largest academic schools in Poland

•over 34 000 students

•16 faculties

•over 220 buildings with modern laboratories, libraries, Internet access, multimedia-fitted lecture rooms

•791 international agreements

•5 280 registered inventions, including utility models

THE UNIVERSITY FACULTIES:1. Architecture

2. Engineering

3. Chemistry

4. Electronics

5. Electrical Engineering

6. Mining Engineering

7. Environmental Engineering 8. Computer Science and Management9. Mechanical and Power Engineering10. Mechanical Engineering11. Basic Problems of Technology12. Microsystem Electronics

and Photonics13. Mathematics14, 15, 16, Regional Faculties

THE RESEARCH:

• Mathematics: theory of probability, mathematical statistics, functional analysis, differential equations

• Chemistry: physical chemistry of solids, organic and inorganic synthesis, quantum chemistry

• Physics: solid-state physics (semiconductors, ferroelectric, thin films, surface physics) and optics

• Biology: biochemistry and microbiology, biodegradation and biotechnological processes

• Electronics: control systems, robotics, microelectronics,optoelectronics, microsystems, photonics;

• Computer science: information processing, computer networks, expert systems and artificial intelligence

• Electrical engineering: high voltage engineering, distribution and utilization of electrical energy

• Materials and raw materials: extraction, utilization of inorganic wastes and synthesis of new materials

• Bioengineering: bioreactor, biotechnology and bioengineering processes, biomechanical engineering

• Environmental control and ecological threats discrimination: protection technologies, waste utilization

• Mechanical engineering: solids and fluid mechanics, materials engineering, biomechanical engineering

• Thermal and power engineering: thermodynamics and fluid dynamics, heat transfer, energy recovery


Faculty of Microsystem Electronics and Photonics - WEMIF

Faculty employs 55 academic teachers, including 12

full professors, 10 associated professors and

currently 43 PhD students.

Faculty Majors:

Microelectronics

and Microsystems

development of microsensors and microsystems for environmental and chemical applications

silicon micromechatronics and microsystems

thick and thin film circuits

process technology and characterisation of device structures for microwave

digital ASIC design

hybrid microelectronics

interconnecting and packaging electronic circuits(assemblies, materials, prototyping methods)

Photonics

photovoltaics and solar cells (PV modules assembling/encapsulation, design and monitoring of PV systems)

optoelectronics, including integrated optics and fiber waveguides, design, fabrication and measurements of photonics devices and systems

process technology and characterisation of device structures for optoelectronics

DIAGNOSTICS TECHNOLOGY

LIPEC

• LIPEC laboratory was established in 1994

www.lipec.info

Laboratory for Interconnecting and Packaging Electronic Circuits - LIPEC

• Since November of 1999 it is

headed by Prof. Jan Felba

• Staff of the laboratory

consists currently of

fourteen researchers and

technicians. Seven of them

are PhD students

• The main activity is education and research

in the area of microelectronic packaging

Short

information

• Interconnecting and packaging microelectronic circuits

• Investigation of new materials for green polymer as well as micro and nano-scale electronics

• Numerical prototyping, optimization and multi-physics simulations of the microelectronic devices, packages and MEMS

• Microelectronic devices and packages reliability evaluation and assessment

• Thermo-mechanical material properties characterization in reference to micro-scale and molecular-scale

THE CENTER OF ECOLOGICAL AND RELIABLE ELECTRONIC PACKAGING

THE MAIN ACTIVITY:

Laboratory for Interconnecting and Packaging Electronic Circuits - LIPEC

LIPEC - The Main Activity

Von Misses Stress [Pa]

Area Description

Microsystems

- coupled field simulations,

- optimization,

- robust and tolerance design.

Micro-

electronic

packaging

- thermo-mechanical simulations,- failure analysis,- reliability assessment (fatigue)

<110>

<110>

<100>

(100)

(111)

• Numerical modelling and qualification using FEM method (ANSYS and ABAQUS)

• Design of Experiments DoE

• Response Surface Analysis RSM

• Numerical method of nanointentation

! Self-designed software package VPT

(Virtual Prototyping Tool)

NUMERICAL PROTOTYPING OF

MICROELECTRONIC COMPONENTS

AND MICRO-SYSTEM PACKAGES

ElectricallyConductiveAdhesives

ThermallyConductiveAdhesives

MATERIALS and TECHNOLOGY FOR

MICROELECTRONIC PACKAGING

„Tin-lead alloy in electronics packaging has to be replaced by new materials. Lead-free alloys and polymer-based materials seem to be the most probable candidates”

Lead-free soldering

alloys0

200

400

600

800

1000

1200

1400

1600

1800

2000

0 20 40 60 80 100

Tim e [s ]

Re

sis

tan

ce

[O

hm

]

Snap – curing electrically conductive adhesives

1.Should not be much more expensive

as normal soldering method is.

2.New technology should use this same

production equipment as actual.

3.New technology shouldn't require

more space as the old one.

4.New technology ought to be as quick,

as normal is.

5.New technology ought to be more simply

like actual process is.

Technical assumptions for solder

replacement technology:


LEAD-FREE SOLDER JOINTS QUALITY

solderability test system


• Solderability testing

• Mechanical strength testing

• Detecting changes of electrical resistance

• Detecting internal defects of joints

• Identification of intermetallic compounds

Silver Jum per

Adhesive

Join t

Strip

l

g

d

d


ELECTRICALLY CONDUCTIVE ADHESIVES

FOR MICROWAVE APPLICATIONS

An adhesive electrical bonding requirements for

microwave applications are much more

demanding than those for low frequency

analogue or digital electronics. The main

reason of differences is the skin effect. Since

due to this effect only thin layer of adhesive

plays important role in current conduction.

3.5.. 14GHz

Partner


• Heat transfer calculation

• Thermal conductivity Molecular Dynamics Simulations

• Croslinking phenomena modeling

• Calculation of contact pressure relaxation

• Modeling of thermal constriction resistance

• Calculation and measurement of composite density changes

2R2R

2r

Thermal

metallic contact

POLYMER MATRIX BEHAVIOR AND HEAT

TRANSFER MODELING IN MOLECULAR-

AND BULK-SCALE DOMAIN

THERMALLY CONDUCTIVE COMPOSITES WITH

NANO- AND MICRO-FILLERS


• Composites with micro sized silver

• Composites with nano sized fillers (silver, CNT)

THERMALLY CONDUCTIVE COMPOSITES WITH

NANO- AND MICRO-FILLERS

T 1

T 2

T 3

T 4

T5

T6

15 mm

15 mm

15 mm

15 mm

5 mm

5 mm

Spacimen

35 mm

Heater

Heat sink

Contact member

λ=80.4 W/mK

Partners

THERMAL CONDUCTIVITY MEASUREMENT


• Sensitivity analysis and tolerance design

• Single and multi-criteria optimization

NUMERICAL PREDICTION OF SOLDER

AND ADHESIVE JOINTS RELIABILITY


SYSTEM FOR SOLDER AND ADHESIVE

JOINTS RELIABILITY TESTING

+

6 days of testing =

18 years of usage

• Vibrations and temperature cycles (humidity)

• Detecting of joint resistance changes

• Detection of temporary solder joints opens

• Max. 128 tested channels


NANOCOMPOSITES AND ELECTRICALLY CONDUCTIVE

MICROSTRUCTURES FOR PRINTED ELECTRONICS

• Very high packaging possibility

• Nature of nano Inks - formula is with the best homogeneous properties (uniform concentration),

• The highest repeatability of dosing ink volumes

• Very high repeatability of printed shapes

Printed

structure!

Bulk silver

Partner

thickness ~ 500 nm


SINTERED NANOSILVER FOR THERMAL AND MECHANICAL

INTERCONNECTIONS

Partner

Paste with nano Ag particles (50-60 nm): 70 wt%

Pre-sintering – 150 Cº/ 1 h

Sintering – 250 Cº/ 1 h

Bond Line thickness

BLT < 3µm

mixture of nano-Ag (47.5 wt%) + µAg

(47.5 wt%) + epoxy resin(5 wt%)

Possible applications (low thermalresistance; high mechanical strength):

interconnections between semiconductor die and lead-frame;

interconnections between component and printedcircuit board

QUALITY INSPECTION OF MATERIALS, PACKAGES AND

SYSTEMS IN MICROELECTRONICS


• Phoenix nanome|x system

• Power: 180 kV /15 W,

• 200 nanometer detail detectability

• 2D X-ray inspection

• full 3D computed tomography

X-RAY INSPECTION AND COMPUTER TOMOGRAPHY

• System for drilling, milling and engraving of PCB

• Stencil printer

• Semi-automatic pick-and place system

• Infrared BGA rework station

• Forced convection reflow oven

• Semi-automatic thermo-ultrasonic wire bonder

• Sonic wire bonder

• Epoxy die mounter and pull tester system

• System for rework, repair and assembly of PCB's

• Ink-jet printer

• Sonificator

LIPEC - Basic Laboratory Equipment

MANUFACTURING

• Solderability test system

• Ionic contamination measurement system

• X-ray fluorescence spectroscopy

• Optical microscope

• Climatic chamber

• Tensile machine

• Automatic adhesion tester

• Vibration exciter

• Infrared camera

• Thermal conductivity measurement system

• Nanofocus X-ray inspection system andcomputed tomography

• System for solder and adhesive joints reliability testing

• CTE and Tg measurement system

• Thermal conductivity and diffusivity analyzer

• Multifunctional bondtester

LIPEC - Basic Laboratory Equipment

TESTING and INSPECTION

Application of adhesives in modern electronic packages and assemblies.

Novel nano composite polymers and joining technologies for reliable and

efficient assembly of electronic components

Innovative thermo-mechanical prediction and optimisation methods for

virtual prototyping of miniaturised packages and assemblies

Green Electronics and Material Recycling Centre of Excellence

Downscaled Assembly of Vertically Interconnected Devices

CANOPY - CArbon NanOtubes/ePoxY composites

Nanoelectronics for save, fuel efficient and environment friendly

automotive solutions

Development, characterization and reliability of high performance nano

thermal interface materials for large power dissipation applications

PARSIMO - Partitioning and Modelling of System in Package

Innovative Nano and Micro Technologies for Advanced Thermo and

Mechanical Interfaces

LIPEC - Selected Research International Projects

mevipro

marec

LIPEC - Bilateral Cooperation

• Long term reliability of solder and adhesive joints

• Combined thermo-mechanical loading including vibration – event detector

The CALCE Electronic Products and System

Center - University of Maryland (USA)

• Optimization of the stacked packaging 3D (SIP and SOP)

• Extraction of material properties by nanoidentation technique, e.g. thin layers

The FRAUNHOFER Research Institution for

Electronic Nano Systems ENAS Chemnitz

(Germany)

LIPEC - Partners

http://www.ite.waw.pl/

http://www.ite.waw.pl/

http://www./

http://www./

LIPEC - Knowledge dissemination

CONFERENCESEDITORIAL WORK

Microelectronics Reliability

(Guest Editor)

Materials Science-Poland

(Editor-in-Chief)

MEMBERSHIP IN INTERNATIONAL

ADVISORY BOARDS

ORGANIZATION

MEMBERSHIP IN INT. COMMITTEES

−IEEE EuroSimE

−Polymers and Adhesives in Microelectronic and

Photonics, IEEE Polytronic

−Electron Beam Technologies, EBT

−International Microelectronics and Packaging

IMAPS – CPMT IEEE Poland

−Electronics Systemintegration Technology, ESTC

−Microreliability and Nanoreliability in Key

Technology Applications, MicroNanoReliability

−Spring Seminar on Electronics Technology, ISSE

−Conference on Nanotechnology, IEEE Nano

−Conference Ecology in Electronics‚

−Materials, Industrial, and Manufacturing

Engineering Conference MIMEC

−European Microelectronics Packaging Conf. EMPC

−Conf. on Functional and Nanostructured Materials

FNMA


BOOKS (in Polish)

Electronic apparatus construction

Packaging in electronics

Numerical thermo-mechanical prototyping

methods in electronic packaging

Formation and measurement of electron beam with high

power density


BOOKS (in English)

Chapter 6 WYMYSŁOWSKI A., et al. Virtual Thermo-Mechanical Prototyping of

Microelectronics and Microsystems

Chapter 12 FELBA J., Schaefer H. Materials and

Technology for Conductive Microstructures

Chapter 10 FELBA J. Thermally

Conductive Nanocomposites

Chapter 2 FELBA J. Thermally Conductive

Adhesives in Electronics

FAŁAT T., FELBA J., MATKOWSKI P. Packaging of Electronics,

Photonics and Microsystems


BOOKS (in English)

Chapter 13 Mościcki A., Smolarek A., FELBA J., FAŁAT T.

Properties of different types of protective layers on silver

metallic nanoparticles for ink-jet printing technique

Chapter 7 PLATEK B., FALAT T., FELBA J., Influence of Structural Parameters of Carbon Nanotubes on their Thermal Conductivity: Numerical Assessment

Chapter 13 TESARSKI S.J. WYMYSLOWSKI A., Glass Transition Analysis of Cross-Linked Polymers: Numerical and Mesoscale Approach

in Vol. VII FALAT T., PŁATEK B., FELBA J. Hybrid thermally

conductive adhesives in electronic assembly used as thermal

interface materials

Chapter 5 Król D.J., WYMYSŁOWSKI A., ALLAF K.N.J., Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement

Chapter 9 TESARSKI S.J. WYMYSLOWSKI A., ALLAF K.N.J., Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers

laboratory for interconnecting and packaging electronic ... · pdf filefaculty of microsystem...

Documents