kyocera substrates) electronic fine ceramics

CERAMIC MANUFACTURING PROCESS

SLIP

EXTRUSION

RAW MATERIAL COMPOUND

MIXING AND MILLING

SPRAY DRYING

TAPE CASTING

STAMPING

ROLL COMPACTION DRY PRESSING

FIRING

MACHINING

SINTERING

GLAZING

FIRING

GRINDING AND LAPPING

DRYING

CUTTING

LASER SCRIBING

INSPECTIONINSPECTIONINSPECTION

GLAZING

INSPECTION

SMOOTH SUBSTRATE FOR THIN FILM

SINTERING

TAPE SUBSTRATE FOR THICK FILM GLAZED SUBSTRATE PRESSED AND

EXTRUDED PARTSLASER SCORED

SUBSTRATE

Tape Substrates for Thick Film

We are producing 96% alumina substrates (A-476) and 93% alumina substrates (A-473T) which have excellent thick film reliability and consistency.

FeaturesOur substrates have excellent thick film reliability and precise dimensional tolerance control (Super premium: ±0.25%). They are cost effective for through-hole processes with small diameter holes (Min. 0.2mm) allowing densification of precision circuitry.

Application

Hybrid lntegrated Circuit

Resistor Network

Chip Resistor

Potentiometer

Focus Substrate, etc

Characteristics of Material

Item

Material Code

Appearance

Color

Alumina Content

Bulk Density

Water Absorption

Vickers Hardness (Hv 1.0)

Flexural Strength

Young's Modulus

Coefficient of Linear Thermal Expansion

Thermal Conductivity (20˚C)

Dielectric Strenght

Volume Resistivity

Dielectric Constant (1MHz)

Dielectric Loss Angle (1MHz)

Surface Roughness

Material

%

kg/m3

%

GPa

MPa

GPa

40-400˚C

40-800˚C

W/(m ⋅ K)

V/m

Ω ⋅ cm (20˚C)

(300˚C)

(500˚C)

–

× 10-4

Ra µm

Alumina (Al2O3)

A-476 (Tape)

96

3.7 × 103

0

13.7

350

320

7.2 × 10-6/˚C

7.9 × 10-6/˚C

24

12 × 10-6

>1014

1010

108

9.4

4

0.2-0.80

A-473T (Tape)

92

3.6 × 103

0

12.3

310

280

6.9 × 10-6/˚C

7.8 × 10-6/˚C

22

12 × 10-6

>1014

1011

109

8.8

6

0.2-0.80

Dense

White

Features Uniform grain size and small voids Equivalent to A-476 for thick film characteristics Less camber and edge-curl Larger size can be produced (Max. 8" × 10") Tight tolerance:Standard: ±0.5% Premium: ±0.25% Same surface roughness on both sides

Application Thick film hybrid IC Focus substrate, and others

Design Guideline Unit: Inch (mm)

A-473T (93% Alumina)

Surface Roughness

Manufacturing Method

As Fired Camber

Thickness Availability

Thickness Tolerance

Size Availability

Length & Width Tolerance

Scribing Tolerance

Parallelism

Perpendicularity

Corner R

Hole Size

Spacing Between Holes

or Edge to Holes

Surface Roughness

Tape

A-476: 8 to 30 µ inch CLA (Ra 0.2-0.75 µ m)

A-473T: 8 to 30 µ inch CLA (Ra 0.2-0.75 µ m)

Punched/Greenscored

Standard:±0.8%NLT±.004 (0.10)Premium:±0.5%NLT±.003 (0.08)

Super Premium: ±0.25%NLT±.002 (0.05)

Standard:±0.8%NLT±.004 (0.10)Premium:±0.5%NLT±.003 (0.08)

Super Premium: ±0.25%NLT±.002 (0.05)

Standard:0.5% of outside dim.

Premium:0.3% of outside dim.

.020 (0.51)

.008 (0.20) Dia. Min.

.015 (0.38) Square Min.

Minimum equal to

thickness of substrate

NLT±.020 (0.51)

Laser Scored

+.008 (0.20)–.002 (0.05)

Edge to Scoreline:+.008 (0.20) –.002 (0.05)

Scoreline to Scoreline: ±.002 (0.05)

±.002 (0.05)

*

*

*

SEM (A-473T)

5.00 µm

Pressed and extruded parts

As a leader in ceramic developement and one of the largest manufacturers of advanced ceramics in the world, Kyocera offers a complete line of ceramics with features such as; excellent electrical insulation at high frequency, high mechanical strength, high heat resistance, high wear resistance, extremely low thermal expansion and excellent chemical resistance. Kyocera's advanced dry pressing and extrusion technology can provide complicated designs and precise dimensional tolerances.


Material

Item

Material Code

Appearance

Color

Alumina Content

Main Characteristics

Bulk DensityWater AbsorptionVickers Hardness (HV1.0)Flexural StrengthCompressive StrengthYoung's ModulusPoisson's RatioFracture Toughness 40~400˚CCoefficient of Linear Thermal Expansion

40~800˚CThermal ConductivitySpecific Heat Heat Shock Resistance (Put in water)Dielectric Strength 20˚CVolume Resistivity 300˚C 500˚CDielectric Constant (1MHz)


Loss Factor

kg/m3

%GPaMPaMPaGPa

–MPa√ m

×10 -6/˚C

W/m ⋅ KJ/kg ⋅ K

˚CV/m

Ω ⋅ cm

–(×10 -4)(×10 -4)

JIS C2141JIS C2141JIS R1610JIS R1601

–

JIS R1602

JIS R1607

JIS R1618

JIS R1611JIS R1611

–

JIS C2141

Mec

hani

cal

Cha

ract

eris

tics

Ele

ctric

alC

hara

cter

istic

sT

herm

alC

hara

cter

istic

s

A-459

Al2O3 90% Al2O3 91% Al2O3 92% Al2O3 96% Al2O3 99% Al2O3 99.5% Al2O3 99.7%

Russet Dark brown White Ivory

A-445 A-473 A-476 A-479 A-479SS A-480S

High Purity,High Chemical

Good

Wear

Hard andChemically

Stable,Fine Grain Strong

and Smooth

Hard andChemically

Stable

Good SurfaceSmoothness

Good forMetallizing,

MechanicallyStrong

Light

High HeatDissipation

Good forMetallizing

3.6 x 103

011.8310–

2800.23

–7.07.914

0.75 x 103

–12 x 106

>1014

1011

109

8.8653

3.8 x 103

012.7290–

3200.24

–7.38.112

0.75 x 103

–12 x 106

>1011

107

106

9.825245

3.6 x 103

012.3310

2,3002800.23

–6.97.818

0.75 x 103

20012 x 106

>1014

1012

1010

9.0654

3.7 x 103

013.7350–

3200.23

–7.27.924

0.75 x 103

20012 x 106

>1014

1010

108

9.4438

3.8 x 103

015.2270

2,1603600.234.67.28.029

0.75 x 103

20012 x 106

>1014

1010

108

9.9220

3.8 x 103

015.2340

2,3503700.234.27.28.032

0.75 x 103

25012 x 106

>1014

1013

1010

9.9110

3.7 x 103

016.2350–

3800.23

–7.28.032

0.75 x 103

–12 x 106

>1014

1013

1010

9.91

10

ALUMINA(Al2O3)

Dense

High Mechanical Strength, High Temperature Resistance, High Frequency Insulation, High Chemical Resistance

Resistance,

Anti-Plasma,

Resistance

Intercepting,

K-690 ML-652

White Dark brown

High MechanicalStrength, ExcellentWear Resistance,

Good SurfaceFinish, High

FractureToughness

MULLITE(3Al2O3 ⋅ 2SiO2)

DensePorous

Excellent Thermal Shock Resistance

–

Very low ThermalExpansion

Thermal Insulator Good Light Shield

Very low ThermalExpansion

High ThermalExpansion

2.0(Bulk) x 103

10~20–

30––––

4.14.81

0.67 x 103

––––––––

6.0 x 103

012.3980

5,6902100.314.5

10.511.0

30.46 x 103

300–––––––

3.2 x 103

010.8280

–210

––

5.05.85

0.75 x 103

–12 x 106

>10 14

1012

109

7.420

148

S-210 S-211 F-1023

White Dark brown Milky whiteLight yellow

STEATITE(MgO ⋅ SiO2)

FORSTERITE(2MgO ⋅ SiO2)

2.8 x 103

05.4180

–1200.24

–7.48.02.2

0.71 x 103

–13 x 106

>10 14

1010

107

618–

3.1 x 103

06.4180

–1300.22

–9.2

10.42

0.71 x 103

–13 x 106

>10 14

107

107

8750

–

3.0 x 103

06.9160

–1500.24

–9.7–5

0.75 x 103

–13 x 106

>10 14

1010

1010

6.55–

3.0 x 103

05.9160

–1500.24

–10.1

–5

0.75 x 103

–13 x 106

>10 14

109

109

6.55–

– – – – –

Good SurfaceFinish

F-1120

ZIRCONIA(PSZ)

Z-201N

1kgf/mm 2=9.807MPa 1cal/cm ⋅ sec ⋅ ˚C=418.7W/(m ⋅ k) 1cal/g ⋅ C=4.187J/g ⋅ K=4.187x10 3J (kg ⋅ K)

Thin Film Substrates

For thin film deposition, we have 99.6% alumina substrates (A-493, A-494) which offer excellent surface smoothness.

Characteristics of Material Unit: Inch (mm)

Length, Width

Design GuidelineThickness Unit: Inch (mm)

Item Unit A-493 A-494

Side A: CLA µinch 3.0 (.08) 2.0 (.05)Surface Roughness

Side B: (Ra µm) 5.0 (.125) 4.0 (.10)

Bulk Density kg/m3 3.86 × 103

Grain Size Average µm < 1.5 < 1.0

Alumina Content Wt% 99.6

Color – White

Water Absorption – Nil

Dielectric Constant 1MHz 9.9±.2

Dielectric Loss Angle 1MHz 2 × 10-4

Volume Resistivity Ω ⋅ cm > 1014 (25˚C)25˚C 33

Thermal Conductivity 300˚C Wm/ ⋅ k 30500˚C 25

per˚C

Coefficient Of Linear 25 to 300˚C 7.2 × 10-6

Thermal Expansion 25 to 600˚C 7.4 × 10-6

25 to 800˚C 8.2 × 10-6

Flexural Strength MPa 550

SEMA-493 A-494

6.0 µm 6.0 µm

Surface Roughness

Thickness Standard: .010 (0.25), .015 (0.38), .025 (0.635)

Minimum: .005 (0.127)

Maximum: .040 (A493), .027 (A494)

Tolerance Standard: ±10% NLT±.002 (0.05)

Premium: ±5% NLT±.0008 (0.02)

Item Green Score Laser Score

Max Size 4.7" × 4.7" (120 × 120)

Standard: (0.10) Standard:±0.8% NIL±.004" +.008"/-.002" (+0.2/-0.05)

Tolerance Premium: Premium:±0.5% NIL±.003" (Thickness:0.020"orLESS) (0.08) ±.004"/-.002" (+0.1/-0.05)

Perpendicularity Straightness

Perpendicularity

Straightness Standard:

a=L × 0.5% b=L × 0.5%.002"

Premium:

a=L × 0.3% b=L × 0.3%

a

L

b

L

A-493

A-494

100 µm

1 µm

Polished Substrates For Thin Film

Features Excellent surface quality for thin film application. Tight dimensional tolerances (thickness, flatness).

Material Kyocera A493, A494 (99.6% alumina) Available thickness .010"-.0315" (0.25-0.80mm) .002" thickness is available with maximum size of 2" × 2" and 8 µ inch surface finish.

Visual Defects Scratches: .0003" deep max. Voids: .0008"dia max. Contamination: Not allowed (by naked eye)

Surface Roughness Unit: Inch (mm)

Thickness Tolerance Unit: Inch (mm)

Flatness Unit: Inch (mm)

Standard 1.2 µ inch CLA (Ra0.03 µ m)

Premium 0.4 µ inch CLA (Ra0.01 µ m)

Size Less than 3" 3" or more

Standard ±.0008 (0.02) ±.0020 (0.05)

Premium ±.0004 (0.01) ±.0008 (0.02)

Standard PremiumSize (inch)

One side polished Both sides polished One side polished Both sides polished

2 × 2 × .010 .0020 (0.05) max. .0016 (0.04) max. .0014 (0.035) max. .0010 (0.025) max.

2 × 2 × .015 .0016 (0.04) .0012 (0.03) .0010 (0.025) .0006 (0.015)

2 × 2 × .025 .0008 (0.02) .0006 (0.015) .0005 (0.013) .0004 (0.01)

3 × 3 × .010 .0036 (0.09) .0030 (0.075) .0020 (0.05) .0016 (0.04)

3 × 3 × .015 .0032 (0.08) .0024 (0.06) .0016 (0.04) .0012 (0.03)

3 × 3 × .025 .0024 (0.06) .0016 (0.04) .0012 (0.03) .0008 (0.02)

4 × 4 × .010 .0200 (0.50) .0120 (0.30) .0100 (0.25) .0050 (0.13)

4 × 4 × .015 .0100 (0.25) .0060 (0.15) .0050 (0.13) .0032 (0.08)

4 × 4 × .025 .0032 (0.08) .0024 (0.06) .0020 (0.05) .0016 (0.04)

4.5 × 4.5 × .015 .0200 (0.50) .0140 (0.35) .0120 (0.30) .0080 (0.20)

4.5 × 4.5 × .025 .0080 (0.20) .0060 (0.15) .0050 (0.13) .0040 (0.10)

Surface Roughness Data

A-493 Standard

A-493 Premium

A-494 Standard

A-494 Premium

100µm

0.5µ

m

Glazed Substrates for Thermal Printheads

FeaturesKyocera glazed substrates consist of 96% alumina with a glass

overcoat. They have superior flatness and fewer surface

defects so it is very applicable for thermal printheads used in

advanced and downsized facsimile machines. Kyocera can

provide various types of glazed substrates for each application

such as partial glazed, full glazed and serial glazed substrates.

Glazed Part

Glazed Part

Glazed Part

Glazed Substrates

1.Partial Glazed SubstratesUsed in both thin and thick film types of thermal printheads for high speed G3 and G4 type facsimiles and color printers. Heater elements are put on a 1 to 3 mm narrow glazed portion to allow thermal printheads to closely fit a sheet of thermal paper and provide very clear and crisp printing.

2.Full Glazed SubstratesUsed in thick film type of thermal printheads for regular type of facsimiles. The glazed surface is quite flat and the meniscus at the edges are low, so the full glazed substrates allow thermal printheads print very clear words.

3.Serial Glazed SubstratesUsed in thermal printheads for wordprocessors and bar code printers. The dimensional tolerances of glaze pitch are very tight allowing the distance between the substrate edge and the glazed portion for heater elements to be short and the width of the glazed portion to be narrow so high speed printing is possible.

Glazed Substrate Material Specification

Glazed Substrate Design Guideline Unit: Inch (mm)

Item Unit Condition GS-5 GS-71

Glass Transition Temperature ˚C – 669 680

Glass Softening Temperature ˚C – 856 870

Coefficient of Linear Thermal Expansion 1/˚C R. T. to 400˚C 6.6 × 10-6 6.8 × 10-6

Thermal Conductivity W/m ⋅ k 20˚C 0.83 0.75

20˚C >1014 >1014

Volume Resistivity Ω ⋅˚C 300˚C >1014 >1014

500˚C 2.8 × 1010 2.1 × 1010

Dielectric Constant – 1MHz 20˚C 7.2 8.7

Dielectric Loss Angle – 1MHz 20˚C 14.6 × 10-4 10.0 × 10-4

Surface Roughness Ra µm <0.02 <0.02

Item STD Dimensions STD Tolerance Premium Tolerance

.025 (0.635) ±.0024 (±0.06) ±.0016 (±0.04)

Thickness .032 (0.800) ±.0032 (±0.08) ±.0024 (±0.06)

.040 (1.000) ±.0040 (±0.10) ±.0032 (±0.08)

L:12.44 max.

Outside Dimensions (316 max.) ±.080 (±0.20) ±.040 (±0.10)

W:3.15 max.

(80 max.) ±.080 (±0.20) ±.040 (±0.10)

.024 max. (0.6 max.) .020 max. (0.5 max.)Thickness Full Glaze

Camber

.025/.032

.020 max. (0.5 max.) .016 max. (0.4 max.)

Substrate Size: 9 × 3.1 (230 × 80)

(0.635/0.8) Partial Glaze

Glaze Thickness: .0027 (70 µm) .020 max. (0.5 max.) .016 max. (0.4 max.)Thickness

Full Glaze

.040 (1.0)t.016 max. (0.4 max.) .012 max. (0.3 max.)Partial Glaze

Full Glaze:

.0018 to .0032 ±.0006 (±15µm) ±.0004 (±10µm)

Glaze Thickness (45 to 80µm)

Partial Glaze:

.0012 to .0024 ±.0004 (±10µm) ±.00028 (±7µm)

(30 to 60µm)

.120" from all edges .0008 max. /.120 .0006 max. /.120Meniscus of Full Glazed Substrates

(3mm) (20µm max./3mm) (15µm max./3mm)

Glaze thickness of partial glazed substrate with width of less than .035" is .002" max.

Microwave Dielectric Ceramics

1.Filter, Isolator, MIC Features Miniaturization of circuit size is possible due to the ceramic's

high dielectric constant. High Q values even at high frequencies. Stable circuit operation can be obtained due to the low

temperature coefficient of the dielectric constant. Because of a wide range of dielectric values, circuit design

can be tailored to fit the application more easily. Surface finish can be selected to allow use with thin film or

thick film technologies. Numerous custom designs such as holes, complicated 3

dimensional shapes, and snaplines are available due to

Kyocera's advanced dry press technology.

2.Dielectric Resonator (DR) (Satellite Broadcast, Base Station) Features Downsizing of DR or cavity is possible because of high ε γ and

high Q value. Stable electrical characteristics


Material Code SM200 SM210 SH790 SH890 SH110 SB350 SL390 SV430

Dielectric Constant εγ 20±1 21±1 79±1 89±1 110±3 35~37 39~42 43~46

Q value (GHz)>8000 >8000 >1500 >1800 >1200 4500 6500 4400

(6) (6) (2.6) (2.6) (2.3) (10) (10) (10)

ppm/˚Cτ ε τ ε τ ε τ ε τ ε τ f τ f τ f

Temperature Coefficient (τ ε or τ f)-25±30 -25±30 -35±30 -35±30 -70±30 0±1~8±1 -3±1~8±1 -7±1~8±1

1/˚C 9.2 × 10-6 9.2 × 10-6 10.1 × 10-6 10.1 × 10-6 10.1 × 10-6 9.0 × 10-6 10.3 × 10-6 10.2 × 10-6Coefficient of Linear Thermal Expansion (40~400˚C)

Thermal Conductivity W/m ⋅ k 7.5 7.5 2.1 2.1 2.1 2.9 2.9 2.9

Bulk Density kg/m3 3.7 × 103 3.7 × 103 5.7 × 103 5.7 × 103 5.7 × 103 4.6 × 103 5.6 × 103 4.8 × 103

Flexural Strength MPa 190 190 180 180 180 180 100 290

Water Absorption % 0 0 0 0 0 0 0 0

Application MIC Filter/Isolator/MIC DR

Shapes

Snaplines and via holes can be added by the pressing

process.

Products can be designed to the customer's individual

specifications and requirements.

Aluminum Nitride Substrates

Features High thermal conductivity (7 to 8 times as much as Al2O3) Thermal expansion is close to Silicon wafer. High mechanical strength and high density. High chemical durability.


Thermal Characteristics Thermal Conductivity VS Temperature

Characteristics Comparison (AIN/AL2O3)

Item Materials AN215 AN217

Color – Black Light Russet

Bulk Density g/cm3 3.4

W/m ⋅ k 150 170Thermal Conductivity

Thermal×10-6/˚C

Characteristics Coefficient of LinearRT~400˚C 4.8

Thermal Expansion ~800˚C 5.4

V/m 12 × 10-6Dielectric Strength

Ω ⋅ cm >1014

ElectricalVolume Resistivity

Characteristics1MHz 8.7Dielectric Constant

1MHz (×10-4) 3Dielectric Loss Angle

GPa 10.8Hardness (Hv1.0)

MechanicalMPa 310

CharacteristicsFlexural Strength

GPa 300Young's Modulus

0

50

100

150

200

250

300

1

SiC

ALN

BeO

2 3 4 5 6 7 8 9

BN

Si

Al2O3

GaAs

Thermal Expansion (10-6/˚C)

The

rmal

Con

duct

ivity

(W

/mK

)

0

50

100

150

200

250

300

1 50 100 150 200 250

BeO

AN217

AN215

Temperature (˚C)

The

rmal

Con

duct

ivity

(W

/mK

)

Al2O3

50

100

55

10

10

15

20

200300

400500

5

2.5

5max

AIN10

100

150

200Thermal Conductivity (W/m ⋅ K)

Thermal Expansion *10-6/˚C (RT-400˚C)

Dielectric StrengthV/m × 106

Flexural StrengthMPa

DielectricLoss Angle1MHz (×10-4)

Dielectric Constant(1MHz)

Al2O3

Multiform Glass

Features High thermal resistivity High mechanical strength Excellent dielectric strength High electrical resistivity Sealing operation is made simple


Cathode-Ray Tube

Viscosity-Temperature Curve

Item Unit Characteristics

Material Code G901 G902

Coefficient of Linear1/˚C 30~380˚C 24.0±1.5 (×10-7) 27.5±1.5 (×10-7)

Thermal Expansion

˚C 525 520Annealing Temperature

˚C 825 820Softening Temperature

Strain Point ˚C 470 465

kg/m3 2.15±0.05×103Bulk Density

MPa 45Flexural Strength

20˚C >1014

Volume Resistivity Ω ⋅ cm 300˚C 1012

500˚C 109

V/m 25 (120) × 10-6Dielectric Strength

(120) is measured by direct current using .010 thickness test piece.

0

2

4

6

8

10

12

14

400 600 800 1000 1200 1400 1600

Strain point

Annealing point

Softtening point

Working-point

Temperature (˚C)

Log

Vis

cosi

ty (

pois

e)

Ferrite

Features Manufactured by the highest technical ceramic manufacturer

in the world. Many standard materials to fit your application. Complex shapes, high precision are no problem with Kyocera

outstanding pressing technology and are available at

competitive prices. The industry's best selection for magnetic shielding for SMT

components or entire circuit. Metallization is also available.


Magnetic materials

Soft magnetic materials

Ferrite

Code No.

Initial Permeability

Relative loss factor

(tan δ / µ)

Relative Temperature

Coefficient (α µ r)

Saturated Magnetic Flux Density Bs (mT)

Residual Magnetic Flux Density Br (mT)

Electrical Resistivity (Ω ⋅ cm)

100kHz

1MHz

10MHz

100kHz

(×10-6)

1MHz

(×10-6)

10MHz

(×10-6)

–25~20˚C

(×10-6)

20~80˚C

(×10-6)

NZ001A

1

1

1

108

NZ021A

7

7

7

26,000

3,600

1,300

35

35

80

20

108

NZ112A

65

65

65

200

130

180

0

0

380

230

108

NZ131A

160

160

160

150

80

280

50

35

370

160

108

NZ221A

370

370

220

30

60

3,000

4

2

290

110

108

NZ241A

480

480

300

15

30

2,700

15

7

350

120

108

NZ273B

150

150

160

120

50

80

15

10

250

90

108

NZ311A

650

650

270

20

55

4,500

20

10

390

210

108

NZ312B

490

500

260

15

60

3,200

0

–1

290

110

108

NZ341A

900

950

330

15

65

4,400

20

9

360

160

108

NZ411A

800

800

200

50

80

4,700

25

15

380

190

108

NZ411B

1,100

1,200

250

15

120

5,300

15

6

380

170

108

NZ511A

2,000

1,500

240

15

360

9,600

7

2

320

100

108

NZ511G

450

430

220

80

210

4,400

8

–2

230

130

108

DESIGN GUIDELINE

DR CORE Both alumina and ferrite are available. d, W&w depends on D&t.

SQUARE CORE Both alumina and ferrite are available. Complicated shape, high precision are no problem with

KYOCERA out-standing press technology.

PUSHPIN CORE Suitable for magnetic shielding components. Using with cap core, low-height is possible.

METALIZATION Both alumina and ferrite are available.

CAP CORE Suitable for magnetic shielding components. Square type is suitable for auto mounting system. Using with pushpin core, low-height is possible.

Ag(Ag/Pd)+Ni+Sn/Pb(Au)

Alumina & Ferrite core with metalization

Ag(AgPd)+Ni+Sn/Pb

UNITS:mm

(d)

(D)

(t)

(W)

(w)

MinimumDimension

0.8

1.0

1.0

0.2

0.25

φd

φD

Ww

t

D 7.0

D' 7.0

d 1.5

d' 1.5

t 0.4

l 1.0

2t+l 7.0

UNITS:mm

2.5 A 10.0, 1.0 C 5.0

B 0.3 B 0.5 B 0.8 atA 4.0 at4.0 A 6.0 at6.0 A

D 0.3 D 0.5 atC 3.0 at3.0 C 5.0Minimum dimension of B&D in round pot cores as followsB 0.4D 0.3NOTE:B&D depends on A&C

A = φ2.2~6.0

B φ1.2

C 0.5

D 4.5

UNITS:mm

D' lt t

d'

d D

A

DC

B

BD

AC

A B

10080.45±0.15 0.2MAX.

(2520)

08050.40±0.15 0.1MAX.

(2012)

0603 0.150.1MAX.

(1608) +0.25/–0.10

0402 0.150.1MAX.

(1005) +0.25/–0.10

normal metalization side metalization flat metalization

figure

good point alumina –––– good adhesion higt Q (45 at 25MHz)

ferrite –––– good adhesion higt Q (28 at 8MHz)

0.1

0.3-0.80.1-0.35A

B

Single Crystal Sapphire Substrates

Sapphire Features Perfect control of crystal orientation. (Fig. 1) Mirror polished surface. Low dielectric loss: Tan δ <10-4. High thermal conductivity. Excellent chemical durability.

SOS Substrates Features SOS (Silicon On Sapphire) structure. Enable circuit miniaturization. (Fig.2) Applicable for high speed circuits. Excellent radiation hardness. Simplify IC designing and process.

Crystal Orientation (Fig.1)


Comparsion in structure and individual chip size of SOS and bulk silicon

Material Code

Appearance

Color

Principle Materials

Bulk Density (kg/m3 )

Water Absorption (%)

Vickers Hardness (GPa, Hv 1.0)

Flexural Strength (MPa)

Young's Modulus (GPa)

Coefficient of Linear

Thermal Expansion at 25˚C (1/˚C)

Thermal Conductivity (W/mk)

Dielectric Strength (V/m)

Volume Resistivity (Ω ⋅ cm)

Dielectric Constant (1MHz)


Parallel to C-axis

Vertical to C-axis

20 ˚C

300 ˚C

500 ˚C

Parallel to C-axis

Vertical to C-axis

SA-100

Dense

Transparent

Al2O3

3.97 × 103

0

22.5

690

470

5.3 × 10-6/˚C

4.5 × 10-6/˚C

41.9

48 × 106

1016

–

1011

11.5

9.3

<10-4

kyocera substrates) electronic fine ceramics

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