jedec activities for mass storages
DESCRIPTION
JEDEC activities for Mass Storages. Next Generation Flash Storages - SSD & UFS – Feb. 5, 2008. This material is prepared to discuss possible cooperation between T13 and JEDEC. JEDEC Memory Committees. SSD. Status: - PowerPoint PPT PresentationTRANSCRIPT
1 Where Semiconductor Leaders Set Standards for the World!Where Semiconductor Leaders Set Standards for the World!
T13, Feb. 20, 2008
JEDEC activities for Mass Storages
Next Generation Flash Storages- SSD & UFS –
Feb. 5, 2008
This material is prepared to discuss possible cooperation between T13 and JEDEC
2 Where Semiconductor Leaders Set Standards for the World!Where Semiconductor Leaders Set Standards for the World!
T13, Feb. 20, 2008
JEDEC Memory Committees
JC42.3 DRAM
JC42.6 Low Power Memory
JEDEC BoD
JC45.2 UDIMM
JC45.4 FBDIMM
JC45.1 RDIMM
JC45.3 Small DIMM
JC64.2 Mechanical
JC64.1 Electrical
JC42Solid State Memory
JC45DRAM Module
JC63MCP
JC64Flash Memory Module
JC42.2 SRAM
JC42.4 NVM
JC45.5 DIMM socket
JC40Digital logic
JC40.1 Logic
JC40.2 PLL
JC40.3 DIMM component
JC64.3 Host controller
JC64.8 SSD
3 Where Semiconductor Leaders Set Standards for the World!Where Semiconductor Leaders Set Standards for the World!
T13, Feb. 20, 2008
SSD
• Status:– JC64 has decided to form JC64.8 SSD committee at Aug.’07, but will work
with other standard groups first to determine the optimal means for JEDEC to work, in a cohesive manner with existing standards group(s).
• Scope: Under discussion– Will be finalized after surveying industry standardization status
• Possible area of cooperation with T13– Co-define Identification and command set for NAND-based storage device
which in some portion T13 is already doing– There might be some other areas JEDEC can help industry, for example
common board design (guide), mechanical spec definition
• Discussion
4 Where Semiconductor Leaders Set Standards for the World!Where Semiconductor Leaders Set Standards for the World!
T13, Feb. 20, 2008
UFS (Universal Flash Storage)
• Scope: – Define next generation removable & embedded storage device specification.– Raw speed target of ~300MB/s per data lane with future scalability
• Status:– UFS TG formed at JEDEC (Dec. ’07)– Over 46 companies have participated
• Various Industries from memory, chipset, mobile phone makers and more
• Possible area of cooperation with T13– Command set definition, which will primarily be used for removable & embedded
storage devices, but may also be compatible with ATA spec
• Discussion