Packaging Innovations Working in collaboration with Antistat

Peel Pack Solution Innovative, patented IC packaging solution, providing complete protection for small quantity shipments such as sample management, small production runs, customer trials

•  Clear product identification •  Reduced moisture ingress •  Anti static protection

•  All round protection in transit and storage •  Use only what you need •  Made from recycled material and is recyclable

• Eradicates pin damage • Reduction in customer complaints • Customer satisfaction rates increase

• Improved bin accuracy and reduced product damage • Reduced packaging cost & dunnage due to smaller footprint • Reduced packaging time

Bio Bag Unique, fully biodegradable, static dissipative packaging solution for electronics and electronic components

This new, innovative packaging developed by Antistat exclusively for Farnell, provides an environmentally-friendly alternative to standard polythene ESD packaging

•  Offers the same level of protection as standard ESD packaging •  Fully biodegradable to the recognised European standard (EN13432) •  No harmful chemicals released into the environment •  Biobags can be disposed of in general waste but are most effective in industrial composting systems

Static charge decay: < 0.002s Surface resistivity: < 1x1010 ohms/sq

Climate change and waste are growing global concerns. With the inherent static dissipative properties, it represents an electronics industry-first and provides an opportunity for your business to make a real difference to the impact we have on our environment as well as being a key differentiator

We are currently working with Antistat to extend the use of the material to other packaging types.

“Estimated to replace 3.6 million polythene bags despatched by Farnell in Europe each year, with plans in place to extend to APAC and the Americas”.

Jedec Trays An exciting, new generation of industry standard, Jedec Trays in development

• Made from recycled and recyclable materials • Currently in field trials with leading global component manufacturer

• Comparatively lighter in weight and offers significantly reduced cost over existing tray solutions • Costs reduced by half! • Weight reduced by over 60% offering reduced shipping costs and improved carbon footprint

Working in collaboration with Antistat

Antistat are a leading packaging and supply chain specialist that, through a long-standing partnership, have worked with us to create a suite of innovative, environmentally-friendly packaging solutions designed to protect electronic components in transit and storage.

Collectively, they present an opportunity to reduce costs and reduce the impact our businesses and our industry has on the environment.

Farnell Justin Willoughby Head of Service – Europe jwilloughby@farnell.com Tel: +44 (0)113 233 8127 Mobile: +44 (0)7730 015843

Antistat John Hensley Managing Director johnhensley@antistat.co.uk Tel: +44 (0)1473 836200 Mobile: +44 (0)771 422 0379