ichia company profile- dec24 y10

Page. 1 “ Integrity & Honesty, Dedication, Innovation, Achievement ”2010 Dec 27

Company Profile for Company Profile for

your fine pitch FPC partneryour fine pitch FPC partner

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http://www.pdffactory.com

Page. 2 “ Integrity & Honesty, Dedication, Innovation, Achievement ”

• Established in 1983

• Current Capital : US$ 110 Million

• Chairman : Benny Huang

• CEO : Jennifer Huang

• No. of Employee : 8,000

• Global Footprint : 7 presences in Asia, North/South America

• Service and Offering : FPC, Keypad, Magnesium Alloy, Cosmetic Sub-Assy.

ichia Technologies, Inc.ichia Technologies, Inc.

Linkou HQ, Taiwan

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History History • Yr 1983 Company Established for Rubber Keypad Mfg.

• Yr 1987 Started Plastic Injection Molding

• Yr 1989 Est. 2nd Factory in Penang, Malaysia

• Yr 1993 Est. N. America Branch in San Diego, USA

• Yr 1995 Est. 3rd Factory in Tijuana, Mexico

• Yr 1996 Est. 4th Factory in Zhong Shan, China

• Yr 1998 Est. FPC R&D in Hsin-Chu Factory

• Yr 1999 Est. 5th Factory in Zhong Shan, China

• Yr 2000 set up FPC Division.

• Yr 2000 IPO Taiwan stock exchange ( Symbol: 2402 )

• Yr 2000 Est. 6th Factory/R&D Center in Lin-Kou, Taipei

• Yr 2001 Acquired Landsfair Tech for Magnesium Alloy Mfg.

• Yr 2002 Set up 7th Factory in Su Zhou, China

• Yr 2004 Dormitory completion in SZ factory

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MVI-Rubber / FIR / GM / P+R -Ultra Thin P+R / Metal -Sheet Type (Plastic, Metal)-Module (Keypad + LGF + FPC+ Metal Dome)

2

Component SolutionsComponent Solutions

FPC-Single-sided-Double sided-Multi layer-COF-SMT

1

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SalesAdmin

Div.

KoreaArea

JapanArea

TaiwanTeam II

CEOJennifer Huang

ChairmanBenny Huang

Mal

aysi

a C

ompa

ny

QA Center

EuropeArea

PanelCluster

RIMTeam

TaiwanTeam I

IT D

iv.

HR

Div

.

Fina

nce

& A

ccou

ntin

g

GreatChina

NorthAmerica

Consultant, CIO,Audit, Legal

Adm

in D

iv. (

SZ)

☆ Hungary Plant☆ Mexico Plant

OrganizationOrganization

RD Center FPC Center Sales & MarketCenter

ZS Q

A D

ep.

LK Q

A D

ep.

SZ Q

A D

ep.

FPC

RD

Dep

.

MVI

RD

Dep

.

MVI

LK

Pla

nt

MVI

ZS

Plan

t

MVI

SZ

Plan

t I

MVI

SZ

Plan

t II

MVI

TE

Div

.

MVI

Eng

. Div

.

Logi

stic

Dep

.

MVI Center

FPC

LK

Pla

nt

Logi

stic

Dep

.

FPC

Eng

Div

.

FPC

SZ

Plan

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Sales Revenue (2004~2010)Sales Revenue (2004~2010)

106

99

88

111

116

144

110

143

155

125

126

116

172

140

0

50

100

150

200

250

300

350

'04 '05 '06 '07 '08 '09 '10 (F)

MMI-KeypadFPC

Unit : Million in US$

205 199

260 253280

242

312

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FPCFPCOffer & DeliveryOffer & Delivery

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Page. 8 “ Integrity & Honesty, Dedication, Innovation, Achievement ”8

Single-sidedFPC

Single-sidedFPC

Single-sideddouble accessSingle-sided

double access COFCOF

Double-sidedFPC

Double-sidedFPC

Multi-layerFPC

Multi-layerFPC

SMT ACF bondingIC bonding

ACP printing

SMT ACF bondingIC bonding

ACP printing

Product PortfolioProduct Portfolio

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Application Type FCCL1/2 oz RA + 10um AD + 1/2mil PI1/2 oz RA + 10um AD + 1mil PI1/2 oz RA + 20um AD + 1mil PI

Pick up Double Side FPC(Adhesive) 1/2 oz RA + 10um AD + 1/2mil PI

IndustrialComputer 1 oz RA + 18um AD + 1mil PI

CMOSDouble Side FPC

(Adhesive) 1/2 oz RA + 1/2mil PI

Double Side FPC(Adhesive-less)

Double Side FPC(Adhesive)

Type FCCL1/2oz RA Cu + 1mil PI

1/2oz RA Cu + 1/2mil PI1/3oz ED Cu + 10umAD + 1mil PI1/2oz RA Cu + 15umAD + 1mil PI

1/2oz RA + 1/2milPI

Single sided FPC(Adhesive-less)

Single sided FPC(adhesive)

Multi layer (air gap) FPC(Adhesive-less)

Double Side FPC(Adhesive-less) 1/2ozRA+1/2milPI

Type FCCL1/3 oz ED Cu + 20um PI1/2oz RA Cu + 12um PI

Multi layer FPC(adhesive-less)

1/2oz RA Cu + 10um AD + 12um PI

Multi layer FPC(adhesive)

Type FCCL1/3 oz ED + 20um PI1/2 oz RA + 1 mil PI

1/2 oz RA + 15 AD + 1mil PI1/2 oz RA + 15 AD + 1/2mil PI

Double Side FPC(Adhesive-less)

Double Side FPC(Adhesive)

ApplicationsApplications

1/3oz ED+25umPI1/4oz ED+25umPI

1/3oz ED+15um AD+1/2mil PI

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Ichia Suzhou Facility IIchia Suzhou Facility IBy end of 2011, this 3 buildings will be all for FPC BG.

Currently, Building-1 for MMI, Building-2 for FPC, Building-3 for Magnesium

Building-1Building-2Building-3

FPC FPCFPC 2011

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Ichia Suzhou Facility IIIchia Suzhou Facility II

120,000 sq. meters

MET30,000 sq. meters

MMI45,000 sq. meters

(Empty now)




FPC & SMT CapacityFPC & SMT Capacity

12000

49700

21500

12000

62800

29800

12000

75100

34600

0

10000

20000

30000

40000

50000

60000

70000

80000

90000

2010 Q3 2010 Q4 2011 Q4

S/S

D/S

M/L

Flex : M2 / month

* Remark: Current capacity utilization 70%

-14,000,00022 (Q2 2011)

80%12,000,00018 (Q2 2010)

SMT

( pcs / month)

Current Utilization % Capacity Lines

2010

Type

I. Bare flex capacity:

II. SMT monthly capacity:




Max. Panel sizeMax. Panel size

Min. pattern PitchMin. pattern Pitch

Min. Ring padMin. Ring pad

250 mm x 500 mm250 mm x 500 mm

S/S 38 um ; D/S 80 um; M/L 100umS/S 38 um ; D/S 80 um; M/L 100um

Ni-Au electrolytic plating Ni:2~9um Au: 0.03~0.09umOSP 0.2~0.5umENIG Ni:1~6um Au: 0.03~0.09umSn electrolytic plating 6+/-4umImmersion Tin 0.3~0.9um

Ni-Au electrolytic plating Ni:2~9um Au: 0.03~0.09umOSP 0.2~0.5umENIG Ni:1~6um Au: 0.03~0.09umSn electrolytic plating 6+/-4umImmersion Tin 0.3~0.9um

Min. via diameterMin. via diameter

No. of layersNo. of layers

Surface finishingSurface finishing

MaterialMaterial

0.3 mm0.3 mm

N/C 0.1 mm ; Laser 0.05 mmN/C 0.1 mm ; Laser 0.05 mm

1 ~ 6 layer1 ~ 6 layer

FCCL: PI 50um, 25um, 20um, 12.5umCu Foil ED Cu1~1/4OZ ; RA Cu 1~1/3OZ

Cover Coat: PI 25um, 20um, 12.5um,Solder Mask 9~13umPSR 17~25umPIC 25um, 38um

Shielding: EMI film 32umSilver Paste 9+/-3um

Stiffener: PI, PET, FR4, Metal

FCCL: PI 50um, 25um, 20um, 12.5umCu Foil ED Cu1~1/4OZ ; RA Cu 1~1/3OZ

Cover Coat: PI 25um, 20um, 12.5um,Solder Mask 9~13umPSR 17~25umPIC 25um, 38um

Shielding: EMI film 32umSilver Paste 9+/-3um

Stiffener: PI, PET, FR4, Metal

SMTSMTConnector : min pitch 0.4mmPassive component : min 0201BGA : min pitch 0.4mm

Connector : min pitch 0.4mmPassive component : min 0201BGA : min pitch 0.4mm

IC BondingIC Bonding Au-Au Eutectic bonding , min pitch 38 umAu-Au Eutectic bonding , min pitch 38 um

FPC Manufacturing CapabilityFPC Manufacturing Capability




• Chip 0201 (01005 in progress) • BGA pitch 0.4mm (0.3mm in progress) • Baking & moisture sensitivity control • Lead Free FPCA – RoHS conversion • Automated Optical Inspection (AOI) with in line real time • Shop floor data capture work stations• X-ray for BGA inspection and mechanical joint analysis • Inert atmosphere (Nitrogen) wave soldering • Under-fill, conformal coating, & IC bonding• Solder paste thickness control with laser solder paste measurement

machine • Function test

SMT CapabilitySMT Capability

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Description Lead Time

Single Sided (+SMT)

Double Sided (+SMT)

Multi-layer (+SMT)

Single Sided (+SMT)

Double Sided (+SMT)

Multi-Layer (+SMT)

Prototype

Mass

Production

7 (+1) days

12 (+1) days

16 (+1) days

3 (+1) weeks

4 (+1) weeks

6 (+1) weeks

Standard Lead TimeStandard Lead Time

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MVI Production MVI Production




• Rubber / FIR• FIP (Film In Plastic)• GM (Glue Molding)• P+R (Plastic + Rubber)• Ultra Thin P+R / Metal • Sheet Type (Plastic, Metal)• Clear (Transparent) Touch Keypad• Capacitive Qwerty Keypad• Module (Keypad + LGF + FPC + Metal

Dome)

Experience in Variety of KeypadExperience in Variety of Keypad




Mechanical Vertical Integration

üMen machine interfaceüTactileüBacklighting

üDecorationüMechanical üElectronics

Total Solution

Housing

Keypad

Light guide

Metal dome

FPC

Metal parts

Sub-assembly




Housing(A, B, C Cover)

FPC / Dome sheet

Input device module(keypad/Side

Key/Dome/FPC)

Lens / lens with ITO film

Optical module

Antenna module

Ichia MVI SolutionIchia MVI Solution

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Experience in Variety of KeypadExperience in Variety of Keypad

Keypad Product

Keypad, NCVM, Light Guide, Jag Ball,

Metal Frame, FPC, Metal Dome

Keypad, Light Guide,

Metal Frame, FPC, Metal Dome

Keypad, Light Guide, Ni-free plating

Cover, assembly with heat staking

GM Type

LGRF

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Mag. Alloy / CosmeticMag. Alloy / Cosmetic

ü Multi-type Keypad

ü Back Lighting

ü Side Key with FPC

ü FPC with Metal Dome, LGF

ü NCVM Decoration Frame

ü Sub-Assembly




Quality Assurance SystemQuality Assurance System




ISO 9001:2000

ISO 14001:2004

UL

TS16949

Aug 2004 June 2006.

Certificate No:C041059

Certificate No:CNABC01-B

Start

Certificate No:E213184

Dec 2006. Q2 2009.

Certificate No:2009/34066




ISO9001.2000QS9000.1998ISO14001.1996

Green PARTNER OF SONY

PARTNER OF SAMSUNG SDI

TS16949

PARTNER OF Samsung Electronics

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3D Measuring EquipmentHigh Temperature Chamber Peeling Off Tester Membrane Thickness X-

Ray Measuring Equipment

Humidity & Temperature Chamber

Thermal Shock Tester

Low Temperature Chamber Solder Furnace Instrument Microscope SEM & EDSMetallurgical Microscope

Cyclic Volta Metric Stripping Atomic Absorption Uv Spectrophotometer MIT Folding Endurance Conductivity Scale

Shear Force Tester Electronic Scale High Resistance Meter Chroma Mewte Oblique Microscope

Long arm microscope

Laboratory Laboratory EEquipmentquipment

ROHS TESTER

TDR




Laboratory Testing & AnalysisLaboratory Testing & Analysis

Solvent Concentration analysis

Solvent Ionic analysis

Micro-section observation and element analysis

Micro-section observation

Micro-section observation

Miniature dimension measurement

Plating Thickness Measurement

Flexural ability testing

Impedance control

Peeling strength of copper clad or PI film

Solder resistance for material/product

Solvent test

Product durability test

High temperature resistance test

Environmental simulation test

High low resistance test

Function

1 setUV Spectrometer

1 setAtomic Absorption

1 setSEM &EDSMaterial Analysis

1 setInstrument Microscope

1 setMetallurgical Microscope

1 set2.5D Measuring Machine

1 setX-RAY Measuring Equipment Dimension Measurement

1 setMIT Folding Endurance Tester

1 setIsolation Impedance between Pattern Tester

1 setPeeling off Strength Tester

1 setHeat Resistance of Solder

1 setSolvent-Resistant TesterReliability/Durability Tests

1 setSalt-Spraying Tester

1 setHigh Temperature Chamber

1 setHumidity & Temperature Chamber

1 setThermal Cycling ChamberEnvironmental Test

SetEquipmentCategory

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Reliability Reliability TTestestinging

• Insulation resistance test• Peeling off test (copper/ cover lay/ stiffener）• Heat resistance of solder Tin• Thermal stock test• Temperature & humidity resistance test • High temperature test• Low temperature test• Solvent resistant• Bending resistant test




Ente

rpri

se V

alu

e

2010 2011 2012 2013

Ichia quality strategy (milestone)

2014~20182009

q Raise The Barq High Operation Disciplineq QIS & Pre-Alert Systemq QCC/QIT/6 Sigma Activity

Ichia will integrate internal & external

resource to build up the

superior products and fulfill

the customer

satisfaction thru the

high discipline

and capable work force across the industry.

Ichia will integrate internal & external

resource to build up the

superior products and fulfill

the customer

satisfaction thru the

high discipline

and capable work force across the industry.

Re-Building

Re-Enforcement

CustomerSatisfaction

3 QCC/QIT Improvement Activity4 Internal Audit (System, Process, Product, QSA, QPA, Supplier)

8 TQM Program Initiative

q Common Vision/Mission

q Staff Recruitment

q QA/QC Integration

q Staff Training & Dev.

10Quality Cost Optimize Program

9 Lean MFG Program Initiative

7 Customer Satisfaction Program Initiative

1 QA/QC Integration & Re-Enforcement

5 Quality Information System & ABL Pre-Warning System

6 6 Sigma Improvement Activity

q Reduce Customer Complaints

q Customer Relations

q AUO/RIM Quality Recognition

Best In ClassBest Of Industry

2 Enhancement of Human Capability & Management Skill

QA/QC QA/QC Organizational Organizational FormationFormation

Strengthen All Strengthen All Manufacture, QA, Manufacture, QA,

QC Function & QC Function & CapabilityCapability

Aggressiveness Quality Performance: Aggressiveness Quality Performance: Maximum of First Pass Yield Rate, Maximum of First Pass Yield Rate, Minimum of Customer ComplaintMinimum of Customer Complaint

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Thank you Thank you



ichia company profile- dec24 y10

Documents

capable work force

pass yield rate

au eutectic bonding

qc function

integrate internal

double side fpc

customer satisfaction

double sided