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Page 1: IBM Power6 1

© 2008 IBM Corporation

IBM Power Systems

IBM Systems & Technology Group

IBM Power Systems Technical

Excellence03/29/07

Page 2: IBM Power6 1

2

IBM Power Systems

© 2008 IBM Corporation

REQUIRED CHARTSThe presenter must display the Special Notices chart, the Notes on Benchmarks and Values charts (if the referenced values are given), and the Notes on Performance Estimates chart (if the referenced performance estimates are given) during the course of the presentation. Any printed copies of this presentation that are distributed must include legible copies of these charts. If printed copies are not distributed, the attendees must be offered the option to receive legible printed copies of these charts.TRADEMARKSPlease review the Special Notices page prior to updating this presentation to ensure all trademarks used are given proper attribution.SPEAKER NOTESThis presentation may contain speaker notes available imbedded or as a separate file. Please ensure these are utilized if available.

Revised January 9, 2003

Notes to Presenter

Page 3: IBM Power6 1

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IBM Power Systems

© 2008 IBM Corporation

This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area.Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied.All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions.IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment.

Revised September 26, 2006

Special Notices

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IBM Power Systems

© 2008 IBM Corporation

Revised January 15, 2008

Special Notices (Cont.)

The following terms are registered trademarks of International Business Machines Corporation in the United States and/or other countries: AIX, AIX/L, AIX/L (logo), AIX 6 (logo), alphaWorks, AS/400, BladeCenter, Blue Gene, Blue Lightning, C Set++, CICS, CICS/6000, ClusterProven, CT/2, DataHub, DataJoiner, DB2, DEEP BLUE, developerWorks, DirectTalk, Domino, DYNIX, DYNIX/ptx, e business (logo), e(logo)business, e(logo)server, Enterprise Storage Server, ESCON, FlashCopy, GDDM, i5/OS, i5/OS (logo), IBM, IBM (logo), ibm.com, IBM Business Partner (logo), Informix, IntelliStation, IQ-Link, LANStreamer, LoadLeveler, Lotus, Lotus Notes, Lotusphere, Magstar, MediaStreamer, Micro Channel, MQSeries, Net.Data, Netfinity, NetView, Network Station, Notes, NUMA-Q, OpenPower, Operating System/2, Operating System/400, OS/2, OS/390, OS/400, Parallel Sysplex, PartnerLink, PartnerWorld, Passport Advantage, POWERparallel, Power PC 603, Power PC 604, PowerPC, PowerPC (logo), Predictive Failure Analysis, pSeries, PTX, ptx/ADMIN, Quick Place, Rational, RETAIN, RISC System/6000, RS/6000, RT Personal Computer, S/390, Sametime, Scalable POWERparallel Systems, SecureWay, Sequent, ServerProven, SpaceBall, System/390, The Engines of e-business, THINK, Tivoli, Tivoli (logo), Tivoli Management Environment, Tivoli Ready (logo), TME, TotalStorage, TURBOWAYS, VisualAge, WebSphere, xSeries, z/OS, zSeries.

The following terms are trademarks of International Business Machines Corporation in the United States and/or other countries: Advanced Micro-Partitioning, AIX 5L, AIX PVMe, AS/400e, Calibrated Vectored Cooling, Chiphopper, Chipkill, Cloudscape, DataPower, DB2 OLAP Server, DB2 Universal Database, DFDSM, DFSORT, DS4000, DS6000, DS8000, e- business (logo), e-business on demand, EnergyScale, Enterprise Workload Manager, eServer, Express Middleware, Express Portfolio, Express Servers, Express Servers and Storage, General Purpose File System, GigaProcessor, GPFS, HACMP, HACMP/6000, IBM Systems Director Active Energy Manager, IBM TotalStorage Proven, IBMLink, IMS, Intelligent Miner, iSeries, Micro-Partitioning, NUMACenter, On Demand Business logo, POWER, PowerExecutive, PowerVM, PowerVM (logo), Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power PC, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), PowerPC Architecture, PowerPC 603, PowerPC 603e, PowerPC 604, PowerPC 750, POWER2, POWER2 Architecture, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER6+, pure XML, Quickr, Redbooks, Sequent (logo), SequentLINK, Server Advantage, ServeRAID, Service Director, SmoothStart, SP, System i, System i5, System p, System p5, System Storage, System z, System z9, S/390 Parallel Enterprise Server, Tivoli Enterprise, TME 10, TotalStorage Proven, Ultramedia, VideoCharger, Virtualization Engine, Visualization Data Explorer, Workload Partitions Manager, X-Architecture, z/Architecture, z/9.

A full list of U.S. trademarks owned by IBM may be found at: http://www.ibm.com/legal/copytrade.shtml.The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org.UNIX is a registered trademark of The Open Group in the United States, other countries or both. Linux is a trademark of Linus Torvalds in the United States, other countries or both.Microsoft, Windows, Windows NT and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both.Intel, Itanium, Pentium are registered trademarks and Xeon is a trademark of Intel Corporation or its subsidiaries in the United States, other countries or both.AMD Opteron is a trademark of Advanced Micro Devices, Inc.Java and all Java-based trademarks and logos are trademarks of Sun Microsystems, Inc. in the United States, other countries or both. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC).SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC).NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both.AltiVec is a trademark of Freescale Semiconductor, Inc.Cell Broadband Engine is a trademark of Sony Computer Entertainment Inc.InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Other company, product and service names may be trademarks or service marks of others.

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IBM Power Systems

© 2008 IBM Corporation

Revised January 15, 2008

Notes on Benchmarks and Values

The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor.

IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html.

All performance measurements were made with AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5L or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006, SPEC2000, LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX 5L and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C Enterprise Edition V7.0 for AIX, XL C/C++ Enterprise Edition V7.0 for AIX, XL FORTRAN Enterprise Edition V9.1 for AIX, XL C/C++ Advanced Edition V7.0 for Linux, and XL FORTRAN Advanced Edition V9.1 for Linux. The SPEC CPU95 (retired in 2000) tests used preprocessors, KAP 3.2 for FORTRAN and KAP/C 1.4.2 from Kuck & Associates and VAST-2 v4.01X8 from Pacific-Sierra Research. The preprocessors were purchased separately from these vendors. Other software packages like IBM ESSL for AIX, MASS for AIX and Kazushige Goto’s BLAS Library for Linux were also used in some benchmarks.

For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor.

TPC http://www.tpc.orgSPEC http://www.spec.orgLINPACK http://www.netlib.org/benchmark/performance.pdfPro/E http://www.proe.comGPC http://www.spec.org/gpcNotesBench http://www.notesbench.orgVolanoMark http://www.volano.comSTREAM http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/benchmark/ Oracle Applications http://www.oracle.com/apps_benchmark/ PeopleSoft - To get information on PeopleSoft benchmarks, contact PeopleSoft directly Siebel http://www.siebel.com/crm/performance_benchmark/index.shtmBaan http://www.ssaglobal.comMicrosoft Exchange http://www.microsoft.com/exchange/evaluation/performance/default.aspVeritest http://www.veritest.com/clients/reports Fluent http://www.fluent.com/software/fluent/index.htmTOP500 Supercomputers http://www.top500.org/Ideas International http://www.ideasinternational.com/benchmark/bench.htmlStorage Performance Council http://www.storageperformance.org/results

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IBM Power Systems

© 2008 IBM Corporation

Revised October 9, 2007

Notes on Performance EstimatesrPerf

rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and should not be reasonably used in that way. The model simulates some of the system operations such as CPU, cache and memory. However, the model does not simulate disk or network I/O operations.

rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time of system announcement. Actual performance will vary based on application and configuration specifics. The IBM eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is dependent upon many factors including system hardware configuration and software design and configuration. Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems. Variations in incremental system performance may be observed in commercial workloads due to changes in the underlying system architecture.

All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM. Buyers should consult other sources of information, including system benchmarks, and application sizing guides to evaluate the performance of a system they are considering buying. For additional information about rPerf, contact your local IBM office or IBM authorized reseller.

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IBM Power Systems

© 2008 IBM Corporation

OverviewProcessorsIBM Power™ Systems, POWER6™ Processor-based SystemsReliability, Availability, ServiceabilityCapacity on DemandPerformanceAdditional HardwareHardware Management ConsoleIO and NetworkingGreen ComputingStorageOperating SystemLinux®

Table of Contents

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IBM Power Systems

© 2008 IBM Corporation

IBM Power Systems™

BladeCenter JS12JS22

570 575

595

Common FeaturesProcessor technologyService ProcessorVirtualization

550

520

560

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IBM Power Systems

© 2008 IBM Corporation

POWER6 System HighlightsBalance System DesignPOWER6 Processor Technology

5th Implementation of multi-core design~100% higher frequencies4X increase in L2 Cache

POWER6 System ArchitectureNew generation of servers

Blades to High End offeringsEnhances memory implementationNew IO: PCIe, SAS / SATA, IO Drawers

Enhanced Virtualization Partition Mobility Workload PartitionsVirtual Shared Pools Int Virt Ethernet

Green TechnologiesProcessor Nap ModeMemory Power Down supportPower Save Mode

AvailabilityNew RAS features

Processor Instruction RetryAlternate Process Recovery

Workload MobilityHot Add resources

LPAR#2

LPARVIOS

LPAR#3

LPAR#1

Dedicated Processor

LPAR# 4

Power Hypervisor

Micro-Partition Shared Processor Pool

VSCSIVNET

BootHMC

35,400

30,000

21,000

10,175

234

164

71

553

0

10,000

20,000

30,000

40,000

0

100

200

300

400

500

600

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IBM Power Systems

© 2008 IBM Corporation

IBM Power System Servers

Footprint, Packaging Blade Blade 19-inch 4U rack

Deskside19-inch 4U rack

Deskside 19-inch 4U rack

Processor POWER6 POWER6 POWER6 POWER6 POWER6

# of processors(# of cores) 2 4 1, 2, 4 2, 4, 6, 8 4, 8, 16

GHz clock 3.8 4.0 4.2 3.5, 4.2 3.6DDR2 GB memory 2 to 64 2 to 32 2 to 64 2 to 256 2 to 384Internal storage* 73GB – 292TB 73GB – 146TB 73GB – 30.6TB 73GB – 30.6TB 73GB – 39.6TBMaximum rPerf 14.71 30.26 31.48 68.20 100.3

PCIePCI-X slots

PCI-X 266 slotsGX bus slots

0 to 20 to 2

00

0 to 20 to 2

00

30 to 562 to 50

2

30 to 562 to 50

2

4 to 80 to 842 to 762 – 4

Max I/O drawers N/A N/A 8 8 12

Max micro-partitions 40 40 401 801 801

IBM i Operating System 5.4 & 6.1 5.4 & 6.1 5.4 & 6.1 5.4 & 6.1 5.4 & 6.1AIX® support 5.3, 6.1 5.3, 6.1 5.3, 6.1 5.3, 6.1 5.3, 6.1

Linux® support RHEL 4.5 / 5.1SLES 10

RHEL 4.5 / 5.1SLES 10

RHEL 4.5 / 5.1SLES 10

RHEL 4.5 / 5.1SLES 10

RHEL 4.5 / 5.1SLES 9 or 10

pSeries

pSeries

1 Requires purchase of optional feature to support micro-partitions *With maximum I/O drawers Optiona2 Preview Announcement Nov 13, 2007l

IBM BladeCenter®

JS22

Power 560Power

520Power

550IBM

BladeCenter® JS12

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IBM Power Systems

© 2008 IBM Corporation

IBM Power System Servers

Footprint, Packaging 19-inch 4U rack 19-inch 4U rack 24-inch frame

by node 24-inch frame

by node Processor POWER6 POWER6 POWER6 POWER6

# of processors(# of cores) 2, 4, 8, 12, 16 4, 8, 16, 24, 32 32

8 ( 4.2 GHz ) To

64 ( 5.0 GHz )GHz clock 4.4, 5.0 4.2 4.7 4.2 / 5.0

DDR2 GB memory 2 to 768 2 to 768 32 to 256 16 to 4 TBInternal storage* 73GB – 79.2TB 73GB – 79.2TB 146.8GB – 5.1TB 146.8GB – 5.1TBMaximum rPerf 141.21 193.25 N/A 573

PCIePCI-X slots

PCI-X 266 slotsGX bus slots

4 to 160 to 1402 to 200

2 – 8

4 to 160 to 1402 to 200

2 – 8

0 to 40 to 200 to 16

2

0 0 to 240 / 180

0 to 4204 to 32

Max I/O drawers 32 32 1 12 / 30 Max micro-partitions 1601 1601 2541 2541

IBM i Operating System 5.4 & 6.1 5.4 & 6.1 N / A 5.4 & 6.1AIX® support 5.3, 6.1 5.3, 6.1 5.3, 6.1 5.3, 6.1

Linux® support RHEL 4.5 / 5.1SLES 9 or 10

RHEL 4.5 / 5.1SLES 9 or 10

RHEL 4.5 / 5.1SLES 10

RHEL 4.5 / 5.1SLES 10

pSeries

pSeries

1 Requires purchase of optional feature to support micro-partitions *With maximum I/O drawers Optiona

Power 575Power 595

Power 570 Power 570/32

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IBM Power Systems

© 2008 IBM Corporation

Processors

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IBM Power Systems

© 2008 IBM Corporation

2004 2007

POWER5™2010

POWER6POWER4™

Distributed Switch

Shared L2

1+ GHzCore

1+ GHzCore

2001

1.65+GHz

Core

Distributed Switch

Shared L2

1.5+GHz

Core Shared L2

1.9 GHzCore

Distributed Switch

1.9 GHzCore Cache

AdvancedCore Design

AdvancedSystem Features

POWER7*

1.5+ GHzCore

Distributed Switch

Shared L2

1.5+ GHzCore

2.3 GHz POWER5+Enhanced ScalingSimultaneous Multithreading (SMT)Enhanced Distributed SwitchEnhanced Core ParallelismImproved FP PerformanceIncreased memory BandwidthReduced Memory LatenciesVirtualization

Very High Frequencies 4-5 GHzEnhanced VirtualizationAdvanced Memory SubsystemAltiVec™ Vector SIMD InstructionsInstruction RetryDecimal Floating-PointDynamic Energy ManagementPartition MobilityStorage Protection KeysAlternate processor recovery

Chip Multi Processing- Distributed Switch- Shared L2Dynamic LPARs (32)

Workload AcceleratorsHighly Threaded Cores

L2 CacheAdvanced

System Features

4-5 GHz2 Cores Alti

Vec

BINARY COMPATIBILITY

POWER Technology

*All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.

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IBM Power Systems

© 2008 IBM Corporation

POWER Design

POWER6 Characteristics

3.5 – 5 GHz 790M transistors .065 micron

POWER6 Architecture

Memory+

GX++ Bridge

GX++ Bus Cntrl

Mem

ory

Cntrl

Mem

ory

Cntrl

Memory+

P6Core

AltiVec

L3Ctrl L3L3

CtrlL3

P6Core

AltiVec

4 MB L2

4 MB L2

Chipto Chip

Chipto ChipFabric Bus

Controller

Ultra-high frequency dual-core chip: ≥ 3.5 GHz7-way superscalar, 2-way SMT core

Up to 5 instr. for one thread, up to 2 for other9 execution units

2LS, 2FP, 2FX, 1BXU, 1VMX, 1DP790M transistors, 341 mm2 dieEnhanced Simultaneous Multi-Threading2x4MB on-chip L2 – point of coherencyOn-chip L3 directory and controllerTwo memory controllers on-chip

TechnologyCMOS 65nm lithography, SOI Cu

High-speed elastic bus interface at 2:1 freqFull error checking and recoveryDynamic power saving

Advanced Clock gating

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IBM Power Systems

© 2008 IBM Corporation

POWER6 System Processor Options…

Memory+

GX+ Bridge

GX Bus Cntrl Mem

ory

Cntrl

Mem

ory

Cntrl

Memory+

P6Core

AltiVec

L3Ctrl L3L3

CtrlL3

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

Memory+

GX+ Bridge

GX Bus Cntrl Mem

ory

Cntrl

Mem

ory

Cntrl

Memory+

P6Core

AltiVec

L3Ctrl L3L3

CtrlL3

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

Memory+

GX+ Bridge

GX Bus Cntrl Mem

ory

Cntrl

Mem

ory

Cntrl

P6Core

AltiVec

L3CtrlL3

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

Memory+

GX+ Bridge

GX Bus CntrlMem

ory

Cntrl

P6Core

AltiVec

L3CtrlL3

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

Memory+

GX+ Bridge

GX Bus Cntrl Mem

ory

Cntrl

Mem

ory

Cntrl

P6Core

AltiVec

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

Memory+

GX+ Bridge

GX Bus CntrlMem

ory

Cntrl

P6Core

AltiVec

P6Core

AltiVec

4 MB L2

4 MB L2

Fabric BusController

595 575, 570, 560, & 550 520, JS12, & JS22

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IBM Power Systems

© 2008 IBM Corporation

POWER6 Packaging Options…

P6

Multi Chip ModulesPOWER6 Chip & L3

Power 595

Single Chip ModulePOWER6 & No L3

Power 520 / JS12 / JS22

P6L3

P6L3

Dual ChipPOWER6 Chip & L3

Power 550, 560, 570/32, & 575

Single Chip ModuleL3 & POWER6Power 570

P6

L3

L3

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IBM Power Systems

© 2008 IBM Corporation

Processor History Overview….

POWER4414 mm2

1.1 – 1.3 GHz

POWER4+267 mm2

1.5 – 1.9 GHz

POWER5389 mm2

1.65 – 1.9 GHz

POWER5+245 mm2

1.9 – 2.3 GHz

POWER6341 mm2

3.5 – 5.0 GHz

2001 2004 20072002 2003 2005 2006

Technology Change

2008

POWER6341 mm2

4.2 – 5.0 GHzRefresh

Technology Change

No TechnologyChange

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IBM Power Systems

© 2008 IBM Corporation

Power Systems Unification

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IBM Power Systems

© 2008 IBM Corporation

BladeCenterJS22

Express

BladeCenterJS12

Express

System i

IBM BladeCenter IBM Power Servers

Power Systems Server Unification

i525i515 i595i570i550

System pp5-595p5-575p5-570p5-550p5-520

Power 520Express

Power 550Express

Power 570 Power 575 Power 595

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IBM Power Systems

© 2008 IBM Corporation

Power Systems POWER6

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IBM Power Systems

© 2008 IBM Corporation

BladeCenter JS12

POWER6 Blade

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IBM Power Systems

© 2008 IBM Corporation

POWER6 JS12 Blade JS12 Blade

Architecture 2 core / 1 Socket @ 3.8 GHz

L3 Cache N / ADDR2 Memory 2GB to 64GB ( ChipKill )DASD / Bays 0 – 2 SAS disk ( 73 / 146 GB ) Daughter Card Options PCI-X and/or PCIe

Integrated Options Dual Port 10/100/1000 EthernetSAS Controller & USB

Fiber Support Yes ( via Blade Center )Media Bays 1 Blade CenterRedundant Power Yes BladeCenterRedundant Cooling Yes BladeCenterService Processor Yes

Virtualization AIX & Linux APVIntegrated Virtualization Manager

Blade Chassis BC-H, BC-E and BC-SNEBS Support Yes

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IBM Power Systems

© 2008 IBM Corporation

Memory

DISK Power10Gbt

Power10Gbt

POWER6Dual Core

High-speed PCI- Express

connector

Optional I/O connector

MemoryDISK

JS12 Blade

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IBM Power Systems

© 2008 IBM Corporation

BladeCenter JS22

POWER6 Blade

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IBM Power Systems

© 2008 IBM Corporation

POWER6 JS22 BladeJS22 Blade

Architecture 4-core / 2 Socket @ 4.0 GHz

L3 Cache N / ADDR2 Memory 2GB to 32GB ( Chipkill™ )DASD / Bays 0 – 1 SAS disk ( 73 / 146GB ) Daughter Card Options PCI-X and/or PCIe

Integrated Options Dual Port 10/100/1000 EthernetSAS Controller & USB

Fiber Support Yes ( via Blade Center )Media Bays 1 BladeCenterRedundant Power Yes BladeCenterRedundant Cooling Yes BladeCenterService Processor Yes

Virtualization AIX & Linux PowerVM Integrated Virtualization Manager

Systems Management IBM Director and CSMIBM EnergyScale™

BC Chassis BC-H and BC-SWarranty 3 years

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IBM Power Systems

© 2008 IBM Corporation

JS22 Blade

POWER6Dual Core

Memory

DISK Power10Gbt

Power10Gbt

POWER6Dual Core

High-speed PCI- Express

connector

Optional I/O connector

Memory

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IBM Power Systems

© 2008 IBM Corporation

JS12 / JS22 Expansion Cards

CFFv (Vertical) expansion cards:QLogic 4GB 2 Port Fibre Channel Expansion Card (CFFv) Ethernet Expansion Card (CFFv) SAS Expansion Card (CFFv)Emulex 4GB Fibre Channel Expansion Card (CFFv)

CFFh (Horizontal) expansion cards:QLogic Ethernet and 4 GB Fibre Channel Expansion Card (CFFh)4X InfiniBand® DDR Expansion Card (CFFh)Cisco 4X InfiniBand DDR Expansion Card (CFFh)Voltaire 4X InfiniBand DDR Expansion Card (CFFh)

One combination form factor vertical (CFFv) may be installed with a combination form factor horizontal (CFFh) expansion card and one SAS HDD.

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IBM Power Systems

© 2008 IBM Corporation

IBM BladeCenter JS12 vs JS22JS12 JS22

Architecture3.8GHz POWER6 SCM

2 core (1 Socket x 2 Core)Single Wide

4.0 GHz POWER6 SCM4 core (2 Socket x 2 Core)

Single Wide

Memory 2GB to 64GB DDR2 (Chip Kill) 533MHZ

2GB to 32GB DDR2 (Chip Kill) 667MHz

DASD / Bays 0-2 SAS disk (73 or 146 GB) 0-1 SAS disk (73 or 146 GB)Daughter Cards Legacy, SFF, or High speed DC Legacy, SFF, or High speed DC

Integrated FeaturesKeyboard, Video and Mouse

Dual Port 1Gb EthernetSAS Controller & USB

Keyboard, Video and MouseDual Port 1Gb EthernetSAS Controller & USB

Fiber Support Yes (via BladeCenter) Yes (via BladeCenter)Redundant Power Yes (via BladeCenter) Yes (via BladeCenter)Redundant Cooling Yes (via BladeCenter) Yes (via BladeCenter)

VirtualizationAIX 5L V5.3 & Linux

Advanced Power Virtualization (Standard)

Integrated Virtualization Manager

AIX 5L V5.3, AIX 6 & LinuxAdvanced Power Virtualization

(Standard)Integrated Virtualization Manager

Systems Management

IBM Director and CSMIBM EnergyScale Technology

IBM Director and CSMIBM EnergyScale Technology

OS Support AIX 5.3, AIX 6 , Linux, & IBM i AIX 5.3, AIX 6 , Linux, and IBM irPerf Performance 14.71 30.26

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IBM Power Systems

© 2008 IBM Corporation

Power 520

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 520 - 4U Rack & DesksidePower 520 8203-E4A

Architecture 1, 2, or 4 cores @ 4.2 GHzL3 Cache: N/A

DDR2 Memory Up to 64GB (Buffered )

Internal SAS Disks Up to 6 DASD (3.5”)

ExpansionPCIe: 3 SlotsPCI-X 266: 2 Slots GX Bus: 2 Slots

Shared with PCIe 1 slot

Integrated SAS / SATA Yes Optional: RAID support

Integrated Ports 3 USB, 2 Serial, 2 HMCOptional: SAS port

Integrated Virtual Ethernet

Dual Port 10/100/1000 EthernetOptional: Quad 1Gbt or Dual 10Gbt

Media Bays 1 Slim-line DVD1 Half High Tape

Remote IO Drawers Yes / Max: 8 GX Bus connection: RIO2 / InfiniBand

Dynamic LPAR Up to 40 partitions Redundant Power OptionalRedundant Cooling Yes

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IBM Power Systems

© 2008 IBM Corporation

Power 520 Physical Specifications:

Deskside/Desktop:Width: 328.5 mm (12.9 in) with tip foot

182.3 mm (7.2 in) without tip footDepth: 778 mm (30.6 in)Height: 540 mm (21.3 in)

Rack-Mount:Width: 440 mm (17.3 in)Depth: 538 mm (21.2 in)Height: 173 mm (6.8 in)

Weight:Rack-mount: 31.75 kg (70 lb)Deskside: 40.8 kg (90 lb)

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Power 550

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 550 Rack & DesksidePower 550 8204-E8A

Architecture 2, 4, 6 or 8 cores @ 3.5 & 4.2 GHzL3 Cache: 32MB per chip

DDR2 Memory Up to 256GB (Buffered )

Internal SAS Disks Up to 6 DASD (3.5”)Optional SFF DASD

ExpansionPCIe: 3 SlotsPCI-X 266: 2 Slots GX Bus: 2 Slots

Shared with PCIe 2 slots Integrated SAS / SATA Yes Optional: RAID support

Integrated Ports 3 USB, 2 Serial, 2 HMCOptional: SAS port

Integrated Virtual Ethernet

Dual Port 10/100/1000 EthernetOptional: Quad 1Gbt or Dual 10Gbt

Media Bays 1 Slim-line DVD1 Half High Tape

Remote IO Drawers Yes / Max: 8 GX Bus connection: RIO2 / InfiniBand

Dynamic LPAR Up to 80 partitions NEBS YesRedundant Power OptionalRedundant Cooling Yes

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IBM Power Systems

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Power 550 Physical Specifications:

Deskside/Desktop:Width: 282.5 mm (11.1 in) with tip foot

182.5 mm (7.2 in) without tip footDepth: 778 mm (30.6 in)Height: 540 mm (21.3 in)

Rack-Mount:Width: 440 mm (17.3 in)Depth: 730 mm (28.7 in)Height: 175 mm (6.89 in)

Weight: 54.4 kg (120 lb)

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POWER6 Entry Systems ComparisonPower 520 Power 550

Processors 4.2 GHz 3.5 & 4.2 GHz

L3 Cache N / A 32MB / Chip

Pluggable Modules No YesDASD / Bays 6 (3.5) 6 (3.5) / 8 SFFMemory 64 GB 256 GB

Integrated SAS/SATA Yes Yes

PCIe / PCI-X 3 / 2Slot 1 Shared

3 / 2Slots 1 & 2 Shared

Integrated Ports 2 Sys Port / 3 USB 2 Sys Port / 3 USBIntegrated Virtual Ethernet Yes Yes

Media Bays Yes Yes

Remote IO Drawers Max 8 Max 8Dynamic LPAR Yes / 40 Yes / 80Redundant Power Yes Yes

NEBS No Yes

Form Factor 4U x 22.8” 4U x 29”

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IBM Power Systems

© 2008 IBM Corporation

Power 560

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 560 Power 560 8234-EMAPower6 Processors 4 / 8 / 16 @ 3.6 GHz

L3 Cache 32 MB / Chip

Redundant Power & Cooling Yes

Redundant Server Processor Optional / Two Nodes minimum )

Redundant Clock Yes (Cold Detect) Two Nodes minimum

CoD No

Hot Node Add No

Concurrent Repair NoSingle Node Dual Nodes

Cores 4 or 8 16

DDR2 Memory (Buffered) Up to 192 GB Up to 384 GB

SAS Disk Bays (3.5”) 6 12

Media Bays 1 Slim-line 2 Slim-line

SAS/SATA Controller 1 2

PCI (Internal) 4 PCIe, 2 PCI-X 266 8 PCIe, 4 PCI-X 266

GX Bus Slots 2 3Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional

1 2

Remote I/O Drawers 8 Max 12 Max

Dynamic LPARs 80 160

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IBM Power Systems

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550 560Rack Units 4U 8U

Processor cores 2 – 8 4 – 16

Frequency 3.5 GHz4.2 GHz 3.6 GHz

Memory 256 GB 384 GB

I/O Drawers 8 12

CoD No NoUpgradesFrom P5+

9406: Yes9133: No No

Concurrent Maintenance No No

HMC Optional Required

Memory Type Standard New FC

Power (Est.) 1400W 2400W

IBM Power Systems: 550 & 560 Positioning

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IBM Power Systems

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Power 560 Bandwidth

Memory BandwidthL1 ( Data ) 51.2 GB/secL2 / Chip

16 core115.2 GB/sec921.6 GB/sec

L3 / Chip16 core

28.8 GB/sec230.4 GB/sec

Memory / Chip16 core

32 GB/sec256 GB/sec

Inter-Node Buses (16 core) 9.6 GB/secIntra-Node Buses (16 core) 57.6 GB/sec

Single NodeInternal I/O BusGX Bus Slot 1GX Bus Slot 2

Total I/O Bandwidth

7.2 GB/sec / node3.6 GB/sec / node4.8 GB/sec / node

24 GB/sec (16 core)

Calculations for 3.6 GHz processors and 667 MHz memory

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IBM Power Systems

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Power 570

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 570 Power 570 9117-MMAPower6 Processors 4.4 / 5.0 GHzL3 Cache 32 MB / Chip

Redundant Power & Cooling Yes

Redundant Server Processor Optional ( Two Nodes minimum )

Redundant Clock Yes (Cold Detect) ( Two Nodes minimum )CoD YesHot Node Add Yes

Concurrent Repair Yes ( Nodes 2 / 3 / 4 )Single Node Four Nodes

Cores 2 / 4 16

DDR2 Memory (Buffered) 2-192 768

SAS Disk Bays (3.5”) 6 24

Media Bays 1 Slim-line 4 Slim-line

SAS/SATA Controller 1 4

PCI (Internal) 4 PCIe, 2 PCI-X 266 16 PCIe, 8 PCI-X 266

GX Bus Slots 2 8

Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional)

1 4

Remote I/O Drawers 8 Max 32 Max

Dynamic LPARs 40 160

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IBM Power Systems

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POWER6 DDR2 Memory DIMMs

Back

DDR2 DDR2 DDR2 DDR2 DDR2 DDR2 DDR2 DDR2

DDR2 DDR2 DDR2 DDR2 DDR2 DDR2 DDR2 DDR2DDR2 DDR2

Front

Systems: Power 560, 570,570/32, 575, & 595Features / Benefits

Dual Sided Connector Pins3X Reliability of Industry Standard Memory

“Memory Power” SupportEnergy Savings ( At low utilizations )

On DIMM BufferingBetter Performance

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IBM Power Systems

© 2008 IBM Corporation

Power 570/32

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 570/32 Power 570 9117-MMAPower6 Processors 4.2 GHzL3 Cache 32 MB / Chip

Redundant Power & Cooling Yes

Redundant Server Processor Optional ( Two Nodes minimum )

Redundant Clock Yes (Cold Detect) ( Two Nodes minimum )

CoD Yes

Hot Node Add Yes

Concurrent Repair Yes ( Nodes 2 / 3 / 4 )Single Node Four Nodes

Cores 8 32

DDR2 Memory (Buffered) 2-192 768

SAS Disk Bays (3.5”) 6 24

Media Bays 1 Slim-line 4 Slim-line

SAS/SATA Controller 1 4

PCI (Internal) 4 PCIe, 2 PCI-X 266 16 PCIe, 8 PCI-X 266

GX Bus Slots 2 8

Dual Port 10/100/1000Quad Port 1 Gb (Optional)Dual Port 10 Gb (Optional)

1 4

Remote I/O Drawers 8 Max 32 Max

Dynamic LPARs 40 160

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IBM Power Systems

© 2008 IBM Corporation

POWER6 570 Processor Memory Packaging

L3

P PL2 L2

L3P P

L2 L2

4 Cores / Book

2 Cores / Book

POWER 570 Higher

FrequenciesUp to 16 Cores / System

POWER 570/32More ProcessorsUp to 32 Cores / System

L3P P

L2 L2

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IBM Power Systems

© 2008 IBM Corporation

pSeries

p590 570/32Footprint, Packaging

24 in Rack42U

19 in Rack16U

Configurations 16 / 32 4 / 8 / 16 / 24 / 32

L2 Cache 1.9 MBPer Processor Chip

8 MBPer Processor Chip

L3 Cache 36MBPer Processor Chip

32MBPer Processor Chip

DIMMs/Max GB memory

128 DIMMS 2 to 1TB

96 DIMMs2 to 768GB

Max GB / Core 32 GB 24 GBMax PCI slots( Internal ) 0 6 per Node

Max: 24 ( 4 Nodes )LPARs 254 254

I/O Drawers 8160 IO Adapter Slots

32 IB ( AIX & Linux )192 IO Adapter Slots

Max Power 16.7 KW 5.6 KW

POWER5+ 590 & Power6 570/32 Product Comparison

570/32

p590

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IBM Power Systems

© 2008 IBM Corporation

Power 575

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 575 Node Power 575 Node

Architecture32 Core node

1 – 14 Nodes / rack ( 448 Cores )4.7 GHz

Cache L3: 32MB / ChipDDR2 Memory 32 to 256 GB ( Buffered )Internal Disks 2 SAS SFF DASD ( 2.5”)

Expansion PCIe: Up to 4 SlotsPCI-X: Up to 2 slots

Integrated SAS Yes

Expansion Slots Dual GX Bus AdaptersIntegrated Ethernet

Two Dual 10/100/1000 EthernetOptional: Dual 10Gb

POWERN+1 Support

1 - 4 Nodes 2 Line Cords5+ Nodes 4 Line Cords

Cooling Combination Water / Air

Remote IO Drawers

Yes Quantity: 1PCI-X ( 20 Slots & 16 DASD )

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IBM Power Systems

© 2008 IBM Corporation

Photo of Power 575 Mechanical Model

Power 575 Water Cooled Node

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IBM Power Systems

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Top View

I/O Unit(Lite or FF)

PCI Riser(2 x PCIe or

1x PCIe, 1x PCI-X DDR2)

PCI Riser(2 x PCIe or

1x PCIe, 1x PCI-X DDR2)

Dual 2 port 4x Host Channel Adapter(Displaces Lower PCI Slot)

Processor UnitI/O Section

Air Moving Device(Fans)

16x DCM(p6 + L3)

32 x DIMM 32 x DIMM

Cold Plate

Dual 2 port 4x Host Channel Adapter(Displaces Lower PCI Slot)

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IBM Power Systems

© 2008 IBM Corporation

Water Cooling….Redundant Modular Water Unit

With Non-Redundant Facilities Water (MWU)

Redundant Modular Water UnitWith Redundant Facilities Water (MWU)

MWUMWU

FacilityWater

MWUMWU

FacilityWater

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IBM Power Systems

© 2008 IBM Corporation

Power 595

POWER6

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IBM Power Systems

© 2008 IBM Corporation

Power 595 Power 595 9119-FHA

Architecture POWER6: 8 / 16 - 64 core4.2 and 5.0 GHz

Cache L2: 4MB/Core L3: 32MB/ChipDDR2 Memory 16GB to 4 TB ( Buffered / ChipKill )

Processor / MemoryNodes

Up to 8 Nodes( 8 Cores & Max: 512 GB Memory )

Point to Point InterconnectProcessors / MemoryAvailability Hot Add & Concurrent Repair

GX Bus ( System Bus) 4 per Node

Remote IO Drawers( IO Expansion )

RIO-2 and 12X Max:30 DrawersDrawer: 20 IO slots & 16 DASD

Virtualization Up to 254 partitions Redundant Service Processor

CEC: Yes Node: YesYes / Hot Failover

Redundant Power & Cooling Yes / Concurrent Repair

Redundant Clock Yes / Hot Failover

Power / Thermal Active Energy Manager (Power Save)

Warranty 1 Year

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IBM Power Systems

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Power 595 Front Rack View

IO Drawers

Dual Clocks

Bulk Power

Nodes

Enet HubLight Strip

Dual System

Controllers

Dual NodeControllers

Midplane

Up to 8 NodesSplit 4 above / 4 below8 Cores and Up to 512GB Memory

Up to 3 Remote IO DrawersUp to 60 PCI SlotsUp to 48 DASD Bays

Dual ClocksDual System ControllersDual Node ControllersDual Power SuppliesDual Ethernet HubsDual LightstripsRedundant CoolingAlternate Processor RecoveryConcurrent Repair

Availability Features

Packaging

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IBM Power Systems

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Max Configuration 64 Cores / 4 TB Memory32 GX Buses

8 cores / Up to ½ TB Memory4 GX Ports / 2 Node Controllers

Power 595 System CEC

GX

GX

GX

GX

NC

NC

L 3

L 3

P6

L2P6

L2 L 3

L 3

P6

L2P6

L2

L 3

L 3

P6

L2P6

L2 L 3

L 3

P6

L2P6

L2

Dual Node Controllers

GX Bus

DIMMs

DIMMs DCA Bulk PowerDCA Bulk Power

ClockClock

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IBM Power Systems

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DDR2 DDR2 DDR2 DDR2 DDR2 DDR2 DDR2DDR2 DDR2 DDR2

Interposer Buffer Chip

Power 595: POWER5 590/595 Memory DIMMs upgrade…

DIMM Slot

POWER5 DDR2 memory transforms into Buffered Memory supported by POWER6

POWER5 DDR2 non buffered Memory

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IBM Power Systems

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POWER5 to Power System 595 Upgrade Options

Unified Power 595

POWER6

No upgrade path from a POWER6 570 to a POWER6 5959406-550 upgrade to i570 withdrawn July 2008

Power 595p5-595

i5-595

i5-570

p5-590

System i System

System p System

POWER5

Power System

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IBM Power Systems

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Power 595 BandwidthMemory Bus Size BandwidthL1 ( Data ) 2 x 8B 80 GB/sec

L2 2 x 32B 160 GB/sec

L3 4 x 8B 80 GB/sec2.56 TB / sec per System

MemorySystem

4 x 1B Write4 x 2B Read

42.7 GB/sec1366 GB/sec per System

Intra-NodeBuses

System6 x 8B

40 GB/sec per chip160 GB /sec per Node

1280 GB /sec per System

Inter-NodeBusesSystem

4 x 8B28 Interconnects

26.7 GB/sec746.7 GB/sec per System

GX Bus 2 x 4B 20 GB/sec640 GB/sec per System

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IBM Power Systems

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Capacity on Demand

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IBM Power Systems

© 2008 IBM Corporation

Capacity Upgrade on DemandUpgrade system with processors and/or memoryNo special contracts, no required monitoring (no ability to turn off the capacity)Purchase agreement

On/Off Capacity on DemandTemporary use of requested number of processors or amount of memory Client selects the capacity and activates the resource (registered system)Capacity can be turned on and off by the clientInformation captured by IBM (or reported to IBM)Rental agreement

Utility Capacity on DemandProcessor resources only / Measured by processor minutesCapacity can be turned on and off by the clientPrepaid or post pay Requires a minimum of AIX V5.3 or higher and APV

Trial Capacity on DemandAllow clients to test the effects of additional processors and/or memory Partial or total activation of processors and memoryResources available for fixed timeNo formal commitment required

Dynamic Processor Sparing• Automated replacement of deallocated processors• Unassigned or inactive processors

Capacity on Demand for POWER6 Processor-based Systems

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IBM Power Systems

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ConfigurationsPower 595: 4.2 / 5.0 GHzCores: 4 active / 28 CoDCores: 4 active / 60 CoD

Backup ModeProcessors: 32 / 64 active

Power System 595 Capacity Back-Up Option...

0

100

200

300

400

500

600

4 Cores 32 Cores 64 Cores

4.2 GHz 5.0 GHz

CBU Resources

rPerf

Capacity Back Up with POWER6– POWER6 595 ( 4.2 GHz or 5.0 GHz )– Base configuration: 4 Active processors– AIX V5.3 / V6.1, and Linux support– On / Off Days included with CBU Configurations

4 / 32 1800 CoD Processor days 4 / 64 3600 CoD Processor days

No Permanent Activation

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IBM Power Systems

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Reliability, Availability and Serviceability

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Processor Instruction Retry Alternate Processor Recovery First Failure Data CaptureDDR Chipkill memoryBit-steering/redundant memoryService Processor Failover*Dynamic Firmware Maintenance*Hot I/O Drawer Add*I/O error handling extended beyond base PCI adapterECC extended to inter-chip connections for the fabric/processor busesMemory and L3 Cache soft scrubbing

Hardware AssistedL2 & L3 Cache Line DeleteHardware Assisted Memory ScrubbingLive Partition Migration

Primary POWER RAS Features

HMC required to enable these functions..

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IBM Power Systems

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Primary POWER RAS Features - Continued

HMC required to enable these functions..

Hot Add: Power 570 Processor & MemoryHot Add: Power 590 Processors & MemoryConcurrent Repair: 570 Nodes 2/3/4 (Hot) and Node 1 (Cold)Concurrent Repair: 590 All NodesRepairRedundant power, fansDynamic Processor DeallocationDynamic processor sparing ECC memoryPersistent memory deallocationHot-plug PCI slots, fans, powerInternal light path diagnosticsHot-swappable disk bays

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IBM Power Systems

© 2008 IBM Corporation

Performance

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© 2008 IBM Corporation

Note:Go to system sales or PartnerInfo and download esbmi and select the charts that are most appropriate for your use.

Due to the constantly changing nature of benchmark standings, those charts are kept separate and updated the 2nd of

every month.

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IBM Power Systems

© 2008 IBM Corporation

I/O Hardware

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© 2008 IBM Corporation

POWER6 Remote I/O Drawer 19” Rack19” IO Drawer

POWER6 Processor-based Servers only– Max 4 of drawers per GX Bus½ x 19” 4U Rack-mount– Optional enclosure for two individual drawersSix PCI Adapter Slots

– PCI-X 2.0 (DDR) 64-bit @ 266 MHz (2 GB/s)“InfiniBand” Host Interface (Loop Architecture)

– 12 x 2.5Gb/s Full Duplex (30 Gb/sec)– Short Run (Intra-rack) or Long Run (Inter-rack)– Four cable lengths: 0.6, 1.5, 3.0, & 8.0mCustomer SetupConcurrently Maintainable Redundant PowerConcurrently Maintainable Redundant CoolingHot Drawer AddBlind-swap Cassettes for Adapter Cards

–Hot-pluggable

Two drawers

PCI-X 266Slots12X Channel

ConnectionSupported SystemsPower 520 / 550 560 / 570

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IBM Power Systems

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Back

Front

16 DASD

GX Dual Port12X ChannelConnections

POWER6 Remote I/O Drawers 24” Racks

SCSICntrl

24” I/O Drawer4U I/O DrawerPCI-X & PCI-X 266 Support 6 PCI-X and 14 PCI-X 266 per

Drawer All adapter slots 64bitsGX Dual Port 12X ChannelInfiniBand Interface30 Gb/sec

Supports 16 Hot-Plug disk drivesFour 4-pack disk / Ultra3 SCSI72.8 / 146.8 / 300 GB Multiple cabling options Hot Drawer AddBlind Swap Adapter CardsHot Pluggable

PCI-X 133 PCI-X 266

Dual or Single Path

SCSICntrl

SCSICntrl

SCSICntrl

Supported SystemsPower 575 / 595

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IBM Power Systems

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8Gb Fiber Channel

Description:Dual PortedPCIe x4 ArchitectureMultiple speeds: 2Gb, 4Gb, or 8GbSupported Systems: Power 520 / 550 / 560 / 570 / 575Supported OS: AIX and LinuxNPIV enabledFeature Code: 5735

PCIeFC

FC8Gb FiberChannel

Link

NPIV

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IBM Power Systems

© 2008 IBM Corporation

Green Computing

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IBM Power Systems

© 2008 IBM Corporation

Power TrendingCollect and Report Power usage data

Thermal ReportingCollect and display Inlet and Exhaust Temperatures

Static Power SaveSave maximum power by dropping voltage and frequency

Power CapEnforces a user-specified power capUses processor and memory throttling

OversubscriptionQuickly lower power when failure occurs.

Processor NapPut processors into low power mode when they are deconfigured or not used.

EnergyScale Functional Description

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IBM Power Systems

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Dynamic Power Save -- Optimize Power / PerformanceTPMD implements algorithms to optimize power vs. performance

Dynamic Power Save -- with Performance FloorUser specifies a minimum acceptable “performance floor”

System Turbo -- Maximum PerformanceProvides maximum performance by raising voltage and frequency

IO Tower/Drawer Power TrendingDrawer, Tower and IO Frame power reporting

Server Power DownEvacuate Servers and power them off

EnergyScale Functional Description - Continued

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PowerVM

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PowerVM…

AIX Workload Partitions

PowerVM Editions featureMicro-Partitioning™Virtual I/O ServerIntegrated Virtualization ManagerPartitioning PoolingNPIVLx86

Logical PartitioningVirtual ProcessorsVirtual NetworkingVirtual MediaVirtual Tape

Hardware & Software delivering industry-leading virtualization on IBM POWER processor-based processors for UNIX, Linux & IBM i

Live Partition MobilityLive Application Mobility

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IBM Power Systems

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Operating Systems

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© 2008 IBM Corporation

AIX

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IBM Power Systems

© 2008 IBM Corporation

POWER6 Delivers with Your Choice of AIX or Linux

Linux on POWERPOWER and x86 apps [2H07]PowerVMReliability, Availability, Serviceability featuresScalability to 128 threads

AIX 6*Virtualization

Workload PartitionsLive Application Mobility

SecurityAvailabilityManageabilityBinary compatible**

Broad application selectionWide range of workloadsReduced ComplexityPotential cost savings with consolidationLive Partition Mobility

Linux, AIX V5.3 and AIX V6.1

Binary compatible with existing applications on POWER6*Micro-PartitioningMainframe-inspired RAS features hardware and operating systemScalability up to 128 threads

AIX 5L V5.2/5.3

*Complete details on AIX binary compatibility can be found at http://www.ibm.com/servers/aix/os/compatibility/

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AIX Binary Compatibility

Guarantee

*Complete details on AIX binary compatibility can be found at http://www.ibm.com/servers/aix/os/compatibility/

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POWER6 ExploitationSoftware Reliability Availability ServiceabilityEnhancements to existing Virtualization TechnologiesWorkload Partitions ( Software based Virtualization )Application Mobility ( Cross system Workload Mobility )64-bit Kernel onlyIntegrated Multilevel SecurityRole Base Access Control ( Partial Root base )Encrypted File systemCAPP EAL4+ and LSPP Security CertificationSolution Performance TuningAIX Kernel Hot-PatchingDynamic Tracing for AIXEase of Use

Portal base SMT, LPAR Simplification

AIX 6 Features….

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AIX Editions

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AIX Editions…..

AIX 5.3 Management Edition bundle consisting ofAIX V5.3Tivoli® Application Dependency Discovery ManagerIBM Tivoli MonitoringIBM Usage & Accounting Mgr Virtualization Edition for Power Systems

AIX 6.1 Enterprise Management bundle consisting ofAIX V6.1PowerVM AIX Workload Partitions ManagerTivoli® Application Dependency Discovery ManagerIBM Tivoli MonitoringIBM Usage & Accounting Mgr Virtualization Edition for Power Systems

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IBM i

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IBM Power Systems

© 2008 IBM Corporation

V6R1• Major SW release (~3.0 MLoC)• New DB2 Functions• IOPless boot from SAN• IPV6 • System Director Navigator• Safe Computing

•SLIC Signing & S/R Encryption•Intrusion Detection•Encrypted backups and Data on disk

Virtualization• IBM i Storage• VIOS SupportPerformance • Performance Management ( Web based )• Improved Storage Performance• 64K Large Page Support/exploitation• 64-bit IBM Technology JVMHigh Availability• System HASM Product• SPOOL Modernization• Disk Instrumentation

V5R4M5 (POWER6 enablement)• IBM i V5R4 Refresh• IOPless WAN Adapter support• IOPless Op Console• Software Enablement for:

• Additional IOPless devices• PCI-Express Devices• Serial-Attached SCSI (SAS)

Availability• RAID Hot Spare

Refresh• Content Manager• Domino• PHP• WDSC

IBM i Operating Systems

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Linux

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● Enterprise Class Computing with Linux on POWER ( LoP )●Flexibility with LPAR, dynamic LPAR, and virtualization features●Reliability with built in self-healing capabilities●Power Architecture/Servers include POWER5, POWER6 and

PowerPC970 ( JS20, JS21 blades )

● Linux distributions available for LoP: - SUSE LINUX Enterprise Server 9 or 10 for POWER (SLES 9, SLES 10) - Red Hat Enterprise Linux 4, 5 for POWER (RHEL)

● Technical support available through IBM SupportLine contract. - SUSE LINUX and Red Hat, Inc. also provide support, upgrades and maintenance

●Orderable from IBM or directly from Linux distributors

● For more information about Linux running on IBM Power Systems servers:● http://www.ibm.com/systems/p/linux/

● http://www.redhat.com/rhel/server/● http://www.novell.com/products/server/

Linux on POWER*

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IBM Power Systems

© 2008 IBM Corporation

IBM Director 6.1

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IBM Power Systems

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AIX

FSP PHYP

SLES RHEL VIOS AIX

PHYP

SLES RHEL IVM (VIOS)

MM

JS21AIX SLES RHEL HS21

Win

HMC

HMC: Hardware Management Console WPAR: Workload Partition (Container)

IVM: Integrated Virtualization Manager PHYP: POWER Hypervisor

VIOS: Virtual IO Server (virtual IO and Layer 2 bridge) BMC: Baseboard Management Controller

MM: Management Module SMP: Symmetric Multi Processor

FSP: Flexible Service Processor

POWER6 System Blade Center POWER 5 System

AIXWPAR

WPAR

WPAR

WPAR AIX (SMP)

PHYP FSP

IBM Systems Director 6.1Physical and virtual platforms Server, Storage, Networking

Foundation Management

Advanced Management

Inventory HealthConfig Update

IBM Systems Director Console

IBM i IBM i

IBM Systems Director for Power Topology

BMC/FSP

Availability WorkloadImage Energy Mgt

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Automatic Discovery and Inventory:POWER resources and connected storage which includes the

collection of both hardware and software inventory. HMC, CEC, LPAR, AIX, pLinux, HMC, VIOS, FSP, and Virtual

Networking components – bridges and VLANS)

Visualize various POWER resource:Topologies and relationship across physical server and virtual

serversCEC, HMC, VIOS, LPAR, devices, AIX, pLinux and Virtual

Networking components, virtual disks, logical volumes and associated volume groups.

Discovery and documentation of full system configurationPhysical and virtual IO resources and association/relationship (for

configuration recovery – i.e. System plan).

Director 6.1 Power Capabilities:

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Show Health and Status of Physical and Virtual ServersHMC and VIOS. Show Alerts: Hardware failures and system logs from VIOS, HMC

and the operating systems.

Base Monitoring:OS Metrics: CPU and memory utilizationFile system metrics across hosts and virtual servers. Historical and OS events monitoring. View CPU utilization metrics for environments that contain both

shared and dedicated processors for both host and virtual servers.

Director 6.1 Power Capabilities:

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Download, Manage, and apply recommended Updates:AIX, pLinux, i5OS, HMC and System Firmware

Deployment/Provisioning/Planning Ability to configure new systems or clone systems using system

plans Deployment of OS and VIOS on a LPAR via HMC.

Base Virtualization ManagementSupport key lifecycle LPAR and mobility operations

Within single HMC domain) operations.

Consolidated Interface Integration of tasks for Key Power Resource Managers

HMC, IVM/VIOS, AIX and i5OS management consoles

Director 6.1 Power Capabilities:

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Comprehensive CLI interface:Discovery/Health/Update/Deployment, LPAR virtualization lifecycle

and mobility, power control and management

Energy Management – Active Energy ManagerMonitoring, reporting, capping (both a server and group), and

controlling power consumption. Receive power status and alerts. Energy Thresholding - Allow a user to set a power or temperature

threshold, and be notified when it is reached (or allow an action to automatically be taken). Full CLI for all key AEM functionality. Support of AEM Server on AIX.

Enterprise Integration and Manageability Out-of-the box management utilizing standard CIM profiles for AIX,

pLinux, i50S, HMC, and VIOS resources

Director 6.1 Power Capabilities:

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High Availability

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High availability solutions for UNIX, i and Linux clientsPowerHA

Cluster management solutions High AvailabilityCan enable near continuous application serviceMinimize impact of planned and unplanned outages

IBM PowerHA™ for AIX® and Linux (formerly HACMP™)IBM PowerHA for i (formerly HASM)

www.ibm.com/systems/power/software/availability

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What is PowerHA?

Business Continuity Solutions for

World wide commerce

Mission-critical applications

Disaster recovery

IBM storage optimization

Integrated optimization for AIX and i

The future with IBM Research & Development

High Availability and Disaster Recovery solutions from IBM for your mission-critical UNIX, i and Linux applications