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HUAWEI SE2900 Session Border Controller V300R002C10
Hardware Description
Issue 01
Date 2016-01-15
HUAWEI TECHNOLOGIES CO., LTD.
Issue 01 (2016-01-15) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd. i
Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.huawei.com
Email: [email protected]
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Contents
1 Service Processing Device ........................................................................................................... 1
1.1 Subrack Datasheet ........................................................................................................................................................ 2
1.2 Subrack Classification and Numbering Rules .............................................................................................................. 5
1.3 F8002 DC Subrack ....................................................................................................................................................... 6
1.3.1 PEM ......................................................................................................................................................................... 12
1.3.2 Fan Tray ................................................................................................................................................................... 15
1.4 F8002 AC Subrack ...................................................................................................................................................... 17
1.4.1 AC PSU .................................................................................................................................................................... 24
1.4.2 Fan Tray ................................................................................................................................................................... 28
1.5 F8002 Subrack System Topology Structure ................................................................................................................ 30
1.5.1 CAN Bus .................................................................................................................................................................. 30
1.5.2 Base Topology Structure .......................................................................................................................................... 31
1.5.3 eFabric Topology Structure ...................................................................................................................................... 32
1.6 F8002 Subrack System Monitoring ............................................................................................................................ 33
1.6.1 Power Module Monitoring ....................................................................................................................................... 33
1.6.2 Fan Tray Monitoring ................................................................................................................................................ 33
1.7 MXU ........................................................................................................................................................................... 34
1.7.1 MXUA0 ................................................................................................................................................................... 34
1.8 SPU ............................................................................................................................................................................. 45
1.8.1 SPUA0 ..................................................................................................................................................................... 45
1.8.2 SPUA1 ..................................................................................................................................................................... 53
1.8.3 SPUZ0 ..................................................................................................................................................................... 61
1.9 VPU ............................................................................................................................................................................ 69
1.9.1 VPUA0 .................................................................................................................................................................... 69
1.9.2 VPUA1 .................................................................................................................................................................... 77
1.10 Filler Panel ................................................................................................................................................................ 85
2 Other Accessories ........................................................................................................................ 87
2.1 Alarm Box ................................................................................................................................................................... 87
2.2 Optical Module ........................................................................................................................................................... 91
2.3 Electrical Module ........................................................................................................................................................ 98
3 Cables .......................................................................................................................................... 101
3.1 Power Cables and PGND Cables .............................................................................................................................. 101
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3.1.1 Power and PGND Cables to a Subrack .................................................................................................................. 101
3.1.2 Power Cables of the Alarm Box............................................................................................................................. 104
3.2 Signaling Cables ....................................................................................................................................................... 105
3.2.1 Ethernet Cable ....................................................................................................................................................... 105
3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable ............................................................................................................ 108
3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable ...................................................................................................... 109
3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable ........................................................................................................... 110
3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable ..................................................................................................... 112
3.2.6 High-Density Cable ............................................................................................................................................... 113
3.2.7 DB9-RJ45 Serial Cable .......................................................................................................................................... 115
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1 Service Processing Device
About This Chapter
1.1 Subrack Datasheet
1.2 Subrack Classification and Numbering Rules
1.3 F8002 DC Subrack
1.4 F8002 AC Subrack
1.5 F8002 Subrack System Topology Structure
1.6 F8002 Subrack System Monitoring
1.7 MXU
1.8 SPU
1.9 VPU
1.10 Filler Panel
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1.1 Subrack Datasheet
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1.2 Subrack Classification and Numbering Rules
Subrack Numbering Rules Each subrack has a unique number.
The subracks in a cabinet are numbered in ascending order from bottom to top. The basic
subrack is the first subrack from the bottom and is numbered 0.
If there are multiple cabinets, the subracks are numbered in ascending order based on the
cabinet numbers.
Figure 1-1 illustrates how subracks are numbered.
Figure 1-1 Subrack numbering rules
Figure 1-1 uses a cabinet configured with more than two subracks as an example. Number subracks
based to the subrack numbering rule depending on the actual situation.
Subrack Slot Numbering Rules
The slots in an subrack are numbered from 1 in ascending order from bottom to top and then
from left to right.
Figure 1-2 illustrates how the slots are numbered in an F8002 subrack.
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Figure 1-2 Slot numbering rules in the F8002 subrack
The slot identifiers are labeled inside the subrack.
1.3 F8002 DC Subrack
Functions
Table 1-1 describes the functions of the F8002 subrack.
Table 1-1 F8002 subrack functions
Function Description
Power supply Two power entry modules (PEMs) are configured in 1+1
redundancy mode. Each PEM supplies DC power to the entire
subrack through the backplane.
Data transmission The F8002 subrack provides data transmission channels.
Heat dissipation Two fan trays are configured to dissipate heat for the subrack.
Subrack identification Each F8002 subrack has a unique number.
If the subrack number is not set, the subrack number indicators are blinking in sequence. For details
about how to set the subrack number, see Hardware-Specific Modifications.
Appearance
Figure 1-3 shows an F8002 subrack.
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Figure 1-3 F8002 subrack (unit: mm)
Each F8002 subrack provides six slots for installing the multi-function switch units (MXUs)
and service boards. Figure 1-4 shows the slot positions of the F8002 subrack.
Figure 1-4 F8002 subrack slot positions
The F8002 subrack provides:
Slots 2 and 5 for MXUs.
Slots 1, 3, 4, and 6 for service boards.
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PEM 1 and PEM 2 for PEMs.
Fan 1 and Fan 2 for fan trays.
Figure 1-5 shows the front view of an F8002 subrack in full configuration.
Figure 1-5 Front view of an F8002 subrack in full configuration
Figure 1-6 shows the rear view of an F8002 subrack.
Figure 1-6 Rear view of an F8002 subrack
Table 1-2 describes the components of the F8002 subrack.
Table 1-2 F8002 subrack components
Component
Quantity
Description
MXU 2 The MXUs implement operation, maintenance, and
management of the system.
Two MXUs are installed in slots 2 and 5 to work in
active/standby mode.
Service
boards
4 The service boards can be installed in slots 1, 3, 4, and 6. The
service boards in any two slots can be configured in
active/standby mode.
PEM 2 Two PEMs are configured in 1+1 redundancy mode. If one
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Component
Quantity
Description
PEM is faulty, the power supply to the subrack is not affected.
Fan tray 2 Two fan trays are configured to draw in cool air from the front
of the subrack and exhaust warm air from the rear of the
subrack. Figure 1-7 shows the air flows.
Ground
point
2 The F8002 subrack provides two ground points.
If the subrack is used in North America, connect both ground
points. If the subrack is used in other regions, only connect one
of the ground points.
Electrostatic
discharge
(ESD) jack
1 The F8002 subrack provides one ESD jack.
Figure 1-7 Heat dissipation in the subrack
Figure 1-8 shows the power supply mode of the F8002 subrack. Each PEM supplies power to
all slots and fan trays in the subrack.
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Figure 1-8 F8002 subrack power supply mode
Logical Structure
Figure 1-9 shows the logical structure of the F8002 subrack.
Figure 1-9 F8002 subrack logical structure
The MXUs implement subrack management and data exchange in the subrack.
The MXUs work in active/standby mode. Only the active MXU executes management
tasks. The MXUs also manage the two fan trays through the RS485 bus and the two
PEMs through the Inter-integrated circuit (I2C) bus.
The service data and signaling data from a service board is forwarded in eFabric
channels to the MXUs through the backplane. The MXUs then forward the data to
another service board.
The management data from a service board is forwarded in Base channels to the MXUs
through the backplane. The MXUs then forward the data to another service board.
The power distribution box (PDB) in the subrack provides two DC power supplies to the
subrack.
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Hardware and Software Compatibility
Table 1-3 lists the boards that can be used in F8002 subracks.
Table 1-3 Types of boards in the F8002 subrack
MXU Type Compatible Service Board Type
Compatibility Rule
MXU SPU
VPU
-
Technical Specifications
Table 1-4 lists the technical specifications of the F8002 subrack.
Table 1-4 F8002 subrack technical specifications
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x
17.40 in. x 26.57 in.)
Weight of an empty
subrack
20.8 kg (45.86 lb)
NOTE
An empty subrack is equipped with two fan trays
and two PEMs.
Weight of a fully loaded
subrack
47.8 kg (105.38 lb)
NOTE
A fully loaded subrack is equipped with two fan
trays, two PEMs, two MXUA0s, and four SPUA0s.
Power
supply
Rated input voltage -48 V DC to -60 V DC
Operating voltage -40 V DC to -72 V DC
Total power inputs Two
Rated input current 60 A/power input
Power rating 2400 W (The rated power of each PEM is
2400 W)
NOTE
The subrack is configured with two PEMs in 1+1
redundancy mode.
Environme
ntal
specificatio
ns
Temperature Long-term operating temperature: 0°C to
45°C (32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C
(-40°F to +158°F)
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Item Specifications
Humidity Long-term operating humidity: 5% RH to
85% RH (non-condensing)
Short-term operating humidity: 5% RH to
95% RH (non-condensing)
Storage humidity: 10% RH to 95% RH
(non-condensing)
Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.3.1 PEM
Functions
Table 1-5 describes the functions of the power entry module (PEM).
Table 1-5 PEM functions
Function Description
Power supply Supplies power to devices in the subrack.
Supports wide input voltage range.
Power
distribution
monitoring
Detects the installation status and type of PEMs.
Provides the indicators on the panel to indicate PEM status.
Detects the voltage and power of the subrack.
Detects the status of the circuit breakers and surge protection circuits.
Detects the PEM temperature.
Reports voltage, current, and power information in real time.
Implements the electronic label function.
Protection Implements surge protection, short circuit protection, and
over-current protection.
Prevents incorrect insertion.
Appearance
Figure 1-10 shows a PEM.
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Figure 1-10 PEM
Figure 1-11 shows the PEM panel.
Figure 1-11 PEM panel
1. STATUS
indicator
2. Power input
terminal RTN(+)
3. Power input terminal
protective cover 4. Handle
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5. Captive
screw
6. Circuit breaker 7. Power input terminal
NEG(-)
8. Circuit breaker
protective cover
The circuit breaker is switched on when it is turned up and is switched off when it is turned down.
Indicators
Table 1-6 describes the STATUS indicator on the PEM panel.
Table 1-6 STATUS indicator on the PEM panel
Silk Screen
Meaning State State Description
STATUS Status
indicator Off There is no power supply.
Green The PEM is operating properly.
Red The power supply is abnormal.
The surge protection circuit is faulty.
The circuit breaker is faulty.
Technical Specifications
Table 1-7 lists the technical specifications of the PEM.
Table 1-7 PEM technical specifications
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x
D)
122.5 mm x 65.0 mm x 122.7 mm (4.82 in. x
2.60 in. x 4.83 in.)
Weight 1.0 kg (2.20 lb)
Input terminal Duplex M6
Voltage
and current
Rated input voltage -48 V DC to -60 V DC
Maximum input voltage -40 V DC to -72 V DC
Total power inputs 1
Rated input current 60 A/power input
PEM voltage drop ≤ 0.5 V
Power rating 2400 W
Environme
ntal
specificatio
Temperature Long-term operating temperature: 0°C to
45°C (32°F to 113°F)
Short-term operating temperature: -5°C to
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Item Specifications
ns +55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F
to +158°F)
Relative humidity ≤ 95% RH
Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.3.2 Fan Tray
Functions
Table 1-8 describes the functions of the fan tray.
Table 1-8 Fan tray functions
Function Description
Heat dissipation The fan trays draw in cool air from the front of the subrack and
exhaust warm air from the rear of the subrack.
Monitoring Fan monitoring boards are configured for fan trays to:
Provide ports for communicating with the switch boards.
Detect and report the fan operating status and speed values.
Control the health indicators on the fan trays.
Support fan blocking status detection and reports fan
alarms.
Support online software upgrades and log uploads.
Monitor and report the fan temperature.
Detect the fan tray installation status.
Speed adjustment The fan speed can be automatically or manually adjusted based
on the ambient temperature, implementing fan speed
adjustment for low-power operating.
Hot swap Online replacement is supported.
Appearance
Figure 1-12 shows a fan tray.
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Figure 1-12 Fan tray
Indicators
There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table
1-9 describes the indicator on the panel.
Table 1-9 Health indicator on the fan tray
Silk Screen Meaning State State Description
None Health indicator Off The fan monitoring
module is not powered on.
Blinking green Blinking at 0.5 Hz: The
fan tray is operating
properly, and the
communication is
normal.
Blinking at 4 Hz: The
fan tray is operating
properly, but the
communication is
abnormal.
Steady orange The fan monitoring
module is powered on, but
the hardware is abnormal.
Blinking red at 0.5
Hz
An alarm is generated.
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Technical Specifications
Table 1-10 lists the technical specifications of the fan tray.
Table 1-10 Technical specifications of a fan tray
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x
D)
124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x
5.16 in. x 4.91 in.)
Weight 1.7 kg (3.75 lb)
Electrical
specificatio
ns
Total power inputs Two power inputs are provided by the backplane
in the subrack.
Maximum power
consumption
140 W
Typical power
consumption
20 W
Environme
ntal
specificatio
ns
Temperature Long-term operating temperature: 0°C to
70°C (32°F to 158°F)
Storage temperature: -40°C to +70°C (-40°F
to +158°F)
Noise 66 dBA
1.4 F8002 AC Subrack
Functions
Table 1-11 describes the functions of the F8002 subrack.
Table 1-11 F8002 subrack functions
Function Description
Power supply Two AC power supply units (PSUs) are configured in 1+1
redundancy mode. Each AC PSU supplies DC power to the
entire subrack through the backplane.
Data transmission The F8002 subrack provides data transmission channels.
Heat dissipation Two fan trays are configured to dissipate heat for the subrack.
Subrack identification Each F8002 subrack has a unique number.
If the subrack number is not set, the subrack number indicators are blinking in sequence. For details
about how to set the subrack number, see Hardware-Specific Modifications.
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Appearance
Figure 1-13 shows an F8002 subrack.
Figure 1-13 F8002 subrack (unit: mm)
Each F8002 subrack provides six front slots and four rear slots. The front slots are installed
with the multi-function switch units (MXUs) and service boards. The rear slots are installed
with AC PSUs and fan modules. Figure 1-14 shows the slot positions.
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Figure 1-14 F8002 subrack slot positions
The F8002 subrack provides:
Slots 2 and 5 for MXUs.
Slots 1, 3, 4, and 6 for service boards.
PSU 1 and PSU 2 for AC PSUs.
Fan 1 and Fan 2 for fan trays.
Figure 1-15 shows the front view of an F8002 subrack in full configuration.
Figure 1-15 Front view of an F8002 subrack in full configuration
Figure 1-16 shows the rear view of an F8002 subrack.
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Figure 1-16 Rear view of an F8002 subrack
Table 1-12 describes the components of the F8002 subrack.
Table 1-12 F8002 subrack components
Component
Quantity
Description
MXU 2 The MXUs implement operation, maintenance, and
management of the system.
Two MXUs are installed in slots 2 and 5 to work in
active/standby mode.
Service
boards
4 The service boards can be installed in slots 1, 3, 4, and 6. The
service boards in any two slots can be configured in
active/standby mode.
AC PSU 2 Two AC PSUs are configured in 1+1 redundancy mode. If one
AC PSU is faulty, the power supply to the subrack is not
affected.
Fan tray 2 Two fan trays are configured to perform heat dissipation for
the components in the subrack. Figure 1-17 shows the air
flows.
Heat dissipation of the subrack: The fans draw in cool air
from the front of the subrack and exhaust warm air from the
rear of the subrack.
Heat dissipation of the PSUs: The fans draw in cool air
from the side panels of the subrack and exhaust warm air
from the rear of the subrack.
Ground
point
2 The F8002 subrack provides two ground points.
If the subrack is used in North America, connect both the
ground points. If the subrack is used in other regions, only
connect one of the ground points.
Electrostatic
discharge
(ESD) jack
1 The F8002 subrack provides one ESD jack.
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Figure 1-17 Heat dissipation in the subrack
Figure 1-18 shows the power supply mode of the F8002 subrack. Each AC PSU supplies
power to all slots and fan trays in the subrack.
Figure 1-18 F8002 subrack power supply mode
Logical Structure
Figure 1-19 shows the logical structure of the F8002 subrack.
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Figure 1-19 F8002 subrack logical structure
The MXUs implement subrack management and data exchange in the subrack.
The MXUs work in active/standby mode. Only the active MXU executes management
tasks. The MXUs also manage the two fan trays through the RS485 bus and the two AC
PSUs through the Inter-integrated circuit (I2C) bus.
The service data and signaling data from a service board is forwarded in eFabric
channels to the MXUs through the backplane. The MXUs then forward the data to
another service board.
The management data from a service board is forwarded in Base channels to the MXUs
through the backplane. The MXUs then forward the data to another service board.
Hardware and Software Compatibility
Table 1-13 lists the boards that can be used in F8002 subracks.
Table 1-13 Types of boards in the F8002 subrack
MXU Type Compatible Service Board Type
Compatibility Rule
MXU SPU
VPU
-
Technical Specifications
Table 1-14 lists the technical specifications of the F8002 subrack.
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Table 1-14 F8002 subrack technical specifications
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x D) 130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x
17.40 in. x 26.57 in.)
Weight of an empty
subrack 20.8 kg (45.86 lb)
NOTE
An empty subrack is equipped with two fan trays
and two AC PSUs.
Weight of a fully loaded
subrack 47.8 kg (105.38 lb)
NOTE
A fully loaded subrack is equipped with two fan
trays, two AC PSUs, two MXUA0s, and four
SPUA0s.
Power
supply
Rated input voltage AC: 200 V to 240 V
High-voltage DC: 240 V
Maximum input voltage AC: 176 V to 264 V
High-voltage DC: 192 V to 288 V
Total power inputs Two
Rated input current 10 A/power input
Power rating 2000 W (The rated power of each AC PSU is
2000 W)
NOTE
The subrack is configured with two AC PSUs in 1+1
redundancy mode.
Environme
ntal
specificatio
ns
Temperature Operating temperature: 0°C to 40°C (32°F
to 104°F)
Storage temperature: -40°C to +70°C
(-40°F to +158°F)
Humidity Long-term operating humidity: 5% RH to
85% RH (non-condensing)
Short-term operating humidity: 5% RH to
95% RH (non-condensing)
Storage humidity: 10% RH to 95% RH
(non-condensing)
Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
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1.4.1 AC PSU
Functions
Table 1-15 describes the functions of the AC power supply unit (PSU).
Table 1-15 AC PSU functions
Function Description
Power supply Supports AC and high-voltage DC power inputs, and converts AC
input power into DC output power.
Supplies DC power to devices in the subrack.
Supports current equalization.
Power
distribution
monitoring
Detects the AC PSU installation status, AC PSU type, and power
input.
Provides indicators on the panel to indicate AC PSU status.
Supports queries on input/output voltage and current.
Supports queries on input power and maximum output power.
Supports queries on the electronic label, temperature, and version of
the AC PSUs.
Detects the fan fault of the AC PSUs.
Protection Supports input under-voltage and over-voltage protection.
Supports input overcurrent and short circuit protection.
Supports output overvoltage protection.
Supports output short circuit current restriction protection.
Supports overheat protection.
Prevents incorrect insertion.
Appearance
Figure 1-20 shows a AC PSU.
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Figure 1-20 AC PSU
Figure 1-21 shows the AC PSU panel.
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Figure 1-21 AC PSU panel
1. STATUS indicator 2. Fan 3. Handle 4. Cable tie holder
5. Power cable clip slot 6. Power input port 7. Captive screw -
Indicators
Table 1-16 describes the STATUS indicator on the AC PSU panel.
Table 1-16 STATUS indicator on the AC PSU panel
Silk Screen
Meaning State State Description
STATUS Status
indicator
Off There is no power supply.
Steady green The AC PSU is operating properly.
Blinking green
at 0.5 Hz
The AC PSU is in hibernation mode and
is supplying no power.
Blinking green
at 4 Hz
The AC PSU software is being loaded.
Steady red The input voltage is not within the
normal range.
The output voltage is not within the
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Silk Screen
Meaning State State Description
normal range.
An output overcurrent or short circuit
fault is occurring.
The AC PSU temperature reaches the
threshold.
A AC PSU fan is faulty
The storage devices are faulty.
Technical Specifications
Table 1-17 lists the technical specifications of the AC PSU.
Table 1-17 AC PSU technical specifications
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x
D)
120.0 mm x 79.0 mm x 122.0 mm (4.72 in. x
3.11 in. x 4.80 in.)
Weight 1.36 kg (3.00 lb)
Voltage
and current
Rated input voltage AC: 200 V to 240 V
High-voltage DC: 240 V
Maximum input voltage AC: 176 V to 264 V
High-voltage DC: 192 V to 288 V
Rated input current 10 A
Operating frequency AC: 50 Hz/60 Hz
Power input One
Power rating 2000 W
Environme
ntal
specificatio
ns
Temperature Operating temperature: 0°C to 40°C (32°F to
104°F)
Storage temperature: -40°C to +85°C (-40°F
to +185°F)
Humidity 5% RH to 95% RH (non-condensing)
Altitude -60 m to +4000 m (-196.85 ft to +13123.20 ft)
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1.4.2 Fan Tray
Functions
Table 1-18 describes the functions of the fan tray.
Table 1-18 Fan tray functions
Function Description
Heat dissipation The fan trays draw in cool air from the front of the subrack and
exhaust warm air from the rear of the subrack.
Monitoring Fan monitoring boards are configured for fan trays to:
Provide ports for communicating with the switch boards.
Detect and report the fan operating status and speed values.
Control the health indicators on the fan trays.
Support fan blocking status detection and reports fan
alarms.
Support online software upgrades and log uploads.
Monitor and report the fan temperature.
Detect the fan tray installation status.
Speed adjustment The fan speed can be automatically or manually adjusted based
on the ambient temperature, implementing fan speed
adjustment for low-power operating.
Hot swap Online replacement is supported.
Appearance
Figure 1-22 shows a fan tray.
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Figure 1-22 Fan tray
Indicators
There is an indicator on the panel of a fan tray, showing the fan tray operating status. Table
1-19 describes the indicator on the panel.
Table 1-19 Health indicator on the fan tray
Silk Screen Meaning State State Description
None Health indicator Off The fan monitoring
module is not powered on.
Blinking green Blinking at 0.5 Hz: The
fan tray is operating
properly, and the
communication is
normal.
Blinking at 4 Hz: The
fan tray is operating
properly, but the
communication is
abnormal.
Steady orange The fan monitoring
module is powered on, but
the hardware is abnormal.
Blinking red at 0.5
Hz
An alarm is generated.
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Technical Specifications
Table 1-20 lists the technical specifications of the fan tray.
Table 1-20 Technical specifications of a fan tray
Item Specifications
Mechanical
specificatio
ns
Dimensions (H x W x
D)
124.5 mm x 131.0 mm x 124.7 mm (4.90 in. x
5.16 in. x 4.91 in.)
Weight 1.7 kg (3.75 lb)
Electrical
specificatio
ns
Total power inputs Two power inputs are provided by the backplane
in the subrack.
Maximum power
consumption
140 W
Typical power
consumption
20 W
Environme
ntal
specificatio
ns
Temperature Long-term operating temperature: 0°C to
70°C (32°F to 158°F)
Storage temperature: -40°C to +70°C (-40°F
to +158°F)
Noise 66 dBA
1.5 F8002 Subrack System Topology Structure
1.5.1 CAN Bus
Functions
The controller area network (CAN) bus performs board power management and transmits
subrack information between the MXUs and service boards. Figure 1-23 shows the CAN bus
connections.
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Figure 1-23 CAN bus connections
Topology
The bus topology is used for CAN bus connections. The CAN bus works as follows:
The MXUs are the management units, and the service boards are the managed units in
the subrack. The management and managed units communicate with each other.
Each board is connected to the CAN bus through two independent channels. If one
channel is unavailable, the other channel is used to ensure uninterrupted communication.
1.5.2 Base Topology Structure
Functions
The Base plane serves as the management and control plane in the subrack. It provides
channels for loading software and transmitting alarms and maintenance information.
Figure 1-24 shows the Base plane connections.
Figure 1-24 Base plane connections
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Topology
The dual-star topology is used for Base plane connections. The Base plane works as follows:
The Base plane connects to each service board slot through the backplane.
The Base plane connects to the MXUs in other subracks through the Base port on the
panel to implement cascading.
The Base channel between the two MXUs enhances communication reliability. Service
processing is not affected if one Base channel becomes unavailable for any service
board.
1.5.3 eFabric Topology Structure
Functions
The enhanced Fabric (eFabric) plane transmits service data in the system.
Figure 1-25 shows the eFabric plane connections.
Figure 1-25 eFabric plane connections
Topology
The dual-star topology is used for eFabric plane connections. The eFabric plane works as
follows:
All service boards are connected to the MXUs through the eFabric plane. The MXUs
exchange the service data for service boards.
The eFabric channel between the two MXUs enhances communication reliability.
Service processing is not affected if one eFabric channel becomes unavailable for any
service board.
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1.6 F8002 Subrack System Monitoring
1.6.1 Power Module Monitoring
The multi-function switch unit (MXU) communicates with the baseboard management
controller (BMC) in the power module over the Inter-Integrated Circuit (I2C) to deliver
monitoring commands and report messages. When detecting an irregular voltage or current,
the BMC in the power module reports an alarm to the MXU. The MXU then forwards the
alarm to the upper-layer network management system (NMS).
Figure 1-26 shows the structure of the power module monitoring system in the F8002
subrack.
Figure 1-26 Structure of the power module monitoring system in the F8002 subrack
The BMCs in power modules communicate with the shelf management modules (SMMs) in
MXUs to implement monitoring of the following information about power modules:
Power module installation status, type and version
Electronic label
Surge protection
Circuit breaker status
Power input
Input/output voltage and current
System power
Temperature
Fan fault of the power modules
1.6.2 Fan Tray Monitoring
The F8002 subrack has built-in fan trays. The fan monitoring module monitors the fan
running status and adjusts the fan speed based on the subrack temperature.
The shelf management modules (SMMs) in the multi-function switch units (MXUs) manage
and monitor the fan trays through the RS485 bus.
Figure 1-27 shows the structure of the fan tray monitoring system in the F8002 subrack.
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Figure 1-27 Structure of the fan tray monitoring system in the F8002 subrack
The fan tray monitoring system carries out the following functions:
Monitors the fan stall state.
Generates temperature alarms.
Queries the fan speed.
Controls the fan speed.
Detects the fan tray installation status.
Detects the fan tray slot numbers.
1.7 MXU
The multi-function switch units (MXUs) exchange service plane data and provide ports for
eFabric interface cascading.
1.7.1 MXUA0
Functions
Table 1-21 describes the functions of the MXUA0.
Table 1-21 Functions
Function Description
Operation and maintenance The general processing card (GPC) on the MXUA0
implements subrack configuration and maintenance,
monitors the system status, and performs performance
measurement.
Supports one Intel® Core™ quad-core I7-3615QE
processor with low power consumption.
Provides two double data rate 3 (DDR3) memory
channels, each for installing one 8 GB unbuffered
dual in-line memory module (UDIMM). The board
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Function Description
offers a maximum memory capacity of 16 GB.
Supports 1333 MHz or 1600 MHz UDIMMs.
Supports error checking and correction (ECC).
Switching and
management
Network
switching
The MXUA0 implements intra-subrack switching and
inter-subrack expansion on the Base plane and eFabric
plane.
The panel provides two external 1GE Base ports and
two 40GE eFabric ports.
The Base plane provides one 1GE channel for each
service slot.
The eFabric plane provides 80 Gbit/s bandwidth for
each service slot.
There are Base and eFabric plane interconnect
channels between MXUA0s.
Device
manageme
nt
The SMM provides the following device management
functions:
Board management
− Detects the board temperature, voltage, and
power, implements power control, manages board
hot swap and reset, and monitors the operating
and health status.
− Supports out-of-band and remote management.
Subrack management
− Performs power supply monitoring, fan
management, and power distribution
management.
− Communicates with the baseboard management
controllers (BMCs) on service boards to manage
and control the service boards.
Storage Supports one 600 GB 2.5-inch SAS disk.
Hot swap The boards are hot-swappable.
Appearance
The MXUA0s are half-width boards and can be installed in front slots 2 and 5 in the F8002
subrack. Figure 1-28 shows an MXUA0.
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Figure 1-28 Appearance (unit: mm)
Figure 1-29 shows the hardware structure of the MXUA0.
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Figure 1-29 Hardware structure
Table 1-22 describes the components of the MXUA0.
Table 1-22 Components
No.
Component
Quantity Description
1 Hard disk 1 One 2.5-inch, 600 GB SAS hard disk is configured before
delivery.
2 Dual
in-line
memory
module
(DIMM)
1 One 8 GB DIMM is used to provide 8 GB memory.
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No.
Component
Quantity Description
3 Cover 1 The metal cover is used to protect the board components
and guide air flows.
Figure 1-30 shows the MXUA0 panel.
Figure 1-30 Panel
1. LAN0 2. LAN1 3. RS232 4. RS485
5. eFabric LAN0 6. eFabric LAN1 7. Subrack number
indicators
8. Base LAN0
9. Base LAN1 10. HLY
indicator
11. ACT indicator 12. Ejector levers
13. OFL
indicator/button
14. DIP button 15. eFabric LAN0/LAN1
indicators
16. HD-ALM
indicator
17. LAN1 LINK
indicator
18. LAN1 ACT
indicator
19. LAN0 LINK
indicator
20. LAN0 ACT
indicator
Interfaces
Figure 1-31 shows the panel ports on the MXUA0. Table 1-23 describes the panel ports.
Figure 1-31 Panel ports
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Table 1-23 Panel port description
Silk Screen Meaning Port Type Standard
LAN0/LAN1 O&M network port RJ45 10/100/1000BASE-
T
RS232 System
commissioning serial
port
RJ45 RS232
RS485 port Power distribution
monitoring serial
port
RJ45 RS485 port
eFabric
LAN0/LAN1
Cascading port for
the eFabric plane
Quad Small
Form-factor
Pluggable Plus
(QSFP+)
40GBASE-SR4
Base LAN0/LAN1 Cascading port of
the Base plane
RJ45 10/100/1000BASE-
T
Indicators
Figure 1-32 shows the indicators and buttons on the MXUA0. Table 1-24 describes the
indicators and buttons.
Figure 1-32 Indicators and buttons
Table 1-24 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY
Health
indicat
or
Off The board is not powered on.
Steady green The board is operating properly.
Blinking red An alarm is generated. The blinking frequency
indicates the alarm severity:
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Silk Screen
Meaning
State State Description
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
ACT
Active/
Standb
y
indicat
or
Off The SMM is in standby mode.
Green The SMM is in active mode.
HD-
ALM
Hard
disk
fault
indicat
or
Off The hard disk is operating properly.
Red The hard disk is faulty.
OFL
Offline
indicat
or
Off The GPC is operating properly.
Blinking blue The GPC is sending a request for power-on or
power-off, or the GPC is being powered on or off.
Steady blue The GPC is powered off. You can remove the board
at the time.
Offline
button -
To power on the GPC, hold down this button for
more than 0.5 seconds.
To safely power off the GPC, hold down this
button for 6 seconds until the OFL indicator is
blinking blue. When the OFL indicator is blinking
blue, the GPC is in the graceful power-off state.
When the OFL indicator is steady blue, the GPC
is powered off.
To forcibly power off the GPC, hold down this
button for 6 seconds when the GPC is in the
graceful power-off state.
DIP
indic
ator/
Subr
ack
numb
er
indic
ators
Button/
Indicat
ors for
setting
a
subrack
number
Off An indicator in the off state stands for the binary digit
0.
Blinking green
at 2 Hz
If indicators L to H are blinking at 2 Hz in sequence,
the indicators are in test mode. The indicators are in
test mode when:
The DIP button is pressed.
The subrack number is not obtained after the
board is powered on or reset.
Blinking green
at 4 Hz
If indicators H to L are blinking at 4 Hz, the subrack
number 0 is being set. After the subrack number is set
to 0, the indicators turn off.
Blinking green
at 1 Hz
If indicators H to L are blinking at 1 Hz, the subrack
number is being set to a number between 1 and 7.
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Silk Screen
Meaning
State State Description
Steady green
An indicator in the on state stands for the binary digit
1.
To set the subrack number, hold down the DIP button
for 6 seconds until the indicators enter the setting
mode, press the DIP button to set the subrack
number, and then hold down the DIP button for 6
seconds to complete the setting.
Binary numbers 000 to 111 indicate subrack numbers
0 to 7 respectively.
NOTE
The subrack number can be set only on the active SMM.
The standby SMM only supports indicator test mode.
If you do not press the DIP button within 30 seconds after
the indicators enter the setting mode, the indicators exit
the setting mode without saving the settings.
Each time you press the DIP button, the subrack number
increases by 1. The subrack number restarts from 0 after
it passes 7.
ACT
Networ
k port
indicat
or
Off The port is not sending or receiving data.
Blinking yellow The port is sending or receiving data.
LIN
K
Networ
k port
indicat
or
Green The link is connected.
Off The link is faulty or disconnected.
eFabr
ic
LAN
0/LA
N1
Indicat
or of
the
cascadi
ng port
of the
eFabric
plane
Off The link is faulty or disconnected.
Steady green The link is connected.
Blinking green The port is sending or receiving data.
Base
LAN
0/LA
N1
Indicat
or of
the
cascadi
ng port
of the
Base
plane
Green off The link is faulty or disconnected.
Steady green The link is connected.
Yellow off The port is not sending or receiving data.
Blinking yellow The port is sending or receiving data.
In the cascading environment, if the MXUA0 GPC in the slave subrack is isolated, the GPC is powered
off, the OFL indicator is off, and the OFL button is unavailable.
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Logical Structure
Figure 1-33 shows the logical structure of the MXUA0.
Figure 1-33 Logical structure
The MXUA0 panel provides the following ports:
Two GE ports
One serial port for system commissioning
One serial port for PDB monitoring
Two ports for eFabric plane cascading
Two ports for Base plane cascading
The GPC implements configuration and maintenance, monitors system status, and collects
performance statistics. It also provides two GE ports for O&M.
The SMM monitors the MXUA0 and the BMCs on service boards, and performs subrack
management.
Fabric LAN implements the eFabric network switching.
Base LAN implements the Base network switching.
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The power module supplies power to the components on the MXUA0.
Hardware and Software Compatibility
Table 1-25 lists hardware and software compatibility of the MXUA0.
Table 1-25 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
MXUA0 MXUA0 Only a board of the same
model can be used to
replace the MXUA0.
You do not need to
manually upgrade software.
Technical Specifications Network switching performance specifications
Table 1-26 lists the network switching performance specifications of the MXUA0.
Table 1-26 Network switching performance specifications
Item Specifications
Description
Number of
Base plane
ports
11 Four GE ports connected to the service boards in the
subrack through the backplane
One GE port connected to the GPC of the MXU
One GE port connected to the GPC of the other MXU in
the subrack through the backplane
One GE port connected to the CPU of the MXU
One GE port connected to the CPU of the other MXU in
the subrack through the backplane
Two GE ports provided on the front panel for Base
plane cascading
One 10GE port for interconnection with the Base plane
of the other MXU, implementing Base plane
redundancy. This port is disabled by default.
Number of
eFabric
plane ports
20 Sixteen 20GE ports connected to the four service boards
in the subrack through the backplane (a maximum of
four 20GE ports for each service board)
Two 40 GE ports connected to the eFabric plane of the
other MXU, implementing eFabric plane redundancy.
Of the two ports, one is reserved for future use and
another is disabled by default.
Two 40GE ports on the front panel for eFabric plane
cascading
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Item Specifications
Description
Port rate GE/10GE
line speed for
the Base
plane
The Base plane supports full line-speed switching.
The cascading ports support 10/100/1000 BASE-T
auto-negotiation.
The service ports support 1000 BASE-X.
The interconnection ports support 10G XAUI.
20GE/40GE
line speed for
the eFabric
plane
The eFabric plane supports full line-speed switching.
The cascading ports support 40G QSFP+.
The service ports support 20G DXAUI.
The interconnection ports support 40G XLG.
Switching
capability
44 Gbit/s for
the Base
plane
Full duplex mode
480 Gbit/s for
the eFabric
plane
Full duplex mode
Number of
MAC
addresses
32768 The ports support automatic learning of MAC addresses.
The MAC address table can contain a maximum of 32,768
MAC addresses.
Number of
VLANs
4094 The VLANs comply with the 802.1Q standard.
Port binding 8 Port binding complies with the 802.3AD standard. A
maximum of eight ports with the same rate can be bound.
Technical Specifications
Table 1-27 lists the technical specifications of the MXUA0.
Table 1-27 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
35.1 mm x 205.0 mm x 531.0 mm (1.38 in. x 8.07
in. x 20.91 in.)
Weight 3.7 kg (8.16 lb)
Electrical
specifications
Maximum
power
consumption
146 W
Typical power
consumption
125 W
Power supply Two redundant -48 V DC inputs (provided by the
backplane)
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Item Specifications
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
Humidity Long-term operating humidity: 5% RH to 85%
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.8 SPU
The service processing units (SPUs) implement service processing and board management.
1.8.1 SPUA0
Functions
Table 1-28 describes functions of the SPUA0.
Table 1-28 Functions
Function Description
Service
processing
Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.
Provides four double data rate 3 (DDR3) memory channels, each for
installing one 16 GB registered dual in-line memory module
(RDIMM). The board offers with the maximum memory capacity of
64 GB.
Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.
Supports error checking and correction (ECC).
Interfacing Provides two 1GE Base ports for communicating with Base planes of
multi-function switch units (MXUs) through the backplane.
Provides two 20GE Fabric ports for communicating with Fabric
planes of MXUs through the backplane.
Provides two 20GE Update interfaces for communicating with the
switching planes through the backplane.
Provides four enhanced small form-factor pluggable (SFP+) ports
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Function Description
and four SFP ports on the panel.
Management Provides an independently powered baseboard management controller
(BMC). The BMC connects to the SMM through the Network Controller
Sideband Interface (NC-SI) bus. The BMC provides the following
functions:
Manages the field replaceable unit (FRU) information, sensor data
records (SDRs), and system event logs (SELs).
Detects the board temperature and voltage, reports alarms, and
controls the power-on, power-off, hot swap, and reset operations of
the board.
Supports serial port redirection.
Loads board software online.
Hot swap The boards are hot-swappable.
Appearance
The SPUA0s are half-width boards and installed in the front service board slots of the subrack.
Figure 1-34 shows an SPUA0.
Figure 1-34 Appearance (unit: mm)
Figure 1-35 shows the hardware structure of the SPUA0.
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Figure 1-35 Hardware structure
Table 1-29 describes the components of the SPUA0.
Table 1-29 Components
No. Component
Quantity Description
1 BMC 1 The BMC, a processing module independent from
the CPU, implements board management and
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No. Component
Quantity Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
2 CPU 1 The board uses one Intel® Xeon® full-power, 8-core
Sandy Bridge-EP CPU.
3 Heat sink 1 The heat sink is used to cool the CPU.
4 Cover 1 The metal cover is used to protect the components
on the board and guide air flows.
5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB
memory.
NOTE
The RDIMMs are installed close to CPU0. The three
RDIMMs are installed in sockets J45, J46, and J7, as
shown in Figure 1-35.
6 Solid-state
drive (SSD)
1 The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
Figure 1-36 shows the board panel.
Figure 1-36 Panel
1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator
5. HLY indicator 6. Ejector levers 7. OFL indicator/button -
Interfaces
Figure 1-37 shows the panel ports on the board. Table 1-30 describes the panel ports.
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Figure 1-37 Panel ports
Table 1-30 Port description
Silkscreen Meaning Type Standard
port 0 10GE or 1GE
optical port or
electrical port
SFP+
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
10G BASE-R
port 1 10GE or 1GE
optical port
port 2 10GE or 1GE
optical port or
electrical port
port 3 10GE or 1GE
optical port
port 4 1GE optical port or
electrical port
SFP
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
1000 BASE-T
port 5 1GE optical port
port 6 1GE optical port or
electrical port
port 7 1GE optical port
Indicators
Figure 1-38 shows the indicators and buttons on the board. Table 1-31 describes the indicators
and buttons.
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Figure 1-38 Indicators and buttons
Table 1-31 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY Health
indicator
Off The board is not powered on.
Steady
green The board is operating properly.
Blinki
ng red
An alarm is generated. The blinking frequency indicates
the alarm severity:
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
UID Location
indicator
Off
The indicator is used to locate a device to be operated.
You can customize the function of this indicator.
Steady
green
Blinki
ng
green
OFL
Offline
indicator
Off The board is operating properly.
Blinki
ng
blue
The board is sending a request for power-on or power-off,
or the board is being powered on or off.
Steady
blue
The board is powered off. You can remove the board at the
time.
Offline
button -
To power on the board, hold down this button for more
than 0.5 seconds.
To safely power off the board, hold down this button
for 6 seconds until the OFL indicator is blinking blue.
When the OFL indicator is blinking blue, the board is
in the graceful power-off state. When the OFL
indicator is steady blue, the board is powered off.
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Silk Screen
Meaning
State State Description
To forcibly power off the board, hold down this button
for 6 seconds when the board is in the graceful
power-off state.
0 to 7
Optical
port
indicator
s
Green
off The link is faulty or disconnected.
Steady
green The link is normal.
Yello
w off The port is not sending or receiving data.
Blinki
ng
yellow
The port is sending or receiving data.
Logical Structure
Figure 1-39 shows the logical structure of the board.
Figure 1-39 Logical structure
The modules of the board provide the following functions:
The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel.
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The processing module forwards service data and implements data encryption and
decryption.
The EF module on the backplane side provides the Update , Base, and Fabric channels to
communicate with the switch modules.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The power module supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-32 lists hardware and software compatibility of the SPUA0.
Table 1-32 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
SPUA0 SPUA0 Only a board of the same
model can be used to
replace the SPUA0.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-33 lists the technical specifications of the SPUA0.
Table 1-33 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight 5.0 kg (11.03 lb)
Electrical
specifications
Maximum
power
consumption
190 W
Typical power
consumption
175 W
Power supply Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
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Item Specifications
Humidity Long-term operating humidity: 5% RH to 85%
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.8.2 SPUA1
Functions
Table 1-34 describes functions of the SPUA1.
Table 1-34 Functions
Function Description
Service
processing
Uses two Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPUs.
Supports two QuickPath Interconnect (QPI) ports, with the
maximum data transmission rate of 8.0 GT/s.
Provides eight double data rate 3 (DDR3) memory channels, each
for installing one 16 GB registered dual in-line memory module
(RDIMM). The board offers with the maximum memory capacity of
128 GB.
Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.
Supports error checking and correction (ECC).
Interfacing Provides two 1GE Base ports for communicating with Base planes
of multi-function switch units (MXUs) through the backplane.
Provides two 20GE Fabric ports for communicating with Fabric
planes of MXUs through the backplane.
Provides two 20GE Update ports to the backplane for
communicating with the switching planes.
Provides four enhanced small form-factor pluggable (SFP+) ports
and four SFP ports on the panel.
Management Provides an independently powered baseboard management controller
(BMC). The BMC connects to the SMM through the Network
Controller Sideband Interface (NC-SI) bus. The BMC provides the
following functions:
Manages the field replaceable unit (FRU) information, sensor data
records (SDRs), and system event logs (SELs).
Detects the board temperature and voltage, reports alarms, and
controls the power-on, power-off, hot swap, and reset operations of
the board.
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Function Description
Supports serial port redirection.
Loads board software online.
Hot swap The boards are hot-swappable.
Appearance
The SPUA1s are half-width boards and installed in the front service board slots of the subrack.
Figure 1-40 shows an SPUA1.
Figure 1-40 Appearance (unit: mm)
Figure 1-41 shows the hardware structure of the SPUA1.
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Figure 1-41 Hardware structure
Table 1-35 describes the components of the SPUA1.
Table 1-35 Components
No. Component
Quantity Description
1 BMC 1 The BMC, a processing module independent from
the CPUs, implements board management and
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No. Component
Quantity Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
2 Encryption
and
decryption
daughter
board
1 This board performs data encryption and
decryption.
3 CPU 2 Intel ® Xeon® full-power, 8-core Sandy Bridge-EP
CPU
4 Heat sink 1 The heat sink is used to cool CPUs. Two CPUs
share one heat sink.
5 Cover 1 The metal cover is used to protect the components
on the board and guide air flows.
6 RDIMM 6 Six 16 GB RDIMMs are used to provide 96 GB
memory.
NOTE
The RDIMMs are installed close to the CPUs. The six
RDIMMs are installed in sockets J45, J46, J47, J48, J7
and J8, as shown in Figure 1-41.
7 Solid-state
drive (SSD)
1 The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
Figure 1-42 shows the board panel.
Figure 1-42 Panel
1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator
5. HLY indicator 6. Ejector levers 7. OFL indicator/button -
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Interfaces
Figure 1-43 shows the panel ports on the board. Table 1-36 describes the panel ports.
Figure 1-43 Panel ports
Table 1-36 Port description
Silkscreen Meaning Type Standard
port 0 10GE or 1GE
optical port or
electrical port
SFP+
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
10G BASE-R
port 1 10GE or 1GE
optical port
port 2 10GE or 1GE
optical port or
electrical port
port 3 10GE or 1GE
optical port
port 4 1GE optical port or
electrical port
SFP
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
1000 BASE-T
port 5 1GE optical port
port 6 1GE optical port or
electrical port
port 7 1GE optical port
Indicators
Figure 1-44 shows the indicators and buttons on the board. Table 1-37 describes the indicators
and buttons.
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Figure 1-44 Indicators and buttons
Table 1-37 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY Health
indicator
Off The board is not powered on.
Steady
green The board is operating properly.
Blinki
ng red
An alarm is generated. The blinking frequency indicates
the alarm severity:
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
UID Location
indicator
Off
The indicator is used to locate a device to be operated.
You can customize the function of this indicator.
Steady
green
Blinki
ng
green
OFL
Offline
indicator
Off The board is operating properly.
Blinki
ng
blue
The board is sending a request for power-on or power-off,
or the board is being powered on or off.
Steady
blue
The board is powered off. You can remove the board at the
time.
Offline
button -
To power on the board, hold down this button for more
than 0.5 seconds.
To safely power off the board, hold down this button
for 6 seconds until the OFL indicator is blinking blue.
When the OFL indicator is blinking blue, the board is
in the graceful power-off state. When the OFL
indicator is steady blue, the board is powered off.
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Silk Screen
Meaning
State State Description
To forcibly power off the board, hold down this button
for 6 seconds when the board is in the graceful
power-off state.
0 to 7
Optical
port
indicator
s
Green
off The link is faulty or disconnected.
Steady
green The link is normal.
Yello
w off The port is not sending or receiving data.
Blinki
ng
yellow
The port is sending or receiving data.
Logical Structure
Figure 1-45 shows the logical structure of the board.
Figure 1-45 Logical structure
The modules of the board provide the following functions:
The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel.
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The processing module forwards service data and implements data encryption and
decryption.
The EF module on the backplane side provides the Update , Base, and Fabric channels to
communicate with the switch modules.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The power module supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-38 lists hardware and software compatibility of the SPUA1.
Table 1-38 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
SPUA1 SPUA1 Only a board of the same
model can be used to
replace the SPUA1.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-39 lists the technical specifications of the SPUA1.
Table 1-39 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight 5.0 kg (11.03 lb)
Electrical
specifications
Maximum
power
275 W
Typical power 240 W
Power supply Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
Humidity Long-term operating humidity: 5% RH to 85%
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Item Specifications
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.8.3 SPUZ0
Functions
Table 1-40 describes functions of the SPUZ0.
Table 1-40 Functions
Function Description
Service
processing
Uses one Intel® Xeon® full-power, 8-core Sandy Bridge-EP CPU.
Provides four double data rate 3 (DDR3) memory channels, each for
installing one 16 GB registered dual in-line memory module
(RDIMM). The board offers with the maximum memory capacity of
64 GB.
Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.
Supports error checking and correction (ECC).
Interfacing Provides two 1GE Base ports for communicating with Base planes of
multi-function switch units (MXUs) through the backplane.
Provides two 20GE Fabric ports for communicating with Fabric
planes of MXUs through the backplane.
Provides two 20GE Update interfaces for communicating with the
switching planes through the backplane.
Provides four enhanced small form-factor pluggable (SFP+) ports
and four SFP ports on the panel.
Management Provides an independently powered baseboard management controller
(BMC). The BMC connects to the SMM through the Network Controller
Sideband Interface (NC-SI) bus. The BMC provides the following
functions:
Manages the field replaceable unit (FRU) information, sensor data
records (SDRs), and system event logs (SELs).
Detects the board temperature and voltage, reports alarms, and
controls the power-on, power-off, hot swap, and reset operations of
the board.
Supports serial port redirection.
Loads board software online.
Hot swap The boards are hot-swappable.
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Appearance
The SPUZ0s are half-width boards and installed in the front service board slots of the subrack.
Figure 1-46 shows an SPUZ0.
Figure 1-46 Appearance (unit: mm)
Figure 1-47 shows the hardware structure of the SPUZ0.
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Figure 1-47 Hardware structure
Table 1-41 describes the components of the SPUZ0.
Table 1-41 Components
No. Component
Quantity Description
1 BMC 1 The BMC, a processing module independent from
the CPU, implements board management and
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No. Component
Quantity Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
2 CPU 1 The board uses one Intel® Xeon® full-power, 8-core
Sandy Bridge-EP CPU.
3 Heat sink 1 The heat sink is used to cool the CPU.
4 Cover 1 The metal cover is used to protect the components
on the board and guide air flows.
5 RDIMM 3 Three 16 GB RDIMMs are used to provide 48 GB
memory.
NOTE
The RDIMMs are installed close to CPU0. The three
RDIMMs are installed in sockets J45, J46, and J7, as
shown in Figure 1-47.
6 Solid-state
drive (SSD)
1 The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
Figure 1-48 shows the board panel.
Figure 1-48 Panel
1. SFP+ ports 2. Optical port indicators 3. SFP ports 4. UID indicator
5. HLY indicator 6. Ejector levers 7. OFL indicator/button -
Interfaces
Figure 1-49 shows the panel ports on the board. Table 1-42 describes the panel ports.
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Figure 1-49 Panel ports
Table 1-42 Port description
Silkscreen Meaning Type Standard
port 0 10GE or 1GE
optical port or
electrical port
SFP+
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
10G BASE-R
port 1 10GE or 1GE
optical port
port 2 10GE or 1GE
optical port or
electrical port
port 3 10GE or 1GE
optical port
port 4 1GE optical port or
electrical port
SFP
NOTE
The ports can be set
to the
auto-negotiation or
forced mode.
1000 BASE-T
port 5 1GE optical port
port 6 1GE optical port or
electrical port
port 7 1GE optical port
Indicators
Figure 1-50 shows the indicators and buttons on the board. Table 1-43 describes the indicators
and buttons.
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Figure 1-50 Indicators and buttons
Table 1-43 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY Health
indicator
Off The board is not powered on.
Steady
green The board is operating properly.
Blinki
ng red
An alarm is generated. The blinking frequency indicates
the alarm severity:
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
UID Location
indicator
Off
The indicator is used to locate a device to be operated.
You can customize the function of this indicator.
Steady
green
Blinki
ng
green
OFL
Offline
indicator
Off The board is operating properly.
Blinki
ng
blue
The board is sending a request for power-on or power-off,
or the board is being powered on or off.
Steady
blue
The board is powered off. You can remove the board at the
time.
Offline
button -
To power on the board, hold down this button for more
than 0.5 seconds.
To safely power off the board, hold down this button
for 6 seconds until the OFL indicator is blinking blue.
When the OFL indicator is blinking blue, the board is
in the graceful power-off state. When the OFL
indicator is steady blue, the board is powered off.
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Silk Screen
Meaning
State State Description
To forcibly power off the board, hold down this button
for 6 seconds when the board is in the graceful
power-off state.
0 to 7
Optical
port
indicator
s
Green
off The link is faulty or disconnected.
Steady
green The link is normal.
Yello
w off The port is not sending or receiving data.
Blinki
ng
yellow
The port is sending or receiving data.
Logical Structure
Figure 1-51 shows the logical structure of the SPUZ0.
Figure 1-51 Logical structure
The modules of the board provide the following functions:
The expedited forwarding (EF) module on the access side provides four SFP+ and four SFP ports on the panel.
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The processing module forwards service data and implements data encryption and
decryption.
The EF module on the backplane side provides the Update , Base, and Fabric channels to
communicate with the switch modules.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The power module supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-44 lists hardware and software compatibility of the SPUZ0.
Table 1-44 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
SPUZ0 SPUZ0 Only a board of the same
model can be used to
replace the SPUZ0 board.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-45 lists the technical specifications of the SPUZ0.
Table 1-45 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight 5.0 kg (11.03 lb)
Electrical
specifications
Maximum
power
consumption
190 W
Typical power
consumption
175 W
Power supply Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
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Item Specifications
Humidity Long-term operating humidity: 5% RH to 85%
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
1.9 VPU
The voice and video process unit (VPU) processes media data, including voice and video
data.
1.9.1 VPUA0
Functions
Table 1-46 describes the functions of the VPUA0.
Table 1-46 Functions
Function Description
Processing
function
Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.
Provides two double data rate 3 (DDR3) memory channels, each for
installing one 16 GB registered dual in-line memory module
(RDIMM). The board offers The maximum memory capacity is 32
GB.
Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.
Supports error checking and correction (ECC).
Ports Provides two 1GE Base ports for communicating with Base planes of
multi-function switch units (MXUs) through the backplane.
Provides two 20GE Fabric ports for communicating with Fabric
planes of MXUs through the backplane.
Provides two 10GE enhanced small form-factor pluggable (SFP+)
optical ports and two GE SFP optical or electrical ports. These four
ports are reserved.
Management
function
Provides an independently powered baseboard management controller
(BMC). The BMC connects to the SMM through the Network Controller
Sideband Interface (NC-SI) bus. The BMC provides the following
functions:
Manages the field replaceable unit (FRU) information, sensor data
records (SDRs), and system event logs (SELs).
Detects the board temperature and voltage, reports alarms, and
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Function Description
controls the power-on, power-off, hot swap, and reset operations of
the board.
Supports serial port redirection.
Loads board software online.
Provides a loading interface for board testing.
Hot swap The boards are hot-swappable.
Appearance
The VPUA0s are half-width boards and installed in the front service board slots of the
subrack. Figure 1-52 shows a VPUA0.
Figure 1-52 Appearance (unit: mm)
Figure 1-53 shows the hardware structure of the VPUA0.
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Figure 1-53 Hardware structure
Table 1-47 describes the components of the VPUA0.
Table 1-47 Components
No. Component
Quantity Description
1 Solid-state
drive (SSD)
1 The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
2 Baseboard
managemen
t controller
(BMC)
1 The BMC, a processing module independent of the
CPU, implements board management and provides
interfaces and buses, such as system interfaces,
General Purpose Input/Output (GPIO), serial ports,
and Inter-Integrated Circuit (I2C) bus.
3 CPU 1 The board uses one Intel® Xeon® full-power, 6-core
Ivy Bridge-EN CPU.
4 Heat sink 1 The heat sink is used to cool the CPU.
5 Cover 1 The metal cover is used to protect the components
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No. Component
Quantity Description
on the board and guide air flows.
6 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB
memory.
7 Digital
signal
processing
(DSP)
daughter
board
1 The DSP daughter board processes voice and video
data.
Figure 1-54 shows the board panel.
Figure 1-54 Panel
1. SFP+ optical port 2. Optical port indicators 3. SFP port
4. UID indicator 5. HLY indicator 6. Ejector levers
7. OFL indicator/button 8. SFP port 9. SFP+ optical port
Interfaces
Figure 1-55 shows the panel ports on the board. Table 1-48 describes the panel ports.
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Figure 1-55 Panel ports
Table 1-48 Panel port description
Silk Screen Meaning Port Type Standard
PORT (0 and 1) 10GE media port SFP+ 10G BASE-R
PORT (2 and 3) 1GE
signaling/Network
File Server (NFS)
interface
SFP 1000 BASE-X
Indicators
Figure 1-56 shows the indicators and buttons on the board. Table 1-49 describes the indicators
and buttons.
Figure 1-56 Indicators and buttons
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Table 1-49 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY Health
indicator
Off The board is not powered on.
Steady
green The board is operating properly.
Blinki
ng red
An alarm is generated. The blinking frequency indicates
the alarm severity:
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
UID Location
indicator
Off
The indicator is used to locate a device to be operated.
You can customize the function of this indicator.
Steady
green
Blinki
ng
green
OFL
Offline
indicator
Off The board is operating properly.
Blinki
ng
blue
The board is sending a request for power-on or power-off,
or the board is being powered on or off.
Steady
blue
The board is powered off. The board can be removed at
the time.
Offline
button -
To power off the board, hold down this button for 6
seconds until the indicator is blinking blue. When the
OFL indicator is blinking blue, the board is in the
graceful power-off state. When the OFL indicator is
steady blue, the board is powered off.
To forcibly power off the board, hold down this button
for 6 seconds when the board is in the graceful
power-off state.
To power on the board, hold down this button for more
than 0.5 seconds.
0 to 3
Optical
port
indicator
s
Off The link is disconnected or faulty.
Steady
green The link is connected.
Off The port is not sending or receiving data.
Blinki
ng
yellow
The port is sending or receiving data.
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Logical Structure
Figure 1-57 shows the logical structure of the board.
Figure 1-57 Logical structure
The modules of the board provide the following functions:
The service interface converter implements conversion between optical data service
interfaces and media data service interfaces or data service interfaces on the backplane.
The configuration and control planes configure conversion module chips on the service
interface and exchange control plane information with the switch modules.
The DSP daughter board processes the media data, such as the voice and video data.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The power module supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-50 lists hardware and software compatibility of the VPUA0.
Table 1-50 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
VPUA0 VPUA0 Only a board of the same
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Board Model Spare Parts Model Compatibility Rule
model can be used to
replace the VPUA0.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-51 lists the technical specifications of the VPUA0.
Table 1-51 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight 4.0 kg (8.82 lb)
Electrical
specifications
Maximum
power
consumption
200 W
Typical power
consumption
185 W
Power supply Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
Humidity Long-term operating humidity: 5% RH to 85%
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
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1.9.2 VPUA1
Functions
Table 1-52 describes the functions of the VPUA1.
Table 1-52 Functions
Function Description
Processing
function
Uses one Intel ® Xeon ® full-power, 6-core Ivy Bridge-EN CPU.
Provides two double data rate 3 (DDR3) memory channels, each for
installing one 16 GB registered dual in-line memory module
(RDIMM). The board offers The maximum memory capacity is 32
GB.
Supports 800 MHz, 1066 MHz, and 1333 MHz RDIMMs.
Supports error checking and correction (ECC).
Ports Provides two 1GE Base ports for communicating with Base planes of
multi-function switch units (MXUs) through the backplane.
Provides two 20GE Fabric ports for communicating with Fabric
planes of MXUs through the backplane.
Provides two 10GE enhanced small form-factor pluggable (SFP+)
optical ports and two GE SFP optical or electrical ports. These four
ports are reserved.
Management
function
Provides an independently powered baseboard management controller
(BMC). The BMC connects to the SMM through the Network Controller
Sideband Interface (NC-SI) bus. The BMC provides the following
functions:
Manages the field replaceable unit (FRU) information, sensor data
records (SDRs), and system event logs (SELs).
Detects the board temperature and voltage, reports alarms, and
controls the power-on, power-off, hot swap, and reset operations of
the board.
Supports serial port redirection.
Loads board software online.
Provides a loading interface for board testing.
Hot swap The boards are hot-swappable.
Appearance
The VPUA1s are half-width boards and installed in the front service board slots of the
subrack. Figure 1-58 shows a VPUA1 board.
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Figure 1-58 Appearance (unit: mm)
Figure 1-59 shows the hardware structure of the VPUA1.
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Figure 1-59 Hardware structure
Table 1-53 describes the components of the VPUA1.
Table 1-53 Components
No. Component
Quantity Description
1 Digital
signal
processing
(DSP)
daughter
board
2 The DSP daughter board processes voice and video
data.
2 Solid-state
drive (SSD)
1 The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
3 BMC 1 The BMC, a processing module independent of the
CPU, implements board management and provides
interfaces and buses, such as system interfaces,
General Purpose Input/Output (GPIO), serial ports, and Inter-Integrated Circuit (I2C) bus.
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No. Component
Quantity Description
4 CPU 1 The board uses one Intel® Xeon® full-power, 6-core
Ivy Bridge-EN CPU.
5 Heat sink 1 The heat sink is used to cool the CPU.
6 Cover 1 The metal cover is used to protect the components
on the board and guide air flows.
7 Memory 2 Two 16 GB RDIMMs are used to provide 32 GB
memory.
Figure 1-60 shows the board panel.
Figure 1-60 Panel
1. SFP+ optical port 2. Optical port indicators 3. SFP port
4. UID indicator 5. HLY indicator 6. Ejector levers
7. OFL indicator/button 8. SFP port 9. SFP+ optical port
Interfaces
Figure 1-61 shows the panel ports on the board. Table 1-54 describes the panel ports.
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Figure 1-61 Panel ports
Table 1-54 Panel port description
Silk Screen Meaning Port Type Standard
PORT (0 and 1) 10GE media port SFP+ 10G BASE-R
PORT (2 and 3) 1GE
signaling/Network
File Server (NFS)
interface
SFP 1000 BASE-X
Indicators
Figure 1-62 shows the indicators and buttons on the board. Table 1-55 describes the indicators
and buttons.
Figure 1-62 Indicators and buttons
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Table 1-55 Description of indicators and buttons
Silk Screen
Meaning
State State Description
HLY Health
indicator
Off The board is not powered on.
Steady
green The board is operating properly.
Blinki
ng red
An alarm is generated. The blinking frequency indicates
the alarm severity:
Blinking at 0.5 Hz: indicates a minor alarm.
Blinking at 1 Hz: indicates a major alarm.
Blinking at 4 Hz: indicates a critical alarm.
UID Location
indicator
Off
The indicator is used to locate a device to be operated.
You can customize the function of this indicator.
Steady
green
Blinki
ng
green
OFL
Offline
indicator
Off The board is operating properly.
Blinki
ng
blue
The board is sending a request for power-on or power-off,
or the board is being powered on or off.
Steady
blue
The board is powered off. The board can be removed at
the time.
Offline
button -
To power off the board, hold down this button for 6
seconds until the indicator is blinking blue. When the
OFL indicator is blinking blue, the board is in the
graceful power-off state. When the OFL indicator is
steady blue, the board is powered off.
To forcibly power off the board, hold down this button
for 6 seconds when the board is in the graceful
power-off state.
To power on the board, hold down this button for more
than 0.5 seconds.
0 to 3
Optical
port
indicator
s
Off The link is disconnected or faulty.
Steady
green The link is connected.
Off The port is not sending or receiving data.
Blinki
ng
yellow
The port is sending or receiving data.
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Logical Structure
Figure 1-63 shows the logical structure of the board.
Figure 1-63 Logical structure
The modules of the board provide the following functions:
The service interface converter implements conversion between optical data service
interfaces and media data service interfaces or data service interfaces on the backplane.
The configuration and control planes configure conversion module chips on the service
interface and exchange control plane information with the switch modules.
The two DSP daughter boards process the media data, such as the voice and video data.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The PSU supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-56 lists hardware and software compatibility of the VPUA1.
Table 1-56 Hardware and software compatibility
Board Model Spare Parts Model Compatibility Rule
VPUA1 VPUA1 Only a board of the same
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Board Model Spare Parts Model Compatibility Rule
model can be used to
replace the VPUA1.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-57 lists the technical specifications of the VPUA1.
Table 1-57 Technical specifications
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight 5.5 kg (12.13 lb)
Electrical
specifications
Maximum
power
consumption
310 W
Typical power
consumption
290 W
Power supply Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
Storage temperature: -40°C to +70°C (-40°F to
+158°F)
Temperature change rate: 15°C/h (27°F/h)
Humidity Long-term operating humidity: 5% RH to 85%
RH (non-condensing)
Short-term operating humidity: 5% RH to 95%
RH (non-condensing)
Short term means that the consecutive working period is not more than 96 hours and that the cumulative
working period over a year is not more than 15 days.
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1.10 Filler Panel
Functions
Filler panels are installed in vacant slots to prevent dust and air from entering the subrack.
Appearance
Filler panels can be classified into:
Filler panels for half-width service boards
Figure 1-64 shows a filler panel installed in the vacant slot for a half-width service
board.
Figure 1-64 Filler panel for a half-width service board (unit: mm)
Interfaces
Filler panels provide no port.
Indicators
There is no indicator on filler panels.
Technical Specifications
Table 1-58 lists the technical specifications of filler panels for half-width service boards.
Table 1-58 Technical specifications of filler panels for half-width service boards
Item Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 215.0 mm x 120.0 mm (1.78 in. x 8.46
in. x 4.72 in.)
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Item Specifications
Weight 0.6 kg (1.32 lb)
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2 Other Accessories
About This Chapter
2.1 Alarm Box
2.2 Optical Module
2.3 Electrical Module
2.1 Alarm Box
Functions
The alarm box is used to receive alarm information and provide audio and visual alarms.
The universal alarm box adopts a box structure. It features advanced technology, appropriate
layout, and high operability, serviceability, and security. The alarm box is generally mounted
on the wall in the maintenance and monitoring room.
Exterior
The front panel of the alarm box provides the following components: alarm sound indicator,
alarm severity indicator, serial interface communication status indicator, speaker, alarm
confirm button, alarm sound turnoff button, and alarm sound turnoff indicator. Figure 2-1
shows the front panel of the alarm box.
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Figure 2-1 Front panel of the alarm box
1. Critical alarm indicator 2. Major alarm indicator 3. Minor alarm indicator
4. Warning alarm indicator 5. Speaker 6. Alarm confirm button
7. Serial communication status
indicator
8. Alarm sound turnoff
button
9. Alarm sound turnoff
indicator
Interfaces
The side panel of the alarm box provides the following components: AC power connector,
power switch, remote speaker interface, indicator test button, and lock. Figure 2-2 shows the
side panel of the alarm box.
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Figure 2-2 Side panel of the alarm box
1. Lock 2. Indicator test button 3. Remote speaker interface
4. Power switch 5. AC power socket 6. Communication interface
7. -48 V power input interface - -
Indicators
You can use the indicator test button to test all the indicators. On pressing the button, all the
indicators, such as the alarm indicators, alarm sound indicators, and serial interface
communication indicator, are turned on. To turn off the indicators, press the button again.
Except the critical alarm, the alarm sound of the major, minor, and warning alarms cannot be
turned on or off by using the alarm sound turnoff button. There are four alarm sound turnoff
indicators on the alarm box. They are EMERGENCY, IMPORTANT, ORDINARY,
PROMPTING, corresponding to the critical alarm, major alarm, minor alarm, and warning
alarm respectively.
The status of the alarm indicator is as follows:
If an indicator is on, it indicates that the alarm sound of the corresponding severity is
turned off. The alarm box does not generate alarm sound if an alarm of the
corresponding severity is reported.
If an indicator is off, it indicates that the alarm sound of the corresponding severity is
turned on. The alarm box generates alarm sound if an alarm of the corresponding
severity is reported.
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As the alarm sound of the critical alarm cannot be turned off, the critical alarm indicator is always off.
You can turn off the alarm sound for the alarms of different levels by pressing the alarm sound
turnoff button. This function, however, does not affect the state of the alarm severity indicator.
Table 2-1 describes the methods used to stop the alarm sound.
Table 2-1 Methods used to stop the alarm sound
State of the Alarm Sound Turnoff Indicator
Pressing the Alarm Sound Turnoff Button
Alarm Sound
The four indicators are
always off.
No operation is required. The alarm sound is enabled
for all alarms.
The alarm sound turnoff
indicator for the warning
alarm is on and other
indicators are off.
Press the alarm sound
turnoff button once.
The alarm sound for the
warning alarms is disabled.
The alarm sound turnoff
indicators for the warning
alarm and minor alarms are
on and other indicators are
off.
Press the alarm sound
turnoff button twice.
The alarm sound for the
warning and minor alarms is
disabled.
The alarm sound turnoff
indicators for the warning,
minor, major alarms are on
and that for the critical
alarm is off.
Press the alarm sound
turnoff button for three
consecutive times.
The alarm sound for the
warning, minor, and major
alarms is disabled.
The four indicators are
always off.
Press the alarm sound
turnoff button for four
consecutive times.
The alarm sound for all
alarms is enabled.
Technical Specifications
Table 2-2 lists the technical specifications of the alarm box.
Table 2-2 Technical specifications of the alarm box
Category
Item Specifications
Mechanic
al
specificat
ions
Dimensions (W x H x D) 412 mm x 282 mm x 90 mm (16.22 in. x 11.10
in. x 3.54 in.)
Weight 2.0 kg (4.41 lb)
Environ
mental
paramete
rs
Working environment Indoor
Temperature 0°C to 45°C (32°F to 113°F)
Relative humidity 10% RH to 95% RH
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Category
Item Specifications
System
configura
tion
paramete
rs
Power supply DC: -48 V to -60 V/0.5 A
AC: 100 V/50 Hz/0.3 A to 240 V/50 Hz/0.3 A
RS422 communication
distance
100 m (328.08 ft)
RS232 communication
distance 80 m (262.46 ft)
Maximum number of
communication interfaces
5
Maximum remote alarm
confirm distance
30 m (98.42 ft)
Maximum distance of the
remote speaker (1W active
speaker)
30 m (98.42 ft)
2.2 Optical Module
Functions
An optical module provides optical-to-electrical and electrical-to-optical conversion functions.
It is connected to an optical fiber to transmit signals.
Appearance
Optical modules can be classified into the following types by encapsulation type: small
form-factor pluggable (SFP), enhanced SFP (eSFP), small form-factor pluggable plus (SFP+),
10-GB small form-factor pluggable transceiver (XFP), and quad small form-factor pluggable
plus (QSFP+). The optical module appearance varies according to the encapsulation type.
Figure 2-3 shows an SFP/SFP+ optical module. Figure 2-4 shows a QSFP+ optical module.
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Figure 2-3 SFP/SFP+ optical module
Figure 2-4 QSFP+ optical module
Figure 2-5 shows the structure of an optical module.
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Figure 2-5 Optical module structure
1. Dust-proof cap 2. Transmit port 3. Spring
4. Label 5. Connector 6. Shell
7. Receive port 8. Handle -
Optical modules of the same encapsulation type may differ in the transmission rate,
transmission distance, and operating wavelength.
The transmission rate can be 1.25 Gbit/s, 10.3125 Gbit/s, or 41.25 Gbit/s.
The operating wavelength can be 850 nm, 1310 nm, or 1550 nm.
The transmission distance can be 550 m, 15 km, 40 km, 80 km, or 120 km.
The transmission distance of an optical module depends on the operating wavelength. Table
2-3 lists the mapping between the operating wavelength and the transmission distance.
Table 2-3 Mapping between the operating wavelength and the transmission distance
Operating Wavelength Transmission Distance
850 nm ≤ 500 m
1310 nm ≤ 40 km
1550 nm > 40 km or even to 120 km without any
relay
The label on an optical module specifies its transmission rate, operating wavelength,
transmission distance, transmission mode, and encapsulation type. Figure 2-6 shows the label
on an optical module.
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Figure 2-6 Label on an optical module
Technical Specifications
Table 2-4 shows the technical specifications of optical modules.
Table 2-4 Technical specifications of optical modules
Model Transmission Rate (Gbit/s)
Transmission Distance (km)
Transmission Mode
Optical Fiber Type
Optical Port Parameters
Encapsulation Type
Operating Temperature
OMXD3
0008
41.25 ≤ 0.15 Multimo
de
Optica
l
conne
ctor
type:
MPO
Optica
l fiber
type:
multi
mode
Operating
wavelength
: 850 nm
Transmit
optical
power:
–7.3 dBm
to –1.0
dBm
Extinction
ratio: ≥ 3.0
dB
Receiver
sensitivity:
≤ -9.5 dBm
Overload
optical
power: 2.4
dBm
QS
FP+
0°C–70°C
(32°F–15
8°F)
eSFP-85
0nm-100
2.125
(multira≤ 0.50 Multimo
de
Optica
l
Operating
wavelength
eSF
P
–20°C to
+85°C
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Model Transmission Rate (Gbit/s)
Transmission Distance (km)
Transmission Mode
Optical Fiber Type
Optical Port Parameters
Encapsulation Type
Operating Temperature
0Base-S
x/FC200
MM
te) conne
ctor
type:
LC
Optica
l fiber
type:
multi
mode
: 850 nm
Transmit
optical
power:
–9.5 dBm
to –2.5
dBm
Extinction
ratio: ≥ 9.0
dB
Receiver
sensitivity:
≤ -17.0
dBm
Overload
optical
power: 0
dBm
(–4°F to
+185°F)
eSFP-13
10nm-10
00Base-
Lx SM
1.25 ≤
10.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
single
-mode
Operating
wavelength
: 1310 nm
Transmit
optical
power:
–9.0 dBm
to –3.0
dBm
Extinction
ratio: ≥ 9.0
dB
Receiver
sensitivity:
≤ -20.0
dBm
Overload
optical
power: -3.0
dBm
eSF
P
0°C–70°C
(32°F–15
8°F)
eSFP-13
10nm-10
00Base-
Vx
1.25 ≤
40.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Operating
wavelength
: 1310 nm
Transmit
optical power:
eSF
P
0°C–70°C
(32°F–15
8°F)
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Model Transmission Rate (Gbit/s)
Transmission Distance (km)
Transmission Mode
Optical Fiber Type
Optical Port Parameters
Encapsulation Type
Operating Temperature
Optica
l fiber
type:
single
-mode
–5.0 dBm
to 0 dBm
Extinction
ratio: ≥ 9.0
dB
Receiver
sensitivity:
≤ -23.0
dBm
Overload
optical
power: -3.0
dBm
eSFP-15
50nm-10
00Base-
Zx/FC10
0
1.25 ≤
80.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
single
-mode
Operating
wavelength
: 1550 nm
Transmit
optical
power:
–2.0 dBm
to +5.0
dBm
Extinction
ratio: ≥ 9.0
dB
Receiver
sensitivity:
≤ -23.0
dBm
Overload
optical
power: -3.0
dBm
eSF
P
0°C–70°C
(32°F–15
8°F)
OMXD3
0001
10.00 ≤ 0.30 Multimo
de
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
multi
mode
Operating
wavelength
: 850 nm
Transmit
optical
power:
–7.3 dBm
to –1.0
dBm
Extinction ratio: ≥ 3.0
SFP
+
0°C–70°C
(32°F–15
8°F)
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Model Transmission Rate (Gbit/s)
Transmission Distance (km)
Transmission Mode
Optical Fiber Type
Optical Port Parameters
Encapsulation Type
Operating Temperature
dB
Receiver
sensitivity:
≤ -9.9 dBm
Overload
optical
power: -1.0
dBm
OSX001
001
10.00 ≤
10.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
single
-mode
Operating
wavelength
: 1310 nm
Transmit
optical
power:
–8.2 dBm
to +0.5
dBm
Extinction
ratio: ≥ 3.5
dB
Receiver
sensitivity:
≤ -12.6
dBm
Overload
optical
power: 0.5
dBm
SFP
+
0°C–70°C
(32°F–15
8°F)
OSX080
N00
9.9530–
10.3125
≤
80.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
single
-mode
Operating
wavelength
: 1550 nm
Transmit
optical
power: 0
dBm to 4
dBm
Extinction
ratio: ≥ 9
dB
Receiver
sensitivity:
≤ -24 dBm
Overload
SFP
+
0°C–70°C
(32°F–15
8°F)
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Model Transmission Rate (Gbit/s)
Transmission Distance (km)
Transmission Mode
Optical Fiber Type
Optical Port Parameters
Encapsulation Type
Operating Temperature
optical
power: -7
dBm
OSX040
N00
9.95–11
.10
≤
40.00
Single-
mode
Optica
l
conne
ctor
type:
LC
Optica
l fiber
type:
single
-mode
Operating
wavelength
: 1550 nm
Transmit
optical
power:
–4.7 dBm
to +4 dBm
Extinction
ratio: ≥ 3
dB
Receiver
sensitivity:
≤ -14.1
dBm
Overload
optical
power: 0.5
dBm
SFP
+
0°C–70°C
(32°F–15
8°F)
2.3 Electrical Module
Functions
An electrical module provides optical-to-electrical and electrical-to-optical conversion
functions. It is connected to an Ethernet cable to transmit signals.
Appearance
Figure 2-7 shows an electrical module.
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Figure 2-7 Electrical module
Figure 2-8 shows the structure of an electrical module.
Figure 2-8 Electrical module structure
1. Handle 2. Spring 3. Label
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4. Connector 5. Shell 6. Port
An electrical module uses an RJ45 port, and is connected to an Ethernet cable to support the
maximum transmission distance of 100 m.
Technical Specifications
Table 2-5 describes the technical specifications of an electrical module.
Table 2-5 Technical specifications of an electrical module
Model Transmission Rate (Mbit/s)
Transmission Distance (km)
Port Type Encapsulation
Operating Temperature
SFP-1000Bas
eT
10–1000,
auto-negotia
tion
≤ 0.1 RJ45 electrical
port
SFP 0°C–70°C
(32°F–158°F)
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3 Cables
About This Chapter
3.1 Power Cables and PGND Cables
3.2 Signaling Cables
3.1 Power Cables and PGND Cables
3.1.1 Power and PGND Cables to a Subrack
Functions A power cable connects the power input terminal on a subrack to the power output
terminal on the power distribution box (PDB) to supply power to the subrack.
A PGND cable connects the ground point on a subrack to the ground point on a
mounting bar of the cabinet for proper grounding.
Appearance Power cable
− Power cable with OT terminals
Both ends of a power cable are OT terminals. The blue cable is connected to the
NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure 3-1
shows power cables with OT terminals.
Figure 3-1 Power cables with OT terminals
− Power cable with dual-hole JG terminals
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Both ends of a power cable are dual-hole JG terminals. The blue cable is connected to
the NEG(-) terminal, and the black cable is connected to the RTN(+) terminal. Figure
3-2 shows power cables with dual-hole JG terminals.
Figure 3-2 Power cable with dual-hole JG terminals
− AC power cable
Most countires have their own AC power cables, including China, Europe, and North America.The
delivered AC power cables must comply with local standards. The following uses China AC power
cables as an example.
AC power cables include the AC power cable using the C13 straight female (SF) and
the PI straight male (SM) and the AC power cable using the C13 angled female (AF)
and the C14 SM. The two types of power cables differ in the power port. Figure 3-3
shows an AC power cable using the C13 SF and PI SM. Figure 3-4 shows an AC
power cable using the C13 AF and C14 SM.
Figure 3-3 AC power cable using the C13 SF and PI SM
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Figure 3-4 AC power cable using the C13 AF and C14 SM
PGND cable
− PGND cable with OT terminals
Each subrack is configured with one PGND cable. The cable is yellow and green.
Both ends of the PGND cable are OT terminals. Figure 3-5 shows a PGND cable with
OT terminals.
Figure 3-5 PGND cable with OT terminals
− PGND cable with dual-hole JG terminals
Each subrack is configured with one PGND cable. The cable is yellow and green.
Both ends of the PGND cable are dual-hole JG terminals. Figure 3-6 shows a PGND
cable with dual-hole JG terminals.
Figure 3-6 PGND cable with dual-hole JG terminals
The subrack used in North America uses power cables with dual-hole JG terminals and PGND cables
with dual-hole JG terminals.
Technical Specifications
Table 3-1 lists the technical specifications of the power and PGND cables for a subrack.
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Table 3-1 Technical specifications of the power and PGND cables for a subrack
Item Specifications
Power cable Power cable with OT terminals or dual-hole JG
terminals: 10 mm2 (8 AWG)
AC power cable
AC power cable using the C13 SF and PI SM:
China, 250 V/10 A, 1 mm2, 10°C to 70°C, and
C13 SF and PI SM
AC power cable using the C13 AF and C14
SM: China/Europe, 250 V/10 A, 1 mm2, -20°C
to +105°C, and C13 AF and C14 SM
PGND cable 16 mm2 (6 AWG)
3.1.2 Power Cables of the Alarm Box
Functions
The power cables are used for supplying power to the alarm box.
Table 3-2 lists the configuration of the power cables.
Table 3-2 Configuration of the power cables
Power Supply
Quantity
Remarks
AC power
supply
1 The cable is configured only if system down notification is
required for the alarm box. If the length of the cable is not
sufficient, connector boards must be added. The boards are
provided by carriers. If carriers do not provide the connector
boards, the quantity of the required boards must be provided in
the survey report.
DC power
supply
1 DC power cable is recommended. An alarm box requires only
one power cable. The length of the cable cannot exceed 100 m
(328.08 ft).
Exterior
None.
Technical Specifications
Table 3-3 lists the technical specifications of the power cables of alarm boxes.
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Table 3-3 Technical specifications of the power cables of alarm boxes
Name Specifications
AC power cable Voltage: 220 V/250 V
Length: 6 m (19.68 ft) (The length varies
according to the actual situation.)
Gauge: 3 x 0.75 mm2 (3 x 0.001 in.2)
Color: black
DC power cable One end of the DC power cable is a 4-pin
connector, and the other end is two 1-pin
connectors.
Voltage: -48 V
Length: 30 m (98.42 ft) (The length
varies according to the actual situation.)
Gauge: 0.8 mm2 (0.001 in.2)
Color: black
3.2 Signaling Cables
3.2.1 Ethernet Cable
Functions
Ethernet cables are used for cascading devices or for communication between devices and the
network. Through Ethernet cables, devices can be locally serviced and remotely accessed over
the network.
Ethernet cables transmit 100 Mbit/s or 1000 Mbit/s signals.
Appearance
An Ethernet cable is a straight-through. It is made of Category 5 enhanced shielded or
unshielded twisted pair cables and RJ45 connectors at both ends. Figure 3-7 shows the
appearance of an Ethernet cable.
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Figure 3-7 Ethernet cable appearance
Figure 3-8 shows the structure of an Ethernet cable.
Figure 3-8 Ethernet cable structure
Pinouts
Figure 3-9 shows the pins at both ends of a straight-through cable. Table 3-4 describes the
pins.
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Figure 3-9 Pins at both ends of a straight-through cable
Table 3-4 Pins at both ends of a straight-through cable
X1 X2 Pin Color Pinouts
1 1 White and orange A pair of twisted
pair cables 2 2 Orange
3 3 White and green A pair of twisted
pair cables 6 6 Green
5 5 White and blue A pair of twisted
pair cables 4 4 Blue
7 7 White and brown A pair of twisted
pair cables 8 8 Brown
Technical Specifications
Table 3-5 lists the technical specifications of the Ethernet cable.
Table 3-5 Technical specifications of the Ethernet cable
Item Specifications
Connectors X1 and X2 RJ45
Number of pins 8 pins
Diameter of the inner conductor 0.51 mm (0.02 in.)
Wire gauge of the inner conductor 24 AWG
Number of cores 8
Outer jacket flame retardant 28
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3.2.2 LC/PC-LC/PC-Multi-Mode Optical Cable
Function
The LC/PC-LC/PC-multi-mode optical cables are used to connect service boards and network
elements (NEs).
Appearance
The LC/PC-LC/PC-multi-mode optical cable is orange, as shown in Figure 3-10. Users can
choose single-mode or multi-mode optical cables based on site requirements.
Figure 3-10 LC/PC-LC/PC-multi-mode optical cable
An LC/PC connector is used at both ends of an LC/PC-LC/PC multi-mode optical cable.
Figure 3-11 shows an LC/PC connector.
Figure 3-11 LC/PC connector
Technical Specifications
The LC/PC-LC/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357. Table
3-6 lists the technical specifications of the LC/PC-LC/PC-multi-mode optical cable.
Table 3-6 Technical specifications of the LC/PC-LC/PC-multi-mode optical cable
Item Specifications
Cable type Optical jumper
Transfer mode Multi-mode
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Item Specifications
Number and type of optical
connector I
LC/PC
Number and type of optical
connector II
LC/PC
Diameter of the optical fiber
core
62.5/125 um
Outer diameter of an optical
cable
2.0 mm (0.08 in.)
Service life 500 times
3.2.3 DLC/PC-DLC/PC-Multi-Mode Optical Cable
Functions
The DLC/PC-DLC/PC-multi-mode optical cables are used to connect LAN switches or disk
arrays to other network devices.
Exterior
Figure 3-12 shows the exterior of a DLC/PC-DLC/PC-multi-mode optical cable.
Figure 3-12 Exterior of a DLC/PC-DLC/PC-multi-mode optical cable
Both ends of a DLC/PC-DLC/PC-multi-mode optical fiber are DLC/PC connectors.
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Technical Specifications
The DLC/PC-DLC/PC-multi-mode optical cables comply with the ITU G651 and GB/T
12357 standards. Table 3-7 lists the technical specifications of the
DLC/PC-DLC/PC-multi-mode optical cables.
Table 3-7 Technical specifications of the DLC/PC-DLC/PC-multi-mode optical cables
Item Specifications
Category Patch cord
Cable model A1b
Transmission mode Multi-mode
Number and type of optical
connector I
DLC/PC
Number and type of optical
connector II
DLC/PC
Diameter of the optical fiber
core
62.5/125um
Outer diameter of an optical
fiber
2.0 mm (0.08 in.)
Optical fiber length 5.0 m (16.40 ft.)
Service life (times) 500
Net weight 0.048 kg (0.106 lb)
Lowest operating
environment temperature
-20 degC
Highest operating
environment temperature
70 degC
3.2.4 LC/PC-LC/PC-Single-Mode Optical Cable
Function
The LC/PC-LC/PC-single-mode optical cables are used to connect service boards and
network elements (NEs).
Appearance
The LC/PC-LC/PC-single-mode optical cable is yellow, as shown in Figure 3-13. Users can
choose single-mode or multi-mode optical cables based on site requirements.
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Figure 3-13 LC/PC-LC/PC-single-mode optical cable
An LC/PC connector is used at both ends of an LC/PC-LC/PC-single-mode optical cable.
Figure 3-14 shows an LC/PC connector.
Figure 3-14 LC/PC connector
Technical Specifications
The LC/PC-LC/PC-single-mode optical cables comply with ITU G.652 and GB/T 9771.1.
Table 3-8 lists the technical specifications of the LC/PC-LC/PC-single-mode optical cable.
Table 3-8 Technical specifications of the LC/PC-LC/PC-single-mode optical cable
Item Specifications
Cable type Optical jumper
Transfer mode Single-mode
Number and type of optical
connector I
LC/PC
Number and type of optical
connector II
LC/PC
Diameter of the optical fiber
core
9/125 um
Outer diameter of an optical
cable
2.0 mm (0.08 in.)
Service life 500 times
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3.2.5 MPO/PC-MPO/PC-Multi-Mode Optical Cable
Function
The MPO/PC-MPO/PC-multi-mode optical cables are used to connect the optical ports on
two devices for data communications.
The MPO/PC-MPO/PC-multi-mode optical cables transmit 41.25 Gbit/s signals.
Appearance
The MPO/PC-MPO/PC-multi-mode optical cable is cyan, as shown in Figure 3-15.
Figure 3-15 MPO/PC-MPO/PC-multi-mode optical cable
An MPO/PC connector is used at both ends of an MPO/PC-MPO/PC-multi-mode optical
cable. Figure 3-16 shows an MPO/PC connector.
Figure 3-16 MPO/PC connector
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Technical Specifications
The MPO/PC-MPO/PC-multi-mode optical cables comply with ITU G651 and GB/T 12357.
Table 3-9 lists the technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable.
Table 3-9 Technical specifications of the MPO/PC-MPO/PC-multi-mode optical cable
Item Specifications
Cable type Optical cable component
Transfer mode Multi-mode
Number and type of optical
connector I
MPO/PC
Number and type of optical
connector II
MPO/PC
Diameter of the optical fiber
core
50 um/125 um
Number of optical fiber cores 8
Outer diameter of an optical
cable
3.5 mm (0.14 in.)
Optical cable length 2 m (78.74 in.), 30 m (1181.1 in.) or 100 m (3937 in.)
Service life 200 times
3.2.6 High-Density Cable
Functions
A high-density cable is connected to a high-density port at one end, and provides one VGA
port, three USB ports, and one serial port at the other end for data transmission.
Appearance
Figure 3-17 shows a black high-density cable.
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Figure 3-17 High-density cable
Technical Specifications
Figure 3-18 shows the pins at both ends of a high-density cable. Table 3-10 lists the technical
specifications of the high-density cable.
Figure 3-18 Pins at both ends of a high-density cable (unit: mm)
Table 3-10 Technical specifications of the high-density cable
Item Specifications
X1 Cable connector, MDR, 26-pin, male, cable
solder type, for OEM
X2 Cable connector, D connector, 15-pin,
female connector, cable solder type, three
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Item Specifications
rows, for OEM
X3 USB2.0 connector, double line, 8-pin,
female connector
X4 Network interface connector, 8-bit 8-pin,
shielded, model socket/top plugging type,
with fixed pin/pin tail length 3.43 mm
X5 USB2.0 connector, single line, 4-pin, female
connector
W1-2 Twisted-pair cable, 100 ohms, SEYVP, 0.48
mm, 26 AWG, 4 pairs, black
W3-4 Twisted-pair cable, 100 ohms, SEYVP, 0.48
mm, 26 AWG, 2 pairs, black
3.2.7 DB9-RJ45 Serial Cable
Functions
The DB9-RJ45 serial cable is used for data transmission. It has a DB9 connector at one end
and an RJ45 connector at the other end. The DB9 connector connects to the serial port of a
client, and the RJ45 connector connects to the serial port of a device.
Appearance
Figure 3-19 shows the appearance of a DB9-RJ45 serial cable.
Figure 3-19 DB9-RJ45 serial cable appearance
Figure 3-20 shows the structure of a DB9-RJ45 serial cable.
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Figure 3-20 DB9-RJ45 serial cable structure
Pinouts
Table 3-11 lists the pins at both ends of a DB9-RJ45 serial cable.
Table 3-11 Pins at both ends of a DB9-RJ45 serial cable
Wire No. Start Pin End Pin Signal
W X1.2 X2.3 TX
X1.3 X2.6 RX
X1.5 X2.5 GND
Technical Specifications
Table 3-12 lists the technical specifications of the DB9-RJ45 serial cable.
Table 3-12 Technical specifications of the DB9-RJ45 serial cable
Item Specifications
Connector type Cable Connector-04040838-D
Connector-9PIN-Female Connector-Cable
Welding Type
Network Interface Connector-Single
Row-Single
Interface-8PIN-8bit-Shielded-Crystal
Connector
Cable model Symmetric twisted pair cable
Characteristic impedance 100 ohms
Diameter of the inner conductor 0.32 mm (0.01 in.)
Wire gauge of the inner conductor 28 AWG
Color Gray