hirose electric co., ltd

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© 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010

HIROSE ELECTRIC CO., LTD.HIROSE ELECTRIC CO., LTD.

March, 2010

IT3 series IT3 series High-speed mezzanine High-speed mezzanine

Connector SystemConnector System

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IT3 Series Design OverviewIT3 Series Design Overview

Flexibility:Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIE and XAUI as it is in tomorrow’s 20+ Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 – 40 mm, IT3 can solve your interface needs for both current and future generations.

Features:•Unique 3-piece structure for excellent reflow solderability•Differential, single-ended, and power•Low mating/extracting forces•Wide misalignment tolerances•Stacking heights from 15 to 40mm•Both SnPb and Pb-free are available•Staggered 1.5mm x 1.75mm BGA

A New Standard Mezzanine for Flexibility and Performance

Flexible Flexible 3-piece design3-piece design has many advantages has many advantages

Detachable(Mating) Side

Mating / Unmating

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Hirose IT3 vs. CompetitionHirose IT3 vs. Competition

Hirose IT3 Amphenol NexLev FCI GigArray

Pin counts : 100/200/300 100/200/300 200/296Stack heights : 10mm to 40mm 10mm to 33mm 15mm to 40mmSignal density : 73 diff pairs/inch 73 diff pairs/inch 66 diff pairs/inch

Sales channel : Direct / Disty Direct only Direct / Disty

2nd Source : Tyco None None

High ASP = $ 50 + per mated connectorHigh ASP = $ 50 + per mated connector

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High Speed “Terms” to Know: MechanicalHigh Speed “Terms” to Know: Mechanical

• BGA: Ball grid array interconnect system using reflow solder balls

• Ground: An electrical connection between a circuit and the earth

• Power: The rate of generation, transferring or using energy, measured in watts

• Stack Height: Vertical distance measured in mm between PCB & connector

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Application ExamplesApplication Examples

Internet Routers &Switches

Servers/Storage

Base Transceive

r Station

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Currently Available VariationsCurrently Available Variations

100 signals 200 signals 300 signals

10 x 10 20 x 10 30 x 10

Pb Mounting In production In production In production

Pb Mating In production In production In production

Pb-free Mounting In production In production In production

Pb-free Mating In production In production In production

12 mm Under planning Under planning Under planning

14 mm Under planning Under planning In production

15 mm Under Development In production In production

17 mm Currently no plan In production In production

20 mm In production In production In production







35 mm Under planning Under planning Under planning


40 mm Under Development In production In production

Stacking HeightIn

terp

os

ers

So

ck

ets

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Available Sales toolsAvailable Sales tools

2D MechanicalDrawings

3D STEPFiles

SI Data

- General Presentation- Modeling- Detailed Test Reports (Available by Stack Height)- Test/Demo Board

Assembly and Design Notes

ProductBrochure

Qualification Data

- L1 Environmental Qualification Test Report

- L2 Long-term BGA Reliability Test Report

- L3 Manufacturing Yield Test Report

MechanicalShow & Tell

Samples

Sample DisplayCases

ComingComingMay 2010May 2010

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Available Sales toolsAvailable Sales tools

Technical Data

No Item Format File name (Ex.)

1 Simplified 3D modelSTEP (SAT &IGES are also available)

IT3M-300S-BGA.stp

2 Footprint data Allegro IT3M-300S-BGA.brd

3 Spice models Spice IT3-**H.sp

4 Touchstone model Touchstone IT3-300-**H.s60p

Technical Document

No Item FormatFile name (Ex.)

or Document number

1 2D drawing PDF IT3M-300S-BGA.pdf

2 Spec sheets PDF IT3M-300S-BGA.pdf

3 Contact reliability report PDF TR0636E-10018

4 Eutectic thermal cycling test report PDF TR0636E-10026

5 Lead free thermal cycling test report PDF TR0636E-20128

6 Temperature rise report PDF TR0636E-20041

7 SI report PDF IT3-**H.pdf

8 Assembly note PDF ETAD-F0457

9 Design note PDF ETAD-F0347

10 Customer demo board test report PDF IT3_demo_board_v2.pdf

11 Characterization board test report PDF IT3_Characterization_Board_v09.pdf

From Assembly Notes and Design Notes; documents 3 through 6 are based on EIA spec.

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High Speed “Terms” to Know: SIHigh Speed “Terms” to Know: SI

• Differential Signaling: Digital signals transmitted as the difference in voltage of a pair of signal lines

• Gbps: = Gigabits per second; a unit data transfer rate/speed = 1k megabits per second

• S. Parameter: Plots attenuation vs. frequency used to document connector performance and is also known as insertion loss

• SI: = Signal Integrity; Process of analyzing and making appropriate system design decisions

• Signal Ended Signaling: Signals transmitted over one wire using common ground return

• Spice Model: Simulated program with integrated circuit emphasis

• Touchstone File: Also known as SnP file; intended for use with documents and specifications for parameter data of active or passive interconnect network

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Assembly friendly unique 3-piece Assembly friendly unique 3-piece

X-ray inspection from bottom side

X-ray Inspection FriendlyX-ray Inspection Friendly

Low Thermal Mass Low Thermal Mass for Reflow processfor Reflow process

For any stacking height combination, receptacle is always same and its height is 6mm only.Small size of receptacle has wide process window for reflow profile.

No need to reflow

Reflow receptacle onlyReflow receptacle only

Lead-Free applications benefit from our easy reflow process design.

1.1. Significantly reduces Significantly reduces frequency of false callsfrequency of false calls

2.2. Simple receptacle design Simple receptacle design gives clear vision for X-ray gives clear vision for X-ray inspection.inspection.

“Mounting receptacle”Reflow-mounted on PCB

“Interposer”Installed onto “Mounting receptacle” after reflow

“Mating receptacle”Mated with “Interposer”

IT3 3-Piece Design Features & BenefitsIT3 3-Piece Design Features & Benefits

IT3 series mounting & mating procedureIT3 series mounting & mating procedure

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HRS IT3 SeriesHRS IT3 Series : 10˚ acceptable: 10˚ acceptable Competitors’Competitors’ : Not acceptable: Not acceptable

Mating / Un-mating operationMating / Un-mating operation

Industry standard footprintIndustry standard footprint


IT3D/M -***S - BGA

0.7

5 m

m

0.875 mm

Signal BGA Signal BGA

Ground BGAGround BGA

HRS IT3 SeriesHRS IT3 Series : 3˚ acceptable: 3˚ acceptable Competitors’Competitors’ : Not acceptable: Not acceptable

High reliableHigh reliableBGA connectionBGA connection

*Patent Pending

IT3’s unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pares per linear inch.

The IT3’s divided receptacle structure reduces thermal stress and ensures long-term reliability of the BGA ball connection with the PWBDrop-in replacement for NexLevDrop-in replacement for NexLev

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Lower forceInsertion and Extraction

Displacement of spring

(mm)

Con

tact

for

ce (

N)

0

Contact normal force

Spring workload

is decreased.

Pre-load structure

Housing design prevents pin stubbing

Exposed contacts

Existing solution

IT3 Series

IT3 Supplier A

Appx. 200 pos. 90 N 145 N

Appx. 300 pos. 135 N 218 N


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IT3 connectors

PCB

IT3 series for 30mm (or any) stacking height application

3-Piece Connector Assembly Benefit3-Piece Connector Assembly Benefit

Already confirmed that there Already confirmed that there are no issues to mount Hirose are no issues to mount Hirose IT3 series connectors on the IT3 series connectors on the bottom side of PCB for 2bottom side of PCB for 2ndnd reflow soldering by major reflow soldering by major CEMs. CEMs.

2nd Reflow soldering compatible2nd Reflow soldering compatible

Other supplier for 30mm height application

6m

m

19

.7m

m

May not suitable for 2nd May not suitable for 2nd Reflow soldering due to Reflow soldering due to

the weight.the weight.

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Robust and Reliable Solder Ball AttachmentRobust and Reliable Solder Ball AttachmentH

igh

Spee

d In

terc

onne

ct S

olut

ions

Not to scale

After reflow soldering

Uncontrolled co-planarity brings the migration of solder ball from low to high temperature side during reflow, which causes the soldering failure.

The countermeasures are to improve the excess co-planarity or to implement the thicker metal mask to cover such co-planarity.

As a contact lead is positioned into a solder ball, it prevents the ball from pealing off during severe shock &vibration test.

Hirose IT3 series Other connector & silicon device package

Since the receptacle’s contact resides in the BGA ball, the IT3 is very strong for shock and vibration. (Patent Pending)

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Unique Interposer Design for Signal IntegrityUnique Interposer Design for Signal Integrity

Interposerwafer

• Micro strip line structure• Up to 6.25G bps with fully populated

pin assignment• Over 10G bps with skipped pin

assignment for differential pairs• Also can be used for power lines

Interposer wafer structure

Signal / Ground configuration

Signal Ground

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IT3 vs. IT2IT3 vs. IT2

BGA grid 0.7 x 0.875 (mm) 1.0 x 1.0 (mm)

# of ballsSignal: 300

Ground: 270Signal : 180

Ground : 200

Receptacle size 56 x 19.2 x 6 (mm) 48.2 x 22.6 x 5.25 (mm)

* Because of connector structure, IT2 cannot have pins skipped for faster data transfer requirement.

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Hybrid (Selectively Loaded) Type AvailableHybrid (Selectively Loaded) Type Available

• IT3HY (85&100Ω) mating / internal structure

IT3HY-100P-38H(schematic only)

IT3D-100S-BGA

IT3M-100S-BGA

85Ω QPI wafer(typical for new Server applications)

Existing 100Ωwafer(typical for Telecom applications)

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IT5 vs. IT3

• IT5 has improved ICR (with 8-aggressor FEXT) for 25 Gbps data rate with plenty of margins.

IT3 IT5

12.5 GHz

Via stub

hirose electric co., ltd

Documents