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HIGH DENSITY DESIGN COMPONENT SOLUTIONS

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Post on 23-Dec-2015

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  • Slide 1
  • HIGH DENSITY DESIGN COMPONENT SOLUTIONS
  • Slide 2
  • Technology Challenges Market Drivers: Make it smaller Make it operate faster Make it more efficient Make it cheaper
  • Slide 3
  • Smaller Circuits Design: 1. Higher levels of circuit integration on silicon 2. Use of smaller foot print components + Components can be placed closer together - Closer the components get to each other, the more unwanted signal noise coupling occurs SMT 0603 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS Technology Challenge
  • Slide 4
  • Faster Speed of Operation : 1. More done in shorter amount of time 2. Higher complexity of functions & display + Smaller SMT Components Can Function at Higher Speeds. - Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity. MHz 1200 800 600 400 Technology Challenge SMT 0603 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS
  • Slide 5
  • Less Power Consumed : 1. More features using less power 2. Thinner barrier silicon IC chips = lower voltage operation = less energy needed. + SMT Passive Components can function at lower voltages - Lower voltage IC have reduced tolerance to spikes transients. Higher level of transient and noise control is required = more passive components needed (capacitors and TVS devices) - Lower ESR (lower loss) components needed CERAMIC CHIP CAPACITORS MLV VARISTORS LOW ESR ALUMINUM & TANTALUM CAPACITORS Technology Challenge
  • Slide 6
  • Reduced Cost of Products: 1. Reduce size of PCB = less cost 2. Use SMT = faster production and reduced cost to build 3. Reduce component count by component integration 4. Use smaller size components (less raw material = less $$$) + Many SMT Passive Components cost less than leaded equivalents + Integrated (multiple element passives) reduce board space and place costs CERAMIC CHIP CAPACITORS & ARRAYS CHIP RESISTORS & ARRAYS FERRITE CHIP BEADS / INDUCTORS PASSIVE ARRAYS (IPC) Technology Challenge
  • Slide 7
  • SMT Component Size 0805 0603 0402 0201 12mm 3mm NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS NRC SERIES CHIP RESISTORS NMC SERIES CERAMIC CHIP CAPACITORS 0201 NIN/NIS SERIES CHIP INDUCTORS Component Solution: Component Size Reduction
  • Slide 8
  • Get More Components In Less Space High Density Design Solutions: Component Size Reduction and Integration 10 PIN 8 ELEMENTS 4 PIN 2 ELEMENTS NRSN SERIES RESISTOR ARAYS REPLACE WITH 2 OR 4 OR 8 ELEMENTS CHIP RESISTORS Integrated Component Solution: Resistor Arrays
  • Slide 9
  • 0.5mm (0.20) ) ~ 1.27mm (0.39) pitch 103 Four 0603 resistors (1.6mm X 0.6mm each) Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total) Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$ 0.5mm (0.20) ~ 1.27mm (0.39) pitch Quad flat pack or PLCC package IC 10 3 0.5mm (0.20) pitch (Same or less pitch as IC!) 0804 resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4 Far less board space used and short connection layout frees up valuable board space! Placing one component = the placement cost = $$$ saved! Quad flat pack or PLCC package IC NRSNA4I2 NRSNA4I4 SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! High Density Design Solutions: Component Size Reduction and Integration Thick Film Resistor Arrays
  • Slide 10
  • Get More Components In Less Space NCA SERIES CAPACITOR ARRAY 1 PART: 4 ELEMENTS 1206 SIZE 4 ELEMENTS CERAMIC CAPACITORS REPLACE WITH High Density Design Solutions: Component Size Reduction and Integration Integrated Component Solution: Capacitor Arrays
  • Slide 11
  • 1.6mm 4.7mm C1C2C3C4 C1C2C3C4 3.2mm 1.6mm 4 Element capacitor array = ~$40/1000 = 4.0 each 1 part = 4.0 total. Placement cost = 0.5 ~ 5 each (industry estimates) lets say it's 2 per part = 2 for 1 part. Total cost of 4 ceramic chip capacitor elements = 6.0 (42% savings) Total board area = 1.6mm X 3.2mm = 5.12mm (32% smaller) Capacitor Array Benefits = Lower total cost and less board space used! 0603 Ceramic chip capacitor = ~$6/1000 = 0.6 each 4 parts = 2.4 total. Placement cost = 0.5 ~ 5 each (industry estimates) lets say it's 2 per part = 8 for 4 parts. Total cost of 4 ceramic chip capacitor elements = 10.4 Total board area = 1.6mm X 4.7mm = 7.52mm High Density Design Solutions: Component Size Reduction and Integration Integrated Component Solution: Capacitor Arrays
  • Slide 12
  • Get More Components In Less Space NPA SERIES PASSIVE ARRAY 1 PART: 8 ELEMENTS 1608 SIZE 8 ELEMENTS 4 CAPACITORS 4 RESISTORS REPLACE WITH SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! High Density Design Solutions: Component Size Reduction and Integration Integrated Component Solution: Passive Component Arrays
  • Slide 13
  • NPA SERIES - Four element RC network array in EIA 1608 size package Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm. R R C C C R 1608 size : 0.16 long X 0.08 wide 4.0mm long X 2.1mm wide High Density Design Solutions: Component Size Reduction and Integration Integrated Component Solution: Passive Component Arrays