heated plate curing

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WP3_Bham; 29May 2014; John Wi lson 1 Heated plate curing Tests with 130nm hybrids and glass ASICs the glue thickness is controllable . i) Room temp curing : 5 hybrids ii) Heated plate curing: 6 hybrids Hybrid panel (+35C) Panel vacuum jig Metal block eating element Insulating sheet of glass 1

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Heated plate curing. Panel vacuum jig. Hybrid panel (+35C). Tests with 130nm hybrids and glass ASICs the glue thickness is controllable . Room temp curing : 5 hybrids ii) Heated plate curing: 6 hybrids. Metal block. Heating element. Insulating sheet of glass. 1. - PowerPoint PPT Presentation

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Page 1: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 1

Heated plate curing

Tests with 130nm hybrids and glass ASICs • the glue thickness is controllable .i) Room temp curing : 5 hybrids ii) Heated plate curing: 6 hybrids

Hybrid panel (+35C)Panel vacuum jig

Metal block

Heating element Insulating sheet of glass

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Page 2: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 2

Tests with glass ASICs

All hybrids (except those over-glued) shear tested on Dage 4000 after the curing has ended.

Most often the glue joint breaks at the glue layer i.e. significant glue left on the ASIC and on the hybrid.

But usually one (+ -1) ASIC shears off leaving hardly any glue stain on the hybrid pad. Is the surface clean? Surfaces are wiped with alcohol but more may be required.

Try cleaning with Safewash soon (but not yet).

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Page 3: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 3

Page 4: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 4

11.082kg

24.202kg

26.845kg

22.477kg

17.837kg

17.229kg

14.965kg

15.197kg

11.934kg Glue/Substrate failure

8.671kg Glue/Substrate failure

% Coverage

44%

63%

78%

57%

58%

54%

46%

52%

56%

51%

Heated plate

Glass ASICs after gluing

Hybrid pads after shear testing

Page 5: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 5

Shear Height Vs Glue Thickness for Heat Cured ASIC’s – Arranged in groups of % Coverage

Page 6: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 6

Production still tricky: e.g. too much glue!

Page 7: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 7

Bare glue dot : cured on glass ASIC(Mech Eng Alicona G4 (IF) system)

2.16mm

2.85mm

726mum

Glue adhering to stencil at pull off

Edge of glue dot?“Bleeding” between stencil and glass.

“Slumping” of glue after stencil removed?

Page 8: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 8

Expected dot pattern from stencil

Stencil dots: 2mm diam and 135 microns high

Closest dist between edges of adjacent dots = (5.40 – 4.0)/2 = 0.7mmTherefore for dots to touch their radii must increase from 1.0 to 1.35mm

Ideal stencil dot (1.0mm rad x 135microns high) will be compressed to a dot of radius 1.30mm if the glue thickness is 80microns.

Therefore in ideal case (80 microns), the 5 glue dots will not quite merge. But, in practice, bleeding + slumping will spread out the dots -> merging.

Page 9: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 9

Conclusions (after lots of gluing!)

•No clear correlation between shear strength and glue thickness

•Correlation emerging between shear strength and coverage (as expected!)

•No apparent difference in shear strength between the two methods (room temp and heated plate curing)

•Systematic effects becoming apparent with experience/practicee.g. glue dots slightly larger for ASICS 7,8, 9 as glue is applied here in overlapping swipes.

• Still scope for putting down variable amounts of glue !

Thanks to Liverpool for sending an extra batch of glass ASICs. Would be very useful to have more glass ASICs in pipeline, please.

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Page 10: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 10

Other news

Dry storage cabinet (Almit) had been delivered but without the nitrogen circulator (ordering mishap)

We have now received the missing N2 unit. Good …. but, it is not “bolt on”, as advertised. A new hole has to be cut in the cabinet to match!

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Page 11: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 11

From previous meetings

Page 12: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 12

All data collected from shear tests

Many of the lower results are where there has been a failure at the glue/substrate interface, possibly due to the hybrid surface not being clean

Page 13: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 13

Not enough glue due to something blocking the stencil holes – next slide.

Omit pts with little glue adhering to ASIC pads.

Page 14: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 14

ASIC with anomalously low shear strength: 2.7kg

After curingGlue on ASIC; stencil removed Hybrid after shear

ASIC after shear

Glue on stencil

-> ensure stencil is clean before use.

Page 15: Heated plate curing

WP3_Bham; 29May 2014; John Wilson 15

Hybrid glued with a pre-heated ASIC vacuum jig.

Due to expansion it made the stencil tricky to get on properly and led to too much glue being stencilled on.

Average Glue thickness is 75µm

This has so far been a one-off. Decide not to preheat the ASIC vacuum jig.

Hybrid glued without preheating the ASIC vacuum jig.

Stencil fitted on much more easily and because of that the correct glue volume was stencilled on.

Average glue thickness is 80µm

Although: - P.T.O