halt & alt case studies - arl · halt & alt case studies david rahe ... internal ground...
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For more information visit www.qualmark.com/company/eventsA link to the recording of today’s session will be sent to you by email
HALT & ALT Case Studies
David Rahe
Business Development Manager, DLi Labs
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Today’s Ask the Expert Presenter
David RaheBusiness Development Manager
DLi Labs
3201 Industrial Terrace, Austin, TX 78758
www.dlinnovations.com/labs/
512-775-4001
© 2009 Qualmark Corporation
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Presentation Summary
Introduction to Accelerated Life Testing
Product Life Cycle
Environmental Stress
Reliability Planning
HALT & ALT
HALT: Qualitative
ALT: Quantitative
Case Studies
HALT
ALT
Examples of Common HALT Failures
Q&A
© 2009 Qualmark Corporation3
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Accelerated Life Testing
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A higher stress produces the same failures as occur
at use stress, except occur more quickly
Time-to-fail at use stress multiplied by a constant
(the acceleration factor) to obtain the equivalent
time-to-fail at high stress
Based on product defined usage models
Linear relationship
Models (predicts time-to-fail as a function of stress):
Arrhenius
Eyring
Inverse Power
© 2009 Qualmark Corporation5
Accelerated Life Testing
► Coffin-Manson
► Halberg-Pecht
► Others
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Manufacturing
Final Test
Storage
Packaging
Shipping
Installation
Calibration
Maintenance
© 2009 Qualmark Corporation
6
Normal Use
Portable vs. Stationary
Vehicle mounted (cab, engine, frame)
Controlled environments
(indoor/outdoor)
Space, sub-sea, desert, tropics, etc.
Mis-Use
Repair
Product Life Cycle
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Temperature
Temperature Cycling
Humidity
Vibration
Shock
Dust
Water
Electrical
© 2009 Qualmark Corporation7
Sulfur
Altitude
Chemical
ESD
Impact
Wear
Environmental Stresses
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Reliability Planning
Understand the Product Life Cycle
Identify the various stresses associated with each
phase of the Life Cycle
Consider how to accelerate those stresses
Develop a test strategy to apply the accelerated
stresses
Identify critical components (i.e. high stress, new
technology, high risk)
Number of samples
Product functional test/exercise defined
Test Budget
Scheduling © 2009 Qualmark Corporation8
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HALT & ALT
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Design Verification TestingDemonstration of performance to a specification
within product usage environments
Reliability Margin TestingInduce stress to identify design margins; design weaknesses
Quick results
Reliability Demonstration/Quantification
Determine warranty periodLong term testing; multiple samples
Product Test SuiteA Comprehensive Test Program Includes all 3 Phases
Minimal Testing
Better Product Testing
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-20
0
20
40
60
80
100
12:0
7:16
PM
12:2
3:56
PM
12:4
0:35
PM
12:5
7:15
PM
1:13
:55
PM
1:30
:36
PM
1:47
:16
PM
2:03
:55
PM
2:20
:35
PM
2:37
:16
PM
2:53
:55
PM
Temp Setpoint °C
Vib Setpoint G
Vib Product G
Air Temp °C
Product Temp °C
#190 °C
#257 °C
© 2009 Qualmark Corporation11
Subjective: information gathering, exploratory
Discover Design Weaknesses
Strength vs. Stress Testing
Step Stress Test to Failure
Temperature Cycling with Multi-Axes Vibration
Failures provide understanding of margins
Product
Specs
Stress
Uppe
r
Destr
uct
Limit
Lower
Destruct
Limit
Destruct MarginDestruct Margin
Upper
Operating
Limit
Lower
Operating
Limit
Margin
Operating
Margin
Operating
Qualitative: HALT
HALT: Highly Accelerated Life Test
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© 2009 Qualmark Corporation12
Objective: defined, statistics, pre-knowledge
Assess product life (hrs. or cycles/actuation)
Determine warranty period
Longer test duration with multiple samples
Time Compression (2 Methods)
1. Increase Cycles or Run Time
2. Increase Stress Level
ALT: Accelerated Life Test
Quantitative: ALT
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Case Studies
*Customer case study details are DLi Labs confidential
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Case Study Introduction
Case Study # 1: IT Product
Purpose: HALT and ALT during Design
Case Study # 2: Test/Measurement Product
Purpose: HALT of Production to Duplicate Field Failure and
Perform Failure Analysis of Failure
Case Study # 3: Payment Terminal Product
Purpose: HALT of Production to Duplicate Warranty
Problems and Perform Failure Analyses
Case Study # 4: Server Cabinet Rails
Purpose: ALT to Qualify Supplier Components
© 2009 Qualmark Corporation14
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Case Study #1: IT Product
Product Details:
2u, 19” Rack Chassis
Major Life Cycle Stresses
Temperature – during use
Mechanical stress - during shipping
© 2009 Qualmark Corporation15
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Case Study #1: IT Product
HALT Results
Temperature
Operating limits: -30°C to 65°C (component failure)
Vibration
Operating limit: 10Grms, daughter board mounting method
Interface Board: Piezo alarm leads shorting to chassis
Capacitor lead fractures (line filter CY1, CY13)
Connectors (Power, User Interface) backed-out
Internal ground strap floating, PEM nut not secure
© 2009 Qualmark Corporation16
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Case Study #1: IT Product
17
Capacitor Damage Cable Release
Piezo Shorting & Cable Release Daughter Bd. Connector Release
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Case Study #1: IT Product
ALT Stress
Temperature
Normal Use: 35°C
Accelerated: 60°C
ALT Results
Arrhenius method of modeling thermal effects on
electronic components
5 samples for 75 days
Acceleration Factor = 11
Weibull Analysis on ALT failures determined the
product Mean Time to Fail would be 19,329 hrs (2.2
years, or 805 days) under normal operation© 2009 Qualmark Corporation18
ReliaSoft Weibull++ 7 - www.ReliaSoft.com
Probability - Weibull
Time, (t)
Unre
liabil
ity, F
(t)
10000.000 100000.00010.000
50.000
90.000
99.000Probability-Weibull
Data 1Weibull-2PMLE SRM MED FMF=3/S=2
Data PointsProbability Line
Target Rel
Dave RaheSchlumberger10/26/200912:35:06 PM
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Case Study #2: Test/Measurement Product
Bench Use
Major Life Cycle Stresses
Temperature – during use
Mechanical stress - during shipping, bench handling
HALT Results
Temperature
Operating limit: -45°C to 60°C (fan failure)
Vibration
Operating limit: 20 Grms
© 2009 Qualmark Corporation19
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Case Study #2: Test/Measurement Product
Failure Analysis of Fan Circuit
Electrical Analysis
Measured voltage, current, power of circuit components
Comparison of both good and suspect fans
Result: Gate drive levels are proper/within spec.
Thermal Analysis
Thermocouple FETs and critical circuit components
Infrared analysis
Results: Failure temperature rise is 100°C (normal 30°C vs.
bad 130°C)
X-Ray Analysis
No evidence of wire bond, fractured or defective solder joints,
material voids, electro-chemical migration
© 2009 Qualmark Corporation20
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Case Study #2: Test/Measurement Product
© 2009 Qualmark Corporation21
Thermocouple
FETsCurrent FETs
Thermal Image
X-Ray Controller IC
X-Ray
Controller IC
X-Ray FET
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Case Study #2: Test/Measurement Product
Conclusion
Q1 output shorted, causes temperature rise beyond
specification (Tj=125°C)
Creates additional load share on 2nd phase motor drive
FET
NPN Silicon Switching Power Transistors (FET) are
defective on the failing fans
Die failure results in collector/emitter short
Manufacturing defect is related to 2 bad lot codes
© 2009 Qualmark Corporation22
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Case Study #3: Payment Terminal Product
Credit Card Scan and Touch Screen
Production with Unacceptable Warranty Returns
#1 Premature Battery Field Failure (Primary)
#2 LCD Display (Secondary)
Major Life Cycle Stresses
Temperature, Humidity, Corrosive Gases – during use and
customer storage
Mechanical stress - during shipping and use
© 2009 Qualmark Corporation23
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Case Study #3: Payment Terminal Product
HALT Results
Temperature
Operating limits: -20°C to 70°C (LCD failure)
Vibration
Operating limit: 25 Grms (Capacitor C6, C21 lead fractures)
Combined
Operating limit: 15 Grms and 70°C (backlight failure)
© 2009 Qualmark Corporation24
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Case Study #3: Payment Terminal Product
ALT Stress
High Temperature & Humidity
Cold Temperature
Safety intrusion circuit electrical simulation
70°C and 85%RH for a period of 60 days
Normal usage environment of 25°C and 50%RH
Target 5 year product life
Acceleration factor of 71 using an aggressive Halberg-
Pecht model
Measure battery and product degradation over the 60 day
10 samples
© 2009 Qualmark Corporation25
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Case Study #3: Payment Terminal Product
ALT Results
Battery:
Active load increased by ~1000% under stress
Intrusion circuit generated multiple open/short events
60% of samples developed battery failure
Recreated battery failures in < 26 days (12~14 months
estimated life)
LCD:
Recreated LCD Backlight failure in 7 of 10 samples
© 2009 Qualmark Corporation26Conclusion: Field failures occur due to storage conditions
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Intrusion Drain Battery Voltage
0
0.5
1
1.5
2
2.5
3
3.5
4
24 36 48 60 72 144 156 168 180 192 204 216 228 300 324 348 372 636
Time in Hours
Batt
ery
Vo
ltag
e
BATT 7 BATT 8 BATT 9 BATT 10
Battery Drain Over Time
0
100
200
300
400
500
600
24 36 48 60 72 144 156 168 180 192 204 216 228 300 324 348 372 1164
Time in Hours
Cu
rre
nt
in u
Am
ps
DUT 6 IDC
Case Study #3: Payment Terminal Product
© 2009 Qualmark Corporation27Conclusion: Field failures occur due to storage conditions
Intrusion Component
Battery Voltage vs. Time
Battery Current vs. Time
Current Spike
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Case Study #4: Server Cabinet Rails
Product Life Cycle Stresses:
Thermal, Humidity, Corrosive Gases
Qualify Plating Method
9 samples (galvanized, zinc plated, zinc w/clear chromate)
ALT Stresses: Corrosion
High Temperature & Humidity (90°C and 80% RH)
High Temperature & Humidity with Sodium Chloride (1% NaCl
35°C and 90% RH)
High Temperature & Humidity with Sulfur Dioxide (~100 ppb,
35°C and 90% RH)
High Temperature & Humidity with Sodium Chloride and Sulfur
Dioxide (~100 ppb, 1% NaCl 35°C and 90% RH)
© 2009 Qualmark Corporation28
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Case Study #4: Server Cabinet Rails
ALT Results
Test Group A
Test Group B
Test Group C
Conclusion: Group A is a superior plating process
© 2009 Qualmark Corporation29
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Examples of HALT Failures
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Common HALT Failures
© 2009 Qualmark Corporation31
Capacitors
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Common HALT Failures
© 2009 Qualmark Corporation32
Capacitors
Corrective
Action
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Common HALT Failures
Crystals
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Common HALT Failures
Power Transistors/FETS
Lead fracture damage
Electrical shorting
© 2009 Qualmark Corporation34
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Common HALT Failures
Coils/Inductors: Lead fractures
© 2009 Qualmark Corporation35
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Common HALT Failures
© 2009 Qualmark Corporation36
Heat Sink Dislodged
Plastic glass transitionDIMM dislodged
Broken Fan Blade
Damaged traces
Resister pack lead fractures
Chassis wear
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ALT and HALT are both valuable tools
Each provide product reliability information
How to apply each process is critical
Both tests should consider the product Life Cycle
environment
Failure Analysis/Root Cause and Corrective Action
must be included
THANK YOU !!
© 2009 Qualmark Corporation37
Conclusion
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Questions?
Please use the chat feature at lower left corner of
your screen to submit questions
© 2009 Qualmark Corporation
Today’s Speaker:
David Rahe, Business Development Manager
A link to the recording of today’s session will be sent to you by email.
Please allow up to 24 hour to receive the link information