global trends of ic package molding cae technology
TRANSCRIPT
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www.moldex3d.com
CoreTech System Co., Ltd.│Copyright© 2019 Moldex3D. All rights reserved.
徐志忠, Jim Hsu
部門協理, RD Director
Global Trends of IC Package Molding
CAE Technology
S6, iNEMI Session: Modeling & Simulation
in Electronics Packaging
IMPACT-IAAC, Taiwan
October 23, 2019
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Computer Aided Engineering
CAE
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Finite Element Analysis (FEA)
Computational Fluid Dynamics (CFD)
Multibody Dynamics Optimization & Simulation
Employees: 15,000Market value: 34.4 Billion
https://zh.wikipedia.org/wiki/
Employees: 3,400Market value: 17.5 Billion
Employees: 250Market value: 0.29 Billion
ANSYS to acquire LS-DYNA Sep 11, 2019
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1/2
CAE ~ 200 Billionhttps://operanewsnow.com/author/htfmarketreport/
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In Plastic Molding Process
CAE
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Provide different solutions for specific needs of different
industries
Bring more efficient way to optimize your design with
environmental sustainability instead of traditional trial-
and-error method
What We Do
Iteration
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產業客戶簡介
Moldex3D Global Customers
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In Advanced Molding Process
Moldex3D
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Ref: http://romeofan.tian.yam.com/posts/13639796
Molding Process In IC Packages
Void prediction, Fluid-structure interaction,
Warpage prediction before and after molding
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Diverse solutions are developed
for IC Package process
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ChemorheologyRelationship
between conversion Rand viscosity η
Thermal conductivity, k
Thermal properties
Heat capacity, Cp
( ) 0 =+
u
t
Mass balance
Energy balance
STkTt
TCp +−=
+
: u
Momentum balance
gpDt
D +−= τ
u
Chemical reaction balance
0=++ RjX
PVTCTemperature-pressure-cure
dependent volume, V(T, P, R)
Governing equations & Constituted properties
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Moldex3D Material Research Center
Moldex3D Material Research Center
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( )( )nmkkdt
d
−+= 121
−=
RT
EAk 1
11 exp
−=
RT
EAk 2
22 exp
Conversion rate
Chemical curing kinetics
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Conversion rate
Chemorheology
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Venting analysis enhancementWithout air resistance With air resistance
Jeong, Y., Ahn, B., Hsu, J., Yang, A., Koyama, T., Oi, K., ... & Tsuriya, M. (2018, April). SiP module mold flowability experiment result and simulation study.
In Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on (pp. 1-6). IEEE.
Void prediction during molding
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Comparison of filling pattern between experiment and simulation results at distinct filling time
Resin and Air Front Evolutions
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Dispenser
Encapsulant
Substrate Solder mask 5 Under bump metallization(UBM)6,9 Printed circuits7 Solder pads8 Through vias10 Solder bumps11 Die
Capillary underfill process
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interfacial tension is treated as a body force
Continuum Surface Force (CSF)
( )f−= f
R h
fx
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Dispensing Behaviors for Multi-paths
Dispensing Behaviors for Multi-paths
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Real world
Further Stress simulationMolding simulation
Akbari, Saeed, Amir Nourani, and Jan K. Spelt. "Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and
underfilling." Composites Part A: Applied Science and Manufacturing 88 (2016): 178-189.
Sham, Man-Lung, Jang-Kyo Kim, and Joo-Hyuk Park. "Thermal performance of flip chip
packages: Numerical study of thermo-mechanical interactions." Computational materials
science 43.3 (2008): 469-480.
Hydrophobic behavior prediction to predict
the fillet
Hydrophobic behavior of the fillet
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Direct forcing on solid body for moving boundary interface
Immersed Boundary Method
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FOWLP assembly process
http://www.semicontaiwan.org/en/sites/semicontaiwan.org/files/data16/docs/(8)%20APIC%20YAMADA%20Innovative%20Wafer
%20Molding%20System%20for%20Fan%20Out.pdf
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Melt front evolution during molding
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– Die shift decreases as the die thickness is increased
– Die shift increases as the compression velocity is increased
Die thickness=759 um
Die thickness=559 um
Die thickness=359 um
Ref: Chee Houe Khong, etc., “A Novel Method to Predict Die Shift During Compression Molding
in Embedded Wafer Level Package”, 2009 Electronic Components and Technology Conference
Process conditions for die shift
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Melt front Animation near corner A & B
Corner A
has the Max. WSI
Corner B
has the Max. WSI
Compression molding for wire sweep
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Molding process In-mold curing Ejection to air
Conversion changes during the first two stages.
The distribution of conversion is not uniform at
this point, and different volume shrinkages occur.
This leads to the part of first warpage of package.
The package sustains temperature decreasing from mold temp.
to room temp and further to post-mold curing process.
The part of second warpage of package occurs in this step.
Post-mold curing
15%
deviation
4%
deviation
Ref : L. Tan et al., "Study of viscoelastic effect of EMC on
FBGA block warpage by FEA simulation," Electronic
Packaging Technology (ICEPT), 2013 14th International
Conference on, Dalian, 2013, pp. 343-346.
In-mold/Post-mold Warpage
Prediction
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Moldex3D Material Research Center
PVTC instrument
( ),, PTVV =
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1.0% volume shrinkage rate
for chemical shrinkage
Uncured state
Cured state
1.5 % volume shrinkage
rate for thermal shrinkage
( )( )
0894.0, ,
if
if ,
,exp
exp
if
if ,
,
1ln1
1)1(
11
565
43
43
21
21
0
0/
=−=+=
−
−=
+
+=
+−=
+−=
CbTTPbbT
TT
TT
Tbb
TbbB
TT
TT
Tbb
TbbV
B
pCVV
VVV
t
t
t
LL
SS
t
t
LL
SS
uncuredcured
cureduncured
PVTC model for shrinkage
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final warpage for EMC/Cu final warpage for EMC/Si
Ref : http://www.imapsource.org/doi/abs/10.4071/2016DPC-TP25
A study on warpage behavior of EMC in post-
mold cure stage using Moldex3D
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-1
-0.5
0
0.5
1
1.5
2
2.5
3
0 1000 2000 3000 4000
Max.
dis
pla
cem
ent
in w
arp
dir
ecti
on
Time (sec)
Displacement v.s. Time
0
20
40
60
80
100
120
140
160
180
200
0 1000 2000 3000 4000
Tem
pera
ture
(degre
e C
)
Time (sec)
Temperature v.s. Time
32
Case A B C
Experiment
Shape
Simulation
Shape(R15.0)
Real case study for PMC analysis
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http://www.adhesivehelp.com/lord/lordelectronics.html
What’s the next step for prediction ?
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What’s the next step for prediction ?
Valve gate module
Q Mi = Q x t / N
Q
Current dispensing module Real-dispensing module
Dispensing simulations are derived by different boundary
conditions to meet the real world requirements
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What’s the next step for prediction ?
Filler size distribution during molding
Strip/Package Warpage prediction
after molding
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Simulate the topnotch professional molding with constant technical innovation.
1990
2000
2010
2018
Past: Molding Simulation
(Software only)
Now: Molding Simulation Solution
(Software, Material, Machine)
Future: Molding Solution
(System control, Material, Process)
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Talent is the most important asset of an enterprise !
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Moldex3D