FPGA Process

Flowchart

Backup

FPGA Configurability

• Basis of configurability– Nature of transistor based FPGA

• Physical limitations– Through header on PCB using Xilinx provided

development tools

Backup

FPGA Configurability

• Customer configurable– Configuration languages• Knowledge of VHDL/Verilog

– Development packages• Xilinx provided development tools

– Physical configuration requirements• Connect programmer and download data file, restart

board

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Processing Elements

DSP• CPU based• C Language

FPGA• Transistor based• VHDL/Verilog

Backup

Customer Needs• Use Supplied Components

– 10MP Visual Camera– IR Camera– 1 of the 2 Inertial Navigation Systems

depending on availability • NovAtel OEM Board OEMV3• NovAtel OEM Board OEMV2

– OEM Camera Processing Board

• Interface to single 10Mpixel Camera through proprietary “D3 Camera” connector.

• Interface to single Thermal Camera through Camera Link Interface.

• Capture 10MP data at 1FPS• Capture the Thermal Camera data

synchronized with the 10Mpixel camera. • Capture INS data and store to match

corresponding photos. • Accept data from auxiliary external cameras

and INS units

• Make data overlay and processing possible on-board

• Output data from the supplied OEM Board connection for real-time viewing

• Store data internally during flight using a SSD SATA drive.

• Package must include mounting and space necessary for four cameras.

• Package everything (except for the IR camera) to protect it against the environment and to minimize the size. “Everything” Includes:– (4) visual cameras and their lenses– (1) INS sensor– (1) OEM Camera Processing Board– Any other components necessary for operation

• Position images for ground observations• Make cameras separable from the processing

hardware• Interface package to a light passenger aircraft.

Backup slide: Final Output

IR Camera with INS Data overlay

Color Aerial Photograph

Customer provided devices

• OEM Digital Signal Processing Board• CameraLink® to D3 Conversion Chips• Novatel OEM Board• IMU System• Cameras – (2) Using D3 Connector interface– (1) IR using Camera Link

BACKUP SLIDE

Appendix: RadiationAssumptions: Treat enclosure as a black box

Neglect ConvectionNeglect Conduction

Temperature at surface of chassis = temperature inside of chassisAll Power consumed by electronics is output as heat radiating oute= .89 qc = .5qb

Appendix: Humidity

• Dew point temperature is given as:

– Constants defined as follows:

• Variables: – Td - Dew point (C)– T - Ambient temperature

(C)– RH - Relative humidity (%)– m - Temperature range

dependant constant (non-dimensional)

– Tn - Temperature range dependant constant (C)

constants

temp range Tn (°C) m

0 to 50 243.12 17.62

-40 to 0 272.62 22.46