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CALL FOR PAPERS SEPTEMBER 27-30, 2010 Phone: +1 407.380.1553 • Web Address: www.icaleo.org PRESENTED BY:

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Page 1: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

NON-PROFIT ORG.

U.S. POSTaGe

PaIDORlaNDO, Fl

PeRmIT 2342

13501 Ingenuity Dr., Suite 128 | Orlando, FL 32826Phone: +1 407.380.1553 · Fax: +1 407.380.5588E-mail: [email protected] Address: www.icaleo.org

Call for PaPers

abstraCt submission and notifiCation sChedule

Preferred method of submission is via the ICALEO® website www.icaleo.org

sePtember27-30, 2010

Phone: +1 407.380.1553 • Web Address: www.icaleo.org

PRESENTED BY:

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marCh 2Abstract Submission Deadline

aPril 1Acceptance Notice with Instructions to Authors

July 15Speaker Final Manuscripts Due, PDF Format

July 15Poster Final Manuscripts Due, PDF Format

august 5Speaker Registration & Payment Due

how to PresentSubmitted abstracts should contain original, recent, unpublished results of application research, development, or implementation. Authors are encouraged to indicate the current phase of their work. Commercial papers will not be accepted. Authors are asked to secure company and/or government security clearance to present and publish as early as possible. This enables LIA to ensure the quality of the conference and to minimize last minute withdrawn papers. Please secure travel and accommodation funding through sponsoring organizations prior to submitting abstracts. We regret that travel and accommodation funding is not available through LIA. final manusCriPt submissionManuscript deadlines must be strictly observed. Late manuscripts run the risk of not being published in the proceedings. This policy enables LIA to better serve congress participants by publishing the proceedings before the congress and distributing them onsite. Your cooperation is appreciated by all.

about laser institute of ameriCaLaser Institute of America (LIA), founded in 1968, is the professional society dedicated to fostering lasers, laser applications and laser safety worldwide. LIA has grown to represent hundreds of corporate and thousands of individual members in the laser industry. Visit www.laserinstitute.org for more information! Join the lia!To take advantage of member registration rates, please go to the LIA website at www.laserinstitute.org for membership information and an application, or call 1.800.34LASER or +1 407.380.1553.

sPonsorshiP & Vendor oPPortunities

ICALEO® offers various level sponsorship opportunities to give your company or organization added promotional exposure.

The ICALEO® Vendor Program is open to all companies and institutions (industrial, medical and educational) within the laser industry. This program gives exhibitors and attendees the opportunity to meet and offers exhibitors the chance to experience ICALEO firsthand.

The Laser Industry Vendor Reception is a unique evening event and is the only scheduled event during that time.

For further information on sponsorship and vendor opportunities, please contact David Evans by phone or email.1.800.34.LASER • [email protected]

welCome to anaheim, California usa

In the center of Southern California, Anaheim/Orange County is the center of fun! The real OC features world-class shopping, trendy restaurants and nightlife, premier arts venues, inviting beaches and the ultimate family attractions.

Warm sunshine, swaying palm trees and breathtaking ocean views create a relaxed Southern California lifestyle where shorts are always in season. Experience Orange County – It’s So California!

sePtember 27-30ICALEO® Anaheim, CA

For program inquiries, please contact LIA Director of Conferences, Gail Loiacono - [email protected]

Page 2: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

about iCaleo®

General Chair: Xinbing Liu, Panasonic Boston Laboratory, Cambridge, MA, USA

The International Congress on Applications of Lasers & Electro-Optics (ICALEO®) has a 28 year history as the conference where researchers and end-users meet to review the state-of-the-art in laser materials processing, laser microprocessing and nanomanufacturing as well as predict where the future will lead. From its inception, ICALEO has been devoted to the field of laser materials processing at macro, micro, and nanoscales and is viewed as the premier source of technical information in the field. Each year ICALEO features areas of topical interest. This year’s featured sessions include diode lasers for processing and pumping, laser process monitoring and control, laser processing of biological materials, lasers in nanotechnology and environmental technology, laser hybrid processing, laser manufacturing for alternative energy sources and laser business development.

who should attend iCaleo®?Anyone interested in laser materials processing from the basic understanding of the interaction between a laser beam and a material, to those interested in how a process can be integrated and optimized for an application. Laser Institute of America’s goal for ICALEO is to bring both academic and industrial people together who may benefit from laser technology. This includes end-users and scientists as well as engineers and technicians engaged in developing laser technology.

international adVisory boardDavid Belforte, Industrial Laser Solutions, Sturbridge, MA, USAEckhard Beyer, Fraunhofer IWS, Dresden, GermanyJan Dubowski, Univ. de Sherbrooke, Sherbrooke, QC, CanadaWalter Duley, Univ. of Waterloo, Waterloo, ON, CanadaRémy Fabbro, LALP (CNRS), Paris, FranceMike Green, Association of Laser Users, Abingdon, Oxon, Great BritainAnthony Hoult, IPG Photonics, Oxford, MA, USAMarshall Jones, GE Global Research, Niskayuna, NY, USAJyoti Mazumder, CLAIM, Univ. of Michigan, Ann Arbor, MI, USAMinoru Obara, Keio Univ., Yokohama-Shi, JapanAndreas Ostendorf, Ruhr-Univ. Bochum, Bochum, GermanyRajesh Patel, Spectra Physics, Division of Newport Corporation, Mountain View, CA, USAHenry Peng, GE (China) Research & Development Center Co., Shanghai, People’s Republic of ChinaWilliam Steen, The Univ. of Liverpool, Herts, Great BritainMinlin Zhong, Tsingshua Univ., Beijing, People’s Republic of China

iCaleo® teChniCal sessions

laser solutions short CoursesChair: Stefan Kaierle, Fraunhofer ILT, Aachen, Germany

This multi-day program is designed to provide manufacturing professionals a choice of laser related short courses, each addressing the capabilities of lasers to improve manufacturing methods.

Instructors are sought to present short courses which will provide the attendee with a broad-based understanding of how the practical applications of lasers are making an impact on manufacturing and provide resources for further information. Courses should be educational in format and 90 minutes in length. Commercial content will not be accepted. Content can include all areas of laser processing applications, such as cutting, welding, drilling, ablation, surface modification, rapid prototyping, ultrafast processing, or other materials processing applications as well as sensing, measurement, alignment, or other quality control applications. Moreover, topics such as laser system design, environmental issues and safety aspects can be covered.

Potential instructors should go to www.icaleo.org for more information.

business forum & Panel disCussionCo-Chairs: Neil Ball, Directed Light Inc., San Jose, CA, USASri Venkat, Coherent Inc., Santa Clara, CA, USA

tools and teChniques for today’s eConomyThis session will focus on practical techniques to optimize your performance in today’s economy and prepare for tomorrow’s. There will be sessions on marketing, managing cash flow, financing capital equipment and more.

Poster Presentation galleryBreakfast with the Presenters – Poster Paper presenters will be available to discuss their findings during a buffet breakfast one morning of the conference. This is an excellent opportunity for networking and enlightenment. Spotlight your work with 2 full days of exposure.

12th annual iCaleo® student PaPer award Contest Awards will be presented to 1st, 2nd and 3rd place winners in addition to being submitted to LIA’s Journal of Laser Applications® for publication (paper will go through the peer review process). Prize winners will be notified after the conclusion of the conference and will be announced through an article in the LIA TODAY newsletter featuring ICALEO. Submitted papers will be reviewed by conference chairs and slotted into appropriate sessions. Judges will not review their own students. Students with accepted papers will be judged by an international panel on the following criteria: • Originality of Topic / Material Presented• Scientific and Technical Merit / Impact• Clarity of Presentation (Oral & Visual)

space in this contest is limited – encourage your students to participate! for more information, e-mail: [email protected]

toPiCs of interest aPPliCations• Aerospace• Automotive• Biomedical• Education• Energy• Flexible Manufacturing• Innovative Applications• Laser Safety• Shipbuilding / Heavy Manufacturing

ProCesses• Advanced Machining• Cutting / Drilling• Direct Metal Deposition• Environmental Issues• Forming & Cleaning• Hybrid Processes• Process Modeling & Control• Rapid Prototyping• Remote Welding• Surface Modification• Welding

lasers & systems• Advanced Laser Sources• Diode Lasers• Diode-pumped Lasers• High Brightness Lasers• Hybrid Systems• Laser Optics & Quality• Sensing & Monitoring• Software Development

Chair: Klaus Löffler, TRUMPF Laser and Systems GmBH, Ditizingen, Germany

Magdi Azer, GE Global Research, Niskayuna, NY, USA

Milan Brandt, Swinburne Univ. of Technology, Melbourne, Australia

Paul Denney, CCAT, East Hartford, CT, USA

Rémy Fabbro, LALP (CNRS), Paris, France

Bo Gu, IPG Photonics Corporation, Oxford, MA, USA

Seiji Katayama, Osaka Univ., Osaka, Japan

Ingomar Kelbassa, RWTH Aachen Univ., Aachen, Germany

Lin Li, The Univ. of Manchester, Manchester, Great Britain

Edward Metzbower, eamweld LLC, Alexandria, VA, USA

William O’Neill, Univ. of Cambridge, Cambridge, Great Britain

Juan Pou, Univ. de Vigo, Vigo, Spain

Stanley Ream, EWI, Columbus, OH, USA

Michael Rethmeier, BAM, Berlin, Germany

Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, Finland

Rui Vilar, Instituto Superior Técnico, Lisboa Codex, Portugal

Rudolf Weber, IFSW Stuttgart, Stuttgart, Germany

toPiCs of interest aPPliCations• Spatial & Temporal Pulse Shaping Applications to Microprocessing• Integrated Optics• Lasers in Electronics Production• Use of Lasers in Fabrication of Solar Cells and Photonic Components• Medical Device Fabrication• MEMS Fabrication & Lasers in Microsystems Technology

ProCesses• Cutting & Drilling• Laser Ablation• Laser Micro-joining • Material & Surface Property Modification• Nonlinear & Near-field Optical Processes• Two-photon Processes & Microstereolithography• Ultrafast Laser Processes

systems• Beam Delivery Systems & Scanning Optics• Laser Micromachining Systems• Motion Control in Microprocessing• Picosecond & Femtosecond Lasers• UV/VUV & EUV Sources• Beam Sources for Nanoapplications

Chair: Kunihiko Washio, Paradigm Laser Research Ltd, Machida, Tokyo, Japan

Jun Amako, Seiko Epson Corporation, Japan

David Clark, Newport Corporation, Mountain View, CA, USA

Masayuki Fujita, Institute for Laser Technology, Osaka, Japan

Paul Harrison, Heriot-Watt Univ., East Grinstead, Great Britain

Peter Herman, Univ. of Toronto, Toronto, ON, Canada

Nam Seong Kim, EO Technics, Anyang, South Korea

Klaus Kleine, Laserline, Inc., Santa Clara, CA, USA

Rainer Kling, Laser Zentrum Hannover e.V.,

Hannover, Germany

Michael Mielke, Raydiance, Inc., Petaluma, CA, USA

Stefan Nolte, Friedrich-Schiller-Univ. Jena, Jena, Germany

Etsuji Ohmura, Osaka Univ., Suita, Osaka, Japan

Yasu Osako, ESI, Portland, OR, USA

Henrikki Pantsar, Fraunhofer CLT, Plymouth, MI, USA

Michael Schmidt, Bayerisches Laserzentrum GmbH,

Erlangen, Germany

Juergen Stollhof, TRUMPF Inc., Plymouth Township, MI, USA

Xiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People’s Republic of China

toPiCs of interest

Co-Chairs:Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USAXianfan Xu, Purdue Univ., West Lafayette, IN, USA

Craig Arnold, Princeton Univ., Princeton, NJ, USAStephan Barcikowski, Laser Zentrum Hannover e.V., Hannover, GermanyKevin Chen, Beijing Golden Way Scientific Co. Ltd., People’s Republic of ChinaShaochen Chen, Univ. of Texas at Austin, Austin, TX, USASuman Das, Georgia Institute of Technology, Atlanta, GA, USAHaris Doumanidis, Univ. of Cyprus, Nicosia, CyprusNick Fang, Univ. of Illinois at Urbana Champaign, Urbana, IL, USACostas Grigoropoulos, Univ. of California - Berkeley, Berkeley, CA, USAChangzhi Gu, Institute of Physics, Chinese Academy of Sciences, ChinaYoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Niigata, JapanSungho Jeong, Gwangju Institute of Science and Technology, South KoreaLan Jiang, Beijing Institute of Technology, People’s Republic of ChinaYuankun Lin, Univ. of Texas-Pan American, TX, USAEtsuji Ohmura, Osaka Univ., JapanAlberto Salleo, Stanford Univ., CA, USAXinwei Wang, Iowa State Univ., IA, USAWeidong Zhou, Univ. of Texas at Arlington, TX, USA

highlighted sessions• Nanomanufacturing of

Energy Devices• Nanometrology• Nanofabrication of

Biomedical Devices• Nanofabrication of

Functional Devices

aPPliCations• Biomaterial

Nanofabrication• Biomedical Devices• Cognitive Devices• Communications• Energy Devices• Imaging• Information Technology• Laser Interactions with

Biomolecules• Nano / Bio-sensors• Nanoelectronics• NEMS• Solar Cells

ProCesses• DUV / EUV Lithography• Femtosecond Laser

Machining• Holography &

Interferometry• Maskless & Soft

Lithography• Nanofiber

Electrospinning• Nanoimprinting /

Embossing• Nanoxerography• Near Field Scanning

Optical Methods• Plasmonic Imaging• Pulsed Laser Deposition• X-Ray Lithography / LIGA

systems• Laser Scanners /

Profilometers• Nanomanipulators• Nanometrology Platforms• Nanopositioners• Nanoscale Rapid

Prototypers• NSOM / SNOM• Optical / Laser

Lithography• Scanning Probe

Microscopes• Steppers & Aligners

laser materials ProCessing Committee laser miCroProCessing Committee nanomanufaCturing Committee

welCome Celebration – Start the week off right with the Sunday evening reception.

President’s reCePtion – Celebrate 29 years of ICALEO during this special event!

student PaPer award – Student papers will be evaluated and judged by ICALEO conference and session chairs.

laser industry Vendor reCePtion & tabletoP disPlay – Exhibitors and attendees have the opportunity to meet and share product ideas.

lia awards lunCheon – Enjoy lunch with colleagues followed by the awards presentation and honored speaker address.

networking oPPortunities – Meet colleagues from around the world!

iCaleo® highlighted eVents

Page 3: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

about iCaleo®

General Chair: Xinbing Liu, Panasonic Boston Laboratory, Cambridge, MA, USA

The International Congress on Applications of Lasers & Electro-Optics (ICALEO®) has a 28 year history as the conference where researchers and end-users meet to review the state-of-the-art in laser materials processing, laser microprocessing and nanomanufacturing as well as predict where the future will lead. From its inception, ICALEO has been devoted to the field of laser materials processing at macro, micro, and nanoscales and is viewed as the premier source of technical information in the field. Each year ICALEO features areas of topical interest. This year’s featured sessions include diode lasers for processing and pumping, laser process monitoring and control, laser processing of biological materials, lasers in nanotechnology and environmental technology, laser hybrid processing, laser manufacturing for alternative energy sources and laser business development.

who should attend iCaleo®?Anyone interested in laser materials processing from the basic understanding of the interaction between a laser beam and a material, to those interested in how a process can be integrated and optimized for an application. Laser Institute of America’s goal for ICALEO is to bring both academic and industrial people together who may benefit from laser technology. This includes end-users and scientists as well as engineers and technicians engaged in developing laser technology.

international adVisory boardDavid Belforte, Industrial Laser Solutions, Sturbridge, MA, USAEckhard Beyer, Fraunhofer IWS, Dresden, GermanyJan Dubowski, Univ. de Sherbrooke, Sherbrooke, QC, CanadaWalter Duley, Univ. of Waterloo, Waterloo, ON, CanadaRémy Fabbro, LALP (CNRS), Paris, FranceMike Green, Association of Laser Users, Abingdon, Oxon, Great BritainAnthony Hoult, IPG Photonics, Oxford, MA, USAMarshall Jones, GE Global Research, Niskayuna, NY, USAJyoti Mazumder, CLAIM, Univ. of Michigan, Ann Arbor, MI, USAMinoru Obara, Keio Univ., Yokohama-Shi, JapanAndreas Ostendorf, Ruhr-Univ. Bochum, Bochum, GermanyRajesh Patel, Spectra Physics, Division of Newport Corporation, Mountain View, CA, USAHenry Peng, GE (China) Research & Development Center Co., Shanghai, People’s Republic of ChinaWilliam Steen, The Univ. of Liverpool, Herts, Great BritainMinlin Zhong, Tsingshua Univ., Beijing, People’s Republic of China

iCaleo® teChniCal sessions

laser solutions short CoursesChair: Stefan Kaierle, Fraunhofer ILT, Aachen, Germany

This multi-day program is designed to provide manufacturing professionals a choice of laser related short courses, each addressing the capabilities of lasers to improve manufacturing methods.

Instructors are sought to present short courses which will provide the attendee with a broad-based understanding of how the practical applications of lasers are making an impact on manufacturing and provide resources for further information. Courses should be educational in format and 90 minutes in length. Commercial content will not be accepted. Content can include all areas of laser processing applications, such as cutting, welding, drilling, ablation, surface modification, rapid prototyping, ultrafast processing, or other materials processing applications as well as sensing, measurement, alignment, or other quality control applications. Moreover, topics such as laser system design, environmental issues and safety aspects can be covered.

Potential instructors should go to www.icaleo.org for more information.

business forum & Panel disCussionCo-Chairs: Neil Ball, Directed Light Inc., San Jose, CA, USASri Venkat, Coherent Inc., Santa Clara, CA, USA

tools and teChniques for today’s eConomyThis session will focus on practical techniques to optimize your performance in today’s economy and prepare for tomorrow’s. There will be sessions on marketing, managing cash flow, financing capital equipment and more.

Poster Presentation galleryBreakfast with the Presenters – Poster Paper presenters will be available to discuss their findings during a buffet breakfast one morning of the conference. This is an excellent opportunity for networking and enlightenment. Spotlight your work with 2 full days of exposure.

12th annual iCaleo® student PaPer award Contest Awards will be presented to 1st, 2nd and 3rd place winners in addition to being submitted to LIA’s Journal of Laser Applications® for publication (paper will go through the peer review process). Prize winners will be notified after the conclusion of the conference and will be announced through an article in the LIA TODAY newsletter featuring ICALEO. Submitted papers will be reviewed by conference chairs and slotted into appropriate sessions. Judges will not review their own students. Students with accepted papers will be judged by an international panel on the following criteria: • Originality of Topic / Material Presented• Scientific and Technical Merit / Impact• Clarity of Presentation (Oral & Visual)

space in this contest is limited – encourage your students to participate! for more information, e-mail: [email protected]

toPiCs of interest aPPliCations• Aerospace• Automotive• Biomedical• Education• Energy• Flexible Manufacturing• Innovative Applications• Laser Safety• Shipbuilding / Heavy Manufacturing

ProCesses• Advanced Machining• Cutting / Drilling• Direct Metal Deposition• Environmental Issues• Forming & Cleaning• Hybrid Processes• Process Modeling & Control• Rapid Prototyping• Remote Welding• Surface Modification• Welding

lasers & systems• Advanced Laser Sources• Diode Lasers• Diode-pumped Lasers• High Brightness Lasers• Hybrid Systems• Laser Optics & Quality• Sensing & Monitoring• Software Development

Chair: Klaus Löffler, TRUMPF Laser and Systems GmBH, Ditizingen, Germany

Magdi Azer, GE Global Research, Niskayuna, NY, USA

Milan Brandt, Swinburne Univ. of Technology, Melbourne, Australia

Paul Denney, CCAT, East Hartford, CT, USA

Rémy Fabbro, LALP (CNRS), Paris, France

Bo Gu, IPG Photonics Corporation, Oxford, MA, USA

Seiji Katayama, Osaka Univ., Osaka, Japan

Ingomar Kelbassa, RWTH Aachen Univ., Aachen, Germany

Lin Li, The Univ. of Manchester, Manchester, Great Britain

Edward Metzbower, eamweld LLC, Alexandria, VA, USA

William O’Neill, Univ. of Cambridge, Cambridge, Great Britain

Juan Pou, Univ. de Vigo, Vigo, Spain

Stanley Ream, EWI, Columbus, OH, USA

Michael Rethmeier, BAM, Berlin, Germany

Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, Finland

Rui Vilar, Instituto Superior Técnico, Lisboa Codex, Portugal

Rudolf Weber, IFSW Stuttgart, Stuttgart, Germany

toPiCs of interest aPPliCations• Spatial & Temporal Pulse Shaping Applications to Microprocessing• Integrated Optics• Lasers in Electronics Production• Use of Lasers in Fabrication of Solar Cells and Photonic Components• Medical Device Fabrication• MEMS Fabrication & Lasers in Microsystems Technology

ProCesses• Cutting & Drilling• Laser Ablation• Laser Micro-joining • Material & Surface Property Modification• Nonlinear & Near-field Optical Processes• Two-photon Processes & Microstereolithography• Ultrafast Laser Processes

systems• Beam Delivery Systems & Scanning Optics• Laser Micromachining Systems• Motion Control in Microprocessing• Picosecond & Femtosecond Lasers• UV/VUV & EUV Sources• Beam Sources for Nanoapplications

Chair: Kunihiko Washio, Paradigm Laser Research Ltd, Machida, Tokyo, Japan

Jun Amako, Seiko Epson Corporation, Japan

David Clark, Newport Corporation, Mountain View, CA, USA

Masayuki Fujita, Institute for Laser Technology, Osaka, Japan

Paul Harrison, Heriot-Watt Univ., East Grinstead, Great Britain

Peter Herman, Univ. of Toronto, Toronto, ON, Canada

Nam Seong Kim, EO Technics, Anyang, South Korea

Klaus Kleine, Laserline, Inc., Santa Clara, CA, USA

Rainer Kling, Laser Zentrum Hannover e.V.,

Hannover, Germany

Michael Mielke, Raydiance, Inc., Petaluma, CA, USA

Stefan Nolte, Friedrich-Schiller-Univ. Jena, Jena, Germany

Etsuji Ohmura, Osaka Univ., Suita, Osaka, Japan

Yasu Osako, ESI, Portland, OR, USA

Henrikki Pantsar, Fraunhofer CLT, Plymouth, MI, USA

Michael Schmidt, Bayerisches Laserzentrum GmbH,

Erlangen, Germany

Juergen Stollhof, TRUMPF Inc., Plymouth Township, MI, USA

Xiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People’s Republic of China

toPiCs of interest

Co-Chairs:Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USAXianfan Xu, Purdue Univ., West Lafayette, IN, USA

Craig Arnold, Princeton Univ., Princeton, NJ, USAStephan Barcikowski, Laser Zentrum Hannover e.V., Hannover, GermanyKevin Chen, Beijing Golden Way Scientific Co. Ltd., People’s Republic of ChinaShaochen Chen, Univ. of Texas at Austin, Austin, TX, USASuman Das, Georgia Institute of Technology, Atlanta, GA, USAHaris Doumanidis, Univ. of Cyprus, Nicosia, CyprusNick Fang, Univ. of Illinois at Urbana Champaign, Urbana, IL, USACostas Grigoropoulos, Univ. of California - Berkeley, Berkeley, CA, USAChangzhi Gu, Institute of Physics, Chinese Academy of Sciences, ChinaYoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Niigata, JapanSungho Jeong, Gwangju Institute of Science and Technology, South KoreaLan Jiang, Beijing Institute of Technology, People’s Republic of ChinaYuankun Lin, Univ. of Texas-Pan American, TX, USAEtsuji Ohmura, Osaka Univ., JapanAlberto Salleo, Stanford Univ., CA, USAXinwei Wang, Iowa State Univ., IA, USAWeidong Zhou, Univ. of Texas at Arlington, TX, USA

highlighted sessions• Nanomanufacturing of

Energy Devices• Nanometrology• Nanofabrication of

Biomedical Devices• Nanofabrication of

Functional Devices

aPPliCations• Biomaterial

Nanofabrication• Biomedical Devices• Cognitive Devices• Communications• Energy Devices• Imaging• Information Technology• Laser Interactions with

Biomolecules• Nano / Bio-sensors• Nanoelectronics• NEMS• Solar Cells

ProCesses• DUV / EUV Lithography• Femtosecond Laser

Machining• Holography &

Interferometry• Maskless & Soft

Lithography• Nanofiber

Electrospinning• Nanoimprinting /

Embossing• Nanoxerography• Near Field Scanning

Optical Methods• Plasmonic Imaging• Pulsed Laser Deposition• X-Ray Lithography / LIGA

systems• Laser Scanners /

Profilometers• Nanomanipulators• Nanometrology Platforms• Nanopositioners• Nanoscale Rapid

Prototypers• NSOM / SNOM• Optical / Laser

Lithography• Scanning Probe

Microscopes• Steppers & Aligners

laser materials ProCessing Committee laser miCroProCessing Committee nanomanufaCturing Committee

welCome Celebration – Start the week off right with the Sunday evening reception.

President’s reCePtion – Celebrate 29 years of ICALEO during this special event!

student PaPer award – Student papers will be evaluated and judged by ICALEO conference and session chairs.

laser industry Vendor reCePtion & tabletoP disPlay – Exhibitors and attendees have the opportunity to meet and share product ideas.

lia awards lunCheon – Enjoy lunch with colleagues followed by the awards presentation and honored speaker address.

networking oPPortunities – Meet colleagues from around the world!

iCaleo® highlighted eVents

Page 4: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

about iCaleo®

General Chair: Xinbing Liu, Panasonic Boston Laboratory, Cambridge, MA, USA

The International Congress on Applications of Lasers & Electro-Optics (ICALEO®) has a 28 year history as the conference where researchers and end-users meet to review the state-of-the-art in laser materials processing, laser microprocessing and nanomanufacturing as well as predict where the future will lead. From its inception, ICALEO has been devoted to the field of laser materials processing at macro, micro, and nanoscales and is viewed as the premier source of technical information in the field. Each year ICALEO features areas of topical interest. This year’s featured sessions include diode lasers for processing and pumping, laser process monitoring and control, laser processing of biological materials, lasers in nanotechnology and environmental technology, laser hybrid processing, laser manufacturing for alternative energy sources and laser business development.

who should attend iCaleo®?Anyone interested in laser materials processing from the basic understanding of the interaction between a laser beam and a material, to those interested in how a process can be integrated and optimized for an application. Laser Institute of America’s goal for ICALEO is to bring both academic and industrial people together who may benefit from laser technology. This includes end-users and scientists as well as engineers and technicians engaged in developing laser technology.

international adVisory boardDavid Belforte, Industrial Laser Solutions, Sturbridge, MA, USAEckhard Beyer, Fraunhofer IWS, Dresden, GermanyJan Dubowski, Univ. de Sherbrooke, Sherbrooke, QC, CanadaWalter Duley, Univ. of Waterloo, Waterloo, ON, CanadaRémy Fabbro, LALP (CNRS), Paris, FranceMike Green, Association of Laser Users, Abingdon, Oxon, Great BritainAnthony Hoult, IPG Photonics, Oxford, MA, USAMarshall Jones, GE Global Research, Niskayuna, NY, USAJyoti Mazumder, CLAIM, Univ. of Michigan, Ann Arbor, MI, USAMinoru Obara, Keio Univ., Yokohama-Shi, JapanAndreas Ostendorf, Ruhr-Univ. Bochum, Bochum, GermanyRajesh Patel, Spectra Physics, Division of Newport Corporation, Mountain View, CA, USAHenry Peng, GE (China) Research & Development Center Co., Shanghai, People’s Republic of ChinaWilliam Steen, The Univ. of Liverpool, Herts, Great BritainMinlin Zhong, Tsingshua Univ., Beijing, People’s Republic of China

iCaleo® teChniCal sessions

laser solutions short CoursesChair: Stefan Kaierle, Fraunhofer ILT, Aachen, Germany

This multi-day program is designed to provide manufacturing professionals a choice of laser related short courses, each addressing the capabilities of lasers to improve manufacturing methods.

Instructors are sought to present short courses which will provide the attendee with a broad-based understanding of how the practical applications of lasers are making an impact on manufacturing and provide resources for further information. Courses should be educational in format and 90 minutes in length. Commercial content will not be accepted. Content can include all areas of laser processing applications, such as cutting, welding, drilling, ablation, surface modification, rapid prototyping, ultrafast processing, or other materials processing applications as well as sensing, measurement, alignment, or other quality control applications. Moreover, topics such as laser system design, environmental issues and safety aspects can be covered.

Potential instructors should go to www.icaleo.org for more information.

business forum & Panel disCussionCo-Chairs: Neil Ball, Directed Light Inc., San Jose, CA, USASri Venkat, Coherent Inc., Santa Clara, CA, USA

tools and teChniques for today’s eConomyThis session will focus on practical techniques to optimize your performance in today’s economy and prepare for tomorrow’s. There will be sessions on marketing, managing cash flow, financing capital equipment and more.

Poster Presentation galleryBreakfast with the Presenters – Poster Paper presenters will be available to discuss their findings during a buffet breakfast one morning of the conference. This is an excellent opportunity for networking and enlightenment. Spotlight your work with 2 full days of exposure.

12th annual iCaleo® student PaPer award Contest Awards will be presented to 1st, 2nd and 3rd place winners in addition to being submitted to LIA’s Journal of Laser Applications® for publication (paper will go through the peer review process). Prize winners will be notified after the conclusion of the conference and will be announced through an article in the LIA TODAY newsletter featuring ICALEO. Submitted papers will be reviewed by conference chairs and slotted into appropriate sessions. Judges will not review their own students. Students with accepted papers will be judged by an international panel on the following criteria: • Originality of Topic / Material Presented• Scientific and Technical Merit / Impact• Clarity of Presentation (Oral & Visual)

space in this contest is limited – encourage your students to participate! for more information, e-mail: [email protected]

toPiCs of interest aPPliCations• Aerospace• Automotive• Biomedical• Education• Energy• Flexible Manufacturing• Innovative Applications• Laser Safety• Shipbuilding / Heavy Manufacturing

ProCesses• Advanced Machining• Cutting / Drilling• Direct Metal Deposition• Environmental Issues• Forming & Cleaning• Hybrid Processes• Process Modeling & Control• Rapid Prototyping• Remote Welding• Surface Modification• Welding

lasers & systems• Advanced Laser Sources• Diode Lasers• Diode-pumped Lasers• High Brightness Lasers• Hybrid Systems• Laser Optics & Quality• Sensing & Monitoring• Software Development

Chair: Klaus Löffler, TRUMPF Laser and Systems GmBH, Ditizingen, Germany

Magdi Azer, GE Global Research, Niskayuna, NY, USA

Milan Brandt, Swinburne Univ. of Technology, Melbourne, Australia

Paul Denney, CCAT, East Hartford, CT, USA

Rémy Fabbro, LALP (CNRS), Paris, France

Bo Gu, IPG Photonics Corporation, Oxford, MA, USA

Seiji Katayama, Osaka Univ., Osaka, Japan

Ingomar Kelbassa, RWTH Aachen Univ., Aachen, Germany

Lin Li, The Univ. of Manchester, Manchester, Great Britain

Edward Metzbower, eamweld LLC, Alexandria, VA, USA

William O’Neill, Univ. of Cambridge, Cambridge, Great Britain

Juan Pou, Univ. de Vigo, Vigo, Spain

Stanley Ream, EWI, Columbus, OH, USA

Michael Rethmeier, BAM, Berlin, Germany

Antti Salminen, Lappeenranta Univ. of Technology, Lappeenranta, Finland

Rui Vilar, Instituto Superior Técnico, Lisboa Codex, Portugal

Rudolf Weber, IFSW Stuttgart, Stuttgart, Germany

toPiCs of interest aPPliCations• Spatial & Temporal Pulse Shaping Applications to Microprocessing• Integrated Optics• Lasers in Electronics Production• Use of Lasers in Fabrication of Solar Cells and Photonic Components• Medical Device Fabrication• MEMS Fabrication & Lasers in Microsystems Technology

ProCesses• Cutting & Drilling• Laser Ablation• Laser Micro-joining • Material & Surface Property Modification• Nonlinear & Near-field Optical Processes• Two-photon Processes & Microstereolithography• Ultrafast Laser Processes

systems• Beam Delivery Systems & Scanning Optics• Laser Micromachining Systems• Motion Control in Microprocessing• Picosecond & Femtosecond Lasers• UV/VUV & EUV Sources• Beam Sources for Nanoapplications

Chair: Kunihiko Washio, Paradigm Laser Research Ltd, Machida, Tokyo, Japan

Jun Amako, Seiko Epson Corporation, Japan

David Clark, Newport Corporation, Mountain View, CA, USA

Masayuki Fujita, Institute for Laser Technology, Osaka, Japan

Paul Harrison, Heriot-Watt Univ., East Grinstead, Great Britain

Peter Herman, Univ. of Toronto, Toronto, ON, Canada

Nam Seong Kim, EO Technics, Anyang, South Korea

Klaus Kleine, Laserline, Inc., Santa Clara, CA, USA

Rainer Kling, Laser Zentrum Hannover e.V.,

Hannover, Germany

Michael Mielke, Raydiance, Inc., Petaluma, CA, USA

Stefan Nolte, Friedrich-Schiller-Univ. Jena, Jena, Germany

Etsuji Ohmura, Osaka Univ., Suita, Osaka, Japan

Yasu Osako, ESI, Portland, OR, USA

Henrikki Pantsar, Fraunhofer CLT, Plymouth, MI, USA

Michael Schmidt, Bayerisches Laserzentrum GmbH,

Erlangen, Germany

Juergen Stollhof, TRUMPF Inc., Plymouth Township, MI, USA

Xiaoyan Zeng, Huazhong Univ. of Science & Technology, Wuhan, People’s Republic of China

toPiCs of interest

Co-Chairs:Yongfeng Lu, Univ. of Nebraska-Lincoln, Lincoln, NE, USAXianfan Xu, Purdue Univ., West Lafayette, IN, USA

Craig Arnold, Princeton Univ., Princeton, NJ, USAStephan Barcikowski, Laser Zentrum Hannover e.V., Hannover, GermanyKevin Chen, Beijing Golden Way Scientific Co. Ltd., People’s Republic of ChinaShaochen Chen, Univ. of Texas at Austin, Austin, TX, USASuman Das, Georgia Institute of Technology, Atlanta, GA, USAHaris Doumanidis, Univ. of Cyprus, Nicosia, CyprusNick Fang, Univ. of Illinois at Urbana Champaign, Urbana, IL, USACostas Grigoropoulos, Univ. of California - Berkeley, Berkeley, CA, USAChangzhi Gu, Institute of Physics, Chinese Academy of Sciences, ChinaYoshiro Ito, Nagaoka Univ. of Technology, Nagaoka, Niigata, JapanSungho Jeong, Gwangju Institute of Science and Technology, South KoreaLan Jiang, Beijing Institute of Technology, People’s Republic of ChinaYuankun Lin, Univ. of Texas-Pan American, TX, USAEtsuji Ohmura, Osaka Univ., JapanAlberto Salleo, Stanford Univ., CA, USAXinwei Wang, Iowa State Univ., IA, USAWeidong Zhou, Univ. of Texas at Arlington, TX, USA

highlighted sessions• Nanomanufacturing of

Energy Devices• Nanometrology• Nanofabrication of

Biomedical Devices• Nanofabrication of

Functional Devices

aPPliCations• Biomaterial

Nanofabrication• Biomedical Devices• Cognitive Devices• Communications• Energy Devices• Imaging• Information Technology• Laser Interactions with

Biomolecules• Nano / Bio-sensors• Nanoelectronics• NEMS• Solar Cells

ProCesses• DUV / EUV Lithography• Femtosecond Laser

Machining• Holography &

Interferometry• Maskless & Soft

Lithography• Nanofiber

Electrospinning• Nanoimprinting /

Embossing• Nanoxerography• Near Field Scanning

Optical Methods• Plasmonic Imaging• Pulsed Laser Deposition• X-Ray Lithography / LIGA

systems• Laser Scanners /

Profilometers• Nanomanipulators• Nanometrology Platforms• Nanopositioners• Nanoscale Rapid

Prototypers• NSOM / SNOM• Optical / Laser

Lithography• Scanning Probe

Microscopes• Steppers & Aligners

laser materials ProCessing Committee laser miCroProCessing Committee nanomanufaCturing Committee

welCome Celebration – Start the week off right with the Sunday evening reception.

President’s reCePtion – Celebrate 29 years of ICALEO during this special event!

student PaPer award – Student papers will be evaluated and judged by ICALEO conference and session chairs.

laser industry Vendor reCePtion & tabletoP disPlay – Exhibitors and attendees have the opportunity to meet and share product ideas.

lia awards lunCheon – Enjoy lunch with colleagues followed by the awards presentation and honored speaker address.

networking oPPortunities – Meet colleagues from around the world!

iCaleo® highlighted eVents

Page 5: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

NON-PROFIT ORG.

U.S. POSTaGe

PaIDORlaNDO, Fl

PeRmIT 2342

13501 Ingenuity Dr., Suite 128 | Orlando, FL 32826Phone: +1 407.380.1553 · Fax: +1 407.380.5588E-mail: [email protected] Address: www.icaleo.org

Call for PaPers

abstraCt submission and notifiCation sChedule

Preferred method of submission is via the ICALEO® website www.icaleo.org

sePtember27-30, 2010

Phone: +1 407.380.1553 • Web Address: www.icaleo.org

PRESENTED BY:

JANUARY

1 2

3 4 5 6 7 8 9

10 11 12 13 14 15 16

17 18 19 20 21 22 2324

/31 25 26 27 28 29 30

SUN MON TUE WED THU FRI SAT

FEBRUARY

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28

SUN MON TUE WED THU FRI SAT

MARCH

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28 29 30 31

SUN MON TUE WED THU FRI SAT

APRIL

2 3

4 5 6 7 8

1

9 10

11 12 13 14 15 16 17

18 19 20 21 22 23 24

25 26 27 28 29 30

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MAY

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2 3 4 5 6 7 8

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16 17 18 19 20 21 2223

/3024

/31 25 26 27 28 29

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JUNE

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JULY

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1

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AUGUST

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1 2 3 4 5

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SUN MON TUE WED THU FRI SAT

SEPTEMBER

3 4

5 6 7 8 9

1 2

10 11

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19 20 21 22 23 24 25

26 27 28 29 29 30

SUN MON TUE WED THU FRI SAT

OCTOBER

1 2

3 4 5 6 7 8 9

10 11 12 13 14 15 16

17 18 19 20 21 22 2324

/31 25 26 27 28 29 30

SUN MON TUE WED THU FRI SAT

NOVEMBER

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28 29 30

SUN MON TUE WED THU FRI SAT

DECEMBER

3 4

5 6 7 8 9

1 2

10 11

12 13 14 15 16 17 18

19 20 21 22 23 24 25

26 27 28 29 30 31

SUN MON TUE WED THU FRI SAT

marCh 2Abstract Submission Deadline

aPril 1Acceptance Notice with Instructions to Authors

July 15Speaker Final Manuscripts Due, PDF Format

July 15Poster Final Manuscripts Due, PDF Format

august 5Speaker Registration & Payment Due

how to PresentSubmitted abstracts should contain original, recent, unpublished results of application research, development, or implementation. Authors are encouraged to indicate the current phase of their work. Commercial papers will not be accepted. Authors are asked to secure company and/or government security clearance to present and publish as early as possible. This enables LIA to ensure the quality of the conference and to minimize last minute withdrawn papers. Please secure travel and accommodation funding through sponsoring organizations prior to submitting abstracts. We regret that travel and accommodation funding is not available through LIA. final manusCriPt submissionManuscript deadlines must be strictly observed. Late manuscripts run the risk of not being published in the proceedings. This policy enables LIA to better serve congress participants by publishing the proceedings before the congress and distributing them onsite. Your cooperation is appreciated by all.

about laser institute of ameriCaLaser Institute of America (LIA), founded in 1968, is the professional society dedicated to fostering lasers, laser applications and laser safety worldwide. LIA has grown to represent hundreds of corporate and thousands of individual members in the laser industry. Visit www.laserinstitute.org for more information! Join the lia!To take advantage of member registration rates, please go to the LIA website at www.laserinstitute.org for membership information and an application, or call 1.800.34LASER or +1 407.380.1553.

sPonsorshiP & Vendor oPPortunities

ICALEO® offers various level sponsorship opportunities to give your company or organization added promotional exposure.

The ICALEO® Vendor Program is open to all companies and institutions (industrial, medical and educational) within the laser industry. This program gives exhibitors and attendees the opportunity to meet and offers exhibitors the chance to experience ICALEO firsthand.

The Laser Industry Vendor Reception is a unique evening event and is the only scheduled event during that time.

For further information on sponsorship and vendor opportunities, please contact David Evans by phone or email.1.800.34.LASER • [email protected]

welCome to anaheim, California usa

In the center of Southern California, Anaheim/Orange County is the center of fun! The real OC features world-class shopping, trendy restaurants and nightlife, premier arts venues, inviting beaches and the ultimate family attractions.

Warm sunshine, swaying palm trees and breathtaking ocean views create a relaxed Southern California lifestyle where shorts are always in season. Experience Orange County – It’s So California!

sePtember 27-30ICALEO® Anaheim, CA

For program inquiries, please contact LIA Director of Conferences, Gail Loiacono - [email protected]

Page 6: For program inquiries, please contact LIA Director of ......To take advantage of member registration rates, please go to the LIA website at for membership information and an application,

NON-PROFIT ORG.

U.S. POSTaGe

PaIDORlaNDO, Fl

PeRmIT 2342

13501 Ingenuity Dr., Suite 128 | Orlando, FL 32826Phone: +1 407.380.1553 · Fax: +1 407.380.5588E-mail: [email protected] Address: www.icaleo.org

Call for PaPers

abstraCt submission and notifiCation sChedule

Preferred method of submission is via the ICALEO® website www.icaleo.org

sePtember27-30, 2010

Phone: +1 407.380.1553 • Web Address: www.icaleo.org

PRESENTED BY:

JANUARY

1 2

3 4 5 6 7 8 9

10 11 12 13 14 15 16

17 18 19 20 21 22 2324

/31 25 26 27 28 29 30

SUN MON TUE WED THU FRI SAT

FEBRUARY

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28

SUN MON TUE WED THU FRI SAT

MARCH

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28 29 30 31

SUN MON TUE WED THU FRI SAT

APRIL

2 3

4 5 6 7 8

1

9 10

11 12 13 14 15 16 17

18 19 20 21 22 23 24

25 26 27 28 29 30

SUN MON TUE WED THU FRI SAT

MAY

1

2 3 4 5 6 7 8

9 10 11 12 13 14 15

16 17 18 19 20 21 2223

/3024

/31 25 26 27 28 29

SUN MON TUE WED THU FRI SAT

JUNE

4 5

6 7 8 9 10

1 2 3

11 12

13 14 15 16 17 18 19

20 21 22 23 24 25 26

27 28 29 30

SUN MON TUE WED THU FRI SAT

JULY

2 3

4 5 6 7 8

1

9 10

11 12 13 14 15 16 17

18 19 20 21 22 23 24

25 26 27 28 29 30 31

SUN MON TUE WED THU FRI SAT

AUGUST

6 7

8 9 10 11 12

1 2 3 4 5

13 14

15 16 17 18 19 20 21

22 23 24 25 26 27 28

29 30 31

SUN MON TUE WED THU FRI SAT

SEPTEMBER

3 4

5 6 7 8 9

1 2

10 11

12 13 14 15 16 17 18

19 20 21 22 23 24 25

26 27 28 29 29 30

SUN MON TUE WED THU FRI SAT

OCTOBER

1 2

3 4 5 6 7 8 9

10 11 12 13 14 15 16

17 18 19 20 21 22 2324

/31 25 26 27 28 29 30

SUN MON TUE WED THU FRI SAT

NOVEMBER

5 6

7 8 9 10 11

1 2 3 4

12 13

14 15 16 17 18 19 20

21 22 23 24 25 26 27

28 29 30

SUN MON TUE WED THU FRI SAT

DECEMBER

3 4

5 6 7 8 9

1 2

10 11

12 13 14 15 16 17 18

19 20 21 22 23 24 25

26 27 28 29 30 31

SUN MON TUE WED THU FRI SAT

marCh 2Abstract Submission Deadline

aPril 1Acceptance Notice with Instructions to Authors

July 15Speaker Final Manuscripts Due, PDF Format

July 15Poster Final Manuscripts Due, PDF Format

august 5Speaker Registration & Payment Due

how to PresentSubmitted abstracts should contain original, recent, unpublished results of application research, development, or implementation. Authors are encouraged to indicate the current phase of their work. Commercial papers will not be accepted. Authors are asked to secure company and/or government security clearance to present and publish as early as possible. This enables LIA to ensure the quality of the conference and to minimize last minute withdrawn papers. Please secure travel and accommodation funding through sponsoring organizations prior to submitting abstracts. We regret that travel and accommodation funding is not available through LIA. final manusCriPt submissionManuscript deadlines must be strictly observed. Late manuscripts run the risk of not being published in the proceedings. This policy enables LIA to better serve congress participants by publishing the proceedings before the congress and distributing them onsite. Your cooperation is appreciated by all.

about laser institute of ameriCaLaser Institute of America (LIA), founded in 1968, is the professional society dedicated to fostering lasers, laser applications and laser safety worldwide. LIA has grown to represent hundreds of corporate and thousands of individual members in the laser industry. Visit www.laserinstitute.org for more information! Join the lia!To take advantage of member registration rates, please go to the LIA website at www.laserinstitute.org for membership information and an application, or call 1.800.34LASER or +1 407.380.1553.

sPonsorshiP & Vendor oPPortunities

ICALEO® offers various level sponsorship opportunities to give your company or organization added promotional exposure.

The ICALEO® Vendor Program is open to all companies and institutions (industrial, medical and educational) within the laser industry. This program gives exhibitors and attendees the opportunity to meet and offers exhibitors the chance to experience ICALEO firsthand.

The Laser Industry Vendor Reception is a unique evening event and is the only scheduled event during that time.

For further information on sponsorship and vendor opportunities, please contact David Evans by phone or email.1.800.34.LASER • [email protected]

welCome to anaheim, California usa

In the center of Southern California, Anaheim/Orange County is the center of fun! The real OC features world-class shopping, trendy restaurants and nightlife, premier arts venues, inviting beaches and the ultimate family attractions.

Warm sunshine, swaying palm trees and breathtaking ocean views create a relaxed Southern California lifestyle where shorts are always in season. Experience Orange County – It’s So California!

sePtember 27-30ICALEO® Anaheim, CA

For program inquiries, please contact LIA Director of Conferences, Gail Loiacono - [email protected]