Experience sharing on Building and

Construction of High-Tech

Semiconductor Factory with 3D

Facility Information Modeling (FIM)

Minfa Lin

04- 23 - 2015

Agenda

Semiconductor Industry Background

FIM Consideration and evaluation

Use of 3D FIM in UMC

聯電未來--- CSR

永續與展望 經濟持續強化本業競爭力、透過發

展新能源事業提供公司長期成長動能，創造股東最大利益。

環保協助客戶產出低環境衝擊之綠色產品；主動因應氣候變遷問題，善盡地球公民責任。

社會扶助弱勢兒童教育、救助弱勢族群及協助災害救助，持續投入公益，帶動社會向善風氣。

3

以人為本

與社會共榮

與地球共生息

Thanks

for

Your Attention

TEL : 0975-616468

E-mail :Minfa_lin@umc.com

Facility Integration

林銘發 (Minfa Lin)

Industry Background What are the problem face by the industry?

According to International Technology Roadmap for Semiconductors

(ITRS) report, semiconductor industry is moving into 18-inch wafer

manufacturing process from 2014 and to start 14nm gate length process in

2017. Construction and setup of the factory is going to shorten to 9

months .

Data Source from : NTU I am Green Fim project

Nanotech

(<100nm)

L W

Channel

Gate oxide

Shrinking Gate Length

Data Source from : NTU I am Green Fim project

Expanding of Wafer Size

Data Source from : NTU I am Green Fim project

9

Investment of

NT 100 ~ 300 Billion

to Build

a Plant in 9 ~12 month

To speed up the rate of return,

construction of factory and facilities need be shorten

in order to start the production as soon as possible.

Northern Taiwan: Fabs 6A, 8AB-8F, 8S

Southern Taiwan: Fab 12A

Sales/Support Office

Tokyo: UMCJ

Singapore:

Fab 12i

Fab (12 total: 1x6”, 7x8”, 5x12”) R&D

UMC – have setup 12 FAB worldwide

FIM Consideration and Evaluation

No. Subject Item Conclusion

1 Objective FIM Efficiency Construction to reduce error,

improve quality and reduce cost

2 SW/HW

Selection

Market acceptance/

HW/SW popularity

Bentley BIM、 Autodesk BIM、 Tekla

Arch/Multi-threaded Application

3 User Training Diverse selection of

training courses

With many training unit worldwide

Support short-term on side service

4 Cost SW/HW Manpower

Training

Work around with the limited

resource

5 Hook

Improvement

Internal operation

and coordination

Trial on a project in CUB

6 Top

Management

Support

Leader Attitude and

determination

Provide benchmark Data to confirm

Fully support

Evaluation

Use of 3D FIM in Semiconductor

Benefit of FIM

Results of using of 3D in FAB

FAB FIM Planning to process

親臨現場、達到有效溝通

FAB makes use of 3D FIM construction life cycle

• Easy to communicate with virtual reality

• Sharing of central database for a project

• Shorten the work schedule for project

• Generation of report at all stage

Benefit of FIM

Data Source from : NTU I am Green Fim project

Results of using of 3D in FAB

引進 3D 初步成果報告總表

AREA Clash Count 預期 非預期 尚待解決 圖例

RF 160

0

MAU 35 0

TRUSS 10 0

RAP 331 0

SUB-FAB 200 0

VACUUMS Pipe 175 71 104 8=>6

LASER Beam 0 0 0 0

SUMMARY 911 71 104 8

Integrating the FAB and UB Buildings

典型的半導體廠 PIPE Corridor Integrated

典型的半導體廠 ELECTRICAL ROOM Integrated

DEMO 1

FAB FIM Planning to process

PLAN -> DESIGN -> CONSTRUCT -> OPERATION

Data Source from : Autodesk UMC Report

Now the construction is still on going in Tainan

FAB FIM Planning to process DEMO2

DEMO3

DEMO1

DEMO4

營建工程預防管制措施

預防異常原因，還是降低異常發生的機率

魏文王問名醫扁鵲說：「你們家兄弟三人，都精於醫術，到底哪一位最好呢？」

扁鵲答說：「我長兄治病，是治病於病情發作之前。由於一般人不知道他事先能剷除病因，所以他的名氣無法傳出去，只有我們家的人才知道。我中兄治病，是治病於病情初起之時。一般人以為他只能治輕微的小病，所以他的名氣只及於本鄉里。而我扁鵲治病，是治病於病情嚴重之時。一般人都看到我在經脈上穿針管來放血、在皮膚上敷藥等大手術，所以以為我的醫術高明，名氣因此響遍全國。」

扁鵲總結說：「我家醫術以長兄最好，中兄次之，我最差。」

文王說：「你說得好極了。」

【心得】

事後控制不如事中控制，事中控制不如事前控制，可惜大多數的事業經營者均未能體認到這一點，等到錯誤的決策造成了重大的損失才尋求彌補，有時是亡羊補牢，為時已晚。

你(妳)覺得誰醫術好?

千金難買早知道 - - 故

還是趕緊加入SEMI 推 FIM 好?

Computer Hardware

As compare to 2004, the computing speed of

computers had increased greatly which is 10

time faster

{ 10 Core-(CPU+VGA) and >32G RAM }

2D vs. 3D圖

2D 圖面

2D 圖

3D 圖

23

2

4

典型的半導體廠3D管線圖

• 建築樓面底圖已關閉

碰撞檢查

建物/管線 能耗模擬

施工模凝

典型的工廠 BIM的運用範例