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Unisys e-@ctionNetwork Document

Processor 1150/1600/

1825/2000

Servicing Guide: Maintenance Procedures(DL3)

Unisys Proprietary

This document is confidential and proprietary to Unisys Corporation. It is not to be used,reproduced, or disclosed outside Unisys without the written consent of Unisys Corporation. Theinformation in this document is furnished solely for use by, or under the direction of, Unisys supportpersonnel in servicing customer’s equipment.

This document is the property of, and must be returned to Unisys Corporation, Global NetworkServices, PO Box 500, Blue Bell, PA 19424.

© 2000 Unisys Corporation.Unpublished Material - All rights reserved.

Class C

Printed in USAJune 2000 3998 5593–007

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Unisys e-@ctionNetwork Document

Processor 1150/1600/

1825/2000

Servicing Guide: Maintenance Procedures(DL3)

Unisys

Unisys Proprietary

This document is confidential and proprietary to Unisys Corporation. It is not to be used,reproduced, or disclosed outside Unisys without the written consent of Unisys Corporation. Theinformation in this document is furnished solely for use by, or under the direction of, Unisys supportpersonnel in servicing customer’s equipment.

This document is the property of, and must be returned to Unisys Corporation, Global NetworkServices, PO Box 500, Blue Bell, PA 19424.

© 2000 Unisys Corporation.Unpublished Material - All rights reserved.

Class C

Printed in USAJune 2000 3998 5593–007

NO WARRANTIES OF ANY NATURE ARE EXTENDED BY THIS DOCUMENT. Any product or related informationdescribed herein is only furnished pursuant and subject to the terms and conditions of a duly executed agreement topurchase or lease equipment or to license software. The only warranties made by Unisys, if any, with respect to theproducts described in this document are set forth in such agreement. Unisys cannot accept any financial or otherresponsibility that may be the result of your use of the information in this document or software material, includingdirect, special, or consequential damages.

You should be very careful to ensure that the use of this information and/or software material complies with the laws,rules, and regulations of the jurisdictions with respect to which it is used.

The information contained herein is subject to change without notice. Revisions may be issued to advise of suchchanges and/or additions.

Notice to Government End Users: The software and accompanying documentation are delivered and licensed as“commercial computer software” and “commercial computer software documentation” as those terms are used in 48C.F.R. § 12.212 and 48 C.F.R. § 227.7202-1 through 227.7202-4, as applicable. The Government shall receive only thoserights provided in the standard commercial software license, or where applicable, the restricted and limited rightsprovisions of the contract FAR or DFARS (or equivalent agency) clause.

Correspondence regarding this publication can be e-mailed to [email protected].

FCC Statement

The statement below is included in this document to comply with a Federal Communications Commission (FCC)regulation. The FCC is an agency of the United States government; thus, the statement below applies to computingequipment installed in the United States of America. Unisys is taking appropriate steps to be in compliance with FCCregulations and similar regulations of other countries.

WARNING: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant toSubpart J of Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmfulinterference when the equipment is operated in a commercial environment. This equipment generates, uses, and canradiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may causeharmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmfulinterference, in which case the user will be required to correct the interference at his own expense.

Canadian Regulatory Statement

This class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.

Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.

Unisys is a registered trademark and e-@ction is a trademark of Unisys Corporation.All other marks are acknowledged to be the trademarks or registered trademarks of their respective owners. UnisysCorporation cannot attest to the accuracy of this information.

Unisys e-@ctionNetwork DocumentProcessor 1150/1600/1825/2000Servicing Guide:Maintenance Procedures(DL3)

Unisys Proprietary – Class C

Unisys e-@ctionNetworkDocumentProcessor 1150/1600/1825/2000

Servicing Guide:MaintenanceProcedures(DL3)

Unisys Proprietary– Class C

3998 5593–007 3998 5593–007

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3998 5593–007 Unisys Proprietary - Class C iii

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iv Unisys Proprietary - Class C 3998 5593–007

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3998 5593–007 Unisys Proprietary - Class C v

Contents

Section 1. Introduction

CAPI Configuration ................................................................ 1–2Non-CAPI Configuration ......................................................... 1–3User Interface ........................................................................ 1–4Diagnostic Flow ...................................................................... 1–4Failures .................................................................................. 1–5Manual Procedure Format .................................................... 1–6Line Number/Failure Code Index .......................................... 1–7Power-On Confidence Tests (CAPI Configurations) ............... 1–9

Starting the System POC Test From The TransportExerciser ............................................................ 1–10

Starting the System POC Test From the MTRApplication Program ............................................. 1–17

Viewing the DOS Window of the Track Control ProgramFor POC Test Status ............................................ 1–20

Description of POC Tests .......................................... 1–21Transport Hardware (AA Gate) Tests .................. 1–21Option Module Tests ........................................ 1–23

POC Test Error Display Description ........................... 1–24Bypass POC Tests ................................................... 1–25

Maintenance Test Routines (CAPI Configuration) .................. 1–26Description of Maintenance Test Routines: ................. 1–30

Transport Tests ............................................... 1–30Basic Microfilmer Tests .................................... 1–30MultiJet Endorser Tests .................................... 1–32Impact Endorser Tests ..................................... 1–33E13B MICR Reader Tests ................................. 1–34Dual Image Module Tests ................................. 1–34High Speed Encoder Module Tests .................... 1–34High Speed OCR Reader Tests .......................... 1–361150 Multi-Jet Endorser Tests .......................... 1–37

Power-On Confidence Tests (Non-CAPI Configurations) ........ 1–38Description of POC Tests .......................................... 1–38

NDP CPU PCBA Kernel Tests ............................ 1–38AA Gate Tests ................................................. 1–39

AA Gate MULTIBUS Loop Test .................. 1–40Configuration Bus Error Test .................... 1–41Character Recognition System Test .......... 1–41Z80 CPU Test ......................................... 1–42AA Gate Test Errors ................................. 1–43

Contents

vi Unisys Proprietary - Class C 3998 5593–007

Option Module Tests ........................................ 1–44Programmable Endorser Printer/Stamp

Test ................................................... 1–44Unisys Microfilmer Test ............................ 1–45High Speed Optical Character Recognition

Reader (HSOCR) Tests ......................... 1–46Multiline Ink Jet Endorser Tests ................. 1–46Imaging Module ....................................... 1–46

POC Repair Procedure .............................................. 1–49Additional Diagnostic Features (Non-CAPI

Configuration) ...................................................... 1–49Bypass POC Tests ........................................... 1–49NDP Debugger Program ................................... 1–50

Display/Set Register ................................ 1–51Block of Memory Test (BT) ....................... 1–51Display Formatted Registers (DF) .............. 1–52Execute Program (G) ................................ 1–52Memory Display/Disassembly (MD) ............ 1–53Memory Modify/Disassembly/Assembly

(M) ..................................................... 1–53Memory Set (MS) ..................................... 1–54

Loading an Application from the DebuggerProgram ..................................................... 1–55

Enabling the MULTIBUS Address Line ToggleUtility .......................................................... 1–55

NDP CPU PWBA Hardware Indicators ................. 1–56Maintenance Test Routines (Non-CAPI) ................................. 1–60

NDP 030 Configurations ........................................... 1–60NDP Ready Configurations ........................................ 1–61Description of Disk-Based Tests ................................ 1–62

Transport Tests ............................................... 1–64Multi-Jet Endorser Tests ................................... 1–661150 Multi-Jet Endorser Tests .......................... 1–70Microfilmer Tests ............................................. 1–72

Basic Microfilm Tests ............................... 1–73Film Transport ......................................... 1–74Lamps/ALMs ........................................... 1–75ICM Test ................................................. 1–75Galvo Tests ............................................. 1–75ID Display ................................................ 1–76Human Readable Headers ......................... 1–76Capping Shutter ...................................... 1–76Hardware Parameter Adjustment Routines . 1–77

Impact Endorser Test ....................................... 1–79Display Scans .................................................. 1–81Gate/Light Exerciser ........................................ 1–81E13B Magnetic Ink Character Recognition Test ... 1–82

AC Reader Tests ...................................... 1–83DC Reader Tests ..................................... 1–85

CMC7 MICR Reader Tests ................................. 1–87

Contents

3998 5593–007 Unisys Proprietary - Class C vii

Imaging Module Tests ...................................... 1–89U4/JPEG Imaging Module ......................... 1–89Select/De-select Extended Power On

Confidence Tests ................................ 1–90POC Execution / Default Flag Selection ..... 1–90Communication Link Test ......................... 1–90IIB Interface Test ..................................... 1–90IM Lamp Supply Test ............................... 1–91Turn IM Lamp On ..................................... 1–91Turn IM Lamp Off ..................................... 1–91View Current POC Results ........................ 1–92Calibrate the Scanner .............................. 1–92Selecting and Executing POC Tests .......... 1–92Dual Imaging Module ............................... 1–97

HS OCR Reader Tests ...................................... 1–99OCR Maintenance Test Routines ............... 1–100OCR Reader Utilities ................................ 1–100Transport Operations ............................... 1–100

CAR Module Tests ........................................... 1–101CAR Module Tests (U4/JPEG Imaging

System) .............................................. 1–101CAR Module Tests: Dual Imaging System ... 1–103

DEBUGGER ..................................................... 1–103Description of Additional Information (Non-CAPI

Configuration) .................................................................... 1–104Character Recognition Stress Decks .......................... 1–104Condition, Cause, Correction (CCC) Table .................. 1–104Snapshot ................................................................. 1–104Machine Checks ....................................................... 1–105

Section 2. Power-On Confidence Tests

Word Loop Test Failure ............................................. 2–10

Section 3. Transport Basic Tests: Tracking Logic and AABackplane Types

Section 4. Transport Basic Subtest 1: Tracking Logic andAA Backplane Types


Contents

viii Unisys Proprietary - Class C 3998 5593–007





Section 10. E13B Double Read Character Recognition Test

Section 11. General Assistance Aids

General Troubleshooting Suggestions ................................... 11–11

Section 12. Condition, Cause, Correction Tables

General Maintenance Hints .................................................... 12–1Reference Documentation ..................................................... 12–2General Conditions, Causes, and Corrections ....................... 12–3Missorts .................................................................................. 12–5Jams ....................................................................................... 12–7BOLs ....................................................................................... 12–13Track ERR (Areas 2, 3, or 4) ................................................. 12–14Feed Errors ............................................................................ 12–15Batch Ticket ........................................................................... 12–18Interlocks ............................................................................... 12–19Endorsers ............................................................................... 12–24

PEP ......................................................................... 12–25Stamp ..................................................................... 12–27

HSEM ...................................................................................... 12–29Unisys NDP 1xxx Cinemode Microfilmer ............................... 12–30

Section 13. Power Supply

Contents

3998 5593–007 Unisys Proprietary - Class C ix

Section 14. Machine Checks

Machine Check Screen .......................................................... 14–2Diagnosis of Machine Check Conditions ............................... 14–4General Causes ...................................................................... 14–4EEW Definitions ...................................................................... 14–5Machine Check Type ............................................................. 14–6Description Lines ................................................................... 14–6Machine Check Cause ........................................................... 14–6Task ....................................................................................... 14–6

NDP 1150/NDP 1825 Task Number .......................... 14–6SVC Message Opcodes ............................................ 14–7

Local Environment Task ................................... 14–8Firmware Screen Task ...................................... 14–9Host Interface Task .......................................... 14–10Sort Task ........................................................ 14–11

PC (Program Counter) ........................................................... 14–11Machine Check Error Number .............................................. 14–12

Offload and Emulation Machine Check Error Numbers . 14–120001-0092, 00C1 (MTOS SVC) ................................. 14–130100-0112 (File Manager) ........................................ 14–150200 (Forms Manager) ............................................. 14–150300 (Program/Task Loading Routine) ...................... 14–160401-0405 (Miscellaneous PIO Routines) ................... 14–160611-0613 (Literal Handling) .................................... 14–171001-1353 (Local Environment Task) ........................ 14–182001-2401 (Firmware Screen Task) .......................... 14–223001-3500 (Status Monitor Task) .............................. 14–264001-4002 (Snapshot Task) ..................................... 14–285000-5901, 5AF8-5C02 (Host Interface) .................... 14–296001-6093, 60A0-60F0, 6200-6802 (Sort Task) ........ 14–35A001-A102 (Utility Task) ........................................... 14–56CAR Task Error Code ............................................... 14–58CAR Unit Message Opcode Definitions (CM) ................ 14–59CAR Unit Message Response Status Definitions (CR) ... 14–59

EEW (Extended Error Word) .................................................. 14–61CS -- CAR Driver SVC Result Status ............................ 14–62DS -- Data Comm EEW .............................................. 14–66DS -- Menu Display State Error Codes ........................ 14–76EF -- 4A Driver SVC Function Definitions - Emulation ..... 14–78ES -- Datacomm PIO SVC Result Status: Emulation ...... 14–79FI -- File Manager Error Codes ................................... 14–82FM -- Forms Manager Error Codes ............................. 14–84KS -- Datacomm PIO SVC Result Status: KLUDGE 4A ... 14–85PS -- Poll-Select Driver (CRT) PIO SVC Result Status .... 14–88ST -- CAR Unit Operating State Definitions ................... 14–89TF -- Transport Driver SVC Function Definitions ........... 14–90TS -- Transport Driver PIO SVC Result Status .............. 14–92Routine TXT_TO_FID Error Codes .............................. 14–101

Section 15. CMC7 Tests

Contents

x Unisys Proprietary - Class C 3998 5593–007

Section 16. NDP 1xxx-65 Cinemode Microfilmer Test

Section 17. Microfilmer Hardware Parameters

General Operation of Parameter Routines ............................ 17–2Continuing with Adjustment Routine ................... 17–3Picking a New Value ......................................... 17–4

Lamp Intensity/Density Procedure and ALM Adjustment ...... 17–5LED/TED Adjustment Procedure ........................................... 17–7ID Display Intensity Adjustment Procedure ............................ 17–10Galvo Home Adjustment Procedure ....................................... 17–12Modify Nonvolatile RAM Values ............................................. 17–13

Section 18. Imaging Module (U4/JPEG)

Section 19. Multiline Ink Jet Endorser Manual Procedures

Extended Error Word Format ................................................. 19–2Fault Code Definitions ............................................................ 19–3Run Time Fault Code Definitions ............................................ 19–33MJE Manual Procedures ........................................................ 19–35Print Problems as Seen in Print Samples .............................. 19–108Suggestions to Fault Isolation if Procedures Fail to Correct

Problem .............................................................................. 19–110Procedure End ....................................................................... 19–113Condition, Cause, Correction Chart ....................................... 19–114Command Names and Descriptions ...................................... 19–116FRU Mnemonic Names ........................................................... 19–121

Section 20. PEP/Stamp Tests

Section 21. CAR Diagnostics (U4/JPEG Imaging System)

Section 22. Dual Image Manual Procedures

Additional POC Test Status Information ................................. 22–1Dual Image Camera Module Error Codes (DIMG xx xx) ........ 22–4

(DIMG xx xx) Image Camera Module CommonFailures ....................................................... 22–5

(DIMG 01 xx) Interface MTR ............................ 22–6 (DIMG 22 xx) Analog Interface Test .................. 22–9 (DIMG 23 xx) Calibrate Front Camera ............... 22–11 (DIMG 24 xx) Calibrate Rear Camera ................ 22–12

Contents

3998 5593–007 Unisys Proprietary - Class C xi

(DIMG 40 xx) Normalizer and Diagnostics RAMTest ........................................................... 22–13

(DIMG 41 xx) Digitizer Framing Logic Test ....... 22–14 (DIMG 80 xx) Background Suppression Test ..... 22–15 (DIMG 81 xx) CAR Spot/Void Threshold Test .... 22–16 (DIMG 82 xx) CAR Interface Test ..................... 22–17 (DIMG 83 xx) Get CAR POC .............................. 22–17 (DIMG A7 xx) Image Interface Confidence Test . 22–19 (DIMG C3 xx) Valid Image Gate Configuration

Test ........................................................... 22–20 (DIMG C4 xx) Image Bus Test .......................... 22–22 (DIMG D0 xx) JPEG Compressor Test .............. 22–26 (DIMG D1 xx) JPEG Built-In Self-Test ................. 22–29 (DIMG D2 xx) CCITT Compressor Test ............. 22–30 (DIMG D3 xx) CCITT Built-In Self-Test ................ 22–33

Dual Image M&D Procedures ................................................ 22–34Front Normalizer Framer Not Found or Front Normalizer

Framer CI Errors Flow ....................................................... 22–35Rear Normalizer Framer Not Found or Rear Normalizer

Framer CI Errors Flow ....................................................... 22–38Image Bus Test Failure Flow .................................................. 22–40CAR Port Not Found or CAR Port CI Errors Flow .................. 22–41White Digital-to-Analog Converter and Analog Interface

Failure Flow ....................................................................... 22–42CAR Module POC Failure Flow ............................................... 22–43CAR SCSI Communication Failure Flow ................................. 22–44Image Interface Communication Failure Flow ....................... 22–46Camera Resolution Incorrect Flow ........................................ 22–47Configuration and Parameter File Access Failures Flow ...... 22–48Compressor Not Found or Compressor CI Errors Flow ......... 22–49Slot Errors Flow ..................................................................... 22–50Fitted/Not Fitted Errors Flow ................................................. 22–51High Speed Digitizer Not Found or High Speed Digitizer CI

Errors Flow ........................................................................ 22–52Image Slot Locations ............................................................. 22–54Dual Image Camera Module Fault Code List ......................... 22–56

Section 23. High Speed Encoder Module

Using the Maintenance Keypad ............................................. 23–2Keypad ................................................... 23–3Display ................................................... 23–3

POC/MTR Error Display ......................................................... 23–4HSEM Diagnostic Flows ......................................................... 23–6

HSEM Fault Code Definitions (HSEM xxxx) .................. 23–6Main Diagnostic Flow ................................................ 23–14Print Quality Diagnostic Flow ..................................... 23–25Maintenance Mode Diagnostic Flow ........................... 23–26Track Motors Diagnostic Flow ................................... 23–27HSEM Outsort MTR Procedures ................................. 23–28HSEM Fault Code List and FRU Description ................. 23–31

Contents

xii Unisys Proprietary - Class C 3998 5593–007

HSEM Tests ............................................................. 23–33

Section 24. CAR Diagnostic Procedures (Dual Image System)

Introduction ............................................................................ 24–1POC Test ................................................................................ 24–2

Interpreting the Error Indicator LEDs .......................... 24–2Executing the POC Test ............................................ 24–4

Card Cage Test Slot ............................................................... 24–5Testing the CAR Unit .............................................................. 24–7Error Code Format ................................................................. 24–7

Message Qualifiers ................................................... 24–8Source Identification ................................................. 24–9Number ................................................................... 24–9String ...................................................................... 24–9Notation Conventions ................................................ 24–9

CAR Error Codes .................................................................... 24–11CAR Diagnostic Flows ............................................................ 24–50

Section 25. NDP 1150 MJE Diagnostic Procedures

MJE Operation ....................................................................... 25–1Field Replacement Units (FRUs) ............................................. 25–7

Section 26. Full-Height OCR Reader Procedures

The FH OCR Reader Diagnostic System ................................ 26–1Error Handling .......................................................... 26–1General Repair Guidelines .......................................... 26–3FH OCR Reader System Block Diagram ...................... 26–4

FH OCR Fault Recovery Procedures ...................................... 26–5FH OCR Reader to Track Communication Errors Manual

Procedures .......................................................... 26–19FH OCR MTR Failures Manual Procedures .................. 26–20FH OCR CCC TABLE ................................................. 26–24

3998 5593–007 Unisys Proprietary - Class C xiii

Figures

1–1. CAPI Configuration ................................................................................ 1–21–2. Non-CAPI, NDP 030 Configuration .......................................................... 1–31–3. Non-CAPI, NDP Ready Configuration ........................................................ 1–31–4. Troubleshooting Flow Chart .................................................................... 1–41–5. Track Control Program Icon ................................................................... 1–91–6. Selecting the Transport Exerciser Program ............................................. 1–101–7. Exerciser - Track Status Screen .............................................................. 1–111–8. POC Test Executing Status Display ......................................................... 1–121–9. Sample POC Transport Error Screen ....................................................... 1–131–10. Sample POC Option Module Error Screen ................................................ 1–141–11. Exerciser - DP1XXX Options Screen ........................................................ 1–151–12. Power Down Prompt Screen .................................................................. 1–161–13. Transport Powered Off Status Display ..................................................... 1–161–14. Selecting the DP1XXX Maintenance Test Routines .................................... 1–171–15. Transport Not Powered On Screen ......................................................... 1–181–16. Track Control Status Screen .................................................................. 1–181–17. Power Down/Up Test Selection .............................................................. 1–191–18. Track Control Program DOS Window ....................................................... 1–201–19. Selecting the Track Startup Program ...................................................... 1–261–20. DP 1XXX MTR Screen ............................................................................ 1–271–21. Maintenance Test Routine Main Menu ...................................................... 1–621–22. Function Key Test Mode Selection Menu .................................................. 1–631–23. Basic Tests Menu .................................................................................. 1–641–24. MJE Main Menu ..................................................................................... 1–661–25. MJE Run Time Commands Menu ............................................................. 1–671–26. MJE POC Commands Menu .................................................................... 1–681–27. MJE Extended Diagnostic Commands Menu ............................................. 1–691–28. LCMJE Module Main Menu ...................................................................... 1–701–29. Microfilm MTR Menu .............................................................................. 1–721–30. Basic Microfilm Tests Menu .................................................................... 1–731–31. Microfilm Film Transport Tests Menu ....................................................... 1–741–32. Hardware Parameter Adjustment Routines Menu ...................................... 1–771–33. PEP/Stamp Endorser Tests Menu ........................................................... 1–791–34. E13B MICR Reader Tests Menu .............................................................. 1–821–35. AC Reader Tests Menu .......................................................................... 1–831–36. DC Reader Tests Menu .......................................................................... 1–851–37. CMC7 MTR Test Menu ........................................................................... 1–871–38. IIPS Maintenance Test Routines: Select IM Unit Test Menu ....................... 1–891–39. IIPS Maintenance Test Routines Select IM Board Type Menu ...................... 1–931–40. IIPS Maintenance Test Routines: Select 286 Main Processor Extended

POC Test Set Menu ........................................................................... 1–941–41. Power On Confidence Execution Menu .................................................... 1–951–42. Dual Image Module Main Menu ............................................................... 1–971–43. OCR Reader System Main Menu .............................................................. 1–99

Figures

xiv Unisys Proprietary - Class C 3998 5593–007

1–44. CAR System MTR Test Menu .................................................................. 1–101

14–1. Diagnostic Flow Chart ............................................................................ 14–114–2. Machine Check Screen ........................................................................... 14–2

17–1. Parameter Routines Screen Format ......................................................... 17–217–2. Film Format ........................................................................................... 17–917–3. Nonvolatile RAM Screen Format .............................................................. 17–14

22–1. Card Locator - NDP 1150 Dual Image ..................................................... 22–5422–2. Card Locator - NDP 1825 Dual Image ..................................................... 22–55

23–1. HSEM Hand-held Maintenance Keypad and Display Unit ............................. 23–323–2. POC Error Display .................................................................................. 23–423–3. MTR Error Display .................................................................................. 23–5

24–1. LEDs on Recognition Unit (RU) PCBA ....................................................... 24–324–2. LEDs on Adaption Unit (AU) and Pixel Unit (PU) PCBAs .............................. 24–3

3998 5593–007 Unisys Proprietary - Class C xv

Tables

1–1. Failure Codes by Manual Section ............................................................ 1–71–2. Transport Hardware (AA Gate) Tests ....................................................... 1–211–3. AA Gate Test Fault Code Options ............................................................ 1–431–4. Hardware-Controlled LEDs ...................................................................... 1–561–5. POC Test Reference Table ..................................................................... 1–581–6. Functions of the Subtests from the Transport Tests Menu ........................ 1–651–7. Functions of the Subtests from the Basic Microfilm Tests Menu ................ 1–731–8. Functions of the Subtests from the Microfilm Film Transport Tests Menu ... 1–751–9. Functions of the Hardware Parameter Adjustment Routines Menu .............. 1–781–10. Functions of the Subtests from the PEP/Stamp Endorser Tests Menu ........ 1–801–11. Functions of the Subtests from the AC Reader Tests Menu ....................... 1–841–12. DC Reader Tests Menu Options .............................................................. 1–861–13. CMC7 MTR Test Menu Options ............................................................... 1–881–14. Datacomm Loopback MTR Menu Options ................................................ 1–91

2–1. LED Fault Code Conditions: NDP030 CPU PCBA ..................................... 2–12–2. Address Bus and Data Bus .................................................................... 2–112–3. Card AA02 TEST A/ TEST B Outputs (DL3) .............................................. 2–332–4. Card AA05 TEST A/ TEST B Outputs (DL3) .............................................. 2–352–5. Card AA08 TEST A/ TEST B Outputs (DL3) .............................................. 2–362–6. Card AA10 TEST A/ TEST B Outputs (DL3) .............................................. 2–382–7. Diagnostic Control Register (DCR) addresses for AA Gate PCBAs .............. 2–47

3–1. Troubleshooting Chart for Unexpected Bus Exceptions (TB 00 0010) withthe NDP 1150 68030-Based Main CPU Board ..................................... 3–3

3–2. Troubleshooting Chart for Unexpected Bus Exceptions (TB 00 0010) withthe NDP 18xx 68030-Based Main CPU Board ...................................... 3–4

10–1. Card AA12 TEST A/TEST B Outputs ....................................................... 10–6

12–1. General Conditions, Causes, and Corrections .......................................... 12–312–2. Missorts CCC ........................................................................................ 12–512–3. Jams CCC ............................................................................................ 12–712–4. BOLs CCC ............................................................................................ 12–1312–5. Track ERR (Areas 2, 3, or 4) CCC ........................................................... 12–1412–6. Feed Errors CCC ................................................................................... 12–1512–7. Batch Ticket CCC .................................................................................. 12–1812–8. Interlocks CCC ...................................................................................... 12–1912–9. Endorsers CCC ..................................................................................... 12–2412–10. PEP CCC .............................................................................................. 12–2512–11. Stamp CCC .......................................................................................... 12–2712–12. HSEM CCC ........................................................................................... 12–2912–13. NDP 1xxx Cinemode Microfilmer CCC ..................................................... 12–30

Tables

xvi Unisys Proprietary - Class C 3998 5593–007

14–1. Field Descriptions for Machine Check Screen ........................................... 14–314–2. Machine Check General Definitions .......................................................... 14–514–3. NDP 1150/NDP 1825 Task Number ....................................................... 14–614–4. SVC Message Opcodes -- Local Environment Task .................................... 14–814–5. SVC Message Opcodes -- Firmware Screen Task ...................................... 14–914–6. SVC Message Opcodes -- Host Interface Task .......................................... 14–1014–7. SVC Message Opcodes -- Sort Task ........................................................ 14–1114–8. Offload and Emulation Machine Check Error Numbers ............................... 14–1214–9. CAR Task Error Code ............................................................................. 14–5814–10. CAR Unit Message Opcode Definitions (CM) ............................................. 14–5914–11. CAR Unit Message Response Status Definitions (CR) ................................. 14–5914–12. EEW (Extended Error Word) Codes .......................................................... 14–6114–13. CS -- CAR Driver SVC Result Status ......................................................... 14–6214–14. DS -- EEWs for Data Comm (Part Numbers 2973 2112, 2973 1866, 2973

1403, and 2494 4555) ..................................................................... 14–6714–15. DS -- EEWs for Data Comm (Part Numbers 2973 4282, 2973 4316, and

2973 4449) ...................................................................................... 14–7014–16. DS -- EEWs for Data Comm (All Other Data Comm PROMs) ........................ 14–7314–17. DS -- Menu Display State Error Codes ...................................................... 14–7614–18. EF -- 4A Driver SVC Function Definitions - Emulation .................................. 14–7814–19. ES -- Datacomm PIO SVC Result Status: Emulation .................................... 14–7914–20. FI -- File Manager Error Codes ................................................................. 14–8214–21. FM -- Forms Manager Error Codes ........................................................... 14–8414–22. KS -- Datacomm PIO SVC Result Status: KLUDGE 4A ................................ 14–8514–23. PS -- Poll-Select Driver (CRT) PIO SVC Result Status .................................. 14–8814–24. ST -- CAR Unit Operating State Definitions ................................................ 14–8914–25. TF -- Transport Driver SVC Function Definitions ......................................... 14–9014–26. TS -- Transport Driver PIO SVC Result Status ............................................ 14–9214–27. Routine TXT_TO_FID Error Codes ............................................................ 14–101

19–1. Fault Code Definitions ............................................................................ 19–319–2. Run Time Fault Code Definitions .............................................................. 19–3319–3. MJE Manual Procedures ......................................................................... 19–3519–4. Commands Available in Different States ................................................... 19–10219–5. Address: Board Correspondence Table ................................................... 19–10619–6. Print Problems as Seen in Print Samples ................................................. 19–10819–7. Suggestions to Fault Isolation if Procedures Fail to Correct Problem .......... 19–11019–8. Normal Bar Up State (States 0-11) .......................................................... 19–11119–9. Normal Bar Up State (States 12-22) ........................................................ 19–11219–10. Condition, Cause, Correction Chart ......................................................... 19–11419–11. Command Names and Descriptions ......................................................... 19–11619–12. FRU Mnemonic Names ........................................................................... 19–121

22–1. (DIMG xx xx) Image Camera Module Common Failures ............................. 22–522–2. (DIMG 01 xx) Interface MTR ................................................................. 22–622–3. (DIMG 22 xx) Analog Interface Test ....................................................... 22–922–4. (DIMG 23 xx) Calibrate Front Camera .................................................... 22–1122–5. (DIMG 24 xx) Calibrate Rear Camera ..................................................... 22–1222–6. (DIMG 40 xx) Normalizer and Diagnostics RAM Test ............................... 22–1322–7. (DIMG 41 xx) Digitizer Framing Logic Test ............................................. 22–1422–8. (DIMG 80 xx) Background Suppression Test .......................................... 22–1522–9. (DIMG 81 xx) CAR Spot/Void Threshold Test .......................................... 22–16

Tables

3998 5593–007 Unisys Proprietary - Class C xvii

22–10. (DIMG 82 xx) CAR Interface Test ........................................................... 22–1722–11. (DIMG 83 xx) Get CAR POC ................................................................... 22–1722–12. (DIMG A7 xx) Image Interface Confidence Test ....................................... 22–1922–13. (DIMG C3 xx) Valid Image Gate Configuration Test .................................. 22–2022–14. (DIMG C4 xx) Image Bus Test ............................................................... 22–2222–15. (DIMG D0 xx) JPEG Compressor Test .................................................... 22–2622–16. (DIMG D1 xx) JPEG Built-In Self-Test ...................................................... 22–2922–17. (DIMG D2 xx) CCITT Compressor Test ................................................... 22–3022–18. (DIMG D3 xx) CCITT Built-In Self-Test ..................................................... 22–3322–19. Front Normalizer Framer Not Found or Front Normalizer Framer CI Errors

Flow ................................................................................................. 22–3522–20. Rear Normalizer Framer Not Found or Rear Normalizer Framer CI Errors

Flow ................................................................................................. 22–3822–21. Image Bus Test Failure Flow ................................................................... 22–4022–22. CAR Port Not Found or CAR Port CI Errors Flow ....................................... 22–4122–23. White Digital-to-Analog Converter and Analog Interface Failure Flow ............ 22–4222–24. CAR Module POC Failure Flow ................................................................. 22–4322–25. CAR SCSI Communication Failure Flow .................................................... 22–4422–26. Image Interface Communication Failure Flow ............................................ 22–4622–27. Camera Resolution Incorrect Flow ........................................................... 22–4722–28. Configuration and Parameter File Access Failures Flow ............................. 22–4822–29. Data File List ......................................................................................... 22–4822–30. Compressor Not Found or Compressor CI Errors Flow ............................. 22–4922–31. Slot Errors Flow .................................................................................... 22–5022–32. Fitted/Not Fitted Errors Flow .................................................................. 22–5122–33. High Speed Digitizer Not Found or High Speed Digitizer CI Errors Flow ...... 22–52

23–1. HSEM Fault Code Definitions (HSEM xxxx) ................................................ 23–623–2. Main Diagnostic Flow ............................................................................. 23–1423–3. Print Quality Diagnostic Flow .................................................................. 23–2523–4. Maintenance Mode Diagnostic Flow ......................................................... 23–2623–5. Track Motors Diagnostic Flow ................................................................ 23–2723–6. HSEM Outsort MTR Procedures .............................................................. 23–2823–7. HSEM Fault Code List and FRU Description .............................................. 23–3123–8. HSEM Tests .......................................................................................... 23–33

24–1. Test Slot Steps and Related LED Displays for RU and AU PCBA’s .............. 24–624–2. Test Slot Steps and Related LED Displays for PU PCBA ............................ 24–624–3. CAR Error Codes ................................................................................... 24–1124–4. CAR Diagnostic Flows ............................................................................ 24–50

25–1. Main Flow ............................................................................................. 25–325–2. MTR Error Code Index ........................................................................... 25–5

26–1. FH OCR CCC Table ................................................................................ 26–24

Tables

xviii Unisys Proprietary - Class C 3998 5593–007

3998 5593–007 Unisys Proprietary - Class C 1–1

Section 1 Introduction

About This GuideThis servicing guide includes maintenance test routine (MTR) information for the NetworkDocument Processor 1150/1600/1825/2000. The Network Document Processor will bereferred to as NDP throughout this guide.

This manual is intended to help the CSE analyze and resolve electronic, electromechanical,and mechanical failures on the NDP 1XXX. The NDP has two possible hardware/softwareconfigurations: Common Application Programming Interface (CAPI) and non-CAPI.

PurposeThis guide provides the maintenance procedures for the NDP 1150/1600/1825/2000selectable speed processors. It presents all required information for the client serviceengineer (CSE) and support personnel to troubleshoot problems with the documentprocessors.

AudienceThe primary audience for this guide includes the CSE and support center personnel.

Introduction

1–2 Unisys Proprietary - Class C 3998 5593–007

CAPI ConfigurationFigure 1–1 shows the CAPI configuration.

Figure 1–1. CAPI Configuration

In this configuration, the PC is running Windows NT 4.0 (or later), and the code to operatethe sorter is resident on the PC. The software modules that run the sorter’s transport andcommunicate with its devices are accessed via application programs written under theWindows programming environment. The PC Interface (PCI) card is resident in one of thePC’s option slots. An interface cable connects the PCI card to the sorter’s AA gatebackplane. This connection allows the PC to talk with the Common API Power EncodeReader Interface (CAPRI) PCBA (slot 10 in the AA gate). The CAPRI PCBA provides the PCwith access to the sorter’s MULTIBUS. The PC’s CPU is directly controlling the operationof the sorter hardware in this configuration. The software layers connecting theapplication program to the sorter driver routines provide the application programmer witha common interface that can be used across Unisys document processor product lines.

PC

PCCPU

PC InterfaceCard

AA Logic Gate

MULTIBUS

Document Processor

CAPRI PCBA

Introduction


Non-CAPI ConfigurationThere are two non-CAPI configurations that are available for the NDP. They are theNDP 030 and the NDP Ready. Figure 1–2 shows the non-CAPI, NDP 030 configuration.

Figure 1–2. Non-CAPI, NDP 030 Configuration

In this configuration, the PC is running Windows NT 3.51 and the code to operate thesorter is not resident on the PC, but rather on the NDP030 CPU PCBA. The PC runs aterminal emulation program that allows the code executing on the NDP030 CPU PCBA todrive the PC’s screen display as well as process its keyboard inputs. The PC essentiallyhandles the systems networking capabilities, while the NDP030 CPU handles the operationof the sorter. The NDP030 CPU PWBA plugs into slot 17 of the sorter’s AA gate anddirectly accesses the MULTIBUS. The interface between the NDP030 CPU PCBA and thePC is a SCSI.

Figure 1–3 shows the non-CAPI, NDP Ready configuration.

Figure 1–3. Non-CAPI, NDP Ready Configuration

In the NDP Ready configuration, the PC is running Windows 3.11 and the code to operatethe sorter is resident on the 68030 CPU PCBA. This PCBA is the same one used in thenon-NDP environment (DP 1000 and DP 1825). Its clock speed is lower than the NDP030CPU PCBA (25MHZ compared to 33MHZ) and its firmware is partially stored in a standardEPROM and the rest is loaded using 5 1/4-inch floppy disks (as in the DP 1xxx), where asthe NDP030 CPU PCBA has its firmware split between a flash (i.e. downloadable from thePC hard disk) EPROM and a standard EPROM. The PC only runs a terminal emulationprogram that allows the code executing on the NDP Ready 68030 CPU PCBA to drive thePC screen display and process keyboard inputs. The Data Comm or $A Interface PCBA in

PC

PCCPU

Document Processor

33 MhzNPD030 CPU

PCBA

MULTIBUS

PC

PCCPU

Document Processor

MULTIBUS

SCSICable

25 Mhz68030 CPU

PCBARS232Cable

Introduction


slot 16 of the AA gate handles the host interface, while the NDP Ready 68030 CPU handlesthe operation of the sorter. The NDP Ready 68030 CPU PCBA plugs into slot 17 of thesorter’s AA gate and directly accesses the MULTIBUS. The interface between the NDPReady 68030 CPU PCBA and the PC is an RS-232.

User InterfaceThe user interface for both CAPI and Non-CAPI configurations is significantly different.The non-CAPI configuration’s interface is similar to the original DP1XXX user interface.The CAPI configuration’s interface follows the format of a Windows application. Thisvolume serves as a reference to the error codes and messages that are displayed by bothNDP configurations.

Diagnostic FlowThis manual provides step-by-step procedures for troubleshooting failures displayed by thePower-On Confidence (POC) test, failures displayed by the Maintenance Test Routines(MTRs), machine checks displayed by non-CAPI system software, and performanceproblems. Figure 1–4 provides a quick visual guide to troubleshooting.

Diagnostic Flow

Non-CAPICAPI

Go toappropriatesection and

followdiagnosticprocedureunder Error

Code

Go to Section14 and reviewmachine check

probablecauses

Readintroductionand refer to

CCC chart inSection 12 for

diagnosticprocedure

Readintroductionand refer to

CCC chart inSection 12 for

diagnosticprocedure

POC/MTRerror codedisplayed

Machinecheck

displayed

Performance orother

problem

Performance orother

problem

POC/MTRerror codedisplayed

Follow screenprompts

For HSEM, go to Section 23

For Dual Image, go to Section 22

Figure 1–4. Troubleshooting Flow Chart

Introduction


This section of the manual provides the following information:

• Definitions of failures

• Descriptions of POC tests and MTRs for CAPI and non-CAPI configurations

• Procedures for selecting and executing POC tests and MTRs for CAPI and non-CAPIconfigurations.

The rest of the manual presents manual procedures that follow up on the failure codesreturned by POC tests and MTRs.

Note: For Image/CAR and OCR, see the related document section.

FailuresElectronic, electromechanical, and mechanical failures in the NDP Document processorsfall into three categories:

• Failures that are obvious and require no additional direction to be corrected. Failuresin this category are generally corrected by procedures derived from productknowledge.

• Failures that are obvious but require additional direction to be corrected. Failures inthis category require use of the Condition/Cause/Correction (CCC) table, line 100000,for direction to perform necessary corrective action. This category is associated withfailures that have hidden causes, failures that do not have obvious corrections, andfailures that do not generate a failure message or fault code when POC tests or MTRsare executed.

• Failures that prevent or hamper operations but, by their nature, are either subtle ordifficult to isolate. Failures in this category display a failure message or code on thescreen when the POC tests or MTRs are executed.

After you execute the POC tests, the rules that apply when the failures and corrections arenot obvious are as follows:

• If the POC reports a failure message, the corrective action is to perform the proceduredictated by the message.

• If the POC fails to complete and does not display a failure message, the exit is toconsult the CCC chart (Section 10) for an analysis procedure.

• If the POC completes without reporting a failure, you must execute the MTRs. Youcan analyze an MTR failure by following the reported failure code or message.

CautionIf you do not follow the steps within a failure procedure in proper order, review thenotes within the procedure, or evaluate the correct test points, you will be unableto locate the failure or will spend excessive time in isolating the failure.

Introduction


Manual Procedure FormatTheir are three manual procedure formats presented in this servicing guide. The standardformat is shown below. The majority of the manual procedures in this book follow thatformat. The numbers in parentheses refer to the notes below the example.

51100(#1)

TB 00 0130(#2)

Z-80 POWER ON CONFIDENCE TEST HAS NOT PASSED(#3)

Note: This failure should have been indicated during the POCtest.(#4)

STEP PROCEDURE YES NO

100 Is AA08 FEED/ a constant low? 150 16350

(#5) (#6) (#8)

150 Replace AA10, and rerun test.

(#6)

Does the problem still exist? 99000 950

(#8) (#7)

950 Verify proper operation. End of procedure.

In this manual procedure format,

#1 The line number assigned to the failure code.

#2 The failure code reported on the screen. It indicates the failure detected.

#3 The failure detected.

#4 Information about the failure or additional aids for the failure analysis. When thisinformation is an aid to failure analysis, it is also referred to in the step of the procedure towhich it applies.

#5 Three-digit number indicating the initial step of this procedure.

#6 Next step to perform, within this procedure, when the question asked is true.

#7 Next step to perform, within this procedure, when the question asked is false.

#8 Five-digit reference indicating that the next step is an exit to a new procedure (line 16350or 99000).

Note: Numbers 92000 through 99999 indicate that the failure procedure did not

isolate the failure cause. A review of the indicated line number provides

additional failure analysis information.

Introduction


The second manual procedure format uses a "Fault Code Table" to reference a correctiveaction procedure from a "Manual Procedure Table." The "corrective action" procedureindexed can then reference other procedures within the "Manual Procedure Table." Thismanual procedure format is used in the following sections:

• Multi-Jet Endorser Manual Procedures

• Dual Image Manual Procedures

• High Speed Encoder Module

There are slight variations between each of the sections, but the overall format is the same.For more detailed information, see the desired section.

The third manual procedure format is exclusively used by the CAR module designed towork with the Dual Imaging system. There is a single CAR DIAGNOSTIC FLOW (a seriesof steps and procedures) that is always followed for all CAR error conditions in thissystem. See Section 22 for details.

Line Number/Failure Code IndexTable 1–1 identifies the failure code line numbers and failure codes within each section ofthis manual. This table applies to the NDP 1000 and NDP 1825 Document Processors.

Table 1–1. Failure Codes by Manual Section

Line NumbersSectionNumber Failure Code

1 Introduction

10000 - 49999 2 PC XX XXXX

50000 - 59999 3 TB 00 XXXX

60000 - 62999 4 TB 01 XXXX

63000 - 67999 5 TB 02 XXXX

68000 - 70999 6 TB 03 XXXX

71000 - 72999 7 TB 04 XXXX

73000 - 76999 8 TB 05 XXXX

77000 - 89999 9 TB 06 XXXX

90000 - 91999 10 CR XX XXXX

92000 - 99999 11 General Assistance Aids

100000 - 149999 12 Condition, Cause, and Correction Table

150000 13 Power Supply

160000 - 160999 15 CMC7 CM XX XXXX

Introduction


Table 1–1. Failure Codes by Manual Section

Line NumbersSectionNumber Failure Code

161000 - 169999 16 Unisys Cinemode Microfilmer MM XX XXXX, WR XX XXXX

No line numbers used 17 Hardware Parameter Adjustments for Unisys Microfilmer

170000 - 179999 18 Imaging Module IM XX XXXX*

No line numbers used 19 MJE XX XX (and run-time hex fault codes)

190000---199999 20 PP XX XXXX

180000–189999 21 CAR (U4/JPEG Image) CAR XXXX

No line numbers used 22 Dual Image module DIMG XX XX

No line numbers used 23 High Speed Power Encode Module HSEM XXXX

No line numbers used 24 CAR (Dual Image)

No line numbers used 25 NDP 1150 MJE LCMJE XX XX

* The majority of the NDP 1000 and NDP 1825 Imaging System diagnostic procedures are in theImage Item Processing (IIPS) Maintenance Manual.

Note: All failure codes for the OCR reader ("OCR XX XX") are covered in the DP 1800OCR Reader Installation and Servicing Guide.

Introduction


Power-On Confidence Tests (CAPI Configurations)In the CAPI configuration of the NDP, Power-On Confidence (POC) tests are executed in adifferent manner than in the Non-CAPI configuration. In the Non-CAPI environment, thediagnostic code that drives the overall system POC test is resident on the NDP CPU PCBA.This PCBA is physically part of the sorter in that it resides in slot 17 of the sorter’s AA gate.The POC code that runs on the NDP CPU PCBA tests the transport hardware, establishescommunications with the microprocessors running POC tests on the option moduleswithin the sorter (i.e. microfilmer, MJE, etc.), and processes their POC status.

In the Non-CAPI configuration, when the sorter power is turned on or when the MASTERRESET push-button is activated, POC is automatically started on the NDP CPU PCBA aswell as on the option module PWBAs. In the CAPI environment this is not true.

Powering on the sorter or pressing the MASTER RESET push-button will start the POCtest cycle only on the option modules in the CAPI environment. These modules completetheir testing and then wait for the POC test code running on the CAPI PC to request statusfrom them. If the CAPI PC is not running its POC code, the sorter option modules will waitindefinitely, in POC test mode, for communications to be established. It is important toremember that resetting the sorter, does not reset the CAPI PC.

In the CAPI environment, the diagnostic code that drives the overall system POC test isresident on the CAPI PC. This code is part of the executable DP1XCTRL.EXE. There aretwo ways to start the overall system POC test in the CAPI environment. When the CAPIPC is turned on, it runs through its standard power up diagnostics. When these arecompleted, a menu is displayed allowing the user to choose the Windows operatingenvironment. For CAPI, the user should select Windows NT Workstation 4.0 (or laterversions). After this selection is made, the user is prompted to press the Ctrl+Alt+Del keysto log on. At the log on window, a user name and password are required to allow WindowsNT to operate. Once Windows NT is operational, the system automatically starts the TrackControl Program. This program provides an interface to the sorter’s MULTIBUS andallows application programs, running under Windows, to communicate with the sortertransport and its various devices. You can tell that the Track Control Program is runningby checking the Windows NT Task Bar. A Track Control Program icon will be active in theTask Bar (Figure 1–5).

Figure 1–5. Track Control Program Icon

Once the Track Control Program is running, the system POC can be started from eitherthe Transport Exerciser or the Maintenance Test Routines application programs.

Introduction


Starting the System POC Test From The Transport ExerciserTo run the system POC test from the Transport Exerciser, start the exerciser applicationby selecting DP1XXX from the Windows NT Start Menu. When the submenu for DP1XXXis displayed, select Transport Exerciser (Figure 1–6).

Figure 1–6. Selecting the Transport Exerciser Program

The screen shown in Figure 1–7 will be displayed after the Transport Exerciser has beenselected.

Introduction


Figure 1–7. Exerciser - Track Status Screen

To begin the system POC test, click on the Power Up button on the Exerciser-Track Statusscreen. When this selection has been made, the CAPI PC will check to see if the sorter ispowered on. If it is not, you are prompted to turn on the sorter and continue. Once theTrack Control Program has determined that the sorter is powered up, it issues a reset tothe transport hardware. This resets all of the track hardware as well as all of the optionmodules (i.e. microfilmer, MJE, etc.). After the reset has been issued, the POC applicationprogram is started on the PC. This program tests the transport hardware and establishescommunications with all of the option modules so that their POC test status can beprocessed. When the system POC test is executing, the Exerciser - Track Status screendisplays the status shown in Figure 1–8.

Introduction


Figure 1–8. POC Test Executing Status Display

The status of individual POC tests is not displayed unless a failure condition occurs. Thisis a departure from the non-CAPI environment which prompts you whenever a testcompletes, whether or not it has passed or failed. If a failure occurs in the transporthardware portion of the system POC test, the error is displayed and further POC testing isaborted. Under these circumstances, the only option you are provided with is to reset thesorter and rerun the entire system POC test again. Consequently, transport hardware POCerrors are considered fatal to sorter operation. This is consistent with the non-CAPIenvironment. A sample transport error screen is shown in Figure 1–9.

Introduction


Figure 1–9. Sample POC Transport Error Screen

If the transport hardware portion of the POC test passes, the option modules are queriedfor their POC test status. If an option module fails it POC test, the error code is placed inan error buffer and the POC status from the next option module is processed. The errorbuffer is always overwritten with an error code from the last option module to report afailure condition. For example, assuming the HSOCR and the Dual Image Module fail theirrespective POC tests, if the Dual Image Module is queried last, its error code will replacethe HSOCR error code in the error buffer. Only one error code will be displayed and it willbe the one pertaining to the Dual Image Module.

This is significantly different from the Non-CAPI method for dealing with option modulePOC errors. In the non-CAPI environment multiple error conditions are reported. In theCAPI environment, the error status from the last option module to fail its POC test isdisplayed. A sample option module, POC test error screen is shown in Figure 1–10.

Introduction


Figure 1–10. Sample POC Option Module Error Screen

POC test failures that occur in optional devices do not prevent you from running the sorter.Devices that do not pass their POC tests are simply disabled. This is implied by theprevious screen display. Even though the CAPI PC is unable to communicate with theHSOCR, you can press the F5 key to proceed with accessing the Transport Exercisermenu.

The Exerciser - DP1XXX Options screen (Figure 1–11) is displayed when the system POChas completed.

Introduction


Figure 1–11. Exerciser - DP1XXX Options Screen

If you want to rerun the system POC test after running the exerciser, you need to click onthe Power Down button on Exerciser screen. This will initiate a power down sequence tothe Track Control Program. Part of this sequence is resetting a flag that is used by theTrack Control Program to determine if the transport has been reset. Whenever a trackreset command is issued to the Track Control Program by an application, this flag is set.The Track Control Program uses the flag to determine if it needs to reset the transport and,consequently, run the system POC test. If this has already been done, running the POC testagain is not necessary. When the program completes its software power down sequence,you are prompted to turn off the transport power (Figure 1–12).

Introduction


Figure 1–12. Power Down Prompt Screen

After the sorter has powered down, the Transport Exerciser displays the status shown inFigure 1–13.

Figure 1–13. Transport Powered Off Status Display

Introduction


To start the system POC test again, click on the select Power Up button. To exit theTransport Exerciser application, click on the Exit button.

Starting the System POC Test From the MTR Application ProgramTo run the system POC test from the MTR program, start the MTR application by selectingDP1XXX from the Windows NT Start Menu. When the DP1XXX submenu is displayed,select CSE Utilities. When the CSE Utilities submenu is displayed, select DP1XXX

Maintenance Test Routines (see Figure 1–14).

Figure 1–14. Selecting the DP1XXX Maintenance Test Routines

The MTR application program communicates with the Track Control Program, which inturn, determines if the sorter transport is powered on. If there is no power applied to thetransport, the screen shown in Figure 1–15 is displayed.

Introduction


Figure 1–15. Transport Not Powered On Screen

Once the sorter power has been turned on, click on the Retry[F4] button (or press the F4key) to instruct the Track Control Program to check for transport power once again. Withthe sorter powered up, the MTR application issues a reset transport request to the TrackControl Program, which in turn issues a reset to the transport hardware and starts the POCapplication program on the PC. When the system POC test is executing, the screen shownin Figure 1–16 is displayed.

Figure 1–16. Track Control Status Screen

When the system POC completes, the Track Control Program sets the transport reset flagindicating that the transport has been reset, and either an error status or the MTR mainmenu is displayed. A sample error screen is shown in Figure 1–10.

Introduction


The transport reset flag is used by the Track Control Program to determine if the systemPOC should be rerun when other applications issue a reset transport request. If the flag isactive, the Track Control Program ignores the request.

If you want to rerun the system POC test after running the MTR application, the you needto return to the MTR main menu and select Power Down/Up from the Test pull downmenu (see Figure 1–17).

Figure 1–17. Power Down/Up Test Selection

This will initiate a power down sequence to the Track Control Program, followed by atrack reset request. Part of the power down sequence is clearing the transport reset flagthat is used by the Track Control Program to determine if the transport has been reset.Whenever a track reset command is issued to the Track Control Program by an application,this flag is set after the reset has been issued to the transport hardware. The Track ControlProgram uses the flag to determine if it needs to reset the transport and, consequently, runthe system POC test. If this has already been done, running the POC test again is notnecessary. When the program completes its software power down sequence, the user isprompted to turn off the transport power (see Figure 1–12).

After the sorter has powered down, the MTR application issues a transport reset commandto the Track Control Program and the system POC is started again.

Introduction


Viewing the DOS Window of the Track Control Program For POCTest Status

In the Non-CAPI environment, multiple error conditions in the sorter option modules aredisplayed. This is not the case for CAPI. Only one error condition is reported if more thanone option module fails its POC test. The fault code displayed is that of the last optionmodule tested which produced an error condition. There is, however, a way to viewongoing POC test status, as well as multiple error conditions, outside of the normal displaymodes used by the Transport Exerciser and the MTR application. The Track ControlProgram outputs status messages passed to it by applications to a DOS window that theuser can access. The system POC program sends such test status messages to the TrackControl Program for display. These messages indicate which tests have passed as well aswhich option module tests have failed. Access the DOS window by holding the Alt keydown once the system POC has started, and pressing the Tab key. This will display awindow showing icons for all of the applications that are currently running.

Holding the Alt key down and pressing Tab, cycles through the icon display. Selecting theDP1X00 Track Control icon will display the DOS window. From this window, the ongoingstatus of the system POC test is displayed (see Figure 1–18).

Figure 1–18. Track Control Program DOS Window

Introduction


Description of POC TestsThe overall, system POC test can be broken down into two stages: transport hardware (AAgate) tests and option module tests.

Transport Hardware (AA Gate) Tests

Table 1–2 lists and describes the transport hardware (AA gate) tests.

Table 1–2. Transport Hardware (AA Gate) Tests

Test Description

Test 1: PBLINK clock signal test Verifies ’PBLINK’ clock signal is active and at the correctfrequency.

Test 2: PCI Interface Loop test The integrity of the PCI Interface address and data lines isconfirmed by a simple loop test from the PCI interface to aregister on the Reader Configuration PCBA (slot AA10). Thesuccessful completion of this test indicates that these linesare free from shorts an can be controlled by the CAPI PC.

Test 3: AA gate hardwareconfiguration test

This test verifies that all non-optional AA gate PWBAs areinstalled by accessing an exclusive MULTIBUS address foreach PCBA and verifying that a bus error condition does notoccur. Non-operational PWBAs are those that handle:

• Area 1 tracking• Area 2 tracking• Clock circuitry for the AA gate• Reader configuration processingOnce the presence of all non-option PWBAs is verified, thestatus of the optional PWBAs is checked.

Test 4: MICR reader test The CAPI PC sends a series of commands via theMULTIBUS to the recognition control and analog PWBAs ofthe Magnetic Ink Character Recognition (MICR) reader.These commands result in the chronological execution ofthe following tests:

• Processor subtest• Maintenance register subtest• Result PROM subtest• Quantizer subtest• Segmentation subtest• MCR test• FIFO test• Maintenance RAM subtest• Analog board subtest

Test 5: AA gate I-signal test This test verifies the operation of the address decoding andinternal data bus for each AA gate PCBA placed in ’I-test’

Introduction


Table 1–2. Transport Hardware (AA Gate) Tests

Test Description

mode. Enabling ’I-test’ mode for an AA gate PCBA allows allMULTIBUS registers on the PCBA to be written to at thesame time. Data written to any one register is stored in allother registers on the PCBA.

Test 6: AA gate A/B signal test This test drives all of the outputs of the AA gate PCBAunder test high or low, and then reads status from the otherPWBAs in the gate to verify that their corresponding inputlevels are in the correct state.

Test 7: Reader/Configurationinterface test

This test verifies the functionality of the following moduleswhich reside on the Reader Configuration PCBA (AA gateslot 10).:

• Z80 registers and instruction set• RAM and ROM• CTC timers• PIOs• A and B buffers• 4 Mhz clockUpon completion of these tests, communications betweenthe CAPI PC and the Z80 CPU are established.

Test 8: AA gate transport statustest

This test checks the status of various hardware devices toensure that they are in a correct state for operation. Itemschecked are: * Circuit breakers * Motor status * Jamstatus * "Gate fault/track error" reset capability * Primaryand secondary clutch separator status

As in the NDP, any errors that occur in the non-option module portion of the CAPI POCtest are considered fatal to system operation.

Introduction


Option Module Tests

After successfully completing the transport hardware portion of the POC test, the CAPI PCrequests POC status from each of the sorter’s devices. The devices currently supported are:

• Pep/Stamp module

• MJE module

• Microfilmer module

• HSOCR reader module

• Image module (IC1000 and Dual Image)

• High Speed Encoder module

Option module error codes are displayed in the same format as the non-option moduleerror codes. However, you are allowed to operate the sorter if any of the option modulesfail their power up test.

Each module has an interface PCBA usually residing in the AA gate that allows the CAPIPC to communicate with it. Each interface PCBA runs its own self test and then processesstatus from the device it is linking to the CAPI PC. The POC application running on theCAPI PC establishes communication with each interface PCBA and processes the POCstatus that the interface PCBA has retrieved from the device. If the option module fails itsPOC test, a fault code buffer is updated with the appropriate error message and the nextoption module is queried for status. The fault code buffer only holds the error code for thelast option module to fail its POC test. At the conclusion of the system POC test, the errorcode stored in the fault code buffer is displayed.

You can select click on the Retry[F4] button (or press the F4 key) to rerun the entiresystem POC test or click on the Continue[F5] button (or press the F5 key) to run theapplication that issued the track reset command to the Track Control Program, either theTransport Exerciser or the MTR program.

Introduction


POC Test Error Display DescriptionErrors that occur during POC are displayed by the DP1XXX Common API ExceptionHandler program. This program handles the display of all transport exception/errorconditions. The POC application passes data to the Exception Handler that references anerror code message from an exception/error code data base. A standard error code displayis shown in Figure 1–10.

The POC error display consists of the following components.

• The five byte error code passed to the Exception Handler by the application, in thiscase the POC test program. This code is to the immediate right of the ExceptionHandler revision level and is in parenthesis. The format is AA BB XX XX XX where

AA: indicates the error exception type

00 = Power on Confidence Test Program exception

01 = Track Control Program exception

02 = Cage Program exception

03 = Fatal system exception

BB: the device ID the exception is associated with

00 = Transport 08 = Microfilmer module

01 = MICR Reader 09 = IC 1000 Image module

02 = OCR 1 0A = High Speed Encoder module

03 = OCR 2 0B = Secondary feeder module

04 = PEP module 0C = Dual Image module

05 = Stamp endorser module 0D = DC Feeder module

06 = Front MJE module 64 = General device

07 = Rear MJE module

The remaining three bytes are used to identify the test executing and the specific errorcondition. This information is not in the Servicing Guide manual procedure formatand is used by the Exception Handler to access the appropriate entry in the error database.

• Eight bytes of additional data that each option module can use for extended statusinformation. See the appropriate option module section for information on how theseeight bytes are used, if at all.

• An Error name field that briefly describes the error condition reported.

• A Detailed error description field that contains a more complete description of theerror condition. If more detailed information is not required, this field matches theError name field.

• A Manual Procedure field that is used to index the error condition into a manualprocedure in the Servicing Guide. For example, the Exception Handler error code "0000 08 02 05" has a manual procedure index of "PC 08 0002".

Introduction


• Suspect Component 1: The most likely field replacement unit (FRU) to have failed,causing the error condition.

• Suspect Component 2: The 2nd most likely FRU to have failed, causing the errorcondition.

• Suspect Component 3: The 3rd most likely FRU to have failed, causing the errorcondition.

• Suspect Component 4: The 4th most likely FRU to have failed, causing the errorcondition.

• Suspect Component 5: The 5th most likely FRU to have failed, causing the errorcondition.

Bypass POC TestsThe system POC can be partially bypassed to allow quicker access of either the TransportExerciser or the Maintenance Test Routines. POC Bypass mode is enabled by editing thefile DP1XXXSTART.BAT in the directory %DP1X00TRKBASE%\BIN, where%DP1X00TRKBASE% is a Windows environmental variable set up by the CAPI softwareinstallation. It specifies the directory in which the Track Control Program is located. POCbypass is enabled by changing the command line

��

in DP1XXXSTART.BAT to

��

After this file has been changed, the Track Control Program should be brought down, if itis running, and started again. To exit the Track Control Program, display its DOS windowand click on the X icon in the top right corner of the window with the right mouse key.Refer to "Viewing the DOS Window of the Track Control Program For POC Test Status"earlier in this section.

To restart the Track Control Program select DP1XXX from the Windows NT Start Menu.When the DP1XXX submenu is displayed, select Track Startup.

When an application issues a transport reset command to the Track Control Program, theTCP will issue the reset to the transport hardware but it will not start the POC testprogram. Instead the POC Bypass program is started. This program skips all transporthardware testing and gets all of the option modules out of test mode and into operationalfirmware.

To disable POC Bypass mode, bring down the Track Control Program, remove the "-p"parameter from the command line mentioned above in DP1XXXSTART.BAT, and restartthe Track Control Program.

Introduction


Maintenance Test Routines (CAPI Configuration)The rest of the diagnostic system tests are the Maintenance Test Routines. In order to runthe MTRs, the Track Control Program must be running. This program is automaticallystarted after the user logs on to Windows NT 4.0 after powering up the CAPI PC. If theTrack Control Program has been shutdown due to previous user activity, it can be startedagain by selecting DP1XXX from the Windows NT Start Menu. When the NDP1XXXsubmenu is displayed, select Track Startup (see Figure 1–19).

Figure 1–19. Selecting the Track Startup Program

Once the Track Control Program is started, the MTRs can be run. To start the MTRapplication select DP1XXX from the Windows NT Start Menu. When the submenu forDP1XXX is displayed, select CSE Utilities. When the CSE Utilities submenu is displayed,select DP1XXX Maintenance Test Routines (see Figure 1–14).

This will start the MTR application program and display the DP1XXX MTR Screen (seeFigure 1–20).

Introduction


Figure 1–20. DP 1XXX MTR Screen

Note: The MTR application should never be run concurrently with the transport

exerciser application. Under the Windows environment it is possible to start up

both applications. However, the Track Control Program is only designed to

interface one application program at a time with the transport MULTIBUS. If

the Transport Exerciser is running and you wish to run the MTRs, access the

exerciser’s main menu and select Exit, or press the Esc key (see Figure 1–11).

This will shutdown the exerciser program, allowing the MTR application to be

run. When the MTR application starts up, it sends a transport reset command

to the Track Control Program. The Track Control Program knows whether or not

it has previously issued a transport reset command. If it has, it does not issue

the track reset and waits for the next request from the MTR application. If a

previous transport reset was not issued, the Track Control Program issues a

reset to the transport hardware and starts the system POC test. After the system

POC test completes, the Track Control Program waits for the next request from

the MTR application. The MTR application always sends a transport reset

request to the Track Control Program when it is started. The Track Control

Program will only run the system POC if it has not previously received a

transport reset request.

Introduction


After the transport reset request has been handled, the MTR main menu is displayed (seeFigure 1–20).

Screen Format

The API screen uses the following format:

• At the top of the screen a menu bar provides various commands.

• Below the menu bar a toolbar displays the function keys.

• Below the function key toolbar is a list of the available tests.

• On the right of the list of tests, a description of the highlighted test is displayed.

• The results of a test are displayed on the lower part of the screen.

Menu Bar and Function Keys

Menu Option Command Function

File Exit Enables you to exit the MTR dialog.

View Enables you to choose how you want to view the screen.

Toolbar Toggles on or off the display of function keys.

Status Bar Toggles on or off the status bar at the bottom of the screen.

Test Results Toggles on or off the test results description at the bottomof the screen.

Option... Displays the View Options dialog, which enables you tochange the fonts for the menu and for the test description.

Test Enables you to select test options.

Loop F9 Specifies that the diagnostic routine you chose from the testmodule submenu will be executed repeatedly.

Execute once F10 Specifies that the diagnostic routine you chose from the testmodule submenu will be executed one time only.

Stop F1 Exits loop mode operation.

Return to menu F2 Returns you to the MTR Test Main Menu (Figure 1–20) fromthe full screen display mode of the test results grid.

Power Down/Up Powers the track down or up.

Introduction


Procedure

Use the following procedure to access test descriptions and tests:

1. Click the box at the left of the name of the module test (for example, Dual Image

Module Tests).

Note: If the box at the left of a test name has a plus sign (+), it can be expanded

into subtests. If the box has a minus sign (–), it has already been expanded.

A list of the tests for that module is displayed (for example, Calibrate Scanner

Utility and Run Lamps).

If a box appears at the left of one of these tests, you can click it for a further list ofsubtests (for example, Calibrate Front Camera and Calibrate Rear Camera).

2. Click and highlight the name of a test to view a description of the test.

Run the highlighted test by clicking on either F9 (Loop Mode) or F10 (Execute Once)

on the toolbar or by pressing the F9 or F10 keys, respectively.

Introduction


Description of Maintenance Test Routines:The following are descriptions of the MTR tests.

Transport Tests

Beam of Light Bias Values This utility graphically displays the Beam Of Light (BOL)bias values for the transport.

Document Flow Test Checks for Transport Ready and the ability to feed itemsfrom both feeders in a single item mode. Too Late ToPocket (TLTP), document data interrupts, pocket selection,gate operation, and proper document track timing arechecked.

Beam of Light Timing Test This test demand feeds 20 documents from the primaryhopper and records the time it takes each document totravel between adjacent BOL pairs. After flow has stopped,the recorded times are compared to predetermined timingwindows to verify that the transport is operating withintolerance. Adjacent BOL pairs with track times that are outof tolerance are identified.

Note: Six inch documents must be used to insure propertrack timing measurements. This test is based onSubtest 05 from the NDP Transport Testssubmenu.

Basic Microfilmer Tests

Microfilm Scan Test This routine allows you to place a document in the opticalgate and film it repeatedly. In this way you can check forvibrations in the galvo assembly.

Height BOL Test This routine diagnoses problems in the height detectorBOLs, determining if the fault lies with the BOL or with itsassociated control circuitry.

Film Transport Tests

Capstan Motor Tests These tests execute seven selectable moves of the CapstanMotor at the selected motor speeds. The movement can beexecuted one time, or it can be continually repeated. Thetests are executed with or without film.

Loop Arm Sensor Test Tests the loop arm sensors by having you press the take-upand the supply loop arms to ensure that each of the threesensors on both arms are operating correctly. This testexecutes without film.

Introduction


Reel Motor Test In this routine the CSE tests the reel motors by pressing onthe loop arms while visually checking for the correct reelmotor movements. This test is executed without film.

Idler Encoder Test Tests the idler encoder by having the CSE manually turn andcheck the idler encoder count. This test executes withoutfilm.

Supply Encoder Test Enables the supply encoder motor and verifies the supplyencoder count. The test loops until the CSE stops it. Anexception is a register failure. This will halt the test.

Galvo Tests

Galvo Home Routine This routine finds the actual galvo home position andverifies that it is within range ($10 - $70).

Galvo Scan Routine This routine implements a continuous loop of two scans: ashort (5 inch) scan, followed by a long (9 inch) scan. Theroutine is designed so that the two scans fit on anoscilloscope trace. Errors detected are reported only afterthe test is terminated.

Hardware Parameter Adjustment Routines

This utility sets up the following operational parameters required for the microfilmer:

• Lamp Intensity/Density adjustment

• ALM adjustment

• LED/TED adjustment

• ID display adjustment

• Galvo adjustment

• Modify NVRAM parameters

ID Display Tests

The CSE selects one of two test display patterns and visually verifies the ID display iscorrect. The display patterns used are

• Enable ID display with 0’s

• Enable ID display with blocks

Introduction


Miscellaneous Tests

Lamps Test The Lamps test turns on the lamps in the following sequence. A visualcheck of the lamps is conducted to ensure the lamps are illuminatingproperly.

1. Front lamp only

2. Rear lamp only

3. Both front and rear lamps

ICM Test The Image Count Mark Test individually enables ICM’s 1 and 2 and requestsa visual verification of their operation.

Human Readable Header Test Part 1 of the test displays three characters that light upevery segment on the Human Readable Header display.This should be visually verified by removing the filmcartridge and observing the display. Part 2 of the testcycles through the Human Readable Header’s characterset. The correct display of the character set should bevisually verified.

Capping Shutter Test The Capping Shutter Test opens and closes the cappingshutter and verifies that the open/close sensorscorrectly report the changing status. A visualverification of the shutters status is also requested bythe test.

MultiJet Endorser Tests

The following are phase/voltage tests and adjustments:

Head Phase Sweep The Head Phase Sweep will print the test pattern graphic ondocuments at various head phase values. By viewing thedocuments, the best head phase setting can be determined.

Charge Voltage Sweep The Charge Voltage Sweep will print the test pattern graphicon documents at various charge voltage values. By viewingthe documents, the best head charge voltage setting can bedetermined.

Set Head Phase Set Head Phase will read the current head phase setting forthe specified MJE unit, and allow this value to be changed.

Set Charge Voltage Set Charge Voltage will read the current charge voltagesetting for the specified MJE unit, and allows this value tobe changed.

In addition, you can select Run Time Commands and Extended Diagnostic Commandsfrom the MultiJet Endorser tests menu.

Introduction


Impact Endorser Tests

Stamp Home Sensor Test: This test places the PEP microprocessor into diagnostic testmode and sends a "home stamp sensor" request to it. Thetest waits five seconds for the stamp sensor to be placed atits home position and a status condition to be returned. If atimeout condition occurs, an error is flagged. If the stampsensor cannot be placed at its home position, the particularfailure condition is reported.

Stamp Phase Motor Tests:

Phase Driver Test: This test checks the functionality of the Stamp Motor PhaseDriver circuitry for motor phases A, B, C, and D. To run thePhase Driver Test, the Stamp motor must be disconnectedfrom the Stamp Driver board.

Phase Current Test: This test allows the user to enable the Stamp Motor Phasecurrent at one of four selectable levels. At the conclusion ofthe test, the Stamp Motor Phase current is disabled.

Hold Stamp Utility: This utility enables Stamp Motor phases A and B, whicheffectively hold the stamp in a fixed position.

PEP Hole Detect Test: This test checks the functionality of the PEP hole detectcircuitry. Twenty test documents, with a fixed number ofholes, are demand fed. After each document is transported,the PEP module is placed in diagnostic mode and thecurrent status of the hole count register is uploaded andsaved in an array. The PEP module is then restored tonormal operation mode. After all twenty documents havebeen processed in this manner, and average of the holecount values stored in the array is calculated. If this averageis less than 48 or greater than 66, an error condition isreported.

PEP Print Needle Test: This test verifies that all of the print needles for charactergenerator banks A, B, and C are functioning correctly.Eighteen documents are demand fed and endorsed duringthe test, one for each print needle being exercised. The testlabels the documents with the bank (A, B, or C) and theprint needle (1 - 6) from that bank, being tested. If the needleunder test is jammed or firing continuously, flow is stoppedand an error message is displayed identifying the needle.When failures occur, the document for the failing needle canbe inspected to provide additional information as to thenature of the failure.

Introduction


E13B MICR Reader Tests

AC Reader Pixel Data Display This test will demand feed a document from the primaryhopper and use the AC recognition system to read theMICR code line on the document. The MICR code isdisplayed and the user is given the option to view thecharacter pixel data from the recognition board.

Dual Image Module Tests

Calibrate Front Camera This MTR creates information used to compensate foranalog and optical variations in the front digitizer andcamera combination. The results for this MTR are stored onthe Image Capture Server (ICS) hard drive inC:\dpimage\frontX.cfg and C:\dpimage\frontX.tbl. Thesedata files are used by the ICS during document flow forsetup of the normalizer framer and camera/digitizer.

Calibrate Rear Camera This MTR creates information used to compensate foranalog and optical variations in the rear digitizer and cameracombination. The results for this MTR are stored on the ICShard drive in C:\dpimage\rearX.cfg and C:\dpimage\rearX.tbl.These data files are used by the ICS during document flowfor setup of the normalizer framer and camera/digitizer.

Run Lamps This MTR enables you to turn the lamp lights on and off toverify that they are working.

High Speed Encoder Module Tests

STATIC 1:

• Track Sensor Current Monitor Test

• Track Sensors Input Simulation Test

• Track Sensors Normal Mode Test

• Servo-Skew Interrupt Test

• Skew Sensor Test

• Skew Sensor Compensation

• Skew Read Result

• NVRAM Test

• External Bus Wrap-Around Test

• Power Control Circuitry Test

• Servo Velocity Adjust

• Servo Slip Reference

• Servo Voltage Monitor Test

Introduction


• Servo Driver Voltage Monitor Test

• Servo Normal Mode Test

• Skew Table Calibration Test

STATIC 2:

• Enter Print on Outsort Mode

• Exit Print on Outsort Mode

• Printer-Microprocessor Instruction Set Test

• Printer-Prom Checksum Test

• Printer-RAM test

• Printer-NVRAM test

• Printer-External Bus Wrap-Around Test

• Printer-External Control Signal Wrap-Around Test

• Hammer Supply Monitor Test

• Hammer Clock Verification Test

• Hammer Voltage Monitor Test

• Hammer Impact Monitor Test

• Hammer VCL Test

• Sensor State

• Sensor Compensation

DYNAMIC:

• Drum Sensors Test

• Ribbon Sensors Test

• Ribbon Stepper Motor Test

• Ribbon Tracking Adjustment Test

• Ribbon Skew Sensors Status

Introduction


High Speed OCR Reader Tests

Non-Volatile RAM Utilities:

Initialize NV RAM: This utility clears the OCR module’s non-volatile RAM andthen automatically initializes the following parameters:

• Lamp intensity

• Transport speed

• Signature values for the OCR diagnostic bus POC tests

The user is then prompted to enter initialization values forthe following non-volatile RAM parameters:

• Classifier configuration

• OCR unit serial number

• Month

• Date

• Year

Edit NV RAM Parameters: This utility allows the user to edit the OCR module’s non-volatile RAM parameters.

Elevator Tests

Locking Mechanism Test: Checks the functionality of the elevator lock and verifiesthat the lock status is correctly interpreted.

Travel Limit Sensor Test: This test verifies the functionality of the camera elevator andits associated travel limit switches. The camera elevator isdropped to its bottom travel limit and the status of thebottom travel limit switch is checked. The elevator is thenmoved to its upper limit and the status of the top travel limitswitch is checked. With the successful conclusion of thetest, the elevator is moved to the bottom travel limitposition.

Lamp Test

Enable Lamp (NVRAM Value): This test turns on the lamp with the lamp intensityvalue stored in the OCR’s non-volatile RAM. Thelamp current sensing circuitry is checked and anyerror is reported. The NVRAM lamp intensity valueis also displayed.

Enable Lamp (User entered value): This test turns on the lamp with a lamp intensityvalue entered by the user. The lamp current sensingcircuitry is checked and any error is reported. Theuser is then offered the option of storing the lampintensity value into NVRAM.

Introduction


1150 Multi-Jet Endorser Tests

1. Print Head Present Test

This test detects if the print head is present. The user is prompted at the beginning ofthe test to choose which module to check, the front MJE or the rear MJE.

2. Read Dot Count Utility

This utility returns the most significant 8 bits of the 32 bit print fire dot counter. Theuser is prompted at the beginning of the utility to choose which module to check, thefront MJE or the rear MJE. The information returned lets the user know the percentageof ink left in the ink cartridge.

3. Reset Dot and Document Count Utility

This utility resets the dot and document counter. The user is prompted at thebeginning of the utility to choose which module to check, the front MJE or the rearMJE.

4. Non-volatile RAM Test

The test verifies the write/read functionality of the non-volatile RAM.

5. Head Purge Test

This test verifies the operation of the print head purge circuitry. During the test, ink isemitted from the head. The user is prompted at the beginning of the test to choosewhich module to check, the front MJE or the rear MJE.

6. Print Logic Test

This test verifies the operation of the print logic circuitry by sending two blankcolumns of character data to the print driver board. The user is prompted at thebeginning of the test to choose which module to check, the front MJE or the rear MJE.

7. Dual Port RAM Test

This test checks the write/read operation of the MJE’s dual port RAM.

8. Print Head Alignment Utility

This utility endorses ten documents for each of the sixteen possible head phasepositions of the MJE. The endorsed documents are sorted to the last pocket in the firstpocket module. The user is then prompted to inspect the documents and select themost desirable head phase position. If the user exits without making a choice, the headphase is automatically set to position eight by default. The user is prompted at thebeginning of the test to choose which module to check, the front MJE or the rear MJE.

9. Firmware Version Level Utility

This utility displays the version level of the MJE Interface PCBA’s resident firmware.It also displays the date that the code was compiled on.

Introduction


Power-On Confidence Tests (Non-CAPIConfigurations)

POC tests are executed each time the system power is turned on or when the MASTERRESET push-button is activated. For the NDP 030 configuration, the main POC testroutines reside on the NDP030 CPU PCBA (slot 17). For the NDP Ready configuration, themain POC test routines reside on the NDP Ready 68030 CPU PCBA (slot 17). Other PCBAsin the AA gate, as well as devices outside of the AA gate, have their own POC test routinesthat reside on their on-board EPROMs. When the sorter is reset, all of the POC tests beginexecution simultaneously. The main CPU PCBA (either the NDP030 CPU PCBA or theNDP Ready 68030 PCBA) processes the POC test status and transfers it to the NDP PC viathe communications link (SCSI or RS-232) between the NDP PC and the main CPU PCBA.

Note: From this point on, the term "NDP CPU" will pertain to both the NDP 030 CPU

and the NDP Ready 68030 CPU. In instances where there are differences

between the operation of the two configurations, they will be noted.

Description of POC TestsThe overall, system POC tests can be broken down into three stages:

1. NDP CPU PCBA kernel tests

2. AA gate tests

3. Option module tests

The following subsections describe in detail the three stages and their corresponding tests.

NDP CPU PCBA Kernel Tests

The kernel tests verify the functionality of the NDP CPU PCBA. The PCBA’s hardwarefunctional blocks are identified below. They are tested in the following order:

1. Motorola 68030 CPU test

2. RAM memory configuration test

3. RAM address line and write/read test (1st megabyte)

4. SCSI initialization (not a test) (NDP 030 configuration only)

5. EPROM checksum test

6. RAM address line and write/read test (remaining memory after 1st megabyte)

7. Privilege exception test

8. Dead bus timer test

9. Programmable timer module test

10. Flash EPROM checksum test (NDP 030 configuration only)

Introduction


If any of the above tests fail, with the exception of the "Flash EPROM checksum test," a68030 CPU halt condition occurs.

If tests 1 through 3 fail, no screen message is displayed because the communications linkbetween the PC and the NDP CPU PCBA is not established.

If tests 5 through 9 fail, the following message may be displayed on the NDP PCs monitor,depending on whether or not communications between the PC and the NDP CPU PCBAhave been established.

�� !�� "� #��# �$��"#�% & & &

Note: Errors in tests 1 through 9 do not result in a standard failure code screen

display.

If no screen message appears or if the "MAIN PROCESSOR: POWER UP TESTEXECUTING..." message is displayed indefinitely, the NDP CPU PCBA has failed its POCkernel test. Observe the MTR LEDs on the NDP CPU PCBA (slot AA17). The LEDsindicate the last test executed. If the initial pattern (FF - all LEDs on) is displayed, thePOC test never started executing. Use the "LED Fault Code Conditions" table at thebeginning of Section 2 to determine which test was executing when the system halted.This table references manual procedure line numbers for analysis procedures. For theNDP 030 CPU, if a failure occurs in the Flash EPROM checksum test, a standard failurecode message is displayed. All the NDP030 CPU kernel tests reside on the PCBA’sEPROM. If the kernel tests pass, a screen message is displayed listing all the tests. Thenprogram control is passed to the POC Test Handler. This handler manages the executionof AA gate POC tests and the option module POC tests.

Note: For the NDP Ready CPU PCBA, all test code is resident on an EPROM. For the

NDP 030 configuration, the kernal tests are resident on an EPROM and the

remaining tests are resident on a "flash" EPROM.

AA Gate Tests

The AA gate tests verify the functionality of the AA gate backplane, ensure that thephysical sorter configuration matches the reported (hardware configured) configuration,and guarantee the operation of the Reader Configuration Interface PCBA (slot AA10). TheAA gate hardware functional blocks are identified below. They are tested in the followingorder:

1. AA gate MULTIBUS loop test

2. Configuration bus error test

3. Character recognition system test

4. Z80 CPU test

Introduction


AA Gate MULTIBUS Loop Test

The integrity of the MULTIBUS address and data lines is confirmed by a simple loop testfrom the NDP CPU PCBA to a register on the Reader Configuration PCBA (slot AA10). Thesuccessful completion of this test indicates that these lines are free from shorts and can becontrolled by the NDP CPU.

Introduction


Configuration Bus Error Test

This test verifies that all nonoptional, AA gate PCBAs are installed by accessing anexclusive MULTIBUS address for each PCBA and verifying that a bus error condition doesnot occur. Nonoptional PCBAs are those that handle

• Area 1 tracking

• Area 2 tracking

• Clocking circuitry for the AA gate

• Reader Configuration processing

Once the presence of all nonoptional PCBAs is verified, the status of the optional PCBAs ischecked. These PCBAs are typically interface cards that allow the NDP CPU tocommunicate with option modules added to the basic transport (that is, the microfilmer,imaging module, endorser, etc.). The MULTIBUS configuration registers are checked tosee what option modules the sorter is configured to have. MULTIBUS addresses exclusiveto each option module’s interface PCBA are then read. If an option module is reportedpresent by the configuration registers, the MULTIBUS address on its correspondinginterface card should not cause a bus trap when read. Correspondingly, a read of theaddress should cause a bus trap if the option module is reported not present by theappropriate configuration register.

Character Recognition System Test

The NDP CPU sends a series of commands via the MULTIBUS to the recognition controland analog PCBAs of the magnetic ink character recognition (MICR) reader. Thesecommands result in the execution of the tests identified below. They are tested in thefollowing order:

• Processor subtest

• Result PROM subtest

• Maintenance register subtest

• Quantizer subtest

• Segmentation subtest

• MCR subtest

• FIFO subtest

• Maintenance RAM subtest

• Analog board subtest

Each of these subtests can also be accessed from the MTRs.

Introduction


Z80 CPU Test

The Z80 CPU is located on the Reader Configuration PCBA (slot AA10). This test verifiesthe functionality of the following modules, which reside on the Reader ConfigurationPCBA:

• Z80 registers and instruction set

• RAM and ROM

• CTC timers

• PIOs

• A and B buffers

• 4 Mhz clock

• PBLINK signal

Upon completion of these tests, communications between the NDP CPU and the Z80 CPUare established, and test results are passed to the NDP CPU.

Introduction


AA Gate Test Errors

Errors that occur in the AA gate POC tests result in a failure code being displayed on theNDP PC monitor. The failure screen gives the fault code with a brief description andallows the user four function key selectable options. These options are described in Table1–3.

Table 1–3. AA Gate Test Fault Code Options

Function Key Description

<F1> Additional information

Selecting this option displays additional text describing the operational intentof the POC test and identifies probable suspects for the failure.

<F2> Transport status

Selecting this option checks the current status of the MULTIBUS registers.

<F3> Load MTR software

NDP 030 Configuration:

Selecting this option transfers program control to the BOOTLOAD routine.This routine automatically downloads the software that the NDP PC has beenconfigured to download (normally, the system software applicationprogram).

Note: If the MTRs are to be downloaded, the appropriate changes mustbe made on the NDP PC to enable CSE mode. These change aredescribed later in this section in the subsection "Maintenance TestRoutines."

NDP Ready Configuration:

Selecting this option transfers program control to the BOOTLOAD routine.This routine automatically downloads the software from the Versa-DOSformatted floppy disk currently in the 5 1/4 inch drive located at the front ofthe PC slice. The drive is mounted just below the bottom right corner of thePC’s monitor. Disks usually loaded after the POC test are the systemsoftware disk or the MTR disk.

<F4> Motorola debugger

Selecting this option accesses the Motorola debugger routine.

When an AA gate POC test completes without error, a "passed" status message, identifyingthe test, is added to the screen display. This enables the user to visually track the progressof the POC test. If all the AA gate tests complete without error, the OPTION MODULEPOC TEST STATUS screen is displayed. At this point, the POC TEST HANDLER beginscalling communications routines that report the POC status of the option modules withinthe sorter that have been running their own separate POC tests concurrently with theNDP CPU PCBA. This is the third stage of the system POC test, the option module tests.

Introduction


Option Module Tests

The NDP currently has the following available option modules:

1. Programmable Endorser Printer/Stamp (PEP/Stamp)

2. Unisys Cinemode Microfilmer

3. High Speed Optical Character Recognition reader (HSOCR)

4. Multiline Ink Jet Endorser (MJE)

5. Imaging Module

Each module has an interface PCBA residing in the AA gate that enables the NDP CPUPCBA to communicate with it. Each interface PCBA runs its own self-test and thenprocesses status from the device it is linking to the NDP CPU PCBA. The POC TESTHANDLER running on the NDP CPU PCBA calls a status routine for each option module.The option module then establishes communications with the appropriate interface PCBAand processes the POC status that the interface PCBA has retrieved from the device.

If the option module passes its POC test, a status message indicating that the optionmodule has completed its POC test is added to the OPTION MODULE POC STATUSdisplay screen. If the option module fails its POC test, the option module status routinedisplays the appropriate fault code reported by the device. Keyboard input is thenrequested to continue the processing of POC status for the remaining option modules.

Successful completion of the system POC test causes the BOOTLOAD program todownload an application program. For normal operation in the NDP 030 configuration, theapplication is the Sorter Control Program (SCP). If it is desirable to run the MTRs in thisconfiguration, CSE Mode must be enabled on the PC prior to the completion of the POCtest. For the NDP Ready configuration, BOOTLOAD downloads the contents of the diskcurrently in the 5 1/4 inch floppy drive.

The following subsections briefly describe the option module self-tests.

Programmable Endorser Printer/Stamp Test

The Endorser Controller PCBA (slot AA09) test includes subtests for the CPU, the RAM,the ROM, and the programmable timer modules for both the PEP and Stamp processors.The communications link between the PEP CPU and the Stamp CPU is also verified. Thestamp motor is tested and is driven to its home position. A dualport RAM test checks thefunctionality of the communications link between the Endorser Controller PCBA and theNDP030 CPU PCBA. If any of the PEP/Stamp POC subtests fail, the appropriate module(PEP or Stamp) is disabled and made inoperable.

Stamp POC errors are not reported if the Stamp Error Bypass jumper is installed on theNDP030 CPU PCBA (slot AA17). The location of this jumper is W4/W3-C (Reference:SH 09.01.02, part number 2493 5900). For the NDP Ready 68030 CPU PCBA, the location ofthe jumper is W2/W3-C (Reference: SH 09.01.02, part number 2494 4200)

Introduction


Unisys Microfilmer Test

The microfilmer POC consists of two separate test systems. Both the Controller PCBA andthe Microfilmer/Image Interface Board (MIIB) have individual test routines that run inparallel with the sorter POC test.

The Controller exercises as much of the microfilmer unit as possible, depending on theconfiguration. For example, if film is present, the human readable header cannot betested. In general, the following components of the microfilmer unit are tested:

• Registers

• Timers

• Board presence levels

• Capstan

• Galvo

• Shutter

• Lamps

• ID display

• Human readable header

• Image presence level

• Image count marks

• Height detector BOLs

• Automatic light meters

In addition, the data communications between the Controller PCBA and the MIIB isverified. The MIIB executes its own set of tests that include an A/B signal test, a registertest, and a dualport RAM test. Fault codes are passed back to the NDP030 CPU by way ofthe dualport RAM interface.

Faults are split into errors and warnings. They are defined as follows:

• Error: The microfilmer unit is not available. The sorter can be used without themicrofilmer.

• Warning: Both the microfilmer and the sorter are available, but in a degraded state.For example, having the Galvo Home Bypass jumper on causes this type of message.

Every error displays a fault code.

Introduction


High Speed Optical Character Recognition Reader (HSOCR) Tests

The HSOCR reader executes its own set of POC tests and sends status to the NDP030 CPUPCBA upon completion. The following components of the HSOCR module are tested:

• Dynamic RAM

• Nonvolatile RAM (NVRAM)

• ROM

• MULTIBUS memory

• Timers

• Recognition electronics

• Camera elevator

• Lamps

The error code format used by the HSOCR reader is slightly different from the format usedby other sorter modules. The format is as follows:

�� ''

In this format,

�� ( #�� )*��

'' ( ��+� �)*��

For additional information on the HSOCR reader diagnostic system, refer to the DP 1800

OCR Reader Installation and Servicing Guide. All manual procedures for the HSOCRreader are covered in that guide.

Note: If the HSOCR reader fails its POC test, system software cannot download

controlware to the HSOCR reader.

Multiline Ink Jet Endorser Tests

The MJE executes its own POC test and sends the status to the NDP CPU when requested.

Imaging Module

There are two imaging systems supported by the NDP POC when running in the non-CAPIconfiguration: U4/JPEG and Dual Image. Both systems cannot be present at the sametime.

U4/JPEG Imaging Module

In the U4/JPEG imaging system, POCs reside in programmable read-only memory (PROM)locations on individual PCBAs within the imaging unit. POC results are displayed at thehost data communications terminal and the NDP PC monitor.

Introduction


When the imaging module is powered on, the power-on confidence tests are run. ThePoint-to-Point Optical Link (POL) PCBA, the Diagnostic Transport Interface (DTI) PCBA,and the Main Processor PCBA have their own power-on confidence tests. The Point-to-Point Optical Link (POL) PCBA also controls the initiation of power-on confidence testsfor the remainder of the imaging module. Examples of these power-on confidence tests are

• Verification tests to exercise the image pipeline and associated hardware with patternstimulus to verify the proper responses.

• Basic communication tests with the Image Interface Board (IIB) PCBA and the StorageRetrieval Module (SRM).

For further information about imaging system POCs, refer to the IC 1000/IC 1825 Imaging

Module Installation and Servicing Guide.

Dual Imaging Module

The Dual Imaging system consists of five basic components: the image camera, the imageelectronics gate, the Image Capture Server (ICS), the CAR Unit, and the Dual MicrofilmImage Interface Board (DMIIB). The NDP CPU communicates with the ICS via the DMIIB.

At power up, the ICS initializes itself and enters an idle state, waiting for commands fromthe NDP CPU. When the NDP CPU is ready to execute the Dual Image POC, it sends an"Enter Test Mode" command to the ICS. After this command has been processed, the ICS isready to except POC test commands from the NDP CPU. Commands for the following testsare then sent to the ICS:

• Get Image Gate Configuration

• PCI Image Interface Confidence Test

• Image Gate Bus Test

• Framing Logic Test

• Normalization Look-up-Table(LUT)/Diagnostic RAM Test

• Analog Interface Test

When the ICS receives a test command, it executes the appropriate test on either the imagecamera hardware, the image electronics gate hardware, or the CAR unit. Pass/fail isreported back to the NDP CPU. The tests defined above are always executed.

Additional tests are run once the configuration of the system has been determined.

If JPEG compression hardware is present in the system, the following tests are executed:

• Run JPEG Self Test

• JPEG Compressor Test

If CCITT compression hardware is present in the system, the following tests are executed:

Introduction


• Run CCITT Self Test

• CCITT Compressor Test

If the CAR unit is present, the following tests are executed:

• CAR Port Background Suppression Test

• CAR Port Spot/Void Threshold Test

• CAR Unit Interface Test

• Get CAR Unit POC Test

The last test executed is the "Validate Image Gate Configuration Test." If any of the testsfail, the Dual Image POC is terminated and the error condition is displayed. If the DualImage POC successfully completes, the ICS is taken out of test mode and returned to itsnormal idle mode of operation.

Introduction


POC Repair ProcedureThe POC tests display repair messages on the NDP PC monitor for you. The POC testsgenerally diagnose to the board level. In this case, the failure code is identified by theprimary error screen display. The board that is at fault is identified by accessing the"Additional Information" screen, which can be selected by pressing function key <F1>

from the primary error screen. The standard corrective action is to replace the indicatedboard and rerun the tests.

Note: When replacing a board, verify that the board was not loose in its socket before

removing it. While a board is removed from its socket, carefully examine the

socket for bent, corroded, or otherwise damaged contacts.

Some faults cannot be diagnosed to a single board. These faults may have been caused byone of two boards or by the interconnecting circuitry between them. The corrective actionin this case is to go to the manual procedures specified by the message on the screen andcarefully follow the procedure outlined there. Some messages may identify a board as the"primary suspect" and another board as the "secondary suspect."

Note: The manual procedures refer to these boards by identification number. A

typical board identification number could be AA02. The first 2 characters

identify the gate that the board resides in; the next two characters identify the

card slot. For example, AA02 is interpreted as card slot 2 in the AA gate.

Wiring information is interpreted as follows: AA02-J1-21 is J1, pin 21, of card

slot 7 in the AA gate.

Additional Diagnostic Features (Non-CAPI Configuration)The following subsections describe additional diagnostic system features available you.

Bypass POC Tests

The system POC can be partially bypassed to enable quicker access to either systemsoftware or MTR software following a reset condition. To perform this bypass, install ajumper at jumper position W1/W2-0 on the NDP030 CPU PCBA (slot AA17). Refer toSH 09.01.02, part number 2493 5900, for details. To bypass the POC test on the NDP Ready68030 CPU, install a jumper at jumper position W1/W4-0. Refer to SH 09.01.04, part number2493 4200, for details. With this jumper installed, the NDP CPU skips its kernel test, aswell as the AA gate tests. A POC TEST HANDLER routine is accessed instead. Thisroutine communicates with all the option modules that are present and sends them codesrequesting that they abort their POC self-tests and jump to their controlware operatingsystems.

In essence, a partial POC is run because many of the option modules complete a significantpart of their respective POC tests before processing the bypass command sent by the NDPCPU. Any error status relayed to the NDP CPU is ignored by the POC TEST HANDLER. Atthe conclusion of the POC bypass sequence, all option modules that did not respond orthat sent back failure codes are listed in a screen message by the POC TEST HANDLER.The message indicates that these option modules did not successfully complete their POCbypass sequence and may not be operational for system use.

Introduction


After the screen message is displayed, program control is passed to a debugger program, asindicated by the appearance on the monitor of the debugger prompt:

,� �-�."% $&$&$ /

In this prompt, X.X.X is the current version level of the debugger program.

Note: The prompt shown above, ,� �-�."% $&$&$ /, is the one displayed in the NDP

030 configuration. The prompt for the NDP Ready configuration is

,��-� ."% $&$. The debugger command examples that follow will show the NDP

030 configuration prompt, although the information also pertains to the NDP

Ready configuration.

NDP Debugger Program

The NDP debugger program resides on the NDP030 CPU PCBA EPROM. This program isprimarily used to aid engineering software debugging. It is case sensitive; to use it, activatethe Caps Lock key. You can use this debug aid to display program information when youencounter bus traps, address traps, or illegal instructions during normal system operations.You can access the debugger by three methods:

• Enabling POC bypass

• Selecting the debugger option from an AA gate POC test failure code screen

• Selecting the debugger menu option from the MTR MAIN MENU after the MTRs havebeen loaded

Some useful debugger commands are described below. The format of the command line is

,� �-�."% $&$&$ / 0�+**��/ 10��*��/2 130+��+��/2

In this format,

NDP 030BUG X.X.X > Is the prompt generated by the debugger

command Is the debugger command

parameters Are separated by spaces and can be of the form<expression> or <address>

options Are one or more options that may be selected

At the conclusion of each command line, press the <xmit> key to execute the command.

Introduction


Display/Set Register

,� �-�."% $&$&$ /&0��4��/ 10��+�/2

Individual registers can be displayed and/or altered by using this format: .<register>[<expression>]. Commands with the leading period and the registers displayed/altered bythese commands are

.A0 - .A7 address register

.D0 - .D7 data register

.PC program counter

.SR status register

.SS supervisor stack pointer

.US user stack pointer

Example

NDP 030BUG X.X.X >.PC.PC=00001010

Display program counter

NDP 030BUG X.X.X >.A7 1300 Set address register 7 to 1300

Block of Memory Test (BT)

,� �-�."% $&$&$ /.# 0�� / 0��5/

The BT command is a destructive test of a block of memory beginning at <address1>through <address2> (both at word boundaries = even addresses). If this test runs tocompletion without detecting errors, the memory tested will be set to all zeros.

If memory problems are found, a message is displayed indicating the address, the datastored, and the data read of the failing address.

This command may take several seconds to test large blocks of memory.

Examples

,� �-�."% $&$&$ /.# 6�� 677��89��: �,,��(��6�� 677�

,� �-�."% $&$&$ /.# 7;�� 7;��<��89��: �,,��(��7;�� 7;��<�7��:�, �# 7;�� !��#�(777� ��,(77��

Introduction


Display Formatted Registers (DF)

,� �-�."% $&$&$ /,7

The DF command is used to display the CPU registers and the disassembled mnemonics ofthe instruction pointed to by the program counter. The trace display is displayed wheneverthe debugger gains control of the program execution.

Note: Any single register can be displayed with the .A0 - .A7, .D0 - .D7, etc.,

commands.

Example

,� �-�."% $&$&$ /,7��(�� (7777(#�;$=>� "�(��6.77� ��(�� -��,�(��,�,� , (��, , ,5(��,5, ,-(��,-,-,-,<(,<,<,<,< ,6(��,6 ,?(�� ,;(��,;��(�� (�� 5(��5�5 �-(��-�<(��< �6(��6666 �?(��? �;(�� -�� @� �� &. A�B,�

Execute Program (G)

,� �-�."% $&$&$ /% 10��/2

The G (or GO) command causes the target program to execute (free run in real time). TheG sequence starts by tracing one instruction, setting any breakpoints, and then freerunning.

Command Format Description

NDP 030BUG X.X.X >G Begin or resume execution at theaddress in the program counter.

NDP 030BUG X.X.X >G <address> Set program counter = address andbegin execution at that address.

Example

,� �-�."% $&$&$ /% 6��89��: �,,��(��6��

Introduction


Memory Display/Disassembly (MD)

�,1�2 0�� / 10�+)��/2 13,�2

The MD command is used to display a section of memory beginning at <address1> anddisplaying the number of bytes given as <count>. If <count> is not specified, the default is16 ($10 or hexadecimal 10) bytes. The optional form MDS gives a display of 16 lines of 16bytes each. The display is in hex and in ASCII characters.

Once the MD command is entered, it continues with the next 16 lines of output each time acarriage return (CR) is entered. Any other command exits MD and enters the newcommand.

The ;DI option is supported. This option causes one-line disassembly to occur on thenumber of bytes specified. The default count for ;DI is one instruction.

Examples

,� �-�."% $&$&$ /�, 5��- 55��- << <6 <? <; �� ,�7%&&5� - �� &&&&&&

,� �-�."% $&$&$ /�, C65D �3,�C65D <D.D�� <�? ��>��&! ,�BE�<�?C65� <�7D�<�? ��>�&! ��BE�<�?C6-5 <D�;777� ��>��&: ,��,;��?B�F�;GC6-? <77D�C6� :�� EC6�B�;

Memory Modify/Disassembly/Assembly (M)

,� �-�."% $&$&$ /�1�2 0��/ 13+��+��/2

The M (or MM) <address> command is used to display memory and enter the subcommandmode (defaults to byte size).

The M command causes the debugger to display the address and the data at that location.The size option (default one byte) controls the number of bytes displayed for each address.The option ;W sets the size option for a word (that is, two bytes). The option ;L sets thesize option for long word (that is, four bytes).

Once entered, the M command has several submodes of operation. The subcommands arein this format:

[<data>] (CR) Update location and sequence forward.

[<data>]^(CR) Update location and sequence backward.

[<data>]=(CR) Update location and reopen same location.

[<data>].(CR) Update location and terminate.

Introduction


The following options are supported:

;W Set size to word (2 bytes).

;L Set size to long word (4 bytes).

;O Set size to byte; access only odd address bytes.

;V Set size to byte; access only even address bytes.

;N Do not verify that data is stored correctly (that is, do not read data stored).This option is useful for writing data to some hardware without reading fromthat hardware.

;DI Perform a one-line disassembly, and then perform a one-line assembly if anew instruction is input. This option supports the (CR) and the .(CR)submodes of operation. The user must enter a space at the beginning ofeach instruction line to be assembled in order to get past the instructionlabel field. If an error occurs during assembly of an instruction, X? isdisplayed beneath the field of the input line that is suspected to be in error.

Example

,� �-�."% $&$&$ /�� <��3! 3<�� H 666<��5 H -<&

Memory Set (MS)

,� �-�."% $&$&$ /�� 0��/ ��

The MS command alters memory by setting data into the address specified.

Command Format Description

NDP 030BUG X.X.X >MS 2000 ’ABC’ Set memory to ASCII string.

NDP 030BUG X.X.X >MS 2003 4445 Set memory to hex data.

Examples

,� �-�."% $&$&$ /�� 5�� I�.�I

,� �-�."% $&$&$ /�, 5��5�� < <5 <- ; <� ; <� ; <� ; <� ; <� ; <� ; �.�JJJ

Introduction


Loading an Application from the Debugger Program

Either the application program or the MTRs can be loaded by entering the followingcommands at the debugger prompt:

,� �-�."% $&$&$ /&�� 5;��

,� �-�."% $&$&$ /% ��,�

The first command disables interrupts to the NDP CPU. The second command sets theprogram counter to address "10000DA" and begins program execution there.

The jump table address of the BOOTLOAD routine is "10000DA". Executing a GOcommand at this address invokes this EPROM-resident routine. In the NDP 030configuration, the BOOTLOAD routine automatically loads the application file that theNDP PC has defined as its download file. The default download file is the Sorter ControlProgram. This can be changed on the NDP PC so that the MTRs are the downloaded file.Details on enabling the MTR file download are covered in the MTR portion of this section.In the NDP Ready configuration, the BOOTLOAD routine downloads the contents of thedisk currently in the 5 1/4 inch floppy disk drive.

Enabling the MULTIBUS Address Line Toggle Utility

If an error occurs in the MULTIBUS loop test, check the integrity of the MULTIBUSaddress lines. A utility is available that alternately reads MULTIBUS addresses $3FF5555and $3FFAAAA. This enables you to monitor address lines 0 to 15 anywhere on the AAgate backplane and verify that the lines toggle periodically. This utility can be accessed byentering the following commands at the debugger prompt:

,� �-�."% $&$&$ /&�� 5;��

,� �-�."% $&$&$ /% ��

The first command disables interrupts to the NDP CPU. The second command sets theprogram counter to address "10000AA" and begins program execution there.

The jump table address of the MULTIBUS address line toggle routine is "10000AA."Executing a GO command at this address invokes this EPROM resident routine, whichbegins toggling the MULTIBUS address lines. The toggle pattern is shown here:

#+44��+� � 6 � < � - � 5 � � � �C �D �; �? �6 �< �- �5 � ��

� � � � � � � � 5 � � � � � � � � - � � � � � � � � < � � � � � � � � & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & &

A keyboard entry enables you to exit the utility and return to the debugger program.

Introduction


NDP CPU PWBA Hardware Indicators

The NDP CPU PWBA has 12 light-emitting diodes (LEDs) that can provide you with usefulstatus information during the system POC test. Eight of these LEDs are softwarecontrolled. The other four are hardware controlled. With the NDP CPU PWBA installed inthe AA gate, the top four LEDs are the hardware-controlled LEDs. Table 1–4 shows theseLEDs, read from top to bottom.

Table 1–4. Hardware-Controlled LEDs

LED Label Description

NDP 030 CPU PCBA:

RST 68030 CPU RESET. LED is lit while the 68030 reset signal is active.

STA 68030 CPU STATUS. LED is solidly lit on a CPU HALT condition. Flashes formany situations.

SCSI 53C710 BUS ACTIVE. LED is lit while SCSI chip has control of the CPU bus.

LCA LCA DONE. LED is lit while the onboard programmable LCA device loads,which is every reset.

NDP Ready 68030 CPU PCBA:

RST 68030 CPU RESET. LED is lit while the 68030 reset signal is active.

STA 68030 CPU STATUS. LED is solidly lit on a CPU HALT condition. Flashes formany situations

DONEA Xlinks configuration error. DMA logic cell array.

DONEB Xlinks configuration error. Miscellaneous logic cell array.

The remaining LEDs beneath the hardware status LEDs are the software-controlled MTRLEDs. The POC test programs running on the NDP CPU PWBA can activate these LEDs bywriting to address $1FFFFB1. The standard convention is to write a unique LED pattern tothis register at the beginning of each POC test. This enables you to determine the last testexecuted when the screen status is not provided (for example, kernel test failures or aprocessor HALT condition). Table 1–5 lists the POC test LED codes. A similar table, withmanual procedure line numbers added, is located in Section 2.

Introduction


Notes:

• Read the table as follows: If the last pattern on the LEDs was $0C, then the last test

that was successfully run was the Flash EPROM checksum test. For additional help

in using the LEDs for diagnosis, see the LED Fault Code Conditions table in Section

2 and the CCC table in Section 13.

• In Table 1–5, "1" indicates that the LED is on.

• The Character Recognition POC is for MICR readers.

• The test LED codes apply to the NDP 030 CPU PCBA and the NDP Ready 68030 CPU

PCBA.

Introduction


Table 1–5. POC Test Reference Table

TestLED MSBBottom

LED LSBTop Hex Pattern

7 6 5 4 3 2 1 0

Power-up 1 1 1 1 1 1 1 1 FF

POC bypass 1 1 1 1 1 1 1 1 FF

CPU test 0 0 0 0 0 0 0 0 01

RAM bus trap 0 0 0 0 0 0 1 0 02

RAM configuration test 0 0 0 0 0 0 1 1 03

RAM W/R test 0 0 0 0 0 1 0 0 04

EPROM check sum test 0 0 0 0 0 1 0 1 05

RAM address line test 0 0 0 0 0 1 1 0 06

RAM parity test 0 0 0 0 0 1 1 1 07

Privilege exception test 0 0 0 0 1 0 0 0 08

Dead bus timer test 0 0 0 0 1 0 0 1 09

PTM test 0 0 0 0 1 0 1 0 0A

SCSI initialization 0 0 0 0 1 0 1 1 0B

Flash EPROM checksumtest

0 0 0 0 1 1 0 0 0C

MULTIBUS loop test 0 0 0 1 0 0 0 0 10

Pblink test 0 0 0 1 0 0 0 1 11

Configuration test 0 0 0 1 0 0 1 0 12

Character RecognitionTest

0 0 0 1 0 0 1 1 13

I-test 0 0 0 1 0 1 0 0 14

A/B test 0 0 0 1 0 1 0 1 15

Reader/Config test 0 0 0 1 0 1 1 0 16

Transport status test 0 0 0 1 0 1 1 1 17

PEP/Stamp status 0 0 1 0 0 0 0 0 20

Microfilmer status 0 0 1 1 0 0 0 0 30

MJE status 0 1 0 0 0 0 0 0 40

HSOCR status 0 1 0 1 0 0 0 0 50

NIE status 0 1 1 0 0 0 0 0 60

Image status 0 1 1 1 0 0 0 0 70

Introduction


Table 1–5. POC Test Reference Table

TestLED MSBBottom

LED LSBTop Hex Pattern

7 6 5 4 3 2 1 0

Address exception 1 1 1 1 0 0 0 1 F1

Bus exception 1 1 1 1 0 0 1 0 F2

Unexpected exception 1 1 1 1 0 0 1 1 F3

Instruction exception 1 1 1 1 0 1 0 0 F4

Unexpected interrupt 1 1 1 1 0 1 0 1 F5

Unexpected privilegeinstruction

1 1 1 1 0 1 1 0 F6

Spurious interrupt 1 1 1 1 0 1 1 1 F7

Transport interruptexception

1 1 1 1 1 0 0 0 F8

Introduction


Maintenance Test Routines (Non-CAPI)This subsection describes the Maintenance Test Routines (MTRs) for non-CAPI systems.Both NDP 030 and NDP Ready configurations are described.

NDP 030 ConfigurationsThe rest of the diagnostic system tests are the MTRs. These routines are contained in a filecalled INITM030.LO, which is resident on the NDP PC hard disk. To access these testroutines, INITM030.LO must be downloaded from the NDP PC hard disk to the NDP030CPU PWBAs RAM. This can be accomplished by enabling the CSE mode on the NDP PC,changing the default sorter boot program to the MTR file (INITM030.LO), and accessing theBOOTLOAD routine on the NDP030 CPU PWBA. A more detailed description of thisprocedure is given next:

1. Enable CSE mode on the NDP PC by bringing up the NDP Unit Manager Logical UnitMain Dialog box. (The Unit Manager Logical Unit is started automatically when theNDP comes up, so you don’t have to “start” the program.) You can switch to the UnitManager by either of these two methods:

• Press Tab while holding down the Alt key until the Unit Manager Logical Unitcomes up.

• Switch to it directly by bringing up the Task List by pressing the Esc key whileholding the Ctrl key and then selecting the Unit Manager Logical Unit and pressingthe Enter key.

2. Click on the Enabled radio button (or press Alt-E) in the Privileged CSE

Functionality for this unit box.

A dialog box is displayed that asks for the CSE password (which changes monthly) andis the same as the current InfoAdvisor password.

3. Enter the password.

CSE mode is enabled on the NDP PC.

4. Change the default sorter boot program to load:

a. Press the Alt-Tab keys to switch to the NDP Accessory Manager, which is runningthe Terminal Emulator for the sorter.

b. Press the F12 key to activate the File Selection Dialog box.

c. Switch to the Boot tab and select M&D (Maintenance & Diagnostics).

This configures the NDP PC so that the MTR file, INITM030.LO, will be downloadthe next time the BOOTLOAD routine on the NDP030 CPU PWBA is executed.

d. Choose OK.

You are returned to the Terminal Emulator.

Introduction


5. Use one of the following methods to access the NDP030 CPU PWBA BOOTLOADroutine:

• Reset the sorter. If the kernel tests and the AA gate tests of the system POC testsuccessfully complete, the BOOTLOAD routine is automatically executed. Thisresults in the new default sorter boot program being downloaded.

• Reset the sorter. If one of the AA gate tests in the system POC test fails, theprimary failure code screen display provides you with an option to Load MTR

software. When you select function key F3 from this display, the BOOTLOADroutine is called. If the NDP PC has had its default sorter boot program changed tothe MTR, INITM030.LO file, the MTRs are downloaded. If this change has not beenmade, the current default boot file is downloaded.

• Access the debugger program in either of these ways:

− Install the POC bypass jumper and reset the sorter.

− Select function key F4 Debugger from the primary failure code screen if anAA gate POC test failure occurs.

At the debugger prompt enter the following commands:

,� �-�."% $&$&$ /&�� 5;��

,� �-�."% $&$&$ /% ��,�

This executes the BOOTLOAD routine and loads the default boot file.

NDP Ready ConfigurationsThe MTRs for the NDP Ready configuration reside on a file called INITM030.LO, which isresident on the NDP Ready MTR floppy disk. To access these test routines, INITM030.LOmust be downloaded from the NDP PC’s floppy disk drive to the NDP Ready 68030 CPUPCBAs RAM. This can be accomplished by inserting the NDP Ready MTR disk into the5 1/4 inch floppy disk drive and accessing the BOOTLOAD routine on the NDP Ready 68030CPU PCBA. Use one of the following methods to access the NDP Ready 68030 CPU PCBABOOTLOAD routine:

• Reset the sorter. If the kernel tests and the AA gate tests of the system POC testsuccessfully complete, the BOOTLOAD routine is automatically executed.

• Reset the sorter. If one of the AA gate tests in the system POC test fails the primaryfailure code screen display provides you with an option to LOAD MTR SOFTWARE.When you select function key F3 from this display, the BOOTLOAD routine is called.

• Access the debugger program in either of these ways:

− Install the POC bypass jumper and reset the sorter.

− Select function key F4 DEBUGGER from the primary failure code screen if an AAgate POC test failure occurs.

• At the debugger prompt enter the following commands:

/&�� 5;��

/% ��,�

Introduction


This executes the BOOTLOAD routine and downloads the contents of the floppy disk.

Description of Disk-Based TestsFollowing the downloading of the MTR file, INITM030.LO, a menu of available tests ispresented on the PC screen, as shown in Figure 1–21.

MAINTENANCE TEST ROUTINE MAIN MENU

Enter the desired selection then press <XMIT>

1 = TRANSPORT TESTS 2 = NON-IMPACT ENDORSER TESTS 3 = MICROFILMER TESTS 4 = IMPACT ENDORSER TEST 5 = DISPLAY SCANS UTILITY 6 = GATE/LIGHT EXERCISER 7 = E13B MICR READER TESTS 8 = CMC7 MICR READER TESTS 9 = IMAGING MODULE TESTS 10 = HSOCR READER TESTS 11 = COURTESY AMOUNT READER TESTS 12 = DEBUGGER

Figure 1–21. Maintenance Test Routine Main Menu

All menu options except DEBUGGER access diagnostic routines that exercise functionaltest modules within the sorter. When you make a selection from the main menu, asubmenu is displayed for the test module that you chose. You then choose your desireddiagnostic routine from the submenu.

Introduction


After you choose your diagnostic routine from the submenu, some of the test modulesdisplay a function key menu, as shown in Figure 1–22.

Select one of the following functions:

<F8> AUTO SEQ. <F9> LOOP TEST <F10> EXECUTE ONCE <SPCFY> MENU

Figure 1–22. Function Key Test Mode Selection Menu

AUTO SEQUENCE

When you select AUTO SEQ., upon completion of the diagnostic routine that you chosefrom the test module submenu, the next test from the submenu is automatically executed.This continues until the last diagnostic routine listed on the submenu is executed. Whenthe routine is completed, the test module submenu is displayed.

LOOP TEST

When you select LOOP TEST, the diagnostic routine that you chose from the test modulesubmenu is repeatedly executed. At the conclusion of the routine, you are prompted toeither press the F1 soft function key to return to the main menu or the F2 soft function keyto return to the test module submenu. You then have 5 seconds to decide to exit the loop.If you do not enter F1 or F2 within 5 seconds, the diagnostic routine is rerun. LOOP TESTmode does not halt on error conditions. The error code is displayed for 5 seconds, alongwith the prompt from which you choose F1 or F2 to exit the loop.

EXECUTE ONCE

When you select EXECUTE ONCE, the diagnostic routine that you chose from the testmodule submenu is executed one time only.

The following subsections provide information about each of the tests shown on thescreen in Figure 1-2 and any subsequent menus.

Introduction


Transport Tests

When you select option 1 from the Maintenance Test Routine Main Menu (Figure 1–23), themenu shown in Figure 1–23 is displayed.

TRANSPORT TESTS MENU


1 = Sorter configuration test 2 = Beam of light bias test 3 = Pocket light/jam circuitry test 4 = Document flow test 5 = Reject window/beam of light timing test 6 = Feed error stress deck test 99 = Return to MTR main menu

Figure 1–23. Basic Tests Menu

The six subtests within the basic tests check for constant status and exact results to thediagnostic stimuli. Be sure that you follow exactly the directions for the running of thetests that appear on the screen, or failure codes may be generated for failures that do notexist.

The failure codes that appear on the screen when a test failure is detected lead to a failurediagnostic procedure that you must follow exactly to isolate the failure.

In some cases a list of cards is called out for probable cause of the failure. This is usuallydone with the source card of the failed signal first and the signal’s fanout cards as asecondary suspect.

Introduction


Table 1–6 describes the functions of the Transport Tests.

Table 1–6. Functions of the Subtests from the Transport Tests Menu

Subtest Function

Sorterconfigurationtest

Checks the configuration of system options and checks for power-onconstants before the Start/Stop bar is pressed. Both hoppers must beempty and all interlocks closed.

Beam of lightbias test

Checks for proper status after a Start/Stop bar is pressed with all interlocksclosed and both hoppers empty. If the status is proper, the test continuesby forcing bias levels at all BOLs and checking appropriate status. Next, allBOLs are forced ON for Areas A and B, and status for each location in bothareas is checked.

Pocket light/jamcircuitry test

Checks first for the last pocket. It then checks Motor Up status and Ready.After the motors are ready, the test checks various statuses. Next itchecks out the Pocket Light command and communication to the 4-pocketbase plate assemblies by lighting pocket lights R, 0, 1, 2, 4, 8, and 16 inrapid succession and then lighting all lights in order at 1/2 second intervals.

Document flowtest

Checks for Ready and the ability to feed items from both feeders in a singleitem mode. Too Late to Pocket (TLTP), document data interrupts, pocketselection, gate operations, and proper document tracking timing arechecked.

Rejectwindow/beam oflight timing test

Consists of the two parts of the Transport Margin Test. Part 1 verifies theReject Window Override Control in areas 1 and 1B. This test ensures thatall documents following the track error are sent to the reject pocketregardless of assignment. The statuses as a result of the track error arealso verified (missort, missort location, feed error, MTWE location, etc.).Part 2 verifies that the speed between BOLs is within tolerance. There are20 samples per BOL pair, and times out of tolerance are displayed on thecathode ray tube (CRT).

Feed errorstress deck test

Runs the Feed Error Test Deck (see Spec. 3125 6332) on the sorter. Arunning count of double documents, overlength documents, underspaceddocuments, mechanical window timing errors, almost feed errors, and blackbands is kept. Any error counts that do not match the test deck aredisplayed on the NDP PC monitor.

Introduction


Multi-Jet Endorser Tests

There are two nonimpact endorser systems supported by the NDP MTRs when running inthe non-CAPI configuration. Both systems cannot be present at the same time. When theuser selects "Nonimpact Endorser Tests" from the Maintenance Test Routines Main Menu,the sorter configuration is checked to determine which endorsement module is present.Based on this information the appropriate endorser system submenu is displayed. Adescription of each systems MTRs follows.

The MJE Main Menu offers three options, as shown in Figure 1–24.

MJE MAIN MENU

SELECT ONE OF THE FOLLOWING, THEN PRESS <XMIT

1 = RUN TIME COMMANDS 2 = POC COMMANDS 3 = ENDED DIAGNOSTIC COMMANDS 99 = RETURN TO MAIN MENU

Figure 1–24. MJE Main Menu

Select 99 to return to the Main Menu, or select one of the following options:

Option Function

1 Perform MJE run-time tests and operations. Refer to Figure 1–25 for the MJE RunTime Commands Menu.

2 Perform MJE POC tests. Refer to Figure 1–26 for the MJE POC Commands Menu.

3 Perform MJE extended diagnostic tests and operations. Refer to Figure 1–27 for theMJE Extended Diagnostics Commands Menu.

Note: The DP 1825 Tests and Adjustments (T&As), the Special Engineering

Instructions (SEIs), and the MJE Manual Procedures (found in Section 20)

direct you to the appropriate menu and commands.

Introduction


MJE Run Time Commands

Figure 1–25 shows the MJE Run Time Commands and Options Menus.

MJE RUN TIME COMMANDS

SELECT ONE OF THE FOLLOWING, THEN PRESS <XMIT 1 SEND STATUS (81) 2 SEND ERRORS/WARNINGS (82) 3 BAR UP TO STATE XX (83) 4 BAR DOWN (84) 5 BAR UP - EYID CLOSED (85) 6 BAR CLEAN (86) 7 BAR EVACUATE (87) 8 ST BR STATE TABLE XX (88) 9 SET PHASE/VOLTAGE XX/YY (89) 10 READ PHASE/VOLTAGE (8A) 11 BAR TO LOW CROSS FLUSH (8C) 12 BAR TO SUPER TIM (8D) 13 BAR TO HIGH CROSS FLUSH (8E) 14 BAR TO READY TO PRINT (8F)

MENU OPTIONS

15 POC COMMAND MENU 16 ENDED DIAGNOSTIC COMMAND MENU 17 RETURN TO MJE MAIN MENU 99 RETURN TO MAIN MENU

Figure 1–25. MJE Run Time Commands Menu

Introduction


MJE POC Commands

Figure 1–26 shows the MJE POC Commands and Options Menus.

MJE POC COMMANDS


1 = RE-SYNC HO TEST (A0) 2 = TEST INTERRUPT ENABLE PORT (A1) 3 = TEST AC RAY DRIVERS (A2) 4 = TEST SOLENOIDS AND CATCHER HEATER DRIVERS (A3) 5 = TEST PRINT MODE CONTROL (A4) 6 = ERCISE 7-SEGMENT DISPLAY (A7) 7 = READ AND REPORT D SWITCH SETTINGS (A8) 8 = TEST SOLENOID MOTION (A9) 9 = TEST INK PUMP/TRANSDUCER (AA) 10 = EMERGENCY STOP INK SYSTEM TEST (AB) 11 = TEST POSITIVE AIR SYSTEM (AC) 12 = TEST VACUUM SYSTEM/STEPPER MOTOR (AD) 13 = TEST UMBILICAL (AE)

MENU OPTIONS

14 = RUN TIME COMMAND MENU 15 = ENDED DIAGNOSTIC COMMAND MENU 16 = RETURN TO MJE MAIN MENU 99 = RETURN TO MAIN MENU

Figure 1–26. MJE POC Commands Menu

Introduction


MJE Extended Diagnostics Commands

Figure 1–27 shows the MJE Extended Diagnostics Commands and Options Menus.

MJE EXTENDED DIAGNOSTIC COMMANDS


1 = RESET (80) 2 = RUN DIAGNOSTIC ROUTINE XX (B4 XX) 3 = STREAKER TEST 4 = MULTLE RE-SYNC HO TEST (A0) 5 = LED SEQUENCE TEST (A4, AE, AC) 6 = COLUMN PRINT

MENU OPTIONS

7 = RUN TIME COMMAND MENU 8 = POC COMMAND MENU 9 = RETURN TO MJE MAIN MENU 99 = RETURN TO MAIN MENU

Figure 1–27. MJE Extended Diagnostic Commands Menu

Introduction



The LCMJE Main Menu offers eight options, as shown in Figure 1–28.

LCMJE MODULE MAIN MENU

SELECT ONE OF THE FOLLOWING FOLLOWED BY THE <XMIT KEY

1 = PRINT HEAD PRESENT TEST 2 = READ DOT COUNT UTILITY 3 = RESET DOT AND DOCUMENT COUNT UTILITY 4 = NON-VOLATILE RAM TEST 5 = HEAD PURGE TEST 6 = PRINT LOGIC TEST 7 = DUAL PORT RAM TEST 8 = FIRMWARE VERSION LEVEL UTILITY 99 = RETURN TO MAIN MENU

Figure 1–28. LCMJE Module Main Menu


Print Head Present Test: This test detects if the print head is present. Theuser is prompted at the beginning of the test tochoose which module to check, the front MJE orthe rear MJE.

Read Dot Count Utility: This utility returns the most significant 8 bits ofthe 322 bit print fire dot counter. The user isprompted at the beginning of the utility to choosewhich module to check, the front MJE or the rearMJE. The information returned lets the user knowthe percentage of ink left in the ink cartridge.

Reset Dot and Document Count Utility: This utility resets the dot and document counter.The user is prompted at the beginning of theutility to choose which module to check, the frontMJE or the rear MJE.

Non-volatile RAM Test: The test verifies the write/read functionality of thenon-volatile RAM.

Head Purge Test: This test verifies the operation of the print headpurge circuitry. During the test, ink is emittedfrom the head. The user is prompted at thebeginning of the test to choose which module tocheck, the front MJE or the rear MJE.

Introduction


Print Logic Test: This test verifies the operation of the print logiccircuitry by sending two blank columns ofcharacter data to the print driver board. The useris prompted at the beginning of the test to choosewhich module to check, the front MJE or the rearMJE.

Dual Port RAM Test: This test checks the write/read operation of theMJE’s dual port RAM.

Firmware Version Level Utility: This utility displays the version level of the MJEInterface PCBA’s resident firmware. It alsodisplays the date that the code was compiled on.

Introduction


Microfilmer Tests

The microfilm MTR for the Unisys microfilmer is divided into many subroutines thatexercise a specific area/module of the microfilm.

When you select option 3 on the Maintenance Test Routine Main Menu (Figure 1-2), themenu shown in Figure 1–29 is displayed.

MICROFILM MTR MENU

SELECT ONE OF THE FOLLOWING BY ENTERING A DIGIT <XMIT>

1 = BASIC MICROFILM TESTS 2 = FILM TRANSPORT 3 = LAMP/ALMS 4 = ICM TEST 5 = GALVO TESTS 6 = ID DISPLAY 7 = HUMAN READABLE HEADERS 8 = CAPPING SHUTTER 9 = HARDWARE PARAMETER ADJUSTMENT ROUTINES 99 = RETURN TO MAIN MENU

Figure 1–29. Microfilm MTR Menu

The following subsections show the menus for each routine and briefly describe each test.

Note: It is not necessary to wait for the imaging module to complete if you select

option 1, 2, or 4.

Introduction


Basic Microfilm Tests

When you select option 1 from the Microfilm MTR Menu (Figure 1–29), the menu shown inFigure 1–30 is displayed.

BASIC MICROFILM TESTS MENU

SELECT ONE OF THE FOLLOWING BY ENTERING A DIGIT <XMIT

1 = SYSTEM RUN 2 = CHK FOR "SYSTEM READY" 3 = BASIC FUNIONS TEST 4 = MICROFILM SCAN TEST 5 = HEIGHT BOL 6 = DATA COMM TEST 7 = QUIT TO MICROFILM MTR MENU

Figure 1–30. Basic Microfilm Tests Menu

Table 1–7 describes the functions of the subtests from the Basic Microfilm Tests Menu.

Table 1–7. Functions of the Subtests from the Basic Microfilm Tests Menu

Subtest Function

SYSTEMRUN

This routine does not define faults using fault codes. This is a good place to start ifthe problem cannot be defined or if a customer is complaining of run-time problems.This subtest uses the same firmware to film documents as used in a normal run, butit films a small number of documents (approximately 1,000). It identifies run-timeerrors with appropriate messages that point to an area in the CCC table. You cantake the necessary diagnostic steps.

CHK FOR"SYSTEMREADY"

This routine is much the same as the SYSTEM RUN, only it looks for general NotReady conditions without document flow. You can use it if you are trying to correct aNot Ready condition. Only one Not Ready condition is displayed at a time, and youcan exit or loop to clear the condition. Again, no fault codes are displayed. You canuse this routine as an initial entry to find a problem.

BASICFUNCTIONSTEST

This routine takes you through a few basic steps of operation of thesorter/microfilmer. Microfilm on/off is verified, lamps are checked for on/off only,motors are brought up, and microfilm is checked for signal. Either a fault code isdisplayed, or you are directed to another area of the MTR.

MICROFILMSCAN TEST

This routine enables you to place a document in the optical gate and film itrepeatedly. In this way you can check for vibrations in the galvo assembly.

HEIGHT BOL This routine diagnoses problems in the BOLs, determining if the fault lies with theBOL or with the control circuitry.

Introduction


Table 1–7. Functions of the Subtests from the Basic Microfilm Tests Menu

Subtest Function

DATACOMM TEST

Choosing this option executes DATACOMM LOOP TEST on the MIIB and Controllercards. Both cards have a loop test resident on the card. The MIIB is softwarecontrolled, whereas the controller test is started by pressing a button on theController card. Both are executed without the cable connected to isolate problemsin this area.

Film Transport


MICROFILM FILM TRANSPORT TESTS

SELECT ONE OF THE FOLLOWING FOLLOWED BY "XMIT":

1 = CAPSTAN MOTOR TEST 2 = LOOP ARM SENSOR TEST 3 = REEL MOTOR TEST 4 = IDLER ENCODER TEST 5 = SUPPLY ENCODER TEST 6 = RETURN TO MICROFILM MENU 99 = RETURN TO MAIN MENU

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Figure 1–31. Microfilm Film Transport Tests Menu

Introduction


Table 1–8 describes the functions of the subtests from the Microfilm Film Transport TestsMenu.

Table 1–8. Functions of the Subtests from the Microfilm Film Transport TestsMenu

Subtest Function

CAPSTAN MOTOR TEST Can execute seven different moves, which can be looped orexecuted one at a time. This test executes with or without film.

LOOP ARM SENSORTEST

Tests the loop arm sensors by having you press the take-up andsupply loop arms to ensure that each of the three sensors on botharms is activated. This test executes without film.

RE MOTOR TEST Verifies that the reel motors operate correctly. This test executeswithout film.

IDLER ENCODER TEST Tests the idler encoder by having you manually turn and check theidler encoder count. This test executes without film.

SUPPLY ENCODER TEST Enables the supply encoder motor and verifies the supply encodercount. The test loops until you stop it. (An exception is a registerfailure. This will halt the test.)

Lamps/ALMs

When you select option 3 from the Microfilm MTR Menu (Figure 1–29), you enable theLamps/ALMs test. It verifies that the present lamp values are in range. It displays thevalues so that they can be verified as the desired values. Each lamp is turned onindividually and verified. Then the ALM values are completed and compared against theNVRAM values to ensure that they are within range.

ICM Test

When you select option 4 from the Microfilm MTR Menu (Figure 1–29), you enable the ICMtest. ICM 1 and ICM 2 are individually turned on and checked visually as well aselectrically.

Galvo Tests

When you select option 5 from the Microfilm MTR Menu (Figure 1–29), you enable theGalvo test. The galvo routines have two parts:

Galvo Homeroutine

Finds the actual galvo home position and checks that it is in range ($20-60).

Galvo Scanroutine

Does a continuous loop of two scans: short (5 inch), followed by long (9 inch).The test is designed so that two scans fit on an oscilloscope trace. Errorsdetected are reported only after the test is stopped.

Introduction


ID Display

When you select option 5 from the Microfilm MTR Menu (Figure 1–29), you enable the IDDisplay test. This routine has seven parts, some of which share functions:

Fixed ID pattern andCheck fixed IDpattern

Flow documents using a fixed pattern. Eight documents are fed for each of12 patterns; 20 documents for a 13th pattern. Selection 1 flows thedocuments; selection 2 verifies that the IDs were correct.

Selectable ID patternand Checkselectable ID patternresults

Allow you to choose the ID pattern and flow as many documents as desired.

Turn on ID displaywith 0s

Opens the capping shutter and displays zeros on the ID display.

Turn on ID displaywith blocks

Opens the capping shutter and displays blocks on the ID display.

Exit this test Enables you to exit the test.

Human Readable Headers

When you select option 7 from the Microfilm MTR Menu (Figure 1–29), you enable theHuman Readable Headers test.

Three characters are displayed that light up all dots and can be seen with film not loaded.The second part of this test flashes the complete character set on the header display. Youmust visually confirm that the character set is being displayed correctly.

Capping Shutter

When you select option 8 from the Microfilm MTR Menu (Figure 1–29), you enable theCapping Shutter test. The capping shutter is opened and shut and verified to be in thecorrect position using the sensors and a visual check.

Introduction


Hardware Parameter Adjustment Routines

In any parameter routine that flows documents, the human readable header and (in mostcases) the ID number are used to indicate what test value is being filmed. The humanreadable header also identifies the specific test that is being executed so that film can bereferred to later and the module easily identified. The film is developed, and theappropriate measurements are taken. The list of settings are displayed whenever youchoose to change any setting.


MICROFILM HARDWARE PARAMETER ADJUSTMENT ROUTINES


1 = LAMP INTENSITY/DENSITY 2 = ALM ADJUSTMENT 3 = LED/TED 4 = ID DISPLAY INTENSITY 5 = GALVO ADJUSTMENT 6 = MODIFY NON-VOLATILE RAM VALUES 7 = RETURN TO MICROFILM MENU 99 = RETURN TO MAIN MENU

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Figure 1–32. Hardware Parameter Adjustment Routines Menu

Table 1–9 describes the functions of the options on the Hardware Parameter AdjustmentRoutines Menu.

On the NDP 1000 Document Processor, before adjusting the parameters, you are promptedto select the film speed to be used. After you select either medium- or high-speed film, theMicrofilmer Hardware Parameters Adjustment Routine menu is displayed.

See Section 18 for more detailed instructions on running parameter routines.

Introduction


Table 1–9. Functions of the Hardware Parameter Adjustment Routines Menu

Option Function

LAMPINTENSITY/DENSITY

Flows documents with varied lamp settings ($80-$E8 varied by $08).Each setting flows two documents and then goes into the next setting.The human readable header and UL display are used to identify the lampsetting on film. The ALM bypass jumper is in place.

ALM ADJUSTMENT Is executed automatically after the LAMP routines or when chosen fromthe menu. The lamp is enabled at the present NVRAM lamp setting, andthe front and rear A/D ALM values are read and put into NVRAM. Nodocuments are fed, and you do not need to intervene.

LED/TED Adjusts both LED and TED values at the same time. Twenty documentsper setting are flowed. After document flow and film processing, thedesired values are entered. Both values are entered at the same time.Values are listed in milliseconds.

ID DISPLAYINTENSITY

Functions like the Lamp Intensity test. After document flow and filmprocessing, the desired ID density value is entered. Settings are done inmilliseconds and are entered as such. Each setting flows fourdocuments. The difference in this routine is that the ID does not matchthe human readable header. The first two documents have an ID of000xxx00. The second two documents have an ID of 111xxx11. Thisaids in distinguishing between intensities.

GALVO ADJUSTMENT Has two parts, either of which you can choose individually. The first partof the routine flows documents with the Galvo Home ByPass jumper inplace. The Galvo home is set in a variety of settings, and 10 documentsare flowed for each setting. The second part of the routine enablessetting the Galvo Home sensor. After this is complete, the chosen homeis verified against the actual home position. If the actual home is morethan 4 counts off the chosen home, a message is given to redo either 1or 2. For related information, see T&As 3304 4439 and 3304 4447 inthe DP 1000/DP 1800 Cinemode Microfilmer Field Test and ReferenceDocument.

MODIFY NON-VOLATILE RAMVALUES

Enables you to display the current Hardware Parameter values, modify thevalues stored in nonvolatile RAM, and store the modified values intononvolatile RAM.

Introduction


Impact Endorser Test

When you select option 4 from the Maintenance Test Routine Main Menu (Figure 1–21) themenu shown in Figure 1–33 is displayed.

PEP/STAMP MTR MAIN MENU

SELECT ONE OF THE FOLLOWING FUNCTIONS<XMIT>

1=ENDORSEMENT TESTS 2=STAMP HOME SENSOR TEST 3=STAMP MOTOR PHASE TEST 4=HOLE DETECT TEST 5=PRINT NEEDLE TEST 99=RETURN TO MAIN MENU

DO NOT RUN THESE TESTS IN AUTO SEQUENCE. STAMP MOTOR PHASE TEST SHOULD ONLY BE EXECUTED WHEN INSTRUCTED VIA MANUAL PROC.

Figure 1–33. PEP/Stamp Endorser Tests Menu

The PEP/stamp tests consist of five subtests to exercise the endorser functions. Wheneverpossible, fault codes and suspect modules are displayed on the screen.

Introduction


Table 1–10 describes the functions of the PEP/stamp endorser tests. Tests can be executedin singular mode or loop mode. None of the tests should be executed in auto sequencemode.

Table 1–10. Functions of the Subtests from the PEP/Stamp Endorser Tests Menu

Subtest Function

ENDORSEMENT TESTS Enables you to select the mode of printing on a document. Youhave the option of selecting stamp only, printer only, or bothendorsements. The routine prints in all zones. Any errors thatoccur are displayed on the screen. Flow continues until ahopper empty, a full pocket, or an error condition occurs. Youmust visually inspect the printed documents to confirm testresults.

STAMP HOME SENSOR TEST Duplicates the POC test that attempts to home the stamp. Thedifference lies in the interpretation of the test results. In thedisk-based test, you may be directed to visually check themovement of the stamp during the execution of the test. Thisaids in isolating the fault.

STAMP MOTOR PHASE TEST Is two tests. The first test checks the phase drivers by pulsingall four motor phases, one at a time. You verify that the signal ispresent at the output of the driver circuitry for each phase. Thesecond test prompts you to choose one of four phase currents:standby, low, medium, or high. The current level is applied tophase A. You then measure I1REF. Choose each current inincreasing order to vary V1REF.

HOLE DETECTION TEST Uses a special document that forces the hole condition. TheMTR monitors the count and compares it with the expectedresults.

PRINT NEEDLE TEST This test verifies that all the print needles for charactergenerator banks A, B, and C are functioning correctly. Eighteendocuments are endorsed during the test, one for each printneedle. The endorsed documents are labeled with the back (A,B, or C) and the print needle (1 - 6), from the bank being tested.The print needle under test is fired at various intervals so that arepeating pattern of dots is printed on the document. If theneedle under test is jammed or firing continuously, flow isstopped and an error message is displayed identifying theneedle. The 18 endorsed documents are sent to pocket 2 if nofailures occur. As soon as the 18th document is endorsed, flowis stopped and the remaining documents in the track are sent tothe reject pocket. If a failure occurs, flow is stopped and alldocuments remaining in the track are sent to the reject pocket.The document on which the error occurred is sent to pocket 2.If fewer than 18 documents are loaded into the primary hopper,a screen message tells the user that not enough documentswere loaded to complete the test.

Introduction


Display Scans

This option is not currently available.

Gate/Light Exerciser

The Gate/Light Exerciser MTR is used to mechanically check and adjust the pocketselector gate position and throw. The first part of the exerciser opens all the pocket gatesand enables all the pocket lights. You are then prompted to visually verify that all of thepocket gates are open and all the pocket lights are on. If this condition is not met, you areprompted to run Subtest 03 of the Transport MTRs.

The second part of the exerciser closes all the pocket gates and disables all the pocketlights. It is executed regardless of the pass/fail status reported in part one. You are thenprompted to visually verify that all the pocket gates are closed and all the pocket lights areoff. If this condition is not met, you are prompted to run Subtest 03 of the TransportMTRs.

Introduction


E13B Magnetic Ink Character Recognition Test

The primary tool for diagnosing E13B character recognition problems – double read, ACread, or DC read – is the Magnetic Ink Character Recognition Stress Deck (#2758 2618) andthe MICR test and adjustment found in the NDP Field Test and Reference Document. SeeT&A 2974 4901 or T&A 3304 4660 (for units equipped with the single-board DC MICRreader).

If you suspect MICR reader problems and the MTR fails to detect a problem, you shouldverify the adjustments in accordance with those T&As, and you should run the CharacterRecognition Stress Deck in all three read modes.


E13B MICR READER TESTS


1 = AC Reader Tests 2 = DC Reader Tests

99 Return to MTR Main Menu

Figure 1–34. E13B MICR Reader Tests Menu

The following subsections discuss the AC and DC MICR reader options.

Introduction


AC Reader Tests

When you select option 1 from the E13B MICR Reader Tests Menu (Figure 1–34), the ACReader Tests Menu is displayed, as shown in Figure 1–35.

AC READER TESTS


1 = START CONFIDENCE TESTS 2 = PROCESSOR TEST 3 = RESULT PROM TEST 4 = MAINTENANCE REGISTER TEST 5 = QUANTIZER TEST 6 = SEGMENTATION TEST 7 = MCR TEST 8 = FIFO TEST 9 = MAINTENANCE RAM TEST 10 = ANALOG BOARD TEST 11 = CAPTURE IMAGE-NEXT DOCUMENT 12 = CAPTURE IMAGE-REJECT DOCUMENT 99 = RETURN TO MTR MAIN MENU

Figure 1–35. AC Reader Tests Menu

Introduction


Table 1–11 describes the subtests from the AC Reader Tests Menu.

Table 1–11. Functions of the Subtests from the AC Reader Tests Menu

Subtest Function

START CONFIDENCETESTS

Starts execution of subtests 02 through 10. If any test fails, theappropriate fault code is displayed.

PROCESSOR TEST Checks the operation of the recognition processor and its PROM.

RESULT PROM TEST Validates the contents of the Test Result PROM.

MAINTENANCEREGISTER TEST

Verifies the operation of the maintenance input and output registers,multiplexors, and some address decoding.

QUANTIZER TEST Verifies the functional operation of the quantizer circuit.

SEGMENTATIONTEST

Verifies proper operation of the segmentation state machine.

MCR TEST Exercises the Magnetic Card Reader (MCR) Large Scale Integration (LSI)chip in three ways: an internal self-test, character image patterns, andfunctional exercises.

FIFO TEST Verifies the operation of the recognition First In First Out (FIFO).

MAINTENANCE RAMTEST

Verifies the operation of the Maintenance RAM used during capture modes.

ANALOG BOARDTEST

Checks for activity on each of the ten channels of the analog board. Itlooks only for activity and does not make quality measurements.

CAPTURE IMAGE–NEXT DOC

Captures the document data from the next document in the primaryhopper. The data is displayed as the read head sees it, individuallydisplaying each channel. Data can be displayed in two ways: a singlecharacter or all the characters read.

CAPTURE IMAGE–REJECT DOC

Captures the data on the next document containing a reject character.Data can be displayed in the same manner as for subtest 11.

Introduction


DC Reader Tests

The DC single-board MICR reader, which resides in card slot 13 of the sorter, has logic,switches, and LEDs specifically implemented for diagnostic purposes.

Although you can use any type E13B documents for the test, for maximum fault detectionyou should use 2730 5192 low-level test documents when running this MTR.

When you select option 2 from the E13B MICR Reader Tests Menu (Figure 1–34), the DCReader Tests Menu is displayed, as shown in Figure 1–36.

DC READER MTR MENU


1 = SCAN A SINGLE DOCUMENT 2 = SCAN DOCUMENTS UNTIL A REJECT IS DETECTED 3 = SCAN AND COMPARE DOCUMENTS

99 RETURN TO MAIN MENU

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Figure 1–36. DC Reader Tests Menu

Introduction


Table 1–12 explains the options on the DC Reader MTR Test Menu.

Table 1–12. DC Reader Tests Menu Options

SCAN A SINGLEDOCUMENT

A single item is fed from the sorter’s primary hopper to pocket 0. When the itempasses the DC read head, the MICR line is read, and the data is processed. Theresultant MICR line information is returned to the MTR program, which displays iton the sorter screen. At that time, a message appears on the screen requestingthat you compare the data displayed on the screen with the MICR line of the itemin pocket 0. A question requiring a Yes/No response is displayed asking whetherthe two compared. If the two do not compare, an error code directs you to themanual procedures.

SCANDOCUMENTSUNTIL AREJECT ISDETECTED

Items are flowed from the primary hopper to pocket 0 until a reject item isdetected. When a reject is found, that item and all subsequent items in the trackare sent to the reject pocket, and flow is halted. The MICR line of the rejecteditem is displayed along with a message that a reject has been found or that anillegal character has been detected. An error code is displayed to direct you to amanual procedure. If no rejects are encountered, all except the last threedocuments are sent to pocket zero. The last three are sent to the reject pocket.

SCAN ANDCOMPAREDOCUMENTS

Initially a single item fed from a test deck you placed in the sorter primary hopperis scanned. It sends that item to pocket 0. The resultant MICR line information isreturned to the MTR program, which displays it on the sorter screen. In addition,a message is displayed requesting that you compare the data displayed on thescreen with the MICR line of the item in pocket 0. A question requiring a Yes/Noresponse on whether the two compared is also displayed. If the two do notcompare, you have the option to try again or to exit to the DC Reader MTR TestMenu. If they do compare, the test proceeds as follows. You are requested toinitiate flow of the remaining items in the sorter primary hopper. The items arescanned by the DC MICR reader and deposited into pocket 0. The MICR data readfrom each item is compared with the data read from the first item fed. When aninvalid comparison occurs, the reject item and all subsequent items in the trackare deposited in the reject pocket, and flow is halted. The MICR line of therejected item is displayed along with the verified MICR data scanned from the firstitem. An error code is also displayed to direct you to the appropriate path ofaction by using the manual procedures. If no rejects are encountered, all exceptthe last three documents are sent to pocket zero. The last three are sent to thereject pocket.

Introduction


CMC7 MICR Reader Tests

The CMC7 single-board MICR reader, which resides in card slot 13 of the sorter, has an8035 microcontroller and associated logic, switches, and LEDs specifically implementedfor diagnostic purposes.

The 8035 microcontroller has an on-board self-test that is invoked automatically when thesorter is powered on or reset. Also, you can invoke it by selecting the appropriate switches(refer to SEI 3304 3688).

The only function of this built-in test is to verify that the microcontroller and the LEDs areoperational. It does not test the head or the MICR processing logic. The test results arereported back visually through the LEDs.

Although you can use any type CMC7 documents for the test, for maximum fault detectionyou should use high-level and low-level signal documents 3126 8931 and 3126 8923 whenrunning this MTR.


CMC7 MTR TEST MENU


1 = SCAN A SINGLE DOCUMENT 2 = SCAN DOCUMENTS UNTIL A REJECT IS DETECTED 3 = SCAN AND COMPARE DOCUMENTS 99 = RETURN TO MAIN MENU

Figure 1–37. CMC7 MTR Test Menu

Note: The new CMC7 Reader (PCBA 4331 8658-xxx) uses the same CMC7 Test Menu

as above. The PCBA is located in slot #11 in the AA-Gate.

Introduction


Table 1–13 explains the options on the CMC7 MTR Test Menu.

Table 1–13. CMC7 MTR Test Menu Options

Option Function

SCAN A SINGLEDOCUMENT

A single item is fed from the sorter’s primary hopper to pocket 0. When the itempasses the CMC7 reader head, the MICR line is read, and the data is processed.The resultant MICR line information is returned to the MTR program, which displaysit on the sorter screen. At that time, a message appears on the screen requestingthat you compare the data displayed on the screen with the MICR line of the itemin pocket 0. A question requiring a Yes/No response is displayed asking whetherthe two compared. If the two do not compare, an error code directs you to themanual procedures.

SCANDOCUMENTSUNTIL AREJECT ISDETECTED

Items are flowed from the primary hopper to pocket 0 until a reject item isdetected. When a reject is found, that item and all subsequent items that are inthe track are sent to the reject pocket, and flow is halted. The MICR line of therejected item is displayed along with a message that a reject has been found orthat an illegal character has been detected. An error code is displayed to directyou to a manual procedure. If no rejects are encountered, all except the last threedocuments are sent to pocket zero. The last three are sent to the reject pocket.

SCAN ANDCOMPAREDOCUMENTS

Initially a single item fed from a test deck you placed in the sorter primary hopperis scanned. It sends that item to pocket 0. The resultant MICR line information isreturned to the MTR program, which displays it on the sorter screen. In addition,a message is displayed requesting that you compare the data displayed on thescreen with the MICR line of the item in pocket 0. A question requiring a Yes/Noresponse on whether the two compared is also displayed. If the two do notcompare, you have the option to try again or to exit to the CMC7 MTR Test Menu.If they do compare, the test proceeds as follows. You are requested to initiateflow of the remaining items in the sorter primary hopper. The items are scannedby the CMC7 MICR reader and deposited into pocket 0. The MICR data read fromeach item is compared with the data read from the first item fed. When an invalidcomparison occurs, the reject item and all subsequent items in the track aredeposited in the reject pocket, and flow is halted. The MICR line of the rejecteditem is displayed along with the verified MICR data scanned from the first item. Anerror code is also displayed to direct you to the appropriate path of action byusing the manual procedures. If no rejects are encountered, all except the lastthree documents are sent to pocket zero. The last three are sent to the rejectpocket.

Introduction


Imaging Module Tests

There are two imaging systems supported by the NDP MTRs when running in the non-CAPIconfiguration. Both systems cannot be present at the same time. When the user selects"Image Module Tests" from the Maintenance Test Routines Main Menu, the sorterconfiguration is checked to determine which imaging system is present. Based on thisinformation the appropriate imaging system submenu is displayed. A description of eachsystems MTRs follows.

U4/JPEG Imaging Module

When you select option 10, Image Module Tests, from the MTR Main Menu (Figure 1–21),and the system has a U4/JPEG Imaging Module, the menu shown in Figure 1–38 isdisplayed.

IIPS MAINTENANCE TEST ROUTINES MTR039

SELECT IM UNIT TEST

1> SELECT/DE-SELECT EXTENDED POWER ON CONFIDENCE TESTS 2> POC EXECUTION / DEFAULT FLAG SELECTION 3> COMMUNICATION LINK TEST 4> IIB INTERFACE TEST 5> IM LAMP SUPPLY TEST 6> TURN IM LAMP ON 7> TURN IM LAMP OFF 8> VIEW CURRENT POC RESULTS 9> CALIBRATE THE SCANNER F1> RETURN TO MAIN MTR MENU

Figure 1–38. IIPS Maintenance Test Routines: Select IM Unit Test Menu

The functions of the options on this menu are presented in the subsections below.

Almost all the options on the menu are also available when you invoke the IS exerciserprogram from a host NDP console or a workstation. The submenus and screens that arepresented when you select any of these choices are shown in Appendix B, "MaintenanceTest Routine (MTR) Program Screens," of the Image Item Processing System Servicing

Guide: Maintenance.

The two options that are not available from a host terminal are option 4, IIB Interface Test,and option 9, Calibrate the Scanner. The "IIB Interface Test" later in this subsectiondescribes the Datacomm Loopback MTR Menu options and screen operations for option 4.Calibration of the scanner is selected on the sorter, but the manual procedures related to itare covered in Section 6 of the Image Item Processing System Servicing Guide:

Maintenance.

Introduction


Following the discussion of the imaging module test options, this subsection presents anexample of a procedure for selecting specific power-on confidence tests. It then reviewssources of additional information regarding unit operation.

Select/De-select Extended Power On Confidence Tests

Option 1 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), Select/De-selectExtended Power On Confidence Tests, enables you to select specific extended POC testsfor the imaging module 286 Main Processor board, the POL board, or the DTI board. Thesystem records your test requests in NVRAM, which resides on the POL board. The valuesare pointers to the Optional Extended tests, which run during the next power-onconfidence test. Refer to "Selecting and Executing POC Tests" later in this section for adescription of the submenu options that display when you choose Select/De-selectExtended Power On Confidence Tests.

POC Execution / Default Flag Selection

Option 2 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), POC Execution /Default Flag Selection, runs on the Main Processor PWBA in the imaging module. Itenables you to

• Restore the default POC test selection after the presently selected POC tests have beenexecuted

• Keep the current POC selection in nonvolatile memory as the new default test set forthe next POC execution

• Execute the selected POC tests

POC execution causes a hard reset of the imaging module hardware under softwarecontrol. The default flag selection option causes POC test selections in NVRAM to bepermanent or temporary. Refer to "Selecting and Executing POC Tests" later in thissection for a description of the POC Execution / Default Flag Selection screen options.

Communication Link Test

Option 3 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38) runs the CommunicationLink test on the Main Processor PWBA in the imaging module. This test checkscommunication links between the test requester and the imaging module.

IIB Interface Test

Option 4 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), IIB Interface Test,executes the Parallel Interface Loopback test and the Serial Interface Loopback test on theMIIB PWBA in the imaging module. Both tests use loopback connectors on the MIIB orinterconnect cables to test the appropriate interface's ability to transmit and receive data.The connectors loop back data patterns transmitted by the MIIB to the MIIB receivecircuitry. A pass/fail status message is displayed on the sorter screen.

Introduction


When you select option 4, the Datacomm Loopback MTR Menu is displayed. Table 1–14explains the options available on this menu.

Table 1–14. Datacomm Loopback MTR Menu Options

Option Function

Parallel InterfaceLoopback test

The Parallel Interface Loopback test exercises the parallel interface cablebetween the MIIB and the DTI boards. A series of screen messages indicatesloopback connector options. You make a keyboard entry to select the desiredoption, the test executes, and a pass/fail status message is displayed on thesorter screen.

Serial InterfaceLoopback test

The Serial Interface Loopback test exercises the serial interface cable betweenthe MIIB and the DTI boards. A series of screen messages indicates loopbackconnector options. You make a keyboard entry to select the desired option,the test executes, and a pass/fail status message is displayed on the sorterscreen.

IM Lamp Supply Test

Option 5 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), IM Lamp Supply Test,turns the image system lamps on and off and checks various status registers to verify thatthe lamps are functioning correctly. This test runs on the Diagnostic and TRANSPORTInterface PWBA in the imaging module. If the status is positive, a "test passed" message isdisplayed on the sorter screen. If the status is negative, an error message is displayed.

Turn IM Lamp On

Option 6 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), Turn IM Lamp On, turnson the xenon lamp in the imaging module. This test runs on the Diagnostic andTRANSPORT Interface PWBA in the imaging module. You run this test when the IM LampSupply Test indicates an error. When you select this test, a message instructs you to verifyvisually that the imaging lamps are on. After the check, you are prompted to return to theimage MTR menu.

Turn IM Lamp Off

Option 7 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), Turn IM Lamp Off, turnsoff the xenon lamp. This test runs on the Diagnostic and TRANSPORT Interface PWBA inthe imaging module. You run this test when the IM Lamp Supply Test indicates an error.When you select this test, a message instructs you to verify visually that the imaging lampsare off. After the check, you are prompted to return to the image MTR menu.

View Current POC Results

Option 8 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), View Current POCResults, enables you to see the results of the imaging system's POC tests. The imaging

Introduction


system runs a series of tests during power-on. When an error occurs, the error code isplaced in a buffer. Only the first error that occurred is displayed at the end of the sorter’sPOC test. If multiple image POC errors occur, you can view all the error codes using thisoption.

Calibrate the Scanner

Option 9 on the IIPS MTR Select IM Unit Test Menu (Figure 1–38), Calibrate the Scanner,enables you to calibrate the image scanner when problems arise with image quality.

Note: Refer to Section 6, error code line 10300, of the IIPS Maintenance Manual for

more information about the Calibrate Scanner routine. Refer to Appendix J of

the same manual for a discussion of procedures related to image quality.

Selecting and Executing POC Tests

To select and execute POC tests, you use the first two options on the IIPS MTR Select IMUnit Test Menu (Figure 1–38).

You use option 1, Select/De-select Extended Power On Confidence Tests, to specify theimaging module board to be tested and to select the specific tests to be executed for thatboard.

You use option 2, POC Execution / Default Flag Selection, to save test selections or acceptdefault tests before the tests execute.

Each test set contains tests specific to the selected board.

• Direct, single execution tests execute on the board and test the board only once.

• Direct, multiple execution tests execute on the board and can be selected so that onetest runs a multiple number of times.

Note: Only one multiple execution test can be run per board at any one time.

• Indirect single execution tests execute on the board, test parts of the module otherthan the board, and test the board only once.

Note: The POL and DTI Boards do not run indirect tests.

• Indirect multiple execution tests execute on the board, test parts of the module otherthan the board, and can be selected so that one test runs a multiple number of times.

Note: Only one multiple execution test can be run per board at any one time.

Introduction


Default POC tests are system-specified tests that always run unless deselected.Deselection is discussed in step 6 of the following procedure.

The following is a sample of the procedural steps required to select imaging module boardtests.

1. Select option 1 from the IIPS MTR Select IM Unit Tests Menu.

The menu shown in Figure 1–39 is displayed.

IIPS MAINTENANCE TEST ROUTINES MTR039

SELECT IM BOARD TYPE FOR EXTENDED POC TEST SELECTION

SELECT/DESELECT POC TESTS FROM ONE OF THE FOLLOWING IM BOARDTESTS SETS

1 = 286 MAIN PROCESSOR BOARD 2 = POL BOARD 3 = DTI BOARD 4 = RETURN TO PREVIOUS MENU 5 = RETURN TO MAIN MENU

-

Figure 1–39. IIPS Maintenance Test Routines Select IM Board Type Menu

2. Press the number associated with the board you wish to test, and press the Xmit key.

This example assumes that you choose option 1. In this case, the system displays thetest sets for the 286 Main Processor board.

Introduction


The menu shown in Figure 1–40 is displayed.

IIPS MAINTENANCE TEST ROUTINES

SELECT 286 MAIN PROCESSOR EXTENDED POC TEST SET

DIRECT TEST - TESTS THE BOARD IT EXECUTES ON INDIRECT TEST - TESTS HARDWARE OTHER THAN THE BOARD IT EXECUTES ON

1 = SELECT DIRECT SINGLE EXECUTION 286 MAIN PROCESSOR EXTENDED POC TEST SET

2 = SELECT DIRECT MULTLE EXECUTION 286 MAIN PROCESSOR EXTENDED POC TEST SET

3 = SELECT INDIRECT SINGLE EXECUTION 286 MAIN PROCESSOR EXTENDED POC TEST SET

4 = SELECT INDIRECT MULTLE EXECUTION 286 MAIN PROCESSOR EXTENDED POC TEST SET

5 = SELECT DEFAULT 286 MAIN PROCESSOR POC (TESTS NORMALLY EXECUTED)

6 = RETURN TO PREVIOUS MENU

7 = RETURN TO MAIN MENU

Figure 1–40. IIPS Maintenance Test Routines: Select 286 Main Processor ExtendedPOC Test Set Menu

3. Press the number associated with the test set for which you want to select tests, andpress the Xmit key.

This example assumes that you choose option 1 to view the contents of the directsingle execution 286 Main Processor Board test set.

The menu listing the 25 tests in the direct single execution 286 Main Processor Boardtest set is displayed.

Note: This menu appears in Appendix B of the IIPS Maintenance Manual as

MTR042.

4. Press the number associated with the test you want to select, and press the Xmit key.

5. Deselect any currently selected test that you do not want by entering the numberassociated with the test and pressing the Xmit key.

The asterisk next to the test disappears, indicating that the test is no longer currentlyselected.

6. Repeat steps 4 and 5 until all desired tests are selected.

Introduction


Note: Unless an on-screen message indicates otherwise, you may select as many

tests as are listed. In this test set, the menu indicates that only 18 tests can

be selected.

Once you have selected all desired tests for this board, follow the next series of stepsto select tests for another imaging module board.

7. Type 0 (zero), and press the Xmit key.

The test set selection screen is redisplayed. In this case, the Select 286 Main ProcessorExtended POC Test Set reappears. (Refer to Figure 1–40.)

8. Choose one of these options:

• To select another test set, repeat steps 3 through 7.

• If you do not wish to select another test set, proceed to step 9.

9. Select the number associated with Return to Previous Menu, and press the Xmit key.

Note: For this sample procedure, you would select number 6. The Select IM Board

Type Screen (Figure 1–39) reappears.

10. Press the number associated with the next desired imaging module board, and pressthe Xmit key.

11. Repeat steps 3 through 9 until you have selected all desired tests. When all desiredtests are selected and you are ready to execute the tests, proceed to step 12.

12. Select option 5 (Return to Main Menu) on the Select IM Board Type Menu (Figure 1–39).

The IIPS Maintenance Test Routines Select IM Unit Tests Menu (Figure 1–38) isdisplayed.

13. Select option 2, POC Execution / Default Flag Selection.

The Power On Confidence Execution Menu is displayed, as shown in Figure 1–41.

POWER ON CONFIDENCE EXECUTION


1 = *SET DEFAULT FLAG (RESTORE DEFAULT POC TESTS AFTER POC EXECUTION)

2 = RESET DEFAULT FLAG (LEAVE CURRENT POC SELECTION INTACT)

3 = EXECUTE POC

4 = RETURN TO PREVIOUS MENU

Figure 1–41. Power On Confidence Execution Menu

14. Decide if you want the system to save your test choices after the tests execute for usein the next POC function.

Introduction


Note: You must make this decision before you execute the selected tests.

The Power On Confidence Execution Menu has the following options. An asterisknext to either option 1 or option 2 indicates which option is currently selected:

• Option 1, Set Default Flag, restores the system-specified default tests and deletesany additional tests you selected after POC execution.

Select 1 if you wish to restore only the default POC tests after POC execution foruse in the next POC function.

• Option 2, Reset Default Flag, leaves your test selections intact. The system doesnot delete the test set you selected.

Select 2 if you wish to keep the current test selections intact after POC executionfor use in the next POC function.

Note: If the option you desire is already selected, skip to step 16.

15. Press the number associated with the desired option, and press the Xmit key.

The asterisk moves to the option you selected.

16. Select 3 and then press the Xmit key to execute the imaging module POC tests.

Introduction


Dual Imaging Module

When you select option 10, Image Module Tests, from the MTR Main Menu (Figure 1–21),and the system has a Dual Imaging Module, (Figure 1–21), the menu shown in Figure 1–42is displayed.

DUAL IMAGE MODULE MAIN MENU

Select one of the following followed by the "XMIT" key

1 = Calibrate Front Camera 2 = Calibrate Rear Camera 3 = Run Front Lamp 4 = Run Rear Lamp 5 = Loop Back Test 99 = Return to MTR Main Menu

Figure 1–42. Dual Image Module Main Menu

The functions of the options on this menu are presented in the following subsections.

Calibrate Front Camera

This MTR creates information used to compensate for the analog and optical variations inthe front digitizer and camera combination. The results for this MTR are stored on the ICShard drive in C:\dpimage\frontX.cfg and C:\dpimage\frontX.tbl. The image control programuses these data files during document flow for setup of the normalizer/framer andcamera/digitizer.

Calibrate Rear Camera

This MTR creates information used to compensate for the analog and optical variations inthe rear digitizer and camera combination. The results for this MTR are stored on the ICShard drive in C:\dpimage\rearX.cfg and C:\dpimage\rearX.tbl. The image control programuses these data files during document flow for setup of the normalizer/framer andcamera/digitizer.

Run Front Lamp

This MTR enables you to turn the front lamp on and off to visually verify that it is working.

Run Rear Lamp

This MTR enables you to turn the rear lamp on and off to visually verify that it is working.

Loop Back Test

This test must be executed with the PCI cable disconnected from the DIIM PCBA and thedual image PC. This test verifies the FIFOs are functioning properly.

Introduction


HS OCR Reader Tests

When you select option 10, HS OCR Reader Tests, from the MTR Test Main (Figure 1–21),the menu shown in Figure 1–43 is displayed.

OCR READER SYSTEM MAIN MENU

TESTING OCR #1

SELECT ONE OF THESE OPTIONS FOLLOWED BY <XMIT

1 OCR MAINTENANCE TEST ROUTINES 2 OCR READER UTILITIES 3 TRANSPORT OPERATIONS

PRESS <SPCFY> TO RETURN TO THE DP 1X00 MAIN MTR MENU

Figure 1–43. OCR Reader System Main Menu

The functions of the options on this menu are presented in the following subsections.

Introduction


OCR Maintenance Test Routines

Option 1 on the OCR Reader System Main Menu enables you to execute the followingoptions.

Option Function

Camera elevator test Checks the elevator lock sensor, exercises the elevator motor, andverifies the elevator travel limit circuitry.

Lamp test Tests the functionality of the OCR reader lamp.

Rerun OCR reader POC tests Enables you to rerun either a single test from the OCR reader POCor the entire OCR reader POC. A "loop mode" is available thatcontinually reruns a single test or the entire POC.

BOL E test Verifies the functionality of the BOL E circuitry by having you coveror uncover BOL E while checking for the correct BOL E status onthe OCR reader.

PC port test Uses an RS-232 loopback connector to exercise the laptop PCinterface on the OCR reader’s CPU board. It writes the test data tothe interface and reads it back to verify the functionality of theinterface.

OCR Reader Utilities

Option 2 on the OCR Reader System Main Menu provides the following options.

Option Function

Display OCR reader POCerror log

Displays the 10 most recent OCR reader POC errors stored in NVRAM

Edit non-volatile RAM Enables you to initialize the OCR reader’s NVRAM and edit theparameters stored in it

Display current OCRstatus

Displays the current status of the OCR reader registers

Transport Operations

Option 3 is currently not available.

Introduction


CAR Module Tests

There are two CAR modules supported by the NDP MTRs when running in the non-CAPIconfiguration. Each CAR module is designed to work with one of the two imagingsystems: U4/JPEG imaging module or dual imaging module.

CAR Module Tests (U4/JPEG Imaging System)

The CAR MTRs that are accessible from the Maintenance Test Routine Main Menu, are forthe U4/JPEG imaging module CAR system.

When you select option 11, CAR Interface Tests, from the Maintenance Test Routine MainMenu (Figure 1–21), the CAR System MTR Test Menu is displayed, as shown in Figure 1–44.

CAR SYSTEM MTR TEST MENU

Press the appropriate number, then press <XMIT.

1 EXECUTE THE CONTROL INTERFACE TEST 2 RETRIEVE THE CAR UNIT POC TEST RESULTS 3 EXECUTE THE CAR UNIT RECOGNIZE TEST IMAGE TEST 4 RETRIEVE THE CAR UNIT STATUS 5 RUN THE CAR TEST DECK WITHOUT POWERING DOWN

99 Return to the main menu.

Figure 1–44. CAR System MTR Test Menu

The following subsections describe the options on the CAR System MTR Test Menu andoutline the procedures for using them.

Note: It is not necessary to wait for the Image Module POC test to complete if option 1,

2, or 4 is selected.

Control Interface Test

When you select option 1 from the CAR System MTR Test Menu (Figure 1–44), the systemdisplays instructions for executing the Control Interface Test. This test determineswhether a communications link can be established over the SCSI Control Interface, whichis the interface between the document processor and the CAR module.

Introduction


Press the F1 key to return to the CAR System MTR Test Menu without executing theControl Interface Test, or press the Spcfy key to execute the test.

The test executes very quickly. The system displays a result screen displaying a success orfailure message. If an error message is displayed, refer to error/status code lines in theCAR Module section of this book.

Retrieve CAR Unit POC Test Results

When you select option 2 from the CAR System MTR Test Menu (Figure 1–44), the systemdisplays instructions for retrieving CAR module POC test results:

1. Turn the CAR module OFF.

2. Wait 5 seconds.

3. Turn the CAR module back ON.

4. Press the Spcfy key.

The system displays this message: "Waiting 60 seconds for the CAR Unit to completePOC." Once that test is completed, the system displays a message stating that the testshave passed successfully or an error message identifying units that did not pass thePOC tests.

5. Press the Spcfy key again to return to the CAR System MTR Test Menu (Figure 1–44).

CAR Unit Recognize Test Image Test

The Image Test using the USBI classifier is part of the system exerciser. Refer to theNDP/DP1000/DP1825 Servicing Guide: Analysis and Test Software for information onrunning the test.

Retrieve CAR Unit Status

Option 4 displays the current CAR module operating state, the character recognition units(CRUs) that are enabled, and information about any error conditions that may be presenton the CAR module.

When you select option 4 from the CAR System MTR Test Menu (Figure 1–44), the systemdisplays instructions for retrieving the CAR module status. Press the F1 key to return tothe CAR System MTR Test Menu without retrieving CAR status, or press the Spcfy key toretrieve the information.

Introduction


Running the CAR Test Deck

When you select option 5 from the CAR System MTR Test Menu (Figure 1–44), the systemdisplays instructions for loading the CAR exerciser disk to run the CAR Test Deck withoutpowering down the document processor. This saves time because the documentprocessor, IM, and CAR POC tests do not have to be repeated. The test deck enables youto test the CAR module read results.

Press the F1 key to return to the CAR System MTR Menu (Figure 1–44) without running theCAR Test Deck, or follow these steps to load the Exerciser without powering down:

1. Display the Unit Manager and select Disable.

2. Minimize the Unit Manager.

3. Select F12 under the heading BOOT.

4. Select SCP as the default program to boot. Select OK.

5. Select Debugger by typing 12 and pressing the Xmit key. Observe the prompt at thebottom of the screen. It should display the following:

NDP 030BUG 2.0

6. Place the cursor at the top left of the screen, type the following (in all caps), and pressthe Xmit key.

G 10000DA

This takes the system into the load routine for loading the system software.

7. Run the CAR test deck as directed by the NDP/DP1000/DP1825 Servicing Guide:

Analysis and Test Software.

CAR Module Tests: Dual Imaging System

The MTRs for the dual imaging module CAR system are not accessible from theMaintenance Test Routine Main Menu. These MTRs are run from the ICS PC. See Section25, "CAR Diagnostic Procedures (Dual Image System) for details.

DEBUGGER

When you select the DEBUGGER option from the Maintenance Test Routine Main Menu(Figure 1–21), the debugger routine is accessed. For details on the debugger, see the "NDPDebugger Program" description in the "Maintenance Test Routine Tests," earlier in thissection.

Introduction


Description of Additional Information (Non-CAPIConfiguration)

In addition to the tests already described, you can also use the character recognition stressdeck, the CCC table, the Snapshot utility, and the list of machine check error codes.

Character Recognition Stress DecksTwo character recognition stress decks contain many different types of documentsdesigned to test the performance of the MICR and OCR readers. MICR stress deckdocuments test the performance of both the AC multitrack and DC E13B MICR readers.The OCR recognition stress deck tests the performance of the OCR1 and OCR2 readers.

These decks are powerful tools to maintain proper read system performance and to helpdiagnose faults. The decks should be used as a part of normal PM and whenever a readproblem is suspected.

Refer to the NDP/DP 1000/DP 1825 Servicing Guide: Analysis and Test Software forinformation about how to run the MICR recognition (MCRR) program and for a detailedprocedure for using the MICR recognition stress deck. Also, refer to T&A 3304 4660 in theNDP Field Test and Reference Document for diagnosis of errors and for adjustments.

Refer to the DP 1800 OCR Reader Installation and Servicing Guide for information aboutthe OCR recognition stress deck and instructions for running the OCR recognition (OCRR)test.

Condition, Cause, Correction (CCC) TableThe CCC table provides a list of failure conditions that do not display a failure code if afailure occurs during the POC tests or when a failure is detected that does not have anobvious correction. A complete CCC table is in Section 13.

Notes:

• The CCC table for imaging system conditions is in the Image Item Processing System

(IIPS) Maintenance Manual.

• The CCC table for the OCR reader is in the DP 1800 OCR Reader Installation and

Servicing Guide.

SnapshotSNAPSHOT is a field engineering tool that enables you to examine relevant data regardingunit operation. A complete description of SNAPSHOT and its application is in the NDP/DP

1825 Servicing Guide: Analysis and Test Software.

Machine ChecksA list of the Machine Check Error Codes is in Section 15 of this document.

Introduction



Section 2 Power-On Confidence Tests

This section provides manual procedures covering AA gate, microfilmer, and PEP/stampPower On Confidence (POC) error codes.

00000 NO ERROR STATUS DISPLAYED

The procedures for line numbers 00000 through 10000 cover POC Test errors that do notresult in the display of an error status on the NDP PC’s display monitor.

A critical error condition has occurred if two minutes after powering on the NDP, nomessage describing the status of the POC tests has been displayed. At this point, the CSEshould inspect the MTR LEDs on the NDP030 CPU PCBA (card AA17). The MTR LEDs arelabeled on the PCBA and are read from top (least significant bit) to bottom (mostsignificant bit). LEDs that are "on" are interpreted as logical ones. Those that are "off" areinterpreted as logical zeroes.

The LED patterns are hexadecimal codes that indicate which NDP030 CPU PCBA POC testfailed prior to the establishment of SCSI communications with the PC. Table 2–1 indexesthe LED codes to fault descriptions. The procedure for diagnosing and correcting the errorstarts on the following page.

Table 2–1. LED Fault Code Conditions: NDP030 CPU PCBA

LED FaultCode (Hex)

Fault Description

01 CPU test failure

02 Bus trap accessing RAM in address range: $0000 - $003F FFFF

03 RAM memory configuration test failure.

04 RAM write/read test failure.

05 EPROM checksum test failure.

06 RAM address line test failure.

07 RAM parity test failure.

08 Privilege exception test failure.

09 Dead Bus Timer test failure.

0A Programmable Timer Module failure.

Power-On Confidence Tests


Table 2–1. LED Fault Code Conditions: NDP030 CPU PCBA

LED FaultCode (Hex)

Fault Description

0B SCSI initialization error.

0C Flash EPROM checksum failure

10 MULTIBUS loop test

11 Pblink test

12 Configuration test

13 Character Recognition Test

14 I-test

15 A/B test

16 Reader/Config test

17 Transport status test

20 PEP/Stamp status

30 Microfilmer status

40 MJE status

50 HSOCR status

60 NIE status

70 Image status

F1 Unexpected address exception.

F2 Unexpected bus exception.

F3 Unexpected exception.

F4 Unexpected instruction exception.

F5 Unexpected interrupt level.

F6 Unexpected privilege instruction level.

F7 Unexpected spurious interrupt level.

F8 Unexpected transport interrupt exception.



00000

No Error Status Displayed


000 Replace the NDP030 CPU PCBA (card AA17) and rerunthe POC test.

Is a POC test status message displayed on NDP PC’sdisplay monitor?

002 008

002 Did the POC test pass? 950 004

004 Follow manual procedure for displayed fault code. End ofprocedure.

008 Remove all PCBA’s from the AA gate except the NDP030CPU PCBA (card AA17). Disconnect the SCSI connectorJ1 from the NDP030 CPU PCBA. Rerun the POC test.

Does the LED fault code on the NDP030 CPU PCBAindicate a SCSI initialization error (LED=0C)?

020 290

010 Replace the NDP030 CPU PCBA (card AA17) and rerunthe POC test.

Is a POC test status message displayed on the NDP PC’sdisplay monitor?

002 290

020 Re-attach the SCSI cable to connector J1 on the NDP030CPU PCBA and rerun the POC test.

Is a POC test status message displayed on the NDP PC’sdisplay monitor?

030 310

030 Re-install the Area 1 Tracking Logic PCBA (card AA02).Rerun the POC test.

Is a POC test status message displayed on the NDP PC?

050 040

040 Replace the Area 1 Tracking Logic PCBA (card AA02).Rerun the POC test.

Does the original problem still exist?

290 900

050 Re-install the Area 2/3/4 Tracking Logic PCBA (cardAA05). Rerun the POC test.


070 060

060 Replace the Area 2/3/4 Tracking Logic PCBA (cardAA05).

Rerun the POC test. Does the original problem still exist?

290 900

070 Re-install the Main Clock PCBA (card AA08). Rerun thePOC test.


090 080

080 Replace the Main Clock PCBA (card AA08). Rerun thePOC test.


290 900




090 Re-install the MICR/Reader Configuration PCBA (cardAA10).

Rerun the POC test. Is a POC test status messagedisplayed on the NDP PC?

110 100

100 Replace the MICR/Reader Configuration PCBA (card AA10).Rerun the POC test.


290 900

110 Is the Recognition/Control PCBA (card AA11) present? 120 140

120 Re-install the Recognition/Control PCBA (card AA11) andrerun the POC test.


140 130

130 Replace the Recognition/Control PCBA (card AA11) andrerun the POC test.


290 900

140 Is the Analog Interface PCBA (card AA12) present? 150 170

150 Re-install the Analog Interface PCBA (card AA12) and rerunthe POC test.


170 160

160 Replace the Analog Interface PCBA (card AA12) and rerunthe POC test.


290 900

170 Is the DC Recognition PCBA (card AA13) present? 180 200

180 Re-install the DC Recognition PCBA (card AA13) and rerunthe POC test.


200 190

190 Replace the DC Recognition PCBA (card AA13) and rerunthe POC test.


290 900

200 Is the Microfilmer/Image Interface Board (MIIB) PCBA (cardAA03) present?

210 230




210 Re-install the MIIB PCBA (card AA03) and rerun the POCtest.


230 220

220 Replace the MIIB PCBA (card AA03) and rerun the POCtest.


290 900

230 Is the Microfilmer/Image Interface Board (MIIB) PCBA (cardAA15) present?

240 260

240 Re-install the MIIB PCBA (card AA15) and rerun the POCtest.


260 250

250 Replace the MIIB PCBA (card AA15) and rerun the POCtest.


290 900

260 Is an Endorser Interface PCBA (card AA09) present? 270 290

270 Re-install the Endorser Interface PCBA (card AA09) andrerun the POC test.


290 280

280 Replace the Endorser Interface PCBA (card AA09) andrerun the POC test.


290 900

290 Verify that the +12v, -12v, +5v, and GND levels for theNDP030 CPU PCBA (card AA17) are stable and withintolerance. If they are not, make the necessaryadjustments. Re- install any PCBA’s previously removedand rerun the POC test.

Does the problem still exist?

300 900

300 Verify that none of the backplane signals for the NDP030CPU PCBA (card AA17) are shorted. If a short condition isencountered, make the necessary adjustments.


910 900

310 Replace the SCSI cable between the PC and the NDP030CPU PCBA. Rerun the POC test.


320 900

320 The PC’s SCSI hardware is interfering with the operation ofthe NDP030 CPU PCBA (card AA17). Make the necessaryadjustments to the PC’s hardware and rerun the POC test.


910 900




900 Re-install all PCBA’s and connectors removed duringprevious manual procedure steps. Verify proper operation.

End of procedure.

910 Contact the Unisys Support Center for technicalassistance. The error condition and the repair proceduresfollowed should be described in a UCF.

End of procedure.

950 Verify proper operation.

End of procedure.



10000 PC 00 0001

Flash memory checksum test failed.


000 Power down the sorter and install the POC bypass jumper(W1/W2-0) on the NDP030 CPU PCBA (card AA17).

Reset the sorter and wait for POC bypass to complete.

At the debugger prompt "NDP 030BUG X.X.X>" enter thefollowing command:

FE<xmit>

This will erase the flash EPROM on the NDP030 CPUPCBA.

Go to step 00010.

010 At the debugger prompt "NDP 030BUG X.X.X>" enter thefollowing command:

DL FLASH.LO<xmit>

This command will download the Sorter Control Programand the rest of the POC code into the RAM of the NDP030CPU PCBA.

When the debugger program indicates the downloadoperation is complete,

Go to step 00020.

020 At the debugger prompt "NDP 030BUG X.X.X>" enter thefollowing command:

FW 200000 400000 1400000

This command will program the flash EPROM with the codedownloaded into the NDP030 CPU PCBA’s RAM.

When the debugger program indicates the operation iscomplete, go to step 00030.



PC 00 0001


030 Power down the sorter and remove the POC bypassjumper installed in step 00000. Rerun the POC test.


040 050

040 Replace the NDP030 CPU PCBA (card AA17) and rerun thePOC test.


070 050

050 Is another error condition being reported? 060 950

060 Follow manual procedure for displayed fault code.

End of procedure.

070 The FLASH.LO file on the NDP PC may be corrupted.Contact the Unisys Support Center for technicalassistance. The error condition and the repair proceduresfollowed should be described in a UCF.

End of procedure.

950 Verify proper operation. End of procedure



Note: The same procedure is used to resolve each of the failure codes on this page.

10100 PC 00 0100

Unexpected address exception occurred.

10110 PC 00 0110

Unexpected exception occurred.

10120 PC 00 0120

Unexpected instruction trap exception occurred.

10140 PC 00 0140

Unexpected bus error exception occurred.

10150 PC 00 0150

Unexpected spurious interrupt occurred.

10170 PC 00 0170

Unexpected interrupt exception occurred.


000 Replace the NDP030 CPU PCBA (card AA17) and rerun thePOC test.


92000 950

950 Verify proper operation.

End of procedure.



Word Loop Test Failure11500 PC 02 0010

Entrance to this failure indicates the word loop register did not respond to a legitimateaddress. This failure could be caused by:

• CAPI Configuration

− A failure of the CAPI interface cable that connects the PCI PCBA (resident in theCAPI PC) with card AA 10.

− Bad address decoding logic on the Reader/Configuration board, AA10.

− An improperly functioning PCI PCBA.

• Non-CAPI Configuration‘

− The CPU board, AA17, not putting the correct addresses on the MULTIBUSaddress bus.

− Shorts or open lines corrupting the MULTIBUS address bus. Shorts could be onany board connected to the address bus or on the bus itself. Opens could beon the bus or in a board slot connector.


For diagnosis of this error code in the Non-CAPI configuration, refer to Table 2-2 for thebackplane distribution of the MULTIBUS address bus.

The tables on the following pages are used in diagnosing PC 02 XXXX failures that occur inthe Non-CAPI configuration. The CAPI "Word Loop Test" checks the interface between theCAPI PC and card AA 10, not the AA gate MULTIBUS.



Table 2–2. Address Bus and Data Bus

ADDRESS BUS

SIGNAL CONNECTS TO

ADR0/ AA01-J1-79 thru AA15-J1-79 and AA16-J1-57 thru AA22-J1-57










ADRA/ AA01-J1-69 thru AA15-J1-69 and AA16-J1-47 thru AA22-J1-47

ADRB/ AA01-J1-70 thru AA15-J1-70 and AA16-J1-48 thru AA22-J1-48

ADRC/ AAO1-J1-67 thru AA15-J1-67 and AA16-J1-45 thru AA22-J1-45

ADRD/ AA01-J1-68 thru AA15-J1-68 and AA16-J1-46 thru AA22-J1-46

ADRE/ AA01-J1-65 thru AA15-J1-65 and AA16-J1-43 thru AA22-J1-43

ADRF/ AA01-J1-66 thru AA15-J1-66 and AA16-J1-44 thru AA22-J1-44



DATA BUS

SIGNAL CONNECTS TO

DATA0/ AA01-J1-82 thru AA15-J1-82 and AA16-J1-73 thru AA22-J1-73








DATA8/ AA10-J1-95 and AA15-J1-95 and AA16-J1-65 thru AA22-J1-65

DATA9/ AA10-J1-93 and AA15-J1-93 and AA16-J1-66 thru AA22-J1-66

DATAA/ AA10-J1-91 and AA15-J1-91 and AA16-J1-63 thru AA22-J1-63

DATAB/ AA10-J1-89 and AA15-J1-89 and AA16-J1-64 thru AA22-J1-64

DATAC/ AA10-J1-87 and AA15-J1-87 and AA16-J1-61 thru AA22-J1-61

DATAD/ AA10-J1-85 and AA15-J1-85 and AA16-J1-62 thru AA22-J1-62

DATAE/ AA10-J1-83 and AA15-J1-83 and AA16-J1-59 thru AA22-J1-59

DATAF/ AA10-J1-81 and AA15-J1-81 and AA16-J1-60 thru AA22-J1-60



11500 PC 02 0010


10 Is the sorter in the CAPI configuration? 15 100

15 Replace the CAPI interface cable thatconnects the PCI PCBA (resident within theCAPI PC) to connector P3 on the CAPRIboard, AA10.Rerun the POC test.


20 Replace AA10 and rerun the POC test.


25 Replace the PCI PCBA resident within theCAPI PC and rerun the POC test.


100 From the Error Display Screen, select <F4>to access the debugger. At the debuggerprompt "NDP 030BUG X.X.X>", enter thefollowing command:

G $10000AA<XMIT>

This will access a test routine thatcontinuously reads addresses $3FFAAAAand $3FF5555.

Using a BDM grounded to a ground post onthe AA gate backplane measure the logiclevels of the address bus at board slotAA10.

Do all the address lines toggle? 120 110

110 Repeat the measurements made in step 100at board slot AA17.

Do all the address lines toggle? 150 160

120 Replace AA10 and rerun test.


130 Is the fault code the same as before? 190 140

140 Follow new fault code. End of procedure.

150 Open exists on backplane. Using Table 2-2,trace address signal that did not toggle atAA10. Make necessary corrections. Reruntest.


160 Did more than one line fail to toggle? 170 210




170 Problem could be a short between lines onthe backplane or ground. Check for shorts.


180 The CPU card (AA17) may not be driving thesignal(s). Replace AA17 and rerun test.


190 Another card on backplane could be causingthe problem. Remove all cards from AAgate except AA08, AA10, and AA17.

Ignoring all other messages, does word looptest pass?

200 220



11500 PC 02 0010


200 Replace cards in the AA gate one at a time,rerunning POC test after inserting each card.Last card inserted before word loop testfails is suspect card. Replace it and reruntest.


210 This line could be shorted to ground. Checkfor shorts. Rerun test.


220 Problem is with one of boards remaining inAA gate. Replace each board in AA gate,one at a time, rerunning POC after eachexchange.

Ignoring all other messages, does work looptest pass?

950 230

230 Check backplane and connectors. Verify novisible damage. Make necessarycorrections. Rerun POC.





11550 PC 02 0020

Entrance to this failure indicates that data written to the word loop register was notproperly read back. This failure could be caused by

• CAPI Configuration

− A failure of the CAPI interface cable that connects the PCI PCBA (resident in theCAPI PC) with card AA 10.


− An improperly functioning PCI PCBA.

• Non-CAPI Configuration‘

− The CPU board, AA17, not putting the correct addresses on the MULTIBUSaddress bus.

− Shorts or open lines corrupting the MULTIBUS address bus. Shorts could be onany board connected to the address bus or on the bus itself. Opens could be on thebus or in a board slot connector.


For the Non-CAPI configuration, the word loop test displays both the data written to theMULTIBUS and the pattern actually read. The pattern displayed on the screen is ahexadecimal representation of the logic levels which were read on the data bus. Thehexadecimal display on the screen relates to the data bus as follows:

HEXADECIMAL A A A A

BINARY 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0

D D D D D D D D D D D D D D D D

A A A A A A A A A A A A A A A A

DATA T T T T T T T T T T T T T T T T

A A A A A A A A A A A A A A A A

F E D C B A 9 8 7 6 5 4 3 2 1 0

/ / / / / / / / / / / / / / / /

1 = HIGH (GREATER THAN 2.4 VDC)

0 = LOW (LESS THAN 0.8 VDC)

HEXADECIMAL A = BINARY 1010

HEXADECIMAL 5 = BINARY 0101

HEXADECIMAL F = BINARY 1111

HEXADECIMAL C = BINARY 1100

HEXADECIMAL 6 = BINARY 0110

For diagnosis of this error code in the Non-CAPI configuration, refer to Table 2-2 for thebackplane distribution of the MULTIBUS address bus.



11550 PC 02 0020


10 Is the sorter in the CAPI configuration?? 15 100

15 Replace the CAPI interface cable thatconnects the PCI PCBA (resident within theCAPI PC) to connector P3 on the CAPRIboard, AA10.Rerun the POC test.




25 Replace the PCI PCBA resident within theCAPI PC and rerun the POC test.


100 Measure data line(s) in error for continuity,using Table 2-2 (under line 11500), fromAA17 to AA10.

Is data line(s) in error continuous? 120 110

110 Make necessary corrections on backplane.


120 No open exists. Problem is either a short onthe backplane or a problem with the carddriving signals (AA17 or AA10). Check thebackplane for shorts between adjacent linesusing Table 2-2 (under line 11500). Makenecessary corrections.




140 Problem could be another board in AA gatepulling data line low. Remove all boardsfrom AA gate except AA08, AA10, and AA17.

Ignoring all other messages, does the wordloop test pass?

160 150



160 Replace boards in AA gate, one at a time,rerunning POC test after each board.Replace the last board inserted before testfailed.





11600 PC 02 0030

AA Gate hardware configuration error.



15 Replace the card identified as "Suspect 1",make note of the AA gate slot number, andrerun the POC test.


20 Replace the CAPI interface cable that connectsthe PCI PCBA (resident within the CAPI PC) toconnector P3 on the CAPRI board, AA10.Rerun the POC test.


25 Was card AA10 replaced in step 15? 35 30


Does problem still exist? 35 950

35 Replace the PCI PCBA resident within the CAPIPC and rerun the POC test.


40 Remove the card identified in step 15 andexamine the card socket for bent or otherwisedamaged contacts.

Are there any obvious contact problems? 45 50

45 Make corrections as required. Re-insert thecard and rerun the POC test.


50 Has the card socket for slot AA10 alreadybeen examined for physical defects?

92000 55

55 Remove the card AA10 and examine the cardsocket for bent or otherwise damagedcontacts.


60 Make corrections as required. Re-insert allcards and rerun the POC test.


100 From the POC error display screen, select"<F1> Extended error status." Is the "PrimarySuspect Component" identified on the screenpresent and properly inserted in its socket?

110 130




110 Remove power. Remove the board identified onthe screen and examine the board socket forbent or otherwise damaged contacts.


120 Make corrections as required. Insert the board,restore power, and rerun the test.

Does this part of the word loop test pass? 950 150

130 Obtain and install the board identified on thescreen.


140 Replace the board identified on the screen,restore power, and rerun the test.


150 Remove power and replace the board identifiedon the screen. Restore power and rerun thetest.







11650 PC 02 0040

AA Gate option module configuration error.



15 Replace the FRU identified as "Suspect 1"and rerun the POC test.


20 Is a "Suspect 2" identified by the error displaymessage?

25 150


30 950


35 150




45 150




55 150



100 From the POC error display screen, select"<F1> Extended error status." Is more thanone "Suspect Component" identified?

110 105

105 Replace the "Suspect Component" and rerunthe POC test.


110 Replace the "Primary Suspect Component"and rerun the POC test.


115 Are multiple "Secondary SuspectComponents" identified in the extended errormessage?

130 120

120 Replace the "Secondary Suspect Component"and rerun the POC test.





130 Replace the "Secondary Suspect Component"displayed first and rerun the POC test.


140 Replace the "Secondary Suspect Component"displayed last and rerun the POC test.


150 Check the configuration jumpers on cardAA10 using schematic SH 09.01.01 andverify that they reflect the sorters actualconfiguration. Make any necessarycorrections and rerun the POC test.






13000 PC 05 0000

PBLINK clock is not active.

13025 PC 05 0001

PBLINK clock period out of tolerance.


100 Observe the LED on bard AA08.

Is the LED blinking approx. everysecond?

120 140

120 Replace board AA10 and rerun test.




140 Turn off power and remove thefollowing boards: AA05 and AA10.Turn on power and observe the LEDon board AA08.


160 150



160 Turn off power and insert one of theboards removed previously. Turn onpower and observe the LED on boardAA08.


180 170

170 Faulty board was the one justinserted. Replace board and reruntest.


180 Have all the boards that wereremoved been reinserted?

92000 160

950 Verify proper operation. End ofprocedure.



Note: Different procedures are used to resolve each of the failure codes on this page.

13050 PC 05 0002

A 10-second timeout elapsed withoutthe reader/configuration PCBAreporting a "POC test complete"status to the sorter main processor.


100 Remove power. Replace card AA10.Restore power and rerun the test.



13075 PC 05 0003

The "Z80 OK" status in $3FFFC1Aconflicts with the "Z80 OK" status in$3FFFC69.


100 Replace board AA10 and rerun thetest.








13100 PC 05 0004

Data transferred by the sorter mainprocessor to the Reader/configurationPCBA was not correctly echoed backby the Z80 processor.


100 Replace board AA10 and rerun the test.



13125 PC 05 0005

Entrance to this failure indicates thatthe Z-80 bit did not reset from the firstcommand given.


100 Remove power. Replace card AA10.Restore power and rerun the test.



13150 PC 05 0006

Entrance to this failure indicates thatthe Z-80 and overload bits were notreset.








13175 PC 05 0007

A 2-second timeout elapsed without theReader/configuration PCBAacknowledging the transfer of datafrom the sorter main processor.

13200 PC 05 0008

The sorter main processor was unableto write data to Port 41 of theReader/configuration PCBA.

13225 PC 05 0009

The sorter main processor placed theReader/configuration PCBA in test modeby enabling Test A/B in DiagnosticControl Register 10. However, the statusof Port 40 on the Reader/configurationPCBA indicates that the appropriate testmode has not been enabled.

13250 PC 05 0010

Entrance to this failure indicates that nobus error trap occurred during reading ofempty document data buffer.


100 Remove power. Replace board AA10restore power and rerun the test.





13275 PC 05 0011

Entrance to this failure indicates that nointerrupt occurred with doc data set.


100 Replace board AA08 and rerun the test.






13300 PC 05 0012

Entrance to this failure indicates that adocument was available but there wasno interrupt or doc data.

13325 PC 05 0013

Entrance to this failure indicates thatE.O.D. Did not generate an interruptfrom buffer A.

13350 PC 05 0014

Entrance to this failure indicates that aninterrupt was generated but doc datawas not set.

13375 PC 05 0015

Entrance to this failure indicates that aninterrupt was not properly generated.







13400 PC 05 0016

Entrance to this failure indicates thatreading register "03FFFC00" did notclear and interrupt.








13425 PC 05 0017

Entrance to this failure indicates that readingregister "03FFFC10" did not clear and interrupt.

13450 PC 05 0018

Entrance to this failure indicates that nooverflow bit set on buffer A.

13475 PC 05 0019

Entrance to this failure indicates that nooverflow interrupt occurred but the bitwas set.

13500 PC05 0020

Entrance to this failure indicates that abuffer overflow did not cause aninterrupt.








13525 PC 05 0021

The Reader/configuration PCBA failed itsAC/DC PIO test

13550 PC 05 0022

The reader/configuration PCBA failed itsPIO status interrupt test.

13575 PC 05 0023

The Reader/configuration PCBA failed toprocess configuration data from$3FFFC12 and $3FFFC13 correctly.

13600 PC 05 0024

Entrance to this failure indicates thatincorrect data was received from theZ80 buffers.

13625 PC 05 0025

The Reader/configuration PCBA failed itsself test.







15000 PC 08 0001

AA gate backplane design level unknown


100 Count the number of card slots, not thenumber of cards, in the AA gate.

Are there 22 card slots? 110 120

110 The backplane is at Design Level 1(DL1). This is the backplaneconfiguration the POC test defaults to. InDL1 sorters this error can only occur ifthe POC test code has been corrupted.Follow the procedure for error code "PC00 0001" and reprogram the NDP030CPU PCBA’s flash EPROM.

End of procedure.

120 Are there 17 card slots? 130 170

130 The backplane is at Design Level 2(DL2). Check signal "DL2PLN", pin P2-86on slot AA10. This signal should begrounded for DL2 backplanes.

Is "DL2PLN" a constant low? 160 140

140 Ground "DL2PLN", pin P2-86 on slotAA10 and rerun the POC test.


150 The DL2 backplane presence signal"DL2PLN" is not properly grounded.Ensure that the signal "DL2PLN" ispermanently grounded an rerun the POCtest.




170 The backplane is at Design Level 3(DL3). Replace AA08 and rerun the POCtest.





15050 PC 08 0002

Test mode active on AA gate PCBA



20 Replace the card identified as "Suspect1" and rerun the POC test.


30 From the POC error display screen,select "<F1> Extended error status."Replace the "Primary SuspectComponent" and rerun the POC test.



15100 PC 08 0003

I-test not exclusive to the PCBA undertest.

15150 PC 08 0004

I-test failure.



20 Replace the FRU identified as "Suspect1" and rerun the POC test.






120 Replace the "Secondary SuspectComponent" and rerun the POC test.





15500 PC 09 0010

Test A failure

Entrance to this failure indicates that a problem exists between the secondary board andthe primary board. This failure could be caused by:

• The primary board fails to drive its outputs low.

• An open exists between the primary board and the secondary board.

• The secondary board fails to detect inputs properly driven by the primary board.

Use the tables below for the specificied PCBA that describe the destination of the outputsof the primary board. Tables 2-3 through 2-6 are located on the following pages. Themanual procedure follows the last table.

Table 2–3. Card AA02 TEST A/ TEST B Outputs (DL3)

SIGNAL AA02 TO

BADBOLCN J1-12 AA08-J1-16

DIRTYCN J1-14 AA08-J1-27

PKTDSTRN J1-19 AA05-J1-18

PSRINT0N J1-21 AA05-J1-21




MISSALLN J1-28 AA05-J1-31





COMPDPN J1-42 AA03-J1-34

AA05-J1-36

AA09-J1-34

AA14-J1-34

AA15-J1-34

BOLLN J1-46 AA09-J1-40

BOLLN J1-48 AA03-J1-48

BOLI1N J1-49 AA03-J1-53

AA15-J1-53

continued



Table 2–3. Card AA02 TEST A/ TEST B Outputs (DL3)(cont.)

SIGNAL AA02 TO

OKADJN J1-83 AA03-J1-83

AA05-J1-83

AA08-J1-83

INTLCK1CN J1-91 AA03-J1-91

AA05-J1-91

AA08-J1-91

JAMCN J1-93 AA03-J1-93

AA05-J1-93

AA08-J1-93

DSINTN J2-07 AA08-J2-07

STLPN J2-13 AA08-J2-15

A1BERRN J2-15 AA08-J2-17

UFMISN J2-16 AA08-J2-16

REGFAILN J2-17 AA10-J2-18

MTWEN J2-19 AA03-J2-18

AA10-J2-20

UVRST J2-20 AA08-J2-19

A1DPLN J2-21 AA08-J2-21

A1ERRN J2-22 AA08-J2-23

BOLADIRN J2-23 AA08-J2-26

JAMBNSN J2-24 AA08-J2-25

DDADN J2-35 AA10-J2-35

ALMSTFEN J2-36 AA10-J2-36

OLADN J2-38 AA10-J2-38

USADN J2-39 AA10-J2-39

BOLDN J2-41 AA10-J2-41

BOLEN J2-43 AA10-J2-43

BOLFN J2-46 AA09-J2-46

BOLHOP1 J2-47 AA08-J2-47

continued



Table 2–3. Card AA02 TEST A/ TEST B Outputs (DL3)(cont.)

SIGNAL AA02 TO

BTDPN J2-48 AA08-J2-45

BOLHOP2 J2-49 AA08-J2-49

BOLSN J2-57 AA08-J2-53

BOLBN J2-61 AA08-J2-55

BOLPE2N J2-65 AA10-J2-58

BOLPE3N J2-67 AA10-J2-60

BOLGN J2-70 AA09-J2-70

ATMDOCN J2-93 AA10-J2-96

BOLJN J2-95 AA09-J2-92


SIGNAL AA05 TO

MISORTCN J1-9 AA08-J1-14

BADBOLCN J1-10 AA08-J1-16

GFAULTCN J1-11 AA08-J1-22

FULLPOCN J1-13 AA08-J1-26

DIRTYCN J1-14 AA08-J1-27

JAMA2N J1-15 AA02-J1-15

TRACERCN J1-16 AA02-J1-16

AA08-J1-28

JAMA4N J1-17 AA02-J1-17

JAMA3N J1-19 AA02-J1-20

LOCK234N J1-40 AA08-J1-40

NPRMIS2N J1-41 AA02-J1-44

A234DPLN J2-31 AA08-J1-31

A3ERRN J2-93 AA08-J1-91

A4ERRN J2-95 AA08-J1-93

A2ERRN J2-96 AA08-J1-95




SIGNAL AA08 TO

GFTERSTN J1-10 AA02-J1-9

AA05-J1-7

ERRENBLN J1-12 AA02-J1-10

AA05-J1-8

FLWSTPDN J1-18 AA02-J1-18

AA03-J1-18

AA10-J1-18

AA14-J1-7

AA15-J1-18

JCFFX2N J1-24 AA02-J1-13

AA05-J1-12

A1CLRN J1-31 AA02-J1-24

AA10-J1-23

C2MSPN J1-50 AA02-J1-54

MOTOR1N J1-51 AA02-J1-50

AA03-J1-50

AA05-J1-51

AA09-J1-50

AA10-J1-50

AA14-J1-50

AA15-J1-50

INTLCKN J1-53 AA02-J1-53

AA05-J1-53

READCLRN J1-59 AA02-J1-59

AA03-J1-59

AAO9-J1-59

AA10-J1-59

AA14-J1-59

AA15-J1-59

PBLINKN J1-60 AA05-J1-60

AA09-J1-60



SIGNAL AA08 TO

AA10-J1-60

PPC-ON J1-81 AA02-J1-81

AA03-J1-81

AA04-J1-81

INTLCLK1N J1-85 AA02-J1-85

AA03-J1-85

AA05-J1-85

BOLERSTN J1-87 AA02-J1-87

AA03-J1-87

AA05-J1-87

PLHN J1-89 AA02-J1-89

AA03-J1-89

AA05-J1-89

PLPIHN J2-27 AA05-J2-27

STSPCN J2-35 AA10-J2-34

SWONLN J2-61 AA03-J2-53

RDYN J2-71 AA05-J2-71

A3LITEN J2-85 AA05-J2-87






SIGNAL AA10 TO

FDERRORN J1-27 AA02-J1-41

AA08-J1-33

DDINTN J2-31 AA08-J2-32

STPFDAN J2-32 AA08-J2-33

OCRPLN J2-33 AA02-J2-33

CKGMN J2-37 AA02-J2-37

AA08-J2-39

FDR2PLN J2-44 AA02-J2-44

AA08-J2-41

NREADYBN J2-82 AA08-J2-65

BTDE J2-88 AA02-J2-88

The error displays for the CAPI and Non-CAPI configurations have slightly differentnaming convention for the "primary" and "secondary" boards referenced in this procedure.

The differences are given below:

Procedure CAPI Non-CAPI

"primary" board "Suspect 1" Primary Suspect Component

"secondary" board "Suspect 2" Secondary Suspect Component



15500 PC 09 0010

Test A failure.



20 From the POC error status displayscreen, select "<F1> Extended errorstatus". Using a BDM or Fluke Model 77Digital Voltage Meter (DVM) grounded toa ground post on the AA gate backplanemeasure the logic levels of the linesgoing from the primary board to thesecondary board at the secondary board

Do any of the lines measure greater than0.8 VDC?

150 110

100 Using a BDM or a Fluke Model 77 DigitalVoltage Meter (DVM) grounded to aground post on the AA gate backplanemeasure the logic levels of the linesgoing from the primary board to thesecondary board at the secondaryboard.

Do any of the lines measure greater than0.8 VDC?

110 150

110 Remove the secondary suspect. Usingthe BDM or DVM as an ohmmeter, checkcontinuity of the line measured in step100 from the card side of the socket tothe backplane side of the socket.

Did all of the lines show propercontinuity?

140 130

130 Make appropriate corrections, insert theboard removed in step 110, restorepower, and rerun the test.

Does this portion of TEST A now pass? 140 130

140 Replace the board removed in step 110,restore power and rerun the test.

Does TEST A now pass? 950 100

150 Do any of the lines measure greater than.8 VDC but less than 2.4 VDC?

165 160

160 Replace the primary board, restorepower and rerun the test.




165 Measure the logic level of the line whichmeasured between 0.8 V and 2.4 V instep 100 at the primary card socket.

Does the line measure between 0.8 Vand 2.4 V?

170 175

170 Remove the primary suspect card.Using the BDM or DVM as an ohmmeter,check continuity of the line measured instep 165 from the board side of thesocket to the backplane side of thesocket.

Did all of the lines show propercontinuity?

160 180

175 An open exists between the lineconnecting the primary and secondaryboards. Make appropriate corrections,restore power, and rerun test.


180 Make appropriate corrections, insert theprimary board, restore power and rerunthe test.





16000 PC 09 0020

Test B Failure


• The primary board fails to drive its outputs high.

• An open exists between the primary board and the secondary board.


Use the tables below for the specified PCBA that describes the destination of the outputsof the primary board. Tables 2-3 through 2-6 are located on the previous pages. The manualprocedure follows the table index charts.

Test B failure.



20 From the POC error status displayscreen, select "<F1> Extended errorstatus". Using a BDM or Fluke Model 77Digital Voltage Meter (DVM) groundedto a ground post on the AA gatebackplane measure the logic levels ofthe lines going from the primary boardto the secondary board at thesecondary board

Do any of the lines measure less than2.4 VDC?

120 110

100 Using a BDM or a Fluke Model 77 DVMgrounded to a ground post on the AAgate backplane measure the logiclevels of the lines going from theprimary board to the secondary boardat the secondary board.

Do any of the lines measure less than2.4 VDC?

120 110

110 Remove power. Replace the secondaryboard. Restore power and rerun thetest.

Does TEST B now pass? 950 100

120 Remove power. Remove the secondaryboard and the primary board. Refer tothe destination table.

Do any of the lines from the primaryboard to the secondary board go toother boards?

130 140



130 Remove all other boards which areconnected to lines which go from theprimary board to the secondary board.Using the BDM or DVM as anohmmeter, check for continuitybetween the failed line and adjacentlines and/or between the failed line andground.

Does the ohmmeter read less than100K ohms on any line?

150 160

140 Using the BDM or DVM as anohmmeter, check for continuitybetween the failed line and adjacentlines and/or between the failed line andground.

Does the ohmmeter read less than100K ohms on any line?

150 160

150 Locate the short and make correctionsas required. Insert all boards whichwere removed in previous steps,restore power and rerun the test.


160 Replace the primary board and insertall boards that were removed inprevious steps. Restore power andrerun the test.





16100 PC 09 0030

Unable to enable TEST A on AA gatePCBA





100 From the POC error status displayscreen, select "<F1> Extended errorstatus". Replace the "Primary SuspectComponent" and rerun the POC test.





16110 PC 09 0031

INTEST not active in Main DCR withTEST A enabled.


10 Replace PCBA AA08. Make note of thePCBA replaced and rerun the POC test.



Replace the FRU identified as "Suspect2" and rerun the POC test.


120 From the POC error status displayscreen, select "<F1> Extended errorstatus". Replace the "Secondary SuspectComponent" and rerun the POC test.


130 Remove the "Secondary SuspectComponent"/"Suspect 2" just replaced.Using a BDM or DVM as an ohmmeter,check the continuity of signal "INTESTN"(J1-61) from the card side of the PCBA’ssocket to the backplane side of thesocket.

Does the line show proper continuity? 150 140

140 Make appropriate corrections, insert thecard removed in step 130, and rerun thePOC test.


150 Re-insert the card removed in step 130.Remove the card replaced in step 10.Using a BDM or DVM as an ohmmeter,check the continuity of signal "INTESTN"(J1-61) from the card side of the PCBA’ssocket to the backplane side of thesocket.




170 Re-insert the card removed in step 150.Using a BDM or DVM as an ohmmeter,check the continuity of the backplanesignal "INTESTN" (J1-61) from the cardreplaced in step 10 to the card removedin step 130.




180 Make appropriate corrections to thebackplane and rerun the POC test.





16120 PC 09 0032

Unable to disable TEST A on AA gatePCBA.





100 From the POC error display screen,select "<F1>Extended error status."Replace the "Primary SuspectComponent" and rerun the POC test.





16130 PC 09 0033

INTEST active in Main DCR with testmodes disabled.

Table 2–7. Diagnostic Control Register (DCR) addresses for AA GatePCBAs

Non-CAPI

AA Gate PCBA DCR Address

AA02 03FFFC70

AA05 03FFFC6A

AA08 03FFFC01

AA10 03FFFC63






130 Remove the "Secondary SuspectComponent" replaced in step 120. Usinga BDM or DVM as an ohmmeter, checkthe continuity of signal "INTESTN" (J1-61)from the card side of the PCBA’s socketto the backplane side of the socket.




150 Remove the card replaced in step 10.Using a BDM or DVM as an ohmmeter,check the continuity of signal "INTESTN"(J1-61) from the card side of the PCBA’ssocket to the backplane side of thesocket.




160 Make appropriate corrections, re-insertall cards removed in previous steps, andrerun the POC test.


170 If not already done, re-insert all cardsremoved in previous steps.

Using a BDM or DVM as an ohmmeter,check the continuity of the backplanesignal "INTESTN" (J1-61) from the cardreplaced in step 10 to the card removedin step 130.




190 The problem may be another PCBA inthe AA gate holding the "INTESTN" signallow. Remove option module cards AA03,AA09, and AA15, if they are present. Ifcard AA09 is a PEP/Stamp endorserinterface, be sure to remove the impactendorser presence jumper from cardAA10. Rerun the POC test.


200 Re-install the option module PCBAs.Restore the impact endorser presencejumper on card AA10, if it was removedin step 190. Rerun the POC test.

From the main error display screenselect option <F4> to access theMotorola debugger. For all of the cardsreferenced in Table 2-7 that are presentin the AA gate, read the contents of theirDiagnostic Control Registers (DCRs).This is done by entering the followingcommand at the debugger prompt:

NDP 030BUG X.X.X>MMXXXXXXXX<xmit>

..where XXXXXXXX is the DCR addressfrom Table 2-7. When the contents ofthe register are displayed, make a noteof the value (the number to theimmediate left of the question mark) andterminate the "Memory Modify" (MM)command by entering a periodcharacter, followed by <Xmit>.



Note: For more information on usingthe debugger see Section 1 ofthis manual.

Replace any PCBAs that have bits 7, 6,5, or 4 set in their DCR, unless theyhave been replaced in previous steps ofthis procedures.


230 One of the character recognition cardsmay be holding "INTESTN" low.

Is AA11 present in the AA gate? 240 950



250 Is AA12 present in the AA gate? 260 270



270 Is AA13 present in the AA gate? 280 290



290 Check the "INTESTN" signal (J1-61)across the entire backplane. Check eachcard slot and verify that no adjacent pinsare making contact with "INTESTN",resulting in a short to ground condition.Make any necessary adjustments andrerun the POC test.


300 Replace the AA gate backplane andrerun the POC test.


400 Problem is being caused by one of theoption module PCBAs.

Restore the option module PCBAs one ata time and rerun the POC test after eachcard is inserted.

Note: If the PEP/Stamp interfacePCBA is being re-installed, besure to restore the impactendorser presence jumper oncard AA10.

Replace the PCBA that, upon re-insertion, causes the "PC 09 0033"error.



Once all option cards have been re-installed or replaced, rerun the POCtest.





16200 PC 09 0040

Unable to enable TEST B on AA gatePCBA





100 From the POC error status displayscreen, select "<F1> Extended errorstatus". Replace the "Primary SuspectComponent" and rerun the POC test.





16210 PC 09 0041

INTEST not active in Main DCR withTEST B enabled.









130 Remove the "Secondary SuspectComponent"/"Suspect 2" just replaced.Using a BDM or DVM as an ohmmeter,check the continuity of signal "INTESTN"(J1-61) from the card side of the PCBA’ssocket to the backplane side of thesocket.




150 Remove the card replaced in step 10.Using a BDM or DVM as an ohmmeter,check the continuity of signal "INTESTN"(J1-61) from the card side of the PCBA’ssocket to the backplane side of thesocket.




170 Using a BDM or DVM as an ohmmeter,check the continuity of the backplanesignal "INTESTN" (J1-61) from the cardreplaced in step 10 to the card removedin step 130.




16220 PC 09 0042

Unable to disable TEST B on AA gatePCBA.










16300 PC 09 0050

INTEST not active in the Main DiagnosticControl Register when all PCBAs withtest mode capability are in TEST A mode(outputs low).


100 Replace AA 08 and rerun the POC test.


110 Remove AA 08. Using a BDM or DVM asan ohmmeter, check the continuity ofsignal "INTESTN" (J1-61) from the cardside of the PCBA’s socket to thebackplane side of the socket.


120 Make appropriate corrections, re-insertthe card and rerun the POC test.





16310 PC 09 0051

TEST A failure. PCBA placed in TEST Amode reported itself in error.







16400 PC 09 0060

INTEST not active in the Main DiagnosticControl Register when all PCBAs withtest mode capability are in TEST B mode(outputs low).


100 Replace AA 08 and rerun the POC test.


110 Remove AA 08. Using a BDM or DVM asan ohmmeter, check the continuity ofsignal "INTESTN" (J1-61) from the cardside of the PCBA’s socket to thebackplane side of the socket.


120 Make appropriate corrections, re-insertthe card and rerun the POC test.



16410 PC 09 0061

TEST B failure. PCBA placed in TEST Bmode, reported itself in error.







17625 PC 12 0005

Power on switch not indicating power inthe AC controls register.





100 Replace the FRU identified as thesuspect card and rerun the POC test.





17650 PC 12 0006

Motors signals incorrect in the ACcontrols register.





100 Replace the FRU identified as thesuspect card and rerun the POC test.

150 950

150 Check the motor up signals(MTR1UPN,MTR2UPN,MTR3UPN,MTR4UPN) coming into the FRU replacedin the previous step. These signalsoriginate in the AC controls. Secondarysuspect boards are the AC control logiccards in the first pocket module and/orthe control module. Make necessarycorrections.





17675 PC 12 0007

Entrance to this failure indicates that thejam bits did not set with TEST Aenabled.


10 Replace AA08 and rerun the POC test?






40 Replace card CABB1 in the AC controlsand rerun the POC test.





17700 PC 12 0009

Entrance to this failure indicates thatBOL and GF/TE reset did not reset thejam bits.












17725 PC 12 0010

Primary feeder/seperator status error









50 Check the primary feeder clutch/brakefuse. Make any necessary corrections.





17750 PC 12 0011

Secondary feeder/seperator statuserror.





30 Check the 3-amp fuse on card AA01.Make the necessary corrections andrerun the test.









17775 PC 12 0012

Entrance to this failure indicates that theclutch solenoid is faulty.







19000 PC 14 0001

Entrance to this failure indicates that thesolenoid on is not reset after 110 MS.


100 Remove power. Replace board AA08. Restorepower and rerun the test.






19000 PC 14 0001

Master (PEP) CPU failed POC test.

19005 PC 14 0002

Master (PEP) CPU port failure.

19010 PC 14 0003

Master (PEP) CPU ROM failure.

19015 PC 14 0004

Master (PEP) CPU internal RAM failure.

19020 PC 14 0005

PEP external RAM failure.

19025 PC 14 0006

PEP internal timer failure.

19030 PC 14 0007

PEP PTM (6840) timer failure.

19035 PC 14 0008

PEP loopback failure.








19040 PC 14 0009

Matrix status failure.


100 Check connectors (J321, J322, J323) on theprinter driver PCBA and on the cables. Make thenecessary corrections.


110 Replace the printer driver PCBA and rerun thetest.



19045 PC 14 0010

Data communication error.





19047 PC 14 0011

Dual port failure.









19048 PC 14 0012

Unexpected exception occurred while accessingendorser interface.










19050 PC 14 0013

Stamp CPU failure.

19055 PC 14 0014

Stamp port failure.

19060 PC 14 0015

Stamp ROM failure.

19065 PC 14 0016

Stamp internal RAM failure.

19070 PC 14 0017

Stamp CPU internal timer failure.

STEP PROCEDURE

Note: Stamp POC errors are not reported ifthe Stamp Error Bypass jumper isinstalled on the Main CPU board(AA17). This jumper is located atW4/W3-C on the NDP030 CPU PCBA(SH 09.01.02).

YES NO






19075 PC 14 0018

Stamp Jam: Either the Stamp is unable to moveor the home/encoder assembly is not working.



100 Check connectors (J1, J2, J3, J4) on the stampdriver board and their respective cables. Makenecessary corrections.


110 On stamp driver board, remove connector J2and place DVM probe on U9-4 (HOMEN). Rotatestamp by hand, make measurement, and thenput J2 back on the board.

Does the signal switch between logic 1 (>2.4VDC) and logic 0 (<0.8 VDC)?

140 120

120 Measure U3-10 on stamp driver board whilerotating the stamp.

Does the signal switch between 0 V and +24VDC?

830 130

130 Measure P1-7 (HOMELED) on stamp driverboard.

Does signal measure between 0.6 VDC and 1.2VDC?

830 820

140 On Stamp driver board, remove connector J2and place DVM probe on U9-10 (ENCODER).Rotate stamp by hand, make measurement, andthen put J2 back on the board.

Does signal switch from logic 1 to logic 0 tologic 1?

190 150



830 160

160 Measure P1-6 (ENCODLED) on stamp driverboard.

Does the signal measure between 0.6 VDC and1.2 VDC?

830 820



PC 14 0018

Stamp Jam (continued)


190 Using MTR disk, go to PEP/Stamp EndorserTest menu. Select Stamp Motor Phase Tests.On submenu, select Phase Driver Check. If J4on the Stamp Driver board is connected, turnpower off and remove it. Select PHASE A fromthe menu and measure Q13 collector (metalcase of transistor) on the stamp driver board.

Does it switch from 0 VDC to -24 VDC? 200 220

200 Measure Q11 collector.

Does it switch between +24 VDC and 0 VDC? 210 830

210 Measure U8-8 (CHOPAC).

Does it switch between logic 0 (<0.8 VDC) andlogic 1 (>2.4 VDC)?

240 830

220 Measure U1-8 (PHAENN).


830 230

230 On AA09, measure P1 pin 25.


800 810

240 From the MTR Phase Driver Check submenu,select PHASE B and measure Q15 collector(metal chase of transistor) on the stamp driverboard.


250 Measure Q12 collector. Does it switch between+24 VDC and 0 VDC?

260 830

260 Measure U8-9 (CHOPBD). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

300 830

270 Measure U1-4 (PHBENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 290

290 On AA09, measure P1 pin 23.


800 810



PC 14 0018



300 From the MTR Phase Driver Check submenu,select PHASE C and measure Q14 collector(metal case of transistor) on the stamp driverboard.



320 830

320 Measure U8-8 (CHOPAC). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

350 830

330 Measure U1-6 (PHCENN).Does it switch betweenlogic 0 (<0.8 VDC) and logic 1 (>2.4 VDC)?

830 340

340 On AA09, measure P1 pin 21. Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

800 810

350 From the MTR Phase Driver Check submenu,select PHASE D and measure Q16 collector(metal case of transistor) on the stamp driverboard.



370 830


400 830

380 Measure U1-2 (PHDENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 390


800 810

400 If J4 on the stamp driver board is still removed,plug it back in. Using MTR disk, go toPEP/Stamp endorser test. On submenu, selectStamp Motor Phase Test. On submenu, selectPhase Current Check. Select Standby Current.On the stamp driver board put a voltmeterbetween U2-8 and U2-12. Do not use a scope!

Does it measure between 0.2 VDC and 0.3 VDC? 450 410



PC 14 0018



410 On stamp driver board, put a meter or scopeprobe on U1-13. Does it measure more than2.4 VDC?

430 420

420 On AA09 measure P1 pin 15. Does it measuremore than 2.4 VDC?

800 810


830 440


800 810

450 In the MTR menu choose low current. On thestamp driver board put a voltmeter between U2-8 and U2-12. Do not use a scope!


460 On stamp driver board, put a meter or scopeprobe on U1-13. Does it measure less than 0.7VDC?

480 470

470 On AA09 measure P1 pin 15. Does it measureless than 0.7 VDC?

800 810


830 490


800 810

500 In the MTR menu choose medium current. Onthe stamp driver board put a voltmeter betweenU2-8 and U2-12. Do not use a scope!



530 520


800 810


830 540


800 810



PC 14 0018



550 In the MTR menu choose high current. On thestamp driver board put a voltmeter between U2-8 and U2-12. Do not use a scope!



580 570


800 810


830 590


800 810

800 Replace Stamp Control Cable. Does theproblem still exist?

97000 950

810 Replace AA09. Does the problem still exist? 97000 950

820 Replace home/encoder sensor assembly. Doesthe problem still exist?

830 Replace stamp driver PCBA. Does the problemstill exist?

97000 950

840 Replace the stamp motor. Does the problemstill exist?

97000 950




19080 PC 14 0019

Stamp home sensor error (found home positionbut could not stay home).





110 Using MTR disk, go to PEP/Stamp EndorserTests menu and select Stamp Motor PhaseTests. On submenu, select Hold Stamp.Execute T&A 3304 3654 to home adjust thehome sensor.

Is T&A setting OK? 120 130

120 Reset to correct setting.


130Go to line 19075 STEP 190.




19085 PC 14 0020

Stamp Driver Board Failure.(Hardware statusreporting stamp failure.)





110 On AA09, measure P1-9 (STAMPBADN).

Does the signal measure less than 2.4 VDC? 120 130

120 On stamp driver board place DVM probe on chipU6 pin 8 (STAMPBADN).


130Go to line 19075 STEP 190.

800 Replace Stamp Control Cable.


830 Replace stamp driver PCBA.





19090 PC 14 0021

Hole Detect Sensor Error.


100 Check the two connectors on the hole detectboard and their respective cables. Makenecessary corrections.


110 With power on, check to see if hole detect lampin the endorser track wall is on. This is locatedinside a housing about two inches upstream ofthe endorser print head.

Is the lamp on? 150 120

120 Measure J326 pin 2 on the Matrix Endorse HoleSense board. Does it measure between 4.75VDC and 5.25 VDC?

800 130

130 Measure J326 pin 2 on the Matrix Endorse HoleSense board. Does it measure between 4.75VDC and 5.25 VDC?

820 140

140 Measure J321 pin 49 on the Printer Driverboard. Does it measure between 4.75 VDC and5.25 VDC?

830 840

150 Put a probe on AA09 P2-45. Place a documentin the track in front of the hole detect lamp andthen take it away. Do this several times whilemonitoring the signal. Does the signal switchbetween logic 0 (<0.8−VDC) and logic 1 (>2.5VDC)?

850 160

160 Repeat STEP 150 with a probe on Printer Driverboard chip U24 pin 12. Does the signal switchbetween logic 0 (<0.8−VDC) and logic 1 (>2.5VDC)?

860 170

170 Repeat STEP 150 with a probe on Printer Driverboard chip U22 pin 12. Does the signal switchbetween 12 VDC and 15 VDC?

840 180

180 Replace the Hole Sense PCBA. Does theproblem still exist?

830 950

800 Replace the lamp.




PC 14 0021

Hole Detect Sensor Error (continued).


810 Replace lamp harness assembly. Does theproblem still exist?

97000 950

820 Replace the Matrix Endorse Hole Sense board.Does the problem still exist?

97000 950

830 Replace the Printer Drive Cable. Does theproblem still exist?

870 950

840 Replace the Printer Driver PCBA. Does theproblem still exist?

97000 950


860 Replace the Printer Control Harness. Does theproblem still exist?

97000 950

870 Replace the Hole Detect Harness. Does theproblem still exist?

97000 950


19095 PC 14 0022

Invalid Configuration.


100 On AA02 check jumpers J1 and J2, make anynecessary corrections.







19100 PC 15 0001

Microfilmer POC failure. MIIB MPUfailure.

19110 PC 15 0002

Microfilmer POC failure. MIIB ROMfailure.

19120 PC 15 0003

Microfilmer POC failure. MIIB RAMfailure.

19130 PC 15 0004

Dual-port RAM failure (MIIB).


100 Replace AA03, and rerun the test.







19140 PC 15 0005

MIIB A/B failure.








19150 PC 15 0006

MIIB interrupt source register error.

19160 PC 15 0007

MIIB track status register failure.


100 Replace AA03 (MIIB), rerun the test.


110 Run the Transport Basic MTRs to isolatethe problem. End of procedure.





19170 PC 15 0008

MIIB track status register B error.





19180 PC 15 0009

MIIB track status register C error.


100 Replace AA03 (MIIB), and rerun the test.


110 Run the Transport Basic MTRs to isolatethe problem. End of procedure.


19190 PC 15 0010

Serial data comm failure.


100 Verify that all cables are correctlyconnected. (Especially check datacommunication cables Controller J1, J3,and AA03-J5 corrections.) Makenecessary corrections.


110 Use the manual procedure for PC 150014 to troubleshoot the problem. Endof procedure.





19200 PC 15 0011

IPL: Track Status register error




110 Replace the Microfilm Controller PCBA,and rerun the test.



19210 PC 15 0012

IPL: Microfilmer Controller Signal Error.


100 Check connector J1 on the MicrofilmController PCBA and the cable. Makethe necessary correction.


110 Replace the Microfilm Controller PCBA.


120 Replace the cable, and rerun the test.




950 Verify proper operation. End ofprocedure



19220 PC 15 0013

IPLN/PSDIPLN Signal mismatch.









19230 PC 15 0014

Data comm test timeout error.


100 Select the Data Comm Tests from theBasic Microfilm Test menu. Select theMicrofilmer Controller Wraparound Test.Execute the test procedure, followingthe instructions displayed on the screen.

Did the test complete with all theMicrofilm Controller PCBA LEDs off?

140 110

110 Did the LEDs show the code below? 140 120

D7 OFFD6 OND5 OFFD4 OFFD3 OND2 OFFD1 OFFD0 OFF

120 Repeat the test, ensuring that you holdthe MTR switch depressed during thetest.

Is the test result completed with all theLEDs off?

140 130

130 Replace the Microfilm Controller PCBA,and retest.


140 Select the Microfilm InterfaceWraparound Test and execute.

Did the test pass? 150 160

150 Check the interface cable between J1 onthe AA gate motherboard and J1 on theMicrofilm Controller PCBA. Repair asnecessary.




19230 PC 15 0014

Data comm test timeout error


160 Execute the manual procedure for theerror code reported by the test. Repairas required.


170 Replace Microfilm Controller PCBA, andrerun the test.





19240 PC 15 0015

Data comm test echo error.


100 Select the Data Comm Tests from theBasic Microfilm Test menu. Select theMicrofilmer Controller Wraparound Test.Execute the test procedure, followingthe instructions displayed on the screen.

Did the test complete with all theMicrofilm Controller PCBA LEDs off?

140 110

110 Did the LEDs show the code below?


120 Repeat the test, ensuring that you holdthe MTR switch depressed during thetest.

Is the test result completed with all theLEDs off?

140 130



140 Select the Microfilm InterfaceWraparound Test, and execute it.


150 Check the interface cable between J1 onthe AA gate motherboard and J1 on theMicrofilm Controller PCBA. Repair asnecessary.


160 Execute the manual procedure for theerror code reported by the test. Repairas required.






19250 PC 15 0016

Microfilmer POC failure. Semaphore notcorrect.

19260 PC 15 0017

Microfilmer POC failure. Microfilm ImageInterface Board (MIIB) not responding tocommand.










19270 PC 15 0019

BOL N is reported blocked.


100 Check the document track fordocuments. Clear the track; clear theBOL. Rerun the test.


110 Replace the MIIB PCBA (AA03), andrerun the test.





19290 PC 15 0020

Microfilmer dual-port RAM failure. Sortertimed out waiting for the MIIB.








130 Check the serial interface cable forproper operation. Make the necessarycorrections.






19300 PC 15 0021

Microfilmer POC failure. Controller MPUtest failed.

19310 PC 15 0022

Microfilmer POC failure. Controller ROMfailure.

19320 PC 15 0023

Microfilmer POC failure. Controller RAMtest failed.












19330 PC 15 0024

Microfilm Controller Interrupt Sourceregister error.





19340 PC 15 0025

Microfilm Controller Configurationregister error.


100 Check jumpers W3 and W4 at BY22 andBY25. Make sure that they match theconfiguration, and rerun the POC test.








19350 PC 15 0026

Controller Input Port 4 register failure.


100 Check for Galvo PCBA present. Makethe necessary corrections.


110 Verify that all cables are correctlyconnected. (Especially check ControllerJ5.) Make the necessary corrections.




130 Replace AA03 (the MIIB PCBA), andrerun the test.



19360 PC 15 0027

Microfilm Controller solenoid/reel portfailure.


100 Check connector P5 on the MicrofilmController PCBA and the cable. Makethe necessary corrections.


110 Replace the Reel/Sol. Driver PCBA.




130 Replace the cable at J5 on the MicrofilmController PCBA.





19370 PC 15 0028

Front Lamp Control register failure.


100 Check that the Lamp Driver PCBA isinstalled and seated correctly. Reseatas required. Rerun the test.


110 Replace the Lamp Driver PCBA, andrerun the test.




130 Using the schematics, check thecontinuity of signals FLCSELN, WEN, andREN on the motherboard and P4-J4.Repair and retest.





19380 PC 15 0029

Rear Lamp Control register failure.


100 Check that the Lamp Driver PCBA isinstalled and seated correctly. Reseatas required. Rerun the test.


110 Replace the Lamp Driver PCBA, andrerun the test.




130 Using the schematics, check thecontinuity of signals RLCSELN, WEN,and REN on the motherboard and P4-J4.Repair and retest.





19390 PC 15 0030

Galvo Home Control register failure.


100 Check that the Galvo Amp PCBA isinstalled and seated correctly. Reseatas required.


110 Replace the Galvo Amp PCBA, and rerunthe test.




130 Using the schematics, check thecontinuity of signals OCSLEN, WEN, andREN on the motherboard and P4-J4.Repair, and rerun the test.





19400 PC 15 0031

Optical Status register failure.


100 Check that the OSM PCBA is installedand seated correctly. Reseat asrequired.


110 Replace the OSM PCBA, and rerun thetest.






130 Using the schematics, check thecontinuity of signals OSRSELN and RWNon the motherboard and P4-J4. Repair,and rerun the test.






19410 PC 15 0032

Microfilm Controller timer #1 failed.

19420 PC 15 0033

Microfilm Controller timer #2 failed.








19430 PC 15 0034

Galvo Amp PCBA presence failure.


100 Check that the Galvo Amp PCBA ispresent and seated correctly. Install orreseat the PCBA as required.


110 Using the schematics, check thecontinuity of signal GALVPLN on P1-55through to the Microfilm ControllerPCBA. Repair as required.





19440 PC 15 0035

Lamp Driver PCBA presence failure.


100 Check that the Lamp Driver PCBA ispresent and seated correctly. Install orreseat the PCBA as required.


110 Using the schematics, check thecontinuity of signal LAMPLN on P1-51through to the Microfilm ControllerPCBA. Repair as required.








19450 PC 15 0036

OSM PCBA presence failure.


100 Check that the OSM PCBA is presentand seated correctly. Install or reseatthe PCBA as required.


110 Using the schematics, check thecontinuity of signal OSMPLN on P1-52through to the Microfilm ControllerPCBA. Repair as required.



19460 PC 15 0037

Reel/Sol. Driver PCBA presence failure.


100 Check that the Reel/Sol. Driver PCBA ispresent and seated correctly. Install orreseat the PCBA as required.


110 Using the schematics, check thecontinuity of signal REELPLN on P1-49through to the Microfilm ControllerPCBA. Repair as required.








19470 PC 15 0038

Servo Amp PCBA presence failure.


100 Check that the Servo Amp PCBA ispresent and seated correctly. Install orreseat the PCBA as required.


110 Using the schematics, check thecontinuity of signal SERVPLN on P1-56through to the Microfilm ControllerPCBA. Repair as required.





19480 PC 15 0039

Film sensor error: Film loaded sensor,loop arm sensor, or cover closed sensorfailed.


100 Verify that all cables are correctlyconnected. (Especially check ControllerJ2 and Distribution B J2.) Make thenecessary corrections.


110 Using the MTR disk, go to the MicrofilmTests Menu. Select FILM TRANSPORT.Then run the loop arm sensor test. Ifthe test passes, select BASICMICROFILM TEST in the Microfilm TestsMenu, and select SYSTEM CHECK.





19490 PC 15 0040

Supply Encoder register failed.


100 Verify that all cables are correctlyconnected. (Especially checkDistribution A J3.) Make the necessarycorrections.





19500 PC 15 0041

Slip encoder failure.


100 Check the cable and connectors at J2and J5 on the Distribution B PCBA.Make the necessary corrections.


110 Using the MTR disk, go to the MicrofilmTests Menu. Select FILM TRANSPORT.Then select IDLER ENCODER TEST.Follow the new fault code.




19510 PC 15 0042

MFC capstan did not reach home intime.


100 Run the capstan motor MTR accordingto the following two conditions:

• WITHOUT FILM

• In nonloop mode

Is the capstan motor in a runawaycondition?

101 106

101 Verify that the following main harnessconnectors are correctly connected, andrerun the POC:

Cable from the capstan motor to theconnector SHSP2 on the Servo HeatSink Assembly

Tachometer feedback wires from thecapstan motor to connector P9 on theServo Amp PCBA


102 Replace the Servo Amp PCBA. Run thecapstan motor MTR according to thefollowing two conditions:

• WITHOUT FILM

• In nonloop mode

Is the capstan motor in a runawaycondition?

103 105

103 Replace the Servo Amp Heat SinkAssembly, and rerun the POC.


104 Replace the capstan motor, and rerunthe POC.


105 Using T&A 3304 4488, check theadjustment of the capstan velocity.Readjust if required.




19510 PC 15 0042

MFC capstan did not reach home in time


106 Verify that all cables are correctlyconnected. (Especially check the cableon the Servo Heatsink PCBA J1, J2, andJ7 and P9/P10 on the motherboard.)Make the necessary corrections.


107 Rerun the POC with film removed if notdone already. Follow the appropriatefault code.

Did PC 15 0042 occur again? 110 950

110 Using T&A 3304 4488, check theadjustment of the capstan velocity.Readjust if required.


120 Run the Film Transport MTR, and selectCAPSTAN MOTOR TEST. Remove anyfilm, and keep the film plate in a raisedposition. Select LARGE FAST MOVESand nonlooping mode.

Did the capstan rotate when youpressed the Xmit key?

130 350

130 Press key F10 to exit the routine, anddeselect the capstan motor. Rotate thecapstan roller by hand.

Is it free to rotate? 140 250

140 On microfilm backplane slot 7, connectan oscilloscope probe to J1 pin 44, andground to J1 pin 29. Time base set to20 msec/cm, auto trigger. Using a fasttwisting action, rotate the capstan rollerin a clockwise direction.

Is the waveform triangular with a peak ofapproximately 2 V?

170 150



19510 PC 15 0042



150 Check the continuity of the connectionsfrom J1 pins 29 and 44 on slot 7 of themotherboard to the capstan motor.Repair as required.


160 Replace the capstan motor, and adjustto T&A 3304 4488.


170 On motherboard slot 7, connectoscilloscope probe 1 to pin 48 andprobe 2 to pin 50. Set time base to 20msec/cm, auto trigger. Rotate thecapstan roller slowly and uniformly.

Do both channels show square waves inphase quadrature with switching levels <0.8 V to > 2.4 V?

180 190

180 Replace the Servo Amp PCBA, andadjust to T&A 3304 4488. Retest.






250 Monitor pin 25 of backplane slot 7,signal MOTEN.

Is pin 25 < 0.8 V? 260 280



19510 PC 15 0042



260 Replace the Servo Heatsink Assembly,and retest.


270 Check the continuity of the harnessbetween slot 7 and the Servo HeatsinkAssembly. Repair and retest.


280 Unplug connector P1 from the ServoHeatsink Assembly, and retest. SelectCAPSTAN MOTOR TEST from the FilmTransport Menu. Do not execute movesat this point. Monitor pin 25 ofbackplane slot 7, signal MOTEN.

Is pin 25 < 0.8 V? 290 310







350 Is the Capstan Motor Roller free torotate?

360 370



370 On motherboard slot 7, is pin 43(CAPDR) < 0.8 V?

380 500



19510 PC 15 0042



380 On motherboard slot 7, is pin 25(MOTEN) > 2.4 V?

390 500

390 On motherboard slot 7, is pin 26(CAMPWR) > 2.4 V?

400 500

400 On the Servo Heatsink PCBA, is J2 pin 2(CAPMOTHI) > 15 V?

410 440

410 On the Servo Heatsink PCBA, is J2 pin 4(CAPMOTLO) < 0.8 V?

420 440

420 Replace the Servo Heatsink PCBA, andretest.


430 Check on the Servo Heatsink Assemblythat J2 pin 5 > 23 V, J2 pin 3 is morenegative than -23 V. If not, find powersupply or harness problem, and retest.


440 Check the continuity of the connectionsfrom J2 pins 2 and 4 on the ServoHeatsink PCBA to the capstan motor.Repair as required.




500 Unplug P1 from the Servo HeatsinkAssembly. Run the Film Transport MTR,and select CAPSTAN MOTOR TEST.Remove any film, and keep the film platein a raised position. Select LARGE FASTMOVES and looping mode. Monitor slot7 pin 83 of the motherboard (CAMPWR).

Is pin 83 > 2.4 V? 510 520



19510 PC 15 0042



510 Trace signal CAMPWR from slot 7 pin 83back to slot 8 pin 83. Repair and retest.


520 On motherboard slot 7, is pin 43(CAPDR) < 0.8 V?

530 560

530 On motherboard slot 7, is pin 25(MOTEN) > 2.4 V?

540 560

540 Replace the Servo Heatsink assembly,and retest.


560 Replace the Servo Amplifier PCBA, andadjust to T&A 3304 4488. Retest.








19520 PC 15 0043

Servo Amp PCBA register read backerror.


100 Check that the Servo Amp PCBA isinstalled and seated correctly. Reseatas required.


110 Replace the Servo Amp PCBA, andretest.




130 Using the schematics, check thecontinuity of signals CDSELN, WEN, andREN on the motherboard and P4-J4.Repair and retest.



19530 PC 15 0044

Takeup loop arm sensor error.


100 Check connectors J2, J7, J8, and J9 ofthe Distribution B PCBA and the cables.Make the necessary corrections


110 Using the MTR disk, go to the MicrofilmTests Menu. Select FILM TRANSPORT.Then select LOOP ARM SENSOR TEST.End of procedure.





19540 PC 15 0045

Supply loop arm sensor error.


100 Check connectors J2, J10, J11, and J12of the Distribution B PCBA. Make thenecessary corrections.


110 Using the MTR disk, go to the MicrofilmTests Menu. Select FILM TRANSPORT.Then select LOOP ARM SENSOR TEST.


19550 PC 15 0046

Film loop error.


100 Verify that all cables are correctlyconnected. (Especially checkDistribution B J7.) Make the necessarycorrections.


105 Using the MTR disk, go to the MicrofilmTests Menu. Select FILM TRANSPORT.Then select REEL MOTOR TEST.

Does the test pass? 120 110

110 Follow the new fault code.

120 Run loop arm sensor test.



950 End of procedure.



19560 PC 15 0047

MFC Galvo home error #1Home registerreadback failure.


100 Check that the Galvo Amplifier PCBA isinstalled and seated correctly. Reseatas required.


110 Replace the Galvo Amplifier PCBA, andretest.




130 Using the schematics, check thecontinuity of signals OCSLEN, WEN, andREN on the motherboard and P4-J4.Repair and retest.





19570 PC 15 0048

MFC Galvo home error #2Galvo homevalue out of range.


100 Verify that all cables are correctlyconnected. (Especially checkDistribution A J1 and Distribution B J3and J5 from the motherboard.) Makethe necessary corrections.


105 Check F1 on the Galvo PCBA. Make thenecessary corrections, and rerun thetest.


110 Execute manual procedure MM 140007.


120 Adjust the Galvo Home Sensor to T&A3304 4447.


130 Replace the Galvo PCBA, and rerun thetest.





19580 PC 15 0049

Galvo voltage error.


100 Replace the Microfilm Controller PCBA.Rerun the test.


110 Replace AA03. Rerun the test.


120 Replace AA17. Rerun the test.





19590 PC 15 0050

MFC Galvo current error during SCAN.


100 Reseat the Galvo PCBA, and retest.


110 Using schematics and a DVM, check thatsupplies +12V, -12V, +24V, and +5Vare within +/- 10%.

Are supplies within tolerance atbackplane slot 1?

120 130

120 Replace the Galvo Amplifier PCBA, adjustto T&A 3304 4470, and retest.


130 Check the backplane connections, repairas required, and retest.




150 Check the adjustment of the galvo toT&A 3304 4470.

Does the problem still exist? 160® 950

160 Replace the galvanometer and adjust toT&As 3304 4447 and 3304 4470.





19600 PC 15 0051

Galvo voltage error.


100 Check connector J5 on the MicrofilmController PCBA and P4 on themotherboard and connecting cable.Reseat the Galvo PCBA. Rerun the test.


110 Disconnect the P4 connector on themotherboard. Measure pin 91 on slot 1using a DVM.

Does the DVM read + 5 V? 120 140



130 Replace the controller signal jumpercable (part 2193 1354).


140 Using a DVM, measure the voltage at pin47 on slot 1 of the motherboard.

Does the DVM read + 12 volts +/- 1%? 150 160

150 Replace the Galvo PCBA and adjust perT&A. Rerun the test.


160 Disconnect the J5 connector on themotherboard, and measure the voltageat pin 47 on slot 1 of the motherboard.

Does the DVM read + 12 volts +/- 1%? 170 99600

170 Reconnect J5 on the motherboard, anddisconnect the galvo connector.Measure the voltage at pin 47, slot 1.

Does the DVM measure + 12 volts +/-1%?

180 190



19600 PC 15 0051

Galvo voltage error


180 Replace the galvanometer, and adjustper T&A. Rerun the test.


190 Replace the main harness assembly(part 2493 1412).





19610 PC 15 0052

MFC Galvo POSACK active during SCAN.


100 The problem could be cable DistributionA J1. Verify that the cable is correct.Make the necessary adjustments.(Replace it if necessary.) Rerun the test.


105 Use a DVM. Is TP1 on the GalvoAmplifier PCBA a logic 0 (< 0.8 V)?

110 120

110 Replace the Galvo Amplifier PCBA, andretest.


120 Check the continuity of signal POSACKNfrom P1-73 on the Galvo Amplifier PCBAback to the Microfilm Controller PCBA.Repair if a problem is found.


130 Run the galvo MTR test, and isolate thefault using manual procedures. Repairas required.





19620 PC 15 0053

POSACK never goes active.


100 Check connector J5 on the MicrofilmController PCBA and P4 on themotherboard. Reseat the GalvoAmplifier PCBA. Rerun the test.


105 Check F1 on the Galvo PCBA. Make thenecessary corrections.


110 Using an oscilloscope, monitor thePOSACK/ signal at pin 73, slot 1 on themotherboard.

Does the signal toggle from 5 V to 0 Vduring POC?

120 140



130 Replace the controller jumper cable(part−2493−1354). Rerun the test.


140 Using an oscilloscope, monitor theSCAN signal at pin 75, slot 1 on themotherboard.

Does the signal toggle from 0 V to +5 V? 150 120

150 Replace the Galvo PCBA, and adjust perT&A. Rerun the test.






19630 PC 15 0054

Microfilm Controller Status register 5failed to clear.





19640 PC 15 0056

MFC shutter test failed.


100 Check connector P13 on themotherboard, and reseat the Reel/Sol.Driver PCBA.


110 Remove connector P13, and perform aPOC while monitoring the signal with anoscilloscope at pin 22, slot 8 on themotherboard.

Does the signal switch from 24 V to + 5V to 0 V?

130 120



130 Remove the cassette, if installed. Checkconnectors P4 and J1 on the DistributionB PCBA, J1 and P12 on the DistributionA PCBA, and all associated cables.


140 Replace the Capping Shutter SolenoidAssembly, and align per T & A.








19650 PC 15 0057

Shutter sensor failed.


100 Verify that all cables are correctlyconnected. (Especially checkDistribution A/Distribution B J1.) Makethe necessary corrections.


110 Using the MTR disk, go to the MicrofilmTests Menu. Select CAPPING SHUTTER.





950 End of procedure.

19660 PC 15 0058

MFC Reel/Solenoid control port failed.


100 Check that the Reel/Sol. PCBA ispresent and seated correctly. Install orreseat the PCBA as required.


110 Replace the Reel/Sol. PCBA, and retest.




130 Using the schematics, check thecontinuity of signals RSDSELN, REN, andWEN on the motherboard and P4-J4.Repair and retest.






19670 PC 15 0059

ID display current error.




110 Using the MTR disk, go to the MicrofilmTests Menu. Select ID DISPLAY.

End of procedure.

19680 PC 15 0060

ID display read-back error.


100 Replace the Microfilmer ID Display cableassembly and rerun the POC test.


110 Replace the Microfilmer DistributionA/Distribution B cable and rerun the POCtest.


120 Replace the Microfilmer ID Display PCBAand rerun the POC test.


130 Replace the Microfilmer Controller PCBAand rerun the POC test.


140 Replace the Distribution A PCBA andrerun the POC test.


150 Replace the Distribution B PCBA andrerun the POC test.





19690 PC 15 0061

Human readable header error.


100 Using the MTR disk, go to the MicrofilmTests Menu. Execute the HumanReadable Headers test.

End of procedure.

19700 PC 15 0062

ICM 1 current error.


100 Using the MTR disk, go to the MicrofilmTests Menu. Execute the ICM Test.

End of procedure.


19710 PC 15 0063

Height detect error.


100 Using the MTR disk, go to the MicrofilmTests Menu. Select BASIC MICROFILMTEST. Then execute the Height BOLtest.

End of procedure.



19720 PC 15 0064

ALM blocked.


100 Remove any documents or debris fromthe optical gate, and rerun the POC.


110 Using the MTR disk, go to the MicrofilmTests Menu. Select LAMPS/ALMS. Ifthe test passes, paint the optical gatewalls, and run the Lamp Intensity Densityand ALM Adjustment hardwareparameter routines.



19730 PC 15 0065

False ALM interrupt.




110 Replace the OSM PCBA, and rerun thetest.





19740 PC 15 0066

Front ALM A/D out of range.


100 Verify that all cables are correctlyconnected. (Especially checkmotherboard P11, Distribution A J4, andDistribution B J3.) Make the necessarycorrections.




120 Using the MTR disk, go to MicrofilmTests Menu. Select LAMPS/ALMS. Ifthe test passes, paint the optical gatewalls, and run the Lamp IntensityDensity and ALM Adjustment hardwareparameter routines.



19750 PC 15 0067

Rear ALM A/D out of range.






110 Using the MTR disk, go to MicrofilmTests Menu. Select LAMPS/ALMS. Ifthe test passes, paint the optical gatewalls, and run the Lamp Intensity Densityand ALM Adjustment hardwareparameter routines.





19760 PC 15 0068

MFC front lamp failure.

Note: Lamps must be off at the startof this test. Bring the motorsdown, and ensure that thelamps are off.


100 Rerun the POC.

Does the front lamp illuminate? 130 110

110 Check fuse F2 on the motherboard;replace it if required. Rerun the test.


115 Use the lamp MTR to power on the frontlamp. Check the voltage at slot 6, pin46 on the motherboard.

Is the voltage more negative than - 0.5V?

120 160

120 Replace the front lamp. Rerun the POC.


130 Reseat the Lamp PCBA. Rerun the test.


140 Replace the Lamp PCBA. Rerun thetest.


150 Check connector P8 on the motherboardand J2 on the Lamp Heatsink Assemblyand associated cables. Repair asrequired.


160 Replace the Lamp Heatsink Assembly.Rerun the test.




19760 PC 15 0068

MFC front lamp failure



170 Check connectors J2 and J1 on theLamp Heatsink Assembly, P6 and P8 onthe backplane, and associated cables.Repair as required.


180 Use the lamp MTR to power on the frontlamp. Check the Lamp PCBA backplanepin 46 with an oscilloscope or DVM.


190 200

190 Replace Lamp Heatsink Assembly.


200 Replace the Lamp Driver PCBA.





19770 PC 15 0069

MFC rear lamp failure.



100 Rerun the POC.

Does the rear lamp illuminate? 130 110

110 Check fuse F1 on the motherboard;replace it if required. Rerun the test.


115 Use the lamp MTR to power on the rearlamp. Check the voltage at slot 6, pin45 on the motherboard.


120 160

120 Replace the rear lamp. Rerun the POC.


130 Reseat the Lamp PCBA. Rerun the POC.


140 Replace the Lamp PCBA. Rerun thetest.


150 Check connectors P8 on themotherboard, J2 on the Lamp HeatsinkAssembly, and associated cables.Repair as required.


160 Replace the Lamp Heatsink Assembly.Rerun the test.




19770 PC 15 0069

MFC rear lamp failure



170 Check connectors J2 and J1 on theLamp Heatsink Assembly, P6 and P8 onthe backplane, and associated cables.Repair as required.


180 Use the Lamp MTR to power on the rearlamp. Check the Lamp PCBA signalRQDR on backplane pin 45 with anoscilloscope or DVM.


190 200

190 Replace the Lamp Heatsink Assembly.









19780 PC 15 0070

Lamp error detection circuitry failure.


100 Reseat the Lamp Driver PCBA slot 6.






140 Check the continuity of signalsRLCURON (pin 65), FLCURON (pin 66),and LSNSTST (pin 76) on themotherboard. Repair them if faulty.





19790 PC 15 0071

Front and rear lamp failure.


100 Verify that all cables are correctlyconnected. (Especially checkmotherboard connectors P6 and P8 andLamp Heatsink connectors J1.) Makethe necessary corrections.


105 Verify that F1 and F2 on themotherboard are correct. Make thenecessary corrections.


110 Do the lamps illuminate during POC? 120 160

120 Reseat the Lamp Driver PCBA.




140 Check connector P8 on themotherboard, J2 on the Lamp HeatsinkAssembly, and associated cables.Repair as required.


150 Replace the Lamp Heatsink Assembly.


160 Check connector P8 on themotherboard, J1 and J2 on the LampHeatsink Assembly, and associatedcables. Repair as necessary.


170 Replace the front and rear lamps.




19790 PC 15 0071

Front and rear lamp failure




190 Replace the Lamp Heatsink PCBA.







19800 PC 15 0072

Jumper configuration error.

AA17 indicates DP 1825; microfilmcontroller indicates NDP 1150.


100 Check the jumper configuration perSH.09.01.01 for board that does notmatch the machine configuration. Makethe necessary corrections. Rerun thePOC.


110 Is the sorter a NDP 1150? 120 130








19810 PC 15 0073

Jumper configuration error.

AA17 indicates NDP 1150; microfilmcontroller indicates DP 1825.


100 Check the jumper configuration perSH.09.01.01 for a board that does notmatch the machine configuration. Makethe necessary corrections. Rerun thePOC.


110 Is the sorter a NDP 1150? 120 130








19820 PC 15 0075

Watchdog timer test failed.


100 Remove jumper W1 at 69BB70 on theMicrofilm Controller PCBA. Place a voltmeter on pin 78 of slot 8.

Does it measure between 0 and 1 V? 120 110



120 Check the voltages coming into themicrofilm gate. Are they all within +/-5%?

130 150

130 Replace card 8 in the microfilm gate,and rerun the test.


140 Replace the cable at J5 of the MicrofilmController PCBA.




150 Replace the DC distribution harness forthe microfilm module.







19830 PC 15 0076

Controller Supply Encoder registerfailed.




110 Using the MTR disk, execute the supplyencoder routine. End of procedure.




19840 PC 15 0077

NVRAM parameter out of range

Note: Indicates someparameter value in NVRAM iseither corrupted or incorrect.


Acceptable NVRAM values (NDP 1150)LED 7D00 - 9470

(32.0 - 38.0 msec)

TED A410 - BB80(42.0 - 48.0 msec)

Lamps 80 -FE

Galvo 10 - 70(See T&A 3304 5352 for recovery)

ID delay 4E20 - 9C40(20.0 - 40.0 msec)

ALM 00 - 30

For medium-speed film (NDP 1150)

ICM 0F90 - 0FB0(3.98 - 4.02 msec)

HR HEADER AFB8 - AFD8(44.98 - 45.02 msec)

For high-speed film (NDP 1150)

ICM 03D8 - 03F8(0.98 - 1.02 msec)

HR HEADER 3A88 - 3AA8(14.98 - 15.02msec)

Acceptable NVRAM values (DP 1825):

LED 38A4 - 5014(14.5 - 20.5 msec)



19840 PC 15 0077

(continued)

NVRAM parameter out of range

Note: Indicates someparameter value in NVRAM iseither corrupted or incorrect.


TED 4C90 - 6400(19.6 - 25.6 msec)

Lamps 80 -EF

Galvo 10 - 70

ID delay 4E20 - 9C40(20.0 - 40.0 msec)

ALM 00 - 30

ICM 03D8 - 03F8(.98 - 1.02 msec)

HR HEADER 3A88 -- 3AA8(14.98 - 15.02msec)

100 Select the hardware parametersadjustment routine. Verify allparameters. If any are not in acceptablerange, make necessary corrections andrerun POC.


110 Replace he Microfilm Controller PCBA,an d rerun the test.





Does the problem still exist? 99600





19850 PC 15 0078

POC failed during NVRAM test.Could not verify values stored in RAMagainst NVRAM.

19860 PC 15 0079

NVRAM failed.









19870 PC 15 0081

BOL N is not generating correct IPLNsignal.







19880 PC 15 0082

Capstan displacement profile is out ofrange.


100 Verify that all cables are correctlyconnected. (Especially check the cableon the Servo Heatsink PCBA J1, J2, andJ7 and on the motherboard P7.) Makethe necessary corrections.


104 Rerun the POC with the film removed ifnot done already. Follow theappropriate fault code.

Did PC 15 0082 occur again? 107 950

107 Using T&A 3304 4488, check theadjustment of the capstan velocity.Readjust it if required.


110 Replace the Servo Amplifier PCBA, andadjust it to T&A 3304 4488. Rerun thePOC.


115 Replace the Microfilm Controller PCBA,and rerun the POC.


120 Run the Film Transport MTR, and selectCAPSTAN MOTOR TEST. Remove anyfilm, and keep the film plate in a raisedposition. Select LARGE FAST MOVESand nonlooping mode.

Did the capstan rotate when youpressed the Xmit key?

130 350

130 Press the F10 key to exit the routine,and deselect the capstan motor.Visually verify that the capstan hasstopped moving.

Has the capstan stopped rotating? 135 133



19880 PC 15 0082

Capstan displacement profile is out ofrange


133 Replace the Servo Heatsink Assembly,and retest. Rerun the Film TransportMTR, and select CAPSTAN MOTORTEST. Select LARGE FAST MOVES andnonlooping mode. Wait 5 seconds, andthen press the F10 key. Visually verifythat the capstan has stopped moving.

Has the capstan stopped rotating? 135 160

135 Rotate the capstan motor by hand.

Is it free to rotate? 140 250

140 On the microfilm backplane slot 7,connect an oscilloscope probe to J1 pin44 and ground it to J1 pin 29. Set thetime base to 20 msec/cm, autotrigger.Using a fast twisting action, rotate thecapstan roller in a clockwise direction.

Is the waveform triangular with a peak ofapproximately 2 V?

170 150



155 Has the Servo Heatsink Assembly beenreplaced in a previous step?

160 157







19880 PC 15 0082



170 On the motherboard slot 7, connect theoscilloscope probe 1 to pin 48 andprobe 2 to pin 50. Set the time base to20 msec/cm, autotrigger. Rotate thecapstan roller slowly and uniformly.

Do both channels show square waves inphase quadrature with switching levels <0.8 V to > 2.4 V?

99600 190




200 197




99600 950


250 Monitor pin 25 of the backplane slot 7,signal MOTEN. Is pin 25 < 0.8 V?

255 280


270 260





19880 PC 15 0082





280 Unplug connector P1 from the ServoHeatsink Assembly, and retest. Selectthe Capstan Motor MTR test; do notexecute moves at this point. Monitor pin25 of the backplane slot 7, signalMOTEN.

Is pin 25 < 0.8 V? 285 99600


300 290





350 Is the Capstan Motor Roller free torotate?

99600 370

370 On the motherboard slot 7, is pin 43(CAPDR) > 0.8 V?

380 500

380 On the motherboard slot 7, is pin 25(MOTEN) > 2.4 V?

390 500

390 On the motherboard slot 7, is pin 26(CAMPWR) > 2.4 V?

400 500

400 On the Servo Heatsink PCBA, is J2 pin 2(CAPMOTHI) > 15 V?

410 440

410 On the Servo Heatsink PCBA, is J2 pin 4(CAPMOTLO) < 0.8 V?

420 440



19880 PC 15 0082



420 Replace the Servo Heatsink PCBA, andretest.


430 Check on the Servo Heatsink Assemblythat J2 pin 5 is > 23 V and that J2 pin 3is more negative than - 23 V. If not, findthe power supply or harness problem,and retest.


440 Check the continuity of the connectionsfrom J2 pins 2 and 4 on the ServoHeatsink PCBA to the capstan motor.Repair as required.


450 Replace the capstan motor, and adjust itto T&A 3304 4488.


500 Unplug P1 from the Servo HeatsinkAssembly. Run the Film Transport MTR,and select CAPSTAN MOTOR TEST.Remove any film, and keep the film platein a raised position. Select LARGE FASTMOVES and looping mode. Monitor slot7 pin 83 of the motherboard (CAMPWR).

Is pin 83 > 2.4 V? 510 520

510 Trace signal CAMPWR from slot 7 pin 83back to slot 8 pin 83. Repair and retest.


520 On the motherboard slot 7, is pin 43(CAPDR) < 0.8 V?

530 99600

530 On the motherboard slot 7, is pin 25(MOTEN) > 2.4 V?

540 99600



19880 PC 15 0082









19890 PC 15 0083

Microfilmer dual-port RAM failure. Testdata corrupted.








130 Check the serial interface cable forproper operation. Make the necessarycorrections.



19900 PC 15 0090

LED NVRAM parameter out of range.


10 Follow manual procedure for PC 150077. End of procedure.

19901 PC 15 0091

TED NVRAM parameter out of range.





19902 PC 15 0092

Front Lamp NVRAM parameter out ofrange.



19903 PC 15 0093

Rear Lamp NVRAM parameter out ofrange.



19904 PC 15 0094

Galvo Home NVRAM parameter out ofrange.



19905 PC 15 0095

ID Display Intensity NVRAM parameterout of range.



19906 PC 15 0096

Automatic Light Meter NVRAMparameter out of range.





19907 PC 15 0097

Image Capture Mark NVRAM parameterout of range.



19908 PC 15 0098

Human Readable Header NVRAMparameter out of range.



19910 PC 15 0100

POC status not being returned by MIIB.








Section 3 Transport Basic Tests: Tracking Logicand AA Backplane Types

50000 TB 0 xxxx

This section deals with faults that occur anytime while running subtests 01-06 and that arenot specifically included in any one subtest.

50000 TB 00 0100

Unexpected bus exception occurred.


100 Replace board indicated on terminal. Reruntransport basic subtest that failed.





Transport Basic Tests: Tracking Logic and AA Backplane Types


50100 TB 00 0110

Unexpected bus exception occurred whenaddress on terminal was accessed.


100 Rerun transport basic test that was runningwhen exception occurred.


110 Find address on screen in table below, if listed.Is address listed?

120 130

120 Replace suspect board(s) associated with listedaddress, one at a time. Rerun transport basictest that caused error after replacing eachboard.







Table 3–1. Troubleshooting Chart for Unexpected BusExceptions (TB 00 0010) with the NDP 1150 68030-Based Main

CPU Board

Address Suspect Board

$0 - $00FF FFFF AA17

$0100 0000 - $0101 FFFF AA17

$0140 0000 - $015F FFFF AA17

$0180 0000 - $0180 003F AA17

$01FF FF01 - $01FF FFFF AA17

$0300 0000 - $0300 1FFF AA17

$03FF F100 - $03FF F200 AA03 (DP 1000-65 camera)

$03FF F900 - $03FF FA00 AA09 (PEP/Stamp)

$03FF E000 - $03FF E7FF AA09 (MJE)

$03FF FC00 - $03FF FC0B AA08

$03FF FC0C - $03FF FC15 AA10

$03FF FC16 - $03FF FC1A AA08

$03FF FC1B AA02

$03FF FC1C - $03FF FC1D AA08

$03FF FC30 AA08

$03FF FC32 - $03FF FC3B AA02

$03FF FC63 - $03FF FC69 AA10

$03FF FC6A - $03FF FC6C AA05

$03FF FC6D - $03FF FC6F AA05

$03FF FC70 - $03FF FC72 AA02

$03FF FC73 - $03FF FC75 AA02

$03FF FC76 - $03FF FC79 AA11, AA12

$03FF FC7A - $03FF FC7B AA11

$03FF FCC0 - $03FF FCFF AA02

$03FF FD00 - $03FF FD3F AA02

$03FF FD40 - $03FF FD7F AA05

$03FF FD80 - $03FF FDBF AA05



Table 3–2. Troubleshooting Chart for UnexpectedBus Exceptions (TB 00 0010) with the NDP 18xx

68030-Based Main CPU Board

Address Suspect Board

$0 - $00FF FFFF AA17

$0100 0000 - $0101 FFFF AA17

$0140 0000 - $015F FFFF AA17

$0180 0000 - $0180 003F AA17

$01FF FF01 - $01FF FFFF AA17

$0300 0000 - $0300 1FFF AA17

$03FF F100 - $03FF F200 AA03 (DP 1800-65 camera)

$03FF E000 - $03FF E7FF AA09 (MJE)

$03FF FC00 - $03FF FC0B AA08

$03FF FC0C - $03FF FC15 AA10

$03FF FC16 - $03FF FC1A AA08

$03FF FC1B AA02

$03FF FC1C - $03FF FC1D AA08

$03FF FC30 AA08

$03FF FC32 - $03FF FC3B AA02

$03FF FC63 - $03FF FC69 AA10

$03FF FC6A - $03FF FC6C AA05

$03FF FC6D - $03FF FC6F AA05

$03FF FC70 - $03FF FC72 AA02

$03FF FC73 - $03FF FC75 AA02

$03FF FC76 - $03FF FC79 AA11, AA12

$03FF FC7A - $03FF FC7B AA11

$03FF FCC0 - $03FF FCFF AA02

$03FF FD00 - $03FF FD3F AA02

$03FF FD40 - $03FF FD7F AA05

$03FF FD80 - $03FF FDBF AA05

$03FF FDC0 - $03FF FDFF AA05


Section 4 Transport Basic Subtest 1: TrackingLogic and AA Backplane Types

60025 TB 01 0001

"Area 3 presence" status in the main diagnosticcontrol register (address $03FF FC30, cardAA08) does not agree with "Area 3 presence"status in BOL 14 status register (address $03FFF07E, card AA05).


100 Are there more than 16 pockets present? 110 130

110 Using schematics, trace signal A3PLN(SH.01.23.05). Is it a constant low?

130 120

120 Trace signal A3PLN to determine why it is notlow. Make necessary corrections.


130 Using schematics, trace signal A3PLN(SH.01.23.05). Is it constant high?

150 140

140 Trace signal A3PLN to determine why it is nothigh. Make necessary corrections.







Transport Basic Subtest 1: Tracking Logic and AA Backplane Types



60050 TB 01 0002

Area 3 present reporting not consistent.





60075 TB 01 0003

Area 3 reported not present, but card can beaccessed.





60100 TB 01 0004

BOL 30 status register (address $03FF FDBE,card AA05) indicates Area 4 is not present.However, no bus traps occur when Area 4-specific addresses are accessed. Area 4addresses are from $03FF FDC0 - $03FF FDFF.


100 Verify jumper W10 on card AA05 (SH.09.01.01)is configured correctly. If more than 32 pocketsexist, a jumper should be present. If aconfiguration problem exists, make necessarymodifications and rerun test.


150 Replace card AA05.






60125 (NDP 1150) TB 01 0005

Configuration register 2 (address $03FF FC13,card AA10) reports PEP/stamp not present, butcard can be accessed.


100 Is Impact Endorser present jumper installed? 120 110

110 Install Impact Endorser jumper and rerun test.





60125 (NDP 18xx) TB 01 0005

Configuration register 2 (address $03FF FC13,card AA10) reports rear MJE not present, butcard can be accessed.






120 Problem is backplane signal NIEPLN open. Useschematics (SH.01.23.06) to trace and makenecessary corrections. Rerun test.






60150 TB 01 0006

Main clock card reports card in test mode.





60200 TB 01 0008

Tracking card reports card in test mode.





60250 TB 01 0010

Tracking card reports card in test mode.





60275 TB 01 0011

MICR/CONFIG reports card in a test mode.








60300 TB 01 0012

Microfilm reports card in test mode.





60375 TB 01 0015

All cards have independently indicated that theyare not in test mode. However, the maindiagnostic control register (address $03FFFC30, card AA08) is reporting a card in testmode.






120 Trace signal INTESTN starting at AA08 - J161.Make necessary corrections.





60400 TB 01 0016

All cards have independently indicated that theyare not in test mode. However, the miscellaneousdiagnostic register (address $03FF FC69, cardAA10) is reporting a card in test mode.




110 Problem is with signal INTESTN. Trace signalINTESTN starting at AA08 - J161. Makenecessary corrections and rerun test.






60425 TB 01 0017

Command result register does not report gatefault reset.

60450 TB 01 0018

Command result register did not clear afterreading.

60475 TB 01 0019

Command result register does not report. BOLreset.

60500 TB 01 0020

Command result register did not clear afterread.

60525 TB 01 0021

Interrupt source register not clear.








60550 TB 01 0022

Clock register not correct.

60575 TB 01 0023

Disposition status shows SOKL or STLP.







60600 TB 01 0024

All interlocks should be closed but TransportStatus Register 2 (address $03FF FC19, cardAA08) is reporting an open interlock.


100 Visually verify that all interlocks are closed.Rerun the test.


105 Replace AA08 and rerun the test.






130 Run the "Display Scans: Interlock Reports" MTRto determine which interlocks are being reportedas open. Use schematic SH.04.03.01 for Area 1and Area 1B interlocks. Use schematicSH.04.02.01 for pocket module interlocks.Make necessary corrections and rerun the test.






60700 TB 01 0028

Transport Status Register 2 (address $03FFFC19, card AA08) reports an open interlock, butno location can be found.









60750 TB 01 0030

User has closed all interlocks, but theinterlock(s) listed are still reporting an opencondition.


100 Start the troubleshooting switch and wiringassociated with the interlock listed. Make thenecessary corrections.


110 Replace the 4 pocket driver card associatedwith the failed baseplate assembly. Rerun thetest.






60800 TB 01 0032

Area 1 cover has been opened, but TransportRegister 2 (address $03FF FC19, card AA08) isreporting all interlocks closed.


100 Is Area 1 cover open? 120 110

110 Rerun test, following instructions to open areaone cover.




130 Replace AA08, and rerun test.


950


60825 TB 01 0033

Area 1 cover has been opened, but BOLE StatusRegister 1 reports its interlock closed.





60850 TB 01 0034

Area 1B cover has been opened, but BOL PE4Status Register 1 (address $03FF FD1E) reportsits interlock is closed.








60875 TB 01 0035

Area 1 cover has been opened, but BOLs otherthan BOL E are reporting an open interlock.





60900 TB 01 0036

Area 1B cover has been opened, but BOLs otherthan BOL PE4 are reporting an open interlock.





60925 TB 01 0037

Interlock(s) other than Area one cover reportedopen in Area 2 (3, 4).










60950 TB 01 0038

Command result register not reporting BOLreset.





60975 TB 01 0039

Not all Area 1 bias values equal zero at powerup.





61000 TB 01 0040

Not all Area 1B bias values equal zero at powerup.





61025 TB 01 0041









61050 TB 01 0042






61075 TB 01 0043






61100 TB 01 0044

An Area 1 status register not zero at power up.





61125 TB 01 0045

An Area 1B status register not zero at power up.








61150 TB 01 0046

Area 2 status register not correct.




110 Problem may be in BOL circuitry. Run subtest02 and follow appropriate fault code. End ofprocedure.


61175 TB 01 0047

Full pocket reported in Area 2/3/4.


100 Check switch and wiring for pocket. Makenecessary corrections.




120 Replace 4-pocket driver associated with pocket.Rerun test.



61200 TB 01 0048

More than one full pocket in Area 2/3/4.




110 Disconnect the 4 pocket drivers, one at a time,until the problem disappears. The last baseplateassembly disconnected is the problem area.The problem could be the card or the wiring.Make the necessary corrections.






61225 TB 01 0049

Transport status reports missort or jam in theprimary/secondary feeders.







61250 TB 01 0050

Transport status reports jam.







61275 TB 01 0051

Jam reported, but no jam can be located.








61300 TB 01 0052

Secondary hopper empty, but documents stillsensed or secondary hopper reporting notpresent and hopper empty.


100 Check jumpers per SH.09.01.01. Makenecessary corrections. Rerun test.


105 Replace BOL in secondary hopper and reruntest.









61325 TB 01 0053

Primary hopper empty, but documents stillsensed.


100 Replace BOL in primary hopper and rerun test.










61350 TB 01 0054

Illegal transport configuration.

61375 TB 01 0055

Illegal transport configuration.

Note: Transport status 2








61400 TB 01 0056

Transport Status Register 2 (address $03FFFC19, card AA08) reports Impact Endorserready. However, Configuration Register 2(address $03FF FC13, card AA10) indicates theImpact Endorser is not present.


100 Verify "Impact Endorser Present" jumper onAA10 is in place if an Impact Endorser ispresent. Make necessary corrections to ensurejumper configuration matches actualconfiguration. Rerun test.







61425 TB 01 0057

Z-80 overload reported




110 Problem is character recognition inputs. Starttroubleshooting at character recognition inputs.Make necessary corrections and rerun test.



61450 TB 01 0058

Low vacuum is sensed in Transport StatusRegister 3.


100 Follow manual procedure for TB 04 0084. Endof procedure.




61475 TB 01 0059

Microfilm reported not ready or film skip.(Microfilm present)





61500 TB 01 0060

Microfilm not present, but reported not ready, orfilm skip.





61525 (NDP 1150) TB 01 0061

PEP/Stamp report not ready.





61525 (NDP 18xx) TB 01 0061

Endorser report not ready.








61550 (NDP 1150) TB 01 0062

PEP/Stamp not present but reported not ready.





61550 (NDP 18xx) TB 01 0062

Endorser not present but reported not ready.





61575 TB 01 0063

Blackband reported in transport status.












61600 TB 01 0064

Illegal transport status. Transport Register 4(address $03FF FC1B, card AA02) is reportingone or more of the following conditions:"A1/2 INT ERR""BUFFER OVERFLOW""MISSORT ALL"





61625 TB 01 0065

Microfilm missort bit set in transport status 5.







61650 TB 01 0066

A circuit breaker has been detected open.


100 Using schematics start troubleshooting withsignal LAMPOFF (SH.03.01.02). Expected highfor no circuit breaker open. (Suspect cards areAA08 and CABB1.) Make necessary correctionsand rerun test.





61675 TB 01 0067

Dirty BOL A reported.












61700 TB 01 0068

A motor error has been detected. Triac card ormotor itself could be cause of this failure.

Note: Do not open an interlock as this willclear error.


100 Replace CABB1 and rerun test.





61725 TB 01 0069

Illegal status reported in transport status 6.








61750 TB 01 0070

Reading document data A did not causeexpected bus trap.

61775 TB 01 0071

Reading document data B did not causeexpected bus trap.

61800 TB 01 0072

Document Data Status reported, but should bezero.








61825 TB 01 0073

Microfilm status not cleared.





61850 TB 01 0074

Motor status error detected.






120 Is the control module present? 130 99000

130 Replace DABB1 and rerun test.



61875 TB 01 0075

Area 4 not present, but motor 4 bit not set.












61900 TB 01 0076

Area 4 motor reported up.









61925 TB 01 0077

Motors reporting ready.







61950 TB 01 0078

C/M Power error reported.












61975 TB 01 0079

Area One cover IEC magnetic switch is sensedclosed.


100 Using schematics, start troubleshooting switchand wiring signal A1SINT (SH.03.01.03)expected constant high for open switch. Makenecessary corrections and rerun test.



62000 TB 01 0080

Main power switch is sensed off.


100 Using schematics, start troubleshooting switchand wiring signal PWRSWNC (SH.02.01.01)expected constant high with power on. Makenecessary corrections and rerun test.



62025 TB 01 0081

Driver status one not reporting correctly.




110 Replace CABB1 and rerun the test.






62050 TB 01 0082

Driver status not reporting open interlock.









62075 TB 01 0083

Driver status two not reporting correctly.







62100 TB 01 0084

Driver status two not reporting correctly.








62125 TB 01 0085

Double document switch sensed closed.


100 Check double document switch adjustment perT&A 2974 3069. Make corrections and reruntest.


110 Using schematics, start troubleshooting withsignal PIEZON (SH.04.04.01) expected high.Make corrections and rerun test.





62150 TB 01 0086

Configuration Register 2 indicates card AA09 ispresent. However, addresses on card AA09 arenot accessible to the main CPU.


100 Visually verify the presence of card AA09 in theAA gate.

Is the card present? 110 160

110 Replace card AA09 and rerun test.


120 Does the same error code occur? 140 130

130 Follow manual procedure for new error code.End of procedure











62160 TB 01 0087

Configuration Register 2 indicates card AA03 ispresent. However, addresses on card AA03 arenot accessible to the main CPU.


100 Visually verify the presence of card AA03 in theAA gate.

Is the card present? 110 160




130 Follow manual procedure for new error code.End of procedure








62170 TB 01 0088

Configuration Register 2 indicates card AA09 ispresent. The main CPU can access the MJE dualport RAM. However, the presence of BOLs J, K,L, and M cannot be verified. This indicates noMJE is installed.










63000 TB 02 0001

An open interlock has been reported inTransport Register 2, but the open interlockcannot be located in the BOL status register.






950 Verify proper operation. End of procedure..

63050 TB 02 0002

Area one bad BOL bit did not set.








63100 TB 02 0003

BOL S (secondary feeder) bad. BOL did not set.







63150 TB 02 0004

Rear MJE present, but BOL J & K not reportingcorrectly.

Note: Should be reporting bad BOL.







63200 TB 02 0005

Rear MJE not present, but BOL J and BOL Kreporting bad BOL.








63250 TB 02 0006

BOLs status reporting bad, but transport statusdoes not agree.







63300 TB 02 0007

"Dirty/Bad BOL" did not reset in area one after aBOL reset.






120 Replace AA05 and rerun test






63350 TB 02 0008

Bad BOL reported at BOL N, P, Q, but microfilmnot present.

63400 TB 02 0009

Area 1B reports an unexpected/incorrect BOLsignal.

63450 TB 02 0010

"Bad/Dirty BOL" did not reset in area 1B after aBOL reset.








63500 TB 02 0011

Area two reports an unexpected/incorrect BOLsignal.





63550 TB 02 0012

No last pocket found in area two.





Note: Make sure jumpers are set correctly on4-pocket driver cards.

63600 TB 02 0013

Area two reports more than one last pocket.








63650 TB 02 0014

Area two BOL reporting Bad/Dirty BOL status,but transport status does not agree.





63700 TB 02 0015

"Bad/Dirty BOL" did not reset in area two afterBOL reset.





63750 TB 02 0016

Area three reports an unexpected/incorrect BOLsignal.








63800 TB 02 0017

No last pocket found in area 3.





63850 TB 02 0018

More than one last pocket found in area three.








63900 TB 02 0019

Area 4 reports incorrect BOL status or lastpocket error.





63950 TB 02 0020

BOL count incorrect in area 1.










64000 TB 02 0021

BOL count check incorrect in area 1B.





64050 TB 02 0022

BOL count check incorrect in area 2.





64100 TB 02 0023






64150 TB 02 0024









64200 TB 02 0025

"Jam" bit did not set in transport status whenforced in area one.







64250 TB 02 0026

"Jam" bit did not set when forced in area one.







64300 TB 02 0027

"Jam 1" bit did not set in driver status whenforced in area 1.










64350 TB 02 0028

"Jam" did not clear in driver status whenBOL/GF/TE reset.





64400 TB 02 0029

"Jam" did not clear with BOL/GF/TE reset.







64450 TB 02 0030

"Jam" bit did not set in transport status whenforced in area 1B.








64500 TB 02 0031

"Jam" bit did not set in when forced in area 1B.









64550 TB 02 0032

"Jam 2" bit did not set in driver status whenforced in area 1B.







64600 TB 02 0033

"Jam" did not clear after GF/TE/BOL reset.








64650 TB 02 0034

"Jam" bit did not set in transport status whenforced in area 2.





64700 TB 02 0035

"Jam" bit did not set when forced in area two.









64750 TB 02 0036











64800 TB 02 0037

"Jam" bit did not clear after GF/TE/BOL reset.





64850 TB 02 0038






64900 TB 02 0039

"Jam" bit did not set when forced in area 3.










64950 TB 02 0040








65000 TB 02 0041






65050 TB 02 0042









65100 TB 02 0043

"Jam" bit did not set when forced in area 4.







65150 TB 02 0044













65200 TB 02 0045






65250 TB 02 0046

BOL status incorrect in area 1.





65300 TB 02 0047

The motors are not down is being reported.










65350 TB 02 0048

Feed error being reported.









65400 TB 02 0049

Transport status 4 incorrect.





65450 TB 02 0050

Unexpected value in transport status 5.










65500 TB 02 0051

Unexpected value in driver status 1.







65550 TB 02 0052

Microfilm BOLs (BOLN, BOLP, BOLQ) aredetected but the microfilm is not declared as aninstalled option.





65600 TB 02 0053

Area 1B reports an unexpected/in correct BOLstatus.








65650 TB 02 0054

The motors are not down is being reported.







65700 TB 02 0055

Feed error being reported.





65750 TB 02 0056

Transport status 04 incorrect.





65800 TB 02 0057

Unexpected value in transport status five.










65850 TB 02 0058

Unexpected status in driver status 1.







65900 TB 02 0059

BOL bias value out-of-range.

Note: BOLs in reverse video on screen areout-of-range.


100 Clean/adjust/or replace indicated BOLs. Reruntest.





65950 TB 02 0060

Bad BOL reported.


100 Run BAD BOL routine under SCANS. DoesSCANS report only one bad BOL?

105 106

105 Replace or adjust bad BOL. Rerun basic subtest02.


106 Are any bad BOLs reported? 107 210

107 Are all BOLs for an area reported bad? (such as,Area 1, Microfilm, Area 2, Area 3, Area 4)

108 110

108 A short probably exists on the common LED lineor phototransistor line for the problem area.This can be due to a single shorted LED orphototransistor, a harness short, a backplaneshort, a 4-pocket driver card (if the problem is inthe pockets), or the tracking logic card for thatarea. For corrections check the CCC table insection 15 under BOLs. If a circuit malfunctionis determined to be the cause, resume thisprocedure at step 110.

110 Is the bad BOL in area 1 or area 1B? 120 150

120 Replace AA02 and rerun basic subtest 02.


150 Is bad BOL(s) in area 2, area 3, or area 4? 160 210

160 Replace AA05 and rerun basic subtest.







68000 TB 03 xxxx

This section deals with diagnosis of problems inthe transport (tests pocket lights, BOLs, andmotors). If the sorter Power On Confidence(POC) test did not pass, proceed to Section 2 onPOC diagnosis. This section provides diagnosticinformation based on the assumption that thePOC test was passed.




68000 TB 03 0001

Area 2 (reject - 14) reports more than one lastpocket in the machine.

68010 TB 03 0002

Area 2 (Reject - 14) reports a last pocket that isinvalid, or a valid last pocket is reported in Area2 with Area 3 (15 - 30) present.


110 Check for proper jumper configurations on the 4Pocket Driver cards and AA05 per SH.09.01.01.Make necessary corrections and rerun test.Does the problem still exist?

120 950

120 Check voltages of +5V and +24V on all 4Pocket Driver cards. Repair as needed andrerun test.


130 Temporarily configure the machine as a shorterunit to isolate a faulty 4 Pocket Driver card or aRibbon Cable connected to them.

Caution: Exercise caution if you performthe following steps while power is applied:

1. Disconnect the Ribbon Cable betweensections. The last section still connectedbecomes the last pocket in the machine.Add "Last in machine" jumper to thissection.

2. Remove AA05 jumpers "More than 16Pockets" or "More than 32 Pockets" asneeded.

Rerun test as needed on the shortened machine.Power down to replace components asindicated. If unit still fails as a 4 pocketconfiguration, replace AA05 and rerun the test.


140 Replace the first 4 Pocket Driver card and rerunthe test. Does the problem still exist?

150 950

150 Replace the signal cable to the first 4 PocketDriver card and rerun the test. Does theproblem still exist?

99000 950




68020 TB 03 0003

Not all bias values after last pocket equal zero.








68030 TB 03 0004

No last pocket found in Area 2 (Reject - 14)andArea 3 (15 - 30) does not exist.

68030 TB 03 0005

Area 3 (15 - 30) reports more than one lastpocket in the machine.

68050 TB 03 0006

Area 3 (15 - 30) reports a last pocket that isinvalid or a valid last pocket is reported in Area 3with Area 4 (31 - 46) present.





68060 TB 03 0007

Not all bias values after last pocket in Area 3equal zero.








68070 TB 03 0008

No last pocket found in the machine.

68080 TB 03 0009

No last pocket found in the machine.

68090 TB 03 0010

Area 4 (31 - 46) reports more than one lastpocket or a last pocket that is invalid.






68100 TB 03 0011

Not all bias values past last pocket in Area 4equal zero.





68110 TB 03 0012

STOP/START bar is stuck.




110 Using schematics, measure signals SSBARN(SH.01.23.09) and SWSTPNO (SH.04.04.01)

Are all signals a constant high? 130 120

120 Use schematics to trace signal that is not highto determine why it is not high. Make necessarycorrections.

Is signal a constant high now? 950 99000

130 Using schematics measure SWSTSPNC(SH.04.04.01).

Is signal constant low? 99000 140

140 Use schematics to trace signal that is not highto determine why it is not high. Make necessarycorrections.

Is signal a constant low now? 950 99000





68120 TB 03 0013

Transport status not correct.

Note: Indicates JAM, or motors up, path noclear, status indicating sorter ready.





68150 TB 03 0016

Microfilm Not Ready or film skip reported, butmicrofilm not present.





68160 TB 03 0017

Microfilm Not Ready or film skip reported, butmicrofilm not on.










68170 TB 03 0018

Microfilm Not Ready or film skip being reported,but microfilm not powered on.







68180 TB 03 0019

Low double is sensed in Transport StatusRegister 3.



68190 TB 03 0020

No "Z-80 OK" bit set in transport status, butMICR board reports "Z-80 OK".








68200 TB 03 0021

"Z-80 OK" not being reported.







68210 TB 03 0022

Z-80 Overload.







68220 TB 03 0023

BOL A reported dirty. (Black band not enabled.)












68230 TB 03 0024

Configuration register number 1 read differsfrom write.





68240 TB 03 0025

BOL A reports dirty.







68250 TB 03 0026

Circuit breaker reporting open.








130 Using schematics, measure signal LAMPOFF(SH.03.01.02).

Is signal a constant high? 99000 140

140 Using schematics, trace why signal LAMPOFF isnot constant high. Make necessary corrections.






68270 TB 03 0028

Microfilm incorrectly reports "ON".




110 Microfilm switch bad. Make necessarycorrections.



68280 TB 03 0029

Incorrect Not Ready status being reported.





68290 TB 03 0030

Motor error sensed.










68300 TB 03 00031

Power switch reporting not "ON".




110 Problem is with power switch. Make necessarycorrections.



68310 TB 03 0032

IEC switch for Area 1 or microfilm sensed open.


100 Does the machine have IEC switches? 110 120

110 Make sure IEC switches work correctly. Makenecessary corrections and rerun test.


120 Are IEC bypass plugs in? 140 130

130 Insert plugs and rerun test.










68320 TB 03 0033

Control module power error sensed.








130 Using schematics, trace signal CMPERR/starting on SH.01.23.02 to determine why signalis not a constant high. Make necessarycorrections.


140 Problem could be +24 V missing from CM ACcontrols. Trouble shoot per power supplymanual procedures. End of procedure.


68321 TB 03 0034

Control module power error sensed.










68322 TB 03 0035

STOP/START bar not sensed.


100 Follow procedure for error code TB 03 0128.End of procedure.

68323 TB 03 0036

Motors did not come up in allotted time.







68324 TB 03 0037

"Motor 3 Up" bit not set, but Area 3 not present.


100 Replace CABB1, and rerun the test.








68325 TB 03 0038

Motor up bits not correct.


100 Replace DABB1, and rerun the test.







68326 TB 03 0039

Motor 4 bit not set as expected.












68327 TB 03 0040

Area 4 motor failed to turn on.


100 Replace DABC1 and rerun test.









68328 TB 03 0041



100 Replace DABG1 and rerun test.












68330 TB 03 0042



100 Replace CABC1 and rerun test.







68340 TB 03 0043



100 Replace CABG1 and rerun test.







68350 TB 03 0044

Motors reporting Not Ready and motor stilldown.










68360 TB 03 0045

Motors reporting Not Ready.





68370 TB 03 0046

Motors Ready, but still reporting down.





68380 TB 03 0047

Primary hopper is sensed as not being empty.


100 Replace BOL in primary hopper. Rerun test.










68390 TB 03 0048

Secondary hopper is being sensed as notempty.


100 Replace BOL in secondary hopper and reruntest.







68400 TB 03 0049

JAM or bad BOL reporting in Area 1.







68410 TB 03 0050

JAM or bad BOL reporting in Area 1B.










68420 TB 03 0051

An error has been detected from transportinterface in Area 2.







68430 TB 03 0052











68440 TB 03 0053








68450 TB 03 0054

Sorter reporting Not Ready, but no cause can befound.










68460 TB 03 0055

Motor JAM test failed.











68470 TB 03 0056

Motors did not jam during Jam test.







68480 TB 03 0057

Not all motors jammed during Jam test.


100 Replace TRIAC board for motor that did not jamand rerun test.





68490 TB 03 0058

Endorser reporting not ready. However,Configuration Register 2 indicates card AA09(NIE/MJE interface) is not present.


100 Visually verify the presence of the Front MJE orRear MJE.

Are any of these modules present in the sorter? 120 200




135 Follow manual procedure for new error code.End of procedure.




160 Troubleshoot starting with signal NIEPLN onSH.01.23.06.





220 Troubleshoot starting with signal NIENRDYN onSH.01.23.10.





68500 TB 03 0059

Endorser reporting not ready. ConfigurationRegister 2 indicates card AA09 (MJE interface) ispresent. Diagnostics are unable to verifypresence of MJE(s).


100 Visually verify the presence of the Front MJE orRear MJE.

Are any of these modules present in the sorter? 120 300








220 Troubleshoot starting with signal NIEPLN onSH.01.23.06.


300 Is card AA09 present? 310 330

310 Remove card AA09 and rerun test.









68510 TB 03 0060

Endorser reporting not ready. ConfigurationRegister 2 indicates card AA09 (MJE interface) ispresent. Rear MJE reported present and turnedoff. Front MJE reported not present.


100 Is the front MJE present in the sorter? 110 140





140 Is the Rear MJE switch on the sorter’s frontcontrol panel on?

160 300




180 Troubleshoot signal EPWRSWN on SH.01.23.10back to the Rear MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments.








350 Troubleshoot starting with signal NIENRDYN onSH.01.23.10.





68520 TB 03 0061

Rear MJE switch reported on after user hasturned switch off.






130 Troubleshoot signal EPWRSWN on SH.01.23.10back to the Rear MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments.





68530 TB 03 0062

Endorser reporting not ready. ConfigurationRegister 2 indicates card AA09 (MJE interface) ispresent. Rear MJE reported not present orturned off. Front MJE reported turned off.


100 Troubleshoot signal FMJEONN on SH.01.23.06back to the Front MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments. Rerun test.










170 Is a Rear MJE present in the sorter? 180 99000

180 Troubleshoot signal EPWRSWN on SH.01.23.10back to the Rear MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments. Rerun test.









68540 TB 03 0063

Front MJE switch reported on after user hasturned switch off.






130 Troubleshoot signal FMJEONN on SH.01.23.06back to the Front MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments.





68545 TB 03 0064

Endorser reporting not ready. ConfigurationRegister 2 indicates card AA09 (MJE interface) ispresent. Rear MJE reported not present orturned off. Front MJE reported turned off.









140 Troubleshoot signal FMJEONN on SH.01.23.06back to the Front MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments. Rerun test.



160 Is a Rear MJE present in the sorter? 170 99000

170 Troubleshoot signal EPWRSWN on SH.01.23.10back to the Rear MJE switch on the front controlpanel of the sorter. Check switch functionalityand make necessary adjustments. Rerun test.




Sorter did not go Not Ready.




68550 TB 03 0101

Sorter did not go Not Ready.

68560 TB 03 0102

Sorter Not Ready.








68570 TB 03 0103

Sorter did not go "Not Ready" after lightingreject pocket light.





68580 TB 03 0104

Reject pocket "Lite" bit not set.







68590 TB 03 0105

Incorrect pocket light on in Area 2.










68600 TB 03 0106

Pocket light(s) indicated on in Area 3 or 4.





68610 TB 03 0107

BOL signal detected in Area 2 that should not beilluminated.







68620 TB 03 0108









68630 TB 03 0109








68640 TB 03 0110






68650 TB 03 0111











68660 TB 03 0112






68670 TB 03 0113

BOL pocket signal detected in Area 2 thatshould not be illuminated.







68680 TB 03 0114









68690 TB 03 0115

BOL lite signal detected in Area 2 that should notbe illuminated.







68700 TB 03 0116






68710 TB 03 0117

BOL lite signal detected in Area 2 pocket thatshould not be illuminated.








68720 TB 03 0118

BOL lite signal detected in Area 3 pockets thatshould not be illuminated.







68730 TB 03 0119

Status register indicates lights on in Area 4.





68740 TB 03 0120

Area 2 or 3 reports incorrect pocket lights.








68750 TB 03 0121

Status register reports extra lights on in Area 4.







68755 TB 03 0122

Sorter did not go ready after a BOL/TrackError/Gate Fault Reset


100 Run MACHINE READY STATUS MTR (Menuselection 10 from the DISPLAY SCANS submenu)to determine cause(s) of not ready condition.Make necessary adjustments and rerun Subtest03.










68760 TB 03 0123

All pocket lights did not light in Area 2.







68770 TB 03 0124

All pocket lights did not light in Area 3.







68780 TB 03 0125

All pocket lights did not illuminate in area 4.










68790 TB 03 0126

All pocket lights did not illuminate in sequence.


100 Check for obvious bad LEDs. Replace asneeded and rerun test. Does the problem stillexist?

110 950

110 Follow manual procedure for TB 03 0001.


68800 TB 03 0127

No last pocket can be found.


100 Follow manual procedure for TB 03 0001.

68900 TB 03 0128

Start / Stop switch or bar broken.


100 Replace AA08


120 Replace AA05.


130 Did the problem occur when testing the controlpanel start/stop switch?

140 150

140 Troubleshoot starting with signals SWSTPNO andSWSTPNC on SH.04.04.01.


150 Troubleshoot starting with 4 pocket driver cardyou were testing with signal SSBAR234N onSH.04.01.02.





71000 TB 04 xxxx

This section deals with problems in the transport (tests document flow). If the sorterpower-on confidence (POC) test did not pass, proceed to the section for POC diagnosis.This section provides diagnostic information based on the assumption that the systempassed the POC tests.




71000 TB 04 0001

Interrupt source register did not clear.




110 Is AA08 J2-62 constant low? 130 130




150 Is the microfilm option installed? 160 99000





71010 TB 04 0002

Illegal system configuration.


100 Check all jumpers per SH.09.01.01. Verify thatall jumpers are correct. Make necessarycorrections.








71020 TB 04 0003

Feeder 1 clutch engaged.





71030 TB 04 0004

Separator 1 is reported on.







71040 TB 04 0005

Feeder 2 clutch/brake error.


100 Check all associated fuses. Make the necessarycorrections.







71050 TB 04 0006

The microfilm reports Not Ready.



150 Is the microfilm power on? 200 300

200 Power the microfilm off. Did it power off? 250 300

250 Rerun test. Does the problem still exist? 300 950

300 Is AA03 J2-61 a constant high? 350 400







600 Camera On switch circuit is defective. Usingschematics, trace signals CAMSWNC andCAMSWNO starting on sheet 02.01.01 andmake necessary correction. Rerun test.


900 A second failure exists which reports the samefailure code. Rerun MTR and follow failure codedisplayed.




71060 (NDP 1150) TB 04 0007

The PEP/Stamp reports Not Ready.


100 Is the PEP/Stamp option installed? 150 160








71060 (NDP 1800) TB 04 0007

The Endorser reports Not Ready.


100 Is the Endorser option installed? 110 150

110 Is the Endorser power on? 120 140

120 Power the Endorser off.

Did the Endorser power off? 130 140

130 Rerun test.


140 Is AA09 J2-60 a constant high? 150 160







200 Endorser switch circuit is defective. Usingschematics, trace signals SWRMJENC,SWFMJENC, SWRMJENO, and SWFMJENOstarting on sheet 02.01.01 and make necessarycorrections. Rerun test.


900 A second failure exists which reports the samefailure code. Rerun MTR and follow failure codedisplayed.




71070 TB 04 0008

The sorter is Not Ready for no apparent reason.

Note: This condition can be caused bypressing the START/STOP bar morethan once.


100 Are the motors up and running? 110 120

110 Stop motors, reset sorter and rerun test.


120 Run MTR routine to display Not Ready condition.Correct any Not Ready conditions and reruntest.




150 Is the microfilm module installed? 160 170









71080 TB 04 0009

Sorter Ready did not cause a transport interrupt.







71090 TB 04 0010

Separator 2 is reported on.





71100 TB 04 0011

UNASSIGNED FAULT CODES

TB 04 0011 through TB 04 0015



71160 TB 04 0016

Sorter did not respond with a feeding signal.


















71170 TB 04 0017

Feeding did not cause a command resultinterrupt.





71180 TB 04 0018

A document was fed from the secondary feederinstead of the primary feeder.





71190 TB 04 0019

A feeder jam was not declared.









71200 TB 04 0020

A secondary feeder jam is sensed.

Notes: This condition is caused by:1. Belt off the feeder pulley.2. A secondary feeder jam.3. Feeder too slow.4. Feeder clutch/brake problem.5. Fuse blown or missing for feeder

clutch/brake.6. Document slippage.


100 Inspect the secondary feeder area for obviousreasons. Make necessary corrections and reruntest.






150 Troubleshoot the problem by tracing FD2CTHDstarting on schematic sheet 01.23.05 (J1 - P13).Determine why clutch it not engaging and makenecessary correction and rerun test.





71210 TB 04 0021

A primary feeder jam is sensed.

Notes: This condition is caused by:

1. Belt off the feeder pulley.

2. A primary feeder jam.

3. Feeder too slow.

4. Feeder clutch/brake problem.

5. Fuse blown or missing for primaryclutch/brake.

6. Document slippage.


100 Inspect the primary feeder area for obviousproblems. Make necessary corrections andrerun test.




125 Replace AA02 and retest.


130 Troubleshoot the problem by tracing FDCTHstarting on schematic sheet SH.01.23.05 (J1 -P9). Determine why clutch is not engaging andmake necessary correction and rerun test.






71220 TB 04 0022

It took too long to declare a valid document atBOL B.


100 Verify proper jumper configuration on all cardsper SH.09.01.01. Rerun subtest 04.


105 Does the document just fed have a damagedleading edge?

110 120

110 Rerun test with new document.


120 Rerun test to see if failure is reported again.







71230 TB 04 0023

Feeder did not shut off as expected.









71240 TB 04 0024

Too much time for document to get from BOL Bto BOL C (upper).

Note: It took too long for a document to getfrom the BOL B to BOL C (upper). Thiscan occur because of poor transportcontrol of the document.


100 Check this area of transport for possible causes.Make necessary corrections and run the testseveral times to determine if the problem is anelectronic failure.

Is it a probable electronic failure? 110 120



120 Problem is mechanical. Make necessarycorrections and rerun test several times.





71250 TB 04 0025

Too much time for document to get from BOL C(lower) to BOL D.

Note: It took too long for a document to getfrom the BOL C (lower) to BOL D. Thiscan occur because of poor transportcontrol of the document.











71260 TB 04 0026

Too much time for document to get from BOL Dto BOL E.

Note: It took too long for a document to getfrom the BOL D to BOL E. This canoccur because of poor transportcontrol of the document.


100 Check all jumpers per SH.09.01.01. Makenecessary corrections.


105 Check this area of transport for possible causes.Make necessary corrections and run the testseveral times to determine if the problem is anelectrical failure.









71270 TB 04 0027

Too much time for document to get from BOL Eto BOL F.

Note: It took too long for a document to getfrom the BOL E to BOL F. This canoccur because of poor transportcontrol of the document.











71280 TB 04 0028

Too much time for document to get from BOL Fto BOL G.

Note: It took too long for a document to getfrom the BOL F to BOL G. This canoccur because of poor transportcontrol of the document.












71290 TB 04 0029

STLP occurred too early.







71300 TB 04 0030

No document available signal was detected.







71310 TB 04 0031

Cannot reset the batch ticket enable bit.










71320 TB 04 0032

More than 127 characters were received from adocument.





71330 TB 04 0033

Too much time for document to get from BOL Gto BOL H.

Note: It took too long for a document to getfrom the BOL G to BOL H. This canoccur because of poor transportcontrol of the document.












71340 TB 04 0034

No STLP was received.







71350 TB 04 0035

Too much time for document to get from BOL Hto BOL J.

Note: It took too long for a document to getfrom the BOL H to BOL J. This canoccur because of poor transportcontrol of the document.











71360 TB 04 0036

Too much time for document to get from BOL Jto BOL K.

Note: It took too long for a document to getfrom the BOL J to BOL K. This canoccur because of poor transportcontrol of the document.











71370 TB 04 0037

Too much time for document to get from BOL Kto BOL N.

Note: It took too long for a document to getfrom the BOL K to BOL N. This canoccur because of poor transportcontrol of the document.











71380 TB 04 0038

Too much time for document to get from BOL Hto BOL N.

Note: It took too long for a document to getfrom the BOL H to BOL N. This canoccur because of poor transportcontrol of the document.











71390 TB 04 0039

Too much time for document to get from BOL Nto BOL P.

Note: It took too long for a document to getfrom the BOL N to BOL P. This canoccur because of poor transportcontrol of the document.












71400 TB 04 0040

Too much time for document to get from BOL Pto BOL Q.

Note: It took too long for a document to getfrom the BOL P to BOL Q. This canoccur because of poor transportcontrol of the document.


100 Verify proper jumper configuration on all cardsper SH.09.01.01. Run subtest 04.









71410 TB 04 0041

Area 1 or Area 1B window circuit failure.







71420 TB 04 0042

An almost feed error occurred.

Notes: This condition can be caused by the following:

1. Damaged document.2. Poor mechanical control of document prior

to the read station, including the feeder.


100 Using undamaged documents rerun the test.


110 Check the mechanical portion of the transportfrom the feeder to the read station. Make anynecessary corrections and rerun test.






150 Recheck all mechanics from the feeder to theread station. Make necessary corrections andrerun test.






71425 TB 04 0043

UNASSIGNED FAULT CODE

71430 TB 04 0044

The reject pocket gate did not open on anoverride.







71440 TB 04 0045

Speedup not correct.







71450 TB 04 0046

An underspaced feed occurred.

Notes: This condition can be caused by thefollowing:




100 Using undamaged documents rerun the test.


110 Check the mechanical portion of the transportfrom the feeder to the read station. Make anynecessary corrections and rerun test.











71460 TB 04 0047

Too much time for document to get from BOL Qto BOL R.

Note: It took too long for a document to getfrom the BOL Q to BOL R. This canoccur because of poor transportcontrol of the document.








130 Problem is mechanical. Make the necessarycorrections and rerun test several times.





71470 TB 04 0048

Too much time for document to get from BOL Kto BOL R.

Note: It took too long for a document to getfrom BOL K to BOL R. This can occurbecause of poor transport control ofthe document.








140 The problem is mechanical. Make the necessarycorrections, and rerun the test several times.





71480 TB 04 0049

Too much time for document to get from BOL Hto BOL R.

Note: It took too long for a document to getfrom BOL H to BOL R. This can occurbecause of poor transport control ofthe document.




105 If the microfilmer is present, verify that boardAA03 is in place. Make the necessarycorrections.








140 The problem is mechanical. Make the necessarycorrections, and rerun the test several times.





71490 TB 04 0050

An overlength feed error occurred.

Notes: This condition can be caused by thefollowing:




100 Using undamaged documents, rerun the test.


110 Check the mechanical portion of the transportfeeder to the read station. Make any necessarycorrections and rerun test.











71500 TB 04 0051

Two documents were reported on a single itemfeed command.

Note: This condition may occur due to poordocument quality or poor documentalignment in the hopper.


100 Rerun test.




130 Troubleshoot FDBRK starting on schematicsheet 04.04.01.Determine why the brake is notholding the primary feeder wheel. Makenecessary corrections and rerun test.






71510 TB 04 0052

A document was able to go beyond the rejectpocket even though the reject gate wasselected.


100 Check all pocket driver fuses.

Are all fuses OK? 110 105

105 Replace the bad fuse, and rerun the test.


110 Refer to the T&A gate adjustment. Make thenecessary mechanical corrections, and rerun thetest.




130 Replace the 4 Pocket Driver/Interface board onthe first 4-pocket baseplate assembly (pocket Rthrough 2), and rerun the test.



71520 TB 04 0053

Path clear delay time was too short.












71530 TB 04 0054

Flow stop occurred too early.





71540 TB 04 0055

Path clear time is too long.









71550 TB 04 0056

A flow stop was not indicated at path clear.








71560 TB 04 0057

A transport status interrupt was not set at flowstop.





71570 TB 04 0058

Document data interrupt did not occur.









71580 TB 04 0059

Fault code not used.








71590 TB 04 0060

No SOKL was detected in response to adisposition.





71600 TB 04 0061

No disposition status interrupt was received withSOKL response to a disposition.





71610 TB 04 0062

An unexpected STLP occurred.










71620 TB 04 0063

An override was detected at the reject pocket,but no feed error was reported.









71630 TB 04 0064

The reject pocket closed on an item assigned toit.












71640 TB 04 0065

No feeding response has detected on a demandfeed from the secondary feeder.





71650 TB 04 0066

A document was fed from the primary feederinstead of the secondary feeder.







71660 TB 04 0067

A false double document feed was reported.


100 Rerun test several times to establish that doubledocument feeds are not actually occurring.

Are double document feeds occurring? 110 120

110 Make necessary corrections and rerun test.


120 Perform double document T&A’s and checkhoses, filters and sensor. Make necessarycorrections and rerun test.


130 Run switch test DDD.

Is DDD switch test bad? 140 150

140 Replace the double document switch and reruntest.












71670 TB 04 0068

A MICR overflow is detected.









71680 TB 04 0069

The pocket information register reports missortall.











71690 TB 04 0070

The primary hopper is sensed as empty.


100 Is the primary hopper empty? 110 120

110 Load primary hopper and rerun test.


120 Clean the primary hopper BOL, check itsadjustment and rerun test.




140 Replace primary hopper BOL and rerun test.






71700 TB 04 0071

The secondary hopper is reporting empty.


100 Is the secondary hopper empty? 110 120

110 Load secondary hopper and rerun test.


120 Clean the secondary hopper BOL, check itsadjustment and rerun test.




140 Replace BOL and rerun test.



71710 TB 04 0072

A buffer overflow EWTE is reported.







71720 TB 04 0073

Feed error occurred.

100 See Section 16, "Condition, Cause, CorrectionTables", line 100000 for diagnosis of theproblem. End of procedure.



71730 TB 04 0074

A jam is detected.

Note: The screen indicates the firstjam/missort location. Suspect amechanical problem.


100 Was there a real document jam? 110 120

110 Check the involved area for mechanicalproblems. Make the necessary correction, andrerun the test.


120 Is the reported jam in Area 2 or the MJE? 130 210







160 Clean and inspect the BOL reporting the jam,and rerun the test.


170 Replace the BOL reporting the jam, and rerunthe test.




220 Clean and inspect the BOL reporting the jam,and rerun the test.


230 Replace the BOL reporting the jam, and rerunthe test.


240 Replace the 4-Pocket Driver/Interface board forthe 4-pocket baseplate assembly reporting thejam, and rerun the test.

99000 950



TB 04 0074

A jam is detected.

Note: The screen indicates the firstjam/missort location. Suspect amechanical problem.


250 Is the problem in Area 3? 260 270








310 Replace CABB1 and rerun the test.





71740 TB 04 0075

A missort is detected.

Note: The screen indicates the firstjam/missort location.


100 Is the report missort location BOL N, BOL P, orBOL Q?

110 130

110 Probable cause is poor drive in the microfilm.Check the transport, drive belts, and vacuum.Rerun the test.



130 Is the reported missort in Area 2? 140 190



160 Clean and inspect the BOL reporting the missort,and rerun the test.


170 Replace the BOL reporting the missort, andrerun the test.


180 Replace the 4-Pocket Drive board for the 4-pocket baseplate assembly reporting themissort. Rerun the test.





TB 04 0075

A missort is detected.

Note: The screen indicates the firstjam/missort location.
















71750 TB 04 0076

A full pocket was detected.

Note: The location of the full pockets arelisted on the screen.


100 Are any full pockets listed on the screen? 110 150

110 Are the pockets actually full? 120 130

120 Empty the full pockets and rerun test.


130 Replace full pocket switches indicated on thescreen and rerun test.

140 950

140 Replace 4 Pocket Driver/Interface boardassociated with the full pocket condition andrerun test.









71760 TB 04 0077

A gate fault is detected.

Note: The gate fault location is displayed onthe screen.


100 Check the gate adjustment for the gatereporting the gate fault, make necessarycorrections and rerun test.


110 Is the reported gate fault in Area 2, Area 3, orArea 4?

120 130



130 Replace the 4 Pocket Driver/Interface boardassociated with the reported gate fault and reruntest.


140 Replace the gate assembly associated with thereported gate fault and rerun test.







71770 TB 04 0078

An Area 2/3/4 track error occurred.

Note: The track error locations are displayedon the screen.


100 A location in Area 2, Area 3, or Area 4 reportedon the screen?

110 120

110 Replace AA05 and rerun test. Does the problemstill exist?

120 950


190 950


99000 950




71780 TB 04 0079

A dead BOL was detected.

Note: The dead BOL locations are displayedon the screen.


100 Is only one dead BOL being reported on thescreen?

110 130

110 Clean the BOL reported as dead and rerun test.


120 Replace the BOL reported as dead and reruntest.


130 Are the reported dead BOLs in Area 1? 140 150



150 Are dead BOLs in Front MJE (L and M),Microfilmer (N, P, and Q), or Image module (I1,I2, and I3)

160 180





200 Replace the 4 Pocket Driver/Interface boardassociated with the reported dead BOLs andrerun test.







71800 TB 04 0081

The motors were not ready without the causebeing detected.


100 Rerun test to determine if this failure code or adifferent failure code will be reported.

Was a different failure code reported? 120 150

120 Follow the new failure code - end of procedure.



160 Replace CABC1 and rerun test.


170 Replace CABG1 and rerun test.


180 Does unit have more than 16 pockets? 190 210



200 Replace DABG1 and rerun test.


205 Replace DABC1 and if present rerun test.








260 Replace AA03, if present, and rerun test.






71810 TB 04 0082

An Area 1/2 track error occurred.

Note: This condition can result if an item fliesout of the track just prior to the rejectpocket or the area prior to the rejectpocket has poor drive.


100 Inspect the area prior to the reject pocket formechanical problems, make necessarycorrections and rerun test.







71820 TB 04 0083

No normal feed error can be located.


100 Rerun test. Does the problem still exist? 110 950










71830 TB 04 0084

Low vacuum is sensed in Transport StatusRegister 3.

Note: In this procedure, the labels LVSW1,OCRVSW1, and OCRVSW2 are vacuumtransport switches on SH.04.04.01.

LVSW1 = vacuum transport switchconnected to AAJ8 - 12

OCRVSW1 = OCR vacuum transportswitch connected to AAJ8 - 5

OCRVSW2 = OCR vacuum transportswitch connected to pole 2 of LVSW1


100 Inspect the double document vacuum system,make necessary corrections, and rerun test.


110 Is an OCR unit present in the sorter? 120 130

120 Inspect the OCR vacuum system. Make surethat the transport belts have not cut either of theOCR vacuum hoses. Vacuum should bemeasured. It should be approximately 3 incheson one port and 4.5 inches on the other port.Make necessary adjustments.


130 Remove connector J8 (SH 01.23.02) from AAgate slot 8. Measure the voltage on pin 5 of thecable. Is the pin consistently at ground potentialwithout any intermittent voltage fluctuations?

140 200

140 Remove card AA08 from the AA gate and verifythat the signal LOVACSW (J2 - 8/P79) onSH.01.23.09 is not shorted to any otherbackplane signals. Make the necessaryadjustments. Re-insert card AA08 andconnector J8. Rerun test.








71830 TB 04 0084


200 Replace connector J8, and rerun the test.


210 Short vacuum transport switch LVSW1. If anOCR unit is present, short OCR vacuumtransport switches OCRVSW1 and OCRVSW2 (SH04.04.01). Rerun test.


220 Verify that the ground for the switches is good.Make necessary adjustments, remove switchjumpers, and rerun test.


230 Remove all vacuum switch shorts except forvacuum transport switch LVSW1. Rerun test.


240 Replace the low vacuum switch LVSW1, andrerun the test.


250 Is an OCR unit present in the sorter? 260 99000

260 Remove the short for LVSW1 and short the OCRvacuum switch OCRVSW1. Rerun the test.


270 Replace the OCR vacuum switch OCRVSW1 andrerun the test.


290 Remove the short for OCRVSW1 and short theOCR vacuum switch OCRVSW2. Rerun the test


300 Replace the OCR vacuum switch OCRVSW2 andrerun the test.


400 Remove the short for OCR vacuum switchOCRVSW2. Short vacuum transport switchLVSW1 and OCR vacuum transport switchOCRVSW1. Rerun the test.


410 Replace the low vacuum switch LVSW1, and theOCR vacuum transport switch OCRVSW1. Rerunthe test.




71830 TB 04 0084


420 Remove the short for switch OCRVSW1. ShortOCR vacuum transport switch OCRVSW2. Rerunthe test.


430 Replace the low vacuum switch LVSW1, and theOCR vacuum transport switch OCRVSW2. Rerunthe test.


440 Remove the short for switch LVSW1. Short OCRvacuum transport switches OCRVSW1 andOCRVSW2. Rerun the test.


450 Replace the OCR vacuum transport switchesOCRVSW1 and OCRVSW2. Rerun the test.


460 Replace all vacuum transport switches: LVSW1,OCRVSW1, and OCRVSW2. Rerun the test.





71840 TB 04 0085

Sorter went Not Ready for no apparent reason.



120 950


130 950


150 950


160 950


170 950


200 950

200 Replace CABB1 and rerun test. Does theproblem still exist?

210 950

210 Replace DABB1 and rerun test. Does theproblem still exist?

99000 950





71850 TB 04 0086

Bit 0 was erroneously set in the end ofdocument flag word from the MICR readinterface.





71860 TB 04 0087

A mechanical window track error (MWTE)occurred.

Note: The location of the MWTE is displayedon the screen.


100 Is the MWTE location displayed on the screen? 110 950

110 Inspect the area of the reported MWTE for poormechanical document control, make necessaryadjustments and rerun test.








71870 TB 04 0088

The reject pocket opened for no apparentreason.







71880 TB 04 0089

An item took too long to be detected by thepocket prior to its assigned pocket and no othererrors were detected.












71890 TB 04 0090

The pocket gate prior to the assigned pocketdid not close.









71900 TB 04 0091

The assigned pocket gate did not open.









71910 TB 04 0092

The Make Not Ready command failed to makethe sorter Not Ready.







71920 TB 04 0093

No MICR detected on first document fed.

Note: This failure code is reported if (1) theread system is inoperative, (2) a blankdocument was the first document inthe primary feeder or (3) the required2730 5192 test document was fedupside down.


100 Was the first document in the primary feeder a2730 5192 test document?

110 120

110 Was the document correctly positioned in theprimary feeder to be read?

130 120

120 Rerun subtest 4 with a 2730 5192 testdocument correctly positioned for read as thefirst document.


130 Have the MICR READ SYSTEM adjustments beenverified since the problem occurred?

140 170





160 The problem is in the character recognitionlogic. Troubleshoot using T&A 2974 4901 andcharacter recognition MTRs. Start with subtest01. End of procedure.

170 Rerun subtest 4 but answer "YES" to firstquestion (first document feed right side up?) and"NO" to all other questions on the screenconcerning the read system.


180 Follow the new failure code. End of procedure.





71930 TB 04 0094

Document data mismatch.


100 Was the first document in the primary feeder the2730 5192 test document?

120 110

110 Rerun test using the 2730 5192 test document.




160 The problem is in the character recognitionlogic. Troubleshoot using T&A 2974 4901. Endof procedure.


71940 TB 04 0095

Too much time for document to get from BOL Qto BOL I1.

Note: It took too long for a document to getfrom the BOL Q to BOL I1. This canoccur because of poor transportcontrol of the document.












71950 TB 04 0096

Too much time for document to get from BOL Kto BOL I1.Note: It took too long for a documentto get from the BOL K to BOL I1. This canoccur because of poor transport control of thedocument.









71960 TB 04 0097

Too much time for document to get from BOL Hto BOL I1.

Note: It took too long for a document to getfrom the BOL H to BOL I1. This canoccur because of poor transportcontrol of the document.












71970 TB 04 0098

Too much time for document to get from BOL I1to BOL I2.

Note: It took too long for a document to getfrom the BOL I1 to BOL I2. This canoccur because of poor transportcontrol of the document.









71980 TB 04 0099

Too much time for document to get from BOL I2to BOL I3.

Note: It took too long for a document to getfrom the BOL I2 to BOL I3. This canoccur because of poor transportcontrol of the document.











71990 TB 04 0100

Too much time for document to get from BOL I3to BOL R.

Note: It took too long for a document to getfrom the BOL I3 to BOL R. This canoccur because of poor transportcontrol of the document.








130 Problem is mechanical. Make the necessarycorrections and rerun test several times.






72000 TB 04 0101

Too much time for document to get from BOL Hto BOL L.

Note: It took too long for a document to getfrom the BOL H to BOL L. This canoccur because of poor transportcontrol of the document.









72010 TB 04 0102

Too much time for document to get from BOL Kto BOL L.

Note: It took too long for a document to getfrom the BOL K to BOL L. This canoccur because of poor transportcontrol of the document.












72020 TB 04 0103

Too much time for document to get from BOL Lto BOL M.

Note: It took too long for a document to getfrom the BOL L to BOL M. This canoccur because of poor transportcontrol of the document.









72030 TB 04 0104

Too much time for document to get from BOL Mto BOL N.

Note: It took too long for a document to getfrom the BOL M to BOL N. This canoccur because of poor transportcontrol of the document.












72040 TB 04 0105

Too much time for document to get from BOL Kto BOL N.

Note: It took too long for a document to getfrom the BOL K to BOL N. This canoccur because of poor transportcontrol of the document.









72050 TB 04 0106

Too much time for document to get from BOL Mto BOL I1.

Note: It took too long for a document to getfrom the BOL M to BOL I1. This canoccur because of poor transportcontrol of the document.











72060 TB 04 0107

Too much time for document to get from BOL Mto BOL R.

Note: It took too long for a document to getfrom the BOL M to BOL R. This canoccur because of poor transportcontrol of the document.













72070 TB 04 0108

Rear MJE not ready.


100 Run MJE MTRs for the rear MJE to determine thecause of the not ready condition. Make anyadjustments specified by the MJE MTR’s andrerun Subtest 04. Does the test pass?

950 110



130 Has AA09 been replaced in a previous manualprocedure?

160 140

140 Replace AA09 and rerun test. Does the testpass?

950 150



950 170


180 Troubleshoot starting with signal NIENRDYN(J2 - 9/P60) on SH.01.23.10.





72080 TB 04 0109

Front MJE not ready.


100 Run MJE MTR’s for the front MJE to determinethe cause of the not ready condition. Make anyadjustments specified by the MJE MTR’s andrerun Subtest 04. Does the test pass?

950 110




160 140


950 150



950 170







72090 TB 04 0110

Front or Rear MJE not ready.


100 Run MJE MTR’s to determine the cause of thenot ready condition. Make any adjustmentsspecified by the MJE MTR’s and rerun Subtest04. Does the test pass?

950 110




160 140


950 150



950 170







72100 TB 04 0111

NIE/MJE not present but reporting not ready.


100 Visually verify the presence of the NIE, FrontMJE, or Rear MJE. Are any of these modulespresent in the sorter?

110 200


950 115




950 135



950 155



950 185


190 Troubleshoot starting with signal NIEPLN(J1 - 9/P58) on SH.01.23.06.



950 210







72110 TB 04 0112

Too much time for document to get from BOL Mto BOL PE1.

Note: It took too long for a document to getfrom BOL M to BOL PE1. This canoccur because of poor transportcontrol of the document.









72120 TB 04 0113

Too much time for document to get from BOL Kto BOL PE1.

Note: It took too long for a document to getfrom BOL K to BOL PE1. This canoccur because of poor transportcontrol of the document.











72130 TB 04 0114

Too much time for document to get from BOL Hto BOL PE1.

Note: It took too long for a document to getfrom BOL H to BOL PE1. This canoccur because of poor transportcontrol of the document.









72140 TB 04 0115

Too much time for document to get from BOLPE1 to BOL PE2.

Note: It took too long for a document to getfrom BOL PE1 to BOL PE2. This canoccur because of poor transportcontrol of the document.











72150 TB 04 0116











72160 TB 04 0117













72170 TB 04 0118

Too much time for document to get from BOLPE4 to BOL N.

Note: It took too long for a document to getfrom BOL PE4 to BOL N. This canoccur because of poor transportcontrol of the document.









72180 TB 04 0119

Too much time for document to get from BOLPE4 to BOL l1.

Note: It took too long for a document to getfrom BOL PE4 to BOL l1. This canoccur because of poor transportcontrol of the document.











72190 TB 04 0120

Too much time for document to get from BOLPE4 to BOL R.

Note: It took too long for a document to getfrom BOL PE4 to BOL R. This canoccur because of poor transportcontrol of the document.











73000 TB 05 xxxx

This section deals with diagnosis of problems in the transport (tests Beam of Light [BOL]timing). If the sorter Power-On Confidence (POC) test did not pass, proceed to the POCsection for diagnosis. This section provides diagnostic information based on theassumption that the POC tests passed.

Note: Errors in this area can be caused by improper feed rate or poorly adjusted first

accelerator roller. If faults continue, execute speed test in system exerciser to

verify feed rate.




73000 TB 05 0010

No val signal at test BOL.


100 Run subtest 04. Does subtest 04 pass? 130 110

110 Follow fault code for subtest 04. End ofprocedure.

130 Replace AA02 and rerun the test. Does theproblem still exist?

150 950


99000 950


73050 TB 05 0020

Val stuck on at test BOL.


100 Run subtest 04. Does subtest 04 pass? 120 110

110 Follow fault code for subtest 04. End ofprocedure.


150 950


99000 950





73100 TB 05 0030

No track error at test BOL.



99000 950


73150 TB 05 0040

No flow stopped interrupt in allotted time.


100 Rerun subtest 04. Does test pass? 120 110

110 Follow fault codes for subtest 04. End ofprocedure.






73200 TB 05 0050

Missort did not occur.










73250 TB 05 0060

Document did not missort to reject pocket.



140 950


150 950


99000 950


73300 TB 05 0070

No feed error occurred.







73350 TB 05 0080

Wrong MTWE location.









73400 TB 05 0090

Wrong number of documents sorted to pocket0.



140 950

140 Replace AA05 and rerun the test. 150 950


73450 TB 05 0100

Too many documents sorted before flowstopped.





73500 TB 05 0110

No MTWE error on document data.










73550 TB 05 0120

Timing error on first document.


100 Rerun subtest 05.







73600 TB 05 0130

No document data available.


100 Rerun subtest 04 of basic tests. Follow faultcodes for subtest 04. End of procedure.


73650 TB 05 0140

Sorter too late to pocket.


100 Rerun subtest 04. Does subtest 04 pass? 120 140





140 Follow subtest 04 fault codes. End ofprocedure.




73700 TB 05 0150

Wrong number of documents sorted to rejectpocket.




110 Run the feed rate utility from the exerciser andverify that the feed rate is within tolerance forthe primary feeder. The feed rate window forthe NDP 1150 is:

970 - 1020 dpm

The feed rate window for the NDP 1825 is:

1746 - 1836 dpm.

If the feed rate is out of tolerance, make thenecessary adjustments and rerun the test.





73750 TB 05 0160

BOLs time out of tolerance.

Note: BOLs listed on screen


100 Fault can be caused by using wrong documents.Are documents 6 inches long?

110 105

105 Rerun test with 6 inch documents. Does theproblem still exist?

110 950

110 Check T&A for the transport area indicated byBOLs. (Refer to FT&R Document for T&Apackages.) If BOL out of tolerance is pair B toC, check primary feeder and separator T&A. Ifout of tolerance pair is S to B, check secondaryfeeder and separator T&A.


120 Are both BOLs pocket BOLs? 130 140


99000 950

140 Is one of the BOLs a pocket BOL? 150 160


160 950


99000 950





73800 TB 05 0170

No last pocket can be found.



73850 TB 05 0180

Unused fault code.




130 950




73900 TB 05 0190

Timeout waiting for sorter to go ready.




130 950







73950 TB 05 0200

Invalid reader configuration.


100 Check jumpers on AA10 per card jumperinstructions on schematic SH.09.01.01.


110 Replace AA10 and rerun.



74000 TB 05 0210

BOL B to C timing error.


100 Check T & A for aligner stations acceleratorrollers, aligner disks, feeder, and separators.





74050 TB 05 0220

Double document error in BOL test.


100 Check double doc vacuum & feeders per T & Aand rerun test.










74100 TB 05 0230

Overlength document error in BOL test.


100 Check feeders per T & A and rerun test.





74150 TB 05 0240

Underspace document error in BOL test.


100 Check feeders per T & A and rerun test.





74200 TB 05 0250

Mechanical timing window error in BOL test.


100 Is MTWE location in Microfilm area? 110 120

110 Check transport vacuum for area in error. Makenecessary corrections.


120 Refer to FTR 1 package for mechanicaladjustments in area indicated. End ofprocedure.





74250 TB 05 0260

Electrical timing window error in BOL test.







74300 TB 05 0270

Almost feed error in BOL test.


100 Indicates possible worn or misadjusted feedersor transport rollers. Refer to T & A. End ofprocedure.

74350 TB 05 0280

Timeout sorter did not go ready.


100 Replace AA08 and rerun test. Does problem stillexist?

99000 950


74400 TB 05 0290

Timeout before sampling complete.


100 Is hopper empty? 110 120

110 Load hopper with more document and reruntest. Does the problem still exist?

130 950

130 Rerun subtests 03 & 04. Follow appropriatefault codes. End of procedure.




74450 TB 05 0300

No track error at test BOL.







77000 TB 06 xxxx

This section deals with diagnosis of problems in the transport (test error detection anddocument flow.) If the sorter POC test did not pass, proceed to Section 2 for POCdiagnosis. This section provides diagnostic information based on the assumption that thePOC tests have passed.


77000 TB 06 0100

Invalid reader configuration.


100 Check jumpers on AA10 per card jumperinstruction, schematic SH.09.01.01.

Are all jumpers correct? 110 950




77050 TB 06 0110

Timeout waiting for sorter to go ready.



Does test pass? 120 110








77100 TB 06 0120

No document data available.


100 Rerun subtest 04 and follow fault codes. End ofprocedure.

77150 TB 06 0130

Sorter too late to pocket.













77200 TB 06 0140

Error in Double Document (DD) count.


100 Check DD vacuum for obstructions in hoses,rerun test.


110 Is the double document count 0? 120 150



130 Replace DD vacuum switch and rerun test.




150 Recheck T & A and feed error test deck perSEI# 3125 6332 in FT&R package. End ofprocedure.


77250 TB 06 0150

Error in overlength document count.


100 Refer to SEI 3125 6332, rerun test.








77300 TB 06 0160

Error in underspaced document count.







77350 TB 06 0170

Error in mechanical timing window count.







77400 TB 06 0180

Error in almost feed error count.










77450 TB 06 0190

Error in batch ticket count.


100 Check adjustments of black bands per T & A3304 2631 and rerun test.









77550 TB 06 0210

Counter Failure. Test failed to drive resettableitem counter.






120 Replace Resettable Item Counter.





77700 TB 06 0240

Item counter count does not agree with numberof documents feed.


110 Replace counter in error and rerun test. Doesthe problem still occur?

120 950







Section 10 E13B Double Read CharacterRecognition Test

This section includes failure codes for the E13B Double Read Character Recognition Test.


90000 CR 0

0 0010

Processor test failed.

90050 CR 00 0020

Result PROM test failed.

90100 CR 00 0030

Maintenance register test failed.

90150 CR 00 0040

Quantizer test failed.

90200 CR 00 0050

Segmentation test failed.

90250 CR 00 0060

MICR test failed.

90300 CR 00 0070

FIFO test failed.

90350 CR 00 0080

Maintenance RAM test.





E13B Double Read Character Recognition Test



90350 CR 00 0090

Analog test failed.


100 Analog test can fail if write head cable isdisconnected or faulty. Check write head cableand verify that it is connected properly and novisible problems exist. Make necessarycorrections.


110 Verify proper jumper positions on AA11 andAA12 per SH.09.01.02. Make necessarycorrections.









90400 CR 00 0100

Test failure reported but no fault code received.


100 This error may occur if the write head cable isdisconnected or faulty. Check write head cableand verify that it is connected properly and novisible problems exist. Make necessarycorrections.


110 Verify proper jumper positions on AA11 andAA12 per SH.09.01.02. Make necessarycorrections











90450 CR 00 0110

Cable connecting analog board to read headreport disconnected.


100 Check cable to assure proper connection.

Is cable properly connected? 120 110

110 Make necessary corrections and rerun test.





90500 CR 00 0120

Character Recognition POC did not complete.


100 Verify proper jumper locations per SH.09.01.01and SH.09.01.02. Make necessary corrections.










90550 CR 00 0130

Unexpected bus exception occurred duringcharacter recognition POC test.


100 Verify proper jumper locations per SH.09.01.01and SH.09.01.02. Make necessary corrections.







90600 CR 01 0010

Character Recognition failed I-Test.


100 Replace suspect board and rerun test.





TEST A FAILURE

90700 CR 02 0010


• The primary board fails to drive its outputs low, or

• An open line exists between the primary board and the secondary board, or


Use the following table to find the destination of the outputs of the primary board.

Table 10–1. Card AA12 TESTA/TEST B Outputs

SIGNAL AA12 OUTPUTS TO

TI0 J2-9 AA11-J2-9

TI1 J2-10 AA11-J2-10

TI2 J2-11 AA11-J2-11

TI3 J2-12 AA11-J2-12

TI4 J2-13 AA11-J2-13

TI5 J2-14 AA11-J2-14

TI6 J2-15 AA11-J2-15

TI7 J2-16 AA11-J2-16

TI8 J2-17 AA11-J2-17

TI9 J2-18 AA11-J2-18



90700 CR 02 0010


100 Using a BDM or a Fluke Model 77 Digital VoltageMeter (DVM) grounded to a ground post on theAA gate backplane measure the logic levels ofthe lines going from the primary board to thesecondary board at the secondary board.

Do any of the lines measure greater than 0.8VDC?

150 110

110 Remove the secondary suspect. Using the BDMor DVM as an ohmmeter, check continuity of thelines measured in step 100 from the card sideof the socket to the backplane side of thesocket.

Did all of the lines show proper continuity? 140 130

130 Make appropriate corrections, insert the boardremoved in step 110, restore power, and rerunthe test.


140 Replace the board removed in step 110, restorepower and rerun the test.


150 Do any of the lines measure greater than .8 VDCbut less than 2.4 VDC?

165 160

160 Replace the primary board, restore power andrerun the test.


165 Measure the logic level of the line whichmeasured between 0.8 V and 2.4 V in step 100at the primary card socket.

Does the line measure between 0.8 V and 2.4 V? 170 175



CR 02 0010


170 Remove the primary suspect card. Using theBDM or DVM as an ohmmeter, check continuityof the line measured in step 165 from the boardside of the socket to the backplane side of thesocket.

Did all of the lines show proper continuity? 160 180

175 An open exists between the line connecting theprimary and secondary boards. Makeappropriate corrections, restore power, andrerun test.


180 Make appropriate corrections, insert the primaryboard, restore power and rerun the test.





TEST B FAILURE

90800 CR 02 0020


• The primary board fails to drive its outputs high, or

• A short to ground or to another line exists on a line between the primary board and thesecondary board, or


Use Table 10-1 (located after line 90700) to find the outputs of the primary board. Thenuse the procedure.

90800 CR 02 0020


100 Using a BDM or a Fluke Model 77 DVM groundedto a ground post on the AA gate backplanemeasure the logic levels of the lines going fromthe primary board to the secondary board at thesecondary board.

Do any of the lines measure less than 2.4 VDC? 120 110

110 Remove power. Replace the secondary board.Restore power and rerun the test.


120 Remove power. Remove the secondary boardand the primary board. Refer to the destinationtable.

Do any of the lines from the primary board tothe secondary board go to other boards?

130 140

130 Remove all other boards which are connected tolines which go from the primary board to thesecondary board. Using the BDM or DVM as anohmmeter, check for continuity between thefailed line and adjacent lines and/or between thefailed line and ground.

Does the ohmmeter read less than 100 K ohmson any line?

150 160



CR 02 0020


140 Using the BDM or DVM as an ohmmeter, checkfor continuity between the failed line andadjacent lines and/or between the failed line andground.

Does the ohmmeter read less than 100 K ohmson any line?

150 160

150 Locate the short and make corrections asrequired. Insert all boards which were removedin previous steps, restore power and rerun thetest.


160 Replace the primary board and insert all boardswhich were removed in previous steps. Restorepower and rerun the test.






90850 CR 03 0010

Too many bytes of data received from thereader.







90900 CR 03 0020

No "IMAGE AVAILABLE" signal received; no dataavailable.


100 Verify that both write head cable (J11) and readhead cable (J10) are connected. Makenecessary corrections.


110 Verify proper jumper positions on AA11 andAA12 per SH.09.01.02. Make necessarycorrections.









90905 CR 04 0010

DC Reader option reported not present.


100 Check for the jumper installed on card AA10"DCMICR."

Is the jumper present? 120 110

110 Install the jumper.







90910 CR 04 0020

Code line mismatch.


100 Is the only difference in code lines one or morerejected characters?

110 170

110 Check the jumpers and switches on card AA13per SH.09.01.02.

Are the jumpers correct? 120 115

115 Correct the jumpers, and rerun the test. --- ---

120 Check the mechanical and electrical adjustmentsper T&A 3304 4660.


130 Replace card AA13, and perform T&A 33044660.


135 Replace the Delay Line assembly.


140 Replace head/preamp, and perform T&A 33044660.








90915 CR 04 0030

Scan detected reject.

Note: This test is primarily used by the CSEto diagnose read problems most likelycaused by poor document encoding orcondition. Before making anyadjustments or replacing parts,carefully inspect the document forencoding quality.


100 Verify the jumpers and switches on card AA13and the adjustments per T&A 3304 4660, andcontinue testing.


110 Check the mechanical T&As for the read stationdrive, entrance, and DYNAVAR.






130 Replace the read head, and perform T&A 33044660.



90920 CR 04 0040

Illegal character detected. A character codeother than reject, a symbol, or 0 through 9 isreported.









90925 CR 04 0050

Code line mismatch.

Note: Poor document encoding can causecharacters to misread or reject. Poormechanical presentation (skew orbuckling) can also cause misreads orrejects.


100 Verify the jumpers and switches on card AA13and the gain setting per T&A 3304 4660, andcontinue testing.


110 Check the mechanical T&As for the read stationdrive, entrance, and DYNAVAR.














90930 CR 04 0060

No MICR data. No document.


100 Did the documents feed and go to pocket 0? 110 140







140 Go to the Main MTR Menu, and run the transporttests.

90935 CR 04 0070

All rejects detected.


100 Check the jumpers and switches on card AA13.















90945 CR 04 0080

No characters detected.


100 Check the jumpers, switches, card edgeconnector, and backplane connector on cardAA13.




130 Replace the card AA13, and perform T&A 33044660.









90950 CR 05 0010

Character Recognition PCBA did not respond toa message sent to it by the CAPI PC.


100 Replace AA11 and rerun the test?

Does the problem still exist 110 950



120 Replace PCI PCBA-AA 10 interface cable andrerun test.


130 Replace the PCI PCBA, internal to the CAPI PC,and rerun test.




Section 11 General Assistance Aids

This section provides troubleshooting suggestions that help to isolate the causes ofspecific diagnostic failures, some causes and effects of problems, and generaltroubleshooting suggestions. Each procedure is preceded by its corresponding Error CodeLine Number.

General Assistance Aids


92000

Entry to this line indicates the failure of the POC diagnostic procedure to correct a POCfailure. Review the following troubleshooting suggestions to help isolate the problem:

1. Review or rerun the diagnostic procedure to make sure the proper test points and step-by-step procedure were followed correctly.

2. Check all cards and AA backplane for proper jumper and switch positions perSH.09.01.01 and SH.09.01.02 in the schematic package.

3. Inspect backplane for bent pins and shorting objects such as staples.

4. Check that all boards are properly seated in connectors.

5. Check the +5V, +5VB, -12V, +12V, and +24V indicators on card AA08.

6. Do the following if the problem still exists:

a. Restore all cards and cables.

b. Place a jumper at location W1/W2-0 of card AA17 to bypass the POC test.

c. Power on, and wait for the "NDPBUG" prompt.

d. Enable the CSE mode on the NDP PC and then change the default sorter bootprogram to the MTR file, INITM030.LO. This procedure is outlined in"Maintenance Test Routines" in Section 1.

e. Load the MTRs from the debugger by entering "G 10000DA" and pressing the Xmitkey.

f. Run the MTR Transport Tests and follow the appropriate failure codes to isolatethe problem.

7. Review the troubleshooting suggestions at line 99999 listed under GeneralTroubleshooting Suggestions.



93000

Entry to this line indicates the failure of failure code PC 05 xxxx diagnostic procedure tocorrect a Z-80/Character Recognition Interface problem. Review the followingtroubleshooting suggestions to help isolate the problem:

1. Review or rerun the diagnostic procedure to make sure the proper test points and stepby step procedure were followed correctly.

2. Remove card AA13 and rerun the POC. If the POC now passes, constant interrupts arebeing generated by the DC Read system. Troubleshoot the DC Read system by usingT&A #3304 4660 as a guide.

3. Replace the MICR/Configurator card, AA10.

4. Replace the Recognition Control card, AA11.

5. Replace the Analog Interface card, AA12.

6. Replace the DC Recognition Card AA13.

7. Look over the AA backplane for shorting objects such as staples.

8. Check the card connector block AA10 for bent pins and proper card seating.

9. Check the +5V, +5VB, +12V, -12V and +24V indicators on card AA08.

10. Review the troubleshooting suggestions at line 99999 listed under general suggestions.



97200

Entry to this line indicates the failure of PEP/stamp MTRs to correct a fault. review thefollowing suggestions to help isolate the problem.

1. Review or rerun the diagnostic procedure to make sure the proper test points and step-by-step procedure were followed correctly.

2. Measure all voltages on the endorser boards.

3. Inspect all electrical connections for tightness.

4. Ensure all stamp components are free of excessive wear and rotate freely. Thisincludes the printhead, legend, transfer roll, and ink roll.

5. Ensure that the PEP printhead is properly adjusted for print gap to T&A 3304 3647 and,if required, stoned to SEI 1076 3896. Poor quality printing is generally due to adincorrectly adjusted print gap, or dirt on the platen or drive rollers.

6. Ensure that faulty ribbon cassettes are replaced. Excessive jams could be due to theuse of faulty ribbon cassettes.

7. If not already done, replace the PEP/Stamp controller card (AA09). Rerun tests.Follow appropriate fault codes.

8. Problems in hole detect circuitry can show up as print problems. If this occurs, runhold detect MTR and follow appropriate fault codes.

9. See suggestions under 99999.

Note: Stamp POC errors are not reported if the Stamp Error Bypass jumper is

installed on the Main CPU Board (AA17). The location of this jumper is

W4/W3-B on card AA17 (SH.09.01.02).



99000

Entry to this line indicates the failure of the MTR Transport Tests’ diagnostic proceduresto correct a Transport Test failure. Review the following troubleshooting suggestions tohelp isolate the problem.

1. Review or rerun the diagnostic procedure to make sure the proper test points and stepby step procedure were followed correctly.

2. Shorting objects such as staples can cause constant or intermittent shorts.

3. Verify and adjust, if necessary, the voltages per T&A #2493 6239 including the checkfor allowable power supply ripple.

4. Check logic to frame ground short per SEI #2493 6221.

5. Check card connector blocks for bent pins and proper card seating.

6. If the problem is in the Area 1 Tracking logic, replace AA02 if it has not already beenreplaced.

7. If the problem is in the Area 2/3/4 Tracking logic, replace the following cards one at atime if they have not already been replaced: AA05 and the 4 pocket driver cards.

8. Review the troubleshooting suggestions at line 99999 listed under General Suggestions.



99500

Entry to this line indicates the failure of the magnetic ink character recognition POC/MTRdiagnostic procedures to correct a POC/MTR failure. Review the followingtroubleshooting suggestions to help isolate the problem.

1. Review or rerun the diagnostic procedures to make sure the proper test points andstep by step procedures were followed correctly.

2. Check for shorting objects (i.e. staples, paper clips) that can cause constant orintermittent shorts, especially on the back plane.

3. Check all onboard jumper locations for all cards (start with AA11, AA12, and AA17)per SH.09.01.02.

4. If not done already, run Capture Image modes (subtest 11 and 12) on MTR disk.

5. Check logic to frame ground shorts per SEI 2493 6221.

6. Check card connector blocks for bent pins and proper card seating.

7. Replace the following cards one at a time if they have not already been replaced: AA11,AA12, AA17.

8. Review the troubleshooting suggestions at line 99999 listed under general suggestions.



99550

Entry to this line indicates the failure of the MTR CM Tests diagnostic procedures tocorrect a CMC7 Reader problem. The CMC7 Reader logic resides on one PCBA. If theMTR fails to detect a problem but the system is malfunctioning, one or more of thefollowing should be considered as the probable cause. The causes are listed in order, mostprobable cause first.

1. Document’s encoding out of specification.

2. Worn DYNAVAR strap, poor adjustment of DYNAVAR pressure, or DYNAVAR groundmissing/intermittent.

3. Read station mechanical T&As improper.

4. CM Recognition gain adjustment incorrect (T&A 3304 3662).

5. CM Recognition PCBA bad (AA13).

6. CM Read head bad.

7. MICR/Configuration PCBA bad (AA10).

8. Review the suggestions at line 99999 listed under "General TroubleshootingSuggestions."



99570

Entry to this line indicates the failure of the magnetic ink character recognition POC/MTRdiagnostic procedures to correct a POC/MTR failure. Review the followingtroubleshooting suggestions to help isolate the problem.

1. Review or rerun the diagnostic procedures to make sure the proper test points andstep-by-step procedures were followed correctly.

2. For E13B MICR, refer to T&A 2494 4901 or 3304 4660 for the single-board reader fortroubleshooting suggestions used in conjunction with the character recognition stresscheck.

3. Check for shorting objects (such as staples and paper clips) that can cause constant orintermittent shorts, especially on the back plane.

4. Check all onboard jumper locations for all cards (start with AA11, AA12, AA13, andAA17) per SH.09.01.02.

5. For multitrack E13B (if present), if not done already, run Capture Image modes(subtests 11 and 12) on the MTR disk.

6. Check the logic to frame ground shorts per SEI 2493 6221.

7. Check the card connector blocks for bent pins and proper card seating.

8. Replace the following cards one at a time if they have not already been replaced:AA10, AA12, AA13, and AA17.




99600

Entry to this line indicates the failure of the microfilmer POC/MTR diagnostic proceduresto correct a problem. Review the following troubleshooting suggestions to help isolate theproblem.



3. Check all onboard jumper locations for all cards (start with the Microfilmer ControllerPCBA, AA03, and AA17) per SH.09.01.01 and SH.09.01.02.

4. If not done already, run the appropriate microfilmer MTR on the MTR disk. Follow thenew fault code.



7. Check the microprocessors on the following cards for proper seating: MicrofilmerController PCBA, AA03, AA17.

8. Use the CCC table, if not done already, to help isolate the problem.

9. Replace the following cards, one at a time, if they have not already been replaced:AA03, Microfilmer Controller PCBA, AA17, Reel/Solenoid Driver PCBA, Galvo PCBA,Lamp PCBA, OSM PCBA, and Servo PCBA.




99700

Entry to this line indicates the failure of the imaging POC/MTR diagnostic procedures tocorrect a problem. Review the following troubleshooting suggestions to help isolate theproblem.



3. Check all onboard jumper locations for all cards (start with the AA15 and AA17) perSH.09.01.01 and SH.09.01.02.

4. If not done already, run the appropriate imaging MTR on the MTR disk. Follow thenew fault code.



7. Check the microprocessors on the following cards for proper seating: image interfaceAA15, AA17.


9. Replace the following cards, one at a time, if they have not already been replaced:AA17 and AA15.




99999

General Troubleshooting Suggestions1. Do you really have a problem? Performing tests out of order or failure to explicitly

follow test procedures can give false failures.

2. Looping on a test that detects the failure will allow an easier signal and symptomtracing.

3. The MTR diagnostic procedures generally assume only one fault exists in a previouslygood working machine. Multiple faults might exist which can cause the same failurecode or a second failure code in a subsequent test. Follow the second failure codediagnostic procedure if you are unable to correct the first problem.

4. If an FCN or new software/firmware has recently been installed, verify that it wasinstalled correctly and all operating instructions, if any, have been followed.

5. Is the card you replaced the same part number, FCN level, as your spare card?

6. Stand back a moment. Observe what the machine statistics, operator and/or failurecode are telling you about the machine operation. Is the problem mechanical? Is itelectrical? Is it software? Is it the operator? Is it the environment (voltage, heat,improper grounding, etc.)? Is it the media (document condition or bad disk)?

7. Review any TIBs; they may give some insight to your problem.

8. Check all connections on terminal strips, power supplies, and others for tightness.Check for all proper voltages.

9. Check CCC table. There may be a description that fits the problem.

10. Check all cables for rubbing on belts, cut insulation, loose fit in their connectors, etc.

11. If you suspect that the failure may be related to the optional Courtesy Amount Read(CAR) module, refer to the IR 9210/IR 9220 Courtesy Amount Read (CAR) Module

Servicing Guide: Installation and Maintenance.


Section 12 Condition, Cause, Correction Tables

100000

The CCC tables are used to define the problem condition, the probable cause(s) indescending probability, and the means of isolation and correction.

General Maintenance Hints1. Mechanical problems often exhibit the same symptoms as electrical malfunctions. Be

sure to check for obvious mechanical problems before replacing logic cards.

2. Careful observation of the problem symptoms can usually narrow the fault down toone of several cards without running any diagnostics.

3. Intermittent problems generally fall into one of the following four categories:

• Voltage and ground noise problems

• Intermittent connection or shorts

• Heat sensitive components

• Operator or media peculiarities

4. Certain failures on the IIB may cause an error code to be displayed for which noprocedure is provided in this manual (for example, PC 16 0000). Whenever this kind ofinvalid error code occurs, refer to error code line 20000 for error code PC 16 XXXX.

Condition, Cause, Correction Tables


Reference DocumentationThe CCC Table includes summary information about conditions that may occur in Areas 1through 4, the endorsers, the high speed encode module (HSEM), and the microfilmers.For more detailed information, refer to the following documents:

• Network Document Processor (NDP) Field Test and Reference Document

• DP 1000/DP 1800 Cinemode Microfilmer Field Test and Reference Document

The CCC Table does not include conditions involving the OCR readers, imaging module,courtesy amount read (CAR) module, or Multi-Jet Endorser (MJE). Refer to the followingdocuments for information regarding errors that involve these components.

• DP 1800 OCR Reader Installation and Servicing Guide

• IC 1800/IC 1825 Imaging Module Installation and Servicing Guide

• IR 9210/IR 9220 Courtesy Amount Read (CAR) Module Servicing Guide: Diagnostic

Procedures



General Conditions, Causes, and Corrections

Table 12–1. General Conditions, Causes, and Corrections

Condition Causes Corrections

Machine checks 3101-3108 Memory corruption Run Power On Confidence(POC) test. Follow errorcode, if any.

Replace CPU card AA17.

Machine hangs. (STATUS LEDon CPU board lights.)

CPU failure Replace CPU card AA17.Replace AA08.

Frequent parity errors reportedby operating firmware

Memory operations Inspect for and correctany intermittent powerconnections.

Replace CPU card AA17.

POC fails to complete, HALTCondition (STATUS LED on).

CPU, Memorycorruption

Go to line 10950.

BUS TRAP ERROR messagesare continually displayed on thesorter screen.

Multibus addresscorruption

Go to line 10975.

OPCO TRAP ERROR messagesare continually displayed on thesorter screen.

Multibus addresscorruption

Go to line 10975.

POC fails to complete. (No faultdisplayed.)

Circuit malfunction Go to line 10000 of MTRand follow diagnosticprocedure directed bysymptom table.

Blank screen afterapproximately 2 minutes

Terminal problem.Circuit malfunction

Go to line 10000 of MTRand follow diagnosticprocedure directed bysymptom table.

POC fails to complete. ******on screen

CPU failure Go to line 10000 of MTRand follow diagnosticprocedures.

Terminal problem Check terminal cable. Goto line 10000 of MTRsand follow diagnosticprocedures.




Machine hangs. (RST LED onCPU board lights or DEBUGprompt is displayed withouterror code.)

CPU Failure. Replace CPU card AA17.

Reset circuitryfailure.

Replace AA08.

POC bypass fails to complete. CPU failure Replace CPU card AA17.

POC fails, but manualprocedure fails to resolve

Machine incorrectlyconfigured as DP1150

Check jumpers on AA17,per SH.09.01.01. RunMTRs on disk.

Cannot power on Circuit breakertripped or bad.

Set/Replace circuitbreaker.

FCPS fuses +24Vsupply fuse or ACcontrol card fusesblown.

Replace fuses.

No AC input power. Connect proper AC inputpower.

Power on/off switchor harness bad

Check/replace switch orharness.

AC control logic bad Replace AC control cardor trouble shoot startingwith SW-OFF & SEQDWN1signals on SH.03.01.04.

Cannot power off Power on switch orharness bad.

Troubleshoot starting withSWOFF signal on AAbackplane SH.01.23.02

Harness bad or nothooked up fromcontrol panel to ACcontrol card.

Check/replace harness.

Circuit malfunction. 1. Replace CABB1.2. Replace CABC1.

PCBA left in testmode.

Run POC tests and MTRto isolate.



Missorts

Table 12–2. Missorts CCC


Missort to R pocket Area-1 tracking error See "MTWE" in this table.

Pocket info registererror (REGFAIL)

See "REGFAIL" in thistable.

Piece of paper ortumbling document

Check transport.

Dead BOL Replace dead BOL.

Gate fault or trackerror

See "Gate Fault" or"TRACKERR" in this table.

Circuit malfunction Run MTR basic tests.

Slippage orslowdown in HSEMaligner.

Adjust HSEM aligners perT&A.

Aligner track needscleaning.

Roller needs cleaning.

Slippage in encoder. Servo rollers needcleaning.

Missort to pocket other thanreject

Gate fault See "Gate Fault" in thistable.

Area 2/3 documentunderspacing orslowdown

Check area 2/3 belt androller tension.

Track error See "TRACKERR" in thistable.

Dead BOL Replace BOL.

Circuit malfunction Run MTR basic MTRtests.

False missorts Track error See "TRACKERR" in thistable.

Piece of paper ontumbling document

Check transport.

Circuit malfunction Run basic MTR tests.

Missorts to microfilm / image Document slow downin microfilm / image

Check microfilm / imagetransport belts androllers.

Jams at opticalgate/mirror

Check walls per T&A.



Table 12–2. Missorts CCC


Dead BOLs Check BOL bias values.Replace faulty BOLs.

Undetected missorts Circuit malfunction orsort programexecution

Run all transport MTRs.

Pocket informationregister malfunction.

Replace card AA02,replace card AA05.

Dead BOLs Check BOL bias values.Replace faulty BOLs.

No missort detection Circuit malfunction Run tracking logic MTR.



Jams

Table 12–3. Jams CCC


Feeder jams Worn belts or tires Replace worn belt/tires.

Feed shield worn ormisadjusted

Adjust/replace shield.

Feeder separatormechanismmisadjusted

Check T&A for feeder andseparator.

Media or operatorhandling

Instruct operator.

No feeder jam detection Logic malfunction Replace card AA08,AA02.

False feeder jams Feed belt or shieldworn or misadjusted

Replace or adjust.

Inadequate hopperflag pressure

Flag should have one ortwo small weights boltedon.

Bad BOL B or BOL S Check/replace bad BOL.

New Media oroperator

Instruct operator.


Aligner station jams Obstruction in track Clear obstruction.

Acceleration oraligner discs areworn.

Adjust/replace disks.

Wall gap is toonarrow.

Check walls per T&A.

Feeder/separator ismisadjusted.

Check T&A for feeder andseparator.

Track is worn ormisadjusted.

Check track per T&A.

Double document detector jams Obstruction in track Clear obstruction.

Walls misadjusted Check wall per T&A.

Track misadjusted Check track per T&A.

Read station jams Obstruction in track Clear obstruction.

No-buckle driverollers

Replace rollers.





Read drum belt wornor misadjusted

Adjust/clean/replacebelts.

Read station jams Walls or trackmisadjusted

Check them per T&A.

DYNAVAR pressuretoo high

Adjust it per T&A.

Torn or kinkedDYNAVAR

Replace DYNAVAR.

Standby station jams Obstruction in track Clear obstruction.

Worn rollers or belt Clean/replace rollers orbelts.

Misadjusted walls ortrack

Adjust them per T&A.

PEP/Stamp endorser jam Obstruction in path Clear obstruction

Dirty transport Clean transport walls,rollers and track

Misadjusted walls ortrack

Adjust them per T&A

Platen misadjusted Adjust it per T&A

Endorser drive/clutchmalfunction

Repair or replace clutchor drive

HSEM Jams Obstruction in path Clear paper/stapleobstruction.

Dirty servo roller Clean servo roller.

HSEM alignermisadjusted

Adjust per T&A.

Dirtyrollers/track/walls

Clean rollers/track/walls.

Damaged leaf springon front printer wall

Replace leaf spring.

Aligner flexure rollermisadjusted

Adjust per T&A.

Walls misadjusted Adjust per T&A.

Beltsworn/misadjusted

Adjust/replace belts.

Front printer wallbroken/misadjusted

Adjust/replace frontprinter wall.





Note: For other HSEM jams refer to the HSEM CCC table later in this section.

Microfilm jams Obstruction in path Clear obstruction.

Dirty track/walls Clean track walls.

Walls misadjusted Check walls per T&A.

Beltsworn/misadjusted

Adjust/replace belts.

False area-1 through imagejams

Pieces of paper orink smear

Clean track/BOLs.

Document slowdown See "MTWE" in this table.

Circuit malfunction Run MTR basic tests

Area 2/3/4 gate jams Obstruction ingate/track

Clear obstruction.

Improper pocketentrance drive

Check pocket entranceroller drive.

Improper stacking See "Improper Stacking"in this table.

Gate Faults See "Gate Faults" later inthis section.

Area 2/3/4 transport jams Obstruction in track Clear obstruction.

Document slippage. Check roller and belttension.

Worn roller/belt Replace bad parts.

Wall, track, prow, orfiller platemisadjusted.

Check item per T&A.

Area 2/3/4 false jam Pieces of paper orink smear

Clean track/BOLs.

Improper documentdrive

Check roller/belt tension.


No area 2/3/4 jam BOLs not adjusted See "BOLs" in this table.


Constant jam (cannot clear jam) BOL blockage Remove blockage.

Locked up or deadBOL

Initiate "BOL reset".Check BOL bias values.Clean or replace BOLs.






Document skew or riding high Unit is not level Carefully recheck the levelof the entire unit usingalignment posts on bothsides of each baseplate.Be sure to tighten thelocknuts on all levelingfeet.

Belt has jumped agroove

Check the poly-vee beltsin the standby track andall pocket modules tomake sure they are not upor down a groove.

Belt is riding on aflange

Check the timing beltsbelow the baseplates andthe drive belts above thebaseplates to make surethey are tracking properly.

Skewed roller orspring off

Check the rollers in thestandby area and pocketmodule to make sure theyare level and spring-loaded. Pay specialattention to the first grayroller in each 4-pocketsection and all Area 2poly-vee roller springs.

Slippage in Transport Check the OCR vacuumtransport, if present, toensure proper vacuum. IfImage and/or Microfilm isinstalled, check the fronttransport belt tension; itmay be too loose or thetransport wall handle(s)may not be fully closed.Adjust as required.





Document catching intrack (edge damage)

Run new documents to allpockets and carefullyinspect the bottom andleading edges fordamage. If damage isobserved, isolate it to themodule in which thedamage begins. Use thedocument as a templateto locate the trackproblem.

Gradual climbing If documents appear to berising the farther they godown the transport, andnone of the possiblecauses listed above(under Document skew)seem to apply, shimsshould be installed. Theshims (0.020") should beinstalled under the firstpoly-vee roller in each 8-pocket module. If thedocuments are still rising,install 0.020" shims underthe first poly-vee roller onthe 4-pocket baseplatethat does not already haveshims. Shims 0.010" arealready installed beneaththe first poly-vee roller.Never use more than0.030" in shims under aroller.





Read station rollersare dirty or worn

If character recognitionsubtest shows more than2 channels of skew,check read stationentrance swing armrollers for dirt build-up orexcessive wear. Dirtyrollers should be cleaned;worn rollers should bereplaced. Loose readdrum belt should be givenproper tension accordingto the T&As; dirty ordamaged Dynavar tapeshould be cleaned orreplaced. Both Conditionsmay cause some skew.

Uneven rubber rollerwear or dirt build-up

Check rubber rollers inthe suspected problemarea for flat spots, conicalor other wear and replaceif necessary. Look for thereason for the unevenwear and correct theproblem. Ink or dirt onrollers can also causedocument transportproblems; clean asnecessary.

HSEM document too high orskewed.

HSEM alignersmisadjusted


Perform skew sensorcalibration.



BOLs

Table 12–4. BOLs CCC


Frequent dirty BOL or dirty &dead BOL

Bad BOL alignment Align BOL and check BOLbias value. Checkfront/back wall alignment.

Marginal BOL Replace BOL.

BOL shield broken Inspect for shorted orbroken cable shield

No dirty or dead BOL detection Circuit malfunction Run MTR basic tests.

Unresettable dead BOL at oneBOL

Document in front ofBOL

Remove document.


Cabling open or short Check repair/cable.


No BOLs work (BOLs notadjusted)

Open or intermittentinterlocks

Run interlocks scan inloop mode to locate badinterlock. Adjust/replaceinterlock.




Track ERR (Areas 2, 3, or 4)

Table 12–5. Track ERR (Areas 2, 3, or 4) CCC


Dead BOL for whole area - 1, 2,3, or 4

One shorted LED orphoto transistor inarea

Unplug one at a time untilbad BOL is found.

Cabling short or open Check/repair cable.


All pocket lights on Circuit malfunction Run MTR basic tests.

One pocket light on Data overlap in area2 or 3 due totumbling documentor pieces of paper

Check belt/roller tension


Cannot reset gate fault ortracking error

No gate fault/trackerror command

Run MTR basic tests.

Gate faults Mechanical bind ingate mechanism orpocket entrance

Clean/fix bind

Blown fuse Replace fuse on 4-pocketdriver card.

Cable problem Fix/hook up cable.

Gate misadjusted Adjust or replace gate.

Circuit malfunction Run MTR basic tests.Replace the TrackingLogic PCBA for theaffected area.



Feed Errors

Table 12–6. Feed Errors CCC


High feed error rate or falsefeed errors

Run feed error test deck toisolate excess feed errorsto type of error.

Obstruction in DoubleDoc (DD) detector orhoses

Clean out obstruction (forDD feed errors).

Improperlyprepared/dog-eareditems

Poor feeder adjustments,hopper weight, or hoppervibrator. Jog and inspectitems per NDP OperationsGuide.

Worn feedercomponents

Replace/adjust asrequired.

Aligner or acceleratordisc worn/misadjusted

Replace/adjust worn partper T&A.

No-buckle driverollers or read drumbelt dirty or worn out

Clean/replace parts.

Document slippage See "MTWE" in this table.


Failure to detect feed errors Isolate which type of feederror is not detected byrunning the feed error testdeck. Check formechanical causes.

Double doc detectoris not working

Check cyclone filter,hoses, and ports for dirtbuild up. Set vacuum perT&A.


Failure to stop flow on a feederror


Burp to reject pocket with nofeed errors

Z-80 CPU hung Reset sorter.

Too late to pocketselect

System contention orprogram problem.






MTWE (Area-1 tracking error) Document slippagedue to dirtytransport, wornparts, or lack ofdriver

Examine statistics todetermine which transportarea to address. Refer tothe NDP Field Test andReference Document forthe T&A.

Pieces of paper dueto bad media/dog-eared items

Use more care whenputting documents intohoppers.



MTWE at PE2 or PE3 Slowdown in HSEMaligner.


Aligner track needscleaning.

Servo roller needscleaning.

Feeder allowingclumps of documentsto feed.

Adjust feeder per T&Asand replace feedercomponents if necessary.

REGFAIL or Electrical WindowError (ETWE)

Circuit malfunction ortracking numbererror

Run MTR basic tests.Replace AA02.

No pocket lights 4-pocket driver cardfuse, harness, logiccard


Primary separator motor runswithout document feed

Hopper vibrator open Correct open/replacehopper vibrator

Circuit malfunction replace 1) aux. TRIAC cardCABGI, or 2) AC controlCABB1

Hopper vibrator fails to run Misadjustment Adjust hopper vibrator gapper T&A

Circuit open Correct open/replacehopper vibrator

Circuit malfunction Replace 1) aux. TRIAC cardCABGI, or 2) AC controlCABB1

Constant or false empty hopper Hopper BOL is dirty Clean hopper BOL andhopper flag.





Misadjusted hopperBOL

Adjust it per T&A.

Bad hopper BOL Replace BOL.

Harness problem Check/repair harness.




Batch Ticket

Table 12–7. Batch Ticket CCC


Constant/false batch tickets BOLA dirty oropposite wall is dirty

Clean them.

BOLA misadjusted Adjust per T&A.

Bad BOLA Replace BOL.

BOL harness problem Check/repair harness.

Circuit problem Run MTR basic tests.

No batch ticket Detection not active Check configuration.

BOLA misadjusted Adjust per T&A.

Circuit malfunction Replace card AA02/AA08.



Interlocks

Table 12–8. Interlocks CCC


Constant open interlock (cannotturn on motors)

Bad or misadjustedinterlock switch

Replace/adjust switch.

Harness problem Check/repair harness orconnection.


No interlock works Logic malfunctions orinterlock switchshorted to ground


Intermittent interlockswitch

Isolate switch and adjustor replace

Check jumpering andharnessing on BOLdistribution cards.

Open interlock (with no locationreported)

IEC cover interlock(s)open

Repair or adjust IECinterlock switch; checkBOL distribution cardjumpers.

Intermittent interlockswitch

Isolate switch and adjustor replace

Check jumpering andharnessing on BOLdistribution cards.

Control panel lights LED bad Replace LED.

Cable problem Check/repair cable.

Circuit problem Replace AA08.

Bad switch Replace switch.

Sorter Not Ready Endorser Not ReadyMicrofilm Not ReadyHSEM Not Ready

Locate which Conditioncauses Not Ready byrunning MTR basic test

Microprocessor/CharRec stop

Open interlock

Jam

Feeder jam

Empty hoppers





Motors down

Pocket light on

Sorter Not Ready (continued) Track err, full pocket,gate fault, dead BOL,jam missort, orpocket light

Power on reset

Program "Not Ready"command

Low double docvacuum

START/STOP bar orswitch not working orstuck on fascia

START/STOP bar fails to bringup motors

START/STOP barstuck

Bar physically stuck. SeeSH.04.04.01 to isolatefault to specific area.

Cannot feed with motor up andsorter Ready

(Batch ticket stop)Constant batch ticket

Run MTR basic tests

Constant feed error

Constant too late topocket

Circuit malfunction

Cannot start motors or softmotor shutdown

Jam or feeder jam See "Jam" in this table.

Intermittent ormisadjusted interlockswitch

Troubleshoot to interlockcausing the problemstarting on SH.01.23.05:8J1-40, LOCK234N forpocket area interlocks, or8J1-85, INTLCK1N forArea 1/1B interlocks.Use PPC-ON to sync thescope (8J1-81) and cyclemotors up and down tolocate the faulty interlock.Adjust or replace switch.

Open interlock Close interlock.





IEC interlock on Area-1 cover, front MJE,Image, or microfilmercover is open

Trouble shoot startingwith signal "BUPERR" onsheet 03.01.03.

C4MHz clock notrunning


AC control motorerror or circuitbreaker tripped

Reset motor error orcircuit breaker.


Improper endorsement data Circuit problem Run MTRs for theappropriate endorser.

Improper microfilm ID number Circuit problem Run microfilmer MTRs.

Improper microfilm operation Circuit problem Run microfilmer MTRs.

Missing line of endorsement Program problem Correct program.

Circuit problem Run MJE MTRs.

High rejects Bad media encoding Work with bank to corrector minimize.

Worn/dirty DYNAVARor heads

Clean/reposition orchange.

Improper DYNAVARpressure

See DYNAVAR per T&A.

Improper groundingon read drum orDYNAVAR

See DYNAVAR per T&A.

Logic to frameground short

Check short per SEI.

Documentmisalignment

Check track alignmentand roller adjustment fromfeeder exit to readstation.

Read systemmisadjusted

Adjust per T&A.

Logic malfunction orZ-80 malfunction


Note: Use of the MTR disk character recognition tests (especially subtests 11 and12) and the character rec stress deck program can help isolate MICR readproblems. See T&A 3304 4660 for NDP Ready or 4344 6541 for CAPI.

CMC7 read problems Logic malfunction Run MTR CMC7 tests.





See line number 99550.

Z-80 Overload reported Document fedbackward or upsidedown with MICR inkon document border.(Garbage MICR)

Feed documents rightside up.

MisadjustedCharacter Rec

See "High rejects" in thistable.

Documents too closetogether

Check feederadjustments.

Bad stacking Improper drive onturn in rollers or wornrollers

Clean ink off rollers,replace rollers, and checkfor proper spring andspring tension on turn inrollers.

Pocket weight stringoff pulley or stringbroken

Fix/replace string.

Turn in flexure rollersnot parallel

Adjust/replace rollers perT&A.

Flexure spring brokenor misadjusted

Adjust/replace spring perT&A.

Pocket snubberdamaged or packedwith paper

Clean/replace snubber.

Pocket entranceguidesmisadjusted/broken

Adjust/replace them perT&A.





Stacking Problems Pocket hardwareproblems

If documents appear to beentering pocket(s) high,the problem may beupstream; see the"Documents catching ontrack" Condition. If theproblem appears to getmore or less worsefarther down the track,see the "Gradual climbing"Condition. If the stackingproblem is isolated (i.e., agood stack on either sideof the bad pocket), checkfor problems in thatpocket. These problemsmay include dirty or wornrubber turn-in roller, throatroller, or dirty steel pinchrollers.

If the documents are"curling" or having tail-endcollisions check the kickerspring adjustment T&Aand the gap between theleft and right columnforming wall T&A. If thedocuments are "backingup" in the pocket, checkto see if the flag is movingfreely. Another possibilityis that the flag weight isoff the pulley or is caughton something.

Auger noise Dirt buildup atbearing block

Clean and lubricate perSEI 2974 4356.

Improper lubrication

Worn parts



EndorsersThis subsection lists fault conditions for the PEP/Stamp endorsers on the NDP 1150. Faultcondition information for the multi-jet endorser used on the NDP 1825 appears inSection 19.

Table 12–9. Endorsers CCC

Condition Cause Correction

Print position incorrect (allendorsers)

Wrong print positionspecified by program

Select proper printposition

Transport driveproblem before or atendorser

Check vacuum drive, beltsand rollers



PEP

Table 12–10. PEP CCC


Print position incorrect Wrong print positionspecified by program

Select proper printposition.

Transport driveproblem

Check belts and rollers

Poor PEP print quality Dirt buildup onplatten or drive roller

Clean platter and driveroller

Printhead gap notcorrect

Readjust printhead gapper T&A 3304 3647

Print needles requireto be stoned flat

Stone printhead per SEI1076 3894

Bad printhead or endof life

Replace printhead.

Harness, circuitproblems

Run endorser MTR

No PEP print Damaged ribbon orribbon beyond end oflife

Replace ribbon cartridge

Ribbon drivemalfunction or ribbonjam not detected

Run endorser print MTRs

Printhead gapmisadjusted

Adjust per T&A 33043647

Hole detect sensormalfunction

Replace lamp if burnt out.

Clean hole detect sensor.Run endorser MTR.

Ribbon cartridge presence notdetected

Ribbon cartridgeincorrectly loaded

Load ribbon cartridgecorrectly

Ribbon cartridgepresence switchmalfunction

Replace switch

Harness/circuitproblem

Run endorser MTR

PEP prints in holes indocuments

Hole detect sensormalfunction

Clean hole detect sensor

Run endorser hole detectMTR



Table 12–10. PEP CCC


Replace lamp if burnt out

Jams caused by ribbon pulledout of cartridge

Ribbon cartridgemalfunction

Replace ribbon cartridge

Staples in documents Removes staples indocuments

PEP not present reported Selection jumpers oncontroller PCBAincorrectly set

Check jumpers J2-3 to J2-2

Fault on controllerPCBA

Replace controller cardAA09

PEP POC failed, but manualprocedures do not resolveproblem

If operation without PEP isOK, deselect PEP andremove ribbon cartridge

Circuit, cable,printhead problem

Run endorser MTR

No Transport Interrupts Circuit fault Run MTR.

Disposes without documentinterrupts

Circuit fault Run MTR

Documents without disposeinterrupts

Too late to endorseor circuit fault

Most probable cause islate dispositions toendorser due to excessivehost load



Stamp

Table 12–11. Stamp CCC


Poor stamp print quality Stamp legend wornor dirty

Clean or replace legend

Ink transfer roll worn Replace ink transfer roll

Light stamp printing Ink force setting toolow

Adjust ink force

Ink supply roll empty Replace ink supply roll

Stamp gapmisadjusted

Adjust to T&As 10763126, 1076 3092, 10763100, and 1076 3118

Stamp legend wornor dirty

Stamp overshoot (OperatorAttention screen)

Stamp printhead orlegend not installed

Install printhead or legend

Ink transfer roll notinstalled

Install ink transfer roll

Home positionmisadjusted


Circuit or cableproblem

Run endorser MTR

Stamp undershoot (fromOperator Attention screen)

Stamp legendincorrectly mountedon printhead

Remount stamp legend

Debris buildup onmechanism

Clean mechanism



Circuit or cableproblem

Run endorser MTR

CSE ATTENTION REQUIRED Screen Messages

Home sensor failed Home sensormisadjusted

Readjust home sensor perT&A 3304 3654

Home sensor failed Run endorser MTR;replace motor

Circuit/harnessproblem

Run endorser MTR

Replace controller PCBA Internal fault oncontroller PCBA




Table 12–11. Stamp CCC


Run endorser MTR

Replace Stamp driver PCBA Fault detected onStamp driver PCBA

Replace Stamp driverPCBA

Circuit, harness, ormotor problem

Run endorser MTR

Stamp not present reported Selection jumpers oncontroller cardincorrect

Check jumpersJ1-1 to J1-2 Front Stamp

J1-3 to J1-2 Rear Stamp

Fault on ControllerPCBA


Stamp POC failed If operation without Stampis OK, deselect Stampand remove Stampprinthead

Note: Stamp POC errors are not reported if the Stamp Error Bypass jumper isinstalled on the Main CPU board (AA17). The location of this jumper isW4/W3-13 on card AA17 (SH.09.01.02).

Circuit, harness, ormotor problem

Run endorser MTR

Disposes without documentinterrupts

Circuit problem Run MTR

Stamp acceleration timeout(from statistics)

Stamp legendincorrectly mountedon printhead

Remount Stamp legend

Debris buildup inmechanism

Clean mechanism


Adjust to T&A 3304 6554



HSEM

Table 12–12. HSEM CCC


Encoding in wrong left-to-rightposition

Flat pinch rollerspring in servo trackwall installedbackwards

Remove, flip over,reinstall.

RibbonTakeupFailure, RibbonMotion Fault,RibbonSkewLeftFailure,RibbonSkewRightFailure

Ribbon takeup motorstalled.Ribbon failed toadvance properly.

Remove ribbon.Reload ribbon.Clean ribbon skewsensors.Run MTRs.

RibbonLow, Ribbon SkewLeft/Right Warning

Operator warning Replace ribbon when usedup.

HammerFlightFault Hammer movementerror detected

If repeats, do hammeradjustment T&A.

Staple/dirt inhammer bank

Remove staple/clean.

RibbonSkewSensorFailure Dirty/bad sensors Clean sensors/run MTR.

NoDrumIndex/DrumSpeedError Drum motor or circuitproblem

Run MTRs.

Missing/ExtraCharacterClocks Circuit problem Run MTRs.

InvalidPrintData Circuit problem Run MTRs.

ParallelInterfaceGone orParallelInterfaceError

Cablebad/disconnected

Fix/reseat cable betweenCAPRI and CommonController PCBAs

Circuit problem Replace CAPRI/CommonController PCBAs.

Communicationfailure betweenCommon Controllerand Printer Controller

Run Bus Test MTR andother MTRs.

SkewedDocument > +1.50degrees/DocumentTooHigh

Document conditionalignment

Take proper care indocument preparation.

Check aligner adjustment.

DocumentSlip or Leading EdgeProblems

Large dog-ear onlower leading edge ofdocument

Check documents.

Slip Tables incorrect Run Slip Calibration MTR.

DocumentNotInStopPosition Servo System Failure Run MTR’s



Unisys NDP 1xxx Cinemode Microfilmer

Table 12–13. NDP 1xxx Cinemode Microfilmer CCC


Microfilmer fails POC Various Go to manual procedureidentified by POC errormessage.

Optical path blocked (front orrear)

Too much reflectionfrom the transportwall

Clean transport walls.

ALM base value notcorrect in NVRAM

Use hardware parameterroutine (Section 17) toadjust ALM value.

Document or debrisin optical gate

Clear optical gate area ofdocuments or debris.

Light not reachingoptical gate or opticssystem

Clear documents ordebris obstructing opticalpath; clean optical path.

ALM sensor problem Run ALM MTR routine.

Misadjusted leading/trailing edge delay

Use hardware parameterroutine (Section 17) toadjust delay values.(Remember to add 0.5milliseconds to theselected value.)

Front or rear ALM failure Too much reflectionfrom the transportwall

Clean transport walls.

Incorrect lampand/or ALM basevalues in NVRAM

Use hardware parameterroutine and verify thatinitial base parametersare still in NVRAM.

Lamp intensity haschanged

Check lamp and lighttransmitting surface offiber optics fordiscoloration or dirt.Replace lamps ifdiscolored.

Perform density step test,and verify basic lampvalues.

ALM sensor problem Run ALM MTR routine.





Film load failure (continuous) Film not loaded atpower on, but coverclosed

Load film and continue.

Film cassette loadedincorrectly in filmtransport

Reload film cassette infilm transport.

Film loadedincorrectly incassettes

Reload film in cassettes.

Film track rollersdirty

Clean film track rollers asper PM procedure.

Film transportproblem

Run film transport MTR.

End of film message withgreater than 15 feet or lessthan 5 feet of film remaining

Supply sensor dirty Clean supply sensor.

Incorrect film corediameter on supplyfilm

Check supply film core;replace if incorrect.

Supply sensorproblem


Film not loaded message withfilm plate in down position

Film load switchproblem

Run film transport MTRroutine.

Camera cover open messagewith cover closed and locked

Cover switch T&Aadjustment incorrect

Adjust cover switch toT&A.

Cover switchproblem

Run MTR routine.

Camera cover will not lock orunlock correctly

Lock mechanism T&Aadjustment incorrect

Adjust lock mechanism toT&A.

Cover lock problem Run MTR routine.

Upper height detector warning Upper height BOL isdirty

Clean BOL and test.

Faulty BOL Replace BOL.

BOL alignment bad Align BOL per T&A.

Faulty BOL circuit Run microfilm MTR.

Lower height detector warning Lower height BOL isdirty

Clean BOL and test.

Faulty BOL Replace BOL.





BOL alignment bad Align BOL per T&A.

Faulty BOL circuit Run microfilm MTR.

Film slip warning Cumulative film sliphas been detected

Clean capstan roller, slipdetection roller, and filmtrack rollers using a lint-free cloth moistened in a50/50 solution ofisopropyl alcohol per T&A3304 3837. If Conditionpersists, check for rollerwear. Replace worn ordamaged components. IfCondition persists, checkcapstan screw fortightness. Check capstanelectrical adjustment T&A;readjust as required. Runmicrofilm MTR.

Takeup loop too small or large(takeup loop too small or largesensor still covered afterautomatic loop recovery isattempted)

Dirty sensor Clean sensor, and retest.

Film not properlythreaded in cassette

Check film loading incassette, and correct ifwrong.

Excessive binding ofrecovery film incassette

Check for binding.Replace film cassette asnecessary.

Cassette spline notproperly engagingwith reel motor spline

Reload film cassette infilm transport. Replaceworn cassette or wornsplines.

Loop arms binding Ensure that loop armsmove freely.

Faulty sensor or reelmotor


Supply loop too small or large(supply loop too small or largesensor still covered afterautomatic loop is attempted)


Film not properlythreaded in cassette

Check film loading incassette, and correct ifwrong.





Excessive binding ofrecovery film incassette

Check for binding.Replace film cassette asnecessary.

Cassette spline notproperly engagingwith reel motor spline

Reload film cassette infilm transport. Replaceworn cassette or wornsplines.


Faulty sensor or reelmotor


Idler encoder failure (zeroencoder count after a film moveis made)


Faulty sensor Run film transport MTR.

Film movementproblem


Encoder disk loose Check encoder disk.

Supply encoder failure (lessthan 500 supply encodercounts after 12 inches of filmmovement)


Loose encoder disk If Condition persists,check if encoder disk isloose. Tighten if required.

Faulty sensor orother problem

If Condition persists, runMTR routine.

Missing IPL (dispositions werereceived by the Controller PCBAwithout an IPL)

Dirty BOL sensor Clean or align BOL andretest.

Intermittent contact If Condition persists,check for intermittentcontact on MIIB or inharness.

Faulty MIIB PCBA If Condition persists,replace MIIB PCBA.

Serial Interface failed If Condition persists,replace Controller PCBA,MIIB PCBA. Check cableJ1, J3.





Faulty ControllerPCBA

If Condition persists,replace Controller PCBA.

Missing disposition (IPLreceived without a disposition)

Dirty BOL sensor Clean or align BOL andretest.

Intermittent contact If Condition persists,check for intermittentcontact on MIIB or inharness.

Faulty MIIB PCBA If Condition persists,replace MIIB PCBA.

ID display failure (minimumcurrent not obtained whiledisplay is turned on or readafter write mismatch)

Faulty ID displayPCBA or bad contactin harness

Execute POC. If ID displayfailure reported, replaceID display PCBA. IfCondition persists, run IDdisplay MTR routine.

Human readable header failure(minimum current not obtainedwith display turned on)

Faulty HRH PCBA orbad contact inharness

Execute POC with filmremoved. If failurereported, replace HumanReadable Header PCBA. IfCondition persists, runHRH MTR routine.

Film slip detected (insufficientidler encoder counts for threeconsecutive moves)

Capstan, idler or filmtrack rollers dirty

Clean film track rollers.Check that qualified film isbeing used.

Worn rollers or notfree to rotate

Check for roller wear.Replace worn or damagedcomponents. Ensure thatrollers rotate freely.

Loose capstan roller Check and tighten ifrequired.

Loose idler encoderdisk

Check and replace ifnecessary.

Excessive film dragat platen

Check for cause of drag.


Capstan velocityincorrect

Adjust to T&A.

Faulty motor or driveelectronics






Film Advance error Film Advance lightout

Run MTR system checkroutine.

Film advance did notoccur.

Run MTR system checkroutine.

Capstan failure Failure of the filmmovement controlregister to have thecorrect readingbefore or after a filmmove is attempted

Run film transport MTRroutine. Check capstanelectrical T&A 33044488.

Galvo scan signal failure Scan signal notpresent after LEDtimeout or is presentafter TED timeout

Replace Controller PCBA.

Galvo posack failure Galvo posack signalnot set after 5consecutivedocuments

Run galvo MTR routines.

Galvo home too low or too high(home position outside allowedrange)

Galvo home sensornot adjustedcorrectly

Run hardware parameterto adjust galvo homeposition.

Galvo/mirror positionnot correct

Adjust to T&A 33044439.

Galvo home sensorfaulty

Run galvo home MTRroutine.

Galvo voltage failure Loss of one or morevoltages on galvoPCBA

Replace Galvo PCBA. Rungalvo MTR routine.

Galvo current failure Current limit detectedwhile sweeping thegalvo

Replace Galvo PCBA. Rungalvo MTR routine.

Lamp control read after writemismatch

Failure of front orrear lamp controlregister to hold avalue

Replace Lamp PCBA. IfCondition persists, checkfor intermittent contact onanalog motherboard.

Capping shutter close failure Sensor not coveredafter closing thecapping shutter

Run capping shutter MTRroutine, and check T&A3304 4363.

Capping shutter open failure Sensor not coveredafter opening thecapping shutter

Run capping shutter MTRroutine, and check T&A3304 4363.





Channel 1 ICM failure (ICMcurrent not in range whileactive)

Faulty ICM LED orbad contact inharness

Run POC with filmremoved. If errordetected, run ICM MTRroutine. If error notdetected, check forintermittent contact incabling.

Channel 2 ICM failure (ICMcurrent not in range whileactive)

Faulty ICM LED orbad contact inharness

Run POC with filmremoved. If errordetected, run ICM MTRroutine. If error notdetected, check forintermittent contact incabling.

Front or rear lamp failure (lampcurrent < than 80 percent ofexpected value)

Faulty lamp If lamp does not illuminateafter pressing start/stop

Faulty driveelectronics

If replacing lamp does notcure problem, run LampMTR.

Interface board internal failure(failure detected on MIIB PCBA)

Faulty PCBA Replace MIIB PCBA.

Controller board internal failure(failure detected on ControllerPCBA)

Faulty PCBA Replace Controller PCBA.

MTR POC failure (failuredetected during POC)

Various Run POC, and use manualprocedures to identifyfault.

Serial interface failure (failure ofthe serial interface detected bythe MIIB PCBA)

Problem on MIIBPCBA, on ControllerPCBA, or in harness

Run serial interface MTRroutine.

Power-on failure (loss of asupply voltage detected)

Faulty power supplyor harness

Check supply voltages.

Watchdog timerfailed


Input capture register failure(internal PCBA failure detected)

Faulty ControllerPCBA


Image density too light or toodark on film

Commercialprocessorspeed/temperaturecontrol incorrect

Have processor checkcalibration strips againstmaster and correctprocess.

Dust buildup onoptics

Clean optics as per PMprocedures.





Lamp intensitysetting incorrect

Run lamp intensityhardware parameterroutine to select correctlamp operation point.

Lamp faulty or at endof life

Replace lamp, and runhardware parameterroutine to select correctlamp operation point.

Vertical streaks on documentimages


Clean optics as per PMprocedures.

Faulty lamp Replace lamp.

Damaged fiberbundle

Replace fiber bundle.

Vertical lines on front or rearimage from optical gate thoughgalvo scan

Dirt buildup in opticalgates/mirrors

Clean optical gatesand/or mirrors.

Damage to opticalgates or track walls

Repair scratches onoptical gates or trackwalls by painting flatblack.

Horizontal density variations(bands) on document images

Faulty Galvo PCBA Replace Galvo PCBA.

Faulty galvo/mirrorassembly

Replace galvo/mirrorassembly.

Intermittent contact Check theinterconnections andrepair.

Poor image resolution Density on film notbetween 1.0 and 1.5

Run lamp adjustmenthardware parameterroutine to select correctoperating density.


Clean optics per PMprocedure.

Document lens notfocused correctly

Focus lens per T&A 33044330.

Defective orscratched galvomirror surface

Replace galvo/mirrorassembly.

Leading edge of front imageand ID number overlap

LED delay not setcorrectly

Run hardware parameterroutine to adjust LEDdelay.





Galvo home positionnot adjustedcorrectly

Run hardware parameterroutine to adjust galvohome position.

ID display positionnot adjustedcorrectly

Adjust ID display positionper T&A 3304 4348.

ID numbers faint Incorrect ID displayon time selected

Run hardware parameterroutine to adjust ID displayon time.

Dirt buildup on IDoptics

Clean ID display opticsper PM procedure.

Document image too short butresolution good

TED delay value notcorrectly set

Run hardware parameterroutine to adjust TEDdelay.

Document image too short orlong and poor resolution

Galvo scan notcorrectly adjusted

Adjust galvo scan perT&A.

ICM not correctly located atedge of film

Platen roller locationnot correct

Adjust platen rollers perT&A 3304 4314.

Forward leading edge imagecurl

Underspaced items Check feeder operation.

Reverse image curl Capstan velocitycontrol incorrect

Adjust electrical T&A.

Capstan drive faulty Run film transport MTR.

Loop arm operationincorrect

See under loop too largeor too small problems.

Forward trailing edge curl Capstan velocitycontrol incorrect

Adjust electrical T&A.

Capstan drive faulty Run film transport MTR.

Loop arm operationincorrect

See under loop too largeor too small problems.

Missorts in microfilm transport Dirty BOL Clean microfilmer BOLs.

Debris in track or dirton belt drive

Clean belt and track perPM procedure.

BOL alignment bad Adjust BOL alignment toT&A.

Track wall adjustmentbad

Adjust track wall to T&As3304 4108 and 33044132.





Transport belt driveadjustment bad

Adjust belt drive to T&A3304 4124.

Jams in microfilm transport Debris in track or dirton belt drive

Clean track and belts perPM procedure.

Transport belt driveadjustment bad

Adjust belt drive to T&A3304 4124.

Track wall gapadjustment bad

Adjust track wall gap toT&As 3304 4090 and3304 4132.

Broken drive belt Replace drive belt.

Microfilmer reporting NotReady. No reason can befound.

Serial interface failed Replace AA03 (MIIB),Microfilm Controller PCBA.


Section 13 Power Supply

150000

To troubleshoot problems with the NDP power supply systems, refer to the "Power SupplyAdjustment" T&A (Part #2493 6239) in the NDP Field Test and Reference Document.

Power Supply



Section 14 Machine Checks

This section describes machine checks, which are part of the diagnostic tools for theNDP 1150 and NDP 1825 Document Processors. Machine checks are declared by sortersystem software whenever certain error conditions occur that need to be brought to theattention of the customer service engineer and/or sorter programmers.

The diagnostic flowchart in Figure 14-1 shows how machine checks work with otherdiagnostic tools.

Diagnostic Flow

POC/MTR

Error Code

Displayed

Machine

Check

Displayed

Performance or

other problem

Go to appropriate

section and follow

diagnostic

procedure under

Error Code

Review Machine Check

probable causes

in this section

Read introductionand refer to CCC chart

for diagnosticprocedures

in Section 12

Figure 14–1. Diagnostic Flow Chart

Machine Checks


Machine Check ScreenWhenever a machine check is declared, a screen is displayed that contains importantinformation relating to the particular error. This is shown in Figure 14-2.

MACHINE CHECK

<MACHINE CHECK TYPE>

ERROR NUMBER:

<DESCRIPTION LINE 1><DESCRIPTION LINE 2>

<MACHINE CHECK CAUSE>

<xmit> TO RECOVER

--------------------------------------------------------------------

FOR FIELD ENGINEER/PROGRAMMER USE ONLY:

TASK: xx PC: xxxxxxxx EEW: xxxx xxxxxxxx xxxx º

Figure 14–2. Machine Check Screen

Machine Checks


Table 14-1 explains the screen field terms used in Figure 14-2.

Table 14–1. Field Descriptions for Machine Check Screen

MACHINE CHECKTYPE

Describes the particular type of error (such as SYSTEMSOFTWARE or PROGRAM).

ERROR NUMBER Is the number assigned to the particular error.

DESCRIPTIONLINES

Describes the error being declared.

MACHINE CHECKCAUSE

Is the probable cause of the error (such as SOFTWARE,HARDWARE, ELECTRICAL, MECHANICAL, or DATA COMM).

TASK Represents the number of the task declaring the error.

PC Represents the program counter where the error wasdetected.

EEW Represents extended error words - status information thathelps define the error condition.

Values for each of these fields are listed in later subsections. The machine check errornumbers are followed immediately by the Extended Error Words.

Machine Checks


Diagnosis of Machine Check ConditionsWhen a machine check condition occurs, follow this procedure:

1. Find the 4-digit machine check error number in a subsection under the "Error Number"subsection. Entries for error numbers can include the Extended Error Word (EEW);the possible hardware cause (PHC) of the condition;, or other diagnostic referenceinformation.

2. Follow the instructions under the error number. The EEW should be decoded bylooking up the non-zero, alphabetic digits found in the EEW subsection. EEWinformation immediately follows the error number listings.

General CausesMachine checks can have many causes: hardware, software, and environmental. Singleoccurrences of machine checks can be caused by electrical power line disturbances orelectrostatic discharges (ESDs). A single occurrence of a machine check should be fullylogged for future reference. If a machine check repeats, it is symptomatic of a hardware orsoftware problem.

In general, machine checks can be caused by the following:

• A noisy or out-of-adjustment + 5 volt logic supply

• Dirty or not fully seated card contacts

• Improper initiation of online programs or mode changes

• Improperly written customer sort programs

Any hardware-specific machine check (for conditions such as low vacuum; circuit breakeropen; or related to the feeder, read station, microfilmer, or imaging module) indicates apossible hardware fault in the respective hardware area. You should run the MTRs for thatarea to help identify the cause of the machine check.

Machine Checks


EEW DefinitionsThe following table (Table 14-2) defines abbreviations that appear in the machine checkEEWs found in this section.

Table 14–2. Machine Check General Definitions

CC SVC Opcode issued by task

CM CAR Unit message opcodes

CR CAR Unit message response status

CS CAR driver SVC result status

CT CAR Unit operating state

DS Bisync - data comm PIO SVC result status

EF Emulation - 4A Driver SVC Function code

ES Emulation - 4A Driver PIO SVC result status

FI File Manager error codes

FM Forms Manager error codes

HIT Host Interface Task

KS Kludge 4A - data comm PIO SVC result status

LET Local Environment Task

MB Modify Configuration buffer

PS Poll-Select Driver (CRT) PIO SVC result status

RB Read Configuration buffer

SRT Sort Task

ST CAR Unit operating state

TF Transport Driver SVC Function Code

TS Transport Driver PIO SVC result status

UA User buffer address

Machine Checks


Machine Check TypeThe MACHINE CHECK TYPE field on the machine check screen has short descriptions ofthe area or operation affected by the machine check, including SYSTEM SOFTWARE,PROGRAM, or FIRMWARE CHECK. More machine check type information appears in thefollowing "Error Number" subsection.

Description LinesThese lines on the machine check screen describe the error being declared. "CIRCUITBREAKER OPEN" is an example of a description line.

Machine Check CauseThe MACHINE CHECK CAUSE field on the machine check screen shows the probablecause of the error, such as SOFTWARE, HARDWARE, ELECTRICAL, MECHANICAL, orDATA COMM.

TaskThe TASK field on the machine check screen represents the number of the task declaringthe error. The following subsections list the task codes for different operations.

NDP 1150/NDP 1825 Task NumberTable 14-3 lists task numbers for different parts of system software.

Table 14–3. NDP 1150/NDP1825 Task Number

1 Local Environment Task

2 Firmware Screen Task

3 Status Monitor Task

5 Host Interface Task

6 Sort Task

$A Initialization Task

$C Forms Manager

Machine Checks


SVC Message OpcodesSVC message opcodes are listed in the following subsections for:

• Local Environment Task (Table 14-4)

• Firmware Screen Task (Table 14-5)

• Host Interface Task (Table 14-6)

• Sort Task (Table 14-7)

Machine Checks


Local Environment Task

Table 14-4 lists SVC message opcodes for the Local Environment Task.

Table 14–4. SVC Message Opcodes -- Local Environment Task

Opcode Definition

01 Enter No_Mode

02 Terminate task

03 Enter Offline mode

04 Enter Online mode

07 Machine check has been declared

08 Recover from machine check

09 Unsolicited input

0A Solicited input

0D Enter Snapshot

0E Exit Snapshot

0F Sorter is ready

10 User display done

11 Execute user sort program

12 Disk operation failed

13 Disk operation successful

20 Display user sort program screen

21 Get input from operator

22 Start screen processing

23 Stop screen processing

24 User sort program halted

25 Host screen write

30 Start monitoring

31 Stop monitoring

51 User sort program is loading

Machine Checks


Firmware Screen Task

Table 14-5 lists SVC message opcodes for the Firmware Screen Task.

Table 14–5. SVC Message Opcodes -- Firmware Screen Task

Opcode Definition

21 Start offload

22 Start emulation

23 Enter no mode

24 Enter online

25 Enter offline

26 Execute user sort program

27 Load and execute user sortprogram

28 Load and execute utility asPT1TSK

29 Load and execute utility asPT2TSK

2A Display done

2B Solicited operator input

2C Unsolicited operator input

2D Microfilmer header

2F Enter snapshot

Machine Checks


Host Interface Task

Table 14-6 lists SVC message opcodes for the Host Interface Task.

Table 14–6. SVC Message Opcodes --Host Interface Task

Opcode Definition

51 User sort program downloaded

53 Enter idle mode

54 Enter sort mode

55 Enter recall mode

56 Enter transfer mode

57 Enter echo mode

58 Host reset started

59 Host reset completed

5B Host screen write

Machine Checks


Sort Task

Table 14-7 lists SVC message opcodes for the Sort Task.

Table 14–7. SVC Message Opcodes --Sort Task

Code Definition

61 Start flow

62 Stop flow

64 Display user sort program screen

65 Accept operator input

66 Ready failed

67 User sort program halted

68 Open disk file

69 Close disk file

6A Read file (single sector)

6B Write file (single sector)

6C Write file (multiple sectors)

6D Read file (multiple sectors)

6E Initialize disk

6F Format disk

70 Allocate disk file

PC (Program Counter)The PC field on the machine check screen represents the program counter where the errorwas detected. An example is 00050FAA.

Machine Checks


Machine Check Error NumberThe ERROR NUMBER field on the machine check screen is the first step in decoding amachine check condition. This field includes a number (ranging from one to fournumbers) that gives the CSE a basic indication of the error causing the machine check.The error number helps lead the CSE to the Extended Error Word (EEW), which givesthem a more detailed description of the problem. EEWs are described immediately afterthis machine check error number subsection.

Offload and Emulation Machine Check Error NumbersThe followings subsections list (in numerical order) the 4-digit error numbers that are thefirst indication of a machine check condition.

All machine checks can be declared in either offload or emulation mode, except for themachine checks specified in Table 14-8.

Table 14–8. Offload and EmulationMachine Check Error Numbers

Machine CheckError Number

Offloadonly

Emulationonly

5xxx *

60Ax *

60Cx *

62xx *

66xx *

6800 *

67xx *

6801 *

6802 *

Machine Checks


0001-0092, 00C1 (MTOS SVC)This subsection lists error numbers for MTOS SVC errors. The Probable Hardware Cause(PHC) for each MTOS SVC error is:

PHC = System disk bad/corruptedDirty/bad disk driveCard 17

Note: The following errors are generated by the Multitasking Operating System

(MTOS) of the NDP 1xxx. These errors should be recorded and reported to a

support engineer at the Plymouth (Michigan) Development Center.

0001 MTOS SVC FAILED

EEW: MSMS MSMS 0000 0000

MS: MTOS defined status of SVC

0003 PAUFIN / PAUSTR TIMEOUT

EEW: TNRA CMCL CUCT 0000

TN: number of task being startedRA: restart argumentCM: coordination modeCL: coordination local event flagCU: coordination unitsCT: coordination time

0060 PARAMETER ERROR: PAUSEEF

EEW: PTPT PTPT FFFF FFFF

PT: pause time in millisecondsFF: function flags for event IO

0070 PARAMETER ERROR: RECEIVE


MS: MTOS defined status for SVC

Machine Checks


0081 TASK NOT PAUSED (RESUME ISSUED TO A TASK NOT PAUSED)

EEW: TRTN 0000 0000 0000

TR: Number of task issuing resumeTN: Number of task to be resumed

0091 MAILBOX MESSAGE NOT ACKNOWLEDGED

EEW: RCOP 0000 0000 0000

RC: Receiving taskOP: Message Opcode

0092 MAILBOX BUFFER NOT ALLOCATED

EEW: N/A

00C1 MEMORY I/O COPY INCOMPLETE

EEW: CCCC CCCC LALA LALA

CC: Condition CodesLA: Last "to address" copied correctly

Machine Checks


0100-0112 (File Manager)0100 FILE MANAGER ERROR

EEW: FIFI FIFI 0000 0000

PHC = System disk bad/corrupted Dirty/bad disk drive Card 17

0111 FILE ID CONVERSION ERROR (TXT_TO_FID)

EEW: ECEC ECEC 0000 0000

EC: Error code from TXT_TO_FID routine


0112 DISK ERROR (F_DIRECT) IN FUNCTION: DSKOK

EEW: SCSC SCSC 0000 0000

SC: Status code from F_DIRECT routine


0200 (Forms Manager)0200 FORMS MANAGER ERROR

EEW: FMFM FMFM 0000 0000


Machine Checks


0300 (Program/Task Loading Routine)0300 TCB ROUTINE ERROR


MS: MTOS defined error for SVC


0401-0405 (Miscellaneous PIO Routines)0401 TRANSPORT SCAN FAILED

EEW: TSTS TSTS 0000 0000

PHC = Card 8 Card 2, 5, 10

0402 FAILED TO FIND FIRST JAM/MISSORT LOCATION


PHC = Card 8

0403 BOL RESET FAILED


PHC = Card 8

0404 GATE FAULT / TRACK ERROR RESET FAILED


PHC = Card 8

0405 RESET TOO-LATE-TO-PKT FAILED


PHC = Card 8

Machine Checks


0611-0613 (Literal Handling)0611 LITERAL HEADER VERSION MISMATCH

EEW: DSDS DSDS 0000 0000

DS: Directory starting address


0612 LITERAL GROUP MISMATCH

EEW: LGLG LGLG LNLN LNLN

LG: Literal GroupLN: Literal Name


0613 LITERAL NOT FOUND

EEW: DSDS DSDS DEDE DEDE

DS: Directory Starting AddressDE: Directory Ending Address


Machine Checks


1001-1353 (Local Environment Task)1001 TIMEOUT WAITING FOR INITIALIZATION TASK TO FINISH

EEW: 0000 0000 0000 0000


1002 INVALID MAILBOX MESSAGE OPCODE

EEW: OPOP OPOP 0000 0000

OP: OpCode


1004 READ TRANSPORT STATUS FAILED OR TIMED OUT


PHC = Card 8 Card 17

1005 TIMEOUT WAITING ON STOP TASK REQUEST (FWS/MON) AT START FLOW

EEW: 0000 0000 0000 0000


1006 OPERATOR INITIATED MICROFILM HEADER FAILED


PHC = Card 3

1009 TIMEOUT WAITING FOR FIRMWARE SCREEN TASK TO (RE) START

EEW: 0000 0000 0000 0000


Machine Checks


1110 SORT PROGRAM REQUEST TO OPEN FILE WHEN FILE ALREADY OPEN

EEW: 0000 0000 0000 0000


1120 SORT PROGRAM REQUEST TO CLOSE FILE WHEN NO FILE OPEN

EEW: 0000 0000 0000 0000


1121 SORT PROGRAM REQUEST TO READ FILE WHEN NO FILE OPEN

EEW: 0000 0000 0000 0000


1122 SORT PROGRAM REQUEST TO WRITE FILE WHEN NO FILE OPEN

EEW: 0000 0000 0000 0000


1123 SORT PROGRAM REQUEST TO UPDATE DISK WITH OPEN FILE(S)

EEW: 0000 0000 0000 0000


1131 SORT PROGRAM REQUEST TO READ FILE WITH BAD BUFFER ADDRESS

EEW: 0000 0000 0000 0000


Machine Checks


1132 SORT PROGRAM REQUEST TO WRITE FILE WITH BAD BUFFER ADDRESS

EEW: 0000 0000 0000 0000


1300 UTILITY TASK ALREADY ACTIVE

EEW: 0000 0000 0000 0000


1320 INSUFFICIENT STACK/HEAP SPACE FOR UTILITY

EEW: HLHL HLHL HAHA HAHA

HL: Location of heap areaHA: Heap space available


1331 PROGRAM LOAD ADDRESS OVERLAPS FIRMWARE

EEW: LALA LALA 0000 0000

LA: Load address


1350 UNABLE TO ALLOCATE HOST INTERFACE ENDPOINT

EEW: RCRC RCRC RLRL RLRL

RC: FIT result code

RL: FIT result class

PHC = ??

Machine Checks


1351 UNABLE TO CREATE HOST INTERFACE ASSOCIATION TO THE PC


RC: FIT result code


PHC = ??

1352 UNABLE TO ALLOCATE NOTICE INTERFACE ENDPOINT


RC: FIT result code


PHC = ??

1353 UNABLE TO CREATE NOTICE INTERFACE ENDPOINT TO THE PC


RC: FIT result code


PHC = ??

Machine Checks


2001-2401 (Firmware Screen Task)2001 INVALID SVC MESSAGE OPCODE ("START" EXPECTED)

EEW: OP00 0000 0000 0000

OP: Opcode


2002 INVALID SVC MESSAGE OPCODE (IN MAIN LOOP)

EEW: OP00 0000 0000 0000

OP: Opcode


2004 EMULATION DATACOMM CHECK FAILED

EEW: 0000 0000 ESES ESES

PHC = Card 16/18 Card 17

2100 READ FROM CRT FAILED

EEW: 0000 0000 PSPS PSPS

PHC = CRT cable connection CRT bad/configured wrong Card 17

2101 READ FROM CRT DURING TERMINAL RECONFIGURE FAILED

EEW: RSRS RSRS 0000 0000

RS: BPS/Screen Read result status

PHC = ??

Machine Checks


2103 NOT READING FROM CRT



2104 ALREADY READING FROM CRT



2105 NON-MENU DISPLAY STATE IN MENU HANDLER

EEW: 0000 00DS 0000 0000


2201 GET DOCUMENT DATA QUEUE INDEX FAILED

EEW: FPFP FPFP CPCP CPCP

FP: Pointer to the first Data Queue elementCP: Pointer to the current Data Queue element


2202 NON-EXCEPTION DISPLAY STATE IN EXCEPTION HANDLER

EEW: 0000 00DS 0000 0000

DS: Display state (0-43)


Machine Checks


2204 AREA 1 INTERLOCK SHORTED (COMMON INTERLOCK LINE IS SHORTED TOGROUND)

EEW: 0000 0000 0000 0000

PHC = Short on Intmux line in Area 1, NIE, microfilmer, or imaging module Card 8

2205 LAST-GOOD-DISPOSE NOT FOUND IN DATA QUEUE

EEW: 00LN XXXX XXXX XXXX

Note: LN represents the LastGoodDispose document ID length, and XXXX XXXX XXXX

represents the least significant 6 bytes of the LastGoodDispose document ID

PHC = Card 15 Card 17 System disk

2206 TIMEOUT WAITING FOR LAST-GOOD-DISPOSE SEMAPHORE

EEW: 0000 0000 0000 0000

PHC = Card 17 System disk

2207 UNEXPECTED STATE OF CAR UNIT

EEW: CSCS CSCS CMCM STCR

CM (left byte) = CAR Unit Message code received by CAR Unit. CM (right byte) = CAR Unit Message code sent by DP.


2208 NON-TIMEOUT ERROR ON CAR INTERFACE



PHC = Card 19 Card 17 CAR cable connection

Machine Checks


2209 REQUEST TO CAR UNIT FAILED



PHC = Card 19 Card 17 CAR cable connection

220A TIMEOUT WAITING FOR IMAGE-QUALITY-LIST SEMAPHORE

EEW: 0000 0000 0000 0000

PHC = ??

220B SCSI LINK TO CAR UNIT IS HUNG

EEW: RSRS RSRS 0000 0000

RS: CAR I/O request result status

PHC = ??

2401 IMAGE QUALITY ERROR DOCID NOT FOUND IN DATA QUEUE

EEW: NFLN IDID IDID IDID

NF: number of items not found in data queue

LN: docid length of last (most recent) item not found

ID: docid of last (most recent) item not found

PHC = ??

Machine Checks


3001-3500 (Status Monitor Task)3001 INVALID SVC MESSAGE OPCODE ("START" EXPECTED)

EEW: 0000 0000 0000 0000


3002 INVALID SVC MESSAGE OPCODE ("STOP" EXPECTED)

EEW: 0000 0000 0000 0000


3100 GLOBAL MEMORY TEST AREA CORRUPTED

EEW: 0000 000X 2324 2526

X: Memory test number (1 - E)23242526 = Memory test pattern

PHC = Card 17

3201 CIRCUIT BREAKER OPEN

EEW: 0000 0000 0000 0000

PHC = Circuit breaker tripped Fuse in AC control blown Card CABB1 Circuit breaker auxiliary contacts open/wiring error

3202 LOW VACUUM

EEW: 0000 0000 0000 0000

PHC = Low double-document or OCR reader vacuum Vacuum switch Card CABB1 Hose leaking or disconnected

Machine Checks


3300 NONIMPACT ENDORSER: INK TRAP

EEW: 0000 0000 0000 0000

PHC = Ink trap switch/wiring Card 9

3301 NONIMPACT ENDORSER: NO INK

EEW: 0000 0000 0000 0000

PHC = NIE needs ink Ink leak No ink switch Card 9

3302 NONIMPACT ENDORSER: JETS OFF WHILE READY

EEW: 0000 0000 0000 0000

PHC = Card 9

3303 NONIMPACT ENDORSER: PUMP OFF WHILE READY

EEW: 0000 0000 0000 0000

PHC = Card 9

3401 MICROFILMER: POWER FAILED

EEW: 0000 0000 0000 0000

PHC = Card 3

3402 MICROFILMER: INVALID ERROR REPORTED


PHC = Card 3

3500 NIE FIRMWARE DETECTED DATA ERROR


PHC = Card 9

Machine Checks


4001-4002 (Snapshot Task)4001 ERROR IN SNAPSHOT TASK MENU HANDLER

EEW: 0000 0000 0000 0000

PHC = ??

4002 DATA COMM INITIALIZATION ERROR WITH SNAPSHOT TASK

EEW: RCRC RCRC 0000 0000

RC: FIT result code

PHC: ??

Machine Checks


5000-5901, 5AF8-5C02 (Host Interface)5001 DATA COMM INITIALIZATION ERROR WITH HOST INTERFACE TASK

EEW: RCRC RCRC 0000 0000

RC: FIT result code

PHC: ??

5100 INVALID MESSAGE RECEIVED FROM LOCAL ENVIRONMENT TASK

EEW: OPTS 0000 0000 0000

OP: Invalid SVC OpcodeTS: Sending Task#

PHC = Card 17 System disk Card 16/18

51F1 TIMEOUT WAITING LET RESPONSE TO ENTER IDLE

EEW: 0000 0000 0000 0000


51F2 TIMEOUT WAITING LET RESPONSE TO ENTER SORT

EEW: 0000 0000 0000 0000


51F3 TIMEOUT WAITING LET RESPONSE TO ENTER ECHO

EEW: 0000 0000 0000 0000


Machine Checks


51F4 TIMEOUT WAITING LET RESPONSE TO ENTER RECALL

EEW: 0000 0000 0000 0000


51F5 TIMEOUT WAITING LET RESPONSE TO ENTER TRANSFER

EEW: 0000 0000 0000 0000


5200 INVALID MESSAGE RECEIVED FROM SORT TASK

EEW: 0000 0000 0000 0000


52F1 TIMEOUT WAITING SRT RESPONSE TO STOP FLOW REQUEST

EEW: 0000 0000 0000 0000


52F2 TIMEOUT WAITING SRT RESPONSE TO USER SORT

PROGRAM LOADED

EEW: 0000 0000 0000 0000


5300 INVALID SCAN MESSAGE

EEW: OPTS 0000 0000 0000

OP: Invalid SVC OpcodeTS: Sending Task#


Machine Checks


53F1 LET DID NOT RESPOND TO HOST WRITE SCREEN

EEW: 0000 0000 0000 0000


5400 INVALID SENDER TO HIT MBX

EEW: 0000 0000 0000 0000


5500 INVALID STATUS RETURNED FROM DATA COMM DRIVER

EEW: 0000 0000 0000 0000

Refer to "DS -- Data Comm EEW" for more EEW information.

PHC = Card 16/18 System disk Card 17

5700 HIT SDB REQUEST WAS IMPROPER

EEW: 0000 0000 0000 0000


5800 DATA COMM DRIVER DID NOT RECEIVE REQUEST

EEW: 0000 0000 0000 0000



Machine Checks


5810 ERROR RETURNED FROM CSL_RECEIVE WHILE WAITING FOR HOSTCOMMAND

EEW: RCRC RCRC DBDB DBDB

RC: FIT result code or event code

DB: miscellaneous debug info (for systems programmers)

PHC: ??

5811 ERROR RETURNED FROM CSL_SEND WHILE WAITING FOR HOST COMMAND




PHC: ??

5812 ERROR RETURNED FROM CSL_RECEIVE WHILE SENDING RESPONSE TOHOST




PHC: ??

5813 ERROR RETURNED FROM CSL_SEND WHILE SENDING RESPONSE TO HOST




PHC: ??

5901 LET DID NOT RECEIVE MESSAGE

EEW: XXOP 0000 0000 0000

XX: UndefinedOP: SVC Opcode sent to let


Machine Checks


5AF8 DATA COMM DRIVER TRANSMIT RESPONSE EXCEPTION

EEW: 0000 0000 0000 0000



5AF9 DATA COMM DRIVER NO LINE ACTIVITY

EEW: 0000 0000 0000 0000



5AFA DATA COMM DRIVER ONLINE REQUEST ERROR

EEW: 0000 0000 0000 0000



5AFB DATA COMM DRIVER HARDWARE ERROR, RECOVERY MAY REQUIRE ARESET OF THE SORTER

EEW: 0000 0000 0000 0000


PHC = Card 16/18 Host connecting cables Improper host software invoked

5AFC DATA COMM DRIVER TIMEOUT

EEW: 0000 0000 0000 0000



5AFD DATA COMM DRIVER UNIT OFF LINE

Machine Checks


EEW: 0000 0000 0000 0000



5AFE DATA COMM DRIVER RESERVE OR RELEASE ERROR

EEW: 0000 0000 0000 0000



5AFF DATA COMM DRIVER RECEIVED INVALID PARAMETER

EEW: 0000 0000 0000 0000



5C01 NO MESSAGE, NO COMMAND, BUT HIT WOKE UP

EEW: 0000 0000 0000 0000


5C02 HIT IN INVALID HOST MODE

EEW: 0000 0000 0000 0000


Machine Checks


6001-6093, 60A0-60F0, 6200-6802 (Sort Task)6001 TRANSPORT PIO SVC FAILED: BAD PARAMETER

EEW: TFTF TSTS TSTS 0000


6002 TRANSPORT PIO SVC FAILED: RESERVE/RELEASE ERROR


PHC = Card 17

6003 TRANSPORT PIO SVC FAILED: UNIT OFFLINE


PHC = Card 17Card 16/18

6004 TRANSPORT PIO SVC FAILED: TIMED OUT


PHC = Card 17 Card 16/18 Card 8

6005 TRANSPORT PIO SVC FAILED: ONLINE ERROR


PHC = Card 17 Card 16/18

6006 TRANSPORT DRIVER PIO TIMED OUT (WAITING FOR ACK)



600F INVALID INTERRUPT WHEN IDLE (CMD RESULT)


PHC = Card 8 Card 3

Machine Checks


6010 INVALID INTERRUPT WHEN IDLE


PHC = Card 8 Card 3

6011 INVALID INTERRUPT WHEN SORTER READY (CMD RESULT)


PHC = Card 8 Card 3

6012 INVALID INTERRUPT WHEN SORTER READY


PHC = Card 8 Card 3

6013 INVALID INTERRUPT WHEN FLOWING


PHC = Card 8 Card 3

6014 INVALID INTERRUPT WHEN FLOWING (TRANSPORT STATUS)


PHC = Card 8 Card 3

6015 TRANSPORT DRIVER DOCUMENT QUEUE FULL


PHC = Card 10 Card 17 Card 8

6016 DOCUMENT DATA CHANNEL A OVERFLOW


PHC = Card 10 Card 11 Card 12 Card 13

Machine Checks


6017 DOCUMENT DATA CHANNEL B OVERFLOW



6018 DOCUMENT DATA CHANNEL A ERROR



6019 DOCUMENT DATA CHANNEL B ERROR



6021 DOCUMENT TOO LATE TO POCKET


PHC = Host system response too slow Card 17 Card 16/18 Card 8

6022 INVALID COMMAND RESULT DURING FLOWING


PHC = Card 8

6023 TIMEOUT WAITING FOR HEADER RESPONSE


PHC = Card 3

Machine Checks


6024 TRANSPORT DRIVER COULD NOT ACCESS MICROFILMER DUAL PORT

EEWW: TFTF TSTS TSTS 0000

PHC = Card 3

6025 INVALID MICROFILMER FUNCTION COMPLETE INTERRUPT WHEN READY


PHC = Card 3

6026 INVALID MICROFILMER FUNCTION COMPLETE INTERRUPT WHEN IDLE


PHC = Card 3

6030 INVALID RESPONSE TO FEED REQUEST


PHC = Card 8

6031 INVALID FEED REQUEST PARAMETER

EEWW: TFTF TSTS TSTS 0000


6033 ILLEGAL MERGE REQUEST - NOT FLOWING FROM PRIMARY FEED



6034 ATTEMPT TO FEED DOCUMENTS WITH NO READER ENABLED


PHC = None

6040 INVALID IMAGING MODULE MESSAGE LENGTH VALUE - DISPOSECOMMAND



Machine Checks


6041 TIMEOUT WAITING FOR IMAGING MODULE RESPONSE INTERRUPT



6042 INVALID RESPONSE FORMAT FROM IMAGING MODULE



6043 INVALID INTERRUPT RESPONSE - IMAGING MODULE REQUEST RESPONSEEXPECTED



6050 PREVIOUS DISPOSITION INCOMPLETE



Machine Checks


6051 POCKET SELECT ERROR



6052 INVALID RESPONSE TO DISPOSITION


PHC = Card 8

6053 INVALID ICM COMMAND PARAMETER



6055 FILM FOOTAGE COUNT FAILED TO INCREMENT


PHC = Card 3 Run microfilmer MTRs

6056 TRANSPORT DRIVER COU NOT ACCESS NIE DUAL-PORT


PHC = Card 9

6060 INVALID RESPONSE TO SLEW CMD: EXPECTING NOT READY


PHC = Card 3 Card 8

6061 INVALID RESPONSE TO SLEW CMD: EXPECTING BEGIN SLEW


PHC = Card 3 Card 8

Machine Checks


6062 INVALID RESPONSE TO SLEW CMD: EXPECTING END SLEW


PHC = Card 3 Card 8

6063 TIMEOUT WAITING FOR SORTER TO GO NOT READY


PHC = Card 8

6064 TIMEOUT WAITING FOR BEGIN SLEW


PHC = Card 3 Card 8

6065 TIMEOUT WAITING FOR END SLEW


PHC = Card 3 Card 8

6066 USER ISSUED SLEW REQUEST DURING FLOW



6067 USER ISSUED SLEW REQUEST WHEN CAMERA NOT PRESENT/POWEREDON



6068 BAD STATUS IN HW MICROFILMER REGISTER 2 OR 3 (SLEW)


PHC = Card 3

Machine Checks


6080 INVALID HEADER STYLE SELECTION



6081 INVALID ICM SELECTION ON HEADER COMMAND



6082 INVALID RESPONSE TO HEADER COMMAND - EXPECTED TIMEOUT



6083 BAD STATUS IN HW MICROFILMER REGISTER 2 OR 3 (HEADER)



6090 INVALID ICM SELECTION



6091 TIMEOUT WAITING FOR ICM COMPLETE



6092 INVALID RESPONSE TO ICM COMMAND - ICM COMPLETE EXPECTED



Machine Checks


6093 BAD STATUS IN HW MICROFILMER REGISTER 2 OR 3 (ICM)


PHC = Card 3

60A0 INVALID BATCH # RESPONSE


PHC = Card 8

60A1 TIMEOUT WAITING FOR BATCH # ADVANCE


PHC = Card 8

60B1 INVALID POCKET LIGHT RESPONSE CODE


PHC = Card 8

60C0 INVALID READ SYSTEM SELECTED: ONLY CM

EEW: MBMB TSTS TSTS 0000

PHC = Card 10

60C1 INVALID READ SYSTEM SELECTED: ONLY AC/DC


PHC = Card 10

60C2 INVALID READ SYSTEM SELECTED: ONLY AC


PHC = Card 10

60C3 INVALID READ SYSTEM SELECTED: ONLY DC


PHC = Card 10

Machine Checks


60C4 INVALID READ SYSTEM OPTIONS


PHC = Card 10

60C5 INVALID BLACK BAND OPTION



60C6 INVALID COMMAND DURING FLOW


PHC = Card 8

60C7 INVALID READ SYSTEM PRESENT

EEW: RBRB TSTS TSTS 0000


60C8 INVALID READ SYSTEM SELECTION DISCOVERED

EEW: RBRB TSTS TSTS 0000

PHC = Card 10

60D0 READ MICROFILMER STATUS FAILED DURING COMMUNICATE:READ STATUS



60D1 READ MICROFILMER STATUS FAILED DURING COMMUNICATE:

READ ATTRIBUTES



Machine Checks


60F0 INVALID RESULT STATUS FROM TRANSPORT DRIVER


PHC = Card 8

6200 SVC MESSAGE NOT ACKNOWLEDGED BY HOST INTERFACE TASK

EEW: 0000 0000 0000 0000


6201 INVALID SVC MESSAGE OPCODE RECEIVED FROM HOST

INTERFACE TASK

EEW: OPST 0000 0000 0000

OP: SVC OpcodeST: Sending task #


6400 SVC MESSAGE NOT ACKNOWLEDGED BY LOCAL ENVIRONMENT TASK

EEW: 0000 0000 0000 0000


6401 INVALID SVC MESSAGE OPCODE RECEIVED FROM LOCAL ENVIRONMENTTASK

EEW: OPST 0000 0000 0000

OP: SVC OpcodeST: Sending task #


Machine Checks


6601 REQUEST INFORMATION BLOCK (RIB) ADDRESS NOT IN USERS MEMORY

EEW: UAUA UAUA 0000 0000


6602 REQUEST INFORMATION BLOCK (RIB) ADDRESS NOT WORD BOUNDARY

EEW: UAUA UAUA 0000 0000


6603 USER BUFFER ADDRESS NOT IN USER MEMORY

EEW: UAUA UAUA RBRB RBRB

RB: User sort program Request InformationBlock ( RIB ) address


6604 USER BUFFER ADDRESS NOT WORD BOUNDARY

EEW: UAUA UAUA RBRB RBRB

RB: User sort program Request InformationBlock ( RIB ) address


6605 INVALID COMMUNICATE FROM SORT PROGRAM

EEW: OPOP 0000 RBRB RBRB

OP: Invalid OpcodeRB: User sort program Request InformationBlock ( RIB ) address


Machine Checks


6606 SORT PROGRAM INFINITE LOOP

EEW: 0000 0000 0000 0000


6640 ERROR IN PROCESSING IQE LIST FROM THE IMAGING MODULE

EEW: DBDB DBDB DBDB DBDB


PHC: ??

6650 OCR1 DATA OVERFLOW



6651 OCR2 DATA OVERFLOW



6652 OCR1 INTERRUPT BUT NO DATA IN FIFO



6653 OCR2 INTERRUPT BUT NO DATA IN FIFO



Machine Checks


6654 INVALID OCR MESSAGE LENGTH



6655 INVALID OCR1 MESSAGE FORMAT



6656 INVALID OCR2 MESSAGE FORMAT



6657 INVALID OCR SELECTION


PHC = System disk

6660 OCR FRAMING ERROR



6661 INVALID TRANSPORT DRIVER INTERRUPT WHILE PROCESSING AN

OCR REQUEST


PHC = System disk Card 10

6662 OCR1 OUTPUT FIFO FILLED UP


PHC = Card 10

Machine Checks


6663 OCR2 OUTPUT FIFO FILLED UP


PHC = Card 10

6670 ATTEMPT TO ENABLE OCR READER WITH NO CONTROLWARE LOADED

EEW: 0000 0000 0000 0000

PHC = None (invalid keyboard entry)

6680 TIMEOUT ON CAR DRIVER TO SORT TASK PIO ACKNOWLEDGE

EEW: 0000 0000 0000 0000


6681 CAR UNIT PARITY ERROR

EEW: 0000 0000 0000 0000

PHC = Card 19CAR cable connection

6682 IMPROPER PARAMETER TO CAR DRIVER

EEW: 0000 0000 0000 0000

PHC = Card 17System disk

6683 CAR QUEUE OVERFLOW

EEW: 0000 00SC AAAA AAAA

SC: Sync byte in CAR queue global memory record which would be overwritten.AA: Address of the CAR queue global memory record which would be overwritten.


Machine Checks


6684 UNEXPECTED ERROR CODE FROM CAR TASK

EEW: 00 00ST 00E1 00E2

E1: Extended error byte 1 returned from CAR taskE2: Extended error byte 1 returned from CAR task


6685 UNEXPECTED RESPONSE FROM CAR UNIT

EEW: 00CM 00ST 00CR 0000


6686 CAR UNIT APPEARS TO BE HUNG, RESET SORTER AND CAR UNIT TOCONTINUE

EEW: 0000 0000 0000 0000

PHC = Card 19 Card 17 CAR cable connection System disk

668F UNEXPECTED RESPONSE FROM CAR DRIVER

EEW: 00CM CSCS CSCS 0000


6701 4A DRIVER PIO SVC FAILED: BAD PARAMETER

EEW: EFEF ESES ESES 0000


6702 4A DRIVER PIO SVC FAILED: RESERVE/RELEASE ERROR



Machine Checks


6703 4A DRIVER PIO SVC FAILED: UNIT OFFLINE



6704 4A DRIVER PIO SVC FAILED: TIMED OUT



6705 4A DRIVER PIO SVC FAILED: FATAL CONTROLLER ERROR



6706 4A DRIVER PIO SVC FAILED: INVALID FUNCTION CODE



6707 4A DRIVER PIO SVC FAILED: INVALID UNIT NUMBER



6708 4A DRIVER PIO SVC FAILED: DRIVER NOT OPEN



Machine Checks


6709 4A DRIVER PIO SVC FAILED: DRIVER RECEIVED INVALID INTERRUPT



670A 4A DRIVER PIO SVC FAILED: CONTROLLER FAILED TO GO ONLINE



6720 ILLEGAL COMMAND RECEIVED FROM 4A DRIVER

EEW: XX00 0000 0000 0000

XX: Command Byte


6721 INVALID FEEDER COMMAND

EEW: XX00 0000 0000 0000

XX: Feed Command Byte

PHC = Card 17 IP20.5System disk Card 8

6722 DISPOSITION COMMAND DURING NON-FLOW

EEW: XX00 0000 0000 0000

XX: Command Byte

PHC = Card 17 IP20.5System disk Card 8

Machine Checks


6723 INVALID ENDORSER BAND LOAD NUMBER (PRELOAD)

EEW: XX00 0000 0000 0000

XX: Endorser band load command byte


6724 INVALID ICM COMMAND - NUMBER OF ICMS IS INVALID

EEW: XX00 0000 0000 0000

XX: Command byte and ICM count


6730 TIMED OUT WAITING FOR DISPOSITION

EEW: 0000 0000 0000 0000


6731 UNEXPECTED DISPOSITION RECEIVED



6732 ILLEGAL ENDORSER BAND LOAD NUMBER

EEW: XX00 0000 0000 0000

XX: Band load command byte


Machine Checks


6733 COMMAND INVALID DURING FLOW: ICM

EEW: XX00 0000 0000 0000

XX: ICM command byte


6734 COMMAND INVALID DURING FLOW: SLEW

EEW: XX00 0000 0000 0000

XX: SLEW command byte


6735 COMMAND INVALID DURING FLOW: HEADER

EEW: XX00 0000 0000 0000

XX: HEADER command byte


6736 COMMAND INVALID DURING FLOW: POCKET LIGHT

EEW: XX00 0000 0000 0000

XX: POCKET LIGHT command byte


6737 INVALID COMMAND OPCODE RECEIVED FROM 4A DRIVER

EEW: XX00 0000 0000 0000

XX: Illegal command byte

PHC = Card 16/18 Card 17 System disk

Machine Checks


6738 COMMAND INVALID DURING FLOW: START FEEDER


PHC = Card 17 Card 16/18 System disk

6739 COMMAND INVALID DURING FLOW: STATISTICS

EEW: XX00 0000 0000 0000

XX: Special character in byte 23 of endorsement text

PHC = Card 17 Card 16/18 System disk

67F0 INVALID 4A DRIVER PIO RESULT


PHC = Card 16/18 Card 17 System disk

6800 LOCAL ENVIRONMENT TASK FAILED TO SET OPERATION MODE

EEW: XX00 0000 0000 0000


6801 INVALID TRANSPORT DRIVER SVC ROUTINE OPCODE

EEW: XXXX 0000 0000 0000

XXXX: SVC code sent to transport driver SVC handler routine


6802 INVALID READ DOCUMENT SVC ISSUED WHEN NOT FLOWING



Machine Checks


A001-A102 (Utility Task)A001 OPEN TRANSPORT SVC TO TRANSPORT FAILED (TIMED OUT)


PHC = Card 17 IP20.5 System disk Card 8

A002 MODIFY CONFIG SVC TO TRANSPORT FAILED (TIMED OUT)


PHC = Card 17 System disk Card 10

A006 READ CONFIG SVC TO TRANSPORT FAILED (UNKNOWN)


PHC = Card 17 System disk Card 10

A010 ILLOGICAL NUMBER OF POCKET MODULES REPORTED

EEW: PMPM PMPM 0000 0000

PHC = 4-Pocket Driver card/jumpers Card 5

Machine Checks


A020 ATTEMPT TO SET MTOS TIMER FAILED


MS: MTOS status


A101 READ CONFIGURATION FROM TRANSPORT FAILED



A102 MODIFY CONFIGURATION TO TRANSPORT FAILED



Machine Checks


CAR Task Error CodeThe CAR Task error codes are defined in Table 14-9.

Table 14–9. CAR Task Error Code

Code Definition

01 CAR task has completed itsprocessing loop

02 CAR queue overwritten

03 CAR unit went into an unexpectedstate

04 CAR task timed out waiting on anacknowledgment from the CARdriver to a SVC

05 CAR task received anunsuccessful SVC response fromthe CAR driver

06 CAR task received "CAR dataavailable" SVC from Sort task, butno data was found

Machine Checks


CAR Unit Message Opcode Definitions (CM)The CAR Unit Message Opcodes are defined in Table 14-10.

Table 14–10. CAR Unit Message OpcodeDefinitions (CM)

Code Definition

01 Get POC results

02 Read CAR unit configuration

03 Get CAR unit status

04 Load CAR recognition software

05 Flow started

06 Flow stopped

07 CAR unit reset

08 CAR disposition

09 Get CAR amounts

0B Data capture mode

0C Test

0D Show nominal results

0E Back to IDLE state

0F Back to OP state

10 Show CAR recognition software information

11 Change timeout period

Machine Checks


CAR Unit Message Response Status Definitions (CR)The CAR unit message response status codes are defined in Table 14-11.

Table 14–11. CAR Unit MessageResponse Status Definitions (CR)

Code Definition

02 Invalid state for message

03 Bad parameter with message

04 Invalid message code

Machine Checks


EEW (Extended Error Word)The EEW field on the machine check screen represents extended error words, whichinclude status information that helps define the error condition. The EEW field cancontain up to 16 characters. When fewer than 16 characters appear in the EEW lists in thefollowing subsections, the remaining characters appear as zeros on the machine checkscreen.

The following subsections cover the 2-letter codes listed in Table 14-12:

Table 14–12. EEW (Extended Error Word) Codes

Code Definition

CS CAR Driver SVC Result Status

DS Data Comm EEW• Datacomm PIO SVC Result Status - Bisync for Data Comm PROM

Part Numbers 2973 2112, 2973 1866, 2973 1403, and 24944555

• Datacomm PIO SVC Result Status--Bisync for Data Comm PROMPart Numbers 2973 4282, 2973 4316, and 2973 4449

• Datacomm PIO SVC Result Status—Bisync for All Other Data CommPROMs

DS Menu Display State Error Codes

EF 4A Driver SVC Function Definitions - Emulation

ES Datacomm PIO SVC Result Status: Emulation

FI File Manager Error Codes

FM Forms Manager Error Codes

KS Datacomm PIO SVC Result Status: KLUDGE 4A

PS Poll-Select Driver CRT PIO SVC Result Status

ST CAR Unit Operating State Definitions

TF Transport Driver SVC Function Definitions

TS Transport Driver PIO SVC Result Status

Routine TXT_TO_FID Error Codes

Machine Checks


CS -- CAR Driver SVC Result StatusTable 14-13 includes a listing of explanations for EEWs related to the CAR Driver SVCResult Status (CS).

Table 14–13. CS -- CAR Driver SVC Result Status

EEW Explanation

F9 01 00 01 Incorrect length of command descriptor block (CDB); must be 8bytes.

F9 01 00 02 Command code not defined. Defined codes are:00h TEST UNIT READY02h REQUEST SENSE08h RECEIVE0Ah SEND12h INQUIRY

F9 01 00 03 Initiator ID not defined. One of the following IDs is expected:PC ID = 0NDP ID = 1

F9 01 00 04 SEND command not expected from PC. Command has not beenexecuted. Expected command = RECEIVE.

F9 01 00 05 Data length in CDB with SEND command greater than 2K bytes(PC). Command was executed but only for 2K bytes of data weretransferred.

F9 01 00 06 RECEIVE command not expected from PC. Command has notbeen executed. Expected command = SEND.

F9 01 00 07 Data length in CDB = 0 with SEND command from PC. Commandhas not been executed.

F9 01 00 08 Data length within M-AU board for RECEIVE command greater thanallocation length (PC). Command has been executed but data waslimited according to allocation length. Minimal allocation lengthshould be 2K bytes.

F9 01 00 09 Allocation length for SENSE command less than 8 bytes. No datahas been transferred.

F9 01 00 0A Undefined LUN from PC. Command has not been executed.Defined LUN for PC is:LUN = 0 for normal operationLUN = 1 for MTR operation

F9 01 00 0B RECEIVE command not expected from NDP. Command has notbeen executed. Expected command = SEND.

F9 01 00 0C Allocation length in CDB with INQUIRY command less than 96 bytes.Data has been transferred according to allocation length.

Machine Checks



EEW Explanation

F9 01 00 0D Data length within the M-AU board for RECEIVE command greaterthan allocation length (NDP). Command has been executed butdata was limited according to allocation length. Minimum allocationlength should be 2K bytes.

F9 01 00 0E SEND command not expected from NDP. Command has not beenexecuted. Expected command = RECEIVE.

F9 01 00 0F Data length in CDB with SEND command greater than 2K bytes(NDP). Command has been executed but only 2K bytes weretransferred.

F9 01 00 10 Allocation length with INQUIRY command equals zero, No datatransferred.

F9 01 00 11 Target has been selected without ATN. No identify message frominitiator received.

F9 01 00 12 Incorrect length of CDB and selected without ATN (see results F901 00 01 and F9 01 00 11).

F9 01 00 13 Data length in CDB = 0 with SEND command from NDP. Commandhas not been executed.

F9 01 00 14 RECEIVE command from NDP with allocation length = 0.Command has not been executed.

F9 01 00 15 RECEIVE command from PC with allocation length = 0. Commandhas not been executed.

F9 01 01 01 Data for RECEIVE command not available (PC). Command has notbeen executed and must be repeated until data is available.

F9 01 01 02 Data for RECEIVE command not available (NDP). Command has notbeen executed and must be repeated until data is available.

F9 01 02 00 Buffer for SEND command not free (PC). Command has not beenexecuted.

F9 01 02 03 Buffer for SEND command not free (NDP). Command has not beenexecuted.

F9 03 00 0X Hardware error : unexpected ESP status;X = status from CAR driver in CAR Unit.

Machine Checks



EEW Explanation

FB XX YY ZZ I/O request terminated by hard error.XX, YY, and ZZ values are defined as follows:

(ZZ) 01 CIB failure 02 CAR unit communication failure 03 Terminated - Failure logged in Host Adapter Error Status (HAES) 04 Terminated - SCSI Bus Reset 05 Terminated - Command Block Error 06 Open Receive Buffer Terminated - Nonexecutable CommandReceived 07 Command Block Error 08 Empty Incoming Mailbox 09 SVC Error 0A No Mailboxes Available 0B No CAR Board Present 0C SCSI target fatal error 80 Unexpected Reselection 81 ID Error 82 Abort Received 83 Bus Device Reset Received 84 Bus Reset 85 Host Adapter Error 86 Unexpected Selection 87 Mail Box Error

(YY) 00 No error 01 Host memory error 02 Select/Reselect timeout 03 CIB bus parity error 04 Message parity error received or message retried 05 Message reject sent 06 Message not sent 09 CIB failure 0A Buffer bounds error 0B Unexpected disconnection 0C Invalid bus phase 0D Initiator detected error 0E CIB received an abort 0F CIB received a bus device reset

(ZZ) 01 A SCSI recovery happened on last command 02 The SCSI logical unit address cannot be accessed 03 SCSI command terminated with a non-recoverable error 04 A SCSI non-recoverable hardware error 05 An illegal parameter in the CDB or additional parameters 06 Target may have been reset 07 A read or write was attempted on target’s protected area.

FE 00 00 00 I/O request had reserve/release error

Machine Checks



EEW Explanation

FF 00 00 00 I/O request had improper parameter

Machine Checks


DS -- Data Comm EEWThis subsection includes Extended Error Words for different Data Comm PROMs. Thissubsection includes three lists of EEWs:

• Datacomm PIO SVC Result Status - Bisync (DS) for Data Comm PROM Part Numbers2973 2112, 2973 1866, 2973 1403, and 2494 4555 (Table 14-14)

• Datacomm PIO SVC Result Status--Bisync (DS) for Data Comm PROM Part Numbers2973 4282, 2973 4316, and 2973 4449 (Table 14-15)

• Datacomm PIO SVC Result Status--Bisync (DS) for All Other Data Comm PROMs(Table 14-16)

Machine Checks


Table 14–14. DS -- EEWs for Data Comm (Part Numbers 2973 2112, 29731866, 2973 1403, and 2494 4555)

EEW Explanation

FB 02 XX XX System software tried to close the data comm processor board but could notget control of the semaphore used to close the board. Check the systemsoftware or the data comm processor program. They may have failed. Thedata comm processor board could have a hardware problem.

FB 03 XX XX The sorter data comm processor exceeded the maximum number of retriesallowed attempting to transmit a text message to the host after receiving ahost abort (EOT) in response to the sorter’s message. (The abort count, orthe number of aborts received from the host, exceeded the retry limit.) Thesorter is now waiting for a bid from the host. Perform the data comm MTRs,and check the host DLP for proper operation.

FB 04 XX XX The sorter data comm processor experienced a timeout waiting for the datacommunications driver (NDP system software) to send the data commprocessor a response message to a previously received host commandmessage. The data comm processor has exceeded the retry limit for sendingtemporary text delays (TTDs) to the host (used to retain control over the linewhile waiting for a response from the driver). The sorter has aborted (sent anEOT to the host) to give up the line. The sorter is now waiting for a bid fromthe host. Possibly, the User Sort Program is running too slowly to keep upwith the data comm compressor board.

FB 05 XX XX The data comm driver (NDP system software) passed an invalid responsemessage to the data comm processor manager to transmit to the host.Probably the actual length was too large or did not agree with the lengthstored within the message. Check the system software or the data commprocessor program. They may have failed. The data comm processor boardcould have a hardware failure.

FB 06 XX XX One of the following occurred:• The data comm processor received an invalid operation code from the

data comm driver while waiting for an Open command.• The data comm processor received an invalid operation code from the

data comm driver while receiving data.• The data comm processor received an invalid operation code from the

data comm driver while transferring data to the data comm driver.• The data comm processor received an invalid operation code from the

data comm driver while waiting for a response to a host command fromthe data comm driver.

• The data comm processor received an invalid operation code from thedata comm driver while waiting to transmit data to the host.

• Check the system software or the data comm processor program. Theymay have failed. The data comm processor board could have ahardware failure.

Machine Checks



EEW Explanation

FB 08 XX XX The data comm processor exceeded the maximum number of retries allowedwaiting for a valid acknowledge (ACK0) from the host to the sorter bid. (Thesorter received an EOT, an invalid response, or no response to thebid.)Perform the data comm MTRs, and check the host DLP for properoperation.

FB 09 XX XX The data comm processor experienced a failure transmitting a character.

The byte following FB 09 indicates which state the protocol machine was inwhen the failure was detected. Listed next are the possible values and thecorresponding states when the error occurred:

01 - The sorter was transmitting ACK0.02 - The sorter was transmitting EOT.03 - The sorter was transmitting ACK0.05 - The sorter was transmitting NAK.06 - The sorter was transmitting ACK1.07 - The sorter was transmitting a bid (ENQ).08 - The sorter was transmitting an abort (EOT).09 - The sorter was transmitting a TTD or forward abort.0A - The sorter was transmitting text to the host.0B - The sorter was transmitting ENQ to an invalid or no response from the host (after transmitting text to the host).

Perform the data comm MTRs, and check the host DLP for proper operation.

FB 0B XX XX One of the following occurred:

• The data comm processor exceeded the maximum number of retriesallowed while acknowledging a bid from the host. (The host did notrecognize the ACK0 from the sorter to its bid.)

• The data comm processor exceeded the maximum number of retriesallowed while transmitting NAKs to the host text. (The sorter is negativein acknowledging a message from the host.)


FB 0D XX XX The application message length was too large or the length did not agree withthe number of digits in the message.

FB 41 XX XX System software tried to answer a service request but found that the datacomm processor board was closed. Check the system software or the datacomm processor program. They may have failed. The data comm processorboard could have a hardware problem.

FB 51 XX XX The data comm driver (system software) experienced failure in attempting tocommunicate to the data comm processor board. Possibly, the data commprocessor could not gain control of the dual-port RAM semaphore.

FB 52 XX XX The data comm processor board returned an invalid response to the datacomm driver (system software).Check the system software or the data commprocessor program. They may have failed. The data comm processor boardcould have a hardware failure.

Machine Checks



EEW Explanation

FB 61 XX XX The host had aborted the command response protocol.

FB C0 XX XX The first CRC byte the data comm processor received from the host wasincorrect. Perform the data comm MTRs, and check the host DLP for properoperation. Possibly the sorter is not receiving characters correctly.

FF 01 XX XX One of the following occurred:• The data comm driver reported an invalid SVC parameter (NDP system

software failure).• The data comm driver reported an invalid unit number (NDP system

software failure).• The data comm driver reported an invalid SVC request (NDP system

software failure). The extended status is the request value (XX XX).

Machine Checks


Table 14–15. DS -- EEWs for Data Comm (Part Numbers 2973 4282, 29734316, and 2973 4449)

EEW Explanation

FB 02 XX XX System software tried to close the data comm processor board but could notget control of the semaphore used to close the board. Check the systemsoftware or the data comm processor program. They may have failed. Thedata comm processor board could have a hardware problem.


FB 0D XX XX The application message length was too large or the length did not agree withthe number of digits in the message.

FB 11 XX XX The data comm processor exceeded the maximum number of retries allowedwhile acknowledging a message from the host. (The host did not recognizethe ACK0 or ACK1 from the sorter to its message.)Perform the data commMTRs, and check the host DLP for proper operation.

FB 12 XX XX The data comm processor exceeded the maximum number of retries allowedwhile transmitting NAKs to the host text. (The sorter is negative inacknowledging a message from the host.)Perform the data comm MTRs, andcheck the host DLP for proper operation.

FB 14 XX XX The data comm processor exceeded the maximum number of retries allowedwaiting for a valid acknowledge (ACK0) from the host to the sorter bid. (Thesorter received an EOT, invalid response, or no response to the bid.)Performthe data comm MTRs, and check the host DLP for proper operation.

FB 15 XX XX The sorter data comm processor exceeded the maximum number of retriesavailable waiting for an acknowledge (ACK1) from the host to the text messagefrom the sorter. Perform the data comm MTRs, and check the host DLP forproper operation. Possibly the sorter is not receiving characters correctly.


FB 17 XX XX The sorter data comm processor exceeded the maximum number of NAKsallowed attempting to transmit a text message. Perform the data commMTRs, and check the host DLP for proper operation.

FB 21 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting for an Open command.

Machine Checks


FB 22 XX XX The data comm processor received an invalid operation code from the datacomm driver while receiving data.

FB 23 XX XX The data comm processor received an invalid operation code from the datacomm driver while transferring data to the data comm driver.

FB 24 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting for a response to a host command from the datacomm driver.

FB 25 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting to transmit data to the host.

FB 32 XX XX The sorter data comm processor experienced a timeout waiting for the datacomm driver (NDP system software) to send the data comm processor aresponse message to a previously received host command message. Thedata comm processor has exceeded the retry limit for sending temporary textdelays (TTDs) to the host (used to retain control over the line while waiting fora response from the driver). The sorter has aborted (sent an EOT to the host)to give up the line. The sorter is now waiting for a bid from the host.Possibly, the User Sort Program is running too slowly to keep up with the datacomm processor board.

FB 41 XX XX System software tried to answer a service request but found that the datacomm processor was closed. Check the system software or the data commprocessor program. They may have failed. The data comm processor boardcould have a hardware failure.

FB 51 XX XX The data comm driver (system software) experienced failure in attempting tocommunicate to the data comm processor board. The data comm processorprobably could not gain control of the dual-port RAM semaphore.

FB 52 XX XX The data comm processor board returned an invalid response to the datacomm driver (system software).

FB 61 XX XX The data comm processor experienced a failure transmitting a character. Thebyte following the FB 61 indicates which state the protocol machine was inwhen the failure was detected. Listed next are the possible values and thecorresponding states when the error occurred.

01 - The sorter was transmitting ACK0.02 - The sorter was transmitting EOT.03 - The sorter was transmitting ACK0.05 - The sorter was transmitting NAK.06 - The sorter was transmitting ACK1.07 - The sorter was transmitting a bid (ENQ).08 - The sorter was transmitting an abort (EOT).09 - The sorter was transmitting a TTD or forward abort.0A - The sorter was transmitting text to the host.0B - The sorter was transmitting ENQ to an invalid or no response from the host (after transmitting text to the host).Perform the data comm MTRs, and check the host DLP for proper operation.

FB 62 XX XX The data comm processor experienced failure transmitting a PAD character(FF).Perform the data comm MTRs, and check the host DLP for properoperation.

FB C0 XX XX The first CRC byte the data comm processor received from the host wasincorrect. Perform the data comm MTRs, and check the host DLP for properoperation. Possibly the sorter is not receiving characters correctly.

Machine Checks


FF 01 XX XX The data comm driver is reporting an invalid SVC parameter (NDP systemsoftware failure).

FF 02 XX XX The data comm driver is reporting an invalid unit number (NDP systemsoftware failure).

FF 03 XX XX The data comm driver is reporting an invalid SVC request (NDP systemsoftware failure). The extended status is the request value (XX XX).

Machine Checks


Table 14–16. DS -- EEWs for Data Comm (All Other Data Comm PROMs)

EEW Explanation

FB 02 XX XX System software tried to close the data comm compressor but could not getcontrol of the semaphore used to close the board. Check the systemsoftware or the data comm processor program. They may have failed. Thedata comm processor board could have a hardware problem.


FB 09 XX XX The data comm processor received too many ENQs from the host aftersending an ACK0 to a host line bid. Perform the data comm MTRs, andcheck the host DLP for proper operation.

FB 10 XX XX The data comm processor received more than the maximum allowablenumber of ENQs to a NAK of host text. Perform the data comm MTRs, andcheck the host DLP for proper operation.

FB 11 XX XX The data comm processor exceeded the maximum number of retries allowedwhile acknowledging a message from the host. (The host did not recognizethe ACK0 or ACK1 from the sorter to its message.)Perform the data commMTRs, and check the host DLP for proper operation.

FB 12 XX XX The data comm processor exceeded the maximum number of retries allowedwhile transmitting NAKs to the host text. (The sorter is negative inacknowledging a message from the host.)Perform the data comm MTRs, andcheck the host DLP for proper operation.

FB 14 XX XX The data comm processor exceeded the maximum number of retries allowedwaiting for a valid acknowledge (ACK0) from the host to the sorter bid. (Thesorter received an invalid response or no response to the bid.)Perform thedata comm MTRs, and check the host DLP for proper operation.

FB 15 XX XX The sorter data comm processor exceeded the maximum number of retriesavailable waiting for an acknowledge from the host to the text message fromthe sorter. Perform the data comm MTRs, and check the host DLP forproper operation.


FB 17 XX XX The sorter data comm processor exceeded the maximum number of NAKsallowed attempting to transmit a text message. Perform the data commMTRs, and check the host DLP for proper operation.

Machine Checks



FB 18 XX XX The host sent text more than the maximum allowable number of times in arow without a DLE STX. Perform the data comm MTRs, and check the hostDLP for proper operation.

FB 19 XX XX The host sent an EOT to the sorter line bid. Perform the data comm MTRs,and check the host DLP for proper operation.

FB 21 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting for an Open command.

FB 22 XX XX The data comm processor received an invalid operation code from the datacomm driver while receiving data.

FB 23 XX XX The data comm processor received an invalid operation code from the datacomm driver while transferring data to the data comm driver.

FB 24 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting for a response to a host command from the datacomm driver.

FB 25 XX XX The data comm processor received an invalid operation code from the datacomm driver while waiting to transmit data to the host.

FB 32 XX XX The sorter data comm processor experienced a timeout waiting for the datacomm driver to respond to a previously received host command message.The data comm processor has exceeded the retry limit for sendingtemporary text delays (TTDs) to the host (used to retain control over the linewhile waiting for a response from the driver). The sorter has aborted (sent anEOT to the host) to give up the line, and is now waiting for a bid from thehost. Possibly, the User Sort Program is running too slowly to keep up withthe data comm processor board.

FB 41 XX XX System software tried to answer a service request but found that the datacomm compressor board was closed. Check the system software or thedata comm processor program. They may have failed. The data commprocessor board could have a hardware failure.

FB 51 XX XX The data comm driver (system software) experienced failure in attempting tocommunicate to the data comm processor board. The data commprocessor probably could not gain control of the dual-port RAM semaphore.

FB 52 XX XX The data comm processor board returned an invalid response to the datacomm driver (system software).

Machine Checks



FB 61 XX XX The data comm processor experienced a failure transmitting a character.

The byte following the FB 61 indicates which state the protocol machine wasin when the failure was detected. Listed next are the possible values and thecorresponding states when the error occurred:

01 - The sorter was transmitting ACK0 to a line bid.02 - The sorter was transmitting EOT.03 - The sorter was transmitting ACK0 to text.05 - The sorter was transmitting NAK.06 - The sorter was transmitting ACK1 to text.07 - The sorter was transmitting a bid (ENQ).09 - The sorter was transmitting a TTD or forward abort.0A - The sorter was transmitting text to the host.0B - The sorter was transmitting ENQ to an invalid or no response from the host (after transmitting text to the host).OC - The sorter was transmitting an ACK to an inquiry.


FB 62 XX XX The data comm processor experienced failure transmitting a PAD character(FF).Perform the data comm MTRs, and check the host DLP for properoperation.

FF 01 XX XX The data comm driver is reporting an invalid SVC parameter (NDP systemsoftware failure).

FF 02 XX XX The data comm driver is reporting an invalid unit number (NDP systemsoftware failure).

FF 03 XX XX The data comm driver is reporting an invalid SVC request (NDP systemsoftware failure). The extended status is the request value (XX XX).

Machine Checks


DS -- Menu Display State Error CodesMenu Display State (DS) error codes are listed in Table 14-17.

Table 14–17. DS -- Menu DisplayState Error Codes

ErrorNumber

Definition

00 Main menu

01 Offload

02 Utility

03 Online

04 Offline

05 Execute USP

06 Accept unsolicited input

07 Debug-Aids

08 USP end-of-job

09 Microfilmer Header

0A Pass dial

0B Data queue

0C Start required

0D Primary hopper empty

0E Host

0F USP display

10 USP accept

11 Jam-Missort

12 Jam-Missort

13 Too late to pocket

14 Microfilmer slewing

15 Microfilmer header

16 NIE

17 Host Recall

18 Host Transfer

19 Host Echo

1A Host Reset

Machine Checks


Table 14–17. DS -- Menu DisplayState Error Codes

ErrorNumber

Definition

1B Loading

1C Disk operation

1D Motor error

1E Gate fault

1F Track error

20 Z-80 overload

21 BOL dead

22 Pocket light

23 Microfilmer

24 Secondary hopper empty

25 Full pocket

26 Interlock

27 Primary feeder jam

28 Secondary feeder jam

29 BOL blocked

2A Microfilmer skip

2B No state

Machine Checks


EF -- 4A Driver SVC Function Definitions - EmulationDefinition information relating to the 4A Driver SVC Function - Emulation (EF) is listed inTable 14-18.

Table 14–18. EF -- 4A Driver SVCFunction Definitions - Emulation

2 Open 4A interface

3 Close 4A interface

4 Send status to host

5 Send document to host

8 Send statistics to host

$0F Wait for host command

Machine Checks


ES -- Datacomm PIO SVC Result Status: EmulationTable 14-19 includes explanations of EEWs related to Datacomm PIO SVC Result Status:Emulation (ES).

Table 14–19. ES -- Datacomm PIO SVC Result Status: Emulation

EEW Explanation

FF 01 00 00 Invalid open parameter specified

FF 02 00 00 Invalid unit 1 SVC / Non-emulation unit 1 SVC

FF 03 XX 00 Invalid SVC requestedXX = request value

FB 01 00 00 Any SVC request before OPEN

FB 02 01 00 Timeout waiting for 4A controller to receive command from driver

FB 02 02 00 Timeout waiting to access dual-port via semaphore #1

FB 03 XX XX Invalid unit 0 SVC,XX XX = SVC request value

FB 04 XX XX Invalid unit 1 SVC,XX XX = SVC request value

FB 05 XX YY Invalid SVC - not unit 0 or 1,XX = unit #YY = SVC request value

FB 06 XX 00 Invalid ICM request value,XX = ICM count

FB 07 XX 00 Invalid IPC byte value from controller,XX = IPC byte

FB 10 XX 00 No buffer returned from GET_BUF routine,XX = buffer number

FB 11 00 00 Invalid queue entry

FB 12 00 00 Invalid command in queue

FB 13 00 00 Invalid send status command

FB 14 00 00 Go ready not set





FB 19 XX 00 Invalid strobe 1 entry, XX = entry

FB 1A XX 00 Not strobe 1 entry, XX = entry

FB 1B 00 00 Not slewing

Machine Checks


Table 14–19. ES -- Datacomm PIO SVC Result Status: Emulation

EEW Explanation

FB 1C XX 00 Invalid IF3 value, XX = value

FB 1D XX 00 Value not pocket select entryXX = entry

FB 1E XX 00 Invalid PSE entry, XX = entry

FB 1F XX 00 Invalid X value in STB1, XX = value

FB 20 XX 00 Invalid interrupt,XX = interrupt source register







FB 27 00 00 No buffer from memory management

FB 28 XX 00 Invalid FIFO1 entry,XX = entry

FB 29 XX 00 No FIFO entry,XX = interrupt source register

FB 2A XX 00 No FIFO entry,XX = interrupt source register

FB 2B XX 00 No FIFO entry,XX = interrupt source register

FB 2C XX 00 Invalid FCP entry,XX = entry

FB 2D 00 00 Go ready not set

FB 2E 00 00 Go ready not set

FB 30 00 00 4A failed to go online

FB F0 XX 00 4A Kludge mode open failure,XX = value

FB F1 XX 00 Emulation mode open failure,XX = value

Machine Checks


FI -- File Manager Error CodesTable 14-20 includes definitions of File Manager Error Codes (FI).

Table 14–20. FI -- File Manager Error Codes

ErrorNumber

Definition

00 No error

01 End of file in data block

02 PAUFIN timeout occurred

03 Hard error in data block

04 Hard error in FAB block

05 Hard error in directory block

06 Command incompatible with device

07 Device timeout error

08 FPBCMD out of range in command

09 Logical Channel number out of range

0A No file Channels available

0B No logical Channel numbers left

0C Logical Channel number not assigned

0D File reserved against request

0E Device reserved against request

0F Invalid FPBOPT in command

10 Incompatible FPBOPTs in command

11 Invalid file identifier

12 File already exists

13 File not found

14 Device not found

15 Access violation

16 Logical record length > segment size

17 Invalid record format, must be ASCII

18 Invalid key format

19 Key length error

1A No room left on disk

1B Insufficient memory space for operation

Machine Checks


Table 14–20. FI -- File Manager Error Codes

ErrorNumber

Definition

1C End of file in directory block

1D Key not found

1E Key already exists

1F Data buffer overflow

20 Mount violation

21 Volume dismount with files open

22 File must be closed

23 All files must be closed

24 Attempt to free a channel with pending

25 Unit reserved to abort open files

26 Internal FMS error

27 File must be reserved

28 unit must be reserved

29 Invalid time unit with PAUFIN

2A Invalid coordination mode in command

2B Size conflict during write

2C Variable length record must be > 0

2D Lock option inconsistent

2E No file open

2F No queue blocks available

Machine Checks


FM -- Forms Manager Error CodesDefinitions of Forms Manager Error Codes (FM) are listed in Table 14-21.

Table 14–21. FM -- Forms Manager Error Codes

ErrorNumber

Definition

64 Mailbox receive error

65 Illegal command byte

66 File could not be found

67 Version-Header mismatch

68 Bad record in forms file

69 Screen name not found

6A Field name not found

6B No more mailboxes available

6C Screen name mismatch SWRITE/SREAD

6D Mailbox number not found

6E Bad status return from PIO call in SREAD

6F Bad status return from PIO call in SWRITE

70 Bad file information in forms (.FM file)

71 Error during compaction (unloading)

72 Not current screen when SREAD from Vscreen

Machine Checks


KS -- Datacomm PIO SVC Result Status: KLUDGE 4ATable 14-22 includes explanations of EEWs for Datacomm PIO SVC Result Status:KLUDGE 4A (KS).

Table 14–22. KS -- Datacomm PIO SVC ResultStatus: KLUDGE 4A

EEW Explanation

FF 01 00 00 Invalid open parameter specified

FF 02 00 00 Invalid unit 1 SVC

FF 03 XX 00 Invalid SVC #, XX = SVC requested

FB 01 00 00 Go ready bit still set - sending SOKL

FB 02 00 00 Can’t get semaphore register 2 for closeSVC-OR-Go ready bit still set - sending stopflow

FB 03 00 00 Go ready bit still set - sending Id number

FB 04 00 00 Go ready bit not set - sending SOKL

FB 05 00 00 Go ready bit not set - sending stop flow

FB 06 00 00 Go ready bit not set - sending Id number

FB 07 XX 00 Invalid interrupt - PSE expected,XX = interrupt

FB 08 XX 00 Invalid interrupt - PSE expected,XX = interrupt

FB 0A XX 00 Invalid interrupt - SRUN expected,XX = interrupt

FB 0B XX 00 Invalid interrupt - DATA_AVL not cleared,XX = interrupt

FB 0C XX 00 Invalid interrupt - not NIFE interrupt,XX = interrupt

FB 0D XX 00 Invalid interrupt - PSE expected,XX = interrupt

FB 0E XX 00 Invalid interrupt - not NIFE interrupt,XX = interrupt

FB 0F XX 00 Invalid interrupt - XMIT_RDY not set,XX = interrupt

FB 15 XX 00 Invalid interrupt - timeout expected,XX = interrupt


Machine Checks



EEW Explanation


FB 18 XX 00 Invalid input FIFO entry - strobe 1 and not PSEXX = entry

FB 19 XX 00 Invalid input FIFO entry - invalid IF2,XX = entry

FB 1A XX 00 Invalid input FIFO entry - IF1_PSE expected,XX = entry

FB 1B XX 00 Invalid input FIFO entry - IF3_PSE expected,XX = entry

FB 1C XX 00 Invalid input FIFO entry - STB1 & bad IF2,XX = entry

FB 1D XX 00 Invalid input FIFO entry - IF1_PSE expected,XX = entry

FB 1E XX 00 Invalid input FIFO entry - IF1_BL1H expected,XX = entry

FB 1F XX 00 Invalid input FIFO entry - IF1_STB1 expected,XX = entry

FB 20 XX 00 Invalid input FIFO entry - IF3_SRUN expected,XX = entry

FB 21 XX 00 Invalid input FIFO entry - invalid PSE,XX = entry

FB 22 XX 00 Invalid input FIFO entry - invalid IF1,XX = entry

FB 23 XX 00 Invalid input FIFO entry - invalid BL_MASKmismatchXX = entry





FB 2A 00 00 No PSE response in time

FB 2B 00 00 Request from handler was not open

Machine Checks



EEW Explanation

FB 2E 00 00 SRUN did not go high in time

FB 2F 00 00 Waiting for data timeout

FB 30 00 00 Waiting for host response timeout

FB 31 00 00 Waiting for host response timeout

FB 32 00 00 Host aborted communication sequence

FB 33 00 00 Host aborted communication sequence

FB 34 00 00 Sorter did not get RESPONSE in time

FB 35 00 00 No input FIFO SOKL entry when expected

FB 43 00 00 Datacomm driver already open

FB 51 XX XX Timeout waiting for Semaphore register 1

FB 52 XX XX Invalid response from controller

FB F0 XX 00 Kludge open failure, XX = value

Machine Checks


PS -- Poll-Select Driver (CRT) PIO SVC Result StatusExplanations of EEWs relating to the Poll-Select Driver (CRT) PIO SVC Result Status (PS)are listed in Table 14-23.

Table 14–23. PS -- Poll-Select Driver (CRT) PIO SVC ResultStatus

EEW Explanation

FB 10 00 00 Invalid or no response received from the ET

FB 20 00 00 Data transfer failed as a result of too many NAKs

FB 30 00 00 Select failed because ET did not receive ready

FB 40 00 00 Hardware error detected

FB 50 00 00 READ canceled so that WRITE can run

Machine Checks


ST -- CAR Unit Operating State DefinitionsCAR Unit Operating State Definitions (ST) are listed in Table 14-24.

Table 14–24. ST -- CAR UnitOperating State Definitions

ErrorNumber

Definition

01 Initialize POC

02 Idle

03 POC failed

04 FLOW

06 Finish processing

08 Op

0A Test

0B Error

0C Sync Error

Machine Checks


TF -- Transport Driver SVC Function DefinitionsTable 14-25 lists error numbers for the Transport Driver SVC Function (TF).

Table 14–25. TF -- Transport DriverSVC Function Definitions

ErrorNumber

Definition

2 Open

3 Close

4 Feed Document

5 Read Document

6 Dispose Document

7 Read Transport status

9 Read Microfilmer status

A Slew Film

D Microfilm Header

E Microfilm ICM

F Reset BOL

10 Reset Gate fault/Track error

11 Read Configuration

12 Modify Configuration

13 Read Last Microfilmer ID #

14 Read Fault ID #

15 Batch # Advance #

16 Light Pocket Light

17 Transport Scan

18 Clear status bit in Driver

19 Read NIE statistics

1A Read microfilmer statistics

1E Imaging module command

1E Imaging module request

20 Read imaging module status

21 Read imaging module statistics

Machine Checks


Table 14–25. TF -- Transport DriverSVC Function Definitions

ErrorNumber

Definition

22 Read imaging module last gooddispose

23 Enable/disable imaging module

24 Clear imaging module error

25 Clear forced reject condition

27 Read OCR status

28 Read OCR statistics

29 Clear OCR error

2A Load OCR character set

2B Activate OCR character set

2C Read OCR1 parameters

2D Read OCR2 parameters

2E Select OCR1 parameters

2F Select OCR2 parameters

30 Read OCR1 configuration

31 Read OCR2 configuration

32 Load OCR controlware

34 Read OCR character subsets

Machine Checks


TS -- Transport Driver PIO SVC Result StatusExplanations for EEWs relating to the Transport Driver PIO SVC Result Status (TS) arelisted in Table 14-26.

Table 14–26. TS -- Transport Driver PIO SVC ResultStatus

EEW Explanation

FA 00 00 00 Unit not offline (online request error)

FB 01 00 00 SVC code number is invalid for Driver

FB 02 00 00 Interface not opened

FB 03 00 00 Interface already opened

FB 04 00 00 Sorter not idle when close SVC received

FB 05 00 00 Sorter not ready

FB 06 00 00 Flow not stopped

FB 07 00 00 Sorter went not ready when SVC issued

FB 08 XX 00 Feed request parameter error, XX =parameter value

FB 09 00 00 Sorter not flowing when stop flow issued

FB 0A 00 00 Illegal merge request

FB 0B 00 00 No document data available

FB 0C 00 00 Flow stopped

FB 0E 00 00 Pocket select error

FB 0F 00 00 Disposition too late

FB 10 00 00 Sorter still has document

FB 11 XX 00 Invalid ICM command on disposition,XX = command byte

FB 12 00 00 Function is illegal - no NIE present

FB 13 00 00 Function is illegal - no Microfilmer

FB 14 00 00 Microfilmer not powered on

FB 15 00 00 Microfilmer not ready

FB 17 XX 00 Invalid microfilmer header style on headercommandXX = header style

FB 18 XX 00 Invalid microfilmer ICM on header commandXX = ICM command byte

Machine Checks



EEW Explanation

FB 19 XX 00 Invalid microfilmer ICM command byte for ICMXX = command byte

FB 1A 00 00 Invalid read system selection

FB 1B 00 00 Invalid read system present

FB 1C 00 00 Invalid read system selected, CM only

FB 1D 00 00 Invalid read system selected, only AC/DC

FB 1E 00 00 Invalid read system selected, only AC

FB 1F 00 00 Invalid read system selected, only DC

FB 20 00 00 Invalid read system options

FB 21 00 00 Invalid blackband option selected

FB FC 02 01 OCR2 controlware reported that it could notreceive a message because it ran out ofMINIOS buffers.

FB FC 02 02 OCR2 controlware reported that rcv_len wascalled before rcv_data had read all the datafrom the previous message.

FB FC 02 03 OCR2 controlware reported that rcv_data wascalled with too big a length.

FB FC 02 04 OCR2 controlware reported that rcv_data wascalled with a negative length that was not -1.

FB FC 02 05 OCR2 controlware reported that start_msgwas called while another message wasalready being transmitted.

FB FC 02 06 OCR2 controlware reported that fin_msg wascalled without a prior call to start_msg.

FB FC 15 XX OCR2 controlware reported a document datainterrupt, but no data in the OCR2 inputFIFO.XX = (OCR) Datacomm Status register

FB FC 38 XX OCR2 controlware reported a framing error.The first character is not STX or SUB.XX =first character

FB FC 3A XX OCR2 controlware reported a framing error.The input FIFO ran empty.XX = register

FB FC 40 XX OCR2 controlware reported a framing error:missing ETX at end.XX = character received instead of ETX

Machine Checks



EEW Explanation

FB FD 01 01 OCR1 controlware reported that it could notreceive a message because it ran out ofMINIOS buffers.

FB FD 01 02 OCR1 controlware reported that rcv_len wascalled before rcv_data had read all the datafrom the previous message.

FB FD 01 03 OCR1 controlware reported that rcv_data wascalled with too big a length.

FB FD 01 04 OCR1 controlware reported that rcv_data wascalled with a negative length that was not -1.

FB FD 01 05 OCR1 controlware reported that start_msgwas called while another message wasalready being transmitted.

FB FD 01 06 OCR1 controlware reported that fin_msg wascalled without a prior call to start_msg.

FB FD 14 XX OCR1 controlware detected a document datainterrupt, but no data in the OCR1 input FIFO.XX =(OCR) Datacomm Status register

FB FD 37 XX OCR1 controlware detected a framing error.The first character is not STX or SUB.XX =first character

FB FD 39 XX OCR1 controlware detected a framing error.The input FIFO ran empty.XX = OCR FIFO Status register

FB FD 3F XX OCR1 controlware detected a framing error:missing ETX at end.XX = character received instead of ETX

FB FE 01 01 Controller detected data parity error

FB FE 01 02 Transport interface detected address parityerror

FB FE 01 03 Transport interface detected address dataerror

FB FE 02 00 Transport interface cable is disconnected

FB FE 03 00 Maintenance mode has been entered

FB FE 04 XX Invalid interrupt in idle loopXX = interrupt source register value

FB FE 05 XX Invalid interrupt in ready loopXX = interrupt source register value

Machine Checks



EEW Explanation

FB FE 06 XX Invalid command result when readyXX = command result register value

FB FE 07 XX Invalid command result when idleXX = command result register value

FB FE 08 XX Invalid interrupt in flow modeXX = interrupt source value

FB FE 09 XX Invalid transport status in flow loopXX = transport status register 1 value

FB FE 0A XX Bad contents in interface status registerXX = register value

FB FE 0B XX Invalid interrupt when waiting cable or exitingmaintenance modeXX = register value

FB FE 0C XX Invalid interrupt when waiting to exitmaintenance modeXX = interrupt source register value

FB FE 0D XX Transport driver document queue is full

FB FE 0E XX Channel "A" document data overflowXX = document data status register value

FB FE 0F XX Channel "B" document data overflowXX = document data status register value

FB FE 10 XX Transport driver detected an OCR1 overflow--too many charactersXX = last character read

FB FE 11 XX Transport driver detected an OCR2 overflow--too many charactersXX = last character read

FB FE 12 XX Channel "A" document data errorXX = document "A" data register value

FB FE 13 XX Channel "B" document data errorXX = document "B" data register value

FB FE 14 XX Transport driver detected an OCR1 documentdata interrupt, but no data in the OCR1 inputFIFOXX =(OCR) Interface Status register 3

FB FE 15 XX Transport driver detected an OCR2 documentdata interrupt, but no data in the OCR2 inputFIFOXX = (OCR) Interface Status register 3

Machine Checks



EEW Explanation

FB FE 16 XX Invalid gate fault/track error reset responseXX = response code

FB FE 17 XX Invalid BOL reset responseXX = response code

FB FE 18 XX Invalid feed request response XX = feedresult

FB FE 19 XX Invalid Batch # Advance request responseXX = response code

FB FE 1A XX Invalid disposition request responseXX = response code

FB FE 1B XX Invalid Pocket Light request responseXX = response code

FB FE 1C XX Invalid Header request responseXX = response code

FB FE 1D XX Invalid ICM request responseXX = response code

FB FE 1E XX Invalid response after Slew, expecting notreadyXX = response code

FB FE 1F XX Invalid begin Slew request responseXX = response code

FB FE 2F XX Invalid image message length valueXX = 0, message from system softwareXX = 1, message from imaging module

FB FE 21 XX Invalid end Slew responseXX = response code

FB FE 23 XX Invalid command result during flow loopXX = command register value

FB FE 24 00 Film footage count failed to increment

FB FE 25 XX Unexpected Microfilmer status - register 2XX = register value

FB FE 26 XX Unexpected Microfilmer status - register 3XX = register value

FB FE 27 XX NIE hungXX = 00, couldn’t access dual port01, NIE didn’t remove last dispose

Machine Checks



EEW Explanation

FB FE 30 XX Invalid response format from the imagingmoduleXX = imaging module opcode

FB FE 32 XX Invalid response from E-routine - imagingmodule code expectedXX = response

FB FE 34 XX Invalid OCR message length value. Thetransport driver received from an OCR unit amessage with a bad length.XX = length value

FB FE 35 XX Invalid OCR1 message format. The transportdriver received from an OCR unit a messagewith a bad format.XX = format

FB FE 36 XX Invalid OCR2 message format. The transportdriver received from an OCR unit a messagewith a bad format.XX = format

FB FE 37 XX Transport driver detected an OCR1 framingerror. The first character is not STX or SUB.XX = first character

FB FE 38 XX Transport driver detected an OCR2 framingerror. The first character is not STX or SUB.XX = first character

FB FE 39 XX Transport driver detected an OCR1 framingerror. The input FIFO ran empty.XX = Interface Status register 3

FB FE 3A XX Transport driver detected an OCR2 framingerror. The input FIFO ran empty.XX = register

FB FE 3B XX Transport driver detected an OCR1 framingerror. The character after NDLE is not NDLEor ETB.XX = character after NDLE

FB FE 3C XX Transport driver detected an OCR2 framingerror. The character after NDLE is not NDLEor ETB.XX = character after NDLE

FB FE 3D XX Transport driver detected an OCR1 framingerror: length mismatch.

Machine Checks



EEW Explanation

FB FE 3E XX Transport driver detected an OCR2 framingerror: length mismatch.

FB FE 3F XX Transport driver detected an OCR1 framingerror: missing ETX at end.XX = character received instead of ETX

FB FE 40 XX Transport driver detected an OCR2 framingerror: missing ETX at end.XX = character received instead of ETX

FB FE 41 XX Transport driver detected that an OCR1 replystatus was not zero and thus indicates aproblem.XX = reply status

FB FE 42 XX Transport driver detected that an OCR2 replystatus was not zero and thus indicates aproblem.XX = reply status

FB FE 43 XX Transport driver detected an invalid responsefrom E-routine. An OCR code is expected.XX = E response code

FB FE 44 XX Transport driver detected an OCR1 outputFIFO was filled up.XX = Interface Status register 3

FB FE 45 XX Transport driver detected that an OCR2output FIFO was filled up.XX = register

FB FE 46 XX Transport driver detected a sync error on theinterface to OCR1.XX = Interface Status register 2

FB FE 47 XX Transport driver detected a sync error on theinterface to OCR2.XX = Interface Status register 2

FB FE 48 XX Transport driver detected a parity lockuperror on the interface to OCR1.XX = Interface Status register 2

FB FE 49 XX Transport driver detected a parity lockuperror on the interface to OCR2.XX = Interface Status register 2

FB FF 00 00 SVC not implemented in this release

FC 00 00 00 I/O request terminated by timeout

FC 24 00 00 Waiting for response to Batch # advance

Machine Checks



EEW Explanation

FC 27 00 00 Waiting for response to an ICM

FC 28 00 00 Waiting for a not ready response to Slew

FC 29 00 00 Waiting for response to begin Slew

FC 2A 00 00 Waiting for response to Slew complete

FC 34 00 00 Timeout waiting for imaging module responseinterrupt

FC 37 XX YY OCR not responding. The transport drivertimed out waiting for a response from an OCRunit.XX = unit (1 or 2)YY = SVC

FC 38 XX YY Timed out waiting for the FIFOs to clear onthe sorter side of the interfaceXX = unit (1 or 2)YY = Interface Status register 1

FC 39 XX YY Timed out waiting for an OCR unit to clear itsFIFOs.XX = unit (1 or 2)YY = OCR Status register

FD 00 00 00 Unit offline

FE 00 00 00 I/O request had reserve/release error

$FF 00 00 00 I/O request had improper parameter

FF 08 XX 00 Feed request parameter errorXX = parameter value

FF 11 XX 00 Invalid Microfilmer ICM command on disposeXX = parameter value

FF 17 XX 00 Invalid Microfilmer Header styleXX = parameter value

FF 18 XX 00 Invalid Microfilmer ICM command on HeaderXX = parameter value

FF 19 XX 00 Invalid Microfilmer ICM commandXX = parameter value

FF 1C XX 00 Invalid read system selected - only CMC7XX = selection

FF 1D XX 00 Invalid read system selected - only AC/DCXX = selection

FF 1E XX 00 Invalid read system selected - only ACXX = selection

Machine Checks



EEW Explanation

FF 1F XX 00 Invalid read system selected - only DCXX = selection

FF 20 XX 00 Invalid read system options selectedXX = selection

FF 21 XX 00 Invalid blackband option selectedXX = selection

Machine Checks


Routine TXT_TO_FID Error CodesTable 14-27 includes definitions of Routine TXT_TO_FID Error Codes.

Table 14–27. Routine TXT_TO_FID ErrorCodes

ErrorNumber

Definition

C8 Illegal delimiter found

C9 Illegal character found

CA Field too long

CB No file name specified

CC Extra input, ignored


Section 15 CMC7 Tests

160000 CM 01 0010

CMC7 option reported not present.


100 Check for the jumper installed on card AA10"CMC7."

Is the jumper present? 120 110

110 Install jumper.





CMC7 Tests


160010 CM 01 0020

Code line mismatch.


90 Does the Reader us PCBA AA11 (4331 8658) 200 100

100 Is the only difference in code lines one or morerejected characters?

110 150

110 Check the jumpers on card AA13 per jumpersheet 09.01.02.


115 Correct jumpers and rerun test. --- ---







150 Referring to SEI 3304 3688, set the switches tomode 0, and rerun test.


155 Does maintenance logic work per SEI 33043688?

160 170

160 Read the characters from the LEDs on cardAA13, and compare them with the characters onthe display. (Take note of the symbol coding perchart on SEI 3304 3688.)

Do all the characters compare? 170 180







210 Correct jumpers and rerun test. – –

CMC7 Tests



220 Check mechanical adjustments and perform T&A3304 3662.







CMC7 Tests



160020 CM 01 0030

Scan detected reject.

Note: This test is primarily used by the CSEto diagnose read problems most likelycaused by poor document encoding orcondition. Before making anyadjustments or replacing parts,carefully inspect the document forencoding quality.



100 Verify jumpers on card AA13 and gain setting perT&A 3304 3662, and continue testing.


110 Check mechanical T&As for read station drive,entrance, and DYNAVAR.




130 Replace read head, and perform T&A 33043662.











900 Verify proper operation. End of procedures.

CMC7 Tests


160030 CM 01 0040

Illegal character detected.







200 Verify jumpers on card AA11 per jumper sheet09.01.02 and retest.





CMC7 Tests



160040 CM 01 0050

Code line mismatch.

Note: Poor document encoding can causecharacters to misread or reject. Poormechanical presentation (skew orbuckling) can also cause misreads orrejects.



100 Verify jumpers on card AA13 and gain settingper T&A 3304 3662, and continue testing.


110 Check mechanical T&As for read station drive,entrance, and DYNAVAR.
















CMC7 Tests


160050 CM 01 0060

No MICR data. No document.


100 Did documents feed and go to pocket 0? 110 140







140 Go to the Basic MTR Menu, and run basic tests.

CMC7 Tests


160060 CM 01 0070

All rejects detected.



100 Check the jumpers on card AA13.


110 Referring to SEI 3304 3688, close all switches,and press SW9.

Did the LEDs blink 10 times? 120 130







150 Replace read head, and perform T&A 33043662.










CMC7 Tests


160070 CM 01 0080

No characters detected.



100 Check the jumpers on card AA13.


110 Referring to SEI 3304 3688, close all switches,and press SW9.

Did the LEDs blink 10 times? 120 130



130 Replace the card AA13, and perform T&A 33043662.














CMC7 Tests



Section 16 NDP 1xxx-65 Cinemode MicrofilmerTest

This section lists MTR procedures for the NDP 1000-65 and NDP 1800-65 CinemodeMicrofilmers. Information about adjusting the hardware parameters of these microfilmersis in Section 17, "Microfilmer Hardware Parameters".

161000 MM 00 0010

Error occurred uploading/downloading NVRAMparameters. Invalid test code received.


100 Reset sorter, and try parameter routines again.


110 Replace Microfilm Controller PCBA, and reruntest.


120 Replace AA03 (MIIB PCBA), and rerun test.


130 Run MTR Data Comm Test.

Does the test pass on both the MicrofilmController and MIIB PCBAs?

150 140

140 Follow the new fault code. End of procedure.

150 Replace the data comm cable. Rerun the test.





NDP 1xxx-65 Cinemode Microfilmer Test


161010 MM 00 0020

Error occurred uploading/downloading NVRAMparameters. Invalid number of parametersreceived.


100 Reset the sorter, and try the parameter routinesagain.


110 Replace Microfilm Controller PCBA, and rerunthe test.


120 Replace AA03 (MIIB PCBA), and rerun the test.


130 Run the MTR Data Comm Test.

Does the test pass on both the MicrofilmController and MIIB PCBAs?

150 140

140 Follow the new fault code. End of procedure.

150 Replace the data comm cable. Rerun the test.







161020 MM 00 0030

No response from controller.


100 Rerun the test.


120 Replace the Microfilm Controller PCBA, andrerun the test.










161030 MM 00 0040

MTR cannot get control of semaphore #1.

161040 MM 00 0050

Command byte never recognized by MIIB.

161050 MM 00 0060


161060 MM 00 0070











161070 MM 01 0004

CSE replied that the "*" character was notdisplayed correctly on the human readableheader display.

161080 MM 01 0005

CSE replied that the "#" character was notdisplayed correctly on the human readableheader display.

161090 MM 01 0006

CSE replied that the "H" character was notdisplayed correctly on the human readableheader display.


100 Replace the Human Readable Header assembly.








161100 MM 01 0007

CSE replied that the character loop A-Z, 0-9 wasnot displayed correctly on the human readableheader display.


100 Verify that all cables are correctly connected.(Especially check Distribution A PCBA J3.) Makenecessary corrections.


105 Replace the Human Readable Header assembly.





161110 MM 01 0008

Current in the human readable header displaywas too low.


100 Verify that all cables are correctly connected.(Especially check Distribution A PCBA J3.) Makenecessary corrections.








161120 MM 02 0001

The BOLs were turned off, but the lower BOL isreported on.

161130 MM 02 0002

The BOLs were turned off, but the upper BOL isreported on.

161140 MM 02 0003

The BOLs were turned off, but the BOL ABCregister reports one.


100 Replace the OSM PCBA, slot 5 of the microfilmeranalog gate.







161150 MM 02 0004

The BOLs were turned off, but the lower BOL isreported on.


100 Place a document in the track blocking bothheight detector BOLs. Place a meter probe onslot 5 pin 50 of the microfilmer analog gate.

Does the signal measure less than 3 VDC? 110 120

110 Turn off the power, and swap the connectors ofthe upper and lower BOLs. Repeat step 100with the power on.


120 Replace the OSM PCBA, slot 5 of the microfilmeranalog gate, and return the connectors for theBOLs to their original positions.




140 Replace the lower height detector BOL, andreturn the BOL connectors to their originalpositions.


150 Replace the OSM PCBA, and rerun the test





161160 MM 02 0005

The BOLs were turned off, but the upper BOL isreported on.










140 Replace the upper height detector BOL, andreturn the BOL connectors to their originalpositions.


150 Replace the OSM PCBA, and rerun the test.





161170 MM 02 0006

The BOLs were turned on, but the lower BOL isreported off.


100 Verify that all cables are correctly connected.(Especially check motherboard P12.) Make thenecessary corrections.


105 Remove any document in the track blocking bothheight detector BOLs. Place a meter probe onslot 5 pin 50 of the microfilmer analog gate.

Does the signal measure greater than 3 VDC? 110 120














161180 MM 02 0007

The BOLs were turned on, but the upper BOL isreported off.


















161190 MM 02 0008

The upper height detector BOL is dirty.


100 Clean the upper height detector BOL.


110 Replace the upper height detector BOL.





161200 MM 02 0009

The lower height detector BOL is dirty.


100 Clean the lower height detector BOL.


110 Replace the lower height detector BOL.







161210 MM 02 0010

The BOLs were covered, but the upper BOL isreported uncovered.




110 Turn off the power and swap the connectors ofthe upper and lower BOLs. Repeat step 100with power on.


120 Replace OSM PCBA, slot 5 of microfilmer analoggate and return the connectors for the BOLs totheir original positions.


130 Replace Microfilm Controller PCBA.







161220 MM 02 0011

The BOLs were uncovered, but the upper BOL isreported covered.















161230 MM 02 0012

The BOLs were covered, but the lower BOL isreported uncovered.















161240 MM 02 0013

The BOLs were uncovered, but the lower BOL isreported covered.















161250 MM 04 0001

Shutter Sensor Error

The MTR opened (enabled)/closed (not enabled)the shutter which was verified by the CSE;however, the Input port #1 register indicates theshutter is still closed (not enabled)/open(enabled).

Note: The Unisys Microfilmer schematicpackage is required for this procedure(part #2493 2824).


100 Did the MTR routine fail with the shutter open? 110 210

110 Check the adjustment of the shutter open sensorto T&A 3304 4413. Adjust as required.


120 Run shutter MTR routine to point where shutteris activated to the open position.

On the Distribution A PCBA, is J8 pin 4 <1.2V? 130 150

130 Is J2 pin 37 on the Microfilm Controller PCBA <1.2 V?

140 160



150 Using schematics, trace signal DSODETE fromthe Distribution A PCBA J8 pin 4 to the MicrofilmController PCBA J2 pin 37. Find the location ofthe problem, and correct it.


160 Is J8 pin 2 on the Distribution A PCBA <0.8V? 170 180

170 Replace the Shutter Open sensor, and adjust toT&A 3304 4363.


180 Is J2 pin 38 on the Microfilm Controller PCBA <0.8 V?

190 200



MM 04 0001

Shutter Sensor Error (continued)

The MTR opened (enabled)/closed (not enabled)the shutter which was verified by the CSE;however, the Input port #1 register indicates theshutter is still closed (not enabled)/open(enabled).


190 Using the schematics, trace the signal DSOLEDCfrom the Distribution A PCBA J8 pin 2 to theMicrofilm Controller PCBA J2 pin 38. Find thelocation of the problem, and correct it.




210 Check the adjustment of the shutter open sensorto T&A 3304 4413. Adjust as required.


220 Run the shutter MTR routine to point the wherethe shutter is activated to the open position.

On the Distribution A PCBA, is J9 pin 4 < 1.2 V? 230 250

230 Is J2 pin 39 on the Microfilm Controller PCBA<1.2 V?

240 260



250 Using the schematics, trace the signal DSCDETEfrom the Distribution A PCBA J9 pin 4 to theMicrofilm Controller PCBA J2 pin 39. Find thelocation of the problem, and correct it.


260 Is J9 pin 2 on the Distribution A PCBA < 0.8 V? 270 280

270 Replace the Shutter Closed sensor, and adjust itto T&A 3304 4363.


280 Is J2 pin 40 on the Microfilm Controller PCBA<0.8 V?

290 200

290 Using the schematics, trace the signal DSCLEDCfrom the Distribution A PCBA J9 pin 2 to theMicrofilm Controller PCBA J2 pin 40. Find thelocation of the problem, and correct it.




MM 04 0001

Shutter Sensor Error (continued)

The MTR opened (enabled)/closed (not enabled)the shutter, which was verified by the CSE;however, the Input Port #1 register indicates theshutter is still closed (not enabled)/open(enabled).







161260 MM 04 0002

Shutter Sensor and Solenoid Error

The MTR requested the shutter open(enabled)/closed (not enabled). The open(enabled)/closed (not enabled) sensor verifiedcorrect operation, but the CSE indicated theshutter position was incorrect.


100 Did the MTR fail with the shutter open? 200 110

110 Check connector P13 on motherboard andreseat the Reel/Sol. Driver PCBA.


120 Remove connector P13, and execute the MTRroutine to the point where the shutter should beopened while monitoring the signal atmotherboard slot 8 pin 22 with an oscilloscope.

Does signal switch from approximately 0 V to+24 V to +5 V?

140 130



140 Check connectors P4/J1 on the Distribution BPCBA and P12/J1 on the Distribution A PCBAand all associated cables. Repair as required.


150 Replace the Capping Shutter assembly, andreadjust to T&A 3304 4363.






MM 04 0002

Shutter Sensor and Solenoid Error (continued)

The MTR requested the shutter open(enabled)/closed (not enabled). The open(enabled)/closed (not enabled) sensor verifiedcorrect operation, but the CSE indicated theshutter position was incorrect.


200 Remove connector P13, and execute the MTRroutine to the point where the shutter should beclosed while monitoring the signal atmotherboard slot 8 pin 22 with an oscilloscope.

Does the signal switch from approximately +5 Vto 0 V?

210 240

210 Is the shutter return spring attached correctly? 240 220

220 Attach or replace the return spring, and retest.


240 Replace the Reel/Sol. Driver PCBA, and retest.


250 Check connectors P4/J1 on the Distribution BPCBA and P12/J1 on the Distribution A PCBAand all associated cables. Repair as required.


260 Replace the Capping Shutter assembly, andreadjust to T&A 3304 4363.







161270 MM 04 0003

Shutter Sensor and Solenoid Error

The MTR requested the shutter to open(enabled)/close (not enabled), but both thesensor and CSE indicated the shutter wasclosed (not enabled)/open (enabled).


100 Repeat the MTR routine, and verify faultyoperation.


110 Check the adjustment of the capping shutter toT&A33044363 and the shutter sensors to33044413. Readjust as required.


120 Is the error code the same as before? 130 150

130 Replace the Microfilm Controller PCBA, andretest.


140 Execute the manual procedure for error codeMM04 002. Execute the procedures for newerror codes as applicable.


150 Execute the manual procedures for error codes.





161280 MM 05 0001

Cover sensor reports open when cover isclosed.


100 Check connectors J2 and J13 on the DistributionB PCBA and their cables. Make any necessarycorrections.


110 Place a probe on pin 3 of BS18 on the MicrofilmController PCBA. With cover open, manuallypress on the cover switch at the near rightcorner of the film box.

Does the signal switch between 0 V and 4 5VDC?

120 140

120 Repeat step 110 using the cover instead of yourfingers.

Does the signal switch between 0 V and 4-5VDC?

150 130

130 Check T&A 3304 4058 and T&A 3304 4066 toadjust the cover, cover latch, and cover switch.Repeat the test.


140 Replace the cover switch and check T&A33044066.







161290 MM 05 0002

Camera cover did not lock when it should have.


100 Check connectors J4 and J15 on the DistributionB PCBA and the cables. Make corrections ifnecessary.


110 Remove connector J13 from the microfilmermotherboard. Rerun the test.


120 Put a probe on slot 8 pin 27. Rerun the test.

When asked to verify that the cover is locked, isthe signal > 20 VDC?

160 130

130 Put a probe on TP-6 of the Reel/Sol. DriverPCBA (slot 8).

Is the signal < 1 VDC? 140 150





160 Check T&A 3304 4058. Then check T&A33044066. Make any necessary corrections.





161300 MM 05 0003

Cover sensor reports closed when cover isopen.


100 Check connectors J2 and J13 on the DistributionB PCBA and their cables. Make any necessarycorrections.


110 Place a probe on pin 4 of BS28 on the MicrofilmController PCBA. With the cover open, manuallypress on the cover switch at the near rightcorner of the film box.


120 140

120 Repeat step 110 using the cover instead of yourfingers.


150 130

130 Check T&A 3304 4058 and T&A 3304 4066 toadjust the cover, cover latch, and cover switch.Repeat the test.


140 Replace the cover switch, and check T&A33044066.







161310 MM 05 0004

Camera did not turn off when instructed.


100 Attach a scope to AA03 pin P2-71 (CAMSWNO).Press the Camera On switch.

Does the signal change from + 5 V to 0 V? 110 120

110 Replace AA03 (the MIIB PCBA), and rerun thetest.


120 Monitor Control Panel Connector Cable J1-10.Press the Camera On switch on/off.

Does the signal change from + 5.0 V to 0 V? 130 950

130 Check the Control Panel Connector cable. Makenecessary corrections. Rerun the test.


140 Replace Control Panel Assembly, and rerun thetest.





Note: Different procedures are used for each failure code on this page.

161320 MM 05 0005

Camera did not turn on when instructed.


100 Replace the camera power switch.


110 Replace the AA03 PCBA.



161330 MM 05 0006

Film not loaded correctly.


100 With power on, lift the film plate, and wait untilthe slack in the film is taken up. Then load thefilm again.


110 Run all the film transport MTR tests.



161340 MM 05 0007

Lamps did not come on.


100 Run the Lamp/ALM MTR. Follow the appropriatefault code. End of procedure.

161350 MM 05 0008

Motors did not come up.


100 Run the Transport Basic MTRs to determine theproblem. Follow the appropriate fault code.End of procedure.



161360 MM 05 0009

Camera cover did not unlock when it shouldhave.


100 Unlock the cover manually, and checkconnectors J4 and J15 on the Distribution BPCBA and the cables. Make corrections ifnecessary, and rerun the test.


105 Does the armature of the cover lock solenoidmove freely by hand? In other words, does thecover lock solenoid appear to be off?

110 150

110 Remove connector J13 from the microfilmermotherboard. Rerun the test. When asked toverify that the cover is unlocked, place a probeon slot 8 pin 28 of the microfilmer motherboard.

Is the signal 24 VDC? 120 160

120 Place a probe on slot 8 pin 27 of the microfilmermotherboard.

Is the signal < 1 VDC? 130 170

130 With power off, reconnect J13 on themotherboard, and check the continuity betweenslot 8 pin 27 of the motherboard and J15 pin 2of the Distribution B PCBA. Also, check thecontinuity between slot 8 pin 28 and J15 pin 1.

Does the continuity check out OK? 140 200

140 Check T&A 3304 4058 and T&A 3304 4066.Make any necessary corrections.


150 Check T&A 3304 4058 and T&A 3304 4066.Make any necessary corrections.




MM 05 0009

Camera cover did not unlock when it shouldhave.


160 Put a probe on slot 8 pin 78.

Does the signal measure < 1 VDC? 170 180

170 Put a probe on TP-16 of the Reel/Sol. DriverPCBA (slot 8 of the microfilmer motherboard).

Does the signal measure < 1 VDC? 180 190

180 Replace the PCBA in slot 8.




200 Replace the cable at J13 of the microfilmermotherboard.


210 Replace the cover lock solenoid.


220 Replace the cable to the cover lock solenoid.





161370 MM 05 0010

Film did not advance correctly.


100 Press the film advance switch.

Did the film advance light illuminate? 140 110

110 Press the film advance switch, and place aprobe on pin J2-75 (FASWNO) of slot 3 on the AAgate.

Is the signal level < 1.0 VDC? 120 130

120 Replace the MIIB PCBA (slot 3 in the AA gate).


130 Check the continuity of the control panel cableon the AA gate. Make the necessarycorrections.


140 Check the continuity of the signal cable (fromthe AA gate to J1 on the Microfilm ControllerPCBA). Make the necessary corrections.


145 Check all cables (especially check Distribution BJ-14). Make the necessary corrections.




160 Replace the Servo Amplifier PCBA.


170 Check the continuity of the controller signalcable. Make the necessary corrections.





161380 MM 05 0011

Film advance light did not light up.


100 Remove the film advance lens from the switch.

Is the bulb present? 110 120

110 Remove the bulb from the holders, and checkfor continuity from the bulb case to the centercontact.

Is there continuity? 130 120

120 Install a new bulb.


130 Replace the lens in the switch, and press the filmadvance switch. Listen for capstan motormovement.

Does the motor sound as if it is turning? 140 150

140 Press the film advance switch, and place aprobe on pin J2-83 of slot 3 on AA gate.

Is the signal < 1.0 VDC? 170 160

150 Press the film advance switch with a probe onpin J2-75 of slot 3 (on AA gate).

Is the signal < 1.0 VDC? 160 170

160 Replace the MIIB PCBA, and retest.


170 Check the continuity of the control panel cablethat terminates on the AA Gate. Make thenecessary corrections.


180 Replace the film advance switch on the controlpanel, and retest.





161390 MM 05 0012

Microfilm is not ready, but no reason can befound.


100 Remove the R/S power, and reseat the MIIBPCBA in slot 3 of the AA gate.


110 Remove the R/S power, and reseat the MainClock Diagnostic Interface PCBA in slot 8.


120 Remove the R/S power, and replace the MIIBPCBA in slot 3.


130 Remove the R/S power, and replace the MainClock Diagnostic Interface PCBA.





161400 MM 05 0013

Microfilm ready bits are not consistent.


100 Remove the R/S power, and reseat the MIIBPCBA in slot 3 and the Main Clock DiagnosticInterface PCBA in slot 8 of the AA gate. Applypower.


110 Replace the MIIB PCBA in slot 3.


120 Replace the Main Clock Diagnostic InterfacePCBA.





161410 MM 06 0001

Reel Motor Error

CSE indicated that the supply reel did not rotatecorrectly when the supply loop arm waspressed.



100 Did both reels rotate when one of the supplyloop arm was pressed?

500 150

150 Did the supply motor rotate? 160 180

160 If the supply motor rotated in the wrongdirection, check the wiring from pins 17 and 18on slot 8 of the motherboard to the supplymotor. The most likely cause is the wiring beingreversed. Repair as required.




180 Remove connector P9 from the motherboard.Using a DVM, measure the voltage between pins17 and 18 on slot 8 of the motherboard as theloop arm is moved back and forth.

Does the voltage vary between 0 V an > 18 V? 290 190

190 As you are moving the supply loop arm back andforth, does slot 8 pin 80 vary from < 0.8 V to >4.5 V?

200 210

200 Replace the Reel/Sol. PCBA, and retest if notalready done.




210 While moving the supply loop arm back andforth, does J5 pin 59 on the MF controller varyfrom < 0.8V to > 4.5V?

220 230

220 Check connection from J5 pin 59 on MFController to pin 80 on Reel/Sol. PCBA. Repairany problems found.




MM 06 0001

Reel Motor Error (continued)



230 While moving the supply loop arm back andforth, measure J2 pin 54 on the Distribution BPCBA.

Does the signal switch from < 1.2 V to >1.2V? 240 270

240 While moving the supply loop arm back andforth, measure J2 pin 54 on the MicrofilmController PCBA.




260 Check the continuity from J2 pin 54 on theDistribution B PCBA to J2 pin 54 on theMicrofilm Controller PCBA. Repair as required.




280 Replace Supply Sensor 2, and retest.


290 Using the schematics, check the continuity frompins 17 and 18 on slot 8 of the motherboard tothe supply motor. Repair as required.




MM 06 0001




300 Replace the supply motor, and retest.




510 Monitor pins 79 and 80 of slot 8 on themotherboard while moving both loop arms backand forth, first the supply and then the takeup.

Do both signals switch between < 0.8 V and>4.0 V with only their respective loop armmovements?

205 520



530 Check the continuity of the signals back to theDistribution B PCBA, and repair problems asfound.





161420 MM 06 0002

Reel Motor Error

CSE indicated that the takeup reel motor did notrotate correctly when the takeup loop arm waspressed.



100 Did both reels rotate when the takeup loop armwas pressed?

500 150

150 Did the takeup motor rotate? 160 180

160 If the takeup motor rotated in the wrongdirection, check the wiring from pins 31 and 32on slot 8 of the motherboard to the takeupmotor. The most likely cause is the wiring beingreversed. Repair as required.




180 Remove connector P9 from the motherboard.

Using a DVM, measure the voltage between pins31 and 32 on slot 8 of the motherboard as theloop arm is moved back and forth.

Does the voltage vary between 0 V and > 18 V? 290 190

190 Move the takeup loop arm back and forth.

Does slot 8 pin 79 vary from < 0.8 V to > 4.5V?

200 210



210 Move the takeup loop arm back and forth.

Does J5 pin 60 on the Microfilm Controller PCBAvary from < 0.8 V to > 4.5 V?

220 230

220 Check the connection from J5 pin 60 on theMicrofilm Controller PCBA to pin 80 on theReel/Sol. PCBA. Repair any problems found.




MM 06 0002




230 While moving the takeup loop arm back andforth, measure J2 pin 48 on the Distribution BPCBA.

Does the signal switch from < 1.2 V to > 1.2 V? 240 270

240 While moving the takeup loop arm back andforth, measure J2 pin 48 on the MicrofilmController PCBA.

Does the signal switch from < 1.2 V to >1.2 V? 250 260







280 Replace Takeup Sensor 2, and retest.




295 Replace the takeup motor, and retest.




MM 06 0002








900 520








161430 MM 06 0003

Reel Motor Error

CSE indicated that the supply reel motor did notrotate correctly when activated.



100 Did both reels rotate? 500 150

150 Did the supply motor rotate? 160 180

160 If the supply motor rotated in the wrongdirection, check the wiring from pins 17 and 18on slot 8 of the motherboard to the supplymotor. The most likely cause is the wiring beingreversed. Repair as required.






190 As you move the supply loop arm back andforth, does slot 8 pin 80 vary from < 0.8 V to >4.5 V?

200 210



210 As you move the supply loop arm back andforth, does J5 pin 59 on the Microfilm ControllerPCBA vary from < 0.8 V to > 4.5 V?

220 230





MM 06 0003




230 While moving the supply loop arm back andforth, measure J2 pin 54 on the Distribution BPCBA.


240 While moving the supply loop arm back andforth, measure J2 pin 54 on the MicrofilmController PCBA.








280 Replace Supply Sensor 2, and retest.




MM 06 0003






300 Replace the supply motor, and retest.


310 If not already done, replace the Reel/Sol. PCBA,and rerun the test.






900 520








161440 MM 06 0004

Reel Motor Error

CSE indicated that the takeup reel motor did notrotate correctly.



100 Did both reels rotate? 500 150

150 Did the takeup motor rotate? 160 180

160 If the takeup motor rotated in the wrongdirection, check the wiring from pins 31 and 32on slot 8 of the motherboard to the takeupmotor. The most likely cause is the wiring beingreversed. Repair as required.






190 When you move the takeup loop arm back andforth, does slot 8 pin 79 vary from < 0.8 V to >4.5 V?

200 210

200 If not already done, replace the Reel/Sol. PCBA,and retest.


210 When you move the takeup loop arm back andforth, does J5 pin 60 on the Microfilm ControllerPCBA vary from < 0.8 V to > 4.5 V?

220 230





MM 06 0004




230 While moving the takeup loop arm back andforth, measure J2 pin 48 on the Distribution BPCBA.


240 While moving the takeup loop arm back andforth, measure J2 pin 48 on the MicrofilmController PCBA. Does the signal switch from <1.2 V to > 1.2 V?

250 260







280 Replace Takeup Sensor 2 and retest. Does theproblem still exist?

200 950

290 Using the schematics check the continuity frompins 31 and 32 on slot 8 of the motherboard tothe supply motor. Repair as required.




MM 06 0004




295 Replace the takeup motor, and retest.






99600 520






161450 MM 07 0010

Front lamp value out of range

(NDP 1150) The value for the Front Lamp storedin nonvolatile memory is outside the range 80Hex - FE Hex.

(NDP 18xx) The value for the Front Lamp storedin nonvolatile memory is outside the range 80Hex - EF Hex.


100 Using the Lamp Adjustment procedure in theHardware Parameter Routines, set the frontlamp value to A0. Rerun the MTR routine.


120 Using the Lamp Adjustment Hardware ParameterRoutine, reset the lamp value to the correctoperating point.




140 Replace AA03, and retest.







161460 MM 07 0020

Rear lamp value out of range

(NDP 1150) The value for the Rear Lamp storedin nonvolatile memory is outside the range 80Hex - FE Hex.

(NDP 18xx) The value for the Rear Lamp storedin nonvolatile memory is outside the range 80Hex - EF Hex.


100 Using the Lamp Adjustment procedure in theHardware Parameter Routines, set the rear lampvalue to A0. Rerun the MTR routine.


120 Using the Lamp Adjustment Hardware ParameterRoutine, reset the lamp value to the correctoperating point.











161470 MM 07 0030

Front lamp did not turn on


100 Check that the lamp is properly mounted andthat there are no obstructions to the lightentering or leaving the fiber optic documentilluminator.


110 Replace the front lamp, and retest.


120 Reseat the Lamp Driver PCBA, and retest.


130 Replace the Lamp Driver PCBA, and retest.


140 Check connector P8 on the motherboard, J2 onthe Lamp Heatsink Assembly, and associatedcables for bad or intermittent contacts.


150 Replace the Lamp Heatsink Assembly, andretest.





161480 MM 07 0040

Rear lamp did not stay off with front enabled.




110 Check the continuity of signals FLCSELN at pin78 and RLCSELN at pin 77 of the motherboardslot 8 back to the Microfilm Controller PCBA J5pins 25 and 23. Repair any bad contacts orshorts found.




130 Check connector P8 on the motherboard, J2 onthe Lamp Heatsink Assembly, and associatedcables for shorts or intermittent contacts.







161490 MM 07 0050

Rear lamp did not turn on.


100 Check that the lamp is properly mounted andthat there are no obstructions to the lightentering or leaving the fiber optic documentilluminator.


110 Replace the rear lamp, and retest.


120 Reseat the Lamp Driver PCBA, and retest.











161500 MM 07 0060

Front lamp did not stay off with rear enabled.




110 Check the continuity of signals FLCSELN at pin78 and RLCSELN at pin 77 of motherboard slot8 back to the Microfilm Controller PCBA J5 pins25 and 23. Repair any bad contacts or shortsfound.




130 Check connector P8 on the motherboard, J2 onthe Lamp Heatsink Assembly, and associatedcables for shorts or intermittent contacts.







161510 MM 07 0070

Front ALM value out of range.

Either unblocked > 30 hex or blocked < 20 hex.


100 Does the ALM read > 30 hex when the track isempty (unblocked)?

150 110

110 Does the ALM read < 20 hex when the track isfull (blocked)?

300 950

150 Check for debris or dust buildup in optical gate.Clean the optical gate. Repaint any excessivewear on the optical gate walls.


160 Replace the OSM PCBA, and retest.


170 Swap P4 and P5 on the Distribution A PCBA, andretest.

Does problem move from the Front to the RearALM?

180 190

180 Replace P4 and P5 to the original location.Replace the Front ALM Sensor Assembly, andretest.


190 Replace the Distribution A PCBA, and retest.


200 Check the continuity of signal FALMVL from J1pin 32 on the Distribution A PCBA to the OSMPCBA. Repair problems as found.


210 Check the continuity of signal ALMSELN from pin98 of the motherboard slot 5 to the MicrofilmController PCBA. Repair problems as found.




300 Ensure that the document is correctly placed toblock the optical gate. Ensure that the documentdoes not have a large area of black or darkprint.




MM 07 0070

Front ALM value out of range (continued)






Does the problem move from the Front to theRear ALM?

330 340

330 Replace P4 and P5 to the original location.Check the cabling to ensure that the front andrear ALMs were not swapped. Check that thereis no dust or debris blocking the optical path tothe ALM sensor. Check that the ALM sensor ismounted correctly. If none of the above is foundto be bad, replace the Front ALM SensorAssembly, and retest.




350 Check the continuity of signal FALMVL from J1pin 32 on the Distribution A PCBA to the OSMPCBA. Repair problems as found.









161515 MM 07 0080

Rear ALM value out of range.



100 Does the ALM read > 30 hex when the track isempty (unblocked)?

150 110

110 Does the ALM read < 20 hex when the track isfull (blocked)?

300 950

150 Check for debris or dust buildup in the opticalgate. Clean the optical gate. Repaint anyexcessive wear on the optical gate walls.





Does the problem move from the Rear to theFront ALM?

180 190

180 Replace P4 and P5 to their original locations.Replace the Rear ALM Sensor Assembly, andretest.




200 Check the continuity of signal RALMVL from J1pin 33 on the Distribution A PCBA to the OSMPCBA. Repair problems as found.






300 Ensure that the document is correctly placed toblock the optical gate. Ensure that thedocument does not have a large area of black ordark print.




MM 07 0080

Rear ALM value out of range. (continued)






Does the problem move from the Rear to theFront ALM?

330 340

330 Replace P4 and P5 to their original locations.Check the cabling to ensure that the front andrear ALMs were not swapped. Check that thereis no dust or debris blocking the optical path tothe ALM sensor. Check that the ALM sensor ismounted correctly. If none of the above is foundto be bad, replace the Rear ALM SensorAssembly, and retest.




350 Check continuity of signal RALMVL from J1 pin33 on Dist A PCBA to OSM PCBA. Repairproblems as found.










161517 MM 07 0090

Lamps did not turn on.


100 Check that the lamps are properly mounted andthat there are no obstructions to the lightentering or leaving the fiber optic documentilluminator.


110 Reseat the Lamp Driver PCBA and retest.


120 Replace the front and rear lamps, and retest.


130 Replace the Lamp Driver PCBA and retest.




150 Replace the Lamp Heatsink Assembly andretest.



161520 MM 08 0010

MIIB data comm error: Data gets corrupted in aTx-Rx wraparound loop.


100 Remove the interface cable from J5 on the AAgate or J1 on the Microfilm Controller PCBA.Rerun the test.




120 Check the connector on the AA gatemotherboard for problems, and retest.






161530 MM 08 0020

MIIB data comm error: SCSI interrupt fails on anoverrun, or a framing error occurred.


100 Remove the interface cable from J5 on the AAgate or J1 on the Microfilm Controller PCBA.Rerun the test.




120 Check the connector on the AA gatemotherboard for problems, and retest.



161540 MM 08 0030

Microfilm controller data comm error: Cannotcommunicate with the Microfilm ControllerPCBA.


100 Execute the manual procedure for error codeMM 08 0050. Repair, and retest.







161550 MM 08 0040

Data comm test error.


100 Rerun the test carefully following the proceduresindicated on the screen.


110 Was a new error code displayed? 120 130

120 Execute a manual procedure for the new errorcode. Repair, and retest.


130 Replace the AA03 (MIIB ) PCBA, and retest.




150 Check the AA backplane connections to AA03and AA17. Repair as required.





161560 MM 08 0050

Microfilm controller data comm error.


100 Select DATA COMMUNICATIONS (option 5) fromthe Basic Microfilm Test Menu. Select theMicrofilm Controller Wraparound Test. Executethe test procedure following the instructionsdisplayed on the screen.

Did the test complete with all the MicrofilmController PCBA LEDs off?

140 110

110 Did the LEDs show the code below? 120 130


120 Repeat the test, ensuring that you hold the MTRswitch depressed during the test.

Is the test result completed with all the LEDs off? 140 130



140 Select the Microfilm Interface Wraparound Test,and execute it.


150 Check the interface cable between the AA gateand J1 on the Microfilm Controller PCBA. Repairas necessary.


160 Execute the manual procedure for the errorcode reported by the test. Repair as required.






161570 MM 09 0001

ICM #1 current is too high when it is off.





161580 MM 09 0002

ICM #1 path is open.


100 Check connector J2 on the Microfilm ControllerPCBA and the cable. Check both ribbon cablesconnected to the Distribution B PCBA. Checkconnector J10 and J11 of the Distribution APCBA. Make the necessary corrections.


110 Replace ICM #1.


120 Check the continuity between J10 pin 1 on theDistribution A PCBA and chip AT8 pin on theMicrofilm controller PCBA. Make the necessarycorrections.





161590 MM 09 0003

ICM #1 A/D value is less than the minimumcurrent.


100 Replace ICM #1.








161600 MM 09 0004

ICM #1 A/D says it is on when the CSE says it isoff.

161610 MM 09 0005

ICM #1 A/D is giving a bad value.

161620 MM 09 0006

ICM #2 disabled but viewed on.








161630 MM 09 0007

ICM #2 path is open.


100 Check connector J2 on the Microfilm ControllerPCBA and the cable. Check both ribbon cablesconnected to the Distribution B PCBA. Checkconnector J10 and J11 of the Distribution APCBA. Make the necessary corrections.


110 Replace ICM #2.


120 Check the continuity between J11 pin 1 on theDistribution A PCBA and chip AT8 pin on theMicrofilm Controller PCBA. Make the necessarycorrections.





161640 MM 09 0008

ICM #2 A/D value is less than the minimumcurrent.


100 Replace ICM #2.








161650 MM 09 0009

ICM #2 A/D says it is on when the CSE says it isoff.

161660 MM 09 0010

ICM #2 A/D is giving a bad value.

161670 MM 09 0011

ICM #1 disabled but viewed on.

161680 MM 09 0012

ICM #2 current is too high when it is off.







161690 MM 10 0001

One of the loop arm supply sensors wasdetected to have a failure. This fault codeindicates that either sensor 1, 2, or 3 could havea failure. Ignore the message on the screenabout sensor 1 failure.

Note: Use a DIP CLIP on the chips specifiedfor easier measurements whileperforming specified tasks.


100 Locate the Microfilm Controller Board on themicrofilm gate. This is the last card on the leftof the gate. It is external to the gate. Measurethe following pins on chip BF18 for a logic 0:

PIN 14

PIN 12

PIN 15

Did all the pins measure a logic 0? 120 110

110 Primary suspect: Microfilmer Controller PCBA.Secondary suspect:

If Pin 14 was incorrect, then switch LED No. 1.

If Pin 12 was incorrect, then switch LED No. 2


Replace the primary suspect first and then therespective secondary. After each replacement,rerun the test.


120 Monitor pin 13 of chip BL18 while you move thesupply loop arm from the up position to thebottom position and back up again.

Was there a transition from a logic 0 to 1 andfrom a logic 1 to a 0?

160 130

130 Perform a continuity check on the cable J2 onthe Microfilm Controller to J10 on theDistribution Board B.

Is the cable O.K.? 140 150

140 Primary suspect: Loop Arm Supply Sensor No.1 Secondary suspects: Microfilm ControllerBoard, Distribution B Board

150 Primary suspect: Replace the cable.



MM 10 0001


160 Monitor pin 11 of chip BL18 while you move thesupply loop arm from the up position to thebottom position and back up again.


200 170



180 Primary suspect: Loop Arm Supply Sensor No.2. Secondary suspects: Microfilm ControllerBoard Distribution B Board

190 Primary suspect: Replace the cable

200 Monitor pin 9 of the chip BL18 while you movethe supply loop arm from the up position to thebottom position and back up again.

Was there a transition from a logic 1 to 0 andfrom a logic 0 to 1?

99600 170



220 Primary suspect: Loop arm supply sensor No.3. Secondary suspects: Microfilm ControllerBoard, Distribution B Board.





161700 MM 10 0002

Loop arm sensor supply switch #2 failed.


100 Using a DVM, monitor J2 pin 54 on the MicrofilmController PCBA while moving the supply looparm though its extremes.




120 Check the continuity of the line from J2 pin 54on the Distribution B PCBA to J2 pin 54 on theMicrofilm Controller PCBA. Repair as required.


130 Replace supply sensor 2, and retest.







161710 MM 10 0003

Loop arm sensor supply switch #3 failed (LoopToo Small Sensor in error).






120 Check the continuity of the line from J2 pin 55on the Microfilm Controller PCBA to J2 pin 55 onthe Distribution B PCBA. Repair as required.


130 Use a DVM. Is J12 pin 2 on the Distribution BPCBA < 0.8 V?

140 150

140 Replace supply sensor 3, and retest.


150 Check the continuity of J12 pin 2 on theDistribution B PCBA to J2 pin 56 on theMicrofilm Controller PCBA. Repair as required.







161720 MM 10 0004

One of the loop arm takeup sensors wasdetected to have a failure. This fault codeindicates that either sensor 1, 2, or 3 could havea failure. Ignore the message on the screenabout sensor 1 failure.

Note: Use a DIP CLIP on the chips specifiedfor easier measurements whileperforming specified tasks.


100 Locate the Microfilm Controller Board on themicrofilm gate. This is the last card on the leftof the gate. It is external to the gate. Measurethe following pins on chip BF18 for a logic 0:

PIN 11

PIN 16

PIN 10

Did all the pins measure a logic 0? 120 110

110 Primary suspect: Microfilmer Controller PCBA.Secondary suspect:




Replace the primary suspect first and then therespective secondary. After each replacement,rerun the test.


120 Monitor pin 5 of chip BL18 while you move thetakeup loop arm from the up position to thebottom position and back up again.


160 130

130 Perform a continuity check on the cable J2 onthe Microfilm Controller to J7 on the DistributionBoard B.


140 Primary suspect: Loop Arm Takeup Sensor No.1. Secondary suspects: Microfilm ControllerBoard, Distribution B Board




MM 10 0004


160 Monitor pin 3 of chip BL18 while you move thetakeup loop arm from the up position to thebottom position and back up again.


200 170



180 Primary suspect: Loop Arm Takeup Sensor No.2. Secondary suspects: Microfilm ControllerBoard Distribution B Board

190 Primary suspect: Replace the cable

200 Monitor pin 1 of the chip BL18 while you movethe takeup loop arm from the up position to thebottom position and back up again.

Was there a transition from a logic 1 to 0 andfrom a logic 0 to 1?

99600 210



220 Primary suspect: Loop arm takeup sensor No.3. Secondary suspects: Microfilm ControllerBoard, Distribution B Board.





161730 MM 10 0005

Loop arm sensor takeup switch #2 failed.


100 Verify that all cables are correctly connected.(Especially check Distribution B PCBA J8.) Makenecessary corrections.






120 Check the continuity of the line from J2 pin 48on the Distribution B PCBA to J2 pin 48 on theMicrofilm Controller PCBA. Repair as required.


130 Replace takeup sensor 2, and retest.







161740 MM 10 0005

Loop arm sensor takeup switch #3 failed. (LoopToo Small Sensor in error)


100 Using a DVM, monitor J2 pin 49 on the MicrofilmController PCBA while moving the takeup looparm though its extremes.




120 Check the continuity of the line from J2 pin 49on the Microfilm Controller PCBA to J2 pin 49 onthe Distribution B PCBA. Repair as required.


130 Use a DVM. Is J9 pin 2 on the Distribution BPCBA < 0.8 V?

140 150

140 Replace takeup sensor 3, and retest.


150 Check the continuity of J9 pin 2 on theDistribution B PCBA to J2 pin 50 on theMicrofilm Controller PCBA. Repair as required.








161750 MM 11 0001

Servo Amplifier PCBA failed read-back test.



100 Check that the Servo Amp PCBA is installed andseated correctly. Reseat as required.


110 Replace the Servo Amp PCBA, and retest.




130 Using the schematics, check the continuity ofsignals CDSELN, WEN, and REN on themotherboard and P4-J4. Repair and retest.



161760 MM 11 0002

Takeup loop sensor error detected.


100 Execute the Loop Sensor MTR routine, andfollow the new fault code.



161770 MM 11 0003

Supply loop sensor error detected.


100 Execute the Loop Sensor MTR routine, andfollow the new fault code.





161780 MM 11 0004

Loop failure occurred.


100 Check if film has run out. Reload the film, andretest.


110 Check that the film in the supply and takeupcassettes is loaded correctly. Check forexcessive binding of the film in the cassette.Correct and retest.


120 Check that the motor splines engage correctlywith the cassette splines. Replace worn ordamaged cassettes or splines. Reload the filmcassette, and retest.


130 Execute the Reel Motor MTR procedure to verifycorrect operation of the reel motors andsensors. Execute the manual procedures for theerror codes indicated.


140 Execute the MTR procedures for the loopsensors, and verify correct operation. Executethe manual procedures for the error codesindicated.






161790 MM 11 0005

Invalid Move command received.


100 Replace the AA03 PCBA, and retest.




120 Replace the AA17 PCBA, and retest.



161800 MM 11 0006

During Capstan test, CSE requested filmpresent, but no film is detected.


100 If the film is not loaded, load the film, and rerunthe test.


110 Follow the new fault code, if any. End ofprocedure.

120 Run the microfilm basic tests. End ofprocedure.




161810 MM 11 0007

During Capstan test, CSE requested to runwithout film, but film is detected as present.


100 If the film is loaded, remove the film, and rerunthe test.

Does the fault code appear again? 120 110


120 Run the microfilm basic tests. End ofprocedure.

161820 MM 11 0008

Sensor Error

Note: This error could result from:

• Loop Too Large Sensor error

• Cover Closed Sensor error

• Film Loaded Sensor error


100 Rerun the test.

Does MM 11 0008 appear again? 120 110


120 Run the Basic and Transport MicrofilmerRoutines. (Start with the Basic System Check.)End of procedure.



161830 MM 11 0009

Film loop error.


100 Check if the film has run out. Reload the film,and retest.


105 Check F1 on the Galvo PCBA. Make thenecessary corrections, and rerun the test.


110 Check that the film in the supply and takeupcassettes is loaded correctly. Check forexcessive binding of the film in the cassette.Correct and retest.


120 Check that the motor splines engage correctlywith the cassette splines. Replace worn ordamaged cassettes or splines. Reload the filmcassette, and retest.


130 Execute the Reel Motor MTR procedure to verifycorrect operation of the reel motors andsensors. Execute the manual procedures for theerror codes indicated.


140 Execute the MTR procedures for the loopsensors, and verify correct operation. Executethe manual procedures for the error codesindicated.






161840 MM 11 0010

Takeup loop sensor error.


100 Execute the Loop Sensor MTR, and follow thefault code.



161850 MM 11 0011

Supply loop sensor error.


100 Execute the Loop Sensor MTR, and follow thefault code.



161860 MM 12 0001

Idler encoder register failed.








161870 MM 12 0002

Idler encoder count too low.


100 Verify that all cables are correctly connected.(Especially check Distribution B J5.) Make thenecessary corrections. Rerun the test.


110 While manually rotating the idler encoder shaft,monitor J2 pin 42 on the Microfilm ControllerPCBA.

Does the voltage switch from < 1.2 V to > 1.2V?

120 150



150 Check the continuity of signal IENDETE from J5pin 4 on the Distribution B PCBA to J2 pin 42 onthe Microfilm Controller PCBA. Repair asrequired.


160 Check that the Idler Encoder Sensor and diskare clean and correctly mounted.


170 Replace Idler Encoder Sensor Assembly, andretest.



161880 MM 13 0001

Supply encoder register failed.







161890 MM 13 0002

Supply encoder count too low.


100 Verify that all cables are correctly connected.(Especially check Distribution B J6.) Make thenecessary corrections.


110 Execute the MTR procedure to activate thesupply motor, and monitor J2 pin 44 on theMicrofilm Controller PCBA.

Does the voltage switch from < 1.2 V to > 1.2V?

120 150



150 Check the continuity of signal SENDETE from J6pin 4 on the Distribution B PCBA to J2 pin 44 onthe Microfilm Controller PCBA. Repair asrequired.


160 Check that the Supply Encoder Sensor and diskare clean and correctly mounted.


170 Replace the Supply Encoder Sensor Assembly,and retest.






161900 MM 13 0003

Supply encoder motor failed to turn on.


100 Run the Reel Motor Test. End of procedure.

161910 MM 14 0001

Galvo scan error occurred.





161920 MM 14 0002

Register 5 did not clear POSAK.







161930 MM 14 0003

Galvo voltage failure.



100 Reseat the Galvo Amp PCBA, and retest.


110 Using the schematics, check with a DVM thatsupplies + 12 V, - 2 V, + 24 V, and + 5 V arewithin +/- 10%.

Are supplies within tolerance at backplane slot1?

120 130

120 Replace the Galvo Amp PCBA. Adjust to T&A3304 4470, and retest.


130 Check the backplane connections. Repair asrequired, and retest.







161940 MM 14 0004

Galvo current failure.





110 Using schematics, with a DVM check thatsupplies + 12 V, - 12 V, + 24 V, and + 5 V arewithin +/- 10%.

Are supplies within tolerance at backplane slot1?

120 130







150 Check the adjustment of the galvo to T&A 33044447 and the PCBA to T&A 3304 4470.


160 Replace the Galvanometer, and adjust to T&As3304 4447 and 3304 4470.





161950 MM 14 0005

Galvo POSAK failure.




105 Check F1 on the Galvo Amp PCBA. Make thenecessary corrections, and rerun the test.


110 Select ICM TEST from the Microfilm Tests Menu,and run the Galvo Scan routine using anoscilloscope monitor TP1 on the Galvo AmpPCBA. Sync the oscilloscope on SCAN (TP7).

Does TP1 give an approximately 2 msec pulseat the trailing edge of SCAN?

130 120







150 Check the adjustment of the galvo to T&A 33044447 and the PCBA to T&A 3304 4470.


160 Replace the Galvanometer, and adjust to T&As3304 4447 and 3304 4470.





161960 MM 14 0007

No Galvo home can be found.


100 Install the Galvo home bypass jumper on theMicrofilm Controller PCBA. Rerun the GalvoScan routine.

Is an error code reported? 110 120

110 Execute the manual procedure for the errorcode. Remove the bypass jumper, and retest.


120 Run the MTR Galvo Home routine, and monitorpin 33 of the microfilmer backplane slot 5 (OSMPCBA) with a DVM or oscilloscope.

Does the signal switch between < 1.2 V and > 3V?

130 170



140 If not already done, adjust the galvo homeposition using T&A 3304 4447, and retest.


150 Check the backplane connections on slot 5 forproblems. Repair as required.




170 Monitor signal GALVHME on J1 pin 34 on theDistribution A PCBA.

Does signal switch between < 1.2 V and > 3 V? 180 190

180 Check the continuity of signal GALVHME from J1pin 34 on the Distribution A PCBA to slot 5 pin33 on the motherboard. Repair as required.


190 Check cable P6 on the Distribution A PCBA forproblems. Repair as required.






MM 14 0007

No Galvo home can be found. (continued)


210 Replace the Galvo Home Sensor PCBA, andadjust to T&A 3304 4447.


220 Monitor J2 pin 34 (GHLEDC).

Does the signal remain > 3 V during the test? 230 250



240 Check the continuity of signal GHLEDC from J2pin 34 on the Microfilm Controller PCBA to J7pin 1 on the Distribution A PCBA. Repair asrequired.


250 Monitor J7 pin 1 on the Distribution A PCBA.

Is the signal < 1.2 V at any time during the test? 260 270

260 Check the continuity of signal GHLEDC from J2pin 34 on the Microfilm Controller PCBA to J7pin 1 on the Distribution A PCBA. Repair asrequired.


270 Check cable P7 on the Distribution A PCBA forproblems. Repair as required.


280 Replace the Galvo Home LED PCBA, and adjustit to T&A 3304 4497.






161970 MM 14 0008

Galvo home position out of expected range.


100 Adjust the galvo home sensor to T&A 33044447.


110 Execute manual procedure MM 14 0007.



161980 MM 15 0001

ID patterns failed.(Set pattern)


100 Remove the shield at the platen, and check theseating and condition of the flat ribbons at theDistribution A and Distribution B PCBAs.


110 Check/reseat the controller flat ribbon cable atthe J2 connector on the Microfilm ControllerPCBA.




130 Replace the Distribution A PCBA.


140 Replace the Distribution B PCBA.


150 Check/reseat the flat ribbon cable at the IDDisplay PCBA.


160 Replace the ID Display PCBA.






161990 MM 15 0002

ID patterns failed.(User-specified pattern)


100 Remove the shield at the platen, and check theseating and condition of the flat ribbons at theDistribution A and Distribution B PCBAs.


110 Check/reseat the controller flat ribbon cable atthe J2 connector on the Microfilm ControllerPCBA.




130 Replace the Distribution A PCBA.


140 Replace the Distribution B PCBA.


150 Check/reseat the flat ribbon cable at the IDDisplay PCBA.


160 Replace the ID Display PCBA.



162000 WR 00 0010

Galvo Error Detection Bypass jumper is in place.

Note: The microfilmer can be operated in thisstate. Galvo errors will be ignored.


100 Remove the Galvo Error Detection Bypassjumper, and execute the Galvo MTR tests.Follow the appropriate fault code. End ofprocedure.




162010 WR 00 0020

ALM Error Detection Bypass jumper is in place.

Note: The microfilmer can be operated in thisstate. No ALM errors will be declared.


100 Remove the ALM Error Detection Bypass jumper,and execute the Lamps/ALMs MTR. Follow theappropriate fault code. End of procedure.

162020 WR 00 0030

Height Detectors failed POC.

Note: The microfilmer may still be used. Filmusage may be greater than normal.


100 Run the Height BOL MTR from the Basic MicrofilmTest Menu. Follow the appropriate fault code. Endof procedure.

162030 WR 00 0040

Human Readable Header failed POC.

Note: The microfilmer may still be used. HumanReadable Headers will not operateproperly.


100 Run the Human Readable Headers MTR test. Followthe appropriate fault code. End of procedure.

162040 WR 00 0050

Channel 2 ICM failed POC.

Note: The microfilmer may still be used. TheChannel 2 ICM will not operate properly.


100 Run the ICM MTR test. Follow the appropriate faultcode. End of procedure.


Section 17 Microfilmer Hardware Parameters

These MTR routines facilitate the adjustment of the following parameters of theNDP 1000-65 and NDP 1800-65 Cinemode Microfilmers (hereafter called the microfilmer):

• Lamp intensity/density

• Automatic Light Monitor (ALM) adjustment

• Leading edge delay (LED) and trailing edge delay (TED)

• ID display intensity

• Galvanometer adjustment

• Modifying nonvolatile RAM values

The microfilmer module is delivered fully adjusted. However, it may be necessary afterinstallation to alter some or all of the parameters to adjust for differences in documentprocessors or for specific customer requirements. An initial test run of documents andreview of the resultant film with the customer will identify this need.

Note: It is recommended that the values stored in nonvolatile memory be recorded and

stored in a safe place with the machine whenever a parameter is modified.

Microfilmer Hardware Parameters


General Operation of Parameter RoutinesThe Hardware Parameter routines are on the MTR disk and are selected using the normalMTR disk loading procedures. After you load the MTR disk, do the following:

1. Select MICROFILM TESTS (option 3) from the MTR Test Main Menu (Figure 1-1)

The Microfilm MTR Menu (Figure 1-6) is displayed.

2. Select HARDWARE PARAMETER ADJUSTMENT ROUTINES (option 9).

You will then be prompted to select the film speed, medium or high. Once you havemade a selection, the screen shown in Figure 17-1 is displayed.

MICROFILM HARDWARE PARAMETER ADJUSTMENT ROUTINES

SELECT ONE OF THE FOLLOWING FOLLOWED BY "XMIT"

1 = LAMP INTENSITY/DENSITY 2 = ALM ADJUSTMENT 3 = LED/TED 4 = ID DISPLAY INTENSITY 5 = GALVO ADJUSTMENT 6 = MODIFY NON-VOLATILE RAM VALUES 7 = RETURN TO MICROFILM MENU 99 = RETURN TO MAIN MENU

Figure 17–1. Parameter Routines Screen Format

3. Select the specific parameter to be changed.

The first screen displayed describes the routine and presents the following options tobe selected:

• Continue with the adjustment routine.

• Do not flow documents. Proceed to a routine to pick new values.

• Exit the Routine and return to the Main Menu.



Continuing with Adjustment Routine

If you choose to continue with the adjustment routine (option 2), the following sequence isfollowed.

1. Specify the type and quantity of documents needed for the test.

2. Specify any jumpers that need to be in place for the test.

3. Specify any special instructions for the routine.

4. Turn on the microfilmer, and press the START/STOP bar to bring up the motors.

Before flow starts, the document processor and microfilmer are confirmed Ready, or aNot Ready condition is reported.

If the document processor is ready, the documents are fed.

• If the document processor is Not Ready, correct the condition, or exit to the MainMenu.

• If at any time during flow the document processor goes Not Ready, the reason isdisplayed on the screen, and you can select the following options:

− Continue.

− The routine repeats the test value currently being executed, including headeridentification.

− Exit to the Main Menu.

5. Refer to the detailed routine description for specific routine execution instructions.

6. Wait for the completion of flow.

7. Bring down the motors, and develop the film.

8. Select one of the following:

• Exit to the Main Menu.

• Continue to pick a new value.



Picking a New Value

If you choose to pick a new value (option 2), the following sequence is followed:

1. The table of test values is displayed on the screen together with the current selectedvalue(s).

2. Follow the instructions on the screen to enter the new selections.

If the new selections are not valid entries, the following is displayed:

Reenter selection

3. On successful acceptance of the new selection, you are prompted to remove anyjumpers and continue.

Note: You must complete each routine to a valid exit. The microfilmer cannot be

reset/powered down in the middle of a routine. If this happens, incorrect

parameters may be stored in nonvolatile memory, and you must rerun the

routine to select a valid operating parameter.



Lamp Intensity/Density Procedure and ALMAdjustment

This routine is used to ensure that the film density and resolution are correct. Density is ameans of expressing the tone of an image as a number. The normal range of acceptabledensity readings (dependent on customer preference) usually falls in the range between 1.0and 1.5. The number is derived by reading the white density document, part number 31796857, with a densitometer, which measures the opacity of the film image.

This procedure must be executed when a lamp or major optics component is changed.

Requirement

Density to be 1.25 +˚_ 0.05 with a minimum resolution of 125 lp/mm with a 50Xmagnification.

Prerequisite

Operator PM.

Special Tools

Density Documents 3179 6857.

Control film developing and Unisys approved film.

Transmission Densitometer with 1 mm or less aperture.

Procedure

1. Ensure that the endorser is deselected.

2. Ensure that operator PM has been performed.

3. Check that density documents are not smeared, smudged, or creased.

4. Load the MTR disk.

The MTR Test Main Menu (Figure 1-1) is displayed.

5. Select MICROFILM TESTS.


6. Select HARDWARE PARAMETER ADJUSTMENT ROUTINES.

Once the film speed is selected, the Hardware Parameter Adjustment Routines Menu(Figure 1-8) is displayed.

7. A menu appears that asks you to select medium- or high-speed film. Select the filmspeed.

8. Load live film into the microfilmer, and close the film transport cover.

A 4-foot film advance automatically occurs.

9. Load at least 100 density documents (3179 6857) into the primary hopper.



10. Follow the instructions displayed on the screen to execute the Lamp Intensity/Densityadjustment procedure.

The routine automatically feeds six documents for each of 10 lamp settings. Thehuman readable header identifies each test on film in the following format:

LTD CC LL

In this format,

CC = counter (1-5).LL = test value.

11. Perform a film advance, cut the film, and remove the takeup cassette.

12. Develop the film using a controlled process.

13. Measure the density of the front and rear images at each test point.

14. Calculate the required operating point for each lamp independently using the followingmethod:

a. Select densities of test values on each side of the required operating point, 1.25.For example, tv1 = A0 density = 1.2, tv2 = A8 density = 1.3).

b. Subtract test values and densities. For example, tv2 - tv1 = 8, density tv2 - densitytv1 = 0.1).

c. Divide the difference in test values by the difference in densities. For example,8/0.1 = 80.

d. Subtract the density of tv1 from 1.25, and multiply by the value from the precedingcalculation. For example, (1.25 - 1.2)*80 = 4.

e. Add this value to tv1 to obtain the required operating point. For example, A0 + 4 =A4.

15. Enter the values calculated for the front and rear lamps using the procedure describedon the screen.

The MTR automatically runs the ALM parameter routine to select the correct ALMoperating values. The routine reports these values on the screen, and you shouldrecord them to allow monitoring of any degradation with time.



LED/TED Adjustment ProcedureThis routine allows the adjustment of the position of the leading edge of the document inthe galvo scan and the adjustment of the termination of the scan relative to the trailingedge of the document. It is required to compensate for machine-to-machine tolerancevariations.

Requirement

To achieve proper spacing between the gate mark and the leading edge of the documentand to prevent distortion on the trailing edge of the document.

Prerequisite

None

Special Tools

4.5" x 9.0" Documents 3179 7467

Procedure






4. Once the film speed is selected, the Hardware Parameter Adjustment Routines Menu(Figure 1-8) is displayed.

5. Select LED/TED.



7. Load at least 1,100 test documents (3179 7467) into the primary hopper.



8. Follow the instructions displayed on the screen to execute the LED/TED Adjustmentprocedure.

The routine flows 20 documents for each of 24 settings of LED/TED delays. Thehuman readable header and ID number display the test setting with the followingformat:

LXX.X__TXX.X

In this format,

L = LED value, XX.X = delay in msec.T = TED value, XX.X = delay in msec.

9. Perform a film advance.

10. Cut and remove the film.

11. Develop the film, ensuring that the scale on the edge of the documents is clearlyvisible.

12. View the film, and select the correct operating values for the LED and TED, asexplained next.

a. Select the LED value to produce a document leading edge position correspondingto that shown in Figure 17-2.

b. Select the TED value by adding 0.5 msec to the value that just shows the fullundistorted 9.0-inch length of the document.

13. Enter the selected LED and TED values following the description on the screen.



Figure 17–2. Film Format



ID Display Intensity Adjustment ProcedureThis routine allows the adjustment of the ID Display intensity by varying the time thedisplay characters are turned on.

Requirement

To achieve proper intensity of the ID characters on film. Characters should be clear andlegible.

Prerequisite

ID Display focused correctly to T&A 3304 4355.

Special Tools

None.

Non-CAPI Procedure







5. Select ID DISPLAY INTENSITY.



7. Load at least 200 documents (any type) into the primary hopper.



8. Follow the instructions displayed on the screen to execute the ID Display Adjustmentprocedure.

The routine flows four documents for each of 40 settings of ID display. The humanreadable header displays the test setting with the following format:

ID YY XX.X

In this format,

YY = test counterXX.X = display on time 10.0 - 30.0 msec.

The ID Display displays the pattern 000000000000 for two documents and111111111111 for two documents.


10. Cut the film, and remove the takeup cassette.


12. View the film, and select the correct operating value for the ID Display on time.

13. Enter the selected ID Display value following the description on the screen. You mustenter data in the form XX.X (in msec).

CAPI Procedure

1. From the Start Up Menu select "CAPI \ CSE Utilities \ CAPI Maintenance TestRoutines".

2. Select "Microfilmer Tests" to expand the Microfilm MTR Menu.

3. Select "Hardware Parameter Adjustment Routines" to expand the parameteradjustment menu.

4. Select the "ID Display Intensity Adjustment" utility.

5. Load live film into the microfilmer, and close the film transport cover. A 4-foot filmadvance automatically occurs.


7. Follow the instructions displayed on the screen to execute the ID Display Adjustmentprocedure. The routine flows four documents for each of 9 settings of ID display. Theformat for the human readable header text is "ID XXXXX us" where "XXXXX" is the "ontime" in microseconds. The ID display is set so that the pattern "000000000000" isdisplayed for every two documents.




11. View the film, and select the correct operating value for the ID Display on time.

12. Enter the selected ID Display value following the description on the screen.



Galvo Home Adjustment ProcedureThis routine allows the fine adjustment of the Galvo Home position on film. It is used toadjust the galvo home position together with the galvo home sensor.

Requirement

To achieve proper position of the gate marks on film. Refer to Figure 30-2.

Prerequisite

Galvo home position adjusted to T&A 3304 4439.

Special Tools

None.

Procedure







5. Select GALVO ADJUSTMENT.

6. Install the Galvo Error Bypass jumper on the Microfilm Controller PCBA.




9. Follow the instructions displayed on the screen to execute the Galvo HomeAdjustment procedure.

The routine flows 10 documents for each of eight settings of Galvo Home. The humanreadable header and ID Display display the test setting with the following format:

ID CC VV

In this format,

CC = test counter.VV = galvo home test value 00 - 80.



12. Develop the film.

13. View the film, and select the correct operating value for the Galvo Home position.Refer to Figure 30-2.



14. Enter the selected Galvo Home value following the description on the screen. Youmust enter data in the form VV.

15. Follow the procedures displayed on the screen to execute the Galvo Home sensoradjustment procedure. Follow T&A 3304 4447 to adjust the sensor position physically.

As home is found, the document processor terminal prompts you with a beep togetherwith the message "above home" or "below home."

16. Continue to adjust the sensor until home is located.

17. Execute the Galvo Home position check routine following the directions on the screen.

You are prompted to repeat the Galvo Home Sensor Adjustment if there is a mismatchbetween the Galvo Home position and the home sensor position.

Modify Nonvolatile RAM ValuesThis routine allows you to

• Display the current Hardware Parameter values

• Modify the values stored in nonvolatile RAM

• Store the modified values into nonvolatile RAM

Note: Always record the values stored in nonvolatile RAM before and after

modification. Then store them safely for future reference.

Requirement

To allow Hardware Parameters stored in nonvolatile RAM to be viewed and modified.

Prerequisite

None.

Special Tools

None.

Procedure







5. Select MODIFY NON-VOLATILE RAM VALUES.

The current parameter values are displayed on the screen. Figure 17-3 shows thedisplay format.



6. Follow the screen instructions to view and/or modify the parameters in nonvolatilememory.

PRESENT PARAMETER VALUES

1 = LED MSB - 8E 2 = LED MSB - 94 3 = TED MSB - B3 4 = TED LSB - B0 5 = FRONT LAMP - A3 6 = REAR LAMP - A3 7 = GALVO HOME - 34 8 = ID DISPLAY MSB - 61 9 = ID DISPLAY LSB - A8 10 = FRONT ALM - 0F 11 = REAR ALM - 04 12 = ICM MSB - 03 13 = ICM LSB - E8 14 = HR HEADER MSB - 3A 15 = HR HEADER LSB - 98 16 = IT

ENTER NUMBER (1-16) OF VALUE TO CHANGE FOLLOWED BY"XMIT"

Figure 17–3. Nonvolatile RAM Screen Format


Section 18 Imaging Module (U4/JPEG)

This section deals with diagnosis of problems in the U4/JPEG imaging modules in the NDP1150 and NDP 1825. Both parts of the imaging module are covered:

• The camera submodule, located between the microfilmer and the first pocket module,consists of the optics, electronics, and power supplies necessary to capture documentimages.

• The gateway submodule, located in the first pocket module, holds the PCBAs andbackplane that enable the analog image data from the camera submodule to bedigitized and processed into image packets.

This section provides diagnostic information based on the assumption that the POC testshave passed. If the sorter POC test did not pass, go back to Section 2 for POC diagnosis.

For diagnostic information for dual image, refer to Section 22, "Dual Image ManualProcedures."

Imaging Module (U4/JPEG)



170000 IM 00 0001

Sorter timed out waiting for the IIB to get controlof the Command Area Semaphore.

170010 IM 00 0002

Sorter timed out waiting for the IIB to send aqueued message to the DTI board.

170020 IM 00 0003

Sorter timed out waiting for the IIB to completetransmission of a message to the DTI board.

170030 IM 00 0004

Sorter timed out waiting for the Dual PortCommand Area to become idle.

170040 IM 00 0005

Sorter timed out waiting for the Dual PortCommand Area Semaphore to become available.

170050 IM 00 0006

Sorter timed out waiting for a response from theimaging module.

PROCEDURE

Refer to error code line (ECL) 02100 in theImage Item Processing System (IIPS) ServicingGuide: Diagnostic Procedures for the diagnosticprocedure.




170060 IM 00 0007

Sorter timed out waiting for the IIB to completetransmission of a message on the parallelinterface.

170070 IM 00 0008

Sorter timed out waiting for the IIB. The IIB wasthrough transmitting to the DTI and was waitingfor a Check Complete status.

170080 IM 00 0009

IIB/DTI parallel interface transmission error.

170090 IM 00 0010

Sorter/IIB communications error. Message toobig for dual port memory error.

170100 IM 00 0011

Sorter/IIB communications error. The IIB ran outof memory.

170110 IM 00 0012

IIB/DTI communications error. The parallelinterface is not ready.

PROCEDURE

Refer to error code line (ECL) 02100 in theImage Item Processing System (IIPS) ServicingGuide: Diagnostic Procedures for the diagnosticprocedure.




170120 IM 01 0010

The data sent does not equal the data received.


100 Replace AA15, and rerun the Parallel InterfaceLoopback test for connector option number 1(MIIB Parallel #1 Loopback, 2485 1487).


120 Does IM 01 0010 occur? 99700 130



170130 IM 01 0020



100 Replace AA15, and rerun the Parallel InterfaceLoopback test for connector option number 2(MIIB Parallel #2 Loopback, 2485 1495).


120 Does IM 01 0020 occur? 99700 130





170140 IM 01 0030



100 Run the Parallel Interface Loopback test forconnector option number 1 (MIIB Parallel #1Loopback, 2485 1487).

Note: Power should always be down whenreplacing a connector.


110 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test forconnector option number 3 (MIIB Parallel #1Cable A Loopback, 4140 4336).

Note: Power should always be down whenreplacing a cable or connector.






170150 IM 01 0040



100 Run the Parallel Interface Loopback test forconnector option number 2 (MIIB Parallel #2Loopback, 2485 1495).



110 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test forconnector option number 4 (MIIB Parallel #2Cable A Loopback, 4140 4344).








170160 IM 01 0050

Image Interface board did not enter MTR mode.

170170 IM 01 0051

The command area never went idle.

170180 IM 01 0052

The sorter received an invalid status code fromthe IIB.

170190 IM 01 0053

The sorter tried three times to send down a testcode to the IIB board, and each time the IIBreceived an invalid test code.









170200 IM 01 0060

The IIB was unable to determine the connectortype.


100 Connect a new loopback connector and rerunthe loopback test that displayed the fault code.



110 Did the fault code IM 01 0060 occur? 130 120


130 Did this error occur with Parallel Loopbackoption 5?

140 150

140 Run the Parallel Interface Loopback test foroption 3.




160 170





180 190





200 210






170200 IM 01 0060



260 270

220 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test foroption 5.



230 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test foroption 6.



240 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Run the Parallel Interface Loopback test foroption 3.



250 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test foroption 4.



260 Replace AA15 and rerun the Parallel InterfaceLoopback test for option 1.



270 Replace AA15 and rerun the Parallel InterfaceLoopback test for option 2.






170200 IM 01 0060


280 Does the fault code IM 01 0060 occur? 99700 290



170210 IM 01 0070



100 Run the Parallel Interface Loopback test forconnector option 3 (MIIB Parallel #1 Cable ALoopback, 4140 4336).



110 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test forconnector option number 5 (MIIB Parallel #1Cable Loopback, 2485 1933).








170220 IM 01 0080

The sorter was unable to get control of theCommand Area Semaphore.







170230 IM 01 0090



100 Run the Parallel Interface Loopback test forconnector option number 4 (MIIB Parallel #2Cable A Loopback, 4140 4344).



110 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Parallel Interface Loopback test forconnector option number 6 (MIIB Parallel #2Cable Loopback, 2485 1941).








170240 IM 02 0010



100 Replace AA15 and rerun the Serial InterfaceLoopback test for connector option number 1(MIIB Serial Loopback, 2485 1479).


110 Does IM 02 0010 occur? 99700 120



170250 IM 02 0020



100 Run the Serial Interface Loopback test forconnector option number 1 (MIIB SerialLoopback, 2485 1479).



110 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Rerun the Serial Interface Loopback test forconnector option number 2 (MIIB Serial Cable ALoopback, 4140 4328).







17260 IM 02 0030

The TDC/RDC serial wraparound test failed.


100 Replace the loopback connector and rerun thesame loopback test.



110 Did fault code IM 02 0030 occur? 130 120


130 Did this error occur with Serial Loopback option3?

140 150

140 Run the Serial Interface Loopback test for option2.



150 Did the error occur with Serial Loopback option2?

160 190


Note: Power should be down when replacinga connector.





170 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Serial Interface Loopback test foroption 3.



180 Replace the DP Interface cable (Ext to Gate)connected from the AA gate to the image gate.Rerun the Serial Interface Loopback test foroption 2.



190 Replace AA15 and rerun the Serial InterfaceLoopback test for option 1.








170270 IM 02 0040

The transmit test on the IIB board failed.


100 Replace the loopback connector and rerun thesame Serial Interface Loopback test.





130 Did this error occur with the Serial Loopbackoption 3?

140 150





160 190


Note: Power should be down when replacinga connector.




170280 IM 02 0050

The receive test on the IIB board failed.








140 150





160 190






170290 IM 02 0060

When trying to transmit data, the control linesindicated that data was never sent.








140 150





160 190












Does the test pass? 950









170300 IM 02 0070



100 Run the Serial Interface Loopback test forconnector option number 2 (MIIB Serial Cable ALoopback, 4140 4328).



110 Replace the DP Interface cable (Gate Int)connected from the AA gate to the image gate.Rerun the Serial Interface Loopback test forconnector option number 3 (MIIB Serial CableLoopback, 2485 1925).






Section 19 Multiline Ink Jet Endorser ManualProcedures

This section provides information on the Multiline Ink Jet Endorser (MJE) fault codes andthe maintenance procedure used to eliminate faults. The section is divided into five parts.

• Fault Code Definitions, including POC (Power-On Confidence) and MTR (MaintenanceTest Routines).

• Run Time Fault Code Definitions.

• MJE Maintenance Procedures.

• Condition, Cause, and Correction Chart.

• Additional information, including command names and descriptions, and FRU (fieldreplaceable unit) mnemonic names.

A definition is provided for each fault code, and a procedure for eliminating the fault isgiven. In some fault code step procedures, the MTR tool kit (part number 4141 1521) isrequired to isolate the FRU.

Before reading the fault codes or using the procedures, be aware of the following points:

• MTR commands are used to control the MJE for many procedures and assume theMJE control panel switches start in the "OFF" position, unless otherwise noted. Thisassures no interaction between automatic and manual commands. These commandscan only be executed by loading the MTR disk (powering on the document processorwith the MTR disk installed, or installing the MTR disk before proceeding past a POCfault display). Select "NON-IMPACT ENDORSER TESTS" from the MTR main menu.

• The procedures refer to three categories of commands:

Run time commandsPOC commandsExtended diagnostic commands

• If a dual-endorse option is present, a selection of rear or front will occur.

• Other menu selections are to be used when called out by this and other procedures(T&As and SEIs).

• In the Action column of this manual, perform the replace action or follow theprocedure listed.

Multiline Ink Jet Endorser Manual Procedures


• When using the procedure, fix one bit failure at a time. When there is a list of word andbits returned, start at the top and read down until you find the one that has failed ormultiple if asked for.

• All levels are TTL unless otherwise noted.

• After replacing a FRU, perform the tests again to verify the problem was corrected.

• Check to make sure that on any board FRU that contains fuses, that they are of propervalue and in good condition.

Note: Unless otherwise prompted, the MJE On/Off switches on the console should not

be changed from their initial state while performing the MJE tests. Doing so will

cause unexpected errors.

Extended Error Word FormatMJE POC test error codes are sometimes accompanied with two extended status wordsthat provide additional information that can be used for diagnostic purposes. In the Non-CAPI environment, the extended status is displayed in binary format, with each word andits appropriate bit positions clearly labeled. In the CAPI environment, the extended statuswords are not displayed in binary. They are displayed in hexadecimal format and areincluded as part of the 8 byte extended data field in the "DP1XXX Common API ExceptionHandler" dialog box. The extended data field is to the immediate right of the 5 byte errorcode, which is bracketed by parenthesis, in the exception handler dialog. The extendederror words for the MJE are embedded in the extended data field in the following manner:

01 02 03 04 05 06 07 08 Bytes displayed by Exception

| | | | Handler (Left to Right)

15-8 7-0 15-8 7-0 NU NU NU NU Word bit positions

|________| |_______|

| |

WORD 1 WORD 2

NU = Not Used for MJE extended error status



Fault Code Definitions

Table 19–1. Fault Code Definitions

Test NumberFault Code

(Hex) Fault Description Action

MJE 01 XX LED visual test Go to 40000

MJE 02 01 EPROM check sum failure Go to 40000

MJE 03 01 External RAM failure Go to 40000

MJE 04 01 Rear font 1 flash memory check sum failure Go to 41100









MJE 04 0A Rear font 10 flash memory check sum failure Go to 41100

MJE 04 0B Rear font 11 flash memory check sum failure Go to 41100

MJE 04 0C Rear font 12 flash memory check sum failure Go to 41100

MJE 04 0D Rear font 13 flash memory check sum failure Go to 41100

MJE 04 0E Rear font 14 flash memory check sum failure Go to 41100

MJE 04 0F Rear font 15 flash memory check sum failure Go to 41100

MJE 04 F0 Rear font 0 flash memory check sum failure Go to 41100

MJE 05 01 Rear graphics 1 flash memory check sum failure Go to 41100














MJE 05 0A Rear graphics 10 flash memory check sum failure Go to 41100

MJE 05 0B Rear graphics 11 flash memory check sum failure Go to 41100

MJE 05 0C Rear graphics 12 flash memory check sum failure Go to 41100

MJE 05 0D Rear graphics 13 flash memory check sum failure Go to 41100

MJE 05 0E Rear graphics 14 flash memory check sum failure Go to 41100

MJE 05 0F Rear graphics 15 flash memory check sum failure Go to 41100

MJE 05 F0 Rear graphics 0 flash memory check sum failure Go to 41100

MJE 06 01 Front font 1 flash memory check sum failure Go to 41100









MJE 06 0A Front font 10 flash memory check sum failure Go to 41100

MJE 06 0B Front font 11 flash memory check sum failure Go to 41100

MJE 06 0C Front font 12 flash memory check sum failure Go to 41100

MJE 06 0E Front font 13 flash memory check sum failure Go to 41100

MJE 06 0F Front font 14 flash memory check sum failure Go to 41100

MJE 06 F0 Front font 15 flash memory check sum failure Go to 41100

MJE 06 0F Front font 0 flash memory check sum failure Go to 41100

MJE 07 01 Front graphics 1 flash memory check sum failure Go to 41100














MJE 07 0A Front graphics 10 flash memory check sum failure Go to 41100

MJE 07 0B Front graphics 11 flash memory check sum failure Go to 41100

MJE 07 0C Front graphics 12 flash memory check sum failure Go to 41100

MJE 07 0D Front graphics 13 flash memory check sum failure Go to 41100

MJE 07 0E Front graphics 14 flash memory check sum failure Go to 41100

MJE 07 0F Front graphics 15 flash memory check sum failure Go to 41100

MJE 07 F0 Front graphics 0 flash memory check sum failure Go to 41100

MJE 08 01 Internal timer failure Go to 40000

MJE 09 01 Rear ACIA. DCD/ not low in loop back mode Go to 40000

MJE 09 02 Rear ACIA CTS/ not low in loop back mode Go to 40000

MJE 09 03 Rear ACIA TDRE not high in loop back mode Go to 40000

MJE 09 04 Rear ACIA TDRE did not go high in given time Go to 40000

MJE 09 06 Rear ACIA RDRF not high with receive data reg full. Go to 40000

MJE 09 07 Rear ACIA did not receive correct data in loop back mode. Go to 40000

MJE 09 08 Rear RDRF not at 0 when data buffer empty. Go to 40000

MJE 09 09 Rear TDRE not a logic 1. Go to 40000

MJE 09 0A Rear TDRE not at a one after transmitting a character. Go to 40000

MJE 09 0B Rear TDRE not zero when data register full. Go to 40000

MJE 09 0C Rear RDRF not set with data in ACIA. Go to 40000

MJE 09 0D Rear DATA not correct. should be a hex CC. Go to 40000

MJE 09 0E Rear RDRF not at a one Go to 40000

MJE 09 0F Rear incorrect data read back from the ACIA. Go to 40000

MJE 09 10 Rear interrupt on the ACIA did not happen. Go to 40000

MJE 0A 01 Front ACIA. DCD/ not low in loop back mode Go to 40000

MJE 0A 02 Front ACIA CTS/ not low in loop back mode Go to 40000

MJE 0A 03 Front ACIA TDRE not high in loop back mode Go to 40000

MJE 0A 04 Front ACIA TDRE did not go high in given time Go to 40000

MJE 0A 06 Front ACIA RDRF not high with receive data reg full. Go to 40000






MJE 0A 07 Front ACIA did not receive correct data in loop back mode. Go to 40000

MJE 0A 08 Front RDRF not at 0 when data buffer empty. Go to 40000

MJE 0A 09 Front TDRE not a logic 1. Go to 40000

MJE 0A 0A Front TDRE not at a one after transmitting a character. Go to 40000

MJE 0A 0B Front TDRE not zero when data register full. Go to 40000

MJE 0A 0C Front RDRF not set with data in ACIA. Go to 40000

MJE 0A 0D Front DATA not correct. should be a hex CC. Go to 40000

MJE 0A 0E Front RDRF not at a one Go to 40000

MJE 0A 0F Front incorrect data read back from the ACIA. Go to 40000

MJE 0A 10 Front interrupt on the ACIA did not happen. Go to 40000

MJE 0B 01 Rear printing bit did not initially reset in sim mode. Go to 40000

MJE 0B 02 Rear printing bit did not set when simulating printing Go to 40000

MJE 0B 03 Rear printing came too soon for Print Position 0. Go to 40000

MJE 0B 04 Rear trailing edge time incorrect for Print Position zero. Go to 40000

MJE 0B 05 Rear print complete did not get set in specified time or resetwhen printing went low

Go to 40000

MJE 0B 06 Rear drop counter was not at zero with no characters orgraphics to print

Go to 40000

MJE 0B 07 Rear printing not set for Print Position 1 in specified time Go to 40000

MJE 0B 08 Rear printing time for position 1 not in tolerance Go to 40000

MJE 0B 09 Rear printing did not stop after Print Position 1 specified time Go to 40000

MJE 0B 0A Rear trailing edge time not in tolerance for Print Position 1. Go to 40000

MJE 0B 0B Rear had no data error with no data to print Go to 40000

MJE 0B 0C Rear data error did not clear upon a read Go to 40000

MJE 0B 0D Rear printing bit for Print Position 2 did not come up inspecified time

Go to 40000

MJE 0B 0E Rear printing bit came up too soon for Print Position 2 Go to 40000

MJE 0B 0F Rear did not get print complete within specified time Go to 40000

MJE 0B 10 Rear print complete for Print Position 2 came up too soon Go to 40000

MJE 0B 11 Rear drop counter did not have correct count for the charactersprinted

Go to 40000

MJE 0B 12 Rear drop counter did not clear upon a read of the counter Go to 40000






MJE 0B 13 Rear printing bit not set in specified time for Print Position 3 Go to 40000

MJE 0B 15 Rear print complete did not come up in specified time for PrintPosition 3

Go to 40000

MJE 0B 14 Rear printing bit came up too soon for Print Position 3 Go to 40000

MJE 0B 16 Rear print complete came up too soon for Print Position 3 Go to 40000

MJE 0B 17 Rear drop counter did have the correct count for the PrintPosition 3 with graphics enabled and all FF’S as characters.

Go to 40000

MJE 0B 18 Rear drop counter did not clear upon a read of the counter Go to 40000

MJE 0C 01 Front printing bit did not initially reset in sim mode. Go to 40000

MJE 0C 02 Front printing bit did not set when simulating printing Go to 40000

MJE 0C 03 Front printing came too soon for Print Position 0. Go to 40000

MJE 0C 04 Front trailing edge time incorrect for Print Position zero. Go to 40000

MJE 0C 05 Front print complete did not get set in specified time or resetwhen printing went low

Go to 40000

MJE 0C 06 Front drop counter was not at zero with no characters orgraphics to print

Go to 40000

MJE 0C 07 Front printing not set for Print Position 1 in specified time Go to 40000

MJE 0C 08 Front printing time for position 1 not in tolerance Go to 40000

MJE 0C 09 Front printing did not stop after Print Position 1 specified time Go to 40000

MJE 0C 0A Front trailing edge time not in tolerance for Print Position 1. Go to 40000

MJE 0C 0B Front had no data error with no data to print Go to 40000

MJE 0C 0C Front data error did not clear upon a read Go to 40000

MJE 0C 0D Front printing bit for Print Position 2 did not come up inspecified time

Go to 40000

MJE 0C 0E Front printing bit came up too soon for Print Position 2 Go to 40000

MJE 0C 0F Front did not get print complete within specified time Go to 40000

MJE 0C 10 Front print complete for Print Position 2 came up too soon Go to 40000

MJE 0C 11 Front drop counter did not have correct count for thecharacters printed

Go to 40000

MJE 0C 12 Front drop counter did not clear upon a read of the counter Go to 40000

MJE 0C 13 Front printing bit not set in specified time for Print Position 3 Go to 40000

MJE 0C 14 Front printing bit came up too soon for Print Position 3 Go to 40000






MJE 0C 15 Front print complete did not come up in specified time for PrintPosition 3

Go to 40000

MJE 0C 16 Front print complete came up too soon for Print Position 3 Go to 40000

MJE 0C 17 Front drop counter did have the correct count for the PrintPosition 3 with graphics enabled and all FFs as characters.

Go to 40000

MJE 0C 18 Front drop counter did not clear upon a read of the counter Go to 40000

MJE 14 01 RE-SYNC ECHO (A0) command for rear DCD not at zero whencommand given to module.

Go to 42100

MJE 14 02 RE-SYNC ECHO (A0) command for rear did not get RDRF withinspecified time

Go to 42100

MJE 14 03 RE-SYNC ECHO (A0) command for rear received a "F0" insteadof the command echoed

Go to 42100

MJE 14 04 RE-SYNC ECHO (A0) command for rear did not receive thecommand echoed or the "F0" code

Go to 42100

MJE 15 01 RE-SYNC ECHO (A0) command for front DCD not at zero whencommand given to module.

Go to 42100

MJE 15 02 RE-SYNC ECHO (A0) command for front did not get RDRF withinspecified time

Go to 42100

MJE 15 03 RE-SYNC ECHO (A0) command for front received a "F0" insteadof the command echoed

Go to 42100

MJE 15 04 RE-SYNC ECHO (A0) command for front did not receive thecommand echoed or the "F0" code

Go to 42100

MJE 16 01 TEST SYSTEM POWER SUPPLIES (B4 01) command for rear didnot get DCD status from the ACIA

Go to 23100

MJE 16 02 TEST SYSTEM POWER SUPPLIES (B4 01) command for rearnever got RDRF for command returned

Go to 23100

MJE 16 04 TEST SYSTEM POWER SUPPLIES (B4 01) command for reartime out before first byte was read from the module

Go to 23100

MJE 16 05 TEST SYSTEM POWER SUPPLIES (B4 01) command for reartimed out before second byte was read from the module

Go to 23100

MJE 16 06 TEST SYSTEM POWER SUPPLIES (B4 01) command for reartimed out before the third byte was read from the module

Go to 23100

MJE 16 07 TEST SYSTEM POWER SUPPLIES (B4 01) command for reartimed out before the fourth byte was read from the module

Go to 23100

MJE 16 08 TEST SYSTEM POWER SUPPLIES (B4 01) command for rearhad communication error. Bit 7 was set in the first byte readback from the module

Go to 42100






MJE 16 09 TEST SYSTEM POWER SUPPLIES (B4 01) command for rearhad communication error. Bit 7 was set in the third byte readback from the module

Go to 23100

MJE 16 0A TEST SYSTEM POWER SUPPLIES (B4 01) command for rearcommand echoed back was incorrect

Go to 23100

MJE 16 0B TEST SYSTEM POWER SUPPLIES (B4 01) command for reartask 01 was echoed incorrectly

Go to 23100

MJE 16 0C TEST SYSTEM POWER SUPPLIES (B4 01) command for rearhad power supply out of tolerance failure.

Go to 19100

MJE 16 11 TEST SYSTEM POWER SUPPLIES (B4 01) command for rear didnot get XMIT ready

Go to 23100

MJE 16 12 TEST SYSTEM POWER SUPPLIES (B4 01) command for rear didnot get TDRE on second byte written to the module

Go to 23100

MJE 16 13 TEST SYSTEM POWER SUPPLIES (B4 01) command for rear didnot get TDRE on last byte written to the module

Go to 23100

MJE 17 01 TEST SYSTEM POWER SUPPLIES (B4 01) command for frontdid not get DCD status from the ACIA

Go to 23100

MJE 17 02 TEST SYSTEM POWER SUPPLIES (B4 01) command for frontnever got RDRF for command returned

Go to 23100

MJE 17 04 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronttime out before first byte was read from the module

Go to 23100

MJE 17 05 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronttimed out before second byte was read from the module

Go to 23100

MJE 17 06 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronttimed out before the third byte was read from the module

Go to 23100

MJE 17 07 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronttimed out before the fourth byte was read from the module

Go to 23100

MJE 17 08 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronthad communication error. Bit 7 was set in the first byte readback from the module

Go to 42100

MJE 17 09 TEST SYSTEM POWER SUPPLIES (B4 01) command for fronthad communication error. Bit 7 was set in the third byte readback from the module

Go to 23100

MJE 17 0A TEST SYSTEM POWER SUPPLIES (B4 01) command for frontcommand echoed back was incorrect

Go to 23100

MJE 17 0B TEST SYSTEM POWER SUPPLIES (B4 01) command for fronttask 01 was echoed incorrectly

Go to 23100






MJE 17 0C TEST SYSTEM POWER SUPPLIES (B4 01) command for fronthad power supply out of tolerance failure

Go to 19100

MJE 17 11 TEST SYSTEM POWER SUPPLIES (B4 01) command for frontdid not get XMIT ready

Go to 23100

MJE 17 12 TEST SYSTEM POWER SUPPLIES (B4 01) command for frontdid not get TDRE on second byte written to the module

Go to 23100

MJE 17 13 TEST SYSTEM POWER SUPPLIES (B4 01) command for frontdid not get TDRE on last byte written to the module

Go to 23100

MJE 18 01 UMBILICAL LOOP TEST (AE) command for rear did not get DCDstatus from the ACIA

Go to 23100

MJE 18 02 UMBILICAL LOOP TEST (AE) command for rear never got RDRFfor command returned

Go to 23100

MJE 18 04 UMBILICAL LOOP TEST (AE) command for rear time out beforefirst byte was read from the module

Go to 23100

MJE 18 05 UMBILICAL LOOP TEST (AE) command for rear timed out beforesecond byte was read from the module

Go to 23100

MJE 18 08 UMBILICAL LOOP TEST (AE) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 18 0A UMBILICAL LOOP TEST (AE) command for rear had incorrectcommand echoed

Go to 23100






MJE 18 10 UMBILICAL LOOP TEST (AE) command for rear has failed. Thisis the same as MTR POC command "TEST UMBILICAL". Bit mapcontains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Word 1 Bit 0 returned (SPB write)

Word 1 Bit 1 returned (SPB clock)

Word 1 Bit 2 returned (SPB read)

Word 1 Bit 7 returned (SPB Dclock)

Word 1 Bit 9 returned (drop counter)

Word 1 Bit 3 returned (Low dpath)

Word 1 Bit 4 returned (high dpath)

Word 1 bits 5 and 6 returned (both dpath return)

Word 1 Bit 5 returned (low dpath return)

Word 1 Bit 6 returned (high dpath return)

Word 1 Bit 8 returned (stim circuit)

Go to 26120

Go to 26120

Go to 26120

Go to 26120

Go to 26120

Go to 26200

Go to 26200

Go to 26290

Go to 26300

Go to 26300

Go to 04100

MJE 19 01 UMBILICAL LOOP TEST (AE) command for front did not get DCDstatus from the ACIA

Go to 23100

MJE 19 02 UMBILICAL LOOP TEST (AE) command for front never got RDRFfor command returned

Go to 23100

MJE 1A 0A TEST INTERRUPT ENABLE (A1) command for rear had incorrectcommand echoed

Go to 23100

MJE 1A 10 TEST INTERRUPT ENABLE (A1) command for rear has failed.This is the same as MTR POC command "TEST INTERRUPTENABLE PORT". Bit map contains detailed information notapplicable to this procedure

Go to 35100

MJE 1B 01 TEST INTERRUPT ENABLE (A1) command for front did not getDCD status from the ACIA

Go to 23100

MJE 1B 02 TEST INTERRUPT ENABLE (A1) command for front never gotRDRF for command returned

Go to 23100

MJE 1B 04 TEST INTERRUPT ENABLE (A1) command for front time outbefore first byte was read from the module

Go to 23100

MJE 1B 05 TEST INTERRUPT ENABLE (A1) command for front timed outbefore second byte was read from the module

Go to 23100






MJE 1B 08 TEST INTERRUPT ENABLE (A1) command for front hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 1B 0A TEST INTERRUPT ENABLE (A1) command for front hadincorrect command echoed.

Go to 23100

MJE 1B 10 TEST INTERRUPT ENABLE (A1) command for front has failed.This is the same as MTR POC command "TEST INTERRUPTENABLE PORT". Bit map contains detailed information notapplicable to this procedure.

Go to 35100

MJE 1C 01 TEST AC RELAYS (A2) command for rear did not get DCDstatus from the ACIA

Go to 23100

MJE 1C 02 TEST AC RELAYS (A2) command for rear never got RDRF forcommand returned

Go to 23100

MJE 1C 04 TEST AC RELAYS (A2) command for rear time out before firstbyte was read from the module

Go to 23100

MJE 19 04 UMBILICAL LOOP TEST (AE) command for front time out beforefirst byte was read from the module

Go to 23100

MJE 19 05 UMBILICAL LOOP TEST (AE) command for front timed outbefore second byte was read from the module

Go to 23100

MJE 19 08 UMBILICAL LOOP TEST (AE) command for front hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100






MJE 19 10 UMBILICAL LOOP TEST (AE) command for front has failed. Thisis the same as MTR POC command "TEST UMBILICAL". Bit mapcontains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Word 1 Bit 0 returned (SPB write)

Word 1 Bit 1 returned (SPB clock)

Word 1 Bit 2 returned (SPB read)

Word 1 Bit 7 returned (SPB Dclock)

Word 1 Bit 9 returned (drop counter)

Word 1 Bit 3 returned (Low dpath)

Word 1 Bit 4 returned (high dpath)

Word 1 bits 5 and 6 returned (both dpath return)

Word 1 Bit 5 returned (low dpath return)

Word 1 Bit 6 returned (high dpath return)

Word 1 Bit 8 returned (stim circuit)

Go to 26120

Go to 26120

Go to 26120

Go to 26120

Go to 26120

Go to 26200

Go to 26200

Go to 26290

Go to 26300

Go to 26300

Go to 04100

MJE 19 0A UMBILICAL LOOP TEST (AE) command for front had incorrectcommand echoed

Go to 23100

MJE 1A 01 TEST INTERRUPT ENABLE (A1) command for rear did not getDCD status from the ACIA

Go to 23100

MJE 1A 02 TEST INTERRUPT ENABLE (A1) command for rear never gotRDRF for command returned

Go to 23100

MJE 1A 04 TEST INTERRUPT ENABLE (A1) command for rear time outbefore first byte was read from the module

Go to 23100

MJE 1A 05 TEST INTERRUPT ENABLE (A1) command for rear timed outbefore second byte was read from the module

Go to 23100

MJE 1A 08 TEST INTERRUPT ENABLE (A1) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 1C 05 TEST AC RELAYS (A2) command for rear timed out beforesecond byte was read from the module

Go to 23100

MJE 1C 06 TEST AC RELAYS (A2) command for rear timed out before thirdbyte was read from the module

Go to 23100






MJE 1C 07 TEST AC RELAYS (A2) command for rear timed out beforefourth byte was read from the module

Go to 23100

MJE 1C 08 TEST AC RELAYS (A2) command for rear had communicationerror. Bit 7 was set in the first byte read back from the module

Go to 23100

MJE 1C 09 TEST AC RELAYS (A2) command for rear had communicationerror. Bit 7 was set in the third byte read back from the module

Go to 23100

MJE 1C 0A TEST AC RELAYS (A2) command for rear had incorrectcommand echoed

Go to 23100

MJE 1C 10 TEST AC RELAYS (A2) command for rear has failed. This is thesame as MTR POC command "TEST AC RELAY DRIVER". Bitmap contains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Bit 5 in Word 1 or 2 returned (AC board disconnected)

Bit 0 in Word 1 or 2 returned (vacuum relay driver)

Bit 1 in Word 1 or 2 returned (ink heater driver)

Go to 09300

Go to 09200

Go to 09200

MJE 1D 01 TEST AC RELAYS (A2) command for front did not get DCDstatus from the ACIA

Go to 23100

MJE 1D 02 TEST AC RELAYS (A2) command for front never got RDRF forcommand returned

Go to 23100

MJE 1D 04 TEST AC RELAYS (A2) command for front time out before firstbyte was read from the module

Go to 23100

MJE 1D 05 TEST AC RELAYS (A2) command for front timed out beforesecond byte was read from the module

Go to 23100

MJE 1D 06 TEST AC RELAYS (A2) command for front timed out before thirdbyte was read from the module

Go to 23100

MJE 1D 07 TEST AC RELAYS (A2) command for front timed out beforefourth byte was read from the module

Go to 23100

MJE 1D 08 TEST AC RELAYS (A2) command for front had communicationerror. Bit 7 was set in the first byte read back from the module

Go to 23100

MJE 1D 09 TEST AC RELAYS (A2) command for front had communicationerror. Bit 7 was set in the third byte read back from the module

Go to 23100

MJE 1D 0A TEST AC RELAYS (A2) command for front had incorrectcommand echoed

Go to 23100






MJE 1D 10 TEST AC RELAYS (A2) command for front has failed. This is thesame as MTR POC command "TEST AC RELAY DRIVER". Bitmap contains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Bit 5 in Word 1 or 2 returned (AC board disconnected)

Bit 0 in Word 1 or 2 returned (vacuum relay driver)

Bit 1 in Word 1 or 2 returned (ink heater driver)

Go to 09300

Go to 09200

Go to 09200

MJE 1E 01 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear did not get DCD status from the ACIA

Go to 23100

MJE 1E 02 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear never got RDRF for command returned

Go to 23100

MJE 1E 04 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear time out before first byte was read from themodule

Go to 23100

MJE 1E 05 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear timed out before second byte was read fromthe module

Go to 23100

MJE 1E 06 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear timed out before third byte was read fromthe module

Go to 23100

MJE 1E 07 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear timed out before fourth byte was read fromthe module

Go to 23100

MJE 1E 08 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear had communication error. Bit 7 was set inthe first byte read back from the module

Go to 23100

MJE 1E 09 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear had communication error. Bit 7 was set inthe third byte read back from the module

Go to 23100

MJE 1E 0A TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear had incorrect command echoed

Go to 23100






MJE 1E 10 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for rear has failed. This is the same as MTR POCcommand "TEST SOLENOIDS and CATCHER HEATER DRIVERS".Bit map contains further information (bit meanings are listedhere in abbreviated form; full descriptions are listed in the"Command Names and Descriptions" subsection).

Word 1 Bit 0 returned and Word 2 no bits returned (catcherheater)


Bit 1 in Word 1 or 2 returned (eyelid 12V)


Bit 3 in Word 1 or 2 returned (antisiphon valve)

Bit 4 in Word 1 or 2 returned (crossflush valve)

Bit 6 in Word 1 or 2 returned (ink fill)

Bit 7 in Word 1 or 2 returned (replenish fill)

Go to 10200

Go to 10250

Go to 10300

Go to 10300

Go to 10400

Go to 10400

Go to 10500

Go to 10600

MJE 1F 01 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front did not get DCD status from the ACIA

Go to 23100

MJE 1F 02 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front never got RDRF for command returned

Go to 23100

MJE 1F 04 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front time out before first byte was read from themodule

Go to 23100

MJE 1F 05 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front timed out before second byte was readfrom the module

Go to 23100

MJE 1F 06 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front timed out before third byte was read fromthe module

Go to 23100

MJE 1F 07 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front timed out before fourth byte was read fromthe module

Go to 23100

MJE 1F 08 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front had communication error. Bit 7 was set inthe first byte read back from the module

Go to 23100

MJE 1F 09 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front had communication error. Bit 7 was set inthe third byte read back from the module

Go to 23100






MJE 1F 10 TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front has failed. This is the same as MTR POCcommand "TEST SOLENOIDS and CATCHER HEATER DRIVERS".Bit map contains further information (bit meanings are listedhere in abbreviated form; full descriptions are listed in the"Command Names and Descriptions" subsection).





Bit 3 in Word 1 or 2 returned (antisiphon valve)

Bit 4 in Word 1 or 2 returned (crossflush valve)

Bit 6 in Word 1 or 2 returned (ink fill)

Bit 7 in Word 1 or 2 returned (replenish fill)

Go to 10200

Go to 10250

Go to 10300

Go to 10300

Go to 10400

Go to 10400

Go to 10500

Go to 10600

MJE 1F 0A TEST SOLENOIDS AND CATCHER HEATER OUTPUT (A3)command for front had incorrect command echoed

Go to 23100

MJE 20 01 TEST PRINT MODE CONTROL (A4) command for rear did notget DCD status from the ACIA

Go to 23100

MJE 20 02 TEST PRINT MODE CONTROL (A4) command for rear never gotRDRF for command returned

Go to 23100

MJE 20 04 TEST PRINT MODE CONTROL (A4) command for rear time outbefore first byte was read from the module

Go to 23100

MJE 20 05 TEST PRINT MODE CONTROL (A4) command for rear timed outbefore second byte was read from the module

Go to 23100

MJE 20 06 TEST PRINT MODE CONTROL (A4) command for rear timed outbefore third byte was read from the module

Go to 23100

MJE 20 07 TEST PRINT MODE CONTROL (A4) command for rear timed outbefore fourth byte was read from the module

Go to 23100

MJE 20 08 TEST PRINT MODE CONTROL (A4) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 20 09 TEST PRINT MODE CONTROL (A4) command for rear hadcommunication error. Bit 7 was set in the third byte read backfrom the module

Go to 23100






MJE 20 0A TEST PRINT MODE CONTROL (A4) command for rear hadincorrect command echoed

Go to 23100

MJE 20 10 TEST PRINT MODE CONTROL (A4) command for rear has failedThis is the same as MTR POC command "TEST PRINT MODECONTROL". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 2 Bit 1 returned (sweep)

Word 1 Bit 1 returned (phase line)

Word 1 Bit 3 returned (print pulse line)

Word 1 Bit 5 returned (latchen line)

Word 1 Bit 7 returned (colreq ack line)

Word 1 Bit 8 returned (print jet pwr sup ctrl)

Word 1 bits 0 and 2 and 4 returned (multiple failure)

Word 1 Bits 2 and 4 and 6 returned (multiple failure)

Word 1 Bit 0 returned (phase line from printhead)

Word 1 Bit 2 returned (print pulse line from printhead)

Word 1 Bit 4 returned (latchen line from printhead)

Word 1 Bit 6 returned (colreq line)

Word 1 Bit 9 returned (dac not controllable)

Word 1 Bit 10 returned (curr det or chg volt on signal)

Word 1 Bit 11 returned (curr det not on)

Word 1 Bit 12 returned ([2] lsbs of dac)

Word 1 Bit 13 returned (chg relay stuck on)

Word 2 Bit 0 returned (curr fault interrupt)

Go to 25140

Go to 25200

Go to 25200

Go to 25200

Go to 25140

Go to 25200

Go to 25450

Go to 25450

Go to 25250

Go to 25250

Go to 25250

Go to 25400

Go to 25700

Go to 25600

Go to 25600

Go to 25700

Go to 25120

Go to 25140

MJE 21 01 TEST PRINT MODE CONTROL (A4) command for front did notget DCD status from the ACIA

Go to 23100

MJE 21 02 TEST PRINT MODE CONTROL (A4) command for front never gotRDRF for command returned

Go to 23100

MJE 21 04 TEST PRINT MODE CONTROL (A4) command for front time outbefore first byte was read from the module

Go to 23100

MJE 21 05 TEST PRINT MODE CONTROL (A4) command for front timed outbefore second byte was read from the module

Go to 23100






MJE 21 06 TEST PRINT MODE CONTROL (A4) command for front timed outbefore third byte was read from the module

Go to 23100

MJE 21 07 TEST PRINT MODE CONTROL (A4) command for front timed outbefore fourth byte was read from the module

Go to 23100

MJE 21 08 TEST PRINT MODE CONTROL (A4) command for front hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 21 09 TEST PRINT MODE CONTROL (A4) command for front hadcommunication error. Bit 7 was set in the third byte read backfrom the module

Go to 23100

MJE 21 0A TEST PRINT MODE CONTROL (A4) command for front hadincorrect command echoed

Go to 23100

MJE 21 10 TEST PRINT MODE CONTROL (A4) command for front has failedThis is the same as MTR POC command "TEST PRINT MODECONTROL". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 2 Bit 1 returned (sweep)

Word 1 Bit 1 returned (phase line)

Word 1 Bit 3 returned (print pulse line)

Word 1 Bit 5 returned (latchen line)

Word 1 Bit 7 returned (colreq ack line)

Word 1 Bit 8 returned (print jet pwr sup ctrl)

Word 1 bits 0 and 2 and 4 (returned multiple failure)

Word 1 Bits 2 and 4 and 6 returned (multiple failure)

Word 1 Bit 0 returned (phase line from printhead)

Word 1 Bit 2 returned (print pulse line from printhead)

Word 1 Bit 4 returned (latchen line from printhead)

Word 1 Bit 6 returned (colreq line)

Word 1 Bit 9 returned (dac not controllable)

Word 1 Bit 10 returned (curr det or chg vlt on signal)

Word 1 Bit 11 returned (curr det not on)

Word 1 Bit 12 returned ([2] lsbs of dac)

Word 1 Bit 13 returned (chg relay stuck on)

Word 2 Bit 0 returned (curr fault interrupt)

Go to 25140

Go to 25200

Go to 25200

Go to 25200

Go to 25140

Go to 25200

Go to 25450

Go to 25450

Go to 25250

Go to 25250

Go to 25250

Go to 25400

Go to 25700

Go to 25600

Go to 25600

Go to 25700

Go to 25120

Go to 25140






MJE 22 01 SOLENOID MOTION TEST (A9) command for rear did not getDCD status from the ACIA

Go to 23100

MJE 22 02 SOLENOID MOTION TEST (A9) command for rear never gotRDRF for command returned

Go to 23100

MJE 22 04 SOLENOID MOTION TEST (A9) command for rear time outbefore first byte was read from the module

Go to 23100

MJE 22 05 SOLENOID MOTION TEST (A9) command for rear timed outbefore second byte was read from the module

Go to 23100

MJE 22 06 SOLENOID MOTION TEST (A9) command for rear timed outbefore third byte was read from the module

Go to 23100

MJE 22 07 SOLENOID MOTION TEST (A9) command for rear timed outbefore fourth byte was read from the module

Go to 23100

MJE 22 08 SOLENOID MOTION TEST (A9) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 22 09 SOLENOID MOTION TEST (A9) command for rear hadcommunication error. Bit 7 was set in the third byte read backfrom the module

Go to 23100

MJE 22 0A SOLENOID MOTION TEST (A9) command for rear had incorrectcommand echoed

Go to 23100






MJE 22 10 SOLENOID MOTION TEST (A9) command for rear has failed.This is the same as MTR POC command "TEST SOLENOIDMOTION". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 1 Bit 2 returned and Word 2 Bit 0 not returned (eyelid ckt)Word 1 Bit 3 returned and Word 2 Bit 1 not returned(antisiphon ckt)Word 1 Bit 4 returned and Word 2 Bit 2 not returned(crossflush ckt)Word 1 Bit 6 returned and Word 2 Bit 4 not returned (fillckt)Word 1 Bit 7 returned and Word 2 Bit 3 not returned(replen ckt)Word 1 Bit 1 returned (eyelid drvr)Word 1 Bit 2 returned (eyelid disconn)Word 1 Bit 3 returned (antisiphon disconn)Word 1 Bit 4 returned (crossflush disconn)Word 1 Bit 6 returned (fill disconn)Word 1 Bit 7 returned (replen disconn)Word 2 Bits 0 thru 4, more than 1 returned (motion cktbad)Word 2 Bit 0 returned (eyelid motion)Word 2 Bit 1 returned (antisiphon motion)Word 2 Bit 2 returned (crossflush motion)Word 2 Bit 3 returned (replen motion)Word 2 Bit 4 returned (fill motion)

Go to 11150

Go to 11150

Go to 11150

Go to 11150

Go to 11150

Go to 11150Go to 11400Go to 11500Go to 11600Go to 11700Go to 11800Go to 11150

Go to 11200Go to 11240Go to 11260Go to 11280Go to 11300

MJE 23 01 SOLENOID MOTION TEST (A9) command for front did not getDCD status from the ACIA

Go to 23100

MJE 23 02 SOLENOID MOTION TEST (A9) command for front never gotRDRF for command returned

Go to 23100

MJE 23 04 SOLENOID MOTION TEST (A9) command for front time outbefore first byte was read from the module

Go to 23100

MJE 23 05 SOLENOID MOTION TEST (A9) command for front timed outbefore second byte was read from the module

Go to 23100

MJE 23 06 SOLENOID MOTION TEST (A9) command for front timed outbefore third byte was read from the module

Go to 23100

MJE 23 0A SOLENOID MOTION TEST (A9) command for front had incorrectcommand echoed

Go to 23100






MJE 23 10 SOLENOID MOTION TEST (A9) command for front has failed.This is the same as MTR POC command "TEST SOLENOIDMOTION". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 1 Bit 2 returned and Word 2 Bit 0 not returned (eyelid ckt)Word 1 Bit 3 returned and Word 2 Bit 1 not returned (antisiphonckt)Word 1 Bit 4 returned and Word 2 Bit 2 not returned (crossflushckt)Word 1 Bit 6 returned and Word 2 Bit 4 not returned (fill ckt)Word 1 Bit 7 returned and Word 2 Bit 3 not returned (replenckt)Word 1 Bit 1 returned (eyelid drvr)Word 1 Bit 2 returned (eyelid disconn)Word 1 Bit 3 returned (antisiphon disconn)Word 1 Bit 4 returned (crossflush disconn)Word 1 Bit 6 returned (fill disconn)Word 1 Bit 7 returned (replen disconn)Word 2 Bits 0 thru 4, more than 1 returned (motion ckt bad)Word 2 Bit 0 returned (eyelid motion)Word 2 Bit 1 returned (antisiphon motion)Word 2 Bit 2 returned (crossflush motion)Word 2 Bit 3 returned (replen motion)Word 2 Bit 4 returned (fill motion)

Go to 11150

Go to 11150

Go to 11150

Go to 11150

Go to 11150

Go to 11150Go to 11400Go to 11500Go to 11600Go to 11700Go to 11800Go to 11150Go to 11200Go to 11240Go to 11260Go to 11280Go to 11300

MJE 24 01 INK PUMP/TRANSDUCER TEST (AA) command for rear did notget DCD status from the ACIA

Go to 23100

MJE 24 02 INK PUMP/TRANSDUCER TEST (AA) command for rear nevergot RDRF for command returned

Go to 23100

MJE 24 04 INK PUMP/TRANSDUCER TEST (AA) command for rear time outbefore first byte was read from the module

Go to 23100

MJE 24 05 INK PUMP/TRANSDUCER TEST (AA) command for rear timedout before second byte was read from the module

Go to 23100

MJE 24 08 INK PUMP/TRANSDUCER TEST (AA) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 24 0A INK PUMP/TRANSDUCER TEST (AA) command for rear hadincorrect command echoed

Go to 23100






MJE 24 10 INK PUMP/TRANSDUCER TEST (AA) command for rear hasfailed. This is the same as MTR POC command "TEST INKPUMP/TRANSDUCER". Bit map contains further information (bitmeanings are listed here in abbreviated form; full descriptionsare listed in the "Command Names and Descriptions"subsection).

Word 1 Bits 1 and 3 returned (pump volt & curr low)

Word 1 Bits 2 and 7 returned (xducer buffer & pump curr high)

Word 1 Bit 0 returned (pump volt high)

Word 1 Bit 1 returned (pump volt low)

Word 1 Bit 2 returned (pump curr high)

Word 1 Bit 3 returned (pump curr low)

Word 1 Bit 6 returned (xducer buffer offset)

Word 1 Bit 7 returned (xducer buffer output)

Word 1 Bit 4 returned (xducer offset high)

Word 1 Bit 5 returned (xducer offset low)

Go to 20115

Go to 20120

Go to 20115

Go to 20115

Go to 20900

Go to 20900

Go to 20115

Go to 20115

Go to 20200

Go to 20300

MJE 25 01 INK PUMP/TRANSDUCER TEST (AA) This fault is associatedwith the Front MJE. Critical timings cause the Front MJE to beconfigured as a Rear MJE in the preceding manual procedures.The POC is then executed again to isolate the problem on theFront MJE.

Go to 45000


Go to 45000


Go to 45000


Go to 45000







Go to 45000

MJE 25 0A INK PUMP/TRANSDUCER TEST (AA) This fault is associatedwith the Front MJE. Critical timings cause the Front MJE to beconfigured as a Rear MJE in the preceding manual procedures.The POC is then executed again to isolate the problem on theFront MJE.

Go to 45000

MJE 25 10 INK PUMP/TRANSDUCER TEST (AA) command for front hasfailed. This is the same as MTR POC command "TEST INKPUMP/TRANSDUCER". Bit map contains further information (bitmeanings are listed here in abbreviated form; full descriptionsare listed in the "Command Names and Descriptions"subsection).

Word 1 Bits 1 and 3 returned (pump volt & curr low)

Word 1 Bits 2 and 7 returned (xducer buffer & pump curr high)

Word 1 Bit 0 returned (pump volt high)

Word 1 Bit 1 returned (pump volt low)

Word 1 Bit 2 returned (pump curr high)

Word 1 Bit 3 returned (pump curr low)

Word 1 Bit 6 returned (xducer buffer offset)

Word 1 Bit 7 returned (xducer buffer output)



Go to 20115

Go to 20120

Go to 20115

Go to 20115

Go to 20900

Go to 20900

Go to 20115

Go to 20115

Go to 20200

Go to 20300

MJE 26 01 POSITIVE AIR PUMP TEST (AC) command for rear did not getDCD status from the ACIA

Go to 23100

MJE 26 02 POSITIVE AIR PUMP TEST (AC) command for rear never gotRDRF for command returned

Go to 23100

MJE 26 04 POSITIVE AIR PUMP TEST (AC) command for rear time outbefore first byte was read from the module

Go to 23100

Multi-Jet Endorser Manual Procedures





MJE 26 05 POSITIVE AIR PUMP TEST (AC) command for rear timed outbefore second byte was read from the module

Go to 23100

MJE 26 08 POSITIVE AIR PUMP TEST (AC) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 26 0A POSITIVE AIR PUMP TEST (AC) command for rear had incorrectcommand echoed

Go to 23100

MJE 26 10 POSITIVE AIR PUMP TEST (AC) command for rear has failed.This is the same as MTR POC command "TEST POSITIVE AIRSYSTEM". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 1 Bit 2 returned (pos air not sensed)

Word 1 Bit 3 returned (tank temp out of range)

Word 1 Bit 4 returned (p.h. temp out of range)

Word 1 Bit 5 returned (a spill sensor)

Word 1 Bit 6 returned (tank too full switch)

Word 1 Bit 7 returned (catcher heater drvr fail)

Word 1 Bit 8 returned (catcher heater open)

Word 1 Bit 9 returned (catcher heater stuck on)

Word 1 Bit 10 returned (catcher voltage stuck on)

Go to 01400

Go to 01500

Go to 01500

Go to 06100

Go to 07100

Go to 08100

Go to 01800

Go to 01800

Go to 01900

MJE 27 01 POSITIVE AIR PUMP TEST (AC) command for front did not getDCD status from the ACIA

Go to 23100

MJE 27 02 POSITIVE AIR PUMP TEST (AC) command for front never gotRDRF for command returned

Go to 23100

MJE 27 04 POSITIVE AIR PUMP TEST (AC) command for front time outbefore first byte was read from the module

Go to 23100

MJE 27 05 POSITIVE AIR PUMP TEST (AC) command for front timed outbefore second byte was read from the module

Go to 23100

MJE 27 08 POSITIVE AIR PUMP TEST (AC) command for front hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 27 0A POSITIVE AIR PUMP TEST (AC) command for front had incorrectcommand echoed

Go to 23100






MJE 27 10 POSITIVE AIR PUMP TEST (AC) command for front has failed.This is the same as MTR POC command "TEST POSITIVE AIRSYSTEM". Bit map contains further information (bit meaningsare listed here in abbreviated form; full descriptions are listed inthe "Command Names and Descriptions" subsection).

Word 1 Bit 2 returned (pos air not sensed)

Word 1 Bit 3 returned (tank temp out of range)

Word 1 Bit 4 returned (p.h. temp out of range)

Word 1 Bit 5 returned (a spill sensor)

Word 1 Bit 6 returned (tank too full switch)

Word 1 Bit 7 returned (catcher heater drvr fail)

Word 1 Bit 8 returned (catcher heater open)

Word 1 Bit 9 returned (catcher heater stuck on)

Word 1 Bit 10 returned (catcher voltage stuck on)

Go to 01400

Go to 01500

Go to 01500

Go to 06100

Go to 07100

Go to 08100

Go to 01800

Go to 01800

Go to 01900

MJE 28 01 VACUUM PUMP TEST (AD) command for rear did not get DCDstatus from the ACIA

Go to 23100

MJE 28 02 VACUUM PUMP TEST (AD) command for rear never got RDRFfor command returned

Go to 23100

MJE 28 04 VACUUM PUMP TEST (AD) command for rear time out beforefirst byte was read from the module

Go to 23100

MJE 28 05 VACUUM PUMP TEST (AD) command for rear timed out beforesecond byte was read from the module

Go to 23100

MJE 28 06 VACUUM PUMP TEST (AD) command for rear timed out beforethird byte was read from the module

Go to 23100

MJE 28 07 VACUUM PUMP TEST (AD) command for rear timed out beforefourth byte was read from the module

Go to 23100

MJE 28 08 VACUUM PUMP TEST (AD) command for rear hadcommunication error. Bit 7 was set in the first byte read backfrom the module

Go to 23100

MJE 28 09 VACUUM PUMP TEST (AD) command for rear hadcommunication error. Bit 7 was set in the third byte read backfrom the module

Go to 23100

MJE 28 0A VACUUM PUMP TEST (AD) command for rear had incorrectcommand echoed

Go to 23100






MJE 28 10 VACUUM PUMP TEST (AD) command for rear has failed. This isthe same as MTR POC command "TEST VACUUM SYSTEM". Bitmap contains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Word 2 bits 0,1,2,3 returned (multiple stpr drvr failure)

Word 2 Bit 0 returned (stpr drvr winding 1)




Word 2 Bit 4 returned (stpr winding 1 open)




Word 1 Bit 5 returned (vac buf amp)



Word 1 Bit 1 returned (vac too high w/valve open)

Word 1 Bit 3 returned (vac too low w/valve closed)

Word 1 Bit 4 returned (vac too high w/valve closed)

No bits returned ( default)

Go to 02700

Go to 02170

Go to 02170

Go to 02170

Go to 02170

Go to 02500

Go to 02500

Go to 02500

Go to 02500

Go to 02170

Go to 02200

Go to 02400

Go to 02800

Go to 02550

Go to 02300

Go to 02950

MJE 29 01 VACUUM PUMP TEST (AD) This fault is associated with the FrontMJE. Critical timings cause the Front MJE to be configured as aRear MJE in the preceding manual procedures. The POC is thenexecuted again to isolate the problem on the Front MJE.

Go to 45000


Go to 45000


Go to 45000







Go to 45000


Go to 45000


Go to 45000


Go to 45000


Go to 45000

MJE 29 0A VACUUM PUMP TEST (AD) This fault is associated with the FrontMJE. Critical timings cause the Front MJE to be configured as aRear MJE in the preceding manual procedures. The POC is thenexecuted again to isolate the problem on the Front MJE.

Go to 45000






MJE 29 10 VACUUM PUMP TEST (AD) command for front has failed. This isthe same as MTR POC command "TEST VACUUM SYSTEM". Bitmap contains further information (bit meanings are listed here inabbreviated form; full descriptions are listed in the "CommandNames and Descriptions" subsection).

Word 2 bits 0,1,2,3 returned (multiple stpr drvr failure)









Word 1 Bit 5 returned (vac buf amp)

Word 1 Bit 0 returned (xducer offSet high)


Word 1 Bit 1 returned (vac too high w/valve open)

Word 1 Bit 3 returned (vac too low w/valve closed)

Word 1 Bit 4 returned (vac too high w/valve closed)

No bits returned ( default)

Go to 02700

Go to 02170

Go to 02170

Go to 02170

Go to 02170

Go to 02500

Go to 02500

Go to 02500

Go to 02500

Go to 02170

Go to 02200

Go to 02400

Go to 02800

Go to 02550

Go to 02300

Go to 02950

MJE 2A 01 Dual port RAM failed Go to 40000

MJE 2B 01 readCLR/motor signal test failed. Go to 44100

MJE 2B 02 MJE ready signal test failed. Go to 44100

MJE 2B 03 MJE ready signal test failed. Go to 44100

MJE 2C 01 Unexpected exception occurred. Go to 44200

MJE 2C 02 MJE time out occurred waiting for the MJE interface (AA09) torespond.

Go to 40000

MJE 70 01 Streaker hardware is not present Go to 43200

MJE 70 02 MJE interface (AA09) failed to respond to the streakercommand

Go to 40000

MJE 70 03 Streaker test failed. a streaker has been detected. No streakshould be present at this time.

Go to 43100






MJE 70 04 Streaker test failed. No streak has been detected. a streakshould be present at this time.

Go to 43100

MJE 70 05 An overflow has been detected. Go to 43100

MJE 70 06 Streaker board reported present and should not be. Go to 43200

MJE 70 07 MJE interface (AA09) failed to respond to the column printcommand.

Go to 40000

MJE 71 01 An invalid response was received from the MJE module afterissuing the reset command.

Go to 23100

MJE 71 02 The data received from the MJE is not a valid response. Go to 23100

MJE 71 03 MJE failed to bar down after a run time error occurred. Go to 23100

MJE 71 04 Run time error/warning detected but not available. Go to 23100

MJE 71 05 MJE interface (AA09) failed to enter M&D mode. Go to 40000

MJE 71 06 Time out occurred while waiting for the MJE interface (AA09) torespond to an M&D extended command.

Go to 40000

MJE 71 07 a serial communications error occurred Go to 23100

MJE 71 08 MJE interface (AA09) timed out waiting for the MJE to respond. Go to 23100

MJE 71 09 The result status received from MJE interface (AA09) is notvalid.

Go to 40000

MJE 71 0A MJE interface (AA09) failed to block unsolicited runtime errorresponse($EF).

Go to 40000

MJE 71 0B The task number returned from the MJE is not the task that wasissued.

Go to 23100

MJE 71 0C No command/test code was received from the MJE. Go to 23100

MJE 71 0D An invalid command/test code was received from the MJE. Go to 23100

MJE 71 0E Framing error occurred. Go to 23100

MJE 71 0F Receiver overrun occurred. Go to 23100

MJE 71 10 Parity error occurred. Go to 23100

MJE 71 11 time out occurred waiting for bar up to complete. Go to 23100

MJE 71 12 MJE interface (AA09) failed to respond to clear not readycommand.

Go to 40000

MJE 71 13 MJE interface (AA09) detected a run time error but no errorswere available in dual port RAM.

Go to 23100

MJE 71 14 MJE interface (AA09) failed to exit M & D mode. Go to 40000

MJE 71 15 MJE interface (AA09) detected an unexpected interrupt. Go to 40000






MJE 71 16 MJE interface (AA09) detected an illegal opcode. Go to 40000

MJE 71 17 Serial interface is out of sync. Go to 23100

MJE 72 01 Unexpected bus exception occurred while accessing address$XXXXXXXX.

Go to 44200

MJE 80 00 Invalid run time error occurred. Go to 23100

MJE 80 3F Eyelid solenoid failure Go to 11100

MJE 80 40 Positive air pump not working Go to 29100

MJE 80 41 Vacuum system not working Go to 02100

MJE 80 42 Print jet short Go to 03100

MJE 80 43 Stimulation under amplitude Go to 04100

MJE 80 44 Stimulation over amplitude Go to 04100

MJE 80 45 Power failure detected by IJC Go to 19100

MJE 80 46 Vacuum system restricted Go to 02100

MJE 80 47 Ink spill in printer Go to 06100

MJE 80 49 Maximum state time exceeded Go to 44000

MJE 80 4C Catcher heater driver failed Go to 01100

MJE 80 4D Catcher heater open Go to 01100

MJE 80 4F Ink pressure high Go to 27100

MJE 80 50 Ink pressure low Go to 28100

MJE 80 51 Printhead ink temperature high Go to 12100

MJE 80 52 Printhead ink temperature low Go to 13100

MJE 80 53 Ink tank temperature high Go to 14100

MJE 80 54 Ink tank temperature low Go to 15100

MJE 80 55 Anti siphon valve did not open Go to 11100

MJE 80 56 Crossflush valve did not open Go to 11100

MJE 80 57 Print jet power supply failure Go to 05100

MJE 80 58 Ink pump current high Go to 30100

MJE 80 59 Ink pump current low Go to 32100

MJE 80 5A Ink pump volts high Go to 20400

MJE 80 5B Ink pump volts low Go to 20500

MJE 80 5C Ink fill valve did not open Go to 11100






MJE 80 5D Ink tank level high Go to 16100

MJE 80 5E Ink fluid low error Go to 17100

MJE 80 61 Printhead control failed Go to 04100

MJE 80 63 Ink will not warm up Go to 22100

MJE 80 64 Eyelid control failed Go to 11100

MJE 80 70 Replenish fluid low error Go to 18100

MJE 80 71 Replenish solenoid failed motion test Go to 11100

MJE 80 72 Brown out occurred Go to 19100

MJE 80 73 Watch dog circuit disabled Go to 44000

MJE 80 74 BRAM failed Go to 24100

MJE 80 75 Multiple solenoid motion failure Go to 33100

MJE 80 80 If after 15 seconds command re-sync echo (A0) issued and noresponse

Go to 31100

MJE 80 99 A to D control failure Go to 34100

MJE 80 EF Unsolicited run time error occurred. Go to 40100

MJE 80 F0 Improper data sent to printer or error code (EF) pending Go to 36100

MJE 90 A1 Print jet short interrupt failed. Go to 35100

MJE 90 A2 AC relay test failed. Go to 09100

MJE 90 A3 Solenoid and catcher heater output test failed. Go to 10100

MJE 90 A4 Print mode control test failed. Go to 25100

MJE 90 A7 7-segment display test failed. Go to 44000.

MJE 90 A9 Solenoid motion test failed. Go to 11100

MJE 90 AA Ink pump/transducer test failed. Go to 20100

MJE 90 AC Positive air system test failed. Go to 01100

MJE 90 AD Vacuum system/stepper motor test failed. Go to 02100

MJE 90 AE Umbilical test failed. Go to 26100

MJE B4 01 Extended diagnostic routine 01 failed. Go to 19100

MJE B4 0B Extended diagnostic routine 11 failed. Go to 21100



Run Time Fault Code Definitions

Table 19–2. Run Time Fault Code Definitions

Fault Code(hex) FAULT DESCRIPTION ACTION

3F Eyelid solenoid failure Go to 11100

40 Positive air pump not working Go to 29100

41 Vacuum system not working Go to 02100

42 Print jet short Go to 03100

43 Stimulation under amplitude Go to 04100

44 Stimulation over amplitude Go to 04100

45 Power failure detected by IJC Go to 19100

46 Vacuum system restricted Go to 02900

47 Ink spill in printer Go to 06100

49 Maximum state time exceeded Go to 37100

4C Catcher heater driver failed Go to 01100

4D Catcher heater open Go to 01100

4F Ink pressure high Go to 27100

50 Ink pressure low Go to 28100

51 Printhead ink temperature high Go to 12100

52 Printhead ink temperature low Go to 13100

53 Ink tank temperature high Go to 14100

54 Ink tank temperature low Go to 15100

55 Anti siphon valve did not open Go to 11100

56 Crossflush valve did not open Go to 11100

57 Print jet power supply failure Go to 05100

58 Ink pump current high Go to 30100

59 Ink pump current low Go to 32100

5A Ink pump volts high Go to 20400

5B Ink pump volts low Go to 20500

5C Ink fill valve did not open Go to 11100

5D Ink tank level high Go to 16100



Table 19–2. Run Time Fault Code Definitions

Fault Code(hex) FAULT DESCRIPTION ACTION

5E Ink fluid low error Go to 17100

61 Printhead control failed Go to 04100

63 Ink will not warm up Go to 22100

64 Eyelid control failed Go to 11100

70 Replenish fluid low error Go to 18100

71 Replenish solenoid failed motion test Go to 11100

72 Brown out occurred Go to 19100

73 Watch dog circuit disabled Go to 44000

74 BRAM failed Go to 24100

75 Multiple solenoid motion failure Go to 33100

99 A to D control failure Go to 34100

EF Unsolicited run time error occurred. Go to 40100

F0 Improper data sent to printer or error code (EF) pending Go to 36100



MJE Manual ProceduresNote: Step 66600 indicates the end of the operation. Verify the operation at that step.

Table 19–3. MJE Manual Procedures

STEP ACTION YES NO

01100 Select (POC COMMANDS) (TEST AC RELAY DRIVERS) (optionalr/f selection) *get results* <specify>.

Did it pass? 01150 09100

01150 Select (POC COMMANDS) (TEST POSITIVE AIR SYSTEM)(optional r/f selection) *get results* <specify>.If no Bits returnedWord 1 Bit 2 returned (POs air not sensed)Word 1 Bit 3 returned (tank temp out of range)Word 1 Bit 4 returned (p. temp out of range)Word 1 Bit 5 returned (a spill sensor)Word 1 Bit 6 returned (tank too full switch)Word 1 Bit 7 returned (catcher heater driver fail)Word 1 Bit 8 returned (catcher heater open)Word 1 Bit 9 returned (catcher heater stuck on)Word 1 Bit 10 returned (catcher voltage stuck on)

66500014000150001500061001610007100081000180001900

01400 Look at NE4 light on AC supply PCBA assembly.

Is it on? 01410 19100

01410 Is the positive air pump running? (Feel the port with the filter. Is it pulling a vacuum?) 01700 01430

01430 Unplug positive air pump and measure the voltage across pins1 and 3 on AC cable fluid system assembly

Does it measure between 100 and 123? 01440 01450

01440 Replace air pump assembly and rerun test.


01450 Unplug J8 on AC supply PCBA assembly and measure voltageacross pins 6 and 12 on AC supply PCBA assembly?

Does it measure between 100 and 123?01460 19410

01460 Reconnect J8 on AC supply PCBA assembly and unplug AC fluidsystem bulkhead connector. Measure voltage across pins 6and 12 on disconnected cable.

Does it measure between 100 and 123? 01470 01480

01470 Replace AC cable fluid system assembly and rerun test.





STEP ACTION YES NO

01480 Replace AC cable board to fluid system and rerun test.


01500 Select (RUN TIME COMMANDS) (SEND ERRORS/WARNINGS)(optional r/f selection) *get results* <specify>.

Select (RUN TIME COMMANDS) (bar down) (optional r/fselection) *wait for completion* <specify>.

Select (RUN TIME COMMANDS) (SEND ERRORS/WARNINGS)(optional r/f selection) *get results* <specify>.

Did it return MJE 80 51?




Did it return any of the above codes?

12100

13100

14100

1510066600


Did it pass? 01620 09100

01620 Primary suspect: AC supply PCBA assembly.Secondary suspect: AC to DC board cable.

Replace each component and rerun the test for eachcomponent until all components have been replaced or until thetest passes.


01700 Install JP1 in place of pressure switch and Select (POCCOMMANDS) (TEST POSITIVE AIR SYSTEM) (optional r/fselection) *get results* <specify>.

Did it return Word 1 Bit 2? 01730 01720




STEP ACTION YES NO

01720 Unscrew tubing nut that the pressure switch is attached to.

Install tube #1 from vacuum transducers open port (this is P2)to port where pressure switch was installed.

Select (RUN TIME COMMANDS) (SEND ERRORS/WARNINGS)(optional r/f selection) *get results* <specify>.


Select (extended DIAGNOSTIC COMMANDS) (Run diagnosticroutine 10) (10) (optional r/f selection) *get results* <specify>.

Did it read above 7?

01725 01740

01725 Remove JP1 & tube #1.

Replace pressure switch assembly and rerun test.


01730 Remove JP1 and connect pressure switch.

Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect DC cable-fluid system assembly or DC cable-board tofluid system.



01740 Unscrew filter on positive air pump.


Did it read above 7?01760 01780

01760 Remove JP1, tube #1 and connect pressure switch.

Replace filter POs air and rerun test.


01780 Remove JP1, tube #1 and connect pressure switch.

Replace air pump assembly and rerun test.





STEP ACTION YES NO

01800 Select (POC COMMANDS) (TEST SOLENOIDS and CATCHERHEATER DRIVERS) (optional r/f selection) *get results*<specify>.

Did it pass? 01820 01840

01820 Primary suspect: AC supply PCBA assembly.Secondary suspect: Ink jet controller PCBA assembly.



01840 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: AC supply PCBA assembly.



01900 Select (POC COMMANDS) (TEST INK PUMP/TRANSDUCER)(optional r/f selection) *get results* <specify>.

Did it pass?01920 01940




01940 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: AC supply PCBA assembly.



02100 Select (extended DIAGNOSTIC COMMANDS) (Run diagnosticroutine 1) (1) (optional r/f selection) *get results* <specify>.

Did it pass?02150 19100




STEP ACTION YES NO

02150 Select (POC COMMANDS) (TEST VACUUM SYSTEM/STEPPERmotor) (optional r/f selection) *get results* <specify>.

Word 2 Bits 0 through 3 (multiple stpr driver failure)Word 2 Bit 0 returned (stpr driver winding 1)Word 2 Bit 1 returned (stpr driver winding 2)Word 2 Bit 2 returned (stpr driver winding 3)Word 2 Bit 3 returned (stpr driver winding 4)Word 2 Bit 4 returned (stpr winding 1 open)Word 2 Bit 5 returned (stpr winding 2 open)Word 2 Bit 6 returned (stpr winding 3 open)Word 2 Bit 7 returned (stpr winding 4 open)Word 1 Bit 5 returned (vac buf amp)Word 1 Bit 0 returned (xducer offset high)Word 1 Bit 2 returned (xducer offset low)Word 1 Bit 1 returned (vac too high w/valve open)Word 1 Bit 3 returned (vac too low w/valve closed)Word 1 Bit 4 returned (vac too high w/valve closed)If no Bits returned (default)

027000217002170021700217002500025000250002500021700220002400028000255002300 and02950

02170 Replace ink jet controller PCBA assembly and rerun test.


02200 Is vacuum pump running?(Is there air blowing out of the pumps open port?)

02260 02220

02220 Unplug vacuum transducer.

Select (POC COMMANDS) (TEST VACUUM SYSTEM/STEPPERmotor) (optional r/f selection) *get results* <specify>.

Does the same fault Word 1 Bit 0 occur?02230 02240

02230 Reconnect vacuum transducer, replace ink jet controller PCBAassembly, and rerun test.



Did it pass?02250 02245

02245 Reconnect vacuum transducer and Go to step 19100

02250 Replace vacuum transducer assembly and rerun test.



Did it pass? 02280 09100




STEP ACTION YES NO

02280 Replace AC supply PCBA assembly and rerun test.


02300 Look at catcher line connector in printhead.

Is it connected ? 02320 02310

02310 Connect catcher line connector and Select (POC COMMANDS)(TEST VACUUM SYSTEM/STEPPER motor) (optional r/fselection) *get results* <specify>.

Did it pass? 66600 02320

02320 Disconnect catcher line from catcher and Select (POCCOMMANDS) (TEST VACUUM SYSTEM/STEPPER motor)(optional r/f selection) *get results* <specify>.

Did it pass? 02325 02330

02325 Replace printhead assembly and rerun test.


02330 Reconnect catcher line & look for pinched catcher line.

Is catcher line pinched? 66600 66500

02400 Primary suspect: Vacuum transducer assembly. Secondarysuspect: DC cable-fluid system assembly or DC cable-board tofluid system.



02500 Primary suspect: Vacuum control assembly.Secondary suspect: DC cable-fluid system assembly or DCcable-board to fluid system.



02550 Select (RUN TIME COMMANDS) (BAR UP TO STATE 0) (Y)(optional r/f selection) (0) *wait for completion* <specify>.

Did it make it? 02570 02560


Go fix the run time error




STEP ACTION YES NO


Were there any?02580 02600

02580 Go fix the run time error.


Is the vacuum pump running?(Is there air blowing out of the pump’s open port?)

02610 02630

02610 Select (RUN TIME COMMANDS) (bar down) (optional r/fselection) *wait for completion* <specify>.

Remove mist box filter and replace lid.



02615 Replace filter-filter box and rerun test.


02620 Replace mist box filter.

Plug fitting at filter box where vacuum control assembly isconnected with tube #2.



02625 Remove tube #2 & replace vacuum control assembly and reruntest.



Select (POC COMMANDS) (TEST AC RELAY DRIVERS) (optionalr/f selection) *get results* <specify>.

Did it pass? 02640 09100

02640 Check NE4 light on AC supply PCBA assembly. Is it on? 02645 19100

02645 Select (RUN TIME COMMANDS) (BAR UP TO STATE 0) (Y)(optional r/f selection) (0) *wait for completion* <specify>.Did it make it? 02650 02560




STEP ACTION YES NO


Look at LED DS5 on AC supply PCBA assembly. Is it on? 02660 02680

02660 Look at NE4 light on AC supply PCBA assembly.

Is it on? 02670 02663

02663 Replace the AC supply PCBA assembly and rerun test.



Primary suspect: Vacuum pump assembly.Secondary suspect: AC cable-board to fluid system orAC cable fluid system assembly.




Primary suspect: AC supply PCBA assembly.Secondary suspect: AC to DC board cable.



02690 Remove tube #2.

Primary suspect: Vacuum pump assembly.Secondary suspect: Vacuum line loose or cut orvacuum transducer assembly.



02700 Disconnect J9 on Ink jet controller PCBA assembly.


Does the same fault Word 2 Bits 0 through 3 occur?02710 02760




STEP ACTION YES NO

02710 Unplug vacuum control assembly.

Check for shorts between pin 1 to pin 3, 4, 5, & 6 and pin 2 topin 3, 4, 5, & 6 on the connector on the fluid system.

Were there any? 02720 02730

02720 Unplug DC cable-board to fluid system at fluid systembulkhead.

Check for shorts between pin 1 to pin 3, 4, 5, & 6 and pin 2 topin 3, 4, 5, & 6 on the vacuum valve connector on the fluidsystem.


02730 Replace Ink jet controller PCBA assembly and vacuum controlassembly and rerun test.


02740 Replace Ink jet controller PCBA assembly and DC cable-fluidsystem assembly and rerun test.


02750 Connect vacuum control assembly.

Replace Ink jet controller PCBA assembly and DC cable-boardto fluid system and rerun test.


02760 Connect J9 on Ink jet controller PCBA assembly.

Primary suspect: Vacuum control assembly.Secondary suspect: DC cable-fluid system assembly orDC cable-board to fluid system.



02800 Unscrew filter on vacuum control assembly.


Did the same fault Word 1 Bit 1 occur?02820 02840

02820 Replace vacuum control assembly and rerun test.


02840 Replace filter vacuum control assembly and rerun test.





STEP ACTION YES NO

02900 Select (POC COMMANDS) (TEST VACUUM SYSTEM/STEPPERmotor) (optional r/f selection) *get results* <specify>.

Did it pass?02910 02100

02910 Unscrew filter on vacuum control assembly.

Select (RUN TIME COMMANDS) (BAR UP - EYELID CLOSED) (Y)(optional r/f selection) *wait for completion* <specify>.

Did the same fault code MJE 80 46 occur?02920 02940

02920 Replace vacuum control assembly and rerun test.


02940 Replace filter vacuum control assembly and rerun test.


02950 Primary suspect: Filter-filter box.Secondary suspect: Vacuum pump assembly.

66500 66600


Does it pass? 03120 09100

03120 Disconnect paddle card at printhead.


Word 1 Bit 7 (printhead is connected but should not beconnected for this test, cancel test)Word 1 Bit 1 (current detect line active and it should notbe)Word 1 Bit 2 (current fault line active and it should not be)Word 1 Bit 3 (current detect line not active and it shouldbe)Word 1 Bit 4 (current fault line active and it should not be)Word 1 Bit 5 (current fault interrupt not active and it shouldbe)Word 1 Bit 0 (charge voltage commanded but failed todetect response)No Bits

03170

21300

0314003160

0314003140

03130

03200

03130 Reconnect paddle card.

Select POC command "TEST print MODE CONTROL"

Did it pass? 03135 25100




STEP ACTION YES NO




Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: AC supply PCBA assembly.




Primary suspect: AC supply PCBA assembly.Secondary suspect: Ink jet controller PCBA assembly.



03170 Disconnect printhead paddle card.


Did the same fault Word 1 Bit 7 occur?03800 03120

03200 Disconnect printhead paddle card & install test board #1 in itsplace.

Connect J1 to J1 & J2 to J2.

Select (RUN TIME COMMANDS) (read PHASE/VOLTAGE)(optional r/f selection) *get results* <specify>. Write downphase number.

Select (RUN TIME COMMANDS) (set PHASE/VOLTAGE XX/YY)(optional r/f selection) (enter phase value) (enter volts value)*wait for completion* <specify>. Set phase to old number &set volts to 175.


Does the same fault code MJE 80 42 occur again?03500 03210

03210 Measure DC voltage between TP9 & TP10 on AC supply PCBAassembly.

Is it 175 +/- 3? 03220 03215




STEP ACTION YES NO

03215 Remove test board #1 and reconnect paddle card.

Replace AC supply PCBA assembly and rerun test.


03220 Measure DC voltage between TP3 & TP1 on printhead CH driverPCB assembly.

Is it 175 +/- 3? 03260 03900


Reconnect paddle card.

Select (RUN TIME COMMANDS) (read PHASE/VOLTAGE)(optional r/f selection) *get results* <specify>. Write downphase number.

Select (RUN TIME COMMANDS) (set PHASE/VOLTAGE XX/XX)(optional r/f selection) (enter phase value) (enter volts value)*get results* <specify>. Set phase to old number & set voltsto 115.

Select (RUN TIME COMMANDS) (BAR CLEAN) (Y) (optional r/fselection) *wait for completion* <specify>.

Does the same fault code MJE 80 42 occur again? 03300 03280

03280 Run exerciser program PHASE and VOLTAGE sweep.


03300 Select (RUN TIME COMMANDS) (BAR CLEAN) (Y) (optional r/fselection) *wait for completion* <specify>.




03500 Replace printhead CH driver PCB assembly and rerun test.

Does the problem still exist?66500 66600

03700 Conduct a thorough examination of the slot, printhead cover,eyelid seal, and surrounding area for fibers or ink mud thatcould disturb one or more jets.

Remove if found. If not, select "SUPER CLEAN" from theExerciser MJE Cleaning Menu.





STEP ACTION YES NO



03710 Was the fault code MJE 80 42? 66400 03700



03800 Disconnect J4 on AC supply PCBA assembly.




Did it pass? 03840 10100




03900 Reconnect J4 on AC supply PCBA assembly.

Primary suspect: Printhead CH driver PCB assembly.Secondary suspect: Umbilical assembly.



04100 Look at DS2 LED on printhead CH driver PCB assembly.

Is it on? 04200 04600

04200 Check Connector J5 & J4 on printhead CH driver PCB assemblyand J6 & J7 on Ink jet controller PCBA assembly for properconnection.

Were they connected properly? 04300 04250

04250 Connect them and select (run time command) (BAR toSTANDBY) (optional r/f selection) *get results* <specify>.





STEP ACTION YES NO



04300 Install test board #2 at J6 & J7 using supplied b & C cable andstim test cable to Ink jet controller PCBA assembly.

Move dip switches on test board #2 to position 1.

Disconnect printhead paddle card & install test board #1 in itsplace; connect J1 to J1 & J2 to J2.


Did it make it?04330 04350




Did it pass?04370 04380



04380 Disconnect test board #2.

Reconnect J6 & J7 on Ink jet controller PCBA assembly.

Reconnect printhead paddle card.

Go to step 19100.


When complete, reinstall J6 & J7 on Ink jet controller PCBAassembly and unplug J5 & J4 on printhead CH driver PCBassembly. Install these cables to test board #2 with dipswitches on test board #2 in position 1.






STEP ACTION YES NO



04420 Reconnect printhead paddle card.

Replace Umbilical assembly and rerun test.



When complete. plug in timer board on printhead to test board#2 & move switches to position 2.







04540 Reconnect J5 & J4 on printhead CH driver PCB assembly.

Replace printhead assembly and rerun test.


04600 Unplug J5 on printhead CH driver PCB assembly and connect totest board #2.

Look at DS2 on test board #2.

Is it on? 04610 04620




Did it pass?04640 04630




STEP ACTION YES NO

04630 Reconnect J5 on printhead CH driver PCB assembly..

Go to step 19100.

04640 Plug in test board #2 to J6 on Ink jet controller PCBA assemblyusing stim test cable.

Look at DS2 on test board #2.

Is it on? 04660 04680

04660 Replace Umbilical assembly and rerun test.




05100 Disconnect the high speed print cable(15-pin ’D’) at the printermodule.

Using a convenient method, attempt to bring the printer up foroperation. (Do not attempt to print).

Connect the high-speed print cable before proceeding.

Does the error 57 continue to occur with the cabledisconnected? 05110 05115

05115 Primary suspect: MJE Interface (AA09). Secondary suspect:Cable between printer module and the AA gate.

Replace each component and rerun test for each componentuntil all components have been replaced or until the testpasses.


05110 Select (POC COMMANDS) (TEST PRINT MODE CONTROL)(optional r/f selection) *get results* <specify>.

Did it pass? 05120 25100

05120 Select (POC COMMANDS) (TEST UMBILICAL) (optional r/fselection) *get results* <specify>.

Did it pass? 05150 26100

05150 Look at F2 on AC supply PCBA assembly.

Is fuse bad? 05170 05200






STEP ACTION YES NO

05200 Select (extended DIAGNOSTIC COMMANDS) (LED SEQUENCETEST) (optional r/f selection) <specify> *get results* (N).

Go look at LED DS18 on AC supply PCBA assembly.

Did it flash?05300 05220



05300 Disconnect printhead paddle PCBA and install test PCBA No. 1in its place. Connect J1 to J1 and J2 to J2.

Select (RUN TIME COMMANDS) (BAR to STANDBY) (optional r/fselection) *get results* <specify>.

Did it make it without error MJE 8057 occurring? 05350 05400






06100 Look for where spill is coming from, if any, and repair.

Clean off spill sensors and Select (POC COMMANDS) (TESTPOSITIVE AIR SYSTEM) (optional r/f selection) *get results*<specify>.

Does fault Word 1 Bit 5 occur? 06200 66600

06200 Unplug spill sensor one at a time.

Select (POC COMMANDS) (TEST POSITIVE AIR SYSTEM)(optional r/f selection) *get results* <specify>.

Does the same fault Word 1 Bit 5 occur? 06400 06300

06300 Clean spill sensors again that causes error.



06320 Replace spill sensor assembly and rerun test.





STEP ACTION YES NO

06400 Unplug connector J9 on Ink jet controller PCBA assembly.




06500 Reconnect J9 on Ink jet controller PCBA assembly.

Unplug DC cable-board to fluid system at fluid system.



06520 Replace DC cable-board to fluid system and rerun test.


06540 Replace DC cable-fluid system assembly and rerun test.






07150 Connect printhead paddle card.






Did it pass? 07300 07250


Go to step 10100


Did it pass? 07400 07350




STEP ACTION YES NO


Go to step 09100

07400 Check fuse F1 & F3 on AC supply PCBA assembly.

Are they both O.K.? 07420 07500




07500 Replace fuse.

Select POC command "TEST POSITIVE AIR SYSTEM."




07600 Disconnect J4 on AC supply PCBA assembly & replace fuse.






07700 Reconnect J4 on AC supply PCBA assembly.

Disconnect J3 on printhead CH driver PCB assembly andconnect it to test board #2.




Replace Umbilical assembly and rerun test.







STEP ACTION YES NO


Connect J1 to J1 & J2 to J2



08150 Reinstall printhead paddle card.






Did it pass? 08300 10100


Did it pass? 08400 09100

08400 Look at DS1 on printhead CH driver PCB assembly.

Is it on? 08450 08420


Did it pass?08430 19100

08430 Replace Umbilical assembly, and rerun test.


08450 Install J3 on printhead CH driver PCB assembly onto test board#2.


Did the same fault Word 1 Bit 8 occur? 08500 08470






STEP ACTION YES NO

08500 Select (extended DIAGNOSTIC COMMANDS) (LED SEQUENCETEST) (optional r/f selection) <specify> *get results* (N).

Go look at DS15 on AC supply PCBA assembly.

Did it flash?08520 08600

08520 Reconnect J3 on printhead CH driver PCB assembly.

Primary suspect (AC supply PCBA assembly).Secondary suspect: Umbilical assembly.



08600 Reconnect J3 on printhead CH driver PCB assembly.

Primary suspect: AC supply PCBA assembly.Secondary suspect: Ink jet controller PCBA assembly.



09100 Select (POC COMMANDS) (TEST AC RELAY DRIVERS) (optionalr/f selection) *get results* <specify>.If no Bits returnedBit 5 in Word 1 or 2 (AC board disconnected)Bit 0 in Word 1 or 2 (vacuum relay driver)Bit 1 in Word 1 or 2 (ink heater driver)

66500093000920009200

09200 Unplug J5 on Ink jet controller PCBA assembly.


Does previous error occur? 09210 09220



09220 Primary suspect: AC supply PCBA assembly.Secondary suspect: AC to DC board cable.






STEP ACTION YES NO

09300 Look at cable AC to DC board cable.

Is it plugged in? 09320 09325

09320 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: AC to DC board cable or AC supply PCBA assembly.



09325 Plug cable AC to DC board cable back in and rerun test.


10100 Select (POC COMMANDS) (TEST SOLENOIDS and CATCHERHEATER DRIVERS) (optional r/f selection) *get results*<specify>.If no Bits returnedWord 1 Bit 0 & Word 2 no Bits high (catcher heater)Word 1 no Bits high & Word 2 Bit 0 (catcher heater)Bit 1 in Word 1 or 2 (eyelid 12V)Bit 2 in Word 1 or 2 (eyelid 5V)Bit 3 in Word 1 or 2 (antisiphon valve)Bit 4 in Word 1 or 2 (crossflush valve)Bit 6 in Word 1 or 2 (ink fill)Bit 7 in Word 1 or 2 (replenish fill)

665001020010250103001030010400104001050010600

10200 DS15 on AC supply PCBA assembly.

Is it on? 10210 10215

10210 Unplug cable AC to DC board cable at J5 on Ink jet controllerPCBA assembly.

Is LED DS15 on AC supply PCBA assembly on? 10220 10230










STEP ACTION YES NO

10250 Unplug AC to DC board cable at J5 on Ink jet controller PCBAassembly.

Select (POC COMMANDS) (TEST SOLENOIDS and CATCHERHEATER DRIVERS) (optional r/f selection) *get results*<specify>.

Did it return Bit 0 in Word 1 or 2? 10255 10260



10260 Primary suspect: AC supply PCBA assembly.Secondary suspect: Umbilical assembly.





Does the same fault occur? 10320 10340

10320 Replace ink jet controller PCBA assembly and rerun the test.



Unplug printhead assembly component connector in printhousing.





10380 Reconnect printhead assembly component connector.

Replace eyelid solenoid and rerun test.





STEP ACTION YES NO







Unplug printhead assembly component connector in printhousing.





10480 Replace manifold assembly and rerun test.



Select POC command "TEST SOLENOIDS and CATCHERHEATER DRIVERS."





Unplug ink fill valve.



10550 Replace ink fill valve assembly and rerun test.





STEP ACTION YES NO

10560 Reconnect ink fill valve.

Primary suspect: DC cable-fluid system assembly. Secondarysuspect DC cable-board to fluid system.








10640 Reconnect J9 on Ink jet controller PCBA.

Unplug replenish valve.



10650 Replace replenish fill valve assembly and rerun test.


10660 Reconnect ink replenish valve.

Primary suspect: DC cable-fluid system assembly. Secondarysuspect: DC cable-board to fluid system.




Did it pass? 11120 10100


Did it pass?11140 19100




STEP ACTION YES NO

11140 Select POC command" TEST SOLENOID MOTION"If no Bits returnedWord 1 Bit 2 high & Word 2 Bit 0 not high (eyelid ckt)Word 1 Bit 3 high & Word 2 Bit 1 not high (antisiphon ckt)Word 1 Bit 4 high & Word 2 Bit 2 not high (crossflush ckt)Word 1 Bit 6 high & Word 2 Bit 4 not high (fill ckt)Word 1 Bit 7 high & Word 2 Bit 3 not high (replen ckt)Word 1 Bit 1 returned (eyelid driver)Word 1 Bit 2 returned (eyelid disconn)Word 1 Bit 3 returned (antisiphon disconn)Word 1 Bit 4 returned (crossflush disconn)Word 1 Bit 6 returned (fill disconn)Word 1 Bit 7 returned (replen disconn)Word 2 if more than 1 Bit of 0 through 4 are returned (motionckt bad)Word 2 Bit 0 returned (eyelid motion)Word 2 Bit 1 returned (antisiphon motion)Word 2 Bit 2 returned (crossflush motion)Word 2 Bit 3 returned (replen motion)Word 2 Bit 4 returned (fill motion)

66500111501115011150111501115011150114001150011600117001180011150

1120011240112601128011300



11200 Move eyelid to make sure it is free.

Select (POC COMMANDS) (TEST SOLENOID MOTION) (optionalr/f selection) *get results* <specify>.

Does the same fault code occur? 11220 66600

11220 Select (POC COMMANDS) (TEST SOLENOID MOTION) (optionalr/f selection) *get results* <specify>.

Did the eyelid move? 11225 11230



11230 Primary suspect: Eyelid solenoid.Secondary suspect: Umbilical assembly.



11240 Tap on antisiphon valve Select (POC COMMANDS) (TESTSOLENOID MOTION) (optional r/f selection) *get results*<specify>.

Did it pass? 66600 11250




STEP ACTION YES NO

11250 Disconnect printhead components connector and install jumperJP2 both ends.



11253 Remove JP2 & replace manifold assembly and rerun test.


11256 Remove JP2 & reconnect printhead components connector.

Replace ink jet controller PCBA assembly and rerun test.


11260 Tap on crossflush valve.


Did it pass? 66600 11270

11270 Disconnect printhead components connector and install jumperJP2 both ends.



11273 Remove JP2 & replace manifold assembly and rerun test.


11276 Remove JP2 & reconnect printhead components connector.



11280 Tap on replenish valve.


Did it pass? 66600 11290

11290 Unplug replenish valve and plug it in where ink valve is.






STEP ACTION YES NO

11293 Reconnect ink valve.

Replace replenish fill valve assembly and rerun test.


11296 Reconnect ink & replenish valves.



11300 Tap on ink fill valve.


Did it pass? 66600 11310

11310 Unplug replenish valve and plug it in where ink valve is.



11330 Reconnect ink & replenish valves.



11340 Reconnect replenish valve.

Replace ink fill valve assembly and rerun test.


11400 Look at eyelid solenoid.

Is it connected? 11410 11405

11405 Connect eyelid solenoid and rerun test.


11410 Primary suspect: Eyelid solenoid.Secondary suspect: Umbilical assembly.



11500 Look at antisiphon valve.


11505 Connect the anti siphon valve and rerun test.





STEP ACTION YES NO

11510 Primary suspect: Manifold assembly. Secondary suspect:Umbilical assembly.



11600 Look at crossflush valve.


11605 Connect the crossflush valve and rerun test.





11700 Look at ink fill valve.


11705 Connect the ink fill valve and rerun test.


11710 Primary suspect: Ink fill valve assembly.Secondary suspect: DC cable-fluid system assembly or DCcable-board to fluid system.



11800 Look at replenish fill valve.


11805 Connect the replenish fill valve and rerun test.





STEP ACTION YES NO

11810 Primary suspect: Replenish fill valve assembly:Secondary suspect: DC cable-fluid system assembly, DC cable-board to fluid system.



12100 Look at NE3 on AC supply PCBA assembly.

Is it on? 12150 12200

12150 Unplug ink heater.


Did it pass? 12160 09100

12160 Replace AC supply PCBA assembly.

Reconnect ink heater and rerun test.


12200 Unplug connector printhead component connector in printheadhousing.



Is it below 50?12400 12300

12300 Unplug Umbilical assembly at J1 on Ink jet controller PCBAassembly.


Is it above 125?12320 12340

12320 Reconnect printhead component connector.








STEP ACTION YES NO


Is it above 125?12500 12420



12500 Look at AC fan.

Is it running? 12600 12650

12600 Is the ambient temperature above 125° F ?

Note: Printer will not run if above 125° F.

66600 66500

12650 Disconnect fan plug and measure AC voltage across the pin onconnector.

Is it between 100 and 120? 12660 12670

12660 Replace fan and rerun test.


12670 Reconnect fan.


Did it pass?12690 19100

12690 Primary suspect: AC cable-board to fluid system. Secondarysuspect: AC supply PCBA assembly.




Did it pass? 13130 09100

13130 Select (POC COMMANDS) (TEST POSITIVE AIR SYSTEM)(optional r/f selection) *get results* <specify>.

Did it pass? 22100 13150




STEP ACTION YES NO

13150 Unplug printhead components connector in print housing andinstall JP2 both ends.



Did ink temperature go above 125?13300 13200

13200 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: Umbilical assembly.




Is it below 50?13400 13320

13320 Remove JP2.

Replace manifold assembly and rerun test.


13400 Ambient temperature at printhead is below 50 DEG F.


14100 Look at NE3 on AC supply PCBA assembly.

Is it on? 14150 14200

14150 Unplug ink heater.

Select (POC COMMANDS) (TEST AC RELAY DRIVERS) (optionalr/f selection) *get results* <specify>..

Did it pass? 14160 09100

14160 Replace AC supply PCBA assembly.

Reconnect ink heater and rerun test.





STEP ACTION YES NO

14200 Unplug ink pump connector at the ink pump.



Is it below 50?14400 14300

14300 Unplug DC cable-board to fluid system at fluid systembulkhead.


Is it below 50?14320 14350

14320 Replace DC cable-fluid system assembly and rerun test.


14350 Unplug DC cable-board to fluid system at J9 on Ink jet controllerPCBA assembly.


Is it below 50?14360 14370

14360 Connect ink pump connector.

Replace DC cable-board to fluid system and rerun test.


14370 Reconnect DC cable-board to fluid system at fluid systembulkhead & ink pump connector.



14400 Connect ink pump connector.

Look at AC fan.

Is it running? 14500 14550


Is it above 125?14600 14520




STEP ACTION YES NO

14520 Primary suspect: Ink pump assembly.Secondary suspect: The ambient is above 125° F.

Note: If the ambient is above 125°F the printer will not run.



14550 Disconnect fan plug and measure AC voltage across the pin onconnector.

Is it between 103 and 127? 14570 14580


Did it pass?14590 14580

14580 Reconnect fan plug.

Go to step 19100

14590 Primary suspect: AC cable-board to fluid system. Secondarysuspect: AC supply PCBA assembly.



14600 Is the ambient temperature above 125° F?

Note: printer will not run if above 125°F.

66600 66500

15100 Unplug connector ink pump assembly at the ink pump andinstall JP4.



Is it above 125?15300 15200




STEP ACTION YES NO

15200 Remove JP4 & connect connector ink pump assembly.

Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: DC cable-fluid system assembly or DC cable-board tofluid system.




Is it below 50?15400 15320

15320 Replace ink pump assembly and rerun test.


15400 Remove JP4 & connect connector ink pump assembly.

Is ambient temperature at printhead below 45° F?

Note: Printer will not run below 45°F.

66600 66500


Did it pass? 16120 10100

16120 Select (POC COMMANDS) (TEST POSITIVE AIR SYSTEM)(optional r/f selection) *get results* <specify>.

Did it return Bit 6 high? 16150 16600

16150 Look at ink level.

Is the distance from the top of the tank to the ink level less than4.5 inches? 16300 16200

16200 Install JP3 in place of float connector.


Did it pass? 16220 16250

16220 Replace float switch assembly and rerun test.





STEP ACTION YES NO

16250 Remove JP3 & connect float connector.

Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: DC cable-fluid system assembly or DC cable-board tofluid system.



16300 Drain the tank to half.

Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (CIRCULATE TABLE) *wait forcompletion* <specify>.

Select (RUN TIME COMMANDS) (BAR UP TO STATE 0) (Y)(optional r/f selection) (0) *wait for completion* <specify>.

Did it return MJE 80 5D? 16200 16310


Was there error MJE 80 5D?16200 16320

16320 Unplug ink fill & ink replenish valves.

Install jumper JP3 in place of float switch.

Disconnect the tube from the ink fill valve elbow.


Did it make it to state 2? 16325 16520



16330 Watch to see if ink or replenish is flowing in the tubing.

Was there any? 16350 16500

16350 Unplug JP3 & connect float switch, fill valve, and replenishvalve.

Replace tube from ink fill valve elbow.

Replace ink or replenish fill valve assembly (whichever oneleaked) and rerun test.

Did it pass? 66500 66600




STEP ACTION YES NO

16500 Unplug JP3 & connect float switch, fill valve, and replenishvalve.

Replace tube from ink fill valve elbow.

Select (RUN TIME COMMAND) (BAR UP TO STATE 2) (Y)(optional r/f selection) (2) *wait for completion* <specify>.

Did it make it to run time state 2? 66600 16510



16520 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: DC cable-fluid system assembly orDC cable-board to fluid system.



16600 Look at the ink tray.

Is ink leaking? 16610 16620

16610 Repair ink leak and rerun test.


16620 Select (run time command) (BAR UP TO STATE 3) (Y) (optionalr/f selection) (3) *wait for completion* <specify>.

Is the ink foaming? 16630 66500

16630 Look below the ink level where the air is entering and repair.Rerun test


17100 Look at ink bottle.

Is ink bottle empty? 17150 17200

17150 Replace ink bottle.


17200 Is ink bottle connected? 17300 17250

17250 Connect ink bottle.





STEP ACTION YES NO



Did it pass? 17400 11100

17400 Install new ink bottle.


Is there ink flowing in the ink fill line? 17500 17600

17500 Replace filter-restrictor assembly and rerun test.


17600 Replace filter inline and rerun test.


18100 Look at replenish bottle.

Is replenish bottle empty? 18150 18200

18150 Replace replenish bottle.


18200 Is replenish bottle connected? 18300 18250

18250 Connect replenish bottle.




Did it pass? 18400 11100

18400 Install new replenish bottle.


Is there replenish flowing in the replenish fill line? 18500 18600

18500 Replace filter-restrictor assembly and rerun test.





STEP ACTION YES NO

18600 Replace filter inline and rerun test.


19100 Look at LEDS DS5, DS6, DS7, & DS8 on Ink jet controllerPWBA assembly.

Are they all on? 19410 19110

19110 Look at LED DS8 on Ink jet controller PWBA assembly.

Is it on? 19130 19120

19120 Primary suspect: -12VDC problem indicated. Diagnose perschematic sheet 03.05.07 and T& a 3304 3092.

Secondary suspect: DC cable-bulkhead to board or Ink jetcontroller PWBA assembly.




Is it on? 19210 19140

19140 Measure DC voltage between TP8 and the right side of fuse F1.

Is there any voltage?19160 19150

19150 Primary suspect: +12VDC problem indicated. Diagnose perschematic sheet 03.05.07 and T&A 3304 3092.




19160 Was the voltage between 11.5-13? 19170 19165

19165 +12VDC problem indicated. Diagnose per schematic sheet03.05.07 and T & a 3304 3092.

Rerun test.


19170 Disconnect J5 on Ink jet controller PWBA assembly.

Replace FUSE F1 and look at LED DS7 on Ink jet controllerPWBA assembly.

Is it on? 19180 19175




STEP ACTION YES NO

19175 Replace ink jet controller PWBA assembly and rerun test.


19180 Reconnect J5 on Ink jet controller PWBA assembly.

Look at LED DS7 on Ink jet controller PWBA assembly.

Is it on? 66600 19190

19190 Replace AC supply PWBA assembly and rerun test.



Is it on? 19300 19220

19220 Measure DC voltage between TP8 and the right side of fuse F2on Ink jet controller PWBA assembly.

Is there any voltage? 19240 19230

19230 Primary suspect: +5VDC problem indicated. Diagnose perschematic sheet 03.05.07 and T&A 3304 3092.




19240 Was the voltage between 4.8-5.5? 19250 19245

19245 +5VDC problem indicated. Diagnose per schematic 03.05.07and T&A 3304 3092.

Rerun test.


19250 Disconnect J5 on Ink jet controller PWBA assembly and replaceFUSE F2.


Is it on? 19260 19255



19260 Reconnect J5 on ink jet controller PWBA assembly.

Look at LED DS6 on the ink jet controller PWBA assembly.

Is it on? 66600 19265




STEP ACTION YES NO




Is it on? 66600 19310

19310 Measure DC voltage between TP8 and the right side of FUSEF3 on Ink jet controller PWBA assembly.

Is there any voltage? 19330 19320

19320 Primary suspect: +24 VDC problem indicated. Diagnose perschematic sheet 03.05.07 and T & a 3304 3092.




19330 Was the voltage between 22.5 and 28.5? 19340 19335

19335 +24 VDC problem indicated. Diagnose per schematic sheet03.05.07 and T & a 3304 3092.


19340 Disconnect J5 on Ink jet controller PWBA assembly and replaceFUSE F3.


Is it on? 19350 19345





Is it on? 66600 19360






STEP ACTION YES NO

19410 Select (extended DIAGNOSTIC COMMANDS) (Run diagnosticroutine 1) (1) (optional r/f selection) *get results* <spcfy>.

Word 1 Bit 0 returned (+5 volt supply)Word 1 Bit 1 returned (+12 volt supply)Word 1 Bit 2 returned (+24 volt supply)Word 1 Bit 4 returned (-12 volt supply)Word 1 Bit 5 returned (line volt supply)Word 1 Bit 3 returned ("enhance" volt supply)Word 1 Bit 6 returned (pressure transducer supply)Word 1 Bit 7 returned (vacuum transducer supply)Word 1 Bit 8 returned (A to D gnd check)Word 1 Bit 9 returned (printhead hour meter level)If no Bits returned

19420194601944019700198001990019415194151941519500

19415 Replace ink jet controller assembly and rerun test.


19420 Measure DC voltage between TP3 & TP8 on Ink jet controllerPWBA assembly.

Do you have voltage between 4.8 & 5.5? 19430 19435




Rerun test.



Do you have voltage between 22.5 & 28.5? 19450 19455




Rerun test.



Do you have voltage between 11.25 & 13? 19470 19480






STEP ACTION YES NO


Rerun test.


19500 Disconnect J6 on Ink jet controller PWBA assembly and select(extended DIAGNOSTIC COMMANDS) (Run diagnostic routine 1)(1) (optional r/f selection) *get results* <spcfy>.

Did it pass?19520 19510




Disconnect timer board of printhead.

Select (extended DIAGNOSTIC COMMANDS) (Run diagnosticroutine 1) (1) (optional r/f selection) *get results* <spcfy>.

Did it pass?19530 19540



19540 Disconnect J5 on printhead CH driver PCB assembly.


Did it pass?19550 19560




Does it pass? 66500 66600


Do you have voltage between -11.25 & -13? 19720 19740






STEP ACTION YES NO

19740 -12 VDC problem indicated. Diagnose per schematic sheet03.05.07 and T&A 3304 3092.

Rerun test.


19800 Look at NE4 on AC supply PWBA assembly.

Is it on? 19840 19810

19810 Disconnect AC cable and bulkhead connector at J5 on ACsupply PWBA assembly.

Measure AC voltage from pin 1 to pin 3 on cable.

Do you have voltage between 100 & 123? 19815 19820



19820 Measure AC voltage on AC cable and bulkhead connector frompin 1 to pin 3.

Was there any voltage? 19825 19830

19825 Connect AC cable and bulkhead.

110 VAC problem indicated. Check circuit breakers. Diagnoseper schematic sheet 03.05.03 and tap setting information perSEI 4142 5455.

Rerun test.



Primary suspect: 110 VAC problem indicated. Check circuitbreakers. Diagnose per schematic sheet 03.05.03 and tapsetting information per SEI 4142 5455.

Secondary suspect: AC cable and bulkhead connector.



19840 Select (POC COMMANDS) (TEST AC RELAY DRIVERS) (optionalr/f selection) *get results* <spcfy>.

Did it pass? 19850 09100

19850 Look at DS23 on Ink jet controller PWBA assembly.

Is it on? 19870 19860




STEP ACTION YES NO

19860 Primary suspect: AC supply PWBA assembly.Secondary suspect: AC to DC board cable or Ink jet controllerPWBA assembly.



19870 Look at DS17 on AC supply PWBA assembly.

Is it on? 19880 19890

19880 Disconnect AC cable and bulkhead connector at J5 on ACsupply PWBA assembly.

Measure AC voltage from pin 1 to pin 3.

Do you have voltage between 103 & 127? 19883 19886


Replace ink jet controller PWBA assembly and rerun test.



110 VAC problem indicated. Check circuit. Breakers. Diagnoseper schematic sheet 03.05.03 and tap setting information perSEI 4142 5455.

Rerun test.


19890 Disconnect J6 on AC supply PWBA assembly.

Is NE4 on? 19970 19980

19900 Look at DS1 on AC supply PWBA assembly.

Is it on? 19910 19905



19910 Measure DC voltage between TP1 and TP2 on AC supply PWBAassembly.

Is it between 8 & 11? 19930 19920


Is it between 8 & 11 volts DC? 19930 19925






STEP ACTION YES NO

19930 Primary suspect: Ink jet controller PWBA assembly. Secondarysuspect: AC to DC board cable.



19970 Primary suspect: AC supply PWBA assembly.Secondary suspect: AC to DC board cable.



19980 Primary suspect: Ink jet controller PWBA assembly. Secondarysuspect: AC to DC board cable.




Did it pass?20110 19100

20110 Select (POC COMMANDS) (TEST INK PUMP/TRANSDUCER)(optional r/f selection) *get results* <spcfy>.

Word 1 Bit 1 & 3 (pump volt & curr low)Word 1 Bit 2 & 7 (xducer buffer & pump curr high)Word 1 Bit 0 returned (pump volt high)Word 1 Bit 1 returned (pump volt low)Word 1 Bit 2 returned (pump curr high)Word 1 Bit 3 returned (pump curr low)Word 1 Bit 6 returned (xducer buffer offset)Word 1 Bit 7 returned (xducer buffer output)Word 1 Bit 4 returned (xducer offset high)Word 1 Bit 5 returned (xducer offset low)If no Bits returned

20115201202011520115209002090020115201152020020300






STEP ACTION YES NO

20120 Disconnect J16 on Ink jet controller PWBA assembly.

Select (POC COMMANDS) (TEST INK PUMP/TRANSDUCER)(optional r/f selection) *get results* <spcfy>.

Did it return Word 1 Bit 2 & 7?20130 20900



20200 Select (RUN TIME COMMANDS) (BAR EVACUATE) (optional r/fselection) *wait for completion* <spcfy>.

When complete, Select (POC COMMANDS) (TEST INKPUMP/TRANSDUCER) (optional r/f selection) *get results*<spcfy>.


20250 Primary suspect: Manifold assembly. Secondary suspect: Inkjet controller PWBA assembly or Umbilical assembly.




When complete, Select (POC COMMANDS) (TEST INKPUMP/TRANSDUCER) (optional r/f selection) *get results*<spcfy>.






Did it pass?20420 20100

20420 Replace ink pump assembly and rerun test.





STEP ACTION YES NO


Did it pass?20550 20100

20550 Primary suspect: Ink pump assembly.Secondary suspect: Filter bypass.



20900 Connect J16 Ink jet controller PWBA assembly.

Primary suspect: Ink pump assembly.Secondary suspect: DC cable-fluid system assembly orDC cable-board to fluid system.





Word 1 Bit 1 returned (current detect line active and it shouldnot be)Word 1 Bit 2 returned (current fault line active and it should notbe)Word 1 Bit 3 returned (current detect line not active and itshould be)Word 1 Bit 4 returned (current fault line active and it should notbe)Word 1 Bit 5 returned (current fault interrupt not active and itshould be)Word 1 Bit 0 returned (charge voltage commanded but failed todetect response)Word 1 Bit 7 returned (printhead is connected but should notbe connected for this test, cancel test)No bits returned

21300

21500

21400

21500

21500

21200

21150

66600



Did it pass?66600 21100




STEP ACTION YES NO

21200 Select (POC COMMANDS) (TEST PRINT MODE CONTROL)(optional r/f selection) *get results* <spcfy>.

Did it pass? 21220 21210


Go to step 25100


Replace AC supply PWBA assembly and rerun test.




Select (POC COMMANDS) (TEST PRINT MODE CONTROL)(optional r/f selection) *get results* <spcfy>.





Primary suspect: AC supply PWBA assembly.Secondary suspect: Printhead CH driver PCB assembly.




Primary suspect: AC supply PWBA assembly.Secondary suspect: Ink jet controller PWBA assembly.




Primary suspect: Ink jet controller PWBA assembly. Secondarysuspect: AC supply PWBA assembly.






STEP ACTION YES NO


Did it pass? 22200 09100


Did it pass?22300 19100

22300 Select (RUN TIME COMMANDS) (BAR UP - EYELID CLOSED) (Y)(optional r/f selection) *wait for completion* <spcfy>.

Look at NE3 on AC supply PWBA assembly.

Did it come on?22400 22320



22400 Primary suspect: Ink pump assembly.Secondary suspect: AC cable-board to fluid system or ACcable-fluid system assembly.



23100 Look at LEDS DS5, DS6, DS7, & DS8 on Ink jet controllerPWBA assembly.

Are they on? 23200 19100

23200 Look at DS13 & DS20 on Ink jet controller PWBA assembly.

Is one of the LEDS on?23220 23300








STEP ACTION YES NO

23300 Primary suspect: MJE Interface (AA09) or cable betweenprinter module and AA gate.

Secondary suspect: Command and control port cable or Ink jetcontroller PWBA assembly.



23400 Look at the dip switch package on the Ink Jet Controller Board.

Are they set per schematic sheet 09.01.02?23500 23420

23420 Set DIP switches per schematic 09.01.02 and hit manual resetbutton.

Select (POC COMMANDS) (RE-SYNC ECHO TEST) (optional r/fselection) *get results* <spcfy>.

Did it pass? 66600 23500

23500 Push manual reset button on Ink jet controller PWBA assemblyand wait 15 seconds.

Does display 015 stay on? 23600 23550

23550 Unplug J11 on Ink jet controller PWBA assembly.

Push manual reset button on Ink jet controller PWBA assemblyand wait 15 seconds.

Does it display 015? 23560 23570

23560 Primary suspect: MJE Interface (AA09).Secondary suspect: High speed print cable between printermodule and AA gate.





23600 Look at Leeds DS16, DS17, DS18, and DS12 on Ink jetcontroller PWBA assembly.

Are they on? 23620 23700




STEP ACTION YES NO

23620 Select (extended DIAGNOSTIC COMMANDS) (MULTIPLE RE-SYNC ECHO TEST) (optional r/f selection) <spcfy> *getresults* (N).

Go look at LED DS21 on Ink jet controller PWBA assembly.

Did it flash? 23640 23630

23630 Primary suspect: MJE Interface (AA09).Secondary suspect: Ink jet controller PWBA assembly orcommand and control port cable between printer module andAA gate.



23640 Select (extended DIAGNOSTIC COMMANDS) (MULTIPLE RE-SYNC ECHO TEST) (optional r/f selection) <spcfy> *getresults* (N).

Go look at LED DS19 on Ink jet controller PWBA assembly.

Did it flash? 23650 23660

23650 Primary suspect: MJE Interface (AA09).Secondary suspect: Ink jet controller PWBA assembly orcommand and control port cable between printer module andAA gate.





23700 Unplug J10 on ink jet controller PWBA assembly.

Look at Leeds DS16, DS17, DS18, and DS12.

Are they on? 23800 23720






STEP ACTION YES NO

23800 Connect J10 on ink jet controller PWBA assembly.

Primary suspect: MJE Interface board. Secondary suspect:Command and control port cable or cable between printermodule and AA gate.



24100 Turn off power and turn it back on.


24200 Look at LEDS DS8, DS7, DS6, and DS5.

Are they on? 24300 19100

24300 Measure DC voltage between TP8 & TP11.

Is it more than 2.5? 24320 24340



24340 Replace lithium battery and rerun test.


25100 Select (POC COMMANDS) (TEST PRINT MODE CONTROL)(optional r/f selection) *get results* <spcfy>.If no Bits returnedWord 2 Bit 1 returned (sweep)Word 1 Bit 1 returned (phase line)Word 1 Bit 3 returned (print pulse line)Word 1 Bit 5 returned (latchen line)Word 1 Bit 7 returned (colreq ack line)Word 1 Bit 8 returned (print jet pwr sup ctrl)Word 1 bits 0, 2, & 4 returned (multiple failure)Word 1 Bits 2, 4, & 6 returned (multiple failure)Word 1 Bit 0 returned (phase line from printhead)Word 1 Bit 2 returned (print pulse line from printhead)Word 1 Bit 4 returned (latchen line from printhead)Word 1 Bit 6 returned (colreq line)Word 1 Bit 9 returned (dac not controllable)Word 1 Bit 10 returned (curr det or chg volt on signal)Word 1 Bit 11 returned (curr det not on)Word 1 Bit 12 returned ([2] lsbs of dac)Word 1 Bit 13 returned (chg relay stuck on)Word 2 Bit 0 returned (curr fault interrupt)

66500251402520025200252002514025200254502545025250252502525025400257002560025600257002512025140






STEP ACTION YES NO



25200 Disconnect AC to DC board cable at J5 on Ink jet controllerPWBA assembly.


Did the same fault occur? 25220 25230






Did it pass? 25300 09100

25300 Primary suspect: Printhead CH driver PCB assembly.Secondary suspect: Umbilical assembly.



25400 Disconnect J11 on ink jet controller PWBA assembly.


Did it pass? 25420 25410



25420 Primary suspect: MJE Interface (AA09). Secondary suspect:High-speed print cable or cable between printer module and AAgate.






STEP ACTION YES NO

25450 Primary suspect: AC supply PWBA assembly.Secondary suspect: Ink jet controller PWBA assembly.






Did it have the same fault? 25650 25620




Primary suspect: AC supply PWBA assembly.Secondary suspect: Printhead CH driver PCB assembly, Ink jetcontroller PWBA assembly, umbilical assembly, or AC to DCboard cable.









STEP ACTION YES NO

26100 Select (extended DIAGNOSTIC COMMANDS) (reset) (optional r/fselection) *wait for completion* <spcfy>. and wait tenseconds.

Select (POC COMMANDS) (TEST UMBILICAL) (optional r/fselection) *get results* <spcfy>.If no Bits returnedWord 1 Bit 0 returned (SPB write)Word 1 Bit 1 returned (SPB clock)Word 1 Bit 2 returned (SPB read)Word 1 Bit 7 returned (SPB Dclock)Word 1 Bit 9 returned (drop counter)Word 1 Bit 3 returned (Low dpath)Word 1 Bit 4 returned (high dpath)Word 1 Bit 5 and 6 returned (both dpath return)Word 1 Bit 5 returned (low dpath return)Word 1 Bit 6 returned (high dpath return)Word 1 Bit 8 returned (stim circuit)

665002612026120261202612026120262002620026290263002630004100



26200 Disconnect J5 on ink jet controller PWBA assembly.

Select (POC COMMANDS) (TEST UMBILICAL) (optional r/fselection) *get results* <spcfy>.

Did it return Word 1 Bit 3 or 4? 26220 26250






26290 Disconnect the high-speed print cable (15-pin "D") at the printermodule.

Select (extended DIAGNOSTIC COMMANDS) (reset) (optional r/fselection) *wait for completion* <spcfy> and wait 10 seconds.

Select (POC COMMANDS) (TEST UMBILICAL) (optional r/fselection) *get results* <spcfy>.


Does the test now pass?26295 26300




STEP ACTION YES NO

26295 Primary suspect: MJE interface (AA09). Secondary suspect:Cable between printer module and AA gate.

Replace each component and rerun test or until the testpasses.



Did it pass? 26310 09100

26310 Select (extended DIAGNOSTIC COMMANDS) (LED SEQUENCETEST) (optional r/f selection) <spcfy> *get results* (N).

Go look at LED DS9, DS10, & DS11 on AC supply PWBAassembly.

Did they all flash?26320 26330

26320 Select (extended DIAGNOSTIC COMMANDS) (LED SEQUENCETEST) (optional r/f selection) <spcfy> *get results* (N).

Go look at LED DS19 & DS20 on AC supply PWBA assembly.

Did they both flash?

26400 26500


Select (extended DIAGNOSTIC COMMANDS) (LED SEQUENCETEST) (optional r/f selection) <spcfy> *get results* (N).

Go look at LED DS19 & DS20 on AC supply PWBA assembly

Did they both flash?

26600 26340

26340 Primary suspect: AC supply PWBA assembly.Secondary suspect: AC to DC board cable & Ink jet controllerPWBA assembly.






STEP ACTION YES NO

26400 Primary suspect: AC supply PWBA assembly.Secondary suspects: Ink jet controller PWBA assembly, AC toDC board cable, printhead CH driver PCB assembly, orUmbilical assembly.



26500 Primary suspect: Printhead CH driver PCB assembly.Secondary suspect: Umbilical assembly & AC supply PWBAassembly.



26600 Connect J2 on AC supply PWBA assembly.

Primary suspect: Printhead CH driver PCB assembly.Secondary suspect: Umbilical assembly.





Did it pass?27200 27120


Did it fail Bit 5 only?27150 20100

27150 Disconnect printhead outlet tube.


Did it pass?27200 27180

27180 Reconnect printhead outlet tube & Go to step 20100.




STEP ACTION YES NO

27200 Reconnect printhead outlet tube.

Select (RUN TIME COMMANDS) (BAR UP TO STATE 7) (Y)(optional r/f selection) (7) *wait for completion* <spcfy>.



Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (CIRCULATE TABLE) *wait forcompletion* <spcfy>.

Select (RUN TIME COMMANDS) (BAR UP TO STATE 6) (Y)(optional r/f selection) (6) *wait for completion* <spcfy>. for15 MINUTES.

Select (RUN TIME COMMANDS) (bar down) (optional r/fselection) *wait for completion* <spcfy>.

Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (NORMAL TABLE) *wait for completion*<spcfy>.

Select (RUN TIME COMMANDS) (BAR CLEAN) (Y) (optional r/fselection) *wait for completion* <spcfy>.

Did the same error occur? 27500 66600

27250 Select (RUN TIME COMMANDS) (SEND ERRORS/WARNINGS)(optional r/f selection) *get results* <spcfy>.


27300 Select (RUN TIME COMMANDS) (BAR UP TO STATE 10) (Y)(optional r/f selection) (10) *wait for completion* <spcfy>.






27400 Select (RUN TIME COMMANDS) (BAR UP - EYELID CLOSED) (Y)(optional r/f selection) *wait for completion* <spcfy>.





STEP ACTION YES NO



27440 Primary suspect: Filter by bass.Secondary suspect: Ink jet controller PWBA assembly.




Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (CIRCULATE TABLE) *wait forcompletion* <spcfy>..



Is the reading less than 75?27520 27540



27540 Replace filter by pass and rerun test.




Did it pass?28150 20100

28150 Look at the tank.

Is there ink in the tank? 28200 28400




STEP ACTION YES NO

28200 Select (RUN TIME COMMANDS) (BAR UP TO STATE 11) (Y)(optional r/f selection) (11) *wait for completion* <spcfy>.

When reached, pinch off tube on manifold assembly that hasthe orifice in it. This tube connects to the manifold beneath theprinthead.


Did it make it?

28210 28300



28214 Unpinch the tube. Select (RUN TIME COMMANDS) (SENDERRORS/WARNINGS) (optional r/f selection) *get results*<spcfy>.




28300 Unpinch tube and disconnect the inlet and outlet tubes fromprinthead. Connect them together and connect the other tubestogether.




Did it read above 5?28320 28340



28325 Replace cover, making sure not to pinch tubes and rerun test.







STEP ACTION YES NO

28340 Primary suspect: Ink pump assembly.Secondary suspect: Manifold assembly.



28400 Look at the ink bottle.

Is it empty? 28410 28420



28420 Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (CIRCULATE TABLE) *wait forcompletion* <spcfy>.


Is ink tank filling? 28430 28440

28430 After tank is filled, Go to 20100

28440 Install JP5 in place of ink float switch. Do not leave jumper intoo long.





28450 Connect float switch assembly.

Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: DC cable-board to fluid system or DC cable-fluidsystem assembly.



29100 Unscrew positive air filter.

Select (RUN TIME COMMANDS) (bar down) (optional r/fselection) *wait for completion* <spcfy>.

Did the same fault code MJE 80 40 occur? 29110 29120




STEP ACTION YES NO

29110 Reinstall positive air filter.

Go to step 01100

29120 Replace filter pos air and rerun test.




Did it pass?30200 20100

30200 Disconnect the inlet and outlet tubes from printhead. Connectthem together and connect the other tubes together.



Did fault code MJE 80 58 or MJE 80 59 occur?

30300 30220



30300 Primary suspect: Ink pump assembly.Secondary suspect: Manifold assembly.



31100 Push manual reset button on ink jet controller PCBA assemblyand wait 15 seconds.

Does display 015 stay on? 31200 23100

31200 Select (extended DIAGNOSTIC COMMANDS) (reset) (optional r/fselection) *wait for completion* <spcfy>.

Does display O15 stay on after 15 seconds? 66600 31300




STEP ACTION YES NO

31300 Disconnect high speed print cable at J11 on ink jet controllerPCBA assembly.

Select (extended DIAGNOSTIC COMMANDS) (reset) (optional r/fselection) *wait for completion* <spcfy>.

Does display 015 stay on after 15 seconds? 31400 31320



31400 Primary suspect: MJE interface (AA09). Secondary suspect:High speed print cable or cable between printer module and AAgate.





Did it pass?28150 20100

32150 Look at the ink tank

Is there ink in the tank? 32300 32400

32300 Disconnect the inlet and outlet tubes from printhead. Connectthem together and connect the other tubes together.



Did fault code MJE 80 59 or MJE 80 58 occur?32350 32320






STEP ACTION YES NO

32350 Reconnect the tubes from the printhead to the umbilicalassembly.

Primary suspect: Ink pump assembly.Secondary suspect: Manifold assembly.



32400 Look at the ink bottle.

Is it empty? 32410 32420



32420 Select (RUN TIME COMMANDS) (SELECT BAR STATE TABLE XX)(optional r/f selection) (CIRCULATE TABLE) *wait forcompletion* <spcfy>.



32430 After tank is filled, Go to 20100.

32440 Install JP5 in place of ink float switch. Do not leave jumper intoo long.




32450 Primary suspect: Ink jet controller PCBA assembly. Secondarysuspect: DC cable-board to fluid system or DC cable-fluidsystem assembly.



33100 Does error come again in the next bar commands? 33120 66600






STEP ACTION YES NO


Did it pass?34120 19100



35100 Select (POC COMMANDS) (TEST PRINT MODE CONTROL)(optional r/f selection) *get results* <spcfy>.

Did it pass? 35200 25100




Were there any errors?36200 36300

36200 Go act on the error.

36300 Was improper command sent to printer at this time? 36310 66500

36310 Refer to Table 19–5. A command can be performed in a givenstate if there is an X in the box for that command under thatstate.



Table 19–4. Commands Available in Different States

CommandPower

On StateBar Down

StateIn a Bar

StateNormalTable

CirculateTable

FlushTable

80 X X X X X

81 X X X X X X

82 X X X X X X

83 X X X X X X

84 X X X X X X

85 X X X X

86 X X X

87 X X X

88 X X X X X

89 X X X X X X

8A X X X X X X

8B X X X X X X

8C X X X X

8D X X X X

8E X X X X

8F X X X X

90 X X X X X X

91 X X X X X X

92 X X X X X X

93 X X X X X X

94 X X X X X

95 X X X X X X

96 X X X X X X

97 X X X X X X

A0 X X X X X X

A1 X X X X X

A2 X X X X X

A3 X X X X X

A4 X X X X X

A7 X X X X X



Table 19–4. Commands Available in Different States

CommandPower

On StateBar Down

StateIn a Bar

StateNormalTable

CirculateTable

FlushTable

A8 X X X X X

A9 X X X X X

AA X X X X X

AB X X X X X

AC X X X X X

AD X X X X X

AE X X X X X

B4,1 X X X X X

B4,2 X X X X X X

B4,3 X X X X X X

B4,4 X X X X X X

B4,5 X X X X X X

B4,9 X X X X X X

B4,a X X X X X X

B4,b X X X X X

CD X X X X X X

Table 19–3. MJE Manual Procedures (cont.)

STEP ACTION YES NO

37100 In the state table you have stayed in a state too long. Do notstay there that long.


38100 Primary suspect: Ink jet controller PCBA assembly.Secondary suspect: High speed print cable.

Replace each component and rerun the test for eachcomponent until all components have been replaced or untilthe test passes.


40000 Replace the MJE interface (AA09) and rerun the test. Doesthe problem still exist?

66500 66600




STEP ACTION YES NO

40100 Inspect fluid system for obvious leaks.

Clean leak sensor as needed.



Is a run time fault code indicated?40120 40130

40120 Follow the procedure for the run time fault code.


40130 Replace ink jet controller board. Rerun test.


41100 Perform exerciser Erase Fonts or Erase Graphics asapplicable. Be sure font/graphics write protection jumperis not installed on the MJE Interface (AA09).

Note: This will erase any customized entries other than theautomatically loaded entry at location 0. This meansthat a Download Fonts or Download Graphicsoperation is required to restore all customizedentries.


41200 Replace MJE interface (AA09) and rerun test.


42100 Check DIP switch setting on ink jet controller board perschematic sheet 09.01.01.


42110 Disconnect the high-speed print cable (15-Pin ’D") at the printermodule. Rerun test.

Does the same test fail?


42120 42130

42120 Primary suspect: MJE interface (AA09).Secondary suspects: Ink jet controller board or commandand control port cable or cable between printer moduleand AA gate.

Replace each component and rerun the test for eachcomponent until all components have been replacedor until the test passes.





STEP ACTION YES NO

42130 Primary suspect: MJE interface (AA09).Secondary suspect: Cable between printer module andAA gate.

Replace each component and rerun the test for eachcomponent until all components have been replaced or untilthe test passes.


43100 Clean and dry streaker sensor PCBA and streaker housing.Rerun the streaker test.

Did it pass? 66600 43200

43200 Replace streaker sensor PCBA. Rerun the streaker test.

Did it pass? 66600 43210

43210 Replace streaker detector PCBA. Rerun the streaker test.

Did it pass? 66600 43220

43220 Replace the streaker harness. Rerun the streaker test.

Did it pass? 66600 43230

43230 Replace MJE interface (AA09). Rerun the streaker test.

Did it pass? 66600 66500

44000 Replace the ink jet controller board and rerun test.


44100 Primary suspect: MJE interface (AA09).Secondary suspect: Main CPU board (AA17).

Replace each board and rerun the test for each board until allboards have been replaced or until the test passes.


44200 Rerun the test that was running when the exception occurred.


44210 Find address on the screen in the table below, if listed.

Is address listed? 44220 44230

44220 Replace suspect board(s) associated with listed address oneat a time. Rerun test.


44230 Replace main CPU board (AA17) and rerun test.





STEP ACTION YES NO

45000 Turn off the sorter and MJEs.

Reverse the following MJE cables:

• (DL1) Reverse J6 (front) and J7 (rear)• (DL2) Reverse J18 (front) and 17 (rear)

Note: These cables are located adjacent to Card AA09.

Turn on the sorter and MJEs and observe the POC fault code.Follow the procedure for the fault code that is displayed.

IMPORTANT : After the fault is corrected, restore the cableto its original location and rerun the POC.

Table 19–5. Address: Board Correspondence Table

68030 Address Suspect Board

$0 - $00FFFFFF AA17

$01000000-$0101FFFF AA17

$03FFF100-$03FFF200 AA03 (NDP 1800-65 camera)

$03FFE000-$03FFE7FF AA09 (MJE)

$03FFFC00-$03FFFC0B AA08

$03FFFC0C-$03FFFC15 AA10

$03FFFC16-$03FFFC1A AA08

$03FFFC1B AA02

$03FFFC1C-$03FFFC1D AA08


$03FFFC30 AA08


$03FFFC63-$03FFFC69 AA10

$03FFFC6A-$03FFFC6C AA05

$03FFFC70-$03FFFC72 AA02

$03FFFC76-$03FFFC79 AA11, AA12

$03FFC7A - $03FFFC7B AA11 for MICR

$03FFFCC0-$03FFFCFF AA02



$03FFFD00-$03FFFD3F AA02

$03FFFD40-$03FFFD7F AA05

$03FFFD80-$03FFFDBF AA05

$03FFFDC0-$03FFFDFF AA05

$01FFFF50-$01FFFF55 AA17



Print Problems as Seen in Print SamplesFollow these steps to resolve print problems that are seen in print samples.

Table 19–6. Print Problems as Seen in Print Samples

Step ACTION Yes No

66300 Remove printhead cover and clean the slot inside and out with adamp lint free cloth. Replace the cover.

Select (RUN TIME COMMANDS) (BAR CLEAN) (Y) (optional r/fselection) *wait for completion* <spcfy>.

Run Exerciser program PHASE and VOLTAGE sweep to get theright values for these settings and set them to the right values.

Do the voltage sweep cards show inconsistency?

Do you still have crooked jet?

Do you still have irregular gap in the print sample after settingphase properly?

Does one half print black or not print at all?.

66350

66400

66340

66390





Select (RUN TIME COMMANDS) (read PHASE/VOLTAGE)(optional r/f selection) *get results* <spcfy>. Write downphase number.

Select (RUN TIME COMMANDS) (set PHASE/VOLTAGE XX/YY)(optional r/f selection) (enter phase value) (enter volts value)*wait for completion* <spcfy>. Set phase to old number. Setvolts to 125.

Select (RUN TIME COMMANDS) (BAR UP - EYELID CLOSED) (Y)(optional r/f selection) *wait for completion* <spcfy>.

Does the DC voltage measure 125 +/- 3 between TP9 & TP10on AC supply PCBA assembly?

66360 66380



Table 19–6. Print Problems as Seen in Print Samples

Step ACTION Yes No

66360 Select (RUN TIME COMMANDS) (set PHASE/VOLTAGE XX/YY)(optional r/f selection) (enter phase value) (enter volts value)*wait for completion* <spcfy>. Set phase to old number. Setvolts to 156.

Select (RUN TIME COMMANDS) (BAR UP - EYELID CLOSED) (Y)(optional r/f selection) *wait for completion* <spcfy>.

Does the DC voltage measure 156 +/- 3 between TP9 & TP10on AC supply PCBA assembly?

66500 66380



66390 Replace ink jet controller PCBA assembly.


66400 Perform printhead swabbing procedure, per SEI 4142 5455.


66450 Replace printhead assembly and rerun test. 66500 66600



Suggestions to Fault Isolation if Procedures Fail toCorrect Problem

Table 19–7. Suggestions to Fault Isolation if Procedures Fail to Correct Problem

Step ACTION

66500 Entry to this line indicates failure of the MJE MTRs to correct a fault.

Review the following suggestions to help isolate the problem.

1. Review or rerun the diagnostic procedure to make sure the proper test points andstep by step procedure were followed correctly.

Remember when there is a list of word and bits returned you start at the top and readdown till you find the one that has failed or multiple if asked for.Problems that are intermittent, are usually due to poor electrical connections, fluid(air or ink) leaks, or restrictions.

2. Measure DC voltages. On the ink jet controller assembly they should be• TP8 to TP2 11.5 to 13

• TP8 to TP3 4.8 to 5.5

• TP8 to TP4 22.5 to 28.5

• TP8 to TP1 11.5 to -13

3. Inspect all electrical connection for tightness and lack of ink contamination.(Remember, the MJE ink is conductive.)

4. Recheck mist box gasket to insure proper seating.5. Check that all vacuum lines are properly connected & lines have no cuts.6. Review the information at line 66300.7. The MTR diagnostic procedures assume only one fault exists in a previously good

working machine. Multiple faults might exist which can cause the same failure code ora second failure code in a subsequent test. Follow the second failure code diagnosticprocedure if you are unable to correct the first problem.

8. If the failure contains a BITMAP, review the bit definitions in the "Command Namesand Descriptions" subsection.

9. If you are getting run time errors and cannot diagnose the problem, you can manuallyaccess the Normal Bar Up State tables Table 19–8 and Table 19–9 to step througheach step to see what function causes the problem. The table gives the status ofsolenoids and pumps during each state.The table also tells how long the printer normally stays in a state, lists what tests (ifany) are done during each state, and gives various pressures and voltage settings.An 0 means that the device is off and a 1 means that the device is on. The normaltable can be stepped through with select run time command "BAR UP TO STATE XX".Example: State 13 antisiphon valve, vacuum pump, catcher heater, and positive air

on. Servo pressure 9.5 psi, servo vacuum 120 in. H2O, tab servo voltage 11 mv., andstate time 7 seconds.



Table 19–8. Normal Bar Up State (States 0-11)

STATE 0 1 2 3 4 5 6 7 8 9 10 11

EYELID ACTIVATE 0 0 0 0 0 0 0 0 0 0 0 0

EYELID HOLD 0 0 0 0 0 0 0 0 0 0 0 0

ANTISIPHON VALVE 0 0 0 0 0 0 1 1 1 1 1 1

VACUUM PUMP 0 1 1 1 1 1 1 1 1 1 1 1

CATCHER HEATER 0 0 0 0 0 0 0 0 0 0 0 0

CROSS FLUSH VALVE 0 0 0 0 0 0 0 0 1 1 1 0

POSITIVE AIR 1 1 1 1 1 1 1 1 1 1 1 1

IP VOLTAGE (x.1) 0 0 0 0 050 050 050 110 120 120 180 110

IP VOLTS MIN (x.1) 0 0 0 0 035 045 045 085 115 115 155 105

IP VOLTS MAX (x.1) 010 010 010 010 055 055 055 115 125 125 185 145

IP CURRENT MIN (mA x10) 0 0 0 0 002 002 002 002 002 002 005 002

IP CURRENT MAX (mA x10) 002 002 002 002 040 040 040 050 050 050 050 050

SERVO PRESSURE (psi x.1) 0 0 0 0 0 0 0 0 0 0 0 0

PRESSURE MIN (psi x.1) 0 0 0 0 0 0 0 0 0 0 0 0

PRESSURE MAX (psi x.1) 060 060 060 060 140 140 140 140 140 140 140 140

SERVO VACUUM (in. H2O) 120 120 120 120 250 120 120 120 120 120 120 120

VACUUM MIN (IN. H2O) 0 0 0 0 0 0 0 0 0 0 0 0

VACUUM MAX (IN. H2O) 255 255 255 255 220 220 220 220 220 140 140 255

TAB SERVO VOLTS (mV) 0 0 0 0 0 0 0 0 0 255 0 011

CHARGE VOLTAGE 0 0 0 0 0 0 0 0 0 0 0 0

RUN TESTS/TRIES 16/100

4/150

2/255

STATE TIME (SEC X.1) 001 001 001 008 050 001 001 010 035 020 006 010

TEST FAIL STATE 0 2 3

BAR DOWN STATE 4 4 4 4 3 3 3 3 3 3 3 3



Table 19–9. Normal Bar Up State (States 12-22)

STATE12 13 14 15 16 17 18 19 20 21 22

EYELID ACTIVATE 0 0 0 0 0 0 0 0 0 1 0

EYELID HOLD 0 0 0 0 0 0 0 0 0 1 1

ANTISIPHON VALVE 1 1 1 1 1 1 1 1 1 1 1

VACUUM PUMP 1 1 1 1 1 1 1 1 1 1 1

CATCHER HEATER 0 1 1 1 1 1 1 1 1 1 1

CROSS FLUSH VALVE 0 0 0 0 0 0 0 0 0 0 0

POSITIVE AIR 1 1 1 1 1 1 1 1 1 1 1

IP VOLTAGE (x.1) 110 0 0 0 0 0 0 0 0 0 0

IP VOLTS MIN (x.1) 105 0 080 080 080 080 080 080 080 080 080

IP VOLTS MAX (x.1) 115 255 160 160 160 160 160 160 160 160 160

IP CURRENT MIN (mA x10) 002 0 002 002 002 002 002 002 002 002 002

IP CURRENT MAX (mA x10) 050 255 050 050 050 050 050 050 050 050 050

SERVO PRESSURE (psi x.1) 0 095 095 095 095 095 095 095 095 095 095

PRESSURE MIN (psi x.1) 040 040 085 085 085 085 085 085 085 085 085

PRESSURE MAX (psi x.1) 140 147 105 105 105 105 105 105 105 105 105

SERVO VACUUM (in. H2O) 120 120 120 120 250 120 120 120 050 050 050

VACUUM MIN (in. H2O) 0 0 0 100 100 100 100 100 0 0 0

VACUUM MAX (in. H2O) 255 255 255 140 140 140 140 140 065 065 065

TAB SERVO VOLTS (mV) 011 011 200 200 200 200 200 200 200 200 200

CHARGE VOLTAGE 0 0 0 0 0 040 255 255 255 255 255

RUN TESTS/TRIES 8/1 64/1

STATE TIME (SEC X.1) 010 070 040 900 010 005 010 000 005 001 005

TEST FAIL STATE 15 19

BAR DOWN STATE 3 3 2 2 2 1 1 1 1 0 0

BAR UP TESTS

TEST NO. 2 -- INK LEVEL TEST --This test looks at the operating float switch one time.The test passes if the float is above the operating level (switch open). The test fails if thefloat is below the operating level (switch closed). If the test fails the number of tries in thetable, then an error, "5E" or "70" (depending on which fill valve was energized), will occur.



TEST NO. 4 -- VACUUM PUMP TEST -- This test looks at the vacuum level 10 times. Thetest passes if the vacuum is above 10 in. 5 or more of the 10 times. It fails if the vacuum isbelow 10 in. 6 or more of the 10 times. If the test fails the number of tries in the table, anerror, "41", will occur.

TEST NO. 8 -- INK TEMPERATURE TEST -- This test looks at the manifold thermister onetime. The test passes if the printhead temperature is over 75 degrees F. If the printheadtemperature is below 75 degrees F., then the software compares the temperature after atwo-minute delay to the previous reading. If the new temperature is more than 1 degree F.higher than this, the test will loop until the printhead temperature passes the 75 degree F.mark. The test fails if a new temperature reading is less than 1 F. higher than its previousreading (temperature not rising more than .5 degrees F per minute), in which case, if it failsthe number of tries specified in table, an error, "63", will occur.

TEST NO. 16 -- VACUUM RESTRICTION TEST -- In this test, the vacuum level is checked.The test passes if the vacuum level is below 5 in. The test fails if the vacuum level isabove 5 in. If it fails the number of tries in table, an error, "46", will occur.

TEST NO. 64 -- SET PHASE -- This test allows the control software to set the printheadphase to an initial value. No errors can occur in this test.

Procedure End

Step ACTION

66600 End of procedure. Verify proper operation.



Condition, Cause, Correction Chart

Table 19–10. Condition, Cause, Correction Chart


Excessive Streakers Printing is going over the top orthrough holes in documents.

Adjust printing height as needed.

Charge voltage set too low orhigh.

If accompanied by print jet shorts, voltage isprobably too high. Perform voltage sweep per SEI4142 5455.

Ink stream striking contaminationon the catcher surface.

If accompanied by print jet shorts, contamination iscloser to the nozzles.

1. Perform printhead extended flush per SEI 41425455.

2. Perform printhead swabbing procedure per SEI4142 5455.

Defective printhead. Replace printhead as last resort. Delicate catchersurface may be examined for obvious contaminants.

Excessive print jetshorts

Charge voltage set too high. Perform voltage sweep per SEI 4142 5455.

Excessive vibration from thetransport.

Locate vibration source (pulley, belt, bearing) asrequired. Higher charge voltages settings increasesensitivity. Insure proper setting of charge voltage.

Ink stream striking contaminationon the catcher surface nearnozzles (charge plates).

1. Perform printhead extended flush per SEI 41425455.

2. Perform printhead swabbing procedure perSEI 4142 5455.

Defective printhead. Replace printhead as last resort. Delicate catchersurface may be examined for obvious contaminants.

Loss of printinginformation

Phase setting not correct. Perform Phase Sweep per SEI 4142 5455.

Obstruction in ink path. Inspect for obvious accumulation on areas that maybe intercepting printing ink drops (eyelid, cover slot,wall slot).

1. Perform Ink Stream Centering Procedure perSEI 4142 5455.

2. Perform wall adjustment per SEI 3304 6202.



Table 19–10. Condition, Cause, Correction Chart


Air in printhead. This condition only occur as a result of improper useof maintenance modes and tests. No more than 2OFF/ON cycles via control panel switch should everbe needed to clear condition or...

1. A leak exists on the inlet side of the printhead(with the in-line filter).

2. Printhead is defective - replace.

Configuration/Applicationincorrect.

Change configuration to correct settings viaConfiguration Utilities to match applicationrequirements (e.g. NIE EMULATION).

Excessive VacuumSystem Problems(errors 41 and/or46)

Vacuum pump inlet filter needsservice. The mist filter box hasprobably let too much ink get tothe pump, clogging it’s filter.

Be sure and install mist filter element properly andreplace periodically per SEI 3304 6251. Ifmaintained, the hose between mist filter "box" andvacuum pump should stay clear of ink dye.

Excessive use ofReplenish Fluid (lightprinting)

Improper installation procedurehas filled tank with excessivereplenish fluid.

Review ’Ink Tank Drain Procedure’ in SEI 41425455.

Replenish algorithm incorrectlyassumed evaporation hasoccurred (excessive ink leftsystem that has not printed,evaporated, or been involved instreakers detected causing anover-replenish condition.

Review Ink Tank Drain Procedure in SEI 4142 5455.



Command Names and Descriptions

Table 19–11. Command Names and Descriptions

CommandCode Name Description

A2 TESTS AC RELAYSDRIVERS

Bit set in Word 1 indicates driver cannot be turned off

Bit set in Word 2 indicates driver cannot be turned on

Bit map for either word defined below:

Bit 0 = vacuum relay driverBit 1 = ink heater relay driverBit 2 = not usedBit 3 = not usedBit 4 = not usedBit 5 = AC supply PCBA assembly not attachedBit 6 = not usedBit 7 = not used

A3 TEST SOLENOIDS andCATCHER HEATERDRIVERS

Bit set in Word 1 indicates driver cannot be turned off.

Bit set in Word 2 indicates driver cannot be turned on.

Bit map for either word defined below:

Bit 0 = catcher heater driverBit 1 = eyelid 12 volt source driverBit 2 = eyelid 5 volt source driverBit 3 = antisiphon valve driverBit 4 = crossflush valve driverBit 5 = not usedBit 6 = ink fill valve driverBit 7 = replenish valve driver





A4 TEST PRINT MODECONTROL

Bit map for Word 1 defined below:

Bit 0 = phase line not correct from PrintheadBit 1 = phase line not correct on ink jet PCBABit 2 = print pulse line not correct from PrintheadBit 3 = print pulse line not correct on ink jet PCBABit 4 = latchen line not correct from PrintheadBit 5 = latchen line not correct on ink jet PCBABit 6 = colreq line not correct on ink jet PCBABit 7 = colreq ack line not correctBit 8 = print jet pwr supply control failedBit 9 = DAC is not under processor controlBit 10= current detect or charge volt on signal is sensed on in errorBit 11= current detect is not on and should beBit 12= the 2 lsb to DAC are not workingBit 13= CHG relay is stuck on.


Bit 0 = current fault interrupt failedBit 1 = sweep failed

A9 TEST SOLENOIDMOTION

Bit set in Word 1 indicates sol not connected

Bit set in Word 2 indicates sol motion not detected


Bit 0 = not usedBit 1 = eyelid driver failedBit 2 = eyelid sol not connectedBit 3 = antisiphon sol not connectedBit 4 = crossflush sol not connectedBit 5 = not usedBit 6 = fill sol not connectedBit 7 = replenish sol not connected


Bit 0 = eyelid motion not detectedBit 1 = antisiphon valve motion not detectedBit 2 = crossflush valve motion not detectedBit 3 = replenish valve motion not detectedBit 4 = ink fill valve motion not detectedBit 5 = not usedBit 6 = not usedBit 7 = not used





AA TEST INK PUMP/TRANSDUCER


Bit 0 = pump voltage too highBit 1 = pump voltage too lowBit 2 = pump current too highBit 3 = pump current too lowBit 4 = transducer offset too highBit 5 = transducer offset too lowBit 6 = transducer buffer amplifier offset failBit 7 = transducer buffer amplifier output fail

AC TEST POSITIVE AIRSYSTEM


Bit 0 = not usedBit 1 = not usedBit 2 = positive air switch not detectedBit 3 = tank temp sensor out of rangeBit 4 = printhead temp sensor out of rangeBit 5 = spill sensor 1 and/or 2 indicates spillBit 6 = ink tank level indicates over fullBit 7 = catcher heater driver failedBit 8 = catcher heater sensed openBit 9 = catcher heater driver sensed on and should not beBit 10= catcher voltage sensed on and should not be

AD TEST VACUUM SYSTEM Bit map for Word 1 defined below:

Bit 0 = transducer offset too highBit 1 = vacuum too high with valve commanded to openBit 2 = transducer offset too lowBit 3 = vacuum too low with valve commanded to closeBit 4 = vacuum too high with valve commanded to closeBit 5 = vacuum buffer amplifier failedBit 6 = not usedBit 7 = not used


Bit 0 = stepper winding1 driver not workingBit 1 = stepper winding2 driver not workingBit 2 = stepper winding3 driver not workingBit 3 = stepper winding4 driver not workingBit 4 = stepper winding1 not connectedBit 5 = stepper winding2 not connectedBit 6 = stepper winding3 not connectedBit 7 = stepper winding4 not connected





AE TEST UMBILICAL Bit map:

Bit 0 = SPB write failureBit 1 = SPB clock failureBit 2 = SPB read failureBit 3 = low Dpath driver failureBit 4 = high Dpath driver failureBit 5 = low Dpath return failureBit 6 = high Dpath return failureBit 7 = Dclock failureBit 8 = STIM circuit failedBit 9 = onboard drop counter failed

B1,4 Run diagnostic routine01

Test system power supplies; returns a bit map of out-of-tolerance supplies

0 = passed, 1 = failed.

Bit 0 = +5 volt supplyBit 1 = +12 volt supplyBit 2 = +24 volt supplyBit 3 = "enhance" volt supplyBit 4 = -12 volt supplyBit 5 = line volt supplyBit 6 = pressure transducer supplyBit 7 = vacuum transducer supplyBit 8 = AtoD gnd checkBit 9 = printhead hour meter level


Read ink pump voltage

Command echoed, task number, word of data

Word of data = pump voltage*10


Read ink pump current


Word of data = pump current/10


Read printhead temperature


Word of data = printhead temp in degrees F


Read ink tank temperature


Word of data = ink tank temp in degrees F






Read ink pressure


Word of data = ink pressure in PSI*10 (95 means 9.5 psi)


Read vacuum level


Word of data = system vacuum in inches of water


Test current fault circuits

Bit 0 = charge voltage commanded but failed to detect responseBit 1 = current detect line active and it should not beBit 2 = current fault line active and it should not beBit 3 = current detect line not active and it should beBit 4 = current fault line active and it should not beBit 5 = current fault interrupt not active and it should beBit 6 = not usedBit 7 = printhead is connected but should not be connected for this test, cancel test.



FRU Mnemonic Names

Table 19–12. FRU Mnemonic Names

Mnemonic Description

B1 Ink Jet Controller PCBA assembly

B2 AC supply PCBA assembly

B3 Printhead CH driver PCB assembly

C1 AC to DC board cable

C2 AC cable & bulkhead conn

C3 AC cable-board to fluid system

C4 Cable-fluid system assembly

C5 DC cable-bulkhead to board

C6 DC cable-board to fluid system

C7 DC cable-fluid system assembly

C8 High-speed print cable

C9 Command & control port cable

C10 Umbilical assembly

FAN Fan

FL1 Filter by pass

FL2 Filter inline

FL3 Filter POS air/vacuum control

FL4 Filter-filter box

FL5 Filter/restrict or assembly

FUSE For B2 F1, F2, & F3

FUSE For B1 F1, F2, & F3

LB Lithium battery

M1 Manifold assembly

MJEIB MJE interface (AA09)

PH Printhead assembly

P1 Vacuum/air pump assembly

P2 Ink pump assembly

S1 Vacuum transducer assembly



Table 19–12. FRU Mnemonic Names

Mnemonic Description

S2 Spill sensor assembly

S3 Float switch assembly

S4 Pressure switch assembly

U1 Problem outside printer

V1 Vacuum control assembly

V2 Fill valve assembly

V3 Eyelid solenoid


Section 20 PEP/Stamp Tests

140000 PP 01 0010

Endorser test failed

Note: Endorser test may fail because ofproblems in the hole detect circuitry. Ifprocedures failed to resolve problem,try running hole detect test.


100 Check cables in PEP/stamp unit. Makenecessary corrections. Rerun test. Does theproblem still exist?

105 950

105 Did anything print on the documents? 110 230

110 Were there dots missing from print ondocuments?

340 120

120 Was the quality of print poor? 130 950

130 Has PEP been cleaned? 150 140

140 Clean PEP per procedure in operations guide.Rerun endorsement tests. Does problem stillexist?

100 950

150 Check PRINT GAP per T & A 3304 3647. Is GAPOK?

170 160

160 Reset GAP. Rerun test. Does the problem stillexist?

100 950

170 Has head been stoned? 190 180

180 Stone head per T & A 1076 3894. Rerunendorsement tests.


190 Replace head. Rerun test. Does the problemstill exist?

200 950

200 Replace printer driver PCBA and rerun test.Does the problem still exist?

210 950

PEP/Stamp Tests


PP 01 0010

Endorser test failed (continued)


210 Replace platen and rerun test. Does theproblem still exist?

220 950

220 Replace spring and rerun test. Does theproblem still exist?

97200 950

230 Power off NDP 1150. With digital multi metercheck F1 and F2 on printer driver PCBA. Dothey measure 0 ohms?

240 235

235 Replace the fuse that is blown. Rerunendorsement test.


240 While running endorsement test (make sure youhave enough documents in primary hopper tomake measurements), check PSEN (Q3collector) on printer driver board. Does it switchbetween logic 0 ( <.8 VDC) and logic 1( >2.4 VDC)?

290 250

250 While running endorsement subtest, as in 240,check PFEN1 (J323 2) on printer driver PCBA.Does it switch between logic 0 ( <.8 VDC) andlogic 1 ( >2.4 VDC)?

260 270


97200 950

270 Replace printhead cable and rerun test. Doesthe problem still exist?

280 950

280 Replace Endorser Controller PCBA and reruntest. Does the problem still exist?

97200 950

290 While running endorsement subtests, checkJ323-50 on printer driver PCBA. Does it switchfrom logic 0 ( < .8 VDC) to logic 1 ( > 2.4 VDC)?

300 320


310 950

310 Problem is with printhead cable. Replace andrerun test. Does the problem still exist?

97200 950

320 Problem is with printhead cable. Replace andrerun test. Does the problem still exist?

330 950

330 Replace Endorser controller PCBA. Rerun test.Does the problem still exist?

340 950

PEP/Stamp Tests


PP 01 0010



340 Has PEP been cleaned? 360 350

350 Clean PEP and rerun test.


360 Adjust print gap per T & A 3304 3647. Was gapokay?

380 370

370 Reset gap per T & A. Rerun test.


380 Has printhead been stoned? 400 390

390 Stone head and rerun test.


400 While running endorsement tests, useoscilloscope to check collector of followingtransistors on printer driver board. Q14, Q17,Q20, Q23, Q26, Q29, Q32, Q35, Q38, Q41,Q44, Q47, Q50, Q53, Q56 Q5, Q8, Q11.

Do all collectors switch between 0 and +24 V? 490 410

410 Remove head and repeat measurements in step400.

Do all collectors switch between 0 and +24 V? 460 420

420 Using schematics to trace collector signal(s) thatdid not switch to edge connector.

Are inputs switching from logic 0 ( < .8 VDC) tologic 1 ( > 2.4 VDC)?

430 440

430 Replace printer driver PCBA and rerun test.


440 Replace printhead cable and rerun test.


PEP/Stamp Tests


PP 01 0010



450 Replace Endorser Controller (AA09) and reruntest.


460 Check resistance of the windings in theprinthead.

Are they all between 2.2 and 2.7 ohms? 470 480



480 Replace printhead and rerun test.


490 Use scope to check collectors of Q15, Q18,Q21, Q24, Q27, Q30, Q33, Q36, Q39, Q42,Q45, Q48, Q51, Q54, Q57, Q6, Q9, Q12, onprinter driver board.

Do all collectors switch between 0 and -24 VDC? 500 410

500 Check resistance of the windings in printhead.

Are they all between 2.2 and 2.7 ohms? 520 510

510 Replace printhead and rerun test.


520 Replace printhead cable and rerun test.





PEP/Stamp Tests


140050 PP 01 0020

Stamp Jam: Either the Stamp is unable tomove or the home/encoder assembly is notworking.





Does the signal switch between logic 1 ( >2.4VDC) and logic 0 ( <0.8 VDC)?

140 120



830 130



830 820



190 150



830 160



830 820

PEP/Stamp Tests


PP 01 0020

Stamp Jam: Either the Stamp is unable tomove or the home/encoder assembly is notworking. (continued)





210 830


240 830

220 Measure U1-8 (PHAENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 230


800 810




260 830


300 830


830 290


800 810

PEP/Stamp Tests


PP 01 0020






320 830


350 830

330 Measure U1-6 (PHCENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 340


800 810




370 830

370 Measure U8-9 (CHOPBD) Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

400 830


830 390


800 810



PEP/Stamp Tests


PP 01 0020




430 420


800 810


830 440


800 810




480 470


800 810


830 490


800 810




530 520


800 810


830 540


800 810

PEP/Stamp Tests


PP 01 0020



550 In the MTR menu choose high current. On thestamp driver board put a voltmeter between U2-8 and U2-12. Do not use a scope! Does itmeasure between 0.8 VDC and 0.9 VDC?

840 560


580 570


800 810


830 590


800 810

800 Replace Stamp Control Cable. Does theproblem still exist?

97200 950


820 Replace home/encoder sensor assembly. Doesthe problem still exist?

830 Replace stamp driver PCBA. Does the problemstill exist?

97200 950

840 Replace the stamp motor. Does the problemstill exist?

97200 950


PEP/Stamp Tests


140100 PP 01 0030

No ribbon present or ribbon always reportingpresent.

Note: The PEP/Stamp Endorser Controllerschematic package is required for thisprocedure (part #2493 0091).


100 Depress ribbon presence switch. Using DVMmeasure RIBOFFN (J323-52) on printer driverPCBA.

Does signal change from logic 1 ( > 2.4 VDC) tologic 0 ( < .8 VDC)?

110 150

110 Measure signal RIBOFFN (P2-37) on AA 09.

Does it switch between logic 1 ( > 2.4 VDC) andlogic 0 ( < .8 VDC)?

120 130

120 Replace AA09 (endorser controller) and reruntest. Does the problem still exist?

97200 950

130 Replace printer control cable and rerun test.


140 Problem is back plane signal. Use schematicsto trace signal RIBOFFN (SH.01.09.54). Makenecessary correction and rerun test.


150 Does RIBSW (J321-55) change from +24 VDC to0 VDC?

160 170

160 Replace printer driver PCBA and rerun tests.


170 Replace ribbon switch and rerun POC/MTRtests.


180 Replace printer drive cable.


190 Replace hole detect harness.



PEP/Stamp Tests


140200 PP 01 0040

Ribbon jams not detected.


100 Turn transport motors on by pressingSTART/STOP bar.

Does ribbon motor rotate? 110 130

110 On printer driver board, measure (J323-12)RIBJAMN.

Does signal go from logic 1 ( >2.4 VDC) to logic0 ( < .8 VDC) when motor is stopped by hand?

120 800

120 On AA09, measure P2-39 when ribbon motor isstopped by hand.

Does signal go from logic 1 ( >2.4 VDC) to logic0 ( <.8 VDC) when the motor is stopped byhand?

820 810

130 Turn transport motors on by pressing theSTART/STOP bar. On the printer driver board,measure J321-48.

Does it measure +24 VDC? 140 170

140 With transport motors on, measure J321-47 onthe printer driver board.

Does it measure +12 VDC? 850 150

150 On printer driver board, measure chip U19 pin 1while transport motors are on.

Does it measure less than .8 VDC? 800 160

160 On AA09 measure P2-61.

Does it measure less than 0.8 VDC? 810 820

170 Power off sorter and check fuse F1 on printerdriver board.

Does it measure 0 ohms? 840 830





PEP/Stamp Tests


PP 01 0040

Ribbon jams not detected. (continued)


820 Replace Endorser Control PCBA (AA09).


830 Replace fuse F1 on printer driver board.


840 Check power supply and endorser power cable.Make necessary corrections.



PEP/Stamp Tests


140300 PP 01 0050

Ribbon motor rotates always.


100 Make sure transport motors are off. On printerdriver PCBA measure J323-8.

Is signal logic 0 ( < .8 VDC)? 120 110

110 Replace printer driver PCBA.


120 On AA09 (Endorser Controller board), measureRIBMOTN (P2-61).

Is it logic 0 ( < .8 VDC)? 130 140


140 Replace cable and rerun test.



PEP/Stamp Tests



140350 PP 02 0010

Home sensor test times out waiting for controlsemaphore to be released.

140360 PP 02 0020

Home sensor test times out waiting for statussemaphore to be released.







PEP/Stamp Tests


140370 PP 02 0030

Home sensor test failed. A stamp jam occurred.





Does the signal switch between logic 1 (>2.4VDC) and logic 0 (<0.8 VDC)?

140 120



830 130



830 820



190 150



830 160



830 820

PEP/Stamp Tests


PP 02 0030

Home sensor test failed. A stamp jam occurred.(continued





210 830


240 830

220 Measure U1-8 (PHAENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 230


800 810




260 830


300 830


830 290


800 810



PEP/Stamp Tests


PP 02 0030

Home sensor test failed. A stamp jam occurred.(continued)



320 830


350 830

330 Measure U1-6 (PHCENN). Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

830 340


800 810




370 830

370 Measure U8-9 (CHOPBD) Does it switchbetween logic 0 (<0.8 VDC) and logic 1 (>2.4VDC)?

400 830


830 390


800 810




430 420


800 810

PEP/Stamp Tests


PP 02 0030


830 440


800 810




480 470


800 810


830 490


800 810




530 520


800 810


830 540


800 810

550 In the MTR menu choose high current. On thestamp driver board put a voltmeter between U2-8 and U2-12. Do not use a scope!


560 On stamp driver board, put a meter or scopeprobe on U1-13.


PEP/Stamp Tests


PP 02 0030

Home sensor test failed. A stamp jam occurred.(continued)


570 On AA09 measure P1 pin 15.


580 On stamp driver board, put a meter or scopeprobe on U1-15.


590 On AA09 measure P1 pin 17.




810 Replace AA09.


820 Replace home/encoder sensor assembly.




840 Replace the stamp motor.



PEP/Stamp Tests


140380 PP 02 0040

Home sensor test failed. Stamp home sensorimplicated.




110 Using MTR disk, go to PEP/Stamp EndorserTests menu and select Stamp Motor PhaseTests. On submenu, select Hold Stamp.Execute T&A 3304 3654 to home adjust thehome sensor.

Is T&A setting OK? 120 130

120 Reset to correct setting.


130 Go to line 19075 step 190.


PEP/Stamp Tests



140390 PP 02 0050

Home sensor test failed. Bad stamp driverboard reported.




110 On AA09, measure P1-9 (STAMPBADN).


120 On stamp driver board place DVM probe on chipU6 pin 8 (STAMPBADN).


130 Go to line 19075 step 190.






140400 PP 02 0060

Data communication between PEP and stamphas failed.





PEP/Stamp Tests



140410 PP 02 0070

Invalid status code received from PEPprocessor.

140420 PP 02 0080

Phase driver check timed out waiting for controlsemaphore to be released.

140430 PP 02 0090

Phase current check timed out waiting forcontrol semaphore to be released.

140440 PP 02 0100

Phase current check timed out waiting forcontrol semaphore to be released.







PEP/Stamp Tests


140500 PP 03 0010

Hole Test Fails.


100 Is lamp lit? 140 110

110 On printer driver PCBA measure lamp (J321-49).Is signal equal logic 1 ( > 2.4 VDC)?

120 130

120 Replace lamp. Does the problem still exist? 97200 950

130 Replace printer driver PCBA. Does the problemstill exist?

97200 950

140 Rerun hole detect test. While documents areflowing, measure on printer driver PCBAHOLESENSORN (J321-58). Does the signalswitch from +15 V to +12 V.

150 200

150 Again while running hole detect test, measureHOLESENSEN (J323-14). Does signal switchfrom logic 1 ( > 2.4 VDC) to logic 0 ( < .8 VDC)?

170 160

160 Replace printer driver PCBA. Rerun test. Doesthe problem still exist?

97200 950

170 On AA09, measure HOLESENSEN (P2-45). Doessignal switch from logic 1 ( > 2.4 VDC) to logic0 ( < .8 VDC)?

190 180

180 Replace cable and rerun test. Does the problemstill exist?

97200 950


97200 950

200 On Matrix Endorser Hole Sensor board (MHSA)measure HOLESENSORN (J325-5). Does signalswitch between +15 VDC and +12 VDC?

210 220

210 Replace cable and rerun test. Does the problemstill exist?

97200 950

220 Replace matrix hole sensor assembly (#24930836). Rerun test. Does the problem still exist?

97200 950


PEP/Stamp Tests


140600 PP 04 0010

One or more of the endorser print needles isfiring continuously.


100 Replace the printhead cable and rerun the test


110 Replace the Endorser Controller/Printer DriverPCBA interface cable and rerun test.


120 Replace the printer driver PCBA and rerun test.


130 Replace the Endorser Controller (AA09) andrerun test.


140 Replace the printhead and rerun test.


950 Verify operation. End of procedure

PEP/Stamp Tests



140700 PP 04 0020 - PP 04 0190

Matrix Printhead pin XX is not functioning.


100 Replace the printhead cable and rerun test.




120 Replace the Printer Driver PCBA and rerun test.


130 Replace the Endorser Controller (AA09) and reruntest.





140800 PP 04 0200

One of the endorser print needles is not firing.


100 Replace the printhead cable and rerun the test.




120 Replace the Printer Driver PCBA and rerun test.


130 Replace the Endorser Controller (AA09) andrerun test.




950 End of procedure

PEP/Stamp Tests



Section 21 CAR Diagnostics (U4/JPEG ImagingSystem)

180000 CAR xx xx

This section contains the manual procedures required to isolate and repair failures relatedto the IR 9210 Courtesy Amount Read (CAR) System. These procedures are for U4/JPEGimaging systems only. For dual image systems, refer to Section 24, "CAR Diagnostics (DualImage System)." Both power-on confidence (POC) and MTR error codes for CAR arecontained in this section.

183020 CAR 00 10

The CAR PRESENT jumper on board 10 of the AA gate may not be installed.

If the following error code/message is reported, follow the procedure below.

Error Code Message

CAR 00 10 CAR UNIT REPORTED NOT PRESENT


100 This error should never occur unless the wrongMain Processor Board EPROMs are installed orthe POC tests have been bypassed AND eitherthe CAR PRESENT jumper hasn’t been installedor an error exists which prevents the CARPRESENT jumper from being detected.

Are the correct version EPROMs installed on theMain Processor Board? 120 110

110 Install the correct version of EPROMs. Go to950.

CAR Diagnostics (U4/JPEG Imaging System)


183020 CAR 00 10


120 Have the POC tests been bypassed?(If so, it will be indicated on the monitor.)

130 140

130 Make the necessary change that enables thePOC tests to be executed.

140 If the correct EPROMs have been installed andthe POC tests are allowed to execute properly,any error associated with detecting the CARPRESENT jumper will be detected during POC.Reboot the document processor to executePOC.

Are an error code and message displayed? 150 160

150 Refer to the Error Code Line procedureassociated with the error code displayed duringPOC.

160 Load the MTR disk and attempt to execute oneof the CAR test selections.

Does the error CAR 00 10 reappear? 170 950

170 Elevate the problem to the next level of support.




183050 CAR 01 1x

CAR Interface Test Status errors.

If any of the following error codes / messages are reported, follow the procedure below.

Error Code Message

CAR 01 13 CONTROL INTERFACE TEST STATUS: BUSY

CAR 01 14 CONTROL INTERFACE TEST STATUS: ERROR


100 Re-execute the Control Interface test.


120 Attach the monitor and keyboard to the CARmodule. Is an error code displayed after theCAR unit completes its POC?

140 130

130 Retrieve the CAR status at the car unit. Is anerror code displayed?

170 150

140 Refer to the IR 9210 Courtesy Amount Read(CAR) Module Technical Manual, Volume 4 forthe error code line procedures referred to by theerror code displayed.




170 Reseat the CAR module AU Board. Re-executethe Control Interface Test.


190 Replace the AU Board. Re-execute the ControlInterface Test.


200 Replace each of the two Control Interface cablesone at a time. Re-execute the Control InterfaceTest after each cable replacement.






183060 CAR 02 1x

CAR Unit POC Results Errors.

If any of the following error codes/messages are reported, follow the procedure below.

Error Code Message

CAR 02 15 CAR UNIT POC RESULTS STATUS: BUSY

CAR 02 16 CAR UNIT POC RESULTS STATUS: ERROR

CAR 02 17 THE CAR UNIT POC REPORTED A FAILURE


100 Power down the sorter. Verify the controlinterface cables between the main processorboards are connected and seated properly. Re-execute the "RETRIEVE CAR UNIT POC RESULTS"MTR.


102 Run the Control Interface test.

Does the test pass?120 115

115 Follow the manual procedure for ControlInterface MTR Error Code.

120 Attach the monitor and keyboard to the CARmodule. Does the CAR Unit complete its POCtest successfully.

150 140

140 Refer to the IR 9210 Courtesy Amount Read(CAR) Module Technical Manual, Volume 4 forthe error code line procedures referred to by theerror code displayed or the CCC table if no errorcode is displayed.



150 Disconnect and then reconnect the ControlInterface cables between the CAR module andthe document processor I/O box and betweenthe I/O connector box and the CIB. Re-executethe Control Interface Test.

Does this test pass? 170 115



183060 CAR 02 1x


170 Reseat the CAR module AU Board. Re-executethe "RETRIEVE CAR UNIT POC RESULTS" MTR.


180 950

180 Replace the AU Board. Re-execute the"RETRIEVE CAR UNIT POC RESULTS" MTR.


200 950

200 Replace each of the two Control Interface cablesone at a time. Re-execute the "RETRIEVE CARUNIT POC RESULTS" MTR after each cablereplacement.






183070 CAR 02 18

Upon completion of its POC tests, the CAR unit failed to enter either the POC Failed or OPstate.

If the following error code / message is reported, follow the procedure below.

Error Code Message

CAR 02 18 CAR UNIT POC RETURNED AN INVALID STATE


100 Run test selection 2, RETRIEVE THE CAR UNITPOC TEST RESULTS, from the CAR System MTRTest Menu.

Does the error code CAR 02 18 still getreported?

110 950

110 The design specifies that only two states (POCFailed and OP) are valid upon completion of theCAR module’s POC. A problem exists with theCAR module. Attach the CAR module’s monitorand keyboard. Apply power to the CAR module.

Upon completion of the CAR module’s POC, isan error code reported on the monitor?

120 130

120 Refer to the ECLP in the CAR Technical Manual,Vol 4 for additional troubleshooting procedures.





183120 CAR 08 xx

CAR Interface Test communication status errors.

If any of the following error codes / messages are reported, follow the procedure below.

Error Code Message

CAR 08 80 UNEXPECTED RESELECTION

CAR 08 81 IDENTIFICATION ERROR

CAR 08 82 ABORT RECEIVED

CAR 08 83 BUS DEVICE RESET RECEIVED

CAR 08 84 BUS RESET

CAR 08 85 HOST ADAPTER ERROR

CAR 08 86 UNEXPECTED SELECTION

CAR 08 87 REPORTED BUSY AFTER 3 RETRIES


100 Is the Control Interface Cable between the CARUnit and the Main Processor Board whichresides in the AA Gate is properly attached atboth ends?

120 110

110 Properly reattach the cable and re-execute theCAR Interface Test. Does the problem still exist?

120950

120 Disconnect the Control Interface Cable and verifythat no connecting pins are bent or missing thenre-connect the cable. Do this at both ends thenre-execute the CAR Interface Test.




183120 CAR 08 xx


130 Verify that the CAR Unit is operating properly.See the IR 9210 Courtesy Amount Read (CAR)Module Technical Manual, Volume 4 for theproper procedures.

Was a problem detected with the CAR Unit? 140 150

140 Fix the problem with the CAR Unit and re-executethe CAR Interface Test.


150 Power down the document processor and CARUnit and replace the Control Interface Cable.Power the document processor back up and re-execute the Control Interface Test as directed.


160 950

160 Refer to the IR 9210 Courtesy Amount Read(CAR) Module Technical Manual, Volume 4 foradditional troubleshooting procedures.



Section 22 Dual Image Manual Procedures

This section deals with diagnosis of problems in the Dual Image modules in the NDP1XXX. It covers the camera submodule and the image camera server (ICS). The camerasubmodule, located next to the first pocket module, consists of the optics, electronics, andpower supplies necessary to capture document images.

Additional POC Test Status InformationIn the CAPI Configuration, additional status information is displayed by the ExceptionHandler when POC test errors occur. The top line of the Exception Handler windowcontains 5 bytes in parenthesis, followed by 8 additional bytes. The 5 byte grouping inparenthesis is the error database ID. This is used by the Exception Handler to reference atable entry in the error database that contains the text for the error description, manualprocedure reference, and suspect components list. The 8 bytes to the right of the errordatabase ID are extended status bytes. For most POC test errors, these bytes are not usedand are set to zero. For the Dual Imaging Module POC test, they are used to relayadditional information that can be used to further diagnose a problem. The extendedstatus information is described below:

XX XX XX XX XX XX XX XX

8th Byte: Not Used

7th Byte: Not Used

6th Byte: Rear Photodiode 1 Intensity

5th Byte: Rear Photodiode 0 Intensity

4th Byte: Front Photodiode 1 Intensity

3rd Byte: Front Photodiode 0 Intensity

2nd Byte: Suspect PCBA’s Slot ID

1st Byte: Not Used

Dual Image Manual Procedures


The N/F and N/F/S PCBAs have a bank of eight LEDs (light emitting diodes) that providevisual indication of the state of the board. The LEDs are identified with a legend on thefront edge of the PCBA. The following table defines the conditions under which each LEDwill be turned on.

LED Bank

+5 Volts Present

IIB PRES – Set if the NF or NFS PCBAs detect the presence of a DMIIB PCBA in the AA logicgate.

SW IPL – Set if software has set the item present level (IPL) active for diagnostics.

IIB IPL – Normally set by the DMIIB PCBA if BOL I2 (beam of light I2 in the image module) hassensed an item.

V1 DP – Set when sending normalized image data to compressors over the V1 bus. (Used bythe NF PCBA to feed the primary compressor; the NFS PCBA uses it to feed the oddcompressors)

V2 DP - Set when sending normalized image data to compressors over the V2 bus. (Used by NFPCBA to feed the AUX compressor; the NFS PCBA uses it to feed the even compressors)

IRQ – Interrupt request to the PCI Image Interface (PCI3) PCBA in the Image Capture Server(ICS).

RESET – Set if board is being reset.

The Turbo CCITT has a bank of eight LEDs (light emitting diodes) that provide visualindication of the state of the board. The following table defines the conditions underwhich each LED will be turned on.

LED Bank

RETCDEB – Compressed data ready for retrieval from output buffer B

CAPCDEB – Capture compressed data to output buffer B

RETDOCB – Retrieve document data from input buffer B

CAPDOCB – Capture document data to input buffer B

RETCDEA – Compressed data ready for retrieval from output buffer A

CAPCDEA – Capture compressed data to output buffer A

RETDOCA – Retrieve document data from input buffer A

CAPDOCA – Capture document data to input buffer A



The Turbo JPEG PCBA has a bank of 12 LEDs that provide visual indication of the state ofthe board. The LEDs are identified with a legend on the front edge of the PCBA. Thefollowing table define the conditions under which each LED will be turned on.

LED Bank

SPARE – not used

EXTENDED DP – Set while a document enters the document buffer. (This signal extends thelength of an incoming document to end on a multiple of eight scaled pixels as required by theblock generator and compressor functions on the board).

CODE DP – Set if the Turbo JPEG PCBA is transmitting JPEG compressed image data to the ICSover the Video Bus.

ZR36050 INT – indicates that the compressor integrated circuit has interrupted the digitalsignal processor (DSP) integrated circuit.

ZR36050 BUSY – Set while the compressor integrated circuit processes a document. Offotherwise.

ZR36015 BUSY – Set while the Block Generator integrated circuit processes a document. Offotherwise.

DOC BUF OVERFLOW – Set if the onboard document buffer memory contains its maximum oftwo images, and a third image tries to enter. This error condition is latched until clearedinternally or by or a board reset, which clears the LED.

DOC BUF BUSY - Set while either onboard document buffer memory is sending a document tothe grayscale remapper and the compression circuits. Off otherwise.

BUF2 SENDING – Set while the second document buffer is transmitting a document to thegrayscale remapper and the compression circuits. Off otherwise.

BUF2 RECEIVING – Set while the second document buffer is capturing a document from thescaling circuit. Off otherwise.

BUF1 SENDING - Set while the first document buffer is transmitting a document to the grayscaleremapper and the compression circuits. Off otherwise.

BUF1 RECEIVING - Set while the first document buffer is capturing a document from the scalingcircuit. Off otherwise.



Dual Image Camera Module Error Codes(DIMG xx xx)

This subsection describes error codes for the following types of failure for the Dual ImageCamera Module:

• Common failures (DIMG xx xx)

• Interface MTR (DIMG 01 xx)

• Analog Interface Test (DIMG 22 xx)

• Calibrate Front Camera (DIMG 23 xx)

• Calibrate Rear Camera (DIMG 24 xx)

• Normalizer and Diagnostics RAM test (DIMG 40 xx)

• Digitizer Framing Logic test (DIMG 41 xx)

• Background Suppression test (DIMG 80 xx)

• CAR Spot/Void Threshold test (DIMG 81 xx)

• CAR Interface test (DIMG 82 xx)

• Get CAR POC (DIMG 83 xx)

• Image Interface Confidence test (DIMG A7 xx)

• Valid Image Gate Configuration test (DIMG C3 xx)

• Image Bus test (DIMG C4 xx)

• JPEG Compressor test (DIMG D0 xx)

• JPEG Built-In Self-Test (DIMG D1 xx)

• CCITT Compressor test (DIMG D2 xx)

• CCITT Built-In Self-Test (DIMG D3 xx)



(DIMG xx xx) Image Camera Module Common Failures

Table 22–1. (DIMG xx xx) Image Camera Module Common Failures

Error Code (Hex) DescriptionM&D Procedures

SectionPrimary

FRUSecondary

FRU

DIMG xx 51 Front ICM Not Fitted Configuration andParameter File AccessFailures

DIMG xx 52 Rear ICM Not Fitted Configuration andParameter File AccessFailures

DIMG xx 53 Front Normalizer FramerNot Fitted

"Fitted/Not Fitted ErrorsFlow"

DIMG xx 54 Rear Normalizer FramerNot Fitted


DIMG xx 57 CAR Port Not Fitted "CAR Port Not Found orCAR Port CI Errors Flow"

CAR Port PCBA ConfigurationConflict



(DIMG 01 xx) Interface MTR

Table 22–2. (DIMG 01 xx) Interface MTR


SectionPrimary

FRUSecondary

FRU

DIMG 01 01 The reset bit was notreset on the DMIIBPCBA.

DMIIB PCBA DMIIB InterfaceCable

DIMG 01 02 The reset bit was notreset when the statuswas read.


DIMG 01 03 The loopback bit wasnot set on registerFC47.


DIMG 01 04 The FIFO status was notempty after a clear FIFOwas given.


DIMG 01 05 An incorrect status forhalf full was given.


DIMG 01 06 The half full status wasincorrect when the FIFOis half full.


DIMG 01 07 An incorrect status forfull was given when theFIFO was full.


DIMG 01 08 Incorrect data was readfrom the FIFO.


DIMG 01 09 The half full status wasincorrect.


DIMG 01 0A The status of the FIFOwas incorrect when itwas half full.


DIMG 01 0B Incorrect data was readfrom the FIFO.


DIMG 01 0C The FIFO should beempty, but the statusindicates that it is notempty.


DIMG 01 0D The FIFO status isincorrect.


DIMG 01 0E The FIFO status isincorrect for empty.






SectionPrimary

FRUSecondary

FRU

DIMG 01 0F The loopback bit wasnot reset.


DIMG 01 10 The input FIFO statuswas incorrect when itwas not yet half full.


DIMG 01 11 The half full status wasnot set when the FIFOwas half full.


DIMG 01 12 The FIFO status wasincorrect for not full yet.


DIMG 01 13 The full status was notset when the FIFO wasfull.


DIMG 01 15 Not successful ontransmit to PCI.

DMIIB PCBA ICS PC, ImageInterface Cable

DIMG 01 16 Not successful on Pollto PCI.


DIMG 01 17 Not successful onReceive from PCI.


DIMG 01 18 The OP code wasincorrect on the GetConfiguration command.

ICS PC, ImageInterface Cable

DMIIB PCBA

DIMG 01 19 Dual Image POCCommunication Failure.The results were notgood on theconfiguration.

DMIIB InterfaceCableconnecting theDMIIB PCBA tothe image gate,Image interfacecable

ICS PC, DMIIBPCBA, Imagegate powersupply and DCpower harness

DIMG 01 1A Not successful on theEnter MTR command.


DMIIB PCBA

DIMG 01 1B Not successful on EnterMTR Poll.


DMIIB PCBA

DIMG 01 1C Not successful onReceive for the EnterMTR command.


DMIIB PCBA

DIMG 01 1D The Enter MTR OP codewas not returned.


DMIIB PCBA

DIMG 02 01 Not successful onTransmit.


DMIIB PCBA





SectionPrimary

FRUSecondary

FRU

DIMG 02 02 Not successful on Poll. ICS PC, ImageInterface Cable

DMIIB PCBA

DIMG 02 03 Not successful onReceive.


DMIIB PCBA

DIMG 02 04 Incorrect OP code aftermultiple tries.


DMIIB PCBA

DIMG 02 05 Invalid MTR fromPerform MTR command.


DMIIB PCBA

DIMG 02 06 Incorrect Type for POC. ICS PC, ImageInterface Cable

DMIIB PCBA

DIMG 02 07 Timed out during Poll forPerform MTR command.


DMIIB PCBA

DIMG 02 08 No good status afterReceive.


DMIIB PCBA

DIMG 02 09 MTR Complete OP codenot returned.


DMIIB PCBA

DIMG 03 01 Not successful ontransmit of Exit MTRcommand.


DMIIB PCBA

DIMG 03 02 Not successful on Pollfor Exit MTR command.


DMIIB PCBA

DIMG 03 03 Receive error on ExitMTR command.


DMIIB PCBA

DIMG 03 04 Incorrect OP code forExit MTR command.


DMIIB PCBA

DIMG 03 05 Exit MTR not good. ICS PC, ImageInterface Cable

DMIIB PCBA



(DIMG 22 xx) Analog Interface Test

Table 22–3. (DIMG 22 xx) Analog Interface Test


SectionPrimary

FRUSecondary

FRU

DIMG 22 01 Front Normalizer FramerCommunication Failure

"Front NormalizerFramer Not Found orFront Normalizer FramerCI Errors Flow"

Front NormalizerFramer PCBA

Image InterfaceCable

DIMG 22 02 Rear Normalizer FramerCommunication Failure


Rear NormalizerFramer PCBA


DIMG 22 03 Front Black DAC ControlFailure

NDP 1150:Front CameraNDP 1825:Front HighSpeed DigitizerPCBA

Power Supply -CameraFront NormalizerFramer PCBA

DIMG 22 04 Rear Black DAC ControlFailure

NDP 1150:Rear CameraNDP 1825:Rear High SpeedDigitizer

Power Supply -CameraRear NormalizerFramer PCBA

DIMG 22 05 Front High SpeedDigitizer CommunicationFailure

"High Speed DigitizerNot Found or HighSpeed Digitizer CI ErrorsFlow"

Front HighSpeed DigitizerPCBA


DIMG 22 06 Rear High SpeedDigitizer CommunicationFailure


Rear High SpeedDigitizer PCBA


DIMG 22 07 Front Lamps Not On Front Lamps,Lamp PowerSupply

Lamp ControlPCBA,Front NormalizerFramer PCBA

DIMG 22 08 Rear Lamps Not On Rear Lamps,Lamp PowerSupply

Lamp ControlPCBA,Rear NormalizerFramer PCBA

DIMG 22 0B Front Photodiode ValueToo High

Front Lamps,Front NormalizerFramer PCBA

Photo SensorAssy.

DIMG 22 0C Rear Photodiode ValueToo High

Rear Lamps,Rear NormalizerFramer PCBA

Photo SensorAssy.



Table 22–3. (DIMG 22 xx) Analog Interface Test


SectionPrimary

FRUSecondary

FRU

DIMG 22 0D Front Photodiode ValueToo Low

Front Lamps,Lamp PowerSupply


DIMG 22 0E Rear Photodiode ValueToo Low

Rear Lamps,Lamp PowerSupply


DIMG 22 53 Front Normalizer FramerNot Fitted


DIMG 22 54 Rear Normalizer FramerNot Fitted


DIMG 22 5E Front High SpeedDigitizer Not Fitted


DIMG 22 5F Rear High SpeedDigitizer Not Fitted




(DIMG 23 xx) Calibrate Front Camera

Table 22–4. (DIMG 23 xx) Calibrate Front Camera


SectionPrimary

FRUSecondary

FRU



DIMG 23 02 Front Configuration FileAccess Failure

"Configuration andParameter File AccessFailures Flow"

DIMG 23 03 Front Calibration CannotConverge

"White Digital-to-AnalogConverter and AnalogInterface Failure Flow"

DIMG 23 04 Front lamps Not On Front Lamps,Lamp PowerSupply

Photo SensorAssy.Lamp ControlPCBA

DIMG 23 05 Front Calibration CannotSet White DACs


DIMG 23 06 Front Calibration CannotSet Black DACs

NDP 1150:Front CameraNDP 1825:Front HighSpeed DigitizerPCBA

Power Supply -Camera

DIMG 23 07 Front Normalization FileAccess Failure


DIMG 23 08 Front Target Failure orMisaligned

Check Targetand glassplacement ormarks.

Front Camera

DIMG 23 0A Front Report File AccessFailure


DIMG 23 0B Front Parameter FileAccess Failure




DIMG 23 5E Front High SpeedDigitizer Not Fitted




(DIMG 24 xx) Calibrate Rear Camera

Table 22–5. (DIMG 24 xx) Calibrate Rear Camera


SectionPrimary

FRUSecondary

FRU


"Rear Normalizer FramerNot Found or RearNormalizer Framer CIErrors Flow"

DIMG 24 02 Rear Configuration FileAccess Failure


DIMG 24 03 Rear Calibration CannotConverge


DIMG 24 04 Rear Lamps Not On Rear Lamps,Lamp PowerSupply

Photo SensorAssy.,Lamp ControlPCBA

DIMG 24 05 Rear Calibration CannotSet White DACs


DIMG 24 06 Rear Calibration CannotSet Black DACs

NDP 1150:Rear CameraNDP 1825:Rear High SpeedDigitizer PCBA

Power Supply -Camera

DIMG 24 07 Rear Normalization FileAccess Failure


DIMG 24 08 Rear Target Failure orMisaligned

Check Targetand glass forplacement ormarks.

Rear Camera

DIMG 24 0A Rear Report File AccessFailure


DIMG 24 0B Rear Parameter FileAccess Failure




DIMG 24 5F Rear High SpeedDigitizer Not Fitted




(DIMG 40 xx) Normalizer and Diagnostics RAM Test

Table 22–6. (DIMG 40 xx) Normalizer and Diagnostics RAM Test


SectionPrimary

FRUSecondary

FRU

DIMG 40 01 Norm LUT/DiagnosticRAM Failure Front


DIMG 40 02 Norm LUT/DiagnosticRAM Failure Rear












(DIMG 41 xx) Digitizer Framing Logic Test

Table 22–7. (DIMG 41 xx) Digitizer Framing Logic Test


SectionPrimary

FRUSecondary

FRU





DIMG 41 03 Front Normalizer FramerDid Not Detect LeadingEdge


DIMG 41 04 Rear Normalizer FramerDid Not Detect LeadingEdge


DIMG 41 05 Front Normalizer FramerNormalized VideoSignature Failure


Backplane

DIMG 41 06 Rear Normalizer FramerNormalized VideoSignature Failure


Backplane

DIMG 41 07 Front Normalizer FramerTotal Height of ImageFailure


DIMG 41 08 Rear Normalizer FramerTotal Height of ImageFailure


DIMG 41 09 Front Normalizer FramerTotal Length of ImageFailure


DIMG 41 0A Rear Normalizer FramerTotal Length of ImageFailure








(DIMG 80 xx) Background Suppression Test

Table 22–8. (DIMG 80 xx) Background Suppression Test


SectionPrimary

FRUSecondary

FRU

DIMG 80 01 Normalizer FramerCommunication Failure



DIMG 80 02 CAR PortCommunication Failure

"CAR Port Not Found orCAR Port CI Errors Flow"

CAR Port PCBA

DIMG 80 03 Normalizer FramerSignature Failure


DIMG 80 04 CAR Port SignatureFailure

CAR Port PCBA


CAR Port PCBA Front NormalizerFramer PCBA

DIMG 80 06 Normalizer FramerPCBA Signature Failure


DIMG 80 07 Image InterfaceCommunication Failure

"Image InterfaceCommunication FailureFlow"

PCI ImageInterface PCBA

DIMG 80 57 CAR Port Not Fitted "CAR Port Not Found orCAR Port CI Errors Flow"



(DIMG 81 xx) CAR Spot/Void Threshold Test

Table 22–9. (DIMG 81 xx) CAR Spot/Void Threshold Test


SectionPrimary

FRUSecondary

FRU

DIMG 81 01 Normalizer FramerCommunication Failure



DIMG 81 02 CAR PortCommunication Failure


CAR Port PCBA




CAR Port PCBA





DIMG 81 07 Image InterfaceCommunication Failure

"Image InterfaceCommunication FailureFlow"


DIMG 81 57 CAR Port Not Fitted "CAR Port Not Found orCAR Port CI Errors Flow"



(DIMG 82 xx) CAR Interface Test

Table 22–10. (DIMG 82 xx) CAR Interface Test


SectionPrimary

FRUSecondary

FRU

DIMG 82 01 CAR Controller in BadState

"CAR SCSICommunication FailureFlow"

DIMG 82 02 CAR in unknown StateFailure


DIMG 82 03 SCSI CommunicationFailure


DIMG 82 04 SCSI Command EchoCommunication Failure


DIMG 82 05 SCSI Driver Open Failure- CAR not Present or On


DIMG 82 FF Not Fitted "CAR SCSICommunication FailureFlow"

(DIMG 83 xx) Get CAR POC

Table 22–11. (DIMG 83 xx) Get CAR POC


SectionPrimary

FRUSecondary

FRU

DIMG 83 01 CAR Controller in BadState


DIMG 83 02 CAR in Unknown StateFailure


DIMG 83 03 SCSI Driver Failure "CAR SCSICommunication FailureFlow"

DIMG 83 04 SCSI Command EchoCommunication Failure




Table 22–11. (DIMG 83 xx) Get CAR POC


SectionPrimary

FRUSecondary

FRU

DIMG 83 05 SCSI Driver Open Failure- CAR not Present or On


DIMG 83 06 CAR POC Failure "CAR Module POCFailure Flow"

DIMG 83 FF Not Fitted "CAR SCSICommunication FailureFlow"



(DIMG A7 xx) Image Interface Confidence Test

Table 22–12. (DIMG A7 xx) Image Interface Confidence Test


SectionPrimary

FRUSecondary

FRU

DIMG A7 01 PCI Image InterfaceCommunication Failure


ICS PC

DIMG A7 03 PCI Image InterfaceSignature Failure


DIMG A7 05 PCI Image InterfaceOverflow Failure


DIMG A7 51 Front ICM Not Fitted PCI ImageInterface PCBA

ICS PC

DIMG A7 52 Rear ICM Not Fitted PCI ImageInterface PCBA

ICS PC



(DIMG C3 xx) Valid Image Gate Configuration Test

Table 22–13. (DIMG C3 xx) Valid Image Gate Configuration Test


SectionPrimary

FRUSecondary

FRU

DIMG C3 01 Front Image Enabled/Front Normalizer FramerPCBA CommunicationFailure




DIMG C3 02 Front ImageEnabled/Front HighSpeed Digitizer PCBACommunication Failure




DIMG C3 03 Rear ImageEnabled/RearNormalizer FramerPCBA CommunicationFailure




DIMG C3 04 Rear Image Enabled/Rear High SpeedDigitizer PCBACommunication Failure




DIMG C3 05 CAR Enabled/CAR PortPCBA CommunicationFailure



DIMG C3 0F CAR Enabled/ CAR PortFound in Incorrect Slot

"Slot Errors Flow"

DIMG C3 10 Front JPEG Enabled/Front JPEGCommunication Failure

"Compressor Not Foundor Compressor CI ErrorsFlow"

Front JPEGCompressorPCBA


DIMG C3 11 Rear JPEG Enabled/Rear JPEGCommunication Failure


Rear JPEGCompressorPCBA


DIMG C3 12 Front JPEG Enabled/JPEG Found in IncorrectSlot

"Slot Errors Flow"

DIMG C3 13 Rear JPEG Enabled/JPEG Found in IncorrectSlot

"Slot Errors Flow"

DIMG C3 14 Front CCITT Enabled/CCITT CommunicationFailure


DIMG C3 15 Rear CCITT Enabled/CCITT CommunicationFailure




Table 22–13. (DIMG C3 xx) Valid Image Gate Configuration Test


SectionPrimary

FRUSecondary

FRU

DIMG C3 16 Dual Camera CCITTFound in Incorrect Slot

"Slot Errors Flow"

DIMG C3 17 Front Camera 2Resolution Incorrect

"Camera ResolutionIncorrect Flow"

DIMG C3 18 Dual Camera NormalizerFramer Enabled/Foundin Incorrect Slot

"Slot Errors Flow"

DIMG C3 51 Front ICM Not Fitted PCI ImageInterface PCBA

ICS PC

DIMG C3 52 Rear ICM Not Fitted PCI ImageInterface PCBA

ICS PC

DIMG C3 53 Front Normalizer FramerFitted/Not Fitted


DIMG C3 54 Rear Normalizer FramerFitted/Not Fitted


DIMG C3 57 Front CAR PortFitted/Not Fitted


DIMG C3 5A Front CCITT Fitted/NotFitted


DIMG C3 5B Rear CCITT Fitted/NotFitted


DIMG C3 5C Front JPEG Fitted/NotFitted


DIMG C3 5D Rear JPEG Fitted/NotFitted


DIMG C3 06 Front ImageEnabled/Rear HighSpeed Digitizer Found inIncorrect Slot


DIMG C3 07 Rear ImageEnabled/Rear HighSpeed Digitizer Found inIncorrect Slot


DIMG C3 5E Front High SpeedDigitizer Not Fitted


DIMG C3 5F Rear High SpeedDigitizer Not Fitted




(DIMG C4 xx) Image Bus Test

Table 22–14. (DIMG C4 xx) Image Bus Test


SectionPrimary

FRUSecondary

FRU

DIMG C4 01 Rear Normalizer FramerBus Failure Pattern aa



DIMG C4 02 Rear Normalizer FramerBus Failure Pattern 55



DIMG C4 03 Rear Normalizer FramerBus Failure Pattern cc



DIMG C4 04 Rear Normalizer FramerBus Failure Pattern 0f



DIMG C4 0D Rear Normalizer FramerCommunication Failure




DIMG C4 11 Front Normalizer FramerBus Failure Pattern aa

"Image Bus Test FailureFlow"

DIMG C4 12 Front Normalizer FramerBus Failure Pattern 55


DIMG C4 13 Front Normalizer FramerBus Failure Pattern cc


DIMG C4 14 Front Normalizer FramerBus Failure Pattern 0f


DIMG C4 19 Front CAR Port BusFailure Pattern aa

CAR Port PCBA Front HighSpeed DigitizerPCBA

DIMG C4 1A Front CAR Port BusFailure Pattern 55


DIMG C4 1B Front CAR Port BusFailure Pattern cc


DIMG C4 1C Front CAR Port BusFailure Pattern 0f


DIMG C4 1D Front Normalizer FramerCommunication Failure



DIMG C4 1F Front CAR PortCommunication Failure







SectionPrimary

FRUSecondary

FRU

DIMG C4 20 Rear JPEGCommunication Failure

"Compressor Not Foundor Compressor CI ErrorsFlow”



DIMG C4 21 Front JPEGCommunication Failure



DIMG C4 22 Rear JPEG Bus FailurePattern aa



DIMG C4 23 Rear JPEG Bus FailurePattern 55



DIMG C4 24 Rear JPEG Bus FailurePattern cc



DIMG C4 25 Rear JPEG Bus FailurePattern 0f



DIMG C4 26 Front JPEG Bus FailurePattern aa



DIMG C4 27 Front JPEG Bus FailurePattern aa



DIMG C4 28 Front JPEG Bus FailurePattern cc



DIMG C4 29 Front JPEG Bus FailurePattern 0f



DIMG C4 2A Rear CCITTCommunication Failure


DIMG C4 2B Front CCITTCommunication Failure


DIMG C4 2C Rear CCITT Bus FailurePattern aa

Rear CCITTCompressorPCBA






SectionPrimary

FRUSecondary

FRU

DIMG C4 2D Rear CCITT Bus FailurePattern 55



DIMG C4 2E Rear CCITT Bus FailurePattern cc



DIMG C4 2F Rear CCITT Bus FailurePattern 0f



DIMG C4 30 Front CCITT Bus FailurePattern aa

Front CCITTCompressorPCBA


DIMG C4 31 Front CCITT Bus FailurePattern 55



DIMG C4 32 Front CCITT Bus FailurePattern cc



DIMG C4 33 Front CCITT Bus FailurePattern 0f



DIMG C4 34 Rear High SpeedDigitizer CommunicationFailure




DIMG C4 35 Front High SpeedDigitizer CommunicationFailure




DIMG C4 36 Rear High SpeedDigitizer Bus FailurePattern aa




DIMG C4 37 Rear High SpeedDigitizer Bus FailurePattern 55




DIMG C4 38 Rear High SpeedDigitizer Bus FailurePattern cc








SectionPrimary

FRUSecondary

FRU

DIMG C4 39 Rear High SpeedDigitizer Bus FailurePattern 0f




DIMG C4 3A Front High SpeedDigitizer Bus FailurePattern aa




DIMG C4 3B Front High SpeedDigitizer Bus FailurePattern 55




DIMG C4 3C Front High SpeedDigitizer Bus FailurePattern cc




DIMG C4 3D Front High SpeedDigitizer Bus FailurePattern 0f




DIMG C4 51 Front ICM Not Fitted "Fitted/Not Fitted ErrorsFlow"


ICS PC

DIMG C4 52 Rear ICM Not Fitted "Fitted/Not Fitted ErrorsFlow"


ICS PC



(DIMG D0 xx) JPEG Compressor Test

Table 22–15. (DIMG D0 xx) JPEG Compressor Test


SectionPrimary

FRUSecondary

FRU

DIMG D0 01 Front JPEGCommunication Failure



DIMG D0 02 Rear JPEGCommunication Failure



DIMG D0 03 Front JPEG MessagingFailure


DIMG D0 04 Rear JPEG MessagingFailure


DIMG D0 05 Front JPEGCompression Failure


DIMG D0 06 Rear JPEG CompressionFailure


DIMG D0 07 Front Normalizer FramerSignature Failure



DIMG D0 08 Rear Normalizer FramerSignature Failure


DIMG D0 09 Front JPEG SignatureFailure


DIMG D0 0A Rear JPEG SignatureFailure


DIMG D0 0B Multiple SignatureFailure Front JPEGPrimary FRU



DIMG D0 0C Multiple SignatureFailure Rear JPEGPrimary FRU



DIMG D0 0D Multiple SignatureFailure Front NormalizerFramer Primary FRU






SectionPrimary

FRUSecondary

FRU

DIMG D0 0E Multiple SignatureFailure Rear NormalizerFramer Primary FRU


DIMG D0 0F System/Memory Failure ReInstall ICSsoftware and/orNT OS

ICS PC

DIMG D0 10 Front Transfer NotStarted Failure



DIMG D0 11 Rear Transfer NotStarted Failure



DIMG D0 12 Front Partial TransferFailure



DIMG D0 13 Rear Partial TransferFailure



DIMG D0 14 Front PCI SignatureFailure



DIMG D0 15 Rear PCI SignatureFailure



DIMG D0 16 Front Overflow Failure Front JPEGCompressorPCBA


DIMG D0 17 Rear Overflow Failure Rear JPEGCompressorPCBA


DIMG D0 18 Front FIFO Not EmptyFailure



DIMG D0 19 Rear FIFO Not EmptyFailure



DIMG D0 1A Front SoftwareChecksum Failure


DIMG D0 1B Rear SoftwareChecksum Failure


DIMG D0 51 Front ICM Not Fitted "Fitted/Not Fitted ErrorsFlow"


ICS PC

DIMG D0 52 Rear ICM Not Fitted "Fitted/Not Fitted ErrorsFlow"


ICS PC





SectionPrimary

FRUSecondary

FRU

DIMG D0 5C Front JPEG Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D0 5D Rear JPEG Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D0 1E File IO Error ICS PC



(DIMG D1 xx) JPEG Built-In Self-Test

Table 22–16. (DIMG D1 xx) JPEG Built-In Self-Test


SectionPrimary

FRUSecondary

FRU

DIMG D1 01 Front JPEGCommunication Failure




DIMG D1 02 Rear JPEGCommunication Failure




DIMG D1 03 Front JPEG Self TestFailed


DIMG D1 04 Rear JPEG Self TestFailed




ICS PC



ICS PC

DIMG D1 5C Front JPEG Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D1 5D Rear JPEG Not Fitted "Fitted/Not Fitted ErrorsFlow"



(DIMG D2 xx) CCITT Compressor Test

Table 22–17. (DIMG D2 xx) CCITT Compressor Test


SectionPrimary

FRUSecondary

FRU

DIMG D2 01 Front CCITTCommunication Failure



DIMG D2 02 Rear CCITTCommunication Failure


CCITTCompressorPCBA

DIMG D2 03 Front CCITT MessagingFailure


DIMG D2 04 Rear CCITT MessagingFailure


DIMG D2 05 Front CCITTCompression Failure


DIMG D2 06 Rear CCITTCompression Failure


DIMG D2 07 Front Normalizer FramerSignature Failure


DIMG D2 08 Rear Normalizer FramerSignature Failure


DIMG D2 09 Front CCITT SignatureFailure


DIMG D2 0A Rear CCITT SignatureFailure


DIMG D2 0B Multiple SignatureFailure Front CCITTPrimary FRU



DIMG D2 0C Multiple SignatureFailure Rear CCITTPrimary FRU



DIMG D2 0D Multiple SignatureFailure Front NormalizerFramer Primary FRU






SectionPrimary

FRUSecondary

FRU

DIMG D2 0E Multiple SignatureFailure Rear NormalizerFramer Primary FRU


DIMG D2 0F System/Memory Failure ReInstall ICSSoftware and/orNT OS

ICS PC

DIMG D2 10 Front Transfer NotStarted Failure



DIMG D2 11 Rear Transfer NotStarted Failure



DIMG D2 12 Front Partial TransferFailure



DIMG D2 13 Rear Partial TransferFailure



DIMG D2 14 Front PCI SignatureFailure



DIMG D2 15 Rear PCI SignatureFailure



DIMG D2 16 Front Overflow Failure Front CCITTCompressorPCBA


DIMG D2 17 Rear Overflow Failure Rear CCITTCompressorPCBA


DIMG D2 18 Front FIFO Not EmptyFailure



DIMG D2 19 Rear FIFO Not EmptyFailure



DIMG D2 1A Front SoftwareChecksum Failure


DIMG D2 1B Rear SoftwareChecksum Failure


DIMG D2 1C Front CCITT Table LoadFailure







SectionPrimary

FRUSecondary

FRU

DIMG D2 1D Rear CCITT Table LoadFailure





ICS PC



ICS PC

DIMG D2 54 Front CCITT Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D2 5B Rear CCITT Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D2 1E File IO Error ICS PC



(DIMG D3 xx) CCITT Built-In Self-Test

Table 22–18. (DIMG D3 xx) CCITT Built-In Self-Test


SectionPrimary

FRUSecondary

FRU

DIMG D3 01 Front CCITTCommunication Failure


DIMG D3 02 Rear CCITTCommunication Failure


DIMG D3 03 Front CCITT Self TestFailed


DIMG D3 04 Rear CCITT Self TestFailed




ICS PC



ICS PC

DIMG D3 5A Front CCITT Not Fitted "Fitted/Not Fitted ErrorsFlow"

DIMG D3 5B Rear CCITT Not Fitted "Fitted/Not Fitted ErrorsFlow"



Dual Image M&D Procedures

CautionWhen you service the dual image camera module, be sure that the internal cablesdo not become partially unseated. Also, be sure that no switches areunintentionally disturbed. The switches on the CAR Interface (BusLogic) PCBA arelocated along the top edge and are especially vulnerable. Before returning thedual image camera module to operation, you must fully seat and secure anyPCBAs that you disturbed during service. In addition, be sure that all externalcables are properly secured.

To use this flow, proceed as follows:

1. Execute the NDP Power On Confidence (POC) tests.

2. The POC error code should identify the faulty FRU or direct you to investigate anotherpart of the machine.

3. After replacing a FRU, power the track off and on to ensure correct operation.

4. Run the exerciser to verify performance.



Front Normalizer Framer Not Found or FrontNormalizer Framer CI Errors Flow

Table 22–19. Front Normalizer Framer Not Found or Front Normalizer Framer CI ErrorsFlow

Next Step

Step Action Response Yes No

10 Power off the track.

Check the image interface cable atboth ends for bent pins, pinchedcable, or poor connections.

Are there any visible signs ofdamage?

F10 20

20 Reconnect the image interfacecable.

Power on the track.

Does the same error code occur? 30 Exit theflow.


Swap the front Normalizer FramerPCBA with the rear PCBA.

Power on the track.

Does the same error code occur? 40 F1


Replace the image interface cable.

Power on the track.



Remove all boards except the frontNormalizer Framer PCBA.

Power on the track.

Does the same error code occur? 60 120

60 Check the power LED on theNormalizer Framer PCBA.

Is the power LED on? 65 100

65 Measure +5 V on the backplanebetween the inboard terminals ofany pair of adjacent capacitorsaround the perimeter of thebackplane.

Is the voltage between 4.90 and5.10 V?

70 100

70 Replace the front digital cameracable (JF610).


80 Replace the front camera. Does the same error code occur? F5 Exit theflow.




Next Step


100 Power down the sorter and turnthe image main breaker off to cutpower to the image gate.

Remove the DC power harness(two connectors) from thebackplane.

Turn the image main breaker onand power up the sorter.

Caution

This is a high-current connection.Current can exceed 100 amps.Injury or death may result fromaccidental electrocution.

Measure the DC voltage across thebus bars at the power supply

Is the voltage between 4 and 5VDC?

F5 110


Remove the power harnesses fromthe supply terminals.


Caution


Measure the +5 V DC voltage onthe Logic/lamps supply.


Repair/ReplaceF34

F20


Reseat all previously removedPCBAs on the failing side of theimage electronics gate, one at atime.

Power on the track.

Does the same failure occur? 140 130




Next Step


130 Does the system have a CARmodule? If so, reseat the CARPCBA.

Does the same failure occur? NDP 1150:F3NDP 1825:F4

Exit theflow.


Replace the last PCBA that wasreseated in the gate.

Exit theflow.

Exit theflow.



Rear Normalizer Framer Not Found or RearNormalizer Framer CI Errors Flow

Table 22–20. Rear Normalizer Framer Not Found or Rear Normalizer Framer CI ErrorsFlow

Next Step



Check the image interface cable atboth ends for bent pins, pinchedcable, or poor connections.


F10 20


Power on the track.



Swap the front Normalizer FramerPCBA with the rear PCBA.

Power on the track.




Power on the track.



Remove all boards except the frontand rear Normalizer FramerPCBAs.

Power on the track.

Does the same error code occur? 60 120

60 Check the power LED on the frontNormalizer Framer PCBA.

Is the power LED on? 65 100

65 Measure +5 V on the backplanebetween the inboard terminals ofany pair of adjacent capacitorsaround the perimeter of thebackplane.

Is the voltage between 4.90 and5.10 V?

70 100

70 Replace the rear digital cameracable (JB610).


80 Replace the rear camera. Does the same error code occur? F5 Exit theflow.




Next Step



Remove the DC power harness(two connectors) from thebackplane.


Caution


Measure the DC voltage across thebus bars at the power supply.


F5 110


Remove the power harnesses fromthe supply terminals.


Caution


Measure the +5 V DC voltage onthe Logic/lamps supply.


PowerSupplyDiagnosticFlow

F20


Reseat all previously removedPCBAs on the failing side of theimage electronics gate, one at atime.

Power on the track.

Does the same failure occur? 140 130




Next Step


130 Does the system have a CARmodule? If so, reseat the CARPCBA.

Does the same failure occur? NDP 1150:F3NDP 1825:F4

Exit theflow.


Replace the last PCBA that wasreseated in the gate.

Exit theflow.

Exit theflow.

Image Bus Test Failure Flow

Table 22–21. Image Bus Test Failure Flow

Next Step


210 Power off the sorter.

Remove the all PCBAs except forthe front Normalizer Framer PCBA.

Power on the sorter.

Does the original error codeoccur?

F1(primaryFRU)

F5(secondaryFRU)

220


Insert one of the PCBAs removedin step 210.


Does the original error code occuragain?

Replace thelast PCBAinserted

230

230 Have all the PCBAs beenreinserted?

Exit the flow. 220



CAR Port Not Found or CAR Port CI Errors Flow

Table 22–22. CAR Port Not Found or CAR Port CI Errors Flow

Next Step



Reseat the CAR Port PCBA.

Power on the track.


820 Remove the front panel from theimage camera module.

Check for any shorts or connectionproblems on the backplane in thearea of the failing slot.

Are there any visible problems? F5 NDP 1150:F3NDP 1825:F4



White Digital-to-Analog Converter and AnalogInterface Failure Flow

Table 22–23. White Digital-to-Analog Converter and Analog Interface Failure Flow

Next Step


1610 Power up the track.

Measure the voltage on the frontand rear linear supply.

Are the +13.5 VDC and -12 VDCvoltages within +/- 0.1 volts".

For NDP1150-4X are the +13.5VDC and -12 VDC voltages within+/- 0.1volts.

For NDP1825-4X are the +15 VDCand -12 VDC voltages within +/-0.1 volts.

1620 F20

1620 Power down the track.

Remove the digital camera cablefrom the camera connector.

Power on the track.

Carefully measure the voltagebetween pins 16 and 17 (+13.5VDC to analog ground).

Measure the voltage between pins13 and 14 (–12 VDC to analogground.)

Are the voltages within ± 0.1 V? 1630 F9


Check both ends of the digitalcamera cable for bent pins and forpinched or frayed wire.

Reconnect the cable, and poweron the track.

Does the same error code occur? F6(primaryFRU)

F1(secondaryFRU)

Exit theflow.



CAR Module POC Failure Flow

Table 22–24. CAR Module POC Failure Flow

Next Step


2210 Press Shift+Ctrl+Esc on the imagecapture server keyboard to displaythe Windows NT task manager.

Select the Application tab, highlightthe Common CAR task, and clickon the "Switch To" button.

Press the F1 key to view the MTRRoutines menu.

Press the F2 key to view the POCResults Screen.

Press the F1 key to execute thePOC Results MTR.

Follow the CAR diagnostic flow inSection 24.



CAR SCSI Communication Failure Flow

Table 22–25. CAR SCSI Communication Failure Flow

Next Step


2410 Power off the sorter to power offthe CAR option.

Shutdown the ICS.

Disconnect and check the CARSCSI cable at both ends for bentpins, pinched cables, or poorconnections.

Reconnect the SCSI cable at bothends.

Power on the sorter; then poweron the ICS.


2420 Power off the sorter to power offthe CAR option.

Shutdown the ICS.

Remove the ICS cover to gainaccess to the SCSI PCBA for CAR.

Disconnect the CAR SCSI cablefrom the ICS, and reseat the CARSCSI PCBA.

Reconnect the CAR SCSI cable.



2430 Examine the LED on the CAR SCSIPCBA.

Is the LED blinking? 2440 F19

2440 Verify that the CAR unit is receivingpower.

For the NDP 1150, remove therear cover from the first eight-pocket module so that the frontside of the CAR unit PCBAs isvisible.

For the NDP 1825, remove thefront cover of the external CAR boxso that the front side of the CARunit PCBAs is visible.


Are at least some of the LEDsalong the front edge of the CARunit PCBAs illuminated?

2450 Follow theCARdiagnosticflows(Section24)



Table 22–25. CAR SCSI Communication Failure Flow

Next Step


2450 Wait approximately 4 minutes afterpowering on the sorter and theICS.

Is the timeout LED on the side ofthe CAR unit illuminated?

F19 Follow theCARdiagnosticflows(Section24)



Image Interface Communication Failure Flow

Table 22–26. Image Interface Communication Failure Flow

Next Step


2610 Power off the ICS.

Remove the cover from the imagecapture server.

Reseat the PCI Image Interfaceboard.

Power on the ICS.


2620 Power off the ICS.

Replace the PCI Image Interfaceboard.

Verify the operation. Exit theflow.



Camera Resolution Incorrect Flow

Table 22–27. Camera Resolution Incorrect Flow

Next Step



Use an editor to view theconfiguration file dpimgcfg.ini onthe ICS. The file is in theC:\dpimage directory.

Locate "FrontCamera1Resolution","FrontCamera2Resolution", and"RearCamera1Resolution".

Do the resolution values in theconfiguration file and the camerascompare favorably?

3025 3020

3020 Change the resolution in theconfiguration file to match thevalue indicated by the camera.


3025 Is this an NDP 1150? 3030 F32


Check the digital camera cable onthe camera and on the imagecamera module backplane for bentpins.

Reseat the cable.

Power on the track.



Replace the digital camera cable.

Power on the track.



Replace the affected Camera.

Power on the track.

Does the same error code occur? F1 Exit theflow.



Configuration and Parameter File Access FailuresFlow

Table 22–28. Configuration and Parameter File Access Failures Flow

Next Step


3610 Start Windows NT Explorer on theImage Capture Server and changethe directory to C:\DPIMAGE.

Inspect the directory list and verifythat each file in Table 22–29 isincluded.

Do all the files exist? 3620 3640

3620 Check the disk drive space on theC: drive of the ICS.

Does the disk have over 500Kbytes available?

3640 Callsoftwaresupport.

3640 Reinstall the ICS system software.

Power off the transport, and thenpower it on.

Does the same error code occur? Callsoftwaresupport.

Exit theflow.

Table 22–29. Data File List

File Name File Name File Name

CAR.IMG FRONT1.TBL DPIMGPAR.INI

AT_LUT.MTR REAR1.CFG FRNT0101.INI

SV_LUT.MTR REAR1.TBL FRNT0201.INI

CAL.INI CMPMTR.INI REAR0101.INI

FRONT1.CFG DPIMGCFG.INI REAR0201.INI



Compressor Not Found or Compressor CI ErrorsFlow

Table 22–30. Compressor Not Found or Compressor CI Errors Flow

Next Step


4200 Make note of the error details. Does the error refer to the CCITTCompressor PCBA?

4210 4240


Move the CCITT Compressor PCBAto the JPEG slot on the failing sideof the gate.

Power up the sorter.

Does the same error code occur? F33 4220



Are there any visible problems? F5 4230


Move the CCITT Compressor PCBAback to the original slot.




Move the JPEG Compressor PCBAto the CCITT slot on the failing sideof the gate.


Does the same error code occur? F28 4250



Are there any visible problems? F5 4260


Move the JPEG Compressor PCBAback to the original slot.





Slot Errors Flow

Table 22–31. Slot Errors Flow

Next Step


4320 Power down the sorter.

Verify that all PCBA(s) are in thecorrect slot using the “Image SlotLocation Table” later in thissection.

Are all PCBA(s) in the correct slot? 4340 4330

4330 Insert the PCBA(s) in the correctslot.

Exit the flow.

4340 Check the connectors, and reseatall PCBA(s).




Replace the PCBA(s) referenced inthe error detail.





Fitted/Not Fitted Errors Flow

Table 22–32. Fitted/Not Fitted Errors Flow

Next Step



Verify that all PCBAs are in thecorrect slot using the “Image SlotLocation Table” next in thissection.

Are all PCBAs in the correct slot? 4440 4430

4430 Insert the PCBA(s) in the correctslot.

Exit the flow.

4440 Verify that the NDP1150 andimage capture server configurationfiles are correctly showing theimage compressor configuration(for example, dual image present,front compressor type, modulelevel).




Replace the PCBA(s) referenced inthe error detail.





High Speed Digitizer Not Found or High SpeedDigitizer CI Errors Flow

Table 22–33. High Speed Digitizer Not Found or High Speed Digitizer CI Errors Flow

Next Step



Check the image interface cable atboth ends for bent pins, pinchedcables, or poor connections.


F10 4520





Swap the front High SpeedDigitizer PCBA with the rear HighSpeed Digitizer PCBA.








Remove all PCBAs from the gateexcept the front Normalizer Framerand the High Speed Digitizer inquestion.




Replace the High Speed Digitizer inquestion.



Replace the front NormalizerFramer.





Table 22–33. High Speed Digitizer Not Found or High Speed Digitizer CI Errors Flow

Next Step



Shutdown the image captureserver, and remove its cover.

Reseat the PCI Image InterfacePCBA.




Shutdown the image captureserver, and remove its cover.

Replace the PCI Image InterfacePCBA.





Image Slot Locations

Figure 22–1. Card Locator - NDP 1150 Dual Image



Figure 22–2. Card Locator - NDP 1825 Dual Image



Dual Image Camera Module Fault Code List

Fault Code Field Replacement Unit

F1 Normalizer Framer PCBA

F3 Turbo CAR Port PCBA

F4 CAR Port PCBA

F5 Backplane (image gate)

F6 Front Camera

F7 Photo Sensor Assembly

F8 Lamp Control PCBA

F9 Digital camera cable

F10 Image Interface cable (ICS to image gate)

F12 Lamp Power Supply

F19 SCSI PCBA

F20 Power Supply - camera

F26 SCSI cable (ICS to CAR module)

F28 JPEG Compressor PCBA

F29 PCI Image Interface PCBA

F31 Rear Camera

F32 High Speed Digitizer PCBA

F33 CCITT Compressor PCBA

F34 DC Power Harness (connects logic/lamp powersupply to the image gate backplane)


Section 23 High Speed Encoder Module

Review the following information before using these procedures:

• In the Fault Code Definition section of this manual, if a Flow Step number is given fora fault code, follow the Flow Step. Otherwise, refer to the FRU column.

• All levels are TTL unless otherwise noted.

• After replacing a FRU, make sure that you perform the respective test and adjustments(T&As) before executing the MTR or exerciser. These T&As are included in theNetwork Document Processor (NDP) Field Test and Reference Document.

• You must bypass the cover interlock switches and open the front door to use thekeypad.

• Check to make sure that, on any board FRU that contains fuses, the fuses are of propervalue and in good condition.

High Speed Encoder Module


Using the Maintenance KeypadTo aid in diagnostics, a hand-held maintenance keypad and display unit can be connectedto the HSEM. The keypad is used to test only the HSEM printer assembly. Other testsmust be run through MTRs, which are initiated from the NDP PC.

Note: The handheld maintenance keypad and display unit described here is the same

unit that is used on the NDP 250/NDP 500 HSEM.

To access the port into which the maintenance keypad must be connected, you mustremove the rear module panel.

The keypad/display unit is inactive when the HSEM is in operational mode while themodule cover is closed. In maintenance mode, the keypad is available for input, and thedisplay presents messages. After use, disconnect the maintenance keypad and restore allinterlocks to their normal operating position. At that point, the HSEM is returned tooperational mode, and is ready to transport and encode documents.



Figure 23-1 shows the maintenance keypad and display.

Legend1. Display

2. Keypad

3. Connecting ribbon cable

Figure 23–1. HSEM Hand-held Maintenance Keypad and Display Unit

Keypad

The CSE uses the keypad to perform maintenance operations on the encoder in the off-linemaintenance mode. The keypad uses 16 keys to communicate with the printer:

• Digits 0 through 9

• Up and down arrow keys

• ��, ��, , and �� keys

Display

The maintenance display is a 16 character liquid crystal display (LCD) window, and showsthe message �� in the maintenance mode. The CSE can chooseverification procedures to perform on the encoder by pressing the up or down arrow keyswhen the �� message displays. The display shows a menu, oneselection at a time, and allows the CSE to scroll through the menu or to select averification procedure to perform. Displayed messages must be understandable by theUnisys service representative. Messages must give direction or refer to easily retrievableinformation.



POC/MTR Error Display"Test Number Fault Codes" for the High Speed Encoder Module are generated by PowerOn Confidence (POC) tests as well as Maintenance Test Routines (MTR). For POC errors,the "Manual Procedure" field in the exception handler display indexes the "Test NumberFault Code." For an example, see Figure 23-2.

Figure 23–2. POC Error Display

For MTR failures, the "Manual Procedures" column in the "Test Results" grid indexes theTest Number Fault Code." For an example, see Figure 23-3.



Figure 23–3. MTR Error Display



HSEM Diagnostic FlowsThis subsection defines the fault codes, describes the manual procedures, and identifiesthe field replacement units (FRUs). At the end of this subsection are the HSEM Fault CodeList and FRU Description and a list of HSEM tests.

HSEM Fault Code Definitions (HSEM xxxx)

Table 23–1. HSEM Fault Code Definitions (HSEM xxxx)


(HEX) Flow Step Fault Description FRU

HSEM 0101 01100 Common controller NVRAM checksum failure B5

HSEM 0102 Common controller NVRAM read/write failure B5

HSEM 0201 02100 Printer bus failure B5, B3

HSEM 0202 02200 Skew/height sensor bus failure B5, B7, B8

HSEM 0602 Servo sensor level failure B6, B5

HSEM 0603 Dog-ear sensor level failure B6

HSEM 0604 Stop sensor level failure B6, B5

HSEM 0702 Servo sensor receive failure B6

HSEM 0703 Dog-ear sensor receive failure B6

HSEM 0704 Stop sensor receive failure B6

HSEM 0802 Servo sensor failure S3, (cables J6-J27), B12

HSEM 0803 Dog-ear sensor failure S2, (cables J6-J27), B12

HSEM 0804 Stop sensor failure S4, (cables J3-J27), B12

HSEM 0901 09100 AC power bit not set

HSEM 0902 09200 Cover interlock open

HSEM 0903 Return Module MTR switch to RUN position

HSEM 0905 Servo motor control bit set. B6, B8

HSEM 0906 Ribbon motor control bit clear. B6, B4

HSEM 0907 Drum motor control bit set. B6, P1

HSEM 0909 Servo motor control bit clear. B6, B8

HSEM 090A Ribbon motor control bit clear. B6, B4

HSEM 090B Drum motor control bit clear. B6, B4






HSEM 0A01 Cannot clear interrupt B5

HSEM 0A02 0A200 No servo sensor interrupt. B5, B6

HSEM 0A03 0A300 No skew/height sensor interrupt. B5, B7

HSEM 0A04 20100 Printer timeout B3, B5

HSEM 0A05 20200 Printer data transfer error B3, B5

HSEM 0A06 No Printer READY bit B5

HSEM 0C01 09200 HSEM cover open B5, B6, I1, I2

HSEM 0C02 0C200 Skew/height sensor bus failure B5, B7, B8

HSEM 0C03 0C300 Skew/height sensor failure B7, S10

HSEM 0C04 0C400 Skew/height sensor trigger failure B5, B7

HSEM 0D01 Skew sensor not compensated B7, S10

HSEM 0D02 Skew sensor voltage too large B7, S10

HSEM 0D03 Skew sensor voltage too small B7, S10

HSEM 0E01 0E100 Servo clock failure B5, B8, B12, M1,J27, J1

HSEM 0E02 0E200 Servo adjustment failure B5, B8

HSEM 0F01 0E200 Servo velocity error

HSEM 0F02 0F100 Fewer than 32 documents processed

HSEM 1001 10100 Servo ±24 V failure B5, B8, P1

HSEM 1002 10200 Servo CCAPDR failure B5, B8

HSEM 1101 11100 Servo power driver failure B5, B9

HSEM 1201 12100 CTACK failure B5, B8, B12, (J14-J27), (J1-M1), M1

HSEM 1202 12200 Gap adjustment failure B8, B7

HSEM 1203 SPDREF failure B7, B8

HSEM 1204 Servo profile failure B8, B5, B9

HSEM 1901 19100 Common controller/printer control signal error B3, B5

HSEM 1902 Common controller/printer data transfer error B3

HSEM 1B03 1B100 Dog-ear sensor stuck covered B6, S2, B5

HSEM 1B04 1B100 Dog-ear sensor stuck uncovered B6, S2, B5

HSEM 1B05 1B100 Servo sensor stuck covered B6, S3, B5






HSEM 1B06 1B100 Servo sensor stuck uncovered B6,S3, B5

HSEM 1B07 1B100 Stop sensor stuck covered B6, S4, B5

HSEM 1B08 1B100 Stop sensor stuck uncovered B6, S4, B5

HSEM 1C01 09200 HSEM cover open B5, B6, I1, I2

HSEM 1D01 1D100 Skew sensor data error

HSEM 1D02 ID200 Skew table calibration: gauge readings notcomplete

HSEM 1E01 09200 HSEM cover open B5, B6, I1, I2

HSEM 1E02 1E200 Skew table calibration: skew/height notcompensated

HSEM 2001 20100 Printer timeout B3, B5

HSEM 2002 20200 Printer data transfer error B3, B5

HSEM 2003 Printer microprocessor instruction set failure B3



HSEM 2103 Printer microprocessor firmware PROM checksumfailure

B3

HSEM 2104 Printer microprocessor MTR PROM checksumfailure

B3



HSEM 2203 Printer microprocessor RAM failure B3



HSEM 2303 23100 Printer microprocessor NVRAM check sum failure B3

HSEM 2304 Printer microprocessor NVRAM read/write failure B3



HSEM 2403 Printer data bus failure B3, B5

HSEM 2404 Parallel interface control failure B3, B5








HSEM 2503 Ribbon skew sensor signal failure B3

HSEM 2504 25040 HMFIREXN failure

HSEM 2506 RIBVMTR or VERDATAX failure B3

HSEM 2507 25070 Cannot set VERCLKIN

HSEM 2508 Cannot reset VERCLKIN B3

HSEM 2509 25090 X-Y bus failure

HSEM 250A 250A0 Port 9002 bus failure

HSEM 250B 250B0 RIBBONCLK or RIBBONEN failure

HSEM 250C Upper nibble of port 9003 failure B3

HSEM 250D 250D0 Port A000 bus failure

HSEM 250E Port A000 control failure B3

HSEM 250F 250F0 Port A001 bus failure

HSEM 2510 Port A001 control failure B3

HSEM 2511 Upper nibble of Port A003 failure B3

HSEM 2512 25120 HMRRST signal failure

HSEM 2513 25130 FLTTIME1 failure

HSEM 2514 Ready signal failure B3

HSEM 2515 25150 FLTTIME2 signal failure



HSEM 2803 28100 Failure to turn on HAMMER MON1 B2, B3

HSEM 2804 28100 Failure to turn off HAMMER MON1 B2, B3

HSEM 2805 28100 Failure to turn on HAMMER MON2 B1, B3

HSEM 2806 28100 Failure to turn off HAMMER MON2 B1, B3

HSEM 2807 28500 CTRLHSUP is not set B1, B2, B3

HSEM 2808 28500 CTRLHSUP is not clear B1, B2, B3



HSEM 2903 29100 Failure hammer clock "frequency" 1A B2, B3

HSEM 2904 29100 Failure hammer clock "frequency" 1B B2, B3






HSEM 2905 29100 Failure hammer clock "frequency" 2A B1, B3

HSEM 2906 29100 Failure hammer clock "frequency" 2B B1, B3

HSEM 2A01 20100 Printer timeout B3, B5

HSEM 2A02 20200 Printer data transfer error B3, B5

HSEM 2A03 2A100 Voltage failure hammer 1 B2, B3, B10, H1







HSEM 2A0A 2A100 Voltage failure hammer 8 B1, B3, B10, H1

HSEM 2A0B 2A100 Voltage failure hammer 9 B2, B3, B10, H1

HSEM 2A0C 2A100 Voltage failure hammer 10 B1, B3, B10, H1

HSEM 2A0D 2A100 Voltage failure hammer 11 B2, B3, B10, H1

HSEM 2A0E 2A100 Voltage failure hammer 12 B1, B3, B10, H1

HSEM 2A0F 2A100 Voltage failure hammer 13 B2, B3, B10, H1

HSEM 2A10 2A100 Voltage failure hammer 14 B1, B3, B10 , H1



HSEM 2A13 2A120 Voltage failure bank 1 or banks 1 and 3 B2, B10, H1

HSEM 2A14 2A120 Voltage failure bank 2 or banks 2 & 4 B1, B10, H1

HSEM 2A15 2A120 Voltage failure in bank 3 B2, B10, H1

HSEM 2A16 2A120 Voltage failure in bank 4 B1. B10, H1

HSEM 2A17 2A140 Voltage failure in all hammers B3, B11, P1

HSEM 2A18 Voltage failure banks 1 & 2 B3

HSEM 2A19 Voltage failure banks 3 & 4 B3

HSEM 2B01 20100 Printer timeout B3, B5

HSEM 2B02 20200 Printer data transfer error B3, B5

HSEM 2B03 2B100 Hammer 1 no movement B3, B2












HSEM 2B0A 2B100 Hammer 8 no movement B3, B1

HSEM 2B0B 2B100 Hammer 9 no movement B3, B2

HSEM 2B0C 2B100 Hammer 10 no movement B3, B1

HSEM 2B0D 2B100 Hammer 11 no movement B3, B2

HSEM 2B0E 2B100 Hammer 12 no movement B3, B1

HSEM 2B0F 2B100 Hammer 13 no movement B3, B2




HSEM 2B13 2B200 Failure in cusp detect of odd hammers B3, B2

HSEM 2B14 2B200 Failure in cusp detect of even hammers B3, B1

HSEM 2B15 Failure to maintain 48v during a hammer fire B1 & B2

HSEM 2C01 20100 Printer timeout B3, B5

HSEM 2C02 20200 Printer data transfer error B3, B5

HSEM 2C03 2C100 Improper VCL hammer #1 B2, B1, B3

HSEM 2C04 2C100 Improper VCL hammer #2 B1, B3






HSEM 2C0A 2C100 Improper VCL hammer #8 B1, B3

HSEM 2C0B 2C100 Improper VCL hammer #9 B2, B3

HSEM 2C0C 2C100 Improper VCL hammer #10 B1, B3






HSEM 2C0D 2C100 Improper VCL hammer #11 B2, B3

HSEM 2C0E 2C100 Improper VCL hammer #12 B1, B3

HSEM 2C0F 2C100 Improper VCL hammer #13 B2, B3




HSEM 2D01 20100 Printer timeout B3, B5

HSEM 2D02 20200 Printer data transfer error B3, B5

HSEM 2D03 2D100 Stepper voltage failure B4, P1

HSEM 2D04 2D200 Stepper phase failure B4, M5

HSEM 2E01 20100 Printer timeout B3, B5

HSEM 2E02 20200 Printer data transfer error B3, B5

HSEM 2F01 20100 Printer timeout B3, B5

HSEM 2F02 20200 Printer data transfer error B3, B5

HSEM 2F03 2F100 No current in ribbon skew sensors LEDs S11, B3, B7

HSEM 2F04 2F200 Ribbon skew left warning sensor failure B7, B3, S11

HSEM 2F05 2F300 Ribbon skew right warning sensor failure B7, B3, S11

HSEM 2F06 2F400 Ribbon skew left fail sensor failure B7, B3, S11

HSEM 2F07 2F500 Ribbon skew right fail sensor failure B7, B3, S11

HSEM 2F08 Ribbon skew right warning and left warningsensors failed

B7

HSEM 2F09 Ribbon skew right fail and left fail sensors failed B7

HSEM 2F0A Ribbon skew right warning and left fail sensorsfailure

B7

HSEM 2F0B Ribbon skew right fail and left warning sensorsfailed

B7



HSEM 3203 Ribbon motion counter did not clear. B3

HSEM 3204 32400 Ribbon motion not at zero

HSEM 3205 Ribbon motion counter did not count. B3






HSEM 3206 Not used

HSEM 3207 32700 Low ribbon clocks detected.

HSEM 3208 VERDATA1 did not clear. B4, B3, HSEMcover/door open

HSEM 3209 32900 VERDATA1 did not set by movement of take-upmotor with applied current.

HSEM 320A VERDATA1 was set without current to take-upmotor.

B4, HSEMcover/door open



HSEM 3303 33300 Drum index failure

HSEM 3304 33400 Drum index frequency failure

HSEM 3305 33500 Drum character clock failure

HSEM 3306 33600 Character clock frequency failure





Main Diagnostic Flow

Table 23–2. Main Diagnostic Flow

Next Step


01100 Execute the following T&As:

Servo Velocity AdjustmentServo Slip ReferenceSkew Sensor Calibration

Power down the sorter. Power up thesorter. Observe the HSEM fault code.

Is the HSEM fault codeHSEM 0101?

B5 01101

01101 Use the NDP 1XXX diagnosticprocedures to diagnose any new faults.

02100 Power down the HSEM. Remove FRU B3.Power up the HSEM. Observe the HSEMfault code.


B5 B3



02201 B7



B5 B8

09100 Observe PB 48 signal ACOK on thesensor power control (B6).

Is the signal a logic 1? B6 09110

09110 Primary suspect: AC power supply

Secondary suspect: (B6)

09200 Observe the HSEM cover. Is the cover closed? 09210 09220

09210 Observe PA 36 signal CVRS-NC on thesensor power control (B6).

Is the signal a logic 0? B6 09230

09220 Close the HSEM cover and rerun thePOC.

09230 Make sure that the cover interlock switchis adjusted properly when the cover isclosed.

Is the switch adjusted properly? 09231 09232

09231 Primary suspect: (I1)

Secondary suspect: Cable J1-AC exportharness

09232 Adjust the covers interlock switch. Rerunthe POC.




Next Step


0A200 Observe signal PB 21 of commoncontroller (B5). Loop the HSEM-Servo-Skew Interrupt test.

Does the signal toggle? B5 B6

0A300 Observe signal PA 41 of commoncontroller (B5). Loop the HSEM-Servo-Skew Interrupt test.


0C200 Observe signal PB 15 of skew sensor(B7). Loop the HSEM-Skew Sensors test.

Does the signal toggle? 0C201 B5

0C201 Observe signal PA 21 of skew sensor(B7).


0C202 Observe signal PA 14 of skew sensor(B7).


0C203 Remove the Servo Amplifier board (B8).Run the HSEM skew sensors-test.

Does the test pass? B8 B7

0C300 Observe signal PA 16 of skew sensor(B7). Loop the HSEM Skew Sensors-test.


0C400 Observe signal PA 39 of skew sensor(B7). Loop the HSEM Skew Sensorstest.


0E100 Loop the HSEM Servo-Velocity Adjusttest. Observe PA 29 &30 on the ServoAmp board (B8).

Do the signals toggle? 0E101 J27, J1,B12,M1

0E101 Observe PA 40&41 on the Servo Ampboard (B8).

Do the signals toggle? B5 B8

0E200 Loop the HSEM Servo-Velocity Adjusttest. Observe PA 49 on the CommonController board (B5).


0F100 Fewer than 32 documents were passedthrough the HSEM while the servo slipreference was active. Repeat the test.

10100 Observe PA 13 on the Servo Amp board(B8).

Is this signal low? B5 10101

10101 Measure ±24 and 5 V to the Servo Ampboard (B8) at the backplane.

Are all voltages present? B8 P1

10200 Loop the HSEM Servo-Voltage Monitortest. Observe PA 34 on the Servo Ampboard (B8).

Does the signal toggle? 10201 B8






Next Step


11100 Loop the HSEM Servo Driver -VoltageMonitor test. Observe PA 46 on theServo Driver board (B9).


12100 Loop the HSEM Servo Normal Mode test.Observe PA 31 on the Servo Amp board(B8).

Does the signal toggle? B5 12101


Does the signal toggle? B8 12101A

12101A Observe pin 5 of J1 on the PrinterInterface board (CHA).

Does the signal toggle? 12101B M1, J1

12101B Observe pin 1 of J1 on the PrinterInterface board (CHB).

Does the signal toggle? 12101C

M1, J1

12101C Observe pin A29 on the Servo Ampboard (CHA).

Does the signal toggle? 12101D

B12

12101D Observe pin A30 on the Servo Ampboard (CHB).


12102 Observe pin 7 of J1 on the PrinterInterface board (B12).

Does the signal toggle? B12,J27

M1, J1

12200 Loop the HSEM Servo-Normal Mode test.Observe PB 28 on the Servo Amp board(B8).

Does the signal show a sign oflife?

B8 B7

19100 Loop the HSEM - Echo test. Observesignal PA 16 of the Common Controllerboard (B5).


19101 Observe signal PA 13 of the CommonController board (B5).






1B100 Run the HSEM Track sensors CurrentMonitor test, the HSEM Track SensorsInput Simulation test, and the HSEMTrack Sensors Normal Mode test todiagnose this fault.

1D100 The data entered conflicts with readingstaken. Rerun the T&A.




Next Step


1D200 Calculate Skew table (1D)(HSEM Skew"Table Calibration") has been executedbefore the rest of the T&A wascompleted. Refer to T&A Skew SensorCalibration for the proper executionorder.

1E200 Skew Table Calibration (1E) has beenexecuted before the rest of the T&Ascompleted. Refer to T&A Skew SensorCalibration for the proper executionorder.

20100 Run the HSEM Echo test to diagnose thisfault.

20200 Run test 7524 (HSEM Printer - Ext. BusWrap test) from the HSEM keypad.

Does the display show FAILED752403?

B3 B5

23100 Execute the following HSEM T&As:

Hammer Flight Time adjustmentCharacter Phase Adjustment

Power down the HSEM. Power up theHSEM. Observe the HSEM fault code.


B3 23101

23101 Use the NDP 1XXX diagnosticprocedures to diagnose any new faults.

25040 Turn off the HSEM power, and removeboth Analog positive boards (B1 & B2).

Turn on the HSEM power, and run theHSEM Printer External Control SignalWrap-Around test.

Does the same fault codeHSEM 2504 occur again?

B3 25041

25041 Turn off the HSEM power, and install theAnalog VE board B1. Turn on the power,and run the HSEM Printer ExternalControl Signal Wrap-Around test.


B1 B2

25070 Turn off the HSEM power, and removeB2. Turn on the HSEM power, and runthe HSEM Printer External Control SignalWrap-Around test.


B3 B2



25091 B1




Next Step




B3 B2

250A0 Turn off the HSEM power, and removeB4 (ribbon control). Turn on the HSEMpower, and run the HSEM printer ExternalControl Signal Wrap-Around test.

Does the same fault codeHSEM 250A occur again?

250A1 B4

250A1 Turn off the HSEM power, and removeB2. Turn on the HSEM power, and runthe HSEM Printer External Control SignalWrap-Around test.


250A2 B2

250A2 Turn off the HSEM power, and removeB2. Turn on the HSEM power, and runthe HSEM Printer External Control SignalWrap-Around test.


B3 250A3

250A3 Observe the fault code. Did the same fault codeHSEM 2515 occur?

B3 B1

250B0 Turn off the HSEM power, and removeB4 (ribbon control). Turn on the HSEMpower, and run the HSEM Printer ExternalControl Signal Wrap-Around test.

Does the same fault codeHSEM 250B occur again?

B3 B4

250D0 Turn off the HSEM power, and removethe top frontplane connector between theB3 and B1 boards. Remove the bottomfrontplane connector between the B2 andB1 boards. Turn on the HSEM power,and run the HSEM Printer ExternalControl Signal Wrap-Around test.

Does the same fault codeHSEM 250D occur again?

B3 250D1

250D1 Turn off the HSEM power, and install thebottom frontplane connector between theB3 and B1 boards. Turn on the HSEMpower, and run the HSEM Printer ExternalControl Signal Wrap-Around test.

Does the same fault codeHSEM 250D occur again?

B1 B2‘

250F0 Turn off the HSEM power, and removethe top frontplane connector between theB3 and B1 boards. Remove the bottomfrontplane connector between the B2 andB1 boards. Turn on the HSEM power,and run the HSEM Printer ExternalControl Signal Wrap-Around test.

Does the same fault codeHSEM 250F occur again?

B3 250F1




Next Step


250F1 Turn off the HSEM power, and removethe bottom frontplane connector betweenthe B3 and B1 boards. Turn on theHSEM power, and run the HSEM PrinterExternal Control Signal Wrap-Around test.

Does the same fault codeHSEM 250F occur again?

B1 B2

25120 Turn off the HSEM power, and removeboth B1 and B2 boards. Turn on theHSEM power, and run the HSEM PrinterExternal Control Signal Wrap-Around test.


B3 25121

25121 Turn off the HSEM power, and install B1.Turn on the HSEM power, and run theHSEM Printer External Control SignalWrap-Around test.


B1 B2

B25130 Turn off the HSEM power, and removeB2. Turn on the HSEM power, and runthe HSEM Printer External Control SignalWrap-Around test.


B3 B2



B3 B1

28100 Loop the HSEM Hammer - Supply Monitortest. Swap the Analog VE boards (B1and B2), and observe the fault code.

Did the fault code follow theAnalog board?

28101 B3

28101 Replace the Analog VE board (B2) if thefault code is 3 or 4.

Replace the Analog VE Even board (B1)board if the fault code is 5 or 6.

28500 Loop the HSEM Hammer Supply Monitortest. Observe PB 13 on the PrinterMicroprocessor board (B3).

Does the signal toggle? B3 28501

28501 Remove the Analog VE Even board (B1). Does the signal toggle? B1 B2

29100 Loop the HSEM Hammer ClockVerification test. Swap Analog VEboards, and observe the fault code.


28101 B3

2A100 Loop the HSEM Hammer Voltage Monitortest. Swap Analog VE boards, andobserve the fault code. Ensure that bothfrontplane connectors are on firmly.


2A101 2A102




Next Step


2A101 Replace the B2 board if the fault code isodd, or replace the B1 board if the faultcode is even.

2A102 Swap hammer bank connections at theHammer Interconnect board (B10) withone of the other three hammer banks.

Did the fault code follow thehammer bank?

H1 2A103

2A103 Measure the signal at the appropriatefrontplane pin (HMMON signals 1-16) onthe Printer Microprocessor board (B3).

Does the signal toggle? B3 2A104

2A104 Check the continuity of the appropriatehammer from the hammer interconnectboard (B10) to the backplane (coil signals1-16).

2A120 Loop the HSEM Hammer Volt Monitortest. Swap Analog VE boards, andobserve the fault code. Ensure that bothfrontplane connectors are on firmly.


2A121 2A122

2A121 Replace the Analog VE board odd (B2) ifthe fault code is 11 or 13. Replace theeven board (B1) if the fault code is 12 or14.

2A122 Check the connections at the HammerInterconnect board (B10).

2A140 Loop the HSEM Hammer - Volt Monitortest. Measure the 48 volts at thehammer interconnect board (B10).Ensure that both frontplane connectorsare on firmly.

Is the voltage 48 V at theboard?

B3 2A141

2A141 Measure the 48 volts at the power supply(P1).

Is the voltage 48 volts at thepower supply?

B11 P1

2B100 Loop the HSEM Hammer - Impact Monitortest. Swap Analog VE boards andobserve fault code. Ensure that bothfrontplane connectors are on firmly.


2B121 B3

2B121 Replace the odd Analog VE board (B2) ifthe fault code is odd, or replace the evenAnalog VE board (B1) if the fault code iseven.




Next Step


2C100 Loop the HSEM Hammer - VCL test.Swap Analog VE boards, and observe thefault code. Ensure that both frontplaneconnectors are on firmly.


2C121 B3, B2,B1

2C121 Replace the odd Analog VE board (B2) ifthe fault code is odd, or replace the evenAnalog VE board (B1) if the fault code iseven.

2D100 Observe signal PB 27 of the ribboncontrol (B4).

Is the voltage 12 V? 2D101 P1

2D101 Observe signal PA 57 of the ribboncontrol (B4). Loop the HSEM Ribbon -Stepper Motor test.

Does the signal toggle? 2D102 B3

2D102 Observe signal PA 39 of the ribboncontrol (B4).


2D200 Observe signal PA 57 of the PrinterMicroprocessor (B3). Loop the HSEMRibbon - Stepper Motor test.

Does the signal toggle? B3 2D201

2D201 Power down the HSEM. Test theresistance between pins PB 17 and PB27 of the ribbon control (B4).

Is the resistance approximately5.5 ohms?

2D202 M5

2D202 Test the resistance between pins PB 15and PB 27 of the ribbon control (B4).


2D203 M5



2D204 M5



B4 M5

2F100 Observe the signal on PA 20 of the skewsensor (B7).

Is the signal low? B3 2F101

2F101 Raise the HSEM printer module. Removethe MICR ribbon. Run test 7534 (HSEMRibbon - Tracking Adjust test) from theHSEM keypad.

Does the display show FAILED753400?

B7 S11

2F200 Raise the HSEM printer module. Removethe MICR ribbon. Observe the signal onPB 35 of the skew sensor (B7).

Is the signal low? 2F201 S11


Is the signal low? B7 B3




Next Step












2F501 Observe the signal on PB 22 of the skewsensor (B7).


32400 Monitor signal DPDCT on PA 25 of theskew sensor (B7). Run the HSEM RibbonSensors test in loop mode.

Does the signal toggle? 32410 32420

32410 Monitor signal RIBMOT on PA 40 of theskew sensor (B7).

Does the signal toggle? B3 B7, B3

32420 Primary suspect: B7

Secondary suspect: S6, B12, cables J2,and J27

32700 Monitor signal SPTE on PA 33 of theskew sensor (B7). Run the HSEM RibbonSensors test in loop mode.

Is there at least one pulse pertest loop?

32710 32720

32710 Monitor signal LOWRIB on PA 36 of theskew sensor (B7).

Is there at least one pulse pertest loop?

B3 B7,B3


Secondary suspects: S7, B12, cablesJ5, and J27

32900 Remove the panel covering the HSEMtake-up motor pulleys. Observe the take-up motor drive belt to the TU reel.

Is the drive belt broken or wornout?

32910 32920

32910 Replace the drive belt, and rerun theHSEM Ribbon Sensor test.

32920 Rerun the HSEM Ribbon sensor test(7532), and observe the take-up reel.

Did the take-up reel rotateduring the test?

B4, B3 B4, M6




Next Step


33300 Lift up the HSEM cover, and cheat thecover interlock switch. Observe thedrum.

Is the drum rotating? 33310 M4

33310 Measure PA 47 signal Index 1 on theskew sensor (B7).

Is the signal pulsating? 33320 S9, B7,cable(J4-J27)

33320 Measure PA 48 signal INDCLK on theskew sensor (B7).

Is the signal occurring every33.3 milliseconds (ms) with apulse width of 23.3 ms?

B3 B7, B3

33400 Adjust the magnetic sensor pickup forthe index clock.

Can the sensor be adjustedproperly?

33410 S9, M4

33410 Verify the Index Clock Freq., and rerunthe POC.

33500 Measure PA 45 Signal Clock on the skewsensor B7.

Is the signal pulsating? 33510 33520

33510 Measure PA 46 signal Charclk on skewsensor B7.

Is the signal occurring every3.3ms. at a width of 1.0 ms.?

B3 B7,B3

33520 Turn off the HSEM power, and removeskew sensor B7. Turn on the HSEMpower, and run the HSEM Drum Sensortest. Measure PA 45 signal clock on theskew sensor.

Is the signal pulsating? B7 S8,cable(J4-J27)

33600 Adjust the magnetic sensor pickup forthe clock character.

Can the sensor be adjustedcorrectly?

33610 S8, M4

33610 Verify the character clock, and rerun thePOC.



Print Quality Diagnostic Flow

Table 23–3. Print Quality Diagnostic Flow

Next Step


100 Examine the ribbon Are there any voids in theribbon?

200 300

200 Replace the ribbon. Rerun the test.

300 Examine the print drum. Is there any obvious damage,wear, or dirt on the drum?

400 500

400 Replace the print drum. Rerun the test.

500 Examine the hammer bank. Are any hammers damaged ordirty?

600 700

600 Repair or replace the hammer bank.Rerun the test.

700 Make adjustments by performing thefollowing T&As:

Magnetic Pickup GapCharacter Phase AdjustmentHammer Bank AdjustmentDrum Horizontal Adjustment

Can the adjustments beperformed?

800 900

800 No fault or error detected. Rerun thesystem exerciser.

900 Repair or replace the faulty component.Rerun the system exerciser.

Is the print quality acceptable? 1000 1100

1000 Corrections were made. Return to thecustomer application.


Secondary suspect: B1

After replacing the boards(s), run theFlight Time Adjustment T&A and theCharacter Phase Adjustment T&A beforererunning the system exerciser.



Maintenance Mode Diagnostic Flow

Table 23–4. Maintenance Mode Diagnostic Flow

Next Step


100 Open the HSEM door. Lift the HSEMcover and defeat the magnetic switchand AC interlock. Observe the LCDdisplay on the maintenance keypad.

Is UNISYS SERVICE displayed? 200 500

200 Toggle the override switch on the top ofthe HSEM logic gate and observe theprint drum.

Is the drum rotating? 300 B6

300 Press the Enter key on the keypad.Observe the LCD display.

Is STEP RIBBON displayed? 400 B3, K1

400 Return the override switch to its originalposition and observe the LCD display.

Is ON LINE displayed? 1200 1000

500 Perform the HSEM Top Cover and DoorSwitch Adjustment T&A.

Can the adjustment beperformed?

1200 B6, I3

600 No fault was found, or the adjustmentwas performed. Rerun the test.



Track Motors Diagnostic Flow

Table 23–5. Track Motors Diagnostic Flow

Next Step


100 Select test HSEM Servo -Velocity Adjustin loop mode. Observe the entry rollers.

Are the entry rollers cycling onand off?

200 400

200 Observe the exit rollers. Are the exit rollers cycling onand off?

210 800

210 Are there consistent jams in theHSEM module?

B5 300

300 No fault or error detected. Rerun thesystem exerciser.

400 Observe the exit rollers. Are the exit rollers cycling onand off?

500 1100

500 Observe the entry AC motor. Is the entry AC motor cyclingon and off?

600 700

600 Replace the drive belt, and rerun thesystem exerciser.

700 Replace the entrance AC motor, andrerun the system exerciser.

800 Observe the exit AC motor. Is the exit AC motor cycling onand off?

900 1000

900 Replace the drive belt, and rerun thesystem exerciser.

1000 Replace the exit AC motor, and rerun thesystem exerciser.

1100 Primary suspect: solid state relay for ACmotor control

Secondary suspect: B6, cable P10-P2



HSEM Outsort MTR Procedures

Table 23–6. HSEM Outsort MTR Procedures

Next Step


100 Record the outsort error. Execute theHSEM confidence test.

Did the test pass successfully? 300 200

200 Follow the fault code displayed on thescreen to isolate the problem.

300 Observe the recorded outsort error. Was the outsort errordocument slip?

310 350

310 Clean or replace the servo rollers perSections 3 and 5 of the NDP Field Testand Reference Manual. Run the systemexerciser.

Was the outsort errordocument slip?

320 900

320 Replace the Servo Amp board, B8, andrun the system exerciser.

350 Observe the recorded outsort error. Was the outsort errordocument jam or document notin stop position?

360 370

360 Replace the Servo Amp board, B8, andrun the system exerciser.

Was the outsort errordocument jam or document notin stop position?

B5 900

370 Observe the recorded outsort error. Was the outsort error hammerflight?

380 400

380 Place the HSEM Printer Module intomaintenance mode. From themaintenance keypad, select the FlightFault Item. Press the Enter key fourtimes, and record the display after eachEnter key depression. Observe therecordings.

Was anything other than a zerodisplayed?

390 800




Next Step


390 From the recorded FLIGHT FAULT, referto the example and chart below to isolatethe failing hammer. This chart gives thehammer number relative to its failure asrecorded earlier.

{Example: Recorded Flight Fault was

H01 0 0 0 0H05 0 0 0 0H09 0 0 0 0H0D 0 5 0 0

Referring to the chart below, this wouldindicate that hammer 14 is failingbecause the hammer flight fault wassomething other then zero.}

Replace the faulty hammer. and performthe Hammer Flight Time and Phase T&As.Run the system exerciser.

Flight Fault Hammer Identification Chart

H01 1 2 3 4______________

H05 5 6 7 8______________

H09 9 10 11 12______________

H0D 13 14 15 16______________

400 Observe the recorded outsort error. Was the outsort error one ofthe following?

SKEWED DOCUMENT >+0.75DEGREES

SKEWED DOCUMENT >+1.50DEGREES

SKEWED DOCUMENT <-0.75DEGREES

SKEWED DOCUMENT <-1.50DEGREES

DOCUMENT TOO HIGH

410 500

410 Rerun the Skew Calibration T&A, andrerun the system exerciser.

Are there still Skew/Heightrelated outsorts?

B7 900




Next Step


500 Observe the recorded outsort error. Was the outsort error one ofthe following?

RIBBON SKEW LEFT FAILURE

RIBBON SKEW RIGHT FAILURE

RIBBON SKEW LEFT WARNING

RIBBON SKEW RIGHT WARNING

510 600

510 Remove the HSEM ribbon. Use testsensors, nontrack to test the ribbontracking sensor states.

Are the sensors functional? 520 B7,S11

520 Run the Ribbon Tracking Adjustment testin loop mode.

Does the ribbon deskew motorswing back and forth from onelimit to the other?

800 B4, M7

600 Rerun the system exerciser, and observethe error code.

Does the error code appearagain?

700 800

700 Perform step 100 again.

800 The system experienced a glitch. Runthe client’s program again.

900 Corrections were made. Return to theclient’s application.



HSEM Fault Code List and FRU Description

Table 23–7. HSEM Fault Code List and FRU Description

FRU BP Slot Description T&A(s)

B1 11 Analog VE (Even) PWBA Flight Time Adjustment

B2 10 Analog VE (Odd) PWBA Flight Time Adjustment

B3 9 Printer Microprocessor PWBA Microprocessor Initialization

B4 8 Ribbon Control PWBA None

B5 6 Common Controller PWBA Skew Sensor Calibration

Servo Slip Reference

Skew Sensor Calibration

B6 4 Sensor Power Control PWBA None

B7 3 Skew Sensor PWBA Skew Sensor Calibration

B8 2 Servo Amplifier PWBA Servo Velocity Adjustment


B9 1 Servo Driver PWBA Servo Velocity Adjustment

B10 Hammer Interconnect PWBA None

B11 HVSD PWBA None

B12 Printer Interface PWBA None

P1 Power Supply Servo Velocity Adjustment

Flight Time Adjustment

H1 Hammer bank Hammer Bank Adjustment

K1 Maintenance keypad None

I1 Cover interlock switch Module Interlock Switch Adjustment

I2 Cover switch Module Interlock Switch Adjustment

I3 Module position switch Module Position Switch Adjustment

I4 Lift switch None

I5 Lift solenoid Latch Solenoid Adjustment

M1 Servo motor Servo Velocity Adjustment


M4 Drum motor Print Drum Belt and Drive PulleyAdjustment

M5 Ribbon stepper motor Ribbon Timing Belt Tension Adjustment

M6 Ribbon take-up motor Ribbon Drive Shaft Endplay and PulleyLocation



Table 23–7. HSEM Fault Code List and FRU Description

FRU BP Slot Description T&A(s)

M7 Ribbon de-skew motor None

S2 Dog-ear sensor None

S3 Servo sensor None

S4 Stop sensor None

S6 Ribbon motion encoder 3142 5762?????????

S7 Ribbon low encoder 3142 5739??????

S8 Character clock magnetic pick-up Magnetic Pickup Gap

S9 Drum index magnetic pick-up Magnetic Pickup Gap

S10 Document skew sensor Skew Sensor Calibration

S11 Ribbon skew sensors None



HSEM Tests

Table 23–8. HSEM Tests

Test Number MTR Kernel Display

01 HSEM - NVM Test

02 HSEM- Ext. Bus Wrap Around Test

06 HSEM Trk Sens-Curr Monitor Test

07 HSEM Trk Sens-Input Simuln Test

08 HSEM Trk Sens-Normal Mode Test

09 HSEM -Power Control Circuitry Test

0A HSEM - Servo Skew Interrupt Test

0C HSEM Skew/Height Sensors -Test

0D HSEM Skew/Height Sensor Compensation

0E HSEM Servo -Velocity Adjust

0F HSEM Servo-Slip Reference

10 HSEM Servo-Volt Mon Test

11 HSEM Servo Driver- Volt Mon Test

12 HSEM Servo-Normal Mode Test

13 HSEM Enter Print on Outsort Mode

14 HSEM Exit Print on Outsort Mode

18 HSEM NDP 1XXX FIFO Interface Test

19 HSEM -Echo Test

1A HSEM Sensor State

1B HSEM Sensor Compensation

1C HSEM Read Skew Results

1D HSEM Skew Sens-Calculate Table

1E HSEM Skew Sens- Set Gauge Heights

20 HSEM Printer - Processor Test

21 HSEM Printer-PROM Checksum Test

22 HSEM Printer- RAM Test

23 HSEM Printer-NVM Test

24 HSEM Printer-Ext. Bus Wrap Test

25 HSEM Printer-External Control Signal Wrap-Around Test

26 HSEM Print Drum Image



Table 23–8. HSEM Tests

Test Number MTR Kernel Display

28 HSEM Hammer-Supply Mon Test

29 HSEM Hammer- Clock Verification Test

2A HSEM Hammer-Volt Mon Test

2B HSEM Hammer-Impact Mon Test

2C HSEM Hammer -VCL Test

2D HSEM Ribbon-Stepper Motor Test

2F HSEM Ribbon-Ribbon Skew/Height Sens Status

32 HSEM Ribbon Sensors-Test

33 HSEM Drum Sensors-Test

34 HSEM Ribbon-Tracking Sensors Test


Section 24 CAR Diagnostic Procedures (DualImage System)

This section describes the testing methods used for diagnosing the courtesy amountrecognition (CAR) unit. It explains how to interpret the POC results to isolate the fault toa field replacement unit (FRU). These procedures pertain to the CAR module designed tooperate with the dual image system. For CAR modules designed to operate with U4/JPEGimage systems, refer to Section 21, "CAR Diagnostics (U4/JPEG Imaging System)."

IntroductionThe following diagnostic tests are available to use for isolating problems:

• Power-on confidence (POC) test for each PCBA in the CAR unit

• Test Slot test

Other information in this section includes the following:

• Error code index

• CAR diagnostic flows

When you see an error code displayed at the image capture server (ICS) PC of the formshown in the "Error Code Format" section, look up the error in the "Error Codes" section toidentify the procedure you should use to diagnose the problem. Error codes, error codeformats, and diagnostic procedures are found later in this section.

CAR Diagnostic Procedures (Dual Image System)


POC TestFor the NDP1825, the CAR module is external to the sorter and has its own power source.On the right, front side of the module is a CAR Status panel. This panel has three statusLEDs: Power, Unit On, and Error. Beneath the Unit On LED is the Unit On switch that isused to power up the external CAR module. When power is applied, the CAR POC testexecutes automatically. This test is also run if the CAR unit is reset.

For the NDP1150, the CAR module is internal to the NDP transport. The CAR gate islocated under the first eight pocket module in the transport. When the sorter is poweredon, so is the CAR unit. Consequently, the NDP1150 CAR unit executes its POC testwhenever the sorter is powered on.

The POC test routines for both the external and internal CAR modules are on EPROMsresident on PCBAs in the CAR gate.

The POC test verifies that the CAR unit is free of faults before it is used with the documentprocessor. The POC test provides confidence that the following components arefunctioning properly:

• Processors

• Memories

• Buses

• Internal serial links

• DC voltage

• Hard-disk controller and drive

Interpreting the Error Indicator LEDsThe error indicator light on the CAR module shows the general result of the CAR POCtest. For the external CAR module, the error indicator light is the Error LED on the CARStatus panel. For the internal CAR module, the error indicator light is located on top of theCAR gate.

• If the error indicator light remains off after the CAR unit is turned on or reset, the CARunit has passed its POC test.

• If the error indicator light is lighted, the POC test has detected an abnormal situation.When this happens, you need to check the result of the POC test on each PCBA, asindicated by a set of error indicator light-emitting diodes (LEDs). The LEDs arelocated on the front side of each PCBA.

Figure 24–1 and Figure 24–2 show the LED displays for the PCBAs.



reset switch for starting test slot function

green

green

red

for 2nd Character Recognition Unit

green

green

red

for 1st Character Recognition Unit

/

o

o

o

o

o

o

Figure 24–1. LEDs on Recognition Unit (RU) PCBA

reset switch for starting test slot function

green

green

red

/

o

o

o

Figure 24–2. LEDs on Adaption Unit (AU) and Pixel Unit (PU) PCBAs

During the POC test of a PCBA, the LEDs flash on and off. At the end of a successful POCtest, the red LED is off and the two green LEDs are flashing.

At the end of an unsuccessful POC test, the red LED is on. The POC test stops when anerror is encountered. The state of the green LEDs (whether they are on, off, or flashing)indicates when the error occurred.



Executing the POC TestUse the following procedure to execute the POC test.

1. Do one of the following:

• For the external CAR module:

a. Turn the power on by pressing the "Unit On" switch on the control panel.

b. Press the reset button inside the cabinet.

• For the internal CAR module:

c. Turn the sorter transport power on.

d. Press the reset button on top of the CAR unit.

The POC test runs.

2. Check the state of the Error indicator on the operator panel after two minutes.

• If the Error indicator is off, no errors were encountered. You are done with thisprocedure.

• If the Error indicator is on, the test was unsuccessful.



Card Cage Test SlotThe test slot is located at the far left side of the card cage. You can use the test slot toverify the hardware functions and the input/output circuitry on suspect PCBAs. The testslot can test the AU, PU, and RU PCBAs independently of the current CAR unit state.

The test slot test has several steps. As the test runs, the result of each step is indicated bythe LEDs. At the end of a successful test, there is a two-second pause. Then the testrepeats until you remove the PCBA or an error occurs. If an error occurs, the test stopsand the red LED on the PCBA lights. The state of the green LEDs (whether they are on oroff) shows when the error occurred.

The following procedure includes a table that shows the state of the LEDs during the test.If an error occurs, use the table to see during which step the error occurred. For example,if the red LED is on and both green LEDs are off, the error occurred during the internalself-test.

Use the following procedure to test a PCBA in the test slot.

WARNINGBe sure that power to the CAR unit is turned off before removing andreplacing FRUs. Otherwise, serious injury or death may result fromelectrical shock.

CautionYou must wear an antistatic wrist strap during this procedure to reduce thepossibility of electrostatic discharge. Failure to wear one could result inequipment damage and/or performance degradation now, or in the future.

1. Insert the test fixture into the test slot, and then insert the PCBA into the test slot.

2. Press the reset button on the PCBA in the test slot.

3. Watch the LEDs.

• If the test repeats, there is no error. Skip to step 5.

• If all three LEDs become static (light up and stay lighted), there is an error. Go tothe next step.

4. Compare the state of the LEDs to those in Table 24-1 and 24-2 to determine when theerror occurred.

5. Remove the PCBA from the test slot.

If an Error Code Line procedure directed you to execute this test, return to that procedureto determine what to do next.



Table 24–1. Test Slot Steps and Related LED Displays for RU and AU PCBA’s

Test Step Process LED

1 Lamp testing green xgreen xred x

2 Internal self-test running green ogreen ored x

3 Internal self-test successfully finished, interfaces beingchecked

green xgreen ored x

4 Interfaces all right green xgreen xred o

5 Pause of two seconds, then loop to step 1 green xgreen xred o

Legendx = on

o = off

Table 24–2. Test Slot Steps and Related LED Displays for PU PCBA

Test Step Process LED

1 Lamp testing green xgreen xred x

2 Internal self-test running green ogreen ored x

3 Internal self-test successfully finished, interfaces beingchecked. Interface OK.

green xgreen @red x

4 Pause of two seconds, then loop to step 1 green xgreen xred o

Legendx = on

o = off

@ = blinking



Testing the CAR UnitUse the Offload Exerciser to test the CAR unit. The Offload Exerciser is described in theNDP Servicing Guide: Analysis and Test Software (2983 9289).

The Image View Utility, a PC-based utility for viewing documents captured by the imagecamera unit, has several commands for analyzing the code line data captured by the CARunit. Instructions for using the Image View Utility are provided in an online help facility,which is accessed from the utility.

Error Code FormatThis section lists the messages that may be generated by the CAR unit. The CAR unitprovides messages when the following states occur:

• POC Failed

• Error

• Sync Error

• Other information

Not all messages in this list require action. Many are for information only. This list isprovided to help isolate a problem. To diagnose an error, refer to the "CAR DiagnosticFlows" subsection later in this section.

An error code includes a message qualifier, a source identification, and a unique number.A string of words or numbers may follow the error code.



Message QualifiersThe first 2 characters are the message qualifier. The message qualifier indicates the type oferror message. The characters that may appear are IN, IW, IE, E followed by a space, Ffollowed by a space, XE, and S followed by a space. They are explained next.

IN

IN means internal news. An internal news message is displayed only on the ICS PC screen.No action is required.

IW

IW means internal warning. A warning indicates that a function has not been performed orhas been only partially performed. For example, if something is wrong with the messagesyntax, the CAR unit issues a warning message and sends the document processor a flag inthe prefix of the response.

IE, E, and F

IE means internal error. An internal error message may be generated by the AU software,PU software, or PC standard functions. Generally, an internal error causes the CAR unit toenter the Error or POC Failed state (depending on the previous state).

E stands for error state. F stands for POC Failed state. When the transport processorrequests the status of the CAR unit, the CAR unit sends internal error messages with Efollowed by a space or F followed by a space as the message qualifier. For example, theinternal error message IEAU081010 000D would be sent to the transport document as EAU081010 000D.

An E or F message also is displayed on the CAR unit PC screen if the PC monitor isconnected.

If the CAR unit is already in the Error, POC Failed, or Sync Error state when an internalerror occurs, the error message is displayed only on the PC screen of the CAR unit (if themonitor is connected). If the screen is full, further messages are ignored.

XE and S

XE means external error. An external error causes the CAR unit to enter the Sync Errorstate.

S stands for sync error. When the transport processor requests the status of the CAR unit,the CAR unit sends external error messages with S followed by a space as the messagequalifier. For example, the error message, XEAU012024 0001 would be sent to thetransport processor as S AU012024 0001.

If an external error occurs when the CAR unit is already in the Sync Error state, the errormessage is displayed only on the CAR unit PC screen. If the screen is full, furthermessages are ignored.



Source IdentificationThe next 4 characters identify which piece of software generated the message. Forexample, AU08 identifies a piece of the AU software. This can be used for support, ifnecessary.

NumberThe last 4 characters compose a number that, when combined with the message qualifierand source identification, uniquely identifies the error code.

StringA string may follow the error code. Typically, the string provides more information aboutthe error. For example, an error message concerning a defective RU may identify the RUby its number in a string. In the description of the error messages, the string information isoften referred to as a parameter.

Notation ConventionsError codes listed in the following subsection, "CAR Error Codes," have the followinggeneral format:

�!�"0��/� �6 0��/ 0��/

In this format, variables are shown in angle brackets.

When an error code is displayed on a monitor, variables are replaced by values, as shownby the following example:

�!�"� � �6 ��

When an RU PCBA reports an error, the beginning of the source identification part of theerror code is a variable. For example,

�!0�)/�5��5

When displayed, the variable is replaced by a value. For example,

�!�<�5��5



Because variables are often embedded in the middle of error codes, it may be difficult tofind some error codes in this listing. As a general rule, if you cannot find an error code inthe listing where you expect to find it, consider the following:

• Codes that begin with E AU, F AU, IEAU, INAU, IWAU, S AU, and XEAU are the mostlikely to have a variable in the fifth and sixth characters. For example, if you do notfind IWAU010105 listed between IWAU010104 and IWAU010106 in the Error Codesubsection, look for it as IWAU<id>0105.

Note: In the Error Codes subsection, the error codes that contain variables in the

first 10 characters follow the codes without variables.

• If the third and fourth characters are numbers, such as IW03260004, the error concernsan RU. Substitute <ru> for the numbers when looking up the code in the index. Forexample, look for IW<ru>260004.



CAR Error CodesTable 24–3 provides a list of CAR error codes and descriptions.

Table 24–3. CAR Error Codes

Error Code Description

E AU059200 The SCSI Buffer for sending messages to PC is not free. PC didnot get the last message correctly.

E AU079000 Error input queue overflow.

E AU079002 <pppp> Invalid CRU number.

<pppp> = Erroneous CRU number

E AU079003 <pppp> No more RUs running.

<pppp> = Number of last CRU to go defective.

E AU079004 <pppp> <qqqq> SBUS/MTR command has invalid length.

<pppp> = Expected command length

<qqqq> = Received command length

E AU079005 <pppp> SBUS/MTR command name is not known.

<pppp> = Name field of command

E AU079006 Index in error input queue is out of Range.

E AU079007 Invalid pointer into error message output queue.

E AU079008 <pppp> <qqqq> Invalid CAR unit state for event flag.

<pppp> = Event flag bit

<qqqq> = CAR unit state

E AU079009 <pppp> Invalid event bit number.

<pppp> = Erroneous event bit number

E AU079010 <pppp> Timer Interrupt detected error.

<pppp> = Value of global variable

= 8000: Fan Motion Detection signal detected.

E AU079011 <pppp> Error returned from dsend_pc().

<pppp> = Error number returned by dsend_pc( );

E AU079012 <pppp> Bad response from PC.

<pppp> = Command name received from PC

E AU079013 <pppp> Sending response to DP failed.

<pppp> = Detailed error code





E AU079014 <pppp> No more data capture on CRU left.

<pppp> = Number of defective CRU.

E AU081010 <qqqq> Bad nominal results from PC.

<qqqq> values:

000B: Result-ID zero or greater than 255000C: Values of length and number of bytes are inconsistent.000D: Data length exceeds buffer size NOMRES_BUF_SIZE.000E: Nominal results records with nonunique result ID.

E AU081011 <qqqq> Bad message response from PC.

<qqqq> = value:

0004: Wrong response code to message PV. Should be AV.0006: Wrong response code to message PD. Should be AD.0008: Wrong response code to message PP. Should be AP.000F: Bad response code to message PX. Should be DN or

AX.

E AU081012 <pppp> <qqqq> Error trying to send message to PC.

<pppp> = Error code returned by dsend_pc()

<qqqq> = Value of program location identifier ’err_index’ in MESSAGE_HANDLER.C

E AU081020 <pppp> <qqqq> Error on pending BOS flag.

<pppp> error cause:

0010: Zero flag bits0020: Event flag group deleted0040: Nonexistent event flag group


E AU081050 <pppp> <qqqq> Error trying to send response to DP.

<pppp> = error cause:

0390: Bad SCSI-Status0360: Excessive response length0380: Wrong response code






E AU0E1001 <pppp> <qqqq> <rrrr> Bad data in reference amount from PC.<pppp> = Byte offset of the bad byte in reference amount data.<qqqq> = Value of program location identifier ’err_index’ in

TESTTASK.C.<rrrr> = Sync byte value.

E AU0E1003 <qqqq> Bad RU number (greater than 31) from check handler. AUdefective.

<qqqq> = Value of program location identifier ’err_index’ in TESTTASK.C

E AU0E1004 <qqqq> Test did not pass because of defective RUs.


E AU0E1006 <qqqq> No RUs are ready.


E AU0E1007 <qqqq> Bad message response code from PC.


E AU0E1008 <pppp> <qqqq> Error trying to send message to PC.



E AU0E1009 <pppp> <qqqq> Error on pending BOS flag.


0010: Zero flag bits0020: Event flag group deleted0040: Non-existent event flag group


E AU501105 <rrrr> Bad success code in amounts.

<rrrr> = Bad success code value.

E AU501106 <pppp> <qqqq> Error trying to send message to PC.

<pppp> = Error code returned by dsend_pc().

<qqqq> = Value of program location identifier.





E AU501107 <rrrr> <ssss> <qqqq> Unexpected message response from PC.

<rrrr> = Command code sent to PC

<ssss> = Command code received from PC

<qqqq> = Value of program location identifier

E AU501108 <pppp> <qqqq> Error on pending BOS flag.

<pppp> = Error cause

0010 = Zero flag bits0020 = Event flag group deleted0040 = Non-existent event flag group


E AU501110 Amount buffer for statistics overflows.

E AU501111 <pppp> Too many statistic IDs in configuration file.

<pppp> = Number of statistic IDs allowed

E AU<id>0990 Parity error in program memory of AU. AU goes into Error state.

E AU<id>0999 <nnnn> Internal lists of BOSAU are corrupted.

<nnnn> = System error number

E AU<id>2011 Interrupt for serial output when output-state not active.

E AU<id>2012 <pppp> <rrrr> Bad response from PU.

<pppp> = Nominal response

<rrrr> = Received response

E AU<id>2013 Interrupt for serial input when output-state active.

E AU<id>2014 <pppp> Unknown command from PU.

<pppp> = Received command

E AU<id>2015 <pppp> PU indicates video data received, but AU did not get appropriatedispo message.

<pppp> = Sync byte

E AU<id>2016 <pppp> <rrrr> PU indicates video data received in command where sync bytedoes not correspond with sync byte in dispo message.

<pppp> = Nominal sync byte

<rrrr> = Received sync byte

E AU<id>2017 More than 12 Video Received flags are set in control FIFO.





E AU<id>2018 <pppp> <rrrr> Interrupt for serial input document sent to CRU. Control FIFO Videoreceived is empty.

<pppp> = Sync/field code

<rrrr> = CRU number

E AU<id>2019 <pppp> <rrrr> <ssss> Interrupt for serial input document sent to CRU. Synch byte iswrong.

<pppp> = Sync/field code nominal

<rrrr> = Sync/field code received

<ssss> = CRU number

E AU<id>2020 <pppp> <rrrr> Control FIFO RU overflow.


<rrrr> = CRU number

E AU<id>2021 <pppp> Interrupt for serial input. Document rejected. Control FIFO videoreceived is empty.


E AU<id>2022 <pppp> <rrrr> Interrupt for serial input. CRU does not receive document.Control FIFO video is empty.


<rrrr> = CRU number

E AU<id>2023 <pppp> <rrrr> <ssss> Interrupt for serial input. CRU does not receive document. Syncbyte is wrong.



<ssss> = CRU number

E AU<id>2025 Interrupt for serial input PU video buffer full. All CRUs in Errorstate or disabled.

E AU<id>2027 Call for subroutine that is already busy.

E AU<id>2031 No more control blocks free to process a dispo message.

E AU<id>2040 <pppp> BR, BD, BS, or BE command received from CRU, and controlblock pointer = 0.

<pppp> = CRU number

E AU<id>2041 <pppp> Sync byte or field code in BR command from CRU is wrong.

<pppp> = CRU number

E AU<id>2042 <pppp> Number of fields in BR command from CRU is wrong.

<pppp> = CRU number





E AU<id>2043 <pppp> Command BR, BD, BS, or BE from CRU. Control FIFO for CRU isempty.

<pppp> = CRU number

E AU<id>2044 <pppp> Command BS from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number

E AU<id>2045 <pppp> Command BR from CRU. Control block pointer equals zero.

<pppp> = CRU number

E AU<id>2046 <pppp> Command BD from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number

E AU<id>2047 <pppp> Command BD from CRU. Control block pointer equals zero.

<pppp> = CRU number

E AU<id>2048 <pppp> Command BE from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number

E AU<id>2049 <pppp> Command BE from CRU. Control block pointer equals zero.

<pppp> = CRU number

E AU<id>204A <pppp> Command BE from DC task. Control FIFO for CRU is empty.

<pppp> = CRU number

E AU<id>204B <pppp> Command BE from DC task. Control block pointer equals zero.

<pppp> = CRU number

E AU<id>204C <pppp> Command BD received from CRU, and command length is wrong.

<pppp> = CRU number

E AU<id>2050 Unknown command or command sequence is wrong.

E AU<id>2062 <pppp> <rrrr> Timeout for document in CRU. Control FIFO is empty.

<pppp> = Sync byte

<rrrr> = Field code

E AU<id>2063 <pppp> <rrrr> Timeout control block undefined.

<pppp> = Sync byte

<rrrr> = Field code

E AU<id>5343 0300 0100 AU board hardware failure.












E AU<id>5343 0300 0A00 AU board hardware failure.

E AU<id>8100 SCSI Send buffer not empty.

E AU<id>8103 SCSI Receive buffer is empty.

E AU<id>9006 Read or Write Index Number to Error Input Queue is out of range.Data may be overwritten. Error Input Queue is cleared.

E PU000021 <pppp> Wrong command list in AU disposition.

<pppp> = Actual command list

E PU000022 <eeee> <aaaa> Wrong receipt from AU on serial interface.

<eeee> = Expected value

<aaaa> = Actual value

E PU000023 Wrong command from AU on serial interface.

E PU000024 More than 30 dispositions received from AU.

E PU000025 More than 30 free CRU numbers received from AU.

E PU000026 PU mode is missing.

E PU000027 Checksum error in RL command.

E PU000028 Checksum error in RD command (upload request data).

E PU000029 Checksum error in 09 command (disposition from AU).

E PU000030 Interrupt sequence on video interface is wrong.

E PU000031 Command 09 (disposition from AU) is missing.

E PU000032 The field width is exceeded.

E PU000033 The field width is too small.

E PU000034 The locations defined in disposition are false; field width is lessthan or equal to 0.

E PU000035 Two fields defined in disposition.

E PU000036 FIFOs for video interface are not empty.

E PU000037 Transmit buffer for serial interface overflowed.

E PU000038 PU buffer overflowed.





E PU000039 <ssss> <dddd> Document ID number in ID line is not identical to sync number fromdisposition.

<ssss> = sync number from AU dispo

<dddd> = doc ID number in ID line

E PU000042 <eeee> <aaaa> Checksum error in RD command.



E PU000043 <eeee> <aaaa> Checksum error in RP command.



E PU000044 <eeee> <aaaa> Checksum error in DD command.



E PU000045 <eeee> <aaaa> Checksum error in DP command.



E PU000061 Video data missing.

E PU000062 No test ID line received.

E PU000063 No free CRU.

E PU000066 <ssss> <dddd> Doc ID number is not identical to sync number of dispo message.

<ssss> = Sync number from AU dispo

<dddd> = Doc ID number from ID line

E PU000067 Document not in PU buffer.

F AUEP1004 Parity error in program memory.

F AUEP1005 Parity error in data memory.

F AUEP1014 No downloading possible because of timer synchronizationproblems. Module: AUPROM or SCMOVP.

F AUEP5100 Internal error in module POCFAI.

F AUEP5101 PC command with checksum error.

F AUEP5102 Unknown command received. Expected commands are AP or AX.

F AUEP5103 Unknown command received. Expected commands are DP, DD,SP, or AX.

F AUEP5104 Unknown command received.





F AUEP5105 Buffer not valid when calling message handler.

F AUEP5106 Start address not valid. Expected start address is equal to or lessthan $0FEFF.

F AUEP5107 PC does not perform download. PC responds with command AX.

F AUEP5108 Last command to perform is not SP.

F AUEP5109 Sender field in command does not contain PC.

F AUEP5110 Receiver field in command does not contain AU.

F AUEP5112 Verification error in performing the command DD.

F AUEP5113 Verfication error in performing the command DP.

F AUEP5114 Error while converting bytes in words.

F AUEP5115 Timeout (60 s) in communication with PC.

F AUEP5116 PP command does not get the response AP.

F AUEP5117 Power-off initiated because of Power Fail signal, but power-off isnot performed.

F AUEP5118 Power-off initiated because of Fan Motion Detection signal, butpower-off is not performed.

F AUEP5119 Power-off initiated because of Fan Motion Detection signal.

F AU079003 <pppp> No more CRUs running.

<pppp> Number of last CRU to go defective.

F AU079010 <pppp> Timer Interrupt detected error.

<pppp> = Value of global variable. = 8000: Fan Motion Detection signal detected.

F AU145055 <ssss> Error in Communication with PU.

<ssss> = Status word of PU

F AU145255 There is no ready RU.

F AU501100 <rrrr> <ssss> Missing byte in PC response to PV/300 message.

<rrrr> = Byte position of missing byte

<ssss> = Missing byte value

F AU501101 <rrrr> <ssss> <tttt> Bad byte in PC response to PV/300 message.

<rrrr> = Byte position of missing byte

<ssss> = Missing byte value

<tttt> = Expected byte value





F AU501102 <rrrr> Expected digit in PC response to PV/300 message is missing.

<rrrr> = Byte position of missing digit

F AU501103 <rrrr> <ssss> Byte in PC response to PV/300 message is not an expectedcomma.

<rrrr> = Byte position of bad byte

<ssss> = Bad byte value

F AU501104 <rrrr> <ssss> <tttt> Illegal statistics ID in PC response to PV/300 message.

<rrrr> = ID position of bad ID

<ssss> = First and second byte of bad statistics ID

<tttt> = Third and fourth byte of bad statistics ID

F AU501112 Bad length of "/301 nnnn" parameter string.

F AU501113 Missing digit in "/301 nnnn" parameter string.

F AU501114 Missing "/301 nnnn" parameter string.

F AU<id>3012 <kkkk> <rrrr> Error in communication with PC.

<kkkk> = First word of command

<rrrr> = Return value

F AU<id>3030 <eeee> <rrrr> Error in communication with PC. PC sent an unknown returnmessage.

<eeee> = Expected message

<rrrr> = Returned message

F AU<id>3031 <kkkk> Error in communication with PC. PC sent an unknown command inreturn message.


F AU<id>3116 <rrrr> Error in communication with PC. PC sent a command with anunknown receiver field during download.

<rrrr> = Receiver field

F PC__0009 Download ID not found: [Download-ID]-.

F PC__0010 No download list in configuration file.

F PC__0011 Download not running, no loadlist specified.

F PC__0012 Error in download file: [Filename].

F PC__0013 Download file not found: [Filename].

F PUEP0010 Wrong command name during Download program.

F PUEP0011 Checksum error in command Download Program.





F PUEP0012 Checksum error in command Start Program.

F PUEP0013 Command Download Program is missing.

F PUEP0014 Wrong transmit/receive name in Download Program.

F PUEP0015 Wrong transmit/receive name in Start Program.

F PUEP0016 Wrong receipt from AU on serial interface.

IEAU059200 The SCSI buffer for sending messages to PC is not free. PC didnot get the last message correctly.

IEAU079000 Error input queue overflow.

IEAU079002 <pppp> Received invalid CRU number (out of range).

<pppp> = Erroneous CRU number

IEAU079003 <pppp> No more CRUs running.

<pppp> = Number of last CRU to go defective.

IEAU079004 <pppp> <qqqq> SBUS/MTR command has invalid length.

<pppp> = Expected command length

<qqqq> = Received command length

IEAU079005 <pppp> SBUS/MTR command name is unknown.

<pppp> = Name field of command

IEAU079006 Index in error input queue is out of range.

IEAU079007 Invalid pointer to error message output queue.

IEAU079008 <pppp> <qqqq> Invalid CAR unit state for event flag.

<pppp> = Event flag bit

<qqqq> = CAR unit state

IEAU079009 <pppp> Invalid event bit number.

<pppp> = Erroneous event bit number

IEAU079010 <pppp> Timer Interrupt detected wrong functions.

<pppp> = Value of global variable = 8000: Fan Motion Detection detected fan defect.

IEAU079011 <pppp> Error Returned from dsend_pc().

<pppp> = Error number returned by dsend_pc( );

IEAU079012 <pppp> Bad response command from PC.

<pppp> = Command name received from PC.

IEAU079013 <pppp> Sending response to DP failed.

<pppp> = Detailed error code





IEAU079014 <pppp> No more data capture on CRU left.

<pppp> = Number of defective CRU

IEAU081010 <qqqq> Bad nominal results from PC.

<qqqq> = values:

000B: Result ID zero or greater than 255000C: Values of length and number of bytes are

inconsistent.000D: Data length exceeds buffer size NOMRES_BUF_SIZE.000E: Nominal results records with non-unique result ID.

IEAU081011 <qqqq> Bad message response from PC.

<qqqq> = value:

0004: Wrong response code to PV message. Should be AV.0006: Wrong response code to PD message. Should be AD.0008: Wrong response code to PP message. Should be AP.000F: Bad response code to PX message. Should be DN or

AX.

IEAU081012 <pppp> <qqqq> Error trying to send message to PC.

<pppp> = Error code returned by dsend_pc().


IEAU081020 <pppp> <qqqq> Error on pending BOS flag.


0010: Zero flag bits0020: Event flag group deleted0040: Nonexistent event flag group


IEAU081050 <pppp> <qqqq> Error trying to send response to DP.


0390: Bad SCSI-Status0360: Excessive response length0380: Wrong response code






IEAU0E1000 <rrrr> <ssss> <pppp><qqqq>

Amount field code from RU does not correspond to reference testdata field code from PC.

<rrrr> = Number of RU with bad amount data

<ssss> = Sync byte

<pppp> = Byte offset of the bad byte in reference amount data


IEAU0E1001 <pppp> <qqqq> <rrrr> Bad data in reference amount from PC.

<pppp> = Byte offset of the bad byte in reference amount data


<rrrr> = Sync byte value

IEAU0E1002 <rrrr> <ssss> <tttt><uuuu> <aaee>

Amount data from RU is not identical to reference amount datafrom PC.

<rrrr> = Number of RU showing amount compare error

<ssss> = Actual sync byte

<tttt> = Actual field code

<uuuu> = Byte-offset of byte in amount data in which compare error occurs

<aaee> = Actual and expected byte values

IEAU0E1003 <qqqq> Bad RU number (greater than 31) from check handler.


IEAU0E1004 <qqqq> Test not passed. Defective RUs.


IEAU0E1005 <rrrr> <ssss> <qqqq> RU time out error.

<rrrr> = RU showing time out error

<ssss> = Sync byte


IEAU0E1006 <qqqq> No RUs ready.






IEAU0E1007 <qqqq> Bad message response code from PC.


IEAU0E1008 <pppp> <qqqq> Error trying to send message to PC.



IEAU0E1009 <pppp> <qqqq> Error on pending BOS flag.


0010: Zero flag bits0020: Event flag group deleted0040: Non-existent event flag group


IEAU145055 <ssss> Error in Communication with PU.

<ssss> = Status word of PU

IEAU145255 There is no ready RU.

IEAU501105 <rrrr> Bad success code in amounts.

<rrrr> = Bad success code value

IEAU501106 <pppp> <qqqq> Error trying to send message to PC.



IEAU501107 <rrrr> <ssss> <qqqq> Unexpected message response from PC.

<rrrr> = Command code sent to PC

<ssss> = Command code received from PC


IEAU501108 <pppp> <qqqq> Error on pending BOS flag.

<pppp> = Error cause

0010 = Zero flag bits0020 = Event flag group deleted0010 = Nonexistent event flag group


IEAU501110 Amount buffer for statistics overflows.





IEAU501111 <pppp> Too many statistic IDs in configuration file.

<pppp> = Number of statistic IDs allowed.

IEAU<id>0990 Parity error in program memory of AU. AU goes into Error state.

IEAU<id>0999 <nnnn> Internal lists of BOSAU are corrupted.


IEAU<id>2011 Interrupt for serial output when output-state not active.

IEAU<id>2012 <pppp> <rrrr> Bad response from PU.

<pppp> = Nominal response

<rrrr> = Received response

IEAU<id>2013 Interrupt for serial input when output-state active.

IEAU<id>2014 <pppp> Unknown command from PU.

<pppp> = Received command

IEAU<id>2015 <pppp> PU indicates video data received, but AU did not get appropriatedispo message.

<pppp> = Sync byte

IEAU<id>2016 <pppp> <rrrr> PU indicates video data received in command where sync bytedoes not correspond with sync byte in dispo message.



IEAU<id>2017 More than 12 Video Received flags are set in control FIFO.

IEAU<id>2018 <pppp> <rrrr> Interrupt for serial input document sent to CRU. Control FIFO Videoreceived is empty.


<rrrr> = CRU number

IEAU<id>2019 <pppp> <rrrr> <ssss> Interrupt for serial input document sent to CRU. Sync byte iswrong.

<pppp> = Nominal sync/field code

<rrrr> = Received sync/field code

<ssss> = CRU number

IEAU<id>2020 <pppp> <rrrr> Interrupt for serial input document sent to CRU.


<rrrr> = CRU number





IEAU<id>2021 <pppp> Interrupt for serial input. Document rejected. Control FIFO videoreceived is empty.


IEAU<id>2022 <pppp> <rrrr> Interrupt for serial input. CRU does not receive document.Control FIFO video is empty.


<rrrr> = CRU number

IEAU<id>2023 <pppp> <rrrr> <ssss> Interrupt for serial input. CRU does not receive document. Syncbyte is wrong.



<ssss> = CRU number

IEAU<id>2025 Interrupt for serial input PU video buffer full. All CRUs in Errorstate or disabled.

IEAU<id>2026 <pppp> Interrupt for serial input. CRU <pppp> does not receivedocument. State manager disabled CRU.

<pppp> = CRU number

IEAU<id>2027 Call for subroutine that is already busy.

IEAU<id>2031 No more control blocks free to process a dispo message.

IEAU<id>2040 <pppp> BR, BD, BS, or BE command received from CRU, and controlblock pointer = 0.

<pppp> = CRU number

IEAU<id>2041 <pppp> Sync byte or field code in BR command from CRU is wrong.

<pppp> = CRU number

IEAU<id>2042 <pppp> Number of fields in BR command from CRU is wrong.

<pppp> = CRU number

IEAU<id>2043 <pppp> Command BR, BD, BS, or BE from CRU. Control FIFO for CRU isempty.

<pppp> = CRU number

IEAU<id>2044 <pppp> Command BS from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number

IEAU<id>2045 <pppp> Command BR from CRU. Control block pointer equals zero.

<pppp> = CRU number

IEAU<id>2046 <pppp> Command BD from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number





IEAU<id>2047 <pppp> Command BD from CRU. Control block pointer equals zero.

<pppp> = CRU number

IEAU<id>2048 <pppp> Command BE from CRU. Control FIFO for CRU is empty.

<pppp> = CRU number

IEAU<id>2049 <pppp> Command BE from CRU. Control block pointer equals zero.

<pppp> = CRU number

IEAU<id>204A <pppp> Command BE from DC task. Control FIFO for CRU is empty.

<pppp> = CRU number

IEAU<id>204B <pppp> Command BE from DC task. Control block pointer equals zero.

<pppp> = CRU number

IEAU<id>204C <pppp> Command BD received from CRU, and command length is wrong.

<pppp> = CRU number

IEAU<id>2050 Unknown command, or command sequence is wrong.

IEAU<id>2062 <pppp> <rrrr> Timeout for document in CRU. Control FIFO is empty.

<pppp> = Sync byte

<rrrr> = Field code

IEAU<id>2063 <pppp> <rrrr> Timeout control block undefined.

<pppp> = Sync byte

<rrrr> = Field code

IEAU<id>2065 <pppp> Timeout Data Capture RU. State manager disabled RU.

<pppp> = CRU number

IEAU<id>3012 <kkkk> <rrrr> Error in communication with PC.


<rrrr> = Return value

IEAU<id>3030 <eeee> <rrrr> Error in communication with PC. PC sent an unknown returnmessage.

<eeee> = Expected message

<rrrr> = Returned message

IEAU<id>3031 <kkkk> Error in communication with PC. PC sent an unknown command inreturn message.






IEAU<id>3116 <rrrr> Error in communication with PC. PC sent a command with anunknown receiver field during download.

<rrrr> = Receiver field

IEAU<id>5343 0300 0100 AU board hardware failure.








IEAU<id>5343 0300 0A00 AU board hardware failure.

IEAU<id>8100 SCSI Send buffer not empty.

IEAU<id>8103 SCSI Receive buffer is empty.

IEAU<id>8106 CAR status unknown.

IEAU<id>9006 Read or Write Index Number to Error Input Queue is out of Range.Data may be overwritten. Error Input Queue is cleared.

IEPCAU0001 Invalid state for message.

IEPCAU0002 Bad parameter with message.

IEPCAU0003 Invalid message code.

IEPCAU0004 Unexpected message.

IEPCCA0001 Length of CDB wrong.

IEPCCA0002 Undefined command code.

IEPCCA0003 Unknown initiator ID.

IEPCCA0004 SEND unexpected from PC.

IEPCCA0005 Data length in CDB for SEND greater than 2 kByte from PC.

IEPCCA0006 RECEIVE unexpected from PC.

IEPCCA0007 Allocation length for RECEIVE less than 2 kByte from PC.

IEPCCA0008 Data length from AU too large (PC).

IEPCCA0009 Allocation length for SENSE less than 8 bytes (PC).

IEPCCA0010 Wrong logical unit number from PC.

IEPCCA0011 RECEIVE unexpected (DP).





IEPCCA0012 Allocation length for RECEIVE less than 2 kByte (DP).

IEPCCA0013 Data length from AU too large (DP).

IEPCCA0014 SEND unexpected (DP).

IEPCCA0015 Data length in CDB for SEND too large (DP).

IEPCCA0016 Allocation length for INQUIRY less than 96 bytes.

IEPCCA0017 HARDWARE Error: Unexpected ESP Status [Status]

IEPCCA0018 Power on reset.

IEPCCA0019 Bus device reset.

IEPCCA0020 SEND buffer not empty (PC).

IEPCCA0021 RECEIVE buffer empty (PC).

IEPCCAA022 RECEIVE buffer empty (DP).

IEPCCA0023 SEND buffer not empty (DP).

IEPCCE0001 Selection timeout on channel [channel].

IEPCCE0002 Data over/under run on channel [channel].

IEPCCE0003 Unexpected bus free on channel [channel].

IEPCCE0004 Target bus phase sequence failure on channel [channel].

IEPCCE0005 Target check condition on channel [channel].

IEPCCE0008 Invalid CCB operation code on channel [channel].

IEPCCE0009 Linked CCB does not have the same logical unit name on channel.

IEPCCE0010 Invalid target direction received from host on channel.

IEPCCE0011 Duplicate CCB received in target mode on channel.

IEPCCE0012 Invalid CCB or segment list parameter on channel.

IEPCCE0013 CCB for canceled task not found on channel [channel].

IEPCCE0014 Task completed with Error on channel [channel].

IEPCCE0015 CCB of target LUN not available on channel [channel].

IEPCCE0016 Invalid host adapter command on channel [channel].

IEPCCE0018 MBO command invalid on channel [channel].

IEPCCE0019 MBI state undefined on channel [channel].

IEPCCE0100 SCSI device driver state [state] unexpected on channel [channel].

IEPCCE0101 SCSI transfer in progress on channel [channel].

IEPCCE0102 SCSI timeout on channel [channel].





IEPCCE0103 SCSI channel closed on channel [channel].

IEPCCE0104 Invalid SCSI command on channel [channel].

IEPCCE0105 No mailbox free on channel [channel].

IEPCCE0107 SCSI check condition on channel [channel].

IEPCCE0108 SCSI command aborted on channel [channel].

IEPCCE0109 Target status busy on channel [channel].

IEPCCE0110 Unexpected inmail received on channel [channel].

IEPCCE0115 SCSI reset detected on channel [channel].

IEPCCE0116 SCSI device driver Error on channel [channel].

IEPCCM0001 Send data on channel [channel] denied.

IEPCCM0002 Receive data on channel [channel] denied.

IEPCCM0004 Data length Error on channel: [channel] send [data1] of [data2].

IEPCHA0001 Host adapter not installed at port address [port].

IEPCHA0002 Internal diagnostic failed at port address [port].

IEPCHA0003 DMA channel initialization failed.

IEPCHA0004 Interrupt channel initialization failed.

IEPCHA0005 Return configuration data failed.

IEPCHA0006 Enable target mode failed.

IEPCHA0007 No operation test failed.

IEPCHA0008 Mailbox initialization failed.

IEPCHA0009 Adapter inquiry failed.

IEPCHA0010 Board identification reserved.

IEPCHA0011 Special options ID reserved.

IEPCHA0012 Firmware revision reserved.

IEPCHA0013 Return installed devices failed.

IEPCHA0014 SCSI ID is [id] expected ID is [id2].

IEPCHA0015 SCSI device driver installation failure.

IEPCHA0016 Open SCSI channel [channel] failed.

IEPCHA0017 Test unit ready failed on channel [channel].

IEPCHA0018 SCSI inquiry failed on channel [channel].

IEPCHA0019 Request sense failed on channel [channel].





IEPCHA0020 Host adapter not idle at port address [port].

IEPCIN0001 Could not allocate memory.

IEPCIN0002 Configuration file not found.

IEPCIN0003 Too many file specifed.

IEPCIN0004 Syntax error in configuration file.








IEPCLP0001 Prefix not available.

IEPCLP0002 Invalid data length.

IEPCLP0003 Data integrity error.

IEPCLP0004 State of CAR Module: Undefined.

IEPCLP0005 State of CAR Module: Unexpected.

IEPCLP0006 Invalid message code.

IEPCLP0008 Response status undefined.

IEPCLP0009 POC result undefined.

IEPCLP0010 Invalid error code.

IEPCLP0011 Error message expected.

IEPCUS0001 Configuration file PCSWCONF.TXT not found.

IEPCUS0002 Cannot open PCSWCONF.TXT.

IEPCUS0003 No data in configuration file.

IEPCUS0004 Upgrade file A:PCBSUPDT.BAT not found.

IEPC__0001 Configuration file PCSWCONF.TXT not found.

IEPC__0002 Error in configuration file PCSWCONF.TXT.

IEPC__0003 Configuration number missing.

IEPC__0004 No configuration data for AU available.

IEPC__0005 No data expected.





IEPC__0006 LOG file entry denied, error in file handling.

IEPC__0007 Data expected.

IEPC__0008 Download still running. Stop download first.

IEPC__0009 Download ID not found: [Download-ID]-.

IEPC__0010 No download list in configuration file.

IEPC__0011 Download not running, no loadlist specified.

IEPC__0012 Error in download file: [Filename].

IEPC__0013 Download file not found: [Filename].

IEPC__0014 Syntax error.

IEPC__0015 Upload medium not writable.

IEPC__0016 Upload not running.

IEPC__0017 Receive command not expected from PC.

IEPC__0018 Upload ID not found: [Upload-ID].

IEPC__0019 Error in upload list.

IEPC__0020 Upload still running, stop upload first.

IEPC__0021 Message out of range.

IEPC__0022 Bad parameter with message.

IEPC__0023 Upload device not installed.

IEPC__0024 Error in upload file: [Filename].

IEPC__0025 Upload medium write protected.

IEPUEP0010 Wrong command name during download program.

IEPUEP0011 Checksum error in Download Program command.

IEPUEP0012 Checksum error in Start Program command.

IEPUEP0013 Command Download Program is missing.

IEPUEP0014 Wrong transmit/receive name in Download Program.

IEPUEP0015 Wrong transmit/receive name in Start Program.

IEPUEP0016 Wrong receipt from AU on serial interface.

IEPU000021 <pppp> Wrong command list in AU disposition.

<pppp> = Actual command list.





IEPU000022 <eeee> <aaaa> Wrong receipt from AU on serial interface.



IEPU000023 Wrong command from AU on serial interface.

IEPU000024 More than 30 dispositions received from AU.

IEPU000025 More than 30 free CRU numbers received from AU.

IEPU000026 PU mode is missing.

IEPU000027 Checksum error in RL command.

IEPU000028 Checksum error in RD command (upload request data).

IEPU000029 Checksum error in 09 command (disposition from AU).

IEPU000030 Interrupt sequence on video interface is wrong.

IEPU000031 Command 09 (disposition from AU) is missing.

IEPU000032 The field width is exceeded.

IEPU000033 The field width is too small.

IEPU000034 The locations defined in disposition are false; field width is lessthan or equal to 0.

IEPU000035 Two fields defined in disposition.

IEPU000036 FIFOs for video interface are not empty.

IEPU000037 Transmit buffer for serial interface overflowed.

IEPU000038 PU buffer overflowed.

IEPU000039 <ssss> <dddd> Document ID number in ID line is not identical to sync number fromdisposition.


<dddd> = Doc ID number in ID line

IEPU000042 <eeee> <aaaa> Checksum error in RD command.



IEPU000043 <eeee> <aaaa> Checksum error in RP command.







IEPU000044 <eeee> <aaaa> Checksum error in DD command.



IEPU000045 <eeee> <aaaa> Checksum error in DP command.



IEPU000061 Video data missing.

IEPU000062 No test ID line received.

IEPU000063 No free CRU.

IEPU000066 <ssss> <dddd> Doc ID number is not identical to sync number of dispo message.


<dddd> = Doc ID number from ID line

IEPU000067 Document not in PU buffer.

IE<ru>020012 <kkkk> <llll> <ssss><rrrr> <cccc>

CRU <ru> received a command with checksum error on the SBUS.

<kkkk> = Name field of received command

<llll> = Length field of received command

<ssss> = Sender field of received command

<rrrr> = Right checksum of received command

<cccc> = Checksum field of received command

IE<ru>020013 <aaaa> CRU <ru> received a command with an unknown instruction on theSBUS.

<aaaa> = Received instruction


CRU <ru> received a command with an unknown command nameon the SBUS.




<rrrr> = Receiver field of received command






IE<ru>020015 <kkkk> <llll> <ssss><rrrr>

CRU <ru> received a command with a not allowed length field onthe SBUS.






CRU <ru> received a command with with an unknown receivername on the SBUS.






IE<ru>020017 <kkkk> <llll> <ssss><rrrr> <wwww>

CRU received a XA command with an unknown receiver in the datafield.





<wwww> = Wrong parameter of received command

IE<ru>020990 Parity error in program memory of CRU <ru>. Possible hardwareerror. CRU <ru> becomes disabled.

IE<ru>020999 <nnnn> Internal error in BOSRU. CRU <ru> becomes disabled.


IE<ru>260001<pppp> Hardware or Character Recognition software error.

<pppp> = Error and task that detected error

INAU079040 <pppp> <qqqq> State of CAR unit changed.

<pppp> = Old State of CAR unit

<qqqq> = New State of CAR unit

INAU079041 CAR Status manager started.

INAU079042 <pppp> CRU enabled.

<pppp> = Number of CRU

INAU079043 <pppp> CRU disabled.






INAU<id>5343 0200 0001 Power-on reset reported to PC.

INAU<id>5343 0200 0002 Power-on reset reported to DP.

INAU<id>5343 0200 0003 Power-on reset reported to PC with logical unit number greaterthan 0.

INAU<id>5343 0200 01<xx> Power-on reset reported to PC with logical unit number greaterthan 0.

<xx> = SCSI ID of initiator and target

INAU<id>5343 0300 0100 Unexpected ESP status.

IWAU030330 <kkkk> <llll> <ssss><rrrr> <cccc>

Unknown command name on the SBUS.






IWAU030332 <kkkk> <llll> <ssss><rrrr> <cccc>

Unknown sender name on the SBUS.






IWAU030711 <ssss> <nnnn> <aaaa><llll>

Wrong parameter in RD command.


<nnnn> = Number of data page

<aaaa> = Address of data page

<llll> = Length of requested data

IWAU030712 <ssss> <nnnn> <aaaa><llll>

Wrong parameter in RP command.









IWAU059240 <pppp> <qqqq> <rrrr><ssss>

Format of response message from PC incorrect.

<pppp> = Error reason:

= 0350 Message too short (less than 6 bytes), or message length field not 0.

= 0340 Message code not 0xa0

<qqqq> = Number of bytes sent by PC

<rrrr> = Message length field of message, if present

<sssss> = Message code, if present


Response command from PC has incorrect length field.

<pppp> = Error reason:

= 0320 Command Length less field too small (<3)

= 0330 Message does not contain full command

<qqqq> = Number of bytes sent by PC

<rrrr> = Command name field

<ssss> = Command length field


User buffer too small for PC response command.

<pppp> = Error reason 0300 means the user buffer is too small.

<qqqq> = Command name field

<rrrr> = Command length field

<ssss> = User buffer size

IWAU059243 <pppp> <qqqq> <rrrr><ssss> <tttt>

Checksum of response command from PC incorrect.

<pppp> = Wrong command checksum

<qqqq> = Command name field

<rrrr> = Command length field

<ssss> = Checksum received

<tttt> = Checksum evaluated by PC_Stdout

IWAU060390 SCSI buffer MTR Send is not free.

IWAU079001 Error message output buffer (queue) overflow.

IWAU079024 <pppp> Enable command given for CRU that is already enabled.Command ignored.






IWAU079025 <pppp> Disable command given for CRU that is already disabled.Command ignored.


IWAU079026 <pppp> Tried to enable a defective CRU.


IWAU079027 <pppp> Tried to enable or disable nonexistent CRU.


IWAU079028 <pppp> <qqqq> Invalid state for received command.

<pppp> = State of CAR unit

<qqqq> = Name of command not allowed in this CAR state

IWAU079029 <pppp> Timer Interrupt detected wrong functions.

<pppp> = Value of global variable

= 0080: Power Fail detected

IWAU079030 <pppp> Bad parameter received with message from DP.

<pppp> = Message code received from DP

IWAU079031 <pppp> Bad message code received from DP.


IWAU079032 <pppp> DP sent a message which is not allowed in current state.


IWAU0A0710 <aaaa> <nnnn> Wrong parameter in XA command.

<aaaa> = First data word

<nnnn> = Second data word

IWAU0A0822 <llll> Command too long on MTR channel.


IWAU0A0826 <kkkk> <llll> <ssss><rrrr> <cccc>

Checksum error on the MTR channel.











Unknown receiver name on the MTR channel.







Unknown command name on the MTR channel.






IWAU140103 <nnnn> <ssss> CRU number <nnnn> is in error status and became disabled.

<nnnn> = CRU number

<ssss> = Statusword of CRU <nnnn>

IWAU140104 <nnnn> <ssss> CRU number <nnnn> did not successfully start its BOSRU. TheCRU is disabled.

<nnnn> = CRU number.


IWAU<id>0100 Spurious interrupt on SBUS. The AU received a SBUS interrupt,but no CRU wanted to send a command.

IWAU<id>0101 <nnnn> <ssss> CRU <nnnn>, which is marked not ready, sent a command

<nnnn> = CRU number


IWAU<id>0105 <nnnn> <ssss> CRU number <nnnn> did not successfully respond to the RLcommand. The CRU is disabled.

<nnnn> = CRU number


IWAU<id>0310 <nnnn> <ssss> Timeout while sending an RX instruction to CRU <nnnn>. The CRUis disabled.

<nnnn> = CRU number






IWAU<id>0320 <nnnn> <ssss> Timeout while receiving the header of a command from the SBUS.The CRU is disabled.

<nnnn> = CRU number


IWAU<id>0322 <nnnn> <kkkk> <llll> Command too long on the SBUS. CRU <nnnn> is disabled.

<nnnn> = CRU number

<kkkk> = Name field of received command (first word ofcommand)

<llll> = Length field of received command (second word ofcommand)

IWAU<id>0324 <nnnn> <kkkk> <llll><ssss> <rrrr>

Timeout while receiving a command from CRU <nnnn>. The CRUis disabled.

<nnnn> = CRU number



<ssss> = Sender field of received command (third word ofcommand)


IWAU<id>0326 <kkkk> <llll> <ssss><rrrr> <cccc>

Checksum error on the SBUS.




<rrrr> = Calculated checksum of received command

<cccc> = Checksum field of received command (last word ofcommand)





IWAU<id>0328 <kkkk> <llll> <ssss><rrrr> <cccc>

Unknown receiver name on the SBUS.




<rrrr> = Receiver field of received command (fourth word ofcommand)

<cccc> = Checksum field of received command (last word ofcommand)

IWAU<id>0400 <nnnn> <ssss> CRU <nnnn> was not ready to receive a command and becamedisabled.

<nnnn> = CRU number


IWAU<id>0410 <nnnn> <ssss> Timeout while sending an RY instruction to CRU <nnnn>. The CRUis disabled.

<nnnn> = CRU number


IWAU<id>0424 <nnnn> <ssss> Timeout while sending a command to CRU <nnnn>. The CRU isdisabled.

<nnnn> = CRU number


IWAU<id>0500 <nnnn> <ssss> <aaaa> Timeout while AU sending an instruction to CRU <nnnn>. The CRUis disabled.

<nnnn> = CRU number


<aaaa> = Instruction to be sent

IWAU<id>0713 <ssss> <nnnn> <aaaa><llll>

Wrong parameter in DD command.









IWAU<id>0714 <ssss> <nnnn> <aaaa><llll>

Wrong parameter in DP command.





IWAU<id>2010 Call for serial output with length 0.

IWAU<id>2026 Interrupt for serial input. RU does not receive document.

IWAU<id>2032 Field width or height in disposition is out of range. Warning to PC.Field reject with error code $20.

IWAU<id>2061 <pppp> <rrrr> Timeout for document with number of fields = 0.

<pppp> = Sync byte

<rrrr> = Field code

IWAU<id>2064 <pppp> <rrrr> More amounts processed than dispo messages received.

<pppp> = Sync byte

<rrrr> = Field code

IWAU<id>5343 0100 01<xx> Incorrect length of command descriptor block (CDB). Commandignored.


IWAU<id>5343 0100 02<xx> Command code in CDB not defined.


IWAU<id>5343 0100 03<xx> Initiator ID not defined.


IWAU<id>5343 0100 04<xx> Send command not expected from PC. Program error in PCsoftware or incorrect command sequence after SCSI reset.Command ignored.


IWAU<id>5343 0100 05<xx> Data length in CDB with Send command greater than 2K bytes.Program error in PC software. Only 2K bytes data transferred.


IWAU<id>5343 0100 06<xx> Receive command not expected from PC. Program error in PCsoftware or incorrect command sequence after SCSI reset.Command ignored.






IWAU<id>5343 0100 07<xx> Data length in CDB = 0 from PC Program error in PC software.Command ignored.


IWAU<id>5343 0100 08<xx> Data length for Receive command greater than allocated length.Program error in PC software or M-AU data length greater than 2Kbytes. Data limited according to allocation length.


IWAU<id>5343 0100 09<xx> Allocation length for SENSE command less than 8 bytes Programerror in initiator software. Command ignored.


IWAU<id>5343 0100 0A<xx> Undefined LUN in CDB from PC Program. Error in PC software.Command ignored.


IWAU<id>5343 0100 0B<xx> Receive command not expected from DP. Program error in DPsoftware or incorrect command sequence after SCSI reset.Command ignored.


IWAU<id>5343 0100 0C<xx> Allocation length in CDB with INQUIRY command less than 96bytes Program error in initiator software. Data limited accordingto allocation length.


IWAU<id>5343 0100 0D<xx> Data length for Receive command greater than allocated lengthProgram error in DP software or M-AU data length greater than 2KbytesData limited according allocation length.


IWAU<id>5343 0100 0E<xx> Send command not expected from DP. Program error in DPsoftware or incorrect command sequence after SCSI reset.Command ignored.


IWAU<id>5343 0100 0F<xx> Data length in CDB with SEND command greater than 2K bytesProgram error in DP software. Only 2K bytes data transferred.


IWAU<id>5343 0100 10<xx> Allocation length with INQUIRY command = 0 Program error ininitiator software. Command ignored.


IWAU<id>5343 0100 11<xx> Target selected W/O ATN. No identify message received frominitiator.






IWAU<id>5343 0100 12<xx> Target selected W/O ATN and incorrect length of CDB. Commandignored.


IWAU<id>5343 0100 13<xx> Data length in CDB with SEND command = 0 Program error in DPsoftware. Command ignored.


IWAU<id>5343 0100 14<xx> Allocation length = 0 with Receive command. Program error in DPsoftware. Command ignored.


IWAU<id>5343 0100 15<xx> Allocation length = 0 with Receive command Program error in PCsoftware. Command ignored.


IWAU<id>5343 0101 01<xx> Data for Receive command issued by PC not available. Occurs innormal operation. Command ignored.


IWAU<id>5343 0101 02<xx> Data for Receive command issued by DP not available. Occurs innormal operation. Command ignored.


IWAU<id>5343 0102 00<xx> Program error in AU software. Command ignored.


IWAU<id>5343 0102 03<xx> Buffer on M-AU for SEND command from DP not free Programerror in AU software. Command ignored.


IWAU<id>8101 <pppp> <rrrr> Invalid state for message.

<pppp> = State of CAR unit

<rrrr> = Message code

IWAU<id>8102 <pppp> Invalid message code.

<pppp> = Message code

IWAU<id>8104 <pppp> <rrrr> Message length does not correspond with this message.


<rrrr> = Message length





IWAU<id>8105 <pppp> <rrrr> <ssss> Received message length is not the same as message length bytetransmitted with message.


<rrrr> = Message length

<ssss> = Message length received

IW<ru>020021 <kkkk> <llll> <ssss><rrrr>

Timeout on receiving a command on VIBUS. CRU <ru> becomesdisabled.





Note: The reported parameters may be wrong. They could bethe parameters of the last right command receivedbefore.

IW<ru>020022 <kkkk> <llll> <ssss><rrrr> <cccc>

Checksum error on VIBUS. CRU <ru> may be disabled.







Unknown command name on VIBUS. CRU <ru> may be disabled.






IW<ru>020025 <kkkk> <llll> CRU <ru> received a command with disallowed length field onVIBUS. CRU <ru> may be disabled.








Unknown receiver name on VIBUS. CRU <ru> may be disabled.






IW<ru>020027 <kkkk> <cccc><dddd> <ssss> <tttt>

Pixel Image too large to fit in memory. CRU <ru> may bedisabled.


<cccc> = Horizontal coordinate of image corner.

<dddd> = Vertical coordinate of image corner.

<ssss> = Horizontal size of the image

<tttt> = Vertical size of the image

IW<ru>020028 <kkkk> <llll> <ssss><rrrr> <dddd>

CRU <ru> received a command. The number of VI words doesnot fit in the reserved memory.





<dddd> = Number of vi-words to be received


CRU <ru> received too many commands without a VE commandon the VIBUS. CRU <ru> may be disabled.






IW<ru>020710 <aaaa> <nnnn> First data word of XA command is an unknown instruction orsecond data word of XA command is an unknown logical device.

<aaaa> = First data word of XA command

<nnnn> = Second data word of XA command





IW<ru>020711 <ssss> <nnnn> <aaaa><llll>

The length of the requested data is too long.



<aaaa> = Address in data page



The length of the requested program code is too long.


<nnnn> = Number of program page

<aaaa> = Address in program page

<llll> = Length of requested program code


Unknown data page or address plus length is greater than 0xffff.



<aaaa> = Address in data page

<llll> = Length of downloadable data


Unknown program page or address plus length greater than 0xffff.


<nnnn> = Number of program page

<aaaa> = Address in program page

<llll> = Length of downloadable program code

IW<ru>260001 Error video command input, data are inconsistent. PU error, videobus error, or video bus driver error.

IW<ru>260002 Errors in video command input are such that commands cannot beevaluated.

IW<ru>260003 Wrong input data from DP.

IW<ru>260004 Wrong Unisys input data.

IW<ru>260005 Plausibility check detected error in CRS software.

IW<ru>260006 Error on system bus input. Erroneous data capture command.

S AU079015 No CRU ready with Flow Started.

S AU<id>2024 <pppp> Interrupt for serial input with command video received. Video toolate - timeout. CAR unit goes to Sync Error state.

<pppp> = Sync

S AU<id>2030 CAR unit receives the 16th disposition before receiving the imagebelonging to the first one. CAR unit goes to Sync Error state.





S AU<id>2060 <pppp> <rrrr> Timeout for document, no video. CAR unit goes to Sync Errorstate.

<pppp> = Sync

<rrrr> = Field code

S PU000001 <pppp> <rrrr> Document ID number in ID line is not identical to sync number fromdisposition.

<pppp> = Sync number from AU dispo

<rrrr> = Doc ID number in ID line

S PU000002 Video data received, no disposition message present.

S PU000003 <pppp> Error on video interface.

<pppp>

Bit0 = 1 parity errorBit1 = 1 Hardware test of video interface (test = 1), the

signals at the four video channels are not identicalBit2 = 1 Number of pixels between 2 control signals EOS are

not divisible by sixteen.

S PU000004 Fewer than 128 clock cycles between 2 control signals EOS.

S PU000005 More than 128 clock cycles between 2 control signals EOS.

S PU000006 FIFO for video interface overflowed.

S PU000007 FIFO for video interface is not empty.

S PU000008 <pppp> <ssss> <iiii> Number of words in FIFO for ID line is false.

<pppp>

0001 = Special situation0002 = FIFO underflow0003 = FIFO overflow0004 = verflow of scanline counter

<ssss> = Number of scanlines

<iiii> = Number of ID lines

XEAU079015 No CRU ready with Flow Started.

XEAU<id>2024 <pppp> Interrupt for serial input with command video received. Video toolate - timeout. CAR unit goes to Sync Error state.

<pppp> = Sync

XEAU<id>2030 CAR unit receives the 16th disposition before receiving the imagebelonging to the first one. CAR unit goes to Sync Error state.





XEAU<id>2060 <pppp> <rrrr> Timeout for document, no video. CAR unit goes to Sync Errorstate.

<pppp> = sync

<rrrr> = field code

XEPU000001 <pppp> <rrrr> Document ID number in ID line is not identical to sync number fromdisposition.

<pppp> = Sync number from AU dispo

<rrrr> = Doc ID number in ID line

XEPU000002 Video data received, no disposition message present.

XEPU000003 <pppp> Error on video interface.

<pppp>

Bit0 = 1 parity errorBit1 = 1 Hardware test of video interface (test = 1), the

signals at the four video channels are not identical.Bit2 = 1 Number of pixels between 2 control signals EOS are

not divisible by sixteen.

XEPU000004 Fewer than 128 clock cycles between 2 control signals EOS.

XEPU000005 More than 128 clock cycles between 2 control signals EOS.

XEPU000006 FIFO for video interface overflowed.

XEPU000007 FIFO for video interface is not empty.

XEPU000008 <pppp> <ssss> <iiii> Number of words in FIFO for ID line is false.

<pppp>

0001 = Special situation0002 = FIFO underflow0003 = FIFO overflow0004 = verflow of scanline counter

<ssss> = Number of scanlines

<iiii> = Number of ID lines



CAR Diagnostic Flows

Table 24–4. CAR Diagnostic Flows

Next Step


10 Verify that there is power to theCAR unit by listening for the fansturning and by checking the LEDson the PCBAs.

Is there power to the CAR unit? 90 20

20 Verify that A power is reaching theCAR power supply.

Is there a problem with the ACpower?

Correct asneeded.

30

30 Verify that the rest of the NDP1XXX is getting power.

Is the rest of the NDP 1XXXgetting power?

40 Go to"GeneralConditions,Causes, andCorrections"in Section12,"Condition,Cause,CorrectionTable."Follow thecorrectionsfor the"CannotPower On"condition.

40 Measure the CAR power supplyvoltages on the backplane of theCAR unit:

Remove the cable from connectorJ53IT. Measure the voltage to pin1 (5 VDC).

Remove the cable from connectorJ531B. Measure the voltage to pin1 (5 VDC).

Are all voltages correct? 90 Replace theCAR powersupply.

90 Press the reset button on top ofthe CAR unit, or power the NDP1XXX off and on to rerun the POCtests.

Observe the LEDs on eachPCBA using Figure 24–1 andFigure 24–2 as a guide. Did thePOC test pass on each PCBA?

100 Replace thefailed PCBAs.

100 Test the PU PCBA in the CAR testslot. Refer to "Card Cage TestSlot," earlier in this section, forfurther instructions.

Did the PU PCBA pass the testslot test?

110 Replace thePU board.



Table 24–4. CAR Diagnostic Flows

Next Step


110 Test the RU PCBAs in the CAR testslot. Refer to "Card Cage TestSlot," earlier in this section, forfurther instructions.

Did the RU PCBAs pass the testslot test?

115 Replace anyfailed RUPCBA.

115 Test the AU PCBA in the CAR testslot. Refer to “Card Cage TestSlot” earlier in this section forfurther instruction.

Did the AUBA pass the test slottest?

140 120

120 Replace the AU board. Does the problem still exist? 130 Exit the flow.

140 Verify that the following cables areproperly connected and do notshow any sign of failure:

• AC Power Cable• Video Cable• SCSI Cable (CAR to ICS)

Note: For the NDP 1825 CARmodule, there are twoSCSI connectors on theCAR backplane, X15 andX16. X15 is a differentialSCSI and X16 is a single-ended SCSI. The cableconnecting the ICS to theCAR box shouldbeattached to the X15differential connector.

Did any cable have a problem?

Note: If the SCSI cable was aproblem, power theNDP 1XXX off and onto reestablishcommunications.

Replace thesuspectcable.

160

160 The problem cannot be isolatedusing the diagnostic procedures.Possible causes include thefollowing:

• Incorrect power supply voltage• Loose connection in power

supply• Bad backplane


Section 25 NDP 1150 MJE DiagnosticProcedures

This section provides information on diagnosing faults in the 1150 MJE.

MJE OperationThe 1150 MJE provides ink-jet endorsement on the rear of documents flowing through theNDP 1150.

The 1150 MJE is composed of 5 main hardware components: the Print Cartridges (2 areused), the Print Head Assembly which holds the 2 print cartridges, the LCMJE Driverboard, the LCMJE Interface board (Card 9), and the transport mechanism.

Transport drive belts and pulleys control movement of the documents past the print headassembly, located at the right end of Area 1.

The Common API software provides a track control interface, nearly identical to theNDP 250/500 MJE interface, which controls the 1150 MJE. This track control softwareinterfaces from the NDP PC, through a dual port interface on the LCMJE board.

Controlware, residing in FLASH Memory on the LCMJE Interface board takes commandsfrom the track control SSW and provides commands, through a serial interface, to thedriver board. The LCMJE Driver board houses the electronics required to drive the dropletgenerators in each of the print cartridges, producing endorsed characters on documentsflowing through the transport.

The 1150 MJE utilizes a replaceable print cartridge with its own ink supply and dropletgeneration electronics. This cartridge is the same one used with the NDP 250/500 MJE,however the 1150 uses two cartridges to assure printing quality at the 150 ips track speed.Both cartridges print the same pattern, resulting in double droplets. This techniquecreates darker print for better microfilm/image readability and reduced ink usage.However, even with double droplets, a new font shaping was added which actually cuts thetotal ink use.

For Dual systems (Front and Rear endorse), an extra LCMJE driver board, an extra printhousing, 2 additional print cartridges and additional drive rollers are provided to allowendorsing on the front of the document, as well.

Updates for Common API SSW are delivered on CD-ROM. Updates for Controlware(FLASH) on the LCMJE are downloadable.

NDP 1150 MJE Diagnostic Procedures


The document processor system software includes online help that provide operationalinstructions for the MJE. Procedures and videos for changing the print cartridge andadjusting the print height are included.

The main problem categories are:

• Printing Quality

• Out-of-Ink Errors

• Jams

• Error Codes Displayed

Use the following flow to diagnose problems:

Note: Re-execute the Main Flow after correcting the problems below.

Error Code orError

Message? Followon-screen

instructions.

Run the Exerciser with 4 lines ofText and a Logo.

Evaluate the Endorsed Print andresolve problems using Table

25–1 and the FRU list.

No

YesMain Flow



Table 25–1. Main Flow

Problem Possible Cause Procedure

Weak or Bad Print Bad/dirty cartridge Clean cartridges using the operator help fileprocedures, Replace if necessary (Mustreplace BOTH cartridges at once). Ifcartridges are replaced, answer ‘yes’ whenasked if the cartridges are new.

One printhead not printing Verify that cables are connected from thehousing assembly to the driver card andthat all cables are connected to the drivercard.

Use the following procedure:

1. Power down and install a jumper atposition 3 on the LCMJE Interface Card(AA Card 9).

2. Using the Exerciser, load theUPDOWN.GF logo, positioned at 3inches. Print the logo on 8-9" blankdocuments. The pattern shows twodark rectangles. The upstream headprints the right rectangle and thedownstream head prints the leftrectangle. Note which head may beprinting badly.

3. Leaving the power on with an interlockopen, identify the upstream anddownstream cables going to the printhead from the LCMJE driver board(mounted on the underside ofbaseplate directly beneath the MJETrack). Swap the upstream anddownstream cables at the board.

4. Reprint the UPDOWN.GF logo. Theprinting in each print position is nowswitched. The downstream driver isnow printing the right rectangle andthe upstream driver is now printing theleft rectangle. Evaluate the print. Ifthe bad printing changed positions, F3.If the bad printing stayed in the sameplace, F2.

5. Swap the driver cables back beforereplacing the FRU.

Downstream/upstream air hosestransposed

Remove and reinstall hoses, ensuring thatthe downstream hose is connected to a “D”port and the upstream hose is connectedto a “U” port on the manifold.

Fuzzy Print Drive belts too loose Adjust drive belt tension per T&A



Table 25–1. Main Flow

Problem Possible Cause Procedure

Improper head assembly position Adjust print housing assembly per T&A

Incorrect print head registration Adjust print registration per T&A

Ink Smearing ondocuments/walls/rollers

Blower driver PCBA or hosesproblem

Open track wall and verify air flow at airvent holes. If no air flow, check blower andhoses and replace as necessary.Otherwise, F3 or F6, if required.

Jams in MJE Area Housing assembly not positionedcorrectly

Adjust housing assembly per T&A

Walls not adjusted properly Adjust wall spacing per T&A

Blower driver PCBA or hosesproblem

Open track wall and verify air flow at airvent holes. If no air flow, check blower andhoses and replace as necessary.Otherwise, F3 or F6, if required.

No Print Bad/dirty cartridges Clean cartridges using the operator help fileprocedures, Replace if necessary (Mustreplace BOTH cartridges at once). Ifcartridges are replaced, answer ‘yes’ whenasked if the cartridges are new.

Cables disconnected Check cables from driver to printheads andfrom interface to driver. Reconnect asnecessary

No power to driver board Measure power to board. Check thatinterface board is seated in correct slot.

If no power, check wiring and appropriatepower supply output voltages

Driver/Interface Board Check that the interface board is seated inits connector. If so, F5.

Print Cartridge Missingmessage, even withcartridges installed

Print Housing assembly orcables faulty

Replace both cartridges with new ones

Verify that the LCMJE driver card to printhousing assembly cables are connected. Ifthe cables are ok, F7.

Communications error withLCMJE module

LCMJE Interface board bad. Replace F4

POC/Error Codes on screen Various. Follow the on screen instructions andreplace the suspect components one at atime, beginning with "Suspect 1".

MTR Error Codes on screenmodule

Various Replace suspect components indicated byMTR Error Code Index Table (Table 25–2)



Table 25–2. MTR Error Code Index

Manual Procedure Error Description Primary Secondary

LCMJE 00 01 MJE dualport RAM not enabledfor multibus access

F4

LCMJE 00 02 Time out waiting for MJEsdualport RAM semaphore to bereleased by MJE

F4

LCMJE 00 03 Invalid test command responsereceived from the MJE

F4

LCMJE 00 04 MJE Module communicationsfailure.

F4

LCMJE 01 01 Rear MJE driver board timed outwhen getting a response.

F3 F2

LCMJE 01 02 Front MJE driver board timed outwhen getting a response.

F3 F2

LCMJE 04 01 MJE Module failure: Non-volatileRAM write/read test erroroccurred.

F4 --

LCMJE 04 02 MJE Module failure: Non-volatileRAM address test erroroccurred.

F4 --

LCMJE 05 01 Rear MJE Module failure: A driverboard timeout occurred duringthe head purge.

F3 F2

LCMJE 05 02 Front MJE Module failure: Adriver board timeout occurredduring the head purge.

F3 F2

LCMJE 06 01 Rear MJE Module failure: A driverboard timeout occurred duringthe print logic test.

F3 F2

LCMJE 06 02 Front MJE Module failure: Adriver board timeout occurredduring the print logic test.

F3 F2

LCMJE 07 01 Rear MJE Module failure: Unableto read the upstream print headthermal sensor.

F8

LCMJE 07 02 Front MJE Module failure: Unableto read the upstream print headthermal sensor.

F8



Table 25–2. MTR Error Code Index (cont.)

Manual Procedure Error Description Primary Secondary

LCMJE 08 01 Rear MJE Module failure: Unableto read the upstream print headthermal sensor.

F8

LCMJE 08 02 Front MJE Module failure: Unableto read the upstream print headthermal sensor.

F8

LCMJE 09 01 MJE Module failure: Busexception occurred whileaccessing the MJE’s dual portRAM.

F4 --

LCMJE 09 02 MJE Module failure: Dual portRAM write/read failure occurred.

F4

LCMJE 11 01 Rear MJE Ambient TemperatureSensor Error.

F2 F3

LCMJE 11 02 Front MJE Ambient TemperatureSensor Error.

F2 F3



Field Replacement Units (FRUs)The following is a list of FRUs.

FRU Part to Replace

F1 Print cartridge(s)

F2 Print housing assembly

F3 LCMJE driver board

F4 LCMJE interface board

F5 Replace in the following sequence: LCMJE driver board, LCMJE interface board, cables

F6 Blower assembly

F7 Replace in the following sequence: print housing assembly and then LCMJE driver card

F8 Replace in the following sequence: print cartridge indicated driver PCBA print housing assembly cable connected from driver board to print housing assembly


Section 26 Full-Height OCR Reader Procedures

This section provides procedures for inspecting and verifying FH OCR reader functionality.It includes power-on confidence (POC) tests and the manual procedures for the FH OCRreader.

The FH OCR Reader Diagnostic SystemThe FH OCR reader contain built-in POC tests which provide the CSE with repair messageson the document processor screen. The OCR manual procedures, a block diagram of thereader system, and a CCC (Condition, Cause, and Correction) table are included. The POCtests, in conjunction with the manual procedures, generally diagnose to the fieldreplaceable unit (FRU). To correct the fault, you must replace the indicated FRU andrerun the tests.

At times when the POC tests do not detect a problem, such as reduced operating efficiencyof the reader, you can isolate the problem using the CCC table. This table lists variousoperational symptoms that indicate a particular problem within the reader unit. The tableincludes a procedure for you to fix the problem or reference to additional information thatyou can use for further diagnosis.

Error HandlingMessages for faults in the OCR reader diagnosed by the POC tests are displayed on thedocument processor screen and refer to procedures in this manual. All electronic,electromechanical, and mechanical faults for the OCR reader fall into three categories:

• Obvious failures that require no additional direction to be corrected. You correct thesefailures using procedures based upon your product knowledge.

• Subtle or difficult to isolate failures that prevent or hamper operations. These failuresdisplay a failure message or code on the screen when POC tests are executed.

When failures and corrections are not obvious, you must execute the POC tests.

− If the POC reports a failure message, you must perform the procedure stated bythe message.

− If the POC fails to complete and does not display a failure message, you shouldconsult the CCC table for an appropriate analysis procedure.

Full-Height OCR Reader Procedures


• Obvious Failures that require additional direction to be corrected. These failures havethe following characteristics:

− They have hidden causes.

− They do not have obvious corrections.

− They do not generate a failure message or fault code when POC tests or MTRs areexecuted.

− You need to use the OCR reader Condition, Cause, Correction (CCC) table fordirection to perform the necessary corrective action.



General Repair GuidelinesWhen a POC test detects an error in the reader system, a fault code is displayed on thedocument processor screen. Noting the fault code, go to the appropriate fault code in theFH OCR fault recovery procedures below and follow the steps listed. Most of the stepswill involve replacing a board or component or by otherwise verifying that it is functioningcorrectly. It may be possible to verify that certain components are functioning correctly,such as power supplies, switches, and harnesses without actually replacing them.

Whenever a test indicates that you should replace a board, you should first verify that theboard is not loose in its slot or that connections to the board or backplane are not loose.Also, while a board is removed from its slot or the board has its cabling removed, youshould carefully inspect the backplane connector and/or cable connectors for bent,corroded, or otherwise damaged contacts.

Some faults could be caused by one of two boards or the interconnecting circuitry betweenthem. To correct the fault, you must go to the manual procedures specified by the messageon the screen and carefully follow those procedures.

Each reader in the FH OCR reader system will generate its own fault codes. In a dualreader system, a fault code will be displayed on the document processor screen for each ofthe readers that exhibits a failure. Although the OCR1 and OCR2 recognition boards areidentical, the error detection and reporting of error codes are handled in a slightly differentmanner depending upon which slot the board is in. Since OCR1 provides the interface toand control over the camera and lamp control boards, and OCR2 is essentially a slave,some of the failure codes that apply to OCR1 do not apply to OCR2.

In addition, some of the OCR2 tests depend upon OCR1 functioning correctly; OCR1failures may cause apparent failures in OCR2 and thus OCR1 failures should be repairedbefore OCR2 failures. Often, repairing the OCR1 problem will in itself correct the OCR2problem.



FH OCR Reader System Block Diagram



FH OCR Fault Recovery Procedures200000 FHO 01 00 01

OCR1 Master processor memory Failure. TheOCR1 Recognition Board’s master processordetected an internal memory fault.


100 Replace OCR1 Recognition board (AA14) andrerun POC



200010 FHO 01 00 02

OCR1 FLSA Processor Loopback Failure. TheOCR1 Recognition Board’s master processorcould not communicate with the FLSAprocessor.





200020 FHO 01 00 03

OCR1 Framer Processor Loopback Failure. TheOCR1 Recognition Board’s master processorcould not communicate with the framerprocessor.







200030 FHO 01 00 04

OCR1 Framer Processor Loopback Failure. TheOCR1 Recognition Board’s master processorcould not communicate with the recognitionprocessor.





200040 FHO 01 00 05

OCR1 Framer Processor Memory Failure. TheOCR1 Recognition Board’s framer processordetected an external memory error.





200050 FHO 01 00 06

OCR1 Recognition Processor Memory Failure.The OCR1 Recognition Board’s recognitionprocessor detected an external memory error.





200060 FHO 01 00 07

OCR1 Interrupt Failure. The OCR1 RecognitionBoard detected a fault in its interrupt system.







200070 FHO 01 00 08





200080 FHO 01 00 09

OCR1 Video Processor Failure. The OCR1Recognition Board detected an error in its videoprocessing logic.





200200 FHO 01 00 32

OCR1 Camera Loopback Failure. The OCR1Recognition Board could not communicate withthe camera.


100 Check the cable connection between thebackplane and the camera and rerun POC




300 Replace the camera harness and rerun POC


400 Replace the Camera Assembly and rerun POC





200210 FHO 01 00 32

OCR1 Camera Video Failure.The OCR1 Recognition Board received incorrectvideo patterns from the camera.


100 Check the reader lamps

Are the lamps stuck in the high intensity mode? 150 500

150 Check the lamp control interface harnessconnections and the lamp control harnessconnections

Are the lamps still in the high intensity mode? 200 500

200 Replace the Lamp Control Board and rerun POC




300 Replace the lamp control interface harness andrerun POC


350 Replace the lamp control harness and rerun POC


500 Check the POC results

Does the original failure (camera video incorrect)still exist?

550 950

550 Check the camera harness connections and thecamera power harness connections and rerunPOC




650 Replace the Camera Assembly and rerun POC


700 Replace the camera backplane power harnessand rerun POC


750 Replace the camera harness and rerun POC





200300 FHO 01 00 34

OCR1 to OCR2 Communication failure.The OCR1 Recognition board did not receive therequired command responses from the OCR2Recognition Board.


100 Check the DIP switch settings on OCR1Recognition board (AA14) and ensure that DIPswitch 1 is CLOSED, then rerun POC


200 Replace OCR1 Recognition board (AA14), againmaking sure that DIP switch 1 is CLOSED, andrerun POC







200310 FHO 01 00 35

Main Cover Open Error.The OCR1 Recognition Board detected that themain cover interlock switch is open and thelamps could not be tested.


100 Verify that the main cover is properly closed andrerun POC


200 Verify that the main cover switch is not damagedor otherwise misaligned; replace if necessaryand rerun POC






500 Replace the lamp control board and rerun POC


600 Replace the lamp control interface harness rerunPOC


700 Replace the lamp control harness rerun POC


800 Verify that the output voltages of the +1 -24Vsupply are correct. Replace the supply ifnecessary





200320 FHO 01 00 36

Lamp Cover Open Error.The OCR1 Recognition Board detected that thelamp cover switch is open.


100 Verify that the lamp cover is properly closed andrerun POC


200 Verify that the lamp cover switch is not damagedor otherwise misaligned or that its magnet is notmissing; replace if necessary and rerun POC


300 Check or replace the lamp temperature switch















200330 FHO 01 00 37

Lamp Temperature Sensor Error.The OCR1 Recognition Board detected that thelamp temperature switch is open (reporting a toohot condition).


100 Check the lamp fan and replace if necessary


150 Check or replace the lamp temperature switch


200 Verify that the lamp cover is properly closed andrerun POC


250 Verify that the lamp cover switch is not damagedor otherwise misaligned or that its magnet is notmissing; replace if necessary and rerun POC















200340 FHO 01 00 38

Lamp Current Error.The OCR1 Recognition Board detected that thelamp current sensor showed either (1) highcurrent condition in the lamp low-power mode or(2) low current condition in the lamp high-powermode


100 Replace the bulbs















200400 FHO 02 00 01

OCR2 Master processor memory Failure.The OCR2 Recognition Board’s masterprocessor detected an internal memory fault.





200410 FHO 02 00 02

OCR2 FLSA Processor Loopback Failure.The OCR2 Recognition Board’s masterprocessor could not communicate with the FLSAprocessor





200420 FHO 02 00 03

OCR2 Framer Processor Loopback Failure.The OCR2 Recognition Board’s masterprocessor could not communicate with theframer processor







200430 FHO 02 00 04

OCR2 Recognition Processor Loopback Failure.The OCR2 Recognition Board’s masterprocessor could not communicate with therecognition processor.





200440 FHO 02 00 05

OCR2 Framer Processor Memory Failure.The OCR2 Recognition Board’s framer processordetected an external memory error.







200450 FHO 02 00 06

OCR2 Recognition Processor Memory Failure.The OCR2 Recognition Board’s recognitionprocessor detected an external memory error.





200460 FHO 02 00 07

OCR2 Interrupt Failure.The OCR1 Recognition Board detected a fault inits interrupt system.





200470 FHO 02 00 08

OCR2 Video Ram Failure.The OCR2 Recognition Board detected an errorin its internal video RAM.







200480 FHO 02 00 09

OCR2 Video Processor Failure.The OCR2 Recognition Board detected an errorin its video processing logic.





200600 FHO 02 00 33

OCR2 Camera Video Failure.The OCR2 Recognition Board received incorrectvideo patterns from the camera.


100 Check the OCR1 POC test results

Did the OCR1 fail any of its POC tests? 200 950

200 Remedy the OCR1 POC failure first using theFHO Error Recovery Manual Procedures (OCR1must successfully pass its POC tests in order forthe video patterns to be available to OCR2) thenrerun POC.









200650 FHO 02 00 34

OCR1 to OCR2 Communication failure.The OCR2 Recognition board did not receive therequired command sequences the OCR2Recognition Board


100 Check the OCR1 POC test results

Did the OCR1 fail any of its POC tests? 200 950

200 Remedy the OCR1 POC failure first using theFHO Error Recovery Manual Procedures (OCR1must successfully pass its POC tests in order forthe video patterns to be available to OCR2) thenrerun POC.


300 Check the DIP switch settings on OCR1Recognition Board (AA14) and ensure that DIPswitch 1 is CLOSED, then rerun POC


400 Replace OCR1 Recognition board (AA14), againmaking sure that DIP switch 1 is CLOSED, andrerun POC







FH OCR Reader to Track Communication Errors ManualProcedures

200800 FHO 01 99 00

OCR1 Communication failure.The Track PC could not communicate with theOCR1 recognition board.


100 Replace the OCR1 Recognition Board (AA14)



200810 FHO 01 99 00

OCR2 Communication failure.The Track PC could not communicate with theOCR2 recognition board.


100 Replace the OCR2 Recognition Board (AA12)





FH OCR MTR Failures Manual Procedures200900 FHO 01 03 30

Calibrate Camera MTR Scan Line HardwareFailure.The OCR1 Recognition Board could not capturea video scan line because it detected a hardwarefailure in its scan capture logic.


100 Replace the OCR1 Recognition Board (AA14) andrerun the test.



200910 FHO 01 03 31

Calibrate Camera MTR Final Black Level SettingFailure.The OCR1 Recognition Board could not set thecamera final black levels properly.




200 Replace the Camera Assembly and rerun thetest.



200920 FHO 01 03 32

Calibrate Camera MTR Initial Black Level SettingFailure.The OCR1 Recognition Board could not initializethe camera black levels properly.









200930 FHO 01 03 33

Calibrate Camera MTR Calibration Failure Error.The OCR1 Recognition Board could notcomplete the camera calibrate process forsome unknown reason.


100 Make sure the calibration target has beenproperly inserted and rerun the test.


200 Make sure the calibration target has is notdamaged, replace if necessary and rerun thetest.









200940 FHO 01 03 34

Calibrate Camera MTR White Target Error.The OCR1 Recognition Board could not detectthe calibration target.


100 Make sure the calibration target has beenproperly inserted and rerun the test.


200 Make sure the calibration target has is notdamaged, replace if necessary and rerun thetest.







200950 FHO 01 03 35

Calibrate Camera MTR Lamp Error.The OCR1 Recognition Board could completecalibration because it detected a lamp failure.


100 Replace the bulbs and rerun the test


200 Rerun POC and check the OCR1 POC results.


300 Using the FH OCR manual procedures, repair theproblem and then rerun the test.





99800

Entry into this line indicates the failure of the FH OCR POC diagnostic procedures tocorrect a problem. Review the following troubleshooting suggestions to help isolate theproblem.

1. Review or rerun the diagnostic procedures to make sure the proper step-by-stepprocedures were followed.

2. Check for shorting objects (such as staples or paper clips) that can cause constant orintermittent shorts, especially on the backplane.

3. Check all onboard jumper locations.

4. Check for logic to frame ground shorts.



7. Check the AA gate power supply voltages, including the +/- 24V supply that suppliesthe camera, for proper outputs.

8. Replace the following, one at a time, in the following order:

AA10 (CAPRI)

AA11 (AC/DC MICR)

AA Gate Backplane

9. Review the suggestions at line 99999 listed under “General TroubleshootingSuggestions”.



FH OCR CCC TABLEThe following text provides information about problem conditions to which normal POCtests do not apply, their probable causes, and possible corrective actions to thoseconditions.

Table 26–1. FH OCR CCC Table

CONDITION CAUSE CORRECTION

Transport rejects a large percentageof documents The print quality isgood on these rejected documentsbut can’t reads or don’t readsappear on the code line, especiallynear the edge of the document

The scan position may beimproperly set, causing some or allof the characters on the documentto be outside of the reader’s field ofview

Adjust the codeline position up ordown and see if the read rateimproves

Transport still rejects a largepercentage of documents eventhough the print quality is eventhough the print quality is good, andthe reader’s codeline height settingseems to be correct

The camera optics may havebecome coated with dust, resultingin reduced video signal

Clean and inspect the glass at thefront of the camera and both endsof the fiber optic assemblies. It maybe necessary to increase thefrequency of preventativemaintenance to preventreoccurrence of this problem

Transport still rejects a largepercentage of documents eventhough the print quality is good, thecodeline height is set properly, andthe camera optics have beencleaned

The camera settings may havedrifted or the lamps may have beenchanged without recalibrating thecamera or somehow the cameracalibration file on the PC may havebecome corrupted.

Perform the Camera Calibration Testand adjustment procedure

No codelines are detected by thereader even though it passes POC.

Scan height set above top ofcodeline or above top of document


Hardware failures listed in order ofdecreasing likelihood:

• Faulty Camera

• Beam Of light

Replace the Camera AssemblyReplace


OCR reader does not turn on itslamps when reading (motors onsignal not detected)

Replace the OCR1 recognition board

The code line read is blank eventhough there are characters on thedocument and the reader lamps areon while reading

Hardware failures listed in order ofdecreasing likelihood:

• Faulty Camera

• Beam of light

Replace Camera AssemblyReplace OCR Recognition board

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