electronics manufacturing conference & expo · 6 >> smta international 2017...

International

PREMIUM SPONSOR

TECHNICAL CONFERENCESeptember 17–21

ELECTRONICS EXHIBITIONSeptember 19–20

www.smta.org/smtai

September 17–21, 2017Donald E. Stephens Convention Center

Rosemont, IL

Conference is Co-located with IPC Fall Standards Development Committee Meetings

Electronics Manufacturing Conference & Expo

EARLY REGISTRATION DISCOUNT!Register by Friday, August 25. SAVE 10%!

Technical Advisory Committee . . . . . . . . . . . . . 3

Board of Directors . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Conference at a Glance . . . . . . . . . . . . . . . . . . . . 4-5

Electronics Exhibition . . . . . . . . . . . . . . . . . . . . . . . 6

Special Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

IPC Fall Standards Development Committee Meetings . . . . . . . . . . . . . . . . . . . . . . 8

Special Events . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-11 SMTA Annual Meeting and Keynote Presentation . . . . . . . . . . . . . . . . 9 Career Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Tech Tours . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Golf Tournament . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Metallographic Photo Contest . . . . . . . . . . . . . 11 Certi�cation Program . . . . . . . . . . . . . . . . . . . . . 11

Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-21 Sunday, September 17 . . . . . . . . . . . . . . . . . . . . 12 Monday, September 18. . . . . . . . . . . . . . . . . . . . 17

Spotlight Sessions. . . . . . . . . . . . . . . . . . . . . . 22-23

Technical Sessions. . . . . . . . . . . . . . . . . . . . . . 24-33 Monday, September 18. . . . . . . . . . . . . . . . . . . . 24 Tuesday, September 19. . . . . . . . . . . . . . . . . . . . 26 Wednesday, September 20 . . . . . . . . . . . . . . . . 28 Thursday, September 21. . . . . . . . . . . . . . . . . . . 31

Registration Information . . . . . . . . . . . . . . . . . . .34

Hotel & Travel Information . . . . . . . . . . . . . . . . .34

Registration . . . . . . . . . . . . . . .Inside Back Cover

TECHNICAL CONFERENCE

September 17–21

ELECTRONICS EXHIBITION

September 19–20

>> 140 technical papers from global experts, making it the conference where the industry’s most respected authors choose to present their research.

>> 20 half day workshops to enhance your career. Workshops are taught by industry experts.

>> Three focused symposiums on Technical Innovations, Harsh Environments, and Lead-Free Soldering Technology.

Discover the latest products and services

>> The exhibition has everything you need to keep up with rapidly changing technology, identify innovative solutions, and maintain your competitive edge.

>> See new products and equipment during the Expo.

>> Get immediate answers and experience unique one-on-one networking opportunities on and o� the show �oor.

TABLE OF CONTENTS

SMTA International is the industry’s premier conference and exposition that collectively delivers focused technical solutions for today’s electronics assembly and manufacturing challenges.

International

SMTA International 2017 >> 3 SMTAssociation @SMTAorg #SMTAI

SMTA International Technical Advisory Committee The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all segments of the industry. The Committee designed the 2017 conference program to ensure that today’s latest trends and developments are fully addressed.

Dudi AmirIntel Corporation

Babak Arfaei, Ph.D.Ford Motor Company

Donald BanksAbbott

Elizabeth BenedettoHP Inc.

Lars BöttcherFraunhofer IZM Berlin

Mike BuetowCIRCUITS ASSEMBLYMagazine

Bill Cardoso, Ph.D.Creative Electron, Inc.

Srinivas Chada, Ph.D.Stryker

Marie ColeIBM Corporation

Richard Coyle, Ph.D.Nokia

Priyanka Dobriyal, Ph.D.Intel Corporation

Trevor GalbraithGlobal SMT & Packaging

Reza Gha�arian, Ph.D.Jet Propulsion Laboratory

Steve GreathousePlexus Corp.

Sa’d Hamasha, Ph.D.Auburn University

Denis JeanKester

Je� KennedyCelestica Inc.

Robert Kinyanjui, Ph.D.John Deere Electronic Solutions

Terry KocourSchlumberger

Pradeep Lall, Ph.D., MBAAuburn University

Tanya MartinSMTA

Andrew MawerNXP Semiconductor

Iulia Muntele, Ph.D.Sanmina Corporation

Michael PetersonSeagate Technology

James PierceAxiom Electronics

Brian RoggemanQualcomm Inc.

Brook Sandy-SmithIndium Corporation

Chrys SheaShea Engineering Services

Lenora ClarkMacDermid Enthone

Paul Vianco, Ph.D.Sandia National Laboratories

Charles G. Woychik, Ph.D.i3 Electronics

Anny ZhangIndium Corporation

Je� Kennedy, President Celestica Inc.

Raiyo Aspandiar, Ph.D., Vice President Technical Programs Intel Corporation

Debbie Carboni, Vice President Expositions KYZEN Corporation

Rich Henrick, Secretary Sanmina Corporation

Eileen Hibbler, Vice President Membership TEK Products

Robert Kinyanjui, Ph.D., Treasurer John Deere Electronic Solutions

Sal Sparacino, Vice President Communications ZESTRON Americas

OFFICERS

Matt Kelly, P.Eng., MBA, Chair IBM Corporation

Martin Anselm, Ph.D. Rochester Institute of Technology

Richard Coyle, Ph.D. Nokia

Tim Jensen Indium Corporation

Scott Priore Cisco Systems Inc.

SMTA Board of Directors

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Rob Rowland Conference Director Axiom Electronics

Raiyo Aspandiar, Ph.D. VP of Technical Programs

Intel Corporation

STRATEGIC DEVELOPMENT COMMITTEE

7 am 7 am

8 am 8 am

9 am 9 am

10 am 10 am

11 am 11 am

Noon Noon

1 pm 1 pm

2 pm 2 pm

3 pm 3 pm

4 pm 4 pm

7 am 7 am

8 am 8 am

9 am 9 am

10 am 10 am

11 am 11 am

Noon Noon

1 pm 1 pm

2 pm 2 pm

3 pm 3 pm

4 pm 4 pm

5 pm 5 pm

4 >> SMTA International 2017 SMTAssociation @SMTAorg #SMTAI

Registration Opens

Registration Opens

Registration Opens

Workshops 8:30 am – 12:00 pmWS1: Principles and Practice of Developing

Soldering Pro�lesWS2: Board Pad and Stencil Design, Soldering Materials, Board and Component Surface Finishes and their A�ect

on Manufacturing Yield and ReliabilityWS3: What I Have to Know About the Choice of Solders to

Prevail in the New Era – Part 1WS4: Weeding Out PCB Fabrication Defects Before Assembly WS5: Re�ow Soldering Process and In�uence on Defects –

An In-Depth Look

HE Symposium

HE1 – Predicting Component Life for Harsh Environments 8:30 am – 10:00 am

HE2 – Impact of Chemically CorrosiveEnvironments to the Reliability of

Electronic Components 10:30 am – 12:00 pm

TI Keynote Lunch 12:30 pm – 1:45 pm

TI2 – Adhesive and Coating Development and Characterization

10:30 am – 12:00 pm

HE3 – Material Selection and Test Methods for Harsh Environments

1:30 pm – 3:00 pm TI3 – Adhesive Development and Characterization

2:00 pm – 3:00 pm

HE4 – Ruggedization of Electronic Components for Demanding

Automotive Applications 3:30 pm – 5:00 pm

TI4 – Technical Innovations Panel 3:30 pm – 5:00 pm

TI Symposium

TI1 – Micro-Dispensing and Additive Manufacturing Developments

8:30 am –10:00 am

Women’s Leadership ProgramAll are welcome to attend!

1:30 pm – 4:15 pm

Panel Discussion Diversity in the Workplace

4:15 pm – 5:00 pmNetworking Reception

5:00 pm – 6:00 pm

Workshops 8:30 am – 12:00 pm

WS11: Surface Finish HASL Alternatives for PCB Applications

WS12: Solder Joint Reliability – Principles and ApplicationsWS13: Ball Grid Array: Design and Assembly of BGAs with

Emphasis on Backward CompatibilityWS14: Defect Analysis and Process Troubleshooting: Part 1

WS15: Design for Excellence: Current Realities

Lunch Break

Refreshment Break

Break

Lunch Break

Refreshment Break

Lunch Break

Workshops 1:30 pm – 5:00 pm

WS6: What I Have to Know About the Choice of Solders to Prevail in the New Era – Part 2

WS7: Fan-Out Wafer-Level Packaging and 3D PackagingWS8: Stencil Printing – Advanced Topics

WS9: SMT For Movers, Shakers & RainmakersWS10: Flexible and Rigid Flex Circuits Design and

Assembly Process Principles

Workshops 1:30 pm – 5:00 pmWS16: 10 Essential Skills Every Process Engineer

Needs to AcquireWS17: Characterization of Soldering Materials,

Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies

WS18: Reliability of Electronics – Role of Intermetallic Compounds

WS19: Defect Analysis and Process Troubleshooting: Part 2WS20: DFM In A World Of Shrinking Electronics –

Will Traditional DFM Survive?

SUNDAY, SEPTEMBER 17WORKSHOPS

MONDAY, SEPTEMBER 18

SESSIONS – MONDAY, SEPTEMBER 18GEN

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T R AC K K E Y Advanced Packaging Technology (APT)Flux, Solder, Adhesives (FSA)Harsh Environments Applications (HE)Inspection Technologies (INS)

Lead-Free Soldering Technology (LF)Manufacturing Excellence (MFX)Substrates/PCB Technology (SUB)Technical Innovations (TI)

CONFERENCE AT A GLANCE

7 am 7 am

8 am 8 am

9 am 9 am

10 am 10 am

11 am 11 am

Noon Noon

1 pm 1 pm

2 pm 2 pm

3 pm 3 pm

4 pm 4 pm

7 am 7 am

8 am 8 am

9 am 9 am

10 am 10 am

11 am 11 am

Noon Noon

1 pm 1 pm

2 pm 2 pm

3 pm 3 pm

7 am 7 am

8 am 8 am

9 am 9 am

10 am 10 am

11 am 11 am

Noon Noon

1 pm 1 pm

2 pm 2 pm

3 pm 3 pm


Registration Opens

Registration Opens

Registration Opens

MFX6 – Cleaning 8:00 am – 9:30 am

MFX7 – Conformal Coating

10:00 am – 11:30 am

LF SymposiumLF1 – The AREA Consortium

8:00 am – 9:30 am

LF2 – Screen Printing to Optimize Lead-Free Processing 10:00 am – 11:30 am

LF3 – Reliability and Performance of Lead-Free Interconnections

12:30 pm – 2:00 pm

LF4 – Readying Pb-Free Innovations for High-Reliability Electronics

2:30 pm – 3:30 pm

Refreshment Break

Refreshment Break

New Product Showcase on the Expo Floor – Hall F

Appreciation Reception on Expo Floor – Hall F

Lunch Break

Refreshment Break

Refreshment Break

Lunch Break

Lunch Break

APT TRACKAPT1 – Analysis

11:00 am – 12:30 pm

APT2 – BTC Leadless 2:00 pm – 4:00 pm

APT3 – Thermal/Power Packaging

8:00 am – 10:00 am

APT4 – Reliability 1 11:00 am – 12:30 pm

APT5 – Reliability 2 2:00 pm – 3:30 pm

APT6 – Advanced Packaging

8:00 am – 9:30 am

APT7 – Warpage 10:00 am – 11:30 am

HDPUG Consortium 12:30 pm – 2:00 pm

INS2 – Counterfeit Electronic Parts and

Supply Chain10:00 am – 11:30 am

INS3 – Inspection Technologies

12:30 pm – 2:00 pm

MFX TRACKMFX1 – Factory

Automation 11:00 am – 12:30 pm

MFX2 – Printing 2:00 pm – 4:00 pm

MFX3 – Product Assembly Challenges

8:00 am – 10:00 am

MFX4 – Re�ow 11:00 am – 12:30 pm

MFX5 – Void Reduction 2:00 pm – 3:30 pm

SUB TRACKSUB1 – Copper Plating 11:00 am – 12:30 pm

SUB2 – Surface Finishes 2:00 pm – 3:30 pm

SUB3 – PCB Reliability 8:00 am – 10:00 am

INS TRACKINS1 – Inspection for

Mfg Improvement 8:00 am – 9:30 am

SUB4 – ENEPIG 11:00 am – 12:30 pm

Spotlight 3 – Solder Alloys and Soldering 8:00 am – 10:00 am

FSA2 – Solder Alloy 2:00 pm – 3:30 pm

FSA TRACKFSA1 – Solder Paste

Combination 11:00 am – 12:30 pm

FSA3 – Under�ll/Encapsulation

8:00 am – 10:00 am

FSA4 – Flux Reliability 11:00 am – 12:30 pm

FSA5 – Low Melting Alloy 2:00 pm – 3:30 pm

Spotlight SeriesSpotlight 1 – Component

Challenges 11:00 am – 12:30 pm

Spotlight 2 – Quality and Reliability

2:00 pm – 4:00 pm

Spotlight 4 – Process Control

11:00 am – 12:30 pm

Spotlight 5 – Warpage Defects Panel

2:00 pm – 3:30 pm

SMTA Annual Meeting & Keynote Presentation8:00 am – 10:00 am

SESSIONS – TUESDAY, SEPTEMBER 19

SESSIONS – WEDNESDAY, SEPTEMBER 20

SESSIONS – THURSDAY, SEPTEMBER 21

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Discover the latest products and services from leading suppliers.

Exhibit hall registration is FREE for attendees who register in advance.

Lunch coupon ($8 value) for Tuesday and Wednesday is provided at no charge.

For more exhibitor information visit the Exhibit Info page at www.smta.org/smtai.

5N Plus Micro PowdersACL Inc.Acroname, Inc.Aegis SoftwareAGI CorporationAIMAkrometrix, LLCAlltemated Inc.Alpha Assembly SolutionsAmerican Hakko ProductsAmerican Standard Circuits, Inc.Amerway, Inc.Amitron CorpAOI SystemsApex Factory AutomationApex Tool Group - WellerAscentech LLC- GEN3/OptiliaASM Assembly Systems LLCASYS Group Americas Inc.Aven Inc.BOFA AmericasBTU InternationalCactus MaterialsCalcuQuoteCanon USACircuits AssemblyCogiscanConductive Containers, Inc.Conecsus LLCCreative ElectronCrystal Mark, Inc.CTI SystemsCyberOptics CorporationDimation, Inc.ELANTAS PDGEMSNowEPS Worldwide Private Ltd.EPTAC CorporationERSA North AmericaESSEMTECEternity Technology CorporationEuroplacer, North AmericaEVS InternationalExcel Electronics, Inc.FKN SystekFuji America CorporationGarland Service CompanyGlenbrook Technologies, Inc.Global SMT & PackagingGPD GlobalHanwha Techwin Automation

Americas. Inc.

Henkel Electronic MaterialsHEPCO, Inc.Heraeus ElectronicsIConnect007IMDS DATAIndium CorporationInovaxe CorporationInsulFab PCB ToolingInventec Performance

Chemicals USAIPCIPG PhotonicsITW EAEJBC Tools USA Inc.JetPCBJTAG TechnologiesJuki Automation SystemsKesterKICKoh Young Technology, Inc.Koki Solder AmericaKulicke & So�aKwikTic Ltd.KYZEN CorporationMacDermid EnthoneMaterionMAXAIR SystemsMek Americas LLCMET StencilMETCALMicroCare CorporationMicroScreenMid America Taping & Reeling, Inc.Mirtec CorporationMYCRONIC, Inc.Nano Stencil CleanNational Technical SystemsNCAB Group USANihon Superior Company Ltd.Nikon MetrologyNordson ASYMTEKNordson DAGENordson EFDNordson SELECTnScrypt, Inc.NSTechOmron Inspection SystemsPACE WorldwidePanasonic Factory Solutions

of AmericaPARMI USA, INC.Photo Etch Technology

Pillarhouse USA, Inc.Prototron Circuits Inc.Qualitek International Inc.Quik-ToolRehm Thermal Systems, LLCSafari Circuits, Inc.Saki America, Inc.Schoeller Electronics

Systems GmbHScienscopeSEHO North America, Inc.Seica Inc.Seika Machinery, Inc.Senju Comtek CorporationSHENMAO Technology Inc.Simplimatic AutomationSMT Hybrid PackagingSMT TodaySMTASMTXTRA LimitedSolderstar LLCSonoscan, Inc.SPEA America, LLC.Specialty Coating SystemsSpeedprint TechnologyStenTechSTI Electronics, Inc.Super PCBTAGARNO USATechnimark, IncTeka Interconnection SystemsTeradyne, Inc.Test Research Inc.Texmac/Takaya, Inc.Tharium CorporationTintronics IndustriesTOPLINEUniversal Instruments CorporationUS TechV-TEK, Inc.Vi TechnologyVirtual Industries Inc.Viscom, Inc.VisiConsult X-Ray Solutions

America Corp.What’s New in ElectronicsYamaha - Trans Tec AmericaYINCAE Advanced Materials, LLCYXLON FeinFocusZESTRONZymet, Inc.

Exhibitor List (as of June 22)

ELECTRONICS EXHIBITION


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Debbie Carboni, Chair KYZEN Corporation

Mick Austin ITW EAE

Jim Baker Spectra Sales Corporation

Bill Burnet Weller

Hal Hendrickson Nordson Test and Inspection

Eric Moen Akrometrix, LLC

Timothy O’Neill AIM

Kristi Schillo� Universal Instruments Corporation

Erika Sebens Alpha Assembly Solutions

Sal Sparacino ZESTRON Americas

Sherry Stepp KYZEN Corporation

Robert Wallace Alpha Assembly Solutions

SMTA International Exhibitor Committee

Sincere thanks to this year’s SMTA International Sponsors!

IMPORTANT MEETINGSMonday, September 18Speaker Breakfast ......................................................7:00 amWomen’s Leadership Program .......................1:30 pmCerti�cation Committee .....................................2:00 pmWomen’s Leadership Reception .....................5:00 pm

Tuesday, September 19Speaker Breakfast ......................................................7:00 amAnnual Meeting/Keynote Presentation ......8:00 amTraining Committee .............................................11:00 amChapter O�cer Meeting .................................. 12:30 pmMSD Council ...............................................................2:00 pmAmbassador’s Meeting ........................................5:00 pm

Wednesday, September 20Speaker Breakfast ......................................................7:00 amChapter Leadership Committee ......................7:30 amMembership Committee ..................................10:00 amMarCom Committee .............................................3:00 pmTechnical Committee ............................................5:00 pm

Thursday, September 21Speaker Breakfast ......................................................7:00 am

Women’s Leadership Program Sponsors Golf Tournament Sponsors

Premium Sponsor Conference Sponsors


Saturday, September 168:00 am – 5:00 pm 5-22A J-STD-001 Task Group

Sunday, September 178:00 am – 9:00 am 2-30 Terms and De�nitions Committee8:00 am – 2:30 pm 7-31B IPC-A-610 Task Group9:00 am – 4:30 pm 7-31A/D-33A Joint Meeting – IPC-A-600 and Rigid

Printed Board Performance Speci�cations Task Groups

1:00 pm – 3:00 pm Committee Management Session1:00 pm – 4:00 pm 5-21A IPC-7070 Task Group2:30 pm – 4:30 pm 5-20 AND 7-30 Assembly & Joining and Product

Assurance Committees4:30 pm – 6:00 pm CCC Committee Chairman Council (By Invitation)6:00 pm – 7:00 pm IPC Committee Chairmen’s Reception

Monday, September 188:00 am – 10:00 am E-21/E-22 EMS Intellectual Property Subcommittee 8:00 am – 10:00 am D-36A IPC-PCQR2 Subscriber Meeting –

By Invitation Only8:00 am – 10:00 am 5-31G Stencil Cleaning Task Group8:00 am – 10:00 am 1-10B Printed Board Thermal Management

Task Group8:00 am – 10:00 am 5-23B Component and Wire Solderability

Speci�cation Task Group8:00 am – 12:00 pm 7-31FS IPC/WHMA-A-620 Space Electronic

Assemblies Addendum Task Group8:00 am – 12:00 pm 3-11 Laminate/Prepreg Materials Subcommittee8:00 am – 12:00 pm 2-18H Con�ict Minerals Data Exchange Task Group8:00 am – 12:00 pm 1-14 DFX Standards Subcommittee8:00 am – 5:00 pm 5-22A/7-31B Joint Meeting – J-STD-001 &

IPC-A-610 Task Groups10:15 am – 12:00 pm 2-19a Critical Components Traceability Task Group10:15 am – 12:00 pm D-36 Printed Board Process Capability, Quality and

Relative Reliability Benchmark Test Subcommittee10:15 am – 12:00 pm 7-11 Test Methods Subcommittee10:15 am – 12:00 pm 5-23A Printed Circuit Board Solderability

Speci�cations Task Group12:00 pm – 1:00 pm ML IPC Committee Awards Luncheon1:30 pm – 3:00 pm 7-31M Fiber Optic Cable Acceptability Task Group1:30 pm – 3:00 pm 5-32B SIR and Electrochemical Migration

Task Group1:30 pm – 3:00 pm 3-12D Woven Glass Reinforcement Task Group1:30 pm – 5:00 pm 2-18J Laboratory Report Declaration Task Group1:30 pm – 5:00 pm 2-17 Connected Factory Initative1:30 pm – 5:00 pm E-30 Con�ict Minerals Due Diligence Committee 1:30 pm – 5:00 pm 1-10C Test Coupon and Artwork Generation

Task Group3:15 pm – 5:00 pm D-35 Printed Board Storage and

Handling Subcommittee3:15 pm – 5:00 pm 5-21h Bottom Termination Components (BTC)

Task Group 3:15 pm – 5:00 pm 5-33G Low Pressure Molding Task Group3:15 pm – 5:00 pm 5-31J Cleaning Compatibility Task Group3:15 pm – 5:00 pm 3-12E Base Materials Roundtable Task Group5:00 pm – 7:00 pm TAEC Technical Activities Executive Committee

(By Invitation)

Tuesday, September 198:00 am – 10:00 am D-33AM 6012 Medical Addendum 8:00 am – 10:00 am B10A 8:00 am – 10:00 am D-24D High Frequency Signal Loss Test Methods

Task Group8:00 am – 10:00 am 3-12A Metallic Foil Task Group8:00 am – 10:00 am General Training Committee Meeting8:00 am – 12:00 pm 5-33A Conformal Coating Task Group8:00 am – 12:00 pm D-32 Thermal Stress Test Methods Subcommittee 8:00 am – 12:00 pm 5-33A Conformal Coating Task Group8:00 am – 5:00 pm 7-31F IPC/WHMA-A-620 Task Group8:00 am – 5:00 pm 2-18K Data Exchange for Aerospace and Defense

Task Group10:00 am – 12:00 pm 7-31BV IPC-A-610 Telecom Addendum

10:00 am – 12:00 pm 5-22ARR J-STD-001/Conformal Coating Material & Application Industry Assessment Working Group

10:15 am –12:00 pm 7-34T 7711/2110:15 am – 12:00 pm D-24B Bereskin Test Method Task Group10:15 am – 12:00 pm 5-32E Conductive Anodic Filament (CAF)

Task Group10:15 am – 12:00 pm 4-33 Halogen-Free Materials Subcommittee1:30 pm – 3:00 pm 7-24 Printed Board Process E�ects Handbook

Subcommittee 1:30 pm – 3:00 pm D-24C High Frequency Test Methods Task Group:

Frequency-Domain Methods1:30 pm – 3:00 pm 7-31FT 620 Training 1:30 pm – 3:00 pm 5-32A Ion Chromatography/Ionic Conductivity

Task Group1:30 pm – 3:00 pm 5-24A Flux Speci�cations Task Group1:30 pm – 5:00 pm D-31B IPC-2221/2222 Task Group1:30 pm – 5:00 pm D-55 Embedded Devices Process Implementation

Subcommittee3:15 pm – 5:00 pm 5-22H Thermal Pro�le Guide Task Group3:15 pm – 5:00 pm 5-33B Solder Mask Performance Task Group3:15 pm – 5:00 pm 7-31AT IPC-A-600 Technical Training Committee 3:15 pm – 5:00 pm D-33AA 6012 Automotive Addendum3:15 pm – 5:00 pm 5-24C Solder Alloy Task Group3:15 pm – 5:00 pm 3-11F UL/CSA Task Group

Wednesday, September 208:00 am – 10:00 am D-22 High Speed/High Frequency Board

Performance Subcommittee8:00 am – 10:00 am 5-21g Flip Chip Mounting Task Group 8:00 am – 10:00 am D-15 Flexible Circuits Test Methods Subcommittee8:00 am – 10:00 am 5-33AWG Conformal Coating Requirements

Working Group8:00 am – 10:00 am 5-24B Solder Paste Task Group8:00 am – 10:00 am 5-21E Solder Stencil Task Group8:00 am – 12:00 pm 7-35 IPC-AJ-820 Assembly and Joining Handbook8:00 am – 5:00 pm 2-18B Materials Declaration Task Group8:00 am – 5:00 pm 7-31K IPC-HDBK-620 Handbook Task Group10:15 am – 12:00 pm D-72 Textiles Materials Subcommittee 10:15 am – 12:00 pm D-12 Flexible Circuits Speci�cations Subcommittee10:15 am – 12:00 pm 5-22AS AND 5-22AD J-STD-001 Space Addendum

and Requirements for Military Systems Joint Working Group

10:15 am – 12:00 pm 5-21F Ball Grid Array Task Group10:15 am – 12:00 pm 4-14 Plating Processes Subcommittee1:30 pm – 3:00 pm VS-CG Validation Services and Coupon

Generator Review1:30 pm – 3:00 pm D-23 High Speed/ High Frequency Base

Materials Subcommittee1:30 pm – 3:00 pm D-11 Flexible Circuits Design Subcommittee1:30 pm – 3:00 pm 7-12 Microsection Subcommittee1:30 pm – 3:00 pm 5-24F Under�ll Materials Design, Selection and

Process Task Group1:30 pm – 5:00 pm 7-31J IPC-A-630 Task Group Meeting1:30 pm – 5:00 pm 1-13 Land Pattern Subcommittee1:30 pm – 5:00 pm D-60 Printed Electronics Committee 3:15 pm – 5:00 pm D-21 High Speed/High Frequency

Design Subcommittee3:15 pm – 5:00 pm B-11 3-D Electronic Packages Subcommittee 3:15 pm – 5:00 pm D-13 Flexible Circuits Base Materials Subcommittee3:15 pm – 5:00 pm 8-41 Technology Roadmap Subcommittee3:15 pm – 5:00 pm 5-32C Bare Board Cleanliness Assessment

Task Group5:15 pm – 7:00 pm MIT Meet and Greet

Thursday, September 218:00 am – 10:00 am 3-11G Corrosion of Metal Finishes Task Group8:00 am – 12:00 pm 2-18 Supplier Declaration Subcommittee8:00 am – 12:00 pm 7-31J IPC-A-630 Task Group Meeting 8:00 am – 12:00 pm 5-21M Press-�t Pins 8:00 am – 5:00 pm 5-22PT Process Engineering Training

SPECIAL EV

ENTS

Fall Standards Development Committee MeetingsContribute to the industry standards and guidelines that your company, customers and suppliers rely on. All SMTAI registrants are welcome to attend IPC committee meetings excluding those designated as “By Invitation.” Registration is required.

For more information, including committee descriptions and current projects, visit www.ipc.org/fall-meetings.

TopicsAssembly and JoiningCleaning and CoatingData Generation & Transfer/DocumentationElectronic Documentation TechnologyElectronic Product Data DescriptionEmbedded DevicesEnvironment, Health & Safety (EHS)

E-TextilesFlexible and Rigid-Flex Printed BoardsHigh Speed/High Frequency InterconnectionsManagementPackaged Electronic ComponentsPrinted Board Design TechnologyPrinted Electronics

Product AssuranceProduct ReliabilityRigid Printed BoardsTerms and De�nitionsTesting


SMTA Annual Meeting & Keynote PresentationTuesday, September 19 | 8:00 am – 10:00 am

Complimentary for All Attendees!

Experiencing Mixed Reality – Using the Microsoft HoloLens

Market projections put the virtual reality, augmented reality, and mixed reality (VR/AR/MR) devices at anywhere from 90 to 120 million devices per year by 2020. Today on the market, there are a number of VR devices – mostly designed and marketed for entertainment. Basic augmented reality in the form of 2D images

superimposed on video or pictures on our cellphones (e.g. Pokémon or Instagram �lters) also exist today, mainly for entertainment. The ability to project 3D images into a user’s �eld of view has many exciting applications in the industrial space with the ability to provide real-time information or images �xed in-space to a real-world object. We call this mixed reality.

The Microsoft HoloLens is a premier mixed reality device. HoloLens is an untethered holographic computer that creates high-de�nition, 3D holograms using advanced nano-optics. These holograms become part of the real world through an array of sensors, which continuously sample the user’s

environment. HoloLens combines all the processing and components in a form factor that enables interaction with the real and the virtual worlds — in a natural way. In his keynote, Mr. Jensen will share some of the technical challenges and triumphs as well as illustrate several practical applications of this innovative technology.

Rune Jensen, General Manager, HoloLens Hardware Design, joined Microsoft in 2007. He is responsible for leading a highly technical team of Electrical, Mechanical and Design Veri�cation engineers responsible for building the HoloLens Hardware. Prior to that, he was a Partner, Director of Silicon Engineering, responsible for SOC Development for HoloLens, Xbox One, Xbox 360 and Zune.

Prior to joining Microsoft, Rune was a Chip Implementation lead at Philips Semiconductors and ReShape.

Rune holds an MS in Electrical Engineering from Aalborg University, Denmark. Rune lives with his wife and 2 kids in Silicon Valley. In his free time, he enjoys spending time with his kids, coaching soccer and other outdoor activities.

Plan time to connect with other industry professionals and participate in fun, networking programs during SMTA International. Some events require fees and advance registration. See the registration page (inside back cover) for complete information.

Rich Freiberger Best of Conference Presentation BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning ProcessesMike Bixenman, DBA, KYZEN Corporation

Best of Proceedings PaperPredicting the Reliability of Package-on-Package-on-Package (PoPoP) Interconnections Based on Accelerated Aging Experiments and Computational ModelingPaul Vianco, Ph.D., Sandia National Laboratories

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Rune JensenMicrosoft

Corporation

Congratulations to the 2016 SMTA International Conference Award Winners

Best International PaperComparison of Active and Passive Temperature CyclingMathias Nowottnick, Ph.D., University of Rostock

Best Student PaperMicrostructure and Performance of Micro Cu Pillars AssembliesMohammed Genanu, Binghamton University

SPECIAL EVENTS

Winners will be recognized at the Opening Session.


SPECIAL EV

ENTS

Women’s Leadership Program and ReceptionMonday, September 18 | 1:30 pm – 6:00 pm

We extend an invitation to everyone at SMTA International to attend the Women’s Leadership Program. This program will help promote women in engineering �elds and will be held on Monday afternoon from 1:30 pm – 4:15 pm. This will be followed by a panel discussion at 4:15 pm where panelists will share their unique stories on diversity in the workplace, mentorship and their contributions in advancing careers of women. Show your support for the inclusion of women and diversity in engineering �elds! The afternoon concludes with our annual Women’s Leadership Connection Reception with wine and hors d’oeuvres from 5:00 pm – 6:00 pm.

Poster SessionTuesday, September 19 | 12:00 pm – 2:00 pm

Expo Hall

Please visit www.smta.org/smtai for a list of participants. Industry experts displaying posters will be available to answer your questions.

New Product Showcase

Tuesday, September 19 | 10:00 am – 6:00 pmWednesday, September 20 | 9:00 am – 4:00 pm

Exhibit Hall Courtyard

New in 2017! Visit the New Product Showcase in the Exhibit Hall Courtyard during expo hours to learn about the industry’s hottest new equipment, materials and services being displayed at SMTA International!

Meet & Greet Reception Tuesday, September 19 | 5:00 pm – 6:30 pm


Meet one-on-one with exhibitors in the Exhibit Hall Courtyard to learn more about the latest trends in electronics manufacturing while enjoying light refreshments and appetizers.

Career CenterTuesday, September 19 and Wednesday, September 20

On the Show Floor – Booth #900 Hosted by Gilbert Consulting Services, Inc.

Stop by the Career Center at SMTA International to plan your next big career move. While there, you can get expert advice on interview preparation, resume building, LinkedIn, understanding the current job market, and to make sure you get the most out of your career in the electronics industry!

Tech ToursTuesday, September 19 and Wednesday, September 20

Back by popular demand! This is an opportunity to participate in technology focused tours that showcase the latest equipment and solutions in a small group setting with no sales pressure. Subject areas will be new products and test equipment. Our exhibiting partners will provide a demo of their equipment and a short technology-based presentation. Pre-registration is not required — feel free to hop on and o� each tour as your schedule permits! Visit our website for more information.

Fun Run Wednesday, September 20 l 7:00 am

Don’t skip your run during SMTA International! Join other SMTA members for a fun run. Participants will meet in the DoubleTree Rosemont lobby. You can choose to take a 2 or 5 mile run. Be sure to select this option on your registration form if interested.

Appreciation ReceptionWednesday, September 20 | 3:30 pm – 4:30 pm


Join us as we recognize and celebrate the speakers, exhibitors, chapters and members who have loyally contributed to the SMTA over the years! Come enjoy a beverage and a bite to eat while connecting with friends and meeting new people. Everyone is invited!

Students and Young Professionals Night Out (age 40 and under)Tuesday, September 19 | 6:00 pm – 9:00 pm

Kings Bowling & Entertainment 5505 Park Place | Rosemont, IL

Ready for some fun? This special event o�ers a great networking opportunity mixed with an evening of entertainment! Dust o� your bowling shoes and head to Kings Bowling & Entertainment for a chance to connect with fellow students and young professionals in the industry. Food, beverage, bowling and shoe rental is provided. Please select this option on your registration form.


SMT Processes and Lean Six Sigma Certi�cationSMT Processes September 19-21September 19 – Course (8:30 am – 5:00 pm)September 20 – Half day course + examSeptember 21 – All day exam (8:30 am – 5:00 pm)Instructor: Jim Hall, ITM Consulting

Lean Six Sigma Green BeltSeptember 19-21September 19 – Course (8:30 am – 5:00 pm)September 20 – Half day course + take home examSeptember 21 – All day +take home examInstructor: Ron Lasky, Indium Corporation

About SMTA Certi�cationEach SMTA Certi�cation program is a three day course on topics in SMT Processes or Lean Six Sigma Green Belt. The program concludes with an open and closed book examination (SMT Processes) or open book exam (Lean Six Sigma Green Belt). These challenging examinations require both written answers and calculations with the intent to enable the attendee to establish competitive credentials as “Certi�ed” by the SMTA in SMT Processes or Lean Six Sigma Green Belt.

Who Should Attend?SMTA Certi�cation is intended for manufacturing and process engineers. Additionally, production, design, test and quality engineering personnel, as well as SMT assembly managers who want to con�rm their current competence at a fundamental level of overall process technology or are looking to improve the productivity and quality of an assembly process, should consider participating.

Contact Jenny Ng for more information:[email protected] or 952-920-7682

10th Annual SMTAI Golf TournamentMaple Meadows Golf Course | Wood Dale, IL Thursday, September 21 | 8:30 am Shotgun Start

Join us for the 10th Annual SMTAI Golf Tournament at Maple Meadows Golf Course, featuring a modern combination of links and prairie design. Pricing is $85/player and $340/foursome. Registration fee includes 18-hole round, golf cart, drink tickets, hot bu�et lunch, and chance to win performance prizes!

Golf Information and Registration: www.smta.org/smtai/golf

Golf Tournament Sponsorship Opportunities Available! Register online!

Visit the Certi�cation web page on www.smta.org for more information and registration.

SPEC

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Metallographic Photo Contest at SMTA InternationalAs an engineer you use photographs to visualize your research, but getting high quality images of such small subjects is really as much an art as it is a science. Now you can get recognized for your metallographic photography skills! All you have to do is submit your high resolution images to [email protected] by August 1, 2017.

The photos will be organized into these groups: By color category:

1. Black and white2. Color

By subject class:1. Interesting solder microstructures2. Interesting component structures3. Novelty: “Hey, that looks like a ...”

A panel of judges will determine the winners for each category and class.

The contest is limited to one entry per person per category/class. Each winner will receive a FREE SMTA individual membership (or renewal) for 1 year! Selected submissions will be displayed at SMTA International 2017.


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Sunday, September 17 8:30 am – 12:00 pm

WS1 Principles and Practice of Developing Soldering Pro�lesRay Prasad, Ray Prasad Consultancy Group

Course Objectives This course is based on IPC 7530 Guidelines for Temperature Pro�ling for Mass Soldering Processes chaired by Ray Prasad. IPC 7530 was released in February 20, 2017. The focus of this course is to focus on dos and donts of developing thermal pro�les for widely used soldering processes in order to reduce soldering defects and improve quality and reliability.

During soldering it is critical that all solder joints reach the minimum soldering temperature. But what is that minimum temperature and most importantly how do you measure it? And how do make sure that those temperatures remain valid over the life of that product in production. There are many alloys in both tin-lead and lead free including low temperature soldering processes that are being used today and being soldered by various soldering methods. But it is surprising how many companies use incorrect pro�les. Even those who may think they are using correct soldering pro�les are using wrong pro�les since they measure and monitor those pro�les incorrectly. Incorrect thermal pro�les can damage or warp components and boards. The problem becomes even more complex when you have a board with components of di�erent size and thermal mass and even of di�erent soldering alloy combinations – all on the same board to be soldered at the same time.

For example, the biggest challenge for the person responsible for developing pro�le is that all components even though their thermal masses are di�erent, they all must meet the same minimum and maximum temperature requirements. So developing a thermal pro�le of an assembly populated with very large thermal mass components (such as a large BGA) and small thermal mass components (such as 0201 or even smaller chip resistors and capacitors) is a

balancing act indeed. Additional complexity is added because di�erent heating and cooling rates have di�erent impact on di�erent types of defects. For example, slower heating rate will help in reduction of voids in a BGA but it will increase the potential for head on pillow in the same BGA.

This is not a theoretical course. It is based on years of instructor’s experience at major companies like Intel and Boeing and numerous small and large companies across the globe and major IPC documents such as IPC 7530 (Thermal Pro�le Development), IPC 7095 (BGA), IPC 7093 (BTC), IPC 786 (now JTD 20/33, Moisture sensitive components) and IPC 782 (now IPC 7351, Land Pattern Design).

The objective of this course is to give a brief summary of all the major soldering processes and equipment and how to correctly measure and control the pro�les being used.

Topics Covered>> An Overview of various soldering process and

their Pro�les• Mass Soldering Process (wave and re�ow)• Thermal shock Prevention for Wave• Application Speci�c Soldering Processes (vapor

phase, laser and Selective Soldering)>> Soldering zones, Pro�les and Pro�lers>> Super heat, Peak, TAL and True TAL>> Recommended Pro�les for tin lead, lead free and

mixed alloys>> Methods and locations for attaching

thermocouples for BGAs – Dos and Don’ts>> Monitoring and Controlling Oven Performance>> Examples of Good and Bad Pro�les and

related defects>> Review, Questions and Answers

Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area. Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Workshops are application oriented and structured to combine �eld experience with scienti�c research to solve everyday problems. Registration includes breaks, course materials and a Certi�cate of Attendance.

FOUR workshops are included in a VIP registration package. A GREAT value! Note: VIP registration cannot be shared.

FULL details of all workshops and instructor biographies can be found at www.smta.org/smtai.

* Designates Speaker of Distinction

WORKSHOPS


WS2 Board Pad and Stencil Design, Soldering Materials, Board and Component Surface Finishes and their A�ect on Manufacturing Yield and Reliability*Jasbir Bath, Bath Consultancy LLC

Course Objectives The course will review board pad design, stencil design, soldering materials, board and component surface �nishes and their interactions in detail from a design, process/re�ow, microstructure and reliability perspective and discuss potential solutions together with assembly guidelines and best practices for improved manufacturing yield and reliability.

Topics CoveredThere are challenges in electronics manufacturing to improve manufacturing yield and reliability with the variety of components being assembled on the board. The course will cover board pad design and stencil aperture design for a variety of components including chip components, BGA/CSP components,

BTC/MLF/QFN/LGA components and lead-frame components and look at their a�ect on manufacturing yield and board level reliability with reference to various IPC and related industry standards and evaluations done in industry. It will also discuss soldering materials, board and component surface �nishes and their in�uence on process yield and reliability. The topics will be covered in terms of: Board Design, Stencil Design, Soldering Materials, Board and Component Surface Finishes, Microstructure, Reliability, Assembly Guidelines, Manufacturing Yields. The course will review these interactions in detail from a design, process/re�ow, microstructure and reliability perspective and discuss potential solutions together with assembly guidelines and best practices for improved manufacturing yield and reliability.

WS3 What I Have to Know About the Choice of Solders to Prevail in the New Era – Part 1*Ning Cheng-Lee, Ph.D., Indium Corporation

Course Objectives While the electronic industry is advancing rapidly toward miniaturization, two more important drivers actually dictate whether the manufacturers could stay in the game or not – Low Cost, and High Reliability. The former is the ticket to get into the game, while the latter is the ticket to stay in the game. These two drivers exempli�ed their vital role most astonishingly in solder materials. This course covers the roles of solder composition on cost, and on reliability. After reviewing the role of Ag in both cost and reliability, the solder materials are reviewed from the lowest cost, zero-Ag solders to composition with higher and higher Ag content. Among all of the alloy options present on the market, including the most recent development, the representative alloys are introduced with more details, including materials properties, soldering performance, some of the known failure modes, and the primary merit of these alloys.

Topics Covered>> Cost>> Ag on physical properties

>> Ag on reliability>> What can be done on improving reliability of

low Ag?>> Low cost alternatives>> Ag=0

a. Sn995 (Sn0.5CuCo)b. SN100C (Sn0.7Cu0.05Ni0.006Ge)c. SnCuNiBi

>> Ag ≤ 1a. SAC0307 (Sn0.3Ag0.7Cu)b. SAC0510Mn (Sn0.5Ag1Cu0.05Mn)c. SAC107+1.6Bi0.2In (M40)

>> Ag ≤ 2a. S1XBIG (Sn1.1Ag0.7Cu1.8Bi0.06Ni)b. SAC125+0.05Ni (L35)c. SACi (Sn1.7Ag0.6Cu0.4Sb)

>> Ag ≤ 3a. Sn2.25Ag0.5Cu6Bi (Violet)b. SAC2508+NiBi

>> Ag ≤ 4a. Sn3.6Ag0.6Cu0.1Ni1.3Sb2.8Bi (Innolot)b. 88.8Sn3.8Ag0.9Cu6Sb0.5Inc. 89Sn4Ag1.1Cu5.6Sb0.3Bi


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*Designates Speaker of Distinction


WS4 Weeding Out PCB Fabrication Defects Before AssemblyBihari Patel, Bihari Patel SMT Connections Inc.

Course Objectives With the Lead Free transition and green revolution changes completed at Assemblers and Fabricators to meet demands of higher densities for Printed Circuit Boards presenter will share his experiences. Global sourcing of PCBs is a reality with larger batch quantities, to prevent line stoppage and expensive rework, it is important that emphasis be placed on PCBs prior to assembly to highlight issues and prevent future issues prior to use. Ensuring quality PCBs are entering in the assembly process, resulting in higher �rst pass yield and reduced rework associated with PCB quality de�ciency. This workshop will highlight any de�ciency in PCB fabrication and ones following best practices will be exhibit their strengths against other fabricators. Will also cover key result areas in Assembly Process and Metal Core - LED PCBs their assembly challenges.

Topics Covered>> Lead Free and Leaded assembly of circuit

boards showing defects experienced related to PCB fabrication

>> 101 of PCB Fabrication for Contract Electronic Manufacturing and Original Equipment Manufacturer

>> Process Control and applicable speci�cations for outgoing quality

>> Descriptions with examples of applicable test methods, including reference to IPC documentation

>> Top twenty defects will be highlighted and with emphasis on how to detect, report and get corrective actions for prevention.

>> Fabricator selection, source Inspection and ongoing preferred fabricator audits

>> Case Studies>> Metal Core – LED PCBs and assembly challenges

WS5 Re�ow Soldering Process and In�uence on Defects – An In-Depth Look*S. Manian Ramkumar, Ph.D., Rochester Institute of Technology

Course Objectives The re�ow soldering process is a key process in surface mount electronics assembly after stencil printing process. The soldering parameters in�uence the quality of the solder joint in a surface mount PCB assembly. This course will provide a thorough understanding of the re�ow process for tin-lead and lead free soldering. Topics include an in-depth look at the various soldering methods, mechanism for solder joint formation, intermetallic formation, re�ow parameters, e�ect of re�ow parameters, thermocouple attachment and pro�ling, importance of pro�ling, defect identi�cation and corrective action. Participants in this course are sure to acquire a sound understanding of the soldering process and its in�uence on assembly yield.

Topics Covered>> Introduction to soldering>> Soldering terminology

a. Surface Tensionb. Wettingc. Capillary Actiond. Wetting Angle

>> Intermetallic compounds and its formation

>> Heating methods for solderinga. Conductionb. Convectionc. Infrared Radiation

>> Di�erent soldering techniques>> Re�ow soldering speci�cations>> Phase diagrams and their analysis>> Re�ow Process requirements>> Features of a re�ow equipment>> Re�ow zones and pro�le parameters>> Comparison between the Sn-Pb and Pb-free

re�ow process>> Types of re�ow pro�le

a. Ramp-Soak-Spikeb. Ramp-to-spike or Straightc. Shoulderd. Flat Head

>> Re�ow pro�le band and its use>> Procedure to generate re�ow pro�le>> Oven setting parameters>> Procedure of thermocouple attachment >> Issues a�ecting Pb-free re�ow>> Re�ow process issues>> Nitrogen inerting and its need>> Critical parameters for re�ow>> Re�ow pro�le elements and associated defects

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WS6 What I Have to Know About the Choice of Solders to Prevail in the New Era – Part 2*Ning Cheng-Lee, Ph.D., Indium Corporation

Course Objectives Since the dawn of electronic industry, the soldering process encompasses mainly component manufacturing and printed circuit board assembly with hierarchic melting range selection. The former use solder alloys with melting temperature around 300°C, which will not melt in the subsequent PCB assembly process, where the solders typically melt around 200°C. Low temperature solders with melting temperature < 180°C are currently mainly used for niche applications. However, iNEMI roadmap predicts low temperature soldering to become one of the main stream processes by 2017. The low temperature soldering is greatly desired for a number of special applications, such as many sensors used in IoT, heat sensitive devices, systems with more hierarchic levels, parts with signi�cant di�erence in coe�cient of thermal expansion, components exhibiting severe

thermal warpage, or products with highly miniaturized design. This course will cover the varieties of low temperature solders with emphasis on lead-free alloys, their physical, mechanical, and soldering properties, and the applications involved with those alloys.

Topics Covered>> Market Demand & Tentative Binary Alloys Options>> SnIn>> BiSn>> BiSn + Ag >> BiSn + Proprietary Dopants>> BiSn + In, Ni>> BiSn + Sb, Zn, Ag>> SnInAg & Applications>> Summary>> Appendix

WS7 Fan-Out Wafer-Level Packaging and 3D Packaging*John Lau, Ph.D., ASM Paci�c Technology

Course Objectives Recent advances in, e.g., fan-out wafer/panel level packaging (TSMC’s InFO-WLP and Fraunhofer IZM’s FO-PLP), 3D IC packaging (TSMC’s InFO_PoP vs. Samsung’s ePoP), 3D IC integration (Hynix/Samsung’s HBM for AMD/NVIDIA’s GPU vs. Micron’s HMC for Intel’s Knights Landing CPU), 2.5D IC Integration (Xilinx/TSMC’s CoWoS and TSV-less interconnects and interposers), embedded 3D hybrid integration (of VCSEL, driver, serializer, polymer waveguide, etc.), 3D CIS/IC integration, 3D MEMS/IC integration, and Cu-Cu hybrid bonding will be discussed in this presentation. Emphasis is placed on various FOWLP assembly methods such as chip-�rst with die-up, chip-�rst with die-down, and chip-last (RDL-�rst). Since RDLs (redistribution layers) play an integral part of FOWLP, various RDL fabrication methods such as Cu damascene, polymer, and PCB (printed circuit board) will be discussed. A few notes and recommendations on wafer vs. panel, dielectric materials, and molding materials will be provided. Also, TSV-less interposers such as those given by Xilinx/SPIL, Amkor, SPIL/Xilinx, ASE, MediaTek, Intel, ITRI, Shinko, Cisco/eSilicon, Samsung, and Sony will also be discussed. Furthermore, new trends in semiconductor packaging will be presented.

Topics Covered>> Introduction >> Fan-Out Wafer/Panel-Level Packaging

• Patents Impacting the Semiconductor Packaging • Fan-out Wafer/Panel-Level Packaging Formations

-Chip-�rst (die-down) -Chip-�rst (die-up) -Chip-last (RDL-�rst)

• RDL Fabrications -Polymer method -PCB/LDI method -Cu damascene method

• TSMC InFO-WLP • TSMC InFO-PoP vs. Samsung ePoP • Wafer vs. Panel Carriers • Notes on Dielectric and Epoxy Mold Compound • Semiconductor and Packaging for IoTs (SiP) • Wafer/Panel-Level System-in-Package (WLSiP

and PLSiP) • Package-Free LED (Embedded LED CSP) • SMT assembly of fan-out packages

>> 3D IC Integration with TSVs • Memory Chip Stacking – Samsung’s DDR4 • Hybrid Memory Cube (HMC) – Micron/Intel’s

Knights Landing • High Bandwidth Memory (HBM) – Hynix/AMD’s

and Samsung/Nvidia’s GPU • Chip stacking by TCNCF • Samsung’s Widcon • 3D IC/CIS Integration • 3D IC/MEMS Integration • Embedded 3D Hybrid Integration

>> 2.5D IC Integration and TSV-Less Interposers • TSMC/Xilinx’s CoWoS • Xilinx/SPIL’s TSV-less SLIT • SPIL/Xilinx’s TSV-less NTI • Amkor’s TSV-less SLIM • ASE’s TSV-less FOCoS • MediaTek’s TSV-less RDLs by FOWLP• Intel’s TSV-less EMIB • Intel/AMD’s TSV-less EMIB for CPU, GPU, and HBM• ITRI’s TSV-less TSH • Shinko’s TSV-less i-THOP • Cisco/eSilicon’s TSV-less Organic Interposer • Samsung’s TSV-less Organic Interposer • Sony’s TSV-less CIS (Cu-Cu Hybrid Bonding)

>> Semiconductor Packaging and Assembly New Trends

>> Summary and Q&A

Sunday, September 17 1:30 pm – 5:00 pm

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WS8 Stencil Printing – Advanced Topics*Chrys Shea, Shea Engineering Services

Course Objectives This advanced course on SMT solder paste stencil printing builds upon the basics to give the attendees a larger toolkit for troubleshooting and process improvement. The session starts with the handling and veri�cation of incoming stencils, and continues with detailed methods of troubleshooting suspected stencil issues, showing images and data from multiple real-world stencil trials.

Stencil underwiping is presented, reviewing types of wipe sequences, wiper papers and solvents, particularly as they relate to modern lead-free solder pastes and the preservation of nanocoatings. Videos and ultraviolet images of the e�ects of cleaning and nanocoatings are shown.

The course then moves to automated Solder Paste Inspection (SPI) and discusses basic types of SPI equipment. It continues with tips for production implementation and setting inspection tolerances. It then introduces simple experimental methods that can be performed quickly and easily to improve yields using SPI data. The di�erences between accuracy and repeatability are discussed, as are the e�ects of setting of reference planes and measurement thresholds.

The course concludes with the latest updates from the past year’s research.

Topics Covered>> Stencil Veri�cation

• SPI veri�cation • Test coupons• SEM images • Cleaning before using

>> Stencil Troubleshooting • Physical damage • Foil thickness • Aperture size • Aperture location • Impact on AR & TE • Cut Quality

>> Underwiping • Purpose and methods• UV Test results • Solvent requirements • Solvent compatibility with solder pastes • Solvent and paper compatibility

with nanocoatings >> Automated Solder Paste Inspection (SPI)

• SPI basics• Production implementation • Setting inspection tolerances• Improving print yields • Accuracy and Repeatability• Reference planes and measurement thresholds• Special features to improve performance

>> Latest developments in stencil printing technologies

WS9 SMT For Movers, Shakers & RainmakersRay Prasad, Ray Prasad Consultancy Group

Course Objectives Most of the SMT courses at various conferences cater primarily to Engineers and Technicians. They are too technical for the Rainmakers, the people who bring in the business and are dealing with business issues of SMT. The objective of this course is to provide technical information to movers, shakers and the rainmakers responsible for selling and buying of SMT equipment and materials including components and PCBs.

This workshop provides an overview of SMT manufacturing processes and role of SMT equipment and materials in non-technical manner. It begins with highlighting the problems that we all need to address, no matter what our job titles are and then delves into the role of materials and equipment to solve those problems. A good understanding of key issues in SMT without getting too technical is intended to help to help you in making sound business decisions.

Topics Covered>> Benchmarking the Problem

• Lead Pitch and Con�guration and Their Impact on Quality

• Impact of Lead Free, No clean, Fine Pitch and No Lead on Yield

• Role of Materials and Equipment in Controlling Quality

>> SMT Components, Processes and Equipment • Selection & Evaluation of SMT Equipment • Active and Passive SMT components• SMT Process Flow for Various Types of Products• Adhesive, Paste and Their Application• Soldering (Re�ow including Vapor Phase, Wave

& Selective)• Flux and Cleaning & No Clean• AOI, Repair and Test

>> Strategy for Preventing Field Returns• Quality Index for Managers to Monitor• Review


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WS10 Flexible and Rigid Flex Circuits Design and Assembly Process Principles*Vern Solberg, Solberg Technical Consulting

Course Objectives The design guidelines for �exible circuits, although similar to rigid circuits, are somewhat unique. In essence, �ex-circuits furnish unlimited freedom of packaging geometry while retaining the precision density, and repeatability of printed circuits. Flex-circuits typically replace the common hard-wire interface between electronic assemblies. The �exible circuits, however, have signi�cant advantages over the hard-wired alternative because they �t only one way, eliminate wire routing errors, and save up to 75% on space and weight. Because the �ex-circuit conductor patterns can maintain uniform electrical characteristics they contribute to controlling noise, crosstalk, and impedance. The �ex-circuits will often be designed to replace complex wire harness assemblies and connectors to further improve product reliability.During the half-day tutorial program participants will have an opportunity to review and discuss the latest revision of PC-2223, Sectional Design Standard for Flexible Printed Boards that include base material sets, alternative fabrication methodologies and SMT-on-�ex assembly processes. The workshop will also furnish practical �ex circuit supplier DfM recommendations for ensuring quality, reliability and manufacturing e�ciency.

Topics Covered>> Applications and use environment

• Commercial/Consumer • Industrial/Automotive • Medical/Aerospace • Establishing end use criteria

>> Designing �exible and rigid-�ex circuits • Flex circuit outline planning • Circuit routing and interconnect methodologies • Fold and bend requirements • SMT land pattern reinforcement criteria

>> Material and SMT components• IPC standards for �ex and rigid-�ex dielectrics• Base material and metallization technologies • Selection criteria for SMT components • SMT land pattern development

>> Assembly processing of �ex and rigid-�ex circuits • Dimensioning and tolerance criteria • Palletized layout for in-line assembly processing • SMT assembly process variations

and methodologies• Alternative joining methods for �exible circuits

Monday, September 18 8:30 am – 12:00 pm

WS11 Surface Finish HASL Alternatives for PCB Applications*George Milad, Uyemura International Corporation

Course Objectives Course Objectives Surface �nish is about connectivity. It is the surface through which the connection from the board to a device occurs. Ball grid arrays, wire bonding pads, press �t, and contact switches are all outside the traditional realm of HASL and electrolytic nickel gold tab plating and require innovative solutions. This workshop will focus on the alternatives: electroless nickel/immersion gold, electroless gold, immersion silver, immersion tin, OSP, electroless palladium, direct gold on copper and the newcomer electroless palladium/immersion gold EPIG. Deposit description, thickness requirements, method of manufacturing, shelf life, application, limitations and relative cost will be covered in detail, from design thru assembly. A complete update on IPC Speci�cations will be presented.

Topics Covered>> Electroless Nickel/Immersion Gold( ENIG) >> Electroless Gold >> Electroless Nickel/Electroless palladium/�ash

Gold (ENEPIG) >> Direct Immersion Gold on Copper DIG >> Electroless Palladium on Copper >> Organic Solderability Preservative OSP >> Immersion Silver >> Immersion Tin >> Electroless Palladium Immersion Gold EPIG


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WS12 Solder Joint Reliability – Principles and ApplicationsJennie Hwang, Ph.D., H-Technologies Group

Course Objectives The course emphasizes on practical, working knowledge, yet balanced and substantiated with science by outlining solder joint reliability fundamentals in fatigue and creep damage mechanisms via ductile, brittle, ductile-brittle fracture, and by discussing the critical “players” of solder joint reliability (e.g., manufacturing process, PCB/component coating surface �nish, solder alloys). Likely solder joint failure modes of interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced and surface cracks will be illustrated. To withstand harsh environments, the strengthening metallurgy to further increase fatigue resistance and creep resistance will be addressed, and the power of metallurgy and its ability to anticipate the relative performance will be illustrated by discussing the comparative performance vs. metallurgical phases and microstructure. The question on whether a life-prediction model can assure reliability will be discussed. A relative reliability ranking among commercially available solder systems, as well as the scienti�c, engineering and manufacturing r easons behind the ranking will be outlined. Attendees are encouraged to bring their own selected systems for deliberation.

Topics Covered>> Solder joint fundamentals & thermo-mechanical

behavior and degradation – fatigue and creep interaction

>> Solder joint failures modes – interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others

>> Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture

>> Solder joint strengthening metallurgy >> Illustration of microstructure evolution vs.

strengthening in Sn Cu+x,y,z and SnAgCu+x,y,z systems

>> Solder joint voids vs. reliability – causes, e�ects, criteria

>> Solder joint surface-crack – causes, e�ects >> Distinctions and commonalties between Pb-free

and SnPb solder joints >> Thermal cycling conditions – e�ects on test results

and test results interpretation >> Testing solder joint reliability – discriminating tests

and discerning parameters >> Life-prediction model vs. reliability >> Solder joint performance in harsh environments >> What solder alloys are on the horizon and what

impact will be on reliability >> Best practices and competitive manufacturing >> Ultimate reliability

WS13 Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward CompatibilityRay Prasad, Ray Prasad Consultancy Group

Course Objectives Ball Grid Array (BGA) is one of many surface mount components but it brings unique challenges in both design and assembly of the mixed assembly products. There is great interest in BGA because it o�ers so many bene�ts such as real estate savings, high yield and better electrical performance. Despite these promises, there are many problems in BGA and CSP (Chip Scale Packaging). The need to implement lead free simply compounds the problem due to intentional or unintentional mix of tin lead and lead free components on a mixed assembly board.

This course is based on the latest revision (Jan 2013) of IPC-7095C “Design and Assembly Process Implementation for BGA, Rev C” currently chaired by Ray and his book Surface Mount Technology Principles and Practice.

This is not a theoretical course. It is based on Ray’s years of experience in successfully implementing SMT

at Boeing and Intel, and various clients including legal cases related backward compatibility. You will get insight into what to do about backward and forward compatibility issues when you have no choice but to deal with tin-lead and lead free BGA on the same board and want to produce products that improve yield, reduce cost and keep away from legal troubles.

In this course we will also talk about major defects such as pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids. And you will learn everything you wanted to know about voids but were afraid to ask. We will talk about various types of voids in BGA, their impact and their minimization and acceptance criteria to meet industry standard.

You will also get an insight into the interdependency of design and manufacturing to achieve higher yield, lower cost and faster time to market.

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Topics Covered>> BGA Component Styles: Tin-lead, No Lead and

High Lead>> Industry Standard for BGA Design and Assembly

(IPC-7095)>> Driving Forces for BGA>> Major Concerns with BGA: Moisture and Warpage >> BGA Design Rules and Guidelines – Impact of ball

size, pitch and I/O count>> BGA Assembly Processes: Issues and Answers

a. Printing and Re�ow Pro�ling Guidelines

>> Backward & Forward Compatibility Issues and role of selective laser re�ow

>> Impact of Lead Free on BGA Reliability>> Various Types of Voids in BGA, their impact,

measurement and control>> Major Types of BGA Defects

a. Pad cratering, head in pillow, as ball drop, smiling and frowning BGA and black pad and champing voids

>> BGA Repair>> Summary

WS14 Defect Analysis and Process Troubleshooting: Part 1*Phil Zarrow & Jim Hall, ITM Consulting

Course Objectives We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear de�nition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and e�ect of defects relative to speci�c processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identi�ed and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

Topics CoveredIntroduction Prevention: Process Development and Validation Variation (Common Cause) Continuous Improvement Defect De�nition Failure Reduced Reliability Process Indicator Special Cause vs. Common Cause Defect Identi�cation Inspection Manual AOI X-Ray Test ICT Functional Contamination False Calls / Escapes Causes of Defects Special Cause vs. Common Cause Variability (repeatability) Accuracy Process not Optimized Root Cause Analysis 5 Whys” Cause and E�ect Diagram Process Relationships Incoming Materials Handling Process Problems

WS15 Design for Excellence: Current Realities*Dock Brown, CRE, DfR Solutions

Course Objectives The objective of the professional development course is to provide the attendees actionable information on the industry best practices on how to predict and ensure the reliability of electronic product lifecycle and within project budget and schedule constraints. Product failures are driven by electrical, mechanical, thermal, chemical, and humidity stresses. Industry standards cover most of those and form the basis for developing design requirements.

Those requirements can then be used during design and development to take conceptual designs and applying design rules with simulation and modeling tools, board performance and likely sources of failures can be quickly determined. Special emphasis is given to recent hot failure topics such as lithium batteries, MLCCs, and board cleanliness.

Topics CoveredGeneral Concepts and Models Fitness for Use Five Pillars of DfX Requirements and Parameter Management Use Conditions Structured Design Process Control Process Capability Four DfX Qualities Requirements Design Conformance Support Design Control Waterfall Risk Management Risk Model Risk Assessment Risk Mitigation ISO 13485 IQ/OQ/PQ PPAP Conceptual Product Space Model Product Life Expectations Materials and Processes Systems Technology Flow Model Rules vs Tools Material Degradation The Bathtub Curve Conformance Failures Random Failures Wear-out Failures Industry Standards Design for Sourcing Commercial of the Shelf (COTS) Custom Supply Chain Ecosystem Outsourcing Case Studies Risk Prone Materials and Processes Lithium Ion Batteries MLCCs Connectors Flame Retardants Fluxes

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Monday, September 18 1:30 pm – 5:00 pm

WS16 10 Essential Skills Every Process Engineer Needs To AcquireHappy Holden, GENTEX

Course Objectives This is a half-day course of skills that you don’t acquire in college! There are many essential skills required for a successful career in the electronics industry. The majority of them are technical, but there are also ‘soft’ skills required. Most of these are not taught in college, but have to be learned ‘on-the-job’ or the opportunities for advanced are seriously impaired. Presented here will be an important ten of the 25 essential skills required in electronics manufacturing. All 25 will be documented in the accompanied free e-Book, along with directions for further study, at your own pace.

Topics Covered>> Total Quality Control (TQC)>> Design of Experiments >> Problem solving skills >> Developing a Figure of Merit >> Design for Manufacturing and Assembly >> Computer Integrated Mfg. and

Automation Planning >> Computer Aided Manufacturing >> Dimensional Analysis >> Quality Function Deployment (QFD) >> Ten Step Business Plan

WS17 Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies*Mike Bixenman, DBA, KYZEN Corporation

Course Objectives As electronic devices build in more features using smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create other issues that may have time delayed e�ects. One such e�ect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with monolayers of moisture, there is the potential for ion mobilization causing current leakage.

How clean is clean enough is a question that OEMs struggle with when designing electronic hardware. Today, more than 50% of components placed onto the board assembly are bottom terminated. The number of connections, component pitch, stando� gap, �ux composition and volume of solder re�owed under the bottom termination can impact reliability.This workshop will look into contaminants derived from the chemical complexity of the PCB including �ux residues. We will explore conditions that could be

problematic to a no-clean process. Cleaning improves reliability but the complexity surrounding cleaning is far reaching with the use of �ne pitch leadless components, the need for longer wash times, high impingement pressure and material compatibility e�ects. We will explore these complexities and teach best cleaning practices. Once cleaning has been implemented, controlling the process assures repeatability lot to lot. We will explore methods for controlling the cleaning process including monitoring, traceability and data analytics.

Topics Covered>> Residues on the surface and under components>> Will these residues cause a reliability problem?>> Test methods that can be used to determine the

activity of these residues>> Will cleaning improve reliability?>> How clean is clean enough?>> Methods for controlling the cleaning process

including monitoring, traceability, and data analytics

WS18 Reliability of Electronics – Role of Intermetallic CompoundsJennie Hwang, Ph.D., H-Technologies Group

Course Objectives Intermetallic compounds play an increasingly critical role to the performance and reliability of solder interconnections in the chip level, package level and board level of Lead-Free electronics. This course covers the relevant and important aspects of intermetallic compounds ranging from scienti�c fundamentals to practical application scenarios. Intermetallic compounds before solder joint formation, during solder joint formation and after solder joint formation in storage and service will be examined. The course also discusses intermetallics at-interface and in-bulk, as well as the role of PCB surface �nish/component coating in relation to intermetallics, in turn, to reliability. The di�erence between SnPb and Pb-Free

solder joint in terms of intermetallic compounds, which a�ects production-�oor phenomena and the actual �eld failure, will be outlined. The course will also address the newer Lead-Free alloys that were recently introduced to the market. Attendees are welcome to bring their own selected systems for deliberation.

Topics Covered>> Intermetallic compounds – de�nition,

fundamentals, characteristics>> Phase diagrams of lead-free solders in contrast

with SnPb>> Intermetallic compounds in the intrinsic

material – Pb-free vs. SnPb

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>> Formation and growth during production process and in product service life

>> Intermetallic compounds – at-interface vs. in-bulk>> E�ects from substrate compositions (hybrid

module thick �lm pads, PCB surface �nish, component surface coating)

>> Gold embrittlement

>> Di�erent types of intermetallic compounds – e�ects on solder joint reliability (Ni/Au, Ni/Pd/Au, Ni/Pd, Cu)

>> SAC alloys incorporated with various doping elements – characteristics, performance

>> E�ects on failure mode>> E�ects on reliability

WS19 Defect Analysis and Process Troubleshooting: Part 2*Phil Zarrow & Jim Hall, ITM Consulting

Course Objectives We don’t assemble electronics in “perfect world”. Defects happen! This course examines Failure and Root Cause analysis of PCBA defects, starting with clear de�nition of the generic types of defects and their impact, such as non-function, reduced reliability, etc. Detection and determination methodologies and procedures will be discussed. Cause and e�ect of defects relative to speci�c processes and equipment centers as well as materials are presented. Key causes of assembly problems and low yields are identi�ed and resolved. This seminar is intended for anyone involved in directing, developing, managing and/or executing

Failure and Root Cause analysis and defect resolution including managers, engineers and others in manufacturing, quality and design.

Topics CoveredSpeci�c Processes General: wrong process, material, etc. Printing Placement Soldering Singulation Coating Mechanical Assembly Testing Speci�c Defect Examples and Causes Wrong Part Damaged Parts Shorts Opens Poor Wetting Insu�cient Contamination New Speci�c Defects HiP / NWO Graping Pad Cratering CAF Conclusion Questions

WS20 DFM In A World Of Shrinking Electronics – Will Traditional DFM Survive?*Dale Lee, Plexus Corp.

Course Objectives As electronic component packaging technologies continue to decrease in size (0201/01005/008003), lead pitch continues to decrease (0.4/0.35/0.3/…), bottom terminated components increase in complexity (QFN/DFN/LGA) and printed circuit board designs increase in diversity of component packaging technologies on a single assembly, layer counts increase, via in pad utilization increases, increasing copper thicknesses, increasing thermal sensitivity of components and assembly process, and industry standards trailing in application to current technology demands has impacted traditional assembly processes. Today’s assemblies require tight solder application, component placement, thermal management and soldering constraints. Using traditional, simpli�ed mass production techniques are not be su�cient to achieve a high-yielding manufacturing process.

This course will highlight elements of the impacts of these technologies on reliability and yield when not properly addressed in the design/assembly/inspection-test process and their impacts on thermal connections of through-hole and surface soldering processes, introduce the elements of matching the manufacturing process to the product design(DFMP), and provide examples of several opportunities within the DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching. The concept of manufacturing, test, reliability by design (XBD) will be presented.

Topics Covered>> Component packaging impacts>> PCB design impacts and industry

standards limitations>> SMT and PTH solder design impacts>> Components with thermal management impacts:

• Component design• PCB Thermal balance: X, Y and Z axis• Trace routing • Equipment limitation/tolerance• PCB array tolerance• Process tooling design

>> Process control impacts>> Paste volume, thermal shock SMT and PTH, re�ow

process warpage>> Cleaning impacts>> Compatibility issues, low stand-o� components

Monday, September 18 1:30 pm – 5:00 pm

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SPOTLIG

HT SERIES

Tuesday, September 19

Spotlight 1 Component Challenges 11:00 am – 12:30 pm

Chair: *Charles Woychik, Ph.D., i3 Electronics

>> Void Reduction Strategy for Bottom Termination (BTC) Components Using Special Flux Coated PreformsAnna Lifton, Alpha Assembly Solutions

>> Solder Geometry Prediction of 01005 Packages using Surface Evolver with Validations*Narayanan Manickam, SMTC Corporation

>> Contact Interconnect Challenge and Resolution – The DDR4 Dual-Contact Methodology, Component, and Board Level Reliability*Paul E. Wang, Ph.D., MiTAC International Corp

Spotlight 2 Quality and Reliability 2:00 pm – 4:00 pm

Chair: *Jason Fullerton, Alpha Assemby Solutions

>> Lean Reliability Program to Meet Today’s Electronics Manufacturing Demand*Rita Mohanty, Ph.D.

>> Reliability Engineering: Skills/Knowledge, Experience & EducationManthos Economou, NVIDIA

>> SSD Quality in Enterprise Storage Application – Key Learning and E2E ApproachDave Verburg, IBM Corporation

>> IPC-1782 Standard for Traceability of Critical Items Based on RiskCameron Shearon, AT&T

Wednesday, September 20

Spotlight 3 Solder Alloys and Soldering 8:00 am – 10:00 am

Chair: Chandradip Patel, Ph.D., Schlumberger

>> Resource-e�cient and Cost-e�ective Wave Soldering – Plasma Fluxing, Pulsar Preheating and Lead-Free Low Temperature SolderingAndreas Reinhardt, SEHO Systems GmbH

>> Comparative Study on Impact of Various Low Creep Doped Alloys Anto Raj, Auburn University

>> Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT AssemblyRanjit Pandher, Ph.D., Alpha Assembly Solutions

>> RoHS Eleven Years Later: How has it Gone *Ron Lasky, Ph.D., P.E., Indium Corporation

Complimentary Technical Sessions Held in Theater on Expo Show Floor

THESpotlight Series

* Designates Speaker of Distinction


Spotlight 4 Process Control 11:00 am – 12:30 pm

Distinguished Speakers SessionChair: *Eric Camden, Foresite, Inc. Co-Chair: Joe Rosseau, Precision Analyticsal Laboratory, Inc.

>> Flux Amount Control for a Consistent Process Quality*Gerjan Diepstraten, Vitronics Soltec BV

>> Cleanliness Process Control – An Innovative Approach to a Complex Problem*Mike Bixenman, DBA, KYZEN Corporation

>> SMT Wars – Lesson Learned from an Electronic Contract Manufacturer and the Customer Who Sued Them*Mike Konrad, Aqueous Technologies

Spotlight 5 Panel: Warpage Induced Defects and 2:00 pm – 3:00 pm

Component Warpage LimitsChair: Brook Sandy-Smith, Indium Corporation Co-Chair: Eric Moen, Akrometrix, LLC

>> Panelists: *Alex Chan, Nokia *Martin Anselm, Rochester Institute of Technology *Dudi Amir, Intel Corporation Neil Hubble, Akrometrix

Wednesday, September 20

T R AC K K E Y

Advanced Packaging Technology (APT)

Flux, Solder, Adhesives (FSA)

Harsh Environments Applications (HE)

Inspection Technologies (INS)

Lead-Free Soldering Technology (LF)

Manufacturing Excellence (MFX)

Substrates/PCB Technology (SUB)

Technical Innovations (TI)

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Streamed on

FacebookLIVE!


Monday, September 18 See track key on page 23.

Harsh Environments Symposium 8:30 am – 5:00 pm

HE1 Predicting Component Life for Harsh Environments 8:30 am – 10:00 am

Chair: *Pradeep Lall, Ph.D., MBA, Auburn University Co-Chair: Michael Peterson, Seagate Technology

>> Fatigue Life Prediction Model for LEDs on Metal Core Printed Circuit Boards (MCPCBs) with Pb-Free Solder Alloys*Maxim Serebreni, DfR Solutions

>> Thermal Cycling – It Doesn’t Have to be a Waste of Time and Money*Peter Borgesen, Ph.D., Binghamton University

>> R1 – a German Reliability Comparison Study between 14 Lead free Alloys*Joerg Trodler, Dipl.-Ing., Heraeus Electronics

HE2 Impact of Chemically Corrosive Environments 10:30 am – 12:00 pm

to the Reliability of Electronic Components Chair: Sa’d Hamasha, Ph.D., Auburn UniversityCo-Chair: Alex Schreiner, Newson USA, LLC

>> E�ect of Cl2, NO2, RH and Temperature on Ag and Cu Corrosion in a Mixed Flowing Gas ChamberBo Yuan, University of Delaware

>> Round Robin Testing of Creep Corrosion Dependence on Relative Humidity*Prabjit Singh, Ph.D., IBM Corporation

>> Packages and Interconnects under Harsh Conditions*Kirsten Weide-Zaage, Ph.D., Leibniz Universität Hannover

HE3 Material Selection and Test Methods 1:30 pm – 3:00 pm

for Harsh Environments Chair: Mike Buetow, CIRCUITS ASSEMBLY MagazineCo-Chair: Scott Priore, Cisco Systems, Inc.

>> Utilization of the IPC B52 Test Board for Platform Release in the Automotive IndustryLothar Henneken, Ph.D., Robert Bosch GmbH

>> E�ect of Long-Term Aging on SnAgCu Solder Joints Reliability in Mechanical Cycling FatigueFrancy John Akkara, Auburn University

>> Ceramic Capacitor Failures – Recent Realities*Dock Brown, CRE, DfR Solutions

HE4 Ruggedization of Electronic Components for 3:30 pm – 5:00 pm

Demanding Automotive ApplicationsChair: *Babak Arfaei, Ph.D., Ford Motor CompanyCo-Chair: Je� Jennings, Harris Corporation

>> Continued Advances in the Research of a Cu-Ni/Sn High Temperature Pb-Free Composite Solder PasteStephanie Choquette, Iowa State University

>> Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-term Isothermal AgingSeth Gordon, Auburn University

>> The Necessity of Temperature Humidity Bias Testing with High Voltages – 1000 VErik Biehl, Ph.D., Robert Bosch GmbH

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TECHNICAL SESSIONS Located in Upper Level, South Ballroom


Technical Innovations Symposium 8:30 am – 5:00 pm

TI1 Micro-Dispensing and Additive 8:30 am – 10:00 am

Manufacturing DevelopmentChair: David Reitz, Inventec Performance Chemicals Co-Chair: Steve Greathouse, Plexus Corp.

>> Solder Paste Jetting, an Integral ApproachJe�rey Leal, Mycronic

>> Micro-dispensed 50 Micron Solder Dots from Type VII SolderKenneth Church, Ph.D., nScrypt, Inc.

>> Modern Multi-Material – 3D-Manufacturing with Separate Toner Layer Structure Production and Component AssemblyRalf-Kilian Zäh, M.Sc., ZeMA - Zentrum für Mechatronik und Automatisierungstechnik (Centre for Mechatronics and Automation)

TI2 Adhesive and Coating Development 10:30 am – 12:00 pm

and CharacterizationChair: Brian Toleno, Ph.D., Microsoft Corporation Co-Chair: Gregory Vance, Rockwell Automation

>> Moisture E�ects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage Threshold Moisture Level for Moisture Sensitive PolymersJe� Jennings, Harris Corporation

>> 1000 Days of Testing Sn Whiskering PCB Assemblies to Determine the Suitability of Conformal Coatings to Mitigate Against ShortingMartin Wickham, National Physical Laboratory

>> Silicone Pressure TestingKent Larson, Dow Corning Corporation

TI TI Luncheon Keynote Presentation 12:30 pm – 1:45 pm

Chair: Rob Boguski, Datest Corporation

>> 2017 iNEMi Roadmap Highlights Impacting Board Assembly Over the Next 5 to 10 YearsBill Bader, iNEMi

TI3 Adhesive Development and Characterization 2:00 pm – 3:00 pm

Chair: Rob Boguski, Datest Corporation Co-Chair: Julie Silk, Keysight Technologies Inc.

>> Fracture Toughness of Thermally Conductive Adhesives*John Timmerman, Ph.D., Henkel

>> Silicone Hot-Melt Technology: A New Alternative for a Fast Assembly OperationLuis Carlos Montemayor, Dow Corning Corporation

TI4 Technical Innovations Panel 3:30 pm – 5:00 pm

Chair: *Reza Gha�arian, Ph.D., Jet Propulsion Laboratory Co-Chair: *Paul E. Wang, Ph.D., Mitac International Corporation

Lead-Free Current/Future Presentations*Raiyo Aspandiar, Ph.D., Intel Corporation*Paul Vianco, Ph.D., Sandia National Laboratories*Charles Woychik, Ph.D., i3 Electronics

Emerging Technology Presentations:>> Panel Level Technologies for Packaging

Lars Böttcher, Frauhofer Institute Berlin>> What is new in Electronics

Steve Greathouse, Plexus Corp.>> Challenges with 3D/2.5D Packaging

*Charles Woychik, Ph.D., i3 Electronics>> Electronics and Optics Trends

Irene Sterian, P.E., Celestica Inc.


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Women’s Leadership Program 1:30 pm – 5:00 pm

Chair: *Priyanka Dobriyal, Ph.D., Intel Corporation Co-Chair: *Marie Cole, IBM Corporation

Presentations 1:30 pm – 4:15 pm

>> The Current State of Women in Manufacturing and the Future ForecastAllison Grealis, Women in Manufacturing

>> Iot – Connected with a PurposeEd Calusinski, IBM Corporation

>> How Brain-like Machine Learning Changed My Daily WorkHengemah James, Intel Corporation

WLP Panel 4:15 pm – 5:00 pm

Diversity in the Workplace

Moderator: Claire Saunders, What’s New in Electronics

Panelists:Ed Calusinski, IBM CorporationJulie Silk, Keysight Technologies, Inc.Jill Mur�n, NIKE, Inc.Gayle Paterson, FLITE

Women’s Leadership Connection Reception 5:00 pm – 6:00 pm

Wine and hors d’oeuvres will be served.


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Tuesday, September 19 See track key on page 23.

APT1 Analysis 11:00 am – 12:30 pm

Chair: *Martin Anselm, Ph.D., Rochester Institute of Technology Co-Chair: Bill Barthel, Plexus Corp.

>> Failure Analysis for Small Form Factor Devices*Priyanka Dobriyal, Ph.D., Intel Corporation

>> Automating Process Control From the Lab to the Fab and Back-EndJack Richtsmeier, Sonoscan, Inc.

>> SMT Electrolytic Capacitor Solder Joint Criteria & Integrity Investigation*David Hillman, Rockwell Collins

MFX1 Factory Automation 11:00 am – 12:30 pm

Chair: Eddie Kobeda, Ph.D., Visionary Thinking Group Co-Chair: Roy Starks, Libra Industries

>> Industry 4.0 and the Cognitive Transformation of Electronics Manufacturing*Marie Cole, IBM Corporation

>> How Your Factory Will Become Smart With CIM And IoTMichael Ford, Mentor Graphics

>> Enabling Intelligent Supply Chain for Electronics Manufacturing*Thilo Sack, Celestica Inc.

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SUB1 Copper Plating 11:00 am – 12:30 pm

Chair: Jim Pierce, Axiom Electronics LLC Co-Chair: Rob Rowland, Axiom Electronics LL

>> Copper Pillar Plating Systems High Speed – Low HeatAlbert Angstenberger, Ph.D., MacDermid Enthone Electronics Solutions

>> Copper Paste for the Novel ProcessKosuke Urashima, Hitachi Chemical

>> Innovative Acid Copper Process for Simultaneously Filling Vias and Plating Through HolesMaria Nikolova, Ph.D., MacDermid Enthone

FSA1 Solder Paste Combination 11:00 am – 12:30 pm

Chair: Ursula Marquez de Tino, Ph.D., Plexus Corp. Co-Chair: Mathias Nowottnick, Ph.D., University of Rostock

>> Rheology Behavior of Flux and Solder PasteFan Gao, Kester

>> Development of a Low Voiding Lead-Free Solder Paste for High Reliability ApplicationsEmmanuelle Guéné, Inventec Performance Chemicals

>> Solder Powder Characteristics and their E�ect on Fine Pitch Printing of Solder PasteAmir Nobari, Ph.D., 5N Plus Micro Powders Inc.

APT2 BTC Leadless 2:00 pm – 4:00 pm

Chair: Anny Zhang, Indium Corporation Co-Chair: Michael Peterson, Seagate Technology

>> Design for Excellence: Inductor Form, Fit, Function Equivalence & New Design Rules*Matt Kelly, P.Eng, MBA, IBM Corporation

>> Bucking BTC/QFN Convention – Design for Survival. Sound Design for QFN, supported by DoERussell Steiner, Allegion

>> Optimization of Stencil Opening, Package Tilting and BLR Performance of SON PackagesAndy Zhang, Texas Instruments

>> Evaluation of QFN Technology with Optically Inspectable Solder Connections*Andrew Mawer, NXP Semiconductor

MFX2 Printing 2:00 pm – 4:00 pm

Chair: *Dudi Amir, Intel Corporation Co-Chair: Tim Jensen, Indium Corporation

>> Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications Part 2*Mark Whitmore, ASM Assembly Systems

>> Stencil and Solder Paste Inspection for Miniaturized SMT Components- Revisited Four Years Later*Chrys Shea, Shea Engineering Services; *Bob Farrell, Benchmark Electronics, Inc.

>> Stencil Aperture Area Ratio Extension – Impact of Stencil Technology, Solder Paste Chemistry and Solder Particle Size*Srinivasa Aravamudhan, Intel Corporation

>> How Creating a Stencil Process that Focuses in the Aperture Design Improves Cp and Cpk values of any Printer ProcessJim Villalvazo, Interlatin


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SUB2 Surface Finishes 2:00 pm – 3:30 pm

Chair: *Don Banks, Abbott Co-Chair: Mark Fulcher, Continental Automotive

>> Achieving a Successful ENIG Finished PCB Under Revision A of IPC 4552*Lenora Clark, MacDermid Enthone

>> The Impact of Deposition Thickness on High Speed Shear Test Result Speci�cally Related to Electroless Palladium and Semi Autocatalytic GoldDaniel Schmidt, Atotech Deutschland GmbH

>> Characteristics of New Electroless Au/Pd/Au Process for Fine Line ApplicationTetsuya Sasamura, Ph.D., C. Uyemura & Co.,Ltd.

FSA2 Solder Alloy 2:00 pm – 3:30 pm

Chair: Jason Emes, Pennatronics Corporation Co-Chair: Tom Rovere, Lockheed Martin

>> New Pb-Free Solder Alloy for Demanding Applications*Mehran Maalekian, Ph.D., AIM Solder

>> Alternative Strengthening Mechanism for Lead-Free Solders*Keith Sweatman, Nihon Superior Company, Ltd.

>> Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications*Ning-Cheng Lee, Ph.D., Indium Corporation

Wednesday, September 20 See track key on page 23.

APT3 Thermal/Power Packaging 8:00 am – 10:00 am

Chair: *Richard Coyle, Ph.D., Nokia Co-Chair: *Charles Woychik, Ph.D., i3 Electronics

>> The High Reliable Package Die-Bonding with Sintering Copper PasteHideo Nakako, Ph.D., Hitachi Chemical Co., Ltd.

>> High Performance Electronic Interconnect Materials Characterization – Techniques & ChallengesNicholas Herrick, Alpha Assembly Solutions

>> Reliability Assessment of Die Attachment Materials for High Power Chip Package DesignHanxue Liu, P.E., Ericsson (China) Communications Company Limited

>> Nano-Cu Sintering Paste for High Power Devices Die Attach Applications*Ning-Cheng Lee, Ph.D., Indium Corporation

MFX3 Product Assembly Challenges 8:00 am – 10:00 am

Chair: *Dock Brown, DfR Solutions Co-Chair: Lars Bruno, M.Sc., Ericsson AB

>> Practical Application and Analysis of Lead-Free Solder for Hearing AidsYoungtak Lee, Starkey Hearing Technologies

>> Impact of Test Vehicle on Process Development for Fine Pitch WLP-CSP Assembly*Iulia Muntele, Ph.D., Sanmina Corporation

>> Characterization Study of Surface Mount Processes for Miniature RF and Co-Axial ConnectorsVineeth Bastin, Nordson DAGE

>> Particle Impact Dampers (PID) can Mitigate Random Vibration Fatigue in Printed Circuit BoardsRon Hunt, Topline


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SUB3 PCB Reliability 8:00 am – 10:00 am

Chair: *Rita Mohanty, Ph.D., DfR Solutions Co-Chair: *Tony Lentz, M.Sc., FCT Assembly, Inc.

>> The Impact of Final Plated Finishes on Insertion Loss for High Frequency PCB’sJohn Coonrod, Rogers Corporation

>> Hybrid Laminate Structure For Minimizing Pad Cratering*Chen Xu, Ph.D., Nokia

>> Comprehensive Study of Various Short Failures on Printed Circuited BoardXiao He, CEPREI

>> Assembly Reliability of FPBG/FCBGA on HASL/ENEPIG *Reza Gha�arian, Ph.D., Jet Propulsion Laboratory

FSA3 Under�ll/Encapsulation 8:00 am – 10:00 am

Chair: Chris Pozo, Molex Co-Chair: Debbie Carboni, KYZEN Corporation

>> Role of EMC Formulation and Operating Current on the Survivability of Cu-Al Wire bonds Operating in Extreme Environments*Pradeep Lall, Ph.D., Auburn University

>> Optimization Study of Filler Loading Level on Interconnection Performance with OSCA-R MaterialsJoseph Biggs, Kester

>> High Reliability and High Temperature Application Solution – Solder Joint Encapsulant PasteWusheng Yin, Ph.D., YINCAE Advanced Materials, LLC

>> X-ray Micro Computed Tomography Based FE Models for Potted Fuze Electronics Assemblies*Pradeep Lall, Ph.D., Auburn University

APT4 Reliability 1 11:00 am – 12:30 pm

Chair: *Marie Cole, IBM Corporation Co-Chair: *Andrew Mawer, NXP Semiconductor

>> Thermal Cycle Reliability of a Low Silver Ball Grid Array Assembled with Tin Bismuth Solder Paste*Richard Coyle, Ph.D., Nokia

>> Solder-Joint Reliability of a Large Body Molded Array Package*Burton Carpenter, NXP Semiconductors

>> Mitigation Strategies to Enhance Product-level BGA Shock Performance for Various Heat Sink Attachment MethodologiesWeidong Xie, Ph.D., Cisco Systems Inc.

MFX4 Re�ow 11:00 am – 12:30 pm

Chair: Ray Whittier, BAE Systems Co-Chair: Greg Kloiber, Ducommun Incorporated

>> Lead-Free Solder Paste Development for Ultra-Fine Pitch Printing and Re�ow of 03015 and 0201 Metric Chip Components*Jasbir Bath, KOKI Solder America

>> Low Temperature Soldering Using Sn-Bi AlloysMorgana Ribas, Ph.D., Alpha Assembly Solutions

>> SMT Pro�ling: Does it Represent Product Re�ow Exposure?Mitchell Ferrill, IBM Corporation


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SUB4 ENEPIG 11:00 am – 12:30 pm

Chair: *Lars Böttcher, Frauhofer Institute Berlin Co-Chair: Jörg Trodler, Heraeus Electronics

>> Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating In�uence of Phosphorus Content and Thickness of Electroless Pd Plating Film*Yoshinori Ejiri, Hitachi Chemical Co., Ltd.

>> Evaluation of the use of ENEPIG in Small Solder Joints under Thermal CyclingBen Gumpert, Lockheed Martin

>> The Mechanism of Nickel Corrosion in ENEPIG Deposits and How to Mitigate It*George Milad, Uyemura International Corporation

FSA4 Flux Reliability 11:00 am – 12:30 pm

Chair: Yanrong Shi, Ph.D., Kester Co-Chair: Eric Bastow, Indium Corporation

>> Dendritic Growth from Chemical Contamination and Partial Cleaning: Fundamental Tests and Application Study*Mike Bixenman, DBA, KYZEN Corporation

>> No-Clean Flux: A Potential Ionic Contaminant*Terry Munson, Foresite, Inc.

>> A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance – Part 2*Jason Fullerton, Alpha Assembly Solutions

APT5 Reliability 2 2:00 pm – 3:30 pm

Chair: *Burton Carpenter, NXP Semiconductors Co-Chair: *Jasbir Bath, Bath Consultancy LLC

>> Investigation of the In�uence of Voids on the Reliability of Solder Joints by the Finite Element MethodChristian Schwarzer, Fraunhofer ISC

>> The E�ect of Vacuum Re�ow Processing on Solder Joint Voiding and Thermal Fatigue Reliability*Richard Coyle, Ph.D., Nokia

>> Reliability of CGA/PGA Assemblies under Harsh Thermal Cycles*Reza Gha�arian, Ph.D., Jet Propulsion Laboratory

MFX5 Void Reduction 2:00 pm – 3:30 pm

Chair: Tom Borkes, The Je�erson Project Co-Chair: Rich Henrick, Sanmina Corporation

>> Process, Design and Material Factors for Voiding Control for Thermally Demanding ApplicationsAmit Patel, Alpha Assembly Solutions

>> E�ect of Voids on Thermo-Mechanical Reliability of Solder JointsMorgana Ribas, Ph.D., Alpha Assembly Solutions

>> Fill the Void III*Tony Lentz, MBS, FCT Assembly, Inc.

FSA5 Low Melting Alloy 2:00 pm – 3:30 pm

Chair: Adam Murling, Indium Corporation Co-Chair: Hemal Bhavsar, Kester

>> Possibilities and Limits of Bismuth SoldersMathias Nowottnick, Ph.D., University of Rostock

>> Void Reduction in Re�ow Soldering Processes by Sweep Stimulation of PCB Substrate – In�uence of Eigenmodes *Viktoria Rawinski, Ersa GmbH

>> iNEMI Project on Process Development of BiSn-Based Low-Temperature Solder Pastes*Raiyo Aspandiar, Ph.D., Intel Corporation


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Thursday, September 21 See track key on page 23.

APT 6 Advanced Packaging 8:00 am – 9:30 am

Chair: Brian Roggeman, Qualcomm Technologies Inc.Co-Chair: *Matt Kelly, MBA, P.Eng., IBM Corporation

>> Fine Line Through Hole Copper Filling in VCP for Next Generation PackagingDaniel Schmidt, Atotech Deutschland GmbH

>> The Next Generation of 2.5D Packaging using a Glass Interposer*Charles Woychik, Ph.D., i3 Electronics

>> Embedded Power Electronic Modules Realized by PCB Embedding*Lars Böttcher, Fraunhofer IZM Berlin

MFX6 Cleaning 8:00 am – 9:30 am

Chair: *Jason Fullerton, Alpha Assembly SolutionsCo-Chair: David Raby, STI Electronics

>> PCB Surface Finishes and the Cleaning Process – A Compatibility StudyNaveen Ravindran, M.S. Ch.E., ZESTRON

>> PCBA Component Cleanliness Speci�cations Limits are LackingMark Northrup, IEC Electronics

>> Localized Ion Chromatography Method Development and Validation*Mike Bixenman, DBA, KYZEN Corporation

INS1 Inspection for Manufacturing Improvement 8:00 am – 9:30 am

Chair: *Bill Cardoso, Ph.D., Creative ElectronCo-Chair: Eric Moen, Akrometrix

>> A Scanning Chromatic Confocal Microscope for Accurate O�-line Solder Paste Volume MeasurementChandru Periasamy, Ph.D., Intel Corporation

>> Revealing the Material Dimension: IBEX MAP Technology Applied to Single-exposure Radiography*Tamzin La�ord, Ph.D., IBEX Innovations Ltd.

>> The Contribution of High Volume Inspection to Save Driving*Peter Ho�rogge, PVA TePla Analytical Systems GmbH

APT7 Warpage 10:00 am – 11:30 am

Chair: *Dale Lee, Plexus Corp.Co-Chair: Andrew Daya, Garmin AT

>> BGA with Controllable Warpage Used to Con�rm the Needs of a Low Warpage Speci�cation*Alex Chan, P.E., Nokia

>> Comparing Shadow Moiré and Digital Fringe Projection Warpage Metrology TechniquesNeil Hubble, Akrometrix

>> Assessment of BGA region PCB Warpage in real SMT EnvironmentHaowen Liu, Ph.D., Intel Corporation

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MFX7 Conformal Coating 10:00 am – 11:30 am

Chair: Rakesh Kumar, Ph.D., Specialty Coating Systems Co-Chair: *Jason Keeping, P.Eng., Celestica, Inc.

>> Acrylic Coating Removal without Thermal Application*Eric Camden, Foresite, Inc.

>> The Impact of Conformal Coating on WLCSP Thermal Cycle Performance: Degradation Mechanism and Mitigation Method*Tae-Kyu Lee, Ph.D., Portland State University

>> Laser Exfoliation Removal of Conformal Coatings from CCA PCB Pad Surfaces*Norman Armendariz, Ph.D., Raytheon Company

INS2 Counterfeit Electronic Parts and Supply Chain 10:00 am – 11:30 am

Chair: *Chrys Shea, Shea Engineering Services Co-Chair: *Raiyo Aspandiar, Ph.D., Intel Corporation

>> Counterfeit Electronic Components – The Threat, Risk Mitigation Methods, Industry StandardsJason Jowers, Velocity Electronics

>> X-Ray Inspection Technology – An Application Driven ApproachGlen Thomas, Ph.D., Creative Electron

>> Taggants for Counterfeit Avoidance: Durability Testing Under Quali�cation Conditions*Diganta Das, Ph.D., CALCE University of Maryland

HDP Consortium 12:30 pm – 2:00 pm

Chair: *Richard Coyle, Ph.D., Nokia Co-Chair: *Iulia Muntele, Ph.D., Sanmina Corporation

>> Multiple Lamination – Reliability of Stacked Via Structures – A Collaborative Project*Bill Birch, PWB Interconnect Solutions Inc.

>> Digital Speckle Correlation for Predicting Failure Prone Structures*Bev Christian, Ph.D., HDPUG

>> Rework of New High-Speed Press-Fit ConnectorsLars Bruno, Ericsson AB

INS3 Inspection Technologies 12:30 pm – 2:00 pm

Chair: *Keith Bryant, SMT Solutions Co-Chair: Jean-Marc Peallat, Vi Technology

>> Supply Chain Maintenance Using Reverse Engineering*Bill Cardoso, Ph.D., Creative Electron, Inc.

>> Automated Conformal Coating Inspection & Thickness MeasurementHector Fonseca, Nordson Yestech

>> X-Ray Inspection for PCBA – Challenges and New DevelopmentsJane Feng, Ph.D., Flex


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Lead-Free Soldering Symposium 8:00 am – 3:30 pm

LF1 The A.R.E.A. Consortium 8:00 am – 9:30 am

Chair: *Diganta Das, Ph.D., CALCE University of MarylandCo-Chair: Jim Wilcox, Universal Instruments Corporation

>> Thermal Cycle Reliability Assessment of Bowed PCB AssembliesLars Bruno, Ericsson AB

>> The E�ect of Die Size on the Thermal Fatigue Reliability and Failure Mode of a Chip Array BGA*Richard Coyle, Ph.D., Nokia

>> E�ect of Process Thermal History on the Microstructure of Copper Pillar SnAg Solder JointsMohammed Genanu, Binghamton University

LF2 Screen Printing to Optimize Lead-Free Processing 10:00 am – 11:30 am

Chair: Srinivas Chada, Ph.D., StrykerCo-Chair: *Dave Hillman, Rockwell Collins

>> Impact of Stencil Foil Type on Solder Paste Transfer E�ciency for Laser Cut SMT StencilsGreg Smith, FCT Assembly, Inc.

>> The Importance of Stencil Tension for Robust SMT Printing ProcessesMike Burgess, ASM Assembly Systems, LLC

>> Low Temperature Solder Paste Process AdvantagesTraian C. Cucu, Alpha Assembly Solutions

LF3 Reliability & Performance of Lead-Free Interconnections 12:30 pm – 2:00 pm

Chair: *Jean-Paul Clech, Ph.D., EPSI, Inc.Co-Chair: Kola Akinade, Ph.D., Cisco Solutions

>> Investigation of the Factors In�uencing the Performance of Low Temperature SolderRohit Valooran, Rochester Institute of Technology

>> Reliability Study of Doped Lead-Free Solder Paste Alloys by Thermal Cycling TestingSharath Sridhar, Auburn University

>> E�ect of Processing Variables on the Mechanical Reliability of Pb Free Solder Joints*Eric Cotts, Ph.D., Binghamton University

LF4 Readying Pb-Free Innovations for 2:30 pm – 3:30 pm

High-Reliability Electronics

>> E�ect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys*Andre Delhaise, Celestica Inc.

>> Pb-Free Design and Implementation Guidance in High Performance Engineering DesignAnthony J. Rafanelli, Ph.D., P.E., Raytheon Integrated Defense Systems


Early Registration DiscountDeduct 10% from your conference registration when you register by August 25!

Group DiscountsRegister four people for a Technical Conference or VIP Conference package and take $100 o� each registration! All must be from the same company and must submit their registrations at the same time. Deduct $100 from each! Not available on-site or on Speaker Registration.

Student RatesSpecial rates are available for full time students. Please visit the SMTA International webpage to register online.

Exhibits Join us on September 19 from 10:00 am – 6:00 pm and September 20 from 9:00 am – 4:30 pm for unparalleled networking opportunities with leading companies. There is no cost to attend the exhibits.

ConferenceVIP Conference Package – Your Best ValueIncludes FOUR workshops, technical paper sessions, symposiums (Technical Innovations, Harsh Environments and Lead-Free), Keynote Presentation, Exhibits Admission, and Proceedings. $8 coupon is provided for lunch in the Exhibit Hall on Tuesday and Wednesday.

Technical ConferenceIncludes technical paper sessions, symposiums (Technical Innovations, Harsh Environments, and Lead-Free), Keynote Presentation, Exhibits Admission, and Proceedings. $8 coupon is provided for lunch in the Exhibit Hall on Tuesday and Wednesday. Does not include workshops.

Single DayIncludes a single day of technical paper sessions/symposiums, Exhibits Admission, and Proceedings. Does not include workshops.

Half Day WorkshopsIncludes course materials, certi�cate, and breaks. Does not include Proceedings.

Focused SymposiumsSymposiums include Technical Innovations, Harsh Environments, and Lead-Free. These are included with a VIP, Technical Conference or combined Conference and IPC Standards Meeting registration. To ensure that we have correct seating and handouts, we ask that you designate on the registration form which symposiums you plan to attend. If you are not registering for a VIP or Technical Conference package, you may also register to attend a speci�c symposium by using a single day conference rate.

IPC Fall Standards Development Committee Meetings Registration OptionsCombined SMTA International Conference and IPC Standards Development Committee MeetingsIncludes IPC committee meetings, technical paper sessions, symposiums (Technical Innovations, Harsh Environments, and Lead-free), Opening Session, Exhibits admission, and Proceedings. $8 coupon is provided for lunch in the Exhibit Hall on Tuesday and Wednesday.

IPC Committee Networking PackageYour registration fee includes IPC standards development committee meetings, entrance to the Exhibits and IPC lunches on Monday and Thursday. SMTA will provide a lunch coupon to use on the Exhibit Floor on Tuesday and Wednesday.

IPC Standards Development Committee MeetingsYour registration fee includes IPC standards development committee meetings, entrance to Exhibits and lunch coupon on the Exhibit Floor on Tuesday and Wednesday.

IPC Committee Awards/Networking LuncheonsYou will need to select Monday committee awards and/or Thursday networking luncheon. Tickets will be provided. You do not need to be attending an IPC meeting to purchase a lunch ticket.

Additional EventGolf Tournament on Thursday, September 21Cost to golf at the Maple Meadows Golf Course is $85/player or $340/foursome. Awards lunch is included. Numerous golf sponsorships are available at smta.org/smtai/golf.

Hotel and Travel InformationSMTA International is held at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Room blocks have been reserved at a rate of $185-209 at the Aloft Chicago O’Hare, Hilton Rosemont/Chicago O’Hare, DoubleTree by Hilton Hotel Chicago O’Hare, Chicago Marriott Suites O’Hare, Hyatt Regency O'Hare, and Leows Chicago O’Hare. All hotels are within easy walking distance of the Convention Center. Book your reservations through our website to secure these rates.

IMPORTANT NOTE: Room Block expires on Friday, August 25.

Please visit www.smta.org/smtai for full travel information.

REGISTRATIO

N

REGISTRATION OPTIONS

International

CONFERENCE REGISTRATIONCONFERENCE: September 17 – September 21, 2017EXHIBITION: September 19 – September 20, 2017

Rosemont, Illinois

Visit www.smta.org/smtai to register today!

Cancellation PolicyCancellations will be refunded (less a $75 processing fee) if received by August 25. All requests must be in writing and all badges/tickets must be returned before a refund can be processed. Substitutions are allowed and encouraged. Cancellation after August 25 and “no shows” are subject to the full registration fee. Refunds will not be made until after the conference. SMTA reserves the right to cancel any workshop with less than 10 registrants.

REGISTER BY AUGUST 25 and SAVE 10%!See previous page for all details on what is included with each registration category.

GROUP DISCOUNT: Register four people from the same company/location and deduct $100 o� each! Member rates apply to both SMTA and IPC members.

Exhibit Hall Only FREE! If pre-registered or $25 on-site

MEMBER NON-MEMBERSMTA International Conference

VIP Package (your best value) $1050 $1200Four workshops are included Speaker/Chair: $800 $900

Technical Conference $650 $800 Speaker/Chair: $350 $450

Single Day Conference $350 $500 Speaker/Chair: $200 $300

Half Day Workshops $350 $450Up to four included with a VIP registration, or you may register for them separately

IPC Standards Development Committee Meetings OptionsIPC Committee Meetings Plus SMTA International Conference $675 $825

IPC Committee Networking Package $155 $180

IPC Committee Meetings $60 $80

Additional OptionsIPC Committee Awards Luncheon (Monday) $50 each Non-committee members may also attend

IPC Committee Networking Luncheon (Thursday) $50 each

Proceedings $150

Golf Tournament (Thursday) $85 each or $340 foursome

Fun Run (Wednesday) FREE!

Students and Young Professionals Night Out (Tuesday) FREE!

Important Note: Everything listed below comes to you at NO ADDITIONAL COST:• Exhibit Hall• Keynote Presentation and

SMTA Annual Meeting• Women’s Leadership Program• Exhibit Hall Lunch coupon ($8 value) on

Tuesday and Wednesday• Tech Tours

• Spotlight Sessions• Poster Session• New Product Showcase• New Product Showcase Meet & Greet • Appreciation Reception • Student & Young Professionals Night Out• Special Feature Area

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electronics manufacturing conference & expo · 6 >> smta international 2017...

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