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Electronic Packaging Electronic Packaging and Manufacturing An overview mech14.weebly.com

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Page 1: Electronic Packaging and Manufacturing Electronic Packagingmech14.weebly.com/uploads/6/1/0/6/61069591/me_epm... · Electronic Packaging Major Electronic systems and markets Computers

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Electronic Packaging and

Manufacturing

An overview

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Concepts Covered:

Electronics Industry

What is Electronic Packaging

Levels of Packaging

Wafer Fabrication

What is Electronic Packaging?

Why is packaging important?

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Features of Electronic Industry

Technology driven business

Continuous price erosion

High growth rates

Large volumes in global markets

Short life cycles

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Major Electronic systems and markets

Computers and business equipment

Calculators, desktops, printers, photocopiers

Communication

Telephones. Fax, Modem

Automotive electronics

Engine control management, cruise control, power steering, safety features, sensors

Consumer electronics

TV, VCR, Audio, watches, games

Medical and industrial systems

High end, high power systems

Military electronics

Missiles, radars, fire control systems, communication mech14.weebly.com

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Tummala, 2001

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Integrated Circuits

Main element of an electronic product

A product also requires

Passive components

• resistors, capacitors, inductors

Electrical/Mechanical components

• Switches, connectors, cables, jumpers

Cooling components

Storage devices

Batteries / Power Supplies

Display components – LEDs, LCDs, Plasma display …

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What is Electronic Packaging?

X X

X

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What is Electronic Packaging?

Source: IET

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What is Electronic Packaging?

Service and art of providing a suitable

environment to the electronic product as

a whole to perform reliably over a period

of time.

No addition to functionality

Protection Communication

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Tummala, 2001

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Mechanical Design aspects of packaging

Connections

Manufacturing

Thermal Management

Maintenance

Shock and Vibration

Ergonomics

Environment

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Alternate definition: Electronic Packaging

Physical realization of an electronic systems based on:

• Design

• Materials (Metals, Plastics, Ceramics..)

• Choice of technology to implement design

• Electrical and thermal analysis

• Reliability analysis

• Much more

Packaging is the step after semiconductor design and

fabrication

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Why is packaging important?

Processor capability

64-bit processor

Billions of transistors

Challenges

Connection of a small chip

with so many I/Os over a

tiny area

Ensure that the transistors

do not overheat

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Why is packaging important?

Display capability

Retina HD display

LED-backlit, Multi-

Touch with IPS

technology

1334-by-750-pixel

resolution at 326 ppi

Challenges

Connect 326

conductor lines per

inch (13 per mm) for

display control and

additional ones for

touch sensing

On a minimal frame

around a large display

Ensuring nothing

breaks

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Why is packaging important?

Sensor capability

Touch ID

Barometer

Three-axis-gyro

Accelerometer

Proximity sensor

Ambient light

sensor

Challenges

Package highly complex

and miniaturized micro-

electro-mechanical

components

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Why is packaging important?

Camera capability

15 MP camera

Depth vision

1080p HD video

recording

Challenges

Connect to the

imaging CMOS chip

- 15 million pixels

each having 1.5μ x

1.5μ dimension

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Why is packaging important?

Connectivity

GSM/EDGE

UMTS/HSPA+

DC-HSDPA

CDMA model: CDMA

EVDO

LTE

802.11a/b/g/n/ac Wi-Fi

Bluetooth 4.0

NFC

GPS and GLONASS

Challenges

How do you integrate a

wide range of GHz

wireless antennas while

limiting crosstalk?

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Why is packaging important?

Physical Dimensions Challenges

How do you find

place for everything,

and ensure that

everything works

reliably ?

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Purpose of Packaging

Provide connection between device (IC)

and PCB and system

Signal/Power distribution to/from the

device (IC) and other components

Protect device from external

environment

Chemical, Mechanical Shock, Water,

etc.

Provide effective path to remove heat

Ensure package is reliable

All at lowest cost

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Levels of Packaging

Dally, 1990

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Formation of a wafer

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Czochralski Process

Named after Jan Czochralski

discovered the method in 1916

Molten Silicon (ultra pure) in a heated crucible

Dopant impurity atoms such as boron, phosphorus can be added to the molten intrinsic silicon in precise amounts

Seed crystal brought in contact with fused Si

rotated (for homogeneity) and pulled upwards

Crystal starts growing in the form of an ingot

thin wafers are chopped off

Source: WAFERPRO

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Source: Wikimedia Commons

https://www.youtube.com/watch?v=xftnhfa-Dmo

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Source: WAFERPRO

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Fundamentals revisited

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Conductors, Insulators and

Semiconductors

Conductivity depends on # of free electrons in outer shell

Al has 3 electrons in outer shell

R = ρL/A where r – resistivity depends on atomic structure

Al: 2.83 x 10-6 Ω-cm SiO2: ~ 1014 Ω-cm

Ag: 1.63 x 10-6 Ω-cm Al: ~ 1015 Ω-cm

SiO2 have covalent bonds resulting in no free electrons on the

outer shell

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Semiconductor - Silicon

Silicon

4 electrons on outer shell

Form covalent bonds with 4 neighbouring atoms

Electrons are not FREE charge carriers

Atomic structure is not perfect

Some electrons have sufficient energy to jump from valence to

conduction band

rSi – 1.56 x 105 Ω-cm (between conductors and insulators)

One in 2 x 1013 electrons may have sufficient energy to move to

conduction band (INTRINSIC CONDUCTION)

Source: https://www.electronics-tutorials.ws/diode/diode_1.html

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Extrinsic Semiconductor

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Resistivity of extrinsic semiconductor

Source: https://www.pveducation.org/ko/pvcdrom/general-properties-of-silicon mech14.weebly.com

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P-N junction

At the junction,

electrons and holes

combine to form a

depletion layer

The resultant

potential barrier

prevents flow of

charge carriers

across the junction

Source: https://www.electronics-tutorials.ws/diode/diode_1.html

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P-N junction diode

Zero Bias

Reverse Bias

Source: https://www.electronics-tutorials.ws/diode/diode_1.html

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P-N junction diode

Forward Bias I-V plot

Source: https://www.electronics-tutorials.ws/diode/diode_1.html

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Fabrication of a Diode

Source: All about Circuits

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